TW445562B

TW445562B - Wafer identification device capable of simultaneously reading the carved wafer numbers in the cassette and its recognizing method

Info

Publication number: TW445562B
Application number: TW89100312A
Authority: TW
Inventors: Shr-Chiau Lin
Original assignee: Prosys Technology Integration
Priority date: 2000-01-11
Filing date: 2000-01-11
Publication date: 2001-07-11

Abstract

The present invention relates to a wafer identification device and method thereof to read the carved wafer numbers in the cassette simultaneously, especially to a wafer identification device and method thereof to read the carved wafer numbers in the cassette simultaneously when each wafer is still in the cassette. The main structure thereof comprises a wafer processing chamber and a carved number reading chamber. When the cassette loaded with a plurality of wafers is moved into the carved number reading chamber, the carved number portion of each wafer is locked and aligned to the position in the same line by using a rotational axis and a positioning rod. Then, the rotational axis is raised together with the wafers for being rotated to a proper position, and the carved number of each wafer is irradiated directly by a light source, so that its reflected signal is absorbed by a signal receiver. Accordingly, a plurality of carved wafer numbers can be read simply without contamination.

Description

^ 445562 五'發明說明（1) 本發明係置及其辨識方即可同時讀取按’一般便，皆會在其之刻號1 3 ( 第1 A圖所示口 1 9之凹口又，隨著早之毫米級進之保護已愈形否良劣之標準臺搬運之過程^ 445562 Five 'description of the invention (1) The present invention can be read by the system and its identification side at the same time. , With the protection of the early millimeters, the process of handling the standard platform has become more and more bad.

BB 圓片而一 A圖及第2 B 2 1、一承載，Cassette) 圓架2 5内可半導體晶圓片晶圓盒蓋2 1 即可隔離幅塵如同前面離子怖植、氧餘道之製程步有關法，各晶半導適當 1 5 之切晶圓積體步到重要。而間皆般之圖所複數及一裝載 17 在包污染敘述化沉驟過於一種可讀取晶尤指·一種晶圓片圓片刻號之晶圓體晶圓片1 1為位置刻印有批號 )，此有該晶圓面晶圓片1 1 ，片1 7皆有如此電路I C之線寬要現今基本要求之，尤其對幅塵之一般晶圓片由於會利晶圓示者個晶晶圓有複 (當覆整各晶一般積、後，用一 SMIF晶搬運盒，其主圓片1 盒底盤數個（然切面個晶圓圊片1 ，一片製版餘同一晶 2 0 要構 7之 2 7 如2 晶圓架2 7之晶圓刻、圓架圓片刻號之晶圓辨識裝未離開晶圓架之情況下辨識裝置與方法。了可追縱品管及識別方及晶圓號碼等出廠資料片之身份字號一般，如或第1 B圖所示具有凹之刻號。求曰漸趨小，其已於最次微米級，故對晶圓片隔離要求更是晶圓片是製程繁多，故在製程機圓搬運盒來保護複數個 (Pod ； Foup)，如第 2 造係包括有一晶圓盒蓋晶圓架2 5 (或稱晶舟所組合而成，其中該晶 5片）具有凹口 19之片1 1亦然），如此當 5及晶圓盒底盤2 7後機會。片之製程步驟眾多，如或電漿蒸鍍等製程，百 2 5内各晶圊片1 7之BB wafer and an A picture and the second B 2 1. A bearing, Cassette) In the round frame 2 5 can be a semiconductor wafer wafer box lid 2 1 to isolate the dust like the front ion implantation and oxygen remnant. For the process step related method, it is important that each crystal semiconductor is appropriately cut into 15 wafer steps. The number of times in the map and the number of loadings are 17 in the package contamination description. The type of wafer is too readable. In particular, a wafer wafer with a wafer wafer engraved with a wafer number 11 is marked with a lot number on the position.) There are wafers 1 1 and 1 7 on the wafer side, and the line width of the circuit IC must be basically required today, especially for general wafers with large dust. There is a complex (when the crystals are generally stacked and stacked, a SMIF crystal transport box is used, and its main wafer is 1 box with several chassis (of course, a wafer wafer 1 is cut, and one plate is made of the same crystal. 2 7 Such as 2 wafer rack 2 7 Wafer engraving of the 7th, wafer identification of the round frame and the number of wafer identification equipment without leaving the wafer rack identification device and method. It can trace the quality control and identification party and wafer number The identification font size of the factory data sheet is generally, as shown in Figure 1B, it has a concave engraved mark. It is becoming smaller and smaller, and it is at the micron level, so the wafer isolation requirements are even more There are many processes, so round the box to protect multiple (Pod; Foup) in the process machine. The second system includes a wafer box cover and a wafer frame 2 5 (also called a wafer boat, in which 5 crystals are formed), and a wafer with a notch 19 is also 1 1). Opportunities after the chassis 2 7. There are many steps in the process of making wafers, such as plasma or plasma evaporation.

第4頁 ^ 445562 五、發明說明相對位置視維修或後，藉由晶圓片1 如第動作示意取手臂3 處抓取出射鏡3 9 被一訊號之晶圓片號資料及惟，服之缺點 1 •晶幅提高其 2 ·晶響整個流 3 •晶可能性。因此識方法，各晶圓片被汙染及 (2〕及刻追縱一晶 7之 3圖圖， 1之來， 5上擷取放回位置如此號所記錄圓片真正所示該晶拾取然後，再器3 晶圓在常上十刻號所在，係圓辨夾頭利用利用 5所架内常已分不讀取位置為習識裝經變化多次，如此之情形對檢便，故一般需在幾次製程步驟辨識裝置來進行追縱及記錄各用晶圓片置3 0其 3 7將每一片一光源3 3照反射光將晶圓獲取及判讀，，如此即可得刻號讀取辨識裝置之主要係利用一晶圓抓晶圓片1 7從晶圓架射反光支臂3 9之反片1 7上之刻號1 5 之後再將此已判讀過到該晶圓片1 7之刻之晶圓辨識裝置及方法卻存在有幾個難以克圓片從晶圓架内整個移出，不僅不方便，且將大被幅塵污染之機會；圓片一片一片地抓出解讀及記錄，速度太慢，影及圓架内移進移出程時間；圓片在晶，如何設計出一種晶圓片刻可在晶圓刻號之晶損壞之機片未離開晶圓架之圓辨識裝置與方法會，又可節省讀取無形增加其被損壞之號之辨識裝置及其辨情況下即可同時讀取，不僅可降低晶圓片各晶圓片刻號之冗長Page 4 ^ 445562 V. Description of the invention After the relative position is inspected or repaired, the wafer 1 is used to pick up the arm 3 at the 3 position as shown in the first action. The lens 3 9 is received by a signal of the wafer number and information. Disadvantages 1 • The crystal amplitude is increased by 2 • Crystal ringing the entire stream 3 • Crystal possibility. Therefore, according to the identification method, each wafer is contaminated and (2) and engraving 3 of the 7th picture of a crystal, 1 comes, 5 is retrieved and returned to the position so that the wafer recorded by this number is really picked up and then The wafer number of the repeater 3 is usually ten ticks. The system uses a circular discriminating chuck to make use of the unreadable position in the five racks. It has been changed many times for learning. In this case, the inspection will be convenient. The identification device needs to be tracked and recorded in several process steps. Each wafer is set to 3 0 to 3 7 each light source 3 3 to obtain and interpret the wafer according to reflected light, so that the engraved number can be read. The main purpose of the identification device is to use a wafer to grasp the wafer 1 7 and shoot the reflective arm 3 9 from the wafer holder to the reflective sheet 1 7 and the engraved number 15 on the 7 before reading this to the wafer 1 At the moment of the wafer identification device and method at 7th, there are several difficult to remove the wafer from the wafer rack, which is not only inconvenient, but also the chance of being polluted by the large amount of dust; the wafer is grasped and interpreted one by one. Recording, the speed is too slow, and the moving time of the shadow and the circular frame; Crystal, how to design a circle identification device and method that can be damaged on the wafer with the crystal of the wafer number on the wafer without leaving the wafer frame, and can save the identification device that reads the invisible increase of the damaged number and It can be read at the same time under the condition of discrimination, which can not only reduce the length of each wafer number of the wafer.

HR 第5頁 Λ d556 2 五、發明說明（3) 時間功效，長久以來一直是使用者殷切盼望及本發明人念茲在茲者，而本發明人基於多年從事於半導體製程元件相關產製品之研究、開發、及銷售之實務經驗，乃思及改良之意念，窮其個人之專業知識，經多方研究設計、專題探討，終於研究出一種可讀取晶圓片刻號之晶圓辨識裝置及其辨識方法。爰是本發明之主要目的，在於提供一種可讀取晶圓片刻號之晶圓辨識裝置及其辨識方法，利用刻號讀取室之轉動軸、定位桿及光學辨識器之助，而可讓各晶圓片在未離開晶圓架之情況下即可被判讀並記錄刻號資料，故可有效降低晶圓片被幅塵污染之機會，以維護其南品質之要求。本發明之次要目的，在於提供一種可讀取晶圓月刻號之晶圓辨識裝置及其辨識方法，在晶圓架内之各晶圓片可在同時一次即被判讀及記錄所有刻號資料，而無需一片一片進行解讀之工作，故可有效降低習用解讀並記錄晶圓片刻號所需之冗長時間。本發明之又一目的，在於提供一種可讀取晶圓片刻號之晶圓辨識裝置及其辨識方法，在各晶圓片未離開晶圓架之情況下即可同時被判讀並記錄其刻號資料，故可有效降低晶圓片移進移出晶圓架時被損誨之機會，以提升產品良率。茲為使貴審查委員對本發明之結構特徵及所達成之功效有更進一步之瞭解與認識，謹佐以較佳之實施例圖及配合詳細之說明，說明如后：HR Page 5 Λ d556 2 V. Description of the invention (3) The time effect has long been the eager expectation of the user and the inventor of the present invention, and the inventor is based on many years of experience in semiconductor product related products. The practical experience of research, development, and sales is to think about and improve ideas, and to lack his personal expertise. After many research and design and special discussions, he finally developed a wafer identification device that can read the wafer engraving number and its identification. Identification method. Is the main object of the present invention, which is to provide a wafer identification device capable of reading the engraved number of a wafer and an identification method thereof. With the help of a rotating shaft, a positioning rod and an optical identifier of the engraved reading room, Each wafer can be read and recorded without leaving the wafer rack, so it can effectively reduce the chance of wafer contamination by web dust to maintain its quality requirements. A secondary object of the present invention is to provide a wafer identification device capable of reading the month number of a wafer and a method for identifying the same. Each wafer in a wafer rack can be read and recorded all the numbers at one time. Data, without the need to read one by one, so it can effectively reduce the long time required for conventional interpretation and recording of the wafer number. Another object of the present invention is to provide a wafer identification device capable of reading the wafer number and a method for identifying the same, and each wafer can be read and recorded simultaneously without leaving the wafer rack. Data, so it can effectively reduce the chance of being damaged when wafers are moved in and out of the wafer rack to improve product yield. In order to make your reviewing members have a better understanding and understanding of the structural features and achieved effects of the present invention, I would like to accompany the drawings of the preferred embodiment and the detailed description, as explained below:

明一較佳實本發明構造 0 ，其中該 7 ，而開口然，開口 5 7 ，但卻必内還設有一施例晶係包括晶圓處 5 7之 7之大須小於升降平之晶圓片7 3的晶經由開口 5 7而進 0之頂端尚設有一之檢知感測器5 3 ，兩道6 否為設有適當學辨一個動軸可藉 5、門6 ^45562 五、發明說明（4) 首先，請參閱第5 A圖，係為本發圓辨識裝置之構造剖視圖；如圖所示，有一晶圓處理室5 0及一刻號讀取室6 理室5 0之頂端設有一可密封之開口 5 上方則是可置放晶圓傳送盒之位置，當小必須大於晶圓架7 5及晶圓盒底盤7 晶圓盒蓋7 1 ;在其晶圓處理室50室台5 5 ，其可承載内包括有凹口 7 35 圓架7 5及晶圓盒底座7 7 ，致使其可出晶圓處理室5 0 ;而在晶圓處理室5 可偵測判斷晶圓傳送盒是否已到達定位至於，刻號讀取室6 0則位於晶圓處理室5 0之者間具有一大小高度足以讓整個晶圓架7 5通過 2 5 ，通道6 2 5邊則設有一可控制該通道6 2 封閉或開啟態樣之閥門6 2 ，而刻號讀取室6 0 一可萬向或定位轉動之晶圓架抓取手臂6 3 ，另位置設有一包括有光源6 7 5及訊號擷取器6 7 識器、一位於承載平台6 5之定位桿6 5 3 、及可帶動晶圓架7 5内各晶圓片7 3同時轉動功效 6 5 5 ;又在該刻號讀取室6 0内底側還可固設連線（未顯示）而控制晶圓架抓取手臂6 3 、光源訊號擷取器67、轉動軸655 、升降平台55 2動作之微處理器6 1 。旁側之通 5是内固内壁之光至少之轉有一 6 7 及閥It is better to realize the structure 0 of the present invention, in which the 7 is opened, and the opening is 5 7, but there is also an example in which the crystal system including the wafer 5 to 7 must be smaller than the flat wafer. A crystal of 7 3 enters 0 through the opening 5 7 and a detection sensor 5 3 is provided at the top. Two 6 can be borrowed if there is a moving shaft. 5. Door 6 ^ 45562 5. Description of the invention (4) First, please refer to FIG. 5A, which is a cross-sectional view of the structure of the present circle identification device; as shown in the figure, a wafer processing chamber 50 and a tick reading chamber 6 Above the sealable opening 5 is the position where the wafer transfer box can be placed. When it is small, it must be larger than the wafer rack 7 5 and the wafer box chassis 7 and the wafer box cover 7 1; in its wafer processing room 50 chamber table 5 5, which can carry a notch 7 35 round frame 7 5 and a wafer box base 7 7 so that it can exit the wafer processing chamber 50; and the wafer processing chamber 5 can detect and judge the wafer transfer box As to whether it has been positioned, the engraving reading room 60 is located between the wafer processing rooms 50 and has a size sufficient to allow the entire wafer rack 7 5 through 2 5, a channel 6 2 is provided on the side of the channel 6 2 5 to control the closed or opened state of the channel 6 2, and the engraving reading room 60 is a wafer holder which can be swiveled in a universal or positioning manner. The arm 6 3 is provided with a light source 6 7 5 and a signal picker 6 7 at another position, a positioning rod 6 5 3 located on the carrying platform 6 5, and each wafer in the wafer holder 7 5 can be driven. 7 3 Simultaneous rotation effect 6 5 5; At the bottom of the engraving reading room 60, a connection (not shown) can be fixed to control the wafer frame grasping arm 6 3, light source signal acquisition device 67, The microprocessor 6 1 which rotates the shaft 655 and the lifting platform 55 2 operates. The side pass 5 is the light of the inner wall and the at least one of the 6 and the valve

第7頁五、發明說明（5) 另外，在晶圓辨識器之外側還設有一可顯示晶圓辨識器内部作業情形及微處理器6 1内部所儲存刻號數字等資料之監視器6 9 ，當然，該監視器6 9亦可作為操作者與微處理器6 1間之溝通橋樑。雖然，在此較佳實施例中顯示之轉動軸6 5 5及定位桿6 5 3係為水平設置者，但其設置位置並非一定，其主要係配合晶圓架抓取手臂6 3控制晶圓架7 5最後所處之位置而定，故其亦可設計為垂直或呈一角度而斜向設置者皆可。再者，煩請參閱第4圖及第5A圖至第5G圖，係分 γ 別為本發明一較佳實施例之流程圖及各製程步驟構造剖視圖：如圖所示，本發明同時讀取各晶圓片刻號之方法，其主要步驟如下· 步驟40 1 ，當晶圓傳送盒送至晶圓處理室50之頂端後，檢知感測器5 3將偵測得知已有一彼晶圓片7 3需要被判讀及記錄其刻號和位置，故會將此訊息通知微處理器 6 1;Page 7 V. Description of the invention (5) In addition, on the outside of the wafer identifier, a monitor capable of displaying the internal operation of the wafer identifier and the microprocessor 6 1 is stored. 6 9 Of course, the monitor 69 can also serve as a communication bridge between the operator and the microprocessor 61. Although the rotating shaft 6 5 5 and the positioning rod 6 5 3 shown in this preferred embodiment are horizontally set, their setting positions are not fixed, and they are mainly used to cooperate with the wafer holder grasping arm 6 3 to control the wafer. The position of the rack 7 5 depends on the last position, so it can also be designed to be installed vertically or at an angle. Furthermore, please refer to FIG. 4 and FIG. 5A to FIG. 5G, which are respectively a flowchart of a preferred embodiment of the present invention and a sectional view of each process step structure: as shown in the figure, the present invention reads each The method of engraving the wafers is as follows: Step 40 1. After the wafer transfer box is sent to the top of the wafer processing chamber 50, the detection sensor 5 3 will detect that there is another wafer 7 3 needs to be read and recorded its engraving and location, so it will notify the microprocessor 6 1 this message;

第8頁 ί；hA4556 2 五、發明說明（6) 7 5連同各晶 6 5上端，如步驟4 3 4 轉一適當角度 9 0度及下降力作用而讓其 3 ，如第5 D 步驟4 0 4 ，並藉此帶動凹口 7 3 5轉晶圓片7 3之圓片7 3將會轉動直而同處步驟 3將受刻號7 G圖所步驟動，其刻號7 7所讀第5 G 步驟至每一一直線 4 0 5 到推壓 3 7之示； 4 0 6 光源6 3 7所取，並圖所示 4 0 7 圓片7 3移第5 B圖及 ’晶圓架抓及調整其高高度，致使邊緣確實觸圊所示；，微貪理器各晶圓片7 至定位桿6 重力下降而因卡合受限晶圓片7 3 位置為止，，微微升起同時升起一部分面積將，刻號讀取 7 5所發射在之位置，將此反射訊位至刻號處理室6 0之承載平台第5 C圊所示；取手臂6 3將連同晶圓架7 3再度，如在此實施例中係垂直轉動各晶圓片7 3可利用其本身之重接於轉動軸6 5 5及定位桿6 5 6 1控制轉動軸6 5 5開始轉動 3同時轉動，當各晶圓片7 3之 53處時，定位桿653將會因卡陷至凹口 7 3 5内，如此該晶而不再轉動，而轉動軸6 5 5將之凹口 7 3 5皆因定位桿6 5 3 如第5E圖及第5F圖所示；轉動軸6 5 5 ，如此各晶圓片7 定之高度，致使其刻印有晶圓片裸露於晶圓架7 5外側，如第5 室6 0内之光學辨識裝置開始啟出之光線將直接照射於各晶圓片而其反射訊號將被訊號擷取器6 號傳至微處理器6 1中處理，如微處理器6 1接收並判讀及記錄來自訊號Page 8; hA4556 2 V. Description of the invention (6) 7 5 together with the upper end of each crystal 65, as shown in step 4 3 4 turn to an appropriate angle of 90 degrees and the force of the falling force to make it 3, as in step 5 D step 4 0 4 and drive the notch 7 3 5 to the wafer 7 3 of the wafer 7 3 will rotate straight and the same place. Step 3 will be moved by the steps of the engraved figure 7 G, which is read by the engraved number 7 7 Step 5 G to each line 4 0 5 to push 3 7 shown; 4 0 6 light source 6 3 7 taken, and shown in the picture 4 0 7 wafer 7 3 move to the 5B picture and 'wafer rack Grasp and adjust its height so that the edges do indeed touch the display;, the wafers 7 of the microgrid to the positioning rod 6 drop in gravity and the wafers 7 3 are restricted due to the engagement, slightly raised at the same time Raise a part of the area, read the position where the engraved number 7 5 is emitted, and send the reflected signal to the 5th C 圊 of the bearing platform of the engraved processing room 60; take the arm 6 3 together with the wafer rack 7 3 Once again, as in this embodiment, each wafer 7 is rotated vertically. 3 It can use its own weight to connect to the rotation axis 6 5 5 and the positioning rod 6 5 6 1 to control the rotation axis 6 5 5 to start rotation. 3 rotate at the same time, when each wafer 53 is 53, the positioning rod 653 will be trapped in the notch 7 3 5 so that the crystal will no longer rotate, and the axis 6 5 5 will notch 7 3 5 is because the positioning rod 6 5 3 is shown in FIG. 5E and 5F; the axis 6 5 5 is rotated so that each wafer 7 is set at a height such that the wafer is engraved with the wafer exposed on the wafer rack 7 5 On the outer side, the light from the optical identification device in the 60th room 60 starts to shine directly on each wafer and the reflection signal will be transmitted to the microprocessor 61 by the signal picker 6 for processing, such as micro The processor 6 1 receives and interprets and records signals from

第9頁 ► 445552 五、發明說明（7) 擷取器6 7内之各晶圓片7 3相對所在位置及刻號7 3 7 資料；步驟4 0 8 ，轉動輪6 5 5下降至原先位置，換言之，讓各晶圓片7 3回至晶圓架7 5内原本位置，如第5D圖所示；及步驟4 0 9 ，晶圓架抓取手臂6 3將晶圓架7 5由刻號讀取室6 0經由通道6 2 5移至晶圓處理室5 0之晶圓盒底盤77上，且升降平台5 5將晶圓架7 5及晶圓盒底盤 7 7上升至晶圓處理室5 0頂端，而與該晶圓盒蓋7 1結合，如第5A圖及第5 B圖所示。另外，在此實施例中係假設晶圓片7 3之刻號係印刻在凹口 7 3 5之對角位置，若情況不是如此時，則在步驟 4 0 4之後還需另加一步驟4 4 5 :微微升起轉動軸6 5 5 ，致使各晶圓片7 3脫離定位桿6 5 3之卡合，之後轉動軸6 5 5繼續帶動各晶圓片7 3轉動至一適合各晶圓片 7 3刻號被擷取訊號之位置。又，為了讓各晶圓片7 3不管係在晶圓架7 5内部或部分裸露晶圓架在外之情況，該轉動軸6 5 5在步驟4 0 5或步驟4 4 5升起時亦可以一斜角角度斜斜升起，如此各晶圓片7 3將以不同之高度陳列，如此更可讓刻號讀取室6 0之光源6 7 5照射及訊號擷取器6 7讀取訊號。又，在此較佳實施例中係以轉動軸6 5 5及定位桿6 5 3為水平態樣來討論，在本發明同樣精神態樣下，其實轉動軸6 5 5及定位桿6 5 3亦可呈現垂直之縱向方位，Page 9 ► 445552 V. Description of the invention (7) Relative position of each wafer 7 3 in the extractor 6 7 and the engraved number 7 3 7 Data; Step 4 0 8, the rotating wheel 6 5 5 descends to the original position In other words, the wafers 73 are returned to the original positions in the wafer rack 75, as shown in FIG. 5D; and in step 409, the wafer rack grasping arm 6 3 engraves the wafer rack 75 The reading room 60 is moved to the wafer box chassis 77 of the wafer processing chamber 50 through the passage 6 2 5 and the lifting platform 5 5 raises the wafer rack 7 5 and the wafer box chassis 7 7 to wafer processing. The top of the chamber 50 is combined with the wafer cassette cover 71, as shown in Figs. 5A and 5B. In addition, in this embodiment, it is assumed that the engraving number of the wafer 7 3 is printed on the diagonal position of the notch 7 3 5. If this is not the case, an additional step 4 is required after step 4 0 4 4 5: Slightly raise the rotating shaft 6 5 5, causing each wafer 7 3 to be disengaged from the positioning rod 6 5 3, and then the rotating shaft 6 5 5 continues to drive each wafer 7 3 to a position suitable for each wafer. Film 7 The position where the 3 tick marks were captured. In addition, in order to allow each wafer 7 3 to be inside or partially exposed of the wafer rack 7 5, the rotating shaft 6 5 5 may be raised when step 4 0 5 or step 4 4 5 is raised. An oblique angle rises obliquely, so that each of the wafers 7 3 will be displayed at different heights, so that the light source 6 7 5 of the engraving reading room 6 7 5 and the signal acquisition device 6 7 can read the signal. . Also, in this preferred embodiment, the rotating shaft 6 5 5 and the positioning rod 6 5 3 are discussed as horizontal states. In the same spirit of the present invention, the rotating shaft 6 5 5 and the positioning rod 6 5 3 are actually discussed. Can also present a vertical vertical orientation,

第10頁 \ 五、發明說明（8) 如此當第5 C圖所示之晶圓架7 5移入刻號讀取室6 0時，轉動軸6 5 5及定位桿6 5 3可立即移位去觸接到各晶圓片7 3之周緣，再繼續進行同上所述之後續步驟，亦可達到讀取晶圓刻號之目的。另外，若本發明之光源6 7 5及訊號擷取器6 7相對位置設計得當，步驟4 0 5其實亦可省略；換言之，各晶圓片7 3在轉動至刻號7 3 7到達同一直線位置後，於未離開晶圓架7 5之情況下即可直接被光源6 7 5所照射及訊號擷取器6 7獲取反射光源訊號。最後，請參閱第6圖，係為本發明之又一實施例構造剖視圖；在符合本發明精神之情況下，本發明亦可用於未設有SM I F環境、一半自動機械化、或一非密閉空間之刻號讀取構造場合中。更明確而言，前述步驟4 0 1至步驟4 0 3動作可利用人工直接搬運來替代晶圓抓取手臂之定位功能，待轉動軸6 5 5帶動晶圓片7 3轉動、定位桿6 5 3致使凹口 7 3 5對齊定位、設於上緣固定壁8 0之光源 6 7 5照射刻號位置、及訊號擷取器6 7讀取辨識其刻號資料後，再同樣以人工方式替代步驟4 0 8至步驟4 0 9 將其裝載有各晶圓片7 3之晶圓架7 3搬離刻號讀取室6 0 ，如此亦可達到前述之功效及目的。綜上所述，一種晶圓片刻號之辨識裝置及其辨識方法，可在晶圓片未離開晶圓架之情況下而同時讀取各晶圓片之刻號，不僅可降低晶圓片被汙染及損壞之機會，又可節省讀取各晶圓片刻號之冗長時間供效。故本發明實為一具Page 10 \ V. Description of the invention (8) So when the wafer holder 7 5 shown in Fig. 5C is moved into the marking reading room 60, the rotating shaft 6 5 5 and the positioning rod 6 5 3 can be immediately displaced. To touch the periphery of each wafer 73, and then continue the subsequent steps as described above, the purpose of reading the wafer engraving can also be achieved. In addition, if the relative positions of the light source 6 7 5 and the signal picker 67 are properly designed, step 4 5 can actually be omitted; in other words, each wafer 7 3 is rotated until the engraved marks 7 3 7 reach the same straight line. After the position, the light source 6 7 5 can be directly irradiated and the signal picker 67 can obtain the signal of the reflected light source without leaving the wafer rack 7 5. Finally, please refer to FIG. 6, which is a sectional view of the structure of another embodiment of the present invention. In the case of conforming to the spirit of the present invention, the present invention can also be used in the environment without SM IF, semi-automatic mechanization, or a non-closed space. The tick mark is read in the construction occasion. More specifically, the aforementioned steps 401 to 403 can be replaced by the manual positioning function of the wafer grasping arm. The axis 6 5 5 will rotate the wafer 7 3 and the positioning lever 6 5 3 causes the notch 7 3 5 to be aligned and positioned, the light source 6 7 5 located on the upper edge fixed wall 8 0 5 irradiates the position of the engraving mark, and the signal extractor 6 7 reads and identifies the engraving data, and then replaces it manually. In steps 408 to 409, the wafer holder 7 3 on which each wafer 7 3 is loaded is removed from the engraving reading room 60, so that the aforementioned effects and purposes can also be achieved. In summary, a device and method for identifying a wafer chip number can simultaneously read the number of each wafer without leaving the wafer rack, which can not only reduce the wafer The chance of contamination and damage can also save the time and efficiency of reading the wafer number. Therefore, the present invention is indeed a

第11頁〇562 五、發明說明（9) 有新穎性、進法專利申請要局早日賜准專惟以上所非用來限定本口晶圓片為實又，本發明雖說明，但本發 )，故舉凡依徵及精神所為請專利範圍内 (一）圖式簡第1 A圖：係第1 B圖：係第2 A圖：係第2 B圖：係第3圖：係習第4圖：係本第5 A圖至第造剖第6圖：係本 (二）圖號簡 11 晶圓 17 晶圓步性及可供產業上利用者，應符合我國專利件無疑，爰依法提出發明專利申請，祈鉤利，至感為禱。述者，僅為本發明之一較佳實施例而已，並發明實施之範圍，例如，雖然本發明皆以凹施例說明，但同樣亦可適用於切面晶圓片；然係以8"晶圓之晶圓傳送盒（Pod)為實施例明亦同樣適用於12"晶圓之晶圓傳送盒（Foup 本發明申請專利範圍所述之形狀、構造、特之均等變化與修飾，均應包括於本發明之申〇單說明：一般晶圓片之上視圖；另一種晶圓片之上視圖；一般晶圓傳送盒之分解示意圖；第2A圖所示晶圓傳送盒之立體分解圖；用晶圓片刻號讀取辨識裝置之動作示意圖；發明晶圓片刻號讀取辨識方法之流程圖； 5 G圖：係本發明一較佳實施例之各步驟構視圖；及發明又一實施例之構造剖視圖。單說明：片 1 3 刻號片 1 5 刻號Page 11 〇562 V. Description of the invention (9) There is novelty and the patent application must be approved by the Bureau as soon as possible. However, the above is not used to limit the wafers of this port. Although the present invention is described, the present invention ), So the examples of Fan Yizheng and the spirit are within the scope of patent application (1) Schematic diagram 1 A: Department 1 B: Department 2 A: Department 2 B: Department 3: Department 2 Figure 4: Figure 5A to Section 6 of the book: Figure (2) Figure No. 11 Wafer 17 Wafer step and available for industrial use should be in line with China's patents, no doubt, according to law File an application for an invention patent, pray for benefits, and pray for it. The description is only one of the preferred embodiments of the present invention, and the scope of the invention's implementation. For example, although the present invention is described by a concave embodiment, it can also be applied to cut wafers; The round wafer transfer box (Pod) is an example, and it is also applicable to 12 " wafer wafer transfer boxes (Foup) The shapes, structures, and special changes and modifications described in the scope of the present invention patent application should include Explanation of the application form of the present invention: a general top view of a wafer; another top view of a wafer; an exploded view of a general wafer transfer box; a three-dimensional exploded view of the wafer transfer box shown in FIG. 2A; Schematic diagram of the operation of the device for reading and identifying wafer chip marks; a flowchart of the method for reading and identifying a wafer chip mark; FIG. 5G: a view showing the steps of a preferred embodiment of the present invention; and another embodiment of the invention Sectional view of construction. Single description: slice 1 3 engraved slice 1 5 scribed

Η 第12頁 Λ45562 五、發明說明αο) 3 0 晶圓辨識裝置 2 1 晶圓盒盍 2 7 晶圓盒底盤 3 3 光源 3 5 訊號擷取器 3 3 3 6 6 6 6 6 7 7 7 9 0 5 1 3 5 7 9 5 3 7 1 2 5 5 5 5 7 5 1 3 5 5 0 晶圓傳送盒晶圓架晶圓抓取手臂透鏡拾取夾頭反射鏡檢知感測器開口微處理器通道承載平台轉動軸光源晶圓盒蓋凹口晶圓架刻號讀取構造12 Page 12 Λ45562 V. Description of the invention αο) 3 0 Wafer identification device 2 1 Wafer box 2 7 Wafer box chassis 3 3 Light source 3 5 Signal picker 3 3 3 6 6 6 6 6 7 7 7 9 0 5 1 3 5 7 9 5 3 7 1 2 5 5 5 5 7 5 1 3 5 5 0 wafer transfer box wafer rack wafer grip arm lens pickup chuck mirror detection sensor opening microprocessor Channel carrying platform rotation axis light source wafer box cover notch wafer frame engraving reading structure

Η 3 9 反光支臂 5 0 晶圓處理室 5 5 升降平台 6 0 刻號讀取室 6 2 閥門 6 3 晶圓架抓取手臂 653 定位桿 6 7 訊號擷取器 6 9 監視器 7 3 晶圓片 7 3 7 刻號 7 7 晶圓盒底盤 8 5 固定壁第13頁Η 3 9 Reflective arm 5 0 Wafer processing chamber 5 5 Lifting platform 6 0 Mark reading chamber 6 2 Valve 6 3 Wafer holding arm 653 Positioning rod 6 7 Signal picker 6 9 Monitor 7 3 Crystal Wafer 7 3 7 Engraved 7 7 Wafer box chassis 8 5 Fixed wall 第 13 页

Claims

Λ45562 六、申請專利範圍一種可同時讀取晶圓架内晶圓片刻號之晶圓辨識置，其主要係由一刻號讀取構造及一微處理器所組合而成，其中該刻號讀取構造係包括有：一承載平台，用以置放一内部承載有複數個晶圓片之晶圓架；動軸，設於承載平台上，當晶圓架放置定位接於每一晶圓片之外徑邊緣，並受控於該微而帶動每一晶圓片轉動；，設於承載平台上，可觸接於每一晶圓片之緣，且在晶圓片轉動後適時卡合於每一晶圓口位置；固設於刻號讀取構造中之一固定壁上，可投以照射於各晶圓片之部分面積；及取器，相對於該光源設置，而可擷取來自各之反射光線訊號，並將此訊號藉由連線而傳微處理器中處理及記錄者。利範圍第1項所述之晶圓辨識裝置，其中該構造之各元件係組合於一開放空間内。利範圍第1項所述之晶圓辨識裝置，其中該構造之各元件係組合於一密閉空間之刻號讀利範圍第3項所述之晶圓辨識裝置，其中該室内側邊尚設有一可讓該晶圓架進出之通道道邊設有一可控制該通道是否封閉態樣之閥至少一轉後可觸處理器一定彳立桿外徑邊片之凹一光源， 2 4 射光線一訊號擷晶圓片輸至該如申請專刻號讀取如申請專刻號讀取取室内。如申請專刻號讀取，且在通Λ45562 6. Scope of patent application A type of wafer identification device that can simultaneously read the engraved number of wafers in a wafer rack. It is mainly composed of a engraved number reading structure and a microprocessor, where the engraved number is read. The structure system includes: a loading platform for placing a wafer rack carrying a plurality of wafers inside; a moving shaft provided on the loading platform, and when the wafer rack is positioned and connected to each wafer The outer diameter edge is controlled by the micro and drives each wafer to rotate; It is set on the bearing platform and can touch the edge of each wafer, and it can be engaged with each of the wafers in time after the wafer is rotated. A wafer mouth position; fixed on a fixed wall in the engraved reading structure, which can be irradiated to a part of the area of each wafer; and a picker, which is arranged relative to the light source, and can be captured from each The reflected light signal is transmitted to the processor and recorded in the microprocessor through the connection. The wafer identification device according to the first item of the invention, wherein the components of the structure are combined in an open space. The wafer identification device according to item 1 of the profit range, wherein the components of the structure are combined in a sealed space. The wafer identification device according to item 3 of the read range, wherein a side of the room is also provided with a A channel that allows the wafer rack to enter and exit is provided with a valve that can control whether the channel is closed or not. After at least one revolution, it can touch the processor. A concave light source with a certain diameter on the outside diameter of the pole. A light source emits a signal. The fetched wafer is input to the room where the special engraving number is applied for reading. If you want to read the special engraved number, and

mm

第14頁 445562 六、申請專利範圍 5 ·如申請專有一晶圓 6 78 10 設有該晶承載對晶圓架如申晶圓如申括有如申轉動如申轉動如申轉動一可圓架該晶圓處抓取請專處理請專一設請專軸與請專轴係請專軸與利範處理密封之晶圓傳理室手臂利範室之利範於晶利範定位利範可以利範定位圍第3項所述之晶圓辨識裝室，位於該刻號讀取室之旁之開口，並於開口上方可置圓傳送盒，而在晶圓處理室送盒内部之晶圓架升降之升而於刻號讀取室内固設有一圍第頂端圍第圓辨圍第桿係圍第一斜圍第桿係 5項所述之晶圓辨識裝尚可設有至少一檢知感 1項所述之晶圓辨識裝識裝置外之監視器。 1項所述之晶圓辨識裝水平放置者。 8項所述之晶圓辨識裝向角度而升起者。 1項所述之晶圓辨識裝與該承載平台呈現垂直置，尚包括側，其頂端放一包括有内設有一可降平台，相可轉動之晶置，其中該測器。置，尚可包置，其中該置，其中該置，其中該態樣置放者 11 12 如申請專利範圍第1 0項所述之晶圓辨識裝置，其中該轉動軸係可以一斜向角度而斜擺者。一種可藉由申請專利範圍第5項所述晶圓辨識裝置以同時讀取晶圓片刻號之晶圓辨識方法，其主要步驟係包括有：Page 14 445562 VI. Application for Patent Scope 5 · If applying for a proprietary wafer 6 78 10 The wafer carrier is equipped with a wafer holder. If a wafer is applied, it is rotated as required. If it is rotated, it can be rotated. Please pick up the wafer, please handle it specially, please set up the dedicated shaft and the dedicated shaft system, please use the dedicated shaft and Lee Fan to handle the sealed wafer handling room. The wafer identification installation room described above is located at the opening beside the engraving reading room, and a round transfer box can be placed above the opening, and the wafer rack inside the wafer processing box delivery box is raised and lowered to the engraving mark. The reading room is fixed with a first top circle, a round disc, a rod system, a first slant system, and a bar as described in item 5. The wafer identification device can still be provided with at least one wafer as described in item 1. Identify monitors outside the device. The wafer identification device described in item 1 is horizontally placed. The wafer identification mounting angle described in item 8 is raised. The wafer identification device described in item 1 is perpendicular to the loading platform, and still includes a side. The top of the wafer identification device is provided with a lowerable platform and a phase-rotatable crystal structure, among which the detector. The wafer identification device described in item 10 of the scope of patent application, wherein the rotation axis can be an oblique angle And the oblique. A wafer identification method capable of simultaneously reading the wafer engraving number by using the wafer identification device described in Item 5 of the scope of patent application, the main steps include:

第15頁 ΛΛ5562 六、申請專利範圍 a. 利用晶圓處理室内之升降平台將晶圓傳送盒内之晶圓架下降至一適當高度位置； b. 刻號讀取室之晶圓架抓取手臂將晶圓架由晶圓處理室經由通道移至刻號讀取室内，且讓刻號讀取室内之定位桿及轉動軸確實觸接晶圓架内各晶圓片之邊緣； c. 轉動軸開始帶動各晶圓片轉動，而各晶圓之凹口轉至定位桿處時即因卡合受限而不再轉動，直至每一晶圓片之凹口皆因定位桿而同處於一直線位置為止； d. 刻號讀取室内之光源開始投射光線至各晶圓片部分面積上，而訊號擷取器則擷取各晶圓片反射而至的各刻號訊號； e. 微處理器接收並判讀及記錄來自訊號擷取器内之各晶圓片所在位置及刻號訊號； f ·晶圓架抓取手臂將晶圓架由刻號讀取室經由通道移至晶圓處理室之升降平台上；及 g.升降平台將晶圓架上升至晶圓處理室頂端，並與放置其上之晶圓盒蓋結合。 1 3 *如申請專利範圍第1 2項所述之晶圓辨識方法，其中在步驟a.中亦可包括下列步驟： —設於晶圓處理室上之檢知感測器將偵測到晶圓傳送盒已放置完成，故通知微處理器啟動各元件之動作，而升降平台首先即將晶圓架下降至所需高度。Page 15 ΛΛ5562 6. Scope of patent application a. Use the lifting platform in the wafer processing chamber to lower the wafer rack in the wafer transfer box to an appropriate height position; b. The wafer rack grasping arm in the nick reading room Move the wafer rack from the wafer processing chamber to the engraving reading room through the channel, and let the positioning rod and rotation axis in the engraving reading room really contact the edges of each wafer in the wafer rack; c. Rotating axis Began to drive the rotation of each wafer, and when the notch of each wafer was turned to the positioning rod, it was no longer rotated due to the limited engagement, until the notch of each wafer was in the same position due to the positioning rod. D. The light source in the engraving reading room starts to project light onto the area of each wafer, and the signal picker captures the signals of each engraving reflected by each wafer; e. The microprocessor receives It also reads and records the position and the engraved signal of each wafer from the signal picker; f · The wafer rack grasping arm moves the wafer rack from the engraved reading room through the passage to the wafer processing room. On the platform; and g. The lifting platform raises the wafer rack to the crystal The top of the processing chamber, and the wafer in combination with the lid placed thereon. 1 3 * The wafer identification method as described in item 12 of the scope of patent application, wherein the following steps can also be included in step a .:-a detection sensor located on the wafer processing chamber will detect the crystal The circular transfer box has been placed, so the microprocessor is notified to start the actions of each component, and the lifting platform first lowers the wafer rack to the required height.

445562 六、申請專利範圍 1 4 _如申請專利範圍第1 2項所述之晶圓辨識方法，其中在步驟b.中亦可包括下列步驟：晶圓架抓取手臂將晶圓架移至刻號讀取室後，連同晶圓架再轉一角度，致使各晶圓片因為重力作用而讓各晶圓片之邊緣確實觸接該轉動軸及定位桿。 1 5 *如申請專利範圍第1 2項所述之晶圓辨識方法，其中在步驟c .之後亦可包括下列步驟：升起轉動軸，致使各晶圓片凹口脫離定位桿之限制，轉動軸再次帶動各晶圊片轉動，致使各晶圓片之刻號易於被光源照射及訊號擷取器所擷取之最佳位置為止 1 6 ·如申請專利範括下列步驟：再升起轉動轴架外，而其上所擷取反射光 1 7 _如申請專利範步驟c,之後尚水平升起轉動使各晶圓片之號則易於被光 1 8 .如申請專利範步驟c,之後亦以一角度斜向圍第1 5項所述之晶圓辨識方法，尚可包，致使各晶圓片之部分面積裸露於晶圓之刻號則易於被光源照射及訊號擷取器〇圍第1 2項所述之晶圓辨識方法，其中在可包括下列步驟：軸，如此亦帶動各晶圓片水平升起，致部分面積裸露於晶圓架外，而其上之刻源照射及訊號擷取器所擷取反射光。圍第1 2項所述之晶圓辨識方法，其中在可包括下列步驟：升起轉動軸，如此帶動各晶圓片升起成445562 VI. Patent application scope 1 4 _The wafer identification method described in item 12 of the patent application scope, which may include the following steps in step b .: The wafer rack grasping arm moves the wafer rack to the engraving. After the number reading room, and the wafer rack are rotated by another angle, each wafer is actually contacted by the rotation axis and the positioning rod due to gravity. 1 5 * The wafer identification method as described in item 12 of the patent application scope, which may include the following steps after step c .: Raise the rotating shaft, so that the notches of each wafer chip are not restricted by the positioning rod, and rotate The shaft drives the wafers to rotate again, so that the engraved marks on each wafer are easily irradiated by the light source and the optimal position captured by the signal picker. 1 6 · If the patent application covers the following steps: Raise the rotating shaft again Outside the shelf, and the reflected light captured thereon is 1 7 _ if the patent application step c is applied, and then it is raised and rotated horizontally, so that the number of each wafer is easy to be light 1 8. If the patent application step c is used, The wafer identification method described in item 15 obliquely at an angle can still be packaged, so that the part of each wafer is exposed to the engraved number of the wafer, which is easy to be illuminated by the light source and the signal picker. 12. The wafer identification method described in item 2, which may include the following steps: Axis, so that each wafer is raised horizontally, so that part of the area is exposed outside the wafer rack, and the engraved source irradiation and signal on it The reflected light captured by the extractor. The wafer identification method described in item 12 may include the following steps: Raise the rotating shaft, so that each wafer is lifted into

第17頁 445562 六、申請專利範圍不同南度，致使各晶圓片以不同之部分面積裸露於晶圓架外，而其上之刻號則易於被光源照射及訊號擷取器所擷取反射光。 1 9 ·如申請專利範圍第1 2項所述之晶圓辨識方法，其中在步驟e.之後亦可包括下列步驟：微處理器將所得到之資料訊號連線至一設於刻號讀取室外側之監視器上顯像出來。 2 0 · —種可藉由申請專利範圍第1項所述晶圓辨識裝置以同時讀取各晶圓片刻號之晶圓辨識方法，其主要步驟係包括有’· a. 將晶圓架置放於刻號讀取構造之承載平台上，且致使刻號讀取構造内之定位桿及轉動軸確實觸接晶圓架内各晶圓片之邊緣， b. 轉動軸開始帶動各晶圓片轉動，而各晶圓片之凹〇轉至定位桿處時即因卡合受限而不再轉動，直至每一晶圓片之凹口皆因定位桿而同處一直線位置為止 c. 刻號讀取構造之光源開始投射光線至各晶圓片部分面積上，而訊號擷取器擷取各晶圓片反射而至的各刻號訊號； d. 微處理器接收並判讀及記錄來自訊號擷取器内之各晶圓片所在位置及刻號訊號；及 e. 將晶圓架移出該承載平台及刻號讀取構造中。 2 1 ·如申請專利範圍第2 0項所述之晶圓辨識方法，其中在Page 17 445562 6. The application scope of the patent is different in the south, which causes each wafer to be exposed outside the wafer rack with a different area, and the engraved marks on it are easy to be illuminated by the light source and captured by the signal capture device. Light. 1 9 · The wafer identification method as described in item 12 of the patent application scope, which may include the following steps after step e .: The microprocessor connects the obtained data signal to a reading set at the marking It is displayed on the outdoor monitor. 2 0 · —A wafer identification method that can read the number of each wafer at the same time by using the wafer identification device described in the first patent application scope. The main steps include: ·· a. Mounting the wafer Placed on the bearing platform of the engraved reading structure, so that the positioning rod and the rotating shaft in the engraved reading structure do touch the edges of each wafer in the wafer rack, b. The rotating shaft starts to drive each wafer Rotate, and when the recess of each wafer is turned to the positioning rod, it will no longer rotate because the engagement is limited, until the notch of each wafer is at the same line position because of the positioning rod. C. The light source of the reading structure starts to project light onto the partial area of each wafer, and the signal picker captures the signal of each tick reflected by each wafer; d. The microprocessor receives and interprets and records the signal from the signal capture. The location of each wafer in the picker and the engraved signal; and e. Move the wafer rack out of the carrier platform and the engraved reading structure. 2 1 · The wafer identification method described in item 20 of the scope of patent application, wherein

第18頁 445562 六、申請專利範圍步驟b .之後亦可包括下列步驟：升起轉動輛，致使各晶圓片C3 口脫離定位桿之限制，轉動輪再次帶動各晶圓）ΐ轉動至各晶圓片之刻號易於被光源照射及訊號擷取器所擁取反射光之最佳位置為止。 2 2 ·如申請專利範圍第2丨項所述之晶圓辨識方法，尚可包括下列步驟：升起轉動軸，致使各晶圓片之部分面積裸露於晶圓架外’而其上之刻號則易於被光源照射及訊號擷取器所操取反射光。 2 3 .如申請專利範圍第2 〇項所述之晶圓辨識方法，其中在步驟b.之後亦可包括下列步驟：水平升起轉動軸，如此亦帶動各晶圓片水平升起，致使各晶圚片之部分面積裸露於晶圓架外’而其上之刻號則易於被光源照射及訊號裸取器所操取反射光。 24.如申請專利範圍第2 0項所述之晶圓辨識方法，其中在步驟b.之後亦可包括下刿梦锁：以一角度斜向升起轉動轴，如此帶動各晶圓片升起成不同高度，致使各晶圓片以不同之面積大小裸露於晶圓架外，如此刻印在其上之刻號將易於被光源照射及訊號擷取器所擷取。Page 18 445562 VI. Patent Application Step b. After that, the following steps can also be included: Raise the car to make the C3 port of each wafer out of the restriction of the positioning rod, and turn the wheel to drive each wafer again. The engraving of the wafer is easy to be illuminated by the light source and the optimal position of the reflected light held by the signal picker. 2 2 · The wafer identification method described in item 2 丨 of the scope of patent application may further include the following steps: Raise the rotating shaft so that part of the area of each wafer is exposed outside the wafer rack 'and the moment on it The signal is easily irradiated by the light source and reflected by the signal picker. 2 3. The method for identifying a wafer as described in item 20 of the scope of patent application, which may include the following steps after step b .: Raise the rotation axis horizontally, so that each wafer is also raised horizontally, causing each Part of the area of the crystal wafer is exposed outside the wafer frame ', and the engraved marks on it are easily irradiated by the light source and reflected light by the signal extractor. 24. The wafer identification method as described in item 20 of the scope of patent application, wherein after step b., The method can also include the following dream lock: raise the rotation axis obliquely at an angle, so that each wafer is raised At different heights, each wafer is exposed to the outside of the wafer rack with different area sizes. The engraved marks on it will be easily irradiated by the light source and captured by the signal capture device.

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