554652 五、發明說明（y 【發明領域】 本發明是有關於一種多層印刷電路板之製造方法，特 別是指一種製程簡單且可節省時間與成本的多層印刷電路 板之製造方法。 5 【習知技藝說明】 隨著印刷電路板層數的增加，除了製造困難度不斷增 加之外，其製程時間亦相對拉長，而其製造技術自然也要 求得更為嚴格，因而能配合製造的廠商相對地減少了，價 格當然也就相對提高。此外，帶有盲孔（使外層板與内層板 10或内層板間訊號可相導通的孔）或埋孔（將貫孔以塞料塞住 使印刷電路板在過錫爐時不致湧錫的孔）的多層印刷電路 板之加工過程亦較為複雜，因為，若要在該多層印刷電路 板上设置盲孔時’必需在内層板製成時，就要先把欲相導 通的兩個内層板間的孔（盲孔）鑽好，然後再在上面繼續鋪 15設其他的内層板或外層板，或者，先製成上面或下面兩層 板，在該兩層板'間鑽孔後，再以壓合方式將該上面或下面 的兩層板與其他層板壓合。而在該多層印刷電路板上設置 埋孔的方式，即是以塞料填塞於該多層印刷電路板上的各 個貫孔’則該等被塞住的貫孔即為埋孔。然而此種設置盲 20 孔及埋孔的作法，在印刷電路板的層數不斷增加時，其複 雜度亦會相對提高。 【發明概要】 因此，本發明之目的，即在提供一種製程簡單且能有 效節省製造時間與成本的多層印刷電路板之製造方法。 第4頁 本紙張尺度適用中國國家標準（CNS)A‘l規格（210 X 297公釐） . 裝·---- (請先閱讀背面之注意事寫本頁) 經濟部智慧財產局員工消費合作社印製 554652 Λ； I~—-----~iii_____ 五、發明說明（2) — 於是，本發明多層印刷電路板之製造方法是將至少兩 _個少層數之印刷電路板疊合_起以形成—多層數印刷電 4路板，該方法是先將兩欲相疊合之印刷電路板上相通的信 ♦號線引至同一側板邊，並在該二板邊製作與各該信號線^ 5接且相對應之焊墊供相互焊接導通，使上、下兩印刷電路 板上之訊號線可相連接導通，而達到製程簡單並減少製作 時間與成本之目的。 ； 【囷式之簡單說明】 本發明之其他特徵及優點，在以下配合參考圖式之較 10佳實施例的詳細說明中，將可清楚的明白，在圖式中： 第一圖顯示本發明多層印刷電路板之製造方法的第一 較佳實施例； 第二圖顯示第一較佳實施例之兩印刷電路板的接合態 樣； 〜 15 第三圖顯示本發明多層印刷電路板之製造方法的第二 較佳實施例；/ 第四圖顯示第二較佳實施例之兩印刷電路板的接合態 樣； " 第五圖顯示本發明多層印刷電路板之製造方法製作盲 20 孔及埋孔時印刷電路板的立體分解圖及每一印刷電路板上 ” 之貫孔；及 * 第六圖顯示第五圖之該等印刷電路板疊合時在印刷電 路板上製作出之盲孔及埋孔。 【較佳實施例之詳細說明】 第5頁 本紙張尺度適用中國國家標準（CNS)A‘l規格（210 X 297公釐） 裝— (請先閱讀背面之注意事項再填邛本頁) 訂 線 經濟部智慧財產局員工消費合作社印製 554652554652 V. Description of the invention (y [Field of the Invention] The present invention relates to a method for manufacturing a multilayer printed circuit board, and particularly to a method for manufacturing a multilayer printed circuit board with a simple process and saving time and cost. 5 [Knowledge Technical Description] With the increase of the number of printed circuit board layers, in addition to the increasing difficulty of manufacturing, its process time is relatively long, and its manufacturing technology is naturally more stringent, so it can cooperate with manufacturers. Reduced, of course, the price will be relatively high. In addition, with blind holes (holes that allow the outer layer board and the inner layer board 10 or the signal between the inner board can communicate) or buried holes (plugging the through hole with a plug to make the printed circuit The process of multilayer printed circuit boards that do not cause tin swells when the board passes through a tin furnace is also complicated, because if blind holes are to be provided in the multilayer printed circuit board, it is necessary to make the inner layer board. First drill the hole (blind hole) between the two inner layer boards to be connected, and then continue laying 15 other inner or outer layer boards on it, or make the upper or After the two-layer board is drilled between the two-layer boards, the upper or lower two-layer boards are pressed together with other layers by a press-fitting method, and a buried hole method is provided on the multi-layer printed circuit board. That is, each through hole of the multilayer printed circuit board is filled with a plug material. Then the plugged through holes are buried holes. However, the method of setting blind 20 holes and buried holes in the printed circuit board As the number of layers increases, the complexity will increase. [Summary of the Invention] Therefore, the object of the present invention is to provide a method for manufacturing a multilayer printed circuit board that has a simple process and can effectively save manufacturing time and cost. 4 pages of this paper size are in accordance with Chinese National Standard (CNS) A'l specifications (210 X 297 mm). Packing ----- (Please read the note on the back to write this page) Intellectual Property Bureau, Ministry of Economic Affairs, Consumer Consumption Cooperative Printed 554652 Λ; I ~ —----- ~ iii _____ 5. Description of the invention (2) — Therefore, the manufacturing method of the multilayer printed circuit board of the present invention is to stack at least two printed circuit boards with a small number of layers_ Starting to form—multi-layer printed electrical 4-circuit board, which side It is to first lead the two signal wires on the printed circuit board that are to be overlapped to the same side board edge, and make corresponding pads connected to each of the signal wires ^ 5 on the two board edges for mutual welding and conduction. The signal lines on the upper and lower printed circuit boards can be connected and conducted to achieve the purpose of simplifying the manufacturing process and reducing the manufacturing time and cost. [Simplified description of the formula] Other features and advantages of the present invention are matched with the following With reference to the detailed description of the preferred embodiment of the figure, it will be clearly understood that in the figure: The first figure shows a first preferred embodiment of the manufacturing method of the multilayer printed circuit board of the present invention; the second figure shows The bonding state of the two printed circuit boards of the first preferred embodiment; ~ 15 The third figure shows the second preferred embodiment of the manufacturing method of the multilayer printed circuit board of the present invention; / The fourth figure shows the second preferred embodiment The bonding state of the two printed circuit boards; " The fifth figure shows the three-dimensional exploded view of the printed circuit board when manufacturing blind 20 holes and buried holes according to the manufacturing method of the multilayer printed circuit board of the present invention and the consistency of each printed circuit board " Holes; and * Figure 6 shows the blind and buried holes made on the printed circuit board when the printed circuit boards of Figure 5 are stacked. [Detailed description of the preferred embodiment] Page 5 This paper size is applicable to China National Standard (CNS) A'l specification (210 X 297 mm) Packing-(Please read the precautions on the back before filling this page) Order Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Online Economy 554652
五、發明說明（） 本發明多層印刷電路板之製造方法是將至少兩個少層 數之印刷電路板疊合一起形成一多層數之印刷電路板。如 第一圖所示，是該方法的第一較佳實施例，其中以兩個四 層印刷電路板1、2之接合為例。首先，將這兩個欲相疊合 5的印刷電路板1、2上要相通的信號線n、21引線至同一 側板邊12、22，然後在該二板邊12、22上製作分別與各 該信號線11、2 1連接且位置相對之焊墊1 3、23 ,且該焊 塾13疋包括對應形成在印刷電路板1之上、下表面的兩個 導接部13 1、132以及形成在板邊12側緣以連接該二導接 10部131、132之焊接部133，且該焊接部133是一平面。而 該焊墊23則包括一形成在印刷電路板2上表面並與上述焊 塾13之導接部132位置相對的導接部231以及一形成在板 邊22側緣並與該導接部23 1連接之焊接部232，因此，當 上、下兩印刷電路板1、2相疊接合時，該等焊墊i3、23 15之各該導接部132與231相貼觸，而該焊接部133、232 則可以電鍍方式相焊接導通，使上、下兩印刷電路板i、2 上的訊號線11、2 1相連接導通，並增加焊接的密合度，藉 而完成一八層印刷電路板3，如第二圖所示。 再參照第三圖所示，是本發明的第二較佳實施例，其 20亦在上、下兩印刷電路板3、4上形成有焊墊31、41 ,且 焊墊31與41亦分別具有導接部311、312、411及焊接部 313、412 ,而與第一實施例不同的是，該等焊墊31、41 之導接部313、412是一凹弧面，如此之設計，當兩印刷電 路板3、4相疊接合時，可增加兩導接部313、412的接觸 第6頁 本纸張尺度適用中國國家標準（CNS)A4規格（2丨〇 X 297公釐） (請先閱讀背面之;1意事j ί Μ — ▼填寫本頁) 經濟部智慧財產局員工消费合作社印製 4;554652 Λ7 五、發明說明（ 5 10 15 20 部分而提高兩電路板3、4焊接的密合度，如第四圖所示。 此夕卜本無明的另一好處是容易在印刷電路板上 盲孔及=，如第五、六圖所示，以三壤二層印刷電路板 、6、7望5成—六層印刷電路板8做為例子，若要㈣ =印刷電路板8上製作盲孔，僅需Μ某—塊或某幾塊 一曰印刷電路板’如印刷電路板6、7上，製作貫孔Μ、 ’則將該等二層印刷電板6、7、8相疊接合在—起成為 該六層印刷電路板8時，如第六圖所示，即可在該六層印 刷電路板8之層板間形成盲孔8卜82。而若要在該六層印 刷電路板8上製作埋孔収加容易，因為形成在每一塊二 層印刷電路板6、7、8上的貫孔51、61、71在該等二層印 刷電路板5、6、7叠合成形成該六層電路板8後並不會相 通（相貫通的機率微乎其微），則該等形成在外層印刷電路 板5、6上不相連通的貫孔51、71即形成了所謂防止祕 的埋孔（其亦是盲孔）83，而不需如上述習知多層印刷電路 板之製程般再對該等相連通之貫孔進行額外的埋孔作業。 综上所述，本發明藉由在至少兩個欲相疊合之少層數 印刷電路㈣同-純邊製作分㈣兩電路板之訊號線連 接且位置相對之焊墊供對應焊接，使上、下兩印刷電路板 之訊號線相導通，並增加兩印刷電路板焊接之密合度，並 且能夠輕易地在製造多層印刷電路板時，製作盲孔與埋 孔，碟實能以簡單之製作方法達到降低製造時間與成^之 功效。 以上所述者，僅為本發明之較佳實施例而已，當不能 訂 線 第7頁 本紙張尺度中關家辟ϋ) A4規格⑵G χ 297公爱） 554652 Λ； Γ>7 5y 五、發明說明（ 以此限定本發明實施之範圍，即大凡依本發明申請專利範 圍及發明㈣㈣料作之簡⑼ 仍屬本發明專利涵蓋之範圍内。 复化與u，皆應 --------------裝—— (請先閱讀背面之注意事04¾本頁) .- #- 經濟部智慧財產局員工消費合作社印製 頁 8 第 本紙張尺度適用中國國家標準（CNS)A4規格（210 497公釐 554652V. Description of the invention () The manufacturing method of the multilayer printed circuit board of the present invention is to stack at least two printed circuit boards with a small number of layers to form a multilayer printed circuit board. As shown in the first figure, this is the first preferred embodiment of the method, in which the joining of two four-layer printed circuit boards 1, 2 is taken as an example. First, the signal lines n and 21 to be connected on the two printed circuit boards 1 and 2 to be overlapped 5 are led to the same side board edges 12, 22, and then the two board edges 12, 22 are made separately from each other. The signal wires 11 and 21 are connected to the opposite solder pads 1 and 23, and the solder pad 13 includes two lead portions 13 1, 132 corresponding to the upper and lower surfaces of the printed circuit board 1 and formed thereon. A welding portion 133 is connected to the side edge of the plate edge 12 to connect the two lead 10 portions 131 and 132, and the welding portion 133 is a flat surface. The soldering pad 23 includes a conductive portion 231 formed on the upper surface of the printed circuit board 2 and opposite to the position of the conductive portion 132 of the solder pad 13, and a conductive portion 23 formed on a side edge of the board edge 22 and connected to the conductive portion 23. 1 is connected to the soldering portion 232, therefore, when the upper and lower printed circuit boards 1, 2 are overlapped and joined, each of the soldering pads i3, 23, 15 and the lead portions 132 and 231 are in contact with each other, and the soldering portion 133, 232 can be connected by electroplating, so that the signal lines 11, 21 on the upper and lower printed circuit boards i, 2 are connected and connected, and the degree of soldering is increased to complete an eight-layer printed circuit board. 3, as shown in the second figure. Referring again to the third figure, it is a second preferred embodiment of the present invention. 20 also has pads 31, 41 formed on the upper and lower printed circuit boards 3, 4, and the pads 31 and 41 are also respectively There are lead portions 311, 312, 411 and welding portions 313, 412. Unlike the first embodiment, the lead portions 313, 412 of the pads 31, 41 are concave arc surfaces, so designed, When the two printed circuit boards 3 and 4 are joined on top of each other, the contact between the two lead portions 313 and 412 can be increased. Page 6 This paper size applies to the Chinese National Standard (CNS) A4 specification (2 丨 〇X 297 mm) ( Please read the back of the book first; 1 事事 j ί Μ — ▼ Fill in this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4; 554652 Λ7 V. Description of the invention (5 10 15 20 part and two circuit boards 3, 4 The tightness of soldering is shown in the fourth picture. Another benefit of this ignorance is that it is easy to blind holes on the printed circuit board and =, as shown in the fifth and sixth pictures, the three-layer two-layer printed circuit board , 6, 7 and 50% —six-layer printed circuit board 8 as an example. If you want to make a blind hole on the printed circuit board 8, you only need one or a few pieces. When a printed circuit board "such as printed circuit boards 6, 7 is made through holes M," then the two-layer printed circuit boards 6, 7, 8 are stacked and joined together to form the six-layer printed circuit board 8. As shown in the sixth figure, a blind hole 8b 82 can be formed between the layers of the six-layer printed circuit board 8. However, if a buried hole is to be formed on the six-layer printed circuit board 8, it is easy to add and receive, because The through-holes 51, 61, 71 on each two-layer printed circuit board 6, 7, 8 will not be connected after the two-layer printed circuit boards 5, 6, 7 are stacked to form the six-layer circuit board 8 ( The probability of being connected is very small), then the through holes 51, 71 formed on the outer printed circuit boards 5, 6 which are not connected, form a so-called buried hole (also a blind hole) 83, which does not need to be protected. As in the above-mentioned conventional multilayer printed circuit board manufacturing process, additional buried holes are performed for these connected through-holes. In summary, the present invention uses at least two printed circuits with a small number of layers to be stacked. The same-pure edge production, the signal wires of the two circuit boards are connected and the opposite pads are provided for corresponding soldering, so that the upper and lower two are printed. The signal lines of the circuit board are connected to each other, and the closeness of the welding between the two printed circuit boards is increased, and it is easy to make blind holes and buried holes when manufacturing multilayer printed circuit boards. The dish can actually reduce the manufacturing time by a simple manufacturing method. The above mentioned effects are only the preferred embodiments of the present invention. When the thread cannot be ordered, page 7 in the paper standard ϋ) A4 size ⑵ G χ 297 public love) 554652 Λ; Γ > 7 5y 5. Description of the invention (to limit the scope of implementation of the present invention, that is, the scope of patent applications and inventions made in accordance with the invention is still within the scope of the invention patent. Rehabilitation and u should both be loaded with -------------- (Please read the notice on the back 0404 page first.) .- #-Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Page 8 This paper size applies to China National Standard (CNS) A4 (210 497 mm 554652
五、發明說明（6) 10 【元件標號對照 I、 2、3、4 四層印刷電路板 5、6、7 二層印刷電路板 II、 21訊號線 12、22板邊 31、41焊墊 133焊接部 232焊接部 313焊接部 412焊接部 81、82盲孔 8 六層電路板 13、23焊墊 131、132導接部 231導接部 311、312導接部 411導接部 51、61、71貫子匕 83埋孔（盲孔） --------------裝--------訂· (請先閱讀背面之注意事項44寫本頁) •線' 經濟部智慧財產局員工消費合作社印製 頁 9 第 ί紙張尺度適用中國國家標準（CNS)A4規格⑵〇 x 297公釐）V. Description of the invention (6) 10 [Comparison of component numbers I, 2, 3, 4 Four-layer printed circuit board 5, 6, 7 Two-layer printed circuit board II, 21 Signal line 12, 22 Board edge 31, 41 Solder pad 133 Welding portion 232 Welding portion 313 Welding portion 412 Welding portion 81, 82 Blind hole 8 Six-layer circuit board 13, 23 Welding pads 131, 132 Leading portion 231 Leading portion 311, 312 Leading portion 411 Leading portion 51, 61, 71 Guanzi dagger 83 buried hole (blind hole) -------------- install -------- order · (Please read the precautions on the back 44 first to write this page) • Line 'Printed on page 9 of the Intellectual Property Bureau's Employees' Cooperatives of the Ministry of Economic Affairs. The paper size applies to the Chinese National Standard (CNS) A4 specification (0 × 297 mm).