JP4130830B2 - Conveying member with cleaning function and method for cleaning substrate processing apparatus using the same - Google Patents
Conveying member with cleaning function and method for cleaning substrate processing apparatus using the same Download PDFInfo
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- JP4130830B2 JP4130830B2 JP2005242843A JP2005242843A JP4130830B2 JP 4130830 B2 JP4130830 B2 JP 4130830B2 JP 2005242843 A JP2005242843 A JP 2005242843A JP 2005242843 A JP2005242843 A JP 2005242843A JP 4130830 B2 JP4130830 B2 JP 4130830B2
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Description
本発明は、各種の基板処理装置をクリーニングするクリーニング機能付き搬送部材と、これを用いた基板処理装置のクリーニング方法に関し、例えば、半導体、フラットパネルディスプレイ、プリント基板などの製造装置や検査装置など、異物を嫌う基板処理装置のクリーニング機能付き搬送部材とクリーニング方法に関する。
The present invention relates to a transport member with a cleaning function for cleaning various substrate processing apparatuses and a method for cleaning a substrate processing apparatus using the same, for example, a manufacturing apparatus or an inspection apparatus for semiconductors, flat panel displays, printed boards, etc. The present invention relates to a transport member with a cleaning function and a cleaning method of a substrate processing apparatus that dislikes foreign matter.
各種の基板処理装置では、各搬送系と基板とを物理的に接触させながら搬送する。その際、基板や搬送系に異物が付着していると、後続の基板をつぎつぎに汚染することになり、定期的に装置を停止させ、洗浄処理する必要があった。このため、稼働率の低下や多大な労力が必要になるという問題があった。
これらの問題を解決するため、粘着性の物質を固着した基板を搬送することにより、基板処理装置内に付着した異物をクリーニング除去する方法が提案されている（例えば、特許文献１）。
In order to solve these problems, a method has been proposed in which foreign substances adhering to the substrate processing apparatus are cleaned and removed by transporting a substrate to which an adhesive substance is fixed (for example, Patent Document 1).
粘着性の物質を固着した基板を搬送することにより、基板処理装置内に付着した異物をクリーニング除去する方法は、前述の課題を克服する有効な方法である。しかし、この方法では、粘着性物質と装置接触部とが強く接着しすぎて剥がれないおそれがあり、基板を確実に搬送できなくなるおそれがあった。
本発明は、このような事情に照らし、基板処理装置内に基板を確実に搬送できると共に、装置内に付着している異物を簡便かつ確実に除去できるクリーニング機能付き搬送部材を提供することを目的としている。
A method of cleaning and removing foreign substances adhering to the substrate processing apparatus by transporting a substrate to which an adhesive substance is fixed is an effective method for overcoming the above-described problems. However, in this method, there is a possibility that the adhesive substance and the apparatus contact portion are strongly bonded and cannot be peeled off, and there is a possibility that the substrate cannot be reliably conveyed.
In light of such circumstances, the present invention has an object to provide a transport member with a cleaning function capable of reliably transporting a substrate into a substrate processing apparatus and easily and reliably removing foreign substances adhering to the apparatus. It is said.
本発明者らは、上記の目的を達成するために、鋭意検討した結果、クリーニング層を設けた基板等の搬送部材を搬送することにより、基板処理装置内に付着した異物をクリーニング除去するにあたり、上記クリーニング層のヴィッカース硬度を特定値以上に設定し、さらに表面自由エネルギーおよび水の接触角を特定範囲に設定することにより、前記問題を生じることなく、さらに異物を簡便かつ確実に除去できることを見出し、本発明を完成するに至った。
As a result of earnest studies to achieve the above object, the present inventors have carried out a transporting member such as a substrate provided with a cleaning layer, thereby cleaning and removing foreign matter adhering in the substrate processing apparatus. It has been found that by setting the Vickers hardness of the cleaning layer to a specific value or more and further setting the surface free energy and the contact angle of water to a specific range, foreign matters can be easily and reliably removed without causing the above problems. The present invention has been completed.
即ち、本発明は、基板処理装置内に搬送することで異物を除去するためのクリーニング機能付き搬送部材であって、搬送部材上にヴィッカース硬度が１０以上、表面自由エネルギーが３０〜５０ｍＪ／ｍ2 、水の接触角が５０〜９０度であるクリーニング層が設けられていることを特徴とするクリーニング機能付き搬送部材（請求項１）、特に、搬送部材上にクリーニング層が直接設けられている請求項１に記載のクリーニング機能付き搬送部材（請求項２）、クリーニング層が実質的に粘着性を有さず、かつ実質的に導電性を有しない請求項１または２に記載のクリーニング機能付き搬送部材（請求項３）に係るものである。
また、本発明は、請求項１〜３のいずれかに記載のクリーニング機能付き搬送部材を、基板処理装置内に搬送することを特徴とする基板処理装置のクリーニング方法（請求項４）に係るものである。
That is, the present invention is a transport member with a cleaning function for removing foreign matters by transporting it into a substrate processing apparatus. The transport member has a Vickers hardness of 10 or more and a surface free energy of 30 to 50 mJ / m 2. A transport member with a cleaning function, characterized in that a cleaning layer having a water contact angle of 50 to 90 degrees is provided, and in particular, the cleaning layer is directly provided on the transport member. The conveyance member with a cleaning function according to claim 1 (Claim 2), the cleaning layer is substantially non-adhesive and has substantially no conductivity. This relates to a member (claim 3).
According to another aspect of the present invention, there is provided a substrate processing apparatus cleaning method (Claim 4), wherein the transport member with a cleaning function according to any one of claims 1 to 3 is transported into the substrate processing apparatus. It is.
このように、本発明のクリーニング機能付き搬送部材によれば、基板処理装置内を確実に搬送できると共に、装置内に付着している異物を簡便かつ確実に除去できる。
Thus, according to the conveyance member with a cleaning function of the present invention, the inside of the substrate processing apparatus can be reliably conveyed, and the foreign matter adhering to the apparatus can be easily and reliably removed.
本発明のクリーニング機能付き搬送部材のクリーニング層は、そのヴィッカース硬度が１０以上、好ましくは２０〜５００であることが必要である。
ここで、ヴィッカース硬度とは、ＪＩＳ Ｚ２２４４に準じダイヤモンド圧子に所定の荷重をかけて、永久くぼみを形成し、その荷重をくぼみの表面積で除した値をいう。
本発明においては、クリーニング層のヴィッカース硬度をこのような特定値以上に設定することにより、クリーニング機能付き搬送部材の搬送時にクリーニング層が被クリーニング部位と密着しすぎることなく、スムーズに搬送できるという効果が得られる。
The cleaning layer of the conveying member with a cleaning function of the present invention needs to have a Vickers hardness of 10 or more, preferably 20 to 500.
Here, the Vickers hardness is a value obtained by applying a predetermined load to the diamond indenter according to JIS Z2244 to form a permanent recess and dividing the load by the surface area of the recess.
In the present invention, by setting the Vickers hardness of the cleaning layer to be equal to or higher than such a specific value, the cleaning layer can be smoothly transported without being excessively adhered to the portion to be cleaned when transporting the transport member with a cleaning function. Is obtained.
また、本発明のクリーニング機能付き搬送部材のクリーニング層は、その表面自由エネルギーが３０〜５０ｍＪ／ｍ2 であることが望ましい。
本発明においてクリーニング層（固体）の表面自由エネルギーとは、クリーニング層表面に対して水およびヨウ化メチレンを用いてそれぞれ接触角を測定し、この測定値と接触角測定液体の表面自由エネルギー値（文献より既知）を、Ｙｏｕｎｇの式および拡張Ｆｏｗｋｅｓの式から導かれる下記の式１に代入し、得られる二つの式を連立一次方程式として解くことにより、求められる固体の表面自由エネルギー値を意味するものである。
The cleaning layer of the transport member with a cleaning function of the present invention preferably has a surface free energy of 30 to 50 mJ / m 2 .
In the present invention, the surface free energy of the cleaning layer (solid) means that the contact angle is measured with respect to the surface of the cleaning layer using water and methylene iodide, and the measured value and the surface free energy value of the contact angle measurement liquid ( Substituting into the following formula 1 derived from Young's formula and extended Fowkes' formula, and solving the obtained two formulas as simultaneous linear equations means the surface free energy value of a solid obtained Is.
＜式１＞
（１＋ｃｏｓθ）γL ＝２√（γS d γL d ）＋２√（γS p γL p ）
ただし、式中の各記号は、それぞれ以下の通りである。
θ：接触角
γL ：接触角測定液体の表面自由エネルギー
γL d ：γL における分散力成分
γL p ：γL における極性力成分
γS d ：固体の表面自由エネルギーにおける分散力成分
γS p ：固体の表面自由エネルギーにおける極性力成分
<Formula 1>
(1 + cos θ) γ L = 2√ (γ S d γ L d ) + 2√ (γ S p γ L p )
However, each symbol in the formula is as follows.
theta: contact angle gamma L: surface free energy of the contact angle measurement liquid γ L d: γ dispersion force component in L γ L p: polar force component gamma S d in gamma L: dispersion force component in the surface free energy of the solid gamma S p : Polar force component in surface free energy of solid
さらに、本発明のクリーニング機能付き搬送部材のクリーニング層は、クリーニング層表面の水の接触角が５０〜９０度となるようにするのが望ましい。
本発明では、クリーニング層の表面自由エネルギーおよび水の接触角をこのような特定範囲に設定することにより、クリーニング機能付き搬送部材の搬送時にクリーニング層が被クリーニング部位の異物を確実に除去できるという効果が得られる。
Furthermore, it is desirable that the cleaning layer of the conveying member with a cleaning function of the present invention has a water contact angle of 50 to 90 degrees on the surface of the cleaning layer.
In the present invention, by setting the surface free energy of the cleaning layer and the contact angle of water to such specific ranges, the cleaning layer can surely remove the foreign matter at the site to be cleaned when transporting the transport member with a cleaning function. Is obtained.
このようなクリーニング層は、そのヴィッカース硬度、表面自由エネルギーおよび水の接触角が上記した特定範囲にあれば、その材質などは特に限定されないが、紫外線や熱などの活性エネルギー源により架橋反応や硬化が促進されて、その引張弾性率を大きくできるものが好ましい。
特に好適なクリーニング層は、その引張弾性率（試験法ＪＩＳ Ｋ７１２７に準ずる）が０．１Ｎ／ｍｍ2 以上、好ましくは１〜３，０００Ｎ／ｍｍ2 である。
さらに、その分子構造が三次元網状化して実質的に粘着性を有さず、搬送系材料とぬれ難いものが好ましい。
このような材料からなるクリーニング層を用いると、搬送時にクリーニング層が被クリーニング部と強く接着することがなく、確実に搬送できる。
Such a cleaning layer is not particularly limited in its material as long as its Vickers hardness, surface free energy and water contact angle are in the specific ranges described above, but crosslinking reaction or curing by an active energy source such as ultraviolet light or heat. Is preferably promoted to increase the tensile elastic modulus.
Particularly preferred cleaning layer has a tensile modulus (according to test method JIS K7127) is 0.1 N / mm 2 or more, preferably 1~3,000N / mm 2.
Furthermore, it is preferable that the molecular structure is a three-dimensional network and does not substantially have adhesiveness, and is difficult to wet with the carrier material.
When a cleaning layer made of such a material is used, the cleaning layer does not adhere strongly to the portion to be cleaned during transport, and can be transported reliably.
また、クリーニング層は、実質的に導電性を有しないことが好ましい。
ここで、実質的に導電性を有しないとは、その表面抵抗率が１×１０13Ω／□以上、好ましくは１×１０14Ω／□以上であることをいう。
本発明においては、クリーニング層の表面抵抗率をこのような特定値以上に設計して、クリーニング層をできるだけ絶縁体にすることにより、静電気による異物の捕獲、吸着できるという効果が得られる。
Moreover, it is preferable that a cleaning layer does not have electroconductivity substantially.
Here, substantially having no conductivity means that the surface resistivity is 1 × 10 13 Ω / □ or more, preferably 1 × 10 14 Ω / □ or more.
In the present invention, by designing the surface resistivity of the cleaning layer to be higher than such a specific value and making the cleaning layer an insulator as much as possible, the effect of capturing and adsorbing foreign matters due to static electricity can be obtained.
このようなクリーニング層は、その粘着力と導電性とが実質的にない限り、その材質や構成などは特に限定されないが、例えば、ポリエチレン、ポリエチレンテレフタレート、アセチルセルロース、ポリカーボネート、ポリプロピレン、ポリアミド、ポリイミド、ポリカルボジイミドなどの耐熱性樹脂などからなるフィルム層、硬化型粘着剤を硬化させて粘着性を実質的に消失させたものなどが挙げられる。
また、このようなクリーニング層の厚さとしては、特に限定されないが、通常は、５〜１００μｍ程度であるのがよい。
Such a cleaning layer is not particularly limited in its material and configuration as long as its adhesive strength and conductivity are not substantially, for example, polyethylene, polyethylene terephthalate, acetylcellulose, polycarbonate, polypropylene, polyamide, polyimide, Examples thereof include a film layer made of a heat-resistant resin such as polycarbodiimide, and a film obtained by curing a curable pressure-sensitive adhesive to substantially eliminate the adhesiveness.
Further, the thickness of such a cleaning layer is not particularly limited, but it is usually preferably about 5 to 100 μm.
クリーニング層の一例としては、感圧接着性ポリマーに分子内に不飽和二重結合を１個以上有する化合物と重合開始剤を少なくとも含有させたものを活性エネルギーにより重合硬化反応させて粘着性が実質的に消失されてなるものが挙げられる。
上記の感圧接着性ポリマーとしては、アクリル酸、アクリル酸エステル、メタクリル酸、メタクリル酸エステルから選ばれる（メタ）アクリル酸および／または（メタ）アクリル酸エステルを主モノマーとしたアクリル系ポリマーが挙げられる。
このアクリル系ポリマーの合成にあたり、共重合モノマーとして分子内に不飽和二重結合を２個以上有する化合物を用いるか、あるいは合成後のアクリル系ポリマーに分子内に不飽和二重結合を有する化合物を官能基間の反応で化学結合させるなどして、アクリル系ポリマーの分子内に不飽和二重結合を導入しておくことにより、このポリマー自体も活性エネルギーにより重合硬化反応に関与させるようにすることもできる。
As an example of the cleaning layer, a pressure-sensitive adhesive polymer containing at least a compound having at least one unsaturated double bond in the molecule and a polymerization initiator is subjected to a polymerization and curing reaction with active energy, thereby substantially maintaining the tackiness. And those that have been lost.
Examples of the pressure-sensitive adhesive polymer include acrylic polymers mainly composed of (meth) acrylic acid and / or (meth) acrylic acid ester selected from acrylic acid, acrylic acid ester, methacrylic acid, and methacrylic acid ester. It is done.
In synthesizing this acrylic polymer, a compound having two or more unsaturated double bonds in the molecule is used as a copolymerization monomer, or a compound having an unsaturated double bond in the molecule is used in the synthesized acrylic polymer. By introducing an unsaturated double bond into the molecule of the acrylic polymer, for example, by chemically bonding it with a reaction between functional groups, this polymer itself is also involved in the polymerization curing reaction by active energy. You can also.
ここで、分子内に不飽和二重結合を１個以上有する化合物（以下、重合性不飽和化合物という）としては、不揮発性でかつ重量平均分子量が１０，０００以下の低分子量体であるのがよく、特に硬化時の接着剤層の三次元網状化が効率良くなされるように、５，０００以下の分子量を有しているのが好ましい。
また、クリーニング層に添加される重合開始剤は、特に限定されず、公知のものを使用でき、例えば活性エネルギー源に熱を用いる場合は、ベンゾイルパーオキサイド、アゾビスイソブチロニトリルなどの熱重合開始剤、また光を用いる場合は、ベンゾイル、ベンゾインエチルエーテル、シベンジル、イソプロピルベンゾインエーテル、ベンゾフェノン、ミヒラーズケトン、クロロチオキサントン、ドデシルチオキサントン、ジメチルチオキサントン、アセトフェノンジエチルケタール、ベンジルジメチルケタール、α−ヒドルキシシクロヘキシルフェニルケトン、２−ヒドロキシジメチルフェニルプロパン、２，２−ジメトキシ−２−フェニルアセトフェノンなどの光重合開始剤が挙げられる。
Here, the compound having one or more unsaturated double bonds in the molecule (hereinafter referred to as a polymerizable unsaturated compound) is a low molecular weight substance that is nonvolatile and has a weight average molecular weight of 10,000 or less. In particular, it is preferable to have a molecular weight of 5,000 or less so that the three-dimensional network of the adhesive layer at the time of curing can be made efficiently.
The polymerization initiator added to the cleaning layer is not particularly limited, and known ones can be used. For example, when heat is used as an active energy source, thermal polymerization of benzoyl peroxide, azobisisobutyronitrile, etc. Initiators, and benzoyl, benzoin ethyl ether, cibenzyl, isopropyl benzoin ether, benzophenone, Michler's ketone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, acetophenone diethyl ketal, benzyl dimethyl ketal, α-hydroxycyclohexyl phenyl Examples include photopolymerization initiators such as ketones, 2-hydroxydimethylphenylpropane, and 2,2-dimethoxy-2-phenylacetophenone.
本発明において、このようなクリーニング層が支持体に設けられる場合、その支持体としては特に限定されないが、例えばポリエチレン、ポリエチレンテレフタレート、アセチルセルロース、ポリカーボネート、ポリプロピレン、ポリアミド、ポリイミド、ポリカルボジイミドなどのプラスチックフィルムなどが挙げられる。
このような支持体の厚さとしては、通常１０〜１００μｍ程度である。
In the present invention, when such a cleaning layer is provided on a support, the support is not particularly limited. For example, a plastic film such as polyethylene, polyethylene terephthalate, acetylcellulose, polycarbonate, polypropylene, polyamide, polyimide, polycarbodiimide, or the like. Etc.
The thickness of such a support is usually about 10 to 100 μm.
本発明は、さらに、クリーニング層の片面に通常の粘着剤層が設けられてなるクリーニングシート、支持体の片面にクリーニング層が設けられ、他面に通常の粘着剤層が設けられてなるクリーニングシートも提供する。
この通常の粘着剤層は、粘着機能を満たす限りその材質などは特に限定されず、通常の粘着剤（例えばアクリル系、ゴム系など）を用いることができる。
The present invention further includes a cleaning sheet in which a normal pressure-sensitive adhesive layer is provided on one side of the cleaning layer, and a cleaning sheet in which a cleaning layer is provided on one side of the support and a normal pressure-sensitive adhesive layer is provided on the other side. Also provide.
The material of the normal pressure-sensitive adhesive layer is not particularly limited as long as it satisfies the pressure-sensitive adhesive function, and a normal pressure-sensitive adhesive (for example, acrylic or rubber) can be used.
このような構成とすることにより、クリーニングシートを通常の粘着剤層により各種の基板や他のテープ・シートなどの搬送部材に貼り付け、クリーニング機能付き搬送部材として装置内に搬送して、被洗浄部位に接触させてクリーニングすることができる。
また、基板などの搬送部材を再利用するため、クリーニング後に基板を上記粘着剤層から剥がす場合、上記粘着剤層の粘着力は再剥離できる範囲であれば特に限定されないが、シリコンウエハ（ミラー面）に対する１８０°引き剥がし粘着力が０．２０〜０．９８Ｎ／１０ｍｍ、特に０．４０〜０．９８Ｎ／１０ｍｍ程度であれば、搬送中に剥離することなく、かつクリーニング後に容易に再剥離できるので好ましい。
With such a configuration, the cleaning sheet is attached to a transport member such as various substrates and other tapes and sheets with a normal adhesive layer, transported into the apparatus as a transport member with a cleaning function, and cleaned. It can be cleaned by contacting the part.
Further, when the substrate is peeled off from the pressure-sensitive adhesive layer after cleaning in order to reuse the transport member such as the substrate, the pressure-sensitive adhesive force of the pressure-sensitive adhesive layer is not particularly limited as long as it can be re-peeled, but a silicon wafer (mirror surface) 180 ° peel adhesive strength is 0.20 to 0.98 N / 10 mm, particularly about 0.40 to 0.98 N / 10 mm, and can be easily removed after cleaning without peeling during transportation. Therefore, it is preferable.
本発明において、上記のクリーニング層は、搬送部材上にクリーニング層形成材料をコーティングするなどの手法により直接形成することができる。また、コーティング後に、粘着剤の硬化処理を施したり、耐熱付与処理などを施すことができる。
また、本発明において、このように搬送部材上にクリーニング層が設けられたクリーニング機能付き搬送部材は、これを基板処理装置内に搬送して、被洗浄部位に接触させることにより、クリーニングすることができる。
上記の搬送部材としては、特に限定されないが、例えば半導体ウエハ、ＬＣＤ、ＰＤＰなどのフラットパネルディスプレイ用基板、その他コンパクトディスク、ＭＲヘッドなどの基板などが挙げられる。
In the present invention, the cleaning layer can be directly formed by a technique such as coating a cleaning member forming material on the conveying member. In addition, after coating, the adhesive can be cured or heat-resistant.
Further, in the present invention, the transport member with a cleaning function in which the cleaning layer is provided on the transport member as described above can be cleaned by transporting it into the substrate processing apparatus and bringing it into contact with the portion to be cleaned. it can.
The transport member is not particularly limited, and examples thereof include semiconductor wafers, flat panel display substrates such as LCDs and PDPs, other compact discs, and MR head substrates.
以下、本発明を実施例に基づいて説明するが、本発明はこれらに限定されるものではない。なお、以下、部とあるのは重量部を意味するものとする。
Hereinafter, although the present invention is explained based on an example, the present invention is not limited to these. Hereinafter, “parts” means parts by weight.
実験１
アクリル酸２−エチルヘキシル７５部、アクリル酸メチル２０部およびアクリル酸５部からなるモノマ―混合液から得たアクリル系ポリマー（重量平均分子量７０万）１００部に対し、ポリエチレングリコ―ル２００ジメタクリレ―ト（新中村化学製：商品名：ＮＫエステル４Ｇ）１００部、およびポリイソシアネート化合物（日本ポリウレタン工業製：商品名：コロネートＬ）３部、および光重合開始剤としてベンジルジメチルケタール（チバ・スペシャリティケミカルズ製：商品名：イルガキュアー６５１）３部を、均一に混合して、紫外線硬化型粘着剤溶液Ａを調製した。
Experiment 1
Polyethylene glycol 200 dimethacrylate for 100 parts of acrylic polymer (weight average molecular weight 700,000) obtained from a monomer mixture consisting of 75 parts of 2-ethylhexyl acrylate, 20 parts of methyl acrylate and 5 parts of acrylic acid (Manufactured by Shin-Nakamura Chemical Co., Ltd .: trade name: NK ester 4G) and 3 parts of a polyisocyanate compound (manufactured by Nippon Polyurethane Industry: trade name: Coronate L) and benzyldimethyl ketal (manufactured by Ciba Specialty Chemicals) as a photopolymerization initiator : Trade name: Irgacure 651) 3 parts were mixed uniformly to prepare an ultraviolet curable adhesive solution A.
また、上記粘着剤溶液Ａから光重合開始剤のベンジルジメチルケタールを除いた以外は、上記と同様にして得た粘着剤溶液を、幅２５０ｍｍ、厚み２５μｍのポリエステル製支持体フィルムの片面に、乾燥後の厚さが１０μｍになるように塗布して通常の粘着剤層を設け、その表面に厚さが３８μｍのポリエステル系剥離フィルムを貼った。
つぎに、支持体フィルムのもう一方の側に、前記の紫外線硬化型粘着剤溶液Ａを、乾燥後の厚さが１０μｍになるように塗布してクリーニング層としての粘着剤層を設け、その表面に同様の剥離フィルムを貼った。
Further, the pressure-sensitive adhesive solution obtained in the same manner as above except that the photopolymerization initiator benzyldimethyl ketal was removed from the pressure-sensitive adhesive solution A was dried on one side of a polyester support film having a width of 250 mm and a thickness of 25 μm. A normal pressure-sensitive adhesive layer was provided by coating so that the subsequent thickness was 10 μm, and a polyester-based release film having a thickness of 38 μm was pasted on the surface.
Next, on the other side of the support film, the UV curable pressure-sensitive adhesive solution A is applied so that the thickness after drying becomes 10 μm, and a pressure-sensitive adhesive layer is provided as a cleaning layer. A similar release film was pasted on.
このシートに中心波長３６５ｎｍの紫外線を積算光量２，０００ｍＪ／ｃｍ2 照射して、本発明のクリーニングシートを得た。
このクリーニングシートのクリーニング層側の剥離フィルムを剥がし、ヴィッカース硬度計（ＮＥＣ製、薄膜硬度計 ＭＨＡ−４００）にて、このクリーニング層のヴィッカース硬度を測定したところ、４５であった。
さらに、このクリーニング層の表面自由エネルギーを測定したところ、４０．１ｍＪ／ｍ2 であり、水の接触角は８８．２度であった。
The cleaning sheet of the present invention was obtained by irradiating the sheet with ultraviolet light having a central wavelength of 365 nm and an integrated light quantity of 2,000 mJ / cm 2 .
The release film on the cleaning layer side of the cleaning sheet was peeled off, and the Vickers hardness of the cleaning layer was measured with a Vickers hardness meter (manufactured by NEC, thin film hardness meter MHA-400).
Furthermore, when the surface free energy of this cleaning layer was measured, it was 40.1 mJ / m 2 and the contact angle of water was 88.2 degrees.
また、このクリーニング層の紫外線硬化後の引張弾性率は１４７．２Ｎ／ｍｍ2 であった。ここで、引張弾性率は、試験法ＪＩＳ Ｋ７１２７に準じて測定した。また、クリーニング層をシリコンウエハのミラー面に幅１０ｍｍで貼り付け、ＪＩＳ Ｚ０２３７に準じてシリコンウエハに対する１８０°引き剥がし粘着力を測定した結果、０．００４９Ｎ（０．５ｇ）／１０ｍｍで実質的に粘着性を有さないことが確認できた。
さらに、温度２３℃、湿度６０％ＲＨの条件下でクリーニング層上から表面抵抗率を表面抵抗測定計（三菱化学社製、型式ＭＣＰ−ＵＰ４５０）にて測定したところ、９．９９×１０13Ω／□以上で測定不能であった。この結果から、クリーニング層は実質的に導電性を有さないことが確認できた。
このクリーニングシートの通常の粘着剤層側の剥離フィルムを剥がし、８ｉｎｃｈのシリコンウエハの裏面（ミラー面）にハンドローラで貼り付け、クリーニング機能付き搬送用クリーニングウエハを作製した。
The tensile modulus of the cleaning layer after UV curing was 147.2 N / mm 2 . Here, the tensile modulus was measured according to the test method JIS K7127. Further, the cleaning layer was attached to the mirror surface of the silicon wafer with a width of 10 mm, and the 180 ° peel adhesion to the silicon wafer was measured according to JIS Z0237. As a result, the cleaning layer was substantially 0.0049 N (0.5 g) / 10 mm. It was confirmed that there was no tackiness.
Furthermore, when the surface resistivity was measured from above the cleaning layer with a surface resistance meter (Model MCP-UP450, manufactured by Mitsubishi Chemical Corporation) under the conditions of a temperature of 23 ° C. and a humidity of 60% RH, it was 9.99 × 10 13 Ω. It was impossible to measure above / □. From this result, it was confirmed that the cleaning layer has substantially no conductivity.
The release film on the normal pressure-sensitive adhesive layer side of the cleaning sheet was peeled off and attached to the back surface (mirror surface) of an 8-inch silicon wafer with a hand roller to prepare a transport cleaning wafer with a cleaning function.
一方、基板処理装置のウエハステージを２つ取り外して、レーザー式異物測定装置で、０．３μｍ以上の異物を測定したところ、８ｉｎｃｈウエハサイズのエリア内で、１つは２５，０００個、もう一方は２３，０００個であった。
ついで、前記で得た搬送用クリーニングウエハのクリーニング層側の剥離フィルムを剥がし、上記の２５，０００個の異物が付着していたウエハステージを持つ基板処理装置内に搬送したところ、支障なく搬送できた。
また、その後にウエハステージを取り外し、レーザー式異物測定装置で、０．３μｍ以上の異物を測定したところ、８ｉｎｃｈウエハサイズのエリア内で４，８００個となっており、クリーニング前に付着していた異物数の４／５以上、つまり８０％以上を除去することができた。
On the other hand, when two wafer stages of the substrate processing apparatus were removed and a foreign substance measuring 0.3 μm or more was measured with a laser type foreign substance measuring apparatus, one was 25,000 in an area of 8 inch wafer size, and the other There were 23,000.
Next, the release film on the cleaning layer side of the transport cleaning wafer obtained above was peeled off and transported into the substrate processing apparatus having the wafer stage on which the above 25,000 foreign substances had adhered. It was.
After that, the wafer stage was removed, and a foreign substance measuring 0.3 μm or more was measured with a laser type foreign substance measuring apparatus. As a result, there were 4,800 pieces in an 8 inch wafer size area, which had adhered before cleaning. 4/5 or more of the number of foreign matters, that is, 80% or more could be removed.
比較実験１
紫外線硬化型粘着剤溶液Ａに代えて、アクリル酸２−エチルヘキシル３０部、アクリル酸メチル７０部およびアクリル酸１０部からなるモノマ―混合液から得たアクリル系ポリマー（重量平均分子量２８０万）１００部に対し、ポリエチレングリコ―ル６００ジアクリレ―ト（新中村化学製：商品名：ＮＫエステルＡ−６００）１００部、ポリイソシアネート化合物（日本ポリウレタン工業製：商品名：コロネートＬ）３部および光重合開始剤としてベンジルジメチルケタール（チバ・スペシャリティケミカルズ製：商品名：イルガキュアー６５１）１０部を均一に混合して得た紫外線硬化型粘着剤溶液Ｂを用いた以外は、実験１と同様にしてクリーニングシートを作製した。
その後、クリーニング層のヴィッカース硬度を、前記と同様にして測定したところ、５であった。また、クリーニング層の表面自由エネルギーを測定したところ、３４．６ｍＪ／ｃｍ2 であり、水の接触角は８２．３度であった。
つぎに、このクリーニングシートから実験１と同じ方法で作製した搬送用クリーニングウエハを、２３，０００個異物が付着していたウェハステージを持つ基板処理装置内に搬送させたところ、１枚目でウエハステージに固着し、搬送できなくなった。
Comparative experiment 1
Instead of the UV curable adhesive solution A, 100 parts of an acrylic polymer (weight average molecular weight of 2.8 million) obtained from a monomer mixture composed of 30 parts of 2-ethylhexyl acrylate, 70 parts of methyl acrylate and 10 parts of acrylic acid In contrast, 100 parts of polyethylene glycol 600 diacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd .: trade name: NK Ester A-600), 3 parts of a polyisocyanate compound (manufactured by Nippon Polyurethane Industry: trade name: Coronate L) and initiation of photopolymerization Cleaning sheet in the same manner as in Experiment 1 except that UV curable adhesive solution B obtained by uniformly mixing 10 parts of benzyldimethyl ketal (Ciba Specialty Chemicals: trade name: Irgacure 651) was used as the agent. Was made.
Thereafter, the Vickers hardness of the cleaning layer was measured in the same manner as described above, and was 5. The surface free energy of the cleaning layer was measured and found to be 34.6 mJ / cm 2 and the contact angle of water was 82.3 degrees.
Next, a cleaning wafer for transfer produced by the same method as in Experiment 1 was transferred from this cleaning sheet into a substrate processing apparatus having a wafer stage to which 23,000 foreign substances had adhered. It stuck to the stage and could not be transported.
実験２
８ｉｎｃｈのシリコンウエハの裏面（ミラー面）に、実験１で調製した紫外線硬化型粘着剤溶液Ａを、乾燥後の厚さが１０μｍになるように塗布して、粘着剤層を設け、その表面に厚さが３８μｍのポリステル系剥離フィルムを貼った。
このシートに中心波長３６５ｎｍの紫外線を積算光量２，０００ｍＪ／ｃｍ2 照射して上記の粘着剤層を硬化、架橋して、クリーニング層を形成し、本発明のクリーニング機能付き搬送用クリーニングウエハを得た。クリーニング層のヴィッカース硬度、表面自由エネルギー、水の接触角は、実験１とほぼ同じであった。
つぎに、このクリーニングウエハを用いて、実験１と同様にして基板処理装置のクリーニング試験を行ったところ、実験１と同様に良好な搬送性が得られ、また実験１と同様の非常に良好な異物除去効果が得られた。
Experiment 2
The UV curable adhesive solution A prepared in Experiment 1 is applied to the back surface (mirror surface) of an 8-inch silicon wafer so that the thickness after drying is 10 μm, and an adhesive layer is provided on the surface. A polyester release film having a thickness of 38 μm was pasted.
