TW592019B - Method for interconnecting multi-layer printed circuit board - Google Patents

Method for interconnecting multi-layer printed circuit board Download PDF

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Publication number
TW592019B
TW592019B TW092121793A TW92121793A TW592019B TW 592019 B TW592019 B TW 592019B TW 092121793 A TW092121793 A TW 092121793A TW 92121793 A TW92121793 A TW 92121793A TW 592019 B TW592019 B TW 592019B
Authority
TW
Taiwan
Prior art keywords
layer
metal
item
scope
convex portion
Prior art date
Application number
TW092121793A
Other languages
Chinese (zh)
Other versions
TW200415975A (en
Inventor
Sung-Gue Lee
Jung-Ho Hwang
Joon-Wook Han
Sang-Min Lee
Tae-Sik Eo
Original Assignee
Lg Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Electronics Inc filed Critical Lg Electronics Inc
Application granted granted Critical
Publication of TW592019B publication Critical patent/TW592019B/en
Publication of TW200415975A publication Critical patent/TW200415975A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28C—PREPARING CLAY; PRODUCING MIXTURES CONTAINING CLAY OR CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28C5/00—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions
    • B28C5/08—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions using driven mechanical means affecting the mixing
    • B28C5/10—Mixing in containers not actuated to effect the mixing
    • B28C5/12—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers
    • B28C5/14—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers the stirrers having motion about a horizontal or substantially horizontal axis
    • B28C5/148—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers the stirrers having motion about a horizontal or substantially horizontal axis the stirrer shaft carrying a plurality of radially extending mixing bars
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28C—PREPARING CLAY; PRODUCING MIXTURES CONTAINING CLAY OR CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28C5/00—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions
    • B28C5/08—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions using driven mechanical means affecting the mixing
    • B28C5/0806—Details; Accessories
    • B28C5/0831—Drives or drive systems, e.g. toothed racks, winches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28C—PREPARING CLAY; PRODUCING MIXTURES CONTAINING CLAY OR CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28C5/00—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions
    • B28C5/08—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions using driven mechanical means affecting the mixing
    • B28C5/10—Mixing in containers not actuated to effect the mixing
    • B28C5/12—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers
    • B28C5/14—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers the stirrers having motion about a horizontal or substantially horizontal axis
    • B28C5/142—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers the stirrers having motion about a horizontal or substantially horizontal axis the stirrer shaft carrying screw-blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28C—PREPARING CLAY; PRODUCING MIXTURES CONTAINING CLAY OR CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28C5/00—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions
    • B28C5/08—Apparatus or methods for producing mixtures of cement with other substances, e.g. slurries, mortars, porous or fibrous compositions using driven mechanical means affecting the mixing
    • B28C5/10—Mixing in containers not actuated to effect the mixing
    • B28C5/12—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers
    • B28C5/14—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers the stirrers having motion about a horizontal or substantially horizontal axis
    • B28C5/146—Mixing in containers not actuated to effect the mixing with stirrers sweeping through the materials, e.g. with incorporated feeding or discharging means or with oscillating stirrers the stirrers having motion about a horizontal or substantially horizontal axis with several stirrers with parallel shafts in one container
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
    • E01C19/00—Machines, tools or auxiliary devices for preparing or distributing paving materials, for working the placed materials, or for forming, consolidating, or finishing the paving
    • E01C19/02—Machines, tools or auxiliary devices for preparing or distributing paving materials, for working the placed materials, or for forming, consolidating, or finishing the paving for preparing the materials
    • E01C19/10—Apparatus or plants for premixing or precoating aggregate or fillers with non-hydraulic binders, e.g. with bitumen, with resins, i.e. producing mixtures or coating aggregates otherwise than by penetrating or surface dressing; Apparatus for premixing non-hydraulic mixtures prior to placing or for reconditioning salvaged non-hydraulic compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Structural Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A method for fabricating a multi-layer printed circuit board includes: forming an etching resist layer on a first metal layer and forming a plating groove on the etching resist layer to selectively expose the first metal layer; forming a plated layer at the surface of the first metal layer exposed by the plating groove through a plating process to form connection protrusion; removing the etching resist layer and forming an insulation layer at the first metal layer; and positioning a second metal layer at the surface of the insulation layer, so as to be connected to an end portion of the connection protrusion. A strength of the base material is increased so as to be easily handled and a productivity can be increased. By forming the connection protrusion through the plating process, a material loss can be reduced.

Description

592019 玖、發明說明： 【發明所屬之技術領域】 本發明係相關於一多層印刷電路板，並且更特別地相 關於-種用於互連多層印刷電路板之方法，該多層電路板 月匕夠電氣地連接由多層所堆疊出之電路圖樣。 【先前技術】 圖1係說明一習知之印刷電路板製造方法，且該習知 ，藝係揭露於韓國專利冑2G3,54()(該對應案為美國專利案 弟 5，600，103 號）。 、揭示於韓國專利案第203540號之製造印刷電路板的方 法將參照第1圖敘述於下。 篩k印刷將依導電膏塗覆在一銅箔圖案3上之製程係 一 ^重複實施，以獲得-圓錐導體凸塊（b卿）2,，其以- 預定同度成長，並且—薄膜型之合成樹脂基礎之支樓體4 係被定位在該圓錐導體凸塊2,上並且用一滾輪或類似物施 壓，於是該圓錐導體凸《2，能從該合成樹脂基底之支樓體 4穿過及凸出。 因此 銅箔係放置於該導體凸塊2，之凸出的上終端 部處及予以施壓以形# —)如力上 t成在该銅洎處之電路圖案，因而完成 一内部連接器1。 然而，前述印刷電路板製造方法之缺點係在於用於塗 敷，導電膏之製程必須被重複地執行數次以形成具有一特 定高度之導體凸塊2’ ’造成該製程變得複雜化。 此外，為了增加該導體凸塊2，之高度，該導體凸塊2, 之較下方部份的直徑應該被維持在一特定尺寸之上。然後 ’ δ亥相鄰導體凸塊係相互維持一距離，使得難以形成一細 線圖案，而難以獲得一精密細緻之印刷電路板。 甚而，在重複塗敷該導電膏之過程中，則不論何時塗 敷該導電f，必須執行對準製程，造成生產力退化以及介 於孩重複塗敷之導電貧之間的連接力亦退化等問題。 圖2A及2B揭示另-習知技藝之範例，其揭露在日本 公開公告號2001 -1 1 1 1 89(其對應於美國專利號 6, 528, 874)。 揭路在日本公開公告號2 〇 〇卜11丨丨8 9之印刷電路板製 造方法係如下所述。 首先，準備一基底材料10。意即，該基底材質1〇係 由一第一銅層11及一第二銅層12,並且在該第一銅層與 該第二銅層之間係堆疊一抗蝕刻層i 3(參考圖2A)。 該第一銅層 16，以電性地592019 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a multilayer printed circuit board, and more particularly to a method for interconnecting multilayer printed circuit boards. Enough to electrically connect circuit patterns stacked in multiple layers. [Prior Art] FIG. 1 illustrates a conventional printed circuit board manufacturing method, and the conventional art is disclosed in Korean Patent No. 2G3,54 () (the corresponding case is US Patent No. 5,600,103) . A method for manufacturing a printed circuit board disclosed in Korean Patent No. 203540 will be described below with reference to FIG. 1. The screen k printing will be repeated according to the process of applying a conductive paste on a copper foil pattern 3 to obtain a -conical conductor bump (b 卿) 2, which grows at a predetermined same degree, and-a thin film type. The synthetic resin-based branch body 4 is positioned on the conical conductor bump 2 and pressed with a roller or the like, so that the cone conductor projection "2 can be obtained from the synthetic resin-based branch body 4 Cross and protrude. Therefore, the copper foil is placed on the protruding upper terminal portion of the conductor bump 2 and is pressed to form a shape. # —) The circuit pattern at the copper pin is forced to t, thereby completing an internal connector 1 . However, a disadvantage of the aforementioned printed circuit board manufacturing method is that it is used for coating. The process of conducting a paste must be repeatedly performed several times to form a conductor bump 2 '' having a specific height, which complicates the process. In addition, in order to increase the height of the conductor bump 2, the diameter of the lower portion of the conductor bump 2, should be maintained above a certain size. Then, the adjacent conductor bumps of δH are maintained at a distance from each other, making it difficult to form a thin line pattern, and it is difficult to obtain a precise and detailed printed circuit board. Moreover, in the process of repeatedly applying the conductive paste, whenever the conductive f is applied, an alignment process must be performed, which causes problems such as productivity degradation and degradation of the connection force between the conductive conductors that are repeatedly applied. . Figures 2A and 2B disclose an example of another-known technique, which is disclosed in Japanese Laid-Open Publication No. 2001-1 1 1 1 89 (which corresponds to U.S. Patent No. 6,528,874). The method for manufacturing a printed circuit board whose road is uncovered in Japanese Public Announcement No. 2000b 11 丨 8 9 is described below. First, a base material 10 is prepared. In other words, the base material 10 is composed of a first copper layer 11 and a second copper layer 12, and an anti-etching layer i 3 is stacked between the first copper layer and the second copper layer (refer to the figure). 2A). The first copper layer 16 is electrically

π係用以形成一連接凸部 連接該堆疊之電路圖案，並且第—鋼層係相對較厚。該第 二銅層12係、為了形成該電路圖t，並且該第二鋼層係相 對較薄。 一抗姓薄膜14係形成在該基底材料1〇之上部表面及 下部表面。意即雖然該抗钱薄膜14形成在覆蓋續第 二銅層12之全部表面（參考圖2B)，但形成在該第一銅層 11之表面的抗蝕薄膜14係被去除以形成窗15以及形成一 連接凸部1 6。 592019 在此一狀況，當完成一餘刻製軺士 ，一蝕刻溶液滲透 μ囪15之形成處’去除該銅層11 γ 泠缸 t在該抗蝕薄膜14被 爱敷之部份處仍保留該銅層11，因而❿^ U而形成該連接凸部16( 苓考圖2C)。 ’故該連接凸部 份變成較小，這 在此時，由於蝕刻從表面依序地執行 ^係形成圓錐狀，且其直徑在朝向終端部 就所謂該蝕刻因子。 冋呀，請參考該 二 ，具被該抗蝕刻層1 3 及該抗蝕薄膜14所保護，故該蝕刿、、六 必鄉刻，谷液並不會滲透第二 銅層12。 在完成該钱刻製程後，該抗㈣膜14係被去除，並且 該抗姓_ 13係藉由使用-餘刻溶液也接著被去除，且 該蝕刻溶液可選擇性地僅蝕刻該抗蝕刻層13(參考圖 之後，一半固化物（prepreg)薄膜17係放置在該連接 凸。P 1 6上並使用一滾輪滾壓。接著，該半固化物薄膜1 7 滲透該連接凸部16以定位在各連接凸部16間，且該連接 凸部1 6之終端部份係凸出在該半固化物薄膜丨7之表面上 (參考圖2E)。 該曝露之連接凸部16的終端部分係被研磨而去除，並 且一第二銅層18係被熱壓印以形成一電路圖案。 接著，該第二銅層12及該第三銅層18係藉由該連接 凸部1 6而電性地連接（參考圖2]?)。 之後，一電路圖案係經由一般方法形成在該第二及第 10 592019 一鋼層12及18上，故完成了 -印刷電路板（參考圖⑹。 然而，根據該第二傳統技術之該印刷電路板 具有下列問題。 忐 意即’首先為了形成具有特定高度之該連接凸部Η， 〜一鋼層11係較厚，而造成材料之大量損失。 触，二二’在形成該連接凸部16之姓刻製程中，在考慮該 ^因子’該連接凸部16<終端部份的直徑係小於該連 凸部16之底部直徑。因此’為了具有該終端部份之特 疋直徑值’則該連接凸冑16之底部直徑需要增加，作是 在此-情況’在該連接凸部16《間必須保持一特定間隔 ’使得縮小介於該連接凸部1…的間隙以形成一精細 電路圖案係困難的。 第三’形成該電路圖案之第二銅層12具有-厚度低於 ^微米，但形成該連接凸部之第一銅層η具有大約1〇〇 U求之厚度’所以’該第二鋼層i 2在經該連接凸部16形 成後則被彎折，故造成處理的困難。 匕外根據以上所述之兩種傳統技術之印刷電路板製 造方法係使用㈣印刷方法或是該㈣製程以形成該連接 凸部’造成-材料損失増加之問胃，該連接凸部之硬度係 退化’而生產量係更嚴重惡化。 【發明内容】 口此，本叙明之一目的係提供用於互連一多層印刷電 路板之方法’該方法能夠防卜你士、φ 匕夕J I万止形成電路圖案之金屬層的變 592019 形，比如被彎折，該電路板並且能夠易於處理，以及能夠 藉由在一印刷電路板製造過程中增加基底材料之強度以增 加一生產量。 本發明之另一目的係提供用於互連一多層印刷電路板 之方法，並且該方法能夠減少材枓的損失，並且藉由經一 電鍍方法形成該連接凸部連接一多層印刷電路板之電路圖、 案以增加一連接凸部之強度。 本發明之尚一目的係提供用於互連一多層印刷電路板 之方法，該方法能夠藉由一次過程而同時製造兩個印刷電 路板而增加生產量。 為了根據本發明之目的達成在此體現及廣泛描述之上 述及其他優點，提供用於製造一多層印刷電路板之方法， 其包括：在第一金屬層上形成一抗蝕刻層，並且在該抗蝕 刻層上形成多個電鍍凹槽以選擇性地曝露該第一金屬層； 經由一電鍍製程在被該電鍍凹槽所曝露出之該第一金屬層 的表面處形成-電鑛層以形成連接凸部；移除該抗姓制鲁 並且在該第-金屬層處形成一絕緣層；以及在該絕緣層之 表面處提供-第二金屬層’以使得可被連接至該連接凸部 之一終端部份。 在用於製造本發明之多層印刷電路板的方法中，該第 金屬層係由鋼所製成，並且#用_ & 層 叮农风1且便用乾燥溥膜作為抗蝕刻 鍍凹 在用於製造本發明之多層印刷電路板的方法中，該電 槽係藉由-曝光/顯影製程而部份地移除該抗^層 12 592019 在用於製造本發明之多層印刷電路板的方法中，該絕 緣層係由半固化物所製4 ’並且如果半固化物係為液體， 則其經由L卩刷方法錄，但在使用—紙狀的半固化 物薄膜時’該半固化物薄膜係藉—滾輪壓印方法來壓住以 製造該絕緣層。 在用於製造本發明之多層印刷電路板方法中，該第二 金屬層係由銅所製成，其藉由使用一印子來塵印且：成： 該絕緣層之一表面處。 在用於製造本發明之多層印刷電路板之方法中，在形 成該絕緣層後’將自該絕緣層表面凸出之終端部份研磨^ 平坦化而形成該連接凸部。 為了達成上述目的，亦提供一種用於製造多層印刷電 路板之方法包括··形成具有在—基底片之兩面處形成 第一金屬肖板，及在該第一金屬薄板之表面處％成一抗# 刻層；選擇性地移除在該基底材料處形成之抗#刻層以形 成曝出該第一金屬薄板之凹槽，並且在該凹槽露出之第一 金屬薄板表面填入一金屬層以形成一連接凸部；移除該抗 ㈣層並在該第-金屬薄板處形成—絕緣層；在該料層 之-表面處提供-第二金屬薄板以使得其連接至該連接凸 部之終端部份：分開定位在該基底片之兩側之兩基板；以 及在形成於分開之兩基板處的第—及第二金屬薄板處形成 一電路圖案。 在用於製造本發明之多層印刷電路板的方法中，一分 13 592019 離薄膜***至該基底片與第一金屬薄板之間，使得在印刷 電路板完成之後，第一金屬薄板可以從該基底板處分開， 且該分離薄膜係較基底板小，於是該基底板的邊緣與第一 金屬薄膜之邊緣係彼此附著在一起。 在用於製造本發明之多層印刷電路板的方法中，藉由 該底材料之邊緣以及該分離薄膜之一部份係一起切割^移 除該基礎片與該第一金屬板附著之4，將該兩片基板與該 基底片分開。 為了達成上述目的，亦提供一種用於製造多層印刷電 路板之方法’ #包括：在—第―金屬薄膜之表面處依序地 形成一光敏感絕緣層及一抗蝕刻層；在該光敏感絕緣層及 该杬蝕刻層處形成多個電鍍凹槽以選擇性地曝露第一金屬 薄膜；經由一電鍍製程在被該電鍍凹槽所曝露出之該第一 金屬薄膜的表面處形成一電鍍層以做為連接凸部；移除唁 =蝕刻層並且將第二金屬薄膜定位在絕緣層之表面處以^ 知連接至該連接凸部之一終端部份。 在用於製造本發明之多層印刷電路板之方法中，使用 一液晶相或一薄型聚合物，如同光敏感絕緣層。 為了達成上述之目的，亦提供一種用於製造多層印刷 電路板之方法，其包括： 提供在一基底片之兩面處之一第一金屬薄板所形成之 基底材料以及光敏感絕緣層及一蝕刻阻擋層係依序形成 在該第一金屬薄板之一面；選擇地移除形成在該基底材料 處之光敏感絕緣層及一抗蝕刻層以形成一凹槽，該凹槽曝 14 路孩第金屬薄膜；填入該凹槽所曝露在該第一金屬薄膜 ，之金屬層以形成一連接凸部；移除該抗蝕刻層並且將 第一金屬薄膜定位在絕緣薄膜之表面處以使得其被連接 亥連接凸部之一終端部份；分開定位在該基底片之兩側 處=兩基板；以及於該分開之兩個基板處之第一及第二金 屬薄膜的地方形成一電路圖案。 本發明之前述及其他目的，特點，觀點及優點將從下 列本發明之詳細描述並且參考所附圖< π變得更明顯。 【實施方式】 以下可藉由本發明之較佳實施例細節以及由所附圖式 所說明之範例而參考之。 圖3Α至3J係顯示根據本發明之一實施例，用於製造 一印刷電路板之方法的序向製程。 根據本發明之一實施例，說明用於製造一印刷電路板 之方法現將參考圖3Α至3J而敘述之。 首先’提供一基底材料5〇。形成該基底材料50以使 得一分離薄膜54被定位在具有一特定厚度及強度之基底 片52之兩側處，並且堆疊第一金屬薄膜56在該基底板52 之兩側’而且該分離薄膜54附著至該基底片52(參考圖 3Α) 〇 該分離薄膜54小於該基底板52，以使得該第一金屬 層56之邊緣係直接地附著至該基底板52之邊緣，然而該 第一金屬層56及該基底片52在堆疊該分離薄膜54之處 15 592019 並不會互相接觸。 以具有足夠硬度， 以利於處理該基底 並且能由任何其他 該基底片52係由半固化物所製成 使得其足夠支撐形成電路圖案的部份 材抖5 0。 該第一金屬層56較佳由銅所製成 材料製造只要其具有良好電性傳導。 …做為分離薄膜54’只要能夠防止介於該基底片㈣ 弟：金…6之間的附著’任何材料都可使用。一種用 ，裝造該基底材料係被揭露在美國專利案MAW，盆 係和本發明之相同申請人申請。 八 一乾燥薄膜58以及一抗飴刿 56 抗蝕刻層係重疊在該第一金屬層 之表面處。該乾燥薄膜58係較在下制和π a 接凸部為厚。 仏在下-製程形成之-連 該基底材枓5〇具有一結構， 該底片π炎+ β、、、Ό構之上部與下部係以 " 為中心對稱，所以下一赞 底片52之上部及下部。 “係同時貫施在該基 在提供該基底材枓5G之後，該乾 曝光/顯影製γ ^，、溥膜58係經由一 貝〜版長而破部份移除以形 3Β)。 风電鍍凹槽60(參考圖 該電錢凹槽6〇係用於絲錶游# + 、击拉rr * 用於後、，，貝形成在該乾燥薄膜考夕 連接凸部，故該第 丹存腰58處之 在緩屬層56之表面可以被曝露出。 由電鍍凹槽60曝露之該第—金屬 實施電錢，以形成具有 、屬層56的表面上 。該電鍍層62俜填人 门又^鑛層62(參考圖3C) 係填入形成在該乾㈣膜58之電錢凹槽6〇 16 内並且附著在該第一金屬層56之表面處。 声… 屬層56的表面處，並且該電鑛 曰62形成一連接凸部68(參考圖3D)。 之後’完成-軟㈣在該連接凸部68上以使得該連接π is used to form a connection pattern connecting the stacked circuit pattern, and the first steel layer is relatively thick. The second copper layer 12 is relatively thin in order to form the circuit diagram t. A primary antibody film 14 is formed on the upper surface and the lower surface of the base material 10. This means that although the anti-money film 14 is formed on the entire surface of the second copper layer 12 (refer to FIG. 2B), the resist film 14 formed on the surface of the first copper layer 11 is removed to form the window 15 and A connection convex portion 16 is formed. 592019 In this situation, when finishing making a warrior for a while, an etching solution penetrates the formation of μm 15 'removing the copper layer 11 γ The cylinder t remains at the portion where the resist film 14 is loved The copper layer 11 thus forms the connection protrusion 16 (Lingkao FIG. 2C). Therefore, the connecting convex portion becomes smaller. At this time, since the etching is sequentially performed from the surface to form a conical shape, and the diameter is toward the terminal portion, this is called the etching factor. Whoops, please refer to the second one, which is protected by the anti-etching layer 1 3 and the anti-corrosive film 14, so the etched, etched and etched, the valley liquid will not penetrate the second copper layer 12. After the money engraving process is completed, the anti-etching film 14 is removed, and the anti-last name _ 13 is also subsequently removed by using the -etching solution, and the etching solution can selectively etch only the anti-etching layer 13 (After referring to the figure, a prepreg film 17 is placed on the connection protrusion. P 1 6 is rolled with a roller. Then, the prepreg film 17 penetrates the connection protrusion 16 to be positioned at Between each of the connecting convex portions 16, and the terminal portion of the connecting convex portion 16 is protruded on the surface of the semi-cured film 17 (refer to FIG. 2E). The terminal portion of the exposed connecting convex portion 16 is It is removed by grinding, and a second copper layer 18 is thermally embossed to form a circuit pattern. Then, the second copper layer 12 and the third copper layer 18 are electrically connected through the connection protrusion 16. Connection (refer to Figure 2)?). Then, a circuit pattern is formed on the second and 10th 592019 steel layers 12 and 18 through a general method, so the printed circuit board is completed (refer to Figure ⑹. However, according to The printed circuit board of the second conventional technology has the following problems. To form the connection protrusions 特定 with a specific height, ~ a steel layer 11 is thicker, which causes a large amount of material loss. Touch, 22 'In the process of forming the connection protrusions 16, the factor ^ is considered 'The diameter of the terminal portion 16 < of the terminal portion is smaller than the diameter of the bottom portion of the terminal portion 16. Therefore,' to have a special diameter value of the terminal portion ', the diameter of the bottom portion of the terminal portion 16 needs to be increased. It is here-the situation 'It is necessary to maintain a certain interval between the connection protrusions 16' so that it is difficult to reduce the gap between the connection protrusions 1 to form a fine circuit pattern. Thirdly, the formation of the circuit pattern The second copper layer 12 has a thickness of less than ^ micron, but the first copper layer η forming the connection convex portion has a thickness of about 100 U. Therefore, the second steel layer i 2 passes through the connection convex portion. 16 is bent after being formed, which causes difficulty in handling. The manufacturing method of the printed circuit board according to the two traditional technologies described above is to use the ㈣ printing method or the ㈣ process to form the connection convex portion 'caused- Material loss coupled with stomach problems, The hardness of the connecting protrusions is degraded 'and the throughput is worsened. [Summary of the Invention] One of the objectives of this description is to provide a method for interconnecting a multilayer printed circuit board. The deformation of the metal layer forming the circuit pattern of the φ JI JI Wanzhi 592019, such as being bent, the circuit board can be easily handled, and the strength of the base material can be increased in the manufacturing process of a printed circuit board to increase A throughput. Another object of the present invention is to provide a method for interconnecting a multilayer printed circuit board, which can reduce the loss of material, and connect a multilayer by forming the connection protrusion by a plating method. The circuit diagram and scheme of the printed circuit board to increase the strength of a connecting protrusion. A still further object of the present invention is to provide a method for interconnecting a multilayer printed circuit board, which can increase the throughput by manufacturing two printed circuit boards at the same time in one process. In order to achieve the above and other advantages embodied and broadly described herein in accordance with the purpose of the present invention, a method for manufacturing a multilayer printed circuit board is provided, comprising: forming an anti-etching layer on a first metal layer; and A plurality of electroplated grooves are formed on the anti-etching layer to selectively expose the first metal layer; a plating process is formed on the surface of the first metal layer exposed by the electroplated grooves through an electroplating process to form an electro-mineral layer to form A connection protrusion; removing the anti-last name system and forming an insulating layer at the first metal layer; and providing a second metal layer at a surface of the insulation layer so as to be connectable to the connection protrusion A terminal part. In the method for manufacturing the multilayer printed circuit board of the present invention, the first metal layer is made of steel, and a dry film is used as the anti-etching concave layer In the method for manufacturing the multilayer printed circuit board of the present invention, the electrical tank is partially removed by the -exposure / development process. 12 592019 In the method for manufacturing the multilayer printed circuit board of the present invention The insulation layer is made of semi-cured material 4 'and if the semi-cured material is liquid, it is recorded by the L 卩 brush method, but when using a paper-like semi-cured film', the semi-cured film system The insulation layer is manufactured by a roller embossing method. In the method for manufacturing the multilayer printed circuit board of the present invention, the second metal layer is made of copper, which is dust-printed by using a stamper and formed into: a surface of the insulating layer. In the method for manufacturing the multilayer printed circuit board of the present invention, after the insulating layer is formed, the terminal portion protruding from the surface of the insulating layer is ground ^ flattened to form the connection convex portion. In order to achieve the above-mentioned object, a method for manufacturing a multilayer printed circuit board is also provided, which includes forming a first metal plate on both sides of a base sheet, and forming% anti-antibodies at the surface of the first metal sheet # Etching layer; selectively removing the anti-etching layer formed at the base material to form a groove exposing the first metal sheet, and filling a metal layer on the surface of the first metal sheet exposed by the groove to Forming a connecting convex portion; removing the anti-rust layer and forming an insulating layer at the first metal thin plate; providing a second metal thin plate at the surface of the material layer so that it is connected to the terminal of the connecting convex portion Part: two substrates positioned separately on both sides of the base sheet; and a circuit pattern formed at the first and second metal thin plates formed at the two separated substrates. In the method for manufacturing the multilayer printed circuit board of the present invention, a minute 13 592019 is inserted between the substrate sheet and the first metal sheet, so that after the printed circuit board is completed, the first metal sheet can be removed from the substrate The plate is separated, and the separation film is smaller than the base plate, so the edge of the base plate and the edge of the first metal film are attached to each other. In the method for manufacturing the multilayer printed circuit board of the present invention, the edge of the base material and a part of the separation film are cut together. The two substrates are separated from the base sheet. In order to achieve the above-mentioned object, a method for manufacturing a multilayer printed circuit board is also provided. The method includes: sequentially forming a light-sensitive insulating layer and an anti-etching layer on the surface of the first metal thin film; A plurality of plating grooves are formed at the layer and the etched layer to selectively expose the first metal thin film; a plating layer is formed at a surface of the first metal film exposed by the plating grooves through a plating process to As the connection protrusion; remove 唁 = etching layer and position the second metal film at the surface of the insulating layer to connect to a terminal portion of the connection protrusion. In the method for manufacturing the multilayer printed circuit board of the present invention, a liquid crystal phase or a thin polymer is used as a light-sensitive insulating layer. In order to achieve the above-mentioned object, a method for manufacturing a multilayer printed circuit board is also provided, which includes: providing a base material formed of a first metal thin plate on both sides of a base sheet, a light-sensitive insulating layer, and an etching stopper Layers are sequentially formed on one side of the first metal sheet; the light-sensitive insulating layer and an anti-etching layer formed at the base material are selectively removed to form a groove, and the groove is exposed to a 14th metal film ; Fill in the metal layer of the first metal thin film exposed by the groove to form a connecting protrusion; remove the anti-etching layer and position the first metal thin film on the surface of the insulating film so that it is connected by the connection A terminal portion of a convex portion; positioned separately on both sides of the base sheet = two substrates; and forming a circuit pattern at the first and second metal thin films at the separated two substrates. The foregoing and other objects, features, viewpoints, and advantages of the present invention will become more apparent from the following detailed description of the present invention and with reference to the accompanying drawings < π. [Embodiment] The following can refer to the details of the preferred embodiment of the present invention and the examples described by the attached drawings. 3A to 3J are sequential processes of a method for manufacturing a printed circuit board according to an embodiment of the present invention. A method for manufacturing a printed circuit board according to an embodiment of the present invention will now be described with reference to FIGS. 3A to 3J. First, a substrate material 50 is provided. The base material 50 is formed so that a separation film 54 is positioned on both sides of a base sheet 52 having a specific thickness and strength, and a first metal film 56 is stacked on both sides of the base plate 52 'and the separation film 54 Attached to the base sheet 52 (refer to FIG. 3A). The separation film 54 is smaller than the base plate 52, so that the edge of the first metal layer 56 is directly attached to the edge of the base plate 52, but the first metal layer 56 and the base sheet 52 where the separation film 54 is stacked 15 592019 will not contact each other. It has sufficient hardness to facilitate handling of the substrate and can be made of any other substrate sheet 52 made of semi-cured material so that it sufficiently supports the portion forming the circuit pattern. The first metal layer 56 is preferably made of a material made of copper as long as it has good electrical conductivity. ... As the separation film 54 ', any material can be used as long as it can prevent the adhesion between the base sheet 弟 brother: gold ... 