TW428023B - Polishing slurry - Google Patents
Polishing slurryInfo
- Publication number
- TW428023B TW428023B TW88101990A TW88101990A TW428023B TW 428023 B TW428023 B TW 428023B TW 88101990 A TW88101990 A TW 88101990A TW 88101990 A TW88101990 A TW 88101990A TW 428023 B TW428023 B TW 428023B
- Authority
- TW
- Taiwan
- Prior art keywords
- weight
- parts
- polishing
- water soluble
- polishing slurry
- Prior art date
Links
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A polishing slurry for chemically mechanically planarizing dielectric layers is disclosed. The slurry comprises: (a) 100 parts by weight of an aqueous medium; (b) 1 to 50 parts by weight of Si02 particles; (c) 0.1 to 10 parts by weight of a pH buffer; and (d) 0.1 to 10 parts by weight of a polishing accelerant selected from the group consisting of water soluble alcohols, water soluble amines, water soluble aminoalcohols, and combinations thereof. The polishing slurry is useful in providing effective polishing to dielectric layers while eliminating metal contamination problems.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW88101990A TW428023B (en) | 1999-02-09 | 1999-02-09 | Polishing slurry |
JP2000015603A JP2000230169A (en) | 1999-02-09 | 2000-01-25 | Slurry for polishing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW88101990A TW428023B (en) | 1999-02-09 | 1999-02-09 | Polishing slurry |
Publications (1)
Publication Number | Publication Date |
---|---|
TW428023B true TW428023B (en) | 2001-04-01 |
Family
ID=21639658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW88101990A TW428023B (en) | 1999-02-09 | 1999-02-09 | Polishing slurry |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2000230169A (en) |
TW (1) | TW428023B (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001319900A (en) * | 2000-05-10 | 2001-11-16 | Toshiba Ceramics Co Ltd | Polishing method of semiconductor substrate |
JP4195212B2 (en) * | 2000-10-23 | 2008-12-10 | 花王株式会社 | Polishing liquid composition |
TWI228538B (en) * | 2000-10-23 | 2005-03-01 | Kao Corp | Polishing composition |
KR20020047417A (en) * | 2000-12-13 | 2002-06-22 | 안복현 | Slurry for polishing metal layer of semiconductor device |
US6682575B2 (en) | 2002-03-05 | 2004-01-27 | Cabot Microelectronics Corporation | Methanol-containing silica-based CMP compositions |
KR100643632B1 (en) | 2005-12-23 | 2006-11-10 | 제일모직주식회사 | Composition of slurry for polishing silicon wafer and method of polishing using thereby |
JP5335183B2 (en) * | 2006-08-24 | 2013-11-06 | 株式会社フジミインコーポレーテッド | Polishing composition and polishing method |
JP2013016832A (en) * | 2012-08-29 | 2013-01-24 | Fujimi Inc | Polishing composition, lpd reduction agent, lpd reduction method using the same |
JP2013021343A (en) * | 2012-08-29 | 2013-01-31 | Fujimi Inc | Lpd reducer, defect reduction method of silicon wafer, and manufacturing method of silicon wafer |
-
1999
- 1999-02-09 TW TW88101990A patent/TW428023B/en not_active IP Right Cessation
-
2000
- 2000-01-25 JP JP2000015603A patent/JP2000230169A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2000230169A (en) | 2000-08-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2005033234A3 (en) | Novel slurry for chemical mechanical polishing of metals | |
TW365028B (en) | Improved polishing slurries and methods for their use | |
WO2003072669A3 (en) | Polishing composition | |
TW428023B (en) | Polishing slurry | |
EP0933166A4 (en) | Abrasive and method for polishing semiconductor substrate | |
MY127266A (en) | Aqueous dispersion, a process for the preparation and the use thereof | |
EP1602444A3 (en) | Polishing method | |
MY120573A (en) | Slurry comprising a ligand or chelating agent for polishing a surface. | |
WO2000000560A3 (en) | Chemical mechanical polishing slurry and method for using same | |
WO1997013889B1 (en) | Improved polishing slurries and methods for their use | |
GB2402418A (en) | Concentrated suspensions | |
TW200605263A (en) | Polishing composition and polishing method | |
TW365563B (en) | Polishing agent for semiconductor and method for its production | |
WO2006115581A3 (en) | Composition and method for polishing a sapphire surface | |
TW501197B (en) | Polishing compound for chemical mechanical polishing and method for polishing substrate | |
MY112735A (en) | Chemical mechanical polishing slurry for metal layers | |
AU2001293125A1 (en) | Tool for applying resilient tape to chuck used for grinding or polishing wafers | |
MY132376A (en) | Fluoride additive containing chemical mechanical polishing slurry and method for use of same | |
MY119075A (en) | Colloidal silica slurry for nip plated disk polishing | |
AU3179597A (en) | Silica which can be used in toothpaste compositions | |
WO2004076575A3 (en) | Modular barrier removal polishing slurry | |
MY118116A (en) | Method of polishing a memory or rigid disk with an ammonia and/or halide-containing composition | |
MY138857A (en) | High selectivity colloidal silica slurry | |
AU2002234154A1 (en) | Method and apparatus for improving the efficiency of cache memories using stored activity measures | |
WO2007041199A3 (en) | Polishing slurries and methods for utilizing same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |