CN110683208A

CN110683208A - Multi-layer cover tape construction

Info

Publication number: CN110683208A
Application number: CN201810742093.3A
Authority: CN
Inventors: 朱燚磊; 拉尔夫·R·罗伯茨; 艾军; 沈时骏
Original assignee: 3M Innovative Properties Co
Current assignee: 3M Innovative Properties Co
Priority date: 2018-07-06
Filing date: 2018-07-06
Publication date: 2020-01-14
Also published as: WO2020008369A1; KR20210029769A; TW202006094A

Abstract

The present invention provides a carrier tape article that includes a heat-sealable cover tape and a carrier tape having a plurality of pockets. The multi-layer cover tape includes a thermoplastic base layer, a thermoplastic cushion layer, an antistatic layer, and a heat seal layer. The antistatic layer has a polymer binder or copolymer binder and PEDOT-PSS (poly-3, 4-ethylenedioxythiophene-polystyrene sulfonic acid) dispersed within the polymer binder or copolymer binder. The sealing layer is a heat activated adhesive.

Description

Multi-layer cover tape construction

Technical Field

The present disclosure relates to heat-sealable cover tapes for electronic component packaging applications. In particular, the cover tape can be heat sealed to the carrier tape to facilitate storage, transport, and mounting of small electronic components.

Background

As electronic parts become more miniaturized, the storage, transportation and handling of such parts becomes more difficult and specialized processes have evolved. One such method is the use of a carrier tape. The carrier tape may be formed from a variety of materials, but is typically a plastic material formed as a strip having a plurality of longitudinal depressions or recesses intended to hold the various components from contacting each other or otherwise being damaged. Such recessed portions must have an upper opening through which the component is placed into the recess, and then the opening must typically be sealed with a cover tape.

One material proposed for cover tapes used in stamped carrier tapes is a multi-layer laminated polymer foam structure, as described in U.S. patent 4,657,137. The cover tape requires the use of at least two separate layers and is prepared by providing a flexible thin plastic or foam layer to which a strong and stable base layer is laminated.

The carrier tape disclosed in us patent 4,964,405 has a cover tape affixed with an adhesive that seals only the depressions and keeps the guide perforations open.

Cover tapes commonly used for carrier tapes have, for example, a nylon-based substrate at least partially coated with an adhesive such as ethylene/vinyl acetate. See, for example, U.S. patent 4,963,405.

One challenge with the use of carrier tapes and cover tapes is providing a suitable cover tape that seals individual components without contaminating the adhesive or debonding agent in some manner. The carrier tape or cover tape must also provide some protection against the development of static electricity, which can damage such delicate electronic components; in fact, winding and unwinding of cover tapes can exacerbate such problems by generating static charges. Cover tapes are typically made with static dissipative tapes derived from vapor coated metals in the middle of the adhesive. The tape covers the adhesive and protects the component from the electrical discharge by draining the triboelectric charge that forms. However, such strips are opaque, which means that the component cannot be viewed in its recess, and they are very expensive.

In us patent 6,171,672, an electrostatic dissipative coating is disclosed that contains carbon, cationic, anionic and non-specific organic polymeric conductors. Ionic salts are not permanent coatings and can leach out, adding to the contamination problem. Furthermore, they are humidity dependent and can be corrosive. Furthermore, such carbon and metals are opaque. In U.S. patent publication 2003/0049437, a cover tape is described that includes a conductive coating containing a dispersion of a conductive polymer.

Disclosure of Invention

The present disclosure relates to heat-sealable cover tapes for electronic component packaging applications. In particular, the cover tape can be heat sealed to the carrier tape to facilitate storage, transport, and mounting of small electronic components. The present disclosure includes a cover tape. In some embodiments, a cover tape includes a base layer, a cushion layer, an antistatic layer, and a sealing layer. The base layer has a first major surface and a second major surface and comprises a thermoplastic polymer having a thickness of 10-20 microns. The mat layer has a first major surface and a second major surface, wherein the first major surface of the mat layer is in contact with or adhesively bonded to the second major surface of the base layer, and the mat layer comprises a polymeric or copolymeric thermoplastic composition having a thickness of 20 to 35 micrometers. The antistatic layer has a first major surface and a second major surface, wherein the first major surface is in contact with the second major surface of the underlayer, and the antistatic layer comprises a polymeric binder or copolymer binder and PEDOT-PSS (poly-3, 4-ethylenedioxythiophene-polystyrene sulfonic acid) dispersed within the polymeric binder or copolymer binder, wherein the PEDOT-PSS is 5-30 wt% of the antistatic layer. The sealing layer has a first major surface and a second major surface, wherein the first major surface of the sealing layer is in contact with the second major surface of the antistatic layer, and the sealing layer comprises a heat-activated adhesive, wherein the heat-activated adhesive comprises a polymer composition or a copolymer composition having a thickness of 0.5 to 2.0 micrometers. The cover tape has a heat activated bond range of at least 135 ℃ and retains a cover tape peel adhesion force when exposed to conditions of time, temperature, humidity, or a combination thereof, and has a 10 as measured on the second major surface of the sealing layer at a temperature of 23 ℃ and a relative humidity of 50%⁶-10¹¹Ohmic Sheet Resistance (SR) value.

Articles of manufacture are also disclosed. In some embodiments, an article comprises: a carrier tape including a plurality of pits; and a cover tape bonded to the carrier tape and sealing the plurality of pockets. The cover tape is as described above.

Drawings

The present disclosure may be more completely understood in consideration of the following detailed description of various embodiments of the disclosure in connection with the accompanying drawings.

Fig. 1 shows a cross-sectional view of an exemplary embodiment of a multi-layer cover tape of the present disclosure.

Fig. 2 illustrates a cross-sectional view of an exemplary embodiment of a multilayer carrier tape construction of the present disclosure.

In the following description of the illustrated embodiments, reference is made to the accompanying drawings in which is shown by way of illustration various embodiments in which the disclosure may be practiced. It is to be understood that embodiments may be utilized and structural changes may be made without departing from the scope of the present disclosure. The figures are not necessarily to scale. Like numbers are used in the drawings to indicate like parts. It should be understood, however, that the use of a number to indicate a component in a given figure is not intended to limit the component in another figure labeled with the same number.

Detailed Description

As electronic parts become more miniaturized, the storage, transportation and handling of such parts becomes more difficult and specialized processes have evolved. One such method is the use of a carrier tape. The carrier tape may be formed from a variety of materials, but is typically a plastic material formed as a strip having a plurality of longitudinal depressions or recesses intended to hold the various components from contacting each other or otherwise being damaged. Such recessed portions are commonly referred to as "pockets" and have an upper opening through which the component is placed into the recess, which is then typically sealed with a cover tape.

In addition to the properties required for typical tapes, cover tape construction requires a number of special features, such as sealing at relatively low temperatures, stable peel values over time to allow consistent removal, and the like. These special features include having conductive layers in the cover tape to prevent triboelectrification when the cover tape is attached to or removed from the carrier tape.

Typically, cover tape constructions are multi-layer articles, and thus interlayer adhesion is an important consideration. In other words, when used, the tape construction must be held together when applied to a carrier tape, transported or stored, and the cover tape removed from the carrier tape. The entire cover tape construction may fail if any of the layers in the cover tape easily disintegrate or lose integrity. In particular, the conductive layer (also referred to as an antistatic layer) may be susceptible to environmental conditions. Environmental conditions that may be encountered with cover tapes are heat and/or a combination of heat and humidity. It is desirable that the peel adhesion values of cover tapes remain stable over time, even when exposed to various environmental conditions. In this context, a stable peel value means that the initial peel adhesion value and the aged peel adhesion value are very similar and do not experience a substantial decrease indicating a loss of integrity of one or more layers within the construction of the cover tape. Accordingly, it is desirable to develop cover tapes that not only have desirable adhesive properties (such as relatively low sealing temperatures and stable peel values over time to allow for consistent removal), but also have conductive, antistatic layers that are stable when exposed to humid conditions.

In the present disclosure, cover tapes and carrier tape constructions using cover tapes will be described. The cover tape is a multi-layer construction that includes a base layer, a cushion layer, an antistatic layer, and a sealing layer. The cover tape has a heat activated bond range as low as 135 ℃ and retains a cover tape peel adhesion force when exposed to conditions of time, temperature, humidity, or a combination thereof, and has a 10 as measured on the second major surface of the sealing layer at a temperature of 23 ℃ and a relative humidity of 50%⁶-10¹¹Ohmic Sheet Resistance (SR) value. Maintaining a peel adhesion value when exposed to conditions of time, temperature, humidity, or a combination thereof means that the peel adhesion remains substantially unchanged over a range of time, temperature, and humidity conditions. Although some variation in peel adhesion is certainly contemplated, the initial peel adhesion and the peel adhesion after exposure to time, temperature, humidity, or a combination thereof are generally similar and not significantly reduced. A significant reduction in peel adhesion upon exposure to time, temperature, or humidity conditions indicates that one or more layers of the cover tape (typically the antistatic layer) are unstable. Although cover tapes can withstand various time, temperature, and humidity conditions, they are suitable for use in applicationsSome typical ranges for these cover tape configurations. As for the aging time, it is common for the aging time to be several days, in some embodiments up to 30 days or more. As for the aging temperature, the temperature is usually in the range of room temperature to 60 ℃. As for humidity, the humidity is generally in the range of typical ambient humidity of 50% RH (relative humidity) to high humidity conditions such as 95% RH. Combinations of elevated temperatures (above room temperature) and humidity levels are also possible, such as 52 ℃ and 95% RH. Cover tapes and carrier tape constructions utilizing cover tapes are described in more detail below.

