TW429568B - Method for thick film coating via hole sidewalls - Google Patents
Method for thick film coating via hole sidewallsInfo
- Publication number
- TW429568B TW429568B TW88104623A TW88104623A TW429568B TW 429568 B TW429568 B TW 429568B TW 88104623 A TW88104623 A TW 88104623A TW 88104623 A TW88104623 A TW 88104623A TW 429568 B TW429568 B TW 429568B
- Authority
- TW
- Taiwan
- Prior art keywords
- tape
- via hole
- ceramic
- film coating
- removable
- Prior art date
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
A method for thick-film coating at least one via hole formed in a ceramic circuit board. The method involves applying a removable tape to at least one side of a ceramic green tape and forming at least one hole simultaneously through both the ceramic tape and the removable tape. The sidewall of the hole is coated with a film of conductive material and the removable tape is subsequently removed from the ceramic tape, leaving a via hole and uncovering a substrate surface free of smeared conductor. Removable tape layers can be applied to both sides of the green tape, producing via holes with no lip or removable tape can be applied on one side and a stencil can be used on the other.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US6926098A | 1998-04-29 | 1998-04-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW429568B true TW429568B (en) | 2001-04-11 |
Family
ID=22087782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW88104623A TW429568B (en) | 1998-04-29 | 1999-03-24 | Method for thick film coating via hole sidewalls |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPH11346055A (en) |
CN (1) | CN1245392A (en) |
TW (1) | TW429568B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107072073B (en) * | 2016-12-29 | 2019-06-04 | 中国电子科技集团公司第二研究所 | A kind of method of LTCC ceramic chips the via hole |
CN107599609A (en) * | 2017-10-20 | 2018-01-19 | 梅州市志浩电子科技有限公司 | The welding resistance screen printing device and method of a kind of printed substrate |
-
1999
- 1999-03-24 TW TW88104623A patent/TW429568B/en active
- 1999-04-28 CN CN 99106517 patent/CN1245392A/en active Pending
- 1999-04-28 JP JP12086099A patent/JPH11346055A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
JPH11346055A (en) | 1999-12-14 |
CN1245392A (en) | 2000-02-23 |
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