6'. One application for making the base material is disclosed in U.S. Patent MAW, and the same applicant filed for the basin and the present invention. A dry film 58 and an anti-etching 56 anti-etching layer are superimposed on the surface of the first metal layer. The dry film 58 is thicker than the bottom and π a contact protrusions.仏 在下-Process formed-even the base material 〇50 has a structure, the film π inflammation + β ,,, and the upper and lower parts of the structure are symmetrical about " as the center, so the upper part of the next film 52 and the The lower part. "At the same time, after the substrate is provided with 5G, the dry exposure / development system ^^, and the film 58 is removed through one part to the length of the plate to shape 3B). Wind plating The groove 60 (refer to the figure, the electric money groove 60 is used for the silk watch game # +, the pull rr * is used for the back, and the shell is formed on the dry film test ridge connection protrusion, so the first Dan waist At 58, the surface of the mild metal layer 56 can be exposed. The first metal exposed by the plating groove 60 is used to form electricity to form a surface having the metal layer 56. The electroplated layer 62 fills the door and ^ The ore layer 62 (refer to FIG. 3C) is filled in the electric money groove 6016 formed in the dry film 58 and is attached to the surface of the first metal layer 56. Acoustic ... At the surface of the metal layer 56, and The power ore 62 forms a connection protrusion 68 (refer to FIG. 3D). After that, 'finish-soft tapping on the connection protrusion 68 to make the connection

Si:广”端部份的直㈣成小於附著在該第-金屬層 底4部份的直徑（參考圖3 ε )。 ，該圓錐形狀具有 金屬層5 6之底部The Si: wide end portion is straightened to be smaller than the diameter of the 4th portion attached to the first metal layer (refer to FIG. 3 ε). The cone shape has the bottom of the metal layer 56

意即，該連接凸部具有一圓錐形狀 一検切上端部以使得其從附著至該第一 部份走向終端部份時，直徑係逐漸減少 “接著絕緣層70係形成在具有該連接凸部68所附 著之該第-金屬層56的一表面上(參考圖3F)。該絕緣層 :〇係由-半固化物所製成，並且如果preperg係在液體狀 態’其可藉由一篩選印刷法來塗敷，但在使用一片型半固That is to say, the connecting convex portion has a conical shape and an upper end portion is cut so that when it is attached to the first portion toward the terminal portion, the diameter is gradually reduced. "The insulating layer 70 is then formed on the connecting convex portion. 68 is attached to a surface of the first metal layer 56 (refer to FIG. 3F). The insulating layer: 0 is made of-semi-cured material, and if the preperg is in a liquid state, it can be printed by a screen. To apply, but using a one-piece semi-solid

化物薄膜之情況了，其被—滚輪麼ep ^^去來壓印所以該連 接凸部68能穿透該半固化物膜。 在形成該絕緣層70後，該連接凸部68之終端部份被 研磨以平坦化該連接凸部68之表面（參考圖3G)。該連接 凸部6 8之終端部份係從該絕緣層7 〇之表面向外突出一特 定程度。 之後，一第二金屬層76係重疊在該絕緣層70之表面 處以使得其能與該連接凸部68之終端部份相接觸（參考圖 3H)。意即，該第二金屬層76係定位在該絕緣層70之表 面並且被一印模壓住。接著，該第一金屬層56及第二金 17 曰β係精㈣接凸部68而電性地連接。該第二金屬層 係較佳由銅所製成，而且只要具有 何其他材料都能被採用。 導電度之任 當該第二金屬層76係被完全地堆疊時， 屬層56及該第二屬層76之基底材料5〇的邊：：沿著虛 線所不之-切開線71切開(參考圖3Η)β由於沿著該切開 線之基底材料50的邊緣被切除，故通過該分離薄膜54 份以及該基底片52與該第一金屬層56相附著之部 知破π除，使得第一電路板8〇及第二電路板“從該基底 片52之上部側與下部側被該分離薄膜54分開，而形成兩 電路板80及82(參考圖31)。 藉由在該分開之第一板80及第二板82上以一般方法 形成電路圖案86及88，可以獲得兩印刷電路板（ 3J)。 " 圖4A至4G係用於製造一印刷電路板之方法的序向製 私視圖’其根據本發明之另一實施例。 一種用於根據本發明另一實施例之製造多層印刷電路 板的方法將參考圖4A至4G予以描述。 首先’提供一基底材料丨〇2。該基底材料1〇2使得一 分離薄膜106置放在由半固化物所製成之一基底片1〇4之 兩側處，並且該第一金屬層1〇8係重疊在具有該分離薄膜 106附著其上之基底片的兩表面處。 之後，一光感絕緣材料110係堆疊在該第一金屬層 108之表面，乾燥薄膜112以及一抗蝕刻層係堆疊在該光 18 592019 感絕緣材料110之一表面上（參考圖4A)。 該分離薄膜1 06係小於該基底片i 04，故該第— 金屬 層108之一邊緣係與該基底片104之一邊緣直接互相附著 ，但是該第一金屬層108與該基底片104在該分離者 1 06被堆疊之部份並不相互附著。 '膜 在接下來製 因而能易於 由半固化物製成之基底片丨04係被硬化以 程中具有足夠剛度支撐形成電路圖案之部份， 處理該基底材料1 〇 2。 〇第一金屬層1 0 8係較佳由銅所製成 好電性導電度之任何材料皆可被採用 忒分離薄膜i06能由任何材料所製成，只要該材料 防止該基底片104與該第-金屬層m之間的附著。b .該光感絕緣材料110能由一液體相或是聚合物之 膜型式所製成，且做為該印刷電路板之—絕緣層。 該基底材料102具有一結構，其中該基底片1〇 部份及下部份得饼益沾 m , 〈上 美底 ，、，，因此隨後之製程是同時實施在該 基底片104之上部份及下部份。 當該基底材料j 02準備 一並剞蔽古/ , +侑好時，則该基底材料102接受 典型曝先/顯影製程以 光敏感絕緣層移除親㈣冑n2及該 〇 形成電鑛凹槽U6(參考圖4B)。 ，並且該成後續所做之連接凸部124 層11〇以眠㈣薄膜112及該光敏感絕緣 層10以曝路出該第-金屬層108之表面。 電鍍係執行在經由該電 、又凹^曰116所曝露之該第一金 19 592019 屬層108之表面以形成該電鍍層12〇(參考圖4C)。該電 鐵層1 20係填入該電鍍凹槽内，且附著至該第一金屬層 108 ’又該電鍍層形成時係較高於該光敏感絕緣層丨丨〇但 並不較該乾燥薄膜112之表面突出。 在經形成該電鍍層12〇之後，該乾燥薄膜丨丨2係被除 去’僅在該第一金屬層108之表面處留下該電鍍層12〇及 該絕緣層11 〇。該剩下的電鍍層丨2〇形成該連接凸部丨24( 參考圖4D)。 之後，該第二金屬層126係堆疊在該絕緣材料11()之 表面處，且與該連接凸部124之終端部份相接觸（參考圖 4E)。意即，該第二金屬層126係定位在該光敏感絕緣層 之一表面處並且該第二金屬層126能與該連接凸部 1 2 4電性連接。 5亥第二金屬層1 2 6係由銅所製成，且只要具有極好電 性導電度之任何材料皆可使用。 當該第二金屬層126被完全堆疊時，被該第一金屬層 108及該第二屬層126堆疊之基底材料102的邊緣係沿著 如虛線所指示之一切割線111切開（參考圖4E)。由於沿著 刀。j線111之基底材料1 0 2的邊緣被切除，故通過該釋 放薄膜106之一部份以及該基底片1〇4與該第一金屬層 108相附著部份處被去除，使得第一電路板1⑽及第二電 路板1 32從該基底片丨〇4之上部側與下部側被該釋放薄膜 106分開，而形成兩電路板13〇及132(參考圖4F)。 精由以一般方法在該分開之第一及第二板13〇及132 20 之上形成電路圖幸ICjfi e 1Q0 αί yu 口系1仏及138，則能夠獲得兩印刷電路板（ 參考圖4G)。 直至目前所描述的用於製造本發明之多層印刷電路板 的方法具有許多優點。 、先因為由半固化物製造之基底片係在該基底材料 之中、給予該基底材料一足夠剛度，目此能容易地處理該 基底材料並且能增加一生產量。 此外’該連接凸部係經由該電鍍製程而形成以與該電 路圖案電性地連接，盥佶用 便用孩師述印刷法或蝕刻之情況相 較則能夠減少材料指生，廿 禎失並且該連接凸部之剛度亦能被增 加0 甚而’因為該印刷電路板能被製造在該基底片之上部 側處及在下部側處，故兩個印刷電路板能被一次製程而予 以製造’並且因此，生產量能夠增加。 ’、、'本發明可以數種形式具體化而不脫離本發明之In the case of the compound film, it is embossed by a roller ep ^^ so that the connection convex portion 68 can penetrate the semi-cured film. After the insulating layer 70 is formed, the terminal portion of the connection convex portion 68 is polished to flatten the surface of the connection convex portion 68 (refer to FIG. 3G). The terminal portion of the connection convex portion 68 is protruded outward from the surface of the insulating layer 70 to a certain degree. Thereafter, a second metal layer 76 is superimposed on the surface of the insulating layer 70 so that it can contact the terminal portion of the connection convex portion 68 (refer to FIG. 3H). That is, the second metal layer 76 is positioned on the surface of the insulating layer 70 and is pressed by a stamp. Next, the first metal layer 56 and the second gold layer 17 are electrically connected to the β-based fine contact protrusions 68. The second metal layer is preferably made of copper, and any other material can be used. When the second metal layer 76 is completely stacked, the sides of the metal layer 56 and the base material 50 of the second metal layer 76 are: cut along the dotted line-cut line 71 (reference (3Η) β is cut off along the edge of the base material 50 along the incision line. Therefore, 54 parts of the separation film and the portion where the base sheet 52 and the first metal layer 56 adhere are removed, so that the first The circuit board 80 and the second circuit board are separated from the upper and lower sides of the base sheet 52 by the separation film 54 to form two circuit boards 80 and 82 (refer to FIG. 31). The circuit patterns 86 and 88 are formed on the board 80 and the second board 82 by a general method, and two printed circuit boards (3J) can be obtained. &Quot; Figures 4A to 4G are sequential views of a method for manufacturing a printed circuit board 'It is according to another embodiment of the present invention. A method for manufacturing a multilayer printed circuit board according to another embodiment of the present invention will be described with reference to FIGS. 4A to 4G. First,' a substrate material is provided. The substrate Material 102 enables a separation membrane 106 to be placed in a semi-cured material The first metal layer 108 is overlapped on both sides of a base sheet 104, and the first metal layer 108 is overlapped on both surfaces of the base sheet having the separation film 106 attached thereto. Then, a light-sensitive insulating material 110 is Stacked on the surface of the first metal layer 108, a dry film 112 and an anti-etching layer are stacked on one surface of the light-sensitive insulating material 110 (refer to FIG. 4A). The separation film 106 is smaller than the base sheet i 04, so one edge of the first metal layer 108 and one edge of the base sheet 104 are directly attached to each other, but the portion where the first metal layer 108 and the base sheet 104 are stacked in the separator 106 is It does not adhere to each other. 'The film is made next so that it can be easily made of a semi-cured base sheet. The 04 series is hardened to have sufficient rigidity in the process to support the part that forms the circuit pattern, and the base material is treated. The first metal layer 108 is preferably made of copper. Any material with good electrical conductivity can be used. The separation film i06 can be made of any material as long as the material prevents the base sheet 104 and the first -Adhesion between metal layers m. B. The The light-sensitive insulating material 110 can be made of a liquid phase or a polymer film type, and serves as an insulating layer of the printed circuit board. The base material 102 has a structure in which the base sheet 10 portion and The lower part of the cake has the benefit of m, 〈上 美 底 ,,,, and so the subsequent process is implemented simultaneously on the upper part and the lower part of the base sheet 104. When the base material j 02 is ready to cover the ancient /, +, When good, the base material 102 undergoes a typical exposure-first / development process to remove the proton n2 and the 0 to form a power ore groove U6 (refer to FIG. 4B) with a light-sensitive insulating layer. The connection between the protruding portion 124, the layer 110, the dormant film 112, and the light-sensitive insulating layer 10 exposes the surface of the first metal layer 108. The electroplating is performed on the surface of the first metal 19 592019 metal layer 108 exposed through the electric and concave 116 to form the electroplated layer 12 (refer to FIG. 4C). The electric iron layer 1 20 is filled in the electroplating groove, and is attached to the first metal layer 108 ′. The electroplating layer is formed higher than the light-sensitive insulating layer when it is formed, but not more than the dry film. The surface of 112 is prominent. After the plating layer 120 has been formed, the dried film 2 is removed ', leaving the plating layer 120 and the insulating layer 110 only at the surface of the first metal layer 108. The remaining plated layer 20 forms the connection protrusion 24 (refer to FIG. 4D). After that, the second metal layer 126 is stacked on the surface of the insulating material 11 () and is in contact with the terminal portion of the connection protrusion 124 (refer to FIG. 4E). That is, the second metal layer 126 is positioned at a surface of the light-sensitive insulating layer and the second metal layer 126 can be electrically connected to the connection protrusion 1 2 4. The second metal layer 1 2 6 is made of copper, and any material having excellent electrical conductivity can be used. When the second metal layer 126 is completely stacked, the edge of the base material 102 stacked by the first metal layer 108 and the second dependent layer 126 is cut along one of the cutting lines 111 indicated by the dotted line (refer to FIG. 4E). ). Thanks along the knife. The edge of the base material 102 of the j-line 111 is cut off, so a portion of the release film 106 and the portion where the base sheet 104 and the first metal layer 108 adhere are removed, so that the first circuit The board 1⑽ and the second circuit board 132 are separated from the upper side and the lower side of the base sheet 104 by the release film 106 to form two circuit boards 130 and 132 (refer to FIG. 4F). By forming a circuit diagram on the separated first and second boards 1330 and 13220 by a general method, for example, ICjfi e 1Q0 α yu port system 1 仏 and 138, two printed circuit boards can be obtained (refer to FIG. 4G). The method described so far for manufacturing the multilayer printed circuit board of the present invention has many advantages. First, because a base sheet made of a semi-cured material is contained in the base material, the base material is given a sufficient rigidity, so that the base material can be easily processed and a production amount can be increased. In addition, 'the connection convex part is formed through the electroplating process to be electrically connected to the circuit pattern. Compared with the case where the printing method or etching is used for washing, the material can be reduced, and The stiffness of the connecting protrusion can also be increased by 0 or even 'because the printed circuit board can be manufactured at the upper side and the lower side of the base sheet, two printed circuit boards can be manufactured in one process' and Therefore, the throughput can be increased. ',,' The invention may be embodied in several forms without departing from the scope of the invention

