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Priority to TW88122391ApriorityCriticalpatent/TW429406B/en
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Publication of TW429406BpublicationCriticalpatent/TW429406B/en
The present invention provides a method for forming metal pads on the surface of a copper wire, which comprises the steps of: first, providing a semiconductor substrate having a copper wire; forming a passivation layer with a first thickness on the semiconductor substrate, the passivation layer with an opening for exposing the surface of the copper wire; next, forming a metal having a second thickness on the surface of the passivation layer, the metal layer also being filled into the bottom of the opening, the first thickness being larger than the second thickness; then, performing a chemical mechanical polishing method to remove the metal layer outside the opening, so as to leave a metal pad on the surface of the copper wire. In accordance with the present invention, it is able to not only simplify the manufacturing process and prevent the Al pad from eroding but also prevent the surface of the Al pad from being over smooth.
TW88122391A1999-12-201999-12-20Method for forming metal pads on the surface of a copper wire
TW429406B
(en)