TW578805U - Structure for uniformly distributing current for porous anode - Google Patents
Structure for uniformly distributing current for porous anodeInfo
- Publication number
- TW578805U TW578805U TW90205710U TW90205710U TW578805U TW 578805 U TW578805 U TW 578805U TW 90205710 U TW90205710 U TW 90205710U TW 90205710 U TW90205710 U TW 90205710U TW 578805 U TW578805 U TW 578805U
- Authority
- TW
- Taiwan
- Prior art keywords
- uniformly distributing
- porous anode
- distributing current
- current
- anode
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90205710U TW578805U (en) | 2001-04-12 | 2001-04-12 | Structure for uniformly distributing current for porous anode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90205710U TW578805U (en) | 2001-04-12 | 2001-04-12 | Structure for uniformly distributing current for porous anode |
Publications (1)
Publication Number | Publication Date |
---|---|
TW578805U true TW578805U (en) | 2004-03-01 |
Family
ID=32847240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW90205710U TW578805U (en) | 2001-04-12 | 2001-04-12 | Structure for uniformly distributing current for porous anode |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW578805U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108624943A (en) * | 2018-07-18 | 2018-10-09 | 惠州市捷成机电设备有限公司 | A kind of horizontal continuity electroplanting device and preparation method thereof |
CN112941579A (en) * | 2019-11-26 | 2021-06-11 | 昆山东威科技股份有限公司 | Production method for improving copper thickness of circuit board hole dense area and circuit board |
-
2001
- 2001-04-12 TW TW90205710U patent/TW578805U/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108624943A (en) * | 2018-07-18 | 2018-10-09 | 惠州市捷成机电设备有限公司 | A kind of horizontal continuity electroplanting device and preparation method thereof |
CN112941579A (en) * | 2019-11-26 | 2021-06-11 | 昆山东威科技股份有限公司 | Production method for improving copper thickness of circuit board hole dense area and circuit board |
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