TWD189096S - 晶圓支撐環 - Google Patents
晶圓支撐環Info
- Publication number
- TWD189096S TWD189096S TW106301900F TW106301900F TWD189096S TW D189096 S TWD189096 S TW D189096S TW 106301900 F TW106301900 F TW 106301900F TW 106301900 F TW106301900 F TW 106301900F TW D189096 S TWD189096 S TW D189096S
- Authority
- TW
- Taiwan
- Prior art keywords
- support ring
- wafer support
- design
- wafer
- item usage
- Prior art date
Links
Abstract
【物品用途】;本設計係關於一種晶圓支撐環。;【設計說明】
Description
本設計係關於一種晶圓支撐環。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/580,872 USD815385S1 (en) | 2016-10-13 | 2016-10-13 | Wafer support ring |
US29/580,872 | 2016-10-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD189096S true TWD189096S (zh) | 2018-03-11 |
Family
ID=60191666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106301900F TWD189096S (zh) | 2016-10-13 | 2017-04-13 | 晶圓支撐環 |
Country Status (3)
Country | Link |
---|---|
US (1) | USD815385S1 (zh) |
JP (1) | JP1590044S (zh) |
TW (1) | TWD189096S (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD208178S (zh) | 2018-07-25 | 2020-11-11 | 日商日本碍子股份有限公司 | 半導體製造用晶圓支持器之部分 |
TWD208177S (zh) | 2018-07-25 | 2020-11-11 | 日商日本碍子股份有限公司 | 半導體製造用晶圓支持器 |
TWD208176S (zh) | 2018-07-25 | 2020-11-11 | 日商日本碍子股份有限公司 | 半導體製造用晶圓支持器 |
TWD208175S (zh) | 2018-07-25 | 2020-11-11 | 日商日本碍子股份有限公司 | 半導體製造用晶圓支持器 |
TWD208174S (zh) | 2018-07-25 | 2020-11-11 | 日商日本碍子股份有限公司 | 半導體製造用晶圓支持器 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD802723S1 (en) * | 2015-11-27 | 2017-11-14 | Ebara Corporation | Sealing ring |
USD875899S1 (en) * | 2016-10-21 | 2020-02-18 | Nok Corporation | Seal |
JP1581114S (zh) * | 2016-10-21 | 2017-07-10 | ||
JP1604073S (zh) * | 2017-06-27 | 2018-05-21 | ||
USD890310S1 (en) * | 2018-02-08 | 2020-07-14 | Nok Corporation | Seal |
USD917825S1 (en) * | 2019-07-16 | 2021-04-27 | Entegris, Inc. | Wafer support ring |
USD940670S1 (en) * | 2019-09-26 | 2022-01-11 | Willbe S&T Co., Ltd. | Retainer ring for chemical mechanical polishing device |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3893649A (en) * | 1971-08-09 | 1975-07-08 | Dynamic Form Systems Inc | Bag holder |
US4867401A (en) * | 1988-08-04 | 1989-09-19 | Graff Frederick E | Bag holder |
US4899967A (en) * | 1989-01-17 | 1990-02-13 | Johnson Austin E | Portable flexible bag holder |
USD457283S1 (en) * | 1995-04-05 | 2002-05-14 | Jay L. Wayt | Refuse bag retainer ring |
CN103862463B (zh) * | 2007-05-31 | 2017-08-15 | 应用材料公司 | 延伸双scara机械手连接装置的伸出距离的方法及设备 |
USD655401S1 (en) * | 2009-08-10 | 2012-03-06 | Nippon Valqua Industries, Ltd. | Hybrid seal member |
TWD149672S (zh) | 2010-08-16 | 2012-10-11 | 荏原製作所股份有限公司 | 密封環 |
USD646764S1 (en) * | 2010-11-04 | 2011-10-11 | Faster S.P.A. | Sealing gasket |
USD667601S1 (en) * | 2011-06-21 | 2012-09-18 | Garbo Grabber, LLC | Trash collecting device |
USD754308S1 (en) * | 2012-08-07 | 2016-04-19 | Nippon Valqua Industries, Ltd. | Composite sealing material |
USD723239S1 (en) * | 2012-08-30 | 2015-02-24 | Entegris, Inc. | Wafer carrier ring |
USD743513S1 (en) * | 2014-06-13 | 2015-11-17 | Asm Ip Holding B.V. | Seal ring |
-
2016
- 2016-10-13 US US29/580,872 patent/USD815385S1/en active Active
-
2017
- 2017-04-13 TW TW106301900F patent/TWD189096S/zh unknown
- 2017-04-13 JP JPD2017-7945F patent/JP1590044S/ja active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD208178S (zh) | 2018-07-25 | 2020-11-11 | 日商日本碍子股份有限公司 | 半導體製造用晶圓支持器之部分 |
TWD208177S (zh) | 2018-07-25 | 2020-11-11 | 日商日本碍子股份有限公司 | 半導體製造用晶圓支持器 |
TWD208176S (zh) | 2018-07-25 | 2020-11-11 | 日商日本碍子股份有限公司 | 半導體製造用晶圓支持器 |
TWD208175S (zh) | 2018-07-25 | 2020-11-11 | 日商日本碍子股份有限公司 | 半導體製造用晶圓支持器 |
TWD208174S (zh) | 2018-07-25 | 2020-11-11 | 日商日本碍子股份有限公司 | 半導體製造用晶圓支持器 |
Also Published As
Publication number | Publication date |
---|---|
USD815385S1 (en) | 2018-04-10 |
JP1590044S (zh) | 2017-11-06 |
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