528653 3 0 9 5twf/005 A7 B7 五、發明説明（丨） (請先閱讀背面之注意事項再填寫本頁) 本發明是有關於一種化學機械硏磨（Chemical-Mechanical Polishing ; CMP) 機台 ，且特別是有關於一種具 有滾筒結構(roller)的化學機械硏磨機台。 在半導體製程技術中，表面平坦化是處理高密度微影 的一項重要技術，因沒有高低落差的平坦表面才能避免曝 光散射，而達成精密的圖案轉移(pattern transfer)。平坦化 技術主要有旋塗式玻璃法（Spin-On Glass ; SOG)與化學機械 硏磨法（CMP)等二種；但在半導體製程技術進入毫微米 (sub-half-micron)之後，旋塗式玻璃法已無法滿足所需求的 平坦度，所以化學機械硏磨技術是現在唯一能提供超大型 積體電路(Very-Large Scale Integration ;VLSI)，甚至極大型 積體電路（Ultra-Large Scale Integration ; ULSI)製程，“全面 性平坦化（global planarization)”的一種技術。 經濟部中央標準局員工消費合作社印製 請同時參照第1A圖與第1B圖，其分別繪示一種習知 化學機械硏磨機台的俯視與側視圖。其中包括：一硏磨台 l〇(polishmg table); —握柄ll〇olde〇，用以抓住被硏磨的 晶片12 ; —硏磨墊13(polishing pad)，舖在硏磨台10上； 一管件14(tube)，用以輸送硏漿15(slurry)到硏磨墊13上； 以及一液泵16，用以將硏漿15抽送到管件14中。當進行 化學機械硏磨時，硏磨台10與握柄11分別沿一定的方向 旋轉，如圖中之箭號18a與18b所示，且握柄11抓住晶片 12的背面19，將晶片12的正面20壓在硏磨墊13上。管 件〗4係將液泵16所打進來的硏漿15，持續不斷地供應到 硏磨墊13上。所以，化學機械硏磨程序就是利用硏漿15 528653 3 09 5twt7005 Λ7 B7 f 經濟部中央標準局員工消費合作社印製 五、發明説明（/ ) 中的化學助劑，在晶片12的正面20上產生化學反應’使 之形成一易硏磨層，再配合晶片12在硏磨墊13上藉由硏 漿15中之硏磨粒（abrasive particles)輔助之機械硏磨’將易 硏磨層之凸出部份硏磨；反覆上述化學反應與機械硏磨， 即可形成平坦的表面。基本上，化學機械硏磨技術是利用 機械拋光的原理，配合適當的化學助劑(reagent)與硏磨粒’ 將表面高低起伏不一的輪廓，一倂加以“拋光”的平坦化技 術: 但是，習知此種化學機械硏磨機台的缺點在於，需要 輸入大量的硏槳15於硏磨墊13上，才能維持硏磨墊13上 的使用量。而硏漿I5是控制化學機械硏磨法中關鍵的製程 參數，假若硏漿I5在硏磨墊13上的分佈不夠均勻的話， 或是流量不夠的話，硏磨率(polishingrate)會降低。且硏漿 I5的價格非常昂貴，硏磨率太低的話，會更浪費硏_ 15 的用量。 有鑑於此，本發明提供一種化學機械硏磨機台，引進 一種滾筒(roller〕結構，可以增強硏漿在硏磨墊上分佈的均 勻性，提高硏磨率。以及節省硏槳的用量，減低製程的花 費（cost) 〇 爲完成本發明之目的，提供一種化學機械硏磨機台， 包括一硏磨台，其以一方向旋轉。一硏磨塾，其設於硏磨 台上。一晶片，其置於硏磨墊上，此晶片具有背面與正面， 而此晶片的正面與硏磨塾相接觸。一^分送管，其置於硏磨 墊上方，此分送管未與硏磨墊相接觸，用以輸送硏漿至硏 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁)528653 3 0 9 5twf / 005 A7 B7 V. Description of the invention (丨) (Please read the precautions on the back before filling out this page) The present invention relates to a chemical-mechanical polishing (CMP) machine. In particular, it relates to a chemical mechanical honing machine table having a roller structure. In semiconductor process technology, surface planarization is an important technique for processing high-density lithography. Because there is no flat surface with high and low dropouts, it can avoid exposure scattering and achieve precise pattern transfer. There are two types of planarization technologies: spin-on glass (SOG) and chemical mechanical honing (CMP); however, after the semiconductor process technology enters the sub-half-micron, spin coating The glass method has not been able to meet the required flatness, so chemical mechanical honing technology is now the only one that can provide very large-scale integrated circuits (VLSI) and even ultra-large-scale integrated circuits (Ultra-Large Scale Integration). ULSI) process, a technology of "global planarization". Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economics Please refer to Figure 1A and Figure 1B, which show the top and side views of a conventional chemical mechanical honing machine, respectively. These include: a honing table l0 (polishmg table);-a handle l0olde〇 to hold the honing wafer 12;-honing pad 13 (polishing pad), spread on the honing table 10 A tube 14 for conveying slurries 15 to the honing pad 13 and a liquid pump 16 for pumping the slurries 15 into the tubes 14. When performing chemical mechanical honing, the honing table 10 and the grip 11 are rotated in a certain direction, as shown by arrows 18a and 18b in the figure, and the grip 11 grasps the back surface 19 of the wafer 12, and the wafer 12 The front side 20 is pressed against the honing pad 13. The pipe fitting 4 continuously supplies the mortar 15 driven by the liquid pump 16 to the honing pad 13 continuously. Therefore, the chemical mechanical honing process is to use the paste 15 528653 3 09 5twt7005 Λ7 B7 f Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Chemical additives in the description of the invention (/) are generated on the front face 20 of the wafer 12 The chemical reaction 'makes it into an easy honing layer, and then cooperates with the wafer 12 on the honing pad 13 by mechanical honing assisted by the abrasive particles in the slurry 15' to protrude the easy honing layer. Partial honing; Repeat the above-mentioned chemical reaction and mechanical honing to form a flat surface. Basically, the chemical mechanical honing technology is a flattening technology that uses the principle of mechanical polishing, with appropriate chemical agents (reagents) and honing grains, to “roughen” the contours of the uneven surface: It is known that a disadvantage of such a chemical mechanical honing machine table is that a large amount of honing paddles 15 need to be input to the honing pad 13 in order to maintain the amount of use on the honing pad 13. Honing I5 is a key process parameter for controlling the chemical mechanical honing method. If the distribution of Honing I5 on the honing pad 13 is not uniform or the flow rate is insufficient, the polishing rate will be reduced. And the price of mash I5 is very expensive. If the honing rate is too low, the amount of 硏 _15 will be wasted. In view of this, the present invention provides a chemical mechanical honing machine table, which introduces a roller structure, which can enhance the uniformity of the distribution of the honing slurry on the honing pad, improve the honing rate, and save the amount of honing blades and reduce the manufacturing process. In order to accomplish the purpose of the present invention, a chemical mechanical honing machine table is provided, which includes a honing table which rotates in one direction. A honing table which is arranged on the honing table. A wafer, It is placed on a honing pad, and the wafer has a back surface and a front surface, and the front side of the wafer is in contact with the honing pad. A dispensing tube is placed above the honing pad, and the dispensing tube is not in contact with the honing pad. Contact for conveying pulp to paper. The size of this paper is applicable to China National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before filling this page)
528653 3 0 9 5twt7005 Λ7 B7 五、發明説明（> ) 磨墊上。一握柄，用以抓住晶片的背面，將晶片的正面壓 在硏磨墊上。一液泵，連接於分送管上，用以將硏漿抽送 到分送管中。以及至少一滾筒，其置於硏磨墊上方，用以 滾平硏磨墊上的硏漿。順著硏磨台的旋轉方向，上述晶片、 滾筒與分送管在硏磨台上的相對位置係爲，依照分佈先後 順序先是分送管、再來是滾筒，然後是晶片。此滾筒具有 平滑的表面，且其材料包括塑膠、橡膠或是金屬等等。此 外，滾筒的轉動方向在硏磨台上的切線方向，與硏磨台的 旋轉方向是相同的。 爲讓本發明之上述和其他目的、特徵、和優點能更明 顯易懂，下文特舉一較佳實施例，並配合所附圖式，作詳 細說明如下。 圖式之簡單說明： 第1A圖係繪示習知一種化學機械硏磨臺整體結構之 俯視圖， 第1B圖係繪示習知一種化學機械硏磨臺整體結構之 側視圖； 經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 第2A圖係繪示本發明之一較佳實施例，一種化學機械 硏磨機台整體結構之俯視圖；以及 第2B圖係繪示本發明之一較佳實施例，一種化學機械 硏磨機台整體結構之傾斜俯視圖。 圖式之標記說明： 10,30 :硏磨台 11，31 :握柄 5 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 3095twf/005 528653 五、發明説明（If ) 12.32 :晶片 13.33 :硏磨墊 、4,34.:管件 15.35 :硏槳 16.36 :液泵 19.39 :晶片的背面 20.40 :晶片的正面 42 :滾筒棒 43 :支撐軸 44 :滾筒 管施例 本發明的特徵在於，在原來的化學機械硏磨系統中， 加入一滾筒(roller)結構，其材料例如爲塑膠或是橡膠，且 很同轉動方向的條件爲：滾筒在硏磨墊(polishing pad)上的 切線方向，與硏磨墊本身的旋轉方向是相同的。此滾筒結 構的功能爲，可用以磨平在硏磨墊上的硏漿(slurry)，增強 硏漿在硏磨墊上分佈的均勻性（uniform)與分送效率 (dispensing efficiency)，並使硏漿在硏磨墊上維持一較薄且 均勻的厚度，可以提高硏磨率。以及節省硏漿的用量，減 低製程的花費(cost.)。 請同時參照第2A圖與第2B圖，其係繪示本發明之一 較佳實施例，一種化學機械硏磨機台整體結構之俯視圖與 傾斜俯視圖。其中包括：一硏磨台table) ; —* 握柄31(h〇lder)，用以抓住被硏磨的晶片32; 一硏磨墊33， 6 ϋ張尺度適I中) A4規格（21〇χ297公--- (請先閱讀背面之注意事項再填寫本頁)528653 3 0 9 5twt7005 Λ7 B7 V. Description of the invention (&); A grip to hold the back of the wafer and press the front of the wafer against the honing pad. A liquid pump is connected to the distribution pipe and is used to pump the slurry to the distribution pipe. And at least one roller, which is placed above the honing pad to smooth out the honing slurry on the honing pad. Along the rotation direction of the honing table, the relative positions of the wafer, the roller, and the distribution tube on the honing table are, in order of distribution, first the distribution tube, then the roller, and then the wafer. This roller has a smooth surface and its materials include plastic, rubber or metal. In addition, the direction of rotation of the drum on the honing table is the same as that of the honing table. In order to make the above and other objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is exemplified below and described in detail with the accompanying drawings. Brief description of the drawings: Figure 1A is a top view showing the overall structure of a conventional chemical mechanical honing table, and Figure 1B is a side view showing the overall structure of a conventional chemical mechanical honing table; Central Bureau of Standards, Ministry of Economic Affairs Printed by the employee consumer cooperative (please read the precautions on the back before filling out this page) Figure 2A is a top view of the overall structure of a chemical mechanical honing machine according to a preferred embodiment of the present invention; and Figure 2B is A preferred embodiment of the present invention is a tilted top view of the overall structure of a chemical mechanical honing machine. Description of the marks on the drawing: 10,30: Honing table 11, 31: Grip 5 The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) 3095twf / 005 528653 5. Description of the invention (If) 12.32 : Wafer 13.33: Honing pad, 4, 34 .: Tube 15.35: Paddle 16.36: Liquid pump 19.39: Back of wafer 20.40: Front of wafer 42: Roller rod 43: Support shaft 44: Roller tube Example Features of the invention The reason is that in the original chemical mechanical honing system, a roller structure was added. Its material is, for example, plastic or rubber, and the conditions of the same rotation direction are: the tangent of the roller on the polishing pad. The direction is the same as the direction of rotation of the honing pad itself. The function of the roller structure is that it can smooth the slurry on the honing pad, enhance the uniformity and distribution efficiency of the slurry on the honing pad, and make the slurry on the honing pad. Maintaining a thin and uniform thickness on the honing pad can improve the honing rate. It also saves the amount of pulp and reduces the cost of the process. Please refer to FIG. 2A and FIG. 2B at the same time, which show a top view and an oblique top view of the overall structure of a chemical mechanical honing machine according to a preferred embodiment of the present invention. These include: a honing table (table); — * Handle 31 (Holder) to hold the honed wafer 32; a honing pad 33, 6 with a moderate I size) A4 size (21 〇χ297 公 --- (Please read the precautions on the back before filling in this page)
、1T φ 經濟部中央標準局員工消費合作社印製 528653 3〇95twf/005 B7 五、發明説明（Γ) 舖在硏磨台30上；一分送管34(dispensing tube)，用以輸 (請先閱讀背面之注意事項再填寫本頁) 送硏漿35到硏磨墊33上，其置於硏磨墊33上方，且未與 硏磨墊33相接觸；一滾筒44，其亦置於硏磨墊33上方， 且未與硏磨墊33相接觸，用以使得硏漿35的分佈較薄且 更均勻；以及一液泵36，用以將硏漿35抽送到分送管34 中。 經濟部中央標準局員工消費合作社印製 當進行化學機械硏磨時，硏磨台30與握柄31分別沿 一定的方向旋轉，如圖中之箭號38a與38b所示，順著硏 磨墊33的旋轉方向38a，滾筒44的俯視位置通常在晶片32 與分送管34之間，例如順著旋轉方向38a，滾筒44位在 分送管34之後，以及晶片32之前。其目的用以先讓硏漿 35經過滾筒44的滾壓，.然後才讓均勻的硏漿35參與硏磨 晶片32的動作。分送管34係將液泵36所打進來的硏漿 35，持續不斷地供應到硏磨墊33上。所以，化學機械硏磨 程序就是利用硏漿35中的化孳助劑，在晶片32的正面40 上產生化學反應，使之形成一易硏磨層，再配合晶片32在 硏磨墊33上藉由硏漿35中之硏磨粒(abrasive particles)輔 助之機械硏磨，將易硏磨層之凸出部份硏磨；反覆上述化 學反應與機械硏磨，即可形成平坦的表面。若各製程參數， 例如硏漿分佈的均勻度與用量控制得宜的話’化學機械硏 磨法可以提供被硏磨表面高達94%以上的平坦度。硏磨步 驟完成之後，本發明的滾筒44結構只要用普通的DI淸洗’ 即可重複使用，非常方便。 上述的滾筒44結構設計爲本發明的特徵，其詳細結構 7 本紙張尺度適用中國國家標準（CNS ) A4規格（公釐） 528653 3095twt'/005 ΑΊ B7 經濟部中央標準局員工消費合作社印製 五、發明説明（A ) 描述如下。滾筒44包括滾筒棒42與支撐軸43兩部分。其 中滾筒棒42以一定方向41轉動，而支撐軸43則用以支撐 滾筒棒42。滾筒棒42具有平滑的表面，其材料可以爲任何 較堅硬或具彈性的物質，例如塑膠、橡膠或是金屬材料都 可以。値得注意的是，滾筒棒42的轉動方向41在硏磨墊 33上的切線方向，與硏磨墊33的旋轉方向38a是相同的。 此外；本發明的滾筒44結構，其形狀與尺寸並沒有任何限 制，且亦不限定只用一根滾筒44結構，多根滾筒結構同時 共用也是可以的，只要能達到使硏漿均勻的功能即可。 綜上所述，本發明所提出的化學機械硏磨機台，具有 以下的特點： (1) 本發明所提出的滾筒44結構，其可用以增強硏漿 (slurry)在硏磨墊(polishing pad)上分佈的均勻性(uniform)與 分送效率（dispensing efftcnency)，並使硏漿在硏磨墊上維持 一合理的厚度，大大提高硏磨的效率。 (2) 本發明所提出的滾筒44結構，可以節省硏漿的用 量’減低製程的花費(cost)。一般來說，本發明實際的硏漿 用量約可減少到習知硏漿用量的2/3左右。 0)本發明所提出的滾筒44結構，其形狀與尺寸並沒有 任何限制，且亦不限定只用一根滾筒結構，多根滾筒結構 同時共用也是可以的。 綜上所述，雖然本發明已以一較佳實施例揭露如上， 然其並非用以限定本發明，任何熟習此技藝者，在不脫離 本發明之精神和範圍內，當可作各種之更動與潤飾，因此 8 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁) 、1· 528653 3 09 5twt'/005 A7 經濟部中央標準局員工消費合作社印製 B7 五、發明説明（1 ) 本發明之保護範圍當視後附之申請專利範圍所界定者爲 準。 (請先閱讀背面之注意事項再填寫本頁)1T φ printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 528653 3095tf / 005 B7 V. Description of Invention (Γ) is laid on the honing table 30; a dispensing tube 34 (dispensing tube) is used to lose (please Read the precautions on the back before filling this page.) Send the honing paste 35 to the honing pad 33, which is placed above the honing pad 33 and is not in contact with the honing pad 33. A roller 44 is also placed on the honing pad 33. The grinding pad 33 is above and is not in contact with the honing pad 33 so as to make the distribution of the mortar 35 thin and more uniform; and a liquid pump 36 for pumping the mortar 35 into the distribution pipe 34. Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. When performing chemical mechanical honing, the honing table 30 and the handle 31 are rotated in a certain direction, as shown by arrows 38a and 38b in the figure. The rotation direction 38a of 33 and the top position of the roller 44 are usually between the wafer 32 and the distribution tube 34. For example, along the rotation direction 38a, the roller 44 is located behind the distribution tube 34 and before the wafer 32. Its purpose is to let the slurry 35 pass through the roller 44 before the uniform slurry 35 participates in the honing of the wafer 32. The distribution pipe 34 continuously supplies the mortar 35 driven by the liquid pump 36 to the honing pad 33. Therefore, the chemical mechanical honing process is to use the chemical honing aid in the honing slurry 35 to generate a chemical reaction on the front surface 40 of the wafer 32 to form an easy honing layer, and then cooperate with the wafer 32 to borrow on the honing pad 33 The mechanical honing assisted by the abrasive particles in the slurry 35 hones the protruding portion of the easy honing layer; by repeating the above-mentioned chemical reaction and mechanical honing, a flat surface can be formed. If the process parameters, such as the uniformity and amount of the mortar distribution, are properly controlled, the 'chemical mechanical honing method can provide a flatness of more than 94% of the surface being honed. After the honing step is completed, the structure of the drum 44 of the present invention can be reused as long as it is washed with ordinary DI, which is very convenient. The structure design of the above-mentioned roller 44 is a feature of the present invention, and its detailed structure 7 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (mm) 528653 3095twt '/ 005 Α7 B7 Printed by the Staff Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs The invention description (A) is described below. The drum 44 includes two parts, a drum rod 42 and a support shaft 43. The roller rod 42 is rotated in a certain direction 41, and the support shaft 43 is used to support the roller rod 42. The roller rod 42 has a smooth surface, and the material can be any hard or elastic material, such as plastic, rubber, or metal. It should be noted that the tangential direction of the rotation direction 41 of the roller rod 42 on the honing pad 33 is the same as the rotation direction 38a of the honing pad 33. In addition, the structure of the roller 44 of the present invention is not limited in shape and size, and is not limited to using only one roller 44 structure. It is also possible to share multiple roller structures at the same time, as long as the function of making the pulp uniform is achieved. can. In summary, the chemical mechanical honing machine table proposed by the present invention has the following characteristics: (1) The roller 44 structure of the present invention can be used to enhance the slurry on the polishing pad. ) Uniformity and distribution efficiency (dispensing efftcnency), and make the mortar on the honing pad a reasonable thickness, greatly improving the efficiency of honing. (2) The structure of the roller 44 proposed in the present invention can save the amount of pulp and reduce the cost of the process. Generally speaking, the actual amount of mash used in the present invention can be reduced to about 2/3 of the amount of conventional mash. 0) There is no restriction on the shape and size of the roller 44 structure proposed in the present invention, and it is not limited to using only one roller structure, and multiple roller structures may be shared at the same time. In summary, although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make various changes without departing from the spirit and scope of the present invention. And retouching, so 8 paper sizes are applicable to Chinese National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before filling out this page), 1.528653 3 09 5twt '/ 005 A7 Central Standard of the Ministry of Economic Affairs Printed by the Consumer Cooperative of the Bureau B7 V. Description of the invention (1) The scope of protection of the present invention shall be determined by the scope of the attached patent application. (Please read the notes on the back before filling this page)
本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）This paper size applies to China National Standard (CNS) A4 (210X297 mm)