TW564503B - Heat treatment method and device - Google Patents

Heat treatment method and device Download PDF

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Publication number
TW564503B
TW564503B TW91122213A TW91122213A TW564503B TW 564503 B TW564503 B TW 564503B TW 91122213 A TW91122213 A TW 91122213A TW 91122213 A TW91122213 A TW 91122213A TW 564503 B TW564503 B TW 564503B
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TW
Taiwan
Prior art keywords
temperature
target
heat treatment
temperature detector
correction
Prior art date
Application number
TW91122213A
Other languages
English (en)
Chinese (zh)
Inventor
Toshiyuki Makitani
Takanori Saito
Takeshi Takizawa
Karuki Eickmann
Original Assignee
Tokyo Electron Ltd
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Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of TW564503B publication Critical patent/TW564503B/zh

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TW91122213A 2001-03-30 2002-09-26 Heat treatment method and device TW564503B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001100031A JP4393009B2 (ja) 2001-03-30 2001-03-30 縦型熱処理装置

Publications (1)

Publication Number Publication Date
TW564503B true TW564503B (en) 2003-12-01

Family

ID=18953511

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91122213A TW564503B (en) 2001-03-30 2002-09-26 Heat treatment method and device

Country Status (2)

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JP (1) JP4393009B2 (ja)
TW (1) TW564503B (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9157765B2 (en) 2010-12-01 2015-10-13 Industrial Technology Research Institute Self-powered power consumption detecting device and power consumption detecting method thereof
TWI564551B (zh) * 2012-02-10 2017-01-01 東京威力科創股份有限公司 溫度感測器及熱處理裝置
TWI802098B (zh) * 2020-11-27 2023-05-11 大陸商北京北方華創微電子裝備有限公司 半導體熱處理設備的承載裝置及半導體熱處理設備

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4523225B2 (ja) * 2002-09-24 2010-08-11 東京エレクトロン株式会社 熱処理装置
JP2007095789A (ja) * 2005-09-27 2007-04-12 Kumamoto Technology & Industry Foundation 輻射加熱装置
US7727780B2 (en) 2007-01-26 2010-06-01 Hitachi Kokusai Electric Inc. Substrate processing method and semiconductor manufacturing apparatus
JP5973173B2 (ja) 2012-01-23 2016-08-23 東京エレクトロン株式会社 熱処理装置及び熱処理装置の制御方法
KR101985413B1 (ko) * 2018-06-14 2019-06-03 에이에스티엔지니어링(주) 버티컬 복층 베이킹 챔버장치
KR20240042452A (ko) * 2021-09-28 2024-04-02 가부시키가이샤 코쿠사이 엘렉트릭 지지구, 기판 처리 장치, 온도 측정 방법, 반도체 장치의 제조 방법 및 기록 매체

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9157765B2 (en) 2010-12-01 2015-10-13 Industrial Technology Research Institute Self-powered power consumption detecting device and power consumption detecting method thereof
TWI564551B (zh) * 2012-02-10 2017-01-01 東京威力科創股份有限公司 溫度感測器及熱處理裝置
TWI802098B (zh) * 2020-11-27 2023-05-11 大陸商北京北方華創微電子裝備有限公司 半導體熱處理設備的承載裝置及半導體熱處理設備

Also Published As

Publication number Publication date
JP4393009B2 (ja) 2010-01-06
JP2002299257A (ja) 2002-10-11

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