TWI222341B - Printed circuit board with continuously stacked circuit and manufacturing method thereof - Google Patents

Abstract

This invention relates to a printed circuit board with continuously stacked circuit and a manufacturing method thereof. A substrate undergoes pretreatment, film pressing, exposure, development, etching to form circuit. The circuit is also formed by coating an insulation layer, removing the insulation layer on the circuit to expose the circuit, and performing PTH and copper plating processes. Especially, the above-mentioned manufacturing processes can be repeated so that the desired thickness can be obtained through a continuously stacked circuit manner. Finally, the printed circuit board can be completed after processes such as conventional positive or negative print flow, drilling, etc. This invention can be used to produce circuit board circuit with high aspect ratio, which can sustain larger current and voltage in comparison with the circuit without high aspect ratio.

Description

^22341 五、發明說明（1) 【發明範圍】 本發明係有關於一種「連續堆疊線路之印刷電路板及 製造方法」，尤指一種可將電路板之線路，以連續堆疊之 方式產製的結構與製造方法，特別是該線路具有高縱橫比 <特性者。 【習用背景】 現有印刷電路板（Print Circuit Board)之產製， 因受限於產製技術，導致線路的縱橫比都被限制在1以 由於線路的縱橫比無法提高，造成線路寬度無法縮 減’相對便無法減小印刷電路板之面積與體積，對於現今 產品要求輕薄短小等訴求而言，傳統技術已無法滿足需 求。未來印刷電路板的線路勢必朝向細線發展，然知，在 線路寬度縮小的前提下，將造成線路表面積減少，如此將 影響電流的流動性，並會限制電壓與電流之承載量。 發明人有鑑於此，體認出印刷電路板線路之製造方法 與技術必須提升，遂特以研發成本案，期能藉由本發明， 使得印刷電路板的線路能在寬度縮小成細線的前提下，仍 能不致於影響電流流動性與電壓和電流的承載量；或是在 線路寬度不變的情況下，具有較習知者更好的電流流動 性，以及更大的電壓和電流承載量。 【發明目的】 本案「連續堆疊線路之印刷電路板及製造方法」，其^ 22341 V. Description of the invention (1) [Scope of the invention] The present invention relates to a "printed circuit board and manufacturing method of continuously stacked circuits", and particularly to a circuit board circuit that can be produced by continuous stacking. Structure and manufacturing method, especially those with high aspect ratio < characteristics of this circuit. [Conventional background] Due to production technology of existing printed circuit boards, the aspect ratio of the circuit is limited to 1 due to the limitation of production technology. As the aspect ratio of the circuit cannot be increased, the width of the circuit cannot be reduced. Relatively, the area and volume of the printed circuit board cannot be reduced. For the demands of today's products such as light, thin, short, etc., traditional technologies have been unable to meet the demand. In the future, the printed circuit board lines will inevitably develop toward thin lines. However, under the premise of reducing the width of the circuit, the surface area of the circuit will be reduced. This will affect the flow of current and limit the voltage and current carrying capacity. In view of this, the inventor realized that the manufacturing method and technology of printed circuit board circuits must be improved, and based on the research and development cost case, it is expected that the width of the printed circuit board circuits can be reduced to thin lines with the present invention. It can still not affect the current mobility and the carrying capacity of voltage and current; or under the condition that the line width is not changed, it has better current mobility and larger voltage and current carrying capacity than those skilled in the art. [Objective of the Invention] This case "Printed Circuit Board and Manufacturing Method for Continuously Stacked Circuits", which

