經濟部智慧財產局員工消費合作社印製 425 5 9； at - , . ； -· _____ B7 五、發明說明（1 ) 本發明係關於’例如在液晶顯示器（Liquid Crystal Display: LCD)使用之玻璃基板（glass substrate)上塗敷抗 蝕液（Photo-resist solution)，施加顯像處理之處理系統- 舉例言之’在LCD之製造過程，為了在LCD用之玻璃 基板上形成ITC)(Indium Tin Oxide)之薄膜或電極田型 (electrode pattern) ’利用舆製造半導體裝置時使用者一樣 之光技術（photo-lithography technique)。光技術係將抗液 .塗在玻璃基板上，將其曝光然後進行顯像處理。 舉例言之，將抗液塗在玻璃基板上之系統，係首先藉 清洗裝置對玻璃基板進行洗滌（scrubber)清洗，經加熱裝 置加熱乾燥後，以冷卻裝置冷卻，再以抗蝕液塗敷裝置塗 敷抗蝕液，然後以加熱裝置後烘焙（post-baking)後，用冷 卻裝置冷卻》 例如第7圊所示，這種系統係沿著運送裝置101行駛之 運送路102，配置冷卻裝置103、抗蝕液塗敷裝置104、加 熱裝置105等。 而，例如以抗蝕液塗敷裝置104為中心考量時，則從 冷卻裝置103經由運送路102，將玻璃基板G運送到抗蝕液 塗敷裝置104(該圈（1>之製程），而塗敷抗蝕液。然後，此 玻璃基板G則經由運送路102，從抗蝕液塗敷裝置104運 送到加熱裝置1〇5(該圓（2)之製程）· 然而，在這種系統，因為一個運送裝置101負責對抗 蝕液塗敷裝置104等之一個處理部運送與運出之兩個製程（ 第6圈之（1)(2))，因此有很難提高系統整体之處理能力之 本紙張尺度適用中國國家標準（CNS)A4規格（2〗0 X 297公« ) <請先闉讀背面之注意事項再填寫本頁) ' -^ k»t n > n —r I— I 線---------b-IL---------- ! 4 4 經濟部智省財產.局員工消费合作杜印製 A7 425598 __B7___ 五、發明說明（2 ) 課題。 本發明在解決上述課題，其目的在提供，能夠提高系 統整体之處理能力之處理系統。 而本發明之另_個目的在提供，能夠階段式擴充系統 之處理能力之處理系統》 為了解決上述課題，本發明可提供，對被處理体依序 施加多種處理之處理系統，其特徵在於，具佛有：並排配 設之直線狀之多數運送路；夾著上述多數運送路之各運送 路，依處理之順序排列用以進行上述多種處理之各處理之 多數處理部；以及’以可移動狀配置在上述運送路上，在 上述處理部間移交被處理体之運送裝置；上述各處理部具 俄有’沿著上述各運送路進行同一處理之多數處理單元。 依據這種架構時’因為能夠分別以不同之運送構件， 將被處理体運入處理部，及從處理部運出被處理体，而且 可沿著依順序排列被處理体之處理部，向單一方向運送、 處理，因此可以減輕運送構件之負荷，其結果，能夠提高 系統整体之處理能力。 依據本發明之第丨實施形態時，設在各處理部之處理 單元之部數，係依該處理部之處理時間之長短決定。這時 之設在各處理部之處理單元之部數，最好是設定成，所有 處理部之以處理單元之部數除每一處理部之處理時間之時 間大致相等。設在各處理部之處理單元之部數，也可以是 設定成，以處理單元之部數除每一處理部之處理時間之時 間大致上等於上述運送裝置之運送時間。 巧張尺度適用中超困家標準（CNS)A4規格⑽x 297公爱）----- -5 - — — —— — — —— — —III — — — — ——I— «———III — — (請先閱讀背面之注意事項再填寫本頁) 425598 A7 ___B7 經濟部智慧財產局員工消費合作社印製Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 425 5 9; at-,.;--_____ B7 V. Description of the Invention (1) The present invention relates to a glass substrate used in, for example, a liquid crystal display (Liquid Crystal Display: LCD) (Glass substrate) Photo-resist solution is applied to the processing system-for example, in the LCD manufacturing process, in order to form ITC on the glass substrate for LCD (Indium Tin Oxide) The thin film or electrode pattern ('electrode pattern') utilizes the same photo-lithography technique used when manufacturing semiconductor devices. Optical technology applies a liquid-resistant coating on a glass substrate, exposes it, and performs development processing. For example, a system for applying a liquid-resistant coating on a glass substrate is a scrubbing method for cleaning the glass substrate by a cleaning device. After being heated and dried by a heating device, it is cooled by a cooling device and then a resist coating device is used. Apply a resist solution, and then post-baking with a heating device and then cool it with a cooling device. For example, as shown in Figure 7), this system is a cooling device 103 along a transport path 102 running on a transport device 101 , Resist coating device 104, heating device 105, and the like. For example, when considering the resist coating device 104 as a center, the glass substrate G is transferred from the cooling device 103 to the resist coating device 104 through the transport path 102 (the circle (1 > process), and The resist is applied. Then, the glass substrate G is transported from the resist application device 104 to the heating device 105 via the transport path 102 (the process of the circle (2)). However, in this system, Since one transporting device 101 is responsible for the two processes of transporting and unloading a processing unit such as the resist coating device 104 (the sixth circle (1) (2)), it is difficult to improve the overall processing capacity of the system. This paper size applies to China National Standard (CNS) A4 specifications (2) 0 X 297 male «) < Please read the notes on the back before filling in this page) '-^ k» tn > n —r I— I Line --------- b-IL ----------! 4 4 Consumption Cooperation of Employees of Intellectual Property Department of the Ministry of Economic Affairs, printed by A7 425598 __B7___ V. Description of Invention (2) Subject . The present invention has been made to solve the above-mentioned problems, and an object thereof is to provide a processing system capable of improving the processing capacity of the entire system. Another object of the present invention is to provide a processing system capable of expanding the processing capacity of the system in stages. In order to solve the above-mentioned problems, the present invention can provide a processing system that sequentially applies a variety of processes to a subject, which is characterized by: There are: a plurality of linear transport paths arranged side by side; each transport path sandwiching the above-mentioned plurality of transport paths, arranged in the order of processing, a plurality of processing sections for performing each of the above-mentioned various processes; and 'movable A transport device that is arranged on the transport path and transfers the object to be processed between the processing sections; each of the processing sections includes a plurality of processing units that perform the same processing along the respective transport paths. According to this structure, 'the processing object can be transported into the processing unit and the processing object can be transported from the processing unit separately with different transport components, and the processing unit of the processing body can be arranged along the order to a single unit. The direction of transportation and processing can reduce the load on the transportation components. As a result, the overall processing capacity of the system can be improved. According to the first embodiment of the present invention, the number of processing units provided in each processing unit is determined by the processing time of the processing unit. At this time, the number of processing units provided in each processing unit is preferably set so that the time for all processing units divided by the number of processing units divided by the processing time of each processing unit is approximately equal. The number of processing units provided in each processing unit may also be set so that the time of dividing the processing time of each processing unit by the number of processing units is approximately equal to the transportation time of the above-mentioned transportation device. The size of the cookie sheet applies to the CNS A4 specification ⑽ x 297 public love) ----- -5-— — — — — — — — — — — — — — — — — — — — — III — — (Please read the notes on the back before filling out this page) 425598 A7 ___B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs
五、發明說明（3 ) 同時，依據本發明之第1實施形態時，本系統最好進 一步備有，用以收容，選擇從上一處理部之處理單元運送 被處理基板之下一處理部之處理單元之選擇規則之選擇規 則收容部，以及，依據上述選擇規則控制上述運送裝置， 將被處理基板從前一處理部之處理單元運送到下一單元之 控制裝置。 這個時候，上述選择規則可以含有多數條件，而最好 含有上述運送裝置之移動距離為最短之條件。同時，上述 選擇規則也可以含有多數條件，而至少含有上述運送裝置 之移交時間為最短之條件。 並且，依據本發明之第1實施形態時，最好有可以判 斷上述各處理部之各處理單元内是否有被處理基板存在之 判斷構件’上述控制裝置則將此判斷裝置之判斷結果應用 在上述選擇規則’藉此選擇運送被處理体之處理單元。 茲參照附圈，說明本發明之實形態如下。 第1圖係本發明一實施形態之抗蝕液塗敷系統之平面圖。 如第1圈所示，在此抗姓液塗數系統1之前方（紙面左 側）設有用以將玻璃基板G運入抗蝕液塗敷系統1之運入部 2。並在此抗姓液塗敷系統1之後方（紙面右方），設有用以 從抗蝕液塗敷系統1運出玻璃基板G之運出部3。 運入部2設有，將分別收容有例如25片玻璃基板g之 卡匣C(cassette)排列在一定位置，而載置之卡匣栽置台4 。而運出部3則設有，將分別收容有例如25片玻璃基板G ------------〇 I· ί請先閱讀背面之注意事項再填寫本頁) ' a— ϋ fen 一&, I It 線丨f '---------V. Description of the invention (3) At the same time, according to the first embodiment of the present invention, the system is preferably further provided for accommodating and selecting to transport the processing unit below the processing unit from the processing unit of the previous processing unit. A selection rule storage section of a selection rule of the processing unit, and the above-mentioned selection rule is used to control the above-mentioned transport device to transport the substrate to be processed from the processing unit of the previous processing section to the control device of the next unit. At this time, the above selection rule may include a plurality of conditions, and it is preferable to include a condition that the moving distance of the conveying device is the shortest. At the same time, the above-mentioned selection rule may also include a plurality of conditions, and at least the condition that the transfer time of the transportation device is the shortest. In addition, according to the first embodiment of the present invention, it is preferable to have a judging means capable of judging whether a substrate to be processed exists in each processing unit of each of the processing sections. The selection rule 'thereby selects a processing unit for transporting the object to be processed. The actual form of the present invention will be described below with reference to the attached circle. FIG. 1 is a plan view of a resist coating system according to an embodiment of the present invention. As shown in the first circle, a carry-in section 2 for carrying the glass substrate G into the resist coating system 1 is provided in front of (the left side of the paper surface) the anti-surname liquid coating system 1. Behind this anti-liquid coating system 1 (to the right of the paper surface), there is provided a carry-out section 3 for carrying out the glass substrate G from the resist coating system 1. The carry-in section 2 is provided with cassettes C (cassettes) each containing, for example, 25 glass substrates g arranged at a certain position, and a cassette mounting table 4 placed thereon. The shipment 3 is provided with 25 glass substrates G, respectively. ------------ 〇I · ί Please read the precautions on the back before filling in this page) 'a— ϋ fen a &, I It line 丨 f '---------
hi. I LI 本紙張尺度適用中國國家標準（CNS)A4規格（210 * 297公釐） 6 A7 B7 42559 8 •.一 / 經 濟 部 智 '慧 I- 局 員 工1 消 費 合 社 印 五、發明說明（4 之卡匣C(cassette)排列在一定位置，而載置之卡匣載置台 在運入部2與運出部3之問，大致平狀行並排設有直線 狀之多數.，本例為7條運送路6〜12。而在各運送路6〜12 配置有處理部13〜18。處理部13〜18係用以對玻璃基板G分 別施加不同之處理者。 更具体是，例如，此抗蝕液塗敷系統1係以，洗滌— 加熱乾燥—冷卻—塗敷抗飪液—後烘焙_>冷卻之順序進行 處理。因此，在第1列之運送路6與第2列之運送路7之間， 配置具有多數清洗處理單元（SCR)之清洗處理部13，在第 2列之運送路7與第3列之運送路8之間，配置具有多數加熱 處理單元（HP)之第1加熱處理部14,在第3列之運送路8與 第4列之運送路9之間，配置具有多數冷卻處理單元（C〇L) 之第1冷卻處理部15，在第4列之運送路9與第5列之運送路 10之間，配置具有多數抗蝕液塗敷單元（CT)之抗蝕液塗敷 處理部16 ’在第5列之運送路1〇舆第6列之運送路11之間， 配置具有多數加熱單元（HP)之第2加熱處理部17，在第6列 之運送路11與第7列之運送路12之間，配置具有多數冷卻 單元（COL)之第2冷卻處理部18。 在此，上述清洗處理部13之清洗單元（SCR)，係令玻 璃基板G在杯（cup)内轉動，而洗滌此玻璃基板G上》上述 第1加熱處理部Η之加熱單元（HP)係用以加熱乾燥清洗後 之玻璃基板G。上述第1冷卻處理部15之冷卻單元（0〇!^>係 用以冷卻加熱乾燥之玻璃基板G»抗蝕液塗敷單元（CT)係 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公:s ) — — — — — — — — — - — I— 1111111 ·11111111 (靖先《讀背面之注意事項再填寫本頁} '42559 8 Λ. A/ I------ B7 五、發明說明（5 ) 用以使在杯内冷卻之玻璃基板G轉動，同時向此玻璃基板 G上供應抗蝕液。上述第2加熱處理部π之加熱單元（HP) 係用以烘焙塗敷抗蝕液之玻璃基板G·而上述第2冷卻處 理部18之冷卻單元（C0L)係用以冷卻烘焙過之玻璃基板g 〇 在此等處理部13〜18之中，屬於烤爐系之處理部之第 1、第2加熱處理部14、17，第1、第2冷卻處理部15，18， 因高度較屬於杯系之處理部之清洗處理部13及抗蝕液塗敷 處理部16為低，因此構成為多層，例如上下兩層。藉此可 以縮短運送路，減少佔用空間》 又如第2圈所示，在各處理部u~18之一側設有運入 玻璃基板G之運入口 31，在各處理部13〜18之另一側設有 運出玻璃基板G之運出口 32。 在各運送路6〜12成可移動狀配置有運送裝置19 ·如 第3圖所示，此運送裝置19備有，可沿運送路6〜12移動之 本体20，可對裝置本体20上下移動及轉動之基座構件 21 (base member)，及可以在基座搆件21上沿水平方向移 動之基板支持構件22。而基座構件21之中央部與裝置本体 20，係由連結部23連結在一起》由設在裝置本体20内之 未圖示之馬達，使連結部23上下移動或轉動，則可使基座 構件21上下移動或轉動。藉這種基座構件21之上下移動或 轉動，及基板支持構件22之水平移動，而運送玻璃基板G 。記號24係引導基板支持構件22之導軌。 在此，假設運送裝置19動作一次需10秒，清洗處理部 本紙張尺度適用中國國家標準（CNS>A4規格（210 X 297公爱） <請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消费合作社印製 Λί-----—1— 訂 ----- ϋ I . H ϋ n i _ d 經濟部智嚷財產局員工消費合作社印製 A： 425598 B7 、發明說明（6 ) 13動作一次需120秒，第1加熱處理部14動作一次需180秒 ’第1冷卻處理部15動作一次需120秒，抗蝕液塗敷處理部 16動作一次需60秒，第2加熱處理部17動作一次需180秒， 第2冷卻處理部18動作一次需180秒。而在本實施形態系統 之各處理單元之部數係設定為，以設在處理部之各處理單 元之部數除各處理部13〜18之處理時間（一次動作）之值大 致上等於一部運送裝置19之運送時間（_次動作）。 具体言之，清洗處理部13有12部清洗處理單元（SCR) ，第1加熱處理部14有18部加熱處理單元（HP)，第1冷卻處 理部15有12部冷卻處理單元（COL)，抗蝕液塗敷處理部16 有6部抗飪液塗敷單元（CT)，第2加熱處理部17有18部加熱 處理單元（HP)，第2冷卻處理部18有18部冷卻處理單元 (COL)。因此整個系統之一次動作需要10秒。但上述數目 係將系統最合適化時之數目，當然可以在引進系統時，設 置具有需要部數之處理單元之各處理裝置13〜18，而在必 要時分階段增加。藉此可以分階段投資，而且可以做合乎 處理性能（process performance)之最合適之投資》 再參照第4圖，說明如此構成之處理系統1之動作如下 〇 收容在運入部2之卡匣C之玻璃基板G，係經由第1列 之運送路6，運送到清洗處理部丨3之清洗處理單元（SCR)( 第4圈（1)之製程）。在清洗處理單元（SCR)清洗後之玻璃基 板G，則經由第2列之運送路7運送到第1加熱處理部Η之 加熱處理單元（HP)(第4圖（2)之製程）〇在加熱處理單元（HP) 本紙張尺度適用中國困家標準（CNS)A4規格（210x297公a ) ------— — — — —— — - I I I I I I I « — — — — — I— (請先Hil背面之注意事項再填寫本頁) 9 經濟部智慧財產局員工消费合作社印裂 425598 ’，：， '. A7 ____B：_ 五、發明說明（7 ) 加熱乾燥之玻璃基板G，則經由第3列之運送路8運送到第 1冷卻處理部15冷卻處理單元（COL)(第4圖（3)之製程）〇 在冷卻處理單元（COL)冷卻後之玻璃基板G，則經由第4列 之運送路9運送到抗蝕液塗敷處理部16之抗飪液塗敷單元 (CT)(第4圖（4)之製程）。在抗蝕液塗敷單元（CT)塗敷抗蝕 液之破璃基板G，則經由第5列之運送路10運送到第2加 熱處理部17之加熱處理單元（HP)(第4圖（5)之製程）》在加 熱處理單元（HP)經過後烘焙之玻璃基板G，則經由第6列 之運送路11運送到第2冷卻處理部18冷卻處理單元（COL)( 第4困（6)之製程）·而在此冷卻處理單元（c〇L)冷卻之玻璃 基板G，則經由第7列之運送路12運送到運出部3(第4圖（7) 之製程）’收容在運出部3之卡匣C。再者，運出部3之卡匣 C在收容玻璃基板G後，便由自動行駛運送裝置（AGV)運 送到曝光裝置》 其次，再說明此處理系統1之控制系統。 上述處理系統之各處理部13〜18分別具有多數處理單 元’但現實上重要的是要使用那一個處理單元進行處理。 因此，本裝置有第6囷所示之控制系統》 此控制系統係由中央控制裝置40、設在各處理部 13〜18之用以檢出各處理部13〜18之空處理單元之感測器 41a〜41f、收容處理單元之選擇規則之處理單元選擇規則 收容部42、設在上述中央控制裝置40，依據上述單元選擇 規則及上述感測器41之檢出结果，選擇在下一處理部 13〜18要處理之之處理單元之處理單元選擇部43、以及， 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） (請先Μίι背面之ii意事項再填寫本頁) ,ο________________._________^___:__________ 10 42559 8 € 經濟部智慧財產局員工消费合作社印製 五、發明說明（8 ) 依據此處理單元選擇部43之決定，控制配置在上述各處理 部13〜18間之各運送路7〜12之運送裝置19之運送裝置控制 部44所構成， 收容在上述選擇規則收容部42之處理單元之選擇規則 ’可決定，例如選擇最靠近前一處理單元（或運送時間最 短）之處理單元，且能夠使用所有之處理單元，不會有遺 漏。這種選擇規則有下列： (1) 在清洗處理部1 ’由紙面上側之清洗處理單元（Scr) 向紙面下側順序使用，使用到最下側之清洗處理單元（SCR) 後，則再度從最上側之清洗處理單元（SCR)開始使用； (2) 選擇下一處理部14〜18之處理單元時，應選擇最靠 近前一處理部之處理單元之處理單元； (3) 在述（2)若同一距離有多數處理單元時，令位於紙 面上側之處理單元優先； (4) 依據上述感測器41判斷是錯誤之處理單元不選擇 :等規則。 再者，上述感測器41a〜41f設在各處理部13〜18之各處 理單元内，只要能判斷該單元内是否有收容基板〇即可》 也可以使用各處理單元内之基板保持裝置之動作信號，判 斷各單元内是否有基板存在，以取代感測器。 如此，本實施形態之處理系統丨能夠分別以不同之運 送裝置19,執行將玻璃基板G運入各處理部13〜18，及從 處理部13〜18運出玻璃基板G*而且是如第4圖之〜(7)之 製程，沿著按玻璃基板G之處理順序排列之處理部13〜18 本紙張尺度適用中國國家標準（CNS)A4規格（210 * 297公釐） --------------裝— ί請先閲讀背面之注意事項再填寫本頁) 幻· 線. 11 A7 425598 _____B7__ 五、發明說明（9 ) ，向一個方向運送處理，因此可以減輕運送裝置丨9之負荷 。而通常系統之節拍（一次動作）係依運送裝置之節拍，因 (請先Μ讀背面之注t事項再填寫本頁) 此’如此減輕運送裝置之負荷，即可提高系統整体之處理 能力。 再者，本發明不限定如上述實施形態，可在其技術範 圍内做各種改變β 例如’上述實施形態係將本發明應用在抗蝕液塗敷系 統’但也可以應用在其他系統，例如顯像處理系統。 也可以如第6圈所示，在爆光裝置51之一側設運入玻 璃基板G之運入口 52,在另一侧設運出玻璃基板G之運出 口 53，將應用本發明之抗蝕液塗敷系統54連接在曝光裝置 51之運出口 53，以連貫處理塗敷抗蝕液―曝光處理—顯像 處理》 而且，本發明係以SLCD之玻璃基板G之處理系統為 例子進行說明，當然也可以應用在處理半導體晶圓等之其 他基板之系統。 圖式之簡單說明 經濟部智慧財產局員工消费合作社印製 第1围係本發明一實施形態之抗蝕液塗敷系統（resist coating system)之平面圖。 第2圖係表示第1圖所示處理部之架構之斜視圖。 第3圓係表示運送裝置之架構之斜視圖。 第4圓係表示第丨圈所示之抗蝕液塗敷系統之處理流程 圈β 第5®係表示第1困所示之抗蝕液塗敷系統之控制系統 本紙張尺度適用中固國家標準（CNS)A4規格（210*297公釐） 12 A7 4 255 9 8 B7 五、發明說明（10 ) 之方塊圖。 第6圈係本發明其他實施形態之處理系統之平面圖。 第7圖係傳統之抗蝕液塗敷系統之說明圈。 II — — — — — — — — — —· ) I t 1 I I I « — — — 111 — — <請先閱讀背面之注意Ϋ項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 13hi. I LI This paper size is in accordance with Chinese National Standard (CNS) A4 (210 * 297 mm) 6 A7 B7 42559 8 (The cassettes C (cassette) of 4 are arranged at a certain position, and the cassette loading table is placed in the loading section 2 and the discharging section 3, and a linear majority is arranged in a substantially flat line side by side. This example is There are 7 conveying paths 6 to 12. And each of the conveying paths 6 to 12 is provided with processing sections 13 to 18. The processing sections 13 to 18 are used to apply different processors to the glass substrate G, respectively. More specifically, for example, this The resist coating system 1 performs processing in the order of washing, heating, drying, cooling, applying anti-cooking liquid, and post-baking. ≫ Cooling. Therefore, it is transported on the transport path 6 in the first row and transported in the second row. A cleaning processing unit 13 having a plurality of cleaning processing units (SCR) is arranged between the paths 7, and a second heating processing unit (HP) having a plurality of heating processing units (HP) is arranged between the transportation path 7 in the second row and the transportation path 8 in the third row. 1 The heat treatment section 14 is arranged between the transport path 8 in the third row and the transport path 9 in the fourth row, and has a large number of coolings. The first cooling treatment section 15 of the processing unit (C0L) is provided with a resist solution having a large number of resist coating units (CT) between the transport path 9 in the fourth row and the transport path 10 in the fifth row. The coating treatment section 16 ′ is arranged between the transportation path 11 in the fifth row and the transportation path 11 in the sixth row, and the second heating treatment section 17 having a large number of heating units (HP) is arranged in the transportation path 11 in the sixth row. A second cooling processing unit 18 having a plurality of cooling units (COL) is arranged between the conveying path 12 in the seventh column. Here, the cleaning unit (SCR) of the cleaning processing unit 13 is configured such that the glass substrate G is placed in a cup ( cup) to wash the glass substrate G. The heating unit (HP) of the above-mentioned first heat treatment section Η is used to heat, dry and clean the glass substrate G. The cooling unit (0) of the first cooling treatment section 15 〇! ^ ≫ It is a glass substrate for cooling, heating and drying. G »Corrosion Coating Unit (CT) is the paper size applicable to China National Standard (CNS) A4 (210 X 297 male: s) — — — — — — — — — — — I— 1111111 · 11111111 (Jing Xian, "Read the notes on the back side and fill out this page} '42559 8 Λ. A / I ------ B7 V. Description of the invention (5) The glass substrate G cooled in the cup is rotated, and a resist is supplied to the glass substrate G at the same time. The heating unit of the second heat treatment part π described above (HP) is used to bake the glass substrate G coated with the resist solution, and the cooling unit (C0L) of the second cooling processing section 18 is used to cool the baked glass substrate g. 〇 In these processing sections 13 to 18 Among them, the first and second heating processing sections 14, 17 and the first and second cooling processing sections 15, 18 belonging to the processing section of the oven system are higher than the cleaning processing section 13 and Since the resist coating processing section 16 is low, it has a multilayer structure, for example, two layers above and below. As a result, the transport path can be shortened and the space occupied can be reduced. As shown in the second circle, a transport port 31 for loading the glass substrate G is provided on one side of each processing unit u-18, and another processing unit 13-18 is separately provided. A transport port 32 for transporting the glass substrate G is provided on one side. A transport device 19 is movably arranged in each of the transport paths 6 to 12. As shown in FIG. 3, this transport device 19 is provided with a body 20 that can move along the transport paths 6 to 12 and can move the apparatus body 20 up and down. And a rotating base member 21 (base member), and a substrate supporting member 22 that can be moved on the base member 21 in a horizontal direction. The central portion of the base member 21 and the device body 20 are connected by a connecting portion 23. The base portion 21 can be moved or rotated by a motor (not shown) provided in the device body 20 to make the base The member 21 moves up or down. By moving or rotating the base member 21 up and down and the horizontal movement of the substrate supporting member 22, the glass substrate G is transported. The reference numeral 24 is a guide rail that guides the substrate supporting member 22. Here, assuming that it takes 10 seconds for the transport device 19 to operate once, the paper size of the cleaning and processing department applies the Chinese national standard (CNS > A4 specification (210 X 297 public love) < please read the precautions on the back before filling this page) Economy Printed by the Employees ’Cooperatives of the Ministry of Intellectual Property Bureau Λί ------ 1— Order ------I. H ϋ ni _ d Printed by the Employees’ Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A: 425598 B7 、 Instructions for Invention (6) The action of 13 takes 120 seconds at a time, the first heat treatment portion 14 takes 180 seconds at a time. The first cooling treatment portion 15 takes 120 seconds at a time, the resist coating treatment portion 16 takes 60 seconds at a time, and the second It takes 180 seconds for the heat treatment section 17 to operate once, and 180 seconds for the second cooling treatment section 18 to operate once. The number of parts of each processing unit in the system of this embodiment is set so that the value of dividing the number of parts of each processing unit provided in the processing part by the processing time (one operation) of each processing part 13 to 18 is approximately equal to one. Transport time of the transport device 19 (_times). Specifically, the cleaning processing unit 13 has 12 cleaning processing units (SCR), the first heating processing unit 14 has 18 heating processing units (HP), and the first cooling processing unit 15 has 12 cooling processing units (COL). The resist coating processing section 16 has 6 anti-cooking liquid coating units (CT), the second heating processing section 17 has 18 heating processing units (HP), and the second cooling processing section 18 has 18 cooling processing units ( COL). Therefore, one action of the entire system takes 10 seconds. However, the above number is the number when the system is most suitable. Of course, when the system is introduced, each processing device 13 to 18 having a required number of processing units can be set, and increased in stages when necessary. This allows you to invest in stages and make the most suitable investment in terms of process performance. "With reference to Figure 4, the operation of the processing system 1 thus constructed is described below. The glass substrate G is transported to the cleaning processing unit (SCR) of the cleaning processing unit 丨 3 via the conveying path 6 in the first row (the process of the fourth circle (1)). After the glass substrate G is cleaned by the cleaning processing unit (SCR), it is transported to the heating processing unit (HP) of the first heating processing unit 经由 via the conveying path 7 in the second row (the manufacturing process of FIG. 4 (2)). Heat treatment unit (HP) This paper size is applicable to China Standard for Household Standards (CNS) A4 (210x297mma) --------------IIIIIII «— — — — — I— (please first Note on the back of Hil, please fill out this page again) 9 The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed 425598 ',:,'. A7 ____ B: _ V. Description of the invention (7) The heat-dried glass substrate G is passed through the 3rd The line 8 is transported to the first cooling processing unit 15 to the cooling processing unit (COL) (the process of FIG. 4 (3)). The glass substrate G cooled by the cooling processing unit (COL) passes through the fourth column. The conveyance path 9 conveys the anti-cooking liquid application unit (CT) of the resist application processing part 16 (the process of FIG. 4 (4)). The glass substrate G on which the resist is applied to the resist application unit (CT) is transported to the heat treatment unit (HP) of the second heat treatment unit 17 via the transport path 10 in the fifth row (Fig. 4 ( 5) Process)》 After the heat treatment unit (HP) passes through the baked glass substrate G, it is transported to the second cooling treatment unit 18 through the conveying path 11 in the sixth column to the cooling treatment unit (COL) (the fourth sleepy (6 ))) And the glass substrate G cooled in this cooling processing unit (c0L) is transported to the unloading unit 3 via the transport line 12 in the seventh column (process of FIG. 4 (7)) and is contained in Cartridge C of transport section 3. Furthermore, after the cassette C of the carrying-out section 3 contains the glass substrate G, it is transported to the exposure device by an automatic driving and conveying device (AGV). Next, the control system of the processing system 1 will be described. Each of the processing units 13 to 18 of the above-mentioned processing system has a plurality of processing units', but it is important in practice to use which processing unit to perform processing. Therefore, this device has the control system shown in 6). This control system is a central control device 40, which is located in each processing unit 13 ~ 18 and detects the empty processing units of each processing unit 13 ~ 18. 41a to 41f, a processing unit selection rule storage section 42 that stores the selection rules of the processing unit, and a central control device 40 provided in the above, and selects the next processing section 13 based on the unit selection rule and the detection result of the sensor 41 ~ 18 The processing unit selection section 43 of the processing unit to be processed, and this paper size applies the Chinese National Standard (CNS) A4 specification (210 x 297 mm) (please fill in this page on the back of the item) , ο ________________._________ ^ ___: __________ 10 42559 8 € Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (8) According to the decision of this processing unit selection section 43, the control is arranged in the 13 ~ 18 processing sections The transport device control section 44 of the transport device 19 of each of the transport paths 7 to 12 is configured, and the selection rule of the processing unit stored in the above-mentioned selection rule storage section 42 can be determined, for example, selecting A processing unit closest to the front (or the shortest transit time) of the processing unit, and able to use all of the processing units, there will be no omissions. The selection rules are as follows: (1) The cleaning processing unit 1 'is used sequentially from the cleaning processing unit (Scr) on the paper surface to the lower side of the paper surface. After the lowermost cleaning processing unit (SCR) is used, it is re-used from The uppermost cleaning processing unit (SCR) starts to be used; (2) When selecting the processing unit of the next processing unit 14 ~ 18, the processing unit closest to the processing unit of the previous processing unit should be selected; (3) In (2) ) If there are a large number of processing units at the same distance, the processing unit located on the upper side of the paper is given priority; (4) The processing unit judged to be an error according to the sensor 41 above does not choose: and other rules. In addition, the sensors 41a to 41f are provided in each processing unit of each processing unit 13 to 18, as long as it can determine whether a substrate is accommodated in the unit. Alternatively, a substrate holding device in each processing unit may be used. The operation signal determines whether a substrate exists in each unit to replace the sensor. In this way, the processing system of this embodiment can carry out the glass substrate G into the processing sections 13 to 18 and the glass substrate G * from the processing sections 13 to 18 by using different conveying devices 19, respectively. The process of ~ (7) in the figure, along the processing sections 13 ~ 18 arranged in the processing order of the glass substrate G. This paper size applies the Chinese National Standard (CNS) A4 specification (210 * 297 mm) ------ -------- Loading — Please read the precautions on the back before filling out this page) Magic line. 11 A7 425598 _____B7__ 5. Description of the invention (9), transport in one direction, so the transport device can be reduced丨 9 load. However, the system's tempo (one action) is usually based on the tempo of the delivery device, because (please read the note t on the back before filling out this page) This ’will reduce the load on the delivery device and increase the overall processing capacity of the system. Furthermore, the present invention is not limited to the above-mentioned embodiments, and various changes can be made within its technical scope. For example, the above-mentioned embodiment applies the present invention to a resist coating system, but it can also be applied to other systems such as display Like processing system. As shown in the sixth circle, an entrance 52 for carrying the glass substrate G on one side of the exposure device 51 and an exit 53 for carrying the glass substrate G on the other side may be provided. The resist solution of the present invention will be applied The coating system 54 is connected to the exit port 53 of the exposure device 51, and applies the resist solution in a continuous process—exposure process—developing process. In addition, the present invention is described using a processing system of a glass substrate G of an SLCD as an example. It can also be applied to systems that process other substrates such as semiconductor wafers. Brief description of the drawing Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The first area is a plan view of a resist coating system according to an embodiment of the present invention. Fig. 2 is a perspective view showing the structure of the processing unit shown in Fig. 1. The third circle is a perspective view showing the structure of the transport device. The fourth circle represents the processing flow of the resist coating system shown in the first circle. Β The fifth circle represents the control system of the resist coating system shown in the first one. The paper size applies to the national solid standard. (CNS) A4 specification (210 * 297 mm) 12 A7 4 255 9 8 B7 5. Block diagram of the description of the invention (10). The sixth circle is a plan view of a processing system according to another embodiment of the present invention. Fig. 7 is an explanatory circle of a conventional resist coating system. II — — — — — — — — — — —) I t 1 III «— — — 111 — — < Please read the note on the back before filling out this page) Printed by the Intellectual Property Bureau Staff Consumer Cooperatives, Ministry of Economic Affairs Paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 13