Unless otherwise indicated, all numbers expressing feature sizes, amounts, and physical characteristics used in the specification and claims are to be understood as being modified in all instances by the term "about". Accordingly, unless indicated to the contrary, the numerical parameters set forth in the foregoing specification and attached claims are approximations that can vary depending upon the desired properties sought to be obtained by those skilled in the art utilizing the teachings disclosed herein. The recitation of numerical ranges by endpoints includes all numbers subsumed within that range (e.g. 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4, and 5) and any range within that range.

As used in this specification and the appended claims, the singular forms "a", "an", and "the" encompass embodiments having plural referents, unless the content clearly dictates otherwise. For example, reference to "a layer" encompasses embodiments having one layer, two layers, or more layers. Unless the context clearly dictates otherwise, as used in this specification and the appended claims, the term "or" is generally employed in its sense including "and/or".

As used herein, the term "adhesive" refers to a polymeric composition that can be used to adhere two adherends together. Examples of adhesives are heat activated adhesives and pressure sensitive adhesives.

Heat activated adhesives are not tacky at room temperature but become tacky and capable of bonding to a substrate at elevated temperatures. T of these binders_g(glass transition temperature) or melting point (T)_m) Is usually higher thanAnd (4) room temperature. When the temperature rises above T_gOr T_mWhen this happens, the storage modulus generally decreases and the adhesive becomes tacky.

Those of ordinary skill in the art are familiar with pressure sensitive adhesive compositions having properties including: (1) strong and durable tack, (2) adhesion with light finger pressure, (3) ability to remain sufficiently on the adherend, and (4) sufficient cohesive strength to be cleanly removed from the adherend. Materials that have been found to function well as pressure sensitive adhesives are polymers designed and formulated to exhibit the requisite viscoelastic properties resulting in a desired balance of tack, peel adhesion, and shear holding power. Obtaining the proper balance of properties is not a simple method.

The term "(meth) acrylate" refers to a monomeric acrylate or methacrylate of an alcohol. Acrylate and methacrylate monomers or oligomers are generally referred to herein as "(meth) acrylates". Materials referred to as "(meth) acrylate functional" are materials that contain one or more (meth) acrylate groups.

The terms "Tg" and "glass transition temperature" are used interchangeably. If measured, Tg values are determined by Differential Scanning Calorimetry (DSC) at a scan rate of 10 deg.C/minute, unless otherwise indicated. Typically, the Tg value of the copolymer is not measured, but is calculated using the well-known Fox equation using the monomer Tg value provided by the monomer supplier, as will be appreciated by those skilled in the art.

As used herein, the term "conductivity" means a measure of the ability of a charge to move within a material. "resistivity" is the inverse of conductivity.

As used herein, the term "cover tape" refers to a tape that is intended to be adhered to the surface of a carrier tape that has recessed portions for receiving and transporting chips and other sensitive electronic components.

As used herein, the term "recessed portion" refers to a separate carrier, such as a pocket or cup-shaped groove formed in a carrier tape, that is typically used to hold a single unit of a certain product. Such portions are typically formed by vacuum forming, thermoforming, molding, or other known processes.

As used herein, the terms "room temperature" or "ambient temperature" are used interchangeably and refer to a temperature of from 20 ℃ to 25 ℃.

As used herein, the term "adjacent" when referring to two layers means that the two layers are adjacent to each other with no intervening open space therebetween. They may be in direct contact with each other (e.g., laminated together) or there may be intervening layers.

All percentages, ratios, and amounts herein are by weight unless otherwise specified.

Cover tapes are disclosed herein. The cover tape is a multi-layer construction that includes a base layer, a cushion layer, an antistatic layer, and a sealing layer. Each of these layers will be described in detail.

The base layer has a first major surface and a second major surface and comprises a thermoplastic polymer. A variety of thermoplastic polymers are suitable. Suitable polymers include polyethylene terephthalate polymers or polyimide thermoplastics. Polyethylene terephthalate polymers are particularly suitable due to their wide availability and desirable characteristics. The base layer can have any suitable thickness, typically a thickness in the range of 10-20 microns.

The second major surface of the base layer is adjacent to the underlying layer described below. The base layer may be in contact with the backing layer or adhesively bonded to the backing layer. The first major surface of the base layer may be unmodified or it may comprise a wide variety of coatings or layers. Examples of suitable layers or coatings that may be in contact with the first major surface of the base layer include hard coatings such as scratch resistant coatings or release coatings such as release coatings. A variety of release coatings are suitably disposed on the first major surface of the base layer. Particularly suitable release coatings include materials such as are used on the back of rolled strip products to allow the strip to be rolled up and left intact, and then unwound at the time of use. Such materials are sometimes referred to as low adhesion backsizes or LABs. A wide variety of LABs have been developed for use with a wide variety of adhesives. Examples of suitable LAB or release coatings suitable for use in the construction of cover tapes of the present disclosure include water-based fluorochemical materials described in U.S. Pat. No. 7,411,020(Carlson et al), silicone release coatings described in U.S. Pat. No. 5,753,346(Leir et al), release compositions described in U.S. Pat. No. 7,229,687(Kinning et al), polyethylene N-alkyl urethanes (polyurethanes) described in U.S. Pat. No. 2,532,011(Dalquist et al), moisture curable materials described in U.S. Pat. No. 6,204,350(Liu et al), and organopolysiloxane-polyurea copolymer release agents described in U.S. Pat. No. 5,290,615(Tushaus et al).

The multi-layer cover tape construction also includes a cushion layer. The mat layer has a first major surface and a second major surface, wherein the first major surface of the mat layer is adjacent to the second major surface of the base layer as described above. In this context, adjacent to the second major surface of the base layer means that the first major surface of the cushion layer is in contact with the second major surface of the base layer or that the first major surface of the cushion layer is adhesively bonded to the second major surface of the base layer.

A variety of thermoplastic materials of polymers or copolymers may be used in the backing layer. In many embodiments, the underlayment comprises an ethylene-based polymer or copolymer. Examples of suitable ethylene-based polymers or copolymers include ethylene-vinyl acetate copolymers, polyethylene, blends of ethylene-vinyl acetate copolymers and polyethylene, and alternating layers of polyethylene and ethylene-vinyl acetate. In some embodiments, the ethylene-based polymer or copolymer comprises an ethylene-vinyl acetate copolymer containing 10 to 30 weight percent vinyl acetate.

The underlayer can have a wide range of suitable thicknesses. In some embodiments, the underlayer has a thickness of 20 to 35 microns.

In some embodiments, the base layer and cushion layer may be separately formed layers that are laminated or adhesively bonded together to form a composite construction. In other embodiments, the composite construction comprising the base layer and the underlayment layer are commercially available and may be used in the as-purchased state without the need to assemble the layers. Examples of commercially available composite constructions comprising layers of polyethylene terephthalate and ethylene/ethylene vinyl acetate blends include those obtained from Zhonghe Tongshhen Lamination and Wangzhe Plastic packaging Inc. (WangzheLamination), as described in the examples section.

The multi-layer cover tape also includes an antistatic layer. The antistatic layer has a first major surface and a second major surface. The first major surface of the antistatic layer is in contact with the second major surface of the cushion layer. The antistatic layer comprises a polymer binder or copolymer binder and conductive particles dispersed within the polymer binder or copolymer binder.

Typically the conductive particles comprise PEDOT-PSS (poly-3, 4-ethylenedioxythiophene-polystyrene sulfonic acid) particles, although a variety of different types of conductive particles may be used, such as carbon nanotubes, antimony doped metal oxide particles or carbon black particles. PEDOT-PSS is a polymer blend of two ionomers. One component of the mixture is comprised of sodium polystyrene sulfonate, which is a sulfonated polystyrene. Part of the sulfonyl groups are deprotonated and carry a negative charge. The other component, poly (3, 4-ethylenedioxythiophene) or PEDOT, is a conjugated polymer, positively charged and based on polythiophenes. The charged macromolecules together form a macromolecular salt. PEDOT-PSS is commercially available as an aqueous dispersion.

In some embodiments, the antistatic layer comprises 5 to 30 wt% of conductive particles, typically PEDOT-PSS. Weight percent is calculated on a dry basis, which means percent refers to the material in the coating that has been dried to remove any volatile components such as solvent or water.

A variety of polymer and copolymer materials are suitable as binders for the antistatic layer. Typically, the binder material comprises a modified acrylate polymer or copolymer, a styrene-based polymer or copolymer, or a combination thereof. In some embodiments, the polymeric binder or copolymer binder of the antistatic layer comprises a modified acrylate polymer or copolymer. In other embodiments, the polymeric binder or copolymer binder of the antistatic layer comprises a styrene-based polymer or copolymer. In other embodiments, the polymeric binder or copolymer binder comprises an acrylate-styrene copolymer. In some embodiments, the antistatic layer binder is a modified styrene copolymer commercially available as NEOCRYL A-1091 from DSM corporation of Wilmington, Mass (DSM, Wilmington, MA). Typically, the polymeric binder or copolymer binder of the antistatic layer is water soluble or water dispersible.

As described above, sensitivity to heat and humidity is a serious problem for the antistatic layer, and thus it is desirable that the polymer binder or copolymer binder layer material is a moisture-resistant material. Moisture resistance can be defined or measured in a variety of ways. In the present disclosure, the polymeric or copolymeric binder layer material is a moisture resistant material such that, when immersed in water for 24 hours, the water uptake is less than 5% by weight.

In some specific embodiments, the antistatic layer is a dried layer formed from a dispersion mixture comprising an aqueous dispersion of a polymeric or copolymeric binder and an aqueous dispersion of PEDOT-PSS (poly-3, 4-ethylenedioxythiophene-polystyrene sulfonic acid), wherein the polymeric or copolymeric binder material is a moisture resistant material such that, when immersed in water for 24 hours, the uptake of water is less than 5% by weight.

The cover tape also includes a sealing layer. The sealing layer provides the adhesive properties of the cover tape, just as the antistatic layer provides antistatic properties to the cover tape. The sealing layer has a first major surface and a second major surface, wherein the first major surface of the sealing layer is in contact with the second major surface of the antistatic layer. The sealing layer is a heat-activated adhesive layer that is capable of adhering the cover tape to the carrier tape to form a carrier tape construction. Heat activated adhesives are not tacky at room temperature but become tacky and capable of bonding to a substrate at elevated temperatures. T of these binders_g(glass transition temperature) or melting point (T)_m) Typically above room temperature. When the temperature rises above T_gOr T_mWhen this happens, the storage modulus generally decreases and the adhesive becomes tacky.

Various heat-activated adhesives are suitable for use in cover tapes. Particularly suitable heat-activated adhesives are those that provide the desired characteristics of a cover tape with a relatively low hot-tack temperature and also provide consistent peel adhesion, meaning that the peel adhesion does not change with time, temperature, humidity, or a combination of these factors. Typically, the heat-activated adhesive provides a heat-activated bonding range for the cover tape that is as low as 135 ℃ or, in other words, the heat-activated adhesive provides a heat-activated bonding range temperature for the cover tape that is at least 135 ℃. While it is generally desirable to heat seal the cover tape constructions of the present disclosure at temperatures as low as 135 ℃, in some embodiments, it may be suitable to heat seal the cover tape constructions at temperatures ranging from 135 ℃ to 170 ℃ or even from 140 ℃ to 160 ℃.

A variety of polymeric or copolymeric materials are suitable for use in the heat activated adhesive composition of the sealing layer. Particularly suitable heat-activated adhesive compositions comprise at least one (meth) acrylate-based polymer or copolymer. In some embodiments, the at least one (meth) acrylate-based polymer or copolymer comprises a (meth) acrylate polymer or copolymer having a weight average molecular weight of 50,000-100,000 g/mole. In other embodiments, the at least one (meth) acrylate-based polymer or copolymer comprises a mixture of at least two (meth) acrylate polymers or copolymers comprising a (meth) acrylate polymer or copolymer having a weight average molecular weight of 50,000-100,000 g/mole and a (meth) acrylate polymer or copolymer having a weight average molecular weight of 100,000-200,000 g/mole.

In addition to the polymer or copolymer components described above, the heat activated adhesive composition may also include one or more additional components. Examples of suitable additional components include tackifiers, plasticizers, stabilizers, and fillers. Examples of fillers include particulate fillers such as silica particles or polymer beads. Examples of polymeric beads include, for example, polyacrylate beads. The additional components can be present in any suitable amount. In some embodiments, the particulate filler comprising silica polymers or polymer beads is present in the heat activated adhesive composition from about 5 to 20 weight percent.

The sealing layer may have a wide range of suitable thicknesses. Typically, the sealing layer thickness is in the range of 0.5-2.0 microns thick.

Disclosed herein are multi-layer cover tape constructions having antistatic properties that are stable over time, temperature, and humidity, and having desirable bonding properties. The cover tape has a temperature of, for example, 23 deg.C10 measured at temperature and 50% relative humidity on the second major surface of the sealing layer⁶-10¹¹Ohmic Sheet Resistance (SR) value. In addition, the cover tape has a heat activated bond range temperature of at least 135 ℃ and a peel adhesion that is maintained when exposed to time, temperature, and humidity conditions. In some embodiments, the cover tape has a peel adhesion value of 30-70gf (gram force) from the carrier tape. As noted above, the retention of peel adhesion means that the initial peel adhesion value and the aged peel adhesion value are very similar without significant reduction. While cover tapes can withstand various time, temperature, and humidity conditions, there are typical ranges that apply to these cover tape constructions. The range of aging conditions can be modeled or simulated in various ways, and a range of aging conditions is desirable. As for the aging time, it is common for the aging time to be several days, in some embodiments up to 30 days or more. As for the aging temperature, the temperature is usually in the range of room temperature to 60 ℃. As for humidity, the humidity is generally in the range of typical ambient humidity of 50% RH (relative humidity) to high humidity conditions such as 95% RH. Combinations of elevated temperatures (above room temperature) and humidity levels are also possible, such as 52 ℃ and 95% RH.

Also disclosed herein are articles comprising a carrier tape having a plurality of pockets and a cover tape bonded to the carrier tape and sealing the plurality of pockets or recessed portions. Cover tapes have been described above and include: a base layer having a first major surface and a second major surface, the base layer comprising a thermoplastic polymer having a thickness of 10 to 20 micrometers; a backing layer having a first major surface and a second major surface, wherein the first major surface of the backing layer is in contact with or adhesively bonded to the second major surface of the base layer, and the backing layer comprises a polymeric or copolymeric thermoplastic composition having a thickness of 20 to 35 micrometers; an antistatic layer having a first major surface and a second major surface, wherein the first major surface is in contact with the second major surface of the underlayer, and the antistatic layer comprises a polymeric binder or copolymer binder and PEDOT-PSS (poly-3, 4-ethylenedioxythiophene-polystyrene sulfonic acid) dispersed within the polymeric binder or copolymer binder, wherein the PEDOT-PSS5-30 wt% of the antistatic layer; and a sealing layer having a first major surface and a second major surface, wherein the first major surface of the sealing layer is in contact with the second major surface of the antistatic layer, and the sealing layer comprises a heat-activated adhesive, wherein the heat-activated adhesive comprises a polymer composition or a copolymer composition having a thickness of 0.5 to 2.0 micrometers. The cover tape has a heat activated bond range of at least 135 ℃ and retains a cover tape peel adhesion force when exposed to conditions of time, temperature, humidity, or a combination thereof, and has a 10 as measured on the second major surface of the sealing layer at a temperature of 23 ℃ and a relative humidity of 50%⁶-10¹¹Ohmic Sheet Resistance (SR) value.

Carrier tapes are well understood in the electronics art. Typically, the carrier tape is made of a thermoplastic polymer material. In some embodiments, the support tape comprises a polystyrene or polycarbonate support tape.

Typically, electronic components are placed in carrier tape pockets and cover tapes are placed over the openings of the pockets in the carrier tape and then heat sealed. Heat sealing is performed at a temperature suitable to form a stable bond between the cover tape and the carrier tape. The carrier tape is typically sealed at a temperature of at least 135 ℃. In some embodiments, the carrier tape is sealed at a temperature of 135 ℃ to 170 ℃, 135 ℃ to 160 ℃, or even 140 ℃ to 160 ℃.

When the electronic components in the carrier tape configuration are delivered to their desired locations, the cover tape is removed to allow removal of the electronic components. To facilitate this process, it is desirable that the heat seal bond be stable over time, meaning that the adhesion of the heat seal bond does not change significantly over time. It is desirable that the peel adhesion is in the range of 30 to 70 gram force (gf).

The present disclosure may be further understood by reference to the following drawings. An embodiment of a multi-layer cover tape is shown in fig. 1. Fig. 1 is a cross-sectional view of a cover tape 100 that includes a base polymer layer 110, a backing polymer layer 120, an antistatic layer 130, and a heat seal layer 140. These layers are merely exemplary and are not drawn to scale. Each of these layers has been further described above.

Fig. 2 shows a top view of a carrier tape construction 200 comprising recessed pockets 210 that receive electronic components 230, and a cover tape 220 that covers and seals the electronic components 230 in the recessed pockets 210.

The present disclosure includes the following embodiments:

these embodiments relate to cover tapes. Embodiment 1 is a cover tape comprising: a base layer having a first major surface and a second major surface, the base layer comprising a thermoplastic polymer having a thickness of 10 to 20 micrometers; a backing layer having a first major surface and a second major surface, wherein the first major surface of the backing layer is in contact with or adhesively bonded to the second major surface of the base layer, the backing layer comprising a polymeric or copolymeric thermoplastic composition having a thickness of from 20 to 35 micrometers; an antistatic layer having a first major surface and a second major surface, wherein the first major surface is in contact with the second major surface of the underlayer, the antistatic layer comprising a polymeric binder or copolymer binder and PEDOT-PSS (poly-3, 4-ethylenedioxythiophene-polystyrene sulfonic acid) dispersed within the polymeric binder or copolymer binder, wherein the PEDOT-PSS comprises 5 to 30 wt% of the antistatic layer; and a sealing layer having a first major surface and a second major surface, wherein the first major surface of the sealing layer is in contact with the second major surface of the antistatic layer, the sealing layer comprising a heat-activated adhesive composition, wherein the heat-activated adhesive composition comprises a polymer composition or a copolymer composition having a thickness of 0.5 to 2.0 micrometers; and wherein the cover tape has a heat activated bond range of at least 135 ℃, the cover tape retains peel adhesion when exposed to conditions of time, temperature, humidity, or a combination thereof, and the cover tape has a 10 as measured on the second major surface of the sealing layer at a temperature of 23 ℃ and a relative humidity of 50 percent⁶-10¹¹Ohmic Sheet Resistance (SR) value.

Embodiment 2 is the cover tape of embodiment 1, wherein the base layer comprises a polyethylene terephthalate polymer or a polyimide thermoplastic.

Embodiment 3 is the cover tape of embodiment 1 or 2, wherein the cushion layer comprises an ethylene-based polymer or copolymer.

Embodiment 4 is the cover tape of embodiment 3, wherein the ethylene-based polymer or copolymer comprises ethylene-vinyl acetate copolymer, polyethylene, a blend of ethylene-vinyl acetate copolymer and polyethylene, or alternating layers of polyethylene and ethylene-vinyl acetate.

Embodiment 5 is the cover tape of embodiment 3, wherein the ethylene-based polymer or copolymer comprises an ethylene-vinyl acetate copolymer comprising 10-30 wt.% vinyl acetate.

Embodiment 6 is the cover tape of any of embodiments 1-5, wherein the polymeric binder or copolymer binder of the antistatic layer comprises a modified acrylate polymer or copolymer, a styrene-based polymer or copolymer, or a combination thereof.

Embodiment 7 is the cover tape of embodiment 6, wherein the polymeric binder or copolymer binder of the antistatic layer comprises a modified acrylate polymer or copolymer.

Embodiment 8 is the cover tape of embodiment 6, wherein the polymer binder or copolymer binder of the antistatic layer comprises a styrene-based polymer or copolymer.

Embodiment 9 is the cover tape of embodiment 6, wherein the polymeric binder or copolymer binder comprises an acrylate-styrene copolymer.

Embodiment 10 is the cover tape of any one of embodiments 1-9, wherein the antistatic layer is a dried layer formed from a dispersion mixture comprising: an aqueous dispersion of a polymeric or copolymeric binder; and aqueous dispersions of PEDOT-PSS (poly-3, 4-ethylenedioxythiophene-polystyrenesulfonic acid); wherein the polymeric binder or copolymeric binder material is a moisture resistant material such that, when immersed in water for 24 hours, the uptake of water is less than 5% by weight.

Embodiment 11 is the cover tape of any of embodiments 1-10, wherein the heat-activated adhesive composition of the sealing layer comprises at least one (meth) acrylate-based polymer or copolymer.

Embodiment 12 is the cover tape of embodiment 11, wherein the at least one (meth) acrylate-based polymer or copolymer comprises a (meth) acrylate polymer or copolymer having a weight average molecular weight of 50,000-100,000 g/mole.

Embodiment 13 is the cover tape of embodiment 11, wherein the at least one (meth) acrylate-based polymer or copolymer comprises a mixture of at least two (meth) acrylate polymers or copolymers comprising a (meth) acrylate polymer or copolymer having a weight average molecular weight of 50,000-100,000 g/mole and a (meth) acrylate polymer or copolymer having a weight average molecular weight of 100,000-200,000 g/mole.

