TW419934B - Fixture for module device production - Google Patents
Fixture for module device production Download PDFInfo
- Publication number
- TW419934B TW419934B TW087117906A TW87117906A TW419934B TW 419934 B TW419934 B TW 419934B TW 087117906 A TW087117906 A TW 087117906A TW 87117906 A TW87117906 A TW 87117906A TW 419934 B TW419934 B TW 419934B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- module device
- pcb
- fixed
- jig
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 238000009434 installation Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 description 10
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 10
- 238000005192 partition Methods 0.000 description 7
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000006187 pill Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019970059115A KR100514039B1 (ko) | 1997-11-10 | 1997-11-10 | 메모리모듈제조용지그 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW419934B true TW419934B (en) | 2001-01-21 |
Family
ID=19524483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW087117906A TW419934B (en) | 1997-11-10 | 1998-10-28 | Fixture for module device production |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH11224983A (ja) |
| KR (1) | KR100514039B1 (ja) |
| TW (1) | TW419934B (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100415940B1 (ko) * | 2001-05-08 | 2004-01-24 | 위테크주식회사 | 인쇄회로기판 고정장치 |
| KR20030049076A (ko) * | 2001-12-14 | 2003-06-25 | (주)엠이씨 | 인쇄회로기판 고정용 지그 |
| KR20030064079A (ko) * | 2002-01-25 | 2003-07-31 | 이성근 | 에스엠티 공정용 피씨비 지그 |
| KR101461118B1 (ko) * | 2008-11-18 | 2014-11-14 | 한미반도체 주식회사 | 반도체 패키지 가공용 지그 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0637472A (ja) * | 1992-07-17 | 1994-02-10 | Matsushita Electric Ind Co Ltd | プリント配線基板保持装置 |
| JPH08330763A (ja) * | 1995-06-01 | 1996-12-13 | Toyo Commun Equip Co Ltd | プリント基板用ホルダーの構造 |
| KR19980015036A (ko) * | 1996-08-14 | 1998-05-25 | 김광호 | 범용성을 갖는 단배열 모듈용 인쇄회로기판 고정용 지그 |
| KR100222296B1 (ko) * | 1996-10-10 | 1999-10-01 | 윤종용 | 범용성을 갖는 단배열 모듈용 인쇄회로기판 고정용 지그 |
-
1997
- 1997-11-10 KR KR1019970059115A patent/KR100514039B1/ko not_active IP Right Cessation
-
1998
- 1998-10-28 TW TW087117906A patent/TW419934B/zh not_active IP Right Cessation
- 1998-11-09 JP JP10317464A patent/JPH11224983A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11224983A (ja) | 1999-08-17 |
| KR19990039140A (ko) | 1999-06-05 |
| KR100514039B1 (ko) | 2006-05-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |