TW583149B - Quartz article having sand blast-treated surface and method for cleaning the same - Google Patents

Quartz article having sand blast-treated surface and method for cleaning the same Download PDF

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Publication number
TW583149B
TW583149B TW089118717A TW89118717A TW583149B TW 583149 B TW583149 B TW 583149B TW 089118717 A TW089118717 A TW 089118717A TW 89118717 A TW89118717 A TW 89118717A TW 583149 B TW583149 B TW 583149B
Authority
TW
Taiwan
Prior art keywords
cleaning
particles
quartz
less
brush
Prior art date
Application number
TW089118717A
Other languages
English (en)
Chinese (zh)
Inventor
Makoto Saito
Original Assignee
Heraeus Quarzglas
Shinetsu Quartz Prod
Yamagata Shin Etsu Quartz Co L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Quarzglas, Shinetsu Quartz Prod, Yamagata Shin Etsu Quartz Co L filed Critical Heraeus Quarzglas
Application granted granted Critical
Publication of TW583149B publication Critical patent/TW583149B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0075—Cleaning of glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/008—Other surface treatment of glass not in the form of fibres or filaments comprising a lixiviation step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Drying Of Semiconductors (AREA)
  • Glass Melting And Manufacturing (AREA)
  • Surface Treatment Of Glass (AREA)
TW089118717A 1999-09-13 2000-09-13 Quartz article having sand blast-treated surface and method for cleaning the same TW583149B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP25866799 1999-09-13
JP27276499A JP4294176B2 (ja) 1999-09-13 1999-09-27 表面が砂目加工された石英物品の洗浄方法

Publications (1)

Publication Number Publication Date
TW583149B true TW583149B (en) 2004-04-11

Family

ID=26543778

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089118717A TW583149B (en) 1999-09-13 2000-09-13 Quartz article having sand blast-treated surface and method for cleaning the same

Country Status (4)

Country Link
JP (1) JP4294176B2 (ko)
KR (1) KR100473705B1 (ko)
TW (1) TW583149B (ko)
WO (1) WO2001019746A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI465155B (zh) * 2005-07-14 2014-12-11 Univ Tohoku 半導體製造裝置用構件及其洗淨方法
TWI586621B (zh) * 2014-08-04 2017-06-11 圓益ＱｎＣ股份有限公司 化學氣相沉積用石英夾具的表面處理方法、石英夾具的表面處理用組合物及由此製成的石英夾具

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3956291B2 (ja) * 2002-09-19 2007-08-08 東芝セラミックス株式会社 半導体処理用部材
US7250114B2 (en) * 2003-05-30 2007-07-31 Lam Research Corporation Methods of finishing quartz glass surfaces and components made by the methods
JP4485826B2 (ja) * 2004-03-25 2010-06-23 東ソー・クォーツ株式会社 異なる直径部分からなる繋ぎ目なしの石英ガラス管の成形方法
JP4638338B2 (ja) * 2004-12-10 2011-02-23 株式会社福井信越石英 石英ガラス治具又は部材の洗浄方法及び超音波洗浄装置
DE102005005196B4 (de) * 2005-02-03 2009-04-23 Heraeus Quarzglas Gmbh & Co. Kg Verfahren zur Herstellung eines Bauteils aus Quarzglas für den Einsatz in der Halbleiterfertigung und nach dem Verfahren erhaltenes Bauteil
KR101222980B1 (ko) * 2006-06-30 2013-01-17 엘지디스플레이 주식회사 증착 장비의 결정 센서의 재생 방법
DE102006035797B3 (de) * 2006-07-28 2007-08-16 Heraeus Quarzglas Gmbh & Co. Kg Verfahren zum Reinigen von Quarzglasoberflächen
KR101685553B1 (ko) 2014-04-14 2016-12-12 주식회사 원익큐엔씨 반도체 제조 장비용 쿼츠 소재의 표면 처리 방법, 및 그에 의해 제조된 쿼츠 소재
ES2706877T3 (es) 2014-11-13 2019-04-01 Gerresheimer Glas Gmbh Filtro de partículas de máquina para conformar vidrio, unidad de émbolo, cabeza de soplado, soporte de cabeza de soplado y máquina para conformar vidrio adaptada a dicho filtro o que lo comprende
KR101994197B1 (ko) 2019-01-17 2019-07-01 주식회사 에이지 석영물체 자동 샌딩 시스템

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3733670C1 (de) * 1987-10-05 1988-12-15 Nukem Gmbh Verfahren und Vorrichtung zum Reinigen insbesondere von scheibenfoermigen oxidischen Substraten
US5401319A (en) * 1992-08-27 1995-03-28 Applied Materials, Inc. Lid and door for a vacuum chamber and pretreatment therefor
US6007673A (en) * 1996-10-02 1999-12-28 Matsushita Electronics Corporation Apparatus and method of producing an electronic device
US6063205A (en) * 1998-01-28 2000-05-16 Cooper; Steven P. Use of H2 O2 solution as a method of post lap cleaning

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI465155B (zh) * 2005-07-14 2014-12-11 Univ Tohoku 半導體製造裝置用構件及其洗淨方法
TWI586621B (zh) * 2014-08-04 2017-06-11 圓益ＱｎＣ股份有限公司 化學氣相沉積用石英夾具的表面處理方法、石英夾具的表面處理用組合物及由此製成的石英夾具

Also Published As

Publication number Publication date
KR100473705B1 (ko) 2005-03-10
JP4294176B2 (ja) 2009-07-08
WO2001019746A1 (en) 2001-03-22
JP2001151537A (ja) 2001-06-05
KR20020043217A (ko) 2002-06-08

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