574436 --- 案號 90125861_年月日____ 五、發明說明（1) 畳埤 本發明係關於一種電場電子流解偶電鍍控制方法，尤 指=種使金屬離子電泳的電場及使金屬離子析出之電流分 別受到控制的解偶電鍍控制方法，使得欲電鍍的粗糙表面 可受：控而達到平整電鍍之目的。本發明亦涉及利用此控制 方法所構成的新穎電鍍裝置，使得電鍍品質可大大地提升 者。 查’有關金屬電鍛的基本原理係使陽極上的金屬離子 經歷：自陽極表面分離進入電鍍液内成為正離子的電離過 程；由電場作用，使正離子於電鍍液内向陰極游動的電泳 過程；及正離子自陰極擄獲電子成為金屬分子附著在陰極 上的電析過程等之總合過程。 如第1圖所示，即為最早的先前技藝之電鍍裝置，其 中包括：一定電壓直流電源101 ; —導電的受鍍體102，與 陰極相接；一要鍍的金屬1〇3，與陽極相接。在通電後， 在陽極金屬103的金屬分子1〇5失去電子而離子化成為正金 屬離子1 0 6，並在電鍍液中受到離子的擴散作用及電場作 用向陰極受鍍體102接近、接觸並獲得電子而電析成金屬 ^子104，沈積在受鍍體102上。另一方面，陽極1〇3上又 2的ΐ屬分子105丟掉電子轉變為新的金屬正離子106之 電離反應，以補充電鑛液之離子濃度 離 用不斷產生，及擴散作用及電場離子的電離作 離子1〇6由陽極金屬103源源= = :用，正金屬 7仏極欠鍍體1 02移動電574436 --- Case number 90125861_ 年月 日 ____ V. Description of the invention (1) 畳 埤 The present invention relates to a method for controlling electric field electron flow decoupling plating, especially = an electric field for electrophoresis of metal ions and metal ion The decoupling plating control method in which the precipitated current is controlled separately, so that the rough surface to be plated can be controlled: to achieve the purpose of flat plating. The invention also relates to a novel electroplating device constituted by using the control method, so that the electroplating quality can be greatly improved. The basic principle of the investigation of metal electroforging is that the metal ions on the anode undergo the ionization process that is separated from the anode surface into the plating solution and becomes positive ions; the electrophoresis process that causes positive ions to swim toward the cathode in the plating solution by the action of an electric field ; And the positron ions capture electrons from the cathode into a total process of metal electrolysis on the cathode and other processes. As shown in Figure 1, it is the earliest prior art electroplating device, which includes: a certain voltage DC power source 101;-a conductive plated body 102 connected to the cathode; a metal to be plated 103 and an anode Connected. After the current is applied, the metal molecules 105 of the anode metal 103 lose electrons and become ionized into positive metal ions 106, and are subjected to the diffusion of the ions and the electric field in the plating solution to approach, contact and contact the cathode plated body 102. Electrons are obtained and electrolyzed into metal particles 104, which are deposited on the substrate 102. On the other hand, the second metal molecule 105 on the anode 103 loses electrons and transforms into a new metal positive ion 106. The ionization reaction supplements the ion concentration of the electric ore fluid, which is constantly generated, and the diffusion effect and the electric field ion Ionization as ions 106 by source of anode metal 103 = =: used, positive metal 7 仏 underplated body 1 02 mobile electricity
