404092 A7 B7 五、發明説明（1 ) , 發明背景二 - 1 .發明領域： (請先閲讀背面之注意事項再填寫本頁) 本發明有關於一種配備有諧振頻率迴路之諧振標籤， 該諧振頻率迴路隨一偵測器所發出特定頻率之無線電波而 諧振；本發明也有關於製造諧振標籤之程序以及製造供諧 振標籤等用之迴路狀金屬箔片的程序。 2 .習知技術說明： ’ 眾所週知，諧振標籤爲一種設有諧振迴路的標籤，而 所設之諧振迴路可隨一特定頻率之無線電波而諧振。因此 ，當諧振標籤被帶到傳輸有特定頻率無線電波的區域時， 諧振標籤會立刻反應而啓動蜂鳴器或偵測器之警示燈。如 此一來，爲了防範商店竊賊，可將諧振標籤接附在百貨公 司、特賣場、錄影帶出租店、CD店等所販售出租之商品 上。於櫃f結帳之後，才將諧振標籤從商品上除下或毀去 諧振標籤上的諧振迴路。如果商店中的物品未結帳即通過- ， -a· 經濟部中央榡準局貝工消費合作社印製 設有特定偵測器的閘門，接附在物品上的諧振標籤便會啓： 動蜂鳴器 '燈光等等，而發出警示訊號》 基本上，諧振標籤包含有一個塑膠膜（作爲介電層） ，在膜的至少一側設有一個螺旋（或線圈形）迴路（以下 稱爲線圈迴路），以及一個作爲電容器電極板的迴路或另 —個設在膜另一側上提供電容器作用的線圈迴路。如果需 要的話，諧振標籤可以層合在一層如紙之類的基質材料上 本紙張尺度適用中國國家標準（CNS ) A4规格（2丨0X297公釐） -4 - A7 B7 404092 五、發明説明（2 ) = (請先閲讀背面之注意事項再填寫本頁) 典型的諧振標籤如圖6所示。請參考圖6，諧振標籤-2 1包含一個作爲介電層的塑膠膜2 2、一個設有金屬箔 片的線圈迴路2 3、以及一個供作爲電容電極板的金屬箔 片迴路2 4。線圈迴路2 3之一端包含一個電容電極板部 2 3 A，其另一端包含一個迴路端子部2 3 B。供作爲電 容電極板的金屬箔片迴路2 4之一端也包含一個電容電極 板部2 4 A，另一端包含一個迴路端子部2 4 B。呈夾合 塑膠膜2 2狀的迴路端子部2 3 B與2 4 B彼此連接而構· 成諧振迴路；其連接方法是以機械方式（如沖壓）破壞塑 膠膜層2 2來達成。依此方式，便可製造完成的諧振標籤 ，另有一種在線圈迴路端部上未 籤。在此種諧振標籤的結構中， 此對應的線圈迴路，並使用迴路 經濟部中央標準局員工消费合作社印製 除了上述諧振標籤外 形成電容電極部的諧振標 是在塑膠膜的兩側形成彼 本身作爲^容電極板。 諧振迴路含有電阻R )C »電容C係藉由在塑 片（例如線圈迴路）作爲 成迴路之金屬箔片提供。 的諧振標籤，需將材料的 公差上極爲精密的迴路》 有鑑於以上所述，以 、電感L與電容（電容器之電容 膠（樹脂）膜的兩側設置金屬箔 介電層而形成，電阻R則係由構 因此’要獲得具有預定諧振頻率 成份予以控制，以達成在尺寸與 往乃使用塑膠膜（介電層）作爲 基層材料，在其一側或兩側層合一金屬箔片（例如鋁箔片 )’來形成線圈迴路。在塑膠膜上的金屬箔片上圖型化形 本紙張尺度適用t關家辟（CNS ) Α4· ( 21G X297公釐) ~ ' 404092 五、發明説明（3 ) 成迴路的方法與製造印刷迴路板相同，首先使用抗蝕劑來-印出預定圖型，再使用化學（如酸性或鹼性）溶液來蝕出 印好的金屬箔片。或者，亦可使用光阻蝕刻法來形成線圈 迴路。 然而，使用化學物進行蝕刻程序不但在溶解金屬箔片 時費時，而且在製程完成後處理廢蝕刻溶液上還有尙未解 決的問題》 經濟部中央標準局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 至於作爲介電層之塑膠膜，以往使用聚乙烯等製成之· 擠製膜。由於擠製塑膠膜會受到製程上的諸多限制（如製 糢之縫寬^施予樹脂之擠製壓力等）所影響，故所獲得的 膜在厚度與厚度公差上有所限制。更詳言之，至今爲止， 以擠出模製法製造的塑膠膜具有以下問題：無法製造出低 於某厚度以下的膜（亦即模製的下限有所限制），且厚度 公差無法降低至某一限度以下。以上述方式獲得的塑膠膜 在半熔融狀態下以熱壓方式與金屬箔片層合，或使用黏著 劑與金屬箔片黏著接合》但在任何速率下，兩種方法均不-能穩定生ΐ含有均勻厚度之介電層的疊層。此外，由於模~ 製塑膠膜的內在強大覆蓋力，塑膠膜的表面與背面迴路間 無法立刻達成連接，或已設立的諧振迴路無法輕易毀壞（ 亦即諧振頻率特性難以解除）。這些是使用習知擠製塑膠 膜所涉及的其他問題。 習知製造印刷迴路板之程序曾提出，將一厚金屬箔片 壓印成預定的迴路圖型，再將所得的迴路黏著成一個基體 。然而，此程序並不適於製造諧振標籤等物，因爲從厚金 本紙張尺度適用中國國家揉準（CNS ) Α4規格（210X297公釐） ~ ~ 6 -404092 A7 B7 V. Description of the invention (1), Background of the invention 2-1. Field of invention: (Please read the notes on the back before filling out this page) The present invention relates to a resonance tag equipped with a resonance frequency loop, the resonance frequency The loop resonates with radio waves of a specific frequency emitted by a detector; the present invention also relates to a process for manufacturing a resonant tag and a process for manufacturing a loop-shaped metal foil for a resonant tag and the like. 2. Known technical description: ‘As we all know, a resonant tag is a tag with a resonant circuit, and the resonant circuit is designed to resonate with radio waves of a specific frequency. Therefore, when the resonant tag is brought to an area where a specific frequency radio wave is transmitted, the resonant tag will immediately respond and activate the warning light of a buzzer or a detector. In this way, in order to prevent shoplifters, resonant tags can be attached to goods sold and rented by department stores, special stores, video rental shops, CD shops, and so on. Remove the resonant tag from the product or destroy the resonant circuit on the resonant tag after checkout at cabinet f. If the items in the store are passed without checkout, -a · The gate of the Ministry of Economic Affairs Central Bureau of Quasi-Bureau Consumer Cooperative has printed a gate with a specific detector, and the resonant tag attached to the item will activate: "Sounders, lights, etc., and give a warning signal" Basically, a resonant tag contains a plastic film (as a dielectric layer), and at least one side of the film is provided with a spiral (or coil) loop (hereinafter referred to as a coil Circuit), and one circuit as a capacitor electrode plate or another coil circuit provided on the other side of the membrane to provide a capacitor function. If necessary, the resonant tag can be laminated on a layer of substrate material such as paper. The paper size is applicable to China National Standard (CNS) A4 specifications (2 丨 0X297 mm) -4-A7 B7 404092 V. Description of the invention (2 ) = (Please read the notes on the back before filling out this page) A typical resonant tag is shown in Figure 6. Referring to FIG. 6, the resonant tag-2 1 includes a plastic film 2 as a dielectric layer 2, a coil circuit 2 provided with a metal foil 3, and a metal foil circuit 2 4 provided as a capacitor electrode plate. One end of the coil circuit 2 3 includes a capacitor electrode plate portion 2 3 A, and the other end thereof includes a circuit terminal portion 2 3 B. One end of the metal foil circuit 2 4 serving as a capacitor electrode plate also includes a capacitor electrode plate portion 2 4 A, and the other end includes a circuit terminal portion 2 4 B. The loop-shaped terminal portions 2 3 B and 2 4 B in the form of sandwiched plastic films are connected to each other to form a resonance circuit; the connection method is achieved by mechanically (such as stamping) breaking the plastic film layer 22. In this way, the completed resonant tag can be manufactured, and another type is not labeled on the coil loop end. In the structure of such a resonant tag, this corresponding coil circuit is printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economics and Circuits. In addition to the above resonant tag, the resonant tag that forms the capacitor electrode is formed on both sides of the plastic film As a capacitor electrode plate. The resonant circuit contains a resistor R) C »capacitor C is provided by a metal foil that forms a loop on a plastic sheet (such as a coil loop). Resonant tags need to have extremely precise loops in terms of material tolerance. In view of the above, the inductor L and the capacitor (capacitor glue (resin) film of the capacitor are provided with metal foil dielectric layers on both sides, and the resistance R It is controlled by the structure 'to obtain a component with a predetermined resonance frequency, so as to achieve the use of plastic film (dielectric layer) as the base material in size and in the past, and laminate a metal foil on one or both sides (such as Aluminum foil) 'to form the coil circuit. The figure is shaped on the metal foil on the plastic film. The paper size is suitable for Guan Jia Pi (CNS) A4 · (21G X297 mm) ~' 404092 V. Description of the invention (3) The method of forming a circuit is the same as manufacturing a printed circuit board. First, a resist is used to print a predetermined pattern, and then a chemical (such as acid or alkaline) solution is used to etch the printed metal foil. Alternatively, it can also be used. Photoresist etching is used to form the coil circuit. However, the use of chemicals to perform the etching process is not only time-consuming in dissolving metal foils, but also has unresolved problems in the disposal of waste etching solutions after the process is completed. " Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page) As for the plastic film used as the dielectric layer, extruded films made of polyethylene were used in the past. It will be affected by many restrictions in the manufacturing process (such as the width of the slit of the mold ^ extrusion pressure applied to the resin, etc.), so the obtained film has restrictions on thickness and thickness tolerance. More specifically, so far, The plastic film produced by extrusion molding has the following problems: it is impossible to produce a film below a certain thickness (that is, the lower limit of the molding is limited), and the thickness tolerance cannot be reduced below a certain limit. Obtained in the above manner The plastic film is laminated to the metal foil by hot pressing in a semi-fused state, or adhesively bonded to the metal foil. However, at any rate, neither method can be used to stabilize the product. Dielectric layer stack. In addition, due to the inherent strong covering power of the molded plastic film, the surface of the plastic film and the back circuit cannot be immediately connected, or the established resonance circuit cannot be easily established. Bad (that is, the resonance frequency characteristics are difficult to remove). These are other issues involved in the use of conventional extruded plastic films. The process of manufacturing printed circuit boards has been proposed to emboss a thick metal foil into a predetermined circuit diagram. Type, and the resulting circuit is glued into a substrate. However, this procedure is not suitable for manufacturing resonant tags, etc., because the thick gold paper size applies the Chinese National Standard (CNS) Α4 specification (210X297 mm) ~ ~ 6 -
I I 經濟部中央標準局员工消費合作社印製 A7 B7 五、發明説明（4 ) 屬箔片無法製出撓性板。製造撓性迴路的習知程序曾提出 鑄模壓印，步驟爲將一金屬箔片與一基體黏結，將該金屬 箔片壓印成預定的迴路圖型，再將不必要部份的金屬箔片 剝掉。然而，此程序有如下之不便：其排除了強度不足進 行剝除之金屬箔片的使用可能，而如果不必要部份不連續 的話，剝除效率會大爲降低。 發明節要：_ 因此，本發明目的之一便是要解決習知技術的前述問 題，並以簡單的製造程序來提供一種具有穩定諧振頻率特 性的諧振標籤。 本發明的另一目的是要在高效率且不使用蝕刻程序的 方式下提供一種具有穩定諧振頻率特性的諧振標籤，以及 供在多種型式之電器、加熱器等之迴路板中使用的迴路狀 金屬箔片，在此種金屬箔片中使用與諧振標籤中相似的接 線迴路β 圖式之簡要說明： 圖1爲本發明諧振標籤之一實施例.的分解立體圖； 圖2爲本發明諧振標籤之另一實施例的分解立體圖； 圖3爲本發明諧振標籤之又一實施例的分解立體圖； 圖4爲本發明諧振標籤之再一實施例的分解立體圖， 其中在樹脂膜上部份設置有一導電樹脂膜； 圖5爲本發明諧振標籤之一實施例的分解立體圖，其 本紙張尺度適用中國國家揉準（CNS ) Α4規格（210Χ297公釐） ϋ n —l· n - I - ---I n n I LI I T U3 、ve (請先閲讀背面之注意事項再填寫本頁) -7 - 經濟部中央標準局員工消費合作社印製 A7 404092 _b7_______ 五、發明説明（5 ) = 中層合有多個線圈狀金屬箔片； ： 圖6爲習知技術諧振標籤的分解立體圖； 圖7 A至7 G爲概視圖，示出在製造諧振標籤時依步 驟順序所獲得之構件的剖面圖，以供說明本發明之製造程 序實施例； 圖8爲用以實施本發明程序的製造裝置之立體圖； 圖9爲圖8所示製造裝置一部份的立體圖，示出該裝 置的應用情形； - 圖1 0A至1 0G爲概視圖，示出在製造諧振標籤時 依步驟順序所獲得之構件的剖面圖，以供說明本發明製造 程序之另一實施例； 圖11爲在本發明程序另一實施例中使用的另一製造 裝置之立體圖； 圖12爲在本發明程序再另一實施例中使用的另一製 造裝置之立體圖； 圖1 3爲側面圖，示出圖1 2所示裝置中之切割鑄模-滾筒；二 1 圖1 4爲側面圖，示出圖1 2所示裝置中之加熱滾筒I I Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of Invention (4) Flexible sheets cannot be made from foils. The conventional procedure for manufacturing flexible circuits has proposed mold embossing. The steps are to bond a metal foil to a substrate, emboss the metal foil into a predetermined circuit pattern, and then unnecessary portions of the metal foil. Peel off. However, this procedure has the following inconveniences: it excludes the use of metal foils with insufficient strength for stripping, and if unnecessary parts are discontinuous, the stripping efficiency will be greatly reduced. SUMMARY OF THE INVENTION: Therefore, one of the objects of the present invention is to solve the aforementioned problems of the conventional technology and provide a resonant tag with stable resonant frequency characteristics by a simple manufacturing process. Another object of the present invention is to provide a resonant tag with stable resonant frequency characteristics and a loop-shaped metal for use in circuit boards of various types of electrical appliances, heaters, etc. in a highly efficient manner without using an etching process. Foil, in this kind of metal foil, use a similar wiring circuit β pattern of the resonant tag. Brief description: Figure 1 is an exploded perspective view of an embodiment of the resonant tag of the present invention; Figure 2 is a resonant tag of the present invention An exploded perspective view of another embodiment; FIG. 3 is an exploded perspective view of another embodiment of the resonant tag of the present invention; FIG. 4 is an exploded perspective view of another embodiment of the resonant tag of the present invention, in which a conductive part is disposed on the resin film Resin film; Figure 5 is an exploded perspective view of an embodiment of the resonant tag of the present invention, the paper size of which is applicable to China National Standard (CNS) A4 (210 × 297 mm) ϋ n —l · n-I---- I nn I LI IT U3, ve (Please read the notes on the back before filling this page) -7-Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 404092 _b7_______ V. Invention Ming (5) = multiple coiled metal foils are laminated in the middle; Figure 6 is an exploded perspective view of a conventional technology resonant tag; Figures 7 A to 7 G are general views showing the steps in the order of manufacturing the resonant tag A sectional view of the obtained component is provided to explain an embodiment of the manufacturing process of the present invention; FIG. 8 is a perspective view of a manufacturing apparatus for implementing the process of the present invention; FIG. 9 is a perspective view of a part of the manufacturing apparatus shown in FIG. Application situation of the device;-Figures 10A to 10G are general views showing cross-sectional views of components obtained in the order of steps when manufacturing a resonant tag, for illustrating another embodiment of the manufacturing process of the present invention; Figure 11 FIG. 12 is a perspective view of another manufacturing apparatus used in another embodiment of the program of the present invention; FIG. 12 is a perspective view of another manufacturing apparatus used in yet another embodiment of the program of the present invention; FIG. 13 is a side view showing Fig. 12 The cutting mold-roller in the device shown in Fig. 12; II 1 Fig. 14 is a side view showing the heating roller in the device shown in Fig. 12
I 圖1 5爲側面圖，示出圖1 2所示裝置中之熱塑滾筒 t 圖16爲本發明諧振標籤之再另一實施例的分解立體 Π31 · 圖， 圖17示出從一諧振標籤基體上所塗覆之黏著劑上剝 本紙張尺度適用中國國家揉準（CNS ) A4規格（210X297公釐） ----i-------------、玎------Λ (請先閲讀背面之注意事項再填寫本頁) -8 ~ 404092 at __ B7_ _ 五、發明説明（6 ) 除釋放紙的情形； 圖18示出在塗有黏著劑之諧振標籤基體表面上之未 塗覆部份的一例； 圖19示出以格狀塗覆黏著劑的一例； 圖2 0爲圖1 8實例之立體圖； 圖21爲本發明一實施例之平面圖。 較佳實施例之詳細說明： 經過周密詳細研究之後，本案發明人發現可使用液體 樹脂取代習用模製樹脂膜來進行塗覆程序，並使用該塗覆 樹脂（膜）作爲黏著劑來黏著金屬箔片迴路，而獲得所要 厚度的介電層。本發明係在上述發現之下達成，由此獲致 一個具有良好諧振頻率特性的諧振標籤》 本發明之諧振標籤特徵在於，在以塗覆程序製成之介 電樹脂膜的一側或兩側黏著有一迴路狀（線圏狀）金屬箔 片。 - 看 -sa 經濟部中央標準局員工消费合作社印製 (請先閲讀背面之注意事項再填寫本頁) 本發明中使用之介電樹脂膜可形成與線圈狀金屬箔片： 相同的線圈狀，或可爲與線圈狀金屬箔片之外週邊所界定 之形狀具有大致相同之面積與形狀的樹脂膜。 更詳言之，例如，可先在金屬箔片的一側上形成樹脂 塗覆層，接著再將樹脂塗覆之金屬箔片壓印成線圈形狀。 依此方式，便可製造出與線圈狀金屬箔片具有相同形狀的 線圈形樹脂膜。或者，可用以下程序來製造諧振標籤：施 加液態樹脂至釋放紙等之表面上以形成樹脂膜；在所得樹 本紙張尺度適用中國國家梂準（CNS ) A4規格（210X297公釐） 經濟部中央標準局員工消費合作社印製 404092 at ___B7_ 五、發明説明（7 ) = 脂膜表面上-黏著一線圈狀金屬箔片；從樹脂膜上剝除釋放: 紙；再在樹脂膜剝除釋放紙後的表面上以背面黏著線圈狀 金屬箔片。又，亦可將液態樹脂施加至疊置有線圈狀金屬 箔片之釋放紙表面上，再將線圏狀金屬箔片黏著至樹脂膜 上而形成樹脂膜。 本發明中所使用的液態樹脂可爲本身爲液體者（亦即 ，可爲如環氧樹脂之類的無溶劑液態樹脂，或爲溶解在溶 劑內之樹脂溶液。任何適合在塗覆程序中使用，且具有良· 好介電性質的樹脂，均可以使用。舉例而言，例如可使用 聚烯烴。最好所得的樹脂膜能夠在黏著金屬箔片至樹脂膜 時提供黏著劑的作用。因此，以具有熱黏著性質之樹脂爲 '佳。在樹脂膜中，可以加入能夠改善或增加膜介電性質的 填充物等》 樹脂膜可以形成在線圈狀金屬箔片的一側或兩側上。 此外，可將至少一側具有樹脂膜的兩個以上之線圈狀金屬 箔片彼此叠置黏接。在此種情形下，各層金屬箔片經由適-當機構予以#連接，以獲得所要的諧振頻率特性。 ： 本發明所使用的樹脂膜，其製法可爲：以滾筒塗覆將 液體樹脂施加至整個表面上，或以照相印刷、絲網印刷等 來塗覆預定部份而提供塗覆圖型。或者，亦可使用彩色印 刷程序來將含有導電性填充物（例如金屬粉）的液體樹脂 等塗覆至金屬箔片迴路的一部份上。所得的樹脂膜可用來 連接設置在介電樹脂膜表面與背面上的線圈狀金屬箔片’ 而構成所要的諧振迴路。此外，含有導電性填充物的樹脂 本紙張尺度適用中國國家揉準（CNS ) A4规格（210X：297公釐） (請先閲讀背面之注意事項再填寫本頁) .裝. 訂 -10 - 經濟部中央標準局負工消費合作社印製 404092 A7 B7 五、發明説明（8 )I FIG. 15 is a side view showing a thermoplastic drum t in the device shown in FIG. 12. FIG. 16 is an exploded perspective view 31 of another embodiment of the resonant tag of the present invention. The paper size of the adhesive on the substrate is suitable for the Chinese National Standard (CNS) A4 (210X297 mm) ---- i -------------, 玎- ---- Λ (Please read the precautions on the back before filling in this page) -8 ~ 404092 at __ B7_ _ V. Description of the invention (6) Except for the release paper; Figure 18 shows the resonance with the adhesive coated An example of an uncoated portion on the surface of a label substrate; FIG. 19 shows an example of applying adhesive in a grid pattern; FIG. 20 is a perspective view of the example of FIG. 18; and FIG. 21 is a plan view of an embodiment of the present invention. Detailed description of the preferred embodiment: After careful and detailed research, the inventor of this case found that the liquid resin can be used to replace the conventional molding resin film to perform the coating process, and the coating resin (film) is used as an adhesive to adhere the metal foil. To obtain a desired thickness of the dielectric layer. The present invention was achieved based on the above findings, and a resonance tag with good resonance frequency characteristics was obtained. The resonance tag of the present invention is characterized in that one or both sides of a dielectric resin film made by a coating process are adhered There is a loop-shaped (coil-like) metal foil. -See -sa Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page) The dielectric resin film used in the present invention can be formed into a coiled metal foil: the same coiled shape, Or it may be a resin film having a substantially same area and shape as the shape defined by the outer periphery of the coiled metal foil. More specifically, for example, a resin coating layer may be formed on one side of a metal foil, and then the resin-coated metal foil may be embossed into a coil shape. In this way, a coil-shaped resin film having the same shape as the coil-shaped metal foil can be manufactured. Alternatively, the following procedures can be used to make resonant tags: apply liquid resin to the surface of release paper, etc. to form a resin film; apply the Chinese National Standard (CNS) A4 (210X297 mm) to the standard of the obtained tree paper (210X297 mm) Printed by the Consumer Cooperative of the Bureau 404092 at ___B7_ V. Description of the invention (7) = On the surface of the lipid film-a coil-shaped metal foil is adhered; peeling and releasing from the resin film: paper; The coil-shaped metal foil is adhered on the front surface and the back surface. Alternatively, a liquid resin may be applied to the release paper surface on which the coil-shaped metal foil is stacked, and the wire-shaped metal foil may be adhered to the resin film to form a resin film. The liquid resin used in the present invention may be a liquid itself (that is, it may be a solvent-free liquid resin such as epoxy resin, or a resin solution dissolved in a solvent. Any suitable for use in the coating process Resins with good and good dielectric properties can be used. For example, polyolefins can be used. The best resin film can provide the role of an adhesive when adhering metal foil to resin film. Therefore, A resin having thermal adhesive properties is preferred. A filler that can improve or increase the dielectric properties of the film can be added to the resin film. The resin film can be formed on one or both sides of the coiled metal foil. , Two or more coil-shaped metal foils having a resin film on at least one side can be superposed and adhered to each other. In this case, each layer of metal foils is #connected via a suitable-appropriate mechanism to obtain a desired resonance frequency Characteristics: The resin film used in the present invention can be prepared by applying liquid resin to the entire surface by roller coating, or coating a predetermined portion by photo printing, screen printing, or the like. Coating pattern can be provided. Alternatively, a color printing process can be used to apply liquid resin containing conductive fillers (such as metal powder) to a part of the metal foil circuit. The resulting resin film can be used The coil-shaped metal foils provided on the surface and back of the dielectric resin film are connected to form a desired resonant circuit. In addition, the resin containing conductive fillers is sized to the Chinese National Standard (CNS) A4 (210X) : 297 mm) (Please read the notes on the back before filling out this page). Packing. Order -10-Printed by the Central Standards Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 404092 A7 B7 V. Description of Invention (8)
- J 膜可使諧振迴路較容易摧毀。 _ 最後，可將線圈狀金屬箔片黏著至樹脂膜兩側而構 諧振標籤之基體’再用一般方法將如紙、塑膠膜、或塑 片之類的支持物或裝飾片黏著至基體上，以前述方法製 諧振迴路，而獲得所要的諧振標籤。 例如，可以下述步驟獲得諧振標籤：將紙或塑膠膜黏 著至以前述方法獲得的諧振標籤基體的一側；施加黏著劑 至基體的另一側；再將一釋放紙黏著至基體上方黏著劑之， 上。所得諧振標籤包含一釋放紙，將釋放紙開後，便可將 諧振標籤直接黏著至貨品上》 在使用如聚乙烯膜之類的非黏著性膜作爲介電層的習 知諧振標籤中，必須使用黏性黏著劑將支持物接著至介電 層上。但本發明之諧振標籤則可使用普通黏著劑來實施， 因爲其中使用樹脂膜作爲介電層。 本發明所用以製造如諧振標鑛類之迴路狀金屬箔片的 方法，其特徵在於：其中使用一疊層，該疊層包含一如紙一 ssm 或塑膠膜類之載體薄片，其上黏著一金屬箔片，以作爲基二 體材料，所述方法包含以下步驟：使用一壓印糢而在所述 疊層之金靥箔片上形成具有凹痕之預定迴路狀圖型；在疊 層具有金屬箔片側之相反側上，安置一如塑膠膜類之支持 物的表面；以及由疊層之載體薄片側或支持物側加熱該電 路狀圖型化部份，以將迴路狀金靥箔片轉換至支持物的表 面上。 在本發明之方法中，載體薄片使用能夠很容易除去之 本紙張尺度適用中國國家梂準（CNS ) A4規格（210X297公釐） ------------裝— (請_先閲讀背面之注意事項再填寫本頁) 訂 -11 - 經濟部中央標準局員工消費合作社印製 404092 at ____B7 __ 五、發明説明（9 ) = •国 黏著劑來黏著至金屬箔片上，故在將印出之金屬箔片轉換— 至支持物表面上時金屬箔片可以很容易地從載體薄片上剝 除。特別是，所使用的黏著劑之黏著力若隨受熱而降低則 更佳，因爲壓出的部份本身是藉由加熱來轉換至支持物上 。使用上述較佳之黏著劑，受熱部份之黏著力便較未受熱 部份爲低，因此使受熱部份之圖型易於轉換至支持物上。 滿足上述要求之較佳黏著劑包括壓敏黏著劑（或黏性 黏著劑），_其中加入在受熱時能夠加速硬化的硬化劑。除· 了上述黏著劑外，另外還可以使用以壓敏黏著劑爲主要成 份，其中再加入如環氧樹脂或b醯氨樹脂等熱塑樹脂之黏 著劑組成。由於樹脂固化之故，此種黏著劑組成之黏著力 隨加熱而降低。此外，亦可使用以黏著劑爲主而其中含有 油脂或臘的黏著劑組成。攙在黏著劑中的油脂或臘於加熱 時會在黏著表面上分離出來，而降低黏著劑的黏著力。 大體來說，本發明是在由載體薄片與金屬箔片構成之 疊層的金屬箔片上設置熱黏著樹脂膜，藉由依此方式提供y 黏著劑至^表面上，而使壓出之金屬箔片可在後續程序步-驟中轉換至支持物上。不過，如果所使用之支持物本身爲 熱黏著樹脂膜，或爲表面塗覆有熱黏著樹脂之膜時，則可 省略此步驟。 本發明中所使用之載體薄片應有足夠的厚度，如此在 將金屬箔片壓印成預定迴路狀圖型時，便不會同時壓印到 載體薄片。不過，其厚度亦應適當安排，以於成捲之疊層 在連續處理中展開時，使黏著於其上的金屬箔片不致破裂 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） " -12 - ------------^-------1T------.J- (請先閲讀背面之注意事項再填寫本頁) 404092 ab] 五、發明説明（10 ) =-J film makes the resonance circuit easier to destroy. _ Finally, the coil-shaped metal foil can be adhered to the two sides of the resin film to form the substrate of the resonant tag. A resonance circuit is made in the aforementioned manner to obtain a desired resonance tag. For example, the following steps can be used to obtain a resonant tag: adhere paper or plastic film to one side of the substrate of the resonant tag obtained in the foregoing method; apply an adhesive to the other side of the substrate; and then attach a release paper to the adhesive above the substrate That's it. The obtained resonant tag includes a release paper, and after the release paper is opened, the resonant tag can be directly adhered to the product. In a conventional resonant tag using a non-adhesive film such as a polyethylene film as a dielectric layer, it is necessary to A support is used to adhere the support to the dielectric layer. However, the resonant tag of the present invention can be implemented using an ordinary adhesive because a resin film is used as the dielectric layer. The method for manufacturing a loop-shaped metal foil, such as a resonant standard ore, according to the present invention is characterized in that: a stack is used, and the stack includes a carrier sheet such as paper-ssm or a plastic film, and a The metal foil is used as a base body material. The method includes the following steps: using a stamper to form a predetermined loop-like pattern with dents on the laminated gold foil; On the opposite side of the foil side, a surface such as a plastic film-like support is placed; and the circuit patterned part is heated by the laminated carrier sheet side or the support side to convert the loop-shaped gold foil. Onto the surface of the support. In the method of the present invention, the carrier sheet can be easily removed with the paper size applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) ------------ installation— (please_ Read the precautions on the back before filling this page) Order-11-Printed by the Consumer Cooperatives of the Central Bureau of Standards, Ministry of Economic Affairs, 404092 at ____B7 __ V. Description of Invention (9) = • National adhesive to adhere to metal foil, so in Convert the printed metal foil—the metal foil can be easily peeled from the carrier sheet when it is on the surface of the support. In particular, it is better if the adhesive force of the used adhesive decreases with heat, because the extruded part itself is transferred to the support by heating. With the above-mentioned preferred adhesive, the adhesion of the heated portion is lower than that of the unheated portion, so that the pattern of the heated portion can be easily transferred to the support. Preferred adhesives that meet the above requirements include pressure-sensitive adhesives (or tacky adhesives), where a hardener that accelerates hardening when heated is added. In addition to the above-mentioned adhesives, pressure-sensitive adhesives can also be used as the main component, and adhesives made of thermoplastic resins such as epoxy resin or ammonia resin can be added. As the resin cures, the adhesive force of this adhesive composition decreases with heating. In addition, it is also possible to use an adhesive consisting mainly of an adhesive containing oil or wax. The grease or wax in the adhesive will be separated on the adhesive surface when heated, which will reduce the adhesive force of the adhesive. Generally speaking, the present invention is to provide a heat-adhesive resin film on a laminated metal foil composed of a carrier sheet and a metal foil, and to provide a y-adhesive to the surface in this way, so that the extruded metal foil Can be transferred to the support in subsequent steps. However, if the support used is a heat-adhesive resin film itself, or if the surface is coated with a heat-adhesive resin film, this step can be omitted. The carrier sheet used in the present invention should have a sufficient thickness so that when the metal foil is embossed into a predetermined loop pattern, it will not be embossed on the carrier sheet at the same time. However, its thickness should also be properly arranged so that when the rolled stack is unrolled in a continuous process, the metal foil adhered to it will not break. This paper applies the Chinese National Standard (CNS) A4 specification (210X297 mm). ) &Quot; -12------------- ^ ------- 1T ------. J- (Please read the notes on the back before filling this page) 404092 ab] 5. Description of the invention (10) =
—1 -S (請先閲讀背面之注意事項再填寫本頁) 。可使用作爲載體薄片之材料例如爲精製紙（光面紙）或一 似羊皮紙，以及如聚乙烯膜、聚丙烯膜或聚酯膜等之塑膠 膜。就熱影像轉換之熱轉換性質、處理容易度及成本而言 ，上述材料中以紙爲佳。 本發明所使用之金屬箔片無特定限制，可使用者例如 爲銅箔、鋁箔或不銹鋼箔。特別是，本發明中可使用以往 認爲不適合供此類應用之薄軟鋁箔。本發明中所使用的金 屬箔片可爲數微米（yrn)至數百微米（zzm)。更詳言-之，以3至15 0 之箔片爲佳。如果是鋁箔的話，以 10至60仁m爲佳。 在標籤與罐頭製造業中習知之壓印技術（即半切割方 法）可供用來在金屬箔片本身上形成具有凹痕的預定迴路 狀圖型。 經由壓印而印成迴路狀圖型的金屬箔片疊層先使用熱 鑄模（此熱鑄模具有與壓印出之迴路狀圖型形狀大致相同 的加熱突出物圖型）來轉換至支持物上，或使用熱密封劑- 等來加熱並施壓至叠層載體薄片的表面上，而轉換至支持- 經濟部中央標準局貝工消费合作社印製 物上。接著，從支持物上剝去疊層之後，印成迴路狀圖型 的金屬箔片因熱黏著而保留在支持物上，不必要的部份則 與疊層一起除去。一旦迴路狀金屬箔片轉換到支持物上之 後，最好再確保金屬箔片黏著於支持物上，例如於必要時 可進一步加熱並施壓至整個結構上。於金屬箔片轉換後加 熱支持物時，加熱圖型不必與印出之金屬箔片同寬，例如 可以窄於金屬箔片的寬度。 本紙張尺度適用中國國家標準（CNS ) A4规格（210X297公嫠） -13 - 404092 五、發明説明（11 ) 在將迴τ路狀金靥箔片轉換至支持物上的加熱步驟中’- 如果所使用的支持物爲一如紙或塑膠膜之類的薄片’則可 (請先閲讀背面之注意事項再填寫本頁) 從支持物側施熱。否則，可由載體薄片與支持物兩側施熱 〇 以本發明之方法來製造諧振標籤時’係使用介電塑膠 膜或介電樹脂膜作爲支持物。迴路狀金屬箔片以前述程序 來轉換至介電支持物的兩側，以在支持物的兩側上形成電 路或電容器區段。依此方式，可建立諧振迴路作爲諧振標' 籤的基體π 使用樹脂膜作爲支持物時，例如可藉由施加預定的液 體樹脂至釋放紙上來製備樹脂塗層，接著再使用釋放紙上 的樹脂膜作爲支持物來將迴路狀金屬箔片轉換至其上。之 後再將釋放紙剝掉，然後可將另一迴路狀金屬箔片轉換至 已設有金屬箔片且已完成剝除的樹脂膜之表面上（亦即已 完成剝除的表面上），而獲得諧振標籤之基體。 經濟部中央標準局員工消費合作社印製 用以作爲介電塑膠膜或介電樹脂膜的樹脂包括本領域-內所習用όί樹脂。詳言之可使用聚乙烯、聚丙烯、聚苯乙： 烯、聚酯等之膜或樹脂塗料。此外，還可使用如聚醯亞氨 等熱阻樹脂作爲支持物來製成抗熱產物。 最好在支持物（即·介電塑膠膜或介電樹脂膜）上事先 設有孔洞或切口，以將形成在表面上的金屬箔片迴路與支 持物的背面連接，或在必要時使諧振迴路可藉由施加電流 來摧毀。支持物上的孔洞或切口設置在支持物表面的金屬 箔片與背面的金屬箔片重叠的位置處。藉由調整孔洞或切 本紙張尺度適用中國國家揉準（CNS ) Α4说格（2丨0X297公釐） 14 — 404092 A7 B7 五、發明説明（12 ) 口的設置位置，便可控制使諧振狀態失效所需的電能。又： ’孔洞或切口可用來連接多層印刷迴路板上下側的迴路。 (請先閲讀背面之注意事項再填寫本頁) 製造諧振標截時施加至金屬箱片表面上的熱黏著樹脂 並無特定限制。因此，任何適於塗覆且具有良好介電特性 的樹脂（例如聚烯烴）均可使用。此外，如果需要的話， 可在樹脂膜中加入填劑等，以改善或增強所得膜的介電特 性。又，如果需要的話，可在叠層中金屬箔片的表面上疊 置介電塑膠膜，再在介電塑膠膜上進一步塗覆熱黏著樹脂· 。在此種情形下，疊層中之金屬箔片與塑膠膜一起接受壓 印，以轉換至支持物上。 經濟部中央標準局負工消費合作社印装 或者，在本發明的方法中，可不使用支持物，而使其 上具有壓印成迴路狀圖型之金屬箔片的各疊層在壓力下受 熱，來製成諧振標籤的基體。施加至金屬箔片表面上的熱 黏著樹脂提供支持物的作用。如此一來疊層的安排方式爲 ，使具有金屬箔片的一側彼此相對，而由載體薄片側加熱 。與前述情形相似，可使用介電樹脂作爲熱黏著樹脂膜所-用的樹脂此外亦可僅在第一叠層之金屬箔片上提供熱黏： 著樹脂而不在第二疊層之金屬箔片上塗覆樹脂膜。又，亦 可在第一疊層之金屬箔片上施加簡單的熱黏著樹脂膜，而 在第二疊層之金屬箔片上施加介電樹脂膜》所得兩疊層結 合在一起成爲一個整體，作爲諧振標籤之基體。 將作爲諧振迴路之線圈狀金屬箔片黏著至樹脂膜兩側 所得的諧振標籤基體可予以加工成所要的產品。在所得諧 振標籤基體的至少一側上黏著捕強構件或如紙、塑膠膜、 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X297公釐） -15 - 404092 at ___B7 五、發明説明（13 ) = -- 薄片等之裝-飾片，便可製成所要的諧振標籤或諧振標貼。_ 例如，可使用黏著劑來將紙或塑膠膜黏著至所得諧振 標籤基體的一側上，並塗覆黏性黏著劑至另一側上而在該 側黏著釋放紙。如此一來便可獲得可在剝掉釋放紙之後直 接施用至貨品上的諧振標籤。 如此，由於使用液體樹脂塗覆程序來製造介電膜，故 就膜厚度公差方面而言，本發明所提供之諧振標籤具有遠 較習知以擠出模製方法製造之塑膠膜爲佳的介電膜。此外-’直接使用樹脂膜黏著劑，可以消除習知技術諧振標籤中 使用黏著劑來黏著塑膠膜所致之介電層厚度不均勻。又， 可容許樹脂有較爲廣泛的選擇度，且可依所要的濃度來加 入填劑等，以改善樹脂膜的介電特性。需要時亦可混合兩 種以上的樹脂。因此，可以獲得在諧振頻率特性上有所改 善的諧振標籤，或具有所要撓性的諧振標籤。 此外，本發明中可以很容易地達成將金屬箔片壓印成 線圏狀的操作，因爲在金屬箔片的至少一側上形成有樹脂- , sm 膜。- ： 經濟部中央標準局員工消費合作社印製 n n n n n I D n t^— a^i I LI n T 0¾ 、va (請先閱讀背面之注意事項再填寫本頁) 又，本發明之方法包含使用叠層作爲基體材料，疊層 中包含一載體薄片，其上黏著有金屬箔片，故金屬箔片本 身可壓印成所要圖型，且可藉由從載體薄片側或支持物側 加熱及施壓來將壓印出的部份轉換至支持物上。與習知鑄 模壓印方法相比，可看出本發明方法即使在薄軟的金屬箔 片上，仍可容許形成所要的迴路圖型。除了習知技術程序 中一般所使用的連續線圈狀圓型外，本發明方法尙可容許 本紙張尺度適用中國國家標率（CNS ) A4规格（210X297公釐） -16 - A7 B7 404092 五、發明説明（14 ) 形成由大小圓圈構成的同心圖型。 I ^ --------1τ (請先閲讀背面之注意事項再填寫本頁) 於使用紙作爲載體薄片時，可形成供對準載體薄片用 的標記。利用此標記，便可輕易在支持物表面與背面上以 重疊方式形成金屬箔片迴路。如此一來，便可獲得一諧振 標籤，而此諧振標籤包含由在兩個相向金屬箔片迴路間插 置介電膜所構成的電容器。 於使用含有金屬箔片而金屬箔片表面塗覆有熱黏著樹 脂膜的疊層作爲本發明之介電層時，該介電層係以塗覆液 體樹脂來製成。因此，所得的介電膜就膜厚度公差方面而 言，遠較習知以擠出模製方法製造之塑膠膜爲佳》因此， 可以獲得在諧振頻率特性及撓性上有所改善的諧振標籤》 第一實施例 經濟部中央標準局男工消費合作社印製 圖1示出根據本發明之諧振標籤實施例的分解立體圖 ，其中設置作爲介電層的樹脂膜2與壓印成線圈狀的鋁箔 3 a具有相同的形狀。請參考圖χ ，樹脂膜2設置在遠離 鋁箔3 a的位置。不過實際上，在鋁箔上施加有液體樹脂 ’並與鋁箔3 a —起壓印成形。因此，樹脂膜2與鋁箔3 a的表面整合在一起而形成單一個體。 參考圖1 ，線圈狀鋁箔3 b與鋁箔3 a重疊並黏著至 棱f脂膜2上，其線圈繞線方向與鋁箔3 a之線圈繞線方向 相反。於樹脂膜2採用熱樹脂時，鋁箔3 a重疊在鋁箱3 b上’或者尙可有一支持物4疊置於其上，所得的疊層則 施予熱接觸黏合。詳言之在本實施例中，在鋁箔3 b上與 本紙張尺度適用中國國家揉準（CNS ) A4規格（210Χ29·7公釐） 17 - 404092 b77 五、發明説明（15 ) = 二 -g 鋁箔3 a枏同地亦形成有樹脂膜2，且在其下表面上層疊— 有例如紙或塑膠膜之類的支持物4。釋放紙6透過插置其 間的黏性黏著劑5而黏著至支持物4上。另一方面，使用 黏性黏著劑或黏著劑7將紙8黏著至鋁箔3 a之上表面上 ，而得到所要的諧振標籤1。 紙8之作用在於保護或隱藏其下的諧振迴路。紙上可 設有如標識之類的印刷物，以指示記載如商標、販售商、 或廣告語句等。 · 經濟部中央標準局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 圖2示出本發明諧振標籤之另一實施例的分解立體圖 ，其中之樹脂膜2 a的面積與線圏狀鋁箔3 a之外週邊形 狀所界定之面積相同。諧振標籤1的其他結構與圖1所示 結構相同，因此此處省略與圖1所示相同之構件的說明， 而僅以相同的符號予以標示。在本實施例中，所示樹脂膜 2 a爲平坦膜片。不過，可將液體樹脂施加至線圈狀鋁箔 的整個表面來形成膜片。因此，可以形成在鋁箔線圈間含 有樹脂膜的形狀。更詳言之，可在一平坦平面上形成線圈-狀突出物。-依此方式，可更加確保樹脂膜表面與背面上形 成的鋁箔之絕緣。 圖3示出本發明諧振標籤之又一實施例的分解立體圖 ，其中設置有線圈狀樹脂膜2與平坦樹脂膜2 a二者。於 使用塑膠膜4作爲支持物時，首先使用線圈狀樹脂膜2將 —側設有樹脂膜2的線圈狀鋁箔3 b黏著至塑膠膜上。接 著，可藉由施加液體樹脂至鋁箔3 b未設有樹脂膜2的整 個表面上（包括可透過線圈看到的支持物4之表面），而 本紙張尺度適用中國國家橾準（CNS ) A4規格（210X297公釐） -18 - A 7 _____B7___ 五、發明説明（16 ) = 形成樹脂膜2 a。 一 (請先閱讀背面之注意事項再填寫本覓) 圖4示出本發明諧振標籤之再一實施例的分解立體圖 ，其中藉由彩色印刷而在樹脂膜2的中間處形成一個其內 混合有導電材料（如鋁粉或銅粉）的導霞樹脂膜 2_上。在本實施例中導電樹脂膜是設置在鋁箔迴路的中間 處，不過導電樹脂膜亦可呈線性設置在線圈的最外側部份 2 c作^麗|點，以在層疊在樹脂膜2表面與背面上的金 屬箔片間' 圖5爲本發明諧振標籤一實施例的分解立體圖，其中 層疊了多個線圈狀鋁箔，每一鋁箔上均層疊有一樹脂膜。 更詳言之在本實施例中，係層疊有三個鋁箔3。圖5中參 考數字1 0表示上下鋁箔連接的位置。依此方式結合多個 箔片，便可達成具有預定諧振特性之更精巧的諧振標籤。 第二實施例 _ 經濟部中央樣準局貝工消費合作社印製 圖7 A至7 G爲概視圖，示出在製造諧振標籤時依步-驟順序所獲得之構件的剖面圖，以供說明本發明之製造程二 序實施例。圖7A中，表面塗覆有熱黏著樹脂膜1 0 1的 金屬箔片1 0 2使用壓敏黏著劑或黏性黏著劑1 0 3而黏 著至載體薄片1 0 4上，以形成一叠層作爲諧振標籤的基 體。 參考圖7B ’叠層1 1 0接受壓印而在金靥箔片1 〇 2上形成凹痕1 〇 9 »所得疊層1 1 〇接著疊置於支持物 (塑膠膜）1 〇 .8上，凹痕部份則使用模1 1 1來進行熱 冢紙張尺度適用中國國家楳準（CNS ) A4規格（210X297公釐） 一 404092 A7 B7___ 五 '發明説明（17 ) = 接觸（圖)。剝下疊層11〇後，受熱形成迴路圖型-的金屬箔片1 〇 上（圖7 D )。依 此方式在支持物1 〇 8表面上形成迴路狀金屬箔片1 0 2 後’在其背面重複相同的操作，而在支持物1 0 8的兩個 表面上均形成迴路狀金屬箔片1 〇 2。如此一來即獲得諧 振標籤的基體（圖7E至7G)。 圖8爲用以連續進行上述操作程序之製造裝置的立體 圖。- - 參考圖8，成捲筒形式供應的疊層1 5 0經展開饋送 給第一切割壓模1 6 0，以壓印出金屬箔片。金屬箔片與 支持物1 5 1 —起壓印，使其可使用第一加熱壓模1 6 1 來轉換至支持物15 1上。組合後的疊層15 0與支持物 1 5 1在反轉滾筒1 67處分開。不必要的疊層1 5 2被 分離取去*而其上具有金屬箱片迴路的支持物1 5 1 a再 使用第一熱塑壓模1 6 2進一步予以熱壓鑄。 用以壓印出金屬箔片的第一切割壓模1 6 0以及使用-第一加熱壓模1 6 1來將金屬箔片轉換至支持物1 5 1上二 的部份在圖9中詳示。參考圖9 ，其中還示出一個用以在 支持物1 5 1中穿孔（如果支持物爲介電膜的話；可參考 圖1 6)的穿孔裝置1 90，以供將介電膜表面上的金屬 箔片迴路與膜背面的迴路連接。 回到圖8，一表面上設有金靥箔片迴路的支持物1 5 1 a接著爲反轉滾筒1 6 8所反轉。支持物1 5 1 a的背 部與從圖8右側所示之捲繞叠層1 5 0上展開之疊層1 5 本紙張尺度適用中國國家揉準（CNS ) A4規格（210X297公釐） ----^-------^------訂 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央揉準局貝工消費合作社印装 -20 - 經濟部中央標準局貝工消費合作社印製 404092 ^ 五、發明説明（18 ) = 〇組合，並使用第二切割壓模1 6 3而以前述相同方式來二 轉換金屬箔片。依此方式，支持物1 5 1 a與疊層1 50 一起通過第二加熱壓模1 6 4與第二熱塑壓模1 6 5，以 完成在支持物1 5 1 a表面與背面上具有金屬箔片迴路的 最終產物1 5 3。 如果需要的話，可在依此方式獲得的產物上黏接印字 紙、塗覆黏性黏著劑、或疊置釋放紙6，以製成諧振標籤 或諧振標貼。 ' 第三實施例 圖1 0A至1 0G爲概視圖，示出在製造諧振標籤時 依步驟順序所獲得之構件的剖面圖，以供說明本發明製造 程序之另一實施例。圖10A至10D所示程序步驟與先 前參考圖7 A至7 D對第二實施例作說明時之程序步驟相 同。在支持物1 0 7的一側上設有迴路狀金屬萡片1 0 2 ，而先前藉由壓印而在其上形成有金屬箔片1 0 2的疊層-1 1 0則!ί置在支持物1 0 7上之金屬箔片1 0 2的上方： 。整個表面接著在壓力下受熱，而在先前建立迴路狀金屬 箔片的表面上形成另一迴路狀金屬箔片1 0 2。 將依此方式所得作爲諧振標貼基體的支持物1 0 7塗 上用以黏著諧振標貼的壓敏黏著劑（黏性黏著劑））1 0 6，並將釋放紙1 0 5黏著至塗有黏性黏著劑的標貼表面 上，而獲得最終之諧振標貼。 圖11爲用以連續進行前述程序操作之製造裝置的立 本紙張尺度逋用中國國家梂準（CNS ) Α4規格（210Χ297公釐） (請先閲讀背面之注意事項再填寫本頁) .裝·—1 -S (Please read the notes on the back before filling this page). Materials that can be used as the carrier sheet are, for example, refined paper (glossy paper) or parchment-like paper, and plastic films such as polyethylene films, polypropylene films, or polyester films. In terms of thermal conversion properties, ease of processing, and cost of thermal image conversion, paper is preferred among the above materials. The metal foil used in the present invention is not particularly limited, and the user may be, for example, copper foil, aluminum foil, or stainless steel foil. In particular, a thin flexible aluminum foil that was previously considered unsuitable for such applications can be used in the present invention. The metal foil used in the present invention may be several micrometers (yrn) to hundreds of micrometers (zzm). To be more specific-a foil of 3 to 15 0 is preferred. In the case of aluminum foil, 10 to 60 kernels is preferred. The embossing technique known in the label and can manufacturing industry (ie, the half-cut method) can be used to form a predetermined loop-shaped pattern with dents on the metal foil itself. The metal foil laminate printed into a circuit pattern by embossing is first transferred to a support using a hot mold (this hot mold has a pattern of heating protrusions approximately the same shape as the circuit pattern embossed). Or use heat sealant-etc. to heat and press on the surface of the laminated carrier sheet, and switch to support-printed by the Shellfish Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. Then, after the stack is peeled from the support, the metal foil printed in a loop pattern remains on the support due to thermal adhesion, and unnecessary parts are removed together with the stack. Once the loop-shaped metal foil is transferred to the support, it is best to ensure that the metal foil adheres to the support, for example, if necessary, further heating and pressure can be applied to the entire structure. When heating the support after the metal foil is converted, the heating pattern need not be the same width as the printed metal foil, for example, it can be narrower than the width of the metal foil. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 cm) -13-404092 V. Description of the invention (11) In the heating step of converting the τ-shaped gold foil to the support '-if The support used is a thin sheet such as paper or plastic film. (Please read the precautions on the back before filling this page.) Apply heat from the support side. Otherwise, heat can be applied from both sides of the carrier sheet and the support. When manufacturing the resonant tag by the method of the present invention, 'a dielectric plastic film or a dielectric resin film is used as the support. The loop-shaped metal foil is transferred to both sides of the dielectric support in the aforementioned procedure to form a circuit or capacitor section on both sides of the support. In this way, a resonance circuit can be established as the substrate of the resonance tag. When a resin film is used as a support, for example, a resin coating can be prepared by applying a predetermined liquid resin to a release paper, and then the resin film on the release paper is used. Used as a support to transfer the loop-shaped metal foil onto it. After that, the release paper is peeled off, and then another loop-shaped metal foil can be transferred to the surface of the resin film that has been provided with the metal foil and has been stripped (that is, the surface that has been stripped), and Obtain the matrix of the resonant tag. Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs The resins used as dielectric plastic films or dielectric resin films include resins commonly used in this field. In particular, films such as polyethylene, polypropylene, polystyrene: olefin, polyester, or resin coatings can be used. In addition, a heat resistant resin such as polyimide can be used as a support to make a heat resistant product. It is best to provide holes or cuts in advance on the support (ie, the dielectric plastic film or the dielectric resin film) to connect the metal foil circuit formed on the surface to the back of the support, or to make resonance if necessary The circuit can be destroyed by applying electric current. Holes or cutouts in the support are provided at positions where the metal foil on the surface of the support overlaps with the metal foil on the back. By adjusting the size of the hole or cut paper, the Chinese national standard (CNS) A4 (2 丨 0X297 mm) 14 — 404092 A7 B7 V. Description of the invention (12) The position of the mouth can be controlled to make the resonance state Power required for failure. Also: 'holes or cutouts can be used to connect the upper and lower circuits on the multilayer printed circuit board. (Please read the precautions on the back before filling this page.) There are no specific restrictions on the heat-adhesive resin applied to the surface of the metal case when manufacturing the resonant tag. Therefore, any resin that is suitable for coating and has good dielectric properties, such as polyolefins, can be used. In addition, if necessary, a filler or the like may be added to the resin film to improve or enhance the dielectric characteristics of the obtained film. In addition, if necessary, a dielectric plastic film may be laminated on the surface of the metal foil in the lamination, and then a thermal adhesive resin may be further coated on the dielectric plastic film. In this case, the metal foil in the stack is embossed together with the plastic film to be transferred to the support. Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economy or, in the method of the present invention, without using a support, each stack having metal foil embossed in a loop-like pattern can be heated under pressure, To make the matrix of the resonant tag. The heat-adhesive resin applied to the surface of the metal foil provides the function of a support. In this way, the stacking arrangement is such that the sides with the metal foils face each other, and the carrier sheet side is heated. Similar to the previous case, a dielectric resin can be used as the heat-adhesive resin film-the resin used can also provide heat-adhesion only on the metal foil of the first laminate: the resin is applied without coating on the metal foil of the second laminate Cover with resin film. Alternatively, a simple heat-adhesive resin film can be applied to the metal foil of the first laminate, and a dielectric resin film can be applied to the metal foil of the second laminate. The two laminates obtained are combined into a whole, as a resonance. The base of the label. The resonant tag substrate obtained by adhering a coiled metal foil as a resonant circuit to both sides of the resin film can be processed into a desired product. At least one side of the obtained resonant tag substrate is adhered with a catching member or paper, plastic film, and the size of this paper is applicable to China National Standard (CNS) A4 (210 X297 mm) -15-404092 at ___B7 V. Description of the invention ( 13) =-Decorations such as sheets, etc., can be used to make the desired resonance label or resonance label. _ For example, an adhesive can be used to adhere a paper or plastic film to one side of the resulting resonant tag substrate, and apply an adhesive to the other side to adhere to the release paper on that side. In this way, a resonant tag can be obtained that can be applied directly to the product after the release paper is peeled off. In this way, since the liquid resin coating process is used to manufacture the dielectric film, the resonant tag provided by the present invention has far better dielectric properties than the conventional plastic film manufactured by extrusion molding in terms of film thickness tolerance. Electrical film. In addition,-'directly using a resin film adhesive can eliminate the non-uniform thickness of the dielectric layer caused by the use of an adhesive to adhere to the plastic film in the conventional resonant tag. In addition, a wide range of resins can be tolerated, and a filler or the like can be added in accordance with a desired concentration to improve the dielectric properties of the resin film. If necessary, two or more resins may be mixed. Therefore, it is possible to obtain a resonance tag having improved resonance frequency characteristics or a resonance tag having desired flexibility. In addition, in the present invention, the operation of embossing the metal foil into a line shape can be easily achieved because a resin-, sm film is formed on at least one side of the metal foil. -: Printed by nnnnn ID nt ^ — a ^ i I LI n T 0¾, va (please read the precautions on the back before filling this page) of the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs As a base material, the stack includes a carrier sheet with metal foil adhered on it, so the metal foil itself can be embossed into the desired pattern, and can be heated and pressed from the carrier sheet side or the support side to apply pressure. The stamped part is transferred to a support. Compared with the conventional mold embossing method, it can be seen that the method of the present invention allows the desired circuit pattern to be formed even on a thin and soft metal foil. In addition to the continuous coil-shaped circular type generally used in the conventional technical procedures, the method of the present invention does not allow the paper size to apply the Chinese National Standard (CNS) A4 specification (210X297 mm) -16-A7 B7 404092 V. Invention Explanation (14) forms a concentric pattern composed of large and small circles. I ^ -------- 1τ (Please read the precautions on the back before filling out this page) When using paper as a carrier sheet, marks can be formed to align with the carrier sheet. With this mark, it is easy to form a metal foil circuit in an overlapping manner on the surface of the support and the back. In this way, a resonant tag can be obtained, and the resonant tag includes a capacitor composed of a dielectric film interposed between two opposing metal foil circuits. When a laminate containing a metal foil and a surface of the metal foil coated with a thermal adhesive resin film is used as the dielectric layer of the present invention, the dielectric layer is made by coating a liquid resin. Therefore, in terms of film thickness tolerance, the obtained dielectric film is far better than the conventional plastic film manufactured by extrusion molding method. Therefore, a resonant tag with improved resonance frequency characteristics and flexibility can be obtained. 》 First embodiment Printed by the Male Workers Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Figure 1 shows an exploded perspective view of an embodiment of a resonant tag according to the present invention, in which a resin film 2 as a dielectric layer and an aluminum foil embossed into a coil shape 3 a has the same shape. Referring to FIG. Χ, the resin film 2 is disposed away from the aluminum foil 3a. However, in practice, a liquid resin ′ is applied to the aluminum foil and embossed together with the aluminum foil 3 a. Therefore, the resin film 2 is integrated with the surface of the aluminum foil 3 a to form a single unit. Referring to FIG. 1, the coiled aluminum foil 3 b overlaps with the aluminum foil 3 a and adheres to the rib f lipid film 2, and the coil winding direction thereof is opposite to the coil winding direction of the aluminum foil 3 a. When the resin film 2 is made of thermal resin, the aluminum foil 3a is superimposed on the aluminum box 3b ', or a support 4 may be stacked thereon, and the resulting laminate is subjected to thermal contact bonding. In detail, in this embodiment, the Chinese national standard (CNS) A4 (210 × 29 · 7 mm) is applied to the aluminum foil 3 b and the paper size. 17-404092 b77 5. Description of the invention (15) = two-g The aluminum foil 3 a also has a resin film 2 formed thereon, and is laminated on its lower surface—a support 4 such as paper or a plastic film. The release paper 6 is adhered to the support 4 through the adhesive adhesive 5 interposed therebetween. On the other hand, the paper 8 is adhered to the upper surface of the aluminum foil 3 a with an adhesive or an adhesive 7 to obtain the desired resonant tag 1. The role of the paper 8 is to protect or hide the resonant circuit below it. There may be printed matter such as logos on the paper to indicate records such as trademarks, vendors, or advertising sentences. Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) Figure 2 shows an exploded perspective view of another embodiment of the resonant tag of the present invention, where the area of the resin film 2 a and The area defined by the outer peripheral shape of the wire-shaped aluminum foil 3 a is the same. The other structures of the resonant tag 1 are the same as those shown in FIG. 1, and therefore descriptions of the same components as those shown in FIG. 1 are omitted here, and only the same symbols are used to indicate them. In this embodiment, the resin film 2 a is shown as a flat film. However, a liquid resin may be applied to the entire surface of the coiled aluminum foil to form a diaphragm. Therefore, it is possible to form a shape containing a resin film between the aluminum foil coils. In more detail, a coil-like protrusion may be formed on a flat plane. -In this way, the insulation of the resin film surface and the aluminum foil formed on the back surface can be more ensured. FIG. 3 shows an exploded perspective view of still another embodiment of the resonant tag of the present invention, in which both the coil-shaped resin film 2 and the flat resin film 2 a are provided. When the plastic film 4 is used as a support, the coil-shaped resin film 2 is first used to adhere the coil-shaped aluminum foil 3 b provided with the resin film 2 on the side to the plastic film. Then, the entire surface of the aluminum foil 3 b without the resin film 2 (including the surface of the support 4 that can be seen through the coil) can be applied by applying liquid resin, and this paper standard applies to China National Standard (CNS) A4 Specifications (210X297 mm) -18-A 7 _____B7___ 5. Description of the invention (16) = forming a resin film 2 a. First (please read the precautions on the back before filling in this guide) Figure 4 shows an exploded perspective view of another embodiment of the resonant tag of the present invention, in which a color is formed at the middle of the resin film 2 and mixed therein Conductive material (such as aluminum powder or copper powder) on the resin film 2_. In this embodiment, the conductive resin film is disposed in the middle of the aluminum foil circuit, but the conductive resin film may also be linearly disposed at the outermost portion 2 c of the coil as a point to be laminated on the surface of the resin film 2 and Between Metal Foil Sheets on the Back 'FIG. 5 is an exploded perspective view of an embodiment of a resonant tag according to the present invention, in which a plurality of coiled aluminum foils are laminated, and a resin film is laminated on each aluminum foil. More specifically, in this embodiment, three aluminum foils 3 are laminated. Reference numeral 10 in FIG. 5 indicates the position where the upper and lower aluminum foils are connected. By combining a plurality of foils in this manner, a more delicate resonant tag having predetermined resonance characteristics can be achieved. Second Embodiment _ Printed by the Central Bureau of Specimen Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperatives Figures 7 A to 7 G are general views showing cross-sectional views of components obtained in a step-by-step sequence when manufacturing resonant tags for explanation The second embodiment of the manufacturing process of the present invention. In FIG. 7A, a metal foil 1 0 2 coated with a heat-adhesive resin film 1 0 1 on its surface is adhered to a carrier sheet 1 0 4 using a pressure-sensitive adhesive or an adhesive 1 0 3 to form a laminate. As the base of the resonant tag. Referring to FIG. 7B, the laminate 1 1 0 is embossed to form a dent 1 on the gold foil 1 0 2 »The obtained laminate 1 1 0 is then stacked on a support (plastic film) 1 0.8. , The indentation part uses the mold 1 1 1 to carry out the hot mound paper size. Applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm)-404092 A7 B7___ Five 'invention description (17) = contact (picture). After peeling off the laminate 110, it is heated to form a circuit pattern on the metal foil 10 (FIG. 7D). In this way, a loop-shaped metal foil 10 is formed on the surface of the support 108, and the same operation is repeated on its back surface, and a loop-shaped metal foil 1 is formed on both surfaces of the support 108. 〇2. In this way, the matrix of the resonance tag is obtained (Figs. 7E to 7G). Fig. 8 is a perspective view of a manufacturing apparatus for continuously performing the above-mentioned operation procedures. --Referring to Fig. 8, the laminate 150 supplied in the form of a roll is fed to a first cutting die 160 for spreading to emboss a metal foil. The metal foil and the support 1 5 1 are embossed so that they can be transferred to the support 15 1 using the first heated stamper 1 6 1. The combined stack 150 and the support 1 51 are separated at the reversing drum 1 67. The unnecessary stack 1 5 2 is separated and removed * and the support 1 5 1 a having the metal box circuit thereon is further hot-molded using the first thermoplastic stamper 16 2. The first cutting die 16 for stamping the metal foil and the use of the first heating die 1 6 1 to convert the metal foil to the support 1 5 1 The upper part is detailed in FIG. 9 Show. Referring to FIG. 9, there is also shown a perforating device 1 90 for perforating the support 1 51 (if the support is a dielectric film; refer to FIG. 16), for attaching a perforation on the surface of the dielectric film. The metal foil circuit is connected to the circuit on the back of the membrane. Returning to FIG. 8, a support 1 5 1 a provided with a gold foil circuit on the surface is then reversed by the reversing roller 168. The back of the support 1 5 1 a and the stack 1 5 unrolled from the roll stack 1 50 shown on the right side of Figure 8 This paper size is applicable to China National Standard (CNS) A4 (210X297 mm)- -^ ------- ^ ------ Order (Please read the notes on the back before filling out this page) Printed by the Central Labor Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperatives-20-Central Standard of the Ministry of Economic Affairs Printed by the local shellfish consumer cooperative 404092 ^ V. Description of the invention (18) = 0 combination, and the second cutting die 1 63 is used to convert the metal foil in the same manner as described above. In this manner, the support 1 5 1 a passes through the second heating stamper 1 6 4 and the second thermoplastic stamper 16 5 together with the stack 1 50 to complete the process of having The final product of the metal foil circuit 1 5 3. If necessary, a printing paper may be adhered to the product obtained in this way, an adhesive may be applied, or a release paper 6 may be laminated to make a resonance label or a resonance label. 'Third embodiment Figs. 10A to 10G are general views showing cross-sectional views of components obtained in the order of steps when manufacturing a resonant tag, for explaining another embodiment of the manufacturing process of the present invention. The program steps shown in Figs. 10A to 10D are the same as those of the second embodiment previously described with reference to Figs. 7A to 7D. A loop-shaped metal cymbal sheet 1 0 2 is provided on one side of the support 10 7, and a stack of metal foil sheets 1 0 2 previously formed by imprinting -1 1 0 is set! Above the metal foil 10 2 on the support 10 7:. The entire surface is then heated under pressure, and another loop-shaped metal foil 102 is formed on the surface of the loop-shaped metal foil previously established. Apply the pressure-sensitive adhesive (adhesive) 1 0 6 that is used as a substrate for the resonant label to the support 1 0 7 obtained in this way, and adhere the release paper 1 5 to the coating. On the surface of the label with tacky adhesive, the final resonant label is obtained. Figure 11 shows the paper size of the manufacturing device used to continuously perform the aforementioned procedures. The paper is in Chinese National Standard (CNS) A4 size (210 × 297 mm) (please read the precautions on the back before filling this page).
、tT -21 - 4〇4〇fff>. _B7_ 五、發明説明（19 ) = 體圖。 - : 與先前參考圖8對第二實施例所說明的程序相似，成 捲筒形式供應的疊層1 5 0經展開饋送給第一切割壓模1 6 0，以壓印出金屬箔片。金靥箔片與支持物1 5 1 —起 壓印，使其可使用第一加熱壓模1 6 1來轉換至支持物1 51上。組合後的疊層150與支持物151在反轉滾筒 1 6 7處分開》不必要的疊層1 5 2被分離取去，而其上 具有金靥箔片迴路的支持物1 5 1 a再使用第一熱塑壓模· 1 6 2進一步予以熱壓鑄。不過本實施例之製程與圖8所 示者仍有所不同。更詳言之，一表面上設有金屬箔片迴路 的支持物1 5 1 a直接饋送至次一步驟而不爲反轉滾筒1 6 8所反轉。支持物1 5 1 a與從安置在裝置中央之捲繞 疊層1 5 0上展開之疊層1 5 0組合。與第二實施例相同 ，在疊層1 5 0上使用第二切割壓模1 6 3壓印有金屬箔 片.。所得含有支持物1 5 1 a與疊層1 5 0的結構通過第 — 經濟部中央梯準局貝工消费合作社印製 (請先閲讀背面之注意事項再填寫本頁) 二加熱壓模1 6 4與第二熱塑壓模1 6 5，以獲得最終產-物1 5 4 ιΓ此最終產物1 5 4在先前形成在支持物上的金二 屬箔片迴路上具有一第二金靥箔片迴路。在依此方式獲得 的產物之支持物上塗覆黏性黏著劑再黏接釋放紙6 ，便可 獲得圖10 G所示的諧振標貼。 第四實施例 圖12示出本發明用以連續進行程序操作之另一種製 造裝置。此裝置與前述實施例不同之處在於使用滾筒代替 本紙張尺度適用中國國家揉準（CNS ) A4規格（210X297公釐) '~~ -22 - A7 B7 404092 五、發明説明（20 ) 平坦示切割·壓模 '加熱壓模、及熱塑壓模。 _ (請先閲讀背面之注意事項再填寫本頁) 參考圖1 2 ’所示裝置包含第一與第二切割鑄模滾筒 180與183、加熱滾筒181與18 4、及熱塑滾筒 1 8 2 與 1 8 5。 參考圖1 3 ，本裝置中所使用的切割鑄模滾筒1 8 0 可爲一對滾筒，例如爲在其表面上設有切割刀片8 0 1的 金屬滾筒1 8 0 a與具有平滑表面的橡膠滾筒1 8 0 b。 參考圖14，加熱滾筒181例如可爲一對滾筒181 a -與1 8 1 b，各在其表面上以與凸板印刷滾筒相似的方式 設有加熱圖型突出物。參考圖15，熱塑滾筒對182例 如可包含兩個各具平滑表面的滾筒。 除了壓模以滾筒代替外，圖1 2所示裝置基本上與圖 1 1所示者相同。 第五實施例 • — 圖16示出由第二實施例所述程序製得的諧振標籤變- 化例之分^立體圖。在提供支持物作用之塑膠介電膜11: 經濟部中央棵準局貝工消費合作社印裝 電洞’ 2 ， 1 介孔路 ο 份洞 在的迴 1 部孔 來上的 片的設 2 2 上 箔覆所 ο 1 側 屬塗上 1 1 兩 金未 2 片膜 2 層下 1 箔電 1 疊留 1 屬介 1 在上膜 金在膜 可 1 電 以設電 ，ο 介 並穿介 中 1 於 ,。在 籤膜應 3 路置。標脂對 1 迴設用振樹置 1 置接之諧著位 洞設連路之黏的 孔側來迴例熱份 有兩用振施的部 設的供諧實成覆 先 2 係毀本形塗 事 1 3 摧在上未 上 1 1 供 面使 2 膜 1 或 表並 本紙張尺度適用中國國家橾準（CNS ) A4規格（210X297公釐） -23 - A7 4〇4〇92 b7 五、發明説明（21 ) = —- 1 3的位置·。 _ 參考圖16 ，在諧振標籤的線圈狀迴路邊緣並未設置 (請先閲讀背面之注意事項再填寫本頁) 電容電極區段。更詳言之，在介電膜1 1 2的兩側形成有 線圈狀金屬箔片迴路，而迴路本身提供電容電極板的作用 。亦即，迴路彼此相向，而介電膜夾於其間。破壞諧振電 路所需的電能等可藉由調整孔洞113的位置來加以控制 〇 經濟部中央標準局員工消費合作社印製 以上本發明特別針對諧振標籤與諧振標貼來予以詳細· 說明。不過，本發明可將所要寬度（例如從1 m m至1 0 mm)之呈線性圖型的金屬箔片轉換至各種物體上。因此 ，本發明的應用領域並不侷限於諧振標籤、單層印刷迴路 板、多層印刷迴路板等等。其他應用領域可包括製造電地 毯、電毯、融雪用加熱板等（在這些物件中本發明可應用 於防熱塑膠板及織布中）；車輛用除霧器（其中本發明可 應用於玻璃上）；以及除霜玻璃及薄板等（其中本發明可 應用於溫室的玻璃板及乙烯基板上。本發明於許多領域中/ 也甚有用ι"包括瓷器或漆器等其上設有金屬圖型之陶瓷物— 體的製造領域。 雖然以上本發明係就特定實施例來予以詳細說明，但 在不脫離本發明精神範圍之下，熟習本技術之士應可立刻 想到各種修改變化。 在諧振標籤基體A之一側表面上塗覆黏性黏著劑5， 再覆以釋放紙6所構成的諧振標貼中，從最終產物之黏:趣 黏著劑5的表面上剝塗j.激U時，有可能會產生靜電（ 本紙張尺度適用中國國家標準（CNS ) A4規格（2丨0X297公釐） 404092 A7 B7 五、發明説明（22 ) 見圖1 7 )=。此時因靜電放電作用之故，諧振特性可能會： 損失（或失效）。 (請先閲讀背面之注意事項再填寫本頁} 要避免此一缺點，可選擇不會產生靜電的黏性黏著劑 ’或如圖1 8至2 0所示，可在諧振標籤材料塗覆黏性黏 著劑的表面上安排未塗覆的部份5 a。在圖1 8實例中未 塗覆部份5 a呈線性安排。圖2 0示出圖1 8實例的立體 圖。線性未塗覆部份5 a可安排成與釋放紙6的剝除方向 平行，或與之成直角》在圖19實例中未塗覆部份5a呈-格子狀。在這些實例之上，可以適當的間隔安排黏性黏著 劑（例如成點狀線形式）。 在習知諧振標籤中，係使用先前形成的膜（例如塑膠 '膜）作爲介電層，而在介電層兩側上形成諧振迴路之線圈 迴路。於傳送極強諧振頻率至諧振標籤時（此爲使諧振迴 路失效的習知方法之一），先前形成的介電層的厚度很厚 而不易輕易造成短路，故在設置於諧振迴路端部的電容電 極板附近必須形成易於造成短路的部份。 _ 經濟部中央標準局員工消费合作社印裝 本發f中的介電層則與習知塑膠膜不同，係由具有介~ 電特性的極薄樹脂層製成，其厚度僅爲數微米，並提供黏 著劑的作用。以習知方法傳送極強諧振頻率至諧振迴路時 ，大量數目的電子會累積在某一電氣上最微弱之處（例如 線圏迴路31彎折部份的端部；如圖21所示，例如爲諧· 振迴路3 0中雙點虛線所包圍的區域Z ，在Z區域內的介 電層部份受摧毀短路），藉此而得以破壞安排於某一頻率 的迴路。至於電氣最微弱之處則並不侷限於線圈迴路的彎 本紙張尺度適用中國國家標準（CNS ) A4规格（210 X297公釐1 -25 - A7 B7 404092 五、發明説明（23 ) . 一 折部份，而可以用使線圈迴路的寬度減窄、或部份減窄的-方式來製備。圖2 1中，參考數字3 2表示用以連接諧振 迴路3 0 (金屬箔片）的連接部份，該等諧振迴路3 0將 介電層夾置於其間。 在電容電極板區並未形成在諧振迴路端部，而是使構 成諧振迴路的兩線圏迴路31彼此相對且將介電層夾置於 其間，並使用迴路本身作爲電容電極板區之諧振標籤中， 可更顯著地提昇前述破壞迴路的效益。 - 失效方法並不限於前述者；亦可使介電層兩表面上的 諧振迴路在按壓後機械連接（此亦爲使習知諧振標籤之諧 振頻率特性失效的方法之一），來使本發明之諧振迴路的 諧振頻率特性失效。 -------------#衣-- /#\ (請先閱讀背面之注杳？事項再填寫本頁), TT -21-4〇4〇ffff >. _B7_ V. Description of the invention (19) = body diagram. -: Similar to the procedure previously described with reference to FIG. 8 for the second embodiment, the stack 150 supplied in the form of a roll is unrolled and fed to a first cutting die 160 to emboss a metal foil. The gold foil and the support 1 5 1 are stamped together so that they can be transferred to the support 1 51 using the first heated stamper 1 6 1. The combined stack 150 is separated from the support 151 at the reversing roller 167. The unnecessary stack 1 5 2 is separated and removed, and the support with the gold foil circuit on it 1 5 1 a Further thermocompression molding was performed using the first thermoplastic stamper 1 2 6. However, the manufacturing process of this embodiment is still different from that shown in FIG. More specifically, a support 1 5 1 a provided with a metal foil circuit on one surface is directly fed to the next step without being reversed by the reversing roller 168. The support 15 1 a is combined with a stack 1 50 that is unfolded from a roll stack 1 50 placed in the center of the device. As in the second embodiment, a metal foil is embossed on the stack 150 using a second cutting stamper 16 3. The obtained structure containing the support 1 5 1 a and the laminated 1 50 0 was printed by the first-Cooperative Consumer Cooperative of the Central Stairs Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page). 4 and the second thermoplastic stamper 1 6 5 to obtain the final product-product 1 5 4 ιΓ This final product 1 5 4 has a second gold foil on the metal secondary foil circuit previously formed on the support Slice circuit. The support of the product obtained in this way is coated with an adhesive and then the release paper 6 is adhered to obtain the resonance label shown in Fig. 10G. Fourth Embodiment Fig. 12 shows another manufacturing apparatus according to the present invention for continuously performing a program operation. This device differs from the previous embodiment in that a roller is used instead of the paper size. Applicable to the Chinese National Standard (CNS) A4 (210X297 mm) '~~ -22-A7 B7 404092 5. Description of the invention (20) Flat cutting · Compression molds' heating molds and thermoplastic molds. _ (Please read the notes on the back before filling this page) Refer to Figure 1 2 'The device shown includes the first and second cutting mold rollers 180 and 183, heating rollers 181 and 18 4, and thermoplastic rollers 1 8 2 and 1 8 5. Referring to FIG. 13, the cutting mold roller 1 8 0 used in the device may be a pair of rollers, such as a metal roller 1 8 0 a having a cutting blade 8 0 1 on its surface and a rubber roller having a smooth surface. 1 8 0 b. Referring to FIG. 14, the heating roller 181 may be, for example, a pair of rollers 181 a-and 1 8 1 b, each of which is provided with a heating pattern protrusion on a surface thereof in a similar manner to a convex printing roller. Referring to Fig. 15, a pair of thermoplastic rollers 182 may include, for example, two rollers each having a smooth surface. The device shown in FIG. 12 is basically the same as that shown in FIG. 11 except that the die is replaced by a roller. Fifth Embodiment FIG. 16 is a perspective view of a modified example of a resonant tag made by the program described in the second embodiment. Plastic Dielectric Films Providing Supports 11: Printed Holes' 2, 1 Mesopore Road ο Central Messaging Bureau Shellfish Consumer Cooperatives, Ministry of Economic Affairs ο 2 holes in the hole, 2 pieces of holes on the hole 2 2 The upper foil is covered ο 1 side is coated with 1 1 two gold but 2 pieces of film 2 under the layer 1 foil electricity 1 stacking 1 metal intermediary 1 in the upper film gold in the film can be 1 electric to set electricity, ο and pass through the intermediary 1 in ,. The film should be set in 3 ways. The standard grease pair is set up with a vibrating tree and set up with a vibrating position. The sticky hole side of the link is connected to the side of the hole. Xing Tu Shi 1 3 Destroyed on the top 1 1 Supply surface 2 Film 1 or sheet and the size of this paper is applicable to China National Standards (CNS) A4 (210X297 mm) -23-A7 4〇04〇92 b7 5 Explanation of the invention (21) = —- 1 3's position ·. _ Refer to Figure 16, the coil-shaped loop edge of the resonance tag is not set (please read the precautions on the back before filling this page) Capacitor electrode section. In more detail, a coil-shaped metal foil circuit is formed on both sides of the dielectric film 1 12, and the circuit itself provides the function of a capacitor electrode plate. That is, the circuits face each other with the dielectric film sandwiched therebetween. The electrical energy required to destroy the resonant circuit can be controlled by adjusting the position of the hole 113. ○ Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs The present invention is specifically described with reference to resonant labels and resonant labels. However, the present invention can convert a metal foil in a linear pattern of a desired width (for example, from 1 mm to 10 mm) to various objects. Therefore, the application field of the present invention is not limited to resonant tags, single-layer printed circuit boards, multilayer printed circuit boards, and the like. Other application fields may include the manufacture of electric carpets, electric blankets, heating plates for snow melting, etc. (in these objects, the present invention can be applied to heat-resistant plastic plates and woven fabrics); defoggers for vehicles (where the present invention can be applied to glass ); And defrosting glass and sheet, etc. (where the present invention can be applied to glass and vinyl panels in greenhouses. The present invention is also useful in many fields / including porcelain or lacquerware with metal patterns on it Ceramics-the field of body manufacturing. Although the present invention has been described in detail with respect to specific embodiments, those skilled in the art should immediately think of various modifications and changes without departing from the spirit of the present invention. In the resonant tag base body On one side of A, the adhesive adhesive 5 is coated, and then the resonance label composed of the release paper 6 is covered. From the surface of the final product, the adhesive: Fun adhesive 5 is peeled off. Static electricity will be generated (This paper size applies the Chinese National Standard (CNS) A4 specification (2 丨 0X297 mm) 404092 A7 B7 V. Description of the invention (22) See Figure 17)) =. At this time due to the effect of electrostatic discharge Resonance characteristics may: Loss (or failure). (Please read the precautions on the back before filling out this page} To avoid this disadvantage, choose an adhesive that does not generate static electricity 'or as shown in Figure 1 8 to 2 0 As shown, the uncoated portion 5 a can be arranged on the surface of the resonant label material coated with the adhesive. The uncoated portion 5 a is linearly arranged in the example of FIG. 18. 18 A perspective view of the example 8. The linear uncoated portion 5a may be arranged parallel to or at right angles to the peeling direction of the release paper 6. In the example of FIG. 19, the uncoated portion 5a is in a grid pattern. On these examples, adhesive adhesives (such as in the form of dotted lines) can be arranged at appropriate intervals. In the conventional resonant tag, a previously formed film (such as a plastic 'film) is used as the dielectric layer, and the dielectric The coil circuit of the resonant circuit is formed on both sides of the electrical layer. When transmitting a very strong resonant frequency to the resonant tag (this is one of the known methods to disable the resonant circuit), the previously formed dielectric layer is thick and not easy Causes a short circuit. A short-circuit portion must be formed near the capacitive electrode plate. _ The dielectric layer in the printed product f of the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs is different from the conventional plastic film. It is made of extremely thin dielectric and electrical properties. Made of resin layer, its thickness is only a few micrometers, and it provides the function of an adhesive. When transmitting the extremely strong resonance frequency to the resonance circuit in a conventional way, a large number of electrons will accumulate at an electrical weakest point (such as The end of the bent portion of the coil loop 31; as shown in FIG. 21, for example, the area Z surrounded by the double-dotted dotted line in the resonance vibration circuit 30, and the dielectric layer portion in the Z area is destroyed and short-circuited) As a result, the circuit arranged at a certain frequency can be destroyed. As for the weakest part of electricity, it is not limited to the bend of the coil circuit. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X297 mm 1 -25- A7 B7 404092 V. Description of the invention (23). One part is folded, and it can be prepared by narrowing or partially narrowing the width of the coil circuit. In FIG. 21, reference numeral 32 denotes a connection portion for connecting a resonant circuit 30 (metal foil), and the resonant circuit 30 sandwiches a dielectric layer therebetween. The capacitor electrode plate area is not formed at the end of the resonance circuit, but the two wires 圏 circuit 31 constituting the resonance circuit are opposed to each other with the dielectric layer sandwiched therebetween, and the circuit itself is used as the resonance label of the capacitor electrode plate area. In this way, the benefits of the aforementioned damage circuit can be significantly improved. -The failure method is not limited to the foregoing; the resonant circuits on both surfaces of the dielectric layer can also be mechanically connected after pressing (this is also one of the methods for disabling the resonance frequency characteristics of the conventional resonant tag) to make the present invention The resonance frequency characteristic of the resonance circuit is invalid. ------------- # 衣-/ # \ (Please read the note on the back? Matters before filling out this page)
1T 經濟部中央標隼局負工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 261T Printed by the Consumers' Cooperative of the Central Bureau of Standards, Ministry of Economic Affairs This paper is sized for the Chinese National Standard (CNS) A4 (210X297 mm)