TW550688B

TW550688B - Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them

Info

Publication number: TW550688B
Application number: TW90111082A
Authority: TW
Inventors: Terada Yoshio
Original assignee: Nitto Denko Corp
Priority date: 1999-04-28
Filing date: 2001-05-08
Publication date: 2003-09-01

Abstract

A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm<2> as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer. having a Vickers hardness of not lower than 10.

Description

550688550688

五、發明說明（1) 技術領域本發明係關於一種用於潔淨各種設備之片材。更特定^ 之，本發明係關於用於易受外來物質損壞之基板處理設° 備，諸如用於製造或檢查半導體、平面顯示器、印刷電路板等等之設備之潔淨片材，包含此片材之輸送構件，及利用該片材於潔淨基板處理設備之方法。背景技藝採用時使其此等基此必需降或需一種包自基板專利公該包自基板有效方此太過基板之發明之各種基板處理設可彼此實體接觸板及輸送糸統時定期將設備暫停要甚多人力，因括輸送其上附著處理設備之内部告10-154686 中）括輸送其上附著處理設備之内部法。然而，此方強烈地黏著，而完全輸送的缺點揭示内客。在此操作中，當外來物質黏著至，後續的基板會連續地受污染。因以進行清潔。此會造成操作效率下而不利。為解決此等問題，已提出有黏著材料之基板，以將外來物質清除的方法（如於未經審查的日本、〇有黏者材料之基板，以將外來物質清除之：法係—種克服前述困難的法有黏著材# | ^ # 、、無法彼此剝離，因、彼。因而使其無法確保鑑於此等情勢，基板輸送至基板處附者至设備内部之本發明之一目的為提理設備之内部，以及外來物質的潔淨片才才供一種可確實地將谷易及確實地移除V. Description of the Invention (1) Technical Field The present invention relates to a sheet for cleaning various equipment. More specifically, the present invention relates to a clean sheet for a substrate processing apparatus susceptible to damage by foreign substances, such as a device for manufacturing or inspecting a semiconductor, a flat panel display, a printed circuit board, etc. A conveying member, and a method for using the sheet in a clean substrate processing equipment. Background technology When it is adopted, it is necessary to reduce the number of such substrates, or a substrate package patent, which is effective from the substrate, and the invention of the substrate, which is too much of the substrate. Various substrate processing devices can physically contact the board and transport the equipment regularly. The suspension requires a lot of manpower, due to the internal method of conveying the attached processing equipment (see Report 10-154686) including the internal method of conveying the attached processing equipment. However, this side is strongly adhered, and the shortcomings of complete conveyance reveal the insider. In this operation, when foreign matter adheres to, subsequent substrates will be contaminated continuously. For cleaning. This can be detrimental to operating efficiency. In order to solve these problems, substrates with adhesive materials have been proposed to remove foreign materials (such as in uncensored Japan, substrates with adhesive materials to remove foreign materials: law system-a kind of overcoming The aforementioned difficult method has the adhesive material # | ^ #, which cannot be peeled from each other, because it can not be guaranteed. In view of these situations, it is an object of the present invention to transfer the substrate to the substrate and to the inside of the device. Only the inside of the processing equipment and the clean sheet of foreign materials are provided for a reliable and reliable removal of Gu Yi.

550688 五、發明說明（2) 人進行廣泛的研究而完成前述目#。結果，現可經由輸送具有潔淨層之片材或經固定有此一、、= :確物質自基板處理設備之内部清除，因而^ 、Ά 土 !! 物質移除’而不造成前述的問題，其中此 /糸乎層貫質上不具有黏性且具有不低勣，十S 士将疋值之拉伸模數或具有低於一特定值之表面自由能，值之維克爾斯（Vickers)硬度。 -低表一特疋換言之，本發明提供一種包含潔淨淨層實質上不具有黏性，且具有不低；。之二片可將普通黏著層設置於另一侧上。潔黏性及實質上不具有導電性較二二貝上不具有焦耳/平方米之表面自由能較佳。…以展現低於3〇毫潔種=!不低於10之維克爾斯硬度之可將其設置於層=於基礎材料上，或於另一側上。上’及可將普通黏著層設置可由其他方面進一牛伙从、，太蘇日h # 务珂述的潔淨片材。本t月之特徵及優點將可明而明白。下之較t具體例的詳細說圭方式在根據本發明之潔μ 諸如單一潔淨片月；潔淨層(其在後文中包括曰口片材及與基礎材料層合之片材的550688 V. Description of the invention (2) The person carried out extensive research to complete the aforementioned item #. As a result, it is now possible to remove the material from the inside of the substrate processing equipment by conveying a sheet with a clean layer or by fixing it, so that the material is removed 'without causing the aforementioned problems, Among them, this is not viscous and does not have a low product. The tensile modulus of the tenths value or the surface free energy of a value lower than a specific value, the value of Vickers. hardness. -Low table 1 feature. In other words, the present invention provides a cleansing layer which is substantially non-sticky and has a low level; The second sheet can be provided with an ordinary adhesive layer on the other side. It has better cleanliness and substantially no electrical conductivity than the surface free energy of 22 Joules per square meter on Erbei. … In order to show less than 30 millimeters =! No less than 10 Vickers hardness can be set on the layer = on the base material, or on the other side. You can set the ordinary adhesive layer on the clean sheet from other aspects, Taisu Ri h # service Keshu. The features and advantages of this month will be clear. The following is a detailed description of specific examples. In the cleaning method according to the present invention, such as a single clean sheet, a clean layer (which includes a mouth sheet and a sheet laminated with a base material in the following).

550688 五、發明說明（3) :二需之1質上不具有黏性，及具有不低於〇. 98牛頓/平 4 9：〇 Λ Λ1 Γ,12；：# rr; ^ ^ .f 千方也未較乜，自9. 8至3, 0 0 0牛頓/平方毫 =義=本發明，•潔淨層之拉伸模數設計成落於以 -成任ΐ ί定範圍内，使其可將外來物質錢，而不會泣成任何的輸送問題。當潔淨 /平方毫乎日±咖、# @ = r層之拉伸杈數低於〇· 98牛頓成為黏著的，因此其在輸送過程中 ::ΪΓ ΐ 的内部區域，而造成輸送問題。 '㈣黏著，以自牛頓心=二 :口超過〇. 20牛頓川◦毫米時，潔淨層會黏著至待泳甲之§又備的内部區域，而造成輸送問題。及i ΐ:: ί Π::!中之潔淨層係由實質上不具有黏性及只貝上不具有導電性之層所製成較佳。在本發明， Πϊ:設計成使潔淨層實質上不具有黏性及實質上不且 ΐ LU其可藉由靜電吸引將外來物質㈣，而不會造成任何的輸送問題。潔淨層以展現不低於i x 1G13歐姆/平方之表面電阻率較佳’不低於1 X 1 〇〗4歐姆/单古舌乂土成使潔淨層之表面電阻ί預定“低二將潔淨片材設計效果。因f當“= 附外來物質之靜電乐尹層之表面電阻率低於i χ】〇!3歐姆/平方時二捕捉及吸附外來物質之靜電效果會受到減損。潔淨層之材料及結構並無特殊之限制，只要其實質上不550688 V. Description of the invention (3): The first one of the two needs is not sticky in quality, and has not less than 0.98 Newton / flat 4 9: 0 Λ 1 Γ, 12;: # rr; ^ ^ .f thousand Fang also did not compare, from 9.8 to 3,0 0 Newtons / square millimeter = meaning = the present invention, the tensile modulus of the clean layer is designed to fall within the range of -cheng Foreign material money can be saved without crying. When the number of stretched branches in the clean / square almost ±±, # @ = r layer is lower than 0.998 Newton, it becomes sticky, so its internal area during the transport process :: ΪΓ ΐ causes transport problems. '㈣ Adhesion, from Newton's heart = 2: When the mouth exceeds 0.20 Newton River ◦ mm, the clean layer will adhere to the inner area prepared by the swimmer, resulting in transportation problems. And i ΐ :: ί Π ::! Is preferably made of a layer that is essentially non-sticky and only non-conductive on the shell. In the present invention, Πϊ: It is designed so that the clean layer is substantially non-sticky and substantially not ΐ LU, which can attract foreign substances by electrostatic attraction without causing any transportation problems. The clean layer exhibits a surface resistivity of not less than ix 1G13 ohm / square. It is better not to be less than 1 X 1 〇 4 ohm / single tongue to make the surface resistance of the clean layer. Material design effect. Because "=" when the surface resistivity of the electrostatic Lein layer with foreign matter is lower than i χ] 0.3 ohm / square, the electrostatic effect of capturing and adsorbing foreign matter will be reduced. There are no special restrictions on the material and structure of the cleaning layer, as long as it is not substantially

五、發明說明（4) 具有黏性及實質上兀 _ 括塑膠諸如聚乙橋、^有導電性即可。此一材料之例子包素、聚碳酸酯、聚丙：對苯二甲酸乙烯酯、乙醯基纖維胺之薄膜，及經由ί ΐ、聚醯胺、聚醯亞胺及聚碳二醯亞具有黏性的材料。硬化黏著劑硬化而製得之實質上不平方米之♦ :: : α片材中之潔淨層以展現低於3 0毫焦耳/ 佳。佳、：= 至匕毫焦耳/平方米更指經由聯立解經由將潔淨：：；(固表面自由能」係由此（由文獻中得知）代子夜版之表面自伸佛克（F〇wkes，）方程氏（Y〇Ung s)方程式及由延兩線性方程式所得之值^ : ¥出之以下方程式（1)中而得之 ° + cos rL = 2/TT-r^T + ? 其中Θ代表接觸角；s〗 (1) 體的表面自由能；4表吏用於接觸角之測量中之液 h中之極性力成份入力成份；V代表力成份；及V s p代表固;:：二固自體由”由面自由能中之分散將潔淨片材設計成使潔淨層之I中之極性力成份。接觸角較佳，多於100度更佳曰。、表7展現多於90度之設計成使其展現落於以上6 2明，經由將潔淨層由能及接觸角，可確實地達：輸：：1對水的表“ 會m層在輸送過程中牢固地黏著至：之效果’而不在本电明之第二潔淨片材中之潔淨層需U的位置。 * #有不低於10之 550688 五、發明說明（5) 、'隹克爾斯硬度’以自2 〇 5 R Π Π击丄从 ' 「維克爾斯硬度」J =νντ此處所使用之術語於鑽石壓痕機上之根據JIS Z2244而得之施力。得的值。在本發明，，由;:：5生之f痕，表面積而克爾斯硬度不低於預定材設計成使潔淨層之維果，而不會使潔淨芦=送成輸送潔淨片材的效觸。 9在輸运過転中與待潔淨的位置密切接在本發明之第二、言、、备ΰ + t 2 > π尹片材中之潔淨層以展現低於30毫；t 斗/千方未之表面自由能較 /、、、佳。此潔淨層對水展規女你… 5至25焦耳/千方未更 1 0 0度較佳。在太/ 、又之表面接觸角，以大於現落於以上所定義w圍n潔淨層設計成使其對水展生確實地輸送潔淨片才=表：自由能及接觸角’可產 :牛固地黏耆至待潔淨的位置。巧則述之潔淨層的材料等等口 i甘不低於以上所定羞夕枯从二=…、将殊之限制，只要其具有以=:Γ可'然而，實際上，可使用可藉活“ 伸模數的材料ί:歷加速交聯反應或固化，以展現增進拉且=这f層係由經由利用活化能使包含至少一每分子聚合固化反應、，以使使用包含選自=二關：：：感麼黏著劑聚合物，可包括丙烯酸、丙烯酸酯、曱基丙烯酸及甲基V. Description of the invention (4) It is viscous and substantially _ including plastics such as polyethylene bridges, and only conductive. Examples of this material include films of polycarbonate, polycarbonate, polypropylene: vinyl terephthalate, ethyl cellulose, and adhesives via fluorene, polyamine, polyimide, and polycarbodiimide. Sexual material. The hardening adhesive is hardened to produce a substantially non-square meter ♦ ::: α The clean layer in the sheet to show less than 30 millijoules / good. Good ,: = to dmillijoules / square meter means to clean through: ； (solid surface free energy) is based on (from the literature) the surface self-elongating Fok (F) 〇wkes,) equation (Y〇Ung s) equation and the value obtained by extending the two linear equations ^: ¥ ° in the following equation (1) + cos rL = 2 / TT-r ^ T +? Where Θ represents the contact angle; s〗 (1) the surface free energy of the body; 4 Tables used for the contact angle measurement of the polar force component in the liquid h force component; V represents the force component; and V sp represents the solid; ： Second solid self-propelled from the surface of the dispersion of free energy, the clean sheet is designed to make the polar component of the clean layer I. The contact angle is better, more than 100 degrees is better. Table 7 shows more than The design of 90 degrees makes its display fall above the above 62 degrees. Through the clean layer by energy and contact angle, it can be surely reached: lose: 1: a pair of water table "m layer will be firmly adhered to ： Effects' position of the cleansing layer which is not in the second clean sheet of the present invention. * # 有 Not less than 10 of 550688 V. Description of the invention (5) "'Kickers hardness' is applied from 205 R Π Π from'" Vickers hardness "J = νντ The term used herein is applied to a diamond indenter according to JIS Z2244. In the present invention, from: 5: f marks, surface area and Kers hardness not less than the predetermined material is designed to make the fruit of the clean layer, without making clean reeds = sending clean sheets 9 Closely connected with the position to be cleaned in the transportation process, the second, speech, and preparation of the present invention + t 2 > The clean layer in the π Yin sheet to show less than 30 millimeters; The surface free energy of t bucket / Qian Fangwei is better than / ,,,. This clean layer is good for you ... 5 to 25 Joules / Qian Weiwei is better than 100 degrees. On the surface The contact angle is designed to be larger than the w-n-n cleansing layer that is currently defined above so that it can reliably transport clean sheets to the water display = Table: Free energy and contact angle 'can be produced: Niu solid sticks to be cleaned The material of the cleansing layer described by Qiao Ze is not less than the above-mentioned value. The limitation is only as long as it has: =: Γ 可 ' However, in fact, materials that can be used to extend the modulus can be used to accelerate the crosslinking reaction or cure to show enhanced tensile strength. This f-layer is composed of at least one polymerized curing reaction by using activation energy. , So that the use contains a selected from = two off ::: sensory adhesive polymer, which can include acrylic, acrylate, methyl acrylic and methyl

C:\2D-CODE\90-07\90]]1082 Ptd 第8頁 550688 五、發明說明（6) 丙烯酸酯之（甲基）丙烯酸及/或（曱基）丙烯酸酯為主要單體之丙烯酸系聚合物。當丙烯酸系聚合物之合成可經由使用每分子具有二或多個不飽和雙鍵之化合物或透過官能基之反應將每分子具有不飽和雙鍵之化合物化學鍵結至如此合成得之丙烯酸系聚合物，以致將不飽和雙鍵引入至丙烯酸系聚合物之分子中而完成時，所產生之聚合物的本身可藉由活化能而參與聚合固化反應。每分子具有一或多個不飽和雙鍵之化合物（以下將其簡稱為「可聚合不飽和化合物」）係具有不高於1 0，0 0 0之重量平均分子量之非揮發性，的低分子化合物較佳。尤其，可聚合不飽和化合物以具有不高於5，0 0 0之分子量，以致黏著層可於固化過程中更有效率地立體網狀交聯較佳。可聚合不飽和化合物係具有不高於1 0，0 0 0之重量平均分子量之非揮發性的低分子化合物亦較佳。尤其，可聚合不飽和化合物以具有不高於5，0 0 0之分子量，以致潔淨層可於固化過程中更有效率地立體網狀交聯較佳。此一可聚合化合物之例子包括苯氧聚乙二醇（曱基）丙烯酸酯、ε -己内酯（曱基）丙烯酸酯、聚乙二醇二（曱基）丙烯酸酯、聚丙二醇二（甲基）丙烯酸酯、三羥曱基丙烷三（甲基）丙烯酸醋、二異戊四醇六（曱基）丙烯酸酯、（甲基）丙烯酸胺基甲酸酯、（曱基）丙烯酸環氧酯、及（曱基）丙烯酸寡聚酯。此等可聚合化合物可單獨或以其兩者以上之組合使用。關於加入於潔淨層中之聚合引發劑，可使用任何已知之材料，而無任何限制。如使用熱作為活化能，則可使用熱 __:1 國_9 C:\2D-CODE\90-07\90111082.ptd 第9頁 550688 五、發明說明（7) J合引發劑諸如過氣化苯甲醯及偶氮主能：使用光聚合引發劑ς二二：：使用光香乙基醚、—卞基、異丙基安息 β甲基、安息 (Michler’s ketone)氯_9_ —本甲 I同、米蚩酮二苯綱。南、二甲基+氧4:::::、十二基.氧乙_、二甲醇縮笨甲駿、α_經環二，南、二乙醇縮苯基笨基丙烧及2,2 -二甲查9贫土本土 ®同、2 -羥二甲 Ρ ρ 本基苯乙酮。 /糸/尹層之厚度亚無特殊之限制。铁〜係自約5至1 0 0微米。 …、而’貫際上，其—般本發明亦提供一種包括設置於基之特定潔淨層及設置於另一側上材枓之一側上之前述材。待設置於基礎材料之另一側上層的潔淨片殊之限制’只要其可展現期望：：：的材料並無特通的黏著劑（例如，丙締酸系黏著劑者功^即可。可使用普 &此種配置中’可利用f通層ϋ黏者劑）。種基板或其他輸送構件諸如二將办乎片材黏著至各潔淨功能之輸送構件輸送以致可將其以具有置接觸，而使其可潔淨；備之内部，以與待潔淨之位在於潔淨之後將基板自件諸如基板再利用的情^者可述之輸送構牛頓κι°毫米之物圓(鏡二係自約0 · 0 1至0. 5牛頓/ ! η古、卜隹站者，尤其著層剝離，及於潔淨之後Ύ而使其可防止基板自黏其上設置潔淨層之Α】：：易地將基板剝離。基礎材料並無特殊之限制。關於此 C:\2D-WDE\90-07\90111082.ptd 第10頁 550688 五、發明說明（8) m::;塑！?—聚對苯二…二基;=…般及聚…薄膜。上，可使用諸：特殊：限制。然而，實際 (=提 -種使用此構“：：；：：:;：=查設備之構件，淨。外來物質損壞之傳導檢查設備之構件二：用於潔有各種傳導檢查設備經由使在檢查設】=方法。 (二如，1C插座之接觸插腳)與產,接觸點焊料）刮削。所產生之外來物質會附著至如’紹、外，經如此附著至接觸插腳側之紹及谭y番腳側。此絕緣造成瑕疵。在最糟的情況中，待檢杳的導=而由於低。為將此等外來物質自接觸插腳移除Ί:生會降化鋁顆粒之聚對苯二甲酸乙二r 使用經塗覆氧入於橡膠基底樹脂諸如石夕酉同^構件（以下生顆粒加插腳潔淨器」）。然而，隨近來在半導體制為「接觸晶圓厚度及增加晶圓長度發展的趨勢，曰曰更中：朝降低台（夾頭平台（chuck table))上之外來更θ破在檢查發生央持失誤。因，，需採取—些對策：將以 C:\2D-CODE\90-07\90111082.ptd 發明說明（9) 碩平台移除。為此，必需定曾以清潔失頭平台，因而將外.併^双查设備之操作暫停作效率下降或需要甚貝自其移除。如此造成操在此等情勢之下，本發以而不利。傳：檢查設備中之接觸插腳以及降—種可清潔 ”之外來物質之量的潔淨構件及“=夾頭平台及輸現經由輪送包括用於移除附著。結果，經發查接觸插腳之外來物質之〃欢一δ又備中之傳導檢淨器」）及β於移除附著至免^:簡稱$「接觸插腳潔 ^妾觸面積（夹頭平台）之外妾觸之設備時可將附著至檢查設備；：：：亚可將接觸插腳清潔，同發現經由將潔淨層之摩擦係數;、二=的外來物質移除。亦確實地將潔淨片材輸送通過檢查一特定值，可換言之，本發=提：磁本發明已獲得成功。件，其包括用於傳導檢查設備用之潔淨構觸插腳之外來物質之』：广、“檢查設備中之傳導檢查接」）及用於移除附著之至構與t 觸面積之外來物質腳/糸乎為接觸之設備之接淨層。貝之6又置於接觸插腳潔淨器之一側上之潔用之潔淨構件，其包得v楦查§又備之傳導檢查接觸插腳之 550688 五、發明說明（10) --- 來物質之設置於輸送構件之一側上之構件（以下簡稱為「接觸插腳潔淨器」），及用於移除附著至與該接觸插腳潔淨為接觸之設備之接觸面積之外來物質之設置於另一上之前述潔淨片材。、 f本發明之潔淨構件中之潔淨層並無特殊之限制，只要確貫可將其輸送通過檢查設備之内部以及簡單地降低外來物質的量即可。然而，實際上，由灰塵移除性質及輸送性質之觀點來看，潔淨層之摩擦係數以不低於i · 〇較佳，自 1. 2至1 · 8更佳。當潔淨層之摩擦係數低於丨· 〇時，夾頭平台上之外來物質恐怕無法確實地附著至潔淨層。相對地，當潔淨層之摩擦係數超過以上所定義之範圍時，潔淨片材恐怕將無法被輸送。在本發明，潔淨層之摩擦係數（“）係經由利用通用的試驗機器，測量當使不銹鋼板（5 〇毫米χ 5 0毫米之平板）沿潔淨層之表面滑動時，所產生之摩擦係數（F )，然後將此測量值及在此程序中施加至鋼板之垂直負重（W)代入以下之方程式（2)中而測得。其所呈現者為動摩擦係數。 // = F / W (2) 其中//代表動摩擦係數；F代表摩擦阻力（牛頓）；及w代表施加至鋼板之垂直負重（牛頓）。潔淨層展現不高於2，0 0 〇牛頓/平方毫米之拉伸模數，以大於1牛頓/平方毫米較佳。當潔淨層之拉伸模數超過 2, 0 0 0牛頓/平方毫米時，夾頭平台上之外來物質恐怕將無法確貫地附著至潔淨層。相對地，當潔淨層之拉伸模數C: \ 2D-CODE \ 90-07 \ 90]] 1082 Ptd Page 8 550688 V. Description of the invention (6) Acrylic acid (meth) acrylic acid and / or (fluorenyl) acrylic acid as the main monomer acrylic acid Department of polymers. When the acrylic polymer is synthesized, the compound having an unsaturated double bond per molecule can be chemically bonded to the acrylic polymer thus synthesized through the use of a compound having two or more unsaturated double bonds per molecule or through a reaction of a functional group. When the unsaturated double bond is introduced into the molecule of the acrylic polymer and is completed, the polymer itself can participate in the polymerization and curing reaction by the activation energy. A compound having one or more unsaturated double bonds per molecule (hereinafter referred to as "polymerizable unsaturated compound") is a non-volatile, low-molecular-weight compound having a weight-average molecular weight of not more than 10,000. Compounds are preferred. In particular, it is preferable that the polymerizable unsaturated compound has a molecular weight of not higher than 5,000, so that the adhesive layer can be three-dimensionally network-crosslinked more efficiently during the curing process. The polymerizable unsaturated compound is also preferably a nonvolatile low-molecular compound having a weight-average molecular weight of not more than 10, 000. In particular, it is preferable that the polymerizable unsaturated compound has a molecular weight of not higher than 5,000, so that the clean layer can be more efficiently three-dimensionally network-crosslinked during the curing process. Examples of this polymerizable compound include phenoxy polyethylene glycol (fluorenyl) acrylate, ε-caprolactone (fluorenyl) acrylate, polyethylene glycol di (fluorenyl) acrylate, polypropylene glycol di (methyl Base) acrylate, trishydroxymethylpropane tri (meth) acrylate, diisopentaerythritol hexa (fluorenyl) acrylate, (meth) acrylate urethane, (fluorenyl) acrylate epoxy , And (fluorenyl) acrylic oligoester. These polymerizable compounds may be used alone or in combination of two or more kinds thereof. As for the polymerization initiator to be added to the cleansing layer, any known material can be used without any limitation. If heat is used as the activation energy, you can use heat __: 1 country_9 C: \ 2D-CODE \ 90-07 \ 90111082.ptd page 9 550688 V. Description of the invention (7) J compound initiator such as over-gas The main energy of benzamidine and azo: using photopolymerization initiators 222 :: using photo ethyl ether, fluorenyl, isopropyl benzoyl β methyl, benzoic acid (Michler's ketone) chlorine I the same, mianketone diphenyl class. South, dimethyl + oxygen 4 :::::, dodecyl. Oxyethyl, dimethylenol, α_ cyclic di, south, diethanol phenylbenzyl propane, and 2,2 -Dimethylcha 9 poor soil native ® same, 2-hydroxydimethyl P ρ acetophenone. The thickness of the / 糸 / 尹 layer is not particularly limited. Iron ~ is from about 5 to 100 microns. ... and, in general, the present invention also provides a specific cleansing layer provided on a base and the aforementioned material provided on one side of a material frame on the other side. The clean sheet to be placed on the upper layer of the other side of the base material has a limitation of 'as long as it can exhibit the desired ::: material without a special adhesive (for example, an acryl-based adhesive can be used.) Use general & this configuration 'available f-pass layer adhesive agent). Such substrates or other conveying members such as two conveying members that adhere to the sheet to each cleaning function so that they can be placed in contact with each other to make them clean; the inside of the device is to be cleaned after cleaning If the substrate is re-used, such as substrate reuse, it can be described as conveying a Newton κmm millimeter object circle (the second series of mirrors is from about 0. 0 1 to 0.5 Newton /! The peeling layer is peeled off, and after cleaning, it can prevent the substrate from self-adhesion. A:]: The substrate is easily peeled off. There are no special restrictions on the basic material. About this C: \ 2D-WDE \ 90-07 \ 90111082.ptd Page 10 550688 V. Description of the invention (8) m ::; plastic!? — Polyterephthalate ... diyl; = ... like and poly ... film. On the list, you can use: Special: Restrictions. However, the actual (= mention-use of this structure "::; :::;: = check the components of the equipment, net. The components of the conduction inspection equipment damaged by foreign substances 2: used to clean all kinds of conduction inspection equipment Make the inspection settings] = method (two such as, 1C socket contact pins) and production, contact point solder) Cut. The foreign material produced will be attached to the side of the contact pin and the side of the contact pin, such as' Shao, wai. This insulation causes flaws. In the worst case, the guide to be inspected = And because of the low. To remove these foreign materials from the contact pins: Polyethylene terephthalate, which will reduce the aluminum particles, is coated with a rubber-based resin such as Shi Xiyan and coated with oxygen. The following raw particles are added with a pin cleaner.) However, recently, the trend of semiconductor manufacturing to "contact the wafer thickness and increase the length of the wafer has become more and more central: towards the lower table (chuck table)" In addition, there is a central holding error in the inspection. Because of this, some measures need to be taken: C: \ 2D-CODE \ 90-07 \ 90111082.ptd Invention description (9) The master platform is removed. To this end, It must be used to clean the missing platform, so the operation of the external and double-checking equipment has been suspended for efficiency reduction or it needs to be removed from it. As a result, operations in these situations are not beneficial. Biography: check the contact pins in the equipment and drop-a kind of clean Quality of clean components and "= chuck platform and delivery are included for removal of attachments by rotation. As a result, the foreign matter of the contact pins has been checked and the conductive detector is in preparation") and β can be attached to the inspection device when removing the device attached to the free contact ^: abbreviated $ 「contact pin cleaning ^ contact area (chuck platform); ::: You can clean the contact pins, see By removing the coefficient of friction of the clean layer; two = the foreign material is also removed. The clean sheet is surely conveyed by checking a specific value, in other words, this hair = mention: magnetic The present invention has been successful. Pieces, including For foreign materials used in conducting inspection of clean structure contact pins ": wide," conducting inspection connector in inspection equipment ") and for removing foreign materials attached to the structure and contact area The contact layer of the contacting equipment. Beizhi 6 is placed on one side of the cleaning device of the contact pin, which is used for cleaning. It can be checked by conducting the inspection of the contact pin 550688. 5. Description of the invention (10) --- A member provided on one side of the conveying member (hereinafter referred to as a "contact pin cleaner"), and a member provided on the other for removing foreign matter attached to the contact area of the device with which the contact pin is cleanly in contact. The aforementioned clean sheet. F There is no special restriction on the cleansing layer in the cleansing member of the present invention, as long as it can be transported through the inside of the inspection equipment and the amount of foreign substances can be simply reduced. However, in fact, from the standpoint of dust removal properties and transport properties, the friction coefficient of the cleansing layer is preferably not less than i · 0, and more preferably from 1.2 to 1.8. When the coefficient of friction of the cleaning layer is lower than 丨 · 〇, foreign materials on the chuck platform may not be able to be reliably attached to the cleaning layer. In contrast, when the friction coefficient of the cleaning layer exceeds the above-defined range, the clean sheet may not be conveyed. In the present invention, the coefficient of friction (") of the clean layer is measured by using a general-purpose test machine to measure the coefficient of friction generated when a stainless steel plate (a plate of 50 mm x 50 mm) is slid along the surface of the clean layer ( F), and then measure the measured value and the vertical load (W) applied to the steel plate in this procedure by substituting it into the following equation (2) and measuring it. The presented one is the dynamic friction coefficient. // = F / W (2 ) Where // represents the dynamic friction coefficient; F represents the frictional resistance (Newton); and w represents the vertical load (Newton) applied to the steel plate. The clean layer exhibits a tensile modulus not higher than 2,000 Newtons per square millimeter, It is preferably greater than 1 Newton per square millimeter. When the tensile modulus of the cleaning layer exceeds 2,000 Newton per square millimeter, foreign materials on the chuck platform may not be able to adhere to the clean layer with certainty. Relatively , When the tensile modulus of the clean layer

\\312\2d-code\90-07\90111082.ptd 第13頁 550688 五、發明說明（11) 低於1牛頓/平方毫米日夸，潔淨在本發明，經由將潔淨層之心怕將無法被輸送。以上所定義之範圍内時，潔淨及拉伸模數預定為在輸送過程中實質上不具有黏性7在冻净片材或其類似物之材，但不使潔淨層牢固地黏著至:，其可產生輸送潔淨片使用於本發明之接觸插腳潔淨;===位置的效果：素並無特殊之限制。可使用範 2枓、形狀及其他因可使用塑膠諸如聚乙烯、聚對苯=f1材料。舉例來說，維素、聚碳酸酯、聚丙烯'聚醉二=乙二酯、乙醯基纖亞胺之薄Μ ’橡膠基底樹脂諸：矽3同：=:及聚碳二酿經塗覆磨蝕性顆粒諸如顆粒狀氧化，基材（襯料）諸如不織布’但不應將本發明解釋為受並所;η氧化鉻之淨器之形狀可視待潔淨之插二:者斤=接觸插腳潔形狀及設備之種類而適當地決定。 ' β曰片之 f此種配置+，可使潔淨片材藉由普通黏著層黏著至用於：Π其非潔淨側上之接觸插腳之接觸插腳潔淨器或^ 达構件諸如具有潔淨功能之各種基板，以形成輸送構件而輸迗至設備之内部，以使其與夾頭平台接觸而進行清潔。其上設置潔淨層之輸送構件並無特殊之限制。然而/，'實際上，可使用半導體晶圓、平面顯示器之基板諸如LCD及 PDP、光碟和MR磁頭之基板、或塑膠諸如聚乙烯、聚對笨一曱酸乙一、乙醯基纖維素、聚碳酸醋、聚丙稀、聚酿胺、聚醯亞胺及聚碳二醯亞胺之薄膜。本發明更提供一種用於製造供各種基板處理設備用之具\\ 312 \ 2d-code \ 90-07 \ 90111082.ptd Page 13 550688 V. Description of the invention (11) Less than 1 Newton / square millimeter per day, clean in the present invention, fearing that the heart of the clean layer will not be able to Be transported. When within the range defined above, the cleansing and tensile modulus are intended to be substantially non-sticky during the conveying process. 7 The frozen sheet or the like does not make the cleansing layer firmly adhere to :, It can produce the effect of conveying the clean sheet for cleaning the contact pins of the present invention; === position: There is no special limitation on the element. Can use Fan 2 shape, shape and other reasons Plastic materials such as polyethylene, polyparaphenylene = f1 materials can be used. For example, vitamins, polycarbonates, and polypropylene are thinner than polyethylene glycol and ethyleneimide. The rubber-based resins are: Silicone 3 Same: =: Covered with abrasive particles such as granular oxidation, substrates (linings) such as non-woven fabrics, but the present invention should not be interpreted as an acceptance; the shape of the chromium oxide cleaner can be cleaned. The shape and type of equipment are appropriately determined. 'β said the f of this configuration +, can make the clean sheet adhere with ordinary adhesive layer to: Π contact pins on the non-clean side of the contact pin cleaner or ^ components such as a variety of cleaning functions The substrate is conveyed to the inside of the device to form a conveying member, so that it contacts the chuck platform for cleaning. There are no special restrictions on the conveying member on which the clean layer is provided. However, ', in fact, semiconductor wafers, substrates for flat-panel displays such as LCDs and PDPs, substrates for optical discs and MR heads, or plastics such as polyethylene, polyethylene terephthalate, ethyl cellulose, polymer Films of carbonated vinegar, polypropylene, polyamine, polyimide and polycarbodiimide. The invention further provides a tool for manufacturing various substrate processing equipment.

第14頁 550688 發明說明 (12) 五有潔淨功能之輪來物質損捭之1 構件之方法，例如，用於製造供易受外示器、』二带叹備，諸如用於製造或檢查半導體、平面顯件之方法。甩路板等等之設備用之具有潔淨功能之輸送構前述之且右、刼 - 件」）之制、、告J糸土淨功能之輸送構件（以下簡稱為「潔淨構較輪送構1牛\形狀在^當使經由將輸送構件諸如基板與具有構件在潔淨片材上，ί形：：潔淨二材層合而製得之潔淨簡稱為「直接切害輪廟士刀割（以下將此方法屋生切割廢料，並附著至曰有自冷#層先加工成為輪送構件形狀：：：件：不利之處。在將經預件層合，而製造潔淨構件之用之滅淨片材與輸送構而抑制在標示之工作過程月j中，可相較於直接切割法需預先進行標示用片材之=切割廢料的產生。然而，必目增加，使潔淨構件之製1 ：；二而使所需之工作步驟的數效率退化。 I /變複雜，及因此而使操作在此等情勢之下，本發明之再— 地輸送通過基板處理設備之内4 卩馮钕供一種可確實著至基板處理設備之内部之=札:確實及簡單地移除附切割法在片材切割過程中所& 貝，及不會產生由直拉製備方法。產生之切割廢料之潔淨構：：本發明人進行廣泛的研究而h 現經由在包括將輸送構件諸=成則述目的。結果，钶構件之製程中（其中潔淨構件之^制板與潔淨片材層合之潔衣造係利用直接切割法、完’ m C:\2D-CODE\90-07\901110S2.ptd 第15頁 550688 五發明說明（13) ^ 成），製造當受到活化能之作用時經歷聚合之潔淨層，及於將潔淨片材切割成為輸送構件之/狀H 行潔=層之聚合固化反應，可製造能簡單及確者地來物鲁之潔淨構件，而不會產生前述的問 M ;承明已獲得成功。。因此，本發換言之，本發明更提供一種製備具有潔件之方法，其包括將具有設置於基礎材料之一此之輸迗構受到活化能之作用時經歷聚合固化之：$由當及設置於另-側上之普通黏著層之 J :成之冷淨層合，使普通黏著層插置於其間，在此一材與輸送構件層之形狀較輸送構件之形狀^，然二^置中，潔淨片材割該潔淨片材，其特徵在於潔淨層係二構件之輪廓切切割潔淨片材之後，再經歷聚合固化:勒迗構件之輪廓在根據本發明之潔淨構件的製備方4。± 由活化能而經歷聚合固化之黏 τ 淨層需由藉片材切割之後進行。此係由於當使；土聚合固化係於經歷聚合固化時，發生交聯而且有2片材切割之前而造成所產生之大量的切割廢料附著，的彈性模數，為防止在片材切割過程中自，恭净構件或設備。據JIS Κ7127之試驗方法測得、之^產生切割廢料，利用根牛頓/平方毫米較佳，不高於拉伸模數不高於1 經由將潔淨層之拉伸模數_頓/平方毫米更佳。可防止在片材切割過程中自潔J =前述之特定範圍，可利用直接切割法製備沒 ^ f副廢料，而使 _ 庵枓的潔淨構件。此外，Page 14 550688 Description of the invention (12) Five methods of cleaning a wheel with material damage to one of its components, for example, for the manufacture of susceptible external displays, "two-band exclamation, such as for the manufacture or inspection of semiconductors 2, plane display method. The conveying member with clean function used in the equipment such as the road-throwing board and the like, and the right, 刼 -pieces mentioned above), and the conveying member with the clean function (hereinafter referred to as "clean structure compared with the rotating structure 1" The shape of the cow is shaped by laminating the conveying member such as the substrate and the member on the clean sheet, and the shape is: The cleanness obtained by laminating the clean two materials is referred to as "directly cutting the round temple monk knife cutting (hereinafter will be This method cuts waste material and attaches it to a layer with a self-cooling #layer, which is processed into the shape of a rotating member first ::: piece: disadvantages. After the preforms are laminated, they are used to make clean parts. Materials and conveying structures are suppressed during the labeling process, compared with the direct cutting method, it is necessary to perform the labeling of the sheet for cutting = the generation of cutting waste. However, it must be increased to make the system of clean components 1: Secondly, the numerical efficiency of the required work steps is degraded. I / becomes complicated, and thus makes the operation under these circumstances, and the present invention further transports the substrate through the substrate processing equipment. Exactly inside the substrate processing equipment = : Reliably and simply removes the accommodating cutting method in the sheet cutting process, and does not produce the method by the straight drawing. The clean structure of the cutting waste generated :: The present inventors have conducted extensive research and found that Through the stated purpose of including the conveying member into a set. As a result, in the process of manufacturing the member (where the clean board of the clean member is laminated with the clean sheet, the clean clothes manufacturing system uses the direct cutting method to complete 'm C: \ 2D-CODE \ 90-07 \ 901110S2.ptd Page 15 550688 Five Descriptions of the Invention (13) ^), manufacturing clean layers that undergo polymerization when subjected to activation energy, and cutting clean sheets into conveying members / 状 H Xing Jie = polymerization curing reaction of the layer, can produce clean components that can simply and surely come to Wulu without producing the aforementioned question M; Cheng Ming has succeeded. Therefore, this issue in other words, this The invention further provides a method for preparing a piece with cleansing, which comprises subjecting an input structure provided on one of the basic materials to undergo polymerization and curing when subjected to activation energy: $ 由当 and ordinary adhesion provided on the other side Layer J: Chengzhi's cold clean layer The common adhesive layer is interposed therebetween, where the shape of the one material and the conveying member layer is more than the shape of the conveying member ^, but in the middle, the clean sheet cuts the clean sheet, which is characterized by the clean layer system two The contour of the component is cut and cut and then subjected to polymerization and curing: the contour of the component is in the preparation method of the clean component according to the present invention. 4. The adhesion τ that undergoes polymerization and curing by activation energy must be borrowed from the sheet. It is performed after cutting. This is due to the fact that when polymerizing and solidifying is undergoing polymerization and curing, cross-linking occurs and 2 sheets are cut before cutting, which results in a large amount of cutting waste adhesion. During the cutting process, the components or equipment are cleaned. According to the test method of JIS κ7127, cutting waste is generated. It is better to use root Newton per square millimeter, not higher than the tensile modulus, not higher than 1. The tensile modulus of the layer is better _ton / mm2. It can prevent self-cleaning during the sheet cutting process. J = the specific range described above. Direct cutting method can be used to prepare no ^ f secondary waste, making _ 庵枓 clean components. In addition,

C:\2D-CODE\90-07\90111082.ptd 第16頁 550688 五 '發明說明（14) 由經歷聚合固經歷聚合固化送，且不會牢在本發明，或藉由活化能拉伸模數，以層之拉伸模數移除外來物質數低於1 〇牛頓者至待潔淨之根據本發明之一側上設置上之普通黏著本發明將進明解釋為受其量份數。复施例1 化之黏著劑製成之潔淨層可於片材切割之成貝貝上不具黏性，而使其可提供可確實輪固黏著至ό又備接觸面積的潔淨構件。、於片材切割後之潔淨層由於交聯反應之加迷之固化，而展現不低於丨0牛頓/平方毫米之自1 0至2，0 0 0牛頓/平方毫米較佳。當潔淨超過2，0 0 0牛頓/平方毫米時，自輸送系統之能力將退化。相對地，當潔淨層之拉伸模 /平方毫米時，潔淨層在輸送過程中將會勒設備的内部面積，而造成輸送問題。之潔淨構件之製備包括使用包含在基礎材料為潔淨層之前述特定黏著層及設置於另一側層的潔淨片材，該潔淨層係為未固化形態。一步說明於以下的實施例中，但不應將本發所限制。以下所使用之術語「份」係指示重於100份由包含75份之丙烯酸2-乙基己酯、20份之丙烯酸曱酯及5份之丙烯酸之單體混合物製得之丙烯酸系聚合物（重量平均分子量：700,000)中加入50份之聚乙二醇二甲基丙烯酸酯、5 0份之丙烯酸胺基甲酸酯、3份之二甲醇縮苯甲醛及3份之二苯基曱烷二異氰酸酯。然後將混合物均勻攪拌，而得紫外光固化黏著劑之溶液。經以1，0 0 0毫焦耳/平方公分之整體劑量照射具有3 6 5毫C: \ 2D-CODE \ 90-07 \ 90111082.ptd Page 16 550688 Five 'invention description (14) It is sent by polymerized solids and polymerized and solidified, and will not be fixed in the present invention, or by activating the energy to stretch the mold The number of foreign materials removed by the layer's tensile modulus is less than 10 Newtons to the ordinary adhesive on one side of the invention to be cleaned according to the invention. The cleansing layer made of the modified adhesive of Example 1 can be non-adhesive on the cut sheet of the sheet, so that it can provide a clean member that can be fixed and adhered to the contact area. The clean layer after the sheet is cut is better than 10 Newton / square millimeter from 10 to 2,0 Newton / square millimeter due to the curing of the cross-linking reaction. When cleaning exceeds 2,000 N / mm2, the capacity of the self-conveying system will deteriorate. In contrast, when the tensile layer per square millimeter of the clean layer is used, the clean layer will increase the internal area of the device during transportation, which will cause transportation problems. The preparation of the clean member includes the use of the aforementioned specific adhesive layer containing a clean layer as a base material and a clean sheet provided on the other side, the clean layer being in an uncured form. One step is illustrated in the following examples, but should not limit the present invention. The term "parts" as used below refers to more than 100 parts of an acrylic polymer made from a monomer mixture containing 75 parts of 2-ethylhexyl acrylate, 20 parts of ethyl acrylate and 5 parts of acrylic acid ( Weight-average molecular weight: 700,000) To 50 parts of polyethylene glycol dimethacrylate, 50 parts of acrylic urethane, 3 parts of dimethylformal and 3 parts of diphenylphosphonium di Isocyanate. The mixture was then stirred uniformly to obtain a solution of an ultraviolet curing adhesive. After irradiation at a total dose of 1,000 millijoules per square centimeter

550688 五、發明說明（15) 微米中心波長之紫外光線以 "方毫米之拉伸模數二匕：:者劑展現49牛頓550688 V. Description of the invention (15) Ultraviolet light with a central wavelength of micrometers has a tensile modulus of "square millimeters"

K 71 2 7之試驗方法進行。 ’、j里係利用根據J IS 八另，^前述之相同方式製得，除 ^ έ 一甲醇縮笨甲駿外 “月’J述之黏著劑不度，以於其上提供—普通黏著著」〇微米之乾厚化黏著劑溶液塗布至厚度3δ =紫外光固表面至40微米之乾厚度，以於直上二::剝硪缚膜之剝離兩聚酿可剝離薄膜以使盥並:潔淨層。然後將置彼此層合。便以層與曰通黏著層彼此相對的配然後使所產生之片材以1，0 0 0毫舞耳/平方八八劑量照射具有365亳微米中心波長‘：：方二刀之整體發明之潔淨片材。潔淨層之表面質上卜先而侍根據本利用由二曼化學公司（Mitsubishi Chewed Corporation)所製造之Mcp_up45〇型表面電阻率儀， 5之-度及60%之相對濕度下測量潔淨層之表二果’讀數大於9.99 x，歐姆/平方，而無法進：測然後將可剝離薄膜自潔淨片材在其之普通黏著層側除。然後將潔淨片材黏著至8英吋矽晶圓之背側（鏡面；而製備具有潔淨功能之輪送潔淨晶圓。另外將兩晶圓段自基板處理設備移除，然後利用雷外來物質分析儀測量具有不小於〇· 3微米尺寸之外來物質The test method of K 71 2 7 is carried out. ', J is made according to the same method as described in J IS, and ^, except that ^ 一一 MeOH was reduced, and the adhesive described in "Yue" J is not enough to provide on it-ordinary adhesion "0 micron dry-thickening adhesive solution is applied to a thickness of 3δ = UV light solid surface to a dry thickness of 40 micrometers, in order to straighten up 2: Peel off the film and peel off the film to make the toilet clean: Floor. Layers are then laminated to each other. The layer and the adhesive layer are arranged opposite to each other, and then the produced sheet is irradiated with a center wavelength of 365 亳 m at a dose of 1,000,000 milliears per square meter. Clean sheet. The quality of the surface of the clean layer was measured by using the Mcp_up45o surface resistivity meter manufactured by Mitsubishi Chewed Corporation. The surface of the clean layer was measured at 5-degrees and 60% relative humidity. The two fruit 'reading is greater than 9.99 x, ohms / square, and it is impossible to measure: the peelable film is then removed from the clean sheet on the side of its ordinary adhesive layer. Then, the clean sheet is adhered to the back side of the 8-inch silicon wafer (mirror surface; and a clean clean wafer is prepared for cleaning. In addition, the two wafer segments are removed from the substrate processing equipment, and then analyzed by lightning foreign substances Meter measures foreign matter with a size of not less than 0.3 microns

