TWD211363S - Substrate carrier - Google Patents

Substrate carrier Download PDF

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Publication number
TWD211363S
TWD211363S TW109305966F TW109305966F TWD211363S TW D211363 S TWD211363 S TW D211363S TW 109305966 F TW109305966 F TW 109305966F TW 109305966 F TW109305966 F TW 109305966F TW D211363 S TWD211363 S TW D211363S
Authority
TW
Taiwan
Prior art keywords
substrate carrier
design
manufacturing process
dotted line
semiconductor manufacturing
Prior art date
Application number
TW109305966F
Other languages
Chinese (zh)
Inventor
佛列德艾利克 魯藍德
蘇密特 帕坦卡
維傑D 帕克
丹尼爾李 迪爾
朱明偉
高濱宏行
蘭迪D 薛米汀
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD211363S publication Critical patent/TWD211363S/en

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Abstract

【物品用途】;本設計所請求之基板載具係用於半導體製程。;【設計說明】;圖式所揭露之虛線部分,為本案不主張設計之部分。[Use of article]; The substrate carrier requested by this design is used in the semiconductor manufacturing process. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design.

Description

基板載具 Substrate carrier

本設計所請求之基板載具係用於半導體製程。 The substrate carrier requested by this design is used in the semiconductor manufacturing process.

圖式所揭露之虛線部分,為本案不主張設計之部分。 The dotted line exposed in the diagram is a part of this case that does not advocate design.

TW109305966F 2019-01-21 2019-07-22 Substrate carrier TWD211363S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/677,482 2019-01-21
US29/677,482 USD904640S1 (en) 2019-01-21 2019-01-21 Substrate carrier

Publications (1)

Publication Number Publication Date
TWD211363S true TWD211363S (en) 2021-05-01

Family

ID=73629428

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109305966F TWD211363S (en) 2019-01-21 2019-07-22 Substrate carrier
TW108304381F TWD210297S (en) 2019-01-21 2019-07-22 Substrate carrier

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW108304381F TWD210297S (en) 2019-01-21 2019-07-22 Substrate carrier

Country Status (2)

Country Link
US (1) USD904640S1 (en)
TW (2) TWD211363S (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD226540S (en) 2021-10-18 2023-07-21 美商蘭姆研究公司 Hub with gas deflectors

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US11986305B2 (en) 2019-04-17 2024-05-21 Masimo Corporation Liquid inhibiting air intake for blood pressure monitor
USD917704S1 (en) 2019-08-16 2021-04-27 Masimo Corporation Patient monitor
USD919094S1 (en) 2019-08-16 2021-05-11 Masimo Corporation Blood pressure device
USD985498S1 (en) 2019-08-16 2023-05-09 Masimo Corporation Connector
USD927699S1 (en) * 2019-10-18 2021-08-10 Masimo Corporation Electrode pad
USD941787S1 (en) * 2020-03-03 2022-01-25 Applied Materials, Inc. Substrate transfer blade
USD933232S1 (en) 2020-05-11 2021-10-12 Masimo Corporation Blood pressure monitor
USD979516S1 (en) 2020-05-11 2023-02-28 Masimo Corporation Connector

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USD411261S (en) 1998-04-16 1999-06-22 Ara John Movsesian Connector for a toy building block
USD751999S1 (en) 2012-12-31 2016-03-22 Soraa, Inc. Array of triangular semiconductor dice

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BR302012006715S1 (en) * 2012-07-03 2014-06-10 Bosch Gmbh Robert BLADE APPLIED CONFIGURATION
US9845533B2 (en) * 2014-11-11 2017-12-19 Applied Materials, Inc. Substrate carrier system utilizing electrostatic chucking to accommodate substrate size heterogeneity
JP1568796S (en) * 2016-04-27 2017-02-06
USD838001S1 (en) * 2016-04-27 2019-01-08 Hamamatsu Photonics K.K. Substrate for spectroscopic analysis
JP1580288S (en) * 2016-04-27 2017-07-03
JP1579897S (en) * 2016-04-27 2017-06-26
JP1568795S (en) * 2016-04-27 2017-02-06
TWI744351B (en) 2016-07-09 2021-11-01 美商應用材料股份有限公司 Substrate carrier
JP1576633S (en) * 2016-09-16 2017-05-22
USD813635S1 (en) * 2016-12-13 2018-03-27 Black & Decker Inc. Circular saw blade
JP1579613S (en) * 2017-01-25 2017-06-19
JP1583356S (en) * 2017-01-25 2017-08-07
JP1579614S (en) * 2017-01-25 2017-06-19
USD859058S1 (en) * 2017-03-03 2019-09-10 Tristar Products, Inc. Cooking apparatus
USD817696S1 (en) * 2017-03-03 2018-05-15 Tristar Products, Inc. Cooking apparatus
JP6957109B2 (en) * 2017-12-12 2021-11-02 株式会社ディスコ Device chip manufacturing method and pickup device
USD877101S1 (en) * 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD411261S (en) 1998-04-16 1999-06-22 Ara John Movsesian Connector for a toy building block
USD751999S1 (en) 2012-12-31 2016-03-22 Soraa, Inc. Array of triangular semiconductor dice

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD226540S (en) 2021-10-18 2023-07-21 美商蘭姆研究公司 Hub with gas deflectors
TWD230583S (en) 2021-10-18 2024-04-01 美商蘭姆研究公司 (美國) Hub with gas deflectors

Also Published As

Publication number Publication date
USD904640S1 (en) 2020-12-08
TWD210297S (en) 2021-03-11

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