Embodiment 14 is the cover tape of any of embodiments 1-13, wherein the heat-activated adhesive composition further comprises a particulate filler present at about 5-20 wt%, the particulate filler comprising silica particles or polymer beads.

Articles of manufacture are also disclosed. Embodiment 15 is an article comprising: a carrier tape including a plurality of pits; and a cover tape bonded to the carrier tape and sealing the plurality of pockets; wherein this cover tape includes: a base layer having a first major surface and a second major surface, the base layer comprising a thermoplastic polymer having a thickness of 10 to 20 micrometers; a backing layer having a first major surface and a second major surface, wherein the first major surface of the backing layer is in contact with or adhesively bonded to the second major surface of the base layer, the backing layer comprising a polymeric or copolymeric thermoplastic composition having a thickness of from 20 to 35 micrometers; an antistatic layer having a first major surface and a second major surface, wherein the first major surface is in contact with the second major surface of the underlayer, the antistatic layer comprising a polymeric binder or copolymer binder and PEDOT-PSS (poly-3, 4-ethylenedioxythiophene-polystyrene sulfonic acid) dispersed within the polymeric binder or copolymer binder, wherein the PEDOT-PSS comprises 5 to 30 wt% of the antistatic layer; and a sealing layer, the sealingThe layer has a first major surface and a second major surface, wherein the first major surface of the sealing layer is in contact with the second major surface of the antistatic layer, the sealing layer comprising a heat-activated adhesive composition, wherein the heat-activated adhesive composition comprises a polymer composition or a copolymer composition having a thickness of 0.50 to 2.0 micrometers; and wherein the cover tape has a heat activated bond range of at least 135 ℃, the cover tape retains peel adhesion when exposed to conditions of time, temperature, humidity, or a combination thereof, and the cover tape has a 10 as measured on the second major surface of the sealing layer at a temperature of 23 ℃ and a relative humidity of 50 percent⁶-10¹¹Ohmic Sheet Resistance (SR) value.

Embodiment 16 is the article of embodiment 15, wherein the carrier tape comprises a polycarbonate or polystyrene carrier tape.

Embodiment 17 is the article of embodiment 15 or 16, wherein the cover tape has a peel value from a carrier tape sealed at a temperature of at least 135 ℃ in the range of 30 to 70 grams-force (gf).

Embodiment 18 is the article of any one of embodiments 15-17, wherein the base layer comprises a polyethylene terephthalate polymer or a polyimide thermoplastic.

Embodiment 19 is the article of any one of embodiments 15-18, wherein the cushion layer comprises an ethylene-based polymer or copolymer.

Embodiment 20 is the article of embodiment 19, wherein the ethylene-based polymer or copolymer comprises an ethylene-vinyl acetate copolymer, a polyethylene, a blend of an ethylene-vinyl acetate copolymer and a polyethylene, or alternating layers of a polyethylene and an ethylene-vinyl acetate.

Embodiment 21 is the article of embodiment 19, wherein the ethylene-based polymer or copolymer comprises an ethylene-vinyl acetate copolymer comprising 10 to 30 weight percent vinyl acetate.

Embodiment 22 is the article of any of embodiments 15-21, wherein the polymeric binder or copolymer binder of the antistatic layer comprises a modified acrylate polymer or copolymer, a styrene-based polymer or copolymer, or a combination thereof.

Embodiment 23 is the article of embodiment 22, wherein the polymeric binder or copolymer binder of the antistatic layer comprises a modified acrylate polymer or copolymer.

Embodiment 24 is the article of embodiment 22, wherein the polymer binder or copolymer binder of the antistatic layer comprises a styrene-based polymer or copolymer.

Embodiment 25 is the article of embodiment 22, wherein the polymeric binder or copolymer binder comprises an acrylate-styrene copolymer.

Embodiment 26 is the article of any one of embodiments 15-25, wherein the antistatic layer is a dried layer formed from a dispersion mixture comprising: an aqueous dispersion of a polymeric or copolymeric binder; and aqueous dispersions of PEDOT-PSS (poly-3, 4-ethylenedioxythiophene-polystyrenesulfonic acid); wherein the polymeric binder or copolymeric binder material is a moisture resistant material such that, when immersed in water for 24 hours, the uptake of water is less than 5% by weight.

Embodiment 27 is the article of any of embodiments 15-26, wherein the heat activated adhesive composition of the sealing layer comprises at least one (meth) acrylate based polymer or copolymer.

Embodiment 28 is the article of embodiment 27, wherein the at least one (meth) acrylate-based polymer or copolymer comprises a (meth) acrylate polymer or copolymer having a weight average molecular weight of 50,