神：其基本特性’其亦應理解到上述實施例並不受限於 何刖述細節’除非另有其他指^，否則應被廣泛推論在 附申請專利範圍所界定之精神及料之内，且因而所有 變及修改’或此種邊界之等效物亦應包含在 利範圍之内。 胃 【圖式簡單說明】 所附圖式係包括來提供更進而了解本發明並合併至及 冓成D兒月書的部份，其解說本發明之實施例並且解釋 21 592019 本發明之原理。 (一）圖式部分 圖1係根據一習知技術之實施例顯示用於製造一印刷 電路板之方法的視圖； 圖2A至2G係視圖，其顯示根據習知技術另一實施例 之製造一印刷電路板之方法的順序製程； 圖3A至3】係視圖，其顯示根據本發明其中之一實施 例之用於製造一印刷電路板之古 敬之方法的順序製程，·以及 圖4A至4G係視圖，j：顯；相祕丄心 田八”、、員不根據本發明另一實施例之 用於製造-印刷電路板之方法的順序製程。 (二）元件代表符號 1 内部連接器 2， 圓錐導體腫塊 3 銅箔圖案 4 支撐體 10 基底材料 11 第一銅層 12 第二銅層 13 抗蝕刻層 14 抗姓薄膜 15 窗 16 連接凸部 17 半固化物薄膜 18 第二銅層 22 592019 50 基底材料 52 基底片 54 分離薄膜 56 第一金屬薄膜 58 乾燥薄膜 60 電鍍凹槽 62 電鍍層 68 連接凸部 70 絕緣層 71 切割線 76 第二金屬層 80 第一電路板 82 第二電路板 102基底材料 104基底片 106分離薄膜 108第一金屬層 11 0光敏感絕緣材料 11 2乾燥薄膜 11 6電鍍凹槽 120電鍍層 124連接凸部 126第二金屬層 130第一電路板 592019 132第二電路板 136電路圖案 138電路圖案God: Its basic characteristics 'It should also be understood that the above-mentioned embodiments are not limited to the details described' Unless otherwise indicated, it should be widely inferred within the spirit and materials defined by the scope of the attached patent, and therefore All variations and modifications' or equivalents of such boundaries shall also be included in the scope of profit. Stomach [Brief Description of the Drawings] The drawings are included to provide a better understanding of the present invention and have been incorporated into and completed into the D'Yueyue Book, which illustrates embodiments of the present invention and explains the principles of the present invention. (A) Schematic Part FIG. 1 is a view showing a method for manufacturing a printed circuit board according to an embodiment of a conventional technique; FIGS. 2A to 2G are views showing a manufacturing process according to another embodiment of the conventional technique Sequential process of a printed circuit board method; FIGS. 3A to 3] are views showing a sequential process of a method for manufacturing a printed circuit board according to one embodiment of the present invention, and FIGS. 4A to 4G View, j: Display; Phase Secret 丄 心田 八 ", the sequence process of the method for manufacturing-printed circuit boards according to another embodiment of the present invention. (II) Component representative symbol 1 Internal connector 2, cone Conductor bump 3 Copper foil pattern 4 Support 10 Base material 11 First copper layer 12 Second copper layer 13 Anti-etching layer 14 Anti-name film 15 Window 16 Connection protrusion 17 Pre-cured film 18 Second copper layer 22 592019 50 Substrate Material 52 Base sheet 54 Separation film 56 First metal film 58 Dry film 60 Plating groove 62 Plating layer 68 Connecting projection 70 Insulating layer 71 Cutting line 76 Second metal layer 80 First circuit board 82 Two circuit boards 102 substrate material 104 substrate sheet 106 separation film 108 first metal layer 11 0 light-sensitive insulating material 11 2 dry film 11 6 plating groove 120 plating layer 124 connection protrusion 126 second metal layer 130 first circuit board 592019 132 second circuit board 136 circuit pattern 138 circuit pattern

Claims (1)

拾、申請專利範圍： #用於連接多層印刷電路板之電路圖案的凸部製 k方法，該方法特徵在於： 带j —帛—金屬I上形成一抗姓刻層及在該抗钮刻層上 電鍍凹槽以選擇地曝露該第一金屬層； 在該電鍍凹槽所曝露出之該第一金屬層的表面處經由 鍛製程形成—電鑛層，以形成連接凸部； 、去除該抗蝕刻層並且在該第一金屬層處形成一絕緣層 ，以及 在該絕緣層之表面處提供一第二金制，以使得可被 妾至該連接凸部之終端部份。 …2.如中請專利範圍帛i項所述之方法，其中—乾燥薄 膜係做為該抗蝕刻層。 /3·如申請專利範圍帛i項所述之方法，其中該連接凸 部係從該抗蝕刻層之表面突出。 4·如申請專利範圍第丨項所述之方法，其中藉由一曝 光/顯影製程而部份地移除該抗蝕刻層來形成該電鍍凹槽 〇 5·如申請專利範圍帛丨項所述之方法，其進而包括·· 在該連接凸部上實施軟蝕刻以使得該連接凸部之終端部份 之直徑係小於該連接凸部與該第一金屬層相附著之底部的 直徑。 _ 6.如申請專利範圍第丨項所述之方法，其中該絕緣層 係由半固化物所製造。 25 592019 7.如申請專利範㈣6項所述之方法，其巾如果該半 固化物係-液體’則其係經由—篩選印刷方法來塗敷 :果在使用一片型半固化物薄膜時’料固化物薄膜係藉 由一滾輪壓印方法來壓印以製造該絕緣層。 8·如申請專利範圍帛1項所述之方法，其中一利用印 模來壓印以在該絕緣層之一表面處的該第二金屬層。 9.如申請專利範圍第i項所述之方法，其中在形成該Scope of application for patents: #Method for making convex parts of circuit patterns for connecting multi-layer printed circuit boards. The method is characterized in that: a j- 帛 -metal I is formed with an anti-surname engraving layer and the anti-button engraving layer. An electroplating groove is selectively exposed on the first metal layer; a surface of the first metal layer exposed by the electroplating groove is formed through a forging process-an electric ore layer to form a connecting protrusion; and removing the resistance An etching layer is formed and an insulating layer is formed at the first metal layer, and a second gold is provided at a surface of the insulating layer so as to be able to be pinched to a terminal portion of the connection protrusion. … 2. The method as described in item (i) of the patent scope, wherein-a dry film is used as the anti-etching layer. / 3. The method as described in item (i) of the scope of application for a patent, wherein the connection protrusions protrude from a surface of the anti-etching layer. 4. The method according to item 丨 of the scope of patent application, wherein the plating groove is formed by partially removing the anti-etching layer by an exposure / development process. The method further comprises: performing soft etching on the connection convex portion so that a diameter of a terminal portion of the connection convex portion is smaller than a diameter of a bottom portion where the connection convex portion is attached to the first metal layer. _ 6. The method according to item 丨 of the patent application scope, wherein the insulating layer is made of a semi-cured material. 25 592019 7. The method as described in item 6 of the patent application, if the semi-cured material is a liquid, then it is applied through a screening printing method: if a piece of semi-cured film is used, The cured film is embossed by a roller embossing method to manufacture the insulating layer. 8. The method according to item 1 of the scope of patent application, wherein a stamp is used to emboss the second metal layer at one surface of the insulating layer. 9. The method as described in item i of the scope of patent application, wherein 絕緣層之後，藉由將該絕緣層表面突出的終端部份研磨及 平坦化而形成該連接凸部。 1 〇· —種用於連接一多層印刷電路板之線路圖案的方法 ’該方法特徵在於： 、提供一基底材料於第一金屬薄板在一基底片之兩表面 處以及在δ亥第一金屬薄板之一表面處形成的抗蝕刻層； 選擇性地移除形成在該基底材料處之該抗蝕刻層以形 成曝路4第一金屬薄板之凹槽，並且在該凹槽所曝露之該 第金屬薄板之表面處經由電鍍製程填入一金屬層以形成鲁 一連接凸部； 移除該抗餘刻層並且在該第一金屬薄板處形成一絕緣 層； 在該絕緣薄膜之一表面提供一第二金屬薄板使得其連 接至該連接凸部之一終端部份； 分開定位在該基底片之兩側處的兩基板； 在該分開之兩基板處之第一及第二金屬薄板處形成一 電路圖案。 26 592019 11 ·如申請專利範圍第10項所述之方法，其中一分離 >專膜係***在該基底片與該第一金屬薄板之間使得該第一 金屬薄板在一印刷電路板完成後可與該基底片分開。 12·如申請專利範圍第11項所述之方法，其中該分離 薄膜係較小於該基底片使得該基底片的邊緣與該第一金屬 薄板的邊緣能相互附著。 