KR100514039B1 - 메모리모듈제조용지그 - Google Patents

메모리모듈제조용지그 Download PDF

Info

Publication number: KR100514039B1
Authority: KR; South Korea
Prior art keywords: circuit board; printed circuit; memory module; clamp; fixing
Prior art date: 1997-11-10

Application number

KR1019970059115A

Other languages

English (en)

Korean (ko)

Other versions

KR19990039140A (ko

Inventor

장성환

Original Assignee

주식회사 넥사이언

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1997-11-10

Filing date

1997-11-10

Publication date

2006-05-23

1997-11-10 Application filed by 주식회사 넥사이언 filed Critical 주식회사 넥사이언

1997-11-10 Priority to KR1019970059115A priority Critical patent/KR100514039B1/ko

1998-10-28 Priority to TW087117906A priority patent/TW419934B/zh

1998-11-09 Priority to JP10317464A priority patent/JPH11224983A/ja

1999-06-05 Publication of KR19990039140A publication Critical patent/KR19990039140A/ko

2006-05-23 Application granted granted Critical

2006-05-23 Publication of KR100514039B1 publication Critical patent/KR100514039B1/ko

Links

238000004519 manufacturing process Methods 0.000 title abstract description 7
238000003780 insertion Methods 0.000 claims abstract description 6
230000037431 insertion Effects 0.000 claims abstract description 6
238000000034 method Methods 0.000 claims description 4
NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 3
101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 3
239000004593 Epoxy Substances 0.000 description 2
KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
239000011889 copper foil Substances 0.000 description 1
230000002950 deficient Effects 0.000 description 1
238000010586 diagram Methods 0.000 description 1
239000000428 dust Substances 0.000 description 1
239000011521 glass Substances 0.000 description 1
239000002440 industrial waste Substances 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
239000005011 phenolic resin Substances 0.000 description 1
229920001568 phenolic resin Polymers 0.000 description 1
239000002994 raw material Substances 0.000 description 1
238000005476 soldering Methods 0.000 description 1

Images

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique

Landscapes

Engineering & Computer Science (AREA)
Power Engineering (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
General Engineering & Computer Science (AREA)
Supply And Installment Of Electrical Components (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)

KR1019970059115A 1997-11-10 1997-11-10 메모리모듈제조용지그 KR100514039B1 (ko)

Priority Applications (3)

Application Number	Priority Date	Filing Date	Title
KR1019970059115A KR100514039B1 (ko)	1997-11-10	1997-11-10	메모리모듈제조용지그
TW087117906A TW419934B (en)	1997-11-10	1998-10-28	Fixture for module device production
JP10317464A JPH11224983A (ja)	1997-11-10	1998-11-09	モジュールデバイス作製用ジグ

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
KR1019970059115A KR100514039B1 (ko)	1997-11-10	1997-11-10	메모리모듈제조용지그

Publications (2)

Publication Number	Publication Date
KR19990039140A KR19990039140A (ko)	1999-06-05
KR100514039B1 true KR100514039B1 (ko)	2006-05-23

Family

ID=19524483

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1019970059115A KR100514039B1 (ko)	1997-11-10	1997-11-10	메모리모듈제조용지그

Country Status (3)

Country	Link
JP (1)	JPH11224983A (ja)
KR (1)	KR100514039B1 (ja)
TW (1)	TW419934B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR100415940B1 (ko) *	2001-05-08	2004-01-24	위테크주식회사	인쇄회로기판 고정장치
KR20030049076A (ko) *	2001-12-14	2003-06-25	(주)엠이씨	인쇄회로기판 고정용 지그
KR20030064079A (ko) *	2002-01-25	2003-07-31	이성근	에스엠티 공정용 피씨비 지그
KR101461118B1 (ko) *	2008-11-18	2014-11-14	한미반도체 주식회사	반도체 패키지 가공용 지그

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0637472A (ja) *	1992-07-17	1994-02-10	Matsushita Electric Ind Co Ltd	プリント配線基板保持装置
JPH08330763A (ja) *	1995-06-01	1996-12-13	Toyo Commun Equip Co Ltd	プリント基板用ホルダーの構造
KR19980015036A (ko) *	1996-08-14	1998-05-25	김광호	범용성을 갖는 단배열 모듈용 인쇄회로기판 고정용 지그
KR19980026608A (ko) *	1996-10-10	1998-07-15	김광호	범용성을 갖는 단배열 모듈용 인쇄회로기판 고정용 지그

