TW461003B - Connector apparatus - Google Patents
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- TW461003B TW461003B TW89112201A TW89112201A TW461003B TW 461003 B TW461003 B TW 461003B TW 89112201 A TW89112201 A TW 89112201A TW 89112201 A TW89112201 A TW 89112201A TW 461003 B TW461003 B TW 461003B
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4 b 1 〇〇3 A7 B7 五、發明說明（1 ) 連接器_^_ 技篮屋JL^交叉來考 本應用利用名為”柔性的探針裝置’，之共審査中之申請 案。 釐见之背景-翎迠， 本發明係有關於微電子元件之炙燒與測試，特別是 對於在插座總成中使用之探針，適合用於以單一晶片或晶 ®的形式與積體電路連接β 發明之背景 微電子元件為了證明其功能及可靠度，於製程當中 接受一連串的測試程序。傳統地測試程序包括晶圊探針測 試’微電子元件在其從晶囿中切割及封裝之前受測試，以 決定每一個晶片的操作。探針卡由長的懸臂電纜線所建構 而成，在晶圚調平時用以一次測試一或數個晶片。 典型地，於晶圓探針測試辛並非在一晶面上所有的 晶片是可用的’導致良質元件的產量低於100〇/〇。晶圓被 切割成個別的晶片，而良質的晶片被組合封裝。受封裝元 件藉著將其裝入炙燒板上的插座接受動態地炙燒，且在125 °C至1 5〇t：的溫度下以電力地操作，持績8至72小時的炙燒 ’為了能引起有缺陷的元件發生故障。炙燒加速故障機制 能引起元件的早天期或早期的故障，且在商業上使用前藉 由功能性的電力測試將有缺陷的元件薛選出來β 為了以最大的操作速度對每一個元件加以分類，在 不同的速度下操作，對受封裝元件作全功能測試。於炙燒 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公龙） > n JJ 1 f I It Kt {讀先閲讀背面之注意事項再填寫本頁) 訂· 經濟部智慧財產局員工消费合作社印製 A7 經濟部智慧財產局WK工湞費含作社印絜 五、發明說明（2 ) ^ ^中’測試分離的封裝元件，同時允許剔除任何故障的 疋件。封裝7L件的良燒及測試藉由插座來完成，該插座尤 其適合炙燒狀況及高速測試。傳統的製程由於重複的加工 及個別的分離元件經過會增加元件總製造時間數週之冗 長步驟的測試是昂貴且費時的。 藉由灸燒及在晶圓切割成分離元件前加以測試，可 以在成本及製程時間上獲得相當大的優點。在晶圓切割成 刀離疋件前藉由在晶圓的每一元件上製造晶片尺寸封裝可 以侍到額外的節約。半導體工業花費相當大的努力發展有 效的方法用於晶圓調平封裝、炙燒及測試，以得到用於製 k微電子元件時極其簡化及縮短製程的利益。為了獲得這 些利益’需提供構件用於炙燒及在晶片由晶圓分割成個別 分離的元件前加速測試。 傳1先的，^ ’電欖線探針用於炙燒及加速晶圊上元件 之測試是不適合的。懸臂電纜線探針太長且龐大以致當需 要對晶園上所有元件同時炙燒時，無法同時接觸到晶圓上 所有的元件。此外，由於組成探針之長的平行電纜線具有 高的自身及相互電感，所以長的懸臂電纜線探針並不適合 高速元件的功能測試5 種低成本小型的高功能探針，對於晶圓炙燒的實 際應用及測試程序來說是有所需要的=為了對晶圓炙燒及 測試有幫助採釺必須確實地與尚未自晶園切割、受測試 .之元件上的所有襯墊接觸。用來接觸晶圓的探針必須在元 件丄襯墊提供電力接觸，襯墊在晶園的表面上變化高度。 .......I I I I I I I * ft— I n I I I I 一-β，· ϋ I 1 1 1 i I I *5^ (請先閱讀背面之注意事項再填寫本頁> 461003 經濟部智慧財產局員工消費合作社印製 A7 B7____ 五、發明說明（3 ) 此外’探針為了與每一個襯墊做確實的電力接觸，必須擊 穿接觸襯墊表面之任何氧化物層。已有很多方法嘗試提供 具有成本效益及確實的構件，於炙燒及測試時探測晶圓， 卻無完全成功者。 一些嘗試已試著提供小的垂直地柔性的探針，用以 確實地舆晶圓上元件之襯墊接觸。根據以美國專利第 4，189,825 號頒給 David R.Robillard 與 Robert L. Michaels 為代表之發明，提供一種懸臂探針用以測試積鱧電路元件 。第1圖中，懸臂（28)支撐著在晶片（23)上鋁質接觸襯墊(24) 上方之鋒利的尖端（26)。一柔性的構件（25)向下推進，移 開尖端（26)進入與襯墊（24)接觸。為了讓尖端（26)與襯墊 (24)之鋁金屬作電力接觸，襯墊（24)上之一層鋁氧化物以 鋒利的尖端（26)使其碎裂。小懸臂樑的剛度一般來說不足 以施力至尖端，而該力對於尖端擊穿接觸襯墊上之鋁氧化 物層來說是必須的，沒有外部的構件施力到懸臂上β玻璃 、矽、陶瓷材料及鎢等材質的懸臂樑已被試著用於不同的 結構配置，在提供具有足夠力量及可撓性之炙燒探針方面 並未成功* 如第2Α®所示，一種可撓曲之薄膜探針，在題目為 可挽曲的接觸探針，IBM Technical Disclosure Bulletin， 1972年10月，第1513頁中有所描述。電介質薄膜（32)包括 適合與積體電路上之襯墊作電力接觸的電極（33)。電極（33) 藉著附裝在電極（33)上接觸襯墊（35)之可撓曲的電纜線（34) ，連接到測試用電子裝備"於可撓曲的聚醯亞胺薄膜上組 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）4 b 1 〇〇3 A7 B7 V. Description of the invention (1) Connector _ ^ _ Technology basket house JL ^ Cross to test This application uses a "flexible probe device", a total of applications under review. See the background-alas, the present invention relates to the burning and testing of microelectronic components, especially for probes used in socket assemblies, suitable for connecting to integrated circuits in the form of a single chip or crystal Beta Background of the Invention In order to prove its function and reliability, microelectronic components undergo a series of test procedures during the manufacturing process. Traditionally, the test procedures include a crystal probe test 'microelectronic components are tested before they are cut and packaged from the crystal. To determine the operation of each wafer. The probe card is constructed by a long cantilever cable, which is used to test one or several wafers at a time when the wafer is leveled. Typically, the wafer probe test is not used in All wafers on one crystal plane are usable ', resulting in less than 100/0 yield of good quality components. The wafers are cut into individual wafers, and good quality components are packaged in packages. Burn plate The sockets underwent dynamic burning and operated electrically at a temperature of 125 ° C to 150 ° C. The burning for 8 to 72 hours was performed in order to cause defective components to fail. Burning accelerated The failure mechanism can cause early or early failure of the component, and before commercial use, the defective component is selected by functional electrical testing. In order to classify each component at the maximum operating speed, Operate at different speeds and perform full-featured testing on the packaged components. For burning this paper, the Chinese National Standard (CNS) A4 specification (210 X 297 male dragon) is applicable. ≫ n JJ 1 f I It Kt {Read First Read Note on the back, please fill in this page again) Order · Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives, printed A7 WK labor costs of the Intellectual Property Bureau of the Ministry of Economic Affairs, including the seal of the company V. Invention Description (2) Package components, while allowing any faulty parts to be eliminated. The good burning and testing of packaged 7L parts are done through a socket, which is particularly suitable for burning conditions and high-speed testing. Traditional processes due to repeated processing and individual Testing a discrete component through lengthy steps that increase the total manufacturing time of the component for several weeks is expensive and time consuming. By moxibustion and testing before the wafer is cut into discrete components, considerable advantages can be obtained in terms of cost and process time. . Additional savings can be served by making wafer-size packages on each component of the wafer before the wafer is cut into blades. The semiconductor industry spends considerable effort developing effective methods for wafer leveling packages. , Burning and testing, in order to obtain the benefits of extremely simplified and shortened process when manufacturing microelectronic components. In order to obtain these benefits' need to provide components for burning and accelerate before the wafer is divided from the wafer into individual discrete components Test. According to the first report, ^ 'Electromarine line probe is not suitable for burning and accelerating the test of components on the crystal. The cantilever cable probe is too long and bulky so that when it is necessary to burn all the components on the wafer at the same time, it is impossible to touch all the components on the wafer at the same time. In addition, because the long parallel cable wires that make up the probe have high self and mutual inductance, the long cantilever cable probe is not suitable for the functional test of high-speed components. It is necessary for the practical application and test procedures of burning = in order to help the wafer burning and testing, the picking must be in contact with all the pads on the components that have not been cut from the wafer and tested. The probe used to contact the wafer must provide electrical contact on the element / pad, which changes height on the surface of the wafer. ....... IIIIIII * ft— I n IIII I-β, · ϋ I 1 1 1 i II * 5 ^ (Please read the precautions on the back before filling out this page> 461003 Staff of Intellectual Property Bureau, Ministry of Economic Affairs Printed by the Consumer Cooperative A7 B7____ 5. Description of the Invention (3) In addition, in order for the probe to make actual electrical contact with each pad, it must penetrate any oxide layer on the surface of the contact pad. Many methods have been attempted to provide this at a cost. Effective and reliable components that detect wafers during burn-in and testing without complete success. Some attempts have been made to provide small vertically flexible probes for reliable pad contact of components on the wafer. According to the invention represented by U.S. Patent No. 4,189,825 to David R. Robillard and Robert L. Michaels, a cantilever probe is provided for testing integrated circuit components. In Figure 1, a cantilever (28) supports A sharp tip (26) on the wafer (23) above the aluminum contact pad (24). A flexible member (25) is pushed down and the tip (26) is removed to come into contact with the pad (24). Let the tip (26) and the aluminum metal of the gasket (24) make In electrical contact, a layer of aluminum oxide on the gasket (24) breaks it with a sharp tip (26). The stiffness of a small cantilever beam is generally not sufficient to exert a force on the tip, and this force causes the tip to penetrate the contact pad The aluminum oxide layer on the pad is necessary. No external components can exert force on the cantilever. The cantilever beams of β glass, silicon, ceramic material and tungsten have been tried for different structural configurations. Succulent probes of sufficient strength and flexibility have not been successful * As shown in Section 2A®, a flexible thin-film probe under the heading Reversible Contact Probe, IBM Technical Disclosure Bulletin, 1972 Described in October, page 1513. The dielectric film (32) includes electrodes (33) suitable for making electrical contact with the pads on the integrated circuit. The electrodes (33) are attached to the electrodes (33) by contact Flexible cable (34) of gasket (35), connected to test electronic equipment " on flexible polyimide film. This paper is sized for Chinese National Standard (CNS) A4 (210 X 297 mm)
Ha *..圓· MM a·* _ MV MM I (請先閱讀背面之注意事項再填寫本頁》 經濟部智慧財產局員工消費合作社印製 A： _B：____ 五、發明說明（4 ) 裝之探針，在美國電機電子工程師學會（IEEE)國際測試會 議（1988)公報中由Leslie等人提出》可撓曲的薄膜容許― 限制的垂直移動量，以容納受測試晶圓上之積體電路上接 合墊的高度變化：諸如由Leslie等人描述的薄膜探針，提 供連接到積體電路晶片以供高效能的測試。然而，薄骐之 尺寸的穩定性並不足以容許在炙燒溫度循環的過程中，與 完整晶圓上之襯墊接觸。 在二氧化矽薄膜上接觸點的構造如第2B圖中所顯示 ，在頒給Glenn J. Leedy之美國專利第5,225,771號中有所 描述。二氧化矽薄膜（40)較聚醖亞胺薄膜具有較佳的尺寸 穩定性，從而稍微改善與受炙燒測試之晶圓上，與接觸襯 墊配合之尺寸穩定性的問題。探針尖端（4 1)藉著通孔（44) 穿經薄膜（4〇)連接到電路跡線（45)，該電路跡線與電介質 薄膜（43)上之一附加的電路系統層連接。限制在二氧化矽 薄膜（40)上測試探針之垂直的柔順性，提供探針陣列於半 導體晶圓上元件的炙燒中使用是不可靠的。 在美國專利第4,585,991號中描述之半導體晶圓上炙 燒探針之陣列構造’如第3A及3B圖中所示，分別為俯視 圖及橫截面圖。探針（5 1 )為一角錐，藉由薄片（54 >附裝至 丰導體晶圊基板（52)上。為了與探針（51)作機械地隔離， 將材料（53)由半導體晶圓（52)中移除。第3A圖中所示之探 針提供了一受限制的垂直移動但其在基板上未提供空 間以供將探針陳列連接至動態炙燒所需之測試的電子裝 儀上的配線需要 **· * "JrTrnr>|1_J· ·. ,η , r ,,,,.., ...Ha * .. Yuan · MM a · * _ MV MM I (Please read the precautions on the back before filling out this page "Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A: _B: ____ V. Description of Invention (4) Packing The probe was proposed by Leslie et al. In the Bulletin of the Institute of Electrical and Electronics Engineers (IEEE) International Test Conference (1988). "The flexible film allows-limited vertical movement to accommodate the volume on the wafer under test. Height variation of bonding pads on the circuit: thin-film probes such as those described by Leslie et al. Provide connection to integrated circuit wafers for high-performance testing. However, the stability of the dimensions of the thin wafers is not sufficient to tolerate temperatures During cycling, contact with the pad on the complete wafer. The structure of the contact points on the silicon dioxide film is shown in Figure 2B and described in US Patent No. 5,225,771 to Glenn J. Leedy The silicon dioxide film (40) has better dimensional stability than the polyimide film, thereby slightly improving the problem of dimensional stability with the contact pad on the wafer subjected to the burn test. Probe tip (4 1) The through-hole (44) passes through the film (40) to the circuit trace (45), which is connected to one of the additional circuit system layers on the dielectric film (43). It is limited to the silicon dioxide film (40 The vertical flexibility of the test probes provided above, it is not reliable to provide a probe array for use in the burning of components on a semiconductor wafer. The array of burning probes on a semiconductor wafer described in US Patent No. 4,585,991 The structure 'is shown in Figs. 3A and 3B, which are a top view and a cross-sectional view, respectively. The probe (5 1) is a pyramid, and is attached to the abundance conductor wafer substrate (52) by a sheet (54). In order to be mechanically isolated from the probe (51), the material (53) is removed from the semiconductor wafer (52). The probe shown in Figure 3A provides a limited vertical movement but it is on the substrate No space is provided for wiring on the electronic equipment that connects the probe display to the test required for dynamic burning ** * " JrTrnr > | 1_J ·., Η, r ,,,, ... ...
