TW399248B

TW399248B - Resin composition and semiconductor device employing the same

Info

Publication number: TW399248B
Application number: TW086117943A
Authority: TW
Inventors: Rumiko Hayase; Shinetsu Fujieda; Yasuyuki Hotta; Shinji Murai
Original assignee: Toshiba Corp
Priority date: 1996-11-29
Filing date: 1997-11-28
Publication date: 2000-07-21
Also published as: KR19980042952A; KR100263663B1

Abstract

A resin composition comprising (a) an epoxy compound, (b) a curing agent comprising a polysiloxane resin having a phenolic hydroxyl group on its side chain, and (c) an inorganic filler.

Description

A7 ______B7 五、發明説明（1 ) ' 發明背景本發明係有關一種樹脂組成物，其具有優異的模塑性和耐熱性因而適合用來鑲鑄半導體裝置，及有關—種經樹脂鑲鑄的’被該樹脂組成物所密封住之半導體裝置。在現時進一步增加半導體元件積體率之趨勢下，元件所含各種機能單元的微小化及元件本身的擴大頃正迅速進展著。對於用樹脂組成物封裝此種半導體元件的目的而言 ’包括作爲主要成份的熱固性環氧樹脂及作爲硬化劑的酚樹脂之環氧樹脂組成物已受到廣泛地採用。例如，所謂的 A S I C ( Application Specific 1C )閘列（gate array )或標準胞型L S I所表的表面安裝型包裝皆爲利用前述環氧樹脂組成物作爲密封樹脂所製成的。在將這些半導體裝置安置在一基材上的程序中，已有多種方法被採用’例如蒸氣相流回，紫外射線流回及焊劑浸漬。此安裝方法中’係將封裝件暴露於2 1 5至2 6 0 °C級次的高溫中’使得滲透到封裝件內部的微量水分被突然蒸發掉，因而常造成封裝樹脂中產生龜裂。經濟部中央標隼局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 當龜裂擴展到封裝樹脂的外表面時，樹脂鑲鑄半導體裝置的抗濕可靠性即受損而造成嚴重問題。再者，當封裝樹脂內產生龜裂時，樹脂會被迫膨脹導致封裝件的變形，因而可能難以將封裝件安裝在基材之上。再者’在將彼等封裝件安裝在基材之上時，即使在被樹脂封合住的半導體元件內部也可能發生各種問題包括龜裂。例如’用於例如鋁所形成的金屬交連配線層（metaiiic 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -4- A7 B7 經濟部中央標準局員工消费合作社印簟五、發明説明（2 ) inttrconnecting wiring layer )的鈍化膜之 P S G (隣砂酸鹽玻璃）或S i N (氮化矽）可能龜裂，或全黏合線可能發生龜裂。爲了解決這些問題，在樹脂鑲鑄半導體裝置特別是大尺寸者的製造中有下文所述各種需求，這些需求主要都是與密封樹脂有關》 (1 ) 密封樹脂施加在內部裝置的應力必須最小化，且密封樹脂與導框或半導體元件上形成的膜例如P S G 膜，S i N膜或聚醯亞胺膜之間的著作用必須改良。 (2 ) 密封樹脂必須具有優良的耐熱性，亦即，有充分高的高溫強度或濕氣吸收下的高溫強度以使其能忍受得住封裝件的安裝溫度。同時，密封樹脂的吸濕性必辑俸可能地低。另一方面，從筆記型個人電腦及攜帶式電話的普及化之觀點來看爲了減少半導體晶片的安裝面積，已廣泛地採用可以使裸晶片直接黏著到基材上的倒裝式安裝（flip chip mounting )。爲了實施這種倒裝式安裝，需要用到具何優良可靠性’亦即低吸濕性及良好黏著性之液體密封樹脂。從這些需求著眼，已開發出一種使用含有矽酮油的樹脂組成物之方法’該砂酮油的添加係爲了減少密封樹_脂施加在內部裝置上的應力及改良密封樹脂與導框等之間的黏著性。不過，矽酮油的添加會伴隨著下述問題，亦即矽酮油可能從模塑產品的表面慢慢的滲流出，由是造成產品外 {請先聞讀背面之注意事項再填寫本頁) -ΙΊ. 裝-A7 ______B7 V. Description of the invention (1) 'BACKGROUND OF THE INVENTION The present invention relates to a resin composition which has excellent moldability and heat resistance and is therefore suitable for mounting semiconductor devices, and related to-a resin-casting type' A semiconductor device sealed by the resin composition. With the current trend of further increasing the integration rate of semiconductor devices, the miniaturization of various functional units contained in devices and the expansion of devices themselves are rapidly progressing. For the purpose of encapsulating such a semiconductor element with a resin composition, an epoxy resin composition including a thermosetting epoxy resin as a main component and a phenol resin as a hardener has been widely used. For example, the so-called A S I C (Application Specific 1C) gate array or the standard cell-type L S I surface-mounted packaging are made using the aforementioned epoxy resin composition as a sealing resin. In the procedure for mounting these semiconductor devices on a substrate, various methods have been used such as vapor phase flow-back, ultraviolet ray flow-back, and flux impregnation. In this mounting method, 'exposing the package to a high temperature of 2 15 to 2600 ° C' causes the trace moisture that penetrates into the package to be suddenly evaporated, which often causes cracks in the packaging resin. Printed by the Consumers' Cooperative of the Central Bureau of Standards, Ministry of Economic Affairs (please read the precautions on the back before filling this page). When the cracks spread to the outer surface of the encapsulating resin, the moisture resistance reliability of the resin-molded semiconductor device is impaired. Cause serious problems. Furthermore, when cracks occur in the packaging resin, the resin may be forced to expand to cause deformation of the package, and it may be difficult to mount the package on a substrate. Furthermore, when these packages are mounted on a substrate, various problems, including cracks, may occur inside a semiconductor device sealed with a resin. For example 'for metal cross-linked wiring layers made of aluminum (metaiiic, this paper size applies Chinese National Standards (CNS) A4 specifications (210X297 mm) -4- A7 B7 Consumers' Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. Note (2) PSG (ortho-salt glass) or SiN (silicon nitride) of the passivation film of the inttrconnecting wiring layer may be cracked, or the full bonding wire may be cracked. In order to solve these problems, there are various requirements described below in the manufacture of resin-molded semiconductor devices, especially those of large sizes. These requirements are mainly related to the sealing resin. (1) The stress applied to the internal device by the sealing resin must be minimized Moreover, the work between the sealing resin and the film formed on the guide frame or the semiconductor element such as a PSG film, a SiN film, or a polyimide film must be improved. (2) The sealing resin must have excellent heat resistance, that is, have a sufficiently high high-temperature strength or high-temperature strength under moisture absorption so that it can withstand the mounting temperature of the package. At the same time, the hygroscopicity of the sealing resin must be low. On the other hand, in order to reduce the mounting area of semiconductor chips from the standpoint of the popularization of notebook personal computers and mobile phones, flip-chip mounting (flip chip) in which bare chips can be directly adhered to a substrate has been widely used. mounting). In order to implement such a flip-chip mounting, it is necessary to use a liquid-sealing resin having excellent reliability, that is, low hygroscopicity and good adhesion. In view of these needs, a method of using a resin composition containing a silicone oil has been developed. 'The addition of this ketone oil is to reduce the stress applied to the internal device by the sealing resin and resin, and to improve the sealing resin and the guide frame. Adhesiveness. However, the addition of silicone oil will be accompanied by the following problems, that is, the silicone oil may slowly leak out from the surface of the molded product, which will cause the product outside {Please read the precautions on the back before filling this page ) -ΙΊ. 装-

•1T 本紙張尺度適用中國國家標準（CNS )八4規格（210X 297公釐） -5- A7 B7 五、發明説明（3 ) 觀缺陷或污染金屬模子。傳統環氧樹脂組成物通常含有酸酐或胺化合物作爲硬化劑。不過，含有這種硬化劑的樹脂組成物具有高吸濕性，因而使其難以得到具有高可靠抗濕性的密封樹脂。如上文所解釋者，目前尙未有不僅能提供在用爲密封樹脂時所需的每一種特性，而且展現出低吸水性及可避免金屬模子污染之樹脂組成物。發明槪述綜上所述，本發明的一項目的爲提供一種用於鑲鑄半導體裝置的樹脂組成物，其具有優良的可模塑性和耐熱性，且同時具有低吸水性。本發明的另一目的爲提出一種經樹脂鑲鑄半導體裝置 ’其具有優良的耐熱性及抗熱震性，且同時具有高度防濕靠性。亦即’根據本發明，提出一種樹脂組成物，其包括：經濟部中央標準局貝工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁} (a ) —環氧化合物；（b )硬化劑，其包括側鏈上有酚羥基的聚矽氧烷樹脂；及（c )無機塡料。再者，根據本發明，提出一種樹脂組成物，其包括： (a )環氧化合物； (b )硬化劑，其包括具有下面通式（p s 1 )所袠取複單位及/或下面通式（p s 2 )所表重複單位之聚矽氣烷樹脂；及 (c )無機塡料；本紙張尺度適用中國國家樣準（CNS )八4規格（21〇χ297公楚） -6 - 五、發明説明（4 i-0-h• 1T This paper size is applicable to Chinese National Standard (CNS) 8-4 specifications (210X 297 mm) -5- A7 B7 5. Invention Description (3) Defective or contaminated metal molds. Conventional epoxy resin compositions usually contain an acid anhydride or an amine compound as a hardener. However, the resin composition containing such a hardener has high hygroscopicity, making it difficult to obtain a sealing resin having high reliable moisture resistance. As explained above, currently, there is no resin composition which can not only provide every characteristic required when used as a sealing resin, but also exhibit low water absorption and avoid contamination of metal molds. Summary of the Invention In view of the foregoing, it is an object of the present invention to provide a resin composition for an inlay semiconductor device, which has excellent moldability and heat resistance, and at the same time has low water absorption. Another object of the present invention is to provide a resin-molded semiconductor device ′ which has excellent heat resistance and thermal shock resistance, and at the same time has high moisture resistance. That is, according to the present invention, a resin composition is provided, which includes: Printed by the Shellfish Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page) (a) — epoxy compound; (b ) A hardener, which includes a polysiloxane resin having a phenolic hydroxyl group on a side chain; and (c) an inorganic filler. Furthermore, according to the present invention, a resin composition is provided, including: (a) an epoxy compound; (b) a hardener, which includes a polysilazane resin having a complex unit obtained by the following general formula (ps 1) and / or a repeat unit represented by the following general formula (ps 2); and (c) an inorganic aggregate; This paper size is applicable to China National Standard (CNS) 8-4 specification (21〇χ297 公楚) -6-5. Description of the invention (4 i-0-h

A7 B7 (psi) 式中R1係選自下列所成組合之中者：各具1$1〇個碳原子的烷基，乙烯基’烯丙基，經取代或未經取代芳基及經取代或未經取代矽烷氧基；R4R 6可相同或相異，各爲選自下列所成組合之中者：氫原丨，鹵素原子，經取代或未經取代的院基’殘基，基，院氧㈣，院氧基，嫌丙氧基，烯丙基及經取代或未經取代芳基，其限制條件爲 R2至R6中至少有一者爲羥基：A7 B7 (psi) where R1 is selected from the group consisting of: alkyl groups with 1 $ 10 carbon atoms each, vinyl 'allyl groups, substituted or unsubstituted aryl groups, and substituted or Unsubstituted silyloxy; R4R 6 may be the same or different, and each is selected from the group consisting of: hydrogen proton, halogen atom, substituted or unsubstituted radical, residue, radical, radical Oxyhydrazone, trisoxy, propyloxy, allyl and substituted or unsubstituted aryl, the restriction is that at least one of R2 to R6 is hydroxyl:

(請先閲讀背面之注意事項再填寫本頁) •裝. 訂經濟部中央標準局負工消費合作社印製 (PS2) 式中R 7係選自下列所成組合之中者.自友 _ 十有·具有1至10個碳原子的經取代或未經取代烷基，里有R本η 〜句6至1 4個碳原子的經取代或未經取代芳基，及經取代或未械而& a U 4禾經取代矽烷氧基；R 8 至R 1 2可相同或相異且個別地爲撰白τ ^ 胃$自下列所成組合之中者 :氫原子，鹵素原子，經取代或夫挪而^ 4禾經取代烷基，羧基，烷羰基’烷氧羰基，烷氧基，醯氧基，，嫌 ^ S烯芮氧基，烯丙基，具有6至14個碳原子的經取代或未树 n4禾經取代芳基，醯胺基和醯亞胺基，其限制條件爲R 8至R i 2 ^ K 中至少有一者爲酚羥基或具有酚羥基的基。(Please read the precautions on the back before filling out this page) • Packing. Printed by the Central Standards Bureau of the Ministry of Economic Affairs, printed by the Consumer Cooperative (PS2) where R 7 is selected from the following combinations. Yes · A substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, which contains R or η ~ 6 to 14 substituted or unsubstituted aryl groups, and a substituted or unsubstituted & a U 4 and substituted silyloxy; R 8 to R 1 2 may be the same or different and are individually written τ ^ Stomach $ from any of the following combinations: hydrogen atom, halogen atom, substituted Or alkanoyl, substituted with alkyl, carboxyl, alkylcarbonyl, alkoxycarbonyl, alkoxy, fluorenyl, alkoxy, allyl, having 6 to 14 carbon atoms The substituted or unsubstituted n4 and substituted aryl, sulfonylamino, and sulfinylimine groups are subject to the limitation that at least one of R 8 to R 2 ^ K is a phenolic hydroxyl group or a group having a phenolic hydroxyl group.

A7 B7 五、發明説明（5 ) 根據本發明，更提出一種經樹脂鑲鑄的半導體裝置，其包括一基材’配置在該基材表面上的半導體元件及一用以密封該半導體元件的樹脂層，其中該樹脂層係由上述諸樹脂組成物中任何一者的經硬化物質所形成的。本發明的其他目的和優點皆揭示於下面的說明中，且部份可從該說明突顯出，或可經由本發明的實作而獲知。本發明的目的和優點可利用所附申請專利範圍中特別指出的工具和組合予以實現和獲得。圖式之簡略說明倂入作爲本發明說明書一部份的所附圖式係用以闡明本發明的較佳實施例，且與上述槪略說明及下面所予較佳實施例的詳細說明，一起用來解釋本發明的原理。圖1爲顯示本發明經樹脂鑲鑄半導體裝置一實施例的斷面圖：圖2爲顯示出本發明經樹脂鑲鑄半導體裝置另一實施例的斷面圖；及圖3爲圖2中所示經樹脂鑲鑄半導體裝置製造步驟一實施例之斷面圖。發明之詳細說明本發明要參考下面較佳實施例予以詳細解說。有關構成本發明樹脂組成物中的成分（a )之環氧化合物，任何環氧化合物只要其分子內含有兩或更多個環氧基者皆可以使用。彼等化合物的例子有雙酚A二環氧丙基本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐）； I-- (請先閲讀背面之注意事項再填寫本頁)A7 B7 5. Description of the invention (5) According to the present invention, a resin-molded semiconductor device is further provided. The semiconductor device includes a substrate, a semiconductor element disposed on the surface of the substrate, and a resin for sealing the semiconductor element. Layer, wherein the resin layer is formed of a hardened substance of any one of the resin compositions described above. Other objects and advantages of the present invention are disclosed in the following description, and some of them can be highlighted from the description, or can be learned through the implementation of the present invention. The objects and advantages of the present invention can be achieved and obtained by using tools and combinations specifically pointed out in the scope of the appended patent application. Brief description of the drawings The drawings incorporated as part of the description of the present invention are used to illustrate the preferred embodiment of the present invention, and together with the above-mentioned schematic description and the detailed description of the preferred embodiment given below, Used to explain the principle of the present invention. 1 is a sectional view showing an embodiment of a resin-molded semiconductor device according to the present invention: FIG. 2 is a sectional view showing another embodiment of a resin-molded semiconductor device according to the present invention; and FIG. A cross-sectional view showing an embodiment of a manufacturing step of a resin-molded semiconductor device. Detailed Description of the Invention The present invention will be explained in detail with reference to the following preferred embodiments. Regarding the epoxide compound constituting the component (a) in the resin composition of the present invention, any epoxy compound can be used as long as it contains two or more epoxy groups in its molecule. Examples of these compounds are bisphenol A diglycidyl. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm); I-- (Please read the precautions on the back before filling this page)

、1T 經濟部中央橾準局員工消費合作杜印製 -8- A7 B7 五、發明説明（6 ) ' f-------、^.-- (請先閲讀背面之注$項再填寫本頁) 醚，雙酚F二環氧丙基醚’聯苯基醚的二環氧丙基醚和彼等的衍生物’聯苯及其衍生物的二環氧丙基醚，g分系線型酚醛樹脂類環氧樹脂’甲酚系線型酚醛類環氧樹脂，萘酣系線型酚醛樹脂類環氧樹脂，雙酚A線型酚醛樹脂類環氧樹脂，酚或烷基酚與羥基苯甲醛縮合物經環氧化衍生所得環氧樹脂’環氧化參（羥基苯）烷，環氧化肆（羥基苯）烷，2，2 / ’ 4，4 / —四羥基二苯甲酮四環氧丙基醚，Ν ’ Ν -二環氧丙胺基—4 —環氧丙氧基苯，1 , 3， 5_三環氧丙氧基苯，2 ’ 2 — ，4 ，4 / —四環氧丙基聯苯’ 4 ，4 ’ / —雙（2 ，3 —環氧基丙氧基）—3 ， 3^ ’ 5 ，5'— 四甲基聯苯，Ν，Ν，Ν - ，Ν> —四環氧丙胺基二苯基甲烷及其縮合物，脂環族環氧樹脂，及鹵化環氧樹脂。經濟部中央標準局員工消費合作社印製上述環氧樹脂可依本發明樹脂組成物中用爲硬化劑的成分（b )而適當地選擇。此外，本發明樹脂組成物中，環氧樹脂和構成成分（b )的總量可經由考慮模塑產品所具熔融黏度和熱膨脹係數的調整而予以適當地決定。例如當樹脂組成物是要用於鑲鑄半導體元件時，環氧樹脂和硬化劑的總量必須較佳地限制在以樹脂配料計爲5重量份數至5 0重量份數範圍之內。本發明樹脂組成物中的成分（b )爲用以硬化前述構成（a )成分的環氧化合物之硬化劑’其包括在其側鏈上有酚羥基之聚矽氧烷樹脂。有關這種在其側鏈上有酚羥基的聚矽氧烷樹脂，較佳者爲採用具有下示通式（p s 1 ) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -9- 所表重複單位之聚矽、 1T Consumption Cooperation by Employees of the Central Procurement Bureau of the Ministry of Economic Affairs -8- A7 B7 V. Description of the Invention (6) 'f -------, ^ .-- (Please read the note on the back before reading Fill in this page) Ether, bisphenol F diglycidyl ether 'glycidyl ether of biphenyl ether and their derivatives' glycidyl ether of biphenyl and its derivatives, g content Line novolac resin epoxy resin 'cresol novolac resin, naphthalene-based novolac resin epoxy resin, bisphenol A novolac resin epoxy resin, phenol or alkylphenol and hydroxybenzaldehyde Epoxidation of the condensate through the epoxidation of the epoxy resin 'epoxidized ginseng (hydroxybenzene) alkane, epoxidized (hydroxy benzene) alkane, 2, 2 /' 4, 4 /-tetrahydroxybenzophenone tetra epoxy propyl Ether, Ν′Ν-diglycidyl-4-glycidoxybenzene, 1, 3, 5-triglycidoxybenzene, 2 '2-, 4, 4 /-tetraglycidyl Biphenyl'4,4 '/-bis (2,3-epoxypropoxy) -3, 3 ^' 5,5'-tetramethylbiphenyl, Ν, Ν, Ν-, Ν >-tetra Glycidyl diphenylmethane and its condensation Materials, cycloaliphatic epoxy resins, and halogenated epoxy resins. Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs The above epoxy resin can be appropriately selected depending on the component (b) used as a hardener in the resin composition of the present invention. In addition, the total amount of the epoxy resin and the constituent component (b) in the resin composition of the present invention can be appropriately determined by taking into consideration the adjustment of the melt viscosity and the coefficient of thermal expansion of the molded product. For example, when the resin composition is to be used for casting semiconductor components, the total amount of the epoxy resin and the hardener must be preferably limited to a range of 5 parts by weight to 50 parts by weight based on the resin ingredients. The component (b) in the resin composition of the present invention is a hardener for curing the aforementioned epoxy compound constituting the component (a), and it includes a polysiloxane resin having a phenolic hydroxyl group on its side chain. Regarding the polysiloxane resin having a phenolic hydroxyl group on its side chain, it is preferable to use the following general formula (ps 1). The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm)- 9- Polysilicon for repeating units shown

A7 B7 五、發明説明（7 ) 所表重複單位或下示通式（p S 2 氧烷樹脂。 (PS1) 式中R1㈣自下列所成組合之中者：各具1$1Q個碳原子的院基，乙嫌基，烯丙基’經取代或未經取代芳基及經取代或未經取代砂院氧基；R2SR 6可相同或相異，各爲選自下列所成組合之中帛：氫原子，鹵素原子，經取代或未經取代的烷基’帛基，烷羰基，烷氧羰基，烷氧基，烯丙氧基’烧丙基及經取代或未經取代芳基，其限制條件爲 (PS2) 式中R7係選自下列所成組合之中者：具有1$1Q個碳原子的經取代或未經取代院基’具有…4個碳原子的經取代或未經取代芳基，及經取代或未經取代繼基；R8 至R"可相同或相異且個別地爲選自下列所成組合之中者 :氫原子，齒素原+，經取代或未經取代垸基，錢基，院碳基’院氧幾基，基’醜氧基，稀两氧基，嫌丙基，具有6至丄4個碳原子的經取代或未經取代芳㊄，醯胺基本紙張尺度適用準(CNS) A4規格(21〇χ;公- I —Μ n I - I n - I > 1 ^1(1 I ^11 T • U3-a (請先閲讀背面之注意事項再填寫本頁) R 2至R 6中至少有一者爲羥基；A7 B7 V. Description of the invention (7) The repeating unit shown in the table or the general formula (p S 2 oxane resin. (PS1) where R1㈣ is from the following combinations: each with 1 $ 1Q carbon atoms Yuanji, Ethyl, Allyl 'substituted or unsubstituted aryl and substituted or unsubstituted oxooxy; R2SR 6 may be the same or different, each selected from the following combinations: : Hydrogen atom, halogen atom, substituted or unsubstituted alkyl'fluorenyl, alkylcarbonyl, alkoxycarbonyl, alkoxy, allyloxy 'alkyl and substituted or unsubstituted aryl, which The limitation is (PS2) where R7 is selected from the group consisting of: substituted or unsubstituted radicals having 1 $ 1Q carbon atoms' substituted or unsubstituted having 4 carbon atoms Aryl, and substituted or unsubstituted substituents; R8 to R " may be the same or different and are individually selected from the group consisting of: hydrogen atom, protogen +, substituted or unsubstituted Fluorenyl, qian, carbon, carbon, carbon, oxo, oxo, dioxy, dioxo, propyl, substituted with 6 to 丄 4 carbon atoms Or unsubstituted arylamine, the basic paper size of amidine is applicable to the standard (CNS) A4 (21〇χ; Male-I —Μ n I-I n-I > 1 ^ 1 (1 I ^ 11 T • U3- a (Please read the notes on the back before filling out this page) At least one of R 2 to R 6 is hydroxyl;

-10- 五、發明説明（8 ) 和醯亞胺基，其限制條件爲R 8至R 1 2 + _ κ 中至少有一者爲酚羥基或具有酚羥基的基。前述通式（PS 1 )中具有1至〇個碳原子的烷基之例子包括甲基，乙基，正丙基，逛拓# 與内基’正丁基，第二丁基’第三丁基，正戊基，正己基，正辛基，正壬基和正經濟部中央標準局員工消費合作社印製癸基。通式（P S 1 )中的經取代或Φ M h 4未經取代芳基的例子包括苯基，鄰-羥基苯基，對一羥甚 U碁本基，鄰一甲基苯基，對—甲基苯基，/3 —萘基’及對—氯苯基。另一方面’有關前述通式（P S 2 )中的具有丄至 1 〇個碳原子的烷S ’可以採用如前述者相同類別的基。有關經取代芳基’除了上文例舉者之外可以採用鄰一甲氧基苯基，對-甲氧基苯基和9 —蒽基。此夕卜於此通式（ p S 2 )中，{^和！^所表基中的任何—者可以與, R11和R12所表基中的任何一者連接在_起形成—閉環。當前述通式（PS 1 )中的R1和前述通式（ps 2 ) 中的R ’係由經取代或未經取代矽烷氧基所構成者時，這些基可鍵聯到鄰接重複單位的經取代或未經取代矽烷氧基，由疋經由下示（一s i — 〇— s i _)鍵形成二次元或三次元構造。此外’構成R 1和R 7的這些矽烷氧基除了鍵聯到鄰接重複單位的矽烷氧基之外也可以鍵聯到其他分子所具經取代或未經取代矽烷氧基上，由是同樣地形成二次元或三次元構造。本紙張尺度適财ns家辟（CNS) M規格（21GX297公麓） (請先閲讀背面之注意事項再填寫本頁) 裝. 訂 -11 - 五、發明説明（9 ) A7 B7-10- V. Description of the invention (8) and sulfonium imino group, the limitation is that at least one of R 8 to R 1 2 + _ κ is a phenolic hydroxyl group or a group having a phenolic hydroxyl group. Examples of the alkyl group having 1 to 0 carbon atoms in the aforementioned general formula (PS 1) include a methyl group, an ethyl group, an n-propyl group, and an alkyl group. Base, n-pentyl, n-hexyl, n-octyl, n-nonyl, and the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economy printed decyl. Examples of the substituted or Φ M h 4 unsubstituted aryl group in the general formula (PS 1) include a phenyl group, an o-hydroxyphenyl group, a p-hydroxyl-Ubenyl group, an o-methylphenyl group, and p- Methylphenyl, / 3-naphthyl 'and p-chlorophenyl. On the other hand, in the alkane S having 丄 to 10 carbon atoms in the aforementioned general formula (P S 2), a group of the same type as the foregoing may be used. Regarding the substituted aryl ', in addition to those exemplified above, o-methoxyphenyl, p-methoxyphenyl and 9-anthryl may be used. Furthermore, in this general formula (p S 2), {^ 和! ^ Any of the bases shown in the table can be connected to any of the bases of R11 and R12 to form a closed loop. When R1 in the aforementioned general formula (PS 1) and R ′ in the aforementioned general formula (ps 2) are composed of a substituted or unsubstituted silyloxy group, these groups may be bonded to the adjacent repeating unit via Substituted or unsubstituted silyloxy groups form a two-dimensional or three-dimensional structure from fluorene through the (one si — 0 — si —) bond shown below. In addition, these silyloxy groups constituting R 1 and R 7 may be bonded to a substituted or unsubstituted silyloxy group other than the silyloxy group adjacent to the repeating unit. Form a two-dimensional or three-dimensional structure. The size of this paper is CNS M (21GX297). (Please read the precautions on the back before filling out this page.) Binding. Order -11-V. Description of the invention (9) A7 B7

有關通式（P s 1 )及/或通式（P S 2 )所表重複單位，其例子可爲下面化學式（1 )至（3 4 )所表的下列重複單位。Examples of the repeating units represented by the general formula (P s 1) and / or the general formula (P S 2) may be the following repeating units represented by the following chemical formulas (1) to (3 4).

i-O—)-i-O —)-

i-O-)-i-O-)-

(1) (2) (3) 經濟部中央標準局員工消費合作社印製 o-f-(1) (2) (3) Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs o-f-

i-O-)- (4)i-O-)-(4)

---I - - - n I I _ _ n —I— T I m I n-------- Ά ✓n..· (請先閱讀背面之注意事項再填寫本頁) (5) (6) (7) (8) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -12 - 五、發明説明（10--- I---n II _ _ n —I— TI m I n -------- Ά ✓n .. · (Please read the notes on the back before filling this page) (5) ( 6) (7) (8) This paper size is applicable to Chinese National Standard (CNS) A4 (210X 297mm) -12-5. Description of the invention (10

(12) A7 B7(12) A7 B7

(11)(11)

<rH2-CH- Si-O-)-< rH2-CH- Si-O-)-

:¾(14) H3 ； '裝 ^ 訂 j /1-· (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局負工消費合作社印製本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -13- 五、發明説明（11 ) A7 B7: ¾ (14) H3 ； Binding ^ Order j / 1- · (Please read the precautions on the back before filling out this page) Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Consumer Cooperatives This paper is printed in accordance with Chinese National Standards (CNS) A4 specifications (210X297 mm) -13- V. Description of the invention (11) A7 B7

(15) (16) (17)(15) (16) (17)

^^^1 «ι^ϋι I tm— m ftffn ffm am— i\, —HI— mi ml In— 1^1^1 ml -* 、T -/i (請先閲讀背面之注意事項再填寫本頁) (18) (19)^^^ 1 «ι ^ ϋι I tm— m ftffn ffm am— i \, —HI— mi ml In— 1 ^ 1 ^ 1 ml-*, T-/ i (Please read the precautions on the back before filling in this (Page) (18) (19)

經濟部中央標準局貝工消費合作社印製本紙張尺度適用中國國家標隼（CNS ) A4規格（2丨0'〆297公釐） -14- A7 B7 五、發明説明（12Printed by Shellfish Consumer Cooperatives, Central Bureau of Standards, Ministry of Economic Affairs This paper is sized for China National Standards (CNS) A4 (2 丨 0'〆297mm) -14- A7 B7 V. Description of Invention (12

(21)(twenty one)

(23) --：--------裝-- (請先閱讀背面之注意事項再填寫本頁)(23)-: -------- install-(Please read the precautions on the back before filling this page)

Η 訂 (24) (25) (26) 經濟部中央標準局貝工消費合作社印製本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -15- A7 五、發明説明（13订 Order (24) (25) (26) Printed by the Shellfish Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs This paper applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) -15- A7 V. Description of the invention (13

本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -16 - 五、發明説明（Μ ) A7This paper size is applicable to China National Standard (CNS) A4 (210X 297 mm) -16-V. Description of Invention (Μ) A7

—HI— m td^ I ant ml am \ ' ^^^1 ^^^1 ^^^1 1^1 ^^^1 ^n 一J * 0¾-e (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製本紙張尺度適用中國國家標準（CNS ) A4規格（2I0X：297公釐） -17 - 經濟部中央橾準局貝工消費合作社印製 A7 __B7 五、發明説明（15 ) 具有通式（P S 1 )所表重複單位的化合物可經由如下面所述方法予以製造。特定言之，將三氯基苯基矽烷與乙醇以1 : 2之莫耳比混合，並反應所得混合物而得二乙氧基苯基矽烷。另一方面，可用羥基氯苯與三甲基氯矽烷反應而得三甲基矽烷氧基氯苯。所得三甲基矽烷氧基氯苯可與二甲氧基苯基矽烷在金屬鈉存在中反應而得三甲基矽烷氧基苯基二乙氧基苯基矽烷，其可經由水解而縮合。另一方面，具有通式（P S 2 )所表重複單位的化合物可以用例如日本專利未審公報Η / 6 2 — 2 2 9 1 3 6 中所揭不的方法予以製造。特定言之，該方法包括下列言奢步驟：將爲了用二甲基砂院基或院基醆保護任酣所形成的具有不飽和鍵之化合物與經單取代二氯矽烷或經單取代二乙氧基矽烷利用鉑觸媒反應後，將所得反應產物透過水解進行縮合反應。具有通式（P S 1 )所表重複單位的化合物及具有通式（P S 1 )所表重複單位的化合物所具熔點和熔融黏度 ‘可以經由利用下述方法製成共聚物而予以控制：其中係將二氯矽烷例如二甲基二氯矽烷，甲基苯基二氯矽院和二苯基二氯矽烷，與具有其羥基被保護任的酚之二氯砂院丨昆# ，並將所得混合物經由水解予以縮合。例如，經由將具有苯基的二氯矽烷如苯基甲基二烷和二苯基二氯矽烷，與具有經保護酚羥基的二氯砂_共聚合可得到具有高玻璃轉變點之聚矽氧烷樹脂。也可u g 由在通式（P S 1 )中的R1或逋式（P S 2 )中的本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ~ ------ ； I、，裝— 訂 - ί (請先聞讀背面之注意事項再填寫本頁) 經濟部_央標隼局員工消費合作社印製 A7 —-一 _87 —__ 五、發明説明（16 ) 導入苯基或萘基而得到具有高玻璃轉變點之聚矽氧烷樹脂〇另一方面，經由用通式（P S 1 )所表重複單位及/ 或通式（P S 2 )所表重複單位與二甲基矽氧烷共聚合可得到具有低熔融黏度的聚砂氧院樹脂。經由在通式（p S 1 )的R1或通式（p S 2 )的R7中導入甲基或乙基也可以得到具有低溶融黏度的聚砂氧院樹脂。此外，不必經由上述與二甲基矽氧烷的共聚合也可以得到具有低熔融黏度的聚矽氧烷樹脂’因爲通常所得之聚矽氧烷都具有相當低分子量的傾向之故。本發明所用聚矽氧烷樹脂所具熔點和熔融黏度可依意欲得到的樹脂組成物及該樹脂組成物的模塑方法而適當地決定。例如，若所欲樹脂組成物爲液體時，聚矽氧烷樹脂在模塑溫度下測得的熔融黏度較佳者必須爲約0 . 0 1至 1 0 P a · S。相反地，若所欲樹脂組成物爲固體時，聚矽氧烷樹脂在模塑溫度下測得之熔融黏度較佳者必須爲約 5 至 500Pa· S。前述聚矽氧烷樹脂的分子量較佳者必須爲3 0 0至 50 ，000 ，更佳者500至30 ，000。因爲，若其分子量低於3 0 0時，會損及聚矽氧烷樹脂的耐熱性和耐熱震性。相反地，若其分子量超過50 ，000時，會損及聚矽氧烷樹脂的可模塑性。根據本發明，除了在其側鏈上有前述酚羥基之聚矽氧烷之外，也可以在（b )成分中混合入通常已知爲環氧化本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁) * J— - 1·*·. 裝 -、?τ -19 - 經濟部中央標準局員工消費合作社印製 A7 __B7五、發明説明（17 ) 合物的硬化劑之化合物。彼種化合物的例子包括胺，酸酐和酚。上述胺的特殊例子爲伸乙基三胺，三伸乙基四胺，二乙胺基丙胺，N -胺基乙基六氫吡哄，苄基二甲胺，參 (二甲胺基甲基）酚，伸甲基二胺，二胺基二苯基甲烷，二胺基二苯基碾，聚醯胺樹脂（胺價：2 0 0至3 5 0 ) ，二氰胺，三氟化硼一乙胺，甲二胺，二甲苯二胺，雙胺基丙基四氧雜螺十一烷加合物及乙基甲基咪唑。前.述酸酐的特殊例子爲酞酸酐，順丁烯二酸酐，十二烷基丁二酸酐，六氫酞酸酐，四氫酞酸酐，甲基六氫酞酸酐，甲基四氫駄酸酐，甲基奈的酸酐（methyl nadic anhydride )，苯四甲酸酐，二苯甲酮四羧酸酐，二氯丁二酸酐及氯菌酸酐。前述酚的特殊例子包括線型酚醛類酚樹脂於此情況中，只要在一分子內含有兩個或更多個酚羥基的任何類別線型酚醛類酚樹脂都可以採用。例如，酚系線型酚醛樹脂，甲酚系線型酚醛樹脂，第三丁基酚系線型酚醛樹脂，壬酚系線型酚醛樹脂，酚芳烷基型樹脂及二環戊二烯酚系線型酚醛樹脂都可以採用。於這些酚樹脂中，從可模塑性和機械強度來看較佳者爲酚系線型酚醛樹脂。酚系線型酚醛樹脂的特殊例子有Shounol BRG-555( Showa High Polymer Co.，Led.軟化點：6 8 °C，熔融黏度 :2-4Pa. S 於 125°C 下），Shounol BRG-5 5 6 ( Showa High Polymer Co., Ltd.軟化點：8 0 °C，溶融黏度 :1.8Pa· S 於 150°C 下）’ Shounol BRG-558 ( Showa High Polymer Co.，Ltd.軟化點：9 7°C，熔融黏度 (請先閲讀背面之注意事項再填寫本頁) 裝.—HI— m td ^ I ant ml am \ '^^^ 1 ^^^ 1 ^^^ 1 1 ^ 1 ^^^ 1 ^ n One J * 0¾-e (Please read the notes on the back before filling in this Page) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs This paper is printed in accordance with the Chinese National Standard (CNS) A4 (2I0X: 297 mm) -17-Printed by the Central Consumers ’Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperatives A7 __B7 V. DESCRIPTION OF THE INVENTION (15) A compound having a repeating unit represented by the general formula (PS 1) can be produced by a method described below. Specifically, trichlorophenylsilane and ethanol were mixed at a molar ratio of 1: 2, and the resulting mixture was reacted to obtain diethoxyphenylsilane. On the other hand, trimethylsilyloxychlorobenzene can be obtained by reacting hydroxychlorobenzene with trimethylchlorosilane. The obtained trimethylsilyloxychlorobenzene can be reacted with dimethoxyphenylsilane in the presence of sodium metal to obtain trimethylsiloxyphenyldiethoxyphenylsilane, which can be condensed by hydrolysis. On the other hand, a compound having a repeating unit represented by the general formula (PS 2) can be produced by a method not disclosed in, for example, Japanese Unexamined Patent Publication No. 6/2 2 2 9 1 3 6. In particular, the method includes the following extra steps: combining a compound having an unsaturated bond formed with a dimethyl sand base or a base base, and mono-substituted dichlorosilane or mono-substituted diethyl After the oxysilane is reacted with a platinum catalyst, the obtained reaction product is subjected to a condensation reaction by hydrolysis. The melting point and melt viscosity of the compound having the repeating unit represented by the general formula (PS 1) and the compound having the repeating unit represented by the general formula (PS 1) can be controlled by making a copolymer by the following method: Dichlorosilane such as dimethyldichlorosilane, methylphenyl dichlorosilane, and diphenyl dichlorosilane, and dichloro sand institute with its hydroxy-protected phenol, quinone #, and the resulting mixture It is condensed by hydrolysis. For example, polysiloxanes having a high glass transition point can be obtained by copolymerizing dichlorosilanes having a phenyl group, such as phenylmethyldioxane and diphenyldichlorosilane, with dichloro sand having a protected phenolic hydroxyl group. Alkyl resin. It can also be ugly from the paper size of R1 or formula (PS 2) in the general formula (PS 1) to the Chinese National Standard (CNS) A4 specification (210X297 mm) ~ ------; I 、， Installation-order-ί (please read the notes on the back before filling in this page) Ministry of Economic Affairs _ Central Standard Printing Bureau Employee Printing Cooperatives Print A7 —- 一 _87 —__ 5. Description of the invention (16) Introduction of phenyl Or a naphthyl group to obtain a polysiloxane resin having a high glass transition point. On the other hand, the repeating unit represented by the general formula (PS 1) and / or the repeating unit represented by the general formula (PS 2) and dimethyl Siloxane copolymerization can obtain polysynthetic oxygen resin with low melt viscosity. By introducing a methyl group or an ethyl group into R1 of the general formula (p S 1) or R7 of the general formula (p S 2), it is also possible to obtain a polysynthetic resin having a low melt viscosity. Further, it is possible to obtain a polysiloxane resin having a low melt viscosity without going through the above-mentioned copolymerization with dimethylsiloxane, because the polysiloxane generally obtained tends to have a relatively low molecular weight. The melting point and melt viscosity of the polysiloxane resin used in the present invention can be appropriately determined depending on the resin composition to be obtained and the molding method of the resin composition. For example, if the desired resin composition is a liquid, the better melt viscosity of the polysiloxane resin measured at the molding temperature must be about 0.01 to 10 Pa · S. On the contrary, if the desired resin composition is solid, the better melt viscosity of the polysiloxane resin measured at the molding temperature must be about 5 to 500 Pa · S. The molecular weight of the aforementioned polysiloxane resin must preferably be 300 to 50,000, and more preferably 500 to 30,000. If the molecular weight is less than 300, the heat resistance and thermal shock resistance of the polysiloxane resin will be impaired. Conversely, if the molecular weight exceeds 50,000, the moldability of the polysiloxane resin is impaired. According to the present invention, in addition to the polysiloxane having the aforementioned phenolic hydroxyl group on its side chain, the component (b) may also be mixed with the paper generally known as epoxidized. This paper is sized to the Chinese National Standard (CNS) A4 specification. (210X297 mm) (Please read the precautions on the back before filling out this page) * J—-1 · * ·. Equipment-,? Τ -19-Printed by the Consumers Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 __B7 V. Invention The compound of the hardener of (17). Examples of such compounds include amines, anhydrides and phenols. Specific examples of the above amines are triethylamine, triethylenetriamine, diethylaminopropylamine, N-aminoethylhexahydropyridine, benzyldimethylamine, ginsyl (dimethylaminomethyl) ) Phenol, Methylene Diamine, Diamino Diphenyl Methane, Diamine Diphenyl Mill, Polyamine Resin (Amine Value: 200 to 3 50), Dicyandiamide, Boron Trifluoride Monoethylamine, methyldiamine, xylenediamine, bisaminopropyltetraoxaspiroundecane adduct and ethylmethylimidazole. Specific examples of the foregoing anhydrides are phthalic anhydride, maleic anhydride, dodecylsuccinic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and Kei Nai anhydride (methyl nadic anhydride), pyromellitic anhydride, benzophenone tetracarboxylic anhydride, dichlorosuccinic anhydride and chloric anhydride. Specific examples of the aforementioned phenol include novolac phenol resins. In this case, any type of novolac phenol resins may be used as long as it contains two or more phenolic hydroxyl groups in one molecule. For example, phenol-based novolac resins, cresol-based novolac resins, third butylphenol-based novolac resins, nonylphenol-based novolac resins, phenol aralkyl-based resins, and dicyclopentadiene-phenol novolac resins are all Can be used. Among these phenol resins, preferred are phenol-based novolac resins in terms of moldability and mechanical strength. Specific examples of phenolic novolac resins are Shounol BRG-555 (Showa High Polymer Co., Led. Softening point: 6 8 ° C, Melt viscosity: 2-4Pa. S at 125 ° C), Shounol BRG-5 5 6 (Showa High Polymer Co., Ltd. softening point: 80 ° C, melt viscosity: 1.8Pa · S at 150 ° C) 'Shounol BRG-558 (Showa High Polymer Co., Ltd. softening point: 9 7 ° C, melt viscosity (please read the precautions on the back before filling this page).

、1T 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） -20- 經濟部中央標準局貝工消費合作社印掣 A7 B7 五、發明説明（18 ) :6 . 2 P a . S 於 1 5 〇°C 下）’ Barcam TD-2131 (Dai nippon Ink & Chemicals Inc.軟化點：8 0 C ’ 溶融黏度： 30Pa· S 於 150°C 下）’ Barcam TD-2093 (Dainippo n Ink & Chemicals Inc.軟化點：1 〇〇 C ’ 溶融黏度： 3 0 P a · S於15 0°C下）。此外也可以使用具有烯丙基的酌樹脂了如 SH — 14 〇A ( Mitsubishi Petrochemical Co., Ltd.) , SH-150A (Mitsubishi Petrochemical Co., Ltd. )，和 X P S F - 4 4 8 8 (G u n e i C h e m i c a 1 I n d u s t r y C o ·，L t d.)。構成（b )成分且包括側鏈上有酚羥基的聚矽氧烷樹脂之硬化劑與視情況的上述通常已知爲環氧樹脂所用硬化劑之化合物的混合比例較佳者必須經決定成可符合下列條件者。亦即，構成（a )成分和（b )成分的環氧樹脂總量必須爲樹脂組成物總量的5至9 0重量％，且同時，（ a )成分所含環氧套（EP)與（b)成分所含酚羥基（ P h 0 Η )之間的比例（E P / P h 0 Η )必須在1 / 1 · 2至1/0 · 2的範圍內。若（a )成分和（b )成分的總量低於5重量％時，會損及樹脂組成物的流性由是在模塑時造成黏合線的偏移或床的脫位。相反地，若前述總量超過9 0重量％時，硬化產物的熱膨脹係數會變高使得不能得到足夠的耐熱性》再者，若（a )成分所含環氧基與（b )成分所含酚羥基之間的比例落在上述範圍之外時，硬化產物的耐熱性會變壞或使樹脂組成物的硬化速率會變得太低，因而難以模塑組成物。本紙承尺度適用中國國家標準（CNS〉Α4規格（210Χ297公趁） (請先閲讀背面之注意事項再填寫本頁) 裝. ,ιτ -21 - 經濟部中央標準局員工消费合作社印製 A7 B7 五、發明説明（19) 此外，構成硬化劑的（b )成分之混合比例較佳者必須限制在5至1 0 〇重量份數每1 〇〇重量份數（a )成分，同時要符合上述條件。若（b )成分的混合比例低於 5重量份數時，會難以得到足夠的耐熱性，或樹脂組成物所具熔融黏度會變得太高，因而損及樹脂組成物的可模塑性。另一方面，若（b )成分的混合比例超過1 0 〇重量份數時，硬化物所具吸水性會變得太高，因而損及模塑產品的可靠性。有關構成本發明樹脂組成物成分所含（c )成分的無機塡料，可以使用石英玻璃，結晶氧化矽，熔融矽石，锆英石，氧化鋁，矽酸鈣，硫酸鋇，菱鐵礦，黏土，高嶺土，滑石，雲母，玻璃纖維，陶瓷纖維，矽酸碳，矽酸氮，氮化鋁，鈦白，碳酸鈣和石膏。其中，更佳者爲石英玻璃，結晶氧化矽和熔融矽石，因爲這些無機塡料可使樹脂組成物展現出低吸濕性及低熔融黏度之故。有關結晶氧化矽和熔融矽石，雖則有兩種不同的形狀，亦即，粉碎矽石和球形矽石，不過彼等可以經由適當地混合而使用。無機塡料的混合比例較佳者必須爲以整個樹脂組成物計算之1 0至9 5重量％，更佳者爲4 0至9 0重量％。若混合比例低於1 0重量％時，硬化物的熱膨脹係數可能變得太大致使不能得到充分的耐熱震性。相反地，若其含量超過9 5重量％時，會損及樹脂組成物的流動性而可能在其模塑步驟造成黏合線的偏移或床的脫位。、 1T This paper size is applicable to Chinese National Standard (CNS) A4 specification (210 × 297 mm) -20- Printed by Aijia Consumer Cooperative of Central Standards Bureau of the Ministry of Economic Affairs A7 B7 5. Description of the invention (18): 6. 2 P a. S At 150 ° C) 'Barcam TD-2131 (Dai nippon Ink & Chemicals Inc. Softening point: 8 0 C' Melt viscosity: 30Pa · S at 150 ° C) 'Barcam TD-2093 (Dainippo n Ink & Chemicals Inc. Softening point: 100 ° C. Melting viscosity: 30 Pa / S at 150 ° C). Alternatively, resins with allyl groups such as SH — 14 OA (Mitsubishi Petrochemical Co., Ltd.), SH-150A (Mitsubishi Petrochemical Co., Ltd.), and XPSF-4 4 8 8 (G unei C hemica 1 Industry Co, · L t d.). The component (b) that contains a hardener containing a polysiloxane resin with a phenolic hydroxyl group on its side chain and a compound that is generally known as the hardener used for epoxy resins as described above may be determined in a suitable ratio. Meet the following conditions. That is, the total amount of the epoxy resin constituting the (a) component and the (b) component must be 5 to 90% by weight of the total resin composition, and at the same time, the epoxy sleeve (EP) and (B) The ratio (EP / Ph 0 Η) between the phenolic hydroxyl groups (P h 0 Η) contained in the component must be in the range of 1/1 · 2 to 1/0 · 2. If the total amount of the components (a) and (b) is less than 5% by weight, the fluidity of the resin composition may be impaired due to the displacement of the bonding line or the dislocation of the bed during molding. Conversely, if the total amount is more than 90% by weight, the thermal expansion coefficient of the hardened product becomes high, and sufficient heat resistance cannot be obtained. Furthermore, if the epoxy group contained in the component (a) and the component (b) contained When the ratio between the phenolic hydroxyl groups falls outside the above range, the heat resistance of the hardened product may be deteriorated or the hardening rate of the resin composition may become too low, making it difficult to mold the composition. The paper bearing standard is in accordance with Chinese national standard (CNS> Α4 specification (210 × 297)) (Please read the precautions on the back before filling out this page) Pack., Ιτ -21-Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 5 2. Description of the invention (19) In addition, if the mixing ratio of the component (b) constituting the hardener is better, it must be limited to 5 to 100 parts by weight per 100 parts by weight of the component (a), and it must meet the above conditions. If the mixing ratio of the component (b) is less than 5 parts by weight, it may be difficult to obtain sufficient heat resistance, or the melt viscosity of the resin composition may become too high, thereby impairing the moldability of the resin composition. On the other hand, if the mixing ratio of the component (b) exceeds 100 parts by weight, the water absorption of the cured product becomes too high, thereby impairing the reliability of the molded product. Related to the composition of the resin composition of the present invention (C) of the inorganic ingredients in the ingredients can be quartz glass, crystalline silica, fused silica, zircon, alumina, calcium silicate, barium sulfate, siderite, clay, kaolin, talc, Mica, glass Fiber, ceramic fiber, carbon silicate, nitrogen silicate, aluminum nitride, titanium white, calcium carbonate, and gypsum. Among them, quartz glass, crystalline silica, and fused silica are more preferable because these inorganic materials can make the resin The composition exhibits low hygroscopicity and low melt viscosity. Although crystalline silica and fused silica have two different shapes, that is, pulverized silica and spherical silica, they can be appropriately mixed For use, the mixing ratio of the inorganic aggregate must be preferably 10 to 95% by weight based on the entire resin composition, and more preferably 40 to 90% by weight. If the mixing ratio is less than 10% by weight In some cases, the thermal expansion coefficient of the cured product may become too rough to obtain sufficient thermal shock resistance. On the other hand, if the content exceeds 95% by weight, the fluidity of the resin composition may be impaired and the resin composition may be damaged during the molding process. Causes a shift in the bond line or dislocation of the bed.

若本發明樹脂組成物要用來密封其中將IC或LSI 本紙張尺度適用中國國家標準（CNS ) Α4规格（210Χ297公釐） (請先閲讀背面之注意事項再填寫本頁) 裝- -、π -22- 經濟部中央樣準局負工消費合作社印製 A7 _B7五、發明説明（20 ) 直接安裝在基材上的flip chip時|高度適宜地爲在基材與半導體元件之間的空間可以被該樹脂組成物容易地塡充。所以構成（c )成分的無機塡料所具最大粒徑及平均粒徑較佳者必須限制在一預定的範圍。例如，無機塡料的最大粒徑較佳者必須爲5 0微米或更小者，更佳者爲3 0微米或更小者。由於半導體與基材之間的空間所具高度通常是在5 0微米至1 5 0微米之級次，因此含有最大粒徑超過 5 0微米的無機塡料之樹脂組成物可能不能導到該間隙內，可能引起樹脂組成物的不均勻塡充由是引出有缺陷的絕緣，或可能在某些情況下產生封裝件龜裂。另一方面，該無機塡料的平均粒徑較佳者必須在0·5微米至50微米範圍內。若無機塡料的平均粒徑小於〇·5微米時，樹脂組成物的黏度會過度地增高，由是減低塡充樹脂組成物的速度因而損及工作效率。相反地，若無機塡料的平均粒徑超過5 0微米，可能損及樹脂組成物進入半導體與基材之間的空間之塡充性質。本發明樹脂組成物可包含硬化觸媒用以促進構成（a )成分的環氧化合物與構成（b )成分的硬化劑之間的硬化反應。例如，可以使用鹼性化合物，有機膦化 '合物’咪唑化合物或其衍生物，D B U ( 1 ，8 —二氮雜雙環（5 ，4，0)十一烯一 7)或DBU的鹽。鹼性化合物的例子包括第三胺類例如苄基二甲胺’ α 一甲基苄基二甲胺，二甲胺基甲基酚，參一二甲胺基甲基酚及彼等的鹽或複合化合物。 (請先閲讀背面之注意事項再填寫本頁) 裝· 訂本紙張尺度適用中國國家標率（CNS ) Α4規格（210X297公4 > -23- B7 五、發明説明（21 ) 有機膦的例子爲三甲基膦，三乙基膦，三丁基膦，三苯基膦，三（對一甲基苯基）膦，三一（壬苯基）膦，甲基二苯基膦，二丁基苯基膦，三環己基膦，1 ，2 —雙（二苯基膦）乙烷，及雙（二苯基膦）甲烷。咪唑化合物的例子爲咪唑，2 -甲基咪唑，2，4 一二甲基咪唑’ 2 —乙基一 4_甲基咪唑，2 —苯基咪唑， 2 —苯基一 4 一甲基咪唑，和2 -十七烷基咪唑。If the resin composition of the present invention is to be used to seal the IC or LSI, the paper size of this paper applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) (please read the precautions on the back before filling this page). Installation--, π -22- Printed by A7 _B7 printed by the Consumers' Cooperative of the Central Bureau of Standards, Ministry of Economic Affairs 5. Description of the invention (20) When flip chip is directly mounted on the substrate | It is highly suitable that the space between the substrate and the semiconductor element can be It is easily filled with this resin composition. Therefore, the maximum particle diameter and average particle diameter of the inorganic aggregate constituting the component (c) must preferably be limited to a predetermined range. For example, the largest particle size of the inorganic aggregate must preferably be 50 microns or less, and more preferably 30 microns or less. Because the height of the space between the semiconductor and the substrate is usually in the order of 50 to 150 micrometers, a resin composition containing an inorganic aggregate with a maximum particle size of more than 50 micrometers may not lead to the gap. In this case, unevenness of the resin composition may be caused by defective insulation, or cracks in the package may be generated in some cases. On the other hand, the average particle diameter of the inorganic aggregate must preferably be in the range of 0.5 to 50 m. If the average particle diameter of the inorganic filler is less than 0.5 micrometer, the viscosity of the resin composition will be excessively increased, which will reduce the speed of filling the resin composition, thereby impairing work efficiency. On the contrary, if the average particle diameter of the inorganic filler exceeds 50 micrometers, the filling properties of the resin composition into the space between the semiconductor and the substrate may be impaired. The resin composition of the present invention may contain a hardening catalyst to promote a hardening reaction between the epoxy compound constituting the component (a) and the hardener constituting the component (b). For example, a salt of a basic compound, an organic phosphonated 'composition' imidazole compound or a derivative thereof, D B U (1,8-diazabicyclo (5,4,0) undecene-7) or DBU can be used. Examples of the basic compound include a third amine such as benzyldimethylamine 'α monomethylbenzyldimethylamine, dimethylaminomethylphenol, ginsyldimethylaminomethylphenol and their salts or Compound compounds. (Please read the precautions on the back before filling out this page) The size of the bound and bound paper is applicable to China National Standards (CNS) A4 specifications (210X297 male 4 > -23- B7) 5. Description of the invention (21) Examples of organic phosphines Trimethylphosphine, triethylphosphine, tributylphosphine, triphenylphosphine, tris (p-methylphenyl) phosphine, tris (nonphenyl) phosphine, methyldiphenylphosphine, dibutyl Phenylphenylphosphine, tricyclohexylphosphine, 1,2-bis (diphenylphosphine) ethane, and bis (diphenylphosphine) methane. Examples of imidazole compounds are imidazole, 2-methylimidazole, 2,4 Mono-dimethylimidazole '2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 2-heptadecylimidazole.