1222341 五、發明說明（2) 主要技術特徵在於：將基板上的線路以連續重覆的堆疊技 術，增加至所需的厚度，藉由增加線路的厚度，以達到增 加線路表面積以及縱橫比，如是，可獲致提升電流流動 性’與電塵和電流的承載量等優點目的。 i j達f述目的本案所提出之具體技術在於··將基板經 :ί ΐ:ΐ ί、曝光、顯影、蝕刻、以形成線路，經塗佈 ΡΤίϊ；5磁β θ除線路上之絕緣層使致線路外露後，進行 L ΛΥΛ’Λ形/Λ路’再藉由適當重覆前述製 依傳統正片或負片流程及鑽孔等程序，即可完成電路板。 茲配合圖面說明本發明之較佳實施例如下： 【實施例】 連續堆疊線路之印刷電路板及製造方 枣發明 其製造方法為 光、27::示以基板1_，經前處理、壓膜、曝 佈絕緣層3後如Cif路2，即如第二圖所示；經塗 使致線路圖），予以去除線路上之絕緣層， (如第五圏，圖）’1,及鍍銅程序4 成線路5以連續堆線路，再藉由重覆前述製程，可形 最後再依傳製程，即可得所需之線路厚度， w堍正片或負片流程及鑽孔等程序，即可完成電1222341 V. Description of the invention (2) The main technical feature is to continuously stack the circuits on the substrate to the required thickness, and increase the thickness of the circuits to increase the surface area and aspect ratio of the circuits. , Can achieve the purpose of improving the current mobility and the carrying capacity of electric dust and current. The specific technology proposed in this case is to put the substrate through: ΐ ΐ: 曝光, expose, develop, etch, to form a circuit, and coat it with Τίϊ; 5 magnetic β θ divide the insulating layer on the circuit so that After the line is exposed, carry out L ΛΥΛ'Λ 形 / Λ 路 ', and then repeat the procedures of conventional positive or negative film making and drilling as appropriate to complete the circuit board. The preferred embodiments of the present invention will be described with reference to the drawings as follows: [Example] Printed circuit boards for continuous stacked lines and manufacturing method of the invention The manufacturing method is light, 27 :: shown as substrate 1_, pre-treated, laminated 2. After the insulation layer 3 is exposed, it is shown as Cif Road 2 (as shown in the second figure; the coating is used to make the circuit diagram), and the insulation layer on the circuit is removed, (such as the fifth figure, picture) '1, and copper plating Program 4 is to build a line 5 to stack the lines continuously, and then repeat the above process, and then shape the process, and then you can get the required circuit thickness. You can complete the process of positive or negative film and drilling, etc. Electricity

1222341 五、發明說明（3) 路板。 茲再就前述製造方法，舉一 4〇7怂物痛 例具想詳加說明之。 402線路厚度5mu線寬為 以縱橫比為5. 6/5= 1.1為例，其製造方法之步驟為： 1.將20Z copper foil之基板，裁成所需之 s 1 z e並鑽對位孔，或以其它方式對位· 2·進行傳統的前處理、壓膜、曝光、蝕刻、等流程以 形成線路； 3.塗，絕緣層（coating)，可用防焊油墨或環氧樹 月旨（Epoxy Resin)或其它與基板相同材質之絕緣 材料， ， 或化學方法 之方式増加 4·整平使線路外露（可用曝光顯影或機械 去除線路表面之絕緣材料）； 5· PTH及鍍銅至ιοζ ; 6·重覆進行步驟2〜5，使線路以連續堆叠 厚度至所需； 7.進行鑽孔； 8·再次進行PTH及鍍銅，如採負片流程，則鍵銅至 〇· 2〜0· 3mi 1，如採正片流程，則鍍銅至 9·後續以傳統PCB製造方法完成印刷電路板·。 顯知’本案可具有下述特點： 1.^1由重覆前述步驟2〜5’可獲致連續堆疊線路，理 論上可形成無窮厚之線路銅厚，以符實際需要。1222341 V. Description of the invention (3) Road board. I would like to give a detailed explanation on the aforementioned manufacturing method with reference to 407. 402 line thickness 5mu line width is taken as an aspect ratio of 5. 6/5 = 1.1 as an example, the steps of its manufacturing method are: 1. Cut the 20Z copper foil substrate into the required s 1 ze and drill the positioning holes Or, in other ways, align 2．Perform traditional pre-treatment, lamination, exposure, etching, etc. to form the circuit; 3. Coating, insulation layer (coating), can be used solder mask or epoxy tree month purpose ( Epoxy Resin) or other insulating materials of the same material as the substrate, or chemical methods to add 4. leveling to expose the line (exposure development or mechanical removal of the insulation material on the surface of the line); 5. PTH and copper plating to ιοζ; 6 · Repeat steps 2 ~ 5 to make the stack thickness continuously to the required; 7. Drill holes; 8 · PTH and copper plating again, if the negative process is used, then bond copper to 0 · 2 ~ 0 · 3mi 1, if the positive process is adopted, then copper plating to 9 · The printed circuit board is then completed by the traditional PCB manufacturing method ·. It is clear that this case can have the following characteristics: 1. ^ 1 By repeating the above steps 2 to 5 ', continuous stacked lines can be obtained, and theoretically, an infinitely thick copper line can be formed to meet actual needs.

