TW552831B

TW552831B - Electronic supports and methods of making the same

Info

Publication number: TW552831B
Application number: TW90104082A
Authority: TW
Inventors: David E Dana; Vedagiri Velpari; Charles Kahle; Langqiu Xu; Bruce E Novich
Original assignee: Ppg Ind Ohio Inc
Priority date: 2000-02-22
Filing date: 2001-02-22
Publication date: 2003-09-11
Also published as: MXPA02008186A; KR20020077503A; EP1258178A2; BR0108559A; CA2400790A1; WO2001063985A2; US20020123285A1; CN1425268A; JP2003526202A; HK1048045A1; AU2001238644A1; WO2001063985A3

Abstract

The present invention provides an electronic support comprising: (A) at least one woven fiber reinforcement material formed from at least one fiber free of basalt glass; and (B) at least one matrix material in contact with at least a portion of the at least one reinforcement material, the at least one matrix material comprising at least one non-fluorinated polymer and at least one inorganic filler, wherein the at least one inorganic filler comprises at least one non-hydratable, lamellar inorganic solid lubricant having a high electrical resistivity and wherein the at least one inorganic filler comprises at least 6 weight percent of a total combined weight of the at least one inorganic filler and the at least one matrix material on a total solids basis.

Description

552831 經濟部中央標準局員工消費合作社印裝 A7 Β7 五、發明説明（1 ) 宣案參者本案凊求以下各案的權益：美國臨時申請案第6〇/183,979 號，名稱「電子支撐件及其製法」，申請曰2〇〇〇年2月22 日；美國臨時申請案第60/ 184, 026號，名稱「形成電子支撐件孔洞之方法及裝置」，申請日2〇〇〇年2月22日；以及美國臨時申請案.第60/233,619號，名稱「電子支撐件以及用以形成私子支撐件中孔洞之方法及裝置」，申請日2〇〇〇年9月j 8 曰〇 fcLtf： 1.發明領域 ' 概略而言本發明係有關電子支撐件以及電子支撐件之製法’特別係有關預浸物層、積層物、包覆積層物、及印刷電路板及其製法。本發明進一步係有關一種於根據本發明製造（電子支推件形成孔洞之方法及裝置，其特別係有關於印刷電路板以機械方式鑽孔。 2 ·技術考量電子支撐件及特別印刷電路板俗稱PCBs或印刷線路板 (PWBs)典型係由二或多層經過聚合物浸潰之加強層通預浸物以及-或多層導電層藉加熱及加壓積層在_起扯成的積層物形成。印刷電路板之製法典型要求於電路孔洞(所謂的孔或通孔)俾輔助仁板内」電互連以及印刷咖路板與其它附著其上之電子組件間的互連。板内互連例：包括連結於印刷電路板的不同層上圖樣化的電路。板斑且它電子組件間之互連例如包括印刷電路板與安裝其上：積尺度適用中家標準（CNS) Α4·( 21〇χ (請先閲讀背面之注意事項再填寫本頁)552831 Printed by the Consumer Standards Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A7 B7 V. Description of Invention (1) Participants in this case sought rights in the following cases: US Provisional Application No. 60 / 183,979, titled "Electronic Support and "Manufacturing Law", application dated February 22, 2000; U.S. Provisional Application No. 60/184, 026, entitled "Method and Device for Forming Holes in Electronic Supports", application date February 2000 22; and U.S. Provisional Application No. 60 / 233,619, titled "Electronic Support and Method and Device for Forming Holes in Private Supports", date of application September 8, 2000 〇fcLtf : 1. Field of the Invention 'In general, the present invention relates to an electronic support member and a method for manufacturing the electronic support member', and particularly relates to a prepreg layer, a laminate, a clad laminate, and a printed circuit board and a manufacturing method thereof. The invention further relates to a method and a device for forming holes in an electronic push piece made in accordance with the invention, which particularly relates to the mechanical drilling of printed circuit boards. 2 · Technical considerations Electronic supports and special printed circuit boards are commonly known PCBs or printed circuit boards (PWBs) are typically formed from two or more layers of polymer-impregnated reinforced laminate prepregs and / or multiple conductive layers that are formed by heating and pressing laminates. Printed circuits The board manufacturing method typically requires electrical interconnections in circuit holes (so-called holes or through holes) and auxiliary cores, and interconnections between printed circuit boards and other electronic components attached to them. Examples of interconnections within the board include: Patterned circuits that are connected to different layers of a printed circuit board. The board spot and the interconnection between its electronic components include, for example, a printed circuit board and mounted on it: the product dimensions apply to the Chinese Standard (CNS) Α4 · (21〇χ ( (Please read the notes on the back before filling out this page)

L 552831 A7 B7 五、發明説明（2 ) 體電路裝置間之連結。於孔洞形成後（典型係藉鑽孔形成）’孔壁典型經鍍敷而形成導電通路。電路藉業界眾所周知方法例如光影法及蝕刻法圖樣化於一或多導電層上。隨著電子業界在單一片積體電路裝置上的電路及功能不斷增加，於印刷電路板上包括於板内以及板與其它組件間需要更多連結來支援裝置。電路板大小加大來因應連結數目的增加不合實際，原因在於印刷電路板結合於其中的終產物的大小及重量限制以及產品的性能要求等緣故。如此為了因應連結數目的增加，印刷電路板的結構特徵的大小 (亦即孔直徑以及圖樣化線寬）必須縮小，同時增加結合至電路板的金屬層層數。經濟部中央標隼局員工消費合作社印製結構特徵大小縮小以及層數增加的需求造成印刷電路板的製程愈複雜且要求愈高。特別形成大量小孔洞可能造成印刷電路板的製造成本顯著增高。參考J〇an T〇urne「使用新穎互連技術來降低基材成本」，歐洲接頭會諶Vi; Eipp 鮮綠.，(1997年）167- 174頁，併述於此以供參考。例如機械鑽孔直徑小於13密耳的孔洞對典型機械鑽孔製程的良率、產量、及成本造成負面影響。原因在於大部份在於關聯於PCBs鑽小孔造成的鑽孔工具磨耗增加。鑽孔工具的磨耗發生於當鑽頭於PCB遭遇玻璃纖維層時。玻璃纖維織物典型用於加強PCB各層，提供&良的剛硬性及強度。但玻璃纖維對鑽孔工具有磨蝕效應而造成其變鈍。鈍調或磨耗的工具會降低所鑽孔的壁面品質、降低所鑽孔的位置準確度、增加纖維的斷裂、以及增加其它鑽孔缺陷例如毛邊、 -5- 本紙張尺度適用中國國家標準（CNS ) Μ規格（210X297公釐） 552831 A7 B7 經濟部中央標準局員工消費合作社印製五、發明説明（3 ) 釘頭、芯吸及通孔（亦即孔洞）表面粗糙等發生率的增加。因而對鑽孔過程造成不良影響。此外，隨著積體電路裝置的性能要求的增高，此等裝置的功率耗散需求也增加。如此導致於裝置表面需要控制俾防止裝置故障的熱通量也增加。例如估計裝置的操作溫度每增高10°C(18T)則故障率提高約2的因數。參考r Tummala及e. Rymaszewski編輯，遞^子封裝年册，(lng 年）168頁’併述於此以供參考。經由改良其上安置此等裝置之印刷電路板（例如直接安裝裝置於pCB上，或附著含裝置的第二層封裝體至PCB)之熱傳導係數-，可改良裝置:能及可靠度。需要有呈積層物及印刷電路板等形式的電子支撐件及具有良好鑽孔性能及較高功能，以及其它可提高鑽頭壽命/、' 減少鑽孔工具磨耗、改良孔壁品質、降低鑽孔成本且可結合於現有鑽孔操作而無需額外處理步驟之印刷電路板之鑽孔裝置之方法。、發明概述本發明提供-種電子支撐件包含：（A)至少一種織造纖維加強材料其係由纟少一種不含玄武岩玻璃之纖維製成；以及（B)至少一種基體材料其係接觸該至少—種加強材料之至少-部份，該至少-種基體材I包含至少—種非氟化聚合物以及至少一種無機填料，纟中該至少一種無機塡料包：至少一種非可水合之層狀無機固體潤滑劑其具有高電阻^ 數，以及其中該至少一種無機填料包含以總固體爲基準係 (請先閲讀背面之注意事項再填寫本頁)L 552831 A7 B7 V. Description of the invention (2) Connection between body circuit devices. After the hole is formed (typically formed by drilling), the hole wall is typically plated to form a conductive path. The circuit is patterned on one or more conductive layers by methods well known in the industry, such as photolithography and etching. As the electronics industry continues to increase the number of circuits and functions on a single-chip circuit device, more connections are needed to support the device, including on the printed circuit board within the board and between the board and other components. The increase in the size of the circuit board in response to the increase in the number of connections is impractical because of the size and weight limitations of the end product into which the printed circuit board is incorporated and the performance requirements of the product. In order to respond to the increase in the number of connections, the size of the structural features of the printed circuit board (ie, the hole diameter and the patterned line width) must be reduced, and the number of metal layers bonded to the circuit board must be increased. The need to reduce the size of structural features and increase the number of layers in the Consumer Cooperatives printed by the Central Bureau of Standards of the Ministry of Economic Affairs has resulted in more complex and demanding printed circuit board manufacturing processes. The formation of a large number of small holes in particular may cause a significant increase in the manufacturing cost of the printed circuit board. Refer to Joan Tourne, "Using Novel Interconnect Technology to Reduce Substrate Costs", European Connectors, Vi; Eipp Bright Green. (1997), pages 167-174, and are hereby incorporated by reference. For example, holes with a diameter of less than 13 mils have a negative impact on the yield, yield, and cost of a typical mechanical drilling process. The reason is that the wear of drilling tools caused by drilling small holes related to PCBs increases. Wear of the drilling tool occurs when the drill bit encounters a fiberglass layer on the PCB. Fiberglass fabrics are typically used to reinforce various layers of PCBs, providing & good rigidity and strength. However, glass fibers have dulling effects due to the abrasive effect on the drilling tool. Blunt or worn tools will reduce the quality of the wall surface to be drilled, reduce the accuracy of the location of the drilled hole, increase the breakage of fibers, and increase other drilling defects such as burrs. -5- This paper size applies to Chinese national standards (CNS ) M specifications (210X297 mm) 552831 A7 B7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (3) Incidence of surface roughness of nail heads, wicking and through holes (ie holes) increased. This has an adverse effect on the drilling process. In addition, as the performance requirements of integrated circuit devices increase, so do the power dissipation requirements of these devices. This leads to the need to control the surface of the device. The heat flux to prevent device failure also increases. For example, it is estimated that for every 10 ° C (18T) increase in the operating temperature of the device, the failure rate increases by a factor of about 2. Reference is made by R. Tummala and e. Rymaszewski, edited, subpackaged yearbook, (lng year) page 168 'and described here for reference. By improving the thermal conductivity of the printed circuit board (such as directly mounting the device on the pCB or attaching the second-layer package containing the device to the PCB) on which the devices are placed, the device can be improved in performance and reliability. Need to have electronic supports in the form of laminates and printed circuit boards, etc., with good drilling performance and higher functions, and other can improve the life of the drill /, 'reduce the wear of drilling tools, improve the quality of the hole wall, reduce the cost of drilling And it can be combined with the existing drilling operation method of the printed circuit board drilling device without additional processing steps. SUMMARY OF THE INVENTION The present invention provides an electronic support comprising: (A) at least one woven fiber reinforced material made of at least one kind of fiber not containing basalt glass; and (B) at least one matrix material which is in contact with the at least -At least-part of a reinforcing material, the at least-matrix material I comprises at least-a non-fluorinated polymer and at least one inorganic filler, the at least one inorganic filler material: at least one non-hydratable layer Inorganic solid lubricants have a high electrical resistance number, and the at least one inorganic filler contains a total solids as a reference system (please read the precautions on the back before filling this page)

、1T — -6 - 552831 五、發明説明（4) v種基體材料之至少6〇/〇重佔该至少一種無機填料以量比。 (請先閲讀背面之注意事項再填寫本頁) 本發明也提供一種電子支撐件包本· . ::強材料;以及(㈣-種基體材二:觸纖種力』::材料之至少—部份’該至少—種基：二 -種非氟化聚合物以及至少一種無機填料種無機填料包含至少一種非可水人、μ至〆一 it JL ^ 口又層狀採機固體潤滑劑 =具有：電阻係數，以及其中該至少一種無機填料包：二、-固随馬基準係佔該至少一種無機填料以及至少—種美-材料之大於1 〇〇/0重量比。 - 土月丘 — ，發明也提供-種電子支撐件包含：（A)至少_種織造纖、、口強材枓其係由至少-種不含玄武岩玻璃之纖維製成；以及（B)至少一種基體材料其係接觸該至少一種加強材料之至少-部份，該至少一種基體材料包含至少—種非氣化聚 t物以及至少一種無機填料，其中該至少一種無機填料包含至 > 種具有熱傳導係數至少30 W/ mk以及高電阻係數之無機填料，以及其中該至少一種無機填料包含以總固體馬基準係佔該至少一種無機填料以及至少一種基體材料之至少6%重量比。經濟部中央標準局員工消費合作社印製本發明也提供一種電子支撐件包含：（A)至少一種織造纖維加強材料；以及（B)至少一種基體材料其係接觸該至少一種加強材料之至少一部份，該至少一種基體材料包含至少一種非氟化聚合物以及至少一種無機塡料，其中該至少一種拱機填料包含至少一種具有熱傳導係數至少3 0 W/ mk以本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 552831 A7 B7 五、發明説明（5 门兒阻係數之無機填料，以及其中該至少一種無機填料已^以總固體爲基準係佔該至少一種無機填料以及至少一種基體材料之大於10%重量比。本發明也提供一種電子支撐件包含：（A)至少一種纖維加 ^ 以及（B)至少一種基體材料其係接觸該至少一種織 =、减、准加強材料之至少一部份，該基體材料包含至少一種典機％料，其含量足夠由於導電性陽極長絲形成貫穿電子支撐件之厚度而爲足夠抑制電短路之含量。本發明也提供一種電子支撐件包含··（A)至少一種製造纖、准加強材肖：以及(B)至少一種基體材料其係接觸該至少一種織造纖維加強材料之至少-部份，該基體材料包含至少 :種無機填料，其係選自具有陽離子交換能力至少&毫當量/100克之材料、可膨脹性黏土材料及其組合。田經濟部中央標準局員工消費合作社印裝 (請先閲讀背面之注意事項再填寫本頁)1T — -6-552831 V. Description of the invention (4) At least 60/0 weight of the v matrix materials accounts for the amount of the at least one inorganic filler. (Please read the precautions on the back before filling this page) The present invention also provides an electronic support package.. :: Strong material; and (㈣-kind of substrate material 2: contact fiber seed force ":: At least the material- Part of the at least-base: two-non-fluorinated polymers and at least one inorganic filler. The inorganic filler contains at least one non-water-soluble, μ to 〆-it JL ^ mouth and layered solid lubricant = It has: a resistivity, and wherein the at least one inorganic filler package: two,-the solid reference base system accounts for the weight ratio of the at least one inorganic filler and at least one kind of beauty-material greater than 1000/0.-土月丘-, The invention also provides an electronic support comprising: (A) at least one kind of woven fiber, and high strength material made of at least one kind of fiber not containing basalt glass; and (B) at least one base material which is in contact At least a part of the at least one reinforcing material, the at least one matrix material comprises at least one non-gasified polymer and at least one inorganic filler, wherein the at least one inorganic filler contains up to > species having a thermal conductivity of at least 30 W / mk and high Resistive inorganic filler, and wherein the at least one inorganic filler comprises at least 6% by weight of the at least one inorganic filler and at least one matrix material based on a total solid horse basis. The invention is printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs An electronic support is also provided comprising: (A) at least one woven fiber reinforced material; and (B) at least one matrix material which contacts at least a portion of the at least one reinforcing material, the at least one matrix material comprising at least one non-fluorine Polymer and at least one inorganic aggregate, wherein the at least one arch filler comprises at least one having a thermal conductivity of at least 30 W / mk. At this paper scale, the Chinese National Standard (CNS) A4 specification (210X297 mm) 552831 A7 B7 V. Description of the invention (5 inorganic fillers with a coefficient of resistance, and wherein the at least one inorganic filler has a total solids basis of more than 10% by weight of the at least one inorganic filler and at least one matrix material. The present invention also Provided is an electronic support comprising: (A) at least one kind of fiber; and B) at least one matrix material that is in contact with at least a portion of the at least one woven = reduced, quasi-reinforced material, the matrix material contains at least one typical organic material, and its content is sufficient because the conductive anode filaments form through the electronic support The thickness of the element is sufficient to suppress the electrical short circuit. The present invention also provides an electronic support comprising: (A) at least one manufacturing fiber and quasi-reinforcement material: and (B) at least one base material which is in contact with the at least one At least part of the woven fiber reinforced material, the matrix material contains at least: an inorganic filler selected from materials having a cation exchange capacity of at least & milliequivalents per 100 grams, an expandable clay material, and combinations thereof. Printed by the Consumer Standards Cooperative of the Central Bureau of Standards (please read the precautions on the back before filling this page)

、1T 本發明也提供一種形成電子支撐件之方法，該方法包含：（A)組合至少一種無機填料與至少一種溶劑材料；分散茲至少一種無機填料以及至少一種溶劑材料於一種基體材料；（C)該包含至少一種無機填料分散於其中的至 y種基體材料接觸至少一種加強材料而形成一預：a ::以及⑼至少部份硬化該預浸物層之至少—種基:材圖式之簡要説明圖1爲結合本發明之結構特色之電子支撐具體實施例之剖面圖。 —非限制性圖2爲結合本發明之結構特色之電子支撐件之另一非 -8- 552831 A71T The present invention also provides a method for forming an electronic support, the method comprising: (A) combining at least one inorganic filler and at least one solvent material; dispersing at least one inorganic filler and at least one solvent material in a matrix material; (C) ) The at least y matrix materials containing at least one inorganic filler dispersed therein are contacted with at least one reinforcing material to form a pre: a :: and ⑼ at least partially harden at least the prepreg layer-the base: material pattern Brief Description FIG. 1 is a cross-sectional view of a specific embodiment of an electronic support combining the structural features of the present invention. —Non-limiting FIG. 2 is another non-electronic supporting member combining the structural features of the present invention. -8- 552831 A7

性具體實施例之剖面圖。性之…^ 之:5子7二，广1洞形成於其中且結合本發明之結構特@ %于支撐件之另一具體實施例類似圖4之剖面圖。圖圖8爲-種結合本發明之結構特色之孔洞形輕置之示请圖9爲鑽之端視圖，舉例説明鑽梢端之主切削緣。發明之詳細説明根據本發明之電子支撐件及形成電子支撑件之方法可相別有利地提供呈積層物及印刷電路板形式之電子支撐件，其具有良好鑽孔性質、較低加工成本、提高處理良=、食好熱傳導係數以及增加功能。此外本發明之方法及裝置相別可用於於電子支撐件特別於印刷電路板形成孔洞。^ 用於此處，「電子支撐件I —詞矣+ % 丁文切1干」 d衣不一種結構其可機柄支撐及/或電互連各元件包括但非限於主動電子組件、被鸯經濟部中央標準局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 電子組件、印刷電路、積體電路、半導體裝置以及其它阳聯此等元件的硬體包括但非限於連接器、插座、固定失及熱阱。雖然非限制性，但於毛_發明電子支撐件包括例4 預浸物層、積層物、包覆積層物、及印刷電路板。用於由處「積層物」一詞表示由一種使用加強材料加強的聚入私基體材料製成的電子支撐件；以及Γ包覆積層物」或「适 -9- 經濟部中央標隼局員工消費合作社印製 552831 五、發明説明（7 ) 板」表示-種積層物具有導電材料接觸其表少一邵份。典型積層物係由二或多屉一表面之至此處「預浸物層」<「預浸物；表：—：形成。用於聚合物基體材料較佳利用但非限於科有伤上。「印刷電路板（PCB)」、「電子電路 }郅 :ϊ=」Γ用於此處表示由聚合物基體:料:: 的包子支撐件，其可使用加強材料加強本成印刷電路及孔洞。 σ 或多個㈣經由使用聚合物基體材料 =典型爲玻璃纖維加強材料製造。破璃纖維加強材心： =印：路板包括但非限於織物、非織物(包括但= ^早向、又軸及三軸織物）、針織物、以短切及連鳍股線席)及多層織物(亦即重疊多層織物藉針縫或其它材料开《成二維織物結構）。此外，用作爲織物之經紗或緯紗（亦即填補）股線的塗層纖維股線於梭織之前可未經加抢（也稱作未加捻或零加捻)或已經加捻，且織物可包括加捻及未加捻經紗及緯紗股線二者的組合。但非限制本發明，玻璃纖維加強材料典型爲織造織物。雖然後文將概略就電子支撐件以及特別就由織造玻璃纖維織物製成的預浸物層、積層物及印刷電路板形式之電子支撐件作讨卿，但業界人士了I本發明非僅限於使用織造加強物製成的電子支撐件，反而可包括但非限於前文討論之任一種加強材料。此外，本發明非僅限於加強積層物及 Ρ刷電路板，反而涵蓋呈未經加強之印刷電路板形式的電 -10- 本紙張尺度適用中國國家標準（CNS ) Μ胁（210Χ297公羞 f碕先閲讀背面之注意事項再填寫本頁}A cross-sectional view of a specific embodiment. The nature of ... ^: 5 sub-72, Guang 1 hole formed in it and combined with the structural features of the present invention @% in another specific embodiment of the support is similar to the cross-sectional view of FIG. 4. Fig. 8 is a view of a hole-shaped light placement combining the structural features of the present invention. Fig. 9 is a view of the end of a drill, illustrating the main cutting edge of the drill tip. Detailed description of the invention The electronic support and the method for forming the electronic support according to the present invention can provide electronic support in the form of a laminate and a printed circuit board, which have good drilling properties, lower processing costs, and improved Good treatment = good heat conductivity and good function. In addition, the method and device of the present invention can be used to form holes in electronic supports, especially printed circuit boards. ^ As used herein, "electronic support I — word 矣 +% 丁文切 1 干" d is not a structure that can be supported by a handle and / or electrically interconnected components including but not limited to active electronic components, Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) Electronic components, printed circuits, integrated circuits, semiconductor devices, and other hardware of these components including but not limited to connection Devices, sockets, fixed loss and heat sinks. Although non-limiting, the electronic support of the invention includes Example 4 prepreg layer, laminate, clad laminate, and printed circuit board. The term "laminate" is used to mean an electronic support made of a private matrix material reinforced with a reinforcing material; and Γ-clad laminate "or" Suitable-9- Staff of the Central Bureau of Standards, Ministry of Economic Affairs Printed by the Consumer Cooperative 552831 V. Description of Invention (7) Board "indicates that a kind of laminate has a conductive material that is less in contact with its surface. Typical laminates are from two or more drawers on one surface to the "prepreg layer" <"prepreg; table:-: formation. It is used for polymer matrix materials, but not limited to injuries. “Printed Circuit Board (PCB)”, “Electronic Circuit} 郅: ϊ =” Γ is used here to indicate a bun support made of polymer matrix: material ::, which can use reinforced materials to strengthen the printed circuit and holes. σ or more 制造 is manufactured by using a polymer matrix material = typically glass fiber reinforced material. Broken glass fiber reinforced material core: = print: road boards include but are not limited to fabrics, non-wovens (including but = ^ early, axial and triaxial fabrics), knitted fabrics, chopped strands and finned strand mats) and Multi-layer fabric (that is, overlapping multi-layer fabric is opened into a two-dimensional fabric structure by stitching or other materials). In addition, the coated fiber strands used as the warp or weft (ie, padded) strands of the fabric may be unpunched (also known as untwisted or zero twisted) or already twisted before weaving, and the fabric A combination of both twisted and untwisted warp and weft strands may be included. Without limiting the invention, glass fiber reinforced materials are typically woven fabrics. Although the following will outline the electronic support and specifically the electronic support in the form of prepreg layers, laminates and printed circuit boards made of woven glass fiber fabric, the industry is aware that the present invention is not limited to An electronic support made using a woven reinforcement may instead include, but is not limited to, any of the reinforcing materials discussed previously. In addition, the present invention is not limited to reinforced laminates and P-brushed circuit boards, but covers electricity in the form of unreinforced printed circuit boards. -10- This paper standard applies to China National Standards (CNS). Read the notes on the back before filling out this page}

552831 A7 B7 經濟部中央標準局員工消費合作社印裝五、發明説明（8 子支撐件。用於此處，「未經加強的印刷電路板」一詞表示不含加強材料之印刷電路板。此外業界人士須了解本發明I形成孔洞之方法可用於任何電子支撐件及特別印刷電路板包括未經加強的印刷電路板以及使用前文討論之加強材料形成的印刷電路板形成孔洞。用於本發明之目的除了操作實例以及有其它指示之外，所有於説明書及申請專利範圍表示各成分數量、反應條件等的數目須了解於各例皆係以「約」一詞修飾。如此，除非有相反的陳述，否則後文説明書及隨附之申請專利範圍列舉的數値參數皆爲近似値，其可隨本發明預定之各種性質改變。於最少情況·下但非限制申請專利範圍之相當例之應用範圍，各個數値參數至少須就報告的有意義位數以及應用尋常約數技術解譯。雖然於本發明之廣義範圍之數値範圍及參數爲近似値，但於特定實例中報告的數値皆儘可能準確。任何數値必然含有於其個別測試過程中由標準差所導致的某些誤差。參照圖1，顯示根據本發明之一非限制性具體實施例之電子支搏件10。電子支撐件1()包含至少_預浸物層14包含至少一種織造纖維加強材料20其帶有至少一種基體材料16施用於其至少、一部份。至少一種基體材料16包含至少一種無機填料18。雖然並非必要，但死_本發明之非限制性具體實施例中，至少一種無機填料18爲粒狀無機填料。用於此處，「粒狀」一岡表π分立的非纖維狀粒子。至少一種無機填料18可具有任何適合預定終產物的粒徑及粒子形狀 -11 - 本紙浪尺度適用中國國家梂準（CNS ) A4· (^10^297^ (請先閲讀背面之注意事項再填寫本頁} 、11 • I 1 —一二 |層 552831 A7 B7 五、發明説明（9 耗非限制性，於本發明之—特定具體實施例中，該至少二=填料之平均粒徑於主維度係於〇〇ι微米至麵微 ▼ 才于〈千均粒徑可根據已知之雷射政射技術測量。本發明之非限制性具體實施例中，粒_ 係使用貝克曼庫特LS 230雷射衍射粒徑裝備測量，咳裝備使用波長爲750毫微米之雷射束俾測量粒子大小，且m m亦即「粒徑」-詞表示可完全包圍該粒子：最，。適當粒子形狀例如包括但非限於立方體、多小面丄球形粒子、板狀粒子及針狀粒子。 (容未顯⑽例如藉積層法 (一备後砰述）牛固固定至預浸物層14而形成積層物，如圖3所 7JT 0 訂雖然並非限制性，本發明之至少—種基體材㈣於後文 !=聚：！基體材料加以説明。用於此處「聚合物基祖材科」表示由長鏈原子聯結在_起且變成心 =或固態的巨分子1。但業界人士了解其它基體材料例抑 =陶璃陶資可用於本發明之若干具體實施例作馬至v-種基材料。本發明有用的聚合經濟部中央標準局員工消費合作社印製㈣性及熱塑性材料。有用的熱固性聚合物材二= 性貫例包括熱固性聚酯類、乙缔系酯類、環氧化物類(分子含有至少-個環氧基或環氧乙t基，例如多元醇或多元妒醇之聚縮水甘油基醚、酚系化合物、胺基塑性物質、熱固 (一爾合物科學及工程系列 -12- 本纸張尺度適用中國國豕標準（€阳）厶4^格（2丨〇父297公羞）經濟部中央標準局員工消費合作社印製 552831 五、發明説明（10) f生來月女基甲酸酿類及其衍生物及混合物。本發明之一非限制丨生具岐實施例中，形成印刷電路板積層物之聚合物基體材料$ FR 4%氧樹脂，其爲多官能環氧樹脂例如二官能基溪化環氧樹脂、聚醯亞胺類及液晶聚合物，其組成爲業界人士重複速率。若須此等組成之進一步參考電子材料手 ~，ASM國際公司（1989年）534- 537頁，特別併述於此以供參考。一有用的扁塑性聚合物基體材料之非限制性實例包括聚烯 ^頦聚醯胺類、熱塑性聚胺基甲酸酯類、熱塑性聚酯力員二乙烯系聚合物及其混合物。有用的熱塑性材料之進一步實例包括聚酉盛亞胺類、聚_石風類、聚苯基石風類、聚鍵酉同颂 > 禾伸苯基氧化物、聚伸苯基硫化物、聚縮醛、聚乙缔基氣、及聚碳酸自旨類。本發明有用的聚合物基體材料調配劑之特定非限制性實例包括伊朋（EP〇N) 112〇-剔環氧樹脂（市面上得自德州二士頓殼牌化學公司）、二氰基二酿胺、2_甲基咪嗤及朵偉諾 (DOWANOL) PM二醇醚（市面上得自密西根州密德蘭陶化學公司）。％、其它可含括於預浸物層14之組成分包括但非限於著色劑或顏料、潤滑劑或加工助劑、紫外光（uv)安定劑、抗氧化劑、其它填料例如阻燃劑及增量劑。勺：發明之非限制性具體實施例中，至少-種基體材料16 包3至少一種非氟化聚合物料。另一非限制性具體實施例中，至少一種基體材料16以總固體爲基準，包含不大於 -13- M氏張尺度適用中國國家洛（210X297公釐了 (請先閲讀背面之注意事項再填寫本頁} 訂552831 A7 B7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of Invention (8 sub-supports. As used herein, the term "unreinforced printed circuit board" means a printed circuit board that does not contain reinforcing materials. In addition The person skilled in the art must understand that the method for forming holes in the present invention I can be used in any electronic support and special printed circuit boards including unreinforced printed circuit boards and printed circuit boards formed using the reinforcing materials discussed above to form holes. Purpose In addition to operation examples and other instructions, all numbers indicating the number of components, reaction conditions, etc. in the description and the scope of patent applications must be understood in each case are modified with the word "about". Unless otherwise stated State otherwise, the numerical parameters listed in the following description and the accompanying patent application scope are approximate, which can be changed according to various properties predetermined by the present invention. In the least cases, but not limited to the equivalent of the patent application scope The scope of application. Each numerical parameter must be interpreted at least in terms of the number of significant digits reported and the application of ordinary rounding techniques. Although the ranges and parameters in the broad scope of the present invention are approximate, the numbers reported in specific examples are as accurate as possible. Any number must contain some of the standard deviation caused by its individual testing process. Referring to Fig. 1, an electronic pacing member 10 according to a non-limiting embodiment of the present invention is shown. The electronic support member 1 () includes at least a prepreg layer 14 and includes at least one woven fiber reinforcement material 20 with At least one matrix material 16 is applied to at least a portion thereof. At least one matrix material 16 includes at least one inorganic filler 18. Although not necessary, in a non-limiting specific embodiment of the present invention, the at least one inorganic filler 18 is Granular inorganic fillers. For this purpose, "granular" non-fibrous particles of Iokai π. At least one inorganic filler 18 may have any particle size and particle shape suitable for the intended end product. China National Standards (CNS) A4 · (^ 10 ^ 297 ^ (Please read the notes on the back before filling out this page), 11 • I 1 —One Two | Layer 552831 A7 B7 V. Description of Invention (9 Consumption is non-limiting. In a specific embodiment of the present invention, the average particle diameter of the at least two = filler is in the main dimension from 0.00 μm to the surface micro ▼ Only the average particle diameter can be determined according to known thunder Measurement by radio technology. In a non-limiting specific embodiment of the present invention, particles are measured using Beckman Coulter LS 230 laser diffraction particle size equipment, and cough equipment is measured using a laser beam with a wavelength of 750 nm. Size, and mm is the "particle size"-the word means that it can completely surround the particle: the most. Suitable particle shapes include, but are not limited to, cubic, multi-faceted, spherical particles, plate-shaped particles, and needle-shaped particles. For example, by using the lamination method (which will be described later), the ox solid is fixed to the prepreg layer 14 to form a laminate, as shown in FIG. 7JT 0 Although not restrictive, at least the base material of the present invention is hereinafter Text! = Poly :! The base material is explained. As used herein, "polymer-based ancestral material family" means a macromolecule 1 that is connected by a long chain atom and becomes a heart or solid. However, people in the industry understand that other substrate materials are limited. Ceramic materials can be used in several specific embodiments of the present invention as a base material. The present invention is useful for printing flexible and thermoplastic materials by the Consumer Standards Cooperative of the Central Standard Bureau of the Ministry of Economics. Useful thermosetting polymer materials: Properties include thermosetting polyesters, ethyl esters, and epoxides (the molecule contains at least one epoxy or ethylene oxide group, such as a polyhydric alcohol or polyhydric alcohol Polyglycidyl ethers, phenolic compounds, amine-based plastic materials, thermosets (Ircon Compound Science and Engineering Series-12- This paper size applies to China's national standard (€ 厶) 厶 4 ^ grid (2 丨〇 Father 297 public shame) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 552831 V. Description of the invention (10) f Birth month feminine formic acid and its derivatives and mixtures. In the embodiment, the polymer matrix material of the printed circuit board laminate is $ FR 4% oxygen resin, which is a multifunctional epoxy resin such as a difunctional epoxy resin, polyimide, and a liquid crystal polymer. The composition is the repetition rate of the industry. If further reference is required for these compositions, ASM International Corporation (1989) pages 534-537, which are specifically described here for reference. A useful flat plastic polymer matrix material Non-limiting examples include Polyolefins, thermoplastic polyurethanes, diethylene polymers based on thermoplastic polyesters, and mixtures thereof. Further examples of useful thermoplastic materials include polyimides, polysulfonates , Polyphenylene oxides, polybonds, and polyethers> Graxyl phenyl oxide, polyphenylene sulfide, polyacetal, polyacetylene, and polycarbonate carbon dioxide. Useful polymerizations of the present invention Specific non-limiting examples of material matrix material formulations include Ebon (EPON) 112-Tip epoxy resin (commercially available from Texas Erston Shell Chemical Company), dicyanodimethamine, 2-methylamine Gimidine and DOWANOL PM glycol ether (available on the market from Midland Ceramics, Michigan).% Other components that can be included in the prepreg layer 14 include, but are not limited to, coloring Agents or pigments, lubricants or processing aids, ultraviolet (UV) stabilizers, antioxidants, other fillers such as flame retardants and extenders. Scoop: In a non-limiting specific embodiment of the invention, at least one base material 16 packs of at least one non-fluorinated polymeric material. Another non-limiting Embodiment, at least one matrix material 16 to a total solids basis, contains no more than -13- M Zhang's Chinese National Rockwell scale applies (a 210X297 mm (Read precautions to fill out the back of the book page}

• in —Bi I HI 經濟部中央標準局員工消費合作社印裝 552831 五、發明説明（11) 50%重置比氣化聚合物料。 — 5…一始JL⑥ +另一非限制性具體實施例中， v 土骨豆材料16包含以總固體爲&m，；τ + λ 量比氟化聚合物料。又另基丰不大於3〇%重 a甘油十又另一非限制性具體實施例中，至少一種基體材料16以總固體爲其M —人产^ A 基丰，包含不大於10%重量比氟化聚合物料。本菸明 > 非阳^ 不焱明之一非限制性具體實施例中，至 :種基體材料16大致上不含氟化聚合物料。用於此處，大致上不含氟化聚合物料」一詞表示聚合物基體材料以總固體：基準，包含不大於5%重量比氟化聚合物料，且較佳不含氟化聚合物料。雖然非限制性，但氟化聚合物用於本具體實施例並不佳，原因在於添加氣化聚合物料至聚人物基體材料提高聚合物基體材料之介電常數，如此於某：應用可能對由該材料製成的電子支撐件的整體性能不利。此外，氟化聚合物昂貴而可能提高電子支撐件成本。參照圖1，本發明有用的無機塡料18可由無機材料形成，包括但非限於陶瓷材料如氧化物、氮化物、碳化物、硼化物、玻璃材料（容後詳述）、金屬及其它礦石例如黏土礦石。雖然非限制性，爲了於積層物製造過程中將加強材料的磨蚀減至最低，於本發明之一非限制性具體實施例中，至少一種操機填料1 8具有硬度値其係不大於加強材料2 〇之硬度値。播機％料1 8及加強材料2 〇之硬度値可藉習知硬度測量法決定例如維克氏（Vickers^或布里暴（Brinell)硬度，但較佳係根據原先摩氏（Mohs)硬度刻度測定，摩氏硬度刻度指示材料表面之相對耐到擦性。如此於本發明之一非限制性具ta貫施例中’加強材料係由具有摩氏硬度値6之玻璃 14- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁)• in —Bi I HI Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 552831 V. Description of the invention (11) 50% reset ratio of gasified polymer materials. — 5… at first JL⑥ + In another non-limiting specific embodiment, v soil bone bean material 16 includes & m, τ + λ in an amount ratio of fluorinated polymer material. In another specific embodiment, the base is not more than 30% by weight a glycerol. In another non-limiting specific embodiment, at least one matrix material 16 is based on a total solids of its M-produced ^ A base, including not more than 10% by weight Fluorinated polymer material. The present smoke > non-yang ^ In one non-limiting specific embodiment, to: the seed base material 16 is substantially free of fluorinated polymer material. As used herein, the term "substantially free of fluorinated polymer materials" means that the polymer matrix material, based on the total solids: basis, contains no more than 5% by weight of fluorinated polymer materials, and is preferably free of fluorinated polymer materials. Although non-limiting, the use of fluorinated polymers in this embodiment is not good because the addition of a gasified polymer material to the polymer matrix material increases the dielectric constant of the polymer matrix material. The overall performance of an electronic support made of this material is disadvantageous. In addition, fluorinated polymers are expensive and may increase the cost of electronic supports. Referring to FIG. 1, the useful inorganic filler 18 of the present invention may be formed from inorganic materials, including but not limited to ceramic materials such as oxides, nitrides, carbides, borides, glass materials (described in detail later), metals, and other ores such as Clay ore. Although non-limiting, in order to minimize the abrasion of the reinforcing material during the manufacturing process of the laminate, in one non-limiting specific embodiment of the present invention, at least one of the fillers 18 has a hardness that is not greater than the reinforcing material 2 〇 hardness 値. The hardness of drill material 18 and reinforcing material 2 can be determined by conventional hardness measurement methods such as Vickers ^ or Brinell hardness, but it is preferably based on the original Mohs hardness The scale measurement indicates that the Mohs hardness scale indicates the relative resistance to rubbing on the surface of the material. Thus, in one non-limiting embodiment of the present invention, the 'reinforcing material is made of glass with Mohs hardness 値 6-this paper size Applicable Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page)

Ψ 552831552831

7 B 五、發明説明（12) 纖維製成，至少一種無機填料之摩氏硬度値不大於6;於另一非限制性具體實施例中，摩氏硬度係於〇. 5至6之範圍。若干適合用於本發明之無機填料之非限制性實例之摩氏硬度値示於下表A。7 B V. Description of the invention (12) The Mohs hardness 値 of at least one inorganic filler is not more than 6; in another non-limiting specific embodiment, the Mohs hardness is in the range of 0.5 to 6. The non-limiting examples of certain inorganic fillers suitable for use in the present invention are shown in Table A below.

表A 無機填料摩氏硬度（原始刻度）氮化硼 22 石墨 0.5-13 二硫化鉬 I4 滑石 1-1.55 雲母 2.8-3.26 高嶺土 2.0-2.57 石膏 1.6_28 方解石（碳酸鈣） 39 氟化鈣 4ιο 氧化鋅 4.511 硫化鋅 3.5-412 铭 2.513 銅 2.5-314 鐵 4-515 金 2.5-316 鎳 5丨7 1巴 4.818 姜白 4.319 銀 2.5-420 2 K. Ludema，摩擦、磨耗、潤滑（1996年)27頁，併述於此以供參考。 3 R· Weast (編輯），物理及化學手册，CRC出版社（1975年）F-22頁。 4 R. Lewis，Sr.，哈利簡明化學辭典，（1993年第12版）793頁，併述於此以供參考。經濟部中央標準局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) -15- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 552831 A7 B7 經濟部中央標準局員工消費合作社印製五、發明説明（13 5 R· Lewis，Sr·，哈利簡明化學辭典，(I993年第U版）11Π頁，併述於此以供參考0 ~ ^ R. Lewis，Sr.，哈利簡明化學辭典，（1993年第12版)784頁，併述於此以供參考。也學及物理羊藝，F-22頁。 8也學及物理羊冊，F-22頁。座^_、磨耗、潤湣，27頁。 3廑擦、磨耗、淵潘，27頁。 |廋擦、磨耗：淵潘，27頁。曼及物理手册，CRC出版社（1990年第71版）4-158頁，併述於此以仳夂本 |摩擦、磨耗^^，77百。 ”亏。 \化學及物理丰研，F-22頁。 >化學及物理羊播，F-22頁。 3也學及物理手册，F-22頁。 7化學及物理丰I，F-22頁。 $化學及物理丰舞，F-"百。 - 學及物理年册，F-22頁。 2Q化學及物理羊舞，F-22頁。如前述，摩氏硬度刻度係有關材料對刮擦的耐性。因& 本發明包含無機填料1 8其具有硬度於其表面係與填料表@ 下方内部的硬度不同。特別，粒子表面可以業界已知之任一種方式改變，該等方式包括但非限於使用業界已知技術對粒子表面特性作化學改變，故粒子表面硬度係小於或等於玻璃纖維硬度，而表面下方的粒子硬度係大於破璃織維硬度。至於另一替代之道，粒子可由一種主要材料形成，該主要材料係使用一或多種次要材料塗覆、包覆或包囊而形成具有較爲柔軟表面的複材。另外，粒子可由主要材料使用不同形式的主要材料塗覆、一包覆或包囊形成一種具有較柔軟表面的複材製成。一實例中但非限制本發明，無機粒子係由無機材料例如碳化矽或氮化鋁製成，其可被提供氧化矽、碳酸鹽或奈米 -16- 本紙張尺度適用中國國家榡準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁} -訂 552831 A7 B7 14 五、發明説明（黏土塗層而形成有用的複材粒子。另一口、例中，無機粒子可與偶合劑反應，該偶合劑之功能鍵結無機粒子，及其功能可交聯薄膜形成材料或.可交聯樹脂。此寺偶合劑述於美國專利5,853,8〇9第7搁第2〇行至第8 欄弟43行’併述於此以供參考。有用，甘油基、異氰酸根 '胺基或胺基曱醯基官能基魏偶: 劑。^-非限制性實例中，帶有燒基支鏈的石夕乾偶合劑可與由無機氧化物形成的無機粒子表面反應而提供有用的具有「較軟」表面的複材粒子。其它實例包括使用不同的非聚合物或聚合物材料包覆、包囊或塗覆由非聚合物或聚合物材彡成的粒子。此種複材粒子之特定非限制性實例^ 杜瓦莱（DUALITE)其爲一種使用碳酸鈣塗覆之合成聚合物粒子，市面上得自紐約州水牛城皮爾斯及史帝文公司。爲了將本發明之電子支撐件之吸水性減至最低，於本之非限制性具體實施例中，至少—種無機填料Μ爲非可水合。用於此處「非可水合」一詞表示無機填料不會與水分子反應而形成水合物，且不含水合水或結晶水。「水合物」係經由水分子與一種物質反應而〇]9[鍵未被割斷所產生。參考R· Lewis, Sr.，哈利簡明化學辭典，( 1993年第12 版）609- 610 頁及 Τ· Perr〇s，( 1967 年）186- 187 頁，特別併述於此以供參考。水合物―之化學式中，水分子的添加通常係以對中的圓點表示例如3Mg〇MSi〇2.H2〇 (滑石）， Al2〇3· 2Si〇2· 2Η〗0 (高嶺土）。就結構上可水合無機材料包括至少一個羥基於一層晶格内部（但非包括羥基於單位結構表 -17 本紙張尺度適用中國國家標準（CNS ) M規格（21〇><297公釐） C請先閱讀背面之注意事項再填寫本頁jTable A Inorganic filler Mohs hardness (original scale) Boron nitride 22 Graphite 0.5-13 Molybdenum disulfide I4 Talc 1-1.55 Mica 2.8-3.26 Kaolin 2.0-2.57 Gypsum 1.6_28 Calcite (calcium carbonate) 39 Calcium fluoride 4ιο Zinc oxide 4.511 zinc sulfide 3.5-412 inscription 2.513 copper 2.5-314 iron 4-515 gold 2.5-316 nickel 5 丨 7 1 bar 4.818 ginger white 4.319 silver 2.5-420 2 K. Ludema, friction, wear, lubrication (1996) page 27 And described here for reference. 3 R. Weast (eds.), Handbook of Physics and Chemistry, CRC Press (1975), pages F-22. 4 R. Lewis, Sr., Harry's Concise Chemical Dictionary (12th edition, 1993), p. 793, and is hereby incorporated by reference. Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the notes on the back before filling this page) -15- This paper size applies to the Chinese National Standard (CNS) A4 (210X297 mm) 552831 A7 B7 Central Standard of the Ministry of Economics Printed by the Bureau ’s Consumer Cooperatives V. Invention Description (13 5 R · Lewis, Sr ·, Harry's Concise Chemical Dictionary, (U993, I993), page 11Π, and described here for reference 0 ~ ^ R. Lewis, Sr., Harry's Concise Chemical Dictionary, (12th edition, 1993), page 784, and is hereby incorporated by reference. Also learns Physics and Sheep Art, page F-22. 8 Also studies and Physics Sheep Book, F-22 Page. Block ^ _, Wear, Run, page 27. 3 Rub, Wear, Yuanpan, page 27. | Wipe, Wear: Yuan Pan, page 27. Handbook of Man and Physics, CRC Press (1990) 71 edition) 4-158 pages, and described here in transcript | friction, abrasion ^^, 77 hundred. "Loss. \ Chemistry and Physics Fengyan, page F-22. &Gt; Chemical and Physical Sheep, F -22 pages. 3 Handbook of Science and Physics, page F-22. 7 Chemistry and Physics Feng I, pages F-22. $ Chemical and Physics Toyomi, F- " Hundred Yearbooks-Yearbook of Science and Physics, F- Page 22. 2Q Chemistry and Physics Yang Wu, page F-22. As mentioned above, the Mohs hardness scale is related to the resistance of materials to scratches. Because the present invention contains inorganic fillers 18 which have hardness on the surface and fillers The hardness inside the table below is different. In particular, the particle surface can be changed in any way known in the industry, including but not limited to chemically changing the surface characteristics of the particle using known techniques in the industry, so the particle surface hardness is less than or equal to glass The hardness of the fibers, and the hardness of the particles below the surface is greater than the glass weave dimension. As another alternative, the particles may be formed from a primary material that is coated, coated, or encapsulated with one or more secondary materials A composite material with a softer surface is formed. In addition, the particles can be coated with a main material using a different form of the main material, a coating or encapsulation to form a composite material with a softer surface. An example is not limited. In the present invention, the inorganic particles are made of an inorganic material such as silicon carbide or aluminum nitride, which can be provided with silicon oxide, carbonate or nano-16-paper. Zhang scale is applicable to China National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before filling out this page}-Order 552831 A7 B7 14 V. Description of the invention (Clay coating forms a useful composite material Particles. In another example, the inorganic particles can react with a coupling agent, the function of which couples the inorganic particles, and its function can crosslink the film-forming material or the crosslinkable resin. This temple coupling agent is described in the US patent 5,853,809 line 7 line 20 to column 8 line 43 'and described here for reference. Useful as glyceryl, isocyanate ', or aminofluorenyl functional groups. ^ -In a non-limiting example, a Shixigan coupling agent with a calcined branch may react with the surface of an inorganic particle formed of an inorganic oxide to provide a useful composite particle having a "softer" surface. Other examples include coating, encapsulating or coating particles formed from non-polymeric or polymeric materials with different non-polymeric or polymeric materials. A specific, non-limiting example of such composite particles DUALITE is a synthetic polymer particle coated with calcium carbonate and is commercially available from Pierce and Stevens Company of Buffalo, New York. In order to minimize the water absorption of the electronic support of the present invention, in this non-limiting specific embodiment, at least one of the inorganic fillers M is non-hydratable. As used herein, the term "non-hydratable" means that the inorganic filler does not react with water molecules to form hydrates, and does not contain water of hydration or crystallization. "Hydrate" is produced by the reaction of water molecules with a substance and the [9] [bond is not cut. Reference is made to R. Lewis, Sr., Harry's Concise Chemical Dictionary, (12th edition, 1993) pages 609-610 and T. Perrós, (1967) pages 186-187, which are specifically incorporated herein by reference. In the chemical formula of hydrates—the addition of water molecules is usually represented by centered dots, for example, 3MgOMSi02.H2O (talc), Al2O3 · 2Si02 · 2Η0 (kaolin). The structurally hydratable inorganic material includes at least one hydroxyl group in one layer of the crystal lattice (but not including hydroxyl groups in the unit structure. Table-17 This paper size is applicable to the Chinese National Standard (CNS) M specification (21〇 > < 297 mm) CPlease read the notes on the back before filling in this page j

經濟部中央標準局員工消費合作社印製 552831 A7 ______ B7 五、發明説明（15) 面，或吸水於表面或藉毛細作用吸水的材料），例如了Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 552831 A7 ______ B7 V. Description of Invention (15) Surface, or materials that absorb water on the surface or by capillary action), such as

Mltche11，年）34 頁圖 3.8所示高嶺土結構；以及H· van 〇lphen，黏土膠體化學，( 1977年第2版） 62頁圖18及19分別顯示的工：i及2 : i層礦石結構，特別併述於此以供參考。一「層」晶格爲一種薄片的組合，亦即原子平面的組合。參考主J襄環境礦石，美國土壤科學會 ( 1977年）196- 199頁，特別併述於此以供參考。一層與一中間層材料（例如陽離子）的組合體稱作爲一單位結構。水=物含有：（1)配位水，其配位水合材料的陽離子且可未破壞結構而被去除；及/或⑺結構水.，其佔據結構的間隙增加靜電能而未干擾電荷平衡。參考R. Evans，晶體化 l^iLU948年）276頁，特別併述於此以供參考。經濟部中央標準局員工消費合作社印裝 (請先閱讀背面之注意事項再填寫本頁) 。本發明之一特定非限制性具體實施例中，至少一種無機填料18包含以總固體爲基準不大於8〇%重量比可水合填料。另一非限制性具體實施例中，至少一種無機塡料^包 ' 種固把爲基準不大於3重量比可水合填料。本發明之又另非限制性具體實施例中，至少一種無機塡料丨8大致上不含可水合填料。用於此處「大致上不含可水合填料」^示以總固體爲基準，至少一種無機填料Μ包含^於 5 /〇重量比及更佳小於1 %重量比可水合填料。 —=後文進一步討論其細節之本_發明之另一非限制性具體貫施例中，至少一種播機填料18包含至少一種由可水合或 K 5 ·’’、機材料製成的塡料來替代或額外添加至前述非可水合無機材料。此種可水合無機材料之非限制性實例爲黏土 -18 - 本紙張尺度適用中國國家( CNS )从胁（21〇χ297公楚）五、發明説明（16) !=?。雲母(如白雲母)、滑石、蒙脱土、高嶺 -種機固體潤滑劑」—詞表示此處，「無間的摩擦係數固體」：=:==: 下不會出現可覺察的流動，且有特处、 ^ 其變形力，以乃认，、特疋此力可對抗傾向於讓質。表者产氏/哥吊條件下可保有特定形狀及大小的物 "~產·國際英語辭盖二完整版n 〇7 1年）2169 ^特別併述於此以供參考。固體包括結晶性及非結晶性 :貝。雖然於本發明並非限制性，例如無機固體潤滑劑可 ;用以將摻混填料18之電子支撐件形成孔洞之鑽孔工且虫電子支撐件鄰近固體表面間產生抗摩擦潤滑效果。用於此處’「摩擦」-詞表示一種固體於另一種固體滑動的阻力。F· Clauss，里直（ 1972年頁’特別併述於此以供參考。經濟部中央標準局員工消費合作社印製雖然非受任何特定理論所限，相信經由結合包含至少一種無機固體潤滑劑填料18之預浸物層14至本發明之電子支撐件10，可改良由此形成之印刷電路板之鑽孔性質。特別相仏固體潤滑劑可於鑽孔過程作爲鑽孔助劑（或鑽孔潤滑劑）藉此減低摩擦以及減少工具的磨_耗。此外，相信經由將固體潤滑劑結合至積層物本身而非施用於外部（如同油或其它鑽孔潤滑劑），潤滑劑可於鑽孔工具與電子支撐件間的界面利用’亦即於鑽孔工具磨耗位置利用。 -19 - 本紙張尺度適用中國國家標隼（CNS ) 格（210x297公羡） 552831 17 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（雖然非限制性，但此處揭示之無機固體潤滑劑具有特徵性結晶習慣，因而被切成薄平板，方便彼此滑動如此提供笔子支撐件及特別玻璃纖維加強物與峨鄰固體表面（其中至少一者在移動當中）間的抗摩擦潤滑效果。參考R.Mltche11, year) Kaolin structure shown in Figure 3.8 on page 34; and H. van olphen, clay colloid chemistry, (2nd edition, 1977) Figures 18 and 19 on page 62 show the work: i and 2: i layer ore structure In particular, it is described here for reference. A "layer" lattice is a combination of flakes, that is, a combination of atomic planes. Refer to Master J. Xiang Environmental Ore, American Society of Soil Science (1977), pp. 196-199, and specifically refer here for reference. The combination of one layer and an interlayer material (such as cations) is called a unit structure. Water contains: (1) coordination water, which coordinates the cations of the hydrating material and can be removed without destroying the structure; and / or tritium structure water, which occupies the gaps in the structure to increase electrostatic energy without disturbing the charge balance. See R. Evans, Crystallization, il) (948), p. 276, which is specifically incorporated herein by reference. Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page). In a specific non-limiting embodiment of the present invention, the at least one inorganic filler 18 comprises a hydratable filler in an amount of not more than 80% by weight based on the total solids. In another non-limiting specific embodiment, at least one kind of inorganic filler is not more than 3 weight ratio of hydratable filler. In yet another non-limiting embodiment of the present invention, at least one of the inorganic materials 8 is substantially free of hydratable fillers. As used herein, "substantially free of hydratable filler" indicates that based on the total solids, at least one inorganic filler M contains hydratable filler in a weight ratio of 5/0 and more preferably less than 1% by weight. — = The details of this are discussed further below_ In another non-limiting specific embodiment of the invention, the at least one seeding filler 18 includes at least one kind of hydrating or K 5 · ”material Instead of or in addition to the aforementioned non-hydratable inorganic materials. A non-limiting example of such a hydratable inorganic material is clay -18-This paper is applicable to the Chinese National Standard (CNS) Congxie (21〇χ297 公楚) 5. Description of the invention (16)! = ?. "Mica (such as muscovite), talc, montmorillonite, kaolin-seed solid lubricant"-the word means here, "continuous friction coefficient solid": =: ==: no appreciable flow, and There are special features, ^ its deforming force, because it is recognized, this force can resist the tendency to let quality. The presenter can keep objects of a specific shape and size under the conditions of Chanel's / Brothers " ~ Chronicle · International English Dictionary 2 full version n 071) 2169 ^ Special and described here for reference. Solids include crystalline and amorphous: shellfish. Although not restrictive in the present invention, for example, inorganic solid lubricants may be used; a driller for forming holes in the electronic support with the filler 18 mixed therein and the anti-friction lubricating effect between the electronic support and the solid surface. As used herein, the term "friction" means the resistance of one solid to sliding of another. F. Clauss, Li Zhi (1972 page 'special and described here for reference. Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs, although not bound by any particular theory, it is believed that the combination contains at least one inorganic solid lubricant filler The prepreg layer 14 of 18 to the electronic support 10 of the present invention can improve the drilling properties of the printed circuit board thus formed. Especially the solid lubricant can be used as a drilling aid (or drilling) Lubricants) to reduce friction and reduce tool wear. In addition, it is believed that by combining a solid lubricant to the laminate itself rather than applying it to the outside (like oil or other drilling lubricants), the lubricant can be used in drilling The use of the interface between the tool and the electronic support means that it is used at the abrasion position of the drilling tool. -19-This paper size applies to the Chinese National Standard (CNS) grid (210x297 public envy) 552831 17 Staff Consumer Cooperative, Central Bureau of Standards, Ministry of Economic Affairs Print A7 B7 V. Description of the invention (Although non-limiting, the inorganic solid lubricant disclosed here has characteristic crystallization habits, so it is cut into thin flat plates. They thus provide the sliding support member and another sub pen especially fiber glass reinforcement and Bauer o solid surface (wherein at least one of them moving) the effect of the anti-friction lubrication between the reference R.

Sr·，fjlAi月化學辭差，( 1993年第12版）712頁，特別併述於此以供參考。雖然並非必要，但於本發明之一非限制性具體實施例中，無機固體潤滑劑具有層狀結構。具有層狀結構之無機固體潤滑劑係由六面體陣列的原子片或原^ 板組成，各薄片内部有強力鍵結以及薄片間有弱凡得瓦爾鍵結，提供薄片間的低抗剪強度。參考摩擦、廢耗、淵生_ 12 5頁，固骨豆潤滑劑及自行潤滑固體，1 9 _ 2 2、4 2 - 5 4、 75-77 、 80·81 、 82 、 9〇_1〇2 、 113-12〇及 128 頁；wSr ·, fjlAi, Chemical Distinguishment of Months, (12th edition, 1993), page 712, which is specifically incorporated herein by reference. Although not necessary, in one non-limiting embodiment of the present invention, the inorganic solid lubricant has a layered structure. The inorganic solid lubricant with a layered structure is composed of hexahedral arrays of atomic sheets or original plates. Each sheet has strong bonds inside the sheets and weak van der Waals bonds between the sheets, providing low shear strength between the sheets. . Refer to friction, waste, and Yuan Sheng _ page 5, 5 Bone Bean Lubricants and Self Lubricating Solids, 1 9 _ 2 2, 4 2-5 4, 75-77, 80 · 81, 82, 9〇_1〇 2, 113-12, and 128 pages; w

CampbeU，「固體潤滑劑」’ ;世界文獻誶核， ASME潤滑研究委員會（1969年）2Q2_2()3頁，特別併述於此以供參考。本發月有用的具有層狀結構之適當無機固體潤滑劑之非 =制性實例包括氮化删、石墨、金屬：硫屬化物、雲母、滑石、高嶺土、碘化鎘、硼酸及其混合物。本發明之非限制性具體實施例中，無機固體潤滑劑係選自氮化硼、石 "至屬一硫屬化物及其混合物。適當金屬二硫屬化物之非限制性實例包括二硫化鉬、二_石西化細、二硫化鈕、二硒化鈕、二硫化銻、二硒化銻及其混合物。其匕具有層狀結構且相信於本發明有用之無機固體潤滑 I括仁非限於已經***有機陽離子之天然及合成黏土。 (請先閱讀背面之注意事項再填寫本頁)CampbeU, "Solid Lubricants"; World Literature Tritium, ASME Lubrication Research Council (1969), 2Q2_2 (), page 3, and is specifically incorporated herein by reference. Non-limiting examples of suitable inorganic solid lubricants having a layered structure that are useful this month include nitriding, graphite, metals: chalcogenides, mica, talc, kaolin, cadmium iodide, boric acid, and mixtures thereof. In a non-limiting embodiment of the present invention, the inorganic solid lubricant is selected from the group consisting of boron nitride, stone " chalcogenide and a mixture thereof. Non-limiting examples of suitable metal dichalcogenides include molybdenum disulfide, di-lithium carbide, disulfide button, diselenide button, antimony disulfide, antimony diselenide, and mixtures thereof. The dagger has a layered structure and is believed to be useful in the present invention as an inorganic solid lubricant. The kernel is not limited to natural and synthetic clays with organic cations inserted. (Please read the notes on the back before filling this page)

-20-20

552831 A7 B7 五、發明説明（18 ) 用於此處「***有機陽離子」_詞表示黏土層（或層）至少部份被導人的有機陽離子而分成成對眺鄰層間的空間。插入黏土且相信於本發明有用之非限制性實例有納諾瑪 (NANOMER^米黏i，市面上得自伊利#州阿靈頓高地納諾闊（Nanocor)公司。本發明之-非限制性具體實施例中，具有六面體晶體結構之氮化硼粒子爲可用作爲本發明之無機填料18之層狀固體潤滑劑。適合用於本發明之六面體氮化硼粒子之非限制性實例有波樂森（P〇larTherm⑧）1〇〇系列（ρτ 12〇，ρτ 14〇， ΡΤ 160 及 ΡΤ 180)、300 系列（ΡΤ 3 50)及 600 系列（ΡΤ 020，經濟部中央標準局員工消費合作社印製 ΡΤ 630，ΡΤ 640及ΡΤ 670)氮化硼粉狀粒子，市面上可得自俄瓦俄州雷克午（Lakewood)先進陶瓷公司。參考「波樂森來e物料之導熱填料」，俄亥俄州雷克午先進陶瓷公司技術報導（ 1996年），特別併述於此以供參考。此等粒子具有熱傳導係數於25°C (298度K)，爲250- 300瓦/米凱氏溫標 (W/mk)，介電常數3·9及體積電阻係數1〇15歐姆-厘米。ι〇〇系列粉狀粒子具有平均粒徑爲5微米至14微米，3〇〇系列粉狀粒子具有平均粒徑由1〇〇微米至150微米，以及600系列粉狀粒子具有平均粒徑於16微米至大於200微米之範圍。並非询限本發明，可用作爲本發明之填料之特殊級波樂森粒子爲波樂森160粒子，如供應商之租告具有平均粒徑6至12微 %> 10 ^ 7 六私1王刀 ν 50 π促： 90 大小（微米） 18.4 7.4 0.6 -21 本紙張尺度(CNS) Α4· (2似297公楚 552831 A7 B7 19’ 五、發明説明（ (請先閲讀背面之注意事項再填寫本頁) 根據此種分布，測量之10%波樂森16〇氮化硼粒子具有平均粒徑大於18_4微米。用於此處「平均粒徑」一詞表示粒子之平均粒子大小。根據本發明之粒子之平均粒徑可根據已知之雷射散射技術測量。本發明之_非限制性具體實施例中，粒子大小係使用貝克曼庫特LS 23〇雷射繞射粒徑儀器測量，如前述，該儀器使用具有波長75〇毫微米的雷射束測量粒子大小且假設粒子爲球形。對使用貝克曼庫特U 23〇粒徑分析儀測量之波樂森160氮化爛粒子樣本之粒徑進行獨立分析’發現氮化硼粒予具有平均粒徑η·9微米，粒子範 %> 10 1 T工m： _ 50 90 大小（微米） --- 20.6 11.3 4.0 1 收禾林i0U虱化硼粒子具有平均粒徑大於20· 6微米。其匕可用作爲採機固體潤滑劑且相信可用於本發明之無機填料例如爲具有_碳的大分子（「buekybaii」）結狀無機填料及氧化銻。本發月之非限制性具體實施例中，至少一種無機填料1 8 係由非可水合之層狀無機固體潤滑劑製成。 ___ 一本經濟部中央標準局員工消費合作社印製當鑽孔工具與積層物間的摩擦力減低時，部份原因係由 :存一在有預浸物層14其包含至少無機塡料18於基體材而这預浸物層也作爲無機固體潤滑劑之故日^由於鑽孔期間產熱減少，因而減少鑽孔被樹脂站= 么生率才目^ $固體、潤滑劑具有熱傳導係數高於$合物基標準(士) μ· ( -22- 552831 A7 五、發明説明（2C)) 體材料16及加強材料20的熱傳導係數，則樹脂的玷污可進一=降低。雖然非受任何特定理論所限，相信經由採用真有同熱傳導係數之固體潤滑劑，不僅潤滑性質可減少鑽孔期間產生的摩擦熱，同時產生的摩擦熱也可藉固體潤滑劑 <兩熱傳導係數而快速耗散。換言之，熱由鑽孔界面被抽離，因而降低界面溫度且防止樹脂的熔化。此外，使用高熱傳導係數填料可對製作成的最終印刷電路板提供改良熱散佈性質’因而改良附著於印刷電路板上的積體電路性能及可信度，討論如前。用於此處「高熱傳導係數」一詞表 π材料具有熱傳導係數於3〇〇度K至少爲1〇 w/mK，較佳於 300度K至少爲20 W/mK，及於300度K更佳至少爲3〇 W/ mK 0 雖然本發明之非限制性具體實施例使用亦爲固體潤滑劑之问熱傳導係數填料，但使用不一定爲固體潤滑劑之高熱傳導係數填料亦涵蓋於本發明之範圍。適合用作爲本發明之無機填料之高熱傳導係數材料之非限制性實例示於表B。 (請先閲讀背面之注意事項再填寫本頁} 、^1 經濟部中央標準局員工消費合作社印製 -23- 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） 552831 A7 B7 經濟部中央標準局員工消費合作社印裝五、發明説明（^ 我機填料熱傳導係數 (W/rnK反應於300度K) 石墨、---------- 至多 200021 — 鉬 13 822 ^ 銘 6923 ^ !巴 7024 一 ^ 鋁 20525 ' _ 鎳 9226 ^ 銅 39827 ~ 金 29728 ^^ 鐵 74.529 銀 4 1 830 ' ^ 氮化硼 20031 '^ 磷化硼 35032 磷化鋁 1 3033 '^ 氮化鋁 — 20034 〜氮化鎵 1 7035 ~^ 磷化鎵 10036 碳化矽 27037 ^ 氮化矽 3038 —s— 氧化鈹 24039 ^ 二硼化鈦 1 0040 21 . Γ 册-λ- 4 上.… 34期322頁，併述於此以供參考 R. Tummala (編輯）’ 裝手册，（1卿年）174頁，併述於此以供參考 23微電子包裝手册，nIF： -- 24同上37頁，併述於此以供參考。 25同上174頁。 26同上。 -24- 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） (請先閲讀背面之注意事項再填寫本頁〕、π 552831 A7 B7 五、發明説明（ 22 27同上。 28同上。 29同上。 3()微電子包裝手册，174頁。 ΐϋΐ。「具有同鱗導係數之非金屬晶體」化學固體期刊（1973年)552831 A7 B7 V. Description of the invention (18) The word "insert organic cation" is used here to indicate that the clay layer (or layer) is divided into pairs to overlook the space between adjacent layers, at least in part. Non-limiting examples of inserting clay and believed to be useful in the present invention are NANOMER ^ Mi Cui, commercially available from Nanocor Corporation, Arlington Heights, Erie # State. The present invention is non-limiting In specific embodiments, boron nitride particles having a hexahedral crystal structure are layered solid lubricants that can be used as the inorganic filler 18 of the present invention. Non-limiting examples of hexahedron boron nitride particles suitable for use in the present invention There are PollarTherm 100 series (ρτ 12〇, ρτ 14〇, PT 160 and PT 180), 300 series (PT 3 50), and 600 series (PT 020), employees of the Central Standards Bureau of the Ministry of Economic Affairs The cooperative prints PT 630, PT 640, and PT 670) boron nitride powder particles, which are available on the market from Lakewood Advanced Ceramics Co., Ltd., see "Thermal fillers of Polesenlai e materials" , Technical Report of Advanced Ceramics, Inc. (1996), Lake W., Ohio, which is specifically included here for reference. These particles have a thermal conductivity of 25 ° C (298 ° K) at 250-300 watts per meter Kelvin Temperature scale (W / mk), dielectric constant 3.9 and volume Resistivity of 1015 ohm-cm. The OM series powder particles have an average particle size of 5 to 14 microns, the 300 series powder particles have an average particle size of 100 to 150 microns, and the 600 series The powdery particles have an average particle size in the range of 16 micrometers to more than 200 micrometers. It is not a limitation of the present invention. The special grade Polesen particles that can be used as the filler of the present invention are Polesen 160 particles. Average particle size 6 to 12 micro%> 10 ^ 7 Liusui 1 King Knife ν 50 π promoted: 90 size (micron) 18.4 7.4 0.6 -21 paper size (CNS) Α4 · (2 like 297 public Chu 552831 A7 B7 19 'V. Description of the invention ((Please read the precautions on the back before filling this page) According to this distribution, 10% of Pollenson 16 boron nitride particles measured have an average particle size greater than 18_4 microns. Used here The term "average particle size" means the average particle size of the particles. The average particle size of the particles according to the present invention can be measured according to known laser scattering techniques. In a non-limiting specific embodiment of the present invention, the particle size uses Baker Mancourt LS 23〇 Laser Diffraction This instrument measures particle size using a laser beam with a wavelength of 75 nm and assumes that the particles are spherical, as previously described. For Polesen 160 nitriding measured with a Beckman Coulter U 23 ° particle size analyzer Independent analysis of the particle size of the rotten particle samples' found that the boron nitride particles have an average particle size of η · 9 microns, particle range%> 10 1 Tm: _ 50 90 size (microns) --- 20.6 11.3 4.0 1 Shuhelin i0U boronized particles have an average particle size greater than 20.6 microns. Its knives are useful as solid lubricants for mining machines and are believed to be useful in the present invention as inorganic fillers such as macromolecular ("buekybaii") nodular inorganic fillers and antimony oxide. In a non-limiting specific embodiment of this month, at least one inorganic filler 18 is made of a non-hydratable layered inorganic solid lubricant. ___ Printed by a consumer cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. When the friction between the drilling tool and the laminate is reduced, part of the reason is that there is a prepreg layer 14 which contains at least an inorganic filler 18 in The base material and this prepreg layer are also used as inorganic solid lubricants ^ Due to the reduction in heat production during drilling, the drilling is reduced by the resin station = morbidity rate ^ $ Solid, lubricant has a thermal conductivity coefficient higher than (Compound-based standard (±) μ · (-22- 552831 A7 V. Description of the invention (2C)) The thermal conductivity of the bulk material 16 and the reinforcing material 20 can further reduce the staining of the resin. Although not limited by any particular theory, it is believed that by using a solid lubricant with a true thermal conductivity coefficient, not only the lubricating properties can reduce the frictional heat generated during drilling, but also the frictional heat generated by the solid lubricant < two thermal conductivity coefficients And dissipate quickly. In other words, heat is extracted from the drilling interface, thereby reducing the interface temperature and preventing the resin from melting. In addition, the use of high thermal conductivity fillers can provide improved thermal spreading properties to the final printed circuit board produced, thereby improving the performance and reliability of the integrated circuit attached to the printed circuit board, as discussed previously. The term "high thermal conductivity" is used herein to indicate that a π material has a thermal conductivity at 300 degrees K at least 10 w / mK, preferably at 300 degrees K at least 20 W / mK, and at 300 degrees K more It is preferably at least 30W / mK. Although the non-limiting embodiment of the present invention uses a filler with a thermal conductivity that is also a solid lubricant, the use of a high thermal conductivity filler that is not necessarily a solid lubricant is also covered by the present invention. range. Non-limiting examples of high thermal conductivity materials suitable for use as the inorganic filler of the present invention are shown in Table B. (Please read the precautions on the back before filling this page}, ^ 1 Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs -23- This paper size applies to Chinese National Standard (CNS) Α4 specification (210 × 297 mm) 552831 A7 B7 Economy Printed by the Consumers' Cooperative of the Ministry of Standards of the Ministry of Foreign Affairs of the People's Republic of China 5. Description of the invention (^ Thermal conductivity of our fillers (W / rnK responds to 300 degrees K) Graphite, ---------- up to 200021 — Mo 13 822 6923 ^! Bar 7024 a ^ aluminum 20525 '_ nickel 9226 ^ copper 39827 ~ gold 29728 ^^ iron 74.529 silver 4 1 830' ^ boron nitride 20031 '^ boron phosphide 35032 aluminum phosphide 1 3033' ^ aluminum nitride — 20034 ~ GaN 1 7035 ~ ^ Gallium Phosphide 10036 Silicon Carbide 27037 ^ Silicon Nitride 3038 —s— Beryllium Oxide 24039 ^ Titanium Diboride 1 0040 21. Γ Issue-λ- 4 On ... 34 pages 322, Also described here for reference. R. Tummala (Editor's) Handbook, (1 year) 174 pages, and described here for reference 23 Microelectronic Packaging Manual, nIF:-24 Ibid. 37 pages, and described in This is for reference. 25 Ibid. 174. 26 Ibid. -24- This paper size applies to China Standard (CNS) A4 specification (210 × 297 mm) (Please read the precautions on the back before filling out this page), π 552831 A7 B7 V. Description of the invention (22 27 ibid. 28 ibid. 29 ibid. 3) Microelectronic packaging Handbook, page 174. ΐϋΐ. "Nonmetallic Crystals with Same Scale Conductivity" Journal of Chemical Solids (1973)

34期322頁同上325頁，併述於此以供參考。同上333頁，併述於此以供基考。同上329頁，併述於此以供參考。 35同上333頁，併述於此以供參考。 36同上321頁，併述於此以供參考。 =兔電子包裝违，36頁，併述於此以供參考。同上。 39同上9051，併述於此以供參考。本發明之非限制性具體實施例中，無機填料18具有高電阻係數。用於此處Γ高電阻係數」一詞表示材料具有電阻係數^少1000微歐姆-厘米（μΩ-厘米）。舉例但非限制本發明，高電阻係數填料可用於習知電子電路板用途俾抑制因電子傳導通過填料造成的電信號喪失。用於特殊應用例如微波電路板、射頻干涉及電磁干涉應用，無需具有高電阻係數之填料。雖然非限制本發明，具有高電阻係數可用於本發明作爲無機填料18之選定材料之電阻係數示於下表c。表C 33 34 (請先閲讀背面之注意事項再填寫本頁)Issue 34, page 322 Ibid., Page 325, and is described here for reference. Ibid. 333, and described here for the basic test. Ibid., Page 329, and is described here for reference. 35 Ibid., Page 333, and is hereby incorporated by reference. 36 Ibid., 321, and is hereby incorporated by reference. = Rabbit Electronic Packaging Violation, page 36, is described here for reference. Ibid. 39 Ibid. 9051, and is described here for reference. In a non-limiting embodiment of the present invention, the inorganic filler 18 has a high electrical resistivity. The term "high resistivity used herein" means that the material has a resistivity ^ 1000 microohm-cm (μΩ-cm). By way of example and not limitation, the present invention, high resistivity fillers can be used in conventional electronic circuit board applications to suppress the loss of electrical signals caused by electron conduction through the filler. For special applications such as microwave circuit boards, RF interference involving electromagnetic interference applications, fillers with high resistivity are not required. Although not limiting the present invention, the resistivity of selected materials having high resistivity that can be used in the present invention as the inorganic filler 18 is shown in Table c below. Form C 33 34 (Please read the notes on the back before filling out this page)

經濟部中央標準局員工消費合作社印製無機填料 _阻係數（ιιΩ -7t米）氮化硼 1.7 X 10^941 氮化鋁 ..... 大於 1〇1942 碳化矽 • 1〇5至 1 X 1 0643 硫化鋅 .2.7 X 105JU.2x 101244 鑽石 2.7X 1〇845 氮化矽 1〇19至1〇2〇46 -25- 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐）經濟部中央標準局員工消費合作社印製 552831Printed Inorganic Fillers by Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs_Resistance Coefficient (ιιΩ -7t meters) Boron Nitride 1.7 X 10 ^ 941 Aluminum Nitride ..... Greater than 101942 Silicon Carbide • 105 to 1 X 1 0643 Zinc Sulfide. 2.7 X 105JU.2x 101244 Diamond 2.7X 1〇845 Silicon Nitride 1019 to 102046 -25- This paper size applies to China National Standard (CNS) A4 specification (210 × 297 mm) Economy Printed by the Consumer Standards Cooperative of the Central Bureau of Standards of the Ministry 552831

化献刪_的合成及處理，⑽7年)654 錄及__⑽成及處理’ (1997年)654 考，及硼化物材料的饱輕，⑽7年)653 «ffflfif ’ CRC出版社(ι_年第η版）12-63頁，併述於此以供參考。 46^f與理f土，CRC出版社(1990年第71版）12-63頁，併述於此以供參考。 • eimer (編輯）’毯化物、氮化物及硼化物材料的合成及虛理，n〇07江、，r/1 頁，併述於此以供參考 1 ： " ―、w千）654 本發明之非限制性具體實施例中，該至少一種無機填料 1 8爲至v 種具有向熱傳導係數及高電阻係數之固體潤滑劑。固體潤滑劑且具有高熱傳導係數及高電阻係數之無機填料之非限制性實例爲六面體氮化硼。本發明之另一非限制性具體實施例中，該至少一種無機填料18具有低熱膨脹係數。用於此處「低熱膨脹係數」一詞表示該材料具有熱膨脹係數（CTE)係低於.聚合物基體材料 16之熱膨脹係數。雖然並非必要，但具有低熱膨脹係數之材料具有CTE低於加強材料20之CTE。本發明之非限制性具體實施例中，無機填料18具有CTE爲負，亦即無機填料18於加熱時收縮。例如但非限制性，一具體實施例中，聚合物基體材料16爲於〇°C至200°C之溫度具有CTE於600- 800 X 10·7 广C範圍之環氧樹脂材料；無機填料1 8具有CTE於相同溫度範圍係低於聚合物基體材料之C]：E，特別於該溫度範圍係低於600-800X1 (Γ7/ °C。另一非限制性具體實施例中，無機填料18於〇°C至200°C之溫度範圍具有CTE低於100 X 1〇_7/ °C。又另一非限制性具體實施例中，無機填料18於0°C至 26 本紙張尺度適用中國國家標準（CNS〉A4規格（2丨〇><297公釐） (請先閲讀背面之注意事項再填寫本頁)Synthesis and Processing of Chemical Deletion, ⑽7 Years) 654 Records and __Constitution and Processing '(1997) 654 Examination, and Full Lightness of Boride Materials, ⑽7 Years) 653 «ffflfif' CRC Press (ι_year (Nth edition) pp. 12-63, and is described here for reference. 46 ^ f and Li Fitu, CRC Press (71st Edition, 1990), pp. 12-63, and are described here for reference. • eimer (edition) 'Synthesis and Logic of Blanket, Nitride, and Boride Materials, no. 0707, p. R / 1, and described here for reference 1: " ―, w thousand） 654 In a non-limiting specific embodiment of the invention, the at least one inorganic filler 18 is from to v solid lubricants having a coefficient of thermal conductivity and a high electrical resistivity. A non-limiting example of a solid lubricant with an inorganic filler having a high thermal conductivity and a high electrical resistivity is hexahedron boron nitride. In another non-limiting embodiment of the present invention, the at least one inorganic filler 18 has a low thermal expansion coefficient. As used herein, the term "low thermal expansion coefficient" means that the material has a coefficient of thermal expansion (CTE) lower than that of the polymer matrix material 16. Although not necessary, the material with a low coefficient of thermal expansion has a CTE lower than that of the reinforcing material 20. In a non-limiting specific embodiment of the present invention, the inorganic filler 18 has a negative CTE, that is, the inorganic filler 18 shrinks when heated. By way of example and not limitation, in a specific embodiment, the polymer matrix material 16 is an epoxy resin material having a CTE in the range of 600-800 X 10.7 wide C at a temperature of 0 ° C to 200 ° C; inorganic filler 1 8 has CTE in the same temperature range which is lower than C of the polymer matrix material]: E, especially the temperature range is lower than 600-800X1 (Γ7 / ° C. In another non-limiting specific embodiment, the inorganic filler 18 In the temperature range of 0 ° C to 200 ° C, the CTE is less than 100 X 10-7 / ° C. In yet another non-limiting specific embodiment, the inorganic filler 18 is at 0 ° C to 26. This paper scale is applicable to China National Standard (CNS> A4 Specification (2 丨〇> 297 mm) (Please read the precautions on the back before filling this page)

552831 Β 五、發明説明（24) 200°C之溫度範圍具有CTE低於50 X 1(Γ7厂C。雖然不欲受任何特定理論所限，相信摻混低熱膨脹性填料於預浸物層14 可減少由該預浸物層製造的電子支撐件10之ζ軸熱膨脹係數。用於此處「ζ軸熱膨脹係數」一詞表示電子支撐件於概略平行電子支撐件厚度方向以及概略垂直電子支撐件主面之熱膨脹係數。用於此處「主面」一詞表示概略垂直於電子支撐件厚度以及概略平行於加強材料主要維度（亦即X- y 維度）之電子支撐件表面。降低電子支撐件之ζ軸熱膨脹係數將經由減少聚合物基體材料與其製成的孔隙壁上鍍層間的不匹配而改良由該層製成的印刷電路板之可信度。降低聚合物基體材料與鍍層間之熱膨脹的不匹配可減少印刷電路板孔壁鍍層之裂痕發生率，偶爾稱作筒形裂痕。可用於本發明之低熱膨脹性材料之非限制性實例包含下表D所列。 (請先閲讀背面之注意事項再填寫本頁)552831 Β 5. Description of the invention (24) The temperature range of 200 ° C has a CTE lower than 50 X 1 (Γ7 Factory C. Although it is not intended to be limited by any specific theory, it is believed that the low thermal expansion filler is mixed in the prepreg layer 14 The ζ-axis thermal expansion coefficient of the electronic support 10 manufactured from the prepreg layer can be reduced. The term "ζ-axis thermal expansion coefficient" used herein means that the electronic support is approximately parallel to the thickness direction of the electronic support and approximately vertical electronic support Coefficient of thermal expansion of the main surface. The term "main surface" used herein means the surface of an electronic support that is roughly perpendicular to the thickness of the electronic support and roughly parallel to the main dimension of the reinforcing material (ie, the X-y dimension). Lowering the electronic support The ζ-axis thermal expansion coefficient will improve the reliability of the printed circuit board made of this layer by reducing the mismatch between the polymer matrix material and the plating layer on the pore wall made of it. Reduce the thermal expansion between the polymer matrix material and the plating layer The mismatch can reduce the occurrence of cracks in the plating of the hole wall of the printed circuit board, and is occasionally referred to as a cylindrical crack. A non-limiting example of a low thermal expansion material that can be used in the present invention Listed under D with table. (Please read the notes and then fill in the back of this page)

*1T 經濟部中央標準局員工消費合作社印製表D 無機塡料熱膨脹係數(CTE) (X 10_7/°C) 氧化鋁 54 於 25°C47 氧化鎂 104 於 25°C48 二氧化鈦 75 於 25°C49 氮化矽 8 於 25。。50 英佛（Invar)51 2 於 25。。52 鉬 48 於 25〇C53 硼 48 於 25〇C54 氮化硼 0.77-7.5 於 20 度 K-1000 度 K (-253。。至727°C)55 碳化矽 .26於0°C-200°C56 鋰輝石 9 於 20。。-1000。(：57 石英 -3 於 25°C58 -優可泰（eucryptite) -60 於 25°C59 -27- 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） 552831 A7 B7 經濟部中央標準局員工消費合作社印製五、發明説明（ 47 R. Tummala (编輯）’微電子包裝手册，（1989年）637頁，併述於此以供表者 48 Tummala，637 頁。〜亏。 49同上。 5Q同上。 51英佛爲一種鐵-鎳合金。 52同上。 53同上。 54同上。 55 Hlavac，J·，玻璃及陶瓷技術：引言，（1983年）232頁，併述於此以供表者。 56同上278頁，併述於此以供參考。、^ 57 Hlavac，232 頁。 58 Tummala，637 頁。 59 Hlavac，’232 頁。其它適當具有低CTE之無機填料1 8包括但非限於鈦酸銘及氮化銘。本發明之另一非限制性具體實施例中，該至少一種無機填料1 8爲可抑制導電性陽極長絲（CAf)於PCB内部形成的材料’如此又減少PCB因長絲造成的短路。導電性陽極長絲爲金屬離子最常見銅離子因電化學遷移而於電路板内部形成的導電性長絲。通常此等長絲係沿著用以形成PCB之破璃纖維加強物與聚合物基體材料（典型爲環氧樹脂）間的交界面形成。相信當玻璃纖維加強物與環氧樹脂間的交界面以某種方式例如離層或水解而受損時以及PCB接受高濕及高偏壓條件時形成CAF。當存在有此等條件時，介於具有相反電荷的結構特徵間建立電化_學腐蝕電池。例如但非限制性，CAF出現於帶相反電荷之線、孔以及線與孔間。通常相信CAF係出現於水滲透於玻璃加強物與環氧樹脂之交界面而介於帶正電荷結構特徵（亦即陽極）與帶負電荷結構 28 - 本紙張尺度適用中國國家樣準（CNS )从胁（21〇><297公瘦） (請先閲讀背面之注意事項再填寫本頁) 訂 552831 A7* 1T Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economics D Coefficient of Thermal Expansion (CTE) of Inorganic Materials (X 10_7 / ° C) Alumina 54 at 25 ° C47 Magnesium Oxide 104 at 25 ° C48 Titanium Dioxide 75 at 25 ° C49 Nitrogen Silicone 8 at 25. . 50 Invar 51 2 to 25. . 52 molybdenum 48 at 25 ° C 53 boron 48 at 25 ° C 54 boron nitride 0.77-7.5 at 20 degrees K-1000 degrees K (-253 ... to 727 ° C) 55 silicon carbide. 26 at 0 ° C-200 ° C 56 Spodumene 9 to 20. . -1000. (： 57 Quartz-3 at 25 ° C58-eucryptite -60 at 25 ° C59 -27- This paper size applies to Chinese National Standard (CNS) Α4 size (210 × 297 mm) 552831 A7 B7 Central Standard of the Ministry of Economic Affairs Printed by the Bureau ’s Consumer Cooperatives V. Invention Description (47 R. Tummala (eds.) 'Microelectronic Packaging Handbook, (1989) page 637, and described here for the table 48 Tummala, page 637. ~ Loss. 49 Ibid. 5Q Ibid. 51 Yingfo is an iron-nickel alloy. 52 Ibid. 53 Ibid. 54 Ibid. 55 Hlavac, J., Introduction to Glass and Ceramic Technology, (1983) p. 232, and described here for table 56 Ibid., Page 278, and described here for reference. ^ 57 Hlavac, page 232. 58 Tummala, page 637. 59 Hlavac, '232. Other suitable inorganic fillers with low CTE 18 include, but are not limited to Titanate and nitride. In another non-limiting embodiment of the present invention, the at least one inorganic filler 18 is a material that can inhibit the formation of conductive anode filaments (CAf) inside the PCB. Shorts caused by filaments. Conductive anode filaments The most common metal ions are copper ions, which are conductive filaments formed inside the circuit board due to electrochemical migration. Usually these filaments are along glass broken fiber reinforcement and polymer matrix material (typically epoxy resin) used to form PCBs. Resin) is formed. It is believed that CAF is formed when the interface between glass fiber reinforcement and epoxy resin is damaged in some way, such as delamination or hydrolysis, and when the PCB is subjected to high humidity and high bias conditions. When When these conditions exist, an electrochemical corrosion cell is established between structural features with opposite charges. For example, but not by way of limitation, CAF appears in lines, holes, and between lines with opposite charges. CAF is generally believed to occur Water penetrates the interface between the glass reinforcement and the epoxy resin between the positively-charged structural features (that is, the anode) and the negatively-charged structure 28-This paper is applicable to the Chinese National Standard (CNS) Congxie (21〇 > < 297 male thin) (Please read the precautions on the back before filling in this page) Order 552831 A7

丁Ding

經濟部中央標準局員工消費合作社印製 552831 --------___ 五、發明説明（27) " " 形成造成電短路。本發月之非限制性具體實施例中，對金屬離子具高度親和力的之然機填料18爲具有陽離子交換能力至少亳當量 /100克乾填料（meq/100 g)的黏土礦石。用於此處「陽離子 =換把力」或「CEC」一詞表示材料中由於層結構的離子等形取代導致層電荷缺陷，爲了平衡該層電荷缺陷所需的包括吸附以及層間可交換陽離子量。參考D· HiUei，土壤（ 1980年）7"4 頁；以及 J· Mitchel卜土立襄行爲I石疋(1976年）32頁，特別併述於此以供參考。cec偶爾稱作總交換能力、基本交換能力或陽離子交換能力可藉業界人士眾所周知的技術測量，由本揭示内容無需對此作進一步解説。若須更多資訊可參,Rich，CEC：測定之過量鹽之去除，i：__ϋ¾_，93期（ 1962年）87- 94 頁；Rich，CEC測疋之Ca+2測足’ 學，92期（1961年）226-23 1頁；以及 p.//bluehen.ags.udel. edu/ deces/prod- agric/ chap9 - 95. htm (2001年1月31曰），特別併述於此以供參考。具有陽離子交換能力至少2〇毫當量/1〇〇克之黏土礦石例如包括但非限於蒙脱土、矽鐵石、包土、伊菜石（水合雲母）、蛭石、亞氣酸鹽、海泡石、美國活性白土、膨潤土、水輝石、合成含氟雲母（如後述）及前述任一者之混合物。參考HiiIel 44-45頁，特別併述於泚以供參考。本發明之另一非限制性具體實施例中，對金屬離子具高度親和力的填料18具有陽離子交換能力至少8〇毫當量/丨〇〇克。具有CEC至少80毫當量/1 〇〇克之黏土礦石例如包括但非 -30- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) :裝· -訂限於蒙脱土、矽鐵石、良土、蛭石、膨潤土、水輝石、水合吴母合成含氟雲母（討論如後）及前述任一者之藏入物。 ° 本發明之另一非限制性具體實施例中，對金屬離子特別對銅離子具高度親和力之無機填料18爲可膨脹的黏土礦石。用於此處Γ可膨脹黏土」一詞包括可溶脹黏土。通常可膨脹黏土材料由於具有高表面積及可交換的層間陽離= 故可提供至少80毫當量/1〇〇克之陽離子交換能力。本發明有用之可膨脹黏土材料之非限制性實例包括蒙脱土、蛭包土、水合雲母、膨潤土、水輝石、可膨脹合成含氟衣母及七述任一者之混合物。概略而言但非必要，可膨脹黏土材料具有陰性層電荷（X)於〇·1至0.9之範圍，該層電荷係藉由存在有可交換之層間陽離子平 ς了 ^之礦:例如高嶺土及滑石不含層間陽離子；Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 552831 --------___ V. Description of Invention (27) " " The formation of electrical short circuit. In a non-limiting specific embodiment of the present month, the organic filler 18 having high affinity for metal ions is a clay ore having a cation exchange capacity of at least 亳 equivalents per 100 g of dry filler (meq / 100 g). As used herein, the term "cation = change handle force" or "CEC" means that the layer charge defect in the material is caused by the ionic isomorphic substitution of the layer structure. In order to balance the charge defect of the layer, it includes adsorption and the amount of exchangeable cations between layers . References D. HiUei, Soil (1980), 7 "4; and J. Mitchel, Buddhism, Ishigaki, I. (1976), 32, specifically incorporated herein by reference. cec is sometimes referred to as total exchange capacity, basic exchange capacity, or cation exchange capacity, which can be measured by techniques well known to those in the industry and need not be further explained by this disclosure. For more information, please refer to, Rich, CEC: Determination of excess salt removal, i: __ϋ¾_, 93 (1962) pages 87-94; Rich, CEC test Ca + 2 foot test 'Science, 92 (1961) 226-23 1 pages; and p.//bluehen.ags.udel. Edu / deces / prod-agric / chap9-95. htm (January 31, 2001), specifically and described here for reference reference. Clay ores with cation exchange capacity of at least 20 milliequivalents / 100 grams include, but are not limited to, montmorillonite, chert , American activated clay, bentonite, hectorite, synthetic fluorine-containing mica (as described later), and a mixture of any of the foregoing. Reference is made to HiiIel, pages 44-45, and is specifically described in the following for reference. In another non-limiting embodiment of the present invention, the filler 18 having a high affinity for metal ions has a cation exchange capacity of at least 80 meq / 1000 g. Clay ore with a CEC of at least 80 milliequivalents / 1000 grams, for example including but not -30- This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page) : Packing · -Order is limited to montmorillonite, chertite, fine soil, vermiculite, bentonite, hectorite, hydrated fumarite synthetic fluorine-containing mica (discussed later) and any one of the aforementioned deposits. ° In another non-limiting embodiment of the present invention, the inorganic filler 18 having a high affinity for metal ions, especially copper ions, is an expandable clay ore. The term "swellable clay used herein" includes swellable clay. Generally, expandable clay materials can provide a cation exchange capacity of at least 80 milliequivalents / 100 grams due to the high surface area and the exchangeable interlayer ionization. Non-limiting examples of expandable clay materials useful in the present invention include montmorillonite, mullite, hydrated mica, bentonite, hectorite, expandable synthetic fluorine-containing coatings, and mixtures of any of the foregoing. Generally speaking, but not necessary, the expandable clay material has a negative layer charge (X) in the range of 0.1 to 0.9, and the layer charge is flattened by the existence of exchangeable interlayer cations such as kaolin and Talc does not contain interlayer cations;

一化學式單元之電荷大於0· 9之礦石如雲母則僅含非可交之層間陽離子，且通常於其非耐候形式無法膨脹。參考JAn ore with a chemical unit with a charge greater than 0.9, such as mica, contains only non-intersecting interlayer cations, and usually cannot swell in its non-weather-resistant form. Reference J

DlX〇n等人（編輯），（ 1977年）200、221-232 頁；以及Μ頁，特別併述於此以供參考。本發明足另一非限制性實施例中，對金屬離子特別對鋼離子具高度親和力之可膨脹黏土材料係選自氟鉀石 (〇ph丨0g〇pites)其至少邵份_雀子係由麵陽離子作等形置換（或取代）；以及W石至少部份卸離子由㈣子作等开:置換。鈉氣鉀石爲合成含氟雲母，纟中至少部份層間鉀離子係有鈉陽離子作等形置換。鈉說钾石爲可膨脹，而典 552831 五、發明説明（29) 型之非对候雲母則不可膨脹（參考前文討論）。參考Kirk_ 第 U 期（第 2 版，1967 年）412T^ 頁’特別併述於此以供參考。 ^ U <又另-非限制性具體實施例中，無機填料1 $帶 I前文討論·^任-種無機填料其已經經過表面處理且以對金屬f子具高度親和力的材料塗覆。例如雖然非僅限於此氮化删I子使用有機金屬㉟子錯合劑處理而形成對金屬離子具高度親和力表面之無機填料。適當有機金屬離子錯：劑,非限制性實例包括峨嘻紫質類及胺類例如伸乙基胺—伸乙基四胺、伸乙基二胺-四乙酸（EDTA)、聚乙烯基峨呢及2-胺基錢。用於此處「峨哈紫質類」一詞表示源自活體物質的錯合物，其基本結構式係'由4個互連環组，，各環含4個碳原子及i個氮原子”比哈紫質之非限制性貫例包含紅色血紅素及綠色葉綠素。參考Hunt，石油地 j化子及，( 1979年）551頁；以及G. Hawley，哈利 @月化子辭袭1，( 1981年第10版）843頁，特別併述於此以供參考。另-非限制性具體實施例中，無機填料粒子如氮化棚及氮化銘可塗覆以具有陽離子交換能力至少2〇毫當量經濟部中央標準局員工消費合作社印製 /100克〈奈米黏土粒子而形成對金屬離子具高度親和力表面之填料粒子。除前文討論之黏土材料外，其_它對金屬離子特別對銅離子具有南度覜和力的石夕酸鹽材料也可用作爲填料18。例如但非限制本發明’多孔碎酸鹽及特別有機官能基多切酸鹽可用作爲填料。本發明之非限制性具體實施例中，對金 32- 本紙張尺度適财關家標隼（CNS ) A4胁（210X297公釐） 552831 A7 ----—--— _B7 五、發明説明（30) ----- 高度親和力之多孔石夕酸鹽具有咖至少爲20毫當另非限制性具體實施例中，對金屬離子具高又’、和力之夕孔珍酸鹽具有CEC至少毫當量/⑽克。本發明之另-非限制性具體實施例中，對金屬離子具高度：=力之填料1 8之特徵爲可由水溶液去除以及攝取陽離子、把力加以特徵化。此種能力係以分配係數^定量，定義爲每克固體吸附之陽離子量對每毫升溶液剩餘陽離子量之比且以笔升/克表不。預期可由水溶液去除金屬離子特別去除銅離子之材料當摻混於此處所述基體時也將減少 CAF分配係數Kd可根據K〇marneni等人，材料研究室賓州大子a園市囔州州互大學開發的方法測量。有關的進一步貝訊參考 Sridhar、Komarneni、Naofumi Kozai 及 Rustum R〇y「非離子性黏土新穎陰離子性黏土功能：藉⑴以⑽“選擇性攝取過度金屬陽離子」，材料化學期刊,8(6)(1998 年），1329- 133 1 頁；Sridhar Komarneni，William J. Paulus 經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 及Rustum Roy，「新穎溶脹雲母.··合成、特徵化及陽離子父換」，复子叉換之新穎發展：材料、基礎及應用，離子 H臭國際會議議事錄，東京（1991年）51-56頁；Masamichi Tsuji及Sridhar Komarneni，Γ分配係數對選擇性無機離子交換劑之分析評估之延伸方法」，分離科學與技術， 27(6)( 1992年）’ 813-821頁；以及Masamichi Tsuji及 SridharDlXon et al. (Eds.), (1977) pages 200, 221-232; and pages M, which are specifically incorporated herein by reference. In another non-limiting embodiment of the present invention, the expandable clay material having a high affinity for metal ions, especially for steel ions, is selected from the group consisting of fluorite (〇ph 丨 0g〇pites), and at least Shao Fen_qiz The surface cations are replaced isomorphically (or substituted); and at least a part of the unloaded ions of the W ions are replaced by the isolator: substitution. Sodium apatite is a synthetic fluorine-containing mica, and at least part of the interlayer potassium ions in the plutonium are replaced by sodium cations. Sodium says that potash is swellable, while Code 552831 V. Inventive (29) type non-isotropic mica is not swellable (refer to the discussion above). Refer to page 412T ^ of Kirk_ Issue U (2nd edition, 1967) and specifically refer to it for reference. ^ U < In another non-limiting embodiment, the inorganic filler 1 is provided in the foregoing discussion. ^ Any of the inorganic fillers have been surface-treated and coated with a material having a high affinity for metal f. For example, although this is not limited to the use of organometallic rhenium complexes to form inorganic fillers with a high affinity for metal ions. Appropriate organometallic ions: agents, non-limiting examples include ehohopsin and amines such as ethylamine-ethylenetetramine, ethylenediamine-tetraacetic acid (EDTA), polyvinyl euna And 2-amino money. As used herein, the term "erhalite" refers to a complex derived from living matter, the basic structural formula of which is composed of 4 interconnected rings, each ring containing 4 carbon atoms and i nitrogen atoms " Non-limiting examples of biha porphyrin include red heme and green chlorophyll. Refer to Hunt, Petrochemical and (1979), p. 551; and G. Hawley, Harry @ 月化子辞袭 1, (10th edition of 1981) page 843, which is specifically incorporated herein by reference. In addition-non-limiting specific examples, inorganic filler particles such as nitrided tents and nitrides can be coated to have a cation exchange capacity of at least 2 〇Milli-equivalent printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs / 100 grams of <nano clay particles to form filler particles with a high affinity surface for metal ions. In addition to the clay materials discussed above, it is particularly effective for metal ions Copper sulfonate materials with a southerly power can also be used as the filler 18. For example, but not limited to the invention, the 'porous crushed acid salt' and the special organic functional polycutate can be used as the filler. Non-limiting of the invention In a specific embodiment, the gold 32- The paper size is suitable for household use (CNS) A4 (210X297 mm) 552831 A7 ------------ _B7 V. Description of the invention (30) ----- High affinity porous oxalate salt has coffee At least 20 milligrams. In another non-limiting specific embodiment, the pore salt is high in metal ions, and has a CEC of at least milliequivalents per gram. The present invention is also a non-limiting specific embodiment. In the case of metal ions with a height of: = force, the filler 18 is characterized by being able to be removed by an aqueous solution and taking up cations to characterize the force. This ability is quantified by the distribution coefficient ^ and is defined as the amount of cations adsorbed per gram of solids. The ratio of the amount of remaining cations per milliliter of solution is expressed in pen liters / gram. It is expected that materials that can remove metal ions, especially copper ions, from aqueous solutions will also reduce the CAF partition coefficient Kd when mixed with the matrix described herein. Marneni et al. Materials Research Laboratory Measured by a method developed by Luzhou Interchange University, Dazi Ayuan, Pennsylvania. For further details, please refer to Sridhar, Komarneni, Naofumi Kozai, and Rustum Roy, "Nonionic Clay Novel Anions" Functional clay function: "Selective uptake of excessive metal cations", Journal of Materials Chemistry, 8 (6) (1998), 1329-133 1 pages; Sridhar Komarneni, William J. Paulus Staff Consumption, Central Standards Bureau, Ministry of Economic Affairs Printed by the cooperative (please read the notes on the back before filling out this page) and Rustum Roy, "New Swelling Mica ... Synthesis, Characterization and Cationic Parent Exchange", Novel Development of Compound Fork Exchange: Materials, Basics and Applications , Proceedings of the International Conference on Ion H, Tokyo (1991), pp. 51-56; Masamichi Tsuji and Sridhar Komarneni, Extending Method for the Analysis and Evaluation of Selective Inorganic Ion Exchangers by the Partition Coefficient ", Separation Science and Technology, 27 ( 6) (1992) '813-821; and Masamichi Tsuji and Sridhar

Komarneni「二價過渡金屬離子於帶有隧道結構之隱黑素 (cryptomelane)型錳酸之選擇交換」，材料研究期刊，8( 3) (1993年）611-616頁。 -33- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X：297公釐）經濟部中央標準局員工消費合作社印製 552831 A7 ___________B7_ 五、發明説明（31 ) " ^ — 爲了使用Komarneni開發之方法測定]^，含有〇〇〇〇1N m4 <〇·5Ν氣化鈉水溶液於室溫製備，此處m+爲所研究的陽離子。溶液樣本封於玻璃瓶内24小時然後使用業界眾所周知的技術例如直流電漿方法分析測定溶液中Μ+確切量，以每百萬份之份數（ppm)表示。此項分析提供試驗期間去除多少 M+的參考點。20毫克受試材料樣本於密封玻璃瓶内與μ毫升溶液平衡24小時。平衡後，分離固相及溶離相，溶液經分析而決定M+的攝取且以Kd ( M+)報告。本發明之非限制性具體實施例中，其中陽離子爲以2、對金屬離子具高度親和力的填料爲黏土礦石或其它具Kd ( Cu2+) 至少600毫升/克的矽酸鹽。本發明之另一非限制性具體實施例中，對金屬離子具高度親和力之粒子爲具有(Cu2+) 至少1500毫升/克之黏土礦石或其它矽酸鹽。本發明之又另非限制性具體實施例中，對金屬離子具高度親和力之粒子爲具有Kd ( Cu2 )至少1 5, 〇〇〇毫升/克之黏土礦石或其它石夕酸鹽。本發明之另一非限制性具體實施例中，對金屬離子具高度親和力之粒子爲具有Kd(Cu2+)至少4〇,〇〇〇毫升/克之黏土礦石或其它硬酸鹽。具有可接受之Kd (Cu2+)値之黏土礦石及其它矽酸鹽之非限制性實例包括膨潤土、水輝石及多孔矽酸鹽及特別多孔有機官能基碎酸鹽。 _ 除了前文討論之材料可降低CAF外，相信其它螯合劑及聚合物可用作爲對金屬離子具高度親和力之填料也可用以降低CAF。雖然非限制本發明，但較佳螯合材料包含含氮離 -34- i紙張尺！^财關家轉（CNS )χ 29ϋ* (請先閲讀背面之注意事項再填寫本頁) :裝· 訂 552831 A7 B7 經濟部中央標準局員工消費合作社印製五、發明説明（32 子〈有機官能基，包括但非限於胺類及亞胺類。其它可用於此項目的之非限制性螯合劑或聚合物可有含硫、含氧、含磷有機官能基或此等螯合官能基的組合。可用於降低 CAF之其它螯合劑之非限制性實例包括席奎斯特 (SILQUEST) A1387珍燒，其爲碎燒基化聚氮雜酿胺 (polyazamide)，市面上得自康乃迪克州格林威治孔普騰 (Crompton)公司；及艾瑪利（Emery)咖爲一種部份醯胺化聚伸乙基亞胺；以及佛赛米（Versamid) 14〇，一種聚酿胺，二者皆得自俄亥俄州辛辛納提克可尼斯（c〇gnis)公司。再度參照圖1，摻混於預浸物層14之無機填料Μ之類別及數量部份係依據無機填料之預定功能決定。本發明之非限制性具體實施例中，無機塡料18之存在量足夠經由⑽形成大致連續或互連相30 (參考圖υ。雖然非限制本發明，但存在於聚合物基體材料16之無機填料18之容積分量可在於或咼於填料18之滲濾閾値（或限度）。用於此處「滲濾閾値」一凋表7JT形成大致互連之填料通路通過基體材料需要的填料足容積分量。參考X^mmala ( 1989年）576- 577頁，特別併述於此以供參考。另一非限制性具體實施例中，填料1 8可於電子支撐件存在爲大致上連續層（容後詳述）。雖言如此，業界人士了解聚合物基體材料16其包含填料 18之容積分量低於填料之滲濾閾—値者，可有效對由該聚合物基體材料製成的電子支撐件提供預定性質，例如但非限於導熱性、電阻性、CAF阻抗、潤滑性及CTE。此外，因添加大量無機填料至聚合物基體材料困難，故於本發明之非 -35- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (讀先閱讀背面之注意事項存填寫本覓) ,ιτ 經濟部中央標準局員工消費合作社印製 552831 A7 —~-B7 ____ _ 五、發明説明（33 ) 限制性具體實施例中，聚合物基體材料包含無機填料之量不大於填料之滲濾閾値。業界人士亦須了解對指定採用之供機填料之谷積分量（或百分比）而言，無機填料之實際重量百分比將依據微粒狀無機填料及聚合物基體材料密度決定。又/ 雖然非限制性，本發明之一具體實施例中，其中至少一種無機填料18爲無機固體潤滑劑，該至少一種無機填料18 <含量以總固體爲基準，係佔聚合物基體材料16與該至少一種無機填料18之合併總重之0.03%重量比至70%重量比之範圍。於另一非限制性具體實施例中，至少一種無機填料 18之含量以總固體爲基準，係佔聚合物基體材料16與該至 V 種播機填料1 8之合併總重之〇· 03%重量比至50%重量比之知圍。又另一非限制性具體實施例中，至少一種無機填料18之含量以總固體爲基準，係佔聚合物基體材料“與該至少一種無機填料18之合併總重之〇· 03%重量比至35%重量比之範圍。本發明之非限制性具體實施例中，其中該至少一種無機填料18具有熱傳導係數於300度K至少爲30 W/mK，至少，種無機填料1 8之含量以總固體爲基準，係佔聚合物基體材料16與該至少一種無機填料18之合併總重之〇· 3%重量比至 70%重量比之範圍。於另一非限性具體實施例中，至少一種無機填料1 8之含量以總固體爲基準，係佔聚合物基體材料16與該至少一種無機填料丨8之合併總重之丨〇%重量比至70%重量比之範圍。又另一非限制性具體實施例中，至 -36 - 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公羡） (請先閲讀背面之注意事項再填寫本頁)Komarneni, "Selective exchange of divalent transition metal ions in cryptomelane manganic acid with tunnel structure", Journal of Materials Research, 8 (3) (1993) pages 611-616. -33- This paper size applies Chinese National Standard (CNS) A4 (210X: 297 mm) Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs 552831 A7 ___________B7_ V. Description of Invention (31) " ^ — developed for use with Komarneni Measured by the method] ^, an aqueous solution containing 0.0001N m4 < 0.5N sodium vaporized solution was prepared at room temperature, where m + is the cation in question. The sample of the solution was sealed in a glass bottle for 24 hours, and then the exact amount of M + in the solution was determined and analyzed using well-known techniques in the industry, such as the DC plasma method, expressed in parts per million (ppm). This analysis provides a reference point for how much M + is removed during the test. A 20 mg sample of the test material was equilibrated with the μmL solution in a sealed glass bottle for 24 hours. After equilibration, the solid and dissolved phases were separated, and the solution was analyzed to determine the uptake of M + and reported as Kd (M +). In a non-limiting specific embodiment of the present invention, the cation is a clay ore with a filler having a high affinity for metal ions or other silicates having a Kd (Cu2 +) of at least 600 ml / g. In another non-limiting embodiment of the present invention, particles having a high affinity for metal ions are clay ore or other silicates having (Cu2 +) of at least 1500 ml / g. In another non-limiting specific embodiment of the present invention, the particles having a high affinity for metal ions are clay ore or other petrolates having Kd (Cu2) of at least 15,000 ml / g. In another non-limiting embodiment of the present invention, the particles having a high affinity for metal ions are clay ore or other hard acid salt having Kd (Cu2 +) of at least 40,000 ml / g. Non-limiting examples of clay ores and other silicates with acceptable Kd (Cu2 +) rhenium include bentonite, hectorite and porous silicates, and particularly porous organic functional salt. _ In addition to the materials discussed above that can reduce CAF, it is believed that other chelating agents and polymers can be used as fillers with a high affinity for metal ions to reduce CAF. Although not limiting the invention, preferred chelating materials include nitrogen-34-i paper rulers! ^ Cai Guan Guan Zhuan (CNS) χ 29ϋ * (Please read the notes on the back before filling out this page): Binding and ordering 552831 A7 B7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Functional groups, including but not limited to amines and imines. Other non-limiting chelating agents or polymers that can be used in this project can have sulfur, oxygen, phosphorus organic functional groups or these chelating functional groups. Combinations. Non-limiting examples of other chelating agents that can be used to reduce CAF include SILQUEST A1387, which is a burnt-based polyazamide, commercially available from Connecticut. Crompton, Greenwich; and Emery, a partially aminated polyethylenimine; and Versamid 14, a polyfermented amine, both From Cognis, Cincinnati, Ohio. Referring again to FIG. 1, the type and quantity of the inorganic filler M blended in the prepreg layer 14 are determined based on the predetermined function of the inorganic filler. In a non-limiting specific embodiment of the invention, the inorganic filler 18 It is present in an amount sufficient to form a substantially continuous or interconnected phase 30 through rhenium (refer to Figure υ. Although not limiting the present invention, the volume component of the inorganic filler 18 present in the polymer matrix material 16 may lie in or permeate the diafiltration of the filler 18 Threshold (or limit). It is used here as the "percolation threshold". Table 7JT forms a substantially interconnected filler passage through the filler material required to pass through the base material. Refer to X ^ mmala (1989) pages 576-577, especially It is also described here for reference. In another non-limiting embodiment, the filler 18 may exist in the electronic support as a substantially continuous layer (described later in detail). However, the industry knows the polymer matrix material 16 The volume component containing the filler 18 is lower than the percolation threshold of the filler—who can effectively provide predetermined properties to the electronic support made of the polymer matrix material, such as, but not limited to, thermal conductivity, electrical resistance, and CAF impedance , Lubricity and CTE. In addition, because it is difficult to add a large amount of inorganic filler to the polymer matrix material, the non-35- in this invention is applicable to the Chinese National Standard (CNS) A4 specification (210X297). Li) (Read the notes on the back and fill in this guide), ιτ printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 552831 A7 — ~ -B7 ____ _ 5. Description of the invention (33) In restrictive specific examples, aggregation The matrix material contains inorganic filler in an amount not greater than the percolation threshold of the filler. The industry should also understand that for the valley integral amount (or percentage) of the specified organic filler, the actual weight percentage of the inorganic filler will be based on the particulate inorganic The density of the filler and the polymer matrix material is determined. Also, although non-limiting, in a specific embodiment of the present invention, at least one inorganic filler 18 is an inorganic solid lubricant, and the content of the at least one inorganic filler 18 is based on the total solids. The basis is a range of 0.03% to 70% by weight of the combined total weight of the polymer matrix material 16 and the at least one inorganic filler 18. In another non-limiting specific embodiment, the content of the at least one inorganic filler 18 is based on the total solids, and accounts for 0.03% of the combined total weight of the polymer matrix material 16 and the seeder fillers 1 to 8 The weight ratio is from 50% to 50%. In still another non-limiting specific embodiment, the content of the at least one inorganic filler 18 is based on the total solids, and accounts for 0.03% by weight of the combined total weight of the polymer matrix material and the at least one inorganic filler 18 to 35% by weight. In a non-limiting specific embodiment of the present invention, the at least one inorganic filler 18 has a thermal conductivity coefficient of 300 degrees K and at least 30 W / mK. Based on solids, it ranges from 0.3% to 70% by weight of the combined total weight of the polymer matrix material 16 and the at least one inorganic filler 18. In another non-limiting embodiment, at least one The content of the inorganic filler 18 is based on the total solids, and ranges from 0% by weight to 70% by weight of the combined total weight of the polymer matrix material 16 and the at least one inorganic filler. 8 is another non-limiting In specific embodiments, up to -36-This paper size applies to Chinese National Standard (CNS) A4 specifications (210X297 public envy) (Please read the precautions on the back before filling this page)

^>52831 五、發明説明（34 無機填料18之含量以總固體爲基準，係佔聚合物基 -材料16與該至少-種無機填料18之合併總重之罵重量比至70%重量比之範圍。，明之非限制性具體實施例中，纟中該至少一種無機填料18具有低熱膨脹係數，該至少一種無機填料“之用量以乾重爲基準係佔聚合物基體材料16與該至少一料18之合併總重之5%重量比至8〇%重量比之範圍。另一非限制性具體實施例中，至少一種無機填料18之用量以乾重爲基準係佔聚合物基體材料16與該至少一種無機填料狀合併總重之20%重量比至75%重量比之範圍。又另一非限制性具體實施例中，至少一種無機填料18之用量以乾重爲基準係佔聚合物基體材料16與該至少一種無機填料^之合二總重之25%重量比至60%重量比之範圍。本發明之非限制性具體實施例中，其中該至少一種益機填料18對金屬離子具高度親和力，該至少_種無機填料18 .之用I以總固體爲基準係佔聚合物基體材料丨6與該至少一種無機填料18之合併總重之0·03%重量比至8〇%重量比之範圍。另一非限制性具體實施例中，至少一種無機填料“之用量以總固體爲基準係佔聚合物基體材料16與該至少一種無機填料18之合併總重之10q/c)重量比至8〇%重量比之範圍。又另一非限制性具體實施例中，一至少一種無機填料以之用量以總固體爲基準係佔聚合物基體材料16與該至少一種無機填料18之合併總重之35%重量比至80%重量比之範圍。再度參照圖1，討論如前，加強材料2〇例如可以織造及非 -37 本紙張尺度適用中國國家標準（CNS ) Α4規格（21〇Χ297公釐） (請先閲讀背面之注意. ^本頁)^ &528; 52831 V. Description of the invention (34 The content of the inorganic filler 18 is based on the total solids, which accounts for the combined total weight of the polymer base-material 16 and the at least one inorganic filler 18 to 70% by weight. In the non-limiting specific embodiment of the invention, the at least one inorganic filler 18 has a low thermal expansion coefficient, and the amount of the at least one inorganic filler is based on the dry weight of the polymer matrix material 16 and the at least one. The combined total weight of the material 18 ranges from 5% by weight to 80% by weight. In another non-limiting embodiment, the amount of the at least one inorganic filler 18 is based on the dry weight of the polymer matrix material 16 and A range of 20% to 75% by weight of the combined weight of the at least one inorganic filler. In another non-limiting embodiment, the amount of the at least one inorganic filler 18 is based on the dry weight of the polymer matrix. The total weight of the material 16 and the at least one inorganic filler ^ ranges from 25% by weight to 60% by weight. In a non-limiting specific embodiment of the present invention, the at least one beneficial organic filler 18 has a metal ion high Affinity, the at least one inorganic filler 18. The use of I based on the total solids accounts for the polymer matrix material 丨 6 and the at least one inorganic filler 18 combined total weight of 0.03% by weight to 80% by weight In another non-limiting embodiment, the amount of the at least one inorganic filler based on the total solids is 10q / c) weight ratio of the combined total weight of the polymer matrix material 16 and the at least one inorganic filler 18 To 80% by weight. In yet another non-limiting specific embodiment, the amount of an at least one inorganic filler based on the total solids accounts for 35% to 80% of the combined total weight of the polymer matrix material 16 and the at least one inorganic filler 18 Range of weight ratio. Referring again to Figure 1, the discussion is as before. The reinforcing material 20 can be woven and non-37. The paper size applies the Chinese National Standard (CNS) A4 specification (21〇 × 297 mm). (Please read the note on the back first. ^ This page )

*1T 經濟部中央標準局員工消費合作社印裝經濟部中央標準局員工消費合作社印製 552831 五、發明説明（35) 織織物、蓆、針織物及多層織物形式存在，·二然非限制性，但本發明之具體實施例中，加前:雖織物。另一非限制性且I# t ^ 料20爲梭璃纖維之梭織物，如圖1所示。馬匕δ破本發明有用的玻璃纖維包括但非限於由可纖維化玻否物製成的纖維例如「Ε·玻璃」、「Α·姑 " 一狹哨」、璃」、「D-玻璃」、「R_玻璃」、「s_破璃」及& 璃^衍生物。用於此處，「可纖維化」一詞表示材料可米成馬概略連續纖維、股線或紗。用於此處，「股線」一 ^ 表示多根個別纖維；「纖維」一詞表示個別^絲；「紗」一詞表示加捻股線。用於此處「Ε_玻璃」衍生物表示包括小量氟及/或硼且較佳不含氟及/或不含硼之玻璃組合物此外，用於此處，「小量氟」表示低於〇 · 5 〇/。重量比氟，較佳低於0.1%重量比氟，以及「小量硼」表示低於5% 重量比硼，較佳低於2%重量比硼。本發明之非限制性具體實施例中’破璃纖維係由Ε-玻璃或^玻璃衍生物組成。此等由玻璃纖維製成的組合物及玻璃長絲之製法爲業界人士眾所周知相信就本揭示内容而言無需進一步討論。若須額外資訊，玻璃組合物及纖維化方法揭示於Κ· Loewenstein，璃纖維連、1製造技術(1993年第3版）30-44、47- 60、115-122及 126- 135 頁；及美國專利 4, 5_42, 106及 5,789, 329，特別併述於此以供參考。雖然於本發明非限制性，當加強材料2〇包含至少一種玻璃纖維以及於非限制性具體實施例爲製造玻璃纖維織物 -38- 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） (請先閲讀背面之注意事項再填寫本頁) -訂 552831 、發明説明（36 :寺，加強材料20可由業界人+已知之任— & 成包括但非限於可纖維化非玻璃無機材料：可地化材：機材料及JL、、日人仏料、可纖維化有然材料業=及組合。無機及有機材料可爲人造或天合物料。可纖維化無機及有機材料也可爲聚於由⑸=：!本發明之非玻璃無機纖維例如包括但非限材料製成的η石墨' 5鋁紅枉石、氧化鋁、壓電陶瓷性-例J 纖維。適當動植物衍生天然纖維之非限制瓊：及棉、纖維素'天然橡·、亞麻、宇麻、***、尼呻乃一。適當聚合物纖維包括但非限於由聚醯胺類(如 :万醯胺類）、熱塑性聚酯類(如聚伸乙基對苯二甲酸 :，伸τ基對苯二甲酸自旨）、丙晞I系（如聚丙晞猜類）、 =讀、聚胺基甲酸s旨類及乙締系聚合物（如聚乙缔醇）士成的聚合物纖維。相信可用於本發明之非玻璃纖維之細即讨論於科，第6期（ 1967年）505_712頁，特 Z述於此以供參考。彡貝了解前述任-種材料之摻合物或氷物以及由前述任一種材料形成的纖維組合若有所需也可用於本發明。經濟部中央榡準局員工消費合作衽印裝 (請先閲讀背面之注意事項再填寫本頁) 如則文纣論，雖然多種玻璃組合物可用於形成本發明之加強物，但於本發明之非限制性具體實施例中，玻璃加強物包含至少一種破璃纖維具有鐵含量佔玻璃組合物總重不 \ 11 重1比。另一非限制性i體實施例中，玻璃加強物包含至少一種玻璃纖維具有鐵含量佔玻璃組合物總重不大於5%重量比。具有鐵含量大於11 °/〇重量比之玻璃纖維例如但非限於玄武岩纖維其典型具有Fe〇含量爲丨1%重量比及 •39- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）經濟部中央標準局員工消費合作社印製 552831 五、發明説明（* 1T Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Printed by 552831 V. Invention Description (35) Weaving fabrics, mats, knitted fabrics, and multilayer fabrics exist. However, in a specific embodiment of the present invention, before the addition: although the fabric. Another non-limiting and I # t ^ material 20 is a woven fabric of woven glass fiber, as shown in FIG. 1. The glass fibers useful in the present invention include, but are not limited to, fibers made of fibrillable glass such as "E. Glass", "A. Gu", "glass", "D-glass" "," R_ 玻璃 "," s_ 破璃 "and & Li ^ derivatives. As used herein, the term "fibrillable" means that the material can be made into rough continuous fibers, strands, or yarn. As used herein, the term "strand" means multiple individual fibers; the term "fiber" means individual filaments; and the term "yarn" means twisted strands. As used herein, "E_glass" derivative means a glass composition including a small amount of fluorine and / or boron and preferably containing no fluorine and / or boron. In addition, as used herein, "small amount of fluorine" means low At 0.50 /. Weight ratio fluorine, preferably less than 0.1% weight ratio fluorine, and "small amount of boron" means less than 5% weight ratio boron, preferably less than 2% weight ratio boron. In a non-limiting specific embodiment of the present invention, the glass-breaking fiber is composed of E-glass or glass derivative. It is well known to those skilled in the art that such compositions made of glass fibers and glass filaments are believed to require no further discussion for the purposes of this disclosure. If additional information is required, glass compositions and methods of fiberization are disclosed in K. Loewenstein, Glass Fiber Co., 1 Manufacturing Technology (3rd Edition 1993) pages 30-44, 47-60, 115-122, and 126-135; and U.S. patents 4, 5-42, 106 and 5,789, 329 are specifically incorporated herein by reference. Although it is non-limiting in the present invention, when the reinforcing material 20 contains at least one glass fiber, and in a non-limiting specific embodiment, the manufacturing of glass fiber fabric -38- This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 × 297 mm) ) (Please read the precautions on the back before filling this page)-Order 552831, Invention Description (36: Temple, Reinforcement Materials 20 can be known by anyone in the industry + known- & into including but not limited to fiberizable non-glass inorganic materials : Geochemical materials: Mechanical materials and JL, Japanese materials, fiberable natural materials industry = and combinations. Inorganic and organic materials can be artificial or natural materials. Fibrizable inorganic and organic materials can also be Gathered from ⑸ = :! The non-glass inorganic fibers of the present invention include, for example, but not limited to, η graphite '5 alumina, vermiculite, alumina, piezoelectric ceramics-Example J fiber. Appropriate animal and plant-derived natural fibers Unrestricted Joan: and cotton, cellulose, natural rubber, linen, jute, hemp, nicotine. Suitable polymer fibers include, but are not limited to, polyamides (such as manganese), thermoplastic polyester class( Poly (ethylene terephthalic acid): Poly (ethylene terephthalic acid), Propylene I series (such as polypropylene), = Polyurethane s series, and Ethylene-based polymers ( Such as polyethylene glycol) polymer fibers. It is believed that the details of non-glass fibers that can be used in the present invention are discussed in Yuke, No. 6 (1967), pages 505_712, which are described herein for reference. Understand the blend or ice of any of the foregoing materials and the fiber combination formed of any of the foregoing materials can also be used in the present invention if necessary. Central Government Bureau of the Ministry of Economic Affairs, consumer cooperation, printing (please read the back first) (Please note that this page is to be completed on this page) As stated, although various glass compositions can be used to form the reinforcement of the present invention, in a non-limiting embodiment of the present invention, the glass reinforcement includes at least one glass-breaking fiber having The iron content accounts for a total weight of the glass composition of no more than 11 weights. In another non-limiting embodiment, the glass reinforcement includes at least one glass fiber having an iron content of not more than 5% by weight of the total weight of the glass composition. With iron content greater than 11 ° / 〇weight Glass fiber, such as but not limited to basalt fiber, typically has Fe0 content of 丨 1% by weight and • 39- This paper size applies to China National Standard (CNS) A4 (210X297 mm) Employees of the Central Standards Bureau of the Ministry of Economic Affairs Printed by Consumer Cooperatives 552831 V. Description of Invention (

Fe203 3 τ爲2%重I比(以玻璃組合物總重爲基準），由於顏色暗故不用於某些用途。用於此處「玄武岩纖維」一詞表示由火成岩製成的氧切含量低、色彩暗且較爲富含鐵及叙（纖維。參考F· Wallenberger等人（編輯），先進無機纖（2_年）335 頁，特別併述於此以供參考。如此於本發明之非限制性具體實施例中，織造纖維加強材料係由$ & _ # t A • '、甶至y —種不含玄武岩纖維之纖維製成。玄武岩組成物之特定非限制性實例可參考r v. Subramanian，「玄武岩纖維」，豐膠加強物手册，j Milewski 及 Η· Katz 編輯（1987 年）2:95 頁，述於此以供參考。本發明之另_非限制性實例中，織造纖維加強：大致上不含玄武岩纖維。用於此處，Γ大致上不含玄武岩纖維」一詞表示以織造纖維加強物總重爲基準織造纖維加強物包含不大於1%重量比玄武岩纖維，及更佳不含玄武岩纖維。本發明之另一非限制性具體實施例中，較佳織造纖維加強包含至少一種Ε-玻璃纖維（討論如前）。後又討論簡單説明適合用於本發明之玻璃纖維之形成方法’、僅供舉例説明根據本發明可使用一種可能的玻璃纖維形成方法但絕非侷限本發明。於典型玻璃纖維形成操作，溶融玻璃經由襯套或拉絲孔底壁一的多個孔口退火而形成多根纖維。幾乎在形成後即刻纖維塗覆以一種上漿組合物保護其表面不會磨蚀，且對纖維提供需要的製程特徵。用於此處「膠漿」或「上漿」等詞表示於纖維形成後施用於纖 -40- 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁)Fe203 3 τ is a 2% weight I ratio (based on the total weight of the glass composition), and is not used for some applications because of its dark color. The term "basalt fiber" is used here to indicate that igneous rocks are low in oxygen cut content, dark in color, and rich in iron and syrup (fibers. See F. Wallenberger et al. (Eds.), Advanced Inorganic Fibers (2_ (Year) page 335, which is specifically incorporated herein by reference. As such, in the non-limiting specific embodiment of the present invention, the woven fiber reinforced material is made from $ & _ # t A • ', 甶 to y — species not included Basalt fiber is made of fibers. Specific non-limiting examples of basalt compositions can be found in r v. Subramanian, "Basalt Fibers", Handbook of Rubber Reinforcements, edited by j Milewski and Η Katz (1987) at 2:95, It is hereby incorporated by reference. In another non-limiting example of the present invention, the woven fiber reinforcement is substantially free of basalt fibers. As used herein, the term Γ is substantially free of basalt fibers. The total weight is the reference woven fiber reinforcement comprising no more than 1% by weight basalt fiber, and more preferably without basalt fiber. In another non-limiting embodiment of the present invention, the preferred woven fiber reinforcement includes at least one Ε-Glass fiber (discussed as before). The following discussion briefly discusses the method of forming glass fibers suitable for use in the present invention, for illustration purposes only. One possible method of forming glass fibers may be used in accordance with the present invention, but it is by no means limited to the present invention. In a typical glass fiber forming operation, the molten glass is annealed through a plurality of openings on the bottom wall of the bushing or drawing hole to form a plurality of fibers. The fibers are coated with a sizing composition to protect the surface from being formed almost immediately after formation Abrasive, and provide the required process characteristics for the fiber. Used here "words such as" sizing "or" sizing "means that the fiber is applied to the fiber after the formation of the fiber -40-This paper size applies to Chinese National Standard (CNS) A4 specifications ( 210X297 mm) (Please read the notes on the back before filling this page)

、1T, 1T

552831 五、發明説明（38) 維之塗覆組合物。然後將纖維集束成爲股線且捲繞成爲捆包供進一步加工處理。此種處理玻璃纖維之方法爲業界人士眾所周知鑑於本發明相信無需額外揭示此等方法。但若需要纖維形成操作之進一步資訊可參考Loewenstp；n 115_ 2 3 5頁’特別併述於此以供參考。上漿組合物典型應用於玻璃纖維而用以形成織造玻璃纖維，揭示於L^wenstein 238-244頁，特別併述於此以供參考此外，當緯紗***經紗間時爲了保護經紗於編織操作上不會磨蝕，典型於經編或整經過程中施用漿紗組合物至上漿玻璃纖維。此種漿紗組合物典型包括聚乙烯醇等業界人士眾所周知的組分。雖然此等上漿及漿紗組合物通常可有效提供由其中製成的玻璃纖維股線及紗線的良好編織能力仁典型非與用以形成電子支撐件的聚合物基體材料相谷。如此業界之常見實務係於摻混於聚合物基體材料且由破璃纖維表面去除非樹脂相容組合物，去除方式係將形成的坡璃纖維織物接受升高溫度，例如織物於38(rc加熱 80小時及/或刮擦織物。此等類型之操作典型稱作熱清潔、去油或去脂，後文合稱爲「去脂」。隨後織物再度塗覆以光整上漿。光整膠漿典型包含矽烷偶合劑及水，且施用於 j物俾改良織物與其中摻混織物之聚合物基體材料間之相容性。但上漿去除處理可能對織蟲有害且成本高。因此於本發明之非限制性具體貫施例中，加強材料包含未去脂 <織造玻璃纖維加強材料其包含玻璃纖維塗覆有一種樹脂相容性上漿組合物。用於此處，「樹脂相容性」或「與^ (請先閲讀背面之注意事項再填寫本頁)552831 V. Description of the invention (38) The coating composition. The fibers are then bundled into strands and wound into bales for further processing. Such methods of treating glass fibers are well known to those skilled in the art in view of the present invention and it is believed that such methods need not be disclosed further. However, if further information on fiber formation operations is required, reference may be made to Loewenstp; n 115_ 2 3 5 5 ′ is specifically incorporated herein by reference. The sizing composition is typically applied to glass fibers to form woven glass fibers. It is disclosed on pages 238-244 of L ^ wenstein, and is specifically described here for reference. In addition, when weft yarns are inserted into the warp space to protect the warp yarns during the weaving operation. Non-abrasive, typically applying sizing composition to sizing glass fibers during warp knitting or warping. Such sizing compositions typically include components well known to those skilled in the art, such as polyvinyl alcohol. Although these sizing and sizing compositions are generally effective in providing good weaving capabilities of the glass fiber strands and yarns made from them, they are typically not compatible with the polymer matrix materials used to form the electronic support. Such a common practice in the industry is to remove the non-resin-compatible composition from the surface of the broken glass fiber by blending with the polymer matrix material. The removal method is to increase the temperature of the formed slope glass fiber fabric. For example, the fabric is heated at 38 (rc). 80 hours and / or scratching the fabric. These types of operations are typically referred to as hot cleaning, degreasing or degreasing, and are collectively referred to hereinafter as "degreasing." The fabric is then recoated with a smooth finish. Sizing The pulp typically contains a silane coupling agent and water, and is applied to the material to improve the compatibility between the fabric and the polymer matrix material in which the fabric is blended. However, the sizing removal treatment may be harmful to the weaver and costly. In a non-limiting specific embodiment of the invention, the reinforcing material comprises a non-defatted < woven glass fiber reinforced material which comprises glass fibers coated with a resin compatible sizing composition. As used herein, "Resin compatible Sex "or" and ^ (Please read the notes on the back before filling out this page)

•1T 經濟部中央標準局員工消費合作社印製 -41 - 經濟部中央標準局員工消費合作社印製 552831 A7 —--___51 五、發明説明（39) 合物基體材料相容性」等詞表示施用於玻璃纖維塗層組合物係與玻璃纖維摻混於其中的聚合物基體材料相容，故塗層組合物（或選定的塗覆層）可達成下列性質之至少一種：於摻混於基體材料之前無需去除（例如藉脱脂或脱油去除），有助於基體材料良好滲透結合該紗之蓆或織物的個別纖維素’以及於習知處理期間經由蓆或織物良好穿透基體材料，以及結果獲得具有預定物理性質及水解安定性之終產物。樹脂相容性上漿組合物可於形成後即刻或於稍後的一段時間例如於編織之後施用於玻璃纖維。用於此處「非去月日」材料或織物爲未冒進行習知處理而由材料或織物去除非樹脂相容性上漿成分。非限制本發明，樹脂相容性上漿組合物之一具體實施例 ^ 或夕個且幸乂佳爲多數粒子其當施用於纖維時將黏〜於纖維且與毗鄰破璃纖維間提供一或多個間隙空間。粒= 〈非限制性實例包括六面體氮化硼及空心苯乙烯聚合物粒子。糸• 1T Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs -41-Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 552831 A7 --- ___51 V. Description of the Invention (39) Compatibility of Compound Matrix Materials "and other words indicate application Since the glass fiber coating composition is compatible with the polymer matrix material into which the glass fiber is blended, the coating composition (or selected coating layer) can achieve at least one of the following properties: No previous removal required (such as by degreasing or degreasing), helps the matrix material to penetrate well into the individual cellulose that binds the yarn mat or fabric 'and penetrates the matrix material well through the mat or fabric during conventional processing, and results An end product having predetermined physical properties and hydrolytic stability is obtained. The resin-compatible sizing composition can be applied to the glass fibers immediately after formation or at a later time, such as after weaving. As used herein, "non-lunar" materials or fabrics are removed from the material or fabric without conventional processing unless the resin is compatible with sizing ingredients. Non-limiting of the present invention, one specific embodiment of the resin-compatible sizing composition ^ or Xia Xingjia is the majority of particles, which when applied to the fiber will stick to the fiber and provide one or more between the adjacent broken glass fiber Gap space. Particles = <non-limiting examples include hexahedral boron nitride and hollow styrene polymer particles. Ito

除粒子外，樹脂相容性上漿組合物及非限制性具體實W 例較佳包含一或多種成膜材料例如有機、無機及聚人2 料。成膜材料之非限制性實例，包括乙缔系聚合物例:作非限於聚乙晞基喻㈣酮類、聚g旨類、聚酿胺類 : 甲酸酯類及其組合。妝基替代前文討論之成膜材料，樹脂相容性上漿組合限制性具骨豆實施例包括一或多種玻璃纖維偶合劑，例如機石夕貌偶合劑、過渡金屬偶合劑、騰酸鹽偶合劑、 (请先閱讀背面之注意事項再填寫本頁} 裝訂 -42- 552831 A7 B7 經濟部中央標準局員工消費合作社印裝五、發明説明（4Q ) 劑、含胺基偉能（Werner)偶合劑及其混合物。樹脂相容性上漿組合物之非限制性具體實施例進一步包含一或多種軟化劑或界面活性劑。軟化劑之非限制性實例包括月Q肪之胺鹽、燒基咪。坐P林衍生物、酸增溶之脂肪酸酿胺、脂肪故與聚伸乙基亞胺之縮合物、以及胺取代聚伸乙基亞胺類。樹脂相容性上漿組合物之非限制性具體實施例進一步包括一或多種化學性質與前文討論之聚合物料及軟化劑不同的潤滑材料俾於織造過程對纖維股線賦予預定加工特性。此種本發明有用之脂肪酸酯類之非限制性實例包括棕櫚酸鯨蠟酯、肉豆蔻酸鯨蠟酯、月桂酸鯨蠟酯、月桂酸十八烷酯、肉豆蔻酸十八烷酯、棕搁酸十八烷酯及硬脂酸十八烷酯。其它有用的脂肪酸酯潤滑材料包括三羥甲基丙烷三壬阪@曰、天然絲躐及二酸甘油醋油類例如但非限於大豆油、亞麻仁油、環氧化大豆油及環氧化亞麻仁油。潤滑油也包括非極性石蠟以及水溶性聚合物料，例如但非限於聚伸烷基多元醇類以及聚氧伸烷基多元醇類。樹脂相容性上漿組合物之非限制性具體實施例額外包括一種樹脂反應性稀釋劑俾進一步改良塗覆纖維股線之潤滑。用於此處「樹脂反應性稀釋劑」4示稀釋劑包括官能基其可與塗覆組合物所相容的相洞樹脂進行化學反應。稀釋劑可爲任-種稀釋劑其帶有一或多個官能基可與：脂系統反應’較佳爲可與環氧樹脂系統反應之官能基。適當潤滑劑之非限制性實例包括帶有胺基（例如改性聚伸乙基 (請先閱讀背面之注意事項再填寫本頁) :裝. 訂 -43- 552831In addition to particles, the resin-compatible sizing composition and non-limiting specific examples preferably include one or more film-forming materials such as organic, inorganic, and polymeric materials. Non-limiting examples of film-forming materials include ethylene-based polymers. Examples include non-limiting examples of polyethylene glycols, polyamines, polyamines: formates, and combinations thereof. The makeup base replaces the film-forming material discussed above. The resin-compatible sizing combination restricts the bone bean. Examples include one or more glass fiber coupling agents, such as a machine-stone appearance coupling agent, a transition metal coupling agent, and a tenate coupling agent. Mixture, (please read the precautions on the back before filling this page) Binding-42- 552831 A7 B7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of Invention (4Q) Agent, Werner Mixtures and mixtures thereof. Non-limiting specific embodiments of the resin-compatible sizing composition further include one or more softeners or surfactants. Non-limiting examples of softeners include amine salts of fatty acids, and calomel .Plin derivatives, acid solubilized fatty acid amines, polycondensates of fats and polyethylenimines, and amine-substituted polyethylenimines. Non-limiting resin-compatible sizing compositions The specific embodiment further includes one or more lubricating materials having different chemical properties from the polymer materials and softeners discussed above, and imparts predetermined processing characteristics to the fiber strands during the weaving process. This invention is useful Non-limiting examples of fatty acid esters include cetyl palmitate, cetyl myristate, cetyl laurate, stearyl laurate, stearyl myristate, stearyl palmitate Octadecyl stearate. Other useful fatty acid ester lubricants include trimethylolpropane tri-nonsalene @ 曰, natural silk 躐 and diglyceride vinegar oils such as, but not limited to, soybean oil, linseed oil, Epoxidized soybean oil and epoxidized linseed oil. Lubricants also include non-polar paraffin and water-soluble polymer materials such as, but not limited to, polyalkylene polyols and polyoxyalkylene polyols. Resin compatibility Non-limiting specific examples of the pulp composition additionally include a resin-reactive diluent, which further improves the lubricity of the coated fiber strands. Used herein "resin-reactive diluent" 4 shows that the diluent includes functional groups that can interact with The phase-hole resin compatible with the coating composition undergoes a chemical reaction. The diluent may be any kind of diluent, which has one or more functional groups and can react with: a lipid system, preferably a system that can react with an epoxy resin system. Functional group. When the non-limiting examples of lubricants include having the amine group (e.g. ethyl extension modified poly (Read Notes on the back and then fill the page): bookbinding -43-552831

胺）、醇·基（例如聚7 ^ 氧基(例如環氧化大二：)、奸基、酸基(例如脂肪酸)或項樹脂相容性:裝二Γ氧化亞麻仁油网 k、、且6物之非限制性具體實施例額外句知 :或多種乳化或分散塗覆組合物組成分之乳化劑，例3 :及/或潤滑劑。適當乳化劑或界面活性劑之非限制性實二 t聚氧伸燒基嵌段共聚物、乙繼基紛類、聚氧；乙 :辛基丰基二醇醚類、山梨糖醇酯之環氧乙烷衍生物、聚 μ n乙氧化垸基紛類及壬酴界面活性劑。 >'、、可έ括於树脂相容性上漿組合物之非限制性具體實 :例：加劑例如交聯材料、增塑劑、聚矽氧類、殺眞菌 w奴菌劑、及消泡材料。有機及/或無機酸或鹼之用量足夠對塗復組合物提供pH 2至1〇也可含括於樹脂相容性上漿組合物。树知相备性上漿組合物之非限制性實例示於表E，其中表 J數値爲以總固體爲基準，規定組分佔總塗覆組合物之重量百分比。 (請先閲讀背面之注意事項再填寫本頁} i裝. 訂經濟部中央標準局員工消費合作社印製 -44- 本紙張尺度適用中國國家標準（CNS )八4胁（2ΐ〇χ297公菱） 552831Amine), alcohol · group (such as poly 7 ^ oxy group (such as epoxidized sophomore :), phosphonium group, acid group (such as fatty acid), or resin compatibility: loaded with two oxidized linseed oil network k, and 6 non-limiting specific examples of the additional sentence: the emulsifier of one or more components of the emulsified or dispersed coating composition, Example 3: and / or lubricants. Non-limiting examples of suitable emulsifiers or surfactants tPolyoxy elongation-based block copolymers, ethylenyl groups, polyoxygen; ethyl: octylfungyl glycol ethers, ethylene oxide derivatives of sorbitol esters, polyμn ethoxylate Various and non-ionic surfactants. &Gt; ',, non-limiting specific examples that can be included in resin-compatible sizing compositions: Examples: Additives such as cross-linking materials, plasticizers, polysiloxanes , Bactericidal fungicides, and defoaming materials. The amount of organic and / or inorganic acid or alkali is sufficient to provide the coating composition with a pH of 2 to 10 and may also be included in the resin-compatible sizing composition. A non-limiting example of a tree-ready sizing composition is shown in Table E, where the number in Table J is based on the total solids, and the specified components account for the total coating composition. (Please read the notes on the back before filling in this page} i. Order. Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs-44- This paper size is applicable to China National Standards (CNS) Ya 4 threats (2ΐ〇χ297 (Gongling) 552831

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GI5.33.65 11 IX 2. 31.9 0.43 _ 2 6 Η- 4· 2· 11 1Χ .5.4GI5.33.65 11 IX 2. 31.9 0.43 _ 2 6 Η- 4 · 2 · 11 1 × .5.4

.6 II 1 2.75 3.0.404. -裝-- (請先閲讀背面之注意事項本頁} 4· 44. 44 60 61 62 司 63 司 64 司 PVP K-30聚乙晞基吡咯啶酮市ϋ得自紐澤西州偉恩Isp化學八〇史帝旁提653市西上得自紐澤西州梅伍德史帝旁(Stepan)公司。A 口 M87 r 縮水甘油氧丙基三甲氧魏市面上得自康乃迪克州格木威孔普騰公令-口4 r-縮水甘油氧丙基王甲氧钱市面上得自康乃迪克州格木威孔普騰公，瑪6717利部祕胺化聚伸乙基亞胺，市面上得自俄亥俄州辛辛納提可尼斯公.6 II 1 2.75 3.0.404. -Pack-(Please read the precautions on the back page first) 4. 44. 44 60 61 62 Division 63 Division 64 Division PVP K-30 Polyethylpyrrolidone City ϋ Available from Wayne Isp Chemical, 80 New Jersey, New Jersey. Stephanie 653 is available from Stepan Company, Maywood, New Jersey. A mouth M87 r glycidyloxypropyltrimethoxo is commercially available. Obtained from Gumway, Kompton, Connecticut-4 r-Glycidyloxypropyl King Methion, commercially available from Gumway, Kompton, Connecticut, 6767. Imine, commercially available from Cincinnati Cornis, Ohio

65馬可OP-10乙氧化烷基酚：此種材料類似馬可OIM〇 sp，但理來去除催化劑；馬可OP-10非市售。 1U 66〒略81山鎌醇g旨之環氧乙垸衍生物，市面上得自紐澤西職希巴尼basf 公司。 ’&DF-136消泡劑’市面上得自紐澤西州帕希巴尼basf公司。 =羅帕克OP-96，0.55微米粒子分散液，市面王得自賓州費城羅門口公司。樹氮化瓣型塗層濃劑25氮化贿散液，市面上得自田納西州橡二波樂森ΡΤ 160氮化硼粉末，市面上得自俄亥俄州雷克午先進陶塞格10消泡劑，市面上得自康乃迪克州格林威治孔普騰公司。 72RD-847A聚酯樹脂，市面上得自俄亥俄州哥倫布玻登(B〇rden)化學公司。 -45- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）訂經濟部中央標準局員工消費合作社印製 552831 A7 B7 五、發明説明（ 43 組成分 A B --- _ 實例 D E F G H 普羅尼克(PLURONIC) F-10874 8.5 8.4 10.9 亞卡牧(ALKAMULS) EL-719。 3.4 2.5 衣可諾(ICONOL) NP-6/b 3.4 4.2 3.6 波里歐(POLYOX) WSR 30177 0.6 0.6 乂v 祕古 mvMAmT τ a 1 — 29.1 28.9 索穆(SERMUL) ΕΝ 66879 2.9 辛佩維尼(SYNPERONIC) t-108 — · 10.9 優雷杜(EUREDUR) 14081 4.9 維賽米(VERS AMID) 14082 — 4.8 13.6 12.6 芙雷梭(FLEXOL)EPO83 73 74 (請先閱讀背面之注意事項再填寫本頁) 尼讀雅^^EL719聚氧伸乙基植物油’市面上得自紐澤西州普林斯頓，隆寶蘭，羅地 76 77 78 79 80 81 82 83 經濟部中央標準局員工消費合作社印裝公司 75 f可諾NP-6垸氧化壬紛，市面上得自紐澤波里歐WSR戰魏淡，市面±得自康代納克si 1〇〇樹脂市面上得自瑞典Eka化學^：克川丹伯利康備么司索穆EN 668乙氧化壬紛，市面上得自比荷盧 k田杜140馬永&^胺树月曰，帀面上得自比利時汽巴嘉基公司。胺樹脂，市面上得自俄亥俄州辛辛納提可尼斯公司。氧化大豆油，市面上得自康乃迪克州丹伯利永備公^。帶有树爿曰相谷性上漿組合物之玻璃纖維之額外非限制性實例揭^於美國申請案第〇9/62〇,526號，名稱「浸潰玻璃纖維股線及含括該玻璃纖維股線之f品」申請日2〇〇〇年丨丨月3 曰，特別併述於此以供參考。再度參照圖1但非限制本發明，加強材料2〇包含4〇%重量比至70%重量比預浸物層14 (包括無機填料18重量）。一個 -46- 本紙張尺度適用中國國家榡準（CNS ) A4規格（21〇Χ297公釐） 552831 A7 B7 經濟部中央標準局員工消費合作社印装五、發明説明（非限制性具體實施例中，加強材料2〇包含48%重量比至Μ% 重量比預浸物層14 (包括無機填料1 8重量）。根據本發明之電子支撐件10之非限制性具體實施例中，電子支撐件10包含至少一預浸物層14其包含至少一種織造纖維加強材料20係由至少一種不含玄武岩玻璃之纖維製成，以及至少一種基體材料16其係接觸該至少一種加強材料20之至少一部份，該至少一種基體材料16包含至少一種非氟化聚合物及至少一種無機塡料18，其中該至少一種無機填料18包含至少一種具有高電阻係數之非可水合層狀無機固體潤滑劑，且以總固體爲基準係佔基體材料16及至少一種然機填料1 8之合併總重之至少6%重量比。此外但非必要至乂種播機％料18具有下列一或多種屬性：摩氏硬度不大於6，熱傳導係數大於30 W/mK，低熱膨脹係數，及對金屬離子之鬲度親和力。前文討論之本發明之電子支撐件10之一具體實施例中，該至少一種粒狀無機填料18爲六面體氮化蝴。根據本發明之電子支撐件10之另一非限制性具體實施例中’電子支撐件10包含至少一層預浸物層14其包含至少兩種織造纖維加強材料20，以及至少一種基體材料16接觸該至 > 一種加強材料2〇之至少一部份，該至少一種基體材料 16包含至少一種非氟化聚合物以1至少一種無機填料1 8，其中孩至少一種無機填料18包含至少一種具有高電阻係數 <非可水合層狀無機固體潤滑劑·，且以總固體爲基準，佔基植材料16與至少一種無機填料1 8之合併總重之1 〇 %重量 (請先閲讀背面之注意事項再填寫本頁) 裝· -47-65 Marco OP-10 ethoxylated alkylphenol: This material is similar to Marco OIMO sp, but the catalyst is removed; Marco OP-10 is not commercially available. 1U 66 〒 81 oxalic alcohol g purpose ethylene oxide derivatives, commercially available from the New Jersey-based Hibani basf company. '&Amp; DF-136 Defoamer' is commercially available from Basfani, Pasibani, NJ. = Ropac OP-96, 0.55 micron particle dispersion, available from the Luomenkou Company in Philadelphia, Pennsylvania. Tree Nitrided Petal Coating Concentrate 25 Nitrile Briquette, available on the market from Tennessee Oaks II Polesen PT 160 Boron Nitride powder, commercially available from Reckow Advanced Tausser 10, Defoam, Ohio Agent, commercially available from Compton, Greenwich, Connecticut. 72RD-847A polyester resin, commercially available from Borden Chemical Company, Columbus, Ohio. -45- This paper size applies to Chinese National Standard (CNS) A4 (210X297 mm). Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. 552831 A7 B7 V. Description of the invention (43 components AB --- _ Example DEFGH PLURONIC F-10874 8.5 8.4 10.9 ALKAMULS EL-719. 3.4 2.5 ICONOL NP-6 / b 3.4 4.2 3.6 POLYOX WSR 30177 0.6 0.6 乂 v Migu mvMAmT τ a 1 — 29.1 28.9 SERMUL ENE 66879 2.9 SYNPERONIC t-108 — · 10.9 EUREDUR 14081 4.9 VERS AMID 14082 — 4.8 13.6 12.6 Freseau (FLEXOL) EPO83 73 74 (Please read the notes on the back before filling out this page) Nidella ^^ EL719 Polyoxygenated Ethyl Vegetable Oil 'is commercially available from Princeton, New Jersey, Lombard, and 76 76 78 79 80 81 82 83 Employee Cooperative Cooperative Printing Company of the Central Bureau of Standards of the Ministry of Economic Affairs 75 f Cono NP-6 oxidized non-ferrous, available on the market from Niuze Borio WSR and Wei Dan, available on the market from Condenac si 100 resins are commercially available from Eka Chemicals, Sweden ^: Kechuan Danbo Li Kangbei Mossomo EN 668 ethoxylated pentoxide, commercially available from Benelux k Tiandu 140 Ma Yong & amine tree Yue Yue It is commercially available from Ciba Geiger, Belgium. Amine resins are commercially available from Cincinnati Cornis, Ohio. Oxidized soybean oil is commercially available from Danbury Evergreen, Connecticut ^. An additional non-limiting example of glass fibers with a tree sizing composition is disclosed in U.S. Application No. 09 / 62,526, entitled "Immersion Glass Fiber Strands and Containing the Glass The "f product of fiber strands" application date is January 3, 2000, and is specifically incorporated herein for reference. Referring again to FIG. 1 but not limiting the present invention, the reinforcing material 20 contains 40% by weight to 70% by weight prepreg layer 14 (including 18 weight of inorganic filler). A -46- This paper size applies to China National Standard (CNS) A4 specification (21 × 297 mm) 552831 A7 B7 Employees of the Central Standards Bureau of the Ministry of Economic Affairs Consumption Cooperatives V. Description of the Invention (in a non-limiting specific embodiment, 20 packs of reinforcing material 48% by weight to 14 [mu] wt% layer (inorganic filler comprising 18 wt) ratio of a prepreg. In a non-limiting embodiment of the electronic support 10 according to the present invention, the electronic support 10 includes at least one prepreg layer 14 including at least one woven fiber reinforcement material 20 made of at least one basalt-free fiber And at least one matrix material 16 which is in contact with at least a part of the at least one reinforcing material 20, the at least one matrix material 16 comprises at least one non-fluorinated polymer and at least one inorganic filler 18, wherein the at least one inorganic filler 18 contains at least one non-hydratable layered inorganic solid lubricant having a high resistivity, and accounts for at least 6% by weight of the combined total weight of the base material 16 and at least one natural filler 18 based on the total solids. In addition, it is not necessary that the seeder 18 has one or more of the following properties: Mohs hardness is not greater than 6, thermal conductivity is greater than 30 W / mK, low thermal expansion coefficient, and affinity for metal ions. In one embodiment of the electronic support 10 of the present invention discussed above, the at least one particulate inorganic filler 18 is a hexahedron nitrided butterfly. In another non-limiting embodiment of the electronic support 10 according to the present invention, the 'electronic support 10 includes at least one prepreg layer 14 which includes at least two woven fiber reinforcement materials 20, and at least one matrix material 16 contacts the To > At least a part of a reinforcing material 20, the at least one matrix material 16 contains at least one non-fluorinated polymer with 1 at least one inorganic filler 18, wherein the at least one inorganic filler 18 contains at least one having a high resistance Coefficient < non-hydratable layered inorganic solid lubricant, and based on total solids, accounting for 10% by weight of the combined weight of the base material 16 and at least one inorganic filler 18 (please read the precautions on the back first) (Fill in this page again.)

552831 五、發明説明（45) =外但非必要’該至少—種無機填料18可具有一或多列屬性：摩氏硬度不大於6，熱傳導係數 =1低熱膨脹係數，及對金屬離子的高度親和力，=〇 ’，本《明m支料1G(非限制性具體實施例中，該至y—種粒狀無機填料18爲六面體氮化硼。根，本發明之電子支撐件1G之另—非限制性具體實施例中j私子支撐件10包含至少一層預浸物層14其包含至少一種織造纖維加強材料20係由至少一種不含玄武岩破璃之纖維製成，以及至少一種基體材料16其接觸該至少一種加強材料2〇之至少一部份，該至少一種基體材料16包含至少一種非氟化聚合物以及至少一種無機填料丨8，其中該至少一種無機填料18包含至少一種具有高熱傳導係數及高電阻係數之無機填料，且以總固體爲基準，係佔基體材料“與至少種供機填料18之合併總重之至少6%重量比。此外但非必要’該至少一種無機填料可具有下列一或多種屬性：摩氏硬度不大於6，熱傳導係數大於3〇 w/mK，低熱膨脹係數’良好潤滑性質（亦即爲無機固體潤滑劑）以及層狀結構。前文討論之電子支撐件1〇之非限制性具體實施例中，该至少一種粒狀無機填料爲六面體氮化硼。經濟部中央樣準局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 根據本發明之電子支撐件10之另一非限制性具體實施例中’電子支撐件10包含至少一層_預浸物層14其包含至少一種織造纖維加強材料20，以及至少一種基體材料16其係接觸該至少一種加強材料2〇之至少一部份，該至少一種基體材料16包含至少一種非氟化聚合物以及至少一種無機填料 -48- 本紙張尺度適用中國國家標準（CNS ) A4規格（2ΐ〇χ—297公釐 552831552831 V. Description of the invention (45) = external but not necessary 'the at least one kind of inorganic filler 18 may have one or more columns of properties: Mohs hardness is not greater than 6, thermal conductivity coefficient = 1 low thermal expansion coefficient, and height to metal ions Affinity, = 0 ', in the present invention, 1G (in a non-limiting specific embodiment, the to y-type granular inorganic filler 18 is hexahedron boron nitride. Root, the electronic support 1G of the present invention In another non-limiting embodiment, the private support 10 includes at least one prepreg layer 14 including at least one woven fiber reinforcement material 20 made of at least one basalt-free fiber and at least one matrix. The material 16 contacts at least a part of the at least one reinforcing material 20, the at least one matrix material 16 comprises at least one non-fluorinated polymer and at least one inorganic filler, wherein the at least one inorganic filler 18 includes at least one Inorganic fillers with high thermal conductivity and high electrical resistivity, based on the total solids, represent at least 6% by weight of the combined total weight of the matrix material and at least one type of mechanical filler 18. Not necessary 'The at least one inorganic filler may have one or more of the following properties: Mohs hardness not greater than 6, thermal conductivity greater than 30 w / mK, low thermal expansion coefficient, good lubricating properties (ie, inorganic solid lubricants), and layers Structure. In the non-limiting specific embodiment of the electronic support 10 discussed above, the at least one granular inorganic filler is hexahedron boron nitride. Printed by the Consumer Cooperative of the Central Bureau of Standards, Ministry of Economic Affairs (please read first Note on the back, please fill in this page again.) In another non-limiting embodiment of the electronic support 10 according to the present invention, the 'electronic support 10 includes at least one layer_prepreg layer 14 which includes at least one woven fiber reinforcement material 20 And at least one matrix material 16 which is in contact with at least a part of the at least one reinforcing material 20, the at least one matrix material 16 contains at least one non-fluorinated polymer and at least one inorganic filler -48- This paper size applies to China National Standard (CNS) A4 specification (2 × χ—297 mm 552831

五、發明説明（經濟部中央標準局員工消費合作社印裝 18，其中孩至少一種典機填料18包本導伤叙不Π Μ批、A 〇至；一種具有高熱傳導係數及南電阻係數（無機塡料， ^ ,,.. 、才且以總重爲基準，佔基 ::料16與至少：種無機填料18之合併總重之至少㈣重 :二:匕外Γ非必要’孩至少一種無機填料具有下列-或夕種屬性：摩氏硬度不大於6，鼽傳導 , 、 …、得等係數大於30 W/mK，低；^鉍脹係數，良好潤滑性質（亦即既… 只即馬《機固體潤滑劑）及層狀結構。前文討論之電子支撐件 m 、、文呀件10又非限制性具體實施歹1 ，1¾至少一種粒狀無機填料爲六面體氮化石朋。根據本發明之電子支撐件10之又另一非限制性具體實施例中，電子支撐件H)包含至少―預浸物層14包含至少一種織造纖維加強材料20，以及至少一種基體材料㈣觸該至少一種加強材料20之至少-部份，該纟少一種基體材料16 i各至少一種典機填料18其含量係足夠抑制傳導性陽極長絲的形成以及減少電子支撐件内部的電短路。特定非限制性具體實施例中，該至少一種纖維加強物爲織造玻璃纖維加強物。另一非限制性具體實施例中，填料對金屬離子具高度親和力。雖然並非必要，對金屬離子具高度親和力之填料具有CEC至少爲20毫當量/1〇〇克，另一具體實施例中，至少爲8 0毫當f /1 〇〇克。另一非限制性具體實施例中，對金屬離子具高度親和力之填料具有Kd( Cu2+)至少600毫升/ 克；以及於另一非限制性具體實施例中，爲至少丨5〇〇毫升/ 克及另一非限制性具體實施例至少丨5, 〇〇〇毫升/克及另一非限制性具體實施例至少40, 000毫升/克。此外但非必要，該至少一種無機填料18進一步具有下列一或多種屬性：摩氏 -49 - 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁) ;裝. 4 552831 經濟部中央標準局員工消費合作衽印製 A7 ----------__五、發明説明（47) 一—硬度不大於6,低熱膨脹係數，良好潤滑性質，良好熱傳導係數以及高電阻係數。對金屬離子具高度親和力之填料之非限制性實例包括但非限於高嶺土、蛭石、包土、'膨潤土、^輝石、水合雲母、矽鐵石、亞氣酸鹽、美國活性白土、f孔矽酸鹽、合成含氟雲母及其混合物。可膨脹性合成含氟雲母之非限制性具體實施例爲鈉氟鉀石。多孔矽酸鹽足一非限制性具體實施例爲有機官能化多孔矽酸鹽。、、2據本發明之電子支撐件10之非限制性具體實施例中， ί %子支撐件10包含至少一預浸物層14其包含至少一種織造纖維加強材料20，以及至少一種基體材料16其係接觸該一種加強材料20之至少一部份，至少一種基體材料Μ 包含至少一種非氟化聚合物以及至少一種無機填料18，其中該至少一種無機填料1 8對金屬離子具高度親和力，且以 =固體爲基準，係佔基體材料16與至少一種無機塡料18之合併總重之至少10%重量比。電子支撐件1〇之另一非限制 ,具體實施例中，該至少一種織造纖維加強材料2〇係由至少一種不含玄武岩玻璃之纖維製成，該至少一種無機填料 18對金屬離子具高度親和力，且以總固體爲基準係佔基體材料16與該至少一種無機填料18之合併總重之至少6%重量比。根據本發明之電子支撐件1 〇之3 一非限制性具體實施例中，電子支撐件1 〇包含至少一預浸物層丨4其包含至少一種織造纖維加強材料20，以及至少一種基體材料16其係接觸〉至^ 一種加強材料2 〇及至少一種無機填料1 8之一部份， -50- 本紙張目家辟（CNS ) A4· ( (請先閱讀背面之注意事項再填寫本頁) :裝. 訂V. Description of the invention (18 printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs, of which there are at least one type of machine packing 18 packs of this guide, no. Μ batch, A 〇 to; a type with high thermal conductivity and southern electrical resistivity (inorganic For example, ^ ,, .., and based on the total weight, accounting for at least one of the combined total weight of the base material :: material 16 and at least: inorganic fillers 18: two: daggers, non-essential, at least one Inorganic fillers have the following properties: Mohs hardness is not greater than 6, 鼽 conduction,…, and other coefficients greater than 30 W / mK, low; ^ bismuth expansion coefficient, good lubricating properties (that is, both ... "Organic solid lubricants" and layered structure. The electronic support m, 10, and 10 discussed previously are non-limiting specific implementations. At least one of the granular inorganic fillers is a hexahedron nitride. According to this In still another non-limiting embodiment of the electronic support 10 of the invention, the electronic support H) includes at least-the prepreg layer 14 includes at least one woven fiber reinforcement material 20, and at least one matrix material contacts the at least one Reinforcement materials up to 20 -In part, the content of the base material 16 i is at least one typical filler 18, and its content is sufficient to inhibit the formation of conductive anode filaments and reduce electrical shorts inside the electronic support. In specific non-limiting specific embodiments, The at least one fiber reinforcement is a woven glass fiber reinforcement. In another non-limiting embodiment, the filler has a high affinity for metal ions. Although not necessary, a filler with a high affinity for metal ions has a CEC of at least 20 milliequivalents 100 g, in another specific embodiment, at least 80 milligrams f / 1 000 g. In another non-limiting specific embodiment, a filler having a high affinity for metal ions has a Kd (Cu2 +) of at least 600 ml / g; and in another non-limiting embodiment, at least 500 ml / g and another non-limiting embodiment at least 5, 000 ml / g and another non-limiting The specific embodiment is at least 40,000 ml / g. In addition, but not necessarily, the at least one inorganic filler 18 further has one or more of the following properties: Mohs-49-This paper size is applicable to China Standard (CNS) Α4 size (210X297 mm) (Please read the precautions on the back before filling out this page); Packing. 4 552831 Consumer Co-operation, Central Standards Bureau, Ministry of Economic Affairs, printed A7 --------- -__ V. Description of the invention (47) I. Hardness is not greater than 6, low thermal expansion coefficient, good lubricity, good thermal conductivity and high electrical resistance. Non-limiting examples of fillers having a high affinity for metal ions include, but are not limited to Kaolin, vermiculite, clathrate, 'bentonite, pygmatite, hydrated mica, sillimanite, oxynite, American activated white clay, f-pore silicate, synthetic fluorinated mica and mixtures thereof. Swellable synthetic fluorinated mica A non-limiting specific example is sodalofite. One non-limiting specific example of a porous silicate is an organic functional porous silicate. According to a non-limiting embodiment of the electronic support 10 according to the present invention, the sub-support 10 includes at least one prepreg layer 14 including at least one woven fiber reinforcement material 20 and at least one matrix material 16 It is in contact with at least a part of the reinforcing material 20, the at least one matrix material M comprises at least one non-fluorinated polymer and at least one inorganic filler 18, wherein the at least one inorganic filler 18 has a high affinity for metal ions, and Based on = solid, it is at least 10% by weight of the combined total weight of the base material 16 and the at least one inorganic aggregate 18. In another embodiment, the electronic support member 10 is non-limiting. In the specific embodiment, the at least one woven fiber reinforcing material 20 is made of at least one kind of fiber not containing basalt glass. The at least one inorganic filler 18 has a high affinity for metal ions. And based on the total solids, at least 6% by weight of the combined total weight of the base material 16 and the at least one inorganic filler 18. According to a non-limiting embodiment of the electronic support 10 according to the present invention, the electronic support 10 includes at least one prepreg layer 4, which includes at least one woven fiber reinforcement material 20, and at least one matrix material 16. Its contact> to ^ a part of a reinforcing material 20 and at least one inorganic filler 18, -50- this paper Mejiapi (CNS) A4 · ((Please read the precautions on the back before filling this page) : Install. Order

Jm 552831 A7 B7 五、發明説明（48 其中該至少一種無機填料18對金屬離子具高度親和力，且以總固體爲基準，係佔基體材料16與該至少—種無機填料 18<合併總重之至多5%重量比。電子支撐件1〇之另一非限制性具體實施例中，至少一種無機填料18對金屬離子具高度親和力，且以總固體爲基準係佔基體材料16盥至少二^ 無機填料18之合併總重之至多1〇%重量比。電子支撐件Η 又=一非限制性具體實施例中，至少一種無機填料^對金屬離子具高度親和力，且以總固體爲基準係佔基體材料Η 與至少一種無機填料18之合併總重之至多15%重量比。根據本發明之電子支撐件1G之另_非限制性具體實施例中，電子支撐件ίο包含至少一預浸物層14其包含至少— 經濟部中央標準局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁} 造纖維加強材料20 ’以及至少一基體材料16接觸該至少: 種加強材料20之至少一部份，基體材料16包含至少一=盔機填料18’其中該至少一種無機塡料18爲—種螯合：下列材料’帶有含氮有機官能基、含硫有機官能基、含故有機官，基、含磷有機官能基及其混合物之材料。非二= 性具體實施例中，螯合劑以總固體爲基準係佔基體材1 與該至少-種無機填料18之合併總重之至多外重^比。16 -非限制性電子支撑件狀具體實施例中，螯合劑以體馬基準係佔基體材料16與該至少_種無機填料Μ之二總重之至多10%重量比。又另一輕制性具體實施例；汗螯合劑以總固體爲基準係佔基體材料16與該至少一秘填料18之合併總重之至多丨5%重量比。热機亦須了解填料18包衫種；Γ、㈣料，因此填料提供 -51 - 552831 五、發明説明（ 49 經濟部中央標準局員工消費合作社印製性質的組合。雖然並非必要，作芒古擇件1〇之任-且所需，前述根據本發明之電子支丹月且貫施例可進一牛七人未顯示）其係接觸該一或多 ^ 3 一種導電材料（圖中 -面之至少-补上:預次物層14中之至少-層之至少、 #饧。雖然非限制性，但該至少.^ , L 郅主面。用於此處「外部主面」 / :面可爲外外，導電材料包含至少一泰路王面。此示形成於導電材料内部戈^ '此。「電路」-詞表欲，例如包括但非限於線、仃〜構特印刷電路板上俾接供所+ + 土土鬼及它通常形成於支於件二：及/或熱互連的結構特徵。電子牙 I S至少一孔洞伸展貫穿電子支撐件之至心郅份，容後詳述。又子牙忤之至少一繼績參照圖1，將對根據本發明之一且俨宭、a η、子支樓件Η)之方法作—般性:二方成電 _ , ^ K玎卿。咸万法包含組合至少一 τ=填料18與至少-種基體材料16。該組合步驟乃業界 =所周知之將填料組合成爲聚合物料之任—種方法 2但非限制本發明，若至少—種基體材科“包含散固性 “匕物’則形成該聚合物之落劑溶液，然後將至少_種無機增料18混合入溶液。但若該至少—種基體材料16包含散 3性聚合物’則聚合物首先熔化’然後將至少一種無^填㈣混合入熔化後的聚合物。另>，熱塑性聚合物與至少 :種無機填料i 8之粉狀混合物可形成及然後加熱而溶化聚合物；或粉狀混合物混合及通過擠壓機而形成緻密混合物’結果形成之混合物可被壓延成爲平坦薄 (請先閱讀背面之注意事項再填寫本頁) :裝-Jm 552831 A7 B7 V. Description of the invention (48 where the at least one inorganic filler 18 has a high affinity for metal ions, and based on the total solids, it accounts for the matrix material 16 and the at least one inorganic filler 18 < the combined total weight is at most 5% by weight. In another non-limiting embodiment of the electronic support 10, at least one inorganic filler 18 has a high affinity for metal ions, and accounts for at least two of the base material 16 based on the total solids ^ inorganic filler The combined total weight of 18 is at most 10% by weight. Electronic support Η Again = In a non-limiting specific embodiment, at least one inorganic filler ^ has a high affinity for metal ions, and accounts for the base material based on the total solids合并 The combined total weight of at least one inorganic filler 18 is at most 15% by weight. In another non-limiting specific embodiment of the electronic support 1G according to the present invention, the electronic support includes at least one prepreg layer 14 and Contains at least-printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) Fiber Reinforcement Materials 20 'and at least one base material The material 16 contacts the at least: at least a part of the reinforcing material 20, and the base material 16 includes at least one = helmet filler 18 ', wherein the at least one inorganic material 18 is a kind of chelate: the following material' with nitrogen-containing organic Functional groups, organic functional groups containing sulfur, organic functional groups containing organic compounds, organic functional groups containing phosphorus, organic functional groups containing phosphorus, and mixtures thereof. Non-specific = In the specific embodiment, the chelating agent accounts for the base material 1 based on the total solids. The combined total weight of at least one inorganic filler 18 is at most the external weight ratio. 16-In a non-limiting electronic support-like embodiment, the chelating agent occupies the matrix material 16 and the at least one inorganic filler in a pony basis. The total weight of the two is at most 10% by weight. Yet another lightweight embodiment; the sweat chelating agent accounts for up to 5% of the combined total weight of the base material 16 and the at least one secret filler 18 based on the total solids. Weight ratio. The heat engine must also understand the 18 types of fillers; Γ, ㈣ material, so the filler provides -51-552831. 5. Description of the invention (49 The combination of printed characteristics of the staff consumer cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. Although not necessary, Option for Mangu 1〇 Any-and as required, the aforementioned electronic lunar month according to the present invention and the embodiment can be added to one or seven people (not shown), which is in contact with the one or more ^ 3 a conductive material (in the figure-at least-supplements: At least-layer at least, # 饧 in the pre-order layer 14. Although non-limiting, it should be at least. ^, L 郅 main surface. Used here "outer main surface" /: surface can be outer and conductive The material contains at least one Thai road king surface. This illustration is formed inside the conductive material ^ 'this. "Circuit"-a word meaning, such as including but not limited to wires, 仃 ~ 构特特 on a printed circuit board + + Dirt ghost and it are usually formed on the supporting structure of the second piece: and / or thermal interconnection. At least one hole of the electronic tooth IS extends through the electronic support to the heart part, which will be described in detail later. At least one of the successes of Ziyaoya will be described with reference to FIG. 1. A method according to one of the present invention (俨宭, a η, sub-branch pieces Η) will be made—generality: two parties into electricity_, ^ K 玎卿. The Xianwan method includes combining at least one τ = filler 18 and at least one matrix material 16. This combination step is the industry = well-known method of combining fillers into polymer materials—a method 2 but not a limitation of the present invention, and if at least—the substrate material family “contains a solid“ dagger ”, the formation of the polymer Agent solution, and then at least one inorganic additive 18 is mixed into the solution. However, if the at least one matrix material 16 contains a bulk polymer, the polymer is first melted, and then at least one unfilled polymer is mixed into the melted polymer. In addition, a powdery mixture of the thermoplastic polymer and at least one of the inorganic fillers i 8 may be formed and then heated to dissolve the polymer; or the powdery mixture may be mixed and formed into a dense mixture by an extruder. The resulting mixture may be The rolling becomes flat and thin (please read the precautions on the back before filling this page):

，1T 4 -52- 50 552831 五、發明説明（業界人士須了解A機嫿极 ._ , ^ ^ W枓18可使用偶合劑或其它相容劑作珂處理俾改良基體材斜奋^ ,dt ^ 才科16與操機填料18之濕潤性。此外 =本發明所必要’偶合劑^無機填料添加前添體材料俾改良濕潤性。用土基 f:眾所周知，但不必進-步揭示粒子之處理方法。 :.丨需要進一步資訊可參考册，H. Katz^J =WSki編輯(㈣年）65·115頁，特別併述於此以供參本發明之非限制性具體實施例中，”、一種無機填料Μ 使用至少-種可與聚合物基體材料⑹目容的溶劑前處理，形成爲糊膏，然後分散於聚合物基體材料“。用於此處「至少-種可與聚合物基體材料相容之溶劑」—_表亍，至少-種溶劑可至少部份溶劑合或溶脹聚合物基體材料：雖然非限制性，但於本發明之_具體實施例中，其中聚合物基體材料馬環氧樹脂材料，無機填料18使用至少—種選自丙明、：甲基甲醯胺（DMF)、二氯甲垸、二醇鍵、里丁嗣（MEK)、及其混合物之溶劑作前處理。八於組合或分散孩至少一種無機填料18與聚合物基體材料 16後，聚合物基體材料16藉業界已知之任一種方法施用於加強材料20而形成預浸物。例如但非限制本發明，若加強物20係呈織造玻璃纖維織物形式_，則加強物2〇可浸潰於浴槽中，該浴槽含有包含至少一種無機填料18之聚合物基體材料16，以及隨後在一組計量滾筒間擠壓而留下測量之^ 體材料16於其上。另外，包含該至少—種無機填料以之^ 53 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐）麵 (請先閱讀背面之注意事項再填寫本頁) *裝.， 1T 4 -52- 50 552831 V. Description of the invention (Industry professionals must understand the A machine 婳 pole. _, ^ ^ W 枓 18 Coupling agents or other compatibilizers can be used for 珂 treatment. Improved base materials ^, dt ^ The wettability of Caike 16 and the padding filler 18. In addition = the 'coupling agent necessary for the present invention ^ Additive material before the inorganic filler is added to improve the wettability. Using soil-based f: well-known, but it is not necessary to-further reveal the treatment of particles Method.:. 丨 For further information, please refer to the book, H. Katz ^ J = WSki editor (leap year) 65 · 115 pages, which are specifically described herein for reference in the non-limiting specific embodiments of the present invention, ", An inorganic filler M is pretreated with at least one solvent compatible with the polymer matrix material, formed into a paste, and then dispersed in the polymer matrix material. "Used herein" at least-one polymer matrix material Compatible Solvents "— Table 亍, at least one solvent can at least partially solvate or swell the polymer matrix material: Although not limited, in the _ specific embodiment of the present invention, wherein the polymer matrix material horse ring Oxygen resin material, inorganic filler 18 use at least -A kind of solvent selected from propylamine, methylformamide (DMF), dichloroformamidine, diol bond, ritamidine (MEK), and mixtures thereof for pre-treatment. After the inorganic filler 18 and the polymer matrix material 16, the polymer matrix material 16 is applied to the reinforcing material 20 by any method known in the industry to form a prepreg. For example, but not limited to the present invention, if the reinforcement 20 is a woven glass fiber In the form of a fabric, the reinforcement 20 can be immersed in a bath containing a polymer matrix material 16 containing at least one inorganic filler 18, and subsequently pressed between a set of metering rollers to leave the measured bulk material 16 on it. In addition, it contains at least one inorganic filler ^ 53 This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297 mm) side (please read the precautions on the back before filling this page) * Installed.

*1T 經濟部中央標準局員工消費合作社印製 552831 五、發明説明（51 經濟部中央標準局員工消費合作社印製 2基體材料16可以業界已知之任—種方法噴霧於加強物。/、它施用包含無機填料18之聚合物基體材料16之法例如靜電塗覆及塗刷方法預期皆含括於本發明之範圍。燥預浸物14後，聚合物基體材料16典型例如通過乾機而至少部份硬化。用於此處「至少部份硬化」-詞表 =聚合物基體材料至少部份乾燥、冷卻及/或硬化。隨後，預浸物材料切成較小尺寸，以及若有所需，組合一或多声 :外二,物層。通常但非限制本發明，於習知積層“ :丄=峨切劉(或沖壓)至預定尺寸，二或多層切割了物層堆登在—起、積層及藉壓縮堆疊物例如於研於升高溫度及壓力下壓縮一段預定時間俾硬化且形成爲具有預定厚度之積層物叫如圖3所示) 詳’支撐件。根據本發明之形成積層物之方法容後根據本發明方法之非限制性實例中，填料18包含粒狀氣 :硼:用：嗣前處理而形成糊膏。然後糊膏分散於含:5 Γ二=固體之環氧樹脂(添加氮化觸糊膏之前)而形二二脂，以總固體爲基準，樹脂包含1财量比 /。重T比虱化硼。包含粒狀氮化硼分散於之=!:Γ織造玻璃纖維加強材料而形成預浸物層。 ^後預㈣層之環氧樹脂至少部対化。前處理氮化删，氮化硼更容易分散於環.氧樹脂、。現在參照圖2，顯示根據本發明之電子^件210之另— 非限制性具體實施例。電子支撐件210包含至少一種 (請先閲讀背面之注意事項再填寫本頁) i裝. *11 4 -54- 552831 A7 B7 五、發明説明（ 52 經濟部中央標準局員工消費合作社印製層214包含至少一種加強材料22〇以及至少一種基體材料216 其接觸該至少一種加強材料22〇之至少一部份。至少一層 2 17包含至少一種無機填料218係接觸該預浸物層214之至少一面例如預浸物層主面226之至少一部份224。雖然並非必要，但若有所需，至少一層217可設置於預浸物層214之至少一面226之一或多個選定部份上而形成至少部份層，或可大致上位於預浸物層214之至少一面226之大致全體表面上而形成大致連續填料層或平面218，容後詳述。該至少一種加強材料2 2 0包含前文討論用於本發明之電子支撐件之任一種加強材料2〇。非限制性具體實施例中，加強材料220爲玻璃纖維加強材料。另一非限制性具體實施例中，加強材料220爲織造玻璃纖維加強材料。另一非限制陘具體實施财，加㈣料22〇爲未去脂之樹脂相容性織造玻璃纖維加強材料。 ?卜二基體材料216可爲前文討論之任一種基體材料16, =含前文討論之任-種無機填料18。例如但非限制性，二:種力二材料22°可爲未去脂之樹脂相容性織造破璃纖基體材細爲環氧樹脂材料，以總固體爲基準威二Γ乳树脂材料及氮化棚合併總重之至多_。重量比 7T面體氮化硼。至里比層217包含前文討論之一或多種機塡實施例中，該至少-種無機填料⑴係選自：：植潤π劑、高導熱材料、低熱膨脹…、機固度親和力的材料、高電阻材料( “一屬離子具高句河确如前），及其組 ^-- (請先閲讀背面之注意事項再填寫本頁) 訂 d -55- 本紙張尺度適）Α4· ( 21〇><297公^ 552831* 1T Printed by the Consumers 'Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 552831 5. Invention Description (51 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 2 Printed on the base material 16 can be sprayed on the reinforcement by any method known in the industry. /, It is applied The methods of polymer matrix material 16 containing inorganic filler 18, such as electrostatic coating and brushing methods, are expected to be included in the scope of the present invention. After drying prepreg 14, polymer matrix material 16 is typically at least partially dried, such as by a dryer. Part hardening. Used herein "at least partially hardened"-glossary = polymer matrix material is at least partially dried, cooled, and / or hardened. Subsequently, the prepreg material is cut into smaller sizes, and if required, Combination of one or more sounds: outer two, physical layers. Usually, but not by way of limitation, in the present invention, ": 积 = 切切刘 (or stamping) to a predetermined size, two or more layers of cut objects stacked on top of each other Laminates and laminated stacks are compressed, for example, compressed for a predetermined period of time under elevated temperature and pressure, and are hardened and formed into a laminate with a predetermined thickness, as shown in Fig. 3). Details of the support member. In a non-limiting example of the method according to the present invention, the filler 18 contains granular gas: boron: pre-treated with rhenium to form a paste. The paste is then dispersed in an epoxy containing: 5 Γ di = solid Resin (before adding nitriding paste) and di-di-ester, based on the total solids, the resin contains a ratio of 1% by weight / T ratio of boron. It contains granular boron nitride dispersed in it! Weaving glass fiber reinforced materials to form a prepreg layer. ^ The epoxy resin of the post-pre-layer is at least partially cured. Pre-treatment nitriding, boron nitride is more easily dispersed in the epoxy resin. Now referring to FIG. 2, Shows another-non-limiting embodiment of the electronic part 210 according to the present invention. The electronic support part 210 contains at least one (please read the precautions on the back before filling this page). * 11 4 -54- 552831 A7 B7 V. Description of the invention (52 The printed layer 214 of the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs contains at least one reinforcing material 22 and at least one matrix material 216 which contacts at least a part of the at least one reinforcing material 22. At least one layer 2 17 contains at least one inorganic filler At least one side of the prepreg layer 214 is, for example, at least a portion 224 of the main surface 226 of the prepreg layer. Although not necessary, at least one layer 217 may be provided on at least one side 226 of the prepreg layer 214 if necessary. One or more selected portions form at least a partial layer, or may be located on substantially the entire surface of at least one side 226 of the prepreg layer 214 to form a substantially continuous filler layer or plane 218, which will be described in detail later. The at least one reinforcing material 2 2 0 includes any of the reinforcing materials 20 discussed above for the electronic support of the present invention. In a non-limiting embodiment, the reinforcing material 220 is a glass fiber reinforcing material. Another non-limiting specific implementation In the example, the reinforcing material 220 is a woven glass fiber reinforcing material. Another non-limiting specific implementation is to add material 22 as a resin-compatible woven glass fiber reinforced material without degreasing. • The second base material 216 may be any of the base materials 16 discussed previously, including any of the inorganic fillers 18 discussed previously. For example, but not limitative, the second material: 22 ° can be a non-greased resin-compatible woven glass-fiber-reinforced base material made of epoxy resin, and the total solids are used as the basis. The total weight of the shed consolidation is at most _. Weight ratio 7T isahedron boron nitride. The liberty layer 217 includes one or more of the organic compounds discussed in the foregoing. In the embodiment, the at least one inorganic filler is selected from the group consisting of: phytowetting agent, high thermal conductivity material, low thermal expansion ..., material with organic affinity, High-resistance materials ("A ionic Gaojuhe is exactly the same as before") and its group ^-(Please read the precautions on the back before filling this page) Order d -55- This paper is suitable for size) Α4 · (21 〇 > < 297 male ^ 552831

合及混合物。 (請先閲讀背面之注意事項再填寫本頁} 之發明之非限制性具體實施例中，其中該至少一種無機眞料2 1 8爲至少-種典機固體潤滑劑，無機固體潤滑劑係選自六面體氮化爛、金屬二硫屬化物、爛酸、氧化銻、滑石及其混合物。另-非限制性具體實施例中，無機固體潤滑劑馬非可水合錢㈣潤滑劑爲具有層狀結構之非可水合無機固體潤滑劑(討論如前）。又另一非限制性具體實施例中，具有層狀結構之非可水合無機固體潤滑劑爲六面體氮化石朋。、本發明之另一非限制性具體實施例中-，其中該至少一種秩機填料218爲高導熱材料，高導熱材料係選自六面體氮化删、氮化鋁、石墨及其混合物。另一非限制性具體實施例中，高導熱材料具有熱傳導係數至少3〇 w/mK。本發明之又另一非限制性具體實施例中，具有熱傳導係數至少％ W/mK之高導熱材料爲六面體氮化硼。本發明之非限制性具體實施例中，其中至少一種無機填料218爲低熱膨脹材料，該低熱膨脹材經濟部中央標準局員工消費合作社印製爛、_石、欽酸銘及其混合物。另一非限制性例中，低熱膨脹材料具有熱膨脹係數於〇〇C至2〇〇c>c之溫度範圍不大於l〇〇x1〇-VC。又另一非限制性具體實施例：，低熱膨脹材料具有熱膨脹係數於—〇。〇至2〇〇。〇之溫度範圍不大於5〇x1(r7rC。本發明之非限制性具體實施例中熱膨脹材料爲六面體氮化砸1。本發明之非限制性具體實施例中，其中該至少一種無機 -56- 本紙張尺度適用中國國家標準（CNS )八4規格（210X297公釐） 54 54 經濟部中央標準局員工消費合作社印製 552831 五、發明説明（填料218爲-種對金屬離子具高度親和力的材料，該有CEC至少20毫當量/1GG克，以及於另—非限二例中具有CEC至少80毫當量/1〇〇克。另— 八把貫抵例中，對全屬論+ 1上命. ^限制性具體實施例中對五屬離子具商度親和力之填料具有κ“ 至卜 600毫升/克’及另一非限制性具體實施例爲至少⑽/ 克，以及另-非限制性具體實施例爲至少15，嶋毫毛以及另-非限制性具體實施例爲至少如屬毫升/克。對丄屬離子具高度親和力之填料之非限制性實例包括但二蒙脱土、經石、琶土、膨潤土、水輝石、水合雲母、珍鐵石、亞氣酸鹽、美國活性白土、多孔石夕酸鹽、合成: 母及其混合物。—非限制性具體實施例中可膨脹合成本：雲母爲鈉氟卸石。-非限制性具體實施例中，多孔石夕酸睡爲有機官能化多孔矽酸鹽。 ^ 匕本發明之另一非限制性具體實施例中，該至少一種無㈣218/螯合劑選自帶有含氮有機官能基、含硫有機官能基、含氧有機官能基、含磷有機官能基或其組合之材料。本發明之非限制性具體實施例中，纟中該至少一種益機爲高電阻材料，該高電阻材料係選自氮化硼、滑石、雲母及其混合物。一非限制性具體實施例中，該高電 ^材有電阻係數至少1000微歐-厘米。雖然非限制性， “恤實犯例中，茲具有電阻係數至少1〇〇〇微歐-厘米之高電阻材料爲六面體氮化硼。 ^發明之又另一非限制性具體實施例中，該至少一種無機％料218具有摩氏硬度値不大於該至少一種加強材料22〇 57- 本紙張尺度適用中國國家標準（CNS ) A4規格（2似297公釐 (請先閲讀背面之注意事項再填寫本頁} 訂 4 552831 A7 B7 五、發明説明 55 經濟部中央標準局員工消費合作社印裂之摩氏硬度値。另一非限制性具體實施例中，該至少一種無機填料218具有摩氏硬度値不大於6 ^雖然非限制本發明，於一具體實施例中，該具有摩氏硬度値不大於6之無機填料218爲六面體氮化硼。雖然非限制性，但該至少一層217之至少一種無機填料 218以，總固體爲基準，係佔基體材料216與至少一層217之人併總重之5%重量比至35%重量比。一非限制性具體實施例中，以總固體爲基準，該至少一種無機填料218係佔基體材料2 16與至少一層217之10%重量比至30%重量比。又另一非限制性具體實施例中，以總固體爲基準·，該至少一種無機 %料2 1 8係佔基體材料2 16與至少一層2 17之12%重量比至 28%重量比。層217除前文討論之無機填料外進一步包含其它材料。例如但非限制本發明，層217包含有機潤滑劑如聚四氟乙烯及硬脂酸酯類（如硬脂酸鋅）；粒狀有機填料如橡膠粒子；及黏著材料（容後詳述）。雖然非限制性，本發明之一具體實施例中，該至少一層 217以總固體爲基準包含佔至少一層2 17總重之不大於2 5 〇/。重量比之黏著性材料。另一非限制性具體實施例中，以總固體爲基準該至少一層2 1 7包含佔該至少一層2 1 7總重之不大於10%重量比之黏著性材料。另一非限制性具體實施例中，以總固體爲基準該至少一層2 1 7包含佔該至少一層2 17 總重之不大於5%重量比之黏著性材料。用於此處「黏著性材料」一詞表示添加至層217而支援層217與其它材料例如 -58- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ----- --------裳— (請先閲讀背面之注意事項再填寫本頁〕訂- d 552831 A7 B7 五、發明説明（經濟部中央標準局員工消費合作社印製其它預浸物層或導電層之黏合的聚合物料。黏著性材料可具有如基體材料216的相同組成或具有不同的化學組成。業界人士了解黏著性材料摻混於層217，比較包含層217 但其大致上不含此種黏著性材料之預浸物層，可提高預浸物層214之總樹脂（聚合物）含量。此種總樹脂含量的增高= 結合預浸物層之電子支撐件性質有害。結果，雖然^限制性，但若黏著性材料摻混於層217，則黏著性材料及聚合物基知:材料2 16之用量須碉整爲預浸物層2丨4之總樹脂含量（以總固體爲基準，基於加強材料22〇、聚合物基體材料216及層2 17的合併總重）係於25%至45%重量比之範圍。一非限制性具m貫施例中，黏著性材料及聚合物基體材料2 16之用量係調整成預浸物層2 14之總樹脂含量係於28至42%重量比之範圍。本發明之另一非限制性具體實施例中，層2丨7大致上不含黏著性材料。用於此處「大致不含黏著性材料」一詞表示以總固體爲基準，層217包含佔該至少一層2 17總重之不大於0· 1%重量比之黏著性材料，且較佳不含黏著性材料。容後詳述，電子支撐件210之預浸物層214可爲第一預浸物層’電子支携:件21 〇進一步包含至少一層額外預浸物層 (未示於圖2但示於圖3)積層至第一預浸物層214之至少一部份。本發明之一非限制性具體實施例中，至少一層217係位在至少一層額外預浸物層與第一預浸物層214間而形成積層物。另一非限制性具體實施例中，第一預浸物層及額外預 )受物層係組合而造成層217至少部份暴露出。 -59- 本紙張尺度適用中國國家標準（CNS ) A4規格（210><297公釐） (請先閱讀背面之注意事項再填寫本頁) i装- 訂 4 552831 A7 ____B7 五、發明説明（57) 若有所需但非必要，導電材料（未顯示於圖2)也可位於電子支撐件210之至少一外表上，容後詳述，至少一電路可形成於導電材料。雖然非限制性，但一具體實施例中，該至少一層217係位於預浸物層214之第一面226之至少一部份上，以及導電材料係位在預浸物層214之第二對側面228之至少一部份上。若有所需但非必要，電子支撐件21 〇進一步包含至少一孔口至少部份伸展貫穿電子支撐件，容後詳述。現在對形成電子支撐件210之非限制性方法做一般性討論。再度參照圖2，包含至少一種基體材料2丨6以及至少一種加強材料220之預浸物層214係以習知方式形成，該至少一種基體材料216至少部份硬化。隨後至少部份基體材料 216之至少一部份被至少部份溶劑合，以及至少一種無機填料218黏著至該至少部份溶劑合之聚合物基體材料226之至少一邵份而形成至少一層217。若有所需，額外基體材料層及/或無機填料層218 (圖中未顯示）隨後可施用且添加至層 2 17且至少部份硬化，如前文討論。然後預浸物進一步處理成爲積層物，討論如後。經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 本發明之非限制性具體實施例中，於預浸物層2丨4至少部份硬化後，包含至少一層無機填料218及至少一層217可藉噴霧氣霧劑而黏著於預浸物層2U之至少一面226之至少一邵份224上，氣霧劑包含至少一種無機·填料218及推進劑，以及右有所需，包含於該至少一種聚合物基體材料相容之溶劑。適合用於本發明之無機填料之氣霧劑形式之非限制 -60- 本紙張尺度適用中國國家標準（CNS ) (之似巧公缝- 552831 經濟部中央標準局員工消費合作社印製 A7 ___ B7五、發明説明（58 ) ^ ~ 性實例爲氮化硼氣霧劑潤滑劑其含有氮化硼、丙鋼及推進劑’市面上可得自田納西州橡樹脊ZYP塗層公司。另外，雖然非限制本發明，但包含至少一種無機填料218 之至少一層217可藉將預浸物層214於包含至少一種溶劑及至少一種無機填料21 8之溶劑浴槽内浸塗而被施用至預浸物層2 14之至少一面226之至少部份224上。例如雖然非限制性，預浸物層214可至少部份浸沒於溶劑浴槽，該溶劑浴槽包含至少一種與該至少一種聚合物基體材料216及至少一種無機填料218相容的溶劑；由浴槽中去除然後乾燥而形成預次物層214，其包含至少一種部份層217係位在其至少一面 226之至少一部份224上。用於形成層2 17之前述方法之較佳溶劑包括但非限於可與用以形成預浸物層214之至少一種聚合物基體材料216相容的/谷劑。雖然非受任何特定理論所限，預期經由使用此種 ’合^$預次物層接觸溶劑時，由於至少一種聚合物基體材料216足邵分溶劑合作用而讓預浸物表面變成沾黏性，藉此有助於至少一種無機填料黏著至預浸物表面。此外，預期乂此種方式讓預浸物層表面變成沾黏性可經由減少預浸 2層堆疊時的滑動而輔助預浸物層的積層。業界人士了解 ♦劑的選擇將依據若干因數決^，此等因數例如但非限於用於元成預物之聚合物基體；^料2 16及溶劑合之預定量。2於包3聚合物基體材料（其包含環氧·樹脂）之預浸物之溶 >非限制性貫例包括丙酮、二甲基甲醯胺（DM。、二氣甲k _醇酸類如甲氧異丙醇、其它酮類如異丁酮（ΜΕκ) ----—— ~ 61 - 本紙張 (請先閲讀背面之注意事項再填寫本頁} -裝· -訂 d 經濟部中央標準局員工消費合作社印製 552831 五、發明説明（59 及其混合物。雖炊v 物基體材料(例如環氧樹仁^/合槽可進-步包含聚合及其它加工助劑例如二)插黏者性材料、粒狀有機填料川如至广種無機填料218之分散劑。業界料2 i 6產生合預及數量可經控制而對指定聚合物基體材枓216產生預足溶劑合程度。雖然並非必要，彳e矣古$ 仁右有所茜，預浸物層214之部分表面於 “ 以"界已知之任_種方式遮蓋以防至少—種益機填料218黏附於罩蓋區。例如但非限制本發明，於施用益機填料218之前可施用遮蔽帶至預浸物214表面226之選定部份以防層217之無機填料218黏著至預浸物表面之選定部份。此外，任何或全郅預浸物層214表面可至少部份或全然塗覆以至少一種典機填料218而形成連續面或連續層217。根據本發明形成電子支撐件21〇之另一非限制性方法中， p亥至V、種水合物基體材料2丨6可施用至至少一種加強材料 220，然後包含至少一種無機填料218之至少一層217可趁聚合物仍然沾黏時，換言之，如前文討論至少部份硬化該至 V 種水合物基體材料216之前，施用至預浸物層2 14之至少一面226之至少一部份224上。無機填料21 8例如可趁聚合物基體材料216至少部份沾黏期間，藉噴霧或吹送填料218 至表面226之該部份224上，或靜電沉積填料218於表面226 之邵分224上。若有所需，聚合物基體材料及/或無機填料 218 (圖中未顯示）之額外層隨後可施用·於該層217上且至少邵份硬化。然後預浸物進一步處理成爲積層物，容後詳述0 -62- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X29*7公釐）礴 (請先閱讀背面之注意事項再填寫本頁) -裝· 訂經濟部中央標準局員工消費合作社印製 552831 A7 B7 五、發明説明（6〇 ) 現在參照圖3，顯示電子支撐件310包含一種積層物312其包含第一預浸物層314、第二預浸物層315毗鄰第一預浸物層3 14之表面326、以及至少一層317包含至少一種無機填料 31 8介於第一預浸物層314與第二預浸物層315間。本發明之非限制性具體實施例中且如前文討論，以總固體爲基準，該至少一層317包含佔該至少一層總重不大於25%重量比之黏著性材料。非限制性具體實施例中，至少一層3丨7大致不含黏著性材料。雖然非限制本發明，如圖3所示，積層物3丨2之第一預浸物層314包含至少一種加強材料32〇，至少一種聚合物基體材料3 16 ’其係接觸該至少一種加強材料320之至少一部份，以及該至少一層317包含至少一種無機填料318位在預次物層314之表面326之至少一部份324上；以及第二預浸物層3 15包含至少一種加強材料321、至少一種聚合物基體材料336其係接觸該至少一種加強材料321之至少一部份。雖然並非必要，但於本發明之非限制性具體實施例中，加強材料320及321爲相同，聚合物基體材料316及336爲相同。雖然並非必要，但若有所需，預浸物層3丨5可包含一層 (未顯示於圖3)類似預浸物314之層317之層而施用於&浸物層315之至少一面之至少部份上。業界人士須了解積層物 3 12進一步包含一或多層額外預浸-物層（圖中未顯示），且該一或多額外預浸物層若有所f可進一步包含_或多層類似層3 17之層。根據本發明之呈積層物形式之電子支撐件之非限 —'1 .—- - - 63 - 本紙張尺度顧中國國家標準（CNS ) A4規 (請先閲讀背面之注意事項^^寫本頁) 訂 552831 五、發明説明（61 體實施例中，積；你—人該包冬至少一種：祕匕3夕層預浸物層積層在-起，因此鄰預二物：料之至少一層係位在該至少-對破 t , ^.. , ^ ^ 刀間。另一非限制性具體實施例 τ ’積層物包含多層；pg、、3 ^ A u 夕層預反物層積層在一起，故包本至少一種然機填料之至少一爲7 ° 層係位在毗鄭各對預浸物層之至少一邵份間。胃 a/ =照=3’本發明之非限制性具體實施例中，積層物包含夕曰預、浸物，纟中一或多予員浸物層3 14包含至少一層317其乙各至少一種雒機填料318接觸預浸物之至少一面326之至少一邵份324，及/或一或多預浸物層315其包含至少一種加強材料321及至少一種聚合物基體材料336其包含至少一種無機填料319接觸加強材料321之至少一部份，討論如前。另非限制性具體實施例中，積層物包含至少一預浸物層，其包含至少一層其包含至少一種無機填料接觸該預浸物之至少一面之至少一部份，以及至少一種加強材料以及至少一種聚合物基體材料其包含至少一種無機填料接觸加強材料之至少一部份。又另一具體實施例中，積層物包含一或多預浸物層其除了前文討論之預浸物層外大致不含無機填料。經濟部中央標準局員工消費合作社印製現在參照圖2及3，前述形成呈預浸物層214及積層物312 形式之電子支撐件210、3 10之方4去相信較爲有益，原因在於該等方法允許至少一層217、317包含至少一種無機填料 218、3 18被摻混入電子支撐件210、3 10而於浸潰加強材料 220、320之前無需將高容積分量的無機填料直接混合至聚 -64- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公t ) 552831 A7 B7Mix and mix. (Please read the precautions on the back before filling out this page} In the non-limiting specific embodiment of the invention, the at least one inorganic filler 2 1 8 is at least-a typical machine solid lubricant, and the inorganic solid lubricant is selected Hexahedron rotten, metal dichalcogenide, rotten acid, antimony oxide, talc, and mixtures thereof. In another non-limiting embodiment, the inorganic solid lubricant, mafic hydrate, can be used as a lubricant. Non-hydratable inorganic solid lubricant with a structure (discussed as before). In another non-limiting embodiment, the non-hydratable inorganic solid lubricant having a layered structure is a hexahedron nitride. In another non-limiting specific embodiment, wherein the at least one rank filler 218 is a highly thermally conductive material selected from the group consisting of hexahedron nitride, aluminum nitride, graphite, and mixtures thereof. In a restricted embodiment, the highly thermally conductive material has a thermal conductivity of at least 30 w / mK. In yet another non-limiting embodiment of the present invention, the highly thermally conductive material with a thermal conductivity of at least% W / mK is a hexahedron nitrogen Boron. In a non-limiting specific embodiment of the present invention, at least one of the inorganic fillers 218 is a low thermal expansion material, and the low thermal expansion material is printed by rotten stone, stone, acetic acid, and mixtures thereof in the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. In another non-limiting example, the low-thermal-expansion material has a temperature range of thermal expansion coefficient of OOC to 2000c> c not more than 100x10-VC. Yet another non-limiting specific embodiment :, low The thermal expansion material has a thermal expansion coefficient in the range of -0.0 to 2000. The temperature range is not more than 50x1 (r7rC. In a non-limiting specific embodiment of the present invention, the thermal expansion material is a hexahedron nitride. 1. The present invention In a non-limiting specific embodiment, wherein the at least one inorganic-56- size of this paper is applicable to the Chinese National Standard (CNS) 8-4 specifications (210X297 mm) 54 54 printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 552831 Description of the invention (Filler 218 is a material with a high affinity for metal ions, which has a CEC of at least 20 milli-equivalents / 1GG grams, and in another non-limiting example, has a CEC of at least 80 milli-equivalents / 10 G. In addition-in the eight consecutive examples, +1 to genus theory. ^ Restrictive specific examples of fillers with affinity for five ions have κ "to 600 ml / g 'and another Non-limiting specific examples are at least ⑽ / g, and other-non-limiting specific examples are at least 15, 嶋毛 and other-non-limiting specific examples are at least as per milliliter / gram. There is a high degree of sacral ions Non-limiting examples of affinity fillers include but montmorillonite, warp stone, palyolite, bentonite, hectorite, hydrated mica, precious iron stone, argonite, American activated white clay, porous petrolite, synthetic: And mixtures thereof.-Swellable synthetic compounds in non-limiting specific examples: Mica is sodium fluorite.-In non-limiting specific examples, porous rosic acid is an organic functional porous silicate. ^ In another non-limiting specific embodiment of the present invention, the at least one pyrene-free 218 / chelating agent is selected from the group consisting of a nitrogen-containing organic functional group, a sulfur-containing organic functional group, an oxygen-containing organic functional group, and a phosphorus-containing organic functional group. Or a combination of materials. In a non-limiting specific embodiment of the present invention, the at least one beneficial device in 纟 is a high-resistance material selected from the group consisting of boron nitride, talc, mica, and mixtures thereof. In a non-limiting embodiment, the high-electricity material has a resistivity of at least 1,000 micro-ohm-cm. Although non-limiting, "In a practical example, a high-resistance material having a resistivity of at least 1,000 microohm-cm is hexahedron boron nitride. ^ In yet another non-limiting specific embodiment of the invention The at least one inorganic material 218 has a Mohs hardness 値 not greater than the at least one reinforcing material 2257- This paper size applies to Chinese National Standard (CNS) A4 specifications (2 like 297 mm (please read the precautions on the back first) Refill this page} Order 4 552831 A7 B7 V. Description of the invention 55 Mohs hardness 値 printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. In another non-limiting embodiment, the at least one inorganic filler 218 has Mohs The hardness 値 is not more than 6 ^ Although not limiting the present invention, in a specific embodiment, the inorganic filler 218 having a Mohs hardness 値 is not more than 6 is a hexahedron boron nitride. Although non-limiting, the at least one layer 217 The at least one inorganic filler 218 is based on the total solids, and accounts for 5% to 35% by weight of the total weight of the base material 216 and at least one layer 217. In a non-limiting specific embodiment, the total solids for On the basis, the at least one inorganic filler 218 accounts for 10% to 30% by weight of the base material 2 16 and at least one layer 217. In yet another non-limiting specific embodiment, based on the total solids, the at least one The inorganic material 2 1 8 accounts for 12% to 28% by weight of the base material 2 16 and at least one layer 2 17. The layer 217 further includes other materials in addition to the inorganic fillers discussed above. For example, but not limited to the present invention, the layer 217 contains organic lubricants such as polytetrafluoroethylene and stearates (such as zinc stearate); granular organic fillers such as rubber particles; and adhesive materials (described in detail later). Although not limiting, the present invention In a specific embodiment, the at least one layer 217 is based on the total solids and contains at least one layer 2 17 with a total weight of not more than 2 5 0 /. A weight ratio of adhesive material. In another non-limiting specific embodiment, the total The solid is used as a basis. The at least one layer 2 1 7 comprises an adhesive material that accounts for not more than 10% by weight of the total weight of the at least one layer 2 1 7. In another non-limiting embodiment, the at least one layer 2 is based on a total solid 1 7 contains the at least one layer 2 17 Adhesive material with a total weight of not more than 5% by weight. The term "adhesive material" used here means added to layer 217 while supporting layer 217 and other materials such as -58- This paper size applies Chinese national standards (CNS) A4 specification (210X297 mm) ----- -------- Shang— (Please read the notes on the back before filling this page] Order-d 552831 A7 B7 V. Description of the invention (Economic The Ministry of Standards and Standards Bureau staff consumer cooperatives print other polymer materials that are prepreg layers or conductive layers. Adhesive materials may have the same composition as the base material 216 or have different chemical compositions. People in the industry understand that the adhesive material is blended in the layer 217. Comparing the prepreg layer that includes the layer 217 but does not substantially contain such an adhesive material, the total resin (polymer) content of the prepreg layer 214 can be increased. This increase in total resin content = the nature of the electronic support in combination with the prepreg layer is detrimental. As a result, although restrictive, if the adhesive material is blended in the layer 217, the adhesive material and the polymer base know that the amount of material 2 16 must be adjusted to the total resin content of the prepreg layer 2 丨 4 The total solids are based on the combined total weight of the reinforcing material 22, the polymer matrix material 216, and the layer 2 17) in the range of 25% to 45% by weight. In a non-limiting embodiment, the amount of the adhesive material and the polymer matrix material 2 16 is adjusted so that the total resin content of the prepreg layer 2 14 is in the range of 28 to 42% by weight. In another non-limiting embodiment of the present invention, the layers 2-7 are substantially free of an adhesive material. As used herein, the term "substantially free of adhesive materials" means that based on the total solids, the layer 217 contains an adhesive material that accounts for not less than 0.1% by weight of the total weight of the at least one layer 2 17 and is preferably not Contains adhesive materials. As described in detail later, the prepreg layer 214 of the electronic support 210 may be the first prepreg layer. The electronic support: the component 21 〇 further includes at least one additional prepreg layer (not shown in FIG. 2 but shown in the figure). 3) Laminate to at least a part of the first prepreg layer 214. In one non-limiting embodiment of the present invention, at least one layer 217 is positioned between at least one additional prepreg layer and the first prepreg layer 214 to form a laminate. In another non-limiting embodiment, the first prepreg layer and the additional pre-receiver layer system are combined to cause at least a portion of the layer 217 to be exposed. -59- This paper size applies Chinese National Standard (CNS) A4 specification (210 > < 297mm) (Please read the precautions on the back before filling this page) i-booking-order 4 552831 A7 ____B7 V. Description of the invention ( 57) If necessary but not necessary, a conductive material (not shown in FIG. 2) may also be located on at least one surface of the electronic support 210. As detailed later, at least one circuit may be formed on the conductive material. Although not limiting, in a specific embodiment, the at least one layer 217 is located on at least a portion of the first surface 226 of the prepreg layer 214, and the conductive material is located on the second pair of the prepreg layer 214 On at least a portion of side 228. If necessary but not necessary, the electronic support member 21 further includes at least one aperture extending at least partially through the electronic support member, which will be described in detail later. A non-limiting method of forming the electronic support 210 is now discussed generally. Referring again to FIG. 2, a prepreg layer 214 including at least one base material 2 6 and at least one reinforcing material 220 is formed in a conventional manner, and the at least one base material 216 is at least partially hardened. Subsequently, at least a portion of at least a portion of the matrix material 216 is at least partially solvated, and at least one inorganic filler 218 is adhered to at least a portion of the at least partially solvated polymer matrix material 226 to form at least one layer 217. If desired, an additional matrix material layer and / or an inorganic filler layer 218 (not shown) can then be applied and added to layer 2 17 and at least partially hardened, as discussed previously. The prepreg is then further processed into a laminate, discussed later. Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page) In a non-limiting specific embodiment of the present invention, after the prepreg layer 2 丨 4 is at least partially hardened, it contains at least A layer of inorganic filler 218 and at least one layer 217 can be adhered to at least one portion 224 of at least one side 226 of the prepreg layer 2U by spraying an aerosol. The aerosol contains at least one inorganic filler 218 and a propellant, and the right It is desirable to include a solvent compatible with the at least one polymer matrix material. Non-restrictive aerosol form suitable for the inorganic fillers of the present invention-60- This paper size applies to Chinese National Standards (CNS) (Similarly Coarse Seam-552831 Printed by Staff Consumer Cooperative of Central Bureau of Standards, Ministry of Economic Affairs A7 ___ B7 V. Description of the invention (58) A practical example is a boron nitride aerosol lubricant containing boron nitride, propylene steel, and a propellant, which are commercially available from the Oak Ridge ZYP Coating Company of Tennessee. In addition, although non- The invention is limited, but at least one layer 217 comprising at least one inorganic filler 218 can be applied to the prepreg layer 2 by dip coating the prepreg layer 214 in a solvent bath containing at least one solvent and at least one inorganic filler 21 8 14 on at least part 224 of at least one side 226. For example, although not limiting, prepreg layer 214 may be at least partially immersed in a solvent bath, the solvent bath containing at least one and the at least one polymer matrix material 216 and at least one Inorganic filler 218 compatible solvent; removed from the bath and dried to form a pre-product layer 214 that includes at least one partial layer 217 on at least a portion 224 of at least one side 226 thereof Preferred solvents for the aforementioned methods for forming layer 2 17 include, but are not limited to, cereals / cereals compatible with at least one polymer matrix material 216 used to form prepreg layer 214. Although not limited by any particular theory It is expected that when using such a composite layer to contact the solvent, the surface of the prepreg will become sticky due to the cooperation of at least one polymer matrix material 216, which will help at least one The inorganic filler adheres to the surface of the prepreg. In addition, it is expected that this method will make the surface of the prepreg layer tacky and can assist the prepreg layer buildup by reducing the slippage when the prepreg 2 is stacked. The industry understands ♦ The choice of agent will be determined based on a number of factors such as, but not limited to, the polymer matrix used in the preform; the material 2 16 and the predetermined amount of solvent. 2 The polymer matrix material (including Epoxy · Resin) Prepreg Solution > Non-limiting examples include acetone, dimethylformamide (DM.), Dimethyl formaldehyde alkyds such as methoxyisopropanol, other ketones such as isopropyl Butanone (ΜΕκ) -------- ~ 61-Paper ( Read the notes on the back before filling out this page} -Installation · -Order d Printed by the Consumers Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 552831 5. Invention Description (59 and its mixtures. Although the base material of the cooking material (such as epoxy tree kernels) ^ / Combination tank can further-include polymerization and other processing aids such as 2) sticking material, granular organic filler Chuan Ruzhi wide variety of inorganic filler 218 dispersant. Industry materials 2 i 6 produce a pre-determined amount It can be controlled to produce a pre-solvent degree of solvation for the specified polymer matrix 枓 216. Although not necessary, 彳 e 矣矣矣矣右右右右茜茜, part of the surface of the prepreg layer 214 is known to Cover in any way to prevent at least one kind of organic filler 218 from sticking to the cover area. For example, without limitation, the invention, a masking tape may be applied to a selected portion of the surface 226 of the prepreg 214 before applying the beneficial filler 218 to prevent the inorganic filler 218 of the layer 217 from adhering to a selected portion of the prepreg surface. In addition, the surface of any or all of the prepreg layer 214 may be at least partially or fully coated with at least one typical filler 218 to form a continuous surface or continuous layer 217. In another non-limiting method of forming the electronic support member 210 according to the present invention, pH to V, a hydrate matrix material 2 and 6 may be applied to at least one reinforcing material 220, and then include at least one layer of at least one inorganic filler 218 217 may be applied to at least a portion 224 of at least one side 226 of the prepreg layer 2 14 before the polymer is still tacky, in other words, as discussed previously before at least partially hardening the to-V hydrate matrix material 216. For example, the inorganic filler 218 may be sprayed or blown onto the portion 224 of the surface 226 while the polymer matrix material 216 is at least partially adhered, or the electrostatically deposited filler 218 is deposited on the surface 226 of the component 224. If desired, additional layers of polymer matrix material and / or inorganic filler 218 (not shown) can then be applied to this layer 217 and at least partly hardened. Then the prepreg is further processed into a laminate, which will be detailed later. 0 -62- This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X29 * 7mm) 礴 (Please read the precautions on the back before filling this page )-Binding Printed by the Consumers Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 552831 A7 B7 V. Description of the Invention (60) Now referring to FIG. 3, it is shown that the electronic support 310 includes a laminate 312 including a first prepreg layer 314 The second prepreg layer 315 is adjacent to the surface 326 of the first prepreg layer 314, and at least one layer 317 contains at least one inorganic filler 3118 between the first prepreg layer 314 and the second prepreg layer 315 . In a non-limiting specific embodiment of the present invention and as previously discussed, the at least one layer 317 includes an adhesive material that accounts for not more than 25% by weight of the total weight of the at least one layer based on the total solids. In a non-limiting embodiment, at least one layer 3 7 is substantially free of adhesive material. Although the present invention is not limited, as shown in FIG. 3, the first prepreg layer 314 of the laminate 3 丨 2 includes at least one reinforcing material 32 0, and at least one polymer matrix material 3 16 ′ is in contact with the at least one reinforcing material. At least a portion of 320, and the at least one layer 317 includes at least one inorganic filler 318 on at least a portion 324 of the surface 326 of the pre-layer 314; and the second prepreg layer 3 15 includes at least one reinforcing material 321. At least one polymer matrix material 336 is in contact with at least a portion of the at least one reinforcing material 321. Although not necessary, in a non-limiting embodiment of the present invention, the reinforcing materials 320 and 321 are the same, and the polymer matrix materials 316 and 336 are the same. Although not necessary, if necessary, the prepreg layer 3 丨 5 may include a layer (not shown in FIG. 3) similar to the layer 317 of the prepreg 314 and applied to at least one side of the & immersion layer 315. At least in part. People in the industry must understand that the laminate 3 12 further includes one or more additional prepreg layers (not shown in the figure), and the one or more additional prepreg layers may further include _ or multiple similar layers 3 17 Of layers. The non-limitation of electronic support in the form of a laminate according to the present invention—'1 .—---63-This paper is based on China National Standard (CNS) A4 regulations (please read the precautions on the back first ^^ write this page) ) Order 552831 V. Description of the invention (in the 61 embodiment, there is at least one kind of package: you-people should pack at least one: the secret dagger 3 tier prepreg layer-up layer, so the next two predecessors: at least one layer of material Located between the at least-pairs of t, ^ .., ^ ^ knife. Another non-limiting specific embodiment τ 'layers include multiple layers; pg ,, 3 ^ A u layer and pre-reflectors are layered together, so At least one of the at least one organic filler is a 7 ° layer that is located between at least one portion of each pair of prepreg layers. Stomach a / = 照 = 3 'In a non-limiting specific embodiment of the present invention The laminate contains prepreg and immersion, one or more of the immersion layers 3 14 contains at least one layer 317 and each at least one concrete filler 318 contacts at least one side 326 of the prepreg 324 at least one portion 324 And / or one or more prepreg layers 315 comprising at least one reinforcing material 321 and at least one polymer matrix material 336 including At least one inorganic filler 319 contacts at least a portion of the reinforcing material 321, as discussed above. In another non-limiting embodiment, the laminate includes at least one prepreg layer including at least one layer that includes at least one inorganic filler in contact with the At least a portion of at least one side of the prepreg, and at least one reinforcing material and at least one polymer matrix material comprising at least one inorganic filler contacting at least a portion of the reinforcing material. In yet another embodiment, the laminate includes One or more prepreg layers are substantially free of inorganic fillers except for the prepreg layer discussed above. Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs Now referring to Figures 2 and 3, the aforementioned formation is a prepreg layer 214 and a laminate. It is believed that the electronic support members 210, 3 and 10 in the form of object 312 are more beneficial because these methods allow at least one layer 217, 317 containing at least one inorganic filler 218, 3 18 to be incorporated into the electronic support members 210, 3 10 Before impregnating the reinforcing materials 220 and 320, it is not necessary to directly mix the high volume inorganic filler to poly-64. This paper is applicable to China. Home standard (CNS) A4 specification (210X297 male t) 552831 A7 B7

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552831 A7 B7 五、發明説明（63 經濟部中央標準局員工消費合作社印裝包含積層物3 12其包含預浸物層314、315積層在一起的堆疊；及一層3 17包含潤滑劑。如前文討論，層3 17係位於該預浸物層堆疊之至少一對毗鄰預浸物層間，或位於沿支撐件之外邵主面之至少一主面。用於此處「堆疊」一詞表示至少二物項，例如預浸物層、積層物、電子支撐件等呈疊置關係排列因而形成此種物項的堆疊。雖然非侷限於此，一具體實施例中，層3 17包含潤滑劑，以及以總固體爲基，進一步包含佔該層總重不大於25%重量比之黏著性材料。潤滑劑包括但非限於無機固體潤滑劑及有機潤滑劑。無機固體潤滑劑包括但非限於六面體氮化硼、硼酸、二硫化銷、石墨及其混合物。有機潤滑劑包括但非限於聚四氣乙晞、硬脂酸鋅及其混合物。現在概略說明特別適合用於機械鑽孔操作之形成電子支撐件之非限制性方法。該方法包含施用潤滑劑材料至第一預浸物層之至少一主面之至少部份上而形成潤滑劑層，堆疊第一預浸物層於一或多層額外預浸物層，故潤滑劑層係位於第一預浸物層與該一或多層額外預浸物層之至少二層間而形成内部潤滑劑層，以及堆疊第一預浸物層及二戈^ 層額外預浸物層而形成電子支撐件。雖然並非必要，但= 有所需，一或多層額外預浸物層之一或多者可包含潤滑= 層位在其至少一面之至少部份上1 根據本發明形成呈積層物形式之電子支撐件之方、、一具體實施例中，無機填料可直接施用至加強材 == 邵份，及然後聚合物基體材料施用於其上。例如，雖^非 (請先閲讀背面之注意事項再填寫本育) :裝. 訂552831 A7 B7 V. Description of the invention (63 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs, including laminates 3 12 which includes prepreg layers 314, 315 stacked together; and a layer 3 17 containing lubricants, as discussed earlier Layer 3 17 is located between at least one pair of adjacent prepreg layers of the prepreg layer stack, or at least one main surface along the main surface outside the support. The term "stacked" used herein means at least two Items such as prepreg layers, laminates, electronic supports, etc. are arranged in a stacked relationship to form a stack of such items. Although not limited to this, in a specific embodiment, layers 3 to 17 include a lubricant, and Based on the total solids, further comprising an adhesive material that accounts for not more than 25% by weight of the total weight of the layer. Lubricants include, but are not limited to, inorganic solid lubricants and organic lubricants. Inorganic solid lubricants include, but are not limited to, hexahedron Boron nitride, boric acid, disulfide pins, graphite, and mixtures thereof. Organic lubricants include, but are not limited to, polytetramethane, zinc stearate, and mixtures thereof. The general description is now particularly suitable for mechanical drilling A non-limiting method for forming an electronic support. The method includes applying a lubricant material to at least a portion of at least one main surface of the first prepreg layer to form a lubricant layer, and stacking the first prepreg layer on the One or more additional prepreg layers, so the lubricant layer is located between at least two layers of the first prepreg layer and the one or more additional prepreg layers to form an internal lubricant layer, and the first prepreg layer is stacked And two extra layers of prepreg to form an electronic support. Although not necessary, = required, one or more of the one or more additional prepreg layers may include lubrication = the layer is on at least one side of it At least in part 1 of the method of forming an electronic support in the form of a laminate according to the present invention, in a specific embodiment, the inorganic filler can be directly applied to the reinforcing material == ore, and then a polymer matrix material is applied thereon. . For example, although ^ No (please read the precautions on the back before filling in this education): Pack. Order

Jm 66- 552831 五、發明説明（64) :艮=’但無機填料可以靜電方式沉積於加強材料上，或加強材料後，、聚水之衆液。於塗覆於無機填料上的加強；：材：彳：猎”或浸塗而施用化。雖然並非必要=有=物Γ:材料隨後可部份硬仁右有所耑，額外無機填料層可於如 =;=之乾燥之前或之後，施用至聚合物材料。料声及/Υι肖可至少邵份硬化及/或額外聚合物基體材物可視f要堆積於加強物上。然後預浸件枓了如一經切割及積層而形成積層物形式之電子支撐 ^發明（另_非限制性具體實施例中，鋪造紙法形成，並中$心^ ^ , $籾你便用/·，，、 ^ ^ Φ /—種揲機填料係於紙製加強件形唯紙二Γ力其上。例如但非限制性，本發明中玻璃纖 =ϊ物可·:由將短切玻璃纖維股線連同無機填料分散 ::?谷夜形成。用於此處’「白水溶液」-詞表示一種溶液，叾包含分散劑、增稠劑、軟化及硬化化 :':刀Τ或扎化聚合物。此種白水溶液爲業界眾所周可參考美國專利5,393,379，特別併述於經濟部中央標準局員工消費合作社印製达鑄換二。”分散液或聚液可沉積於集管箱，及隨後於移動中的綠網上而形成破璃纖維板。的玻璃纖維紙製加強物，換…二：而形成經填補 =強Γ，聚合物基體材料可施用至前文詳細討論 m加強物而形成根據本發明之預浸物層。若有所需， -67- 公釐） t ϋII( CNS ) A4im ΤΊι〇Χ297 552831 經濟部中央標準局員工消費合作社印製 A7 ——___________B7五、發明説明（65) 採機％料可結合於前又討論之施用至紙製加強物的聚合物、土月庄材料及/或包含一或多種無機填料之一層可施用至預，物層。然後如前文討論，將二或多層預浸物層堆疊及層疊。、濕鋪k紙法其可用以形成根據本發明之經填補的玻璃纖維紙製加強物之另一非限告丨丨把鲁 F限制f生貫例中，短切玻璃纖維以及 - 4多㈣㈣㈣同_或多種發泡劑分散於水。適合用於本發明之發泡劑及非限制性實例爲崔頓（trit〇n) X100,其馬乙氧化辛盼，市面上得自康乃迪克州丹伯利永備公司。然後分散液經攪動而形成發泡漿液，然後澆鑄至線網上，發泡體被眞空吸離且至少部份乾燥而形成經填補的玻璃.纖維紙製加㈣。隨s t合物基體材料可施用至前文詳細討論之紙製加強物而形成根據本發明之預浸物層。若有所需，無機填料可結合於S前討論之施用S紙製加強物之聚合物基體材料，及/或包含一或多種無機填料之一層可施用至預浸物I。然後二或多層預浸物層可如前述堆^ 與積層。本發明進一步預期包含呈包覆積層物形式之電子支撐件，及由預浸物層之積層物製成的印刷電路板，細節討^ 如前。回頭參照圖3，根據本發明之電子支撐件31〇包含= 導電材料之導電層322其接觸積展_物3 12之至少一面327: ^ 少一部份325而形成包覆積層物313。 · 導電材料層322可藉業界已知之任一種方法製成。例如但非限制本發明，導電層322可經由積層導電材料例如但非限 (請先閑讀背面之注意事項再填寫本頁) 裝.Jm 66-552831 V. Description of the invention (64): Gen = ’But inorganic fillers can be deposited electrostatically on the reinforcing material, or after the reinforcing material, the liquid is collected. Reinforced coating on inorganic fillers:: Material: 彳: hunting "or dip coating and apply. Although not necessary = 有 = 物 Γ: The material can then be partially hardened, and additional inorganic filler layers can be used. Apply to the polymer material before or after drying, such as =; = The material and / or material may be hardened at least and / or additional polymer matrix materials may be deposited on the reinforcement. Then the prepreg枓 Invention of electronic support in the form of a laminate after cutting and layering ^ Invention (In addition _ non-limiting specific embodiments, the paper-making method is formed, and the center is $ ^^, $ 籾你就用 / · ,,,, ^ ^ Φ / —The filler of the machine is attached to the shape of the paper reinforced piece of paper. For example, but not by way of limitation, in the present invention, the glass fiber = 可物 ·: The short-cut glass fiber strand is combined with Inorganic filler dispersing: ?? Ye Ye formed. Used herein "" white aqueous solution "-the word means a solution that contains a dispersant, thickener, softening and hardening: ': knife or polymer. This This white water solution is widely known in the industry. U.S. Patent No. 5,393,379 can be referred to, and it is specifically described in the central standard of the Ministry of Economic Affairs. The employees of the quasi-station employee cooperatives printed up to change two. "The dispersion or polymer can be deposited on the header box, and then on the moving green net to form broken glass fiber boards. Reinforcement made of glass fiber paper ... Two: while filling = strong Γ, the polymer matrix material can be applied to the m-reinforcement discussed previously in detail to form a prepreg layer according to the present invention. -67-mm if required) t ϋII (CNS) A4im ΤΊι〇Χ297 552831 Printed by A7, Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs —— ___________ B7 V. Description of the invention (65) The miner's material can be combined with the polymer and paper that are applied to the paper reinforcements discussed earlier. The material and / or one layer containing one or more inorganic fillers may be applied to the pre-layer. Then, as discussed previously, two or more prepreg layers are stacked and laminated. Wet-kraft paper method may be used to form according to the present invention Another non-limiting report of the filled glass fiber paper reinforcements 丨 In the example of the Lu F limit, the short-cut glass fiber and-4 different kinds of _ or multiple foaming agents are dispersed in water. Suitable for use Foaming agent in the present invention A non-limiting example is triton (X) 100, whose horse ethoxylate is oxidized, and is commercially available from Danbury Yongbei, Connecticut. The dispersion is then agitated to form a foaming slurry, which is then cast to On the wire net, the foam is sucked away by the hollow and at least partially dried to form a filled glass. Fiber paper is added to the fiber. The st composite base material can be applied to the paper reinforcement discussed in detail above to form Inventive prepreg layer. If desired, an inorganic filler can be combined with the polymer matrix material applied to the S paper reinforcement discussed earlier, and / or a layer containing one or more inorganic fillers can be applied to the prepreg. I. Then two or more prepreg layers may be stacked and laminated as previously described. The present invention further contemplates an electronic support in the form of a clad laminate, and a printed circuit board made from the laminate of the prepreg laminate, Details discussed ^ As before. Referring back to FIG. 3, the electronic support member 31 according to the present invention includes a conductive layer 322 of a conductive material that contacts and accumulates at least one side 327 of the product 3 12: ^ A portion 325 is less to form a coating laminate 313. The conductive material layer 322 can be made by any method known in the industry. For example, but not limited to the present invention, the conductive layer 322 can be installed by laminating conductive materials such as, but not limited to (please read the precautions on the back before filling this page).

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Jm -68- 552831 經濟部中央標準局員工消費合作社印製 A7 五、發明説明（ t fif:枓心薄片或箱至半硬化或硬化預浸物層315或積層 ^表面327之至少—部份325形成。至於替代之道，導電 Γ:可經：使用業界眾所周知的技術，包括但非限於電解讀敷或㈣而沉積導電材料層料硬化或硬化 =物層⑴表面327或積層物312之至少—部们25上形成0 . 適：用作爲導電層322之導電材料包括但非限於銅、銀、銘、金、錫、錫-鉛合金、鈀、及其組合及合金。繼續參照圖3，現在概略，明㈣各也明形成根據本發明之包覆積層 3 i 4、3V，1 Γ万j法_。該方法包含堆疊二或多預浸物層明之預、3物：、至〃者係根據珂文討論之製造根據本發明义預改物〈万法製成，以及一或多们 =將預浸物層314、315與導電層322 =雖:非限:性，一具體實施例中，—或 31=:其位置爲至少部份存在於包覆積層物 313又外邵王面327上。業界人士了解本發明之預浸物、積層物及包覆積声物可用「二成所周知之多層印刷電路板。用於此處，料内；ρ:π—詞表示印刷電路板有至少-導電材胃〜内層係存在呈大致上連續平平面）或可使用一或多電路圖樣化」容後詳述。…泉或泉方ΓΓΠ!成根據本發明之印刷電路板之非限制性万法。孩万法包含形成如前文吋私層物，以及藉業界眾所周知之任：：明（包覆積 1 稷万法圖樣化一或多電 --------- (請先閱讀背面之注意事項再填寫本頁) -訂 4 -69- 經濟部中央標準局員工消費合作社印製 552831 、發明説明（67 積層物之至少—導電層之至少部份上。例如雖然據業衣性、，柷光蝕劑可施用至導電層上、經光成像以及推、眾、斤周知之貫務而顯像。隨後，曝光後之導電材料 '業：：去除而形成電路於電子支撐件表面上。此種方法爲、1 “所周知，前述實例僅供舉例説明圖樣化電路之適當侷限本發明。❺了或替代形成—或多電路於積層 ♦^ ί〆一面上之外，一或多個孔洞或通孔伸展至少部份男穿電子支撐件其可藉業界眾所周知之任一種方法例如々 ”艮於機械或雷射鑽孔而鑽孔或淨孔入電子支撐根據本發明之印刷電路板。 · 兩現在將概略説明根據本發明於電子支撐件及特別於印刷 %路板形成孔洞之非限制性方法。典型孔洞於電子支撐件係藉鑽孔支撑件形成，最常見係利用機械鑽孔方法鑽孔俾允許於電子支撑件對側面上圖樣 =電路間的電互連。於形成孔洞i，_層導電材料沉積於。壁^上及/或孔洞使用導電材料填補而有助於所需電互連及 /或熱耗散。如前文討論，鑽孔步驟爲關鍵性步驟，鑽孔步驟不僅決定製成的印刷電路板品質，同時也決定總生產良率及成本。若所鑽孔未準確定位，或孔壁粗糙，則樹脂玷 ’了或以其Έ：万式污損面板則須廢棄。此外，若鑽孔缺陷係發生於電路圖樣化之後，則廢棄—面板的成本顯著升高。觀察到當孔洞形成裝置用以於印刷電路板形成孔洞、或當= 子支撐件於鑽孔期間變成磨耗時，鑽孔位置準確度品質及電路板的整體品質降低。結果生產良率下 & =二=、 ^成生產成 (請先閱讀背面之注意事項再填寫本頁)Jm -68- 552831 A7 printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the invention (t fif: Heart-thin sheet or box to semi-hardened or hardened prepreg layer 315 or laminated ^ surface 327 at least-part 325 Forming. As an alternative, conductive Γ: can be used: the use of well-known techniques in the industry, including but not limited to electro-deposition or rubbing, to deposit or harden a layer of conductive material = layer 物 surface 327 or layer 312 at least- 0 is formed on the members 25. Suitable: The conductive materials used as the conductive layer 322 include, but are not limited to, copper, silver, metal, gold, tin, tin-lead alloys, palladium, and combinations and alloys thereof. With continued reference to FIG. 3, now Roughly, each of them also clearly forms the clad laminate 3 i 4, 3V, 1 Γjj method according to the present invention. This method includes stacking two or more prepreg layers. According to Ke Wen's discussion, the pre-modified product is made according to the present invention, and one or more of them = the prepreg layers 314, 315 and the conductive layer 322 = although: not limited: nature, in a specific embodiment , —Or 31 =: its position is at least partly present in the coating layer 313 and outside Shao Wang noodles on 327. People in the industry understand that the prepregs, laminates, and sound coatings of the present invention can be used as "multi-layered printed circuit boards known by Ercheng. Used here, in-material; ρ: π—words The printed circuit board has at least-conductive material stomach ~ the inner layer is present in a substantially continuous flat plane) or can be patterned using one or more circuits "will be described in detail later. … Spring or spring square ΓΓΠ! Becomes a non-limiting method for a printed circuit board according to the present invention. The Hawan method includes the formation of a private layer as described above, and is well-known in the industry :: Ming (encapsulation product 1 稷 Wan method pattern to one or more electricity --------- (Please read the back Please fill in this page again) -Order 4 -69- Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 552831, Invention Description (at least at least part of the laminate-conductive layer. For example,柷 Photoresist can be applied to the conductive layer, developed by photoimaging and well-known tasks. Subsequently, the exposed conductive material is removed to form a circuit on the surface of the electronic support. This method is, 1 "It is well known that the foregoing examples are merely examples to illustrate the proper limitation of the patterned circuit of the present invention. The circuit is formed or replaced instead-one or more circuits are formed on one side of the build-up surface, one or more holes Or through-hole stretching at least part of the men's electronic support can be drilled or cleared into the electronic support of the printed circuit board according to the present invention by any method well known in the industry, such as drilling through holes in mechanical or laser drilling. Both will now outline the roots According to the present invention, non-limiting methods for forming holes in electronic supports and in particular printed circuit boards. Typical holes in electronic supports are formed by drilling supports, and the most common are drilling by mechanical drilling methods. Pattern on the opposite side of the support = electrical interconnections between circuits. In the formation of holes i, a layer of conductive material is deposited. Walls and / or holes are filled with conductive materials to facilitate the required electrical interconnection and / or heat Dissipation. As discussed above, the drilling step is a critical step. The drilling step not only determines the quality of the printed circuit board produced, but also determines the overall production yield and cost. If the hole is not accurately positioned, or the hole wall is rough , Then the resin is not used or it is: the Wan-style stained panel must be discarded. In addition, if the drilling defect occurs after the circuit pattern is patterned, the cost of the panel is significantly increased. It is observed that when the hole formation device Used to form holes in the printed circuit board, or when = the sub-support becomes worn during drilling, the accuracy of the drilling position and the overall quality of the circuit board are reduced. As a result, the yield rate & = 二 =, ^ Production into production (Please read the notes on the back before filling out this page)

