552837 Λ7 Π7 五、發明說明（I ) 【發明領域】 本發明係關於一種銅箔基板製造方法，尤指一種可產出 超薄鋼箔之轉印式銅箔基板製造方法，而可供電路板製造廠 商獨立製成銅箔基板。 5 【習知技藝說明】 自1937年美國最大產銅公司Anaconda研發出以電解法 連續製造銅箱之技術後，使鋼箔可以低廉之成本大量供應銅 基層板使用，相對促成1 950年代後印刷電路板之普及。而隨 近年來電通设備之南速化、輕量化及小型化之趨勢，其 10内部電路板亦須相對配合採線路微細化及銅箱薄形化設計。 如圖1所示之一習知印刷電路板用銅箔製造裝置，其係 於容置有銅電解液71之電解槽72中，間隔設有一 SUS316不 錄鋼製滾筒式旋轉陰極73及複數固定之電解用陽極74,並 於該旋轉陰極73及電解用陽極74間通電，使銅電鍍沉積於 15 該旋轉陰極73表面而形成一層電解銅箔75。 上述習知裝置產出之銅箔75厚度雖可藉調整電流大小 及滾筒式旋轉陰極73轉速而改變，然於實際操作上，該銅箔 75需具一定厚度，使銅箔抗拉強度大於銅箔相對該滾筒式旋 轉陰極73之附著力，始得自滾筒式旋轉陰極73表面分離取 20 出，故其實際上無法供應如6# m(微米）以下之超薄銅馆。 再者’該裝置產出之銅箔75因係呈極脆弱敏感之薄片狀，不 僅其儲存、運送及其後續製程之取置操作皆殊為不易，銅箔 75本身更易於該等過程中形成皺折、針眼及破孔等瑕疲，影 響後續產品之良率。 第4頁 本纸張尺度適用中國國家標準（CNS)A‘l規格（210 X 297公釐） (請先閱讀背面之注意事@填寫本頁) I , 裝--------訂---------- 經濟部智慧財產局員工消費合作社印製 552837552837 Λ7 Π7 V. Description of the Invention (I) [Field of the Invention] The present invention relates to a method for manufacturing a copper foil substrate, and particularly to a transfer type copper foil substrate manufacturing method capable of producing ultra-thin steel foil, which can be used for a circuit board. The copper foil substrate is made independently by the manufacturer. 5 [Know-how] Since the largest copper-producing company in the United States Anaconda developed the technology of continuous manufacturing of copper boxes by electrolytic method in 1937, steel foil can be supplied to copper substrates in large quantities at a low cost, which has relatively facilitated printing after the 1950s. The popularity of circuit boards. With the recent trend of rapid, lightweight and miniaturization of electrical equipment in recent years, its internal circuit boards must also be relatively matched with the miniaturization of mining lines and the thin design of copper boxes. As shown in FIG. 1, a conventional copper foil manufacturing device for a printed circuit board is arranged in an electrolytic cell 72 containing a copper electrolyte 71, and a SUS316 non-recording steel drum-type rotary cathode 73 and a plurality of fixed are arranged at intervals. An electrolysis anode 74 is energized between the rotary cathode 73 and the electrolysis anode 74 to deposit copper on the surface of the rotary cathode 73 to form a layer of electrolytic copper foil 75. Although the thickness of the copper foil 75 produced by the conventional device can be changed by adjusting the current and the rotating speed of the drum-type rotating cathode 73, in actual operation, the copper foil 75 needs to have a certain thickness to make the copper foil tensile strength greater than that of copper. The adhesion of the foil to the drum-type rotating cathode 73 can be separated from the surface of the drum-type rotating cathode 73 and taken out of 20, so it cannot actually supply ultra-thin copper pavilions such as 6 # m (micron) or less. Moreover, because the copper foil 75 produced by this device is extremely fragile and sensitive, not only is it difficult to store, transport, and handle operations in subsequent processes, but the copper foil 75 itself is easier to form in these processes. Defects such as wrinkles, pinholes and broken holes affect the yield of subsequent products. Page 4 This paper size is applicable to China National Standard (CNS) A'l specification (210 X 297 mm) (Please read the notes on the back @ Fill this page first) I, Install -------- Order ---------- Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 552837
’五、發明說明（2 ) /而車又厚銅v白之首要缺點，當其與基板壓合形成銅羯基板 後，於後續巍刻程序中，因其銅落81高度問題，易造成如第 一圖所不原互為隔離之銅箔81間較上層進一步側彎接觸，而 j生不當短路之側蝕現象，故不易形成細線路(如^"之線 見線)而…、去符合現今電子通訊設備内部電路板之線路微 細化趨勢需求。再者，較厚㈣於雷射穿孔時需耗費較^ ••篁ίί長時間，相對即耗費成本減少產率，且因其需較高雷 射能量，易造成如第四圖所示銅馆層81底部之基板Μ樹脂 融化及氣化而形成擴孔現象，而與第三圖之正常打孔成品相 較，明顯衫響電路板電性性能。更由於較厚銅箔需較高雷射 穿孔旎篁，於實際穿孔過程中常需暫時中斷，待溫度適當冷 卻後始繼續進行，以避免能量過度集中造成銅箔底部樹脂高 溫氣化形成擴孔，然相對即增加作業時程而降低產量。 基於此’獲得較薄銅羯以利於細線路之製造乃為大勢所 趨，而鑒於上述厚銅箔於實際作業中種種無法克服之缺點， >其後遂有將1/2οζ(盎司）銅箔壓合為銅箔基板，而後經如強 酸藥液將銅箔咬蝕以降低厚度之另一習知方法因應而生，然 該製程不僅增加藥液成本及衍生強酸藥液及重金屬後續處理 之環保問題，其實際對銅箔咬蝕厚度亦不均勻。 進一步就第五、六圖所示之一習知銅箔基板製造方法而 論，其係先提供兩可相向壓合之上蓋板91 (top board)及下底 板92(carrier board)，且上蓋板91下表面及下底板92上表 面各襯墊一具保護緩衝作用之牛皮紙93，兩牛皮紙93間則 自上而下依序設置一鏡面鋼板94、上銅箔層95、一基板材料 第5頁 ίο 15 20 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之¾意枣項4填穹本頁) -裝 * i_i n n n n - a^T· 4 552837 濟 智 慧 財 產 局 員 工 消 費 合 作 社 印 製'Fifth, the description of the invention (2) / The main disadvantage of the car is thick copper v white, when it is pressed against the substrate to form a copper 羯 substrate, in the subsequent weaving process, because of the height of the copper drop 81, it is easy to cause In the first picture, the copper foils 81, which are isolated from each other, are further side-curved in contact with the upper layer, and the side corrosion phenomenon caused by an improper short circuit, so it is not easy to form thin lines (such as ^ " lines see lines) and ... Meet the current trend of miniaturization of circuit boards in electronic communication equipment. In addition, thicker puppets require a longer time for laser perforation, which is relatively cost-effective and reduces the yield, and because it requires higher laser energy, it is easy to cause the copper hall as shown in the fourth figure The substrate M resin at the bottom of the layer 81 is melted and vaporized to form a hole expansion phenomenon. Compared with the normal punched product of the third figure, the electrical performance of the circuit board is obviously affected. Furthermore, because thicker copper foil requires a higher laser perforation, it is often necessary to temporarily interrupt the actual perforation process and continue after the temperature is properly cooled to avoid excessive concentration of energy caused by high-temperature gasification of the resin at the bottom of the copper foil to form reaming. However, it is relatively increasing the operation time and reducing the output. Based on this, it is a general trend to obtain thinner copper alloys to facilitate the manufacture of thin circuits. In view of the above-mentioned shortcomings of the thick copper foil that cannot be overcome in actual operation, > Combined into a copper foil substrate, and then another conventional method of eroding the copper foil to reduce the thickness such as a strong acid chemical solution is developed. However, this process not only increases the cost of the chemical solution and the environmental protection issues of the strong acid solution and the subsequent treatment of heavy metals. , Its actual thickness of copper foil etch is not uniform. Further on one of the conventional copper foil substrate manufacturing methods shown in the fifth and sixth figures, it first provides two top boards 91 (top board) and a bottom board 92 (carrier board) which can be opposed to each other, and The lower surface of the cover plate 91 and the upper surface of the lower bottom plate 92 are each cushioned with kraft paper 93 for protection and cushioning. Between the two kraft papers 93, a mirror steel plate 94, an upper copper foil layer 95, and a substrate material are sequentially arranged from top to bottom. 5 pages ίο 15 20 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (please read the ¾ Italian date item 4 on the back first to fill in this page)-Packing * i_i nnnn-a ^ T · 4 552837 Printed by the Consumer Cooperative of the Employees of Intellectual Property Bureau
----—_1£_______ 五、發明說明（3 ) (或稱Prepreg)層96、下銅箱層97及另一鏡面鋼板98 ;而 後藉上蓋板91及下底板92相向將上述其間各層逐漸加壓， 並經加溫、抽真空及降溫等程序後，使上銅箔層95及下銅箔 層97充分結合於基板材料層96上下表面，而形成第六圖中 5 之一銅箔基板99。 惟上述製程中，誠如前述該上、下銅箔層95、97因係 呈極脆弱之薄片狀，於壓合過程中極易產生皱折甚或破損； 而尤如第六圖所示，融熔之基板材料層96樹脂極可能透過鋼 馆層95、97之破孔滲漏至鏡面鋼板94、98而對其造成污染， 故每一壓合程序後皆須清洗並以砂布研磨鏡面鋼板94、98， 以去除其上之樹脂黏渣941並維持其一定平整度，故除增加 耗材及耗費清洗工時外，進而言之，一般清潔鋼板之刷磨機 亦僅砲清除附著於鏡面鋼板表面之黏渣，對已深入鋼板表層 者即热法處理，無形中並減短昂貴之鏡面鋼板使用壽命。 再者，由於基板材料層9 6 —般均含玻璃纖維及樹脂成 分’易產生微細屑渣直接黏附於銅箔層95、97，或以如第五 圖中懸浮微粒951狀態沉降至銅箔層95表面，使其於壓合過 程中於銅’泊層9 5、9 7表面形成微小凹孔（p丨t),致使其後形 成電路板線路時，易造成不當短路或斷路而嚴重影響產品之 20 良率。 【發明概要】 因此，本發明之主要目的係提供一種可產出超薄銅羯之 轉印式銅箔基板製造方法。 本發明之次一目的係提供一種轉印式銅箱基板製造方______第，玄 m(cns)a4 (210-mTW 10 15 -----------裝 i — f靖先閲專面之·事'本頁) J^T. ：\7552837 發明說明（斗， 法，其可供電路板製造廠商獨立製成銅落隸，而無須依賴他人提供銅箔。 本發明之另一目的係提供一種轉印式銅箔基板製造方法，其於製程中銅箔層係始終附著於另一物件上，而無傳統 銅箔薄片之缺點。 為達上述目的，本發明之一種轉印式銅箔基板製造方 法，包括下述步驟：提供一第一載板及一第二載板，其分別 具有一第一表面及一第二表面；將該第一載板之至少該第一 表面及4第一載板之至少該第二表面鍍鋼，以分別形成一第 一銅箔層及一第二銅箔層；將該第一載板之第一銅箔層相向 該第二載板之第二銅箔層相向設置，並提供一基板材料層而 設於該相向之第一銅羯層與第二銅搭層間；將該第一載板與 第二載板相向壓合，使該第一銅箔層及第二銅箔層分別結合 於該基板材料層之相反兩側，最後則將該第一載板與第二載 15 板拆解分離。 藉此，本發明可生產較薄之銅箔，而可適用各種規格需 求並便於其後蝕刻及穿孔作業，並可由電路板廠商獨立製成 銅箔基板，而各載板表面之銅箔層並對載板具保護防污作用。 【圖式簡單說明】 有關本發明之其他特徵及優點，及為達上述目的、特徵 所採用的技術手段及其功效，將在以下配合參考圖式之較佳 實施例詳細說明如下： 第一圖係一習知印刷電路板用銅箔製造裝置操作狀態側 視示意圖； 10 20 第7頁 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐 (請先閱讀背面之注意事項再填芍本頁) •裝------- . ;線. -n ϋ ϋ----—_ 1 £ _______ V. Description of the invention (3) (or Prepreg) layer 96, lower copper box layer 97 and another mirror steel plate 98; and then the upper cover plate 91 and the lower bottom plate 92 face each other to interpose the above layers. After gradually pressurizing, and after procedures such as heating, vacuuming and cooling, the upper copper foil layer 95 and the lower copper foil layer 97 are fully bonded to the upper and lower surfaces of the substrate material layer 96 to form a copper foil 5 in the sixth figure. Substrate 99. However, in the above process, as mentioned above, because the upper and lower copper foil layers 95 and 97 are extremely fragile, they are prone to wrinkles or even breakage during the lamination process; as shown in the sixth figure, melting The molten substrate material layer 96 resin is likely to leak through the holes in the steel hall layers 95 and 97 to the mirror steel plates 94 and 98 and cause contamination. Therefore, after each lamination procedure, the mirror steel plate 94 must be cleaned and polished with abrasive cloth. , 98, in order to remove the resin sticky slag 941 and maintain a certain flatness, so in addition to increasing consumables and cleaning man-hours, in addition, in general, the brush grinding machine for cleaning steel plates can only remove the adhesion to the surface of mirror steel plates The sticky slag is thermally treated for those who have penetrated into the surface of the steel plate, which will virtually reduce the service life of the expensive mirror steel plate. In addition, since the substrate material layer 9 6 generally contains glass fibers and resin components, it is easy to produce fine debris and directly adhere to the copper foil layers 95 and 97, or settle to the copper foil layer in the state of suspended particles 951 as shown in the fifth figure. 95 surface, so that it forms tiny concave holes (p 丨 t) on the surface of the copper 'poor layer 9 5 and 9 7 during the lamination process, so that it will easily cause improper short circuit or disconnection and severely affect the product when it later forms a circuit board circuit. Of 20 yields. [Summary of the Invention] Therefore, the main object of the present invention is to provide a transfer-type copper foil substrate manufacturing method capable of producing ultra-thin copper foil. A second object of the present invention is to provide a manufacturer of transfer type copper box substrate ______, m (cns) a4 (210-mTW 10 15 ----------- install i — fjing Please read the "Special Issues · This Page" J ^ T. ： \ 7552837 Description of the invention (bucket, method, which can be used by circuit board manufacturers to make copper foils independently, without having to rely on others to provide copper foil. Another object is to provide a method for manufacturing a transfer-type copper foil substrate, in which the copper foil layer is always attached to another object during the manufacturing process, without the disadvantages of the traditional copper foil sheet. A method for manufacturing a printed copper foil substrate includes the following steps: providing a first carrier board and a second carrier board, respectively having a first surface and a second surface; and at least the first carrier board The surface and at least the second surface of the first carrier plate are plated with steel to form a first copper foil layer and a second copper foil layer, respectively; the first copper foil layer of the first carrier plate faces the second carrier The second copper foil layer of the board is arranged opposite to each other, and a substrate material layer is provided and is provided between the opposite first copper sacral layer and the second copper layer; A carrier board is pressed against the second carrier board so that the first copper foil layer and the second copper foil layer are respectively bonded to the opposite sides of the substrate material layer, and finally the first carrier plate and the second carrier layer 15 The board can be disassembled and separated. In this way, the present invention can produce thinner copper foil, which can meet various specifications and facilitate subsequent etching and perforation operations. The copper foil substrate can be made independently by the circuit board manufacturer, and the surface of each carrier board The copper foil layer protects the carrier board against pollution. [Brief description of the drawings] Regarding other features and advantages of the present invention, as well as the technical means used to achieve the above-mentioned purposes, features and their effects, we will refer to the following for reference. The preferred embodiment of the drawings is described in detail as follows: The first diagram is a schematic side view of the operating state of a conventional copper foil manufacturing device for a printed circuit board; 10 20 page 7 This paper size applies to China National Standard (CNS) A4 specifications (210 X 297 mm (please read the notes on the back before filling out this page) • Install -------.; Line. -N ϋ ϋ
n i·— n I 552837 Λ7 ---------------------ί)：__ 五、發明說明（S ) ^〜~ 第二圖係一習知銅箔基板之銅箔正常狀態局部剖視示竟 圖； σ不- 第三圖係一習知銅箔基板經正常雷射穿孔後之局部剖視 示意圖； 5 第四圖係一習知銅箔基板經不當雷射穿孔而形成擴孔現 象後之局部剖視示意圖； 第五圖係一習知銅箔基板製造方法之第一操作狀態側視 示意圖； 第六圖係第一圖之習知銅箔基板製造方法之第二操作狀 10 態側視示意圖； 第七圖係本發明較佳實施例之流程圖； 第八圖係該較佳實施例之第一實施狀態側視示意圖； 第九圖係該較佳實施例之第二實施狀態側視示意圖； 第十圖係該較佳實施例之第三實施狀態部分側視示意 15 圖；及 第十一圖係該較佳實施例之第三實施狀態部分側視示意 圖，以明示其獲得之銅箔基板成品。 【較佳實施例詳細說明】 如第七圖所示，本發明之一種轉印式銅箔基板製造方法 20 一較佳實施例，其包括之步驟如下： 首先，步驟10係提供一概呈矩形扁平板狀之第一載板 31，該第一載板31如第八圖所示，於本實施例中係由AISI 630 (硬度達420VPN)高硬度合金鋼製成且經拋光之鏡面鋼板， 而具有一平整硬質之一第一表面311;然該第一載板31亦可 第8頁 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事^本頁)ni · — n I 552837 Λ7 --------------------- ί): __ V. Description of the invention (S) ^ ~~ The second picture is a conventional copper Partial cross-sectional view of the normal state of the copper foil of the foil substrate; σNO-The third image is a schematic cross-sectional view of a conventional copper foil substrate after normal laser perforation; 5 The fourth image is a conventional copper foil substrate Partial cross-sectional view of a hole expansion phenomenon caused by improper laser perforation; Figure 5 is a schematic side view of the first operating state of a conventional copper foil substrate manufacturing method; Figure 6 is a conventional copper foil of the first figure 10th side view of the second operation state of the substrate manufacturing method; the seventh view is a flowchart of a preferred embodiment of the present invention; the eighth view is a side view of the first implementation state of the preferred embodiment; the ninth view is A schematic side view of the second implementation state of the preferred embodiment; a tenth view is a side view of the third implementation state of the preferred embodiment; and a eleventh view is a third implementation of the preferred embodiment. A schematic side view of the state part to clearly show the finished copper foil substrate. [Detailed description of the preferred embodiment] As shown in the seventh figure, a preferred embodiment 20 of a transfer-type copper foil substrate manufacturing method of the present invention includes the following steps: First, step 10 provides a generally rectangular flat A flat first carrier plate 31, as shown in the eighth figure, in this embodiment is made of AISI 630 (hardness up to 420VPN) high hardness alloy steel and polished mirror steel plate, and It has a flat and hard first surface 311; however, the first carrier plate 31 can also be page 8. This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the notes on the back first (^ This page)
A. JI:r I 壯衣·--I----訂 I---I-- 經濟部智慧財產局員工消費合作社印¾ 552837 Λ；A. JI: r I Zhuangyi · --I ---- Order I --- I--Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economy ¾ 552837 Λ;
5 ·· 10 15 20 發明說明（G) 由其他具一定硬度、平整度且可耐高溫壓合所產生化學品侵 #之適當材料製成； 如步驟11所示，再將該第一載板31之第一表面311經 清潔研磨處理，以進一步去除其上微觀之到痕、凹陷、凸粒 或附著物，以確保其更佳之表面平整度； 再如步驟12所示，將經表面清潔研磨處理之該第一表 面311經酸洗（pre_dip)處理，以增加其防銹抗氧化能力，然 其他同樣具防銹作用之習知製程亦可適用； 後即如步驟13，於該第一載板31整體表面，以任何習 知之化學電鍍技術形成一預定厚度之第一銅箔層犯，即如苐 七圖所不，且由於其係採電鍍方式，故該生成之第一銅箔層 32厚度可控制於如6微米以下之極微範圍内；再將該第一鋼 箔層32面如步驟14經水洗，以便於後續處理； 再如步驟15所示，將位於該第一表面311之第一銅箔 層32進一步經有機微蝕之表面粗化處理，以增加其結合強 ，該粗化處理亦可採用其他任何習知方式，如將該第一鋼 ^層32浸入主要含硫酸銅及硫酸溶液之處理槽，並供應適當 強度之連續處理電流，使該銅箔層32表面沉積形成針狀或瘤 狀微細突出附著物等； 後如步驟16、17所示，再將第一銅箔層32經水洗以去 除其上之有機化學藥液，再予烘乾使其保持乾燥，至此，該 附有第一銅箔層32之第一載板31即告完成； 同時，即如第七、八圖所示，另以一與第一載板31實 質相同之第二載板41，經分別與前述步驟10至17相同之步 第9頁 ^--------訂---------線 ί靖先閱讀背面之沒音：)事項再^、^本頁) ‘適用中國國家標準（CNS)A4規格（210 X 297公釐） 552837 Λ7 經濟部智慧財產局員工消費合作社印製 五、發明說明（ 驟20至26，而於該第二載板41之第二表面411形成一預定 厚度之第二銅箔層42，其細節不再贅述； 再如步驟51至步驟56所示，提供兩可相向壓合之上蓋板 61(t0p board)及下底板 62(Carrier board),且上蓋板 61 5下表面及下底板62上表面各襯墊一具保護緩衝作用之牛皮紙 63、64或其他適當保護層，兩牛皮紙㈡、64間則自上而下 依序設置該第一載板31、一呈半固化之基板材料（或稱 Prepreg)層65及該第二載板41，且其中第一銅箔層32及第 二銅落層42係分別壓疊於基板材料層65上、下表面，該基 板材料通常為玻璃纖維及樹脂等之混合物，然亦可為其他任 何適當材質製成； 而後如步驟71至75及第九圖所示，藉由上蓋板61及 下底板62相向將第一載板31、基板材料層65及第二載板41 均勻而逐漸加壓，並同時將該等載板31、41等元件整體置於 一加熱環境，本實施例中係自〇至150°C緩慢加熱後並經抽 真空，使基板材料層65均勻散佈，而後自150°C加熱至180 °C後持續一特定時間，使基板材料層65到達其熱聚合點，與 其上下表面之第一銅箔層32及第二銅箔層42充分聚合為一 體；而後將上述各物件置於一冷壓環境中逐漸降溫，以消除 其内應力； 最後，即如步驟76、77所示，由於第一銅箔層32及第 二鋼箔層42已與基板材料層65充分聚合為一體，而各銅箔 層32、42與各載板31、41對應表面間僅為附著關係，此時 將第一載板31及第二載板41反向拆離之際，第一及第二銅 第10頁 10 15 20 本紙張尺度適用中國國家標準（CNS)A4規格（210x 297公釐) (請先閱讀背面之注意事eia、寫本頁) 裝--------訂--------- 552837 Λ： \ 土 Ρ •五、發明說明（8 ) 错層32、42即可分別自第一載板31及第二载板41輕易脫離， 且第一銅箔層32係自第一載板31兩側彎折處撕開，而以類 似轉印效果般結合於基板材料層65，以形成如第十一圖所示 上、下表面各具有該第一及第二銅箔層32、42之鋼箔基板， 5剩餘之上蓋板61、下底板62及載板3卜41則如第十圖所示， 再將該等銅箔基板適當裁切後即可供後續電路板製程使用。 藉由上述本發明揭示之實施步驟，其較習知技術具有下 述顯著之功效改良及突破處： 一、 藉由本發明所生產之銅箔，其厚度即取決於電鍍厚 度而了控制到達1微米之超薄銅箱規格，其不僅可適用各 種銅基層板構裝密度及線寬間距縮小之需求，亦無前述厚銅 箔之諸多製程上之缺點，便於其後蝕刻及雷射穿孔等加工作 業。 二、 再者，藉本發明揭示之方法，電路板製造廠商無須 依賴他人提供銅箔，即可直接以原有之鏡面鋼板作為載體， 於其上以簡單之電鍍設備製得銅箔，經與基板材料層壓合後 即可直接自行製得印刷電路板，使其全程皆可獨立作業。 二、於上述製程中，銅箔層原係電鍍附著於載板表面， 而後則經壓合於基板材料層表面，故自始至終該銅箔層皆未 如習知方式製得之銅箔呈極脆弱敏感之薄片狀，換言之，本 發明獲得之銅箔層可完全免除習知片狀銅箔運送及取置不便 之困擾，更無於該等過程中形成皺折、破孔等瑕疵而影響後 續產品良率之虞，且因其運輸取置方便，可以機械工具為之 使生產更為自動化。第11頁 ·· 10 15 20 本紙張尺度適用中國國豕標準（CNS)/\4規格（21〇 X 297公爱 裝--------訂---------線 (請先間讀背面之注意:f·項再^芎本頁) 552837 5 10 Λ7 五、發明說明（3 四、 而於製程中，由於各載板表面係甴銅箔層完全包覆， 可保護載板不受基板材料粉塵污染，故其不需清洗即可重複 使用’且相對銅箔層亦不致於壓合過程中形成凹孔，可提高 其後形成之電路板線路導電性能。 五、 另就實際操作而言，由於各銅箔層係經電錢而均勾 附著於各載板表面，當其與基板材料層疊置時可獲得較高接 合平整度，相較習知銅箔基板係以各單片銅箔疊置於基板而 壓合之方式，更可顯著提昇其電路板產品電性性能。 惟’上揭圖式及說明，僅為本發明之實施例而已，非為 限夂本發明之實施；大凡熟悉該項技藝人仕，依本發明特徵 範嘴所作其他等效變化或修飾，皆應涵蓋在以下本案之申請 專利範圍内。 (請先閱讀背面之江音奉寫本頁) 裝·-------訂 I ------ 經濟部智慧財產局員工消費合作社印製 適 I度 尺 張 紙 本 格 規 A4 S) N (C 準 標 家 0 |國 頁 12 公 97 552837 Λ7 B7 五、發明說明（，〇 ·· 元件符號對照表 31·.. 第一載板 311·, ..第·表面 32··. 第一銅箔層 41... 第二載板 411·. ..第二表面 42... 第二銅箔層 61 上蓋板 62 下底板 63、64 牛皮紙 65 基板材料層 --------^---------線 (請先閱讀背面之注意事項4ja上4本頁)5 ·· 10 15 20 Description of the invention (G) Made of other suitable materials with certain hardness, flatness, and resistance to chemical invasion from high temperature lamination; as shown in step 11, the first carrier board The first surface 311 of 31 is cleaned and polished to further remove microscopic marks, depressions, convex particles or attachments thereon to ensure better surface flatness. Then, as shown in step 12, the surface is cleaned and ground. The first surface 311 is treated with a pre-dip treatment to increase its anti-rust and anti-oxidation capabilities, but other conventional processes that also have anti-rust effects can also be applied; then, as in step 13, the first load The entire surface of the plate 31 is formed with a first copper foil layer of a predetermined thickness by any conventional chemical electroplating technology, that is, as shown in Figure 27, and because it is electroplated, the generated first copper foil layer 32 The thickness can be controlled within a very micro range such as less than 6 microns; the first steel foil layer 32 surface is washed with water as in step 14 for subsequent processing; and as shown in step 15, the first steel foil layer 32 is located on the first surface 311. A copper foil layer 32 is further organically etched. The surface is roughened to increase its bonding strength. The roughening treatment can also use any other conventional method, such as immersing the first steel layer 32 in a processing tank mainly containing copper sulfate and sulfuric acid solution, and supplying a suitable strength. Continuously process the current to deposit the surface of the copper foil layer 32 to form needle-like or nodular fine protruding attachments; and then, as shown in steps 16 and 17, the first copper foil layer 32 is washed with water to remove organic chemistry thereon. The medicinal solution is dried to keep it dry. At this point, the first carrier plate 31 with the first copper foil layer 32 is completed. At the same time, as shown in Figures 7 and 8, A second carrier plate 41 that is substantially the same as a carrier plate 31 is subjected to the same steps as steps 10 to 17 respectively. Page 9 ^ -------- Order --------- line Read the silence on the back :) Matters again ^, ^ this page) 'Applicable to China National Standard (CNS) A4 specifications (210 X 297 mm) 552837 Λ7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 20 to 26, and a second copper foil layer 42 of a predetermined thickness is formed on the second surface 411 of the second carrier plate 41, the details of which are no longer As shown in step 51 to step 56, two oppositely pressed upper cover plates 61 (t0p board) and lower bottom plate 62 (Carrier board) are provided, and the lower surface of the upper cover plate 61 and the upper surface of the lower bottom plate 62 are provided. Each pad has a protective cushioning kraft paper 63, 64 or other appropriate protective layer, and two kraft paper rafters, 64 are arranged in order from top to bottom, the first carrier plate 31, and a semi-cured substrate material (or called Prepreg) layer 65 and the second carrier board 41, and the first copper foil layer 32 and the second copper falling layer 42 are laminated on the upper and lower surfaces of the substrate material layer 65, respectively. The substrate material is usually glass fiber and resin The mixture may be made of any other suitable material; then, as shown in steps 71 to 75 and the ninth figure, the first carrier plate 31 and the substrate material layer 65 are opposed by the upper cover plate 61 and the lower bottom plate 62 facing each other. And the second carrier plate 41 is uniformly and gradually pressurized, and at the same time, the components such as the carrier plates 31 and 41 are placed in a heating environment as a whole. In this embodiment, after slowly heating from 0 to 150 ° C and vacuuming, Allow the substrate material layer 65 to spread evenly, and then heat it from 150 ° C to 180 ° C for a specific time The substrate material layer 65 is brought to its thermal polymerization point, fully integrated with the first copper foil layer 32 and the second copper foil layer 42 on the upper and lower surfaces; and then the above objects are gradually cooled in a cold-pressed environment to eliminate Internal stress; finally, as shown in steps 76 and 77, since the first copper foil layer 32 and the second steel foil layer 42 have been fully polymerized with the substrate material layer 65, the copper foil layers 32, 42 and each The corresponding surfaces of the carrier plates 31 and 41 are only attached. At this time, when the first carrier plate 31 and the second carrier plate 41 are detached in the reverse direction, the first and second copper pages 10 10 15 20 This paper standard applies China National Standard (CNS) A4 Specification (210x 297 mm) (Please read the notice on the back first, write this page) Installation -------- Order --------- 552837 Λ: \ Soil P • V. Description of the invention (8) The split layers 32 and 42 can be easily separated from the first carrier plate 31 and the second carrier plate 41, respectively, and the first copper foil layer 32 is on both sides of the first carrier plate 31 The bent portion is torn and bonded to the substrate material layer 65 like a transfer effect to form the first and second copper foil layers 32 on the upper and lower surfaces as shown in FIG. 11. The 42 steel foil substrate, 5 the remaining upper cover plate 61, the lower bottom plate 62, and the carrier plate 3 and 41 are shown in the tenth figure. After the copper foil substrate is appropriately cut, it can be used for subsequent circuit board manufacturing processes. . Through the implementation steps disclosed in the present invention, it has the following significant improvements and breakthroughs over conventional techniques: 1. The thickness of the copper foil produced by the present invention is controlled to reach 1 micron depending on the thickness of the plating. The ultra-thin copper box specifications are not only applicable to the requirements of various copper base plate structural density and line width spacing reduction, but also without the shortcomings of the many processes of the thick copper foil mentioned above, which facilitate subsequent processing operations such as etching and laser perforation. . 2. Furthermore, by the method disclosed by the present invention, the circuit board manufacturer can directly use the original mirror steel plate as a carrier without relying on the copper foil provided by others, and the copper foil can be obtained by simple electroplating equipment thereon. After the substrate materials are laminated, the printed circuit board can be directly produced by itself, so that it can operate independently throughout the entire process. 2. In the above process, the copper foil layer was originally electroplated and adhered to the surface of the carrier board, and then was laminated on the surface of the substrate material layer. Therefore, the copper foil layer that has not been prepared in a conventional manner is extremely fragile from beginning to end. Sensitive flakes, in other words, the copper foil layer obtained by the present invention can completely avoid the trouble of conventional sheet copper foil transportation and inconvenience, and it will not cause defects such as wrinkles and holes in these processes to affect subsequent products. Yield risk, and because of its convenient transportation, it can be automated with machine tools. Page 11 ·· 10 15 20 This paper size is applicable to China National Standard (CNS) / \ 4 specifications (21〇X 297) (Please read the note on the back first: f · item ^ 芎 this page) 552837 5 10 Λ7 V. Description of the invention (3 IV. In the manufacturing process, since the surface of each carrier board is completely covered with copper foil, you can It protects the carrier board from dust contamination of the substrate material, so it can be reused without cleaning ', and the copper foil layer does not form a recessed hole during the lamination process, which can improve the conductivity of the circuit board circuit formed later. In terms of actual operation, since each copper foil layer is attached to the surface of each carrier board through electricity, it can obtain higher joint flatness when it is laminated with the substrate material, compared with the conventional copper foil substrate system. By laminating each single piece of copper foil on the substrate and laminating it, the electrical performance of its circuit board products can be significantly improved. However, the figures and descriptions above are only examples of the present invention and are not limited. Implementation of the present invention; anyone who is familiar with the art and other equivalent changes or modifications made according to the features of the present invention should Covered within the scope of the patent application in the following case. (Please read Jiang Yinfeng on the back to write this page first.) Packing ------- Order I ------ Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Appropriate I rule rule paper size A4 S) N (C quasi-standard home 0 | country page 12 public 97 552837 Λ7 B7 V. Description of the invention (,… · Component symbol comparison table 31 ..: First carrier board 311 · ···· surface 32 ······························································································ Kraft paper 65 substrate material layer -------- ^ --------- line (please read the precautions on the back first on 4ja 4 pages)
L 第13頁 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）L page 13 This paper is sized for China National Standard (CNS) A4 (210 X 297 mm)