JPH02133438A - Production of electrical laminate - Google Patents
Production of electrical laminateInfo
- Publication number
- JPH02133438A JPH02133438A JP63288170A JP28817088A JPH02133438A JP H02133438 A JPH02133438 A JP H02133438A JP 63288170 A JP63288170 A JP 63288170A JP 28817088 A JP28817088 A JP 28817088A JP H02133438 A JPH02133438 A JP H02133438A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- magnesium silicate
- laminate
- resin varnish
- bases
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052919 magnesium silicate Inorganic materials 0.000 claims abstract description 17
- 235000019792 magnesium silicate Nutrition 0.000 claims abstract description 17
- 239000000391 magnesium silicate Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 239000002966 varnish Substances 0.000 claims abstract description 16
- 238000000465 moulding Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 9
- 229920000647 polyepoxide Polymers 0.000 abstract description 9
- 239000011521 glass Substances 0.000 abstract description 6
- 238000001035 drying Methods 0.000 abstract description 5
- 238000002156 mixing Methods 0.000 abstract description 4
- 239000011888 foil Substances 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 238000005336 cracking Methods 0.000 abstract description 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 2
- 239000000835 fiber Substances 0.000 abstract 1
- 238000004080 punching Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052620 chrysotile Inorganic materials 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- CWBIFDGMOSWLRQ-UHFFFAOYSA-N trimagnesium;hydroxy(trioxido)silane;hydrate Chemical compound O.[Mg+2].[Mg+2].[Mg+2].O[Si]([O-])([O-])[O-].O[Si]([O-])([O-])[O-] CWBIFDGMOSWLRQ-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
Description
本発明は、電気機器や電子機器、計算機、通信８！器等
に用いられる電気用積層板の製造方法に関するらのであ
る。The present invention is applicable to electrical equipment, electronic equipment, computers, communication 8! This paper relates to a method for manufacturing electrical laminates used in appliances, etc.
電気用積層板を製造するにあたっては、フェノール樹脂
、エポキシ樹脂、ポリイミド樹脂などの樹脂ワニスを紙
やガラス布などの基材に含浸して乾燥することによって
樹脂含浸基材を作成し、この樹脂含浸基材を所要枚数重
ねると共にその両面又は片面に銅箔などの金属箔を重ね
、これを加熱加圧して積層成形することによっておこな
われている。
そして、積層板にスルーホールなどの孔を加工するあた
っては、〃ラス織布を基材としで用いるときにはドリル
加工でおこなわれるが、紙やプラスヘーパー（プラス不
織布）を基材として用いるときには主としてパンチング
加工でおこなわれている。In manufacturing electrical laminates, a resin-impregnated base material is created by impregnating a base material such as paper or glass cloth with a resin varnish such as phenol resin, epoxy resin, or polyimide resin and drying it. This is done by stacking a required number of base materials, overlapping metal foil such as copper foil on both or one side of the base materials, and then heating and pressing them to form a laminate. When holes such as through-holes are formed in a laminate, drilling is used when lath woven fabric is used as the base material, but punching is mainly used when paper or plush fabric (plush non-woven fabric) is used as the base material. This is done through processing.
孔あけ加工の作業性はもちろんパンチング加工のほうが
優れているが、パンチング加工の場合にはパンチングの
際に孔あけ部分に局所的な衝撃が作用するために、孔周
辺にクラックが発生し易いという問題がある。
本発明は上記の点に鑑みて為されたものであり、クラッ
クの発生のおそれなくパンチング加工によって孔あけ加
工ができる電気用積層板の製造方法を提供することを目
的とするものである。Of course, punching is superior in terms of workability, but cracks are likely to occur around the hole due to the localized impact that is applied to the hole being punched. There's a problem. The present invention has been made in view of the above points, and it is an object of the present invention to provide a method for manufacturing an electrical laminate, which allows holes to be formed by punching without fear of cracking.
本発明に係る電気用積層板の製造方法は、ケイ酸マグネ
シウムを含有する樹脂ワニスを含浸してｌｌＩｇｌされ
る樹脂含浸基材を、積層成形することを特徴とするもの
である。
本発明において使用されるケイ酸マグネジツムとしては
、繊維状ケイ酸マグネシウムを用いるのが好ましく、こ
の繊維状ケイ酸マグネシウムはクリソタイルやセビオラ
イトとして知られているものであり、市販商品としては
代印薬品工業（株）社製のニードプラスがある。例えば
クリソタイルの組成はＭｇ６ＳＬＯｔｏ（ＯＨ）ａであ
り、ニードプラスの主成分は５ｉｎ２・ＭｇＯ・Ａ１□
Ｏ１である。
樹脂ワニスとしては、フェノール樹脂やエポキシ樹脂、
ポリイミド樹脂、不飽和ポリエステル樹脂などの熱硬化
性ム（脂のワニスを用いることができる。これらの樹脂
は単独であるいは混合して用いることができ、またその
変性物を用いることもできる。そしてこの樹脂ワニスに
ケイ酸マグネシウムを配合して均一に混合することによ
って用いるものである。ケイ酸マグネシウムの配合量は
、樹脂ワニスの樹脂分に対して５〜５０重量％の範囲に
設定するのが好ましい。５重量％未満ではケイ酸マグネ
シウムを配合したことによるクラック発生防止の効果が
十分に得られないものであり、また５０重量％を超える
と積層板の平滑性などの表面外観が低下する傾向があっ
て好ましくない。
しかして、ケイ酸マグネシウムを含有する上記樹脂ワニ
スを紙やガラスペーパーのような基材に含浸させて乾燥
させることによって、樹脂含浸基材（プリプレグ）を調
製することができる。次ぎにこの樹脂含浸基材を所要の
複数枚重ね、さらに必要に応じてその片側の外面もしく
は両側の外面に銅箔などの金属箔を重ねる。金属箔のｔ
Ａ４脂含浸基材側の面には必要に応じて接着剤を塗布し
ておいてもよい。そしてこれを加熱しつつ加圧して積層
成形することによって、プリント配線板として仕上げて
用いられる電気用積層板を得ることができる。The method for manufacturing an electrical laminate according to the present invention is characterized by laminating and molding a resin-impregnated base material that is impregnated with a resin varnish containing magnesium silicate and subjected to llIgl. It is preferable to use fibrous magnesium silicate as the magnesium silicate used in the present invention, and this fibrous magnesium silicate is known as chrysotile or seviolite, and is commercially available from Daiji Yakuhin Kogyo Co., Ltd. There is Need Plus manufactured by Co., Ltd. For example, the composition of chrysotile is Mg6SLOto(OH)a, and the main component of Need Plus is 5in2・MgO・A1□
It is O1. As resin varnish, phenolic resin, epoxy resin,
Thermosetting resins such as polyimide resins and unsaturated polyester resins can be used. These resins can be used alone or in combination, and their modified products can also be used. It is used by blending magnesium silicate into a resin varnish and mixing it uniformly.The amount of magnesium silicate blended is preferably set in the range of 5 to 50% by weight based on the resin content of the resin varnish. If it is less than 5% by weight, the effect of preventing crack generation by incorporating magnesium silicate will not be sufficiently obtained, and if it exceeds 50% by weight, the surface appearance such as the smoothness of the laminate tends to deteriorate. Therefore, a resin-impregnated base material (prepreg) can be prepared by impregnating a base material such as paper or glass paper with the resin varnish containing magnesium silicate and drying it. Next, the required number of sheets of this resin-impregnated base material are stacked, and if necessary, metal foil such as copper foil is stacked on one side or both sides of the base material.
An adhesive may be applied to the side of the A4 fat-impregnated base material, if necessary. Then, by laminating and molding this by heating and pressurizing it, it is possible to obtain an electrical laminate that can be finished and used as a printed wiring board.
以下本発明を実施例によって例証する。
え（Ｋによ
第１表に示す配合で調製されるエポキシ樹脂ワニス（エ
ポキシ樹脂；シェル化学社製エピコート１００１）に、
繊維状ケイ酸マグネシウム（クリソタイル）を第１表に
示す配合量で混合した。このエポキシ樹脂ワニスを０．
２ ｍｈｏ厚のガラスペーパーに含浸させて加熱乾燥す
ることによって、乾燥後の重量で樹脂分が５０重量％の
樹脂含浸基材を調製した。このＱ（脂含浸基材を７枚重
ねると共にさらにその上下にそれぞれ銅箔を重ね、４０
ｋｇ／ ｃｍ１６５℃の条件で１２０分間積層成形す
ることによって、厚み１．６１の両面銅張りガラスペー
パー基材エポキシ樹脂積層板を得た。
歴竪涯
ケイ酸マグネシウムを混合しないエポキシ樹脂ワニスを
用いるようにした他は、上記「実施例１〜３」の場合と
同様にして、厚み１．６ｍｍの両面銅張りガラスペーパ
ー基材エポキシ樹脂積層板を得た。
上記の実施例１〜３及び比較例で得た積層板について、
パンチング加工性を測定した。パンチング加工性の評価
は、積層板にパンチングで孔あけ加工をした際に孔周辺
でのクラックの発生を目視で検査することによっておこ
なった。結果を第１◎：クラック発生せず
○：クラック殆ど発生せず
×：クラ７２発生
第
表
（配合量は重量部）
１表の比較例及び実施例１〜３の結果にみられるように
、ケイ酸マグネシウムを樹脂ワニスに混合して用いるこ
とによって、８￥層板を孔あけ加工する際のパンチング
加工性を高めることができることが確認される。The invention will now be illustrated by examples. (Epoxy resin varnish (epoxy resin; Epicoat 1001 manufactured by Shell Chemical Co., Ltd.) prepared by K according to the formulation shown in Table 1,
Fibrous magnesium silicate (chrysotile) was mixed in the amounts shown in Table 1. Apply this epoxy resin varnish to 0.
A resin-impregnated base material having a resin content of 50% by weight after drying was prepared by impregnating a glass paper with a thickness of 2 mho and heating and drying it. This Q (7 sheets of fat-impregnated base material is stacked, and further copper foil is stacked on top and bottom of each layer, and 40
kg/cm and laminated for 120 minutes at 165° C. to obtain a 1.61 mm thick double-sided copper-clad glass paper base epoxy resin laminate. A 1.6 mm thick double-sided copper-clad glass paper base epoxy resin laminate was prepared in the same manner as in Examples 1 to 3 above, except that an epoxy resin varnish not mixed with magnesium silicate was used. Got the board. Regarding the laminates obtained in Examples 1 to 3 and Comparative Examples above,
Punching workability was measured. Punching workability was evaluated by visually inspecting the occurrence of cracks around the holes when holes were punched in the laminate. The results are as follows: ◎: No cracks occurred ○: Almost no cracks occurred ×: Cracks 72 occurred Table 1 (Amounts are in parts by weight) As seen in the results of Comparative Examples and Examples 1 to 3 in Table 1, It is confirmed that by mixing magnesium silicate with a resin varnish and using it, it is possible to improve the punching processability when punching an 8-layered board.
上述のように本発明にあっては、ケイ酸マグネシウムを
含有する樹脂ワニスを含浸して調製される樹脂含浸基材
を積層成形するようにしたので、ケイ酸マグネシウムの
フィラーとしての作用でパンチングで孔あけ加工する際
にクラックが積層板に発生することを低減することがで
き、パンチング加工性を高めることができるものである
。As mentioned above, in the present invention, the resin-impregnated base material prepared by impregnating with a resin varnish containing magnesium silicate is laminated and molded, so that punching is possible due to the action of magnesium silicate as a filler. It is possible to reduce the occurrence of cracks in the laminate during punching, and improve punching workability.
Claims (1)
して調製される樹脂含浸基材を、積層成形することを特
徴とする電気用積層板の製造方法。(1) A method for manufacturing an electrical laminate, which comprises laminating and molding a resin-impregnated base material prepared by impregnating a resin varnish containing magnesium silicate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63288170A JPH02133438A (en) | 1988-11-15 | 1988-11-15 | Production of electrical laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63288170A JPH02133438A (en) | 1988-11-15 | 1988-11-15 | Production of electrical laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02133438A true JPH02133438A (en) | 1990-05-22 |
Family
ID=17726716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63288170A Pending JPH02133438A (en) | 1988-11-15 | 1988-11-15 | Production of electrical laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02133438A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5264065A (en) * | 1990-06-08 | 1993-11-23 | Amp-Akzo Corporation | Printed circuits and base materials having low Z-axis thermal expansion |
| US5338567A (en) * | 1990-06-08 | 1994-08-16 | Amp-Akzo Corporation | Printed circuits and base materials precatalyzed for metal deposition |
| WO2001063985A3 (en) * | 2000-02-22 | 2002-04-04 | Ppg Ind Ohio Inc | Electronic supports and methods and apparatus for forming apertures in electronic supports |
| US8689982B2 (en) | 2003-11-11 | 2014-04-08 | Thermo Fisher Scientific Oy | Particle separating device |
-
1988
- 1988-11-15 JP JP63288170A patent/JPH02133438A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5264065A (en) * | 1990-06-08 | 1993-11-23 | Amp-Akzo Corporation | Printed circuits and base materials having low Z-axis thermal expansion |
| US5338567A (en) * | 1990-06-08 | 1994-08-16 | Amp-Akzo Corporation | Printed circuits and base materials precatalyzed for metal deposition |
| WO2001063985A3 (en) * | 2000-02-22 | 2002-04-04 | Ppg Ind Ohio Inc | Electronic supports and methods and apparatus for forming apertures in electronic supports |
| US8689982B2 (en) | 2003-11-11 | 2014-04-08 | Thermo Fisher Scientific Oy | Particle separating device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH02133438A (en) | Production of electrical laminate | |
| JPS5942628B2 (en) | Manufacturing method for copper clad laminates | |
| JPH064310B2 (en) | Electric laminate | |
| JPS6072931A (en) | Production of paper-base phenolic resin laminate | |
| JPH02133440A (en) | Production of electrical laminate | |
| JPH02133444A (en) | Production of electrical laminate | |
| JPH02133437A (en) | Production of electrical laminate | |
| JPH02133439A (en) | Production of electrical laminate | |
| JPS60190344A (en) | Laminated board for electricity | |
| JP2587870B2 (en) | Epoxy resin composition for paper base laminate | |
| JPH02133445A (en) | Production of electrical laminate | |
| JPH02133436A (en) | Production of electrical laminate | |
| JPH02133443A (en) | Production of electrical laminate | |
| JPH0315536A (en) | Preparation of printed wiring board | |
| JPH02133441A (en) | Production of electrical laminate | |
| JPH0315529A (en) | Preparation of printed wiring board | |
| JPH10130399A (en) | Glass cloth base laminate | |
| JPH06260765A (en) | Multilayer wiring board and manufacture thereof | |
| JPS60190347A (en) | Laminated board for electricity | |
| JPS61118430A (en) | Production of metal-clad laminated sheet | |
| JP2000239420A (en) | Production of laminated sheet | |
| JPS62270333A (en) | Copper-lined laminated board | |
| JPH09164645A (en) | Lamainated sheet | |
| JPS6063145A (en) | Laminated board for electricity | |
| JP2003119346A (en) | Epoxy resin composition for impregnating organic fabric base, prepreg using the same, laminated board and printed circuit board |