-70- 552831 A7 B7 五、發明説明（68 ) ' " 本的升高。。根據本發明之形成孔洞之方法可特別有利地用以於印刷電路板製造期間於電子支撐件形成孔洞，原因在.於相信其可能延長鑽頭壽命，減少鑽孔工具磨耗，改良孔壁品質及孔洞位置準確度，以及降低鑽孔成本。此外，本方法及裝置可結合於既有鑽孔操作而無需顯著的設備修改或額外加 =步驟。進一步預期其它印刷電路板加工操作例如路由、你邊、切晶粒、及光整皆可由此處揭示之方法獲益。現在概略説明根據本發明之於電子支撐件形成孔洞之非限制性方法。參照圖4，該方法包含電子支撐件4ι〇排齊孔洞形成裝置412。雖然非限制性，但電子支撐件41〇爲以前又詳細討論之方式形成電子支撐件，包括如此處揭示之摻混填料之基體材料及/或層。雖言如此，本發明方法也適合 =於白知電子支撐件，其於商業上方便易由多個製造商獲得。用於此處「孔洞形成裝置」一詞表示可於電子支撐件以機械万式形成孔洞之任一種裝置。雖然非限制本發明，但於圖4所示具體實施例中，孔洞形成裝置412使用鑽雖413 成孔/同4 14。適合用於本發明之市面上可得之孔洞形成裝經濟部中央標準局員工消費合作社印裝 412例如但非限於日立公司耽號_ 5頭（主抽）機器、優 =林（uniline)测單頭機器及普利泰（piur㈣單主式鑽孔機。於定位電子支撑件41輯齊孔洞形成裝置412後，孔洞川至^份伸展貫穿電子支撐件41G之厚度416，孔洞之形成万式係將孔洞形成裝置412接觸且貫穿電子支撐件41〇之至 -71 - 552831 69 五、發明説明（二邵份417形成。本發明之非限制性具體實施例中 ::爾劑422及載劑423之流體流42〇係於孔洞形成操：含 V-邵份期間配衆至接近孔洞形成裝置412，又與鑽錐前進通過電子支撐件41〇時，接觸孔洞：：：足鑽錐413與電子支撐件410間之界面426之裝似。須了解前述方法可用以於結合此處所述填料之積2 形成孔洞以及於習知積層物形成孔洞。、0物 j發明之非限制性具體實施例中，固體潤滑劑 =體潤滑劑。前文討論之可用於無機填㈣(顯示於： 1)…種無機固體潤滑劑可用作爲根據本發明之形成Q =方法之無機固體潤滑劑422。非限制性具时 1 固”滑劑422爲具有層狀結構之無機固體潤滑㈣^ =非限制性，適當具有層狀結構之無機固體潤滑劑粒子包括氮化硼、棚酸、石墨、金屬二硫屬化物、帝母1 :二嶺土、破化鎮及其混合物。適當金屬二硫屬化心但非限於：硫化i目、二晒仙、二硫健、二碼化輕、 -硫化鶴、二硒化鑛、及其混合物。本發明之非限制性且體貫施例中，無機固體潤滑劑係用於流體流似。 - 經濟部中央標準局員工消費合作社印製適合用於本發明之氮化鄕子之非限制性㈣討論之波樂森六面體氮化硼粒子。流體流420之載劑423可爲液體_或氣體。若载劑423爲液體’則固體潤滑劑422可呈於液體之分散液、懸浮形式存在。適當液體載劑之非限制性實例包括水；、由領如礦油或以石油爲主的油類·’_;及其它有機落劑如丙酮、 -72 552831 五、發明説明（7C)) 異丁酮（MEK)、二氣曱烷、甲苯及其混合物。分散液之非限制性實例爲歐帕克氮化硼離型塗層濃劑25，爲25%重量比7T面體氮化硼粒子分散於水之分散液，，市面上可得自田納西州橡樹脊ZYP塗層公司。參考「歐帕克氮化硼離型塗層濃劑」’ ZYP塗層公司的技術報導，特別併述於此以供參考。根據供應商，本產品之六面體氮化硼粒子具有平均粒徑小於3微米。分散液也包括1 %鋁矽酸鎂，其根據供應商的説明係作爲懸浮劑而防止氮化硼沉降，以及輔助結合穴面體氮化侧粒子至該分散液所施用的基材。使用貝克曼庫克LS 230粒徑分析儀獨立試驗歐帕克氮化硼離型塗層濃劑25氮化硼樣本，發現平均粒徑爲& 2微米，粒子係於次 -------^1-裝-- (請先閲讀背面之注意事項再填寫本頁) 微米至35微米之範圍且有下述$ 良徑分布： %> 10 50 90 大小（微米） 10.2 5.5 2.4 根據此種分布，測得1 〇%歐帕克氮化硼離型塗層濃劑25氮化硼粒子具有平均粒徑大於10. 2微米。-70- 552831 A7 B7 V. Description of the invention (68) '" The rise of the book. . The method for forming a hole according to the present invention can be particularly advantageously used to form a hole in an electronic support during the manufacture of a printed circuit board. The reason is that it is believed that it may prolong the life of the drill bit, reduce the wear of the drilling tool, improve the quality of the hole wall and the hole. Location accuracy and reduced drilling costs. In addition, the method and device can be combined with existing drilling operations without significant equipment modification or additional steps. It is further contemplated that other printed circuit board processing operations such as routing, edge trimming, die cutting, and finishing may benefit from the methods disclosed herein. A non-limiting method for forming a hole in an electronic support according to the present invention will now be outlined. Referring to FIG. 4, the method includes aligning the hole-forming device 412 with the electronic support 40 mm. Although non-limiting, the electronic support 410 is an electronic support formed in a manner previously discussed in detail, including a matrix material and / or layer blended with a filler as disclosed herein. Having said that, the method of the present invention is also suitable for Baizhi electronic supports, which are commercially available easily from multiple manufacturers. As used herein, the term "hole-forming device" means any device capable of mechanically forming holes in an electronic support. Although the present invention is not limited, in the specific embodiment shown in FIG. 4, the hole forming device 412 uses a drill to form a hole 413 / same as 414. Suitable for use in the market of the present invention are hole forming equipment, the Central Standards Bureau, the Ministry of Economic Affairs, the staff consumer cooperatives ’printing 412, such as, but not limited to, Hitachi ’s delay number _ 5 heads (main pumping) machines, excellent = forest (uniline) test orders Head machine and puri 泰 single main drilling machine. After positioning the hole support device 412 of the electronic support member 41, the holes extend to 416 parts and extend through the thickness 416 of the electronic support member 41G. The hole forming device 412 is in contact with and penetrates the electronic support 41 to -71-552831 69. V. Description of the invention (Two Shaofen 417 is formed. In a non-limiting specific embodiment of the present invention: 尔剂 422 and vehicle 423 The fluid flow 42 is caused by the hole formation operation: during the V-Shaofen period, it is matched to the near hole formation device 412, and when it advances with the drill cone through the electronic support 41, it contacts the hole: :: foot drill cone 413 and the electron The interface 426 between the supporting members 410 is similar. It should be understood that the foregoing method can be used to form holes in combination with the product 2 described herein and to form holes in conventional laminates. Non-limiting specific embodiments of the invention Medium, solid Lubricant = body lubricant. The inorganic solid lubricants discussed above that can be used in inorganic fillers (shown in: 1) can be used as the inorganic solid lubricant 422 for forming the Q = method according to the present invention. Non-limiting time 1 "Solid" lubricant 422 is an inorganic solid lubricant with a layered structure. ^ = Non-limiting, suitable inorganic solid lubricant particles with a layered structure include boron nitride, shed acid, graphite, metal dichalcogenide, emperor 1: Erling clay, Pohua town and mixtures thereof. Appropriate metal dichalcogenide cores but not limited to: sulfide i-mesh, Ersunxian, disulfide, light-coded,-sulfur crane, diselenide, And their mixtures. In a non-limiting and consistent embodiment of the present invention, inorganic solid lubricants are used for fluid flow.-The Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs prints the nitrided dumplings suitable for use in the present invention. Non-limiting 波 The Pollen hexahedron boron nitride particles discussed. The carrier 423 of the fluid stream 420 may be a liquid or a gas. If the carrier 423 is a liquid, then the solid lubricant 422 may be in a liquid dispersion Exist in suspended form. Suitable liquid carriers Restrictive examples include water; oils such as mineral oil or petroleum-based oils; and other organic solvents such as acetone, -72 552831 V. Description of the Invention (7C)) Isobutanone (MEK), Dioxane, toluene, and mixtures thereof. A non-limiting example of a dispersion is Opak Boron Nitride Release Coating Concentrate 25, a dispersion of 25% by weight 7T hexahedron boron nitride particles dispersed in water, Available on the market from Oak Ridge ZYP Coatings, Tennessee. Refer to "Opak Boron Nitride Release Coating Concentrate" for a technical report from ZYP Coatings, specifically described here for reference. According to the supplier The hexahedron boron nitride particles of this product have an average particle size of less than 3 microns. The dispersion also includes 1% magnesium aluminosilicate, which acts as a suspending agent according to the supplier's instructions to prevent boron nitride from settling, and assists in bonding the nitridated side particles of the cavity body to the substrate to which the dispersion is applied. The Beckman Cook LS 230 particle size analyzer was used to independently test 25 samples of OPAC boron nitride release coating concentrate 25 boron nitride. The average particle size was & -^ 1-Pack-(Please read the precautions on the back before filling this page) Micron to 35 micron range with the following good path distribution:% > 10 50 90 Size (micron) 10.2 5.5 2.4 Based on this 2 微米。 This distribution, measured 10% Opak Boron Nitride release coating concentrate 25 boron nitride particles have an average particle size greater than 10. 2 microns.

、1T 經濟部中央標準局員工消費合作社印製其它有用的製品於市面上可得自田納西州橡樹脊Ζγρ塗層公司者包括氮化硼潤滑塗層塗料、布雷斯普（BRAZE ST〇p) 及溶接離型產品。本發明有用之氣態載劑之非限制性實例包括壓縮空氣、氮氣、氬氣、也包括推進劑如丁烷或丙燒 (由於可燃故不佳）。雖然不欲受特定理論所限，但相信經由配漿包含固體潤滑劑422的流體流420接近孔洞形成裝置412，讓固體潤滑劑 422接觸界面426之一部份424，可減少於鑽孔過程鑽錐413 -73- 本紙張尺度適用中國國家標準（CNS ) Α4規格（210 X 297公釐）經濟部中央標準局員工消費合作社印製 552831 A7 ---—___________B7 _ 五、發明説明（71 ) — --— 勺磨耗因而延長鑽錐壽命。此外，相信鑽孔期間產生的執可經由減少孔洞形成裝置412與電子支撐件41〇間的摩擦：予降低’因而減少樹脂站污鑽孔414。進_步相信經由使用具有高導熱係數的固體潤滑劑而例如但非限於六面體氮化硼來將熱由界面426傳導離開藉此減少樹脂玷污發生率可進一步提尚產熱減少的效果。適合用於流體流42〇之具有高導熱係數之固體潤滑劑包括但非限於前文已經揭示用作爲無機填料18、218之潤滑劑（顯示於圖丨及2)。 ”、泥體流420可以業界已知之任一種方法配漿。例如流體流 420可經由噴嘴或噴霧器（圖中未顯示）噴霧。本發明之非限制性具體實施例中，包含固體潤滑劑及液體載劑之流體流係經由中空通道（圖中未顯示）至少部份伸展貫穿孔洞形成裝置412之鑽錐413内部而予提供。流體流42〇係經由通過中二通道以及由鑽錐外表面伸出的至少一孔洞流入中空通道内部而被配聚於鑽錐與電子支撐件間的交界面。其它包含固m /閏/¾劑422及液體載劑423之配裝流體流420之方法包括但非限於恰在鑽孔之前塗刷以及浸潰電子支撐件41〇俾塗覆以固體潤滑劑422。於電子支撐件410形成的孔洞414之大小及數目可視需要改變。雖然非限制性，例如直徑於〇 025毫米（0· 〇〇 1吋）至 12.7毫米（0· 50吋）之孔洞414可根j家本發明之方法形成於電子支撐件410。形成於電子支撐件410之孔洞414可部份伸展貫穿電子支撐件厚度416 (例如盲通孔或埋頭通孔），或可伸展而完全貫 -74- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1Γ (請先閱讀背面之注意事項再填寫本頁} -裝· 訂 552831 五、發明説明（72 度416,如圖4所示(例如貫穿孔)。^ 孔洞4U及:;同亩支撐件410可包括一或多個前述各類型用導電材料如焊科填補。卜右有所而，孔洞4U可使根據本發明於電子支撐件形成孔洞之方法之另性具體實施例中，雨早士择、非限制 ^支撐件足位置係排齊孔洞形成裝接觸固體潤滑劑之流體流衝擊孔洞形成裝置。然後孔1.1T printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs and other useful products available on the market from the Oak Ridge, Tennessee Zγρ Coating Company include boron nitride lubricating coatings, BRAZE STOP and Dissolved release products. Non-limiting examples of gaseous carriers useful in the present invention include compressed air, nitrogen, argon, and also propellants such as butane or propane (poor due to flammability). Although not intending to be bound by a specific theory, it is believed that the fluid flow 420 containing the solid lubricant 422 through the slurry is brought close to the hole-forming device 412, and the solid lubricant 422 contacts a portion 424 of the interface 426, which can reduce the drilling during the drilling process. Cone 413 -73- This paper size applies to Chinese National Standard (CNS) A4 size (210 X 297 mm) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 552831 A7 ---___________ B7 _ V. Description of the invention (71) — --- Spoon wear thus extends drill life. In addition, it is believed that the friction generated during the drilling can be reduced by reducing the friction between the hole-forming device 412 and the electronic support 41o: thereby reducing the resin station soiling hole 414. It is further believed that by using a solid lubricant having a high thermal conductivity such as, but not limited to, hexahedron boron nitride to conduct heat away from the interface 426 to reduce the incidence of resin fouling, the effect of reducing heat generation can be further enhanced. Suitable solid lubricants having a high thermal conductivity for use in fluid stream 42 include, but are not limited to, lubricants previously disclosed for use as inorganic fillers 18, 218 (shown in Figures 1 and 2). ", Mud stream 420 can be blended in any method known in the industry. For example, fluid stream 420 can be sprayed through a nozzle or a sprayer (not shown). In a non-limiting specific embodiment of the present invention, solid lubricants and liquids are included. The fluid flow of the vehicle is provided through a hollow channel (not shown) extending at least partially through the inside of the drill cone 413 of the hole forming device 412. The fluid flow 42 is passed through the second channel and extends from the outer surface of the drill cone At least one of the holes that flows out flows into the hollow channel and is aggregated at the interface between the drill cone and the electronic support. Other methods of assembling the fluid flow 420 including the solid m / 闰 / ¾ agent 422 and the liquid carrier 423 include but It is not limited to brushing and immersing the electronic support member 41 ° immediately before drilling and coating it with a solid lubricant 422. The size and number of the holes 414 formed in the electronic support member 410 may be changed as needed. Although non-limiting, such as the diameter Holes 414 ranging from 0.025 mm (0.001 inches) to 12.7 mm (0.50 inches) may be formed in the electronic support 410 according to the method of the present invention. The holes formed in the electronic support 410 The hole 414 may partially extend through the thickness of the electronic support 416 (such as a blind through hole or a countersunk through hole), or may be completely extended through -74- This paper size applies to China National Standard (CNS) A4 (210X297 mm) 1Γ (Please read the precautions on the back before filling out this page}-Binding and binding 552831 V. Description of the invention (72 degrees 416, as shown in Figure 4 (such as through-holes). ^ Holes 4U and :; the same acre support 410 may Including one or more of the foregoing types are filled with a conductive material such as a welding branch. According to another aspect, the hole 4U may enable another method of forming a hole in an electronic support according to the present invention. Unrestricted ^ The foot position of the support is aligned with holes to form a fluid flow contacting the solid lubricant to impact the hole forming device. Then the holes

Si支擇件之至少-部份，亦即形成-個孔洞至少部 ^穿％子支撐件厚度。流體流可以間歇方式換言之於孔 >同形成操作之至少—部份期間供應；或可於孔洞形成步驟期間連續衝擊孔洞形成裝置上。 ' 經濟部中央標隼局員工消費合作社印製、現在參照圖5小根據本發明之於電子支撐件形成孔洞之方法之另一非限制性具體實施例中，電子支撐件51〇排齊孔洞形成裝置512，讓電子支擇件51〇表面5 18緊鄰孔洞形成裝置512。包含無機固體潤滑劑材料522之一層52〇其位置係沿電子支撐件510之介於電子支撐件51〇上表面518與孔洞形成裝置512間之上表面518之至少一部份。然後藉孔洞形成裝置5 12及鑽錐513，形成一個至少部份貫穿電子支撐件51〇厚度之孔洞514。如此鑽錐513也形成孔洞524其完全伸展貫穿層520厚度526。若有所需，可沿電子支撐件51〇之對側面 5 2 8没置包含無機固體潤滑劑5 3J的第二層5 3 〇，如圖5所非限制性具體實施例中，層520爲單層。用於此處，「單層」一詞當述及層520時表示層520未支撐於二次支撐基材 75- ^--- (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） 552831At least a part of the Si support member, that is, a hole is formed at least partially through the thickness of the sub-support member. The fluid flow may be supplied intermittently in other words to the holes > at least in part during the same forming operation; or may be continuously impinged on the hole forming device during the hole forming step. '' Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs, and referring now to FIG. 5, in another non-limiting specific embodiment of the method for forming holes in an electronic support according to the present invention, the electronic support 51 is aligned with holes. The device 512 is such that the surface 5118 of the electronic supporting member 51 is adjacent to the hole forming device 512. A layer 52 of an inorganic solid lubricant material 522 is located along at least a part of the upper surface 518 of the electronic support 510 between the upper surface 518 of the electronic support 51 and the hole-forming device 512. Then, the hole forming device 512 and the drill cone 513 are used to form a hole 514 at least partially penetrating the thickness of the electronic support member 51. In this way, the drill cone 513 also forms a hole 524 which fully extends through the thickness 526 of the layer 520. If necessary, the second layer 5 3 0 containing the inorganic solid lubricant 5 3J may be disposed along the opposite side 5 2 8 of the electronic support 51. As shown in the non-limiting specific embodiment shown in FIG. 5, the layer 520 is Single layer. As used herein, the term "single layer" when referring to layer 520 indicates that layer 520 is not supported on a secondary support substrate 75- ^ --- (Please read the precautions on the back before filling this page) This paper size Applicable to China National Standard (CNS) Α4 specification (210 × 297 mm) 552831

t層5。20可爲直接施於電子支撐件510表面518的單層，或可爲自撐層，其於鑽孔之前插置於表面518與孔洞形置 512 間。 . 另一非限制性具體實施例中，層52〇置於表面5丨8上，讓固體潤滑劑522直接接觸電子支撐件51〇表面518。此特定具體實施例巾，層520可爲前文討論之單層，或可由多層:且 f。例如但非限制性，層520可積層或以其它方式附著至二次支撐基材（圖中未顯示）俾於安置層52〇介於電子支撐件 510表面518與孔洞形成裝置512間之前對層52〇提供支撐。根據本發明之另一非限制性實例中，其中無機固體潤滑劑爲六面體氮化硼，一層六面體氮化蝴可直接施用至酚系紙=口板外表面，施用方法係將氮化硼分散液（討論如前）噴霧或塗刷至表面上。此種入口板材料爲業界眾所周知，市面上可得自馬里蘭州巴爾地摩桑特蘭（CenterUne)公司爲「厚紙心酚系背襯EB- 95」。一層六面體氮化硼也藉噴霧或塗刷氮化硼分散液至電子支撐件5丨〇表面5丨8例如上表面而直接施用於電子支撐件510，其用量係足夠於形成孔洞514 之削’當鑽錐首次穿透氮化硼時提供預定鑽孔性質。經濟部中央標準局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 雖然非受任何特定理論所限，但相信孔洞形成裝置512之鑽錐513切削貫穿潤滑層520時，部份無機固體潤滑劑522將黏附於鑽錐513及/或被帶入孔洞-而於鑽孔期間提供潤滑。如此相信，若無機固體潤滑劑522有高導熱係數（討論如前），則當鑽孔貫穿層520時鑽錐5 13的溫度可藉熱傳導而下降。 -76 - 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公疫） 552831 經濟部中央標準局員工消費合作社印製五、發明説明（74 層520包含前文討論之一或多種固體潤滑材料。本發明之 =限:性具體實施例巾，層52〇較佳包含六面體氮化;。若所需，層520進一步包含其它材料例如聚合物及蠟類。本發明之另一非限制性具體實施例中，層520包含至少一種黏結材料而將固體潤滑材料522之個別粒子黏合在一起。但未使用黏結材料被緊壓在一起之潤滑材料522形成層520也可於本發明。本發明有用之黏結材料之非限制性實例相信匕括潤/骨劑如聚乙晞醇、聚乙埽基？比哈淀酮；聚胺基甲酸酉曰來乙酸乙晞酯、聚丙烯酸酯類、聚酯類、脂肪酸酯類、聚_類、聚甲基丙晞酸縮水甘油醛·；及蠟類如石樣。除了黏結材料及無機固體潤滑劑外，層520包含有機潤滑材料例如硬脂酸鋅、聚四氟乙晞、石蠟、脂肪酸類、脂舲酸酯類及聚乙二醇。層520具有提供預定鑽孔特徵需要的任何厚度526。一個非限制性具體實施例中，層520製作成儘可能薄俾提供所需鑽孔及處置特徵。預期多個電子支撐件可使用本發明之敎示而於單一孔洞形成操作中堆疊及鑽孔。特別參照圖6，本發明之一非限制性具體實施例中，第一電子支撐件61〇及第二電子支撐件 611可彼此堆疊，故第一電子支撐件61〇下表面628係毗鄰第二電子支撐件6 11下表面6 1 8。包含無機固體潤滑劑622之層 620於使用孔洞形成裝置612而於電子支撐件610、611形成孔洞6 14之前位置桃鄰第一電子支撺件6 1 〇上表面6 19。業界人士了解雖然於圖6顯示610及611爲單層電子支撐件，但其 -77- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X29*7公釐） (請先閱讀背面之注意事項再填寫本頁) -裝· 訂 d 552831 A7 B7 五、發明説明（ 75 經濟部中央標準局員工消費合作社印製可爲業界已知之任一型電子支撐件包括但非限於多層積層物及印刷電路板。進一步預期潤滑層於孔洞形成操作期間置於選定之毗鄰電子支撐件間。特別如圖7所示，包含無機固體潤滑劑742 之層740可於孔洞形成之前，置於第一電子支撐件71〇下表面728與第二電子支撐件7Π上表面718間。也預期可使用多層潤滑層於孔洞形成操作。例如如前文討論，圖5顯示電子支撐件510帶有二潤滑層520及530位置分別沿電子支撐件 510之對側主面518及528。圖7所示本發明之另一非眼制性具體實施例中，有多個電子支撑件71G、· 711，包含無機固體潤滑劑742之一層740設置於第一電子支撐件71〇與第二電子支撐件711間，以及選擇性地，包含無機固體潤滑劑722 之另一層720可於使用孔洞形成裝置712而於電子支撺件 71〇、711形成孔洞714之前設置毗鄰電子支撐件71〇之上表面 719。本發明心非限制性具體實施例中，多個電子支撐件堆疊在一起，包含無機固體潤滑劑之一層置於多個之喻電子支撑件間。此外若有所需，潤滑層== 鄰堆疊電予支撐件之暴露對側主面之任―面或兩面/ 根據本發明於電子支撐件形成孔洞方法之另—非限制性具體實施例中，至少一電子支撐件位置排齊孔洞形成裝置讓々至少一電子支撐件上表面係®比鄰孔洞形成裝置。已口 /、面體氮化砸]之一層設置於該至少一電子支撑件上表面與孔洞形成裝置間，使用孔洞形成裝置形成一=洞其至 (請先閱讀背面之注意事項再填寫本頁} -裝· •訂 — -78- 552831 經濟部中央標準局員工消費合作社印製 A7 ____B7五、發明説明（76) 少部份貫穿至少一電子支撐件厚度。業界人士了解於前述形成孔洞方法之任一方法中，包冬無機固體潤滑劑之層可於定位電子支撐件排齊孔洞形成裝置之前設置於沿欲鑽孔之電子支撐件之至少一部份。本發明之另一非限制性具體實施例中，固體潤滑材料可摻混於孔洞形成裝置。特別參照圖8，孔洞形成裝置812包含一鑽錐813，鑽錐有外表面848及塗層材料85〇包含層狀固體潤滑劑852位於外表面848之至少部份854之上。本發明之非限制性具體實施例中，潤滑劑853爲六面體氮化硼。雖然非限制本發明，一具體實施例中，塗覆材料85〇係位於鑽錐 813之外切削面之至少部份上。位於鑽錐813之至少部份854外表面848上的塗覆材料85〇可藉業界已知施用此種塗層之任一種方法施用。例如塗層 850特別包含六面體氮化硼之塗層可藉噴霧、塗刷、濺鍍、 VD (化學氣相 >几積）、電漿沉積或脈衝雷射沉積施用。另外包含固體潤滑劑852之塗層可藉化學方法形成。、舉例但非限制，發明，施用包含六面體氮化石朋之塗層時，經由刪酸與三聚氰胺反應形成的反應產物施用至鑽錐外表面，鑽錐暴露於高於献之溫度60分鐘而形成六面體氮化硼層。，另一根據本發明形成孔洞形成裝置812之替代方法之非限缝實例中，無機固體潤滑劑8湖如但非限於粉狀六面體二可、，且口或夕種粉狀金屬及/或碳化物以及透過業 ::所周知之粉體冶金技術燒結助劑而形成鑽錐⑴。有關、-步資訊可參考「帶有自行潤滑氮化硼之之膠合碳化 __ -79- 本紙張尺^準(CNS ) (請先閱讀背面之注意事項再填寫本頁) •裝· 訂 d 552831 經濟部中央標準局員工消費合作社印製 A7 ——___B7_ _五、發明説明（77) 物」，日本新材料咼性能陶瓷，日本新媒體國際公司丨99 ^ 年9月2曰。業界人士了解七述孔洞形成裝置8丨2可結合任一種於前文时論之電子支撐件形成孔洞之方法，或可用於習知孔洞形成方法。特別當使用孔洞形成裝置812而於電子支撐件形成孔洞時，（1)電子支撐件排齊孔洞形成裝置，該裝置包含鑽錐其外表面至少部份塗覆以含六面體氮化硼的塗層材料； (2) 孔洞形成裝置接觸電子支撐件之第一側之至少部份；及 (3) 穿透電子支撐件之至少第一側而形成至少部份貫穿電子支撐件之孔洞。本發明進一步預期包含使用後文討論其細節之孔洞形成方法製成的電子支撐件及電路板。現在將於下列實例説明本發明之非限制性實例。實例結合本發明之特色之一系列電氣級預浸物及積層物製備如後：積層物A :經過加熱清潔及矽烷光整的電氣級7628型E-破璃纖維使用商用預浸設備及技術浸潰以及利用加州艾那亥納爾可（Nelco)國際公司進行B級硬化（亦即部份硬化）而形成預浸物。浸潰樹脂爲具有Tg 140°C之FR-4環氧樹脂，由納爾可公司定名爲4000-2環氧樹脂。8張預浸物堆疊於積層壓機的壓板間，堆疊頂和底放置1盎司銅箔。積層壓機的積層板預熱至93°C(200°F)，堆疊於0.1百萬巴斯卡（MPa)(16 psi)壓力加壓4分鐘。然後溫度以4.4°C至6.6°C (8°F至12T ) -80- $氏張尺度適用中國國家標準（cns )八4規格（2i〇><297公^ "~~ ' f請先閱讀背面之注意事項再填寫本頁，> •裝訂The t-layer 5.20 may be a single layer applied directly to the surface 518 of the electronic support 510, or may be a self-supporting layer which is interposed between the surface 518 and the hole-shaped arrangement 512 before drilling. In another non-limiting embodiment, the layer 52 is placed on the surface 518 and the solid lubricant 522 directly contacts the surface 518 of the electronic support 51. In this particular embodiment, the layer 520 may be a single layer as previously discussed, or may be composed of multiple layers: and f. For example, without limitation, the layer 520 may be laminated or otherwise attached to a secondary supporting substrate (not shown in the figure). The layer 520 is positioned between the surface of the electronic support 510 and the hole forming device 512 before the placement layer 52. 52 to provide support. According to another non-limiting example of the present invention, in which the inorganic solid lubricant is hexahedron boron nitride, a layer of hexahedron nitride butterfly can be directly applied to the outer surface of the phenolic paper = orifice, and the application method is to apply nitrogen Boron Dispersion (discussed previously) Spray or paint onto the surface. This type of entrance sheet material is well known in the industry and is commercially available as "Thick Paper Cardol Backing EB-95" from CenterUne, Baltimore, Maryland. A layer of hexahedron boron nitride is also directly applied to the electronic support 510 by spraying or brushing the boron nitride dispersion onto the surface 5 丨〇 5 丨 8, such as the upper surface, and the amount is sufficient to form the holes 514. Shaving 'provides predetermined drilling properties when the drill cone penetrates boron nitride for the first time. Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page). Although not limited by any particular theory, it is believed that when the drill cone 513 of the hole forming device 512 cuts through the lubricating layer 520, A portion of the inorganic solid lubricant 522 will adhere to the drill cone 513 and / or be brought into the hole-while providing lubrication during drilling. It is believed that if the inorganic solid lubricant 522 has a high thermal conductivity (discussed previously), the temperature of the drill cone 5 13 may decrease by heat conduction when drilling through the layer 520. -76-This paper size applies to Chinese National Standard (CNS) A4 (210X297). 552831 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of Invention (74 layer 520 contains one or more solid lubricants discussed above. In the present invention, the limit: a specific embodiment, the layer 52 may preferably include hexahedron nitride; if necessary, the layer 520 further includes other materials such as polymers and waxes. Another non-limiting of the present invention In a specific embodiment, the layer 520 includes at least one bonding material to bond individual particles of the solid lubricating material 522 together. However, the layer 520 of the lubricating material 522 without using the bonding material to be pressed together can also be used in the present invention. The present invention Non-limiting examples of useful bonding materials are believed to include emollients / bone agents such as polyvinylacetate, polyvinylacetate? Bihalidone; polyurethanes, ethyl acetate, polyacrylates, polymers Esters, fatty acid esters, polyphenols, polyglycidyl glycidaldehyde, and waxes are stone-like. In addition to bonding materials and inorganic solid lubricants, layer 520 contains organic lubricating materials such as hard Zinc acid, polytetrafluoroacetamidine, paraffin, fatty acids, fatty acid esters, and polyethylene glycol. Layer 520 has any thickness 526 needed to provide predetermined drilling characteristics. In one non-limiting embodiment, layer 520 It is made as thin as possible to provide the required drilling and handling features. It is expected that multiple electronic supports can be stacked and drilled in a single hole forming operation using the instructions of the present invention. With particular reference to Figure 6, one of the present invention is not In a limited embodiment, the first electronic support 61o and the second electronic support 611 can be stacked on each other, so the lower surface 628 of the first electronic support 61o is adjacent to the second electronic support 6 11 and the lower surface 6 1 8 The layer 620 containing the inorganic solid lubricant 622 is located adjacent to the first electronic support 6 1 0 and the upper surface 6 19 before the holes 6 14 are formed in the electronic supports 610 and 611 using the hole forming device 612. The industry understands that although Figure 6 shows that 610 and 611 are single-layer electronic supports, but its -77- paper size applies to China National Standard (CNS) A4 specifications (210X29 * 7 mm) (Please read the precautions on the back before filling this page )-Loading · d 552831 A7 B7 V. Description of the invention (75 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs, any type of electronic support known to the industry, including but not limited to multilayer laminates and printed circuit boards. It is further expected that the lubricant layer will form in the holes During operation, it is placed between the selected adjacent electronic supports. As shown in FIG. 7 in particular, the layer 740 containing the inorganic solid lubricant 742 can be placed on the lower surface 728 of the first electronic support 71 and the second electron before the holes are formed. The upper surface 718 of the support member 7Π. It is also expected that a multi-layer lubrication layer can be used to form the hole. For example, as discussed above, FIG. 5 shows that the electronic support member 510 has two lubrication layers 520 and 530 along the opposite side of the electronic support member 510 Main faces 518 and 528. In another non-ocular embodiment of the present invention shown in FIG. 7, there are a plurality of electronic support members 71G, 711, and a layer 740 including an inorganic solid lubricant 742 is disposed on the first electronic support member 71 and the second Between the electronic supporting members 711 and optionally, another layer 720 containing an inorganic solid lubricant 722 may be provided adjacent to the electronic supporting member 710 before the hole 714 is formed by the electronic supporting members 71 and 711 using the hole forming device 712. Upper surface 719. In a non-limiting specific embodiment of the present invention, a plurality of electronic supports are stacked together, and a layer containing an inorganic solid lubricant is placed between a plurality of metaphorical electronic supports. In addition, if necessary, the lubricating layer == any one or both sides of the exposed opposite main surface of the adjacent stacked electric support member / in another non-limiting embodiment of the method for forming a hole in an electronic support member according to the present invention, The at least one electronic support is aligned with the hole forming device so that the upper surface of the at least one electronic support is adjacent to the hole forming device. The mouth / facet-nitriding layer is disposed between the upper surface of the at least one electronic support and the hole forming device, and the hole forming device is used to form a hole = (Please read the precautions on the back before filling this page } -Installation · Ordering--78- 552831 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs A7 ____B7 V. Description of the invention (76) A small part runs through the thickness of at least one electronic support. The industry understands the aforementioned method of forming holes. In any method, the layer of the Baodong inorganic solid lubricant may be disposed on at least a part of the electronic support member to be drilled before positioning the hole-forming device of the electronic support member. Another non-limiting specific of the present invention In the embodiment, the solid lubricating material may be blended into the hole forming device. With particular reference to FIG. 8, the hole forming device 812 includes a drill cone 813, the drill cone has an outer surface 848, and the coating material 85 contains a layered solid lubricant 852. The outer surface 848 is above at least a portion 854. In a non-limiting embodiment of the present invention, the lubricant 853 is hexahedron boron nitride. Although the present invention is not limited, a specific embodiment The coating material 85 is located on at least a part of the cutting surface outside the drill cone 813. The coating material 85 on the outer surface 848 of at least part 854 of the drill cone 813 can be applied by known in the industry. Apply by any method. For example, the coating 850, especially the coating containing hexahedron boron nitride, can be sprayed, painted, sputtered, VD (chemical vapor phase), plasma deposition or pulsed laser deposition. A coating containing solid lubricant 852 may be formed by chemical methods. For example but not limitation, the invention, when applying a coating containing hexahedral nitride zeolite, the reaction product formed by the reaction of acid and melamine is applied to the drill On the outer surface of the cone, the drill cone is exposed to a temperature higher than 60 minutes to form a hexahedron boron nitride layer. In another non-limiting example of an alternative method of forming a hole forming device 812 according to the present invention, an inorganic solid lubricant 8 Lakes such as, but not limited to, powdery hexahedrons, and orally or powdery metals and / or carbides and transmission industry :: well-known powder metallurgy technology sintering aids to form drill cones. Related , -Step information can refer to " Self-lubricating bonded carbonized boron nitride __ -79- This paper ruler (CNS) (Please read the precautions on the back before filling out this page) • Binding d 552831 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs System A7 ——___ B7_ _V. Description of the invention (77) ", Japan's new material 咼 performance ceramics, Japan New Media International Co., Ltd. 丨 99 ^ September 2nd. The industry understands that the seven holes forming device 8 丨 2 can be combined Any of the methods for forming holes in the electronic support described in the previous article, or it can be used in the conventional method of forming holes. Especially when using the hole forming device 812 to form holes in the electronic support, (1) the electronic support is aligned with the holes. A device comprising a drill cone whose outer surface is at least partially coated with a coating material containing hexahedron boron nitride; (2) at least a portion of the first side of the hole-forming device contacting the electronic support; and (3 ) Penetrating at least the first side of the electronic support to form a hole that at least partially penetrates the electronic support. The present invention is further contemplated to include an electronic support and a circuit board made using a hole formation method whose details are discussed later. Non-limiting examples of the invention will now be illustrated by the following examples. The example combines one of the features of the present invention with a series of electrical-grade prepregs and laminates as follows: Laminate A: Electrically-grade 7628 E-glass fiber with electrical cleaning and heating and silane finishing using commercial prepreg equipment and technical immersion And prepreg by Nelco International Corporation of California for B-hardening (ie, partial hardening). The impregnated resin is an FR-4 epoxy resin with a Tg of 140 ° C, which is named 4000-2 epoxy resin by Nalco. Eight prepregs were stacked between the platens of the lamination press, with 1 ounce of copper foil on top and bottom of the stack. The laminates of the laminator were preheated to 93 ° C (200 ° F) and stacked under 0.1 million Baska (MPa) (16 psi) pressure for 4 minutes. Then the temperature is from 4.4 ° C to 6.6 ° C (8 ° F to 12T) -80-$ 's Zhang scale is applicable to China National Standard (cns) eight 4 specifications (2i〇 > < 297 公 ^ " ~~' f Please read the notes on the back before filling in this page, > • Binding

Jm 552831 A7 B7 經濟部中央標準局員工消費合作社印製五、發明説明（之速率提高至板溫達17rc(35(rF)。然後積層壓力提高至 2·3 MPa ( 3 50 psi)及維持6〇分鐘。積層物溫度首先藉水循環通過壓板歷25分鐘降低，然後空氣循環通過壓板歷“分叙降低，同時整個過程維持積層壓力。隨後解除加壓及積層物由積層壓機移開。積層物修整而形成積層物A。各積層物 <玻璃含量爲60至65%重量比之範圍。積層物八之維度爲 45.7(厘米）X61.0 厘米（18 忖 X24忖）。積層物B :積層物b係以積層物八之相同方式且使用相同材料製成，但有一層氮化硼施用於各組預浸物間，亦即積層物包括8預浸物層及7氮化硼層。特別·，各氮化硼層係使用氮化硼氣霧劑潤滑劑噴霧其中7層預浸物的主面至目測檢視顯7F均勻遮蓋爲止而以人工施用。氮化硼氣霧劑潤滑劑於市面上係得自田納西州橡樹脊ZYP塗層公司，含有氮化爛、丙嗣及推進劑。積層所含氮化硼總量由50克至70克。最後作爲積層物之外主面的預浸物任一面上未施用的氮化硼。由於噴霧塗層係以人工施用·，故氮化硼用量依各層而異且依各積層物而異。但預期各層包括每平方厘米預浸物 2.56至3.58毫克氮化硼。各積層物之玻璃含量係於70至75〇/〇重量比之範圍。積層物C : 50. 8厘米X 68· 6厘米（20吋X27吋）762 8型E-玻璃織物使用刷子以手工塗覆12〇克納爾可4000-2 FR-4環氧樹脂’將樹脂溶液均勻展開於織物上δ然後塗覆後織物於 154 C ( 3 10°F )空氣循環烘箱接受β階段硬化3至5分鐘而形成預浸物。織物爲經過加熱清潔且經過矽烷光整處理的電氣 -81 - 本紙張尺度適财關家標準（CNS)八4胁（21GX297公楚） (請先閱讀背面之注意事項再填寫本頁) -裝· 1· 552831 A7 B7 發明説明（級7628型環氧樹脂用織物，市面上得自維吉尼亞州林契柏各貝德芙編㉟公司。㈣積層物以積層物A所述相同方式經由堆疊及壓縮8層預浸物及2層銅络製成。各積層物之玻^ 含夏係於7 0至7 5 %重量比之範圍。積層物D ··積層物D係以積層物c之相同方式及相同材料製成’但FR- 4環氧樹脂包括氮化硼粒子。特別9克波樂森 160 7T面體氮化测粉末（討論如前）混合25克丙酮（市面上得自屬州匹茲堡費雪（Fischer)科學公司）而濕潤氮化硼且形成含26%重量比氮化硼的糊膏。然後糊膏分散於丨2〇克納爾可 4000-02環氧樹脂形成以總固體爲基準，含11%重量比氮化硼之之環氧樹脂。各積層物之玻璃含量係於7〇至75%重量比範圍。試·驗1 積層物A、B及D根據ASTM方法C-177 (特別併述於此以供參考）於300K (70°F溫度）於空氣中評估導熱率及熱阻。對所試驗之特定積層物B而言，積層物共含55克氮化硼。對各積層物測得之熱傳導係數示於下表1。 (請先閲讀背面之注意事項再填寫本頁：> -裝. 、π 4 經濟部中央標準局員工消費合作社印製 -82- 本紙張尺度適用中國國家標準（CNS ) Α4規格（公釐）、發明説明（8〇Jm 552831 A7 B7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. 5. The description of the invention was increased to a plate temperature of 17rc (35 (rF). Then the lamination pressure was increased to 2.3 · MPa (3 50 psi) and maintained at 〇minutes. The temperature of the laminate is first lowered by circulating water through the platen calendar for 25 minutes, and then the air is circulated through the platen calendar to "reduce and reduce, while maintaining the laminate pressure throughout the process. The pressure is then released and the laminate is removed by the laminate machine. Trim to form laminate A. Each laminate < glass content is in the range of 60 to 65% by weight. The eight dimensions of the laminate are 45.7 (cm) x 61.0 cm (18 忖 X24 忖). Laminate B: Lamination Object b is made in the same way and using the same material as layer eight, but a layer of boron nitride is applied to each group of prepregs, that is, the layer includes 8 prepreg layers and 7 boron nitride layers. Special · Each boron nitride layer is manually applied by spraying the main surface of 7 layers of prepregs with a boron nitride aerosol lubricant until the visual inspection shows that 7F is evenly covered. The boron nitride aerosol lubricant is on the market Tied up from Tennessee Oak Ridge ZYP coating company, containing nitriding rot, propidium, and propellant. The total amount of boron nitride contained in the layer is from 50 grams to 70 grams. Finally, it is not applied on any side of the prepreg as the main surface other than the layer. Boron nitride. Since the spray coating is applied by hand, the amount of boron nitride varies from layer to layer and from layer to layer. However, each layer is expected to include 2.56 to 3.58 mg of boron nitride per square centimeter of prepreg. Each The glass content of the laminate is in the range of 70 to 75/0 by weight. Laminate C: 50. 8 cm X 68. 6 cm (20 inches X 27 inches) 762 Type 8 E-glass fabric is manually coated using a brush 120 grams of Narco 4000-2 FR-4 epoxy resin 'spread the resin solution evenly on the fabric δ and then coated the fabric in a 154 C (3 10 ° F) air circulation oven to undergo β-stage hardening for 3 to 5 minutes The prepreg is formed. The fabric is electric cleaned by heating and silane-finished. -81-This paper is a standard suitable for households (CNS) Yabashi (21GX297). (Please read the precautions on the back first. (Fill in this page)-1 · 552831 A7 B7 Description of invention (Class 7628 epoxy fabric , Available on the market from Lynchberger Bedford Editing Company, Virginia. The laminate is made by stacking and compressing 8 layers of prepreg and 2 layers of copper in the same manner as described for laminate A. Each Laminated glass ^ Contains summer series in the range of 70 to 75% by weight. Laminated D · Laminated D is made in the same way and the same material as laminated c ', but FR-4 epoxy resin includes Boron nitride particles. Special 9 grams of Poleson 160 7T isahedron nitride powder (discussed as before) mixed with 25 grams of acetone (available from Fischer Scientific Company, Pittsburgh State) to wet the boron nitride and A paste containing 26% by weight of boron nitride was formed. The paste is then dispersed in 20 grams of Narco 4000-02 epoxy resin to form an epoxy resin containing 11% by weight of boron nitride based on total solids. The glass content of each laminate is in the range of 70 to 75% by weight. Test · Examination 1 Laminates A, B, and D were evaluated for thermal conductivity and thermal resistance in air at 300K (70 ° F) in accordance with ASTM method C-177 (specifically described herein for reference). For the particular laminate B tested, the laminate contained a total of 55 grams of boron nitride. The thermal conductivity measured for each laminate is shown in Table 1 below. (Please read the precautions on the back before filling in this page: > -install. Π 4 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs -82- This paper size applies to China National Standard (CNS) Α4 specifications (mm) 、 Explanation of invention (8〇

:…、表1 ’積層物肢D (皆#混氮化硼)之熱傳導係數測係馬於積層物A之熱傳導係數測量値。特別結合本發明〈特色之積層物B之傳導係數測量値高於積層#A5〇%，而 (請先閲讀背面之注意事項再填寫本頁) 、、”本發明#色（積層&d之熱傳導係#丈測量値係高於積層物 A 45% 〇經濟部中央標準局員工消費合作社印製基於前述資料，本發明之非限制性具體實施例中，電子支撐件係呈積層物形式，積層物包含一第一預浸物層；一第二預浸物層位置毗鄰第一預浸物層之主面；以及至少一層含六面體氮化硼粉末位於第一預浸物層與第二預浸物層間’以總固體爲基準’該至少一層包含佔至少一部份層總重大於2 5 %重量比之黏著材料，該種電子支撐件之熱傳導係數至少爲0· 27 W/ mK。一非限制性具體實施例中，前述電子支撐件之熱傳導係數至少爲〇 . 29 W/ mK。另一非限制性具體實施例中，前述電子支撐件之熱傳導係數至少爲 83 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 552831 經濟部中央標準局員工消費合作社印製 A7 -----·~_______Β7__五、發明説明--- 〇· 3 1 W/mK 〇入本發明之另—非限制性具體實施例中，t子支撐件其包 t積層物包含二或多預浸物層，二或多預浸物層中之2少 :層包含(1)至少一種織造玻璃纖維加強材料係由不含玄武岩玻璃之纖維製成；以及（2)至少一種基體材料其接S該至卜種加強材料之-部份，該至少_種基體材料包含⑴至乂種非氟化聚合物，（ii) 一種環氧樹脂，以及（iii)至少一種含六面體氮化硼粉末之無機填料，以及其中基準，該至少-種無機填料係佔至少一種丄一種基體材料合併總重之至少6%重量比，該電子支撐件之熱傳導係數至少爲〇·27 W/mK。另一非限制性具體實施例，前述電子支撐件之熱傳導係數至少爲〇·29 w/mK。'又另一非限制性具體實施例中，前述電子支撐件之熱傳導係數至少爲0.31 W/mK。試驗2 積層物A、B、C及D接受測試評估鑽尖的磨耗。參照圖 9 ’ 「鑽尖磨耗」一詞用於此處表示於鑽尖周緣測量，鑽頭 974之主切削緣972之寬度970縮小。鑽孔係對3層咼之積層物堆®進行，積層物帶有〇. 〇 1 〇 $忖 (0· 2667毫米）厚度鋁進入層及〇· 〇82吋（2· 083毫米）厚度紙芯酚系樹脂塗層之襯墊。一次鑽孔三層積層物通常爲業界之標準實務。對0.018吋（ 0.4572毫米）直徑鑽頭測量鑽尖磨耗。鑽頭爲德國史溫豪森Η AM公司供給的固體碳化物爲绩頭。鑽孔期間碎屑負載量維持恆定於〇· 00125。用於此處 -84- 本纸張尺度適用中國國家標準（CNS ) A4$格（210X297公釐） " 一 (請先閲讀背面之注意事項再填寫本頁) .裝-: ..., Table 1 The measurement of the thermal conductivity of the laminated object D (all #mixed boron nitride) is the measurement of the thermal conductivity of the laminated product A. Particularly combined with the present invention <the measurement of the conductive coefficient of the characteristic laminate B> is higher than the laminate # A50%, and (please read the precautions on the back before filling this page), "" present invention #color (layer & d Thermal conductivity #Measurement is 45% higher than laminate A. 〇 Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. Based on the foregoing information, in a non-limiting specific embodiment of the present invention, the electronic support is in the form of a laminate. The object includes a first prepreg layer; a second prepreg layer is located adjacent to the main surface of the first prepreg layer; and at least one layer of hexahedron-containing boron nitride powder is located on the first prepreg layer and the second The prepreg layer is based on the total solids. The at least one layer contains an adhesive material that accounts for at least a part of the total weight of the layer is greater than 25% by weight. The thermal conductivity of the electronic support is at least 0. 27 W / mK. In a non-limiting specific embodiment, the thermal conductivity of the aforementioned electronic support is at least 0.29 W / mK. In another non-limiting specific embodiment, the thermal conductivity of the aforementioned electronic support is at least 83 country Standard (CNS) A4 specification (210X297 mm) 552831 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs A7 ----- · ~ _______ Β7__ V. Description of the invention --- 0.3 W / mK In addition, in a non-limiting specific embodiment, the t-support member includes two or more prepreg layers, and two of the two or more prepreg layers: the layer includes (1) at least one woven glass The fiber-reinforced material is made of fiber without basalt glass; and (2) at least one matrix material is connected to a part of the reinforcing materials, and the at least one matrix material contains ⑴ to 非 non-fluorinated Polymer, (ii) an epoxy resin, and (iii) at least one hexahedral boron nitride powder-containing inorganic filler, and wherein, based on the at least one inorganic filler, the combined total weight of at least one kind of matrix material With a weight ratio of at least 6%, the thermal conductivity of the electronic support is at least 0.27 W / mK. In another non-limiting specific embodiment, the thermal conductivity of the aforementioned electronic support is at least 0.29 w / mK. In another non-limiting specific embodiment, the foregoing electronic branch The thermal conductivity of the brace is at least 0.31 W / mK. Test 2 Laminates A, B, C, and D are tested to assess the wear of the drill tip. Refer to Figure 9 'The term' wear of the drill tip 'is used here to indicate the drill tip Measured around the periphery, the width 970 of the main cutting edge 972 of the drill bit 974 is reduced. The drilling is performed on a 3-layer stack of stacks, with the stack having a thickness of 0.001 〇 $ 忖 (0 · 2667 mm) into the layer. And 〇82. Inch (2.083mm) thick paper core phenolic resin-coated liners. One-time drilling of three-layer laminates is usually standard practice in the industry. Measure the point of a 0.018-inch (0.4572mm) diameter drill bit. Attrition. The drill was a solid carbide supplied by Schwanhausen AM, Germany. The chip load during drilling was kept constant at 0.00125. Used here -84- This paper size applies Chinese National Standard (CNS) A4 $ format (210X297 mm) " First (Please read the precautions on the back before filling this page). Packing-

、1T d 552831 A7 B7 五、發明説明（82 ) 「碎屑負載量」一詞表示鑽頭鑽入速率（以每分鐘吋數測量）對主軸速率（以每分鐘轉速（rpm)測量）之比。主軸速度爲 100, 000 rpm及鑽入速度爲每分鐘125吋（317·5厘米）。回縮速度爲每分鐘1000吋（25.4米）。鑽孔係使用普利泰單主軸多站台鑽孔機進行’得自義大利布維洛普利泰公司。各積層物類別有4堆三層積層物接受鑽孔。對各積層物類別之第一堆使用單站鑽孔1000孔。各積層物類別之第二積層物堆疊使用單鑽鑽孔2000孔，而各積層物類別之第三堆疊積層物使用單鑽鑽孔3000孔，及各積層物類別之第四堆疊積層物使用單鑽鑽孔4000孔。鑽孔各堆疊後測量鑽尖磨耗。爲了基於鑽孔總數比較鑽尖磨耗，以及考慮由各鑽孔的總厚度及積層物厚度變化，決定各鑽頭之鑽頭磨耗係數。用於此處「鑽頭磨耗係數」以及Γ」表示每一段鑽孔距離之鑽尖磨耗量且使用下式計算： =_鑽尖磨耗 _ 3X(積層物厚度）x(鑽孔數）經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 例如若鑽孔一堆疊3積層物個別厚1 524微米（〇· 〇6忖）共 3000孔後，鑽尖磨耗爲6微米，則鑽頭磨耗係數爲〇.437微米/米，換言之，對所鑽每米板厚度之鑽尖磨耗爲〇.43 7微米。此外，各組積層物之鑽頭磨典係數求平均而獲得前文討論之以10, 〇〇〇孔爲基礎之平均鑽頭磨耗係數料。表2顯不四組積層物之及平均。 -85- 本紙張尺度適用中國國家標準（CNS ) a4規格（210X297公釐） 552831 A7 B7 五、發明説明（83 ) 表2 鑽頭磨; fe係數（微米/米）積層物厚度 (毫米）所鑽孔數平均 1000 2000 3000 4000 A 1.4224-1.4986 0.6534 1.0785 0.5392 0.5786 0.7124 B 1.6256-1.6764 0.5628 0.5668 0.5314 0.5038 0.5412 C 1.1684-1.1938 0.6376 0.6770 0.5786 0.4920 0.5963 D 1.1938-1.2954 0.5943 0.5274 0.5038 0.4605 0.5215 (請先閱讀背面之注意事項再填寫本頁) 比較積層物A及B，二者包括經商業處理之預浸物，含氮化硼之積層物B之鑽頭磨耗係數係低於未含氮化硼之積層物 A之鑽頭磨耗係數◊同理當比較皆含所供製造之預浸物之積層物C及D時，含積層物D之氮化硼之鑽頭磨耗係數係低於未含氮化砸I之積層物C。試驗結果指示添加氮化硼之積層物無論係含於環氧樹脂或作爲預浸物間之一層皆可減低鑽尖磨耗傾向。業界人士了解可未悖離本發明之構想對前文討論之具體實施例作變化。因此本發明並非限於所揭示之特定具體實施例，反而意圖涵蓋如隨附之申請專利範圍界定之本發明之精髓及範圍内的全部修改。經濟部中央標準局員工消費合作社印製 -86- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）1T d 552831 A7 B7 V. Description of the invention (82) The term "debris load" means the ratio of the drill bit penetration rate (measured in inches per minute) to the spindle speed (measured in revolutions per minute (rpm)). The spindle speed was 100,000 rpm and the drilling speed was 125 inches (317 · 5 cm) per minute. Retraction speed is 1000 inches (25.4 meters) per minute. Drilling was carried out using a Priti single-spindle, multi-station drilling machine 'from the company Bulillo-Pulita, Italy. There are 4 stacks of three-layer stacks in each stack type for drilling. Use a single station to drill 1000 holes for the first pile of each layered category. The second stack of each laminate category uses a single drill to drill 2000 holes, while the third stack of each laminate category uses a single drill to drill 3,000 holes, and the fourth stack laminate of each laminate category uses a single drill. Drill 4,000 holes. Measure the wear of the drill tip after drilling each stack. In order to compare the wear of the drill tip based on the total number of drill holes, and to consider the change in the total thickness of each drill hole and the thickness of the laminate, the drill wear coefficient of each drill bit is determined. “Abrasion coefficient of drill bit” and Γ ”are used here to indicate the amount of abrasion of the drill tip for each drilling distance and are calculated using the following formula: = _ Drill point abrasion_ 3X (layer thickness) x (number of holes) Central Ministry of Economic Affairs Printed by the Consumer Bureau of the Standards Bureau (please read the precautions on the back before filling out this page). For example, if you drill a stack of 3 laminates with a thickness of 1 524 microns (〇 · 〇6 忖) for a total of 3000 holes, the wear of the drill tip is 6 micrometers, the drill bit wear coefficient is 0.437 micrometers / meter, in other words, the wear of the drill point per meter of plate thickness is 0.43 7 micrometers. In addition, the drill bit grinding coefficients of each layer of the laminate are averaged to obtain the average drill wear coefficient material based on 10,000 holes discussed above. Table 2 shows the sum of the four groups of laminates. -85- This paper size is in accordance with Chinese National Standard (CNS) a4 specification (210X297 mm) 552831 A7 B7 V. Description of the invention (83) Table 2 Drill grinding; fe factor (micrometer / meter) Thickness of laminate (mm) Drilled Average number of holes 1000 2000 3000 4000 A 1.4224-1.4986 0.6534 1.0785 0.5392 0.5786 0.7124 B 1.6256-1.6764 0.5628 0.5668 0.5314 0.5038 0.5038 C 1.1684-1.1938 0.6376 0.6770 0.5786 0.4920 0.5963 D 1.1938-1.2954 0.5943 0.5274 0.5038 0.4605 0.5215 (Please read the note on the back first Please fill in this page again.) Compare Laminates A and B, both of which include commercially processed prepregs. The drill bit wear coefficient of Laminate B with BN is lower than that of Laminate A without BN. The abrasion coefficient is the same. When comparing the laminates C and D both containing the prepared prepreg, the abrasion coefficient of the drill with boron nitride containing the laminate D is lower than the laminate C without the nitride I. The test results indicate that the addition of boron nitride-containing laminates, whether contained in epoxy resin or as a layer between prepregs, can reduce the tendency of the drill tip to wear. Those skilled in the art understand that the specific embodiments discussed above may be changed without departing from the concept of the present invention. Therefore, the present invention is not limited to the specific specific embodiments disclosed, but is intended to cover the essence of the present invention and all modifications within the scope as defined by the scope of the attached patent application. Printed by the Employees' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs -86- This paper size applies to the Chinese National Standard (CNS) A4 (210X297 mm)

Claims

552831 A8 B8 C8 D8 '申請專利範圍經濟部智慧財產局員工消費合作社印製 L 一種電子支撐件，包含： A.至少一種織造纖維加強材料其係由至少一種不本武岩玻璃之纖維製成；以及 "Β·至少一種基體材料其係接觸該至少一種加強材料之至/ 4 4至少一種基體材料包含至少一種非氣化聚合物以及至少一種無機填料，其中該至少一種血機填料包含至少一種非可水合之層狀無機固體潤滑劑並且有高電阻係數’以及其中該至少一種無機填料包含以總固體馬基準係佔該至少-種無機填料以及至少—種基體材料之至少6%重量比。 · 2. 如申請專利範圍第丨項之電子支撐件，其中該至少一種織造纖維加強材料包含至少一種破璃纖維。 3. 如申請專利㈣第2項之電子支撐件，其中該織造纖維加強材料爲未經去脂的織造玻璃纖維加強材料。 4. 如申請專利範圍第W之電子支撐件，其中該織造玻璃纖維加強材料包含至少-種含有不大於5%重量比鐵之玻璃纖維。 5. 如申請專利範圍第4項之電子支撐件，其中該至少一種織造坡璃纖維加強材料係大致不含玄武岩玻璃纖維。 6·如中請專利範圍第工項之電子支撐件，其中該至少一種基體材料爲大致不含氟化聚合物。 7· ^申請專利範圍第1項之電子支撐件，其中該至少一種無機塡料爲粒狀無機填料 8.如申請專利範圍第7項之電子支撐件，纟中該至少種閱面之注事 * 項血I5裝 # I I I I I訂線 x 297公釐） 552831 A8 B8 C8 D8 申請專利範圍無機填料具有摩氏硬度（Mohs，hardness)不大於6。 9·如申請專利範圍第7項之電子支撐件，其中該至少一種無機填料具有高熱傳導係數。 10.如申請專利範圍第9項之電子支撐件，其中該熱傳導係數至少爲30 W/mK。 11·如申請專利範圍第7項之電子支撐件，其中該至少一種無機填料具有低熱膨脹係數。 12·如申請專利範圍第11項之電子支撐件，其中該熱傳導係數於(TC至20(TC之溫度範圍係不大於ιοοχ 10-7/°C。 13·如申請專利範圍第7項之電子支撐件，其中該無機固體潤滑劑係選自六面體氮化硼、金屬二硫屬化物、硼酸、及前述任一者之混合物。 14·如申請專利範圍第13項之電子支撐件，其中該無機固體潤滑劑爲六面體氮化硼。 15. 如申請專利範圍第1項之電子支撐件，其中該電子支撐件爲一預浸物層。 16. 如申請專利範圍第15項之電子支撐件，其中該纖維加強材料及基體包含一第一預浸物層以及進一步包含至少一額外預浸物層黏附於該第一預浸物層之主面之至少部份。 Π·如申請專利範圍第16項之電子-支撐件，包含至少一種導電材料接觸電子支撐件之至少一部份。 18·如申請專利範圍第i項之電子支撐件，包含灵少一種導電材料接觸電子支撐件之至少一部份。 88- 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 X 297公釐） (請先閱讀背面之注意事填寫本頁) -裝 ---訂---------線· 經濟部智慧財產局員工消費合作社印制衣 552831 A8 B8 C8552831 A8 B8 C8 D8 'Scope of patent application Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs L An electronic support comprising: A. At least one woven fiber reinforced material made of at least one kind of non-Wuyan glass fiber; And " B. At least one matrix material which is in contact with the at least one reinforcing material / 4 4 at least one matrix material comprises at least one non-gasified polymer and at least one inorganic filler, wherein the at least one blood organ filler comprises at least one The non-hydratable layered inorganic solid lubricant has a high resistivity 'and wherein the at least one inorganic filler comprises at least 6% by weight of the at least one inorganic filler and the at least one matrix material based on the total solid horse basis. · 2. The electronic support according to the scope of the patent application, wherein the at least one woven fiber reinforcing material includes at least one glass-breaking fiber. 3. For example, the electronic support of the second item of the patent application, wherein the woven fiber reinforced material is a woven glass fiber reinforced material without degreasing. 4. The electronic support according to claim W, wherein the woven glass fiber reinforced material comprises at least one glass fiber containing not more than 5% by weight iron. 5. The electronic support according to item 4 of the patent application, wherein the at least one woven slope glass fiber reinforced material is substantially free of basalt glass fibers. 6. The electronic support according to the item in the patent application, wherein the at least one matrix material is substantially free of fluorinated polymers. 7. ^ The electronic support of the scope of the patent application No. 1 in which the at least one inorganic filler is a granular inorganic filler 8. If the electronic support of the scope of the patent application No. 7 in the patent, the at least one kind of reading notes * Item Blood I5 Pack # IIIII Thread x 297 mm) 552831 A8 B8 C8 D8 Patent application scope Inorganic filler has Mohs (hardness) of not more than 6. 9. The electronic support member according to item 7 of the patent application scope, wherein the at least one inorganic filler has a high thermal conductivity coefficient. 10. The electronic support according to item 9 of the patent application scope, wherein the heat transfer coefficient is at least 30 W / mK. 11. The electronic support member according to item 7 of the application, wherein the at least one inorganic filler has a low thermal expansion coefficient. 12. If the electronic support of item 11 in the scope of patent application, wherein the thermal conductivity coefficient is between (TC to 20 (TC temperature range is not greater than ιοοχ 10-7 / ° C. 13) If the electronic scope of the patent application item 7 A support, wherein the inorganic solid lubricant is selected from the group consisting of hexahedron boron nitride, metal dichalcogenide, boric acid, and any one of the foregoing. 14. The electronic support according to item 13 of the application, wherein The inorganic solid lubricant is hexahedron boron nitride. 15. The electronic support member according to item 1 of the patent application, wherein the electronic support member is a prepreg layer. 16. The electronic device according to item 15 of the patent application The support, wherein the fiber-reinforced material and the matrix include a first prepreg layer and further include at least a portion of an additional prepreg layer adhered to at least a portion of the main surface of the first prepreg layer. The electronic-support member of the scope item 16 includes at least one conductive material contacting at least a part of the electronic support member. 18. The electronic support member of the scope of application i of the patent application includes a less-than-one conductive material contacting the electronic support member. At least part of it. 88- This paper size applies to China National Standard (CNS) A4 (21〇X 297mm) (Please read the notes on the back first and fill in this page) ---- Line · Printing of clothing by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 552831 A8 B8 C8

六、申請專利範圍 19·如申請專利範圍第”員之電子支撐件，其中該至少一種無機填料具有至少一種選自（幻摩氏硬度不大於6，（b)熱傳導係數大於30 W/mK，（c)低熱膨脹係數，及（d)對= 屬離子之高度親和力中之性質。至 20· —種電子支撐件，包含·· A.至少一種織造纖維加強材料；以及 B·至少一種基體材料其係接觸該至少一種加強材料之至少一郅份，該至少一種基體材料包含至少一種非氟化聚合物以及至少一種無機填料，其中該至少一種無機媢料包含至少-種非可水合之層狀無機固體潤滑劑复具二高電阻係數，以及其中該至少_種無機填料包含：：體爲基準係佔該至少一種無機填料以及至少一種義〜料之大於10〇/〇重量比。土材一裡，电亍叉得件 A·至少一種織造纖維加強材料其係由至少一種不本、武岩玻璃之纖維製成；以及、各叉之化 B.至少-種基體材料其係接觸該至少_種加至少一邵份，該至少一種基體材料包含至少一種聚合物以及至少一種無機填料，並化料包含至少-種具有熱傳導係數阻係數之無機填料，以及其中爲至少一種無機填料：：種以總固體馬基準係佔該至少一種無機填料以及至心一-基體材料之至少6%重量比。 ^ 消維 22.如申請專利範圍第21項之電子支撐件，其中該織造纖 -89 - 297公釐）本紙張尺度 f關家標準（CNS)A4規格（21〇1 552831 A8B8C8D8 經濟部智慧財產局員工消費合作社印制衣六、申請專利範圍加強材料爲未經去脂的織造玻璃纖維加強材料。 23·如申請專利範圍第21項之電子支撐侔潤滑劑爲六面體氮化删。纟中該無機固體 24]口申請專利範圍第21項之電子支撐件，其中該熱傳導係欠於0C至200 C之溫度範圍係不大於1〇〇χ 1〇力乇。 25. 如申請專利範圍第21項之電子支撐件，其中該纖維加強材料及基體包含-第-預浸物層以及進—步包本至少一額外預浸物層黏附於該第一預浸物層之主面之份。 1 26. 如申請專利範圍第21項之電子支撑件，包含至少_種導電材料接觸電子支撐件之至少一部份。 27·如申請專利範圍第21項之電子支撑件，其中該至少一種無機填料對金屬離子具有高度親和力。 28. —種電子支撐件，包含： A ·至少一種織造纖維加強材料；以及 B·至少一種基體材料其係接觸該至少一種加強材料之至y碍伤，孩至少一種基體材料包含至少一種非氟化术口物以及至少一種抶機塡料，其中該至少一種無機填料包各至少一種具有熱傳導係數至少3〇 w/mk以及高電阻係數之無機填料，以及其中該至少—種無機填料包含 U 爲基準係佔該至少 '種無機填料以及至少一種基體材料之大於1 〇%重量比。 29. —種電子支撐件，包含： A ·至少一種纖維加強材料；以及 -90- 本紙張尺度適用中國國家標準（CNS)A4規格Sixth, the scope of patent application 19. The electronic support member of the "member of the scope of patent application", wherein the at least one inorganic filler has at least one selected from (the magic Mohs hardness is not greater than 6, (b) the thermal conductivity is greater than 30 W / mK, (C) low thermal expansion coefficient, and (d) properties in a high affinity for = ions. To 20 · —an electronic support, including ... A. at least one woven fiber reinforced material; and B. at least one matrix material It is in contact with at least one part of the at least one reinforcing material, the at least one matrix material comprises at least one non-fluorinated polymer and at least one inorganic filler, wherein the at least one inorganic material comprises at least one non-hydratable layer The inorganic solid lubricant has two high electrical resistivities, and wherein the at least one inorganic filler comprises: a basis of more than 10/0 by weight of the at least one inorganic filler and at least one meaning. Here, the electric fork has a piece A · at least one woven fiber reinforced material, which is made of at least one non-standard, Wuyan glass fiber; and B. at least one base material which is in contact with the at least one plus at least one part, the at least one base material contains at least one polymer and at least one inorganic filler, and the chemical compound contains at least one inorganic material with a thermal conductivity coefficient of resistance Filler, and at least one inorganic filler therein: a kind that accounts for at least 6% by weight of the at least one inorganic filler and the core-matrix material based on the total solid horse system. Electronic support, in which the woven fiber -89-297 mm) This paper standard f family standard (CNS) A4 specifications (21101552552A8B8C8D8 Reinforcing material is woven glass fiber reinforced material without degreasing. 23 · If the electronic support of item 21 of the patent application, the lubricant is hexahedron nitride. The inorganic solid 24] in the application of patent scope 21 Item of the electronic support, wherein the thermal conduction is less than 0C to 200 C temperature range is not more than 100 × 10 force. 25. If a patent is applied for The electronic support according to item 21, wherein the fiber-reinforced material and the matrix include a first-prepreg layer and a step-pack at least one additional prepreg layer adhered to a main surface of the first prepreg layer 1 26. If the electronic support according to item 21 of the patent application includes at least one conductive material contacting at least a part of the electronic support. 27. If the electronic support according to item 21 of the patent application, wherein at least An inorganic filler has a high affinity for metal ions. 28.-An electronic support comprising: A · at least one woven fiber reinforcement material; and B · at least one matrix material which is in contact with the at least one reinforcement material to prevent damage, The at least one base material includes at least one non-fluorinated mouthpiece and at least one concrete filler, wherein each of the at least one inorganic filler package has at least one inorganic filler having a thermal conductivity of at least 30 w / mk and a high resistivity, and Wherein the at least one inorganic filler contains U as a basis, it accounts for more than 10% by weight of the at least one inorganic filler and at least one matrix material. . 29. An electronic support, including: A · at least one fiber-reinforced material; and -90- This paper size applies to China National Standard (CNS) A4

六、申請專利範圍 B·至少-種基體材料其係接觸該至少一種織造纖維加材科疋至少一部份’該基體材料包含至少一種無機填、’其含量足夠由於導電性陽極長絲形成貫穿電子支撐件之厚度而爲足夠抑制電短路之含量。 30· ^申請專利範圍第29項之電子支撐件，其中該至少一種操機填料對金屬離子具有高度親和力。 31·如申請專利範圍第30項之電子支撐件，其中該至少一種織U纖維加強物爲織造玻璃纖維加強物。 32·如申請專利範圍第31項之電子支撐件，其中該織造纖維加強材料爲未經去脂之織造玻璃纖維加強材料。 33·如申，專利範圍第3〇項之電子支撐件，其中該無機填料具有陽離子交換能力至少2〇毫當量/1〇〇克。从如申請專利範圍第33項之電子支撐件，其中該無機填料具有陽離子交換能力至少8〇毫當量/1〇〇克。、 35·如申請專利範圍第33項之電子支撐件，其中該無機填料爲一種選自蒙脱土、矽鐵石、包土、伊莱石（水合雲母）、蛭石、亞氣酸鹽、海泡石、美國活性白土、膨二土、水輝石、合成含氟雲母及其混合物之黏土材料。經濟部智慧財產局員工消費合作社印製 36·如申請專利範圍第3〇項之電子支撐件，其中該無機填料具有分配係數Kd ( Cu2+)至少600毫克/升。 37.如申請專利範圍第36項之電子立撐件，其中該無機填料具有分配係數1^((：112+)至少1500毫克7升。 38·如申請專利範圍第3〇項之電子支撐件，其中該至少〜無機填料爲一種螯合劑選自帶有含氮有機官能基、 -91 - 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 552831 頜- ---------— D8_ 六、申請專利範圍有機έ &基、含氧有機官能基、含鱗有機官能基之材料及其混合物。 39· ^申凊專利範圍第3〇項之電子支撐件，其中該無機填料爲可膨服黏土材料。 4〇·如申请專利範圍第3〇項之電子支撐件，其中該無機填料 /、有至乂、種選自摩氏硬度不大於6，（b)低熱膨脹係數，（c)良好潤滑性質，（d)高熱傳導係數以及（e)高電阻係數之性質。 41·如申請專利範圍第3〇項之電子支撐件，其中纖維加強材料及基體包含一第一預浸物層以及進一步包含至少一額外預浸物層係黏附於該第一預浸物層之主面之至少部份。 42. 如申請專利範圍第3〇項之電子支撐件，進一步包含—種導電材料係接觸電子支撐件之至少—部份。 43. 如申請專利範圍第3〇項之電子支撐件，其中該對金屬離子具高度親和力之無機填料以總固體爲基準係佔基體材料及至少一種拱機填料之合併總重之至多1 重量比。 44. 如申！專利範圍第29項之電子支撐件’其中該對金屬離子具向度親和力之無機填料以總固體爲基準係#基體材料及至少-種無機填料之合併總重之至多跳重量比。 45· —種電子支撐件，包含： A·至少一種製造纖維加強材料；以及 B ·至少一種基體材料其係接觸該至少一種織造纖維加強材料之至少一部份，該基體材料包含至少一種無機填 (請先閱讀背面之注咅？事項再填寫本頁) r:-裂--------^訂---------線· 經濟部智慧財產局員工消費合作社印製 -92- 552831Sixth, the scope of patent application B. At least one kind of base material which is in contact with the at least one kind of woven fiber plus material. At least a part of the base material contains at least one inorganic filler. The content is sufficient due to the formation of conductive anode filaments. The thickness of the electronic support is a content sufficient to suppress electrical shorts. 30. ^ The electronic support of claim 29, wherein the at least one actuator filler has a high affinity for metal ions. 31. The electronic support of claim 30, wherein the at least one woven U fiber reinforcement is a woven glass fiber reinforcement. 32. The electronic support of claim 31, wherein the woven fiber reinforcing material is a non-defatted woven glass fiber reinforcing material. 33. As claimed, the electronic support of item 30 of the patent, wherein the inorganic filler has a cation exchange capacity of at least 20 milliequivalents / 100 grams. The electronic support member according to item 33 of the patent application range, wherein the inorganic filler has a cation exchange capacity of at least 80 milliequivalents / 100 grams. 35. The electronic support according to item 33 of the patent application scope, wherein the inorganic filler is a member selected from the group consisting of montmorillonite, wollastonite, clay, illite (hydrated mica), vermiculite, argonate, sea Clay materials of Sepiolite, American activated clay, bentonite, hectorite, synthetic fluorine-containing mica and mixtures thereof. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 36. For example, the electronic support of item 30 in the patent application scope, wherein the inorganic filler has a partition coefficient Kd (Cu2 +) of at least 600 mg / liter. 37. The electronic stand member according to item 36 of the patent application, wherein the inorganic filler has a partition coefficient of 1 ^ ((: 112+) at least 1500 mg and 7 liters. 38. The electronic support member according to item 30 of the patent application , Where the at least ~ inorganic filler is a chelating agent selected from the group consisting of nitrogen-containing organic functional groups, -91-This paper size applies to Chinese National Standard (CNS) A4 specifications (210 X 297 mm) 552831 Jaw---- -------- D8_ VI. Patent application scope Organic & group, oxygen-containing organic functional group, scale-containing organic functional group materials and mixtures thereof 39. ^ Electronic support of the 30th patent application The inorganic filler is an expandable clay material. 40. The electronic support of item 30 in the scope of the patent application, wherein the inorganic filler /, to 乂, and the species are selected from Mohs hardness not greater than 6, ( b) Low thermal expansion coefficient, (c) Good lubricating properties, (d) High thermal conductivity coefficient and (e) High electrical resistivity properties. 41. For example, the electronic support of the 30th scope of the patent application, wherein the fiber reinforced material and the matrix Including a first prepreg layer and further The layer containing at least one additional prepreg is adhered to at least a portion of the main surface of the first prepreg layer. 42. For example, the electronic support of claim 30, further comprising a conductive material contacting the electrons At least part of the support. 43. The electronic support of claim 30, wherein the inorganic filler having a high affinity for metal ions accounts for the base material and at least one archer filler based on the total solids. The combined total weight is at most 1 weight ratio. 44. As claimed! The electronic support of item 29 of the patent, wherein the inorganic filler having a pairwise affinity for metal ions is based on the total solids #base material and at least one kind of inorganic The combined total weight of the fillers is at most a jump weight ratio. 45. An electronic support comprising: A. at least one manufactured fiber reinforced material; and B. at least one matrix material that is in contact with at least one of the at least one woven fiber reinforced material In part, the base material contains at least one inorganic filler (please read the note on the back? Matters before filling out this page) r: -Crack -------- ^ Order --------- line · Warp Intellectual Property Office employees consumer cooperatives printed -92-552831

六、申請專利範 :材：係選自具有陽離子交換能力至少2。毫當量/H)〇克〈村枓、可膨脹性黏土材料及其組合。種形成電子支撐件之方法，該方法包含： A·組合至少一種無機填料與至少一種溶劑材料· B·分散該至少一種無機填料以及至少一種溶劑材料於至少一種基體材料；触C ·該包含至少一種無機填料分散於其中的至少一種基把材料接觸至少一種加強材料而形成一預浸物層；以及 D ·至少部份硬化該預浸物層之至少一種基體材料。 47·如申睛專利範圍第46項之方法，其中該至少_種無機填料爲六面體氮化硼。 48·如申請專利範圍第46項之方法，其中該至少_種溶劑係選自丙酮、二甲基甲醯胺、二氣曱烷、二醇醚、異丁酮及削述任一者之混合物。 49.如申請專利範圍第46項之方法，進一步包含將預浸物層積層至少一額外預浸物層，讓該至少一額外預浸物層之主面係緊鄰該預浸物層之一主面。經濟部智慧財產局員工消費合作社印制衣 93- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）6. Application for patent: Material: It is selected from at least 2 with cation exchange capacity. Milli-equivalent / H) 0 g <Village, expandable clay material and combinations thereof. A method for forming an electronic support, the method comprising: A. combining at least one inorganic filler and at least one solvent material. B. dispersing the at least one inorganic filler and at least one solvent material in at least one matrix material. At least one base in which an inorganic filler is dispersed, contacting the material with at least one reinforcing material to form a prepreg layer; and D. at least one matrix material that at least partially hardens the prepreg layer. 47. The method of claim 46, wherein the at least one inorganic filler is hexahedron boron nitride. 48. The method of claim 46, wherein the at least one solvent is selected from the group consisting of acetone, dimethylformamide, dioxane, glycol ethers, isobutyl ketone, and mixtures of any one of the foregoing. . 49. The method of claim 46, further comprising laminating at least one additional prepreg layer so that the main surface of the at least one additional prepreg layer is adjacent to one of the main prepreg layers. surface. Clothing printed by employees' cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 93- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)