TW429406B - Method for forming metal pads on the surface of a copper wire - Google Patents

Method for forming metal pads on the surface of a copper wire

Info

Publication number
TW429406B
TW429406B TW88122391A TW88122391A TW429406B TW 429406 B TW429406 B TW 429406B TW 88122391 A TW88122391 A TW 88122391A TW 88122391 A TW88122391 A TW 88122391A TW 429406 B TW429406 B TW 429406B
Authority
TW
Taiwan
Prior art keywords
copper wire
thickness
metal
forming
pad
Prior art date
Application number
TW88122391A
Other languages
English (en)
Inventor
Tsu Shih
Chen-Hua Yu
Original Assignee
Taiwan Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg filed Critical Taiwan Semiconductor Mfg
Priority to TW88122391A priority Critical patent/TW429406B/zh
Application granted granted Critical
Publication of TW429406B publication Critical patent/TW429406B/zh

Links

Landscapes

  • Wire Bonding (AREA)
TW88122391A 1999-12-20 1999-12-20 Method for forming metal pads on the surface of a copper wire TW429406B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88122391A TW429406B (en) 1999-12-20 1999-12-20 Method for forming metal pads on the surface of a copper wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88122391A TW429406B (en) 1999-12-20 1999-12-20 Method for forming metal pads on the surface of a copper wire

Publications (1)

Publication Number Publication Date
TW429406B true TW429406B (en) 2001-04-11

Family

ID=21643477

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88122391A TW429406B (en) 1999-12-20 1999-12-20 Method for forming metal pads on the surface of a copper wire

Country Status (1)

Country Link
TW (1) TW429406B (zh)

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MK4A Expiration of patent term of an invention patent