\\312\2d-code\90-07\90111082. 第18頁 550688 五、發明說明（16) '—'' '— 的存在。結果，在兩晶圓段之其中一者上在具有8英时晶圓尺寸之面積上發現1 8, 0 0 0個具有不小於〇. 3微米尺寸之外來，質，及在另一者上發現17,〇〇〇個。接著將可剝離薄膜自前述之輸送潔淨晶圓在其潔淨層側上剝除。然後將輸送潔淨晶圓輸送至具有經附著丨8，〇〇〇個外來物質之晶圓段之基板處理設備的内部。結果，輸送潔淨晶圓之輸送可毫無問題地進行。其後將晶圓段移除，然後利用雷射型外來物質分析儀測量具有不小於〇· 3微米尺、寸之外來物質的存在。結果，在具有8英吋晶圓尺寸之面積上發現4, 0 0 0個具有不小於〇· 3微米尺寸之外來物質，顯不已將在清潔之前經附著之外來物質的3/4以上移除。〜 _比較實施例1 ’、 “以，實施例1中之相同方式製備得，除了二甲醇縮苯醛之量為0· 05份之在潔淨片材中之潔淨層具有黏性。缺測量潔淨層之拉伸模數。結果為0 · 5牛頓/平方毫米。以< 嘗試將以與實施例1中相同之方式自前述之潔淨片材制備得之輸送潔淨晶圓輸送通過基板處理設備之内部。然衣而’輸送潔淨晶圓黏著至輸送臂，因此無法輸 …、實施例2 於100份由包含75份之丙烯酸2-乙基己酯、2〇份之丙綠酸曱酯及5份之丙烯酸之單體混合物製得之丙烯酸系聚人物（重量平均分子量：7 〇〇，〇〇〇 )中加入5 〇份之聚乙二^ : 甲基丙烯酸酯、5 0份之丙烯酸胺基甲酸酯、3份之二甲妒縮苯曱醛及3份之二苯基曱烷二異氰酸酯。然後將混合=\\ 312 \ 2d-code \ 90-07 \ 90111082. Page 18 550688 V. Description of the invention (16) The existence of '-' ''-. As a result, on one of the two wafer segments, 18,000 on the area having a wafer size of 8 inches were found to be not less than 0.3 micron in size, quality, and on the other Found 17,000. The peelable film is then peeled from the aforementioned transported clean wafer on its clean layer side. The transported clean wafer is then transported to the inside of a substrate processing apparatus having a wafer segment to which 8,000 foreign substances are attached. As a result, the transfer of the clean wafer can be performed without problems. Thereafter, the wafer segment was removed, and then the presence of foreign matter having a size of not less than 0.3 micrometers and inches was measured using a laser-type foreign matter analyzer. As a result, 4,000 foreign materials having a size of not less than 0.3 micrometers were found on an area having a wafer size of 8 inches, and it was apparent that more than 3/4 of the foreign materials adhered before cleaning were removed. . ~ _Comparative Example 1 ', "It was prepared in the same manner as in Example 1, except that the amount of dimethyl acetal was 0.05 parts. The clean layer in the clean sheet had stickiness. The lack of measurement cleanliness The tensile modulus of the layer. The result was 0. 5 Newtons per square millimeter. &Lt; An attempt was made to convey the clean wafer prepared from the aforementioned clean sheet in the same manner as in Example 1 through the substrate processing equipment. Internal. However, the 'clean wafer' is adhered to the conveying arm, so it cannot be lost ..., Example 2 contains 100 parts of 75 parts of 2-ethylhexyl acrylate, 20 parts of propyl chloroformate and 5 parts. Acrylic polymer (weight-average molecular weight: 70,000) prepared from an acrylic monomer monomer mixture of 50 parts was added with 50 parts of polyethylene ^: methacrylate, 50 parts of acrylic amino group Formate, 3 parts of dimethyl acetophenal and 3 parts of diphenylmethane diisocyanate. Then mix =

550688 五、發明說明（17) 均勻授拌，而得紫外光固化黏著劑之溶另外將以與前述之相同方式制 / 一含二曱醇縮苯曱酸外之黏著劑ς二、冷3 了，述之黏著劑不度2 5 0毫米之聚酯可剝離薄膜之’ ^布至厚度25微米及寬以於其上提供一普通黏著専：。之二側至1〇微米之乾厚度，剝離薄膜黏著至普通黏著；二將厚度38微米之聚酯可 ;著騎塗布至基礎材;另=== 又，以於其上提供作為潔淨層之黏。妙 ^乾厚剝離薄膜黏著至潔淨層之表面。 θ …、、後將頒似的可，後使所產生之月材以^⑽毫劑量照射具有3 65毫微米中心 ^方^刀之正肢發明之潔淨片材。經紫外/ /外先，而付根據本淨層之黏著層展現丄卜材中之作為潔數之測^係利用根據川Κ7127之試驗方法進^。°拉伸模將在潔萍層側上之黏著層以j 〇毫米之寬度黏著之鏡面，然後根據J I S 7 0 ? Ί 7、目丨丨曰Α 日日口 '0θθ®"18〇° f後將可剝離薄膜自潔淨片材在其之黏然後將，淨片材黏著至8英…圓之背側(鏡面）’二備具有β淨功能之輸送潔淨晶圓。，外將兩晶圓段自基板處理設備移除，然後利用雷射型外來物質分析儀測量具有不小於〇. 3微米尺寸之外來物質的存在。、结果’在兩晶圓段之其中一者上在具有8英忖晶圓尺寸之面積上發現2 5, 0 0 0個具有不小於〇. 3微米尺寸$550688 V. Description of the invention (17) Mix evenly to obtain the solution of the UV curing adhesive. In addition, it will be prepared in the same way as above.-An adhesive containing dipyridyl acetic acid and cold. 3 The polyester peelable film with an adhesive degree of less than 250 mm is described as 布 cloth to a thickness of 25 micrometers and wide to provide a common adhesive on it :. On the two sides to a dry thickness of 10 microns, the peeling film is adhered to ordinary adhesion; on the other hand, a polyester with a thickness of 38 microns may be coated on the base material; the other is to provide a clean layer on it. sticky. Miao ^ Dry thickness The release film is adhered to the surface of the clean layer. θ, ..., will be awarded later, and then the resulting moon material is irradiated with a dose of ^ ⑽mmol to a clean sheet invented by a prosthetic limb with a center of 3 65nm. After UV // exterior, the adhesive layer in accordance with the present net layer was used to display the cleanliness in the material. The measurement was performed using the test method according to Chuan K7127. ° The tensile mold will adhere the mirror layer on the side of the Jieping layer to a mirror surface with a width of j 〇 millimeter, and then according to JIS 7 0? Ί7, heading 丨 Rikou '0θθ® " 18〇 ° f After that, the peelable film is adhered to the self-cleaning sheet, and then the clean sheet is adhered to 8 inches ... the back side of the circle (mirror surface). Second, a clean wafer with β net function is transported. Then, the two wafer segments were removed from the substrate processing equipment, and then the presence of foreign matter having a size of not less than 0.3 micrometer was measured using a laser-type foreign matter analyzer. ， Results ′ On one of the two wafer segments, 2,5 0 0 were found in an area having an 8-inch crystal circle size with a size of not less than 0.3 microns.

第20頁 550688 五、發明說明（18) 外來物質’及在另一者上發現2 2，0 0 0個。接著將可剝離薄膜自前述之輸送潔淨晶圓在其潔淨層侧上，除三然後將輪送潔淨晶圓輸送至具有經附著2 5, 0 0 0個夕t f物貝之晶圓段之基板處理設備的内部。結果，輸送潔淨曰曰圓之輸送可耄無問題地進行。其後將晶圓段移除，然後利用雷射型外來物質分析儀測量具有不小於〇· 3微米尺寸之外來物質的存在。結果，在具有8英吋晶圓尺寸之面積上發現6, 2 0 0個具有不小於〇· 3微米尺寸之外來物質，顯不已將在清潔之前經附著之外來物質的3/4以上移除。且匕較實施例2 以與實施例2相同之方式製備潔淨片材，除了其係以5毫焦耳/平方公分之整體劑量照射具有3 6 5毫微米中心波長之紫外光。然後以與實施例2相同之方式測量經如此製備得之潔淨片材之潔淨層的拉伸模數。結果為〇 · 6 7牛頓/平方毫米。然後測量潔淨層之黏著層對矽晶圓之黏著。結果為0.33牛頓/10宅米。嘗試將以與實施例2中相同之方式自前述之潔淨片材製備得之輸送潔淨晶圓輸送通過具有經附著2 2，0 0 0個外來物質之晶圓段之基板處理設備之内部。結果，輸送潔淨晶圓固疋至a日圓段。因此’輸送潔淨晶圓不再能被輸送。、實施例3 於100份由包含75份之丙烯酸2-乙基己酯、20份之丙稀酸甲酯及5份之丙烯酸之單體混合物製得之丙烯酸系聚合物（重量平均分子量：7 0 0，0 0 0 )中加入5 0份之聚乙二醇二Page 20 550688 V. Description of the invention (18) Foreign matter 'and 2 2,0 0 were found on the other. The peelable film is then transported from the aforementioned transported clean wafer on its clean layer side, and then removed by three, and then the wheeled clean wafer is transported to a substrate having a wafer segment attached with 2,500 tf substrates. The interior of the processing equipment. As a result, the conveyance of cleanliness can be performed without problems. Thereafter, the wafer segment was removed, and then the presence of foreign matter having a size of not less than 0.3 micron was measured using a laser-type foreign matter analyzer. As a result, 6,200 foreign materials having a size of not less than 0.3 micrometers were found on an area having a wafer size of 8 inches, and it was apparent that more than 3/4 of the foreign materials adhered before cleaning were removed. . And, compared with Example 2, a clean sheet was prepared in the same manner as in Example 2, except that it was irradiated with ultraviolet light having a center wavelength of 36.5 nm at an overall dose of 5 millijoules per square centimeter. Then, the tensile modulus of the clean layer of the clean sheet thus prepared was measured in the same manner as in Example 2. The result was 0.67 Newtons per square millimeter. Then measure the adhesion of the adhesive layer of the clean layer to the silicon wafer. The result was 0.33 Newtons / 10 house meters. An attempt was made to transport the transported clean wafer prepared from the aforementioned clean sheet in the same manner as in Example 2 through the inside of a substrate processing apparatus having a wafer segment to which 22,000 foreign substances were attached. As a result, the clean wafer is transported to the a-yen section. So 'transport clean wafers can no longer be transported. Example 3 100 parts of an acrylic polymer prepared from a monomer mixture containing 75 parts of 2-ethylhexyl acrylate, 20 parts of methyl acrylic acid, and 5 parts of acrylic acid (weight average molecular weight: 7 0 0，0 0 0) added 50 parts of polyethylene glycol two

C:\2D-CODE\90-07\90111082.ptd 第21頁 550688C: \ 2D-CODE \ 90-07 \ 90111082.ptd Page 21 550688

子基丙烯酸醋、50份之丙烯酸胺基甲酸酿鈿本甲醛及3份之二苯基甲烷二里氰酸萨炒= 甲酵另外將以與前述之相同方式製得，㊉含二甲醇縮苯，酸外之黏著劑溶》劑不以方；其上提供一普通黏著層。然後子又剝離薄膜黏著至普通黏著層之表面二著劑溶液塗布至基礎材料薄膜之另一側至⑼微米之乾二匕又，以於其上提供作為潔淨層之黏著層。畔二子制離薄膜黏著至潔淨層之表面。曰’、、、後將類似的可Acrylic acid vinegar, 50 parts of acrylic amino formic acid brewed with carbaldehyde formaldehyde and 3 parts of diphenylmethane di cyanocyanine saponin = formazan will be prepared in the same way as above, ㊉ contains dimethyl acetal The solution of the adhesive outside the acid is not a prescription; a common adhesive layer is provided thereon. Then the peeling film is adhered to the surface of the ordinary adhesive layer, and the adhesive solution is applied to the other side of the base material film to a dry micrometer of ⑼ micrometer, so as to provide an adhesive layer as a clean layer thereon. Panasonic release film adheres to the surface of the clean layer. ‘,,, and later will be similar

然後使所產生之片材以3, 0 0 0毫焦耳/平方公分之敕劑量照射具有3 6 5毫微米中心波長之紫外丨，而得根二本發明之潔淨片材。潔淨層之表面實質上不具有黏性。經紫外光固化之潔淨層展現〇. 5 8牛頓/平方毫米之拉伸模數。拉伸模數之測量係利用根據jIS K7 127之試驗方法進行。將潔淨層以1 0毫米之寬度黏著至矽晶圓之鏡面，然後根據 J I S Z 0 2 3 7測里對石夕晶圓之1 § 〇剝離黏著。結果為〇 · 〇〇 4 9 牛頓/1 0毫米。因此經證實潔淨層實質上不具有黏性。利用由三菱化學公司所製造之MCP-UP450型表面電阻率儀’在2 3 C之溫度及6 0 %之相對濕度下測量潔淨層之表面電阻率。結果，讀數大於9· 99 X 1 013歐姆/平方，而無法進行測量。因此經證實潔淨層實質上不具有導電性。然後將可剝離薄膜自潔淨片材在其之普通黏著層側上剝Then, the produced sheet was irradiated with ultraviolet rays having a center wavelength of 365 nm at a dose of 3,000 millijoules per square centimeter to obtain a clean sheet according to the present invention. The surface of the clean layer is substantially non-sticky. The clean layer cured by ultraviolet light exhibited a tensile modulus of 0.5 8 Newtons per square millimeter. The measurement of the tensile modulus is performed by a test method according to jIS K7 127. Adhere the clean layer to the mirror surface of the silicon wafer with a width of 10 mm, and then peel and adhere to Shi Xi wafer 1 § 〇 according to J I S Z 0 2 37. The result was 0 · 49 0 Newtons / 10 mm. Therefore, it was confirmed that the cleansing layer was not substantially sticky. The surface resistivity of the clean layer was measured using a MCP-UP450 type surface resistivity meter 'manufactured by Mitsubishi Chemical Corporation at a temperature of 2 3 C and a relative humidity of 60%. As a result, the reading was greater than 9.99 X 1 013 ohm / square, and the measurement could not be performed. Therefore, it has been confirmed that the clean layer is substantially non-conductive. The peelable film is then peeled from the clean sheet on its normal adhesive layer side

\\312\2d-code\90-07\90111082.ptd 第22頁 550688 - I _ 五、發明說明（20) 除。然後將潔淨片材黏著至8英吋矽晶而製備具有潔淨功能之輸送潔淨晶圓。β側（鏡面），复-遞例4 將厚度25微米及寬度25〇毫米之匕將與實施例3所使用之相同的普通=淨溥肤之一側上至10微米之乾厚度。铁曰=置方；聚酯 :可剝離薄膜黏著至普通黏著層之表面，作為潔淨層之聚酯薄膜展現2〇〇牛頓 :數。亦測量聚酿薄膜對矽晶圓〇。：=之拉伸為0半插/1 η真业㈤雖黏者。牡里\\ 312 \ 2d-code \ 90-07 \ 90111082.ptd Page 22 550688-I _ 5. Description of invention (20) Division. Then, the clean sheet is adhered to 8-inch silicon crystals to prepare a clean wafer for transportation. β side (mirror surface), complex-Example 4 A dagger with a thickness of 25 micrometers and a width of 25 millimeters will be the same as the one used in Example 3, with a dry thickness of 10 micrometers on one side. Iron = square; polyester: Peelable film is adhered to the surface of the ordinary adhesive layer, and the polyester film as a clean layer exhibits 200 Newtons: number. Polyvinyl alcohol film was also measured on silicon wafers. ： = The stretch is 0 half insertion / 1 η true industry ㈤Although sticky. Muli

生。…因此經證實聚醋薄膜實質上不具有DJ 測量聚自旨薄膜之表面電率。 ^ 1 〇13歐姆，而無法進行測量由此等而心買數/:"9 >< 實質上不具有導電性。、、α果、、星證貫潔淨層然後將可剝離薄膜自潔淨片相同之方式製備具有潔,# …、後以與貫施例3 另外利用雷射型：：：：：：：淨晶圓(2)。曰曰0之在其鏡面上之具有不小於〇央t矽的存在。結果，在第一片二 Λ y、寸之外來物質片材上發現12個，及在第一 ’二f8個外來物質’在第二晶圓以使其鏡面面二t;片發現10個。然後將此等部。其後利用雷二板處理設備之内在其鏡面上之外來物質里此寺日日S]之貝的存在。在第一矽晶圓上在8英吋第23頁 \\3l2\2d-code\90-07\90111082.ptd 550688 五、發明說明（21) 尺t面積上發現23, 788個具有不小於〇.2微米尺寸曰“物貝在第一矽晶圓上發現2 6，〇〇 8個，及在第三矽曰曰圓上發現28, 403個。、、上著將：剝離薄膜自前述之輸送潔淨晶圓⑴在其之潔 I二〜卢」除。然後將輸送潔淨晶圓（1)輸送至具有經附 ’ 8個外來物質之晶圓段之基板處理設備的内部。結果，輸送有困難。其後將具有7個存在於其上之具有不小 ^ 0^ 2 U米尺寸之外來物質之全新的8英吋矽晶圓以其鏡面 ::rtf送至基板處理設備之内部。然後利用雷射型外 =物貝：析儀各別測量此等晶圓之具有不小於〇. 2微米尺 ^之外來物質的存在。結果，在8英时晶圓尺寸之面積上、；旁+ j方、u· 2u木尺寸之外來物質，顯示將在峋冷之1T附著之74%的外來物質移除。接著將前述的輪送潔淨晶圓（2)輸送至且 2 6,0 0 8個外來物質之晶圓段之基板處理設備的&内部。結果，輸送有困難。其後使具有13個存在於其上之且有不小魏2微米尺寸之外來物質之全新的8英切晶圓;;如前所述之相同方式進行測量。結果’在8英叶晶圓尺寸之面積上發現7,988個具有不小於〇.2微米尺寸之外來物質，顯示將在清潔之前附著之69%的外來物質移除。比較實施例3 以與實施例3相同之方式製備得，除了其係以5焦耳/平方公分之整體劑量照射具有3 6 5毫微米中心波長之紫外光之在潔淨片材中之潔淨層具有黏性。然後測量、如此製備得Raw. … So it has been confirmed that the polyacetate film does not substantially have the DJ for measuring the surface electrical rate of the polyimide film. ^ 1 〇13 ohms, which makes it impossible to make measurements, and so on. /: &Quot; 9 > < It has substantially no conductivity. ,, α ,,,,,,,,, and, a star cleansing layer, then the peelable film self-cleaning sheet is prepared in the same manner with clean, # ..., and then with the same as Example 3 In addition, the use of laser type ::::::: net crystal Circle (2). On the mirror surface, 0 has the existence of not less than 0 t. As a result, twelve foreign materials were found on the first two Λ y, inch foreign materials, and ten mirrors were found on the second wafer with the first 'two f8 foreign materials'. Then divide these sections. Later, the existence of the shell in the temple was used within the mirror to treat foreign matter inside the Lei Erban processing equipment. On the first silicon wafer, 8 inches, page 23, \\ 3l2 \ 2d-code \ 90-07 \ 90111082.ptd 550688 V. Description of the invention (21) It was found that 23,788 had a size of not less than 0. .2 micron size "2,008" was found on the first silicon wafer, and 28,403 on the third silicon wafer. The top film: the release film from the aforementioned Clean wafers are transported in their cleanliness. The transported clean wafer (1) is then transported to the inside of a substrate processing apparatus having a wafer section with 8 foreign substances attached. As a result, transportation was difficult. Thereafter, a brand new 8-inch silicon wafer with 7 foreign objects having a size of not less than ^ 0 ^ 2 U meters was sent to the inside of the substrate processing equipment with its mirror surface :: rtf. Then, using a laser-type exogenous material: the analyzers individually measure the existence of foreign materials of these wafers having a size of not less than 0.2 micrometers. As a result, in the area of the wafer size at 8 inches, the side + j square, u · 2u wood size foreign matter, showed that 74% of the foreign matter attached to the cold 1T was removed. Then, the aforementioned clean wafer (2) is transported to the & interior of the substrate processing equipment of the wafer segment of 2,068 foreign matter. As a result, transportation was difficult. Thereafter, a brand new 8-inch wafer with 13 foreign materials existing thereon and having a size of 2 micrometers or less; was measured in the same manner as described above. As a result, 7,988 foreign materials having a size of not less than 0.2 micrometers were found on an area of 8-inch wafer size, showing that 69% of the foreign materials attached before cleaning were removed. Comparative Example 3 was prepared in the same manner as in Example 3, except that the clean layer in the clean sheet had a sticky layer that was irradiated with ultraviolet light having a center wavelength of 36.5 nm at a total dose of 5 Joules per square centimeter. Sex. Then measure and prepare

550688550688

之潔淨片材之潔淨層的拉伸模數。結果為〇 · 〇 6 7牛頓/平方毫米。然後测里 >糸淨層之對石夕晶圓之黏著。結果為Q Μ 牛頓/1 0毫米。嘗試將以與實施例3中相同之方式自前述之潔淨片材製備得之輸送潔淨晶圓（3)輸送通過具有經附著28, 4〇3個外來物質之晶圓段之基板處理設備之内部。結果，輸送潔淨晶圓固定至晶圓段。因此，輸送潔淨晶圓不再可被輸送。實施例5 於100份由包含30份之丙烯酸2-乙基己酯、7〇份之丙稀酸曱酯及10份之丙烯酸之單體混合物製得之丙烯酸系聚合物（重量平均分子量：2, 80 0, 〇〇〇)中加入15〇份之二異戍四醇六丙烯酸酯（商品名：UV 1 7 0 0B，尼彭合成化學工業股份有限公司（Nippon Synthetic Chemical 又， L t d.)製造）、3份之聚異氰酸酯化合物（商品名：◦ 〇 1 〇 n a t e L，尼彭聚胺曱酸酯工業股份有限公司（N丨pp〇nThe tensile modulus of the clean layer of the clean sheet. The result was 0.07 Newton / square millimeter. Then measure the adhesion of the clear layer to the Shi Xi wafer. The result is Q MW Newton / 10 mm. An attempt was made to transport the clean wafer (3) prepared from the aforementioned clean sheet in the same manner as in Example 3 through the inside of a substrate processing apparatus having a wafer segment to which 28,403 foreign substances were attached. . As a result, the transported clean wafer is fixed to the wafer segment. Therefore, transporting clean wafers can no longer be transported. Example 5 Acrylic polymer prepared from 100 parts of a monomer mixture containing 30 parts of 2-ethylhexyl acrylate, 70 parts of ethyl acrylate and 10 parts of acrylic acid (weight average molecular weight: 2 (80, 00, 00)) was added 150 parts of diisoisotetraol hexaacrylate (trade name: UV 1700B, Nippon Synthetic Chemical Co., Ltd., L t d. )), 3 parts of a polyisocyanate compound (trade name: ◦ 〇〇〇〇〇〇〇ン〇 L, Nippon Polyurethane Industry Co., Ltd. (N 丨 pp〇n

Polyurethane Industry Co·，Ltd·)製造）及 1〇份之二甲醇縮苯甲酸（Irgacure 651 ’汽巴特用化學品股份有限公司（Ciba Specialty Chenncals Co·， Ltd)製造）。缺後將混合物均勻擾拌，而得紫外光固化黏著劑溶液A。&後使紫外光固化黏著劑溶液以1，0 0 〇毫焦耳/平方公八之敕體劑量照射具有365毫微米中心波長之紫外光，二ς= 化。潔淨層之表面實質上不具有黏性。經紫外光固之潔淨層展現1，440牛頓/平方毫米之拉伸模數。技伸之測量係利用根據J IS Κ7127之試驗方法進行。 550688 、發明說明（23) 另外方、1 00如由包含75份之丙烯酸2_乙基己酯、2〇份之丙烯酸甲酉旨及5份之丙烯酸之單體混合物製得之丙婦酸系聚合物（重量平均分子量：7〇〇, 〇〇〇)中加入5〇份之聚乙二醉2 0 0 —甲基丙烯酸酯（商品名： Ester 4g，Polyurethane Industry Co., Ltd.) and 10 parts of dimethyl acetal (Irgacure 651 'Ciba Specialty Chenncals Co., Ltd.). After lacking, the mixture was uniformly stirred to obtain an ultraviolet curing adhesive solution A. & The ultraviolet-curing adhesive solution was irradiated with ultraviolet light having a center wavelength of 365 nanometers at a body dose of 1,000 millijoules per square meter. The surface of the clean layer is substantially non-sticky. The UV-cured cleansing layer exhibited a tensile modulus of 1,440 N / mm2. The measurement of the technical extension was performed by a test method according to J IS KK7127. 550688, Description of the invention (23) In addition, 1 100 is a fulvic acid system prepared from a monomer mixture containing 75 parts of 2-ethylhexyl acrylate, 20 parts of methyl formate, and 5 parts of acrylic acid. To the polymer (weight-average molecular weight: 70,000) was added 50 parts of polyethylene 200-methacrylate (trade name: Ester 4g,

Smnnakamuu Chemical c〇.，Ud.製造）、5〇份之：ϋ'Ν'01Chemicai Co.， Ltd.衣以）及3份之聚異氰酸酯化合物（商品名： C〇1〇nate L，尼彭聚胺甲酸醋工業股份有限公司製Smnnakamuu Chemical Co., manufactured by Ud.), 50 parts: ϋ'N'01Chemicai Co., Ltd.) and 3 parts of polyisocyanate compound (trade name: C〇〇〇〇nate L, Nippon polymer Carbamate Industry Co., Ltd.

然後將混合物均勻攪拌，而制他y曰 # J 米…基礎材料薄膜之一細上提供-普通黏著層。接著將厚度38微 ς = 度，以方；其上&供一潔淨層。鈇德一予黏著至潔淨層之表面。 ’、、、後將-類似的可剝離薄膜然後使所產生之片材以丨，〇〇〇毫焦耳/平方公分雕 =量照？具有365毫微米中心波長之紫外匕發明之潔淨片材。然後將可剝離薄膜自潔于根據本層側上剝除。接著測量潔淨層之表面自由能。=為二淨宅焦耳/平方米。潔淨層展現1〇5. 1度之對水的接觸、’、· 4 然後將可剝離缚膜自潔淨片材在其普通黏著角。。然後利用手動輥將潔淨片材黏著至8英吋矽曰曰剝除 (鏡面），而製備得具有潔淨功能之輸送潔淨晶：。月面Then the mixture is stirred uniformly, and one of the thin film of the basic material is provided-the ordinary adhesive layer. The thickness is then 38 micrometers in degrees; above it & for a clean layer. Tak Yi-yu adheres to the surface of the clean layer. ',,, and later-a similar peelable film, and then the resulting sheet is engraved with 丨, 000 millijoules per square centimeter = amount of light? Clean sheet of the invention with a UV dagger with a center wavelength of 365 nm. The peelable film is then self-cleaned on the side according to this layer. Then measure the surface free energy of the clean layer. = For Erjing House Joules / square meter. The clean layer exhibited a water contact of 105.1 degrees, ′, · 4 and then the peelable film was cleaned from the sheet at its ordinary adhesion angle. . Then use a manual roller to adhere the clean sheet to 8 inches of silicon and peel off (mirror surface) to prepare a clean crystal with clean function: Lunar surface

550688550688

另外將晶圓段自基板處理設備移除，然後利用雷射型外來物質分析儀測量具有不小於〇· 3微米尺寸之外來物質的存在。結果，在8英吋晶圓尺寸之面積上發現21，〇〇〇個具有不小於0 · 3微米尺寸之外來物質。八接著將可剝離薄膜自潔淨晶圓在其潔淨層側上剝除。然後將潔淨晶圓輸送至基板處理設備之内部。結果，即使係於1 0 0片的連縯輸送之後，潔淨層仍未牢固地黏著至待潔淨的位置。因此，可毫無問題地進行輸送。In addition, the wafer segment was removed from the substrate processing equipment, and then the presence of foreign matter having a size of not less than 0.3 micron was measured using a laser-type foreign matter analyzer. As a result, 21,000 foreign materials having a size of not less than 0.3 micrometers were found on an area of an 8-inch wafer size. Eight The peelable film is then stripped from the clean wafer on its clean layer side. The clean wafer is then transported inside the substrate processing equipment. As a result, the cleaning layer was not firmly adhered to the position to be cleaned even after the continuous transmission of 100 films. Therefore, conveyance can be performed without problems.

其後將晶圓段自基板處理設備移除，然後利用雷射型外來物質分析儀測量具有不小於〇 · 3微米尺寸之外來物質的存在。結果’在8英吋晶圓尺寸之面積上發現1〇, 〇〇〇個具有不小於0 · 3微米尺寸之外來物質，顯示將在清潔之前經附著之外來物質的一半移除。比較實施例5 使用利用包括將1 〇〇份之聚乙二醇2〇〇二甲基丙烯酸酯 (商口口名· NK Ester 4G，Sninnakamura Chemical Co.， Ltd·製造）、100份之聚乙二醇6〇〇二丙烯酸酯（商品名：NK Ester A-600，Sninnakamura Chemical Co·，Ltd.製造）Thereafter, the wafer segment is removed from the substrate processing equipment, and then the presence of foreign matter having a size of not less than 0.3 micrometers is measured using a laser-type foreign matter analyzer. As a result, 10,000 foreign substances having a size of not less than 0.3 micrometers were found on an area of 8 inches wafer size, which showed that half of the foreign substances adhered before cleaning were removed. Comparative Example 5 100 parts of polyethylene was used, including 100 parts of polyethylene glycol 2000 dimethacrylate (trade name: NK Ester 4G, manufactured by Sninnakamura Chemical Co., Ltd.) and 100 parts of polyethylene. Diol 600 acrylate (trade name: NK Ester A-600, manufactured by Sninnakamura Chemical Co., Ltd.)

及3份之聚異氰酸酯化合物（商品名：c〇i onate L，尼彭聚胺曱酸S旨工業股份有限公司製造）加至丨〇〇份由包含3〇份之丙稀酸2-乙基己醋、70份之丙稀酸曱g旨及1〇份之丙浠酸之單體混合物製得之丙烯酸系聚合物（重量平均分子量： 2，8 0 0，0 0 0 )中，然後再將混合物均勻攪拌之方法製備得之黏著劑溶液C作為潔淨層之黏著劑。然後以與實施例5之相And 3 parts of a polyisocyanate compound (commercial name: coonate L, manufactured by Nippon Polyurethane S Industrial Co., Ltd.) was added to 〇00parts containing 30 parts of 2-ethyl acrylic acid Acrylic acid polymer (weight average molecular weight: 2,8 0,0 0 0) in an acrylic polymer (weight average molecular weight: 2,8 0,0 0 0), and then The adhesive solution C prepared by the method of uniformly stirring the mixture was used as the adhesive of the clean layer. Then it is the same as that of Example 5.

\\312\2d-code\90-07\90111082.ptd 第27頁 550688 五、發明說明（25) 同方式測量如此製得之潔淨層的拉伸模數。結果為〇 1牛頓/平方毫米。以與實施例5之相同方式自潔淨層製備潔淨片材。然後測量潔淨層之表面自由能。結果為5 7. 3毫焦耳/平方米潔淨層展現4 9. 4度之對水的接觸角。嘗試將以與實施例5中相同之方式自前述之潔淨片材製備得之輸送潔淨晶圓輸送至基板處理設備之内部。、纟士果潔淨晶圓在第一片材之輸送過程中固定至晶圓段。因°此輸送潔淨晶圓不再可被輸送。實施例6 於100份由包含75份之丙烯酸2-乙基己酯、20份之丙稀酸曱酿及5份之丙烯酸之單體混合物製得之丙歸酸系聚合物（重量平均分子量：700,000)中加入1〇〇份之聚乙二>醇 200二曱基丙烯酸酯（商品名：NK Ester 4G，一予 @之聚異氰\\ 312 \ 2d-code \ 90-07 \ 90111082.ptd page 27 550688 V. Description of the invention (25) The tensile modulus of the clean layer thus obtained was measured in the same manner. The result was 0.1 N / mm2. A clean sheet was prepared from the clean layer in the same manner as in Example 5. Then measure the surface free energy of the clean layer. The result is 57.3 millijoules per square meter. The clean layer exhibits a contact angle to water of 49.4 degrees. An attempt was made to transport the transported clean wafer prepared from the aforementioned clean sheet in the same manner as in Example 5 to the inside of the substrate processing apparatus.纟士果 The clean wafer is fixed to the wafer section during the first sheet conveying process. Because of this, clean wafers can no longer be transported. Example 6 A 100-weight acrylic acid-based polymer (weight average molecular weight: 100 parts) prepared from a monomer mixture containing 75 parts of 2-ethylhexyl acrylate, 20 parts of acrylic acid brewing, and 5 parts of acrylic acid. 700,000) was added 100 parts of polyethylene > alcohol 200 difluorenyl acrylate (trade name: NK Ester 4G, Yiyou @ 的聚异 cyano

Sn i nnakamura Chemical Co.，Ltd.製造）酸S旨化合物（商品名：Colonate L，尼彭聚胺甲护/、股份有限公司製造）及3份之作為光聚合引於才义1工” 苯曱醛（Irgacure 651，汽巴特用化學品股份一八/制造）。然後將混合物均句攪拌，而製備得紫限公司製劑溶液A。糸外光固化黏著另外將以與前述之相同方式製得，除了前 — 液A不含作為光聚合引發劑之二曱醇縮苯甲醛外黏著劑溶溶液塗布至厚度38微米及寬度25〇毫米之聚酽=黏著劑之一侧至10微米之乾厚度，以於其上提供—曰剝離薄膜曰通黏著層。Sn i nnakamura Chemical Co., Ltd.) Acid S purpose compound (trade name: Colonate L, manufactured by Nippam Polyamide Co., Ltd.) and 3 parts of which are introduced as photopolymerization in Caiyi 1 ”Benzene Formaldehyde (Irgacure 651, Cibat Chemical Co., Ltd./manufactured). Then the mixture was stirred to prepare the purple solution of the company's formulation A. 糸 External light curing adhesive will be prepared in the same manner as before Except for front-liquid A, which does not contain diacetal as the photopolymerization initiator, the adhesive solution is coated to a thickness of 38 microns and a width of 25 mm. Polyfluorene = one side of the adhesive to a dry thickness of 10 microns In order to provide on it-a release film and a through adhesive layer.

550688550688

Ϊ ί將厚度38微米之聚酯可剝離薄膜黏著至普通黏著層之 :面。接著將前述之紫外光固化黏著劑溶液α 曰膜…側至10微米之乾厚度，以於其上提/作礎為 :€之黏者層。然後將類似的可剝離薄膜黏著至屛 <表面。 -^Ϊ Glue a polyester peelable film with a thickness of 38 microns to the side of the ordinary adhesive layer. Next, the above-mentioned UV-curable adhesive solution α is a film ... side to a dry thickness of 10 micrometers, and is based on the lift-up / base layer: €. A similar peelable film was then adhered to the < surface. -^

，後使所產生之片材以2, 0 0 0毫焦耳/平方公分之整二Γ照!ί具有3 6 5毫微米中心波長之紫外★，而得根據‘ 二明之潔淨片材。然後將可剝離薄膜自潔淨片材在其之兔侧上剝除。接著利用NEC製造之ΜΗΑ 一 40 0型維克爾斯ς &叶测量潔淨片材之潔淨層的維克爾斯硬度。結果為45。經利用紫外光固化之潔淨層展現147· 2牛頓/平方毫米 $拉伸模數。拉伸模數之測量係利用根據]13 Κ7127之試驗方法進行。將潔淨層以1〇毫米之寬度黏著至矽晶圓之^鏡 =，然後根據JIS Ζ0 23 7測量對矽晶圓之180。剝離黏著，結果為0. 0 0 4 9牛頓/1 〇毫米。因此，經證實潔淨層實質不具有黏性。、儀電進性Then, the resulting sheet was irradiated with a total length of 2,000 millijoules per square centimeter, and the ultraviolet rays with a center wavelength of 36.5 nanometers were obtained, and the clean sheet according to ‘Ermin's. The peelable film was then peeled from the clean sheet on its rabbit side. Then, the Mickel-400 type Vickers leapers & leaf manufactured by NEC were used to measure the Vickers hardness of the clean layer of the clean sheet. The result is 45. The UV-cured clean layer exhibited a tensile modulus of 147.2 Newtons per square millimeter. The measurement of the tensile modulus was performed using a test method according to [13 KK7127]. The clean layer was adhered to the mirror of the silicon wafer with a width of 10 mm, and then 180 of the silicon wafer was measured according to JIS ZO23. Peel adhesion, the result was 0.04 9 Newtons / 10 mm. Therefore, it was confirmed that the cleansing layer was not substantially sticky. Electrical performance

利用由三菱化學公司所製造之MCp — up45〇型表面電阻率 ’在2 3 °C之溫度及60%之相對濕度下測量潔淨層之表面阻率。結果，讀數大於9· 99 X 1〇π歐姆/平方，而無法仃測量。由此等結果，經證實潔淨層實質上不具有導電 #然後將可剝離薄膜自潔淨片材剝除。然後將潔淨片材為者至8英吋矽晶圓之背侧（鏡面），而製備具有潔 ^ 輸送潔淨晶圓。之The surface resistivity of the clean layer was measured using a MCp-up45o type surface resistivity manufactured by Mitsubishi Chemical Corporation at a temperature of 23 ° C and a relative humidity of 60%. As a result, the reading was greater than 9.99 X 10π ohm / square, and it was impossible to measure it. From these results, it was confirmed that the cleansing layer has substantially no conductivity # and then the peelable film was peeled from the clean sheet. Then clean the wafer to the back side (mirror surface) of the 8-inch silicon wafer, and prepare a clean wafer with clean transport. Of

550688 五、發明說明（27) 另外將兩μ圓段自基板處理設備移除，然後利用雷射型外來物質分析儀測量具有不小於〇 · 3微米尺寸之外來物質的存在。結果，在兩晶圓段之其中一者上在具有8英吋晶圓尺寸之面積上發現25, 〇〇〇個具有不小於〇. 3微米尺寸之外來物質’及在另一者上發現2 3，〇〇〇個。接著將可剝離薄膜自前述之輸送潔淨晶圓在其之潔淨層側上剝除。然後將輸送潔淨晶圓輸送至具有經附著U曰個外來物質之晶圓段之基板處理設備的内部。結果，’ 潔夺晶圓之輸送可毫無問題地進行。其後將 ^适然後利用雷射型外來物質分析儀測量具有 &除’ 尺寸之：來物質的存在。結I，在具有8英忖晶圓= 面積上叙現4, 800個具有不小於〇. 3微米尺寸之外來顯示！:將在清潔之前經附著之外來物質的4/5以上移r貝’ 比較實施例6 工私除。以與貝轭例6之相同方式製備潔包括將100份之聚？—舻finn —工X 于J便用利用550688 V. Description of the invention (27) In addition, the two μ circles are removed from the substrate processing equipment, and then the existence of foreign matter having a size of not less than 0.3 micrometers is measured using a laser-type foreign matter analyzer. As a result, 25,000 foreign substances having a size of not less than 0.3 micrometers were found on one of the two wafer segments in an area having a wafer size of 8 inches, and 2 were found on the other. 3,000. The peelable film is then peeled from the aforementioned transported clean wafer on its clean layer side. The transported clean wafer is then transported to the inside of a substrate processing apparatus having a wafer segment to which a foreign substance is attached. As a result, the transfer of the geki wafer can be performed without any problem. It is then adapted and then measured with a laser-type foreign material analyzer having a & division 'size: the presence of foreign material. As a result, 4,800 wafers with an area of 8-inch wafers or more are displayed in a size of not less than 0.3 micrometers! : Remove more than 4/5 of the foreign matter adhered before cleaning. Comparative Example 6 Workers and workers are removed. In the same manner as in Example 6 of the yoke, including the 100 parts together? — 舻 finn —Work X is used in J

Ester* A-60 0，Snin—^6 0 0二丙烯酸醋（商品名：㈣、3份之聚異氰smchemicai c〇·，Ltd•製造）胺曱酸脂工業股/ °物(f品名：C〇1〇nate L，尼彭聚Ester * A-60 0, Snin— ^ 6 0 0 Diacrylic acid vinegar (trade name: ㈣, 3 parts of polyisocyanic smchemicai c., Ltd.) Amino acid industrial stock / ° (f product name: C〇1〇nate L, Nipon Ju

又知有限公司製造）及1 Q份之作為杏發劑之：曱醇縮苯、/幻"刀之作為先聚合弓I 用化學品股份有限：J(制商:二.Irga，e 651 ’汽巴特酸2-乙基己酯、7“八：：：：至:00份由包含30份之丙烯混合物製得之丙烯：人：曱酯及1 0份之丙烯酸之單體 2,80"00)中，量平均分子量： 4後再將混合物均勻攪拌之方法製備得之Also known as Co., Ltd.) and 1 Q parts as an apricot hair extension agent: acetal, / magination " knife as the first polymerization bow I use chemicals limited stock: J (manufacturer: two. Irga, e 651 'Cibamate acid 2-ethylhexyl ester, 7 "eight :::: to 00 parts of propylene made from a mixture containing 30 parts of propylene: human: fluorene ester and 10 parts of acrylic acid monomer 2,80 " 00), the average molecular weight: 4 prepared by a method of uniformly stirring the mixture

C:\2D-CODE\90-07\90111082.ptd 第30頁 550688 五、發明說明（28) ^ : S 5 作為潔淨層之黏著劑。然後以與如前所述之 I ί 二，1如此製備得之潔淨片材之潔淨層的維克爾斯毫=耳^為5\。測量潔淨層之表面自由能。結果為34· 6 毛^ 平方=分。潔淨層展現8 2 · 3度之對水的接觸角。二々於^ =貫施例6中相同之方式自前述之潔淨片材製 , !!送办淨晶圓輸送至具有經附著2 3，0 0 0個外來物質 ί =圓^基板處理設備之内部。結果，潔淨晶圓在第一 i π* t二达過種中固定至晶圓段。因此，輸送潔淨晶圓不再可被輸送。實施例7 酸包含75份之丙稀酸2一乙基己醋、20份之丙稀 :(重量平酸之單體混合物製得之繼二甲基丙稀酸能:，，°0°)中加入50份之聚乙二醇200C: \ 2D-CODE \ 90-07 \ 90111082.ptd Page 30 550688 V. Description of the invention (28) ^: S 5 is used as an adhesive for the cleaning layer. Then, the Vickers of the cleansing layer of the clean sheet thus prepared as described above with I, 2, 1 is equal to 5 \. Measure the surface free energy of the clean layer. The result was 34.6 gross squared = minutes. The clean layer exhibits a contact angle to water of 8 2 · 3 degrees. 々 = In the same way as in Example 6, made from the aforementioned clean sheet, !! The delivery wafer is transported to a substrate with 2 3 0 0 foreign materials attached to it. internal. As a result, the clean wafer is fixed to the wafer segment in the first i π * t second pass seed. As a result, clean wafers can no longer be transported. Example 7 The acid contains 75 parts of acrylic acid 2-ethylhexyl vinegar and 20 parts of acrylic acid: (Subsequent to dimethylacrylic acid prepared by a monomer mixture of ping acid: ,, 0 °) Add 50 parts of polyethylene glycol 200

Chemical Co τ。〇口名.NK Estei" 4G，Sninnakamura 品名：U_N_〇1’，•製造）、5〇份之丙烯酸胺基曱酸酯（商造）、3份之聚里^;C〇.，Ud•製彭聚胺曱酸酯工業^ = ^合物（商品名：Colonate L，尼引發劑之二甲醇縮二：有，公司製造）及3份之作為光聚合得紫外光E1化著劑溶$a°。'然後將混合物均钱拌，而製另外將以與前述 / 液A不含作為光聚人目同方式製得，除了前述之黏著劑溶溶液塗布至厚度3 8^\^之二甲醇縮苯甲料之黏著劑之一側至1 0微米之妒及兄度250耄米之聚酯可剝離薄膜己厚度，以於其上提供一普通黏著層。Chemical Co τ. 〇 Mouth name. NK Estei " 4G, Sninnakamura Product name: U_N_〇1 ', • made), 50 parts of acrylic urethane (commercially produced), 3 parts of poly ^; Co., Ud • Peng Polyurethane Industry ^ = ^ compound (commercial name: Colonate L, the second initiator of methanol, diacetate: yes, manufactured by the company) and 3 parts of it as photopolymerization to obtain UV light E1 chemical agent a °. 'Then the mixture is mixed, and the system is also prepared in the same manner as the above / liquid A without the photopolymerization, except that the aforementioned adhesive solution is applied to a thickness of 3 8 ^ \ ^ bismethyl acetal One of the adhesives on the side of the material has a thickness of 10 μm and a polyester peelable film with a thickness of 250 mm to provide a common adhesive layer thereon.

550688 五發明說明（29) ____ 接著將厚度38微米之聚酯可剝離薄表面。接著將前述之紫外光固化荽1 W通黏著層之材料薄膜之另一側至1 〇微米之乾戶户θ ’奋’夜A塗布至基礎潔：層之刪。然後將類似的；；離;;： = 為之表面。号联黏者至黏著層然後使所產生之片材以1，〇〇〇毫焦劑量照射具有3 65毫微米中心波長: I方公分之整體發明之潔淨片#。然後將可剝離薄膜、自二’而，根據本淨層側上剝除。經利用紫外光固化二/片材在其之潔摩擦係數及50牛頓/平方毫米之拉二:片材展現1. 7之數，使50毫米x 50毫米尺寸之不=。為測量摩擦係 300毫米/分鐘之速率及9. 8牛頓之垂預定方向中在表面移動。然後利用通用的拉伸試驗=::潔淨層之 =^。拉伸模數之測量係利用根據”里產生之摩法進灯。 1 ^ <试驗方然後將可剝離薄膜自潔淨片材在1並除。然後利用手動輥將潔淨片材點著=二j者層側上剝形狀之接觸插腳潔淨構件之接有8奂吋矽晶圓 P編chip，PASS INC.製造）Ξ =柳潔淨器（商品名：衣仏J的月面（非丧、|本、得具有潔淨功能之輸送潔淨構件。 …、 ’而製備接著將可剝離薄膜自潔淨構件在其後將潔淨構件仿造輸送通過晶圓探針曰1制除。然體，以清潔接觸插腳及夾頭平△ /、係用於衣造半導部。結果，潔淨層並未牢固地=備)之内 I接觸位置。因此，可550688 5 Description of the invention (29) ____ Then the polyester with a thickness of 38 microns can be peeled off the thin surface. Next, the other side of the material film of the UV-curable 1 W through-adhesive layer described above to 10 μm dry household θ 'fen' Ye A was applied to the foundation cleaning: layer deletion. Then put similar ;; away ;;: = for the surface. Connect the adhesive to the adhesive layer and then irradiate the resulting sheet with a center wavelength of 3 65 nm: a clean sheet # of the total invention at a dose of 1,000 mJ. The peelable film is then peeled off from the base layer on the basis of the clean layer. Through the use of ultraviolet light curing two / sheet in its clean friction coefficient and 50 Newtons / square millimeter pull two: the sheet shows a number of 1.7, so that the size of 50 mm x 50 mm is not equal. To measure the friction system at a rate of 300 mm / min and a 9.8 Newton sag, the surface was moved in a predetermined direction. Then use the common tensile test = :: clean layer = ^. The measurement of the tensile modulus is performed by using the rubbing method produced according to "1." The test party then divided the peelable film from the clean sheet at 1 and divided it. Then the manual sheet was used to light the clean sheet = 2 8-inch silicon wafer P-chip chip, manufactured by PASS INC., is connected to the contact pin clean member of the peeling shape on the side of the layer. 柳 = willow cleaner (commodity name: 衣仏 J's lunar surface (non funeral, | This method has the function of conveying clean components with clean function.…, And then prepare the peelable film from the clean component and then transfer the clean component to the wafer probe through the wafer probe. Then, clean the contact pins and The chuck flat △ /, is used in the clothing semi-conductor. As a result, the cleaning layer is not firmly within the I contact position. Therefore, it can be

\\312\2d-code\90-07\901ii〇82>ptd 第32頁 550688\\ 312 \ 2d-code \ 90-07 \ 901ii〇82 > ptd page 32 550688

發明說明宅無問題地進行輸送。二其後在顯微鏡下觀察接觸插腳。結果，經確認在清潔之刖附著至接觸插腳之外來物質諸如氧化物消失，顯示接觸插腳已經清潔。此外，經發現在清潔之前在夾頭平台上發現之具有約1毫米尺寸之矽殘屑完全消失，顯示夾頭平台已經清潔。其後，以實際的基礎輪送及檢查作為產品之晶圓。結果，可毫無問題地進行處理。實施例8 於100份由包含75份之丙烯酸2-乙基己 as …^ /土、^刀、之丙烯酸甲酯及5份之丙烯酸之單體混合物製得之丙烯酸系聚合物（重量平均分子量：0 0 0 )中加入50份之聚乙二醇200 二甲基丙烯酸酿（商品名：NK Ester 4G ,Sninnakamura C口hemiCal C〇·， Ltd.製造）、50份之丙烯酸胺基曱酸酯（商名 ϋ N 0 1 S n i η n a k a mu r a C h e m i c a 1 C 〇.，L t d.製造）、3份之聚異氰酸醋化合物（商品名^〇i〇nate l，、彭聚胺曱酸酿工業股份有限公司之二甲醇縮笨甲酸(Irgacure651，汽巴。口月又知有限公司製造然後將混合紫外光固化黏著劑溶液A。㈣而衣備另外以與前述之相同方式製得普通 A，除了前述之黏著劑不含二甲醇縮苯曱搭。]合液 :普通的感壓黏著劑溶液A塗布宅米之聚酿基礎材料薄膜之一側至1〇微米之乾十厚及度見，= 供—普通黏著層。然後將厚度38微米之聚酿可剝ς薄㈣DESCRIPTION OF THE INVENTION The house is conveyed without problems. Second, observe the contact pins under a microscope. As a result, it was confirmed that foreign matter such as oxides that had adhered to the contact pins during the cleaning of the puppets disappeared, indicating that the contact pins had been cleaned. In addition, it was found that the silicon debris having a size of about 1 mm was completely disappeared on the chuck platform before cleaning, indicating that the chuck platform had been cleaned. After that, the wafers are rotated and inspected on the actual basis. As a result, processing can be performed without problems. Example 8 An acrylic polymer (weight-average molecular weight) prepared from 100 parts of a monomer mixture containing 75 parts of 2-ethylhexyl acrylate as ... ^ / earth, ^ knife, methyl acrylate, and 5 parts of acrylic acid ： 0 0 0) 50 parts of polyethylene glycol 200 dimethacrylic acid (trade name: NK Ester 4G, made by Sninnakamura Ckou hemiCal Co., Ltd.) and 50 parts of acrylate aminoacetate (Commercial name ϋ N 0 1 S n η naka mu ra C hemica 1 C 〇., Manufactured by L t d.), 3 parts of a polyisocyanate compound (trade name ^ 〇i〇nate 1,), pentaamine曱 Acid Brewery Industry Co., Ltd.'s Dimethyl Methanol (Irgacure 651, Ciba. Manufactured by Kou Yue Zhi Co., Ltd. and then mix the ultraviolet light curing adhesive solution A. ㈣) Clothing is also prepared in the same manner as previously described Ordinary A, except for the aforementioned adhesive, does not contain dimethyl acetal.] Blend: Ordinary pressure-sensitive adhesive solution A is coated on one side of the rice-based brewing basic material film to 10 microns dry and See, = =-ordinary adhesive layer. Then the 38 micron thick polymer can be peeled Thin

550688 五、發明說明（31) 著至普通黏著層之表面。將 A塗布至基礎材料薄膜之另_紫外光固化黏著劑溶液供作為潔淨層之黏著層。將 30微米之乾厚度，而提層之表面，而製備潔淨片材A、。L 、可剝離薄膜黏著至黏著然後測量紫外光固化黏著 JIS K7127)。結果，其在藉由拉伸模數（試驗方法·· 現〇. 1牛頓/平方毫米之拉槿、先！歷固化反應之前展方公分之整體劑量照射具有3 6 5毫微J ^、’、^毫焦耳/平之紫外光固化黏著劑Α展現4 9 ;::長之糸外光數。丁明/十方*米之拉伸模 Λ Λ 匕製得之潔淨片材a黏著至晶圓。在丨用吉I片材A黏著至8英吋矽晶圓之背面（鏡面），然 ^再利用直接切割法切割成晶圓之形狀。於25個片材上連續進灯此插作。結果，於片材切割過程中未產生切割廢 # 0 " 其後使5片具有片材之晶圓以1，0 0 0毫焦耳/平方公分之整體劑s照射具有3 6 5毫微米中心波長之紫外光，而製備具有潔淨功能之輸送潔淨晶圓Α。另外利用雷射型外來物質分析儀各別測量4片全新8英吋石夕晶圓之在其鏡面上之具有不小於〇 · 2微米尺寸之外來物質的存在。結果，在第一片材上發現8個具有不小於〇. 2微米尺寸之外來物質’在第二片材上發現11個，在第三片材上發現9個’及在第四片材上發現5個。將此等晶圓以使其550688 V. Description of the invention (31) It touches the surface of the ordinary adhesive layer. Apply A to another UV-curable adhesive solution of the base material film for the adhesive layer as a clean layer. A dry thickness of 30 microns was applied to the surface of the layer to prepare a clean sheet A ,. L. Peelable film is adhered to the adhesion, and then the UV-curable adhesion is measured (JIS K7127). As a result, it has a total dose irradiation of 3 6 5 nanometers J ^, ' , ^ MJ / flat UV curing adhesive A exhibits 4 9; :: number of long external rays of light. Ding Ming / ten square * meter stretch mold Λ Λ The clean sheet a made by dagger adheres to the crystal Circle. Attach the back of the 8-inch silicon wafer (mirror surface) with Ji I sheet A, and then use the direct cutting method to cut into the shape of the wafer. Continuously insert lights on 25 sheets to interpolate As a result, no cutting waste was generated during the sheet cutting process. After that, 5 wafers with sheet were irradiated with a total dose of 1,000 millijoules per square centimeter with 3 6 5 nm. The central wavelength of ultraviolet light is used to prepare a clean wafer A with clean function. In addition, a laser-type foreign material analyzer is used to measure 4 new 8-inch Ishiba wafers on the mirror surface. · The presence of foreign matter with a size of 2 microns. As a result, 8 were found on the first sheet with a size of not less than 0.2 microns Addition to substances 'found in the second sheet 11, found on the third sheet 9', and 5 was found on the fourth sheet. This and other wafer so

第34頁 C:\2D-CODE\90-07\90111082.ptd 550688 五、發明說明（32) 鏡面面向下地輸送至具有靜電吸？丨機構之個別基板處理設備之内部，然後利用雷射型外來物質分析儀測量具有不小於0 · 2微米尺寸之外來物質的存在。結果，在第一片材上在8英吋的晶圓尺寸面積上發現31，254個具有不小於〇· 2微米尺寸之外來物質，在第二片材上發現2 9, 954個，在第三片材上發現2 8，6 8 3個，及在第四片材上發現2 7，9 8 6個。Page 34 C: \ 2D-CODE \ 90-07 \ 90111082.ptd 550688 V. Description of the invention (32) Is the mirror surface conveyed to the surface with electrostatic attraction?丨 Inside the individual substrate processing equipment of the facility, and then use a laser-type foreign matter analyzer to measure the presence of foreign matter with a size not less than 0.2 micron. As a result, 31,254 foreign materials having a size of not less than 0.2 micron were found on the 8-inch wafer size area on the first sheet, and 2, 9,954 were found on the second sheet. Two, eight, eight, eight, three were found on the three sheets, and two, seven, eight, eight, six were found on the fourth sheet.

接著將可剝離薄膜自前述之輸送潔淨晶圓A在其之潔淨層側上剝除。然後將輸送潔淨晶圓A輸送至具有經附著3 1， 254個外來物質之晶圓段之基板處理設備的内部。結果，’ 輸送可毫無問題地進行。其後將全新的8英吋矽晶圓以使其鏡面面向下地輸送至基板處理設備之内部，然後利用雷射型外來物質分析儀測量具有不小於0· 2微米尺寸之外來物吳的存在。將此操作進行5次。結果記述於表1。實施例9The peelable film is then peeled from the aforementioned transported clean wafer A on its clean layer side. The clean wafer A is then conveyed to the inside of a substrate processing apparatus having a wafer segment to which 3,254 foreign substances are attached. As a result, the 'transportation can be performed without problems. Thereafter, a new 8-inch silicon wafer was transported with its mirror surface facing down to the inside of the substrate processing equipment, and then the presence of foreign matter with a size of not less than 0.2 micron was measured with a laser-type foreign matter analyzer. Do this 5 times. The results are described in Table 1. Example 9

以與實施例8之相同方式製備潔淨片材b，除了使用利用包括將1 0 0份之多官能丙烯酸胺基曱酸酯（商品名：uv 1 7〇 0B ’尼彭合成化學工業股份有限公司製造）、3份之聚異氛酸醋化合物（商品名：C 〇 1 〇 n a t e L，尼彭聚胺曱酸酯工業股份有限公司製造）及1 0份之作為光聚合引發劑之二甲醇縮本甲酸（商品名：I r g a c u r e 6 5 1，汽巴特用化學品股份有限公司製造）加至1 〇〇份由包含3 q份之丙烯酸2 _乙基己醋、7 0份之丙烯酸甲酯及丨〇份之丙烯酸之單體混合物製得之丙烯酸系聚合物（重量平均分子量：2，8 0 〇，〇〇〇 )中，然後再將混合物均勻攪拌之方法製備得之紫外光固化黏著A clean sheet b was prepared in the same manner as in Example 8, except that the use of 100 parts of a polyfunctional acrylic amino sulfonate (trade name: UV 1700B) was used. (Manufactured), 3 parts of polyisocyanate compound (brand name: C 〇〇〇〇〇〇〇one L, manufactured by Nipon Polyurethane Industry Co., Ltd.) and 10 parts of dimethyl alcohol as a photopolymerization initiator This formic acid (trade name: Irgacure 6 51, manufactured by Cibato Chemical Co., Ltd.) was added to 1,000 parts by 3 q parts of acrylic acid 2-ethylhexyl vinegar, 70 parts of methyl acrylate and丨 0 parts of an acrylic polymer (weight average molecular weight: 2,800,000) prepared from a monomer mixture of acrylic acid, and then the mixture was uniformly stirred to prepare a UV-cured adhesive.

C：\2D-CODE\90-07\90111082.ptd 第35頁 550688 五、發明說明（33) 劑溶液B作為紫外一者劑B之拉伸模數。社::後測里I外光固化黏頓/平方毫米之加他^ ，、在、，翌歷固化之前展現0. 〇1牛之整體劑量照射I 毛焦耳/千方公分 .m ^ .. 具有3 65毫微米中心波長之紫外氺夕杜t 先固化黏者劑B a招]/ / Λ丄丄/ 心糸外九之紫外秋後使前= 0牛頓/平方毫米之拉伸模數。 :、' =刖述之潔淨片材β以、：接切割法，而製備2 j 1目丨j之方式進行直叫、证 < 山丄衣1有^片具有片材之晶圓。社杲，於y仏隹瓦/ τ 刀屬。然後使2 5片晶圓中之5 >：以1 η η η丄焦耳/平方公分夕敕粬w曰 M 丫月以1，0 0 0毫C: \ 2D-CODE \ 90-07 \ 90111082.ptd page 35 550688 5. Description of the invention (33) The tensile modulus of the solution B as the ultraviolet one. Agency :: Post-measurement I external light curing sticky / mm2 plus ^, before, and before the calendar curing shows a total dose of 0. 〇1 cattle exposure I hair Joules / thousand centimeters. M ^ .. Ultraviolet light with a central wavelength of 3 65 nm. Curing Adhesive B a]] / / Λ 丄丄 / Heart 糸 Out of the ultraviolet light after the fall makes the front = 0 Newton / square millimeter of tensile modulus. :, '= The clean sheet β described above is connected to the dicing method to prepare 2 j 1 mesh and j for direct calling and verification. &Lt; Yamagata 1 has ^ wafers with sheets. She 杲, Yu y 仏隹 watt / τ knife. Then make 5 of the 25 wafers >: 1 η η η 丄 Joules / cm² 敕粬曰 w 曰 M month to 1, 0 0 0 milli

. 正脰劑i照射具有3 6 5亳料半Φ、、、士 E 之紫外光，而萝锯目士* J毛U木中心波長接著將可^ ^具有潔淨功能之輸送潔淨晶圓B。接者將可剝離薄膜自” w 層側上剝除。麸徭脾鈐，,則、〆糸/尹晶圓B在其之潔淨 ou W从十1 w後將輸送潔淨晶圓Β輸送至且有妳附荖？Q 9 5 4個外來物質之曰、王〆、’、、、工丨付者2 9，浐-可古毹网H日口 &之基板處理設備之内部。結果，其後將8英，晶圓以使其鏡* 來物質分析；；在右。脾+π &有不小ο.2被米尺寸之外來物質的存在將此細作進行5次。、结果記述於表i。比較實施例8 以與貫施例8之相回士斗、*丨士 &丄夕曰m ^ ^ , 问方式利用直接切割法製備具有片材之晶圓，除了潔淨片έ丨 H m fin t材包括使潔淨片材Α在黏著至 +毛焦耳/千方公分之整體劑量照射具有未中心波長之紫外光之方法而製備得。肖果，在片材切割過程中自潔噃厗吝也士旦从+ ^ 捲荖大m 1 : 切割廢料。此等切屑接者大里附者至具有片材之晶圓的邊緣、晶圓之背面及帶The positive tincture i irradiates ultraviolet light with 3 6 5 ½, Φ ,, and ± E, and the central wavelength of the saw blade * J hair U wood. Then, a clean wafer B with a cleaning function can be transported. Then, the peelable film is peeled off from the side of the "W" layer. The bran and spleen are then cleaned. Then, the clean wafer B will be transported to the clean wafer B after 10 w. Attached? Q 9 5 The inside of the 4 substrates of foreign materials, Wang Xi, ',,, Gong Ji pay 2 9, 浐-可古毹网 H Rikou & substrate processing equipment. As a result, will be 8 inches, the wafer is used to make a mirror * for material analysis; on the right. The spleen + π & there is no small ο. 2 the existence of foreign matter with the size of rice. This detail is performed 5 times. The results are described in Table i Comparative Example 8 A wafer having a sheet material was prepared by a direct dicing method in the same way as in Example 8 except for a clean sheet. H m The fin t material is prepared by making the clean sheet A irradiated with ultraviolet light having a non-center wavelength at an overall dose of + J Joules / thousand centimeters. Xiao Guo, self-cleaning during the sheet cutting process. Yashidan from + ^ roll 荖 m 1: cutting waste. These chips are attached to the edge of the wafer with the sheet, the back of the wafer and the tape

第36頁 550688 五、發明說明（34) --- 型標籤。因此，具有片材之晶圓C的製備暫停。比較實施例9 以與實施例8之相同方式製備潔淨片材D，除了使用锐明於實施例8之感壓黏著劑溶液A作為潔淨層之黏著劑。潔淨片材D中之潔淨層展現0· 1牛頓/平方毫米之拉伸模數^ / 然後使潔淨月材D以與實施例8中之相同方式進行直接切割’而製備具有片材之晶圓。結果，在片材切割過程中未產生切割廢料。製備2 5片具有片材之晶圓。然後嘗試將輸送潔淨晶圓D輸送至具有經附著2 7，9 8 6個外來物質之晶圓』段之基板處理設備的内部。結果，輸送潔淨晶圓D在第一片材之輸送過程中黏著至晶圓段。因此，潔淨晶圓D不再可輸送。外來物質之移除百分比 - 1片材輸送 2片仞輸送 3片材輸送 4片材輸送 5片材輸送實施例S 85% 92% 9 6 % 96% 9 6% 實施例9 70% 7 5 % 83% 83% 8 3 % 比較實施例8 潔淨晶圓之製備暫停。比較實施例9 輸送困難輸送暫停輸送暫停輸送暫停輸送暫停 --------Page 36 550688 V. Description of the invention (34) --- type label. Therefore, the preparation of the wafer C with the sheet is suspended. Comparative Example 9 A clean sheet D was prepared in the same manner as in Example 8, except that the pressure-sensitive adhesive solution A sharpened in Example 8 was used as the adhesive for the cleansing layer. The clean layer in the clean sheet D exhibited a tensile modulus of 0.1 Newtons per square millimeter ^ / Then the clean moon D was directly cut in the same manner as in Example 8 to prepare a wafer with a sheet . As a result, no cutting waste is generated during the sheet cutting process. Prepare 2 5 wafers with sheet. Then, an attempt is made to transport the clean wafer D to the inside of a substrate processing apparatus having a wafer attached with 2, 7, 8 6 foreign substances. As a result, the transported clean wafer D is adhered to the wafer segment during the transport of the first sheet. Therefore, the clean wafer D is no longer transportable. Percentage of foreign matter removal-1 sheet conveyance 2 sheet conveyance 3 sheet conveyance 4 sheet conveyance 5 sheet conveyance Example S 85% 92% 9 6% 96% 9 6% Example 9 70% 75% 83% 83% 8 3% Comparative Example 8 Production of clean wafers was suspended. Comparative embodiment Example 9 Difficult to convey Conveyance pause Conveyance pause Conveyance pause Conveyance pause --------

工業應用性如前所述，根據本發明之潔淨片材可確實地輪送通過基Industrial Applicability As described above, the clean sheet according to the present invention can be reliably rotated through the substrate

C:\2D-CODE\90-07\90111082.ptd 第37頁 550688 五、發明說明（35) 板處理設備之内部，且可容易及確實地將附著至設備内部之外來物質移除。雖然本發明已就其之具有特定程度特異性的較佳形式作說明，但應明瞭可不脫離如後文提出專利申請之本發明之精神及範圍，而就構造之細節及零件之組合及配置改變本較佳形式之揭示内容。C: \ 2D-CODE \ 90-07 \ 90111082.ptd Page 37 550688 V. Description of the invention (35) The inside of the board processing equipment can easily and surely remove foreign substances attached to the inside of the equipment. Although the present invention has been described in terms of its preferred form with a certain degree of specificity, it should be clear that the details of the structure and the combination and arrangement of parts can be changed without departing from the spirit and scope of the present invention as filed in the patent application below. Disclosure of this preferred form.

C:\2D-CODE\90-07\90111082.ptd 第38頁 550688C: \ 2D-CODE \ 90-07 \ 90111082.ptd Page 38 550688

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Claims

550688 ΛΆ^ 90WQR9 月曰 η, I.；六、申請專利範圍 1 · 一種％淨片材，包含有· 實質上不具有黏性，且且之根據川Π127所測得之拉伸模數0·=牛頓/平方毫米用於支承在其一侧上夕分、纟一 <，糸淨層；及 2·如申請專利範圍第片之基礎材料。置於該基礎材料另一側上之普通黏著層，。其巾更包含有設 3. 如申請專利範圍第〗項之潔曰現不高於0· 20牛頓/10毫半不，，、中該潔淨層展剝離黏著。 / ^之關於m鏡面的18〇。 4. 如申請專利範圍第】項之潔淨片材，質上不具有黏性及實質上不具有導電性/、中5亥泳淨層貫 5·如申請士利範圍第4項之潔淨“才，其中具有黏性及貫質上不具有導電性、 /具、薄膜製成。之^層係、由塑膠材料或 6·如申請專利範圍第1項之潔淨片材，現低於30毫焦耳/平方米之表面自由能。"糸平層展 7·如申請專利範圍第6項之潔淨片材，其中現大於90度之對水的接觸角。 8 · —種潔淨片材，包含有：具有不低於1 0之維克爾斯（V i c k e r s)硬度之潔淨層；及用於支承在其一側上之該潔淨層之基礎材料。 9 ·如申請專利範圍第8項之潔淨片材，其更包括設置於該基礎材料另一側上之普通黏著層。 1 0 ·如申請專利範圍第1或8項之潔淨片材，其中該潔淨修正替猶4 參550688 ΛΆ ^ 90WQR September, η, I .; 6. Patent application scope 1 · A% net sheet, containing · It is not substantially sticky, and its tensile modulus measured according to Chuan 127 is 0 · = Newton / square millimeter is used to support the first layer, the first layer, and the second layer on the one side; and 2. The base material such as the first piece of the patent application scope. A normal adhesive layer placed on the other side of the base material. The towel also contains a design 3. If the cleanliness of the item in the scope of the patent application is not higher than 0. 20 Newtons / 10 half a second, the clean layer peels and adheres. / ^ 的 18〇 on m mirror surface. 4. As for the clean sheet in the scope of the application for patent], it is non-sticky in nature and does not have electrical conductivity. 5. The clean sheet of the 5th scope of the patent application scope. Among them, it is made of sticky and non-conductive material, and it is made of thin film. The layer system, made of plastic material or clean sheet such as the 1st item in the scope of patent application, is now less than 30 millijoules. / Square meter of surface free energy. &Quot; Flat flattening 7. If the clean sheet of the scope of patent application No. 6 is, the contact angle to water is now greater than 90 degrees. 8 ·-a kind of clean sheet, including : A clean layer with a Vickers hardness of not less than 10; and a base material for supporting the clean layer on one side of it. 9 · Clean sheet as in item 8 of the scope of patent application It also includes an ordinary adhesive layer provided on the other side of the base material. 10 · For example, the clean sheet of the scope of patent application No. 1 or 8, wherein the cleansing correction is replaced by 4

C: \總檔\90\901 丨]082\901 ] ]〇82(替換）·2·ρΐ( 第40頁 550688 一1 条六、層申請專利範圍 $ ,黏著層，且其係藉由活化能固化。係經由^用範圍第10項之潔片材，其中該潔淨層和雙鍵之彳卜14把使包含至少一母分子具有一或多個不飽入固化/5 Γ 5物之感壓黏著劑聚合物及聚合引發劑進行聚〇 2 怎，以致其黏性實質上地消失而製得。係為紫°外申=。專利範圍第11項之潔淨片材，其中該活化能將專利範圍第1項之潔淨片材，其係使用於藉由淨方法Γ才幸刖送至基板處理設備内部之基板處理設備潔 14·—種供傳導檢查設備用之潔淨構件，包含有：用於移除附著至該傳導檢查設備之傳導外J物質的接觸插腳潔淨器；及 d接觸插_之設置於該接觸插腳潔淨器之一侧上，用於該接觸插腳潔淨器接觸之設備之接觸面來：至-申請專利範圍第!項之潔淨片材。之外來物質之如 1 5 · —種供傳導檢查設備用之潔淨構件，包括：設置於輸送構件之一側上，用於移除附著至該傳導檢杳设備之傳導檢查接觸插腳之外來物質的接觸插腳潔淨=一及 w 設置於該接觸插腳潔淨器之一側上，用於移除附著至與該接觸插腳潔淨器接觸之設備之接觸面積之外來物質之^ 申請專利範圍第1項之潔淨片材。、 1 6 ·如申請專利範圍第〗4或丨5項之潔淨構件，其中琴絮C: \ Total file \ 90 \ 901 丨] 082 \ 901]] 〇82 (replacement) · 2 · ρΐ (page 40 550688-1) Article 6: The patent application scope is $, the adhesive layer, and it is activated by It can be cured. It is a clean sheet according to item 10 of the application range, wherein the clean layer and the double bond 14 make at least one parent molecule have one or more unsaturated solidification / 5 Γ 5 The pressure-sensitive adhesive polymer and the polymerization initiator are polymerized so that their viscosity substantially disappears and is prepared. It is purple ° external application =. The clean sheet of the scope of the patent No. 11 wherein the activation energy will be The clean sheet of the first item of the patent scope is used for the substrate processing equipment clean 14 which is sent to the inside of the substrate processing equipment by a clean method Γ. A kind of cleaning member for conduction inspection equipment, including: A contact pin cleaner for removing the conductive J substance attached to the conduction inspection device; and d contact pin_ is provided on one side of the contact pin cleaner for contacting the device contacted by the contact pin cleaner In the face: to-apply for the clean sheet of the scope of patent application item! Quality 1 5 · —A clean member for conduction inspection equipment, including: disposed on one side of the conveying member, for removing contact with foreign substances other than the conduction inspection contact pins of the conduction inspection equipment Pin cleanliness = one and w are located on one side of the contact pin cleaner and are used to remove foreign matter attached to the contact area of the equipment in contact with the contact pin cleaner. ， 1 6 · If the patent application scope is 4 or 5 clean components, of which

匸:\總檔\90\90]】]082\901] 1082(替換)-2.ptc' 第 41 ; " " -------- 550688 j號 9Q〗~nriR9 申請專利範圍月曰修正淨片材包括設置於美#从^ 另一側上，用於移&附ζ之一側上之黏著層，及設置於備之接觸面積之外來物質之㊁=觸插腳潔淨器接觸之設現不低於I.::;:】：:1。項之潔淨片材’其中該潔淨層展根據:ns K7127所濟高於2, 000牛頓/平方毫米之侍之拉伸模數。 / U巧專利範圍第1 4或1 5項之潔淨構件，其係使用、寿曰由將该潔淨構件輸送至傳導檢查設備内部之傳導檢查設備潔淨方法。 20 ^如申請專利範圍第1 6項之潔淨構件，其係使用於藉由將4〆淨構件輸送至傳杳設備内部之傳導檢查設備潔淨方法。 π ^ — 2 1 · —種製備具有潔淨功能之輸送構件之方法，包含有下列步驟： 1具有ό又置於基礎材料之一側上之由當受到活化能之作用時=歷聚合固化之黏著劑製成之潔淨層及設置於另一側之W通黏著層之潔淨片材與輸送構件層合，使普通黏著層插置於其間’在此_配置中，該潔淨片材之形狀較該輸送構件之形狀大；及 =該輸，構件之輪靡切割該潔淨片材；八中该潔淨層係於沿該輸送構件之輪廓切割該潔淨片材之後，再經歷聚合固化反應。 C:\ 總檔\90\90111082\90] 11082(替換)-2.ptc匸: \ Total file \ 90 \ 90]]] 082 \ 901] 1082 (replacement)-2.ptc 'No. 41; " " -------- 550688 j No. 9Q〗 ~ nriR9 Scope of patent application The correction sheet for the month includes the adhesive layer provided on the other side of the beauty # 从 ^ and used to remove the adhesive layer on one side of the attached z, and the foreign material provided outside the contact area of the device = contact pin cleaner The contact setting is not lower than I.::;;:]::1. The clean sheet according to item ′ wherein the clean layer is stretched according to: the tensile modulus of ns K7127 which is higher than 2,000 Newtons per square millimeter. / The clean component of the patent scope No. 14 or 15 uses the method of cleaning the conductive inspection equipment that transports the clean component to the inside of the conductive inspection equipment. 20 ^ If the clean component in item 16 of the scope of patent application is used, it is a method for cleaning the conduction inspection equipment by transporting 4 clean components to the inside of the transfer equipment. π ^ — 2 1 · — A method for preparing a conveying member with a cleaning function, including the following steps: 1 When the effect of activation energy is placed on the side of one of the base materials = polymerization adhesion curing The clean layer made of the agent and the clean sheet of the W through adhesive layer provided on the other side are laminated with the conveying member, so that the ordinary adhesive layer is interposed there. In this configuration, the shape of the clean sheet is larger than that The shape of the conveying member is large; and = the conveyance of the member cuts the clean sheet; the clean layer in the eighth is cut after cutting the clean sheet along the outline of the conveying member, and then undergoes a polymerization curing reaction. C: \ master file \ 90 \ 90111082 \ 90] 11082 (replace) -2.ptc

第42頁 550688 年月修正曰六、申請專利範圍 22·如申請專利範圍第21項之製備具有潔淨功能之輸送構件之方法，其中該潔淨層在片材切割時展現不高於1牛頓/平方毫米之根據113 K7127所測得之拉伸模數。 2 3.如申請專利範圍第21項之製備具有潔淨功能之輸送構件之方法’其中該潔淨層於聚合固化之後展現不低於j 〇牛頓/平方宅米之根據j I S K 7 1 2 7所測得之拉伸模數。 24· —種使用於如申請專利範圍第21項之製備具有潔淨功能之輸送構件之方法中之潔淨片材，包含有設置於基\ 材料之一側上之由當受到活化能之作用時可經歷聚合^ 之黏著劑製成之潔淨層及設置於另一側上之並二日零占者層，該深淨層係為未固化狀態。Amendment on page 42 of the month of 550688 6. Application for a patent scope 22. The method for preparing a conveying member with a cleaning function, such as the scope of application for patent item 21, wherein the clean layer exhibits no more than 1 Newton / square when cutting the sheet The millimeter is based on the tensile modulus measured in 113 K7127. 2 3. The method for preparing a conveying member with a cleaning function according to item 21 of the scope of the patent application, wherein the clean layer exhibits no less than j 0 Newton / square meter squared after polymerization and curing according to j ISK 7 1 2 7 The obtained tensile modulus. 24 · —A clean sheet used in the method for preparing a conveying member with a cleaning function as described in the scope of patent application No. 21, including a clean sheet provided on one side of the base material, which can be activated by the activation energy. The clean layer made of an adhesive that has undergone polymerization ^ and a two-day zero-occupant layer provided on the other side, and the deep clean layer is in an uncured state.

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