TW445562B - Wafer identification device capable of simultaneously reading the carved wafer numbers in the cassette and its recognizing method - Google Patents
Wafer identification device capable of simultaneously reading the carved wafer numbers in the cassette and its recognizing method Download PDFInfo
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- TW445562B TW445562B TW89100312A TW89100312A TW445562B TW 445562 B TW445562 B TW 445562B TW 89100312 A TW89100312 A TW 89100312A TW 89100312 A TW89100312 A TW 89100312A TW 445562 B TW445562 B TW 445562B
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Description
^ 445562 五'發明說明(1) 本發明係 置及其辨識方 即可同時讀取 按’一般 便,皆會在其 之刻號1 3 ( 第1 A圖所示 口 1 9之凹口 又,隨著 早之毫米級進 之保護已愈形 否良劣之標準 臺搬運之過程^ 445562 Five 'description of the invention (1) The present invention can be read by the system and its identification side at the same time. , With the protection of the early millimeters, the process of handling the standard platform has become more and more bad.
BB 圓片 而一 A圖及第2 B 2 1、一承載 ,Cassette) 圓架2 5内可 半導體晶圓片 晶圓盒蓋2 1 即可隔離幅塵 如同前面 離子怖植、氧 餘道之製程步 有關 法, 各晶 半導 適當 1 5 之切 晶圓 積體 步到 重要 。 而 間皆 般之 圖所 複數 及一 裝載 17 在包 污染 敘述 化沉 驟過 於一種可讀取晶 尤指·一種晶圓片 圓片刻號之晶圓 體晶圓片1 1為 位置刻印有批號 ),此有該晶圓 面晶圓片1 1 , 片1 7皆有如此 電路I C之線寬要 現今基本要求之 ,尤其對幅塵之 一般晶圓片由於 會利 晶圓 示者 個晶 晶圓 有複 (當 覆整 各晶 一般 積、 後, 用一 SMIF晶 搬運盒 ,其主 圓片1 盒底盤 數個( 然切面 個晶圓 圊片1 ,一片 製版餘 同一晶 2 0 要構 7之 2 7 如2 晶圓 架2 7之 晶圓 刻、 圓架 圓片刻號之晶圓辨識裝 未離開晶圓架之情況下 辨識裝置與方法。 了可追縱品管及識別方 及晶圓號碼等出廠資料 片之身份字號一般,如 或第1 B圖所示具有凹 之刻號。 求曰漸趨小,其已於最 次微米級,故對晶圓片 隔離要求更是晶圓片是 製程繁多,故在製程機 圓搬運盒來保護複數個 (Pod ; Foup),如第 2 造係包括有一晶圓盒蓋 晶圓架2 5 (或稱晶舟 所組合而成,其中該晶 5片)具有凹口 19之 片1 1亦然),如此當 5及晶圓盒底盤2 7後 機會。 片之製程步驟眾多,如 或電漿蒸鍍等製程,百 2 5内各晶圊片1 7之BB wafer and an A picture and the second B 2 1. A bearing, Cassette) In the round frame 2 5 can be a semiconductor wafer wafer box lid 2 1 to isolate the dust like the front ion implantation and oxygen remnant. For the process step related method, it is important that each crystal semiconductor is appropriately cut into 15 wafer steps. The number of times in the map and the number of loadings are 17 in the package contamination description. The type of wafer is too readable. In particular, a wafer wafer with a wafer wafer engraved with a wafer number 11 is marked with a lot number on the position.) There are wafers 1 1 and 1 7 on the wafer side, and the line width of the circuit IC must be basically required today, especially for general wafers with large dust. There is a complex (when the crystals are generally stacked and stacked, a SMIF crystal transport box is used, and its main wafer is 1 box with several chassis (of course, a wafer wafer 1 is cut, and one plate is made of the same crystal. 2 7 Such as 2 wafer rack 2 7 Wafer engraving of the 7th, wafer identification of the round frame and the number of wafer identification equipment without leaving the wafer rack identification device and method. It can trace the quality control and identification party and wafer number The identification font size of the factory data sheet is generally, as shown in Figure 1B, it has a concave engraved mark. It is becoming smaller and smaller, and it is at the micron level, so the wafer isolation requirements are even more There are many processes, so round the box to protect multiple (Pod; Foup) in the process machine. The second system includes a wafer box cover and a wafer frame 2 5 (also called a wafer boat, in which 5 crystals are formed), and a wafer with a notch 19 is also 1 1). Opportunities after the chassis 2 7. There are many steps in the process of making wafers, such as plasma or plasma evaporation.
第4頁 ^ 445562 五、發明說明 相對位置 視維修或 後,藉由 晶圓片1 如第 動作示意 取手臂3 處抓取出 射鏡3 9 被一訊號 之晶圓片 號資料及 惟, 服之缺點 1 •晶 幅提高其 2 ·晶 響整個流 3 •晶 可能性。 因此 識方法, 各晶圓片 被汙染及 (2〕 及刻 追縱 一晶 7之 3圖 圖, 1之 來, 5上 擷取 放回 位置 如此 號所 記錄 圓片 真正 所示 該晶 拾取 然後 ,再 器3 晶圓 在常 上十 刻號 所在 ,係 圓辨 夾頭 利用 利用 5所 架内 常已 分不 讀取 位置 為習 識裝 經變化多次,如此之情形對檢 便,故一般需在幾次製程步驟 辨識裝置來進行追縱及記錄各 用晶圓片 置3 0其 3 7將每一片 一光源3 3照 反射光將晶圓 獲取及判讀, ,如此即可得 刻號讀取辨識裝置之 主要係利用一晶圓抓 晶圓片1 7從晶圓架 射反光支臂3 9之反 片1 7上之刻號1 5 之後再將此已判讀過 到該晶圓片1 7之刻 之晶圓辨識裝置及方法卻存在有幾個難以克 圓片從晶圓架内整個移出,不僅不方便,且將大 被幅塵污染之機會; 圓片一片一片地抓出解讀及記錄,速度太慢,影 及 圓架内移進移出 程時間; 圓片在晶 ,如何設計出一種晶圓片刻 可在晶圓 刻號之晶 損壞之機 片未離開晶圓架之 圓辨識裝置與方法 會,又可節省讀取 無形增加其被損壞之 號之辨識裝置及其辨 情況下即可同時讀取 ,不僅可降低晶圓片 各晶圓片刻號之冗長Page 4 ^ 445562 V. Description of the invention After the relative position is inspected or repaired, the wafer 1 is used to pick up the arm 3 at the 3 position as shown in the first action. The lens 3 9 is received by a signal of the wafer number and information. Disadvantages 1 • The crystal amplitude is increased by 2 • Crystal ringing the entire stream 3 • Crystal possibility. Therefore, according to the identification method, each wafer is contaminated and (2) and engraving 3 of the 7th picture of a crystal, 1 comes, 5 is retrieved and returned to the position so that the wafer recorded by this number is really picked up and then The wafer number of the repeater 3 is usually ten ticks. The system uses a circular discriminating chuck to make use of the unreadable position in the five racks. It has been changed many times for learning. In this case, the inspection will be convenient. The identification device needs to be tracked and recorded in several process steps. Each wafer is set to 3 0 to 3 7 each light source 3 3 to obtain and interpret the wafer according to reflected light, so that the engraved number can be read. The main purpose of the identification device is to use a wafer to grasp the wafer 1 7 and shoot the reflective arm 3 9 from the wafer holder to the reflective sheet 1 7 and the engraved number 15 on the 7 before reading this to the wafer 1 At the moment of the wafer identification device and method at 7th, there are several difficult to remove the wafer from the wafer rack, which is not only inconvenient, but also the chance of being polluted by the large amount of dust; the wafer is grasped and interpreted one by one. Recording, the speed is too slow, and the moving time of the shadow and the circular frame; Crystal, how to design a circle identification device and method that can be damaged on the wafer with the crystal of the wafer number on the wafer without leaving the wafer frame, and can save the identification device that reads the invisible increase of the damaged number and It can be read at the same time under the condition of discrimination, which can not only reduce the length of each wafer number of the wafer.
HR 第5頁 Λ d556 2 五、發明說明(3) 時間功效,長久以來一直是使用者殷切盼望及本發明人念 茲在茲者,而本發明人基於多年從事於半導體製程元件相 關產製品之研究、開發、及銷售之實務經驗,乃思及改良 之意念,窮其個人之專業知識,經多方研究設計、專題探 討,終於研究出一種可讀取晶圓片刻號之晶圓辨識裝置及 其辨識方法。爰是 本發明之主要目的,在於提供一種可讀取晶圓片刻號 之晶圓辨識裝置及其辨識方法,利用刻號讀取室之轉動軸 、定位桿及光學辨識器之助,而可讓各晶圓片在未離開晶 圓架之情況下即可被判讀並記錄刻號資料,故可有效降低 晶圓片被幅塵污染之機會,以維護其南品質之要求。 本發明之次要目的,在於提供一種可讀取晶圓月刻號 之晶圓辨識裝置及其辨識方法,在晶圓架内之各晶圓片可 在同時一次即被判讀及記錄所有刻號資料,而無需一片一 片進行解讀之工作,故可有效降低習用解讀並記錄晶圓片 刻號所需之冗長時間。 本發明之又一目的,在於提供一種可讀取晶圓片刻號 之晶圓辨識裝置及其辨識方法,在各晶圓片未離開晶圓架 之情況下即可同時被判讀並記錄其刻號資料,故可有效降 低晶圓片移進移出晶圓架時被損誨之機會,以提升產品良 率。 茲為使 貴審查委員對本發明之結構特徵及所達成之 功效有更進一步之瞭解與認識,謹佐以較佳之實施例圖及 配合詳細之說明,說明如后:HR Page 5 Λ d556 2 V. Description of the invention (3) The time effect has long been the eager expectation of the user and the inventor of the present invention, and the inventor is based on many years of experience in semiconductor product related products. The practical experience of research, development, and sales is to think about and improve ideas, and to lack his personal expertise. After many research and design and special discussions, he finally developed a wafer identification device that can read the wafer engraving number and its identification. Identification method. Is the main object of the present invention, which is to provide a wafer identification device capable of reading the engraved number of a wafer and an identification method thereof. With the help of a rotating shaft, a positioning rod and an optical identifier of the engraved reading room, Each wafer can be read and recorded without leaving the wafer rack, so it can effectively reduce the chance of wafer contamination by web dust to maintain its quality requirements. A secondary object of the present invention is to provide a wafer identification device capable of reading the month number of a wafer and a method for identifying the same. Each wafer in a wafer rack can be read and recorded all the numbers at one time. Data, without the need to read one by one, so it can effectively reduce the long time required for conventional interpretation and recording of the wafer number. Another object of the present invention is to provide a wafer identification device capable of reading the wafer number and a method for identifying the same, and each wafer can be read and recorded simultaneously without leaving the wafer rack. Data, so it can effectively reduce the chance of being damaged when wafers are moved in and out of the wafer rack to improve product yield. In order to make your reviewing members have a better understanding and understanding of the structural features and achieved effects of the present invention, I would like to accompany the drawings of the preferred embodiment and the detailed description, as explained below:
明一較佳實 本發明構造 0 ,其中該 7 ,而開口 然,開口 5 7 ,但卻必 内還設有一 施例晶 係包括 晶圓處 5 7之 7之大 須小於 升降平 之晶圓片7 3的晶 經由開口 5 7而進 0之頂端尚設有一 之檢知感測器5 3 ,兩 道6 否為 設有 適當 學辨 一個 動軸 可藉 5、 門6 ^45562 五、發明說明(4) 首先,請參閱第5 A圖,係為本發 圓辨識裝置之構造剖視圖;如圖所示, 有一晶圓處理室5 0及一刻號讀取室6 理室5 0之頂端設有一可密封之開口 5 上方則是可置放晶圓傳送盒之位置,當 小必須大於晶圓架7 5及晶圓盒底盤7 晶圓盒蓋7 1 ;在其晶圓處理室50室 台5 5 ,其可承載内包括有凹口 7 35 圓架7 5及晶圓盒底座7 7 ,致使其可 出晶圓處理室5 0 ;而在晶圓處理室5 可偵測判斷晶圓傳送盒是否已到達定位 至於,刻號讀取室6 0則位於晶圓處理室5 0之 者間具有一大小高度足以讓整個晶圓架7 5通過 2 5 ,通道6 2 5邊則設有一可控制該通道6 2 封閉或開啟態樣之閥門6 2 ,而刻號讀取室6 0 一可萬向或定位轉動之晶圓架抓取手臂6 3 ,另 位置設有一包括有光源6 7 5及訊號擷取器6 7 識器、一位於承載平台6 5之定位桿6 5 3 、及 可帶動晶圓架7 5内各晶圓片7 3同時轉動功效 6 5 5 ;又在該刻號讀取室6 0内底側還可固設 連線(未顯示)而控制晶圓架抓取手臂6 3 、光源 訊號擷取器67、轉動軸655 、升降平台55 2動作之微處理器6 1 。 旁側 之通 5是 内固 内壁 之光 至少 之轉 有一 6 7 及閥It is better to realize the structure 0 of the present invention, in which the 7 is opened, and the opening is 5 7, but there is also an example in which the crystal system including the wafer 5 to 7 must be smaller than the flat wafer. A crystal of 7 3 enters 0 through the opening 5 7 and a detection sensor 5 3 is provided at the top. Two 6 can be borrowed if there is a moving shaft. 5. Door 6 ^ 45562 5. Description of the invention (4) First, please refer to FIG. 5A, which is a cross-sectional view of the structure of the present circle identification device; as shown in the figure, a wafer processing chamber 50 and a tick reading chamber 6 Above the sealable opening 5 is the position where the wafer transfer box can be placed. When it is small, it must be larger than the wafer rack 7 5 and the wafer box chassis 7 and the wafer box cover 7 1; in its wafer processing room 50 chamber table 5 5, which can carry a notch 7 35 round frame 7 5 and a wafer box base 7 7 so that it can exit the wafer processing chamber 50; and the wafer processing chamber 5 can detect and judge the wafer transfer box As to whether it has been positioned, the engraving reading room 60 is located between the wafer processing rooms 50 and has a size sufficient to allow the entire wafer rack 7 5 through 2 5, a channel 6 2 is provided on the side of the channel 6 2 5 to control the closed or opened state of the channel 6 2, and the engraving reading room 60 is a wafer holder which can be swiveled in a universal or positioning manner. The arm 6 3 is provided with a light source 6 7 5 and a signal picker 6 7 at another position, a positioning rod 6 5 3 located on the carrying platform 6 5, and each wafer in the wafer holder 7 5 can be driven. 7 3 Simultaneous rotation effect 6 5 5; At the bottom of the engraving reading room 60, a connection (not shown) can be fixed to control the wafer frame grasping arm 6 3, light source signal acquisition device 67, The microprocessor 6 1 which rotates the shaft 655 and the lifting platform 55 2 operates. The side pass 5 is the light of the inner wall and the at least one of the 6 and the valve
第7頁 五、發明說明(5) 另外,在晶圓辨識器之外側還設有一可顯示晶圓辨識 器内部作業情形及微處理器6 1内部所儲存刻號數字等資 料之監視器6 9 ,當然,該監視器6 9亦可作為操作者與 微處理器6 1間之溝通橋樑。 雖然,在此較佳實施例中顯示之轉動軸6 5 5及定位 桿6 5 3係為水平設置者,但其設置位置並非一定,其主 要係配合晶圓架抓取手臂6 3控制晶圓架7 5最後所處之 位置而定,故其亦可設計為垂直或呈一角度而斜向設置者 皆可。 再者,煩請參閱第4圖及第5A圖至第5G圖,係分 γ 別為本發明一較佳實施例之流程圖及各製程步驟構造剖視 圖:如圖所示,本發明同時讀取各晶圓片刻號之方法,其 主要步驟如下· 步驟40 1 ,當晶圓傳送盒送至晶圓處理室50之頂端 後,檢知感測器5 3將偵測得知已有一彼晶圓片7 3需要 被判讀及記錄其刻號和位置,故會將此訊息通知微處理器 6 1;Page 7 V. Description of the invention (5) In addition, on the outside of the wafer identifier, a monitor capable of displaying the internal operation of the wafer identifier and the microprocessor 6 1 is stored. 6 9 Of course, the monitor 69 can also serve as a communication bridge between the operator and the microprocessor 61. Although the rotating shaft 6 5 5 and the positioning rod 6 5 3 shown in this preferred embodiment are horizontally set, their setting positions are not fixed, and they are mainly used to cooperate with the wafer holder grasping arm 6 3 to control the wafer. The position of the rack 7 5 depends on the last position, so it can also be designed to be installed vertically or at an angle. Furthermore, please refer to FIG. 4 and FIG. 5A to FIG. 5G, which are respectively a flowchart of a preferred embodiment of the present invention and a sectional view of each process step structure: as shown in the figure, the present invention reads each The method of engraving the wafers is as follows: Step 40 1. After the wafer transfer box is sent to the top of the wafer processing chamber 50, the detection sensor 5 3 will detect that there is another wafer 7 3 needs to be read and recorded its engraving and location, so it will notify the microprocessor 6 1 this message;
第8頁 ί;hA4556 2 五、發明說明(6) 7 5連同各晶 6 5上端,如 步驟4 3 4 轉一適當角度 9 0度及下降 力作用而讓其 3 ,如第5 D 步驟4 0 4 ,並藉此帶動 凹口 7 3 5轉 晶圓片7 3之 圓片7 3將會 轉動直 而同處 步驟 3將受 刻號7 G圖所 步驟 動,其 刻號7 7所讀 第5 G 步驟 至每一 一直線 4 0 5 到推壓 3 7之 示; 4 0 6 光源6 3 7所 取,並 圖所示 4 0 7 圓片7 3移 第5 B圖及 ’晶圓架抓 及調整其高 高度,致使 邊緣確實觸 圊所示; ,微貪理器 各晶圓片7 至定位桿6 重力下降而 因卡合受限 晶圓片7 3 位置為止, ,微微升起 同時升起一 部分面積將 ,刻號讀取 7 5所發射 在之位置, 將此反射訊 位至刻號處理室6 0之承載平台 第5 C圊所示; 取手臂6 3將連同晶圓架7 3再 度,如在此實施例中係垂直轉動 各晶圓片7 3可利用其本身之重 接於轉動軸6 5 5及定位桿6 5 6 1控制轉動軸6 5 5開始轉動 3同時轉動,當各晶圓片7 3之 53處時,定位桿653將會因 卡陷至凹口 7 3 5内,如此該晶 而不再轉動,而轉動軸6 5 5將 之凹口 7 3 5皆因定位桿6 5 3 如第5E圖及第5F圖所示; 轉動軸6 5 5 ,如此各晶圓片7 定之高度,致使其刻印有晶圓片 裸露於晶圓架7 5外側,如第5 室6 0内之光學辨識裝置開始啟 出之光線將直接照射於各晶圓片 而其反射訊號將被訊號擷取器6 號傳至微處理器6 1中處理,如 微處理器6 1接收並判讀及記錄來自訊號Page 8; hA4556 2 V. Description of the invention (6) 7 5 together with the upper end of each crystal 65, as shown in step 4 3 4 turn to an appropriate angle of 90 degrees and the force of the falling force to make it 3, as in step 5 D step 4 0 4 and drive the notch 7 3 5 to the wafer 7 3 of the wafer 7 3 will rotate straight and the same place. Step 3 will be moved by the steps of the engraved figure 7 G, which is read by the engraved number 7 7 Step 5 G to each line 4 0 5 to push 3 7 shown; 4 0 6 light source 6 3 7 taken, and shown in the picture 4 0 7 wafer 7 3 move to the 5B picture and 'wafer rack Grasp and adjust its height so that the edges do indeed touch the display;, the wafers 7 of the microgrid to the positioning rod 6 drop in gravity and the wafers 7 3 are restricted due to the engagement, slightly raised at the same time Raise a part of the area, read the position where the engraved number 7 5 is emitted, and send the reflected signal to the 5th C 圊 of the bearing platform of the engraved processing room 60; take the arm 6 3 together with the wafer rack 7 3 Once again, as in this embodiment, each wafer 7 is rotated vertically. 3 It can use its own weight to connect to the rotation axis 6 5 5 and the positioning rod 6 5 6 1 to control the rotation axis 6 5 5 to start rotation. 3 rotate at the same time, when each wafer 53 is 53, the positioning rod 653 will be trapped in the notch 7 3 5 so that the crystal will no longer rotate, and the axis 6 5 5 will notch 7 3 5 is because the positioning rod 6 5 3 is shown in FIG. 5E and 5F; the axis 6 5 5 is rotated so that each wafer 7 is set at a height such that the wafer is engraved with the wafer exposed on the wafer rack 7 5 On the outer side, the light from the optical identification device in the 60th room 60 starts to shine directly on each wafer and the reflection signal will be transmitted to the microprocessor 61 by the signal picker 6 for processing, such as micro The processor 6 1 receives and interprets and records signals from
第9頁 ► 445552 五、發明說明(7) 擷取器6 7内之各晶圓片7 3相對所在位置及刻號7 3 7 資料; 步驟4 0 8 ,轉動輪6 5 5下降至原先位置,換言之, 讓各晶圓片7 3回至晶圓架7 5内原本位置,如第5D圖 所示;及 步驟4 0 9 ,晶圓架抓取手臂6 3將晶圓架7 5由刻號 讀取室6 0經由通道6 2 5移至晶圓處理室5 0之晶圓盒 底盤77上,且升降平台5 5將晶圓架7 5及晶圓盒底盤 7 7上升至晶圓處理室5 0頂端,而與該晶圓盒蓋7 1結 合,如第5A圖及第5 B圖所示。 另外,在此實施例中係假設晶圓片7 3之刻號係印刻 在凹口 7 3 5之對角位置,若情況不是如此時,則在步驟 4 0 4之後還需另加一步驟4 4 5 :微微升起轉動軸6 5 5 ,致使各晶圓片7 3脫離定位桿6 5 3之卡合,之後轉 動軸6 5 5繼續帶動各晶圓片7 3轉動至一適合各晶圓片 7 3刻號被擷取訊號之位置。 又,為了讓各晶圓片7 3不管係在晶圓架7 5内部或 部分裸露晶圓架在外之情況,該轉動軸6 5 5在步驟4 0 5或步驟4 4 5升起時亦可以一斜角角度斜斜升起,如此 各晶圓片7 3將以不同之高度陳列,如此更可讓刻號讀取 室6 0之光源6 7 5照射及訊號擷取器6 7讀取訊號。 又,在此較佳實施例中係以轉動軸6 5 5及定位桿6 5 3為水平態樣來討論,在本發明同樣精神態樣下,其實 轉動軸6 5 5及定位桿6 5 3亦可呈現垂直之縱向方位,Page 9 ► 445552 V. Description of the invention (7) Relative position of each wafer 7 3 in the extractor 6 7 and the engraved number 7 3 7 Data; Step 4 0 8, the rotating wheel 6 5 5 descends to the original position In other words, the wafers 73 are returned to the original positions in the wafer rack 75, as shown in FIG. 5D; and in step 409, the wafer rack grasping arm 6 3 engraves the wafer rack 75 The reading room 60 is moved to the wafer box chassis 77 of the wafer processing chamber 50 through the passage 6 2 5 and the lifting platform 5 5 raises the wafer rack 7 5 and the wafer box chassis 7 7 to wafer processing. The top of the chamber 50 is combined with the wafer cassette cover 71, as shown in Figs. 5A and 5B. In addition, in this embodiment, it is assumed that the engraving number of the wafer 7 3 is printed on the diagonal position of the notch 7 3 5. If this is not the case, an additional step 4 is required after step 4 0 4 4 5: Slightly raise the rotating shaft 6 5 5, causing each wafer 7 3 to be disengaged from the positioning rod 6 5 3, and then the rotating shaft 6 5 5 continues to drive each wafer 7 3 to a position suitable for each wafer. Film 7 The position where the 3 tick marks were captured. In addition, in order to allow each wafer 7 3 to be inside or partially exposed of the wafer rack 7 5, the rotating shaft 6 5 5 may be raised when step 4 0 5 or step 4 4 5 is raised. An oblique angle rises obliquely, so that each of the wafers 7 3 will be displayed at different heights, so that the light source 6 7 5 of the engraving reading room 6 7 5 and the signal acquisition device 6 7 can read the signal. . Also, in this preferred embodiment, the rotating shaft 6 5 5 and the positioning rod 6 5 3 are discussed as horizontal states. In the same spirit of the present invention, the rotating shaft 6 5 5 and the positioning rod 6 5 3 are actually discussed. Can also present a vertical vertical orientation,
第10頁 \ 五、發明說明(8) 如此當第5 C圖所示之晶圓架7 5移入刻號讀取室6 0時 ,轉動軸6 5 5及定位桿6 5 3可立即移位去觸接到各晶 圓片7 3之周緣,再繼續進行同上所述之後續步驟,亦可 達到讀取晶圓刻號之目的。 另外,若本發明之光源6 7 5及訊號擷取器6 7相對 位置設計得當,步驟4 0 5其實亦可省略;換言之,各晶 圓片7 3在轉動至刻號7 3 7到達同一直線位置後,於未 離開晶圓架7 5之情況下即可直接被光源6 7 5所照射及 訊號擷取器6 7獲取反射光源訊號。 最後,請參閱第6圖,係為本發明之又一實施例構造 剖視圖;在符合本發明精神之情況下,本發明亦可用於未 設有SM I F環境、一半自動機械化、或一非密閉空間之刻號 讀取構造場合中。更明確而言,前述步驟4 0 1至步驟4 0 3動作可利用人工直接搬運來替代晶圓抓取手臂之定位 功能,待轉動軸6 5 5帶動晶圓片7 3轉動、定位桿6 5 3致使凹口 7 3 5對齊定位、設於上緣固定壁8 0之光源 6 7 5照射刻號位置、及訊號擷取器6 7讀取辨識其刻號 資料後,再同樣以人工方式替代步驟4 0 8至步驟4 0 9 將其裝載有各晶圓片7 3之晶圓架7 3搬離刻號讀取室6 0 ,如此亦可達到前述之功效及目的。 綜上所述,一種晶圓片刻號之辨識裝置及其辨識方法 ,可在晶圓片未離開晶圓架之情況下而同時讀取各晶圓片 之刻號,不僅可降低晶圓片被汙染及損壞之機會,又可節 省讀取各晶圓片刻號之冗長時間供效。故本發明實為一具Page 10 \ V. Description of the invention (8) So when the wafer holder 7 5 shown in Fig. 5C is moved into the marking reading room 60, the rotating shaft 6 5 5 and the positioning rod 6 5 3 can be immediately displaced. To touch the periphery of each wafer 73, and then continue the subsequent steps as described above, the purpose of reading the wafer engraving can also be achieved. In addition, if the relative positions of the light source 6 7 5 and the signal picker 67 are properly designed, step 4 5 can actually be omitted; in other words, each wafer 7 3 is rotated until the engraved marks 7 3 7 reach the same straight line. After the position, the light source 6 7 5 can be directly irradiated and the signal picker 67 can obtain the signal of the reflected light source without leaving the wafer rack 7 5. Finally, please refer to FIG. 6, which is a sectional view of the structure of another embodiment of the present invention. In the case of conforming to the spirit of the present invention, the present invention can also be used in the environment without SM IF, semi-automatic mechanization, or a non-closed space. The tick mark is read in the construction occasion. More specifically, the aforementioned steps 401 to 403 can be replaced by the manual positioning function of the wafer grasping arm. The axis 6 5 5 will rotate the wafer 7 3 and the positioning lever 6 5 3 causes the notch 7 3 5 to be aligned and positioned, the light source 6 7 5 located on the upper edge fixed wall 8 0 5 irradiates the position of the engraving mark, and the signal extractor 6 7 reads and identifies the engraving data, and then replaces it manually. In steps 408 to 409, the wafer holder 7 3 on which each wafer 7 3 is loaded is removed from the engraving reading room 60, so that the aforementioned effects and purposes can also be achieved. In summary, a device and method for identifying a wafer chip number can simultaneously read the number of each wafer without leaving the wafer rack, which can not only reduce the wafer The chance of contamination and damage can also save the time and efficiency of reading the wafer number. Therefore, the present invention is indeed a
第11頁 〇562 五、發明說明(9) 有新穎性、進 法專利申請要 局早日賜准專 惟以上所 非用來限定本 口晶圓片為實 又,本發明雖 說明,但本發 ),故舉凡依 徵及精神所為 請專利範圍内 (一) 圖式簡 第1 A圖:係 第1 B圖:係 第2 A圖:係 第2 B圖:係 第3圖:係習 第4圖:係本 第5 A圖至第 造剖 第6圖:係本 (二) 圖號簡 11 晶圓 17 晶圓 步性及可供產業上利用者,應符合我國專利 件無疑,爰依法提出發明專利申請,祈 鉤 利,至感為禱。 述者,僅為本發明之一較佳實施例而已,並 發明實施之範圍,例如,雖然本發明皆以凹 施例說明,但同樣亦可適用於切面晶圓片; 然係以8"晶圓之晶圓傳送盒(Pod)為實施例 明亦同樣適用於12"晶圓之晶圓傳送盒(Foup 本發明申請專利範圍所述之形狀、構造、特 之均等變化與修飾,均應包括於本發明之申 〇 單說明: 一般晶圓片之上視圖; 另一種晶圓片之上視圖; 一般晶圓傳送盒之分解示意圖; 第2A圖所示晶圓傳送盒之立體分解圖; 用晶圓片刻號讀取辨識裝置之動作示意圖; 發明晶圓片刻號讀取辨識方法之流程圖; 5 G圖:係本發明一較佳實施例之各步驟構 視圖;及 發明又一實施例之構造剖視圖。 單說明: 片 1 3 刻號 片 1 5 刻號Page 11 〇562 V. Description of the invention (9) There is novelty and the patent application must be approved by the Bureau as soon as possible. However, the above is not used to limit the wafers of this port. Although the present invention is described, the present invention ), So the examples of Fan Yizheng and the spirit are within the scope of patent application (1) Schematic diagram 1 A: Department 1 B: Department 2 A: Department 2 B: Department 3: Department 2 Figure 4: Figure 5A to Section 6 of the book: Figure (2) Figure No. 11 Wafer 17 Wafer step and available for industrial use should be in line with China's patents, no doubt, according to law File an application for an invention patent, pray for benefits, and pray for it. The description is only one of the preferred embodiments of the present invention, and the scope of the invention's implementation. For example, although the present invention is described by a concave embodiment, it can also be applied to cut wafers; The round wafer transfer box (Pod) is an example, and it is also applicable to 12 " wafer wafer transfer boxes (Foup) The shapes, structures, and special changes and modifications described in the scope of the present invention patent application should include Explanation of the application form of the present invention: a general top view of a wafer; another top view of a wafer; an exploded view of a general wafer transfer box; a three-dimensional exploded view of the wafer transfer box shown in FIG. 2A; Schematic diagram of the operation of the device for reading and identifying wafer chip marks; a flowchart of the method for reading and identifying a wafer chip mark; FIG. 5G: a view showing the steps of a preferred embodiment of the present invention; and another embodiment of the invention Sectional view of construction. Single description: slice 1 3 engraved slice 1 5 scribed
Η 第12頁 Λ45562 五、發明說明αο) 3 0 晶圓辨識裝置 2 1 晶圓盒盍 2 7 晶圓盒底盤 3 3 光源 3 5 訊號擷取器 3 3 3 6 6 6 6 6 7 7 7 9 0 5 1 3 5 7 9 5 3 7 1 2 5 5 5 5 7 5 1 3 5 5 0 晶圓傳送盒 晶圓架 晶圓抓取手臂 透鏡 拾取夾頭 反射鏡 檢知感測器 開口 微處理器 通道 承載平台 轉動軸 光源 晶圓盒蓋 凹口 晶圓架 刻號讀取構造12 Page 12 Λ45562 V. Description of the invention αο) 3 0 Wafer identification device 2 1 Wafer box 2 7 Wafer box chassis 3 3 Light source 3 5 Signal picker 3 3 3 6 6 6 6 6 7 7 7 9 0 5 1 3 5 7 9 5 3 7 1 2 5 5 5 5 7 5 1 3 5 5 0 wafer transfer box wafer rack wafer grip arm lens pickup chuck mirror detection sensor opening microprocessor Channel carrying platform rotation axis light source wafer box cover notch wafer frame engraving reading structure
Η 3 9 反光支臂 5 0 晶圓處理室 5 5 升降平台 6 0 刻號讀取室 6 2 閥門 6 3 晶圓架抓取手臂 653 定位桿 6 7 訊號擷取器 6 9 監視器 7 3 晶圓片 7 3 7 刻號 7 7 晶圓盒底盤 8 5 固定壁 第13頁Η 3 9 Reflective arm 5 0 Wafer processing chamber 5 5 Lifting platform 6 0 Mark reading chamber 6 2 Valve 6 3 Wafer holding arm 653 Positioning rod 6 7 Signal picker 6 9 Monitor 7 3 Crystal Wafer 7 3 7 Engraved 7 7 Wafer box chassis 8 5 Fixed wall 第 13 页
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TW89100312A TW445562B (en) | 2000-01-11 | 2000-01-11 | Wafer identification device capable of simultaneously reading the carved wafer numbers in the cassette and its recognizing method |
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