1222341 五、發明說明（4) 2·不論是印刷電路板其内層或外層的線路銅厚，都可 藉由重覆前述步驟2〜5，以獲致連續堆疊線路，以 取得所需之線路鋼厚。 3·藉由連續堆疊線路，可增加線路鋼厚，並增加線路 表面積’以仔到局縱橫比之線路’連帶獲致提升電 流流動性與電壓和電流的承載量。 4·藉由連續堆疊線路，可增加線路鋼厚，可有效縮小 線路之寬度，亦即線路之寬度與厚度都可自行任意 調整。 5.線路間皆有絕緣物質塗佈，可增加產品之信賴度， 確保線路間之絕緣效果。 6 ·由於線路皆已有絕緣層塗佈，故防焊效果佳，文字 也易於印刷，且印刷之文字可確保清晰及完整。 7·線路堆疊之形狀，可因製程改變而有所不同，以形 成例如：梯形、倒梯形、正方形、長方…… 任何形狀。 第七圖係為以本發明製 顯示了線路2上有連續堆番 圖，係為將本案的線路6i 方形之示意圖。 成之電路板的另一實施例，其 線路5、5、5 ;又如第八 與連續堆疊線路6 2實施成正 路之印刷電路板及製 性，確具效用與實用 爰依法提請專利，懇1222341 V. Description of the invention (4) 2 · Whether it is the copper thickness of the inner layer or the outer layer of the printed circuit board, you can repeat the previous steps 2 ~ 5 to obtain continuous stacking lines to obtain the required circuit steel thickness. . 3. By continuously stacking the wires, the thickness of the wires can be increased, and the surface area of the wires can be increased to increase the current flow and voltage and current carrying capacity. 4. By continuously stacking the lines, the steel thickness of the lines can be increased, and the width of the lines can be effectively reduced, that is, the width and thickness of the lines can be adjusted arbitrarily. 5. The insulation material is applied between the lines, which can increase the reliability of the product and ensure the insulation effect between the lines. 6 · Since the lines have been coated with an insulating layer, the soldering effect is good, and the text is easy to print, and the printed text can ensure clarity and completeness. 7. The shape of the circuit stack can be different due to process changes, so as to form: trapezoid, inverted trapezoid, square, rectangular ... Any shape. The seventh diagram is a schematic diagram showing the continuous stacking of the circuit 2 according to the present invention, and is a schematic diagram of the square of the circuit 6i of the present case. Another embodiment of the completed circuit board, its circuits 5, 5, and 5; and as the eighth and the continuous stacked circuit 62, the printed circuit board and the system are implemented as a positive circuit, indeed effective and practical.

η’本發明「連續堆疊$ ^方法」，其明顯具有進步性 價值和產業利用性’具有諸優η ’The“ continuously stacked $ ^ method ”of the present invention, which has obvious progressive value and industrial utilization’ has many advantages.

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1222341 圖式簡單說明 【圖式之簡單說明】 第一圖：係為本發明製造方法之電路板剖面圖一。 第二圖：係為本發明製造方法之電路板剖面圖二。 第三圖··係為本發明製造方法之電路板剖面圖三。 第四圖··係為本發明製造方法之電路板剖面圖四。 第五圖：係為本發明製造方法之電路板剖面圖五。 第六圖：係為本發明製造方法之電路板剖面圖六。 第七圖··係為本發明製造方法之電路板連續堆疊多層線路 的實施不意圖。1222341 Brief description of the drawings [Simplified description of the drawings] The first figure: is the first sectional view of the circuit board of the manufacturing method of the present invention. FIG. 2 is a sectional view of a circuit board of the manufacturing method of the present invention. The third figure is a sectional view of a circuit board of the manufacturing method of the present invention. The fourth figure is a sectional view of a circuit board of the manufacturing method of the present invention. Fifth Figure: is a sectional view of a circuit board of the manufacturing method of the present invention. FIG. 6 is a sectional view of a circuit board of the manufacturing method of the present invention. The seventh figure is not intended to implement the continuous stacking of multiple layers of circuit boards in the manufacturing method of the present invention.