574436 _案號90125861_年月日__ 五、發明說明（2) 析成金屬分子104而完成受鍍體102的電鍍製程。 利用第1圖所示的最早先前技術之電鍍裝置係以電鍍 時間的長短來控制電鍍的厚度。由於陰極表面有一定的粗 链度，會造成離子、電子結合電析時’造成不均句的情 況。使電鍍表面粗糙度愈鍍愈大，而且厚度也不均勻。請 參照第2圖所示因陰極受鍍體1 0 2的表面粗糙所引起的離 子、電子結合之微觀電析過程。由於在陰極102中的電子 移動遠較在電解液中較正離子106移動的快，所以電鍍一 段時間後，會在陰極102表面表面左方產生離子空乏層 107，電子會聚集在陰極102表面等待正離子106電泳過空 乏層107。但是陰極102表面有一定的粗糙高度109，在電 場的驅動下，陰極10 2表面較凸出的尖端會聚集較多的電 子110。再加上尖端左方的空乏層111首先與電泳來正離子 接觸，所以正離子在凸出的尖端會有較快，較多的析出。 因而造成正離子與電，子結合電析時，會有不均勻的情況， 使電鍍表面粗糙度愈鍵愈大，而且厚度也不均勻。 到目前為止，主要有兩項做法被提出來以改進電鍍製 程，以求達到厚度均勻及表面平整的目的。第一項改進的 做法如美國專利第4 7 8 9 4 3 7號所揭示者，在電鍍液中添加 平整劑，例如糖漿。請參考第3圖利用平整劑包圍正離子 的反應機構。已被平整劑2 0 5包圍的正離子201在到達陰極 1 0 2之前，由於正離子間相斥成平均分散分佈2 0 2，並維持 垂直於電極平面的方向平行電泳移動203。在接近陰極102 處由於受到尖端較多電子引力的影響，會偏轉方向朝尖端574436 _Case No. 90125861_Year Month Date__ V. Description of the Invention (2) The electroplating process of the plated body 102 is completed by the precipitation of metal molecules 104. The earliest prior art plating apparatus shown in Figure 1 controls the thickness of the plating by the length of the plating time. Because the cathode has a certain degree of coarse chain, it will cause uneven sentence when ions and electrons are combined and electrolyzed. The plating surface roughness becomes larger and the thickness is uneven. Please refer to Fig. 2 for the micro-electrolysis process of ion and electron bonding caused by the surface roughness of the cathode plated body 102. Because the electrons in the cathode 102 move much faster than the positive ions 106 in the electrolyte, after a period of plating, an ion depletion layer 107 will be generated on the left of the surface of the cathode 102, and the electrons will collect on the surface of the cathode 102 and wait for positive The ions 106 are electrophoresed through the empty depleted layer 107. However, the surface of the cathode 102 has a certain rough height 109. Under the driving of the electric field, the more protruding tips on the surface of the cathode 102 will gather more electrons 110. In addition, the empty layer 111 on the left side of the tip is first brought into contact with positive ions by electrophoresis, so positive ions will precipitate faster and more at the protruding tip. As a result, the combination of positive ions and electrons and electrons may cause non-uniformity, which will increase the roughness of the electroplated surface and increase the bond thickness. So far, two main approaches have been proposed to improve the electroplating process in order to achieve uniform thickness and flat surface. The first improvement is disclosed in U.S. Patent No. 4 7 8 9 4 37, which adds a leveling agent such as syrup to the plating solution. Refer to Figure 3 for a reaction mechanism that surrounds positive ions with a leveling agent. The positive ions 201 that have been surrounded by the leveling agent 2 0 5 reach the cathode 10 2 due to the repulsion between the positive ions to form an evenly distributed distribution 2 0 2 and maintain parallel electrophoretic movement 203 in a direction perpendicular to the electrode plane. Near the cathode 102, due to the influence of more gravitational forces on the tip, it will deflect toward the tip
第6頁 2002.09.17. 007 574436Page 6 2002.09.17. 007 574436
中05處在移雜動Γ』：隨行並帶著包圍離子的平整劑2 0 5。 4 ^ ίΛ Φ 4 析出來後會留在陰極表面，由於尖端 美有車父多的電析，遠黑 八’ 附近2。6。一般平整劑，:上會有較多的平整劑附著在尖端 整劑内移動較電解液中:黏滞Λ比電解液大，正離子在平 雛；*吐6 ^ 中陵’尖端所附的平整劑較多，讓正 平敫程中，料凹下處反比凸出處容易。 !性及分佈，使得離子不易持續集中至陰極失 d、·ρ集中地。迫使離子平均分佈電析於陰極表面上。而 / kί ί目的。然而這種方式容易有平整劑被包圍而混 斤，金屬分子内207，雖然可以用加熱處理等方法將平 正劑逼出，但往往會造成最終電鍍表面上的殘留應力。而 且添加物讓電鍍廢液成份變得更複雜更難處理，會提廢液 處理成本。 第二項改進的做法是採用脈沖電源的方法，例如 US4459460 ，US3886053 ，US6071398 ，US4789437 ， US613258等案所揭示者，其基本工作原理謹依第4〜9圖說 明之。 如第4圖所示為當脈沖電源不供電期間之情況。由於 正離子間正電性的互斥，在平衡狀態下金屬正離子3 〇 i在 電極1 0 2表面3 0 5上應該會平均分佈。第5圖為當脈沖電源 開始時，瞬間會有很大的電子流3 〇 2流入陰極1 〇 2之情形。 由於電子在電極内流動的速度快，而重的正離子移動的速 度慢。正離子會找到最近的陰極表面305取得電子，析出 成為金屬分子303。第6圖為當金屬表面金屬離子消耗完畢The middle 05 is moving heterogeneous Γ ′: It goes along with the leveling agent 2 5 that surrounds the ions. 4 ^ ΛΛ Φ 4 will remain on the surface of the cathode after being precipitated. Because of the electrolysis of the car, the tip of the car is much darker, and it ’s far from Hei’an. General leveling agent: there will be more leveling agent attached to the tip of the leveling agent and moving more than the electrolyte: viscous Λ is greater than the electrolyte, positive ions are in the flat chick; * spit 6 ^ Zhongling 'tip attached There are more leveling agents, so that the concave part of the material is easier than the convex part in the normal flattening process. The properties and distribution make it difficult for the ions to continue to concentrate on the cathode loss d, · ρ. An even distribution of ions is forced on the cathode surface. And / kί ί purpose. However, in this way, the leveling agent is easily surrounded and mixed. Although the metal molecule 207 can be forced out by heat treatment or other methods, it often causes residual stress on the final electroplated surface. In addition, the additives make the composition of the electroplating waste liquid more complicated and difficult to handle, which will increase the cost of waste liquid treatment. The second improved method is to use a pulse power method, such as disclosed in US4459460, US3886053, US6071398, US4789437, US613258, etc. The basic working principle is illustrated in Figures 4-9. Figure 4 shows the situation when the pulse power is not supplied. Due to the mutual repulsion of positive ions between positive ions, in the equilibrium state, the metal positive ions 30i should be evenly distributed on the surface 105 of the electrode 102. Figure 5 shows a situation where a large electron current 3 2 flows into the cathode 1 2 when the pulse power is started. Because electrons flow fast inside the electrode, heavy positive ions move slowly. Positive ions will find the nearest cathode surface 305 and get electrons, which will precipitate into metal molecules 303. Figure 6 shows when metal ions are consumed on the metal surface.
第7頁 2002. 09.17. 008 574436 五、發明說明（4) f表面的電鍍液會形成正離子空乏声304 陰極的電子沒有正離子可以纟士 A，合取^層304。新進入 等待正離子由離子空乏層‘ ‘二:於陰極表面305 陽極…丨，大部份的電子合1中來結合。由於 ；ΐ Γ； ^ ^ Λ /^3〇1" ί 且聚集於凸起尖端的電子又 心43 0 7而 正離子，因此在正離子空J 令308吸引 於尖端部份，讓電鍍表面愈士兪粗 雷】，，會有集中 平均的作用。第7圖利用脈沖電'^源，在正^厚度愈來愈不 上切斷電子的供應，可以避免電子隼中子尖空端乏等層二成離 j脈：的電鑛。由於脈沖電鑛時陰極：面：：離 子，並不容易準確估算，估少_合、生十勺有夕> 的離 會造成電子集中尖端效應。現行太慢，估多時 多的電子流入，然後再利用反向丁 雷，較 如第8圖所示為脈波訊號加上反向脈波移餘:電子’ 成較定電壓方式電鍍達成更平整的 電鍍叮達 t自然擴散到達陰極表=表以子 慢。而且電鍍時取佳的狀況是離子 ^僅二 最後還有一個缺點疋，實際上脈沖電源 非真能瞬間關斷，如苐9圖所 換須要寺間而 示開始電鑛會有-斷電壓w/昇切換的//波型，310所 研上幵，廷時的電鍍電流不 第8頁 2002. 09.17. 009 574436 _案號90125861_年月日__ 五、發明說明（5) 足，電子會選電泳距離最短的位置電析正離子，仍有可能 出現尖端效應。所以於應用脈沖電鍍法時仍使用平整劑。 故利用傳統方法實施電鍍作業，電子在電場的影響 下，在陰極表面的凸出尖端會聚集較多的電子，造成電鍍 金屬表面上凸處愈凸，凹處愈凹，陰極表面甚難做到完全 平整。 發明目的及概述 是以本發明的主要目的在於提供一種新穎的電鍍方 法，其中電場與電流間可以分別獨立調整，使得正離子聚 集在陰極表面的速度較電子快；由於電場的作用，正離子 會聚集在最接近電場陰極處，也就是電鍍表面最凹的部份 等待電子的到達後析·出，所以本發明這種方式的電鍍會使 電鍍表面凹處析出多而凸出析出少，達成平整電鍍。 本發明另一目的.在於提供一種實施本發明方法的電鍍 裝置，使表面粗糙凹凸的陰極受鍍體可達成平整表面。 按照本發明的電鍍方法，其電極的佈置方式為由一高 電壓電源作為正離子電泳驅動電場之用，但並不供應電鍍 電流，及由另一低電壓高電流的電源作為電鍍電子流，並 位在高電壓電源電極的内側。因此，可由與高電壓電源連 接之電泳電極控制正離子的電泳速度較低電壓高電流所供 應的電子流快，即聚集了較多的正離子等待電子，不使電 子有時間發生尖端現像；另一方面，由於作為電鍍體的電 析陰極其凹處最接近位在其後方高電壓電源之電場陰極並 由其上靜電子的吸引，故正離子會向電析電極的凹處集Page 7 2002. 09.17. 008 574436 V. Description of the invention (4) The electroplating solution on the surface of f will form a positive ion squeak 304 The electrons of the cathode can be converted to A without positive ions. New entry waits for positive ions to be bound by the ion-depleted layer ‘‘ ii: on the cathode surface 305 anode…, most of the electrons are combined. Ϊ́ Γ; ^ ^ Λ / ^ 3〇1 " ί and the electrons gathered at the convex tip are centered 43 0 7 and positive ions, so in the positive ion space J 308 attracts the tip part, so that the electroplated surface is more Shijiao coarse thunder], will have the effect of centralized averaging. Figure 7 uses a pulsed electric source, which can't cut off the supply of electrons in the thickness of the positive electrode, which can avoid the lack of the empty end of the neutron tip of the electron plutonium. Since the cathode: face :: ion is not easy to estimate accurately in pulse power ore, it is estimated that less ionization will result in a sharp effect of electron concentration. The current is too slow. It is estimated that the electrons flow in for a long time and then use the reverse Ding Lei, compared to the pulse signal plus reverse pulse shift margin as shown in Figure 8. The flat plated tint diffuses naturally to the cathode surface = the surface is slow. And the best condition when electroplating is that there is only one shortcoming at the end of the ion. In fact, the pulse power can not be turned off instantaneously. As shown in Figure 9, it requires a temple to switch off and it shows that there will be a -break voltage w / Switching // wave type, 310 research institutes, the current of plating is not page 8 2002. 09.17. 009 574436 _ case number 90125861_ year month day __ 5. Description of the invention (5) enough, electronic conference The positive ions are electrolyzed at the position with the shortest electrophoretic distance, and the tip effect may still occur. Therefore, a leveling agent is still used when applying the pulse plating method. Therefore, the traditional method is used to perform the plating operation. Under the influence of the electric field, more electrons will be gathered on the protruding tip of the cathode surface, which will cause the convexities on the electroplated metal surface to become more convex, and the concaves to be more concave. Completely