1997
- 1997-11-10 KR KR1019970059115A patent/KR100514039B1/ko not_active IP Right Cessation
1998
- 1998-10-28 TW TW087117906A patent/TW419934B/zh not_active IP Right Cessation
- 1998-11-09 JP JP10317464A patent/JPH11224983A/ja active Pending

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0637472A (ja) *	1992-07-17	1994-02-10	Matsushita Electric Ind Co Ltd	プリント配線基板保持装置
JPH08330763A (ja) *	1995-06-01	1996-12-13	Toyo Commun Equip Co Ltd	プリント基板用ホルダーの構造
KR19980015036A (ko) *	1996-08-14	1998-05-25	김광호	범용성을 갖는 단배열 모듈용 인쇄회로기판 고정용 지그
KR19980026608A (ko) *	1996-10-10	1998-07-15	김광호	범용성을 갖는 단배열 모듈용 인쇄회로기판 고정용 지그

Also Published As

Publication number	Publication date
JPH11224983A (ja)	1999-08-17
KR19990039140A (ko)	1999-06-05
TW419934B (en)	2001-01-21

Legal Events

Date	Code	Title
2002-10-02	A201	Request for examination
2004-07-31	E902	Notification of reason for refusal
2005-07-14	E701	Decision to grant or registration of patent right
2005-09-02	GRNT	Written decision to grant
2008-09-03	LAPS	Lapse due to unpaid annual fee

Publication	Publication Date	Title
DE69635097T2 (de)	2006-06-14	Optisches Halbleiteranordnungsmodul, Herstellungsverfahren und Montierung dieses Moduls auf einer Leiterplatte
DE69524364D1 (de)	2002-01-17	Mehrzahl-Anschluss für elektronische Dickschichtkomponente und Herstellungsverfahren
WO1998052399A1 (fr)	1998-11-19	Dispositif et procede servant a monter des composants electroniques
KR100514039B1 (ko)	2006-05-23	메모리모듈제조용지그
GB2168200B (en)	1987-12-09	Holding device for mounting an electronic component on a printed circuit board
JPH03145186A (ja)	1991-06-20	半導体モジュール
WO2003030609A1 (fr)	2003-04-10	Appareil electrique comprenant une structure de blindage
DE59300799D1 (de)	1995-11-30	Leiterkarte für eine Leistungshalbleiter aufweisende Leistungselektronikschaltung.
KR100406761B1 (ko)	2003-12-01	플랙시블 피시비의 연배열 크림솔더 인쇄용 지그 및연배열 크림솔더 인쇄방법
JPH05152468A (ja)	1993-06-18	Ｉｃソケツト
JPS58111394A (ja)	1983-07-02	電子回路基板
KR20030049076A (ko)	2003-06-25	인쇄회로기판 고정용 지그
JP2003110204A (ja)	2003-04-11	プリアセンブルド基板
JP2503922B2 (ja)	1996-06-05	混成集積回路
JPH0364876A (ja)	1991-03-20	電子部品のリード端子取付方法
JPH02297503A (ja)	1990-12-10	光ファイバケーブルのクランプ装置
JP2774456B2 (ja)	1998-07-09	回路基板
JPH06155336A (ja)	1994-06-03	Ｉｃソケットクランプ治具
JP3367511B2 (ja)	2003-01-14	テープキャリアの実装方法および液晶表示装置の製造方法
KR950024116U (ko)	1995-08-23	인쇄회로기판의 납땜용 지그(Jig)
EP0304902A3 (en)	1989-04-26	Arrangement for modifying and/or repairing a flat module when inserting surface-mounted components
JPH04253362A (ja)	1992-09-09	リード部品
JPH07245498A (ja)	1995-09-19	リード脚を有する電子部品の取付方法
KR200205463Y1 (ko)	2000-12-01	플랙시블 피시비의 연배열 크림솔더 인쇄용 지그
JPS584232Y2 (ja)	1983-01-24	電気部品の取付構造