DBU酚鹽的例子包括SA — 8 5 3 ( Sanapro )。也可以使用電位觸媒作爲硬化觸媒，例如No vacure HX -3722，HX-372 1, HX-3748, HX-374 1，HX-3742,和 HX-3088 ( Asahi Chemical Industry Co.，Ltd.或 MY-25 (Ajinomoto Co. )。前述硬化觸媒在本發明樹脂組成物中的混合比例較佳者必須在0 · 1至10重量份數每10 0重量份數的構造經濟部中央標準局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) (a )成分的環氧化合物與構成（b )成分的硬化劑之總量。若硬化觸媒的含量低於0 · 1重量份數時，則樹脂組成物的硬化可能變得不足使得所得硬化產物，經鑲鑄的樹脂模塑產物所具耐熱性受損。相反地，若硬化觸媒的含量超過1 0重量份數，可能損及所得硬化產物的耐熱性，防濕性及電性質。硬化觸媒的更佳混合比例爲0 · 5至5重量份數每1 0 0重量份數的（a )成份和（b )成分總量〇本發明樹脂組成物可包括黏著促進劑以改良樹脂組成物在硬化後對基材的黏著作用。彼等黏著促進劑的例子爲本紙張尺度通用中國國家標準（CNS ) A4規格（210X297公釐） -24- A7 _____B7_ 五、發明説明（22 ) @固性樹脂例如胺基樹脂，聚胺甲酸酯樹脂及不飽和聚酯 :異氰酸酯化合物；橡膠；矽烷化合物及金屬鉗合化合物 0 這些化合物中，金屬鉗合化合物不僅可以有效地改良胃半導體元件的黏著性，而且可以改良硬化樹脂的防水性。彼等金屬鉗合化合物的例子有Z r鉗合物，T i鉗合物和A丨鉗合物。 Z r鉗合物的特殊例子爲肆乙醯基丙酮基鍩，一丁氧基Ξ乙醯丙酮基锆，二丁氧基二乙醯乙酸銷，肆乙基乙醯乙酸鍩，丁氧基參乙基乙醯乙酸锆，三丁氧基一乙基乙醯乙酸鉻，肆乙基乳酸锆，二丁氧基雙乙基乳酸锆，雙乙醯丙酮基雙乙基乙醯丙酮基鉻，一乙醯丙酮基參乙基乙醯丙酮基銷，一乙醯丙酮基雙乙基乙醯丙酮基錐，及雙乙醯丙酮基雙乙基乳酸基鍩。有關T i鉗合物和A丨鉗合物，可以使用具有配位體例如沒一二酮，羥羧酸，酮酯，酮醇和二醇之化合物。經濟部中央標準局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 在採用熱固性樹脂或橡膠作爲本發明組成物中的黏著促進劑時，該熱固性樹脂或橡膠的混合比例較佳者必須爲樹脂組成物的0 · 2至2 0重量％。若該混合比例低於 0 · 2重量％時，不能得到充分的黏著促進劑效用。相反地，若該混合比例超過2 0重量％時，硬化物的吸水性會變得太高或模塑產物的耐熱性會惡化。在使用金屬鉗合物於本發明樹脂組成物中作爲黏著促進劑時，該金屬鉗合物的混合比例較佳者必須爲樹脂組成物的0 · 0 1至5重量本紙張尺度適用中國國家標準（CNS ) A4規格（210Χ 297公釐） -25- 經濟部中央標準局貝工消費合作社印製 A7 B7 五、發明説明（23 ) %。若該混合比例低於0 . 〇 1重量％時，不能得到充足的金屬鉗合物效用。相反地，若混合比例超過5重量％時，半導體元件的交連配線可能因離子雜質而致侵蝕，或在樹脂組成物施加於經樹脂鑲鑄半導體裝置時，損及模塑產品的電絕緣性質。另外，在本發明樹脂組成物中可以加入其他添加劑例如滞燃劑如三氧化銻，磷化合物和含鹵素化合物；離型劑如天然蠟，合成蠟，線型脂肪酸或其金屬鹽，酸醯胺，酯和石蠟；顏料例如碳黑和二氧化鈦；及表面處理劑例如矽烷偶合劑。再者，.於本發明樹脂組成物中可以摻和應力釋放劑（s t r e s s - r e 1 i e v i n g a g e n t )例如砂酮橡膠，砂酮油，各種塑膠粉，工程塑膠粉，A B S樹脂粉和Μ B S樹脂酚。構成（a )成分的環氧樹脂和構成（b )成分的聚矽氧烷樹脂很有可能被雜質所染，例如本發明樹脂組成分中的鹼金屬離子或鹵素離子。此外也可料到樹脂組成物中可能殘留未反應的鹵化烷基，鹵化芳基或氯矽烷，或者在副反應中產生鹵化物化合物。已知者，當含有這些雜質的樹脂組成物被用來密封半導體元件時，會因鋁配線被侵蝕或防濕性受損而造成交^連配線的中斷。所以有強烈地從樹脂組成物脫除掉這些雜質的需要存在。這些雜質可以經由下述方法有效地脫除掉，其中係將含有這些雜質的樹脂組成物溶解在水溶性極性溶劑例如小甲基吡咯酮，N，N —二甲基乙醯胺’四氫呋喃（tHF )，丙酮或乙醇之內，由是形成樹脂溶液’然後將其滴入本紙伕尺度通用中國國家標準（CNS ) A4規格（210X297公釐） -26- nn ^^^1 nn m >^—^1 ^^^1 4 ml ^^^1 ^^^1 ^^4 • -s (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局貝工消費合作社印製 A7 --------B7 _ 五、發明説明（24 ) 大量水中或有機酸如草酸的稀水溶液內，再過濾收集所致沈源聚合物。也可以經由下述方法脫除這些雜質，其中係將含有這些雜質的樹脂組成物溶解在不能與水混溶的有機溶劑例如***，乙酸乙酯或氯系有機溶劑之內，然後於此樹脂溶液中加入水或有機酸稀水溶液，振盪之後靜置所得混合溶液’如此將混合溶液分離成有機溶劑相和水相，並收集有機溶劑相.因而脫除掉這些雜質。這些方法都可以重複到鹼金屬或鹵素雜質的濃度已減低到預定的可接受濃度爲止。亦即，在合成樹脂中所含呈雜質形式的鹼金屬之濃度較佳者必須限制到5 0 p p m或更低者，更佳者 2 0 p pm或更低者，最佳者5 p pm或更低者。另一方面’在樹脂中所含爲雜質的鹵素化合物之濃度較佳者必須限制在5 0 0 p pm或更低者，更佳者3 0 0 p pm或更低者，最佳者1 0 0 p pm或更低者。若要將L C或L S I直接安裝在一基材上時，該密封物質須爲液體。根據本發明可以經由適當地組合具有低熔點的（a )成分與具有低熔點的（b )成分而得到有高度可靠性的液體樹脂組成物。例如，在將室溫下爲液體或油狀的（a )成分與在室溫下爲液體或油狀的（b )成分組合後，可得到液體樹脂組成物。若要將液體樹脂組成物用爲液體密封物質時，該樹脂組成物的黏著較佳者必須在 100°C溫度下爲5Pa. S或更低者。因爲，若樹脂組成物的黏著超_過5 P a · S時，樹脂組成物塡充到基材及半導體元件之間的空間內之操作會變得困難’因而需要用本紙張尺度適用中國國家標準（CNS ) A4規格（21〇X：297公釐） -f -- -I- —-I— i-.i —^― 1— 4 I— I - -- I - -- 111— (請先閱讀背面之注$項再填寫本頁) -27 - 經濟部中央樣準局貝工消费合作社印製 A 7 B7 _ 五、發明説明（25 ) 到長時間來塡充樹脂組成物。再者，若樹脂組成物的黏著超過5Pa· S時，在樹脂鑲鑄半導體裝置中會產生未經塡充的部份，由是不僅會造成裝置的有缺陷絕緣，而且會使半導體元件容易離開基材。順便提及者，樹脂組成物在室溫下的較佳黏著爲2 OP a· S或更低者，更佳者爲 1 0 P a · S或更低者。雖然對於樹脂組成物所具黏著的下限（D有任何特別限制，較佳者該樹脂組成物在1 ο 〇 °c溫度下的黏著必須爲ImPa. S或更高者，因爲若樹脂組成物的黏度過度地低時，硬化產物上可能產生模糊不淸現象之故。若有需要調整本發明樹脂組成物的黏度時，可以使用有機溶劑或反應性稀釋劑。可用於此情況中的有機溶劑之非限制性例子爲酮類溶劑如環己酮，丙酮，丁酮和甲基異丁基酮；賽珞蘇類溶劑例甲基賽珞蘇，乙基賽珞蘇，甲基賽珞蘇乙酸酯及乙基賽珞蘇乙酸酯；及酯類溶劑如乙酸乙酯，乙酸丁酯，乙酸異戊酯及乳酸乙酯。這些溶劑可以單獨使用或以其兩種或更多種的組合使用。有關反應性稀釋劑，可以使用環氧單體或具有可交聯性不飽和碳-碳鍵的低分子化合物。環氧單體的特殊例子爲環氧丙醇，1 ，2，7，8 -二環氧基辛烷，1 ，4_ 丁二醇環氧丙基醚，環氧環己烷，2 ’ 3 —環氧基原冰片烯，4 -乙烯基環己酮一氧化物’氧化華烯’環氧環十二烷，4 一乙烯基環己烷二氧化物，1 ，2 ’ 5 ，6 —二環氧基環辛烷，環氧環辛烷，氧化薇烯’ 1 ，2 -環氧基- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -8— -1 j«^^^1 - -» I - -- V - - I n *^n .¾. ，ve ,/1»· (請先閱讀背面之注意事項再填寫本頁) -28- A7 B7 五、發明説明（26 ) 5，9 —環十二碳二嫌，1 ，2 -環氧基乙基苯’氧化;g ，環氧丙基苯基醚，對-第三丁基苯基環氧丙基醚，2 , 3 -環氧基丙基，對-甲氧基苯基醚’及鄰-聯苯基環氧丙基醚。具有可交聯不飽和碳-碳鍵的低分子化合物之特殊例子爲二乙二醇二烯丙基醚，N，N — —亞甲基雙丙烯醯胺，氯菌酸二烯丙基酯，六氫酞酸二烯丙基酯，1 ，2，4 _苯三酸三烯丙基酯，4 一烯丙基一 2，6 —二—第三丁基酚，異酞酸二烯丙基酯，酞酸二烯丙基酯，二乙烯基苯，苯乙烯，烯丙基苯，二乙烯基碾，羧酸烯丙基苯酯，4 —乙烯基苯基，三烯基—1，3 — 5 —苯三羧酸酯，丙稀酸2 _乙基己酯，丙烯酸2 —羥基乙酯，丙烯酸2 —羥基丙酯，丙烯酸四氫呋喃甲酯，丙烯酸苯氧基乙酯，丙嫌酸壬苯氧基乙酯，丙烯酸四氫呋喃甲氧基乙酯，1 ，3 -二經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 氧陸圜醇丙烯酸酯的ε —己內酯加合物，丙烯酸1 ，3 _ 二氧戊烷酯’丙烯酸己二醇酯，新戊二醇二丙烯酸酯，二乙二醇二丙烯酸酯，三丙二醇二丙烯酸酯，聚乙二醇二丙烯酸酯’羥基三甲基乙醯新戊二醇二丙烯酸酯，新戊二醇己二酸酯二丙烯酸酯，羥基三甲基乙醯新戊二醇ε —己內酯加合物二丙烯酸酯，2— (2 —羥基_1 ，1—二甲基乙基）—5 —羥基甲基一5 —乙基一1 ，3 —二氧陸圜二丙烯酸酯’三環癸烷二甲醇基二丙烯酸酯，1 ，己二醇二環氧丙基醚二丙烯酸酯，三甲醇基丙烷三丙烯酸酯，丙醯二季戊四醇三丙烯酸酯，丙醯二季戊四醇四丙烯酸醋本紙張尺度適用中國國家梯準（CNS ) Α4規格（210X297公釐） -29- 經濟部中央梂準局貝工消費合作杜印袋 A7 B7 五、發明説明（27 ) ，二-三甲醇基丙烷四丙烯酸酯，丙醯二季戊四醇五丙烯酸酯，二季戊四醇六丙烯酸酯，及二季戊四醇六丙烯酸酯 ε —己內酯加合物。若要用上述具有可交聯不飽和碳一碳鍵的化合物作爲反應性稀釋劑時，可以使用過氧化物或偶氮化合物作爲硬化觸媒。過氧化物的例子爲二烯丙基過氧化物，過氧化酯，二醯基過氧化物，氫過氧化物，酮過氧化物及過氧縮酮。彼等的特殊例子爲過氧化苯甲醯基，過氧化對氯苯甲醯碁，過氧化2 ，4_二氯苯甲醯基，過氧化辛醯基，過氧化月桂醯基，過氧化乙醯基，過氧化丁酮，過氧化環己酮，雙 -（1 -羥基環己基過氧化物），過氧化羥庚基，過氧化第三丁基，氫過氧化對_ 烷，氫過氧化異丙苯，2，5 一二甲基己基_2，5 —二氫過氧化物，過氧化二_第三丁基，過氧化二異丙苯基，2 ，5_二甲基_2 ，5_二 (第三丁基乙氧基）己烷，2 ，5 —二甲基己基_2 ，5 一二一（過氧苯甲酸酯），過苯甲酸第三丁酯，過乙酸第三丁酯，過辛酸第三丁酯，過氧異丁酸第三丁酯，和過酞酸二一第三丁酯。有關偶氮化合物，可以使用偶氮二異丁腈，2 ，2 > 一偶氮二丙院，m，m 氧偶氮苯乙稀或腙。本發明樹脂組成物可依下述製得。亦即，利用例如 Henschel混合機將所有成分充分地交混後，用熱輥或雙軸擠壓機進行熔融混合處理，隨後將所得熔融物冷卻到室溫本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） (請先閱讀背面之注意事項再填寫本頁) •丨裝- 、?τ -30- 經濟部中央標準局員工消费合作社印製 A7 ____B7___ 五、發明説明（28 ) 並用鎚磨機予以粉碎。若要用到的樹脂組成物爲液體時，可以省略粉碎處理。有關用本發明樹脂組成物密封半導體元件之方法，可以採用一般所用的低壓轉送模製法。不過，密封方法不限於轉送模製法，任可其他密封方法例如壓縮模.製，注射模製，澆鑄模製或鑄封法（p〇mng )，都可以用來密封半導體元件。本文所用"密封（鑲鑄）〃一詞意欲包括所謂的一側密封，其中將一樹脂層插置於一半導體元件與一基材之間。密封後的熱硬化較佳者必須在不低於1 5 0 °c的溫度下進行。有關要用本發明樹脂組成物的硬化物所密封的半導體元件所具類別和尺寸沒有限制。本發明樹脂組成物不限可用來密封半導體裝置，而且也可以用來製造希望有優良耐熱性的模製物。本案發明人發現經由使用側鏈上有酚羥基的聚矽氧烷樹脂作爲環氧化合物的硬化劑時即可得到密於密封且能夠克服所有傳統問題之樹脂組成物，因而完成本發明。亦即，根據本發明，由環氧樹脂及包含側鏈上有酚羥基的聚矽氧烷樹脂之硬化劑所構成的樹脂組成物能夠舒解可能施加在其硬化物上的應力而不會增加該硬化物·的吸水作用。所以，若利用本發明樹脂組成物製造經樹脂鑲鑄半導體裝置時，絕不會損及該裝置的防濕可靠性。此外，根據本發明所得經樹脂鑲鑄半導體裝置具有優良的黏著性及耐熱震性。再者，經由恰當地選擇側鏈上有酚羥基的聚矽氧烷樹脂所具構造和分子量不僅可得到固體聚矽氧烷而且可得任何本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -I -1 »mH- ....... - - —- I -I -I I - - I in ii 1^1 ^^^1 (請先閲讀背面之注意事項再填寫本頁) -31 - 經濟部中央樣準局貞工消費合作社印製 A7 ___B7 _______ 五、發明説明（29 ) 種合意的液體聚矽氧烷，由是可以適當地控制樹脂組成物的黏度和熔融黏度。因此，可以得到具有優良可靠性且適用於表面安裝，亦即製造例裝晶片（flip chip )’ C S P (晶片尺寸封裝件）或B G A (球栅行列）之液體樹脂組成物。此外，由於本發明樹脂組成物中所含聚矽氧烷樹脂內的酚可以與環氧化合物反應，所以金屬模子的表面不會發生如樹脂組成物中添加矽酮油的情形所看到的因矽酮油慢慢滲流所致污染現象。因此，根據本發明可以提出一種具有優良性質，適於密封半導體元件之樹脂組成物。本發明要參照下列實施例予以進一步解說。樹脂組成物係依下述製得。首先，用表面處理劑在Henschel.混合機內處理無機塡料。然後，根據下面表1所示配方，將環氧化合物，聚矽氧烷樹脂，硬化觸媒和硬化劑混合在一起。接著，將混合物熱熔融藉以將彼等均勻混合，之後予以冷卻和粉碎。然後，使用加熱到6 0至1 6 0 °C的熱輥將所有成分一起混合和捏合，隨後將所得捏合物冷卻和粉碎而得實施例i至 3和比較例1所表各種樹脂組成物。 '本紙張又度適用中國國家標準（CNS ) A4規格（210X297公釐） m» mu HH ^^^1 I ^^^1 m 1--1 nn ^ r Ί ./_1·' (請先閱讀背面之注意事項再填寫本頁) -32- A7 B7 五、發明説明（30 ) 表1 實施例比較例 1 2 3 1 (a)成分 A1 17.0 A2 6.7 A3 6.0 A2 7.7 (b)成分聚矽氧烷樹脂 B1 9.6 B2 2.5 B3 3.7 其他硬化劑 D1 2.4 D1 1.9 D1 3.9 (C)成分無機塡料 70 85 85 85 硬化觸媒 0.2 0.2 0.2 0.2 模具潤滑劑 0.5 0.5 0.5 0.5 顏料 0.4 0.4 0.4 0,4 表面處理劑 0.3 0.3 0.3 0.3 滞燃劑 2.0 2.0 2.0 2.0 反應性稀釋劑 - - (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局貝工消費合作社印製表1中所示各構成（a )成分的環氧化合物表下列化合物 A 1 :鄰-甲酚系線型酚醛樹脂類環氧樹脂（環氧當量：1 9 7 ) A2:雙酚A型環氧樹脂（環氧當量：190) A3 :聯苯型環氧樹脂（環氧當量：1 9 1 ) 要分別摻加到構成（b )成分的硬化劑內之聚矽氧烷樹脂B1，B2和B3表下列具有前述化學式（1)，（ a )和（1 8 )所表重複單位之樹脂。各聚矽氧烷樹脂所本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） A7 B7 五、發明説明（Μ ) 具重量平均分子量，軟化點和酚當量摘列於下面表2之中表2 重複單位重量平均分子量軟化點（°C ) 酚當量 Β1 ⑴ 4000 70 115 Β2 (9) 3500 50 256 Β3 (18) 5000 65 287 —---- /IV (請先閱讀背面之注意事項再填寫本頁) 不是聚矽氧烷樹脂的硬化劑D 1表下列化合物。 D1 :酚系線型酚醛樹脂（酚當量：1〇4) 其他用到的成分如下所列。、τ 反應性稀釋劑：1，2 -環氧基—3 -苯氧基丙烷硬化觸媒：三苯基膦離型劑：巴西棕櫚蠟顏料：碳黑滯燃劑：三氧化銻經濟部中央橾準局員工消費合作杜印裝無機塡料：C 1熔融矽石粉（球狀；平均粒徑：2 0 微米；最大粒徑：7 5微米）表面處理劑：7 -環氧丙氧基丙基三甲氧基矽烷（八· 187, Nippon Unicar Co., Ltd.) 再者’使用下列化合物作爲（a)成分，（b)成分 ’或（c )成分，並於其中加入其他預定的成分，根據下面所述程序處理所得混合物以製成實施例4，5或6，及本紙張尺度適用中國國家橾隼（CNS ) A4規格（210X297公釐） -34- 經濟部中央樣準局貝工消费合作社印製 A7 B7__ ——~~ ....... .....—— 一一五、發明説明（32 ) 比較例2和3的組成物與樣品。 (a )成分： A4 ··雙酣F型環氧樹脂（環氧當量.1 7 〇 ) (3 - ，4 ' 一環氧基環己基甲基）—3 ’ 4 一環氧基二環己烷羧酸酯（環氧當量_ 1 2 6 ) (b )成分： B 4 :具有前述化學式（2 7 )所表重複單位的砂氧烷與二甲基矽氧烷的共聚物（共聚合比例=1 ·· 5) ’·重量平均分子量：8 0 0 B 5 :具有前示化學式（1 1 )所表重複單位的砂氧烷與二甲基矽氧烷的共聚物（共聚合比例=1 : 8):重量平均分子量：1，20〇 B 6 :具有前示比學式（2 7 )所表重複單位的矽氧烷與二甲基矽氧烷之共聚物（共聚合比例=1 ·· 2);重量平均分子量：5 5 0 這些成分B4，B5和B6在室溫下皆爲液體。其他硬化劑： D2 :甲基六氫酞酸酐 D3 : 3 ，3二烯丙基~4，4、一二羥基二苯基甲烷 · (c )成分·· C2:氧化矽（平均粒徑=2.7微米；最大粒徑= 3 0微米） C3:氧化矽（平均粒徑=5·1微米；最大粒徑= 本紙張尺度逋用中國國家標率（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝· 訂 -35- 經濟部中央橾準局員工消費合作社印製 A7 B7 五、發明説明（33 ) 3 0微米） C 4 :氧化矽（平均粒徑=4 · 1微米：最大粒ί莖 3 0微米） C 5 :氧化矽（平均粒徑=5 2微米；最大粒徑二 1 0 0微米）硬化觸媒：Novacure ΗΧ3088 (Asahi Chemical Industry Co., Ltd.) 反應性稀釋劑：苯基環氧丙基醚顏料：碳黑染料：黑色染料 (實施例4 ) (a )成分：A 4 (b )成分：B 4 其他硬化劑：D 2 (c )成分：C 2 硬化觸媒：顏料：首先，（a )成分混合在一起後，利用旋轉型捏合裝置（Shinky Co.，Ltd.; HX201 )捏合得到一混合物。然後，於該混合物中加入硬化觸媒，並用上述捏合裝置再捏合所得混合物而得一樹脂組成物。如此所得樹脂組成物在室溫下爲液體，該樹脂組 2 0 · 4重量份數 1 0 · 7重量份數 1 6 · 0重量份數 5 Q · 0重量份數 2 ] 5重量份數 0 · 4重量份數 (b )成分成分和鏔料 {請先閲讀背面之注意事項再填寫本頁』本紙張尺度適用中國國家梯準（CNS ) A4規格（210X297公釐） -36-Examples of DBU phenates include SA-8 5 3 (Sanapro). Potential catalysts can also be used as hardening catalysts, such as No vacure HX-3722, HX-372 1, HX-3748, HX-374 1, HX-3742, and HX-3088 (Asahi Chemical Industry Co., Ltd. or MY-25 (Ajinomoto Co.). The mixing ratio of the aforementioned hardening catalyst in the resin composition of the present invention must be in the range of 0.1 to 10 parts by weight per 100 parts by weight. Printed by a consumer cooperative (please read the precautions on the back before filling out this page) (a) The total amount of epoxy compound of component and hardener that constitutes (b) component. If the content of hardening catalyst is less than 0 · 1 weight In the case of parts, the hardening of the resin composition may become insufficient, so that the obtained hardened product may have poor heat resistance of the molded resin product. On the contrary, if the content of the hardening catalyst exceeds 10 parts by weight, May impair the heat resistance, moisture resistance, and electrical properties of the resulting hardened product. A better mixing ratio of the hardening catalyst is 0.5 to 5 parts by weight per 100 parts by weight of (a) and (b) Total amount of ingredients. The resin composition of the present invention may include an adhesion promoter to improve the resin. Adhesion of finished products to the substrate after hardening. Examples of their adhesion promoters are the paper standard Common Chinese National Standard (CNS) A4 (210X297 mm) -24- A7 _____B7_ V. Description of the Invention (22) @ Solid resins such as amine resins, polyurethane resins and unsaturated polyesters: isocyanate compounds; rubbers; silane compounds and metal clamping compounds. Among these compounds, metal clamping compounds can not only effectively improve the properties of gastric semiconductor elements. Adhesiveness, and can improve the water resistance of the hardened resin. Examples of their metal clamping compounds are Zr clamp, Ti clamp and A 丨 clamp. A special example of Zr clamp is Zhanyi Fluorenylacetonyl fluorene, monobutoxy fluorenyl acetonyl zirconium zirconium, dibutoxy diethyl sulfonium acetic acid, ethyl ethyl sulfonium acetic acid hydrazone, butoxy paraethyl ethyl fluorinated zirconium acetate, tributoxy Monoethylacetoacetate chromium acetate, zirconium ethyl lactate, dibutoxydiethyl zirconate lactate, diethylacetonyl diethylacetonate acetonyl chromium, monoethylacetonyl acetonyl ethylacetonyl acetone Pin, acetoacetone diethyl ethyl Acetylenone, and diethylacetone, diethyllactate hydrazone. For T i clamps and A 丨 clamps, ligands such as monodione, hydroxycarboxylic acid, ketoester, and ketone can be used. Compounds of alcohols and glycols. Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling this page). When a thermosetting resin or rubber is used as the adhesion promoter in the composition of the present invention, Or it is preferable that the mixing ratio of the rubber is 0.2 to 20% by weight of the resin composition. When the mixing ratio is less than 0.2% by weight, a sufficient adhesion promoter effect cannot be obtained. On the contrary, if the mixing ratio exceeds 20% by weight, the water absorption of the cured product becomes too high or the heat resistance of the molded product is deteriorated. When a metal clamp compound is used as an adhesion promoter in the resin composition of the present invention, the better mixing ratio of the metal clamp compound must be 0 · 0 1 to 5 weight of the resin composition. The paper standards are applicable to Chinese national standards. (CNS) A4 specification (210 × 297 mm) -25- Printed by A7 B7, Shellfish Consumer Cooperative, Central Bureau of Standards, Ministry of Economic Affairs 5. Description of invention (23)%. If the mixing ratio is less than 0.01% by weight, sufficient metal clamp compound effect cannot be obtained. Conversely, if the mixing ratio exceeds 5% by weight, the cross-linked wiring of the semiconductor element may be corroded by ionic impurities, or the resin composition may be impaired in the electrical insulation properties of the molded product when the resin composition is applied to the semiconductor device with resin molding. In addition, other additives such as a flame retarder such as antimony trioxide, a phosphorus compound, and a halogen-containing compound may be added to the resin composition of the present invention; a release agent such as a natural wax, a synthetic wax, a linear fatty acid or a metal salt thereof, acid amide, Esters and paraffins; pigments such as carbon black and titanium dioxide; and surface treatment agents such as silane coupling agents. Furthermore, the resin composition of the present invention may be blended with a stress-releasing agent (str e s s-r e 1 i e v i n g a g e n t) such as sand ketone rubber, ketone oil, various plastic powders, engineering plastic powders, A B S resin powder and MB resin phenol. The epoxy resin constituting the component (a) and the silicone resin constituting the component (b) are likely to be stained by impurities such as alkali metal ions or halogen ions in the resin composition of the present invention. In addition, it is expected that unreacted halogenated alkyl, halogenated aryl or chlorosilane may remain in the resin composition, or a halide compound may be generated in a side reaction. It is known that when a resin composition containing these impurities is used to seal a semiconductor device, the interconnection wiring is interrupted due to erosion of aluminum wiring or impaired moisture resistance. Therefore, there is a need to strongly remove these impurities from the resin composition. These impurities can be effectively removed by a method in which the resin composition containing these impurities is dissolved in a water-soluble polar solvent such as small methylpyrrolidone, N, N-dimethylacetamidamine'tetrahydrofuran (tHF ), In acetone or ethanol, the resin solution is formed ', and then it is dropped into the paper. The standard Chinese National Standard (CNS) A4 size (210X297 mm) -26- nn ^^^ 1 nn m > ^ — ^ 1 ^^^ 1 4 ml ^^^ 1 ^^^ 1 ^^ 4 • -s (Please read the notes on the back before filling out this page) Printed by A7, Shellfish Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs --- ----- B7 _ 5. Description of the invention (24) A large amount of water or a dilute aqueous solution of an organic acid such as oxalic acid is collected by filtration and collected. These impurities can also be removed by a method in which the resin composition containing these impurities is dissolved in an organic solvent that is immiscible with water, such as diethyl ether, ethyl acetate, or a chlorine-based organic solvent, and then the resin solution Water or a dilute aqueous solution of an organic acid is added to the solution, and the resulting mixed solution is left to stand after shaking. Thus, the mixed solution is separated into an organic solvent phase and an aqueous phase, and the organic solvent phase is collected. These impurities are thus removed. These methods can be repeated until the concentration of the alkali metal or halogen impurities has been reduced to a predetermined acceptable concentration. That is, the concentration of the alkali metal in the form of impurities contained in the synthetic resin is preferably limited to 50 ppm or less, more preferably 20 p pm or less, and most preferably 5 p pm or The lower. On the other hand, the halogen compound contained as an impurity in the resin has a better concentration which must be limited to 500 p pm or lower, more preferably 3 0 0 p pm or lower, and the best 10 0 p pm or lower. When L C or L S I is to be mounted directly on a substrate, the sealing substance must be liquid. According to the present invention, a highly reliable liquid resin composition can be obtained by appropriately combining the component (a) having a low melting point and the component (b) having a low melting point. For example, the component (a) which is liquid or oily at room temperature and the component (b) which is liquid or oily at room temperature are combined to obtain a liquid resin composition. When the liquid resin composition is to be used as a liquid sealing substance, the adhesion of the resin composition must be 5 Pa.s or lower at 100 ° C. If the adhesion of the resin composition exceeds 5 P a · S, the operation of filling the resin composition into the space between the substrate and the semiconductor element will become difficult. Therefore, it is necessary to use this paper to apply to the Chinese country. Standard (CNS) A4 specification (21 ×: 297 mm) -f--I- —-I— i-.i — ^ ― 1— 4 I— I--I--111— (Please Please read the note on the back of the page before filling in this page) -27-Printed by the Central Samples Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperatives A 7 B7 _ V. Description of the invention (25) It takes a long time to fill the resin composition. In addition, if the adhesion of the resin composition exceeds 5 Pa · S, an unfilled portion may be generated in the resin-molded semiconductor device, which not only causes defective insulation of the device but also causes the semiconductor element to be easily separated. Substrate. Incidentally, the preferable adhesion of the resin composition at room temperature is 2 OP a · S or lower, and more preferably 10 Pa · S or lower. Although there is no particular limitation on the lower limit of the adhesion of the resin composition (D, it is preferred that the adhesion of the resin composition at a temperature of 1 ο ° C must be ImPa. S or higher, because if the resin composition has When the viscosity is excessively low, haze may occur on the hardened product. If there is a need to adjust the viscosity of the resin composition of the present invention, an organic solvent or a reactive diluent may be used. The organic solvents that can be used in this case Non-limiting examples are ketone solvents such as cyclohexanone, acetone, methyl ethyl ketone, and methyl isobutyl ketone; examples of cyperidine solvents are cyperidine, ethyl cyperidine, methyl cyperacetate Esters and ethyl cyperidine acetate; and ester solvents such as ethyl acetate, butyl acetate, isoamyl acetate, and ethyl lactate. These solvents can be used alone or in a combination of two or more kinds thereof. For the reactive diluent, an epoxy monomer or a low-molecular compound having a crosslinkable unsaturated carbon-carbon bond can be used. A specific example of the epoxy monomer is glycerol, 1, 2, 7, 8 -Diepoxyoctane, 1,4-butanediol ring Oxypropyl ether, epoxycyclohexane, 2 '3-epoxyorbornene, 4-vinylcyclohexanone monooxide' Warrenene 'epoxy cyclododecane, 4-vinylcyclohexane Dioxane, 1,2'5,6-diepoxycyclooctane, epoxycyclooctane, violene oxide'1,2-epoxy- This paper size applies to Chinese National Standard (CNS) A4 Specifications (210X297 mm) -8— -1 j «^^^ 1--» I--V--I n * ^ n .¾., Ve, / 1 »· (Please read the precautions on the back first (Fill in this page again) -28- A7 B7 V. Description of the invention (26) 5,9 —cyclododecane dioxin, 1,2-epoxyethylbenzene 'oxidation; g, epoxypropylphenyl ether , P-Third-butylphenylepoxypropyl ether, 2,3-epoxypropyl, p-methoxyphenylether 'and o-biphenylepoxypropyl ether. It can be crosslinked. Specific examples of low-carbon compounds with unsaturated carbon-carbon bonds are diethylene glycol diallyl ether, N, N-methylenebispropenamide, diallyl chloric acid, hexahydrophthalic acid Diallyl ester, 1,2,4_triallyl trimellitate, 4 monoallyl-2,6-di —Third butylphenol, diallyl isophthalate, diallyl phthalate, divinylbenzene, styrene, allylbenzene, divinyl glutamate, allylphenyl carboxylate, 4-vinylphenyl, trienyl-1,3--5-triphenyltricarboxylic acid, 2-ethylhexyl acrylic acid, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, tetrahydrofuran methacrylate Esters, phenoxyethyl acrylate, nonphenoxyethyl propionate, tetrahydrofuran methoxyethyl acrylate, 1,3-di-Both printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the notes on the back first (Fill in this page again) ε-caprolactone adduct of oxyhexanol acrylate, 1, 3 _ dioxolane acrylate 'hexyl glycol acrylate, neopentyl glycol diacrylate, diethylene glycol Diacrylate, Tripropylene Glycol Diacrylate, Polyethylene Glycol Diacrylate 'Hydroxytrimethylacetin neopentyl glycol diacrylate, neopentyl glycol adipate diacrylate, hydroxytrimethylacetin Neopentyl glycol ε-caprolactone adduct diacrylate, 2- (2-hydroxy_1, 1-dimethyl (Ethyl) —5 —hydroxymethyl — 5 —ethyl — 1,3-dioxolan diacrylate, tricyclodecane dimethanol diacrylate, 1, hexanediol diglycidyl ether di Acrylate, trimethylolpropane triacrylate, propylene dipentaerythritol triacrylate, propylene dipentaerythritol tetraacrylate vinegar. Paper size is applicable to China National Standard (CNS) A4 (210X297 mm) -29- Central Ministry of Economic Affairs梂 Junkai Stationery Cooperative Consumer Printing Duo Bag A7 B7 V. Description of the Invention (27), di-trimethylolpropane tetraacrylate, propylene dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and dipentaerythritol hexaacrylate ε —caprolactone adduct. When the above-mentioned compound having a crosslinkable unsaturated carbon-carbon bond is used as a reactive diluent, a peroxide or an azo compound can be used as a hardening catalyst. Examples of peroxides are diallyl peroxide, peroxide ester, difluorenyl peroxide, hydroperoxide, ketone peroxide and peroxyketal. Specific examples of them are benzamyl peroxide, p-chlorobenzyl peroxide, 2,4-dichlorobenzyl peroxide, octyl peroxide, lauryl peroxide, and ethenyl peroxide. , Methyl ethyl ketone peroxide, cyclohexanone peroxide, bis- (1-hydroxycyclohexyl peroxide), hydroxyheptyl peroxide, third butyl peroxide, p-alkane hydroperoxide, isopropyl hydroperoxide Benzene, 2,5 dimethylhexyl_2,5-dihydroperoxide, di-third butyl peroxide, dicumyl peroxide, 2,5_dimethyl_2,5_ Bis (third butylethoxy) hexane, 2,5-dimethylhexyl_2,5 one-two (peroxybenzoate), third butyl perbenzoate, third butyl peracetate Esters, tert-butyl peroctoate, tert-butyl peroxyisobutyrate, and tert-butyl perphthalate. As for the azo compound, azobisisobutyronitrile, 2, 2 > azobispropanone, m, m oxazobenzene or arsine can be used. The resin composition of the present invention can be prepared as follows. That is, all components are thoroughly blended by using, for example, a Henschel mixer, and then melt-mixed with a hot roll or a twin-screw extruder, followed by cooling the resulting melt to room temperature. The paper is compliant with Chinese National Standards (CNS). Α4 specification (210 × 297 mm) (Please read the precautions on the back before filling in this page) • 丨-、? Τ -30- Printed by the Consumers' Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs A7 __B7___ 5. Description of the invention (28) Combined use It is crushed by a hammer mill. When the resin composition to be used is a liquid, the pulverization treatment can be omitted. As a method for sealing a semiconductor element with the resin composition of the present invention, a low-pressure transfer molding method generally used can be adopted. However, the sealing method is not limited to the transfer molding method, and other sealing methods such as compression molding, injection molding, casting molding, or potting (pomng) can be used to seal semiconductor components. The term " seal (cast) " as used herein is intended to include so-called one-side seals in which a resin layer is interposed between a semiconductor element and a substrate. The heat curing after sealing must be performed at a temperature of not less than 150 ° C. There are no restrictions on the type and size of the semiconductor element to be sealed with the cured product of the resin composition of the present invention. The resin composition of the present invention can be used not only for sealing semiconductor devices, but also for manufacturing a molded article desired to have excellent heat resistance. The inventors of the present invention found that by using a polysiloxane resin having a phenolic hydroxyl group on the side chain as a hardener for an epoxy compound, a resin composition that can be tightly sealed and can overcome all conventional problems can be obtained, and the present invention has been completed. That is, according to the present invention, a resin composition composed of an epoxy resin and a hardener containing a polysiloxane resin having a phenolic hydroxyl group on a side chain can relax stresses that may be applied to the hardened material without increasing it This hardened | cured material absorbs water. Therefore, when the resin-molded semiconductor device is manufactured using the resin composition of the present invention, the moisture-proof reliability of the device is never impaired. In addition, the resin-molded semiconductor device obtained according to the present invention has excellent adhesion and thermal shock resistance. Furthermore, by properly selecting the structure and molecular weight of the polysiloxane resin with phenolic hydroxyl groups on the side chain, not only solid polysiloxane can be obtained but also any paper size applicable to Chinese National Standard (CNS) A4 specifications (210X297). Mm) -I -1 »mH- .......---I -I -II--I in ii 1 ^ 1 ^^^ 1 (Please read the notes on the back before filling this page ) -31-Printed by A7 ___B7 _______ of Zhengong Consumer Cooperative of the Central Bureau of Procurement of the Ministry of Economic Affairs 5. Description of the Invention (29) A desirable liquid polysiloxane, which can appropriately control the viscosity and melt viscosity of the resin composition. Therefore, it is possible to obtain a liquid resin composition which has excellent reliability and is suitable for surface mounting, that is, manufacturing a flip chip 'C S P (chip size package) or B G A (ball grid array). In addition, since the phenol in the polysiloxane resin contained in the resin composition of the present invention can react with the epoxy compound, the surface of the metal mold does not cause the same factors as seen in the case of adding silicone oil to the resin composition. Pollution caused by slow seepage of silicone oil. Therefore, according to the present invention, a resin composition having excellent properties and suitable for sealing a semiconductor element can be proposed. The invention will be further explained with reference to the following examples. The resin composition was obtained as follows. First, the inorganic concrete was treated with a surface treatment agent in a Henschel. Mixer. Then, an epoxy compound, a silicone resin, a hardening catalyst, and a hardener were mixed together according to the formulation shown in Table 1 below. Next, the mixture is thermally fused to uniformly mix them, and then cooled and pulverized. Then, all the components were mixed and kneaded together using a hot roller heated to 60 to 160 ° C, and then the obtained kneaded product was cooled and pulverized to obtain various resin compositions shown in Examples i to 3 and Comparative Example 1. 'This paper is again compatible with Chinese National Standard (CNS) A4 (210X297 mm) m »mu HH ^^^ 1 I ^^^ 1 m 1--1 nn ^ r Ί ./_1·' (Please read first Note on the back page, please fill in this page again) -32- A7 B7 V. Description of the invention (30) Table 1 Examples Comparative Examples 1 2 3 1 (a) Component A1 17.0 A2 6.7 A3 6.0 A2 7.7 (b) Component Polysiloxane Alkane resin B1 9.6 B2 2.5 B3 3.7 Other hardeners D1 2.4 D1 1.9 D1 3.9 (C) Component inorganic filler 70 85 85 85 Hardening catalyst 0.2 0.2 0.2 0.2 Mold lubricant 0.5 0.5 0.5 0.5 Pigment 0.4 0.4 0.4 0,4 Surface Treating agent 0.3 0.3 0.3 0.3 Flame retarding agent 2.0 2.0 2.0 2.0 Reactive diluent-(Please read the precautions on the back before filling out this page) Printed in Table 1 (A) Table of epoxy compounds of the following compounds A 1: o-cresol novolac resin epoxy resin (epoxy equivalent: 197) A2: bisphenol A epoxy resin (epoxy equivalent: 190 ) A3: Biphenyl type epoxy resin (epoxy equivalent: 1 9 1) To be separately added to the hardener of component (b) Silicon siloxane resin B1, B2 and B3 has the following tables (18) the resin of formula (1), (a) repeating units of the table. The paper size of each polysiloxane resin is in accordance with Chinese National Standard (CNS) A4 (210X297 mm) A7 B7 5. Description of the invention (M) The weight average molecular weight, softening point and phenol equivalent are summarized in Table 2 below. Table 2 Repeating unit weight average molecular weight softening point (° C) Phenol equivalent B1 ⑴ 4000 70 115 Β2 (9) 3500 50 256 Β3 (18) 5000 65 287 —---- / IV (Please read the note on the back first Please fill in this page again) Hardener D1 which is not a polysiloxane resin. D1: Phenolic novolac resin (phenol equivalent: 104) Other ingredients used are listed below. , Τ Reactive diluent: 1,2 -epoxy-3 -phenoxypropane hardening catalyst: triphenylphosphine release agent: carnauba wax pigment: carbon black flame retarder: antimony trioxide central Consumption cooperation with the staff of the Junquan Bureau Du printed inorganic materials: C 1 fused silica powder (spherical; average particle size: 20 microns; maximum particle size: 75 microns) Surface treatment agent: 7-glycidoxypropyl Trimethoxysilane (A.187, Nippon Unicar Co., Ltd.) Furthermore, 'the following compounds are used as the (a) component, (b) component' or (c) component, and other predetermined components are added thereto, The resulting mixture was processed according to the procedure described below to make Example 4, 5 or 6, and this paper size applies to the Chinese National Cricket (CNS) A4 specification (210X297 mm) -34- Shellfish Consumption of the Central Sample Bureau of the Ministry of Economic Affairs Cooperatives printed A7 B7__ —— ~~ ...................—————————— 115. Description of the invention (32) Compositions and samples of Comparative Examples 2 and 3. (a) Ingredients: A4 ·· Double fluorene F-type epoxy resin (epoxy equivalent. 1 7 〇) (3-, 4 'mono-epoxycyclohexylmethyl)-3' 4 mono-epoxy dicyclohexyl Alkyl carboxylate (epoxy equivalent _ 1 2 6) (b) component: B 4: copolymer of oxaxane and dimethylsiloxane (copolymerization ratio) having repeating units represented by the aforementioned chemical formula (2 7) = 1 ·· 5) '· Weight average molecular weight: 8 0 0 B 5: Copolymer of oxaxane and dimethylsiloxane having a repeating unit represented by the aforementioned chemical formula (1 1) (copolymerization ratio = 1) : 8): Weight-average molecular weight: 1,20〇B 6: Copolymer of siloxane and dimethyl siloxane having a repeating unit represented by the formula (2 7) shown above (copolymerization ratio = 1 · · 2); Weight average molecular weight: 5 50 These components B4, B5 and B6 are all liquid at room temperature. Other hardeners: D2: methylhexahydrophthalic anhydride D3: 3,3 diallyl ~ 4,4, monodihydroxydiphenylmethane · (c) component · · C2: silicon oxide (average particle size = 2.7 Micron; maximum particle size = 30 micron) C3: silicon oxide (average particle size = 5.1 micron; maximum particle size = Chinese paper standard (CNS) A4 size (210X297 mm) for paper size) (please first Read the precautions on the back and fill in this page) Binding-booking-35- Printed by A7 B7, Employees' Cooperatives of the Central Bureau of Standards, Ministry of Economic Affairs 5. Description of the invention (33) 30 microns) C 4: Silica (average particle size = 4 · 1 micron: the largest grain is 30 micrometers in stem; C 5: silicon oxide (average particle size = 52 micrometers; maximum particle size is 220 micrometers) Hardening catalyst: Vacuum Η × 3088 (Asahi Chemical Industry Co., Ltd .) Reactive diluent: Phenyl glycidyl ether Pigment: Carbon black Dye: Black dye (Example 4) (a) Component: A 4 (b) Component: B 4 Other hardener: D 2 (c) Ingredient: C 2 curing catalyst: Pigment: First, after (a) ingredients are mixed together, knead by a rotary kneading device (Shinky Co., Ltd .; HX201) To a mixture. Then, a hardening catalyst was added to the mixture, and the resulting mixture was kneaded again using the above-mentioned kneading device to obtain a resin composition. The resin composition thus obtained was liquid at room temperature, and the resin group was 2 0 · 4 parts by weight 1 0 · 7 parts by weight 1 6 · 0 parts by weight 5 Q · 0 parts by weight 2] 5 parts by weight 0 · 4 parts by weight (b) Ingredients and ingredients {Please read the precautions on the back before filling this page "This paper size applies to China National Standards (CNS) A4 (210X297 mm) -36-

A7 7 B 34 /V 明説明發、五爲度黏的下溫室在物成A7 7 B 34 / V

ο TX 在而 S 3 P 爲下度溫 3 4 5 3 2 A B D C 分分劑分： }成成化成媒 5 } } 硬} 觸 · 例 a b 他 C 化料施 { {其彳硬染實一—I CD 2 1 5 ^«05 dn? dn? 份份份份數數量量量量份.份重重重重量量 8 8 5 ο 重重首先，（a)成分，（t>)成分，（c)成分和染料合在一起後，利用三輥軋機捏合得到—混合物。然後’ 該混合物中加入硬化觸媒，並用上述軋機再捏合所得混物而得一樹脂組成物。如此所得樹脂組成物在室溫下爲體，該樹脂組成物在室溫下的黏度爲7Pa· S而在 00°C溫度下爲〇-8Pa· S。 ---------' 裝-- y£\ (請先閲讀背面之注意事項再填寫本頁) 訂經濟部中央標準局員工消費合作社印製 (實施例6 ) (a )成分：A 5 (b )成分：B 6 其他硬化劑：D 3 (c )成分：C 4 反應性稀釋劑： 1 4 · 6重量份數 8 · 6重量份數 1 2 · 2重量份數 6 0 · 〇重量份數 4 · 0重量份數本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -37- Α7 -----------Β7五、發明説明（35 ) 硬化觸媒： 0 · 2重量份數染料： 0.4重量份數首先，（a)成分，（b)成分，（c)成分反應性稀釋劑和染料混合在—起後，利用三輥軋機捏合得到一混合物。然後’於該混合物中加入硬化觸媒，並用上述軋機再捏合所得混合物而得—樹脂組成物。如此所得樹脂組成物在室溫下爲液體，該樹脂組成物在室溫下的黏度爲 6Pa· S而在l〇〇°c溫度下爲0.6Pa. S。 (比較例2 ) (a )成分： (b )成分：其他硬化劑： (c )成分：硬化觸媒：顏料： A 4 40·8重量份數 Β 4 21·4重量份數 D 2 32·0重量份數 0 · 0重量份數 5 · 0重量份數 0 · 8重量份數 ----------I-- /(. (請先閲讀背面之注意事項再填寫本頁) 訂經濟部中央標準局員工消費合作社印製首先’ （a)成分，（b)成分，和顏料混合在一起後，利用旋轉型捏合裝置（Shinky Co.，Ltd.; HX20 1 )捏合得到一混合物。然後，於該混合物中加入硬化觸媒，並用上述捏合裝置再捏合所得混合物而得一樹脂組成物。如此所得樹脂組成物在室溫下爲液體，該樹脂組成物在室溫下的黏度爲〇 . 3 P a . S而在1 〇〇°c溫度本紙張尺度適用中國國家標準（CNS)Α4規格（210x297公釐） -38-ο TX and S 3 P is the lower temperature 3 4 5 3 2 ABDC Dispensing and dispensing:} 成成化成 5}} Hard} contact · Example ab C chemical material application {{其彳硬染实一 — I CD 2 1 5 ^ «05 dn? Dn? Parts Parts Parts Parts Numbers Amounts Amounts Amounts 8 8 5 ο Weight First, (a) component, (t >) component, (c) component After being combined with the dye, a three-roll mill was used to obtain a mixture. Then, to this mixture, a hardening catalyst is added, and the obtained mixture is kneaded again using the above-mentioned rolling mill to obtain a resin composition. The resin composition thus obtained was bulk at room temperature, and the viscosity of the resin composition at room temperature was 7 Pa · S and at 00 ° C was 0-8 Pa · S. --------- 'Pack-y £ \ (Please read the notes on the back before filling this page) Order printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (Example 6) (a) Ingredients: A 5 (b) component: B 6 other hardener: D 3 (c) component: C 4 reactive diluent: 1 4 · 6 parts by weight 8 · 6 parts by weight 1 2 · 2 parts by weight 6 0 · 〇 Parts by weight 4 · 0 parts by weight The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -37- Α7 ----------- B7 V. Description of the invention (35) Hardening catalyst: 0 · 2 parts by weight Dye: 0.4 parts by weight First, (a) component, (b) component, (c) component reactive diluent and dye are mixed together, and then obtained by kneading with a three-roll mill A mixture. Then, to this mixture, a hardening catalyst is added, and the resulting mixture is kneaded again using the above mill to obtain a resin composition. The resin composition thus obtained was liquid at room temperature, and the viscosity of the resin composition was 6 Pa · S at room temperature and 0.6 Pa · S at 100 ° C. (Comparative Example 2) (a) Component: (b) Component: Other hardener: (c) Component: Hardening catalyst: Pigment: A 4 40 · 8 parts by weight B 4 21 · 4 parts by weight D 2 32 · 0 parts by weight 0 · 0 parts by weight 5 · 0 parts by weight 0 · 8 parts by weight ---------- I-- / (. (Please read the precautions on the back before filling in this page ) Ordered by the Consumer Standards Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. First, (a) ingredients, (b) ingredients, and pigments are mixed together and kneaded using a rotary kneading device (Shinky Co., Ltd .; HX20 1) to obtain a Then, a hardening catalyst is added to the mixture, and the obtained mixture is kneaded again using the above kneading device to obtain a resin composition. The resin composition thus obtained is liquid at room temperature, and the viscosity of the resin composition at room temperature For 0.3 P a. S and at a temperature of 100 ° C, this paper size applies the Chinese National Standard (CNS) A4 specification (210x297 mm) -38-

B7五、發明説明（36 ) 下爲O.OlPa· S 分分劑分： }成成化成媒 3 } } 硬 } 觸：例 a b 他 C 化料較{彳其{硬染比B7 V. Description of the invention (36): O.OlPa · S is divided into:} 成成化成 MEDIA 3}} Hard} Touch: Example a b Other chemical materials are better than {彳其 {hard dyeing ratio

A DCA DC

數數數份數份份數數量份量量份份重量重重量量 5 重 6 ο 重重首先，（a )成分，硬化劑，（c )成分和染料混合在一起後，利用三輥軋機捏合得到一混合物。然後，於該混合物中加入硬化觸媒，並用上述軋機再捏合所得混合物而得一樹脂組成物。如此所得樹脂組成物在室溫下爲液體，該樹脂組成物在室溫下的黏度爲36Pa· S而在 100°C 溫度下爲 4-4Pa· S。 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 4 4 3 5 A B D C 分分劑分：成成化成媒 sc Ey \)y XI/ \)/ 碌 Ν1/ 觸：例 a b 他 C 化料品{ ^ 其 { 硬顏樣Counting parts Serving parts Serving parts Serving parts Serving parts Weight by weight Weight 5 Weight 6 ο Weight First, (a) component, hardener, (c) component and dye are mixed together, and then kneaded with a three-roll mill to obtain a mixture. Then, a hardening catalyst was added to the mixture, and the obtained mixture was kneaded again using the above-mentioned rolling mill to obtain a resin composition. The resin composition thus obtained was liquid at room temperature, and the viscosity of the resin composition was 36 Pa · S at room temperature and 4-4 Pa · S at 100 ° C. (Please read the precautions on the back before filling this page) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 4 4 3 5 ABDC Dispensing and Distributing: Cheng Cheng Chemical Media sc Ey \) y XI / \) / ΝΝ1 / Touch: Example ab other C chemical products {^ 其 {Hard face

數數數數份份份份數數量量量量份份重重重重量量 4 7 ο ο 重重本紙張尺度適用中國國家標準（CNS ) A4規格（210X：297公釐） -39- 經濟部中央標隼局員工消費合作社印裝 A7 B7五、發明説明（37 ) 首先，（a)成分’ （b)成分，（c)成分和顏料混合在一起後，利用旋轉型捏合裝置（Shinky Co.，Ltd.·/ HX20 1 )捏合得到一混合物。然後，於該混合物中加入硬化觸媒，並用上述捏合裝置再捏合所得混合物而得一樹脂組成物。如此所得樹脂組成物在室溫下爲液體，該樹脂組成物在室溫下的黏度爲2 . 6 P a . S而在1 0 〇°C溫度下爲 0 · 1 P a · S。依下述評估如此所得樹脂組成物所具特性。首先，對這些實施例1至3和比較例1的樹脂組成物進行下列評估檢驗。 (1 )在1 7 5 °C和三分鐘之條件下經由轉送模製而製備成每一樹脂組成物的試片（8毫米X 8毫米X 4毫米 )’所得模製片都在2 2 0 °C溫度後硬化4小時。對每一試片測量其撓曲模數，撓曲強度，熱膨脹係數，玻璃轉變點和吸水率。此外，也在框材（4 2合金）上模製每一樹脂組成物以製備試片’且也對每一試片測量拉取方向上的黏著強度。這些檢驗所得結果示於下面的表3之中。 (2 )爲硏究這些樹脂組成物的防濕性，乃實施下列 PCT檢驗。亦即’用各樹脂組成物製備成試片（8毫米 X8毫米）’其再依據TQFP封裝法予以密封。接著，將檢驗裝置放在2 2 0 °C溫度下後硬化4小時而製成經樹脂鑲鑄半導體裝置。之後，將每一經樹脂鑲鑄半導體裝置放置在相對濕度爲8 5%且溫度爲8 5°C的氣圍中7 2小 (請先閱讀背面之注意事項再填寫本頁) • J1 n —1 · 裝-Count Count Count Count Count Count Count Count Count Count Quantitative Quantitative Quantitative Quantitative Quantitative Quantitative Quantitative 4 7 ο ο The standard of this paper applies to China National Standard (CNS) A4 (210X: 297 mm) -39- Central Standard of the Ministry of Economy A7 B7 printed by the employees 'cooperatives of the State Council V. Description of the invention (37) First, (a) ingredients' (b) ingredients, (c) ingredients and pigments are mixed together, and then a rotary kneading device (Shinky Co., Ltd. ... / HX20 1) Kneaded to obtain a mixture. Then, a hardening catalyst was added to the mixture, and the resulting mixture was kneaded again using the above-mentioned kneading device to obtain a resin composition. The resin composition thus obtained was liquid at room temperature, and the viscosity of the resin composition at room temperature was 2.6 P a. S and 0 · 1 P a · S at a temperature of 100 ° C. The characteristics of the resin composition thus obtained were evaluated as follows. First, the resin compositions of these Examples 1 to 3 and Comparative Example 1 were subjected to the following evaluation tests. (1) Test pieces (8 mm X 8 mm X 4 mm) of each resin composition were prepared by transfer molding under conditions of 17.5 ° C and three minutes. The obtained molded pieces were all at 2 2 0 After 4 hours at ° C. For each test piece, its flexural modulus, flexural strength, coefficient of thermal expansion, glass transition point, and water absorption were measured. In addition, each resin composition was molded on a frame material (42 alloy) to prepare a test piece ', and the adhesive strength in the pulling direction was also measured for each test piece. The results of these tests are shown in Table 3 below. (2) In order to investigate the moisture resistance of these resin compositions, the following PCT test was performed. In other words, a test piece (8 mm X 8 mm) was prepared from each resin composition, and it was sealed according to the TQFP packaging method. Next, the test device was hardened at 220 ° C for 4 hours to prepare a resin-molded semiconductor device. After that, place each resin-molded semiconductor device in an air enclosure with a relative humidity of 8 5% and a temperature of 8 5 ° C. 7 2 hours (Please read the precautions on the back before filling this page) • J1 n —1 · Loading-

、1T 本紙乐尺度適用中國國家梂準（CNS ) Α4規格（210Χ297公釐） -40- Μ _____Β7__ 五、發明説明（38 ) 時以進行吸濕處理。其後將該經樹脂模塑半導體裝置暴露於經加熱到1 2 5 °C的氟碳化合物蒸氣圍內一分鐘以檢驗封裝件在此階段中產生龜裂之比例。再者，也將此經樹脂鑲鑄半導體裝置放置在經加熱到1 2 7 °C的飽和水蒸氣內一預定時間以檢驗其缺陷百分比（因漏洩所到缺陷和因開口所致缺陷），依此評估其防濕性。 (3)爲了硏究這些樹脂組成物的耐熱震性，乃實施下列T C T檢驗。亦即，用每一樹脂組成物製備供耐熱震所用的大尺寸試片（8毫米X 8毫米）。然後，將檢驗裝置放置在2 2 0 °C溫度下4小時進行後硬化而製成經樹脂鑲鑄半導體裝置。然後對每一經樹脂鑲鑄半導體裝置實施熱震循環’其一循環包括一 6 5 °C/室溫/1 5 〇。(：。將此循環重複5 0至4 0 0次以經由檢核裝置所具性能特性而測定缺陷百分比。這些P C T和T C T檢驗的結果摘列於下面的表4之中。 I --* 1- I II —^1. : V ! I —^1 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消费合作社印装本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） ^ 五、發明説明（39 ) A7 B7 表3 資施例比較例 1 2 3 1 撓曲模數 (Gpa) 16 18 19 · 22 撓曲強度 (Mpa) 154 160 157 128 熱膨脹係數 (l/deg)x 1 Ο5 1.5 1.2 1.2 1.2 玻璃轉變點 (°C ) 132 124 102 122 吸水率 (重量％ ) 0.24 0.23 0.21 0.23 黏著強度 (Mpa) 17 15 16 11 tjl I 1 i != 1 I I i 1- ---« V m I i I— . .. ---- Τ» (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -42 - A 7 B7 五、發明説明（4〇 ) 表4 實施例比較例 1 2 3 1 P C T 檢驗吸濕檢驗後產生龜裂的比例 0/20 0/20 0/20 0/20 性能缺陷％ 100小時 0/20 0/20 0/20 0/20 200小時 0/20 0/20 0/20 0/20 300小時 0/20 0/20 0/20 1/20 400小時 0/20 0/20 0/20 2/20 5 00小時 0/20 0/20 0/20 5/20 T C T 檢驗 50循環 0/20 0/20 0/20 0/20 100循環 0/20 0/20 0/20 0/20 200循環 0/20 0/20 0/20 1/20 300循環 0/20 0/20 0/20 4/20 400循環 0/20 0/20 0/20 5/20 (請先閱讀背面之注意事項再填寫本頁) 裝. 訂、 1T This paper music scale is applicable to China National Standard (CNS) A4 specification (210 × 297 mm) -40- Μ _____ Β7__ 5. Hygroscopic treatment for invention description (38). The resin-molded semiconductor device was then exposed to a fluorocarbon vapor heated to 125 ° C for one minute to examine the proportion of cracks in the package at this stage. Furthermore, this resin-molded semiconductor device was also placed in saturated water vapor heated to 1 2 7 ° C for a predetermined time to check its percentage of defects (defects due to leakage and defects due to openings), according to This evaluates its moisture resistance. (3) In order to investigate the thermal shock resistance of these resin compositions, the following T C T test was performed. That is, a large-sized test piece (8 mm x 8 mm) for thermal shock resistance was prepared with each resin composition. Then, the inspection device was post-cured at 220 ° C for 4 hours to make a resin-molded semiconductor device. Then, each resin-molded semiconductor device is subjected to a thermal shock cycle ', and one cycle includes a temperature of 65 ° C / room temperature / 1150. (:. This cycle is repeated 50 to 400 times to determine the percentage of defects through the performance characteristics of the inspection device. The results of these PCT and TCT tests are summarized in Table 4 below. I-* 1 -I II — ^ 1.: V! I — ^ 1 (Please read the precautions on the back before filling out this page) The printed paper size of the staff consumer cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs applies the Chinese National Standard (CNS) Α4 specification ( 210X297 mm) ^ V. Description of the invention (39) A7 B7 Table 3 Examples of comparative examples 1 2 3 1 Flexural modulus (Gpa) 16 18 19 · 22 Flexural strength (Mpa) 154 160 157 128 Thermal expansion coefficient ( l / deg) x 1 Ο5 1.5 1.2 1.2 1.2 Glass transition point (° C) 132 124 102 122 Water absorption (% by weight) 0.24 0.23 0.21 0.23 Adhesive strength (Mpa) 17 15 16 11 tjl I 1 i! = 1 II i 1- --- «V m I i I —... ---- Τ» (Please read the precautions on the back before filling out this page) Printed by the Central Consumers Bureau of the Ministry of Economy Staff Consumer Cooperatives This paper is for China Standard (CNS) A4 specification (210X 297 mm) -42-A 7 B7 V. Description of the invention (4〇) Table 4 Examples Comparative example 1 2 3 1 Proportion of cracks after moisture absorption test after PCT inspection 0/20 0/20 0/20 0/20 Performance defect% 100 hours 0/20 0/20 0/20 0/20 200 hours 0 / 20 0/20 0/20 0/20 300 hours 0/20 0/20 0/20 1/20 400 hours 0/20 0/20 0/20 2/20 5 00 hours 0/20 0/20 0/20 5/20 TCT test 50 cycles 0/20 0/20 0/20 0/20 100 cycles 0/20 0/20 0/20 0/20 200 cycles 0/20 0/20 0/20 1/20 300 cycles 0 / 20 0/20 0/20 4/20 400 cycle 0/20 0/20 0/20 5/20 (Please read the precautions on the back before filling this page)

經濟部中央標準局員工消費合作社印$L 從表3明顯看出，本發明樹脂組成物的試片（實施例 1至3 )與比較例1所得者比較之下展現出優良的撓曲強度和黏著強度。特別者，經發現經由摻和含聚矽氧烷樹脂的硬化劑可以明顯地改良黏著強度。如從表4明顯可知者，即使經樹脂模塑半導體裝置放置在高溫和高濕度條件下5 0 0_小時，本發明實施例1至本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -43- 經濟部中央橾準局員工消費合作社印装 A7 ___________B7_ 五、發明説明（41 ) 3的經樹脂鑲鑄半導體裝置也未產生任何缺陷，因而證明本發明經樹脂鑲鑄半導體裝置具有優良的防濕性。相反地，於使用不含側鏈上具酚羥基的聚矽氧烷之樹脂組成物密封半導體裝置的比較例1經樹脂鑲鑄半導體裝置之情況中，在檢驗3 0 0小時後於某些裝置中可發現缺陷，且在檢驗5 0 0小時後有四分之一的裝置有缺陷。從表4所示T C T檢驗結果可看出，即使經樹脂鑲鑄半導體裝置接受重複4 0 0次的熱震循環，本發明實施例的經樹脂模塑半導體裝置都沒有任何缺陷。相反地，於比較例1樹脂鑲鑄半導體裝置的情況中，在2 0 0次熱震循環後某些裝置出現缺陷，且於4 0 0次熱震循環之後有四分之一的裝置有缺陷。如上所示者，本發明樹脂組成物的硬化產品在所有方面包括機械強度在內都顯示出優良結果，因而顯明用本發明樹脂組成物密封的經樹脂鑲鑄半導體裝置展現出明顯的高防濕性和耐熱震性。順便提及者，在實施例1至3任何一者的樹脂組成物經模製後在金屬模子的內部都沒有因聚矽氧烷滲流所致任何程序的污染。將實施例4，5或6及比較例2和3與樣品中所得液體樹脂組成物分別模製成厚度4毫米的片材，其接著在 Γ 8 0 °C溫度下加熱硬化5小時由是得到試片（4毫米X 10毫米XI00毫米）。然後，測量這些試片的撓曲模數和撓曲強度。同時，在將硬化試片切割成適當尺寸後測本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） - n^i L «In ml ^KI 1* .¾-$ /1- (請先閲讀背面之注意事項再填寫本頁) -44 - A7 B7 經濟部中央標準局員工消费合作社印製五、發明説明（42 ) 量這些試片的熱膨脹係數，玻璃轉變點和吸水率。再者，將每一樹脂組成物稍微塗被B T樹脂形成的基材上，並將一砂晶圓（3毫米X 3毫米）放置在基材上。將以此方式塗被的樹脂組成物置於1 5 0 °C溫度下加熱一小時以硬化該樹脂組成物，因而製備成試片。然後，每一試片測量壓縮方向的黏著強度。這些檢驗所得結果皆列於下面的表5 之中。依下述使用實施例4，5和6及比較例2和3與樣品中所得樹脂組成物製備經樹脂鑲鑄半導體裝置。首先，在 L S I倒裝晶片的墊部上形成一焊塊（1 〇毫米X 1 〇毫米；焊塊高度：5 0微米）。然後，將所得晶片安裝在線路板上並利用熱壓黏合固定在其上。另一方面，分別將實施例4，5和6，以及比較例2和3與樣品中所得樹脂組成物給到注射筒內，並隨後使其流到事先在一電熱板上加熱到6 0 °C的晶片之一側中。經如此施加的樹脂組成物會因毛細現象被導引到介於晶片與基材之間的空間內。於實施例4至6與比較例2的樹脂組成物之情況中，樹脂組成物的塡充係在5分鐘內完成，而在比較例3與樣品所得樹脂組成物的情況中，分別需要1 2分鐘的時間來完成塡充以及甚至於長達3 0分鐘的時間仍不足以完成塡充。於完成樹脂組成物的塡充之後，將彼等置於1 5 0 °C溫度的爐內加熱一小時藉以硬化樹脂組成物，因而得到倒裝晶片半導體裝置。然後，以實施例1至3情況中的相同方式進行的 ---------(裝-- /f (請先閱讀背面之注意事項再填寫本頁)Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs of the People's Republic of China It is clear from Table 3 that the test pieces (Examples 1 to 3) of the resin composition of the present invention showed excellent flexural strength and Adhesive strength. In particular, it has been found that the adhesive strength can be significantly improved by blending a polysiloxane-containing resin hardener. As apparent from Table 4, even if the resin-molded semiconductor device is placed under high-temperature and high-humidity conditions for 500 hours, the embodiment 1 to the paper size of the present invention applies the Chinese National Standard (CNS) A4 specification (210X297). (%) -43- A7 ___________B7_ printed by the Consumer Cooperatives of the Central Bureau of Quasi-Economic Bureau of the Ministry of Economic Affairs 5. The resin-molded semiconductor device of the invention description (41) 3 did not produce any defects, thus proving that the resin-molded semiconductor device of the present invention has Excellent moisture resistance. In contrast, in the case of a semiconductor device of Comparative Example 1 in which a semiconductor device was sealed by using a resin composition containing no polysiloxane having a phenolic hydroxyl group on the side chain, the device was tested in some devices after 300 hours of inspection. Defects can be found, and a quarter of the devices were defective after 500 hours of inspection. It can be seen from the T C T test results shown in Table 4 that the resin-molded semiconductor device according to the embodiment of the present invention does not have any defects even if the resin-molded semiconductor device receives a thermal shock cycle repeated 400 times. In contrast, in the case of the resin-molded semiconductor device of Comparative Example 1, some devices had defects after 200 thermal shock cycles, and a quarter of the devices had defects after 400 thermal shock cycles. . As shown above, the hardened product of the resin composition of the present invention shows excellent results in all aspects, including mechanical strength, and thus it is apparent that the resin-molded semiconductor device sealed with the resin composition of the present invention exhibits significantly high moisture resistance. And thermal shock resistance. Incidentally, the resin composition of any of Examples 1 to 3 was not contaminated by any procedure due to the permeation of polysiloxane in the inside of the metal mold after molding. The liquid resin composition obtained in Example 4, 5 or 6 and Comparative Examples 2 and 3 and the samples were respectively molded into a sheet having a thickness of 4 mm, and then heated and hardened at a temperature of Γ 8 0 ° C for 5 hours to obtain Test piece (4 mm X 10 mm XI00 mm). Then, the flexural modulus and flexural strength of these test pieces were measured. At the same time, after cutting the hardened test piece to an appropriate size, the paper size is measured according to the Chinese National Standard (CNS) A4 (210X297 mm)-n ^ i L «In ml ^ KI 1 * .¾- $ / 1- ( Please read the notes on the back before filling this page) -44-A7 B7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of Invention (42) Measure the thermal expansion coefficient, glass transition point and water absorption of these test pieces. Further, each resin composition was slightly coated on a substrate formed of a B T resin, and a sand wafer (3 mm × 3 mm) was placed on the substrate. The resin composition coated in this manner was heated at 150 ° C for one hour to harden the resin composition, thereby preparing a test piece. Then, the adhesive strength in the compression direction was measured for each test piece. The results of these tests are listed in Table 5 below. Resin-molded semiconductor devices were prepared using the resin compositions obtained in Examples 4, 5 and 6 and Comparative Examples 2 and 3 and samples as follows. First, a solder bump (10 mm × 100 mm; solder bump height: 50 μm) was formed on the pad portion of the L S I flip chip. Then, the obtained wafer is mounted on a wiring board and fixed thereto by thermocompression bonding. On the other hand, the resin compositions obtained in Examples 4, 5 and 6, and Comparative Examples 2 and 3 and the samples were fed into a syringe, and then allowed to flow to a heating plate heated to 60 ° in advance. C's one side of the wafer. The resin composition thus applied is guided to the space between the wafer and the substrate due to capillary phenomenon. In the case of the resin compositions of Examples 4 to 6 and Comparative Example 2, the filling of the resin composition was completed within 5 minutes, and in the case of the resin composition obtained in Comparative Example 3 and the sample, respectively, 1 2 Minutes of time to complete the charge and even as long as 30 minutes is not enough to complete the charge. After the resin composition was completely filled, they were heated in an oven at a temperature of 150 ° C for one hour to harden the resin composition, thereby obtaining a flip-chip semiconductor device. Then, in the same way as in the case of Examples 1 to 3 --------- (install-/ f (please read the precautions on the back before filling this page)

•1T 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -45- Β7 五、發明説明（43 ) P C T和T C T檢驗評估如此所得倒裝晶片半導體裝置。所得結果摘列於下面的表6之中。表 5 _：__ 實施例比較例樣品 4 5 6 2 3 撓曲模數 8.4 7.3 9.2 2.6 11.3 8.2 (Mpa) 撓曲強度 144 150 136 102 138 140 (Mpa) 熱膨脹係數 3.3 3.2 2.8 7.2 3.4 3.5 (l/deg)x 1 05 玻璃轉變點（°c ) 112 103 110 111 125 110 吸水率（重量％) 0.56 0.52 0.46 1.10 0.58 0.57 黏著強度 35 32 40 23 14 24 (Mpa) ---------裝-- (請先閱讀背面之注意事項再填寫本頁) 、?τ 經濟部中央標準局貝工消費合作社印製本紙張尺度逋用中國國家橾準（CNS ) Α4規格（21〇Χ 297公釐） -46 - A7五、發明説明彳4 ) 表6 1 t施例比較例樣品 4 5 6 2 3 PCT 檢驗吸濕檢驗後產生龜裂之比例 0/20 0/20 0/20 3/20 0/20 20/20 性能缺陷百分比 100小時 0/20 0/20 0/20 5/20 2/20 200小時 0/20 0/20 0/20 12/20 2/20 3 00小時 0/20 0/20 0/20 20/20 2/20 _ 400小時 0/20 0/20 0/20 參 2/20 5 00小時 0/20 0/20 0/20 3/20 TCT 檢驗 0循環（硬化後） 0/20 0/20 0/20 5/20 5/20 20/20 50循環 0/20 0/20 0/20 20/20 8/20 1 00循環 0/20 0/20 0/20 13/20 _ 200循環 0/20 0/20 0/20 _ 20/20 __ 200循環 0/20 0/20 0/20 . .400循環 0/20 0/20 0/20 _ _ - (請先閲讀背面之注意事項再填寫本頁) 裝·• 1T This paper size is in accordance with Chinese National Standard (CNS) A4 (210X 297mm) -45- Β7 V. Description of Invention (43) PCT and TCT inspection and evaluation of the flip-chip semiconductor device thus obtained. The results obtained are summarized in Table 6 below. Table 5 _: __ Example Comparative Example Sample 4 5 6 2 3 Flexural modulus 8.4 7.3 9.2 2.6 11.3 8.2 (Mpa) Flexural strength 144 150 136 102 138 140 (Mpa) Thermal expansion coefficient 3.3 3.2 2.8 7.2 3.4 3.5 (l / deg) x 1 05 Glass transition point (° c) 112 103 110 111 125 110 Water absorption (% by weight) 0.56 0.52 0.46 1.10 0.58 0.57 Adhesive strength 35 32 40 23 14 24 (Mpa) -------- -Install-(Please read the notes on the back before filling this page),? Τ This paper is printed by the Central Standards Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperatives, and the paper size is in accordance with China National Standards (CNS) Α4 size (21〇 × 297 (Mm) -46-A7 V. Description of the invention 彳 4) Table 6 1 t Example Comparative Example Sample 4 5 6 2 3 PCT test Proportion of cracks after moisture absorption test 0/20 0/20 0/20 3 / 20 0/20 20/20 Performance defect percentage 100 hours 0/20 0/20 0/20 5/20 2/20 200 hours 0/20 0/20 0/20 12/20 2/20 3 00 hours 0/20 0/20 0/20 20/20 2/20 _ 400 hours 0/20 0/20 0/20 See 2/20 5 00 hours 0/20 0/20 0/20 3/20 TCT inspection 0 cycles (after hardening ) 0/20 0/20 0/20 5/20 5/20 20/20 50 cycles 0/20 0/20 0/20 20/20 8/20 1 00 cycles 0/20 0/20 0/20 13/20 _ 200 cycles 0/20 0/20 0/20 _ 20/20 __ 200 Cycle 0/20 0/20 0/20. .400 cycle 0/20 0/20 0/20 _ _-(Please read the precautions on the back before filling this page)

.IT 經濟部中央標準局貝工消費合作社印製本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -47- 經濟部中央標準局貝工消費合作社印製 ΑΊ Β7五、發明説明（45 ) 從表5可看出’本發明（實施例4，5和6 )樹脂組成物的試片與比較例者相比之下展現出優良的撓曲強度和黏著強度。從實施例5樹脂組成物與比較例3樹脂組成物之間的撓曲模數比較明顯可知，在兩者皆含相同塡料量之下’含有聚矽氧烷作爲（b )成分的實施例5樹脂組成物顯示出與比較例3者較爲低之撓曲模數，顯示出實施例5 試片有遠較爲減低的應力。如表6中所示結果明顯可知，即使將經樹脂模塑半導體裝置放置於局(溫和高濕度條件下5 0 0小時，本發明實施例4和5經樹脂鑲鑄半導體裝置中也未發現任何缺陷，因而證明本發明經樹脂鑲鑄半導體裝置的優點防濕性。相反地’於使用不含無機塡料的樹脂組成物密封半導體裝置的比較例2經樹脂鑲鑄半導體裝置的情況中，在檢驗 3 0 0小時後’所有裝置都有缺陷。在使用含有大粒徑無機塡料的樹脂組成物之樣品例之中，樹脂組成物不能充分地導到間隙之內，使得在樹脂組成物硬化之後立即在所有裝置中發現缺陷。從表6所示T C T檢驗結果可看出，本發明實施例經樹脂模塑半導體裝置在4 0 0次熱震循環之後沒有任何缺陷’顯示出優良的耐熱震性。相反地，於不含無機塡料的比較例2經樹脂鑲鑄半導體裝置之情況中，在5 〇熱震循環後’某些裝置出現缺陷，而在不含構成（b )成分的聚矽氧烷之比較例3經樹脂鑲鑄半導體裝置之情況中，於 2 0 0熱震循環之後某些裝置出現缺陷。此外，於摻和大本紙張尺度適用中國國家標準（CNS〉A4規格（21〇X297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝..IT Printed by the Central Laboratories of the Ministry of Economic Affairs of the Bayer Consumer Cooperative. This paper is printed in accordance with the Chinese National Standard (CNS) A4 (210X297 mm) -47- Printed by the Central Laboratories of the Ministry of Economic Affairs of the Bayer Consumer Cooperative. (45) As can be seen from Table 5, the test pieces of the resin composition of the present invention (Examples 4, 5 and 6) exhibited superior flexural strength and adhesive strength compared with those of the comparative examples. From the comparison of the flexural modulus between the resin composition of Example 5 and the resin composition of Comparative Example 3, it is clear that the examples containing "polysiloxane" as the (b) component under the same amount of both materials. The 5 resin composition showed a lower flexural modulus than that of Comparative Example 3, and it showed that the test piece of Example 5 had far lower stress. As is clear from the results shown in Table 6, even if the resin-molded semiconductor device was placed in a local (500 hours under mild high humidity conditions), no resin was found in any of the semiconductor-molded semiconductor devices of Examples 4 and 5 of the present invention. The defect proves the advantages of the resin-molded semiconductor device of the present invention in terms of moisture resistance. Conversely, in the case of the resin-molded semiconductor device of Comparative Example 2 in which the semiconductor device was sealed with a resin composition containing no inorganic filler, in After 300 hours of inspection, 'All devices are defective. In the sample examples using the resin composition containing a large particle size inorganic filler, the resin composition could not be sufficiently guided into the gap, so that the resin composition hardened. Defects were found in all devices immediately afterwards. From the TCT test results shown in Table 6, it can be seen that the resin-molded semiconductor device of the embodiment of the present invention has no defects after 400 thermal shock cycles. On the contrary, in the case of the resin-molded semiconductor device of Comparative Example 2 containing no inorganic filler, after 50 thermal shock cycles, some devices were defective. In the case of Comparative Example 3, which does not contain the polysiloxane containing component (b), as a resin-molded semiconductor device, defects occurred in some devices after a thermal shock cycle of 200. In addition, it was mixed with a large amount of Paper size applies Chinese national standard (CNS> A4 specification (21 × 297 mm)) (Please read the precautions on the back before filling this page).

、1T -48- A7 B7 經濟部中央標準局員工消費合作社印製五、發明説明（46 ) 粒徑無機塡料的樣品例經樹脂鑲鑄半導體裝置的情況中，在樹脂組成物硬化後立即在所有裝置中出失調現象。如上所述者，根據本發明，可以經由適當地選擇所用成分的類別和混合比例得到一液體樹脂組成物。在使用液體樹脂組成物時，其塡充時間可縮短，且同時可以得到如上所示具有優良防濕性和耐熱震性之倒裝型半導體裝置。此外，也可以使用本發明液體樹脂組成物作爲鑄封樹脂或黏著劑。圖1所示爲本發明經樹脂鑲鑄半導體裝置一實施例（ a )斷面圖。參考圖1，於本發明經樹脂鑲鑄半導體裝置 i 〇中，一半導體元件1係安裝在一基材2之上，且在半導體元件1表面上形成的連結墊2係經連接線5電連接到導框4。此構造整個地被本發明樹脂組成物硬化物所構成的樹脂層6所密封。以這種方式構成的本發明經樹脂鑲鑄半導體裝置1 0 如上所提者具有優良的耐熱性，耐熱震性及防濕可靠性，且同時，沒有其任何成分會從其表面滲流出而損及其外觀之問題。圖2闡示本發明經樹脂鑲鑄半導體裝置另一實施例之斷面圖。於圖2所示半導體裝置之中，係以面朝下形式將半導體晶片2 4經由焊塊2 3安裝在基材2 1的表面上。本發明樹脂組成物硬化物所構成的樹脂層2 2係插置於基材2 1與半導體晶片2 4之間的空間內。圖2所示倒裝晶片型半導體裝置可經由將樹脂組成物 (請先聞讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS > A4規格（210Χ297公釐） -49 - 經濟部中央標準局貝工消費合作社印製 A7 B7 __五、發明説明（47 ) 利用毛細現象或經由施加壓力流到基材與半導體晶片之間形成的空間內而製成。這種製造方法的一實施例槪示於圖 3之中。由於基材2 1與半導體晶片2 4之間的空間極爲小到5 0到1 5 0微米，因此要給到其中的樹脂組成物 2 5須爲低黏度者。於本發明樹脂組成物爲液體之情況中，該樹脂組成物可以容易地滲透到如圖3所示的基材2 1 與半導體晶片2 4之間的空間之內，使得本發明樹脂組成物特別適於製造倒裝晶片型半導體裝置。如上文解說者，根據本發明可以提出一種具有低吸濕性，優良模製性和耐熱性之樹脂組成物。此外，使用本發明樹脂組成物的硬化物來封裝半導體元件時也可以製得具有優良耐熱性，耐熱震性，和防濕可靠性的經樹脂鑲鑄半導體裝置。所以，從工業觀點來看，本發明非常有價値。其他的優點和修改皆爲諳於此技者所易知者。所以，本發明於其較廣方面不限於本文所示和所說明的特殊細部和代表性實施例。因此之故，可以完成各種修改而不違離後附串請專利範圍所界定的整體創作槪念及其相等者的旨意或範圍。主要元件對照 1 半導體元件 2 基材 3 連結墊 4 導框本紙張尺度適用巾®®家縣（CNS ) A4驗（21QX297公楚） ~-50 - (請先閱讀背面之注意事項再填寫本頁) '裝. *?τ 經濟部中央標準局員工消费合作社印製 A7 B7五、發明説明（48 ) 5 連結線 6 樹脂層 10/20 經樹脂鑲鑄半導體裝置 2 1 基材 2 2 樹脂層 2 3 焊塊 24 半導體晶片 2 5 樹脂組成物 HH —^^1 I: I— ι*^ϋ ·ί -*. 1— In —^1 —^ϋ 1MWI —tn V-J #f\ (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -51 -1T -48- A7 B7 Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (46) Samples of particle size inorganic fillers are made of resin-molded semiconductor devices. Imbalance occurs in all devices. As described above, according to the present invention, a liquid resin composition can be obtained by appropriately selecting the type and mixing ratio of the components used. When the liquid resin composition is used, the charging time can be shortened, and at the same time, a flip-chip semiconductor device having excellent moisture resistance and thermal shock resistance can be obtained. Alternatively, the liquid resin composition of the present invention can be used as a potting resin or an adhesive. FIG. 1 is a cross-sectional view of an embodiment (a) of a resin-molded semiconductor device according to the present invention. Referring to FIG. 1, in the resin-molded semiconductor device i 0 according to the present invention, a semiconductor element 1 is mounted on a substrate 2, and a connection pad 2 formed on the surface of the semiconductor element 1 is electrically connected via a connecting wire 5. Go to guide frame 4. This structure is entirely sealed by the resin layer 6 composed of the cured resin composition of the present invention. The resin-molded semiconductor device 10 of the present invention constructed in this way has excellent heat resistance, thermal shock resistance, and moisture-proof reliability as mentioned above, and at the same time, no component of it will leak from its surface and be damaged. And its appearance. Fig. 2 illustrates a cross-sectional view of another embodiment of a resin-molded semiconductor device according to the present invention. In the semiconductor device shown in FIG. 2, a semiconductor wafer 24 is mounted on a surface of a base material 21 via a solder bump 23 in a face-down manner. The resin layer 2 2 composed of the cured resin composition of the present invention is interposed in the space between the substrate 21 and the semiconductor wafer 24. The flip-chip semiconductor device shown in Figure 2 can be made by using a resin composition (please read the precautions on the back before filling out this page). This paper size applies to Chinese national standards (CNS > A4 size (210 × 297 mm) -49 -Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperative, A7 B7 __V. Description of Invention (47) It is made by using capillary phenomenon or by applying pressure to the space formed between the substrate and the semiconductor wafer. This manufacturing An example of the method is shown in Fig. 3. Since the space between the substrate 21 and the semiconductor wafer 24 is extremely small to 50 to 150 microns, the resin composition 25 to be given therein must be Those with low viscosity. In the case where the resin composition of the present invention is a liquid, the resin composition can easily penetrate into the space between the substrate 2 1 and the semiconductor wafer 24 as shown in FIG. The resin composition of the invention is particularly suitable for manufacturing a flip chip type semiconductor device. As explained above, according to the present invention, a resin composition having low hygroscopicity, excellent moldability, and heat resistance can be proposed. In addition, the present invention is used A resin-molded semiconductor device having excellent heat resistance, thermal shock resistance, and moisture resistance reliability can also be produced when a semiconductor component is encapsulated with a hardened composition of a lipid composition. Therefore, the present invention is very valuable from an industrial point of view. Other advantages and modifications are readily apparent to those skilled in the art. Therefore, the invention is not limited in its broader aspects to the specific details and representative embodiments shown and described herein. As a result, it can be accomplished Various modifications without departing from the intention or scope of the overall creative concept as defined by the patent scope and its equivalent. Main component comparison 1 Semiconductor component 2 Substrate 3 Linking pad 4 Guide frame This paper is suitable for paper towels®® Home County (CNS) A4 Inspection (21QX297 Gongchu) ~ -50-(Please read the precautions on the back before filling out this page) 'Packing. *? Τ Printed by the Consumer Standards Cooperative of the Central Standard Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Explanation (48) 5 Connecting line 6 Resin layer 10/20 Resin-molded semiconductor device 2 1 Base material 2 2 Resin layer 2 3 Solder block 24 Semiconductor wafer 2 5 Resin composition HH — ^^ 1 I: I— ι * ^ ϋ · ί-*. 1— I n — ^ 1 — ^ ϋ 1MWI —tn V-J #f \ (Please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210X297 mm) -51-

Claims

7ί 經濟部智慧財產局員工消費合作社印製美职專利範圍 3們第8δΐι?943號專4k吖年y丨月> 曰優壬/更正 £8 民國89年11月修正中女申諳專刹範面礙让太 1·—種樹脂組成物，其包括： (a )環氧化合物； _ / (b )硬化劑，其包括其側鏈上具有酚系羥基之聚砍氧烷樹脂：及 (c )無機塡料。 2 ·如申請專利範圍第1項之樹脂組成物，其中該樹脂組成物在l〇〇°C溫度下的黏度爲5P a· S或·更低者該（基之該（基之爲以基（ (C 者，內。 3 ·如申請專利範圍第1項之樹脂組成物，其中構成 c)成分的該無機塡料之含量係以整個樹脂組成物爲 10至95重量％。 4 ·如申請專利範圍第3項之樹脂組成物，其中構成 c)成分的該無機塡料之含量係以整個樹脂組成物爲 40至90重量％。 5 ·如申請專利範圍第1項之樹脂組成物，其中構成 )成分的環氧樹脂與構成（b )成分的硬化劑之總量整個樹脂組成物爲基之5至9 0重量％ ’且同時在該 )成分所含環氧基（EP)與（b)成分所含軋系羥 P h Ο Η )之間的比例（E P / P h Ο Η )係在1 / 2至1/0·2範圍內。 6 .如申請專利範圍第1項之樹脂組成物，其中構成 )成分·的該無機塡料所具最大粒徑爲5 0微米或更小且該無機塡料的平均粒徑係在〇·5至50微米範圍 ---------^-- (請先閲讀背面之注意事項再填寫本頁) -* 線本纸張尺度逋用中國國家標準（CNS ) Α4规格（210X297公嫠）.^ . A8 B8 C8 D8 經濟部中央標準局貝工消費合作社印製 •申請專利範圍 1 1 1 — 種樹脂組成物，其包括 1 1 ( a ) 環氧化合物 t 1 卜 ( b ) 硬化劑，其包括其側鏈上有酚羥基之聚矽氧烷請 • 先樹脂及閲 1 背 1 ( C ) 無機塡料。之 1 注 I 2 • 如申請專利範圍第 1 項之樹脂組成物 » 其中該樹意事 1 脂組成物在 1 0 0 °c 溫度下的黏度爲5 Ρ a • S 或更低者項再 I 〇 1 本裝頁 1 3 • 如申請專利範圍第 1 項之樹脂組成物其中構成 1 | 該 ( C ) 成分的該無機塡料之含量係以整個樹脂組成物爲 Γ 基之 1 0 至 9 5重量％ 0 h 1 4 • 如申請專利範圍第 3 項之樹脂組成物其中構成訂 I 該 ( C ) 成分的該無機塡料之含量係以整個樹脂組成物爲 1 I 基之 4 0 至 9 0重量％〇 1 1 5 • 如申請專利範圍第 1 項之樹脂組成物其中構成 1 1 ( a ) 成分的環氧樹脂與構成 ( b )成分的硬化劑之總量、、 1 爲以整個樹脂組成物爲基之 5 至 9 0重量 % 且同時在該 1 I ( a ) 成分所含環氧基 ( E P ) 與 (b ) 成分所含酚羥基 1 1 I ( P h 〇 Η )之間的比例 (E P / I 3 h 〇 Η ) 係在1 / 1 1 • 2 至 1 / 0 · 2範丨圍 0 6 • 如申請專利範圍第 1 項之樹脂組成物其中構成 (J | ( C ) 成分的該無機塡料所具最大粒徑爲 5 0 微米或更小 1 I 者且該 Μ >t、、機塡料的平均粒徑係在 0 · 5 至 5 0 微米範圍. 1 1 I 內 0 1 1 1 本纸張尺度逋用t困國家揉準（CNS ) A4规格（2!〇><297公釐） -52- 399248 A8 B8 C8 D8 經濟部中央揉率局貝工消費合作社印裝六、申請專利範圍 7 ·如申請專利範圍第1項之樹脂組成物，其中在該 (b )成分內所含該聚矽氧烷樹脂的分子量係在3 0 〇至 50，〇〇〇範圍內。 8 ·如申請專利範圍第7項之樹脂組成物，其中在該 (b )成分內所含該聚矽氧烷樹脂的分子量係在5 0 0至 30，〇〇〇範圍內。 9 ·如申請專利範圍第1項之樹脂組成物，其更包括作爲硬化劑的至少一種選自胺，酸酐和酚之中的化合物。 1 0 · —種樹脂組成物，其包括： (a )環氧化合物； (b )硬化劑，其包括具有下面通式（p s 1 )所表重複單位及/或下面通式（P S 2 )所表重複單位之聚矽氧烷樹脂：及 (c )無機塡料；7ί The Intellectual Property Bureau of the Ministry of Economic Affairs's Consumer Cooperatives printed U.S. patents for the scope of their work. No. 8δΐι? 943 Special 4k acryl y 丨 month > Yueyou Ren / Correction £ 8 November 1998 Amendment to Chinese Women's Special Appeal Fan Rangtai 1 · A resin composition comprising: (a) an epoxy compound; _ / (b) a hardener comprising a polyoxyalkylene resin having a phenolic hydroxyl group on its side chain: and ( c) inorganic materials. 2 · The resin composition according to item 1 of the patent application scope, wherein the viscosity of the resin composition at 100 ° C is 5P a · S or lower ((C, within. 3) As in the resin composition of the scope of application for patent 1, the content of the inorganic aggregate constituting component c) is 10 to 95% by weight of the entire resin composition. 4 • As applied The resin composition according to item 3 of the patent, wherein the content of the inorganic aggregate constituting the component c) is 40 to 90% by weight of the entire resin composition. 5. The resin composition according to item 1 of the patent application, wherein The total amount of the epoxy resin and the hardener constituting the component (b) is 5 to 90% by weight based on the entire resin composition, and the epoxy group (EP) and (b ) The ratio (EP / P h 〇 Η) of the rolling system hydroxyl group P h 〇)) contained in the component is in the range of 1/2 to 1/0 · 2. 6. The resin composition according to item 1 of the patent application scope, wherein the maximum particle diameter of the inorganic aggregate constituting the component) is 50 micrometers or less and the average particle diameter of the inorganic aggregate is 0.5 To the 50 micron range --------- ^-(Please read the notes on the back before filling in this page)-* The size of the thread paper is in accordance with the Chinese National Standard (CNS) Α4 specification (210X297) ). ^. A8 B8 C8 D8 Printed by the Bayer Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs • Application for a patent 1 1 1 — a resin composition including 1 1 (a) epoxy compound t 1 b (b) hardener It includes polysiloxanes with phenolic hydroxyl groups on its side chains. • Resins and 1 (C) inorganic materials. No. 1 Note I 2 • If the resin composition in the scope of patent application item 1 »Where the tree is a matter of matter 1 The viscosity of the lipid composition at 100 ° C is 5 ρ a • S or lower, then I 〇1 This page 1 3 • If the resin composition of item 1 of the patent application scope contains 1 | The content of the inorganic filler of the (C) component is based on the entire resin composition as a 0 to 9 5 Weight% 0 h 1 4 • As for the resin composition of item 3 of the patent application range, the content of the inorganic aggregate constituting the component I (C) is based on the entire resin composition of 1 to 4 0 to 9 0 ％％〇1 1 5 • The total amount of epoxy resin constituting 1 1 (a) and the hardener constituting (b) is 1 in the resin composition of item 1 of the scope of patent application. Based on 5 to 90% by weight And at the same time, the ratio (EP / I 3 h 〇Η) between the epoxy group (EP) contained in the 1 I (a) component and the phenolic hydroxyl 1 1 I (P h 〇Η) contained in the (b) component is In the range of 1/1 1 • 2 to 1/0 · 2 range 丨 0 0 • The resin composition of item 1 of the patent application scope, in which the maximum particle size of the inorganic aggregate constituting the (J | (C) component is 50 μm or less 1 I and the average particle size of the M > t, organic material is in the range of 0.5 to 50 micrometers. Within 1 1 I 0 1 1 1 t Standards for troubled countries (CNS) A4 specifications (2! 〇 > < 297 mm) -52- 399248 A8 B8 C8 D8 Printed by the shelling consumer cooperative of the Central Rubbing Bureau of the Ministry of Economic Affairs 6. Application for patent scope 7 The resin composition according to item 1 of the patent, wherein the molecular weight of the polysiloxane resin contained in the component (b) is in the range of 300 to 50,000. 8. The resin composition according to item 7 of the scope of patent application, wherein the molecular weight of the polysiloxane resin contained in the component (b) is in the range of 5,000 to 30,000. 9. The resin composition according to item 1 of the patent application scope, further comprising at least one compound selected from the group consisting of an amine, an acid anhydride, and a phenol as a hardener. 1 · A resin composition comprising: (a) an epoxy compound; (b) a hardener comprising a repeating unit represented by the following general formula (ps 1) and / or the following general formula (PS 2) Table repeating units of polysiloxane resin: and (c) inorganic materials;

式中R1係選自下列所成組合之中者：各具1至1 〇個碳原子的烷基，乙烯基，烯丙基，經取代或未經取代芳基及經取代或未經取代矽烷氧基；R2至R6可相同或相異，各爲選自下列所成組合之中者：氫原子，鹵素原子，經取代或未經取代的烷基，羧基，烷羰基，烷氧羰基，烷氧基，嫌丙氧基’烯丙基及經取代或未經取代芳基，其限制條件爲本纸張尺度逋用中國國家標準（CNS ) A4規格（210X297公釐） -53- Ik-------ί 裝-----_—訂------i <請先聞讀背面之注意事項再填寫本頁) 8 8 8 8 ABCD 六、申請專利範圍 R2至R6中至少有一者爲羥基；In the formula, R1 is selected from the group consisting of alkyl, vinyl, allyl, substituted or unsubstituted aryl, and substituted or unsubstituted silane, each having 1 to 10 carbon atoms. Oxygen; R2 to R6 may be the same or different, and each is selected from the group consisting of: hydrogen atom, halogen atom, substituted or unsubstituted alkyl group, carboxyl group, alkylcarbonyl group, alkoxycarbonyl group, alkane Oxygen, propyloxy 'allyl, and substituted or unsubstituted aryl, the restrictions are based on the paper size, Chinese National Standard (CNS) A4 specification (210X297 mm) -53- Ik-- ----- ί Loading -----_— Ordering ------ i < Please read the notes on the back before filling in this page) 8 8 8 8 ABCD VI. Application for patent scope R2 to R6 At least one of them is hydroxyl;

式中R7係選自下列所成組合之中者：具有1至1〇個碳原子的經取代或未經取代烷基，具有6至1 4個碳原子的經取代或未經取代芳基，及經取代或未經取代矽烷氧基；R8 至R 1 2可相同或相異且個別地爲選自下列所成組合之中者 :氫原子，鹵素原子，經取代或未經取代烷基，羧基，烷羰基’烷氧羰基，烷氧基，醯氧基，烯丙氧基，烯丙基，具有6至1 4個碳原子的經取代或未經取代芳基，醯胺基和醯亞胺基，其限制條件爲R 8至R 1 2中至少有一者爲酚羥基或具有酚羥基的基。 1 1 ·如申請專利範圍第1 0項之樹脂組成物，其中該樹脂組成物在10 〇°C溫度下的黏度爲5P a· S或更低者。經濟部中央標準局貝工消費合作社印製 (請先Η讀背面之注意事項再填寫本頁) 1 2 ·如申請專利範圍第1 〇項之樹脂組成物，其中構成該（c )成分的該無機塡料之含量係以整個樹脂組成物爲基之1 0至9 5重量％ » 1 3 ·如申請專利範圍第1 2項之樹脂組成物，其中構成該（c )成分的該無機塡料之含量係以整個樹脂組成物爲基之4 0至9 0重量％。 14·如申請專利範圍第10項之樹脂組成物，其中本紙張尺度適用中國國家標準（CNS ) Α4规格（210X297公釐） -54- 經濟部中央標準局貝工消费合作社印褽Wherein R7 is selected from the group consisting of a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted aryl group having 6 to 14 carbon atoms, And substituted or unsubstituted silyloxy; R8 to R 1 2 may be the same or different and are individually selected from the group consisting of a hydrogen atom, a halogen atom, a substituted or unsubstituted alkyl group, Carboxyl, alkoxycarbonyl ', alkoxycarbonyl, alkoxy, fluorenyloxy, allyloxy, allyl, substituted or unsubstituted aryl groups having 6 to 14 carbon atoms, fluorenylamino and fluorene The amine group is limited in that at least one of R 8 to R 1 2 is a phenolic hydroxyl group or a group having a phenolic hydroxyl group. 1 1 · The resin composition according to item 10 of the patent application scope, wherein the viscosity of the resin composition at a temperature of 100 ° C is 5 Pa · S or lower. Printed by the Shellfish Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) 1 2 · If the resin composition of item 10 of the patent application scope, where the (c) component of the The content of the inorganic aggregate is 10 to 95% by weight based on the entire resin composition »1 3 · The resin composition according to item 12 of the patent application scope, wherein the inorganic aggregate constituting the (c) component The content is 40 to 90% by weight based on the entire resin composition. 14. If the resin composition of item 10 of the scope of patent application, the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -54- Seal of the Bayong Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs

399248 β8 ____D8 六、申請專利範圍構成（a )成分的環氧樹脂與構成（b )成分的硬化劑之總量爲以整個樹脂組成物爲基之5至9 0重量％，且同時在該（a )成分所含環氧基（EP)與（b )成分所含酚羥基（PhOH)之間的比例（EP/PhOH)係在1 /1·2至1/0· 2範圍內。 1 5 ·如申請專利範圍第1 〇項之樹脂組成物，其中構成（C )成分的該無機塡料所具最大粒徑爲5 0微米或更小者，且該無機塡料的平均粒徑係在〇 . 5至5 0微米範圍內。 1 6 ·如申請專利範圍第1 〇項之樹脂組成物，其中在該（b )成分內所含該聚矽氧烷樹脂的分子量係在 300至50，000範圔內。 1 7 ·如申請專利範圍第1 0項之樹脂組成物，其中在該（b )成分內所含該聚矽氧烷樹脂的分子量係在 500至30，000範圍內。 1 8 ·如申請專利範圍第1 0項之樹脂組成物，其更包括作爲硬ft劑的至少一種選自胺，酸酐和酚之中的化合 1 9 ^經脂鑲鑄的半導體裝置，其包括一基材，一配置在該基的半導體元件及一用以密封該半導體元件的樹脂層，其中該樹脂層係由包括下列成分的樹脂組成物之硬化物所形成者：_ (a )環氧化合物； (請先閲讀背面之注意事項再填窝本頁) • J—· 、1T 本紙張尺度逋用中國國家標準（CNS ) Α4规格（210Χ297公嫠） -55- 399248 8 88 8 ABCD 六、申請專利範圍 (b )硬化劑，其包括具有下面通式（P S 1 )所表重複單位及/或下面通式（P. S 2 )所表重複單位之聚矽氧烷樹脂；及 (c )無機塡料。 J V'.,裝-- (請先閲讀背面之注意事項再填寫本頁) •1T e Λ 經濟部中央標準局貞工消費合作社印¾ 本紙張尺度逋用中國國家橾準（CNS ) A4規格（210X297公釐） -56- 7ί 經濟部智慧財產局員工消費合作社印製美职專利範圍 3們第8δΐι?943號專4k吖年y丨月> 曰優壬/更正 £8 民國89年11月修正中女申諳專刹範面礙让太 1·—種樹脂組成物，其包括： (a )環氧化合物； _ / (b )硬化劑，其包括其側鏈上具有酚系羥基之聚砍氧烷樹脂：及 (c )無機塡料。 2 ·如申請專利範圍第1項之樹脂組成物，其中該樹脂組成物在l〇〇°C溫度下的黏度爲5P a· S或·更低者該（基之該（基之爲以基（ (C 者，內。 3 ·如申請專利範圍第1項之樹脂組成物，其中構成 c)成分的該無機塡料之含量係以整個樹脂組成物爲 10至95重量％。 4 ·如申請專利範圍第3項之樹脂組成物，其中構成 c)成分的該無機塡料之含量係以整個樹脂組成物爲 40至90重量％。 5 ·如申請專利範圍第1項之樹脂組成物，其中構成 )成分的環氧樹脂與構成（b )成分的硬化劑之總量整個樹脂組成物爲基之5至9 0重量％ ’且同時在該 )成分所含環氧基（EP)與（b)成分所含軋系羥 P h Ο Η )之間的比例（E P / P h Ο Η )係在1 / 2至1/0·2範圍內。 6 .如申請專利範圍第1項之樹脂組成物，其中構成 )成分·的該無機塡料所具最大粒徑爲5 0微米或更小且該無機塡料的平均粒徑係在〇·5至50微米範圍 ---------^-- (請先閲讀背面之注意事項再填寫本頁) -* 線本纸張尺度逋用中國國家標準（CNS ) Α4规格（210X297公嫠）.^ . 經濟部智慧財產局員工消費合作社印製 B8 C8 ___ D8 六、申請專利範囷 7 ·如申請專利範圍第1項之樹脂組成物，其中在該 (b )成分內所含該聚矽氧烷樹脂的分子量係在3 〇〇至 50 ’ 0〇〇範圍內。 8 ·如申請專利範圍第7項之樹脂組成物，其中在該 (b )成分內所含該聚矽氧烷樹脂的分子量係在5 〇〇至 30，0〇〇範圍內。 9 ·如申請專利範圍第1項之樹脂組成物，其·更包括作爲硬化劑的至少一種選自胺，酸酐和酚之中的化合物。 10_—種樹脂組成物，其包括： (a )環氧化合物； (b)硬化劑，其包括具有下面通式（PS 1 )所表重複單位及/或下面通式（P S 2 )所表重複單位之聚矽氧烷樹脂：及 (c )無機塡料；399248 β8 ____D8 6. The total amount of the patent application scope of the epoxy resin constituting the component (a) and the hardener constituting the component (b) is 5 to 90% by weight based on the entire resin composition, and at the same time ( a) The ratio (EP / PhOH) between the epoxy group (EP) contained in the component and the phenolic hydroxyl group (PhOH) contained in the component (b) is in the range of 1/1 · 2 to 1/0 · 2. 15 · The resin composition according to item 10 of the scope of patent application, wherein the inorganic aggregate constituting the component (C) has a maximum particle diameter of 50 microns or less, and the average particle diameter of the inorganic aggregate The range is from 0.5 to 50 microns. 16. The resin composition according to item 10 of the patent application range, wherein the molecular weight of the polysiloxane resin contained in the component (b) is within the range of 300 to 50,000. 17 · The resin composition according to item 10 of the patent application range, wherein the molecular weight of the polysiloxane resin contained in the component (b) is in the range of 500 to 30,000. 1 8 · The resin composition according to item 10 of the patent application scope, which further comprises at least one compound selected from the group consisting of amines, acid anhydrides, and phenols as hard ft agents. 19 ^ Fat-cast semiconductor devices, including A substrate, a semiconductor element disposed on the base, and a resin layer for sealing the semiconductor element, wherein the resin layer is formed of a hardened product of a resin composition including the following components: (a) epoxy Compounds; (Please read the precautions on the back before filling in this page) • J— ·, 1T This paper uses Chinese National Standard (CNS) Α4 size (210 × 297 male) -55- 399248 8 88 8 ABCD VI. Patent application scope (b) hardener, which includes a polysiloxane resin having a repeating unit represented by the following general formula (PS 1) and / or a repeating unit represented by the following general formula (P. S 2); and (c) Inorganic materials. J V '., Installed-(Please read the precautions on the back before filling out this page) • 1T e Λ Printed by Zhengong Consumer Cooperative, Central Bureau of Standards, Ministry of Economic Affairs ¾ This paper uses China National Standard (CNS) A4 (210X297 mm) -56- 7ί Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, the Consumer Cooperative of the United States of America, the scope of printing of US patents No. 8δΐι? 943 No. 4k acryl y 丨 month > Yue Youren / Correction £ 8 Republic of 89 In the month of the month, the female sergeant in Shenyang ’s special courts was rejected. A resin composition comprising: (a) an epoxy compound; _ / (b) a hardener, which includes a phenolic hydroxyl group on its side chain. Polyoxyalkylene resin: and (c) inorganic filler. 2 · The resin composition according to item 1 of the patent application scope, wherein the viscosity of the resin composition at 100 ° C is 5P a · S or lower ((C, within. 3) As in the resin composition of the scope of application for patent 1, the content of the inorganic aggregate constituting component c) is 10 to 95% by weight of the entire resin composition. 4 • As applied The resin composition according to item 3 of the patent, wherein the content of the inorganic aggregate constituting the component c) is 40 to 90% by weight of the entire resin composition. 5. The resin composition according to item 1 of the patent application, wherein The total amount of the epoxy resin and the hardener constituting the component (b) is 5 to 90% by weight based on the entire resin composition, and the epoxy group (EP) and (b ) The ratio (EP / P h 〇 Η) of the rolling system hydroxyl group P h 〇)) contained in the component is in the range of 1/2 to 1/0 · 2. 6. The resin composition according to item 1 of the patent application scope, wherein the maximum particle diameter of the inorganic aggregate constituting the component) is 50 micrometers or less and the average particle diameter of the inorganic aggregate is 0.5 To the 50 micron range --------- ^-(Please read the notes on the back before filling in this page)-* The size of the thread paper is in accordance with the Chinese National Standard (CNS) Α4 specification (210X297) ). ^. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs B8 C8 ___ D8 VI. Patent Application 囷 7 · If the resin composition of the scope of patent application No. 1 is applied, the polymer contained in the component (b) The molecular weight of the silicone resin is in the range of 3,000 to 50'000. 8. The resin composition according to item 7 of the scope of patent application, wherein the molecular weight of the polysiloxane resin contained in the component (b) is in the range of 5,000 to 30,000. 9. The resin composition according to item 1 of the patent application scope, which further comprises at least one compound selected from the group consisting of amines, acid anhydrides, and phenols as a hardener. 10_—a resin composition comprising: (a) an epoxy compound; (b) a hardener comprising a repeating unit represented by the following general formula (PS 1) and / or a repeat represented by the following general formula (PS 2) Unit of polysiloxane resin: and (c) inorganic filler;

式中R1係選自下列所成組合之中者：各具1至10個碳原子的烷基，乙烯基，烯丙基，經取代或未經取代芳基及經取代或未經取代矽烷氧基：R2至R6可相同或相異，各爲選自下列所成組合之中者：氫原子，鹵素原子，經取代或未經取代的烷基，羧基，烷羰基，烷氧.毅基，烷氧基，烯丙氧基，烯丙基及經取代或未經取代芳基，其限制條件爲本紙張尺度逋用中國國家橾準（CNS ) A4規格（210X297公釐） ---------^------1T------捧 (請先閲讀背面之注f項再填寫本頁) A8 B8 C8 D8 六、申請專利範圍 R2至R6中至少有一者爲羥基；In the formula, R1 is selected from the group consisting of alkyl, vinyl, allyl, substituted or unsubstituted aryl, and substituted or unsubstituted silaneoxy, each having 1 to 10 carbon atoms. R2 to R6 may be the same or different, and each is selected from the group consisting of: hydrogen atom, halogen atom, substituted or unsubstituted alkyl group, carboxyl group, alkylcarbonyl group, alkoxy group, Alkoxy, allyloxy, allyl and substituted or unsubstituted aryl groups, the limitation is the paper size, using China National Standard (CNS) A4 specification (210X297 mm) ----- ---- ^ ------ 1T ------ hold (please read the note f on the back before filling this page) A8 B8 C8 D8 VI. At least one of the patent application scopes R2 to R6 is Hydroxyl

式中R7係選自下列所成組合之中者：具有1至1〇個碳原子的經取代或未經取代烷基，具有6至1 4個碳厫子的經取代或未經取代芳基，及經取代或未經取代矽烷氧基；R 8 至R 1 2可相同或相異且個別地爲選自下列所成組合之中者 :氫原子，鹵素原子，經取代或未經取代烷基，羧基，烷羰基，烷氧羰基，烷氧基，醯氧基，烯丙氧基，烯丙基，具有6至1 4個碳原子的經取代或未經取代芳基，醯胺基和醯亞胺基，其限制條件爲R8至R 12中至少有一者爲酚系羥基或具有酚_系羥基的基團。 1 1 ·如申請專利範圍第1 0項之樹脂組成物，其中該樹脂組成物在10 0°C溫度下的黏度爲5P a· S或更低者。 1 2 ·如申請專利範圍第1 0項之樹脂組成物，其中構成該（c )成分的該無機塡料之含量係以整個樹脂組成物爲基之1 〇至9 5重量％。 1 3 ·如申請專利範圍第1 2項之樹脂組成物，其中構成該（c )成分的該無機塡料之含量係以整個樹脂組成物爲基之40至90重量％。 1 4 ·如申請專利範圍第1 0項之樹脂組成物，其中 I-- (請先閱讀背面之注意事項再填寫本頁) 訂線經濟部智慧財產局員工消費合作社印製本紙張尺度逍用中國國家梂準（CNS > A4规格（210X297公釐） • 3 - B8 C8 D8 經濟部智蒽財是局員工消費合作钍印製六、申請專利範圍 •·| 構成 ( a ) 成分的環氧樹脂與構成（ b ) 成分的硬化劑之 1 總量爲以整個樹脂組成物爲基之 5至 9 0 重量％，且同時 1 在該 ( a ) 成分所含環氧基（ Ε Ρ ) 與 ( b )成分所含酚 /—V 請 A 1 I 系羥基 ( P h 0 Η )之間的比例 (Ε P / P h 0 Η ) 係在 Kt 聞 tt 1 1 1 1 / 1 2 至1 / 0 · 2範圍內 » 背之 1 1 1 5 • 如申請專利範圍第 1 0項之樹脂組成物，其中注意事 1 1 構成 ( C ) 成分的該無機塡料所具最大粒徑爲5 CT微米或項再 1 I 更小者 ) 且該無機塡料的平均粒徑係在 0 • 5至5 0 微米寫本吉裝 I 範圍內 0 1 1 1 1 6 如申請專利範圍第 1 0項之樹脂組成物，其中 1 1 在該 ( b ) 成分內所含該聚矽氧烷樹脂的分子量係在 1 1 3 0 0 至 5 0，0 0 0範圍內 0 訂 I 1 7 • 如申請專利範圍第 1 6項之樹脂組成物，其中 1 I 在該 ( b ) 成分內所含該聚矽氧烷樹脂的分子量係在 1 1 I 5 0 0 至 3 0，0 0 0範圍內 » 1 1 線 1 1 8 • 如申請專利範圍第 1 0項之樹脂組成物，其更包括作爲硬化劑的至少一種選白胺，酸酐和酚之中的化合 1 I 物〇 1 I 1 9 • 一種經樹脂包覆的半導體裝置 9 其包括一基材 1 1 1 9 一配置在該基材表面上的半導體元件及 —' 用以密封該半 1 1 導體元件的樹脂層， 1 1 其中該樹脂層係由包括下列成分的樹脂組成物之硬化 1 | 物所形成者 : 1 | ( a ) 環氧化合物； 1 1 1 本紙張尺度適用中國國家標準< CNS ) A4规格（210X297公釐） A8 B8 C8 D8 六、申請專利範圍 (b )硬化劑，其包括一側鏈上具有酚系羥基之聚矽氧烷樹脂；及 (c )無機塡料。 111111 I I I I 訂— 11 I n ^ (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧时是局資工消費合作社印製本紙張尺度逋用中國國家梂率（CNS ) A4说格（210X297公釐）In the formula, R7 is selected from the group consisting of a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and a substituted or unsubstituted aryl group having 6 to 14 carbon atoms. , And substituted or unsubstituted silyloxy; R 8 to R 1 2 may be the same or different and individually selected from the group consisting of: hydrogen atom, halogen atom, substituted or unsubstituted alkane Aryl, carboxyl, alkoxycarbonyl, alkoxycarbonyl, alkoxy, fluorenyl, allyloxy, allyl, substituted or unsubstituted aryl having 6 to 14 carbon atoms, fluorenyl and The sulfonyl imino group has a limitation that at least one of R8 to R12 is a phenolic hydroxyl group or a group having a phenolic hydroxyl group. 1 1 · The resin composition according to item 10 of the scope of patent application, wherein the viscosity of the resin composition at a temperature of 100 ° C is 5 P a · S or less. 1 2. The resin composition according to item 10 of the application, wherein the content of the inorganic aggregate constituting the component (c) is 10 to 95% by weight based on the entire resin composition. 1 3. The resin composition according to item 12 of the patent application range, wherein the content of the inorganic aggregate constituting the (c) component is 40 to 90% by weight based on the entire resin composition. 1 4 · If you apply for the resin composition of item 10 in the scope of patent application, where I-- (Please read the precautions on the back before filling out this page) China National Standards (CNS > A4 size (210X297mm) • 3-B8 C8 D8 Ministry of Economic Affairs Zhixuancai is the employee's consumer cooperation of the Bureau. Printing 6. Application scope of patents • · | Composition (a) epoxy component The total amount of 1 of the resin and the hardener of the component (b) is 5 to 90% by weight based on the entire resin composition, and at the same time 1 is the epoxy group (E P) and ( b) The phenol / -V in the composition, please the ratio between A 1 I-based hydroxyl groups (P h 0 Η) (E P / P h 0 Η) is in Kt Wen 1 1 1 1/1 2 to 1/0 · Within 2 »Back of 1 1 1 5 • For the resin composition of item 10 in the scope of patent application, among which attention should be paid to the maximum particle size of the inorganic aggregate which constitutes (C) component is 5 CT microns or Term is 1 I smaller) and the average of the inorganic material The particle size is in the range of 0 • 5 to 50 micrometers. I 1 0 1 1 1 1 6 The resin composition as described in the patent application No. 10, wherein 1 1 contains the polymer in the (b) component. The molecular weight of the silicone resin is in the range of 1 1 3 0 0 to 5 0, 0 0 0. I 1 7 • If the resin composition of the patent application No. 16 item, 1 I is in the (b) component The molecular weight of the polysiloxane resin contained therein is in the range of 1 1 I 5 0 0 to 3 0, 0 0 0 »1 1 Line 1 1 8 • If the resin composition of the 10th scope of the patent application, It also includes at least one selected white amine, acid anhydride and phenol as a hardener. 1 I 〇1 I 1 9 • A resin-coated semiconductor device 9 including a substrate 1 1 1 9 The semiconductor element on the surface of the substrate and-'a resin layer for sealing the semi- 1 1 conductor element, 1 1 wherein the resin layer is hardened by a resin composition including the following components 1 | Formed by: 1 | (a) epoxy compound; 1 1 1 This paper size applies Chinese National Standard < CNS) A4 specification (210X297 mm) A8 B8 C8 D8 6. Application scope of patent (b) Hardener, It includes a polysiloxane resin having a phenolic hydroxyl group on one side chain; and (c) an inorganic filler. 111111 IIII Order — 11 I n ^ (Please read the notes on the back before filling out this page) The Ministry of Economic Affairs is printed by the Bureau of Industry, Capital and Industrial Cooperatives, using the Chinese National Standard (CNS) A4 standard (210X297) Mm)