flat. SUMMARY OF THE INVENTION The main purpose of the present invention is to provide a novel electroplating method, in which the electric field and the current can be adjusted independently, so that positive ions can gather on the surface of the cathode faster than electrons; due to the effect of the electric field, positive ions will Concentrated at the cathode closest to the electric field, that is, the most concave part of the electroplated surface will wait for electrons to come out and precipitate out. Therefore, the electroplating in this way of the present invention will cause more precipitates on the electroplated surface and less protrusions to achieve flatness. plating. Another object of the present invention is to provide an electroplating device for carrying out the method of the present invention, so that a cathode plated body having a rough and uneven surface can achieve a flat surface. According to the electroplating method of the present invention, the electrodes are arranged in such a manner that a high-voltage power source is used as a positive ion electrophoresis driving electric field, but does not supply a plating current, and another low-voltage high-current power source is used as a plating electron current, and Located inside the high voltage power electrode. Therefore, the electrophoretic electrode connected to the high-voltage power supply can control the electrophoresis speed of the positive ions. The electrons supplied by the lower voltage and high current flow faster, that is, more positive ions are gathered to wait for the electrons, so that the electrons do not have the time to appear sharp; On the one hand, since the recess of the electrolysis cathode as the electroplating body is closest to the electric field cathode of the high-voltage power source behind it and is attracted by the electrostatic particles on it, positive ions will collect in the recess of the electrolysis electrode.
第9頁 2002. 09.17.010 574436 塵 90125861 年__月一 曰 修正 五、發明說明（6) 結，並在該等凹處得到電子電析成金羼分子。故利用本發 明電析發生是凹處較凸處更有利’因而凹凸電極表面電鍍 結果自然地趨向平整。 較佳實施例_的說明 對本發明上述目的、其他目的及功效進一步的實質了 解，謹配合附圖所示的實施例說明如下： 首先，請參照第1 0圖所示本發明出電泳驅動電場及電 鍍電流所構成的電鍍裝置其中兩組電源401，40 5電極的佈 置方式。電場電源4 0 1為用作產生金屬正離子電泳的驅動 電場之電源，其陽極與金屬離子電泳驅動電場的陽極4 0 2 連接，而陰極與電泳驅動電場的陰極4 0 3相連接，兩電極 4 0 2，4 0 3各被覆以絕緣物質4 0 4。電泳驅動電場電源僅提供 電場以導引正離子電泳，並不提供電鍍電流，故使用高電 壓、低電流之電源，且絕緣物質4 0 4用以斷絕電子進出， 因而防止陽極40 2及陰極4 0 3表面被電離或電析覆蓋。 電鍍電源4 0 5為用作產生電鍍電流，其陽極與位在電 場陽極4 02右端面鄰近的金屬離子電離陽極4 〇6相接，而其 陰極則與位在電場陰極4 〇 3在端面鄰近的金屬離子電析陰 極4 0 7相接。電鍍電源4 〇 5主要在控制電子流的流速，故使 用低電壓高電流的電源。 按照本發明’首先將與電場電源及電鍍電源連接的各 ^恭極置放於電鍍槽之電鍍液内。在使電場電源4 0 1及電 ρί途源4〇5成通路時’則由電場電源4(Π在兩電極4 0 2，403 曰立起一電泳電場’用以導引電鍍液4 0 8内的金屬正離Page 9 2002. 09.17.010 574436 Dust 90125861 __ Month One Amendment V. Description of the invention (6) Junction, and get the electron electrolysis to gold molecules in these recesses. Therefore, it is more advantageous for the concave portion to be higher than the convex portion by the use of the electrolysis of the present invention. Therefore, the electroplating result of the uneven electrode surface naturally tends to be flat. Description of the Preferred Embodiments For a more substantial understanding of the above-mentioned objects, other objects, and effects of the present invention, please refer to the embodiments shown in the accompanying drawings as follows: First, please refer to FIG. The electroplating device composed of electroplating current includes two sets of power sources 401, 405 and 5 electrodes. The electric field power source 4 0 1 is used as a power source for generating a driving electric field for metal positive ion electrophoresis. Its anode is connected to the anode 4 0 2 of the metal ion electrophoresis driving electric field, and the cathode is connected to the cathode 403 of the electrophoretic driving electric field. 4 0 2 and 4 0 3 are each covered with an insulating substance 4 0 4. The electrophoretic driving electric field power supply only provides an electric field to guide positive ion electrophoresis, and does not provide plating current. Therefore, a high-voltage, low-current power source is used, and an insulating substance 4 0 4 is used to cut off electrons in and out, thereby preventing the anode 40 2 and the cathode 4 0 3 The surface is covered by ionization or electrolysis. The electroplating power source 405 is used to generate electroplating current, and its anode is connected to the metal ion ionization anode 406 located near the right end face of the electric field anode 402, and its cathode is adjacent to the electric field cathode 403 near the end face. The metal ion electrolysis cathode is connected to 407. The electroplating power source 405 mainly controls the flow rate of the electron flow, so a low voltage and high current power source is used. According to the present invention ', each electrode connected to an electric field power source and a plating power source is first placed in a plating bath of a plating bath. When the electric field power source 401 and the electric power source 405 are connected to each other, the electric field power source 4 (Π is placed on the two electrodes 4 0 2,403, and an electrophoretic electric field is erected) is used to guide the plating solution 4 0 8 Metal inside is leaving
第10頁 2002. 09.17.011 574436 案號 90125861 曰 修正 五、發明說明（7) 子；而電鍍電源40 5為用以產生電鍍電流，使電鍍液40 8内 的金屬正離子在電析陰極4 〇7上獲得電子成金屬分子而電 析在此陰極4 07上完成電鍍作業。 請參照第1 1圖，表示本發明因電泳驅動電場的陰極 40 3之存在，而影響金屬正離子在電鍍電源4 0 5的電析陰極 4〇7上產生平坦化，等待電鍍陰極40 7的電析反應之機構。 利用本發明，由於分別以高壓電場電源4 0 1控制正離子的 較尚電泳速度，另以低壓電源4 0 5控制電析率，故，在電 析陰極4 0 7之表面由於電泳速度快而電鍍速率慢，聚集了 較多的金屬正離子等待電子。當電析陰極4 〇7之表面不平 整時之高度4 09，正離子由於受到電析陰極4 〇7後方電場陰 極403上靜電子的吸引，會向電析陰極407的凹處4〇1擠， 以期能最接近電場陰極4 0 3，並在該處等待電析陰極4 〇 7上 有新的電子4 1 1到來，以便結合電析出。由於本發明的電 鍵量在電析陰極4 07上的電析是凹處較凸出處更多，所以 電鑛結果會自然的趨向平整，達到平整電鍍表面的目的。 本發明的重點在於讓電泳驅動電場與電鍍電流供應兩 項控制因素可以獨立調整’電極個數可以是四個，也可以 將兩個陽極合併而成為三個電極的方式，電路上#叶也可 =- 源經由=制產"流與電場可；別控制 ί:ί 2 書及中知專f範圍内分成電泳驅動電場及 原僅為方便於 所作權宜之計，而*應限定 本發明必有兩電源，但無論如何變化， 離子於電析陰極表面之凹處等待電子蛀& 不二. 本發明之内。. 、、D合析出’均涵盍在Page 10, 2002. 09.17.011, 574436, case number 90125861, the amendment (7) of the invention; and the plating power source 40 5 is used to generate a plating current, so that positive metal ions in the plating solution 40 8 are electrolyzed on the cathode 4 Electron-forming metal molecules are obtained on 〇7 and electroplating is completed on this cathode 407. Please refer to FIG. 11, which shows that the present invention, due to the existence of the cathode 40 3 of the electrophoretic driving electric field, affects the generation of metal positive ions on the electrolysis cathode 4 07 of the electroplating power source 4 05, waiting for the electroplating cathode 40 7 Mechanism of electrolysis reaction. With the present invention, since the relatively high electrophoresis speed of positive ions is controlled by the high-voltage electric field power source 401 and the electrolysis rate is controlled by the low-voltage power source 405, the surface of the electrolysis cathode 407 has a high electrophoresis speed. The plating rate is slow, and more metal positive ions are accumulated waiting for electrons. When the surface of the electrolysis cathode 4 007 is uneven, the height 4 09, because positive ions are attracted by the electrostatic particles on the electric field cathode 403 behind the electrolysis cathode 407, they will squeeze into the depression 407 of the electrolysis cathode 407. In order to be closest to the electric field cathode 403, and wait for new electrons 4 1 1 to arrive on the electrolysis cathode 407, in order to combine with electro precipitation. Since the amount of electric bonds of the present invention on the electrolysis cathode 407 is more recessed than projected, the result of the electromine will naturally tend to be flat, and the purpose of flattening the electroplated surface is achieved. The focus of the present invention is to allow the two control factors of the electrophoretic driving electric field and the plating current supply to be adjusted independently. The number of electrodes can be four, or the two anodes can be combined to form three electrodes. =-Source via = Production " Flow and electric field can be controlled; don't control: 2 books and Zhongzhizhuan f are divided into electrophoretic driving electric fields and the original is only for the convenience of expediency, and * should limit the invention There are two power sources, but no matter how they change, the ions wait for electrons in the recesses on the surface of the electrode of the electrolysis cathode. Within the present invention. .,, D combined precipitation are all contained in
第11頁 2002. 09.17.012 574436 _案號 90125861_年月日__ 圖式簡單說明 第1圖為最早的先期電鍍裝置之構造示意圖，用以顯示 電池電源、兩電極的佈置方式； 第2圖為第1圖陰極表面的粗糙度及正離子電析反應機構 的示意放大圖。 第3圖為在電鍍液中添加平整劑之習知電鍍裝置，在陰 極表面之正離子電析反應機構示意圖； 第4〜9圖為習知以脈沖電源實行電鍍作業的一系列正離 子電板反應的中間過程之不意圖。 第1 0圖為本發明電場電源、電析電源各電極佈置的構造 圖； 第11圖為第10圖中，電場陰電極與電析陰電極之正離子 電析反應機構示意圖。 主要元件代表符號說明Page 11 2002. 09.17.012 574436 _Case No. 90125861_Year Month Day __ Brief Description of the Drawings Figure 1 is the structural diagram of the earliest pre-plating device, which shows the arrangement of battery power and two electrodes; Section 2 The figure is a schematic enlarged view of the roughness of the cathode surface and the positive ion electrolysis reaction mechanism in FIG. 1. Fig. 3 is a schematic diagram of a conventional electroplating device for adding a leveling agent to a plating solution, and a positive ion electrolysis reaction mechanism on the surface of the cathode; Figs. 4 to 9 are a series of positive ion electric plates that are conventionally plated with a pulsed power source The intent of the intermediate process of the reaction. Fig. 10 is a structural diagram of the arrangement of the electrodes of the electric field power source and the electrolysis power source of the present invention; Fig. 11 is a schematic diagram of the positive ion electrolysis reaction mechanism of the electric field cathode electrode and the electrolysis cathode electrode in Fig. 10. Symbol description of main components
2002. 09.17.013 401 電 泳 驅 動 電 場 電 源 402 電 泳 驅 動 陽 極 403 電 泳 驅 動 陰 極 404 絕 緣 物 質 405 電 鍍 電 源 406 電 離 陽 極 407 電 析 陰 極 408 電 鍍 液 409 電 析 陰 極 表 面 凹 凸處之南度差 410 電 析 陰 極 凹 處 411 電 子 第12頁2002. 09.17.013 401 Electrophoresis driving electric field power source 402 Electrophoresis driving anode 403 Electrophoresis driving cathode 404 Insulation substance 405 Electroplating power source 406 Ionization anode 407 Electrolytic cathode 408 Electroplating solution 409 Electrolytic cathode surface unevenness of the surface unevenness 410 Electrolytic cathode concave Division 411 Electronics 第 12 页