TWD209200S - Film for manufacturing semiconductor device - Google Patents

Film for manufacturing semiconductor device Download PDF

Info

Publication number
TWD209200S
TWD209200S TW109301937D02F TW109301937D02F TWD209200S TW D209200 S TWD209200 S TW D209200S TW 109301937D02 F TW109301937D02 F TW 109301937D02F TW 109301937D02 F TW109301937D02 F TW 109301937D02F TW D209200 S TWD209200 S TW D209200S
Authority
TW
Taiwan
Prior art keywords
film
manufacturing semiconductor
semiconductor device
design
diaphragm
Prior art date
Application number
TW109301937D02F
Other languages
Chinese (zh)
Inventor
尾崎義信
田澤強
谷口紘平
矢羽田達也
板垣圭
Original Assignee
日商昭和電工材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭和電工材料股份有限公司 filed Critical 日商昭和電工材料股份有限公司
Publication of TWD209200S publication Critical patent/TWD209200S/en

Links

Images

Description

製造半導體裝置用的膜片 Diaphragm for manufacturing semiconductor devices

本設計物品是一種製造半導體裝置用的膜片。 This design article is a diaphragm for manufacturing semiconductor devices.

本設計圖式所揭露之虛線為本案不主張設計之部分。圖式中一點鏈線所圍繞者,係界定本案所欲主張之範圍,該一點鏈線本身為本案不主張設計之部分。顯示使用狀態的參考視圖1和2表示本設計之物品及所應用環境中之各部件名稱,其中本設計應用之物品係由基膜與黏著劑層、成膜支撐構件所構成,黏著劑層和基膜是透明的。 The dotted line disclosed in this design diagram is the part of the project that does not advocate design. The one-point chain line in the diagram defines the scope of this case. The one-point chain line itself is a part of the case that does not advocate design. The reference views 1 and 2 showing the state of use show the names of the articles of this design and the parts in the application environment. The articles of this design are composed of a base film, an adhesive layer, and a film-forming support member. The adhesive layer and The base film is transparent.

TW109301937D02F 2019-10-25 2020-04-10 Film for manufacturing semiconductor device TWD209200S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-023721 2019-10-25
JPD2019-23721F JP1660179S (en) 2019-10-25 2019-10-25

Publications (1)

Publication Number Publication Date
TWD209200S true TWD209200S (en) 2021-01-01

Family

ID=70775842

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109301937D02F TWD209200S (en) 2019-10-25 2020-04-10 Film for manufacturing semiconductor device

Country Status (2)

Country Link
JP (1) JP1660179S (en)
TW (1) TWD209200S (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200937508A (en) 2007-09-21 2009-09-01 Semiconductor Energy Lab Substrate provided with semiconductor films and manufacturing method thereof
TW201622010A (en) 2014-11-13 2016-06-16 Shindengen Electric Mfg Method for manufacturing semiconductor device and glass coating forming device
TW201934683A (en) 2018-02-05 2019-09-01 南韓商三星電子股份有限公司 Protective film composition and method of manufacturing semiconductor package by using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200937508A (en) 2007-09-21 2009-09-01 Semiconductor Energy Lab Substrate provided with semiconductor films and manufacturing method thereof
TWI470682B (en) 2007-09-21 2015-01-21 Semiconductor Energy Lab Substrate provided with semiconductor films and manufacturing method thereof
TW201622010A (en) 2014-11-13 2016-06-16 Shindengen Electric Mfg Method for manufacturing semiconductor device and glass coating forming device
TWI584381B (en) 2014-11-13 2017-05-21 Shindengen Electric Manufacturing Co Ltd A method of manufacturing a semiconductor device, and a glass film forming apparatus
TW201934683A (en) 2018-02-05 2019-09-01 南韓商三星電子股份有限公司 Protective film composition and method of manufacturing semiconductor package by using the same

Also Published As

Publication number Publication date
JP1660179S (en) 2020-05-25

Similar Documents

Publication Publication Date Title
TWD209201S (en) Film for manufacturing semiconductor device
JP2019033095A5 (en) Light emitting device
TWD211363S (en) Substrate carrier
JP2012531264A5 (en)
TWD210909S (en) Potato snacks
JP2005023300A5 (en)
TWD209151S (en) Susceptor shaft
TWD211589S (en) Substrate support pedestal
TWD207255S (en) Monitoring device
TWD204357S (en) Baby bottle
TWD201884S (en) Tape dispenser
TWD209199S (en) Film for manufacturing semiconductor device
TWD209200S (en) Film for manufacturing semiconductor device
TWD209041S (en) Film for manufacturing semiconductor device
TWD218901S (en) Case for an electronic device
TWD209793S (en) Transportable semiconductor wafer rack
TWD209792S (en) Transportable semiconductor wafer rack
TWD202849S (en) Substrate retaining ring
TWD203974S (en) Substrate retaining ring
JP1746405S (en) Susceptor cover
JP1741172S (en) Susceptor cover
TWD231876S (en) Tripod
TWD207366S (en) Camera
JP1724640S (en) semiconductor device
TWD214768S (en) Fan fixture