13 ·如申請專利範圍第1 〇項所述之方法，其中該基底 片係由半固化物所製成。 14.如申請專利範圍第1〇項所述之方法，其中該抗蝕 刻層係由一乾燥薄膜所形成。 15·如申請專利範圍第1〇項所述之方法，其中藉由一 +光/ ,、、、員〜製耘而部份地移除該抗蝕刻層以在該抗蝕刻層 處形成該凹槽。 1欠如申請專利範圍帛10項所述之方法，其中該連接 :、藉由t鍍製程而在由該凹槽所曝露之該— 薄膜的表面上形成—電鍍層而製成。 金屬 17.如申請專利範圍第1〇項所述之方法，並 ^在f連接凸部上執行軟㈣使得該連接凸部之终端部 徑U小於㈣接凸部附著在該第—金屬薄板之底部的 丄〇·戈口 T靖寻利範 其中該連接 坦化從該絕 其中該絕緣After the insulating layer, the connecting convex portion is formed by grinding and planarizing the protruding terminal portion of the surface of the insulating layer. 10. A method for connecting a circuit pattern of a multilayer printed circuit board. The method is characterized in that: a base material is provided on both surfaces of a base sheet of a first metal sheet, and An anti-etching layer formed at one surface of the thin plate; selectively removing the anti-etching layer formed at the base material to form a groove in the first metal thin plate of the exposure path 4, and the first metal plate exposed in the groove A metal layer is filled into the surface of the metal sheet through an electroplating process to form a connecting protrusion; the anti-etching layer is removed and an insulating layer is formed at the first metal sheet; a surface of the insulating film is provided with a The second metal sheet is connected to a terminal portion of the connecting convex portion; two substrates positioned separately on both sides of the base sheet; a first and a second metal sheet are formed on the separated two substrates; Circuit pattern. 26 592019 11 · The method according to item 10 of the scope of patent application, wherein a separation > special film is inserted between the base sheet and the first metal sheet so that the first metal sheet is completed on a printed circuit board Separate from the base sheet. 12. The method according to item 11 of the scope of patent application, wherein the separation film is smaller than the base sheet so that the edge of the base sheet and the edge of the first metal sheet can adhere to each other. 13. The method as described in claim 10, wherein the base sheet is made of a semi-cured material. 14. The method as described in claim 10, wherein the etching resist layer is formed of a dry film. 15. The method as described in item 10 of the scope of patent application, wherein the anti-etching layer is partially removed by a + light / ,,,, or ~ to form the recess at the anti-etching layer. groove. 1 The method described in item 10 of the scope of the patent application, wherein the connection is made by forming a plating layer on the surface of the-film exposed by the groove by a t-plating process. Metal 17. The method as described in item 10 of the scope of the patent application, and performing a soft tap on the f-connecting convex portion so that the diameter U of the terminal portion of the connecting convex portion is smaller than that of the connecting convex portion attached to the first metal sheet. The bottom of the 口 〇 · 口 T Jing seeking profit Fan where the connection is frank from the insulation which the insulation π厂现之2 凸部係在經形成該絕緣層之後，藉由研磨 緣層表面突出之該連接凸部的終端部份而 19.如申請專利範圍第1〇項所述之方 27 層係由半固化物所製成。 申月專利範圍第1 0項所述之方法，其中該兩個 基板係以下列方式而從該基底片處分開··該基底材料的邊 緣與該分離薄膜之一邺彳八 xp , ^ 4知一起切開以移除該基底片與該第 一金屬薄板相附著之部份。 21· —種用於連接一多層印刷電路板的線路圖案之凸部 製造方法，該方法特徵在於： 在一第一金屬層之表面處依序地形成一光敏感絕緣層 及一抗钱刻層； 在4光敏感絕緣層及一抗餘刻層處形成一電鑛凹槽以 選擇性地曝露出該第一金屬層； 在由電鍍凹槽曝露出之第一金屬層的一表面經由一電 鍍製程形成-電鍍層以形成連接凸部；以及 移除該抗蝕刻層並且將一第二金屬㈣立在該絕緣層 之-表面處使得被連接至該連接凸部之—終端部份。 22·如申6青專利範圍第21項所述之凸部製造方法，其 中液相或薄膜型聚合物可被使用作為光敏感絕緣層。 23·如申請專利範圍第21項所述之凸部製造方法，其 中-乾燥薄膜係被使用作為該抗㈣層。 24·如申請專利範圍第21項所述之凸部製造方法，其 中"亥凹槽係藉由—曝光/顯影製程而部份地移除該光敏感 絕緣層及該抗敍刻層而形成。 25·如申請專利範圍第21項所述之凸部製造方法，其 中，亥第—金屬層係藉使用一印模而壓印並且形成在該絕緣 28 592019 層之一表面。 26.如申請專利範圍第21項所述之凸部製造方法，其 進而包括： 藉由使用該第一金屬層及該第二金屬層而形成一電路 圖案。After the formation of the insulating layer, the 2 convex portions of the π factory are formed by grinding the terminal portion of the connecting convex portion protruding from the surface of the edge layer. 19. The 27-layer system described in item 10 of the scope of patent application Made of semi-cured material. The method described in item 10 of Shenyue's patent scope, wherein the two substrates are separated from the base sheet in the following manner: The edge of the base material and one of the separation films are xxp, ^ 4 Cut together to remove the part where the base sheet is attached to the first metal sheet. 21 · —A method for manufacturing a convex portion of a circuit pattern for connecting a multilayer printed circuit board, the method is characterized by: sequentially forming a light-sensitive insulating layer and an anti-money engraving on the surface of a first metal layer Forming a power ore groove at the 4 light-sensitive insulating layer and an anti-etching layer to selectively expose the first metal layer; a surface of the first metal layer exposed by the plating groove is passed through a An electroplating process forms an electroplated layer to form a connection protrusion; and removes the anti-etching layer and stands a second metal at the -surface of the insulating layer so as to be connected to the -terminal portion of the connection protrusion. 22. The method for manufacturing a convex portion as described in item 21 of the 6th patent application, wherein a liquid-phase or film-type polymer can be used as a light-sensitive insulating layer. 23. The method of manufacturing a convex portion according to item 21 of the scope of patent application, wherein a dry film is used as the anti-sag layer. 24. The method of manufacturing a convex portion as described in item 21 of the scope of patent application, wherein the " Hai groove is formed by partially removing the light-sensitive insulating layer and the anti-etching layer through an exposure / development process. . 25. The method for manufacturing a convex portion as described in item 21 of the scope of patent application, wherein the helium-metal layer is embossed by using a stamper and formed on one surface of the insulating layer 28 592019. 26. The method of manufacturing a convex portion according to item 21 of the scope of patent application, further comprising: forming a circuit pattern by using the first metal layer and the second metal layer. 拾壹、圖式： 如次頁Pick up, schema: as the next page 2929
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KR100442918B1 (en) 2004-08-02
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CN1520250A (en) 2004-08-11
JP3921595B2 (en) 2007-05-30
TW200415975A (en) 2004-08-16

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