This sheet is irradiated with an ultraviolet ray having a central wavelength of 365 nm and an integrated light quantity of 2,000 mJ / cm 2 to cure and crosslink the above-mentioned pressure-sensitive adhesive layer to form a cleaning layer, thereby obtaining a transport cleaning wafer with a cleaning function of the present invention. It was. The Vickers hardness, surface free energy, and water contact angle of the cleaning layer were almost the same as in Experiment 1.
Next, using this cleaning wafer, a cleaning test of the substrate processing apparatus was performed in the same manner as in Experiment 1. As a result, good transportability was obtained in the same manner as in Experiment 1, and very good as in Experiment 1. A foreign matter removing effect was obtained.
比較実験２
実験１で調製した紫外線硬化型粘着剤溶液Ａに代えて、比較実験１で調製した紫外線硬化型粘着剤溶液Ｂを用いた以外は、実験２と同様にして、クリーニング層を形成し、クリーニング機能付き搬送用クリーニングウエハを作製した。クリーニング層のヴィッカース硬度、表面自由エネルギー、水の接触角は、比較実験１とほぼ同じであった。
この搬送用クリーニングウエハを、実験１と同様に基板処理装置内に搬送したところ、比較実験１と同様に、１枚目でウエハステージに固着し、搬送できなくなった。
Comparative experiment 2
A cleaning layer was formed in the same manner as in Experiment 2 except that the UV curable adhesive solution B prepared in Comparative Experiment 1 was used instead of the UV curable adhesive solution A prepared in Experiment 1. An attached transfer cleaning wafer was prepared. The Vickers hardness, surface free energy, and water contact angle of the cleaning layer were almost the same as those in Comparative Experiment 1.
When this transfer cleaning wafer was transferred into the substrate processing apparatus as in Experiment 1, the first wafer was fixed to the wafer stage as in Comparative Experiment 1, and could not be transferred.
実験３
エチレン−１，２−ビストリメリテート，テトラカルボン酸二無水物（新日本理化製の「リカシッドＴＭＥＧ−１００」）１００モルと、２，２′−ビス〔４−（４−アミノフェノキシ）フェニル〕プロパン（和歌山精化製の「ＢＡＰＰ」）５０モルと、脂肪族ジアミン（宇部興産製の「ＡＴＢＮ１３００×１６ｓｐ」）５０モルとを、有機溶媒中で反応させることにより、ポリアミック酸溶液を得た。
この溶液を塗布し加熱処理して、ポリアミック酸をポリイミドに変換する方法により、８インチのシリコンウエハのミラー面上に上記ポリイミドからなるクリーニング層を有するクリーニング機能付き搬送用クリーニングウエハを作製した。クリーニング層のヴィッカース硬度は２６、表面自由エネルギーは４３．４ｍＪ／ｍ2 、水の接触角は８０．３度であった。
Experiment 3
100 mol of ethylene-1,2-bistrimellitate, tetracarboxylic dianhydride (“Ricacid TMEG-100” manufactured by Shin Nippon Chemical Co., Ltd.) and 2,2′-bis [4- (4-aminophenoxy) phenyl] A polyamic acid solution was obtained by reacting 50 mol of propane (“BAPP” manufactured by Wakayama Seika) and 50 mol of an aliphatic diamine (“ATBN1300 × 16sp” manufactured by Ube Industries) in an organic solvent.
A transport cleaning wafer with a cleaning function having a cleaning layer made of the above polyimide on a mirror surface of an 8-inch silicon wafer was produced by applying this solution and heat-treating to convert polyamic acid into polyimide. The cleaning layer had a Vickers hardness of 26, a surface free energy of 43.4 mJ / m 2 , and a water contact angle of 80.3 degrees.
実験４
ピロメリット酸二無水物１００モルと、４，４′−ジアミノジフェニルエーテル９２モルと、プロピレンオキシドジアミン（分子量４，０００）（三井化学ファイン製の「ジェファ−ミンＤ４０００」）８モルとを、有機溶媒中で反応させることにより、ポリアミック酸溶液を得た。
このポリアミック酸溶液を用いて、実験３と同様にして、クリーニング機能付き搬送用クリーニングウエハを作製した。クリーニング層のヴィッカース硬度は１８、表面自由エネルギーは４６ｍＪ／ｍ2 、水の接触角は７９．７度であった。
Experiment 4
100 moles of pyromellitic dianhydride, 92 moles of 4,4'-diaminodiphenyl ether, 8 moles of propylene oxide diamine (molecular weight 4,000) ("Jeffamine D4000" manufactured by Mitsui Chemicals Fine) The polyamic acid solution was obtained by making it react in.
Using this polyamic acid solution, a transport cleaning wafer with a cleaning function was produced in the same manner as in Experiment 3. The cleaning layer had a Vickers hardness of 18, a surface free energy of 46 mJ / m 2 , and a water contact angle of 79.7 degrees.
比較実験３
３，３′，４，４′−ビフェニルテトラカルボン酸二無水物１００モルと、ｐ−フェニレンジアミン９２モルと、エチレンオキシド・プロピレンオキシド共重合ビスアミノプロピルエ−テル（分子量２，０００）（三井化学ファイン製の「ジェファ−ミンＥＤ−２００３」）８モルとを、有機溶媒中で反応させて、ポリアミック酸溶液を得た。
このポリアミック酸溶液を用いて、実験３と同様にして、クリーニング機能付き搬送用クリーニングウエハを作製した。クリーニング層のヴィッカース硬度は６３、表面自由エネルギーは７３．８ｍＪ／ｍ2 、水の接触角は１６度であった。
Comparative experiment 3
3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride 100 mol, p-phenylenediamine 92 mol, ethylene oxide / propylene oxide copolymerized bisaminopropyl ether (molecular weight 2,000) (Mitsui Chemicals) A fine polyamic acid solution was obtained by reacting 8 mol of “Jeffermin ED-2003” (Fine) in an organic solvent.
