TW559841B - Ceramic-material, ceramic several-layers-component with said ceramic-material and method to produce the component - Google Patents

Ceramic-material, ceramic several-layers-component with said ceramic-material and method to produce the component Download PDF

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TW559841B
TW559841B TW91111667A TW91111667A TW559841B TW 559841 B TW559841 B TW 559841B TW 91111667 A TW91111667 A TW 91111667A TW 91111667 A TW91111667 A TW 91111667A TW 559841 B TW559841 B TW 559841B
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ceramic
ceramic material
layer
patent application
component
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Guenther Pfeiler
Christl Mead
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Epcos Ag
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    • C04B35/63Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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Description

559841 五、發明說明(1 ) 本發明涉及陶瓷材料,其含有鈦酸鋇。本發明亦涉及 一種含有陶瓷材料之陶瓷多層組件及其製造方法。 陶瓷材料已爲人所知,其適合用來製造多層電容器且 具有大約是50或更大之介電常數ε。這些陶瓷材料之缺 點是:由於較大之介電常數,則製造電容値很小之多層 電容是困難的。 由 Mhaisalkar,S.G.;Ready, D.W;Akbar,S.A·;等人所 寫之文件”Mic rowave Dielectric Properties of Doped BaTi409”;J.Am· Ceram. Soc.74[8]( 1 99 1 ) 1 894- 1 898 中已 知一些陶瓷材料,其具有低的介電常數ε = 35且除了 BaTi4〇9之外仍含有Μη02或BaCo3。這些陶瓷材料之缺 點是:其必須在大於120(TC之很高之燒結溫度中進行燒 結且因此不可使用銀成份較高之內電極,此乃因純銀之 熔點是1 0 8 3 °C。在以這些習知之陶瓷材料來製造多層式 電容器時各內電極所需之材料成本會較高,內電極通常 是由銀及鉛所構成之混合物,其中Ag/Pt之混合比(ratio) 是5 0/5 0。但鈿是昂貴的,因此成本很高。 本發明之目的是提供一種陶瓷材料’其具有較低之介 電常數。 本發明中此目的以申請專利範圍第1項之陶瓷材料來 達成。本發明有利之其它形式,具有本發明之陶瓷材料 之陶瓷多層組件及其製造方法描述在申請專利範圍各附 屬項中。 559841 五、發明說明(2) 本發明中之陶瓷組件含有鈦酸鋇(BaTi4〇9)及另外含有 0.1至0.5重量百分比之Μη203 ° 藉由添加Μη203,則以鈦酸鋇爲主之陶瓷材料即具有 較低之介電常數(其介於3 5和3 8之間)。因此,在製造 多層式電容器時可輕易地設定較小之電容値,就此種電 容器之厚度(有效之介電質)及其面積(決定該有效之電容 器板之面積)而言所使用之各層不必遵守一種很精確之 尺寸精確度。 在本發明有利之實施形式中,陶瓷材料另含有一種 Nd2〇3成份,其未超過〇·2重量百分比。 藉由添加Nd203,則可達成之優點是:本發明之陶瓷材 料具有所謂”COG特性”。 本發明亦提供一種陶瓷多層組件,其層堆疊是由交替 地重疊配置之電極層及介電質層所構成且介電質層含有 本發明之陶瓷材料。此種陶瓷多層組件例如可以是多層 電容器,其中各介電質層形成介電質。各電極層即爲電 容器板。藉由適當地配置各外電極(其是與電極層相接 觸),則可使多個單一電容器並聯。 若陶瓷材料含有0.2至1 ·5重量百分比之Ag20成 份,則這樣是有利的。藉由陶瓷材料以銀來作適當之摻 雜,則銀由本發明之多層陶瓷之電極層向外擴散之現象 可降低。可使用銀作爲本發明之陶瓷多層組件之各電極 層用之材料。本發明之陶瓷材料若未添加Ag20來進行 559841 五、發明說明(3) 摻雜,則各電極層中所存在之銀可大量地擴散至陶瓷 中,這樣會使各電極層不穩定。 電極金屬之已減小之擴散現象允許電容器可被製成, 此時在介電質層之厚度介於5和60 // m之間時,電極層 厚度最大是1 . 5 μ m時即足夠在燒結之後保持一種均勻 而連續之電極層。 這些薄電極層之優點是:除了較少之材料損耗(其特別 是在使用貴金屬(例如,銀或鈀)時很重要)之外,由於電 極層及介電質層之收縮特性之差異很小而使積層 (Delamination)變小。此外,厚度較小之電極層所具有 之優點是:在電容器之電容相同時體積之使用率較高。 又,當陶瓷材料含有1至1〇重量百分比之Bi4Ti3012 時是有利的。鈦酸鉍具有燒結輔助劑之功能。藉由添加 一種燒結輔助劑至陶瓷材料’則可達成之優點是:陶瓷 材料在燒結時之燒結溫度可下降至1 000至I200°c之 間,這樣可使電極層中之銀成份較局。 因此,多層組件是特別有利的’其中電極層包含一種 由銀及鈀(重量比是Ag/Pd = 80/20)所形成之混合物。電 極層中較高之銀成份可藉由下述方式達成:陶瓷材料中 以Ag20來摻雜以及藉由燒結輔助劑使燒結溫度下降。 若燒結溫度未下降,則鈀成份須較高’此乃因鈀在較銀 還高之溫度時才會溶化。但較高之鈀成份會使此種組件 製造時之成本較高。
559841 五、 發明說明 ( 4) 陶 瓷 材 料 之 製 造方法例如包含以下各步驟: a) 製 成 一 由 多 種適當之原始材料所形成之混合物。 b) 在 1 00 0和 1 1 5 0 °C之間之溫度對該混合物進行轉換 約 1 至 5 小 時之久。 c) 使 已 轉 換 之 混合物被磨細。 下 述 之 其 它 步 驟亦是可能的: d) 由 已 轉 換 之 混合物製成一種沈積物。 e) 添 加 Ba4Ti3 〇12及Ag02至沈積物。 此 外 本 發 明 亦提供陶瓷多層組件之製造方法,其中 對 由 重 疊 配 置 之 陶瓷原箔(其BaTi4〇9具有1至l〇Wt% 之 B i 4 T i 3 0 ! 2成份)及電極層所構成之堆疊進行燒結且此 種 燒 結 在 溫 度 1 0 0 0至1 1 5 0 °c時進行。 本 發 明 之 方 法 可藉由燒結輔助劑之添加來達成。這樣 所 具 有 之 優 點 是 :燒結溫度可保持較低,因此可使用之 電 極 層 除 了 鈀 以 外亦可含有相當多之銀成份。特別是可 使 用 Ag/Pd 比 (rc itio)是在7 0/3 0和80/20之間之電極 層 〇 本 發 明 以 下 將 依據實施例及圖式來詳述。圖式簡單說 明 ; 第 1 圖 本 發 明 陶瓷多層組件之橫切面。 第 2 圖 本 發 明 之組件之電容之溫度特性之圖解。 第 1 圖 是 -- 種 電容器,其是可表面安裝之組件(SMD) 且 具 有 互 相 重 疊 之電極層1,各電極層1含有電極金屬 -6- 559841 五、發明說明(5) 且藉由陶瓷材料所形成之介電質層2而互相隔開。在電 容器之正面上配置各金屬層3,其中每一電極層1恰巧 與各金屬層3之一在電性上相連。金‘屬層3例如可以是 由銀,鎳及錫所構成之層堆疊,其可特別容易焊接,其 中錫層是最外層,其以電鍍方式沈積在鎳層上。 本發明之陶瓷材料特別適合用來製成多層式電容器, 其幾何大小是0 · 6 nim長,0.8刪1寬及1 .2 ± 0 .1 mm高且電容 是 0.5 〜1 OOPF ° 介電質層可由陶瓷材料(其含有鈦酸鋇及0.2重量百 分比之Μη304)所製成。 由鈦酸鋇開始,以5個內電極及介於其間之陶瓷層來 製成一種多層式電容器,其中陶瓷層由本發明之陶瓷成 份所構成,其包含0.2Wt%之Μη203及O.lWt%之 Nd203。另須對此多層式電容器測定各種不同之電性額 定資料。卜表顯不電容C之電性額定資料,例如,損耗 角度tan5,介電常數ε及-55°C及125°C時電容値相對於 25 t (TKC)時電容値之相對改變率。 表:電容器或本發明之陶瓷之電性額定資料 C TPF1 T an δ [xlO·3] ε TKC(-55 °C ) TKC(125 °C ) 151.68 0.85 38.6 0.1 6 % -0 · 0 6 % 此表顯示:本發明之陶瓷材料所具有之介電常數是 38.6 第2圖是上表中該電容器之電容對溫度之相對改變 559841 五、發明說明(6) 符號說明 1 ...電極層 2...介電質層 3 ...金屬層

Claims (1)

  1. 559841
    θ 餺 # 六、申請專利範圍 第9 1 1 1 1 667號「陶瓷材料,陶瓷多層組件及其製造方法 」專利案 (9 2年7月修正) 六申請專利範圍: 1· 一種以BaTi 409爲主之陶瓷材料,其另外包含0.1至 〇·5重量百分比之Μη203及可達〇·2重量百分比之 Nd2〇3 〇 2.如申請專利範圍第1項之陶瓷材料,其中陶瓷材料另 含有可達2重量百分比之Ag2〇。 3·如申請專利範圍第1或 2項之陶瓷材料,其中陶瓷 材料另含有1至10重量百分比之Bi4Ti3012作爲燒結 輔助劑。 4. 一種陶瓷多層組件,其層堆疊是由交替重疊配置之電 極層(1)及介電質層(2)所構成,其特徵爲:介電質層 (2 )含有一種如申請專利範圍第1至3項中任一項之 陶瓷材料。 5·如申請專利範圍第4項之組件,其中電極層(1 )含有 一由銀及鈀所構成之混合物,其重量比(rati0)Ag/Pd 是介於70/30及80/20之間。 6.如申請專利範圍第4或5項之組件’其中各電極層在 層堆疊之外側上是與金屬層(3 )相接觸’相鄰之各電 極層(1)是與不同之金屬層(3)相接觸,層堆疊之外部 尺寸未超過1.5 _高,1.6 _寬及2 nun長’在各金屬 559841 六、申請專利範圍 層(3)之間所測得之電容未超過100PF。 7. —種陶瓷多層組件之製造方法,其特徵爲:由重疊配 置之陶瓷原箔(其含有BaTi4〇9及1至1〇重量百分比 之B i 4T i 30i 2以作爲燒結輔助劑且配置在其各電極層 (1 )之間)所構成之堆疊須進行燒結且此種燒結是在 1 000至1150°C之間進行。
TW91111667A 2001-07-06 2002-05-31 Ceramic-material, ceramic several-layers-component with said ceramic-material and method to produce the component TW559841B (en)

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