TW439135B - Method and device for cleaning substrates - Google Patents
Method and device for cleaning substrates Download PDFInfo
- Publication number
- TW439135B TW439135B TW088111310A TW88111310A TW439135B TW 439135 B TW439135 B TW 439135B TW 088111310 A TW088111310 A TW 088111310A TW 88111310 A TW88111310 A TW 88111310A TW 439135 B TW439135 B TW 439135B
- Authority
- TW
- Taiwan
- Prior art keywords
- patent application
- substrate
- item
- scope
- cleaning
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 168
- 239000000758 substrate Substances 0.000 title claims abstract description 114
- 238000000034 method Methods 0.000 title claims abstract description 36
- 239000012530 fluid Substances 0.000 claims abstract description 20
- 239000007788 liquid Substances 0.000 claims description 56
- 230000002079 cooperative effect Effects 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 11
- 239000007789 gas Substances 0.000 claims description 8
- 239000000243 solution Substances 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 238000011010 flushing procedure Methods 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 63
- 238000001035 drying Methods 0.000 description 17
- 230000000694 effects Effects 0.000 description 11
- 238000005201 scrubbing Methods 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000008367 deionised water Substances 0.000 description 8
- 229910021641 deionized water Inorganic materials 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- 230000033001 locomotion Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- 238000005498 polishing Methods 0.000 description 4
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 3
- 235000017491 Bambusa tulda Nutrition 0.000 description 3
- 241001330002 Bambuseae Species 0.000 description 3
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 3
- 239000011425 bamboo Substances 0.000 description 3
- 230000001680 brushing effect Effects 0.000 description 3
- 238000009960 carding Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19830162A DE19830162A1 (de) | 1998-07-06 | 1998-07-06 | Verfahren und Vorrichtung zum Reinigen von Substraten |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW439135B true TW439135B (en) | 2001-06-07 |
Family
ID=7873131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW088111310A TW439135B (en) | 1998-07-06 | 1999-07-02 | Method and device for cleaning substrates |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1101245A2 (ja) |
| JP (1) | JP2002520132A (ja) |
| KR (1) | KR20010071759A (ja) |
| DE (1) | DE19830162A1 (ja) |
| TW (1) | TW439135B (ja) |
| WO (1) | WO2000002234A2 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI415533B (zh) * | 2010-09-15 | 2013-11-11 | Zhen Ding Technology Co Ltd | 濕處理裝置及濕處理方法 |
| DE102022104205B3 (de) | 2022-02-22 | 2023-06-22 | Hiwin Technologies Corp. | Automatisches Parameterladeverfahren und -system sowie Serviceserver und Client-Server |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010096566A (ko) * | 2000-04-11 | 2001-11-07 | 윤종용 | 반도체 웨이퍼 세정장치 및 이를 이용한 반도체 웨이퍼세정방법 |
| US6732750B2 (en) | 2000-04-11 | 2004-05-11 | Samsung Electronics Co., Ltd. | Semiconductor wafer cleaning apparatus and method of using the same |
| DE10103111A1 (de) * | 2001-01-24 | 2002-08-01 | Mattson Wet Products Gmbh | Vorrichtung zum Behandeln von Substraten |
| DE10122669A1 (de) * | 2001-05-10 | 2002-12-12 | Mattson Wet Products Gmbh | Vorrichtung zum Nassreinigen von scheibenförmigen Substraten |
| DE10200525A1 (de) * | 2002-01-09 | 2003-10-23 | Mattson Wet Products Gmbh | Vorrichtung und Verfahren zum Behandeln von scheibenförmigen Substraten |
| DE10219771B4 (de) * | 2002-05-03 | 2006-05-11 | Emag Ag | Vorrichtung zum automatischen Reinigen von in Maschinenkassetten aufgenommenen Vakuumhaltern oder -pipetten |
| KR100677034B1 (ko) * | 2003-10-20 | 2007-01-31 | 동부일렉트로닉스 주식회사 | 반도체 소자의 세정방법 및 그 장치 |
| CN109518203B (zh) * | 2018-12-13 | 2020-10-30 | 江苏美霖铜业有限公司 | 一种有色金属表面处理装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2683940B2 (ja) * | 1989-08-09 | 1997-12-03 | 信越半導体 株式会社 | ワークの自動洗浄装置 |
| JP3162704B2 (ja) * | 1990-11-28 | 2001-05-08 | 東京エレクトロン株式会社 | 処理装置 |
| US5317778A (en) * | 1991-07-31 | 1994-06-07 | Shin-Etsu Handotai Co., Ltd. | Automatic cleaning apparatus for wafers |
| JP2543007B2 (ja) * | 1993-08-23 | 1996-10-16 | 株式会社エンヤシステム | ウエ−ハ枚葉洗浄装置 |
| DE4413077C2 (de) * | 1994-04-15 | 1997-02-06 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zur chemischen Behandlung von Substraten |
| JP2888412B2 (ja) * | 1994-07-04 | 1999-05-10 | 信越半導体株式会社 | ブラシ洗浄装置及びワーク洗浄システム |
| DE19525521B4 (de) * | 1994-07-15 | 2007-04-26 | Lam Research Corp.(N.D.Ges.D.Staates Delaware), Fremont | Verfahren zum Reinigen von Substraten |
| DE19652526C2 (de) * | 1996-04-22 | 2000-12-07 | Steag Micro Tech Gmbh | Transporteinrichtung für Substrate und Verfahren zum Beladen der Transporteinrichtung mit Substraten |
-
1998
- 1998-07-06 DE DE19830162A patent/DE19830162A1/de not_active Withdrawn
-
1999
- 1999-07-02 TW TW088111310A patent/TW439135B/zh active
- 1999-07-03 WO PCT/EP1999/004633 patent/WO2000002234A2/de not_active Application Discontinuation
- 1999-07-03 EP EP99934565A patent/EP1101245A2/de not_active Withdrawn
- 1999-07-03 JP JP2000558541A patent/JP2002520132A/ja active Pending
- 1999-07-03 KR KR1020017000196A patent/KR20010071759A/ko not_active Application Discontinuation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI415533B (zh) * | 2010-09-15 | 2013-11-11 | Zhen Ding Technology Co Ltd | 濕處理裝置及濕處理方法 |
| DE102022104205B3 (de) | 2022-02-22 | 2023-06-22 | Hiwin Technologies Corp. | Automatisches Parameterladeverfahren und -system sowie Serviceserver und Client-Server |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2000002234A2 (de) | 2000-01-13 |
| WO2000002234A3 (de) | 2000-08-24 |
| EP1101245A2 (de) | 2001-05-23 |
| DE19830162A1 (de) | 2000-01-20 |
| JP2002520132A (ja) | 2002-07-09 |
| KR20010071759A (ko) | 2001-07-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent |