583347 五、發明說明 【技術領 本發 指一種由 以提高其 【先前之 如第 玻璃基板 作業，而 方式，以 鑄槽8 4 模仁8 5 然而 度），在 模仁會因 的使用壽 【目的及 本發 電鑄模仁 構表面以 化學方式 方式於化 沈積金屬 仁表面硬 【技術内 (1) 域】 明係有 導電薄 硬度之 技術】 3圖所 8 1表 於基板 改變微 中進行 〇 ，電鑄 塑膠射 硬度不 命，故 功效】 明之主 表面硬 真空濺 於金屬 學鎳層 層與電 度之功 容】 關一種電鑄 膜、沈積金 製造方法。 示，為習用 面塗佈光阻 8 1表面形 結構8 2 1 電鑄鎳，而 模仁之硬度 出成型之高 夠而容易產 有加以改進 要目的，在 度提升方法 射鍍膜方式 導電薄膜上 上形成一電 鑄鎳層共同 效0 模仁表面硬度提升之方法，尤 屬層及電鑄鎳層共同形成模仁 電鑄模仁之製造流程，其係於 8 2 ，再經光罩曝光及顯影等 成微結構8 2 1 ，再經由加熱 成曲面微結構8 3 ，而後於電 於曲面微結構8 3上形成電鑄 約Η V 2 4 0 (維克氏微小硬 溫及高摩擦力的作用下，電鑄 生損耗，進而降低了電鑄模仁 之必要。 於解決上述的問題而提供一種 ，藉由於玻璃基板之曲面微結 鍍上一層金屬導電薄膜，再以 沈積一化學鎳層，最後以電鑄 鑄鎳層，而由金屬導電薄膜、 形成金屬模仁，以達到提升模583347 V. Description of the invention [Technical claim This refers to a method to improve its [previously as the first glass substrate operation, and the way to cast the groove 8 4 mold core 8 5 degrees), in the mold core will be used [life] The surface of the core structure of the power generation mold is chemically hardened on the surface of the chemically deposited metal core. [Inside (1) domain] The technology with thin conductive hardness is shown in Fig. 8. 1 The table is performed in the micro substrate change. Casting plastic shot hardness is not fatal, so the effect] Ming Zhi hard vacuum splashed on the metallic nickel layer and power capacity] A method for manufacturing electroformed film and depositing gold. As shown in the figure, for the conventional surface coating photoresist 8 1 surface-shaped structure 8 2 1 electroformed nickel, and the hardness of the mold kernel is high enough for molding and easy to produce. The purpose is to improve it. A method of forming an electroformed nickel layer to improve the surface hardness of the mold core, especially the manufacturing process of the layer and the electroformed nickel layer to form the mold core and the electroformed mold core. It is based on 8 2 and is then formed through photomask exposure and development. The microstructure 8 2 1 is heated to form a curved microstructure 8 3, and then an electroformed approximately Η V 2 4 0 is formed on the curved microstructure 8 3 (Vickers under the action of micro-hard temperature and high friction, Electroforming generates losses, thereby reducing the need for electroforming mold cores. In order to solve the above problems, a method is provided, in which a metal conductive film is plated on the surface of the micro-junction of the glass substrate, and then a chemical nickel layer is deposited. A nickel layer, and a metal conductive film to form a metal mold core to achieve a lifting mold
第4頁 583347 五、發明說明（2) 本發明係 括下列步驟： 形成導電 於玻璃基 沈積金屬 將具有金 後，再以化學 電鑄： 將沈積有 行電鑄，以於 分離： 將基板分 鎳層共同形成 本發明之 實施例之詳細 當然，本 所不同，但所 說明，並於附 【實施例之詳 請參閱第 之實施例結構 種結構之限制 本實施例 下列步驟： 膜之基板置入化學鎳溶液中浸泡 電薄膜上沈積一層鎳金屬層； 金屬層的 沈積金屬 離，即可 之金屬权 上述及其 說明與附 發明在某 選用之實 圖中展不 細說明】 1圖及第 ，此僅供 提供一種電鑄模仁表面硬度提升方法，其包 膜： 板之曲面微結構表面形成金屬導電薄膜； 層： 屬導電薄 方式於導 基板置入裝有電鑄液的電鑄槽中進 層上形成一電鑄鎳層； 取得由導電薄膜、化學鎳層與電鑄 仁。 他目的與優點，不難從下述所選用 圖中，獲得深入了解。 些另件上，或另件之安排上容許有 施例，則於本說明書中，予以詳細 其構造。 2圖，圖中所示者為本發明所選用 說明之用’在專利申請上並不受此 之一種電鑄模仁表面硬度提升方法，其包括Page 4 583347 V. Description of the invention (2) The present invention includes the following steps: forming a conductive glass-based deposition metal that will have gold, and then chemical electroforming: electroforming the deposition line for separation: separating the substrate The nickel layer together forms the embodiment of the present invention. Of course, the details of this embodiment are different, but the explanation is attached. [For details of the embodiment, please refer to the structure of the first embodiment. Restrictions on the structure and structure of this embodiment. The following steps of this embodiment: A nickel metal layer is deposited on the electric thin film by immersing it in a chemical nickel solution; the deposited metal layer of the metal layer can be deposited, and the metal rights can be described above and its description and attached invention are not shown in a selected actual drawing. This is only to provide a method for improving the hardness of the surface of electroformed mold cores. The coating is: a metal conductive film is formed on the surface of the curved microstructure of the plate; layer: it is a conductive thin method and the conductive substrate is placed in an electroforming tank containing an electroforming liquid. An electroformed nickel layer is formed on the advanced layer; the conductive film, the chemical nickel layer and the electroformed kernel are obtained. His purpose and advantages are not difficult to obtain from the selected applications below. Embodiments are allowed in some other parts, or the arrangement of the other parts, and their structures are detailed in this specification. FIG. 2 is a method for improving the surface hardness of an electroformed mold core in a patent application.
第5頁 583347 五、發明說明（3) 步 將玻璃 泡6〜2 0 該基板2 1 5〜1 2分 步驟二 利用旋 0 r p m 之 0 °C下烘烤 案之光罩經 0 mJ) 1上形成曲3 〜1 8 0 步驟三 於玻璃 膜方式先鍍 真空度約0 電層2 0之 錫 1 0 g/L 、 3 0 °C，浸 酸溶液3 2 結構表面形 步驟四 將具有 驟·: 基板2 分鐘後 ，並在 鐘，以 :形成 轉塗佈 速度旋5〜1 U V曝 ，並以 面微結 μ m ， :鍍膜 基板2 上一層 洗淨 1以 ，再 烘箱 除去 曲面 機（ 轉將 0分 光機 顯影 構2 南度 氫氧 用去 中以 基板 微結 spin 光阻 鐘， 曝光 液顯 2，4 1之曲面 銀導電層 • 0 0 1 〜0 · 基板2 1 ，浸泡 鹽酸 4 Oml/L) 泡時間為1〜3 (濃度5〜1 0 成一含有把成份 :化學鍍鎳1 4 鈀成份導電薄膜 化鉀溶液（2〜4 w· t% )浸 離子水（即乾淨的純水）清洗 8 0〜1 2 5 °C的溫度，烘烤 2 1上多餘水份。 構1 2 c〇ater)al00〜500 塗佈於基板21上，並於11 使光阻變軟，再利具有特定圖 (曝光能量為500〜150 影5〜4 0分鐘，以於基板2 且該曲面微結構2 2之直徑約 7 0 // m。 微結構2 2表面以真空濺射鍍 2 0。其中該真空濺射鍍膜之 0 0 0 1 tori'。再將具有銀導 在氯化亞錫溶液3 1 (氣化亞 中，酸驗值< 1 ，溫度5〜 分鐘，之後再浸泡在氯化I巴鹽 p p m )中，以於基板之曲面微 之導電薄膜2 3 。 2 3之基板2 1置入化學鎳溶Page 5 of 583347 V. Description of the invention (3) Steps are to blister the glass 6 ~ 2 0 The substrate 2 1 5 ~ 1 2 Sub-step 2 Use a mask of 0 mJ for baking at 0 ° C at 0 rpm) 1 Step 3 ~ 1 8 0 Step 3 The glass film method is first applied with a vacuum degree of about 0 electrical layer 2 0 tin 10 g / L, 30 ° C, immersion solution 3 2 structure surface shape step 4 will have a step ·: After 2 minutes on the substrate, spin the coating at a speed of 5 ~ 1 UV at a transfer coating speed of 5 ~ 1, and micro-junction on the surface.: Wash 1 layer on the coated substrate 2 and then remove the surface by an oven ( Turn the 0 spectrophotometer to develop the structure 2 to remove the hydrogen and oxygen to the substrate micro-junction spin photoresist clock, the exposure liquid shows a curved silver conductive layer of 2, 4 1 • 0 0 1 ～ 0 · substrate 2 1, immersed in hydrochloric acid 4 Oml / L) Soak time is 1 ~ 3 (concentration: 5 ~ 10%) Contains ingredients: electroless nickel plating 1 4 palladium component conductive thin film potassium solution (2 ~ 4 w · t%) immersed in ionized water (ie clean pure Water) Wash at 8 0 ~ 1 2 5 ° C and bake excess water on 21 1. Structure 1 2 c〇ater) al00 ~ 500 Apply on substrate 21 and soften photoresist at 11 Zaili has a specific map (exposure energy is 500 ~ 150 shadows for 5 ~ 40 minutes on substrate 2 and the curved microstructure 22 has a diameter of about 7 0 // m. Microstructure 2 2 surface is vacuum sputter plated 2 0. Among the vacuum sputter coatings, 0 0 0 1 tori '. Then the silver having a lead in a stannous chloride solution 3 1 (gasification, acid value < 1, temperature 5 ~ minutes, and then immersion In the chloride chloride salt (ppm), a thin conductive film 2 3 is formed on the curved surface of the substrate. The substrate 2 1 of 2 3 is placed in a chemical nickel solution.
第6頁 583347 五、發明說明（4) 液3 3中，其溫 進行鎳的自催化 鎳層2 4 ，而該 步驟五：電 將鍍上化學 的電鑄槽2 6中 Su 1 famate，N i 當的操作電流密 上形成 步 將 、化學 以 合金， 發明方 氏微小 ，以增 當 。其中 參閱第 1置入 一電鑄鎳 驟六·分 基板2 1 鎳層2 4 本發明之 因此，可 法所製成 硬度）， 長模仁的 然，本發 ，步驟四 3圖，其 鉻酸溶液 一層鉻2 7 ，再 與前述第一實施 以上所述實 度約7 0〜 反應，而於 化學鎳層之 鑄1 5 鎳層2 4的 ’該電每液 ：S03NH2 ) 2 度（2 ASD， 層2 5。 離1 6 與模仁分離 與電鑄鎳層 方法所製成 以提升模仁 之模仁，其 模仁的表面 使用壽命。 明仍存在許 之化學鍍鎳 係將鍍有鈀 3 5中於I巴 進行步驟五 例相同之功 施例之揭示 9 0 °C， 鈀導電薄 厚度約為 基板2 1 係氨基續 )溶液， ;8 ASD) 酸驗值約4〜5 ，以 膜2 3上形成一化學2 〜2 0 0 // m。 置入裝有電鑄液3 4 酸鎳（N i c k e 1 並對基板2 1施予適 ，以於化學鎳層2 4 ，即可取 2 5共同 之模仁， 表面之硬 表面硬度 硬度提高 多例子， 方式亦可 金屬之導 金屬導電 等後續步 效。 係用以說 得由把導電薄膜2 3 形成之金屬模仁。 由於其表面係為鎳I巴 度’依據測試’依本 約Η V 5 0 0 (維克 後，便能增進耐磨性 其間僅細節上之變化 以下列方式替換；請 電薄膜2 3之基板2 薄膜2 3上電鍍沈積 驟，如此，亦可達到 明本發明，並非用以Page 6 5343347 V. Description of the invention (4) In the liquid 3 3, the auto-catalytic nickel layer 2 4 of nickel is carried out at the temperature, and this step 5: electroplating is performed on a chemical electroforming bath 2 6 Su 1 famate, N i When the operating current is densely formed, the alloy is chemically alloyed, and the square is invented to increase the current. Among them, refer to the first step of placing an electroformed nickel step 6 · sub-substrate 2 1 nickel layer 2 4 The present invention can be made by the hardness), long mold kernel, this hair, step 4 3 figure, its chromium The acid solution is a layer of chromium 2 7, and then reacts with the above-mentioned actual degree of about 70 to ~, and the chemical nickel layer is cast 1 5 nickel layer 2 4 'The electricity per liquid: S03NH2) 2 degrees (2 ASD, layer 2 5. Li 16 is separated from the mold core and electroformed nickel layer method is used to improve the mold core's mold core, and the surface life of the mold core. It is clear that Xu's electroless nickel plating will be plated with palladium Perform the same five steps in Ibar in 5 to 5 for the same work example. Reveal at 90 ° C, the thickness of the palladium conductive thin is about 2 1 for the amino group on the substrate. Continued); 8 ASD) The acid test value is about 4 ~ 5. A chemical 2 ~ 2 0 0 // m is formed on the film 23. Put nickel acid 1 (nickel 1) containing electroforming solution and apply the substrate 2 1 to the chemical nickel layer 2 4, you can take 2 5 common mold kernels. The surface hardness of the surface is increased. It can also be used for subsequent steps such as metal conduction and metal conduction. It is used to say that the metal mold core formed by the conductive thin film 2 3. Because its surface is nickel I Badu 'based test' according to this test Η V 5 0 0 (After Vic, the abrasion resistance can be improved. Only the changes in details are replaced in the following way; please electroplating deposition on the substrate 2 3 of the film 2 3, so that the invention can also be achieved, not for
第7頁 583347 五、發明說明（5) 限制本發明，故舉凡數值之變更或等效元件之置換仍應隸 屬本發明之範®壽。 由以上詳細說明，可使熟知本項技藝者明瞭本發明的 確可達成前述目的，實已符合專利法之規定，爰提出專利 申請。Page 7 583347 V. Description of the invention (5) The invention is limited. Therefore, any change in value or replacement of equivalent components should still belong to the scope of the invention. From the above detailed description, those skilled in the art can understand that the present invention can indeed achieve the aforementioned purpose, and it has indeed complied with the provisions of the Patent Law, and filed a patent application.
第8頁 583347 圖式簡單說明 第1圖係本發明之流程圖 第2圖係本發明製程之示意圖 第3圖係本發明步驟四以鍍鉻替代鍍鎳之流程示意圖 第4圖係習用之電鑄模仁之製造流程之示意圖 【圖號說明】 (習用部分） 光阻8 2 曲面微結構8 3 電鑄模仁8 5 基板8 1 微結構8 2 1 電鑄槽8 4 (本發明部分 步驟一：洗淨1 1 步驟二：形成曲面微結構1 2 步驟三：真空濺射鍍膜1 3 步驟四：化學鍍鎳1 4 步驟五：電鑄1 5 步驟六：分離1 6 銀導電層2 0 基板2 1 曲面微結構2 2 導電薄膜2 3 化學鎳層24 電鑄鎳層25 電鑄槽2 6 鉻2 7 氣化亞錫溶液3 1 氯化鈀鹽酸溶液3 2 化學鎳溶液3 3 電鑄液3 4 鉻酸溶液3 5Page 583347 Brief description of the diagram. Figure 1 is a flowchart of the present invention. Figure 2 is a schematic diagram of the process of the present invention. Figure 3 is a schematic diagram of the process of step 4 of the present invention in which chromium plating is used to replace nickel plating. Figure 4 is a conventional electroforming mold. Schematic diagram of Ren's manufacturing process [Illustration of drawing number] (conventional part) Photoresist 8 2 Curved microstructure 8 3 Electroformed mold core 8 5 Substrate 8 1 Microstructure 8 2 1 Electroformed tank 8 4 (Some steps of the present invention: Wash 1 1 Step 2: Formation of curved microstructures 1 2 Step 3: Vacuum sputtering coating 1 3 Step 4: Electroless nickel plating 1 4 Step 5: Electroforming 1 5 Step 6: Separation 1 6 Silver conductive layer 2 0 Substrate 2 1 Surface Microstructure 2 2 Conductive film 2 3 Electroless nickel layer 24 Electroformed nickel layer 25 Electroformed bath 2 6 Chromium 2 7 Tin gasified solution 3 1 Palladium chloride hydrochloric acid solution 3 2 Chemical nickel solution 3 3 Electroformed liquid 3 4 Chromium Acid solution 3 5