第八圖：係為本發明製造方法之電路板線路實施成正方形 之示意圖。 【圖號說明】 1 基 板 2 線 路 3 絕 緣層 4 PTH及鍍銅 5 連 績堆疊線路 6 1 :線路 6 2 :連續堆疊線路Fig. 8 is a schematic view showing that the circuit board circuit of the manufacturing method of the present invention is implemented in a square shape. [Illustration of drawing number] 1 base board 2 lines 3 insulation 4 PTH and copper plating 5 continuous stacking lines 6 1: line 6 2: continuous stacking line

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Claims (1)

1222341 六、申請專利範圍 包括4述；：連J堆f線路之印f:路板的製造方法，係 影、蝕刻板中’經別處理、麼膜、曝光、顯 成線路i藉Κΐί外露’進打ΡΤΗ及鑛銅程序，俾形 錄當取得所需之線路厚度後，再依 片抓程及鑽孔等程序，即可完成電路板。 反2、如申請專利範圍第1項所述 2路板的製造方法，，中該塗佈絕緣層Πί:;: 材暂油墨或環氧樹脂（EP〇xy Resin)或其它與基板相° 材質之絕緣材料。 兴卷板相同 3、 如申請專利範圍第1項所述之 刷電路板的製造方法，纟中該杨線路線路之印 線路外露之方法，係可用曝光顯嫌=絕緣層，使致 成去除線路表面之絕緣材^錢〜或機械或化學方法以達 4、 如申請專利範圍第i項所述之連 刷電路板的製造方法，其中該連續堆查路 ^ ^ 用於印刷電路板之内層或外層線路。路之^係可應 5、 如申請專利範圍第1項所述之 刷電路板的製造方法，#由該連續堆路路= 線路寬度予以縮減。 略之方法’可就 6、 一種連續堆疊線路之印刷電路板， 經前處理、曝光、•顯影、姓刻^基板中’ 層後’予以去除線路上之絕緣層，外：塗=緣1222341 VI. The scope of application for patents includes 4 descriptions :: the J-f line printed on the line f: the method of manufacturing the circuit board, the film, the etched plate, 'after other processing, film, exposure, and display of the circuit i borrow Κΐίexposed' Enter the PTT and copper mining procedures. After obtaining the required circuit thickness, follow the procedures such as film grip and drilling to complete the circuit board. Reverse 2. The method for manufacturing a 2-way board as described in item 1 of the scope of the patent application, in which the coated insulating layer is used: material: temporary ink or epoxy resin (EP〇xy Resin) or other materials with a substrate ° Of insulation material. The winding board is the same 3. The method for manufacturing the printed circuit board described in item 1 of the scope of the patent application, and the method for exposing the printed circuit of the Yang line circuit can be used to expose the exposure = insulation layer, so that the circuit is removed Surface insulation material ^ money ~ or mechanical or chemical methods to achieve 4, as described in the scope of the patent application for the continuous brush circuit board manufacturing method, wherein the continuous stacking road search ^ ^ used for the inner layer of the printed circuit board or Outer lines. The road can be applied in accordance with 5. The manufacturing method of the brushed circuit board as described in item 1 of the scope of the patent application, #Continuous stacking road = line width to be reduced. The method can be omitted. 6. A printed circuit board with continuously stacked circuits can be pre-treated, exposed, developed, and engraved with ^ on the substrate to remove the insulating layer on the circuit. 第10頁 1222341 六、申請專利範圍 PTH及鍍銅箔程序，俾形成線路，再藉由重覆前述製程， 可獲致該印刷電路板上之線路增加厚度，並具有連續堆疊 之結構特徵。 7、如申請專利範圍第6項所述之一種連續堆疊線路 之印刷電路板，其中該連續堆疊線路係設於印刷電路板之 内層或外層線路。Page 10 1222341 VI. Scope of patent application PTH and copper-plating procedures, forming circuits, and then repeating the foregoing process, the printed circuit boards can be increased in thickness and have the characteristics of continuous stacking. 7. A printed circuit board of a continuous stacked circuit as described in item 6 of the scope of patent application, wherein the continuous stacked circuit is provided on the inner layer or the outer layer of the printed circuit board. 第11頁Page 11