TW429568B - Method for thick film coating via hole sidewalls - Google Patents

Method for thick film coating via hole sidewalls

Info

Publication number
TW429568B
TW429568B TW88104623A TW88104623A TW429568B TW 429568 B TW429568 B TW 429568B TW 88104623 A TW88104623 A TW 88104623A TW 88104623 A TW88104623 A TW 88104623A TW 429568 B TW429568 B TW 429568B
Authority
TW
Taiwan
Prior art keywords
tape
via hole
ceramic
film coating
removable
Prior art date
Application number
TW88104623A
Other languages
Chinese (zh)
Inventor
Louis Raymond Albrecht Iii
Ronald Leavitt Law
Apurba Roy
Steven Aubrey Shewmake
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Application granted granted Critical
Publication of TW429568B publication Critical patent/TW429568B/en

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

A method for thick-film coating at least one via hole formed in a ceramic circuit board. The method involves applying a removable tape to at least one side of a ceramic green tape and forming at least one hole simultaneously through both the ceramic tape and the removable tape. The sidewall of the hole is coated with a film of conductive material and the removable tape is subsequently removed from the ceramic tape, leaving a via hole and uncovering a substrate surface free of smeared conductor. Removable tape layers can be applied to both sides of the green tape, producing via holes with no lip or removable tape can be applied on one side and a stencil can be used on the other.
TW88104623A 1998-04-29 1999-03-24 Method for thick film coating via hole sidewalls TW429568B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US6926098A 1998-04-29 1998-04-29

Publications (1)

Publication Number Publication Date
TW429568B true TW429568B (en) 2001-04-11

Family

ID=22087782

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88104623A TW429568B (en) 1998-04-29 1999-03-24 Method for thick film coating via hole sidewalls

Country Status (3)

Country Link
JP (1) JPH11346055A (en)
CN (1) CN1245392A (en)
TW (1) TW429568B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107072073B (en) * 2016-12-29 2019-06-04 中国电子科技集团公司第二研究所 A kind of method of LTCC ceramic chips the via hole
CN107599609A (en) * 2017-10-20 2018-01-19 梅州市志浩电子科技有限公司 The welding resistance screen printing device and method of a kind of printed substrate

Also Published As

Publication number Publication date
JPH11346055A (en) 1999-12-14
CN1245392A (en) 2000-02-23

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