Vl：, if. ； ： i5 ； A (Xj + I S l»l»n :.1P , ,. . ·ι . s...^ -------------裝1 ^1 ^1 ^1 ϋ im k n I 線 {靖先M讀背面之注意事項再填寫本頁) A7 B7 五、發明說明（5 ) 一種用於提供可撓曲探針至元件接觸襯墊的方法， 其包括利用可撓曲電纜線或桿件，將測試電路系統連接至 襯墊。第4A囷中所示之可撓曲探針，在頒給Gobina Das等 人之美國專利第5,977,787號中有所描述β探針（60)為一背 曲的樑構件’早先的時候在頒給R〇nald B〇ve之美國專利 第3,806,801號中有一般地的描述。探針（60)被設計用於在 晶圓上元件炙燒時使用。支撐著探針（60)的導板，62) 具有之膨脹係數小於測試中晶圓之膨脹係數β探針尖端（63) 偏移了 一小段的距離（60)，對樑構件（60)提供了撓曲的明 確形式。雖然彎曲的樑構件非常適合用於測試個別的積败 電路晶片，但是用於需要有數千個接觸點之晶圓炙燒是太 過昂貴了。再者’彎曲的樑構件由於樑構件之足夠的弩曲 所需之長度，探針的電力性能受到限制。 第4Β圖中所示為另一個利用可撓曲桿件的方法，揭 露在頒給Arnold W. Yanof及William Daulcsher之美國專利 第5,513,430號中。第4B圖中顯示可撓曲探針係為桿件（66) 的形式，其能夠對作用在探針尖端（67)上之力量做出反應 而彆曲。桿件（66)與基板（69)間形成一個角度，為了能夠 讓其對來自配合的接觸襯墊在尖端（67)上的力量作出反應 垂直地撓曲。為了促進撓性，桿件（66)從底電極（68)至尖 端（67)形成一斜度（65)。 尚有其他利用可撓曲電纜線與桿件的方法，如第4C 圖中所顯示，揭露於頒給Benjamin N. Eldridge等人之美國 專利第5,878,486號中。第4C®中所顯示之探針，包括彈 本紙張尺度適用中0 g家標準（CNS>A4規格（210 * 297公爱） <請先閲it背面之注意事項再填寫本頁>Vl :, if.;: I5; A (Xj + IS l »l» n: .1P,, .. · ·. S ... ^ ------------- install 1 ^ 1 ^ 1 ^ 1 ϋ im kn I line {Jingxian M read the precautions on the back and fill out this page) A7 B7 V. Description of the invention (5) A method for providing a flexible probe to the contact pad of a component, This includes connecting the test circuit system to the gasket using a flexible cable or rod. The flexible probe shown in Section 4A 囷 is described in U.S. Patent No. 5,977,787 to Gobina Das et al. The beta probe (60) is a curved beam member 'was issued earlier Ronald Bove is generally described in US Patent No. 3,806,801. The probe (60) is designed for use when components on a wafer are burned. The guide plate supporting the probe (60), 62) has an expansion coefficient smaller than the expansion coefficient of the wafer under test. The β probe tip (63) is offset by a short distance (60), and is provided to the beam member (60). Gives a clear form of deflection. Although curved beam members are well-suited for testing individual failed circuit wafers, it is too expensive to burn wafers that require thousands of contacts. Furthermore, the 'bent beam member' is limited in its electrical performance due to the sufficient crossbow length of the beam member. Figure 4B shows another method of using a flexible member, which is disclosed in U.S. Patent No. 5,513,430 to Arnold W. Yanof and William Daulcsher. Fig. 4B shows that the flexible probe is in the form of a rod (66), which can respond to the force acting on the probe tip (67) and not flex. The rod (66) forms an angle with the base plate (69), so that it can flex vertically in response to the force from the mating contact pad on the tip (67). To promote flexibility, the rod (66) forms a slope (65) from the bottom electrode (68) to the pointed end (67). There are other ways to use flexible cables and rods, as shown in Figure 4C, and disclosed in U.S. Patent No. 5,878,486 to Benjamin N. Eldridge et al. The probes shown in 4C®, including the standard paper size applicable to the paper standard (CNS > A4 size (210 * 297)) < Please read the precautions on the back of it before filling out this page >
I t— 1· r I n ί I 經濟部智慧財產局員工消費合作社印製 8 經濟部智慧財產局員Η消費合作社印製 A7 —-______B7____ 五、發明說明（6 ) 性電纜線（71)上的探針尖端（72)，為了促進撓性其可變曲 成特定的形狀。電纜線（71)藉著傳統的電纜線黏著劑（73) 與基板（74)結合。第4C圖中所顯示之型式的探針，需要一 段長的彈性長度來獲得晶圓炙燒所需要的接觸力及柔順性 此外’如此使用個別電纜線之探針，對使用在晶圓炙燒 來說是太過昂貴，由於每個晶圓需要數千個探針。 提供可撓曲探針的進一步的方法包含使用***在測 試頭與受測元件間之柔性層，以至測試頭上的電極與元件 上配合的接觸襯墊作電力地連接。電連接器在頒給wiUem Luttmer美國專利第3,795,〇37號中有所描述，利用將可撓 曲導體嵌進彈性體材料中，在壓入可舆電連接器之頂面及 底面接觸具傳導性之配對的範圍間連接。為了構成柔性的 ***層對可撓曲的導體作了很多的變化包括，斜的電纜線 、具傳導性的填充聚合物、鍍金的桿件及其他具傳導性彈 性體材料之構件。 以上所列出之方法及其他在提供能容許經濟的炙燒 及在晶圊切割成分離的晶片前，加速晶圓上微電子元件之 測試的高效能探針方面的嘗試未能成功。 發明1概要說明 根據本發明t揭露一種小型的柔性探針其包括一個 具傳導性的尖端.該探針置於—支撐表面可容許探針尖端 相關於支律表面可換曲地移動。探針尖端垂直地移動以對 當襯塾偏移尖端時配合的接觸概塾上的力量作出反應。探 斜的機械柔順十生容許在探針與微電子元件上相㈣的接觸 "一 ' , ........ 'I -----_ 表紙以3剌 —— I I I I I It — — — — —— ' ! I I I I I — — — — — — I (請先M讀背面之注$項再填寫本頁) 經«部智.¾財產局員工消費合作社印製 d61003 A7 ________B7 五、發明說明（7 ) 概墊間，作確實地電力接觸，機械柔順性容納接觸襯墊在 高度上的變化。 本發明之目標在於提供一種方法及構件，用於為了 在元件被切割成分離的晶片前炙燒，與在未被切割晶®上 之微電子元件的接觸襯墊作電力連接》根據本發明之柔性 的探針，容許同時與在晶圓表面之所有的接觸襯墊陣列作 確實的電力連接，以至在晶®上的微電子元件能夠經濟地 炙燒。 本發明的另一個目的在於提供一種用於未被切割晶 圓上之微電子元件炙燒的裝置。此裝置與每一個元件上的 接觸襯墊作電力連接，驅動電路系統提供元件在高溫下動 態炙燒期間所需之電信號。同時地供應電信號與電力到晶 圓上之所有晶片。裝置中探針的機械柔順性可容納接觸襯 墊及探針尖端在高度上的變化，以至每個探針尖端在整個 炙燒過程的溫度循環期間，與配合的接觸襯墊保持接觸。 本發明尚有另一個目的在於提供一種電探針卡，容 許尚未封裝微電子元件之高速測試。本揭露内容中所講授 的小型柔性的探針，為了把電測試信號用於該等元件並且 從該元件測量電信號，與元件上相對應的襯墊做暫時的連 接。小型的柔性探針容許高速電信號來回通過元件，由於 過度的電感或電容與用於習知技藝中之電纜線探針結合， 並未有損失。 本發明進一步的目的在於提供一種方法與構件，用 於炙燒、測試及操作微電子元件，其中元件上電接觸點配 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 10 丨裝----- ^1 ί n B n f -麥w {請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（8 ) 置在兀件的整個表面之區域陣列中。本揭露内容中所講授 的小型柔性的探針’用於與元件上接觸點作確實的電力連 接，其中之接觸電佈置在—區域陣列中。儘管在室溫及元 件的操作溫度範圍二者條件下，元件上接觸點高度有變化 ，機械的柔順性容許每個探針之尖端，與元件上之配合的 接點保持電力接觸。 本發明之另一個目的在於提供—種小型插座，為了 晶片之炙燒'測試及操作的目的’此插座用於將積體電路 晶片連接到電路系統。插座中每個小探針接觸點容許安裝 在插座中的晶片能有高速的操作。本揭露内容中所講授的 探針之機械柔順性’可使能與具有最小的或無封裝之硬式 晶片作確實的電力連接。根據本發明之柔性的探針容許用 於晶片比例封裝及覆晶之經濟的插座 '具有小型化構造。 本發明的所有目的可藉由提供一種機械地柔性的電 探針來達成，其中一探針尖端配置在可撓曲材料之伸長的 薄彈簧片兩端之間。此伸長的薄彈簧片藉著位在彈簧月每 一端之桿構件，將其支撐於基板之上，從而容許尖端藉著 對彈性材料彎曲及伸展，在垂直的方向輕易地移動。 於此所揭露之探針與傳統的懸臂探針相較具有顯著 地改良’其在任何特定的探針力和探針尺寸上能提供探針 尖端具有較大範圍的柔性的移動傳統的懸臂探針被限制 在移動的範圍π該移動的範圍係為探釺對特定力之反應 及探針材料之彈性限制所及之範圍。懸臂探針中最大的機 械應力集伞在懸臂材料的表面之撓曲點上本發明對於特 -------------裝 « I 1 n 訂---------線 <請先|«讀背面之注意事項再填寫本頁) 經濟部智慧財產局貝工消费合作社印製 A7 B7 五、發明說明（9 ) 定的彈簧材料及探針力，在其達到材料之彈性限制之前， 提供較大範圍的移動。 本發明藉著在晶圓調平時確實地提供測試及灸燒功 能’可增加微電子元件製造效率，與此同時縮減了測試裝 置的尺寸。機械地柔性的探針提供相對於探針尺寸來說， 較大的移動範圍。此移動範圍對於與具有在實質上不同平 面之接觸襯墊的元件作連接是重要的。柔性的探針尖端可 撓曲地移動以容納配合的接觸襯墊在高度上的差異，與此 同時保持接觸襯墊上探針尖端足夠的力量，以確保其間確 實的電力接觸β 圖式之簡要說明 本發明之新穎的功能及可信賴的特性在附加的申請 專利範圍中提出。本發明自身及其中之其他的功能及優點 ，藉由參考以下的詳細說明，結合其中伴隨的相關圖式閱 讀，可有最佳的了解。 第1圖顯示一種習知技藝之懸臂探針的斷面囷。 第2 Α及2Β圊顯示一種習知技藝之可撓曲的薄联探針 的橫載面圊。 第3A及3B圖顯示習知技藝於矽晶園上製造的探針圓 ，其中第3A圖顯示探針之平面俯視圖及第3B圖顯示探針 之斷面圖》 第4A至4C圊顯示習知技藝之可撓曲的桿件探針》 第5圖顯示根據本發明之柔性的探針困。 第6圖顯示包含一接地的平面蓋板之柔性的探針的交 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 12 — ίιιιιΊ— — — —^ V» — — — — ·11111111 <請先《讀背面之注意事項再填寫本I) 經濟部智慧財產局員工消費合作社印絮 A7 ___B：_____ 五、發明說明（1Q ) 替結構配置圖。 第7A至7C圖顯示柔性的探針之一具想實施例，其中 第7A圖為俯視圖、第7B圖顯示靜止探針之斷面圖及第7C 圖為探針受到力（F)作用時的斷面圖° 第8A至8D圖顯示根據本發明對於柔性的探針之探釺 設計的交替具體實施例的俯視圖。 第9A至9D圖顯示根據本發明在柔性的探針结構中使 用的探針尖端。 ' 第10圊顯示柔性的探針之一個具體實施例圖。 第11圖顯示柔性的探針結合彈性體膠囊密封材料之— 個具體實施例圖。 第12A至12C圖顯示具電路連接之柔性的探針的一個 具體實施例’其中第1 2A圖為俯視圖、第〗2B圖為靜止探 針之斷面圖及第12C圖為探針受到力（F)作用時的斷面圊。 第13A及13B圊顯示具有積體接地蓋板之柔性的探針 的一個具體實施例，其中第13A圖為俯視圖及第13B圖為 斷面圖。 第14圖顯示具積體接地蓋板之柔性的探針的一個交 替具雖實施例的斷面圖s 第15A圖顯示與柔性的探針結分之測試頭裝置。 第1 ’B圖顯不在第丨5八圖中之柔性的探針的斷面围= 兔交倖璧實座之詳細說日且I t— 1 · r I n ί I Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 8 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 —-______ B7____ 5. Description of the invention (6) on the cable (71) The probe tip (72) can be flexibly bent into a specific shape to promote flexibility. The cable (71) is combined with the substrate (74) by a conventional cable adhesive (73). The type of probe shown in Figure 4C requires a long elastic length to obtain the contact force and flexibility required for wafer burning. In addition, 'probes that use individual cables are used to burn wafers. Too expensive, since thousands of probes are needed per wafer. A further method of providing a flexible probe includes the use of a flexible layer interposed between the test head and the device under test, so that the electrodes on the test head and the mating contact pads on the component are electrically connected. The electrical connector is described in U.S. Patent No. 3,795, 〇37 issued to wiUem Luttmer, which uses a flexible conductor embedded in an elastomeric material to conduct conduction when pressed into the top and bottom contacts of the electrical connector The connection between sexual pairs. In order to form a flexible insertion layer, many changes have been made to flexible conductors, including inclined cables, conductive filled polymers, gold-plated rods, and other components made of conductive elastomeric materials. The methods listed above and other attempts to provide high-performance probes that allow economical burning and accelerate the testing of microelectronic components on wafers before the wafer is cut into separate wafers have failed. Summary of Invention 1 According to the invention t, a small flexible probe is disclosed that includes a conductive tip. The probe is placed on a support surface to allow the probe tip to move flexibly in relation to the rhythmic surface. The probe tip moves vertically to respond to forces on the mating contact profile when the liner is offset from the tip. The oblique tenacity of mechanical obedience allows the contact between the probe and the microelectronic component " 一 ', ........' I -----_ The surface of the paper is 3 剌 —— IIIII It — — — — — —— '! IIIII — — — — — — I (please read the note on the back of the book before filling in this page) «Ministry of Wisdom. ¾ Printed by the Staff Consumer Cooperative of Property Bureau d61003 A7 ________B7 V. Description of the invention (7) Make sure electrical contact between the pads, and the mechanical compliance can accommodate the change in height of the contact pads. The object of the present invention is to provide a method and a component for electrically connecting a contact pad of a microelectronic component on an uncut wafer in order to burn before the component is cut into separate wafers. The flexible probe allows real electrical connections to all the contact pad arrays on the wafer surface at the same time, so that the microelectronic components on the wafer can be burned economically. Another object of the present invention is to provide a device for burning microelectronic components on an uncut wafer. This device is electrically connected to the contact pads on each component, and the drive circuit system provides the electrical signals required by the component during dynamic burning at high temperatures. Electrical signals and power are simultaneously supplied to all wafers on the wafer. The mechanical flexibility of the probes in the device can accommodate variations in height of the contact pads and probe tips, so that each probe tip remains in contact with the mating contact pads during the temperature cycle of the entire burn-in process. Another object of the present invention is to provide an electrical probe card that allows high-speed testing of microelectronic components that have not yet been packaged. The small and flexible probes taught in this disclosure, in order to apply electrical test signals to these components and measure electrical signals from the components, make temporary connections to the corresponding pads on the components. Small, flexible probes allow high-speed electrical signals to pass back and forth through the component. There is no loss due to the excessive inductance or capacitance combined with the cable probes used in conventional techniques. A further object of the present invention is to provide a method and component for burning, testing, and operating microelectronic components, wherein the electrical contact points of the components are matched with the paper size applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 10丨 Install ----- ^ 1 ί n B nf-麦 w {Please read the notes on the back before filling this page) Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (8) The entire surface of the element is in an area array. The small and flexible probes' taught in this disclosure are used to make a reliable electrical connection with the contact points on the component, and the contact electricals are arranged in an area array. Although the height of the contact points on the component changes at both room temperature and the operating temperature range of the component, the mechanical compliance allows the tip of each probe to maintain electrical contact with mating contacts on the component. Another object of the present invention is to provide a small socket for the purpose of 'burning-in and testing' of a chip. The socket is used to connect an integrated circuit chip to a circuit system. Each small probe contact in the socket allows the chip mounted in the socket to operate at high speed. The mechanical compliance of the probes taught in this disclosure enables a secure electrical connection to a rigid chip with minimal or no packaging. The flexible probe according to the present invention allows an economic socket 'for miniaturized chip packaging and flip chip' having a miniaturized structure. All the objects of the present invention can be achieved by providing a mechanically flexible electrical probe in which a probe tip is disposed between two ends of an elongated thin spring sheet of a flexible material. This elongated thin spring sheet is supported on the base plate by lever members located at each end of the spring, thereby allowing the tip to easily move in a vertical direction by bending and stretching against the elastic material. The probe disclosed herein has a significant improvement over traditional cantilever probes. 'It can provide a wide range of flexibility in the movement of the probe tip with a large range of flexibility in any particular probe force and probe size. Traditional cantilever probes The needle is limited to the range of movement π The range of movement is the range covered by the probe's response to a specific force and the elastic limit of the probe material. The largest mechanical stress collecting umbrella in the cantilever probe is on the deflection point of the surface of the cantilever material. The present invention is particularly suitable for ------------ installation «I 1 n order --------- --Line <Please read the notes on the back before filling this page) Printed by A7 B7, Shelley Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (9) Provides a wide range of movements before reaching the material's elastic limit. By providing the test and moxibustion function reliably during wafer leveling, the present invention can increase the manufacturing efficiency of microelectronic components, and at the same time reduce the size of the test device. The mechanically flexible probe provides a large range of movement relative to the size of the probe. This range of movement is important for connecting components with contact pads in substantially different planes. The flexible probe tip can be flexibly moved to accommodate the difference in height of the mating contact pads, while maintaining sufficient force on the probe tip on the contact pads to ensure proper electrical contact between them. The novel functions and reliable features of the present invention are set forth in the scope of additional patent applications. The present invention and its other functions and advantages can be best understood by referring to the following detailed descriptions and reading the accompanying related drawings. Figure 1 shows a cross section of a cantilever probe of a conventional technique. Sections 2 Α and 2B 圊 show a cross-section 圊 of a flexible thin probe which is a conventional technique. Figures 3A and 3B show the probe circle made on the silicon wafer by the conventional technique. Figure 3A shows the top plan view of the probe and Figure 3B shows the cross-sectional view of the probe. Skillful Flexible Rod Probe "Figure 5 shows a flexible probe according to the present invention. Figure 6 shows the size of the paper containing a flexible probe with a grounded flat cover. Applicable to China National Standard (CNS) A4 (210 X 297 mm). 12 — ίιιΊ — — — — ^ V »— — — — · 11111111 < Please read "Notes on the back side before filling in this I) Printed A7 of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ___B: _____ 5. Description of the invention (1Q) Alternate structure layout. Figures 7A to 7C show one conceivable embodiment of one of the flexible probes, where Figure 7A is a top view, Figure 7B is a cross-sectional view of a stationary probe, and Figure 7C is a view of the probe when subjected to a force (F). Sectional views ° Figures 8A to 8D show top views of alternate embodiments of a probe design for a flexible probe according to the present invention. Figures 9A to 9D show a probe tip used in a flexible probe structure according to the present invention. 'Figure 10 shows a specific embodiment of a flexible probe. FIG. 11 shows one embodiment of a flexible probe combined with an elastomer capsule sealing material. Figures 12A to 12C show a specific embodiment of a flexible probe with a circuit connection, where Figure 12A is a top view, Figure 2B is a cross-sectional view of a stationary probe, and Figure 12C is a force applied to the probe ( F) Section 圊 when acting. Figures 13A and 13B show a specific embodiment of a flexible probe with an integrated ground cover, wherein Figure 13A is a top view and Figure 13B is a cross-sectional view. Fig. 14 shows a cross-sectional view of an embodiment of a flexible probe with an integrated ground cover, and Fig. 15A shows a test head device connected to the flexible probe. Fig. 1'B shows the cross section of the flexible probe not shown in Fig. 5-8 = the detailed description of the rabbit's cross
根據本發明的® P丨丨，矛L J⑴柔性的探針的第一個具體實施 1列如第〕圖所顯示.印揣抑According to the present invention's ® P 丨 丨, the first embodiment of the flexible probe of the spear L J⑴ is shown in the first column.
’：島路之探針容許與諸如積體電路（ICS (請先wtt背面之注意事項再填寫本頁) 裝--------訂---------線-------— flf Xu 4i« n If 4 6 1 0 0 3 A7 ____B7_ 五、發明說明（11 ) 、覆晶、被動元件及晶片比例封裝等微電子元件上之接觸 襯整作確實的電力連接。探針容許探針尖端（81)對尖端上 的力作出反應做可撓曲的垂直移動。於是當一接觸襯墊被 推進與探針尖端（81)接觸，結構之機械的柔順性容許尖端 在具有足夠之力，供探針尖端（81)貫穿在接觸襯墊上之絕 緣氧化物薄膜與配合的接觸襯墊接觸β探針的機械柔順性 容納在微電子元件的一個區域中接觸襯墊在高度上的差異 ’與此同時在每個探針尖端提供足夠的力量，以確保在尖 端（81)與相對應之接觸襯墊間確實的電力連接。再者，在 測試或炙燒循環期間，熱膨脹可導致元件及探針支撐架勉 曲，所以探針的機械柔順性是必須的以容許尖端維持與相 對應之襯墊連接。 第5圖中’探針尖端（81)被支撐在具傳導性材料之一 伸長的薄彈簧片上◊薄彈簧片（83)由桿件（85)所支撐，在 伸長的薄彈簧片（83)之每一端與接觸襯墊（84)結合。探針 尖端（81)能夠可撓曲地移動以反應垂直地施於尖端（81)之 力。尖端（81)的垂直移動致使薄彈簧片（83)可撓彆曲及伸 長’以至柔性的復原力施加在尖端（81)上。 經濟部智慧財產局員工消費合作社印製 第5圊中所顯示之柔性的探針，桿件（85)藉由電極（86) 被支撐在基板（89)之上，該電極與電路跡線（87)作電力地 連接。電路跡線（87)依序藉由通孔（88)與基板（89)中的電 路系統連接。上述一系列的連接將探針尖端（81)與基板（89) 中的電路連接，為了能夠操作連接至探針的元件^在諸如 炙燒的應用中，基板（89)由矽或低膨脹陶瓷材料製成，為 14 <請先閱讀背面之注意事項再填寫本頁> 本紙張尺度適用中國國家楳準<CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印繁 A： --------B7 五、發明說明（12 ) 了能夠達到在整個溫度範圍，典型地從25 °C至1 50 :C，尺 寸的穩定性。 對於在高頻率下操作，佈置從尖端（81)至通孔（88)之 電力連接以減小連接電感至探針尖端（81)。迴路的電感藉 著將通孔（88)實質上地置於探針尖端（81)之下《儘管通孔 (88)無法一直理想地如此配置，尖端（81)與通孔（88)間的 距離掛需要高頻率操作之應用來說是短的。 第6圖中顯示柔性的探針之第二個具體實施例，其中 伸長的薄彈簧片（93)藉由接地的平面蓋板（92)與基板（99) 中之電路系統隔開受到保護。接地的平面蓋板（92)藉著電 介質層（98A，98B)作電力地絕緣。電介質層（98A)被夾在 基板（99)的頂面與接地的平面蓋板（92)之間。可選擇的電 介質層（98B)是彈性體的電介質材料被夾在接地的平面蓋 板（92)與薄彈簧（93)之間。電介質層（98B)的彈性體材料係 較佳地由矽、氟矽、氟碳及氨基鉀酸酯聚合物組成的群組 中選擇=彈性體的電介質層（98B)將薄彈簧片（93)與接地 的平面蓋板（92)隔離，與此同時容許彈簧片（93)垂直地挽 曲= 在第6圖中’在伸長的薄彈簧片（93 }之每—端上的接 觸概墊（94)與桿件（95)結合，桿件依序被支撐在基板（99) 的襯墊<96)上。將電力連接至探針尖端（9丨），可經薄彈簧 -A3)至接觸襯墊(94)與被支撐在電極（96)上的桿件（95)結 合’電極（96)藉由電路跡線（97)連接至基板（99)中的電路 系統上 遣卜 _ 家標 規格--- --------------' i i ί I 訂--------- {請先Μ讀背面之注意事項再填寫本頁) 4 6 1 0 0 3 A7 B7 五、發明說明（13 ) 如第6圖中所示，探針尖端（91)配置在薄彈簧片（93)上 ，沿著在伸長的薄彈簧片（93)之每一端上的桿件（95)間之 中心線的預定位置。在探針尖端（91)上之垂直力致使薄彈 簧片（93)的彈性彎曲及伸展，和彈性趙的電介質層（98b) 的變形。在探針尖端（91)上之垂直力藉由薄彈簧片（93)的 彈性彎曲及伸展和彈性體的電介質層（98B)的變形所產生 之反力來作柔性地抵抗。 第7A圖所顯示係為在第5圖中所圖示之一般型式之柔 性的探針的第一個具體實施例之平面围。伸長的薄彈餐片 (103)是由金屬薄片製成，包括在薄片的每一端構造有接 觸襯墊（104)。薄彈餐片（103)之金屬材質需選择在極限損 壞下能顯出高降伏強度及適度的伸長者。金屬材質諸如鉬 、钶、不鏽鋼、鈹銅合金、銅鎳合金、鎳、鈦及其中元素 之合金是為較佳的。一種適合的金屬係為鈹銅合金（ASTM Spec.No.B534)，其具有550Mpa的降伏強度》另一種適合 的金屬係為鈦合金（们，8八丨，114〇,1丫>，具有910\1?&的降伏 強度。 第7A围所顯示之探針尖端（1〇1)被支撐在薄彈簧片 (103)上，以至探針尖端（1〇1)向著基板（1〇9)垂直地壓下以 反應施加在探針尖端的垂直力（F)。第7B及7C圖中的斷面 圖顯示探針尖端（101)的垂直降低。施加在探針（101)尖端 的垂直力（F)可撓曲地將薄彈簧片（103)彆曲，以容許尖端 (101)向著基板（109)壓下。如第7C圖中之斷面圖所示，探 針尖端（101)的垂直移動將薄彈簧片（103)弩曲及伸展》 本纸張尺度適用中固B家標準（CNS)A4規格（210 * 297公Λ ) (請先《讀背面之注意事項再填寫本頁}': Island road probes are allowed to be integrated with circuits such as integrated circuits (ICS (please note the precautions on the back of wtt before filling out this page). -----— flf Xu 4i «n If 4 6 1 0 0 3 A7 ____B7_ V. Description of the invention (11), contact lining on microelectronic components such as flip chip, passive components, and chip proportional packaging make sure power Connection. The probe allows the probe tip (81) to flexibly move in response to the force on the tip. Then when a contact pad is pushed into contact with the probe tip (81), the mechanical flexibility of the structure allows The tip has sufficient force for the insulating flexibility of the probe tip (81) penetrating the contact pad to contact the mating contact pad. The mechanical flexibility of the beta probe is accommodated in a region of the microelectronic element. The difference in height of the pads at the same time provides sufficient force at the tip of each probe to ensure a positive electrical connection between the tip (81) and the corresponding contact pad. Furthermore, during the test or burn cycle During this period, thermal expansion can cause component and probe support to buckle, so the probe is mechanically compliant It is necessary to allow the tip to maintain the connection with the corresponding pad. In Figure 5, the 'probe tip (81) is supported on an elongated thin spring sheet with a conductive material, and the thin spring sheet (83) is formed by a rod. (85) is supported and is combined with a contact pad (84) at each end of the elongated thin spring sheet (83). The probe tip (81) can be flexibly moved in response to being applied vertically to the tip (81). The vertical movement of the tip (81) causes the thin spring sheet (83) to flex and stretch, so that a flexible restoring force is exerted on the tip (81). Printed in the 5th frame of the Consumer Cooperative of the Intellectual Property Bureau, Ministry of Economic Affairs In the flexible probe shown, the rod member (85) is supported on the substrate (89) by an electrode (86), and the electrode is electrically connected to the circuit trace (87). The circuit trace (87) depends on The sequence is connected to the circuit system in the substrate (89) through the through hole (88). The above series of connections connect the probe tip (81) with the circuit in the substrate (89) in order to be able to operate the components connected to the probe ^ In applications such as burning, the base plate (89) is made of silicon or a low-expansion ceramic material. 14 < Please read the notes on the back before filling in this page > This paper size is applicable to China National Standards < CNS) A4 Specification (210 X 297 mm) Employees ’Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs, India, India and India A:- ------- B7 V. Description of the invention (12) It can reach dimensional stability over the entire temperature range, typically from 25 ° C to 1 50: C. For operation at high frequencies, arrange a power connection from the tip (81) to the through-hole (88) to reduce the connection inductance to the probe tip (81). By placing the through-hole (88) substantially below the probe tip (81), the inductance of the loop "although the through-hole (88) cannot always be so ideally configured, the distance between the tip (81) and the through-hole (88) Distance hanging is short for applications requiring high frequency operation. Fig. 6 shows a second specific embodiment of the flexible probe, wherein the elongated thin spring leaf (93) is protected from the circuit system in the base plate (99) by a grounded flat cover plate (92). The ground plane cover (92) is electrically insulated by a dielectric layer (98A, 98B). The dielectric layer (98A) is sandwiched between the top surface of the substrate (99) and the ground plane cover plate (92). An optional dielectric layer (98B) is an elastomeric dielectric material sandwiched between a grounded planar cover plate (92) and a thin spring (93). The elastomer material of the dielectric layer (98B) is preferably selected from the group consisting of silicon, fluorosilicon, fluorocarbon, and urethane polymers. The dielectric layer (98B) of the elastomer is a thin spring sheet (93). Isolated from the ground plane cover (92), while allowing the spring leaf (93) to buckle vertically = contact pads on each end of the thin spring leaf (93) in Fig. 6 ( 94) In combination with a lever (95), the lever is sequentially supported on a pad < 96) of the base plate (99). Connect the power to the probe tip (9 丨) through the thin spring-A3) to the contact pad (94) and the rod (95) supported on the electrode (96) in combination with the 'electrode (96) through the circuit The trace (97) is connected to the circuit system in the base plate (99). _ Family standard specifications --- -------------- 'ii I Order ------ --- {Please read the notes on the back before filling this page) 4 6 1 0 0 3 A7 B7 V. Description of the invention (13) As shown in Figure 6, the probe tip (91) is arranged on a thin spring On the sheet (93), a predetermined position along the center line between the rods (95) on each end of the elongated thin spring sheet (93). The vertical force on the probe tip (91) causes the elastic bending and stretching of the thin spring leaf (93), and the deformation of the dielectric layer (98b) of the elastic Zhao. The vertical force on the probe tip (91) is flexibly resisted by the reactive force generated by the elastic bending and stretching of the thin spring sheet (93) and the deformation of the dielectric layer (98B) of the elastomer. FIG. 7A shows the plane of the first specific embodiment of the flexible probe of the general type illustrated in FIG. 5. The elongated thin elastic meal sheet (103) is made of a metal sheet and includes a contact pad (104) configured at each end of the sheet. The metal material of the thin elastic meal sheet (103) should be selected to show high drop strength and moderate elongation under extreme damage. Metal materials such as molybdenum, rhenium, stainless steel, beryllium copper alloy, copper nickel alloy, nickel, titanium, and alloys of the elements are preferred. One suitable metal system is a beryllium copper alloy (ASTM Spec. No. B534), which has a drop strength of 550 MPa. Another suitable metal system is a titanium alloy (men, 88, 114, 1 1 >, having 910 \ 1? &Amp; Falling strength. The probe tip (101) shown at 7A is supported on the thin spring sheet (103) so that the probe tip (101) faces the substrate (109). ) Press down vertically to reflect the vertical force (F) applied to the tip of the probe. The cross-sections in Figures 7B and 7C show the vertical drop of the probe tip (101). The vertical applied to the tip of the probe (101) The force (F) flexibly bends the thin spring sheet (103) to allow the tip (101) to be pressed toward the base plate (109). As shown in the sectional view in FIG. 7C, the probe tip (101) The vertical movement of the thin spring sheet (103) will crossbow and stretch. ”This paper size is applicable to China Solid B Standard (CNS) A4 specification (210 * 297 male Λ) (Please read the“ Cautions on the back side before filling this page ” }
* n n n 1« I 經濟部智慧財產局貝工消费合作社印製 16 A7* n n n 1 «I Printed by Shelley Consumer Cooperative, Bureau of Intellectual Property, Ministry of Economy 16 A7
五、發明說明（14 ) 探針尖端（101)係為角錐體，藉由眾所周知的加工方 法在結晶（100)矽的表面構成之蝕坑複製而成β尖端角 )4.75度是由構成角錐面之結晶矽平面來決定。尖端 (1〇1)的材料為鎢，其構成一尖銳的硬點能夠擊穿典型地 用在半導體1C元件之鋁接觸襯墊上的氧化鋁層。適合用來 製造硬探針尖端的材料包括鉬、鎳合金、鉞、Paliney 7、 铑、銖、鈦、鎢及其中元素的合金。 藉由在矽蝕坑複製尖銳的探針尖端的製造方法，在 此領域是眾所周知的，在1973年由D.A.Kiewit出版，，科 學儀器之回顧 V〇1.44 ’第1741-1742頁，Kiewit說明探針 尖端的製造方法，藉著將錄棚合金置入石夕姓坑中複製而成 ’然後將矽基底材料移除。Kiewit在藉由沸騰的聯氣氩氧 化物作表面處理之矽表面上，構成角錐狀蝕坑。 薄彈簧片（103)藉著桿件（】05)支撐在基板（1〇9)之上， 桿件在伸長的薄彈簧片（103)的每一端與電極（106)結合。 桿件（105)係由電沉積金屬所構成，從由硬銅、鎳、銅錄 合金或硬金等構成的組合中挑選係為較佳地。探針尖端 (101)與測試電路的電力連接可藉由傳導經過薄彈簧片 1 0 3) '接觸概塾（丨〇 4)、桿件(.10 5)、電極（1 〇 6.)、電路跡線 (107)及通孔（108)來達成。裝配從通孔（1〇8)到探針尖端 (101)之電路已構成一迴路，其可將盡可能最小的區域封 閉其中，為了能夠減小電感且從而容許在高頻率或數據率 下操作。V. Description of the invention (14) The probe tip (101) is a pyramid, which is copied by a well-known processing method on the surface of crystalline (100) silicon and formed by the pits of the β-tip angle. The crystalline silicon plane is determined. The material of the tip (101) is tungsten, which constitutes a sharp hard spot that can penetrate the aluminum oxide layer typically used on the aluminum contact pad of a semiconductor 1C element. Suitable materials for hard probe tips include molybdenum, nickel alloys, rhenium, Paliney 7, rhodium, baht, titanium, tungsten, and alloys of these elements. It is well known in the art by duplicating the manufacturing method of a sharp probe tip in a silicon etch pit, published by DAKiewit in 1973, Review of Scientific Instruments V.1.44 'Pages 1741-1742, Kiewit describes probes The cutting-edge manufacturing method is copied by placing the recording alloy in the pit of Shi Xi's name, and then removing the silicon base material. Kiewit forms a pyramid-shaped pit on a silicon surface that is surface-treated with boiling argon oxide. The thin spring piece (103) is supported on the base plate (109) by the rod (05), and the rod is combined with the electrode (106) at each end of the elongated thin spring piece (103). The rod member (105) is composed of an electrodeposited metal, and it is preferably selected from a combination consisting of hard copper, nickel, copper alloy or hard gold. The electrical connection between the probe tip (101) and the test circuit can be conducted through the thin spring sheet 10 3) 'contact profile (丨 〇4), rod (.105), electrode (106), Circuit traces (107) and vias (108). Assembling the circuit from the through hole (108) to the probe tip (101) has formed a loop that can seal the smallest possible area therein, in order to reduce the inductance and thus allow operation at high frequencies or data rates .
教個柔性的探之交替的結構配置顯示於第8A至8D ——..... — 本纷:張叉度適芾^國®家標？.（cNSM'i規格ΠΚΊ :>爱） ...π . ~ ----It — — —— — — — 1111111 — — — — — — —-- ί請先IVJit背面之注意事項再填寫本1} 經濟部智慧財產局員工消費合作社印紫 經濟部智慧財產局員工消費合作社印*1衣 461003 A7 ____B7_____ 五、發明說明（15 ) 圖中。可靠的結構配置有助於接觸襯墊的探測，該接觸襯 墊在積體電路上以線性陣列方式緊密地配置。最新積想電 路上之接觸襯墊其中心間距可小到60微米》為了能與間隔 配置的探針概墊緊密地接觸，特別設計的探針以特別設計 的陣列相互套疊。第8A至8D圖中所示之設計，提供構件 用與受測試之積髏電路元件上緊密地配置之接觸襯墊陣列 接觸。 第8A圃中所示之柔性的探針’容許伸長的薄彈簧片 陣列中探針的相互套叠，與一探針尖端線性陣列之軸成_ 角度。此結構配置包括一具有探針尖端（111)的彈簧片， 該探針配置在薄彈簧片的短部分（113)與長部分（112)之間 。接觸襯墊（114)與（116)分別配置在短部分（113)端及長部 分（112)端》彈普片由短部分（113)下的桿件（115)與長部分 (112)下的桿件（117)所支撐。桿件（115)及（117)的錯開配置 容許探針一個接著一個緊密配置。 第8B圖中所示之柔性的探針，包括一伸長的薄彈簧 片，該彈簧片具有一盡頭是接觸襯墊（124)的短部分（123) 及一盡頭是接觸襯墊（126)的長部分（122) »探針尖端（121) 配置在長部分（122)與短部分（123)之間。接觸襯墊（126)由 桿件（127)支撐，接觸襯墊（丨24)由桿件（125)支撺》藉著佈 置數個如第8B囷中所示之探針，以短部分及長部分交替 配置而成一列’在緊密地配置的陣列中相互套疊的探針， 對於測試具有小的襯墊間隔之積體電路是適合的。 第8C圖中所示之柔性的探針，包括一伸長的薄彈簧 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） 18 I II ^-----I I ! --II ^il — ί— γ (請先Mff背由之注意事項再填寫本I ) 五、發明說明（16 ) A7 B7_ 片（133)支撐在兩個接觸襯墊（134)及（136)之間。探針尖端 (131)配置在彈簧片（133)上介於桿件（135)與另一桿件（137) 間的中點，該二桿件（135)及（ι37)分別與接觸襯墊及 (136)結合。伸長的桿件（135)及（137)和伸長的接觸襯墊 (Π4)及（136)成一角度以容許探針能如第8C圖圖示，以一 緊密地間隔配置陣列方式相互套要。 第8D圖中之柔性的探針，包括一伸長的薄彈簧片， 該彈簧片具有一盡頭是接觸襯墊（144)的短部分（丨43)及一 盡頭是接觸襯墊（】46)的長部分（142)。探針尖端（141)配置 在薄彈簧片上長部分（142)與短部分（143)之間。橢圓形桿 件（145)及（147)分別支撐接觸襯墊（144)及（146)，以至探針 能以一緊密地間隔配置陣列方式相互套疊。彈簧片部分 (142)及（〗43)當元件上之接觸襯墊對探針尖端（141)產生偏 移時，可撓曲地彎曲及伸展。 第9A至9D圖中所示之探針尖端安裝在微電子元件的 測試及炙燒之特定應用上。這些探針尖端及其他的種類在 積體電路工業來說是眾所周知的。在此所提出的範例是正 在使用之取多類型的探針尖端中具有代表性的。製造的方 法對於製造電力接觸點方面技藝的從業人員來說是眾所周 知的= 第9A圖中所示之探針尖端用於探測積體電路上之鋁 接合.襯墊係為較佳的 其中尖銳的頂點（1 5 3)適合擊穿铭 接合概墊上的氣化物層。角錐（1 52)在結晶{ 1 〇〇)矽的表面Teach a flexible exploration of the alternate structural configuration shown in Sections 8A to 8D ——..... — This article: Is the degree of Zhang Fork suitable for the National Standard? . (CNSM'i Specifications ΠΚΊ: > Love) ... π. ~ ---- It — — — — — — 1111111 — — — — — — — Please fill in the precautions on the back of IVJit before filling Book 1} Indian Consumer Cooperative Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by the Intellectual Property Bureau of the Ministry of Economic Affairs of the Employee Consumption Cooperatives of the Ministry of Economic Affairs * 1 461003 A7 ____B7_____ 5. Description of the invention (15) In the picture. Reliable structural configuration facilitates the detection of contact pads, which are closely arranged in a linear array on the integrated circuit. In the latest design circuit, the contact pads can have a center distance as small as 60 microns. In order to be in close contact with the spaced-apart probe pads, specially designed probes are nested in a specially designed array. The designs shown in Figures 8A to 8D provide components that come in contact with an array of contact pads that are closely arranged on the tested cross-section circuit components. The flexible probe 'shown in Fig. 8A allows the probes in the elongated thin spring leaf array to overlap each other at an angle to the axis of a linear array of probe tips. This structural arrangement includes a spring leaf having a probe tip (111), the probe being disposed between the short portion (113) and the long portion (112) of the thin spring plate. The contact pads (114) and (116) are respectively arranged at the short section (113) end and the long section (112) end. "The pop sheet is composed of the rod (115) under the short section (113) and the long section (112). Is supported by a rod (117). The staggered arrangement of the rods (115) and (117) allows the probes to be arranged closely one after the other. The flexible probe shown in FIG. 8B includes an elongated thin spring leaf having a short portion (123) with a contact pad (124) at the end and a contact pad (126) at the end. Long section (122) »The probe tip (121) is arranged between the long section (122) and the short section (123). The contact pad (126) is supported by the rod (127), and the contact pad (丨 24) is supported by the rod (125). "By arranging several probes as shown in Figure 8B, The long portions are alternately arranged in a row of 'probes nested in a tightly arranged array, which is suitable for testing integrated circuits with small pad spacings. The flexible probe shown in Figure 8C includes an elongated thin spring. The paper size is applicable to China National Standard (CNS) A4 (210 X 297 public love). 18 I II ^ ----- II!- II ^ il — ί — γ (please fill in the precautions of Mff before filling in this I) V. Description of the invention (16) A7 B7_ The piece (133) is supported between the two contact pads (134) and (136) . The probe tip (131) is arranged on the spring piece (133) at a midpoint between the rod member (135) and another rod member (137), and the two rod members (135) and (ι37) are respectively in contact with the pad And (136) binding. The elongated rods (135) and (137) and the elongated contact pads (Π4) and (136) are at an angle to allow the probes to interrelate with each other in a closely spaced array as shown in Figure 8C. The flexible probe in FIG. 8D includes an elongated thin spring leaf, and the spring leaf has a short portion (丨 43) at the end of which is the contact pad (144) and a contact pad (] 46) at the end. Long section (142). The probe tip (141) is disposed between the long portion (142) and the short portion (143) on the thin spring plate. The elliptical rods (145) and (147) support the contact pads (144) and (146), respectively, so that the probes can be nested on each other in a closely spaced array. The spring piece portions (142) and (〖43) can flexibly bend and stretch when the contact pads on the element deviate from the probe tip (141). The probe tips shown in Figures 9A to 9D are mounted on specific applications for testing and burning microelectronic components. These probe tips and others are well known in the integrated circuit industry. The example presented here is representative of the many types of probe tips being used. The manufacturing method is well known to those skilled in the art of manufacturing electrical contact points = The probe tip shown in Figure 9A is used to detect aluminum bonding on integrated circuits. The gasket is preferably one of the sharp The apex (1 5 3) is suitable to penetrate the vaporized layer on the bonding pad. Pyramid (1 52) on the surface of crystalline {1〇〇) silicon
構成之蝕坑複製而成..角錐Π 52)被支撐在薄彈簧片π 5 U 張尺§適用围家標a K:NS)A4規格、29.;·亡釐 -----I------t --— Ini— -----II — (鲭先閱讀背面之江意事項再填寫本ϊ 經濟部智慧財產局員工消費合作衽印繁 19 經濟部智慧財產局8工消費合作社印製 461003 A： B7___ 五、發明說明（17 ) 上。角錐（152)的頂點（153)在角錐之相對面間尖銳地具有 54.75度的誘導角。硬質材料用於探針尖端（152)，其中由 鉬、鎳、蛾、Paliney 7、铑、銖、鈦、鎢及其中元素之合 金所構成的材料組合中選擇材料係為較佳地。探測之軟質 接觸點’材料諸如餓、铑及鎢係為較佳的，因為它們對於 焊接及其他的軟質材料反應是緩慢地。 第9B囷中所示之探針尖端係為較佳的用在接觸貴重 金屬接觸襯墊。薄圓盤（157)被配置於薄彈簧（155)表面上 的金屬桿件（156)所支撐•桿件（156)藉由化學蝕刻加工法 造成過熔低陷，以暴露出薄困盤（157)的邊緣。薄圓盤（157) 係由惰性金屬製成，且由金、Paliney 7、白金、铑及其中 元素之合金所構成的材料組合中選擇材料係為較佳地。 第9C囷中所示之探針尖端係為較佳的用在接觸焊接 及其他的軟質材料。金屬桿件（162)上的圓形金屬尖端（161) 被配置於薄片彈簧（160)上。圓形金眉尖端（】61)藉由閃光 雷射熔解及高溫材料流回進入球體斷面的模子中使其成形 。適合圓形金屬尖端（161)之材料包括由鎳、白金、铑、 銅鎳合金、鈹銅合金及Paliney 7等構成的材料組合中選擇 的材料。 第9D圖中所示之探針尖端係為較佳的用在接觸小型 接觸襯墊及緊密地配置在一起的襯墊上。具有頂邊緣（166) 的探針尖端（167)配置在薄彈簧片（165 )的頂表面。探針尖 端（167)係為較佳地藉由將邊緣鍍上一層犧牲材料，然後 將犧牲材料移除留下朝著垂直的方向之薄的金屬部分（167) 本紙張尺度適用中固國家標準（CNS>A4規格（210 X 297公釐） 20 — — — — — — — — » . — — —— — II * — — — — — —— i (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作.社印製 A7 五、發明說明（18 ) 所構成。 第ίο圖所顯示為柔性的探針之第三個具體實施例’ 其中一伸長的薄彈簧片（172)由於在薄彈簧片（172)之長抽 的垂直方向具有一波紋（173)，提供了增強的可撓性p 一 或更多個波紋可提供彈簧片（172)更容易地彎曲及伸展， 容沣更具可撓性以反應作用在探針尖端（171)上的垂直力 =波紋（1 73)係由在（100)矽之結晶表面所構成之伸長的蝕 坑複製而成。在矽表面蝕刻伸長的凹坑之方法是眾所周知 的，其具代表性的文章為”矽結晶表面之非等方性的蝕刻 之最新三度空間的微細構造製造法，，由Ernest Bass〇us在美 國電機及電子工程師學會電子元件會刊，％丨.£〇_ 2:>，>}〇.10(1978)第1184頁中所發表。波紋（173)係藉將金屬 條放置在姑坑之長轴的垂直方向而製成。 第10圖中，在伸長的薄彈簧片（Π2)之每一端上的電 極（174)與桿件（175)結合，該桿件將彈簧支撐在基板（179) 上之一預定的距離 < 桿件（175)被置於接觸襯墊（176)上， 藉由電路跡線（177)及通孔（178)與基板（179)上的電路系統 連接。 第丨0圖中.探針尖端ί丨7 1.)配置在薄彈著片（丨7 2.)之上 ，距離伸長的薄彈簧片Π 72)之每—端上的桿件（丨75)有一 預疋的距離°在探針失端（17])上的垂直力致使薄彈簧片 卜2 >藉由波紋：ί 3 >的挽曲"j增強彈性地彎曲及伸屐波 蚊ί丨7 3)的南度由控制其寬縻來決定，以至不會碰到受測 試元件的頂部· ； .n **·«Μ·ιι_ I—,,,,ιΐιΐ mm I I I· III I «-.nnnwin i»^ —~ ----------*·*~***—~· *—- -, — 41¾ 甲由圉國家標壤.規格 i’’K; > :.Κ}Γ 餐：一…一.一·———一》™一‘一一—ι一—一卿. illllllln — —— - I I I I I I I ^ · u I I I I I I (請先Mit背面之注意事項再填寫本頁) 461003 經濟部智慧財產局員工消费合作社印製 Α7 Β7 五、發明說明（19 ) 第11圖所顯示為柔性的探針之第四個具體實施例，其 中基板（189)表面上的電路系統（187)受彈性體膠囊密封劑 (188)保護，該密封劑被失在薄彈簧片（182)與基板（189)頂 面之間。膠囊密封劑（188)能防護抵抗腐蝕及機械的損傷 ’與此同時容許薄彈簧片（182)在探針尖端（181)被推進對 著受測試元件上配合的接觸概墊時，能柔性地移動。 在第四個具體實施例中，一伸長的薄彈簧片（182)具 有一或數個波紋（183)，其方向舆薄彈簧片（182)的長轴方 向垂直。彈簧片（182)藉桿件（185)支撐在基板（189)上之一 預定的距離，該桿件在伸長的薄彈簧片（182)之每一端上 的電極（184)結合。桿件（185)置於接觸概墊（186)上，藉由 電路跡線（187)穿過通孔（188)與基板（189)上的電路系統連 接。 第12 A-12C圖所顯示為第三個具體實施例的詳細圖， 針對一包含有兩個波紋（193)之結構配置》第丨2A®之俯視 圖顯示一柔性的探針’其探針尖端（191)配置在薄彈著片 (192)上β彈簧片（192)係為蒙耐合金Κ-500之銅碟合金薄膜 。薄彈簧片（192)的厚度介於〗〇與75微米間，在25至5〇微 米的範圍内係為更佳地。薄彈簧片（192)的寬度介於20與 150微米間，在30至75微米的範圍内係為更佳地。在薄彈 酱片（192)之第一端（194)處桿件（195)的質量中心與在薄彈 簧片（192)之第二端（194)處桿件（195)的質量中心間的距離 大約為200至1500微米的長度》桿件的質量中心間的距離 從250至750微米的長度係為更佳地。 本紙張尺度適用中國國家標準<CNS)A4規格<210 X 297公麓） {請先《讀背面之沒意事項再填寫本頁) t n^gJI I n I K · 22 蛵濟邹智慧財產局員工消費合作.社印袈 A7 ______B7___ 五、發明說明（20 ) 第12B及12C圖中圖示探針尖端（191)受到垂直力（F)作 用時的反應，圖中顯示探針受到力（F)作用前、後之斷面 圖。如第12C圖所示，作用在探針尖端（191)的力（F)使薄 彈簧片（192)向著基板（199)撓曲。彈簧片（192)彈性地寶曲 及伸展’從而產生反力柔性地抵抗當力（F)作用時揼針尖 端（191)進一步的撓曲。波紋（193)藉著增加彈簧片（192)的 伸展及彎曲移動提高柔順性。特別是波紋（193)減小了彈 簧片（192)的張力，明顯地釋放出因彈簧片（192)的伸展所 引致的應力。 探針尖端（1 91)與用於操作受測試元件的電力電路系 統連接。探針（191)藉著被桿件（195)支撐的彈簧片（192)連 接，該桿件在伸長的薄彈簧片（192)的兩端與接觸襯墊（194) 結合=桿件(195)被支撐在基板（199)表面的電極（196)上。 電極（196)依序連接到電路跡線（197)，該跡線藉由可傳導 的通孔（198)連接到基板（1 99)中的電力電路系統。任擇地 ，一接地的平面可插在探針尖端（191)與基板（199)中的電 路系統之間，以保護探針尖端（19丨）不受基板（199)中相鄰 之電路跡線（197)信號的影響。 第I3A及I3B圖中顯示—柔性的探針，其可提供積趙 電路之高效忐測試所需的低電感：第13 B圖中顯示柔性的 探針的斷面圖.其中探針尖端（2〇1)配置在薄彈簧片（2〇2) 之上用在彈簧片（202.)中信號的往復接地線路，可藉由 一金屬層（212)提供‘該金屬層藉著將一電介質層（2丨〗）央 在·其間以與彈簧片；202 >隔離 _____ ’ 类適用士 g 固家螵 a iCNS>A4 規格。K m:;—---—------------- -------------裝--------訂---- n n It · 線 (請先lait背面之注意事項再填寫本買) 經濟部智慧財產局具工消费合作社印製 4 b1 0 0 3 A7 __B7___ 五、發明說明（2〗） 探針尖端（201)上的信號與結合的接地回路，二者藉 著短的電力線路連接到基板（209)中之其個別的電路上。 探針尖端（201)與和彈簧（202)上接觸襯墊（204)結合之支擇 桿件（205)相連接。支撐在電極（206)上的桿件（205)連接到 電路跡線（207) ’該跡線依序與基板（209)中的測試電路連 接。電極（212)上相對應之接地回路與支撐桿件（215)相連 接。支撐在電極（216)上之桿件（215)與接地跡線（2〗7)連接 ，該跡線依序與基板（209)中之接地電路連接。 第14圈中所顯示者為在第13A及13B困中之具有接地 回路之柔性的探針的一個可供選擇的例子。第丨4圖中的探 針在機械方面是堅固耐用的，因為具有能釋放應力之波紋 (223)的伸長的薄彈簧片（222)，在兩端直接地被桿件（225) 支撐著。探針尖端（221)與基板（229)中的測試電路系統連 接’該連接係經過彈簧片（222)、接觸襯墊（224)、桿件（225) 及電極（226)連接到基板（229)中的測試電路系統β接地電 極（235)藉著將一電介質薄膜夾在其間以與彈簧片（222)隔 離*接地回路線路是從接地電極（235)經過桿件（236>到基 板（229)上之接地電極（233)。 接地回路（235)附裝在分開的桿件（236)上，而桿件附 裝在基板（229)上的接地電極（233) ·接地回路（235)藉著將 一電介質薄膜（231)夾在其間以與彈簧片（222)隔離。 第15Α圖中顯示一種測試頭裝置，該裝置包含具有接 地回路電極之柔性的探針。測試頭提供了一種用於測試高 效能積體電路晶片之構件。晶片上之高效能電力接觸連接 本紙張尺度適用中S B家標準<CNS)A4規袼（210 X 297公爱） 24 ， ' .、 ---,,--!ΊΙ-----裝—i^-!*^ (請先閱讀背面之汶意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 A7 ____B7___ 五、發明說明（22 ) 襯墊，驅動可連接到高速晶片測試器的輪入/輸出插槽的 電路系統。每一個探針藉由電路跡線（258)連接到晶片測 試器的插槽（SI、S2、S3、S4·.，,），該電路跡線於陶瓷基 板（249)上的電極（257)處終止。 建構在陶瓷基板（249)上之測試頭提供了機械的及熱 的穩定性。每個柔性的探針包括配置在薄彈簧片（242)上 的探針尖端（241)，該彈餐片藉著桿件（245)支樓在基板（249) 表面之上預定的距離。探針尖端（241)在垂直的方向可挽 曲地移動，以容納晶片上接觸襯墊於高度上的任何差異， 同時能維持與晶片上接觸襯墊確實的連接。 第15A圖中之可塑性探針的機械操作，可藉著參考第 15B圖所示之斷面圊能有更佳的了解。探針尖端（241)配置 在薄彈簧（242)上’薄彈簧包括波紋（243)以增加探針的可 撓性。在伸長的薄彈簧（242)每一端上的接觸襯墊（244)與 桿件（245)結合。電路跡線（247)上的電極（246)支撐著桿件 (245) ’其連接到基板（249)中分別的電路跡線（258) » 第15B圏中所示之柔性的探針包含一位在彈簧（242)之 頂側的接地回路（255)接地回路（255)藉著將一電介質薄 膜（25 i)夾在其間以與彈簧（242)隔離。接地回路（255)藉由 桿件（2 5 6)連接到接地電極（2 5 3)。此結構配置避免彈簧片 (242)中之機械應力傳送到接地電路（255)。 儘管本發明之數個較佳的具體實施例已作說明許 多的修改及可供選擇的例子對熟知此技藝之人士來說不會 背離本發明的精神與範疇是顯而易見的 一一_ ^ .............. 丨丨 钱穴度適用中關家鮮賴咖,.公髮了 — ———-- I — -------- - -- - ·!1111111 — — — — — — — — — <請先Μίι背面之注意事項再填寫本頁) 4 6 10 0 3 A7 B7 五、發明說明（23 ) 經濟部智慧財產局員工消費合作社印製 2 3…晶片 24.. .接觸襯墊 25.. .柔性的構件 26.. .鋒利的尖端 28…懸臂 32…電介質薄膜 33.. .電極 34.. .可撓曲電纜線 35.. .接觸襯墊 40.. .二氧化矽薄膜 41.. .探針尖端 42.. .電路系統 43.. .電介質薄膜 44.. .通孔 45.. .電路跡線 51.. .探針 5 2...基板 53…材料 54…薄片 60…探針 61…導板 62…導板 元件標號對照 65.. .斜度 66.. .桿件 67.. .探針尖端 68.. .底電極 69.. .基板 71.. .彈性電纜線 72.. .探針尖端 73.. .電纜線黏著劑 74…基板 81.. .探針尖端 83…薄彈簧片 84.. .接觸襯墊 85.. .桿件86.. .電極 87.. .電路跡線 88.. .通孔 89…基板 91.. .探針尖端 92…接地的平面蓋板 93…薄彈簧片 94.. .接觸襯墊 95.. .桿件 (請先Μ讀背面之沒意事碩再填寫本頁) r ---- 11 訂* —---1 —於 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 26 經濟部智慧財產局員工消費合作社印f A7 ____B7 五、發明說明（24 ) 63...探針尖端 96...電極 97...電路跡線 126...接觸襯塾 98A...電介質層 127...桿件 98B…電介質層 131...探針尖端 99…基板 133...薄彈簧片 101...探針尖端 134...接觸襯墊 103...薄彈簧片 135...桿件 104...接觸襯墊 136…接觸襯墊 105...桿件 137...桿件 106...電極 141...探針尖端 10 7...電路跡線 142...薄彈簧片的長部分 108...通孔 143…薄彈簧片的短部分 109...基板 144…接觸襯墊 111...探針尖端 145...橢圓形桿件 112...薄彈簧片的長部分 146...接觸襯墊 113...薄彈簧片的短部分 147...橢圓形桿件 114…接觸襯墊 151...薄彈簧片 115..桿件 152..,角錐 116...接觸襯墊 153...尖銳的頂點 ί 17…桿件 155...薄彈簧片 12]...探針尖端 156...金屬桿件 122薄彈簧Η的長部分 157,薄圊盤 123 ,薄彈簧片的短部分 160 ..薄片彈簧 124..接觸襯墊 i 6 1園形的金屬尖端 ----------------II----------I I (請先Kit背面之;i意事項再填寫本頁) II IF1 » ι_··—»·ι_ |" —麵IT" 謂ι·ϋ, I·1·· _·,Μ*·__|ΙΙ·Ι^ΜΙ_ΙΙ mm滩甲中圈S家標康（CNii) Α4規格（:那、29:·公釐 4 6 10 0 3 經濟部智慧財產局員工消費合作杜印製 A7 __B7 五、發明說明（25 ) 125…桿件 162…金屬桿件 165...薄彈簧片 194...接觸襯墊 166...頂邊緣 195...桿件 167…探針尖端 196...電極 171...探針尖端 197…電路跡線 172…薄彈簧片 198…通孑L 173...波紋 199...基板 174…電極 201…探針尖端 175…桿件 202...彈簧片 176...接觸襯墊 204...接觸襯墊 177...電路跡線 205...支撐桿件 178...通孔 206...電極 179...基板 207...電路跡線 181...探針尖端 209...基板 182...薄彈簧片 211...電介質層 183...波紋 212...金屬層 184...電極 215...支撐桿件 185...桿件 216...電極 186...接觸襯墊 217…接地跡線 18 7...電路系統 221...探針尖端 188...彈性體膠囊密封材料 222...薄彈簧片 189...基板 223...波紋 191...探針尖端 224...接觸襯墊 192...薄彈簧片 225...桿件 <請先Mrt背面之注意Ϋ項再填寫本頁> . — —-----訂---------^ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 28 A： B7 五、發明說明（26 193.. .波紋 226.. .電極 229.. .基板 231.. .電介質薄膜 233…接地電極 235.. .接地電極 236…桿件 241.. .探針尖端 242.. .薄彈簧片 245.. .桿件 246…電極 247.. .電路跡線 249.. .陶瓷基板 251.. .電介質薄膜 253…接地電極 255.. .接地回路 256.. .桿件 257.. .電極 2 5 8.，.電路跡線 259.. .電路系統 I - m n .^1 m n 11 11 I tf n n -*-1-。* n *lt n I (請先Mtt背面之注意事項再填寫本I) 經濟部智慧財產居員工消費合作社印製 ：>9Reproduced by the etched pit: corner cone Π 52) is supported on a thin spring sheet π 5 U ruler§ Applicable to the house standard a K: NS) A4 size, 29 .; ----- t --- Ini— ----- II — (Mako first reads the information on the back of the book and then fills in this. 消费 Consumer cooperation of the Intellectual Property Bureau of the Ministry of Economic Affairs. Printed by the Consumer Cooperative 461003 A: B7___ 5. On the description of the invention (17). The apex (153) of the pyramid (152) sharply has an induction angle of 54.75 degrees between the opposite sides of the pyramid. A hard material is used for the probe tip (152 ), Which is preferably selected from a material combination consisting of molybdenum, nickel, moth, Paliney 7, rhodium, baht, titanium, tungsten, and alloys of the elements therein. The soft contact point of detection 'materials such as starvation, rhodium Tungsten and tungsten are preferred because they react slowly to welding and other soft materials. The probe tips shown in Section 9B 囷 are better for contacting precious metal contact pads. Thin discs ( 157) Supported by a metal rod (156) disposed on the surface of the thin spring (155). The rod (156) is processed by chemical etching. Method to cause over melting and depression to expose the edge of the thin disk (157). The thin disk (157) is made of inert metal and is made of gold, Paliney 7, platinum, rhodium and alloys of the elements The material selection in the material combination is preferred. The probe tip shown in 9C 囷 is preferably used in contact welding and other soft materials. The round metal tip (161) on the metal rod (162) ) Is arranged on the leaf spring (160). The circular gold-brow tip (61) is formed by flash laser melting and high temperature material flowing back into the mold of the sphere section. It is suitable for round metal tip (161) The materials include materials selected from the group consisting of nickel, platinum, rhodium, copper-nickel alloy, beryllium-copper alloy, and Paliney 7. The probe tip shown in Figure 9D is better for contacting small contacts. The pad and the pad closely arranged together. The probe tip (167) having a top edge (166) is arranged on the top surface of the thin spring sheet (165). The probe tip (167) is preferably borrowed By coating the edges with a sacrificial material and then removing the sacrificial material The thin metal part facing down (167) This paper size applies to the national solid standard (CNS > A4 specification (210 X 297 mm)) 20 — — — — — — — — — — — — — — — — II * — — — — — —— i (Please read the notes on the back before filling out this page) Consumption Cooperation between Employees and Intellectual Property Bureau of the Ministry of Economic Affairs. Printed by A7 V. Invention Description (18). Ίο 图 所A third specific embodiment of the probe shown as a flexible one 'One of the elongated thin spring blades (172) provides an enhanced flexibility due to a corrugation (173) in the vertical direction of the thin spring blades (172). Flexible p One or more corrugations can provide the spring leaf (172) to bend and stretch more easily, and the container is more flexible to reflect the vertical force acting on the probe tip (171) = corrugation (1 73) It is copied from an elongated etch pit formed on the crystalline surface of (100) silicon. The method of etching the elongated pits on the silicon surface is well known, and its representative article is "The latest three-dimensional microfabrication manufacturing method of non-isotropic etching of the silicon crystal surface," by Ernest Bass〇us in Journal of the American Society of Electrical and Electronics Engineers Electronic Components,% 丨. £ 〇_ 2: >, > 10.10 (1978) published on page 1184. Corrugated (173) is a metal bar The long axis of the pit is made in the vertical direction. In Figure 10, the electrode (174) on each end of the elongated thin spring sheet (Π2) is combined with a rod (175), which supports the spring on the base plate. (179) The previous predetermined distance < the rod (175) is placed on the contact pad (176), and the circuit system on the substrate (179) is formed by the circuit trace (177) and the through hole (178). Fig. 丨 0. Probe tip ί 7 1.) The rods (each located on each end of the elongated thin spring piece Π 72) are arranged above the thin elastic piece (丨 7 2.).丨 75) There is a pre-distance distance ° The vertical force on the probe tip (17)) causes the thin spring sheet 2 > by the ripple: ί 3 > The elasticity of bending and stretching the mosquitoes is determined by controlling its width so that it will not touch the top of the component under test; .n ** · «Μ · ιι_ I — ,,, , ιΐιΐ mm III · III I «-.nnnwin i» ^ — ~ ---------- * · * ~ *** — ~ * *---, 41¾ A is a national soil of the Laos. Specifications i''K; >: .Κ} Γ Meal: One… One. One · ———— One》 ™ One 'One One—ι One—One Qing. Illllllln — ——-IIIIIII ^ · u IIIIII (Please (Notes on the back of Mit before filling out this page) 461003 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the Invention (19) The fourth embodiment of the flexible probe shown in Figure 11 The circuit system (187) on the surface of the base plate (189) is protected by an elastomer capsule sealant (188), which is lost between the thin spring leaf (182) and the top surface of the base plate (189). The capsule sealant (188 ) Can protect against corrosion and mechanical damage ', while allowing the thin spring leaf (182) to move flexibly when the probe tip (181) is pushed against the contact pad mating on the component under test In a fourth specific embodiment, an elongated thin spring sheet (182) has one or several corrugations (183), and its direction is perpendicular to the long axis direction of the thin spring sheet (182). The spring sheet (182) is by lever The member (185) is supported at a predetermined distance on the base plate (189), and the rod member is combined with an electrode (184) on each end of the elongated thin spring sheet (182). The rod (185) is placed on the contact pad (186), and the circuit trace (187) passes through the through hole (188) and is connected to the circuit system on the substrate (189). Figure 12 A-12C shows a detailed view of the third specific embodiment. A plan view of a structural configuration containing two corrugations (193) "2A® shows a flexible probe 'its probe tip (191) The β spring sheet (192) disposed on the thin elastic sheet (192) is a copper dish alloy film of Monel alloy K-500. The thickness of the thin spring sheet (192) is between 0 and 75 micrometers, and it is more preferably in the range of 25 to 50 micrometers. The thin spring piece (192) has a width between 20 and 150 microns, and is more preferably in the range of 30 to 75 microns. Between the center of mass of the rod (195) at the first end (194) of the thin spring sauce piece (192) and the center of mass of the rod (195) at the second end (194) of the thin spring piece (192) A distance of approximately 200 to 1500 microns. A distance between the centers of mass of the rods from 250 to 750 microns is more preferred. This paper size applies to Chinese national standards < CNS) A4 specifications < 210 X 297 feet) (please read the "unexpected matters on the back side before filling out this page) tn ^ gJI I n IK · 22 Employee consumption cooperation. Social seal A7 ______B7___ V. Description of the invention (20) Figures 12B and 12C show the response of the probe tip (191) under the action of vertical force (F), which shows that the probe is under force (F ) Sectional view before and after the action. As shown in Fig. 12C, the force (F) acting on the probe tip (191) causes the thin spring piece (192) to flex toward the substrate (199). The spring piece (192) flexes and flexes elastically to generate a reaction force to flexibly resist the further deflection of the tip of the needle (191) when the force (F) acts. The corrugation (193) improves the compliance by increasing the extension and bending movement of the spring leaf (192). In particular, the corrugation (193) reduces the tension of the spring leaf (192) and obviously releases the stress caused by the extension of the spring leaf (192). The probe tip (1 91) is connected to a power circuit system for operating the component under test. The probe (191) is connected by a spring piece (192) supported by a rod (195). The rod is combined with the contact pad (194) at both ends of the elongated thin spring piece (192) = the rod (195 ) Is supported on an electrode (196) on the surface of the substrate (199). The electrode (196) is sequentially connected to a circuit trace (197), which is connected to a power circuit system in the substrate (1 99) through a conductive via (198). Optionally, a ground plane can be inserted between the probe tip (191) and the circuit system in the substrate (199) to protect the probe tip (19 丨) from adjacent circuit traces in the substrate (199) The effect of line (197) signal. Figures I3A and I3B show flexible probes, which can provide the low inductance required for the high-efficiency test of the product circuit: Figure 13B shows the cross-sectional view of the flexible probe. The probe tip (2 〇1) The reciprocating ground circuit arranged on the thin spring sheet (202) and used for the signal in the spring sheet (202.) can be provided by a metal layer (212). (2 丨〗) The center is separated from the spring leaf; 202 > Isolate _____ 'Class Applicable to g Gujia ia iCNS > A4 specifications. K m:; ------------------- ------------- install -------- order ---- nn It · line (please fill in the precautions on the back of lait before filling out this purchase) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Industrial Cooperatives 4 b1 0 0 3 A7 __B7___ V. Description of the invention (2) The probe tip (201) The signal and the combined ground loop are connected to their respective circuits in the base plate (209) through a short power line. The probe tip (201) is connected with a supporting rod (205) combined with a contact pad (204) on the spring (202). A rod (205) supported on the electrode (206) is connected to a circuit trace (207) 'which is sequentially connected to a test circuit in the substrate (209). A corresponding ground loop on the electrode (212) is connected to the support rod (215). The rod member (215) supported on the electrode (216) is connected to the ground trace (2) 7), which is sequentially connected to the ground circuit in the substrate (209). Shown on lap 14 is an alternative example of a flexible probe with a ground loop in the 13A and 13B traps. The probe in Fig. 4 is mechanically sturdy because it has an elongated thin spring leaf (222) with corrugations (223) that can release stress, and is directly supported at both ends by rods (225). The probe tip (221) is connected to the test circuit system in the substrate (229). The connection is connected to the substrate (229) through a spring leaf (222), a contact pad (224), a rod (225), and an electrode (226). The test circuit system β) ground electrode (235) is separated from the spring leaf (222) by sandwiching a dielectric film therebetween. The ground circuit is from the ground electrode (235) through the rod (236) to the base plate (229). ) On the ground electrode (233). The ground loop (235) is attached to a separate rod (236), and the rod is attached to the ground electrode (233) on the base plate (229). The ground loop (235) borrows A dielectric film (231) is sandwiched therebetween to isolate it from the spring leaf (222). Figure 15A shows a test head device that includes a flexible probe with a ground loop electrode. The test head provides a Test the components of high-efficiency integrated circuit wafers. The high-efficiency electrical contact on the wafer is connected to this paper standard applicable to SB standards < CNS) A4 regulations (210 X 297 public love) 24, '., --- ,,, -! ΊΙ ----- 装 —i ^-! * ^ (Please read the Wenyi items on the back before filling Page) Intellectual Property Office employee Economic Co-op printed A7 ____B7___ V. Description of the Invention (22) liner, may be connected to a high-speed driving of the wafer into the tester wheel / slot output circuitry. Each probe is connected to the socket (SI, S2, S3, S4, ...) of the wafer tester by a circuit trace (258). The circuit trace is an electrode (257) on the ceramic substrate (249). Terminate everywhere. The test head built on the ceramic substrate (249) provides mechanical and thermal stability. Each flexible probe includes a probe tip (241) disposed on a thin spring plate (242), which is stretched by a rod member (245) a predetermined distance above the surface of the base plate (249). The probe tip (241) can be flexibly moved in a vertical direction to accommodate any difference in height of the contact pads on the wafer while maintaining a firm connection with the contact pads on the wafer. The mechanical operation of the plasticity probe in Fig. 15A can be better understood by referring to the section shown in Fig. 15B. The probe tip (241) is disposed on the thin spring (242). The thin spring includes a ripple (243) to increase the flexibility of the probe. The contact pads (244) on each end of the elongated thin spring (242) are combined with the rod (245). The electrode (246) on the circuit trace (247) supports the rod (245) 'which is connected to the respective circuit trace (258) in the substrate (249) »The flexible probe shown in Fig. 15B 圏 includes a The ground loop (255) on the top side of the spring (242) is isolated from the spring (242) by sandwiching a dielectric film (25i) therebetween. The ground loop (255) is connected to the ground electrode (2 5 3) by a rod (2 5 6). This configuration prevents the mechanical stress in the spring plate (242) from being transmitted to the ground circuit (255). Although several preferred embodiments of the present invention have been described, many modifications and alternative examples will be apparent to those skilled in the art without departing from the spirit and scope of the present invention. ............ 丨 丨 The degree of money is applicable to Zhongguanjialailaicai .. The public issued — ————— I — -----------· ! 1111111 — — — — — — — — — < Please refer to the notes on the reverse side before filling out this page) 4 6 10 0 3 A7 B7 V. Description of the invention (23) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 2 3 ... wafer 24 ... contact pad 25 ... flexible member 26 ... sharp tip 28 ... cantilever 32 ... dielectric film 33 ... electrode 34 ... flexible cable 35 ... contact Pad 40 .. Silicon dioxide film 41 .. Probe tip 42 .. Circuit system 43 .. Dielectric film 44 .. Via 45 .. Circuit trace 51 .. Probe 5 2 ... substrate 53 ... material 54 ... sheet 60 ... probe 61 ... guide plate 62 ... guide plate component reference 65 .. slope 66 .. rod 67 .. probe tip 68 .. bottom electrode 69 .. Substrate 71 .. Flexible cable 72 .. Probe End 73 .. Cable adhesive 74. Substrate 81 .. Probe tip 83. Thin spring sheet 84 .. Contact pad 85 .. Rod 86 .. Electrode 87 .. Circuit trace 88 .. through-hole 89 ... base plate 91 ... probe tip 92 ... grounded flat cover plate 93 ... thin spring piece 94 ... contact pad 95 ... rod (please read the unintended thing on the back first) Please fill in this page again) r ---- 11 Order * ---- 1 — Applicable to China Paper Standard (CNS) A4 (210 X 297 mm) for this paper size 26 Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs f A7 ____B7 V. Description of the invention (24) 63 ... Probe tip 96 ... Electrode 97 ... Circuit trace 126 ... Contact liner 98A ... Dielectric layer 127 ... Rod 98B ... Dielectric layer 131 ... probe tip 99 ... substrate 133 ... thin spring piece 101 ... probe tip 134 ... contact pad 103 ... thin spring piece 135 ... rod 104 ... Contact pad 136 ... contact pad 105 ... rod 137 ... rod 106 ... electrode 141 ... probe tip 10 7 ... circuit trace 142 ... long portion of thin spring leaf 108 ... through hole 143 ... short section of thin spring leaf 109 ... substrate 144 ... contact pad 111 ... probe tip 145 ... elliptical member 112 ... long portion of thin spring plate 146 ... contact pad 113 ... short portion of thin spring plate 147 ... elliptical member 114 ... contact pad 151. .. thin spring piece 115 .. rod 152 .., pyramid 116 ... contact pad 153 ... sharp apex ί 17 ... rod 155 ... thin spring piece 12] ... probe tip 156 ... Metal rod 122 Long part 157 of thin spring ,, Thin 圊 disc 123, Short part of thin spring piece 160 .. Sheet spring 124 .. Contact pad i 6 1 Round metal tip ----- ----------- II ---------- II (please first fill in the back of Kit; please fill in this page) II IF1 »ι_ ·· —» · ι_ | " — 面 IT " It means ι · ϋ, I · 1 ·· _ ·, Μ * · __ | ΙΙ · Ι ^ ΜΙ_ΙΙ mm Sjiajiao Kang (CNii) Α4 specifications (: that, 29: · 公4 6 10 0 3 Consumption cooperation between employees of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by A7 __B7 V. Description of the invention (25) 125 ... rod 162 ... metal rod 165 ... thin spring piece 194 ... contact pad 166 ... top edge 195 ... rod 167 ... probe tip 196 ... electrode 171 ... probe tip 197 ... circuit trace 172 ... thin spring piece 198 ... through hole L 1 73 ... corrugated 199 ... substrate 174 ... electrode 201 ... probe tip 175 ... rod 202 ... spring 176 ... contact pad 204 ... contact pad 177 ... circuit trace 205 ... support bar 178 ... through hole 206 ... electrode 179 ... substrate 207 ... circuit trace 181 ... probe tip 209 ... substrate 182 ... thin spring piece 211. .. dielectric layer 183 ... corrugated 212 ... metal layer 184 ... electrode 215 ... support rod 185 ... rod 216 ... electrode 186 ... contact pad 217 ... ground trace 18 7 ... Circuit system 221 ... Probe tip 188 ... Elastomer capsule sealing material 222 ... Thin spring leaf 189 ... Substrate 223 ... Corrugation 191 ... Probe tip 224 .. .Contact pad 192 ... thin spring piece 225 ... rod < please note this item on the back of Mrt before filling in this page >. — —----- Order -------- -^ This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 28 A: B7 V. Description of the invention (26 193.... Corrugated 226... Electrode 229... Dielectric film 233 ... Ground electrode 235 ... Ground electrode 236 ... Pole 241 ... Probe tip 242 ... Thin spring leaf 245 ... Pole 246 ... Electrode 247. .. Circuit trace 249 .. Ceramic substrate 251 .. Dielectric film 253 ... Ground electrode 255 .. Ground circuit 256 .. Rod 257 .. Electrode 2 5 8 .. Circuit trace 259 .. .Circuit system I-mn. ^ 1 mn 11 11 I tf nn-*-1-. * n * lt n I (please fill out the notes on the back of Mtt before filling in this I) Printed by the Consumers ’Cooperative of Intellectual Property of the Ministry of Economic Affairs: > 9
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW89112201A TW461003B (en) | 2000-06-21 | 2000-06-21 | Connector apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW89112201A TW461003B (en) | 2000-06-21 | 2000-06-21 | Connector apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW461003B true TW461003B (en) | 2001-10-21 |
Family
ID=21660162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW89112201A TW461003B (en) | 2000-06-21 | 2000-06-21 | Connector apparatus |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW461003B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI411074B (en) * | 2009-12-25 | 2013-10-01 | Ind Tech Res Inst | Fine-pitch matrix connectors |
-
2000
- 2000-06-21 TW TW89112201A patent/TW461003B/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI411074B (en) * | 2009-12-25 | 2013-10-01 | Ind Tech Res Inst | Fine-pitch matrix connectors |
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