Using this polyamic acid solution, a transport cleaning wafer with a cleaning function was produced in the same manner as in Experiment 3. The cleaning layer had a Vickers hardness of 63, a surface free energy of 73.8 mJ / m 2 , and a water contact angle of 16 degrees.
上記の実験３，４および比較実験３の各クリーニング機能付き搬送用クリーニングウエハに関し、前記と同様に、基板処理装置内への搬送性の評価およびクリーニング搬送後の異物の除去性について、調べた。これらの結果を、下記の表１に示した。
With respect to the cleaning wafers with a cleaning function in Experiments 3 and 4 and Comparative Experiment 3, the evaluation of the transportability into the substrate processing apparatus and the removal of foreign matters after the cleaning transport were examined in the same manner as described above. These results are shown in Table 1 below.
表１
┌─────┬─────┬────────┐
│ │ 搬送性 │ 異物の除去性 │
│ │ │ 〔除塵率：％〕│
│ │ │ │
├─────┼─────┼────────┤
│ │ │ │
│実 験 ３│ 良 好 │ ９０ │
│ │ │ │
│実 験 ４│ 良 好 │ ９０ │
│ │ │ │
├─────┼─────┼────────┤
│ │ │ │
│比較実験３│ 不 良 │ − │
│ │ │ │
└─────┴─────┴────────┘
Table 1
┌─────┬─────┬────────┐
│ │ Transportability │ Foreign matter removal │
│ │ │ [Dust removal rate:%] |
│ │ │ │
├─────┼─────┼────────┤
│ │ │ │
│Experiment 3│ Good │ 90 │
│ │ │ │
│Experiment 4│ Good │ 90 │
│ │ │ │
├─────┼─────┼────────┤
│ │ │ │
│Comparison Experiment 3│Bad │-│
│ │ │ │
└─────┴─────┴────────┘
上記の表１の結果から明らかなように、クリーニング層のヴィッカース硬度を１０以上の範囲、表面自由エネルギーを３０〜５０ｍＪ／ｍ2 の範囲、水の接触角を５０〜９０度の範囲に設定した実験３，４では、基板処理装置内への搬送性を満足できると共に、異物の除去性については、９０％以上の高い除去率が得られていた。
これに対し、クリーニング層のヴィッカース硬度が１０以上でも、表面自由エネルギーが５０ｍＪ／ｍ2 を超え、水の接触角が５０度未満となる比較実験３では、基板処理装置内への搬送が困難になるという不具合を生じた。
As apparent from the results in Table 1, the Vickers hardness of the cleaning layer was set to 10 or more, the surface free energy was set to 30 to 50 mJ / m 2 , and the water contact angle was set to 50 to 90 degrees. In Experiments 3 and 4, the transportability into the substrate processing apparatus could be satisfied, and a high removal rate of 90% or more was obtained for the removal of foreign matters.
On the other hand, even in the case where the cleaning layer has a Vickers hardness of 10 or more, in comparative experiment 3 in which the surface free energy exceeds 50 mJ / m 2 and the contact angle of water is less than 50 degrees, it is difficult to convey the substrate into the substrate processing apparatus. The problem of becoming.
Claims (4)
A transport member with a cleaning function for removing foreign matter by transporting it into a substrate processing apparatus, having a Vickers hardness of 10 or more, a surface free energy of 30 to 50 mJ / m 2 and a water contact angle on the transport member. A conveying member with a cleaning function, wherein a cleaning layer having a temperature of 50 to 90 degrees is provided.
The conveyance member with a cleaning function according to claim 1, wherein a cleaning layer is directly provided on the conveyance member.
The conveying member with a cleaning function according to claim 1 or 2, wherein the cleaning layer has substantially no adhesion and substantially no conductivity.
A cleaning method for a substrate processing apparatus, wherein the transport member with a cleaning function according to claim 1 is transported into the substrate processing apparatus.
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| JP2005242843A JP4130830B2 (en) | 2005-08-24 | 2005-08-24 | Conveying member with cleaning function and method for cleaning substrate processing apparatus using the same |
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| Publication Number | Publication Date |
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| JP2006054472A JP2006054472A (en) | 2006-02-23 |
| JP4130830B2 true JP4130830B2 (en) | 2008-08-06 |
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| JP2005242843A Expired - Fee Related JP4130830B2 (en) | 2005-08-24 | 2005-08-24 | Conveying member with cleaning function and method for cleaning substrate processing apparatus using the same |
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| CN101982248B (en) * | 2010-09-26 | 2012-05-23 | 昆山博益鑫成高分子材料有限公司 | Manufacturing method of suede cleaning roller |
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| JP3051883B2 (en) * | 1994-03-02 | 2000-06-12 | テクノロール株式会社 | Static elimination roll |
| JPH08126602A (en) * | 1994-10-31 | 1996-05-21 | Nitto Denko Corp | Rotary self-adhesive dust-removing cleaner |
| JP3394625B2 (en) * | 1995-01-30 | 2003-04-07 | 日東電工株式会社 | Adhesive tape for removing foreign matter adhering to semiconductor wafer |
| JPH10154686A (en) * | 1996-11-22 | 1998-06-09 | Toshiba Corp | Method of cleaning semiconductor substrate processing device |
| JPH11224895A (en) * | 1997-12-04 | 1999-08-17 | Sony Corp | Disc jig for removing particles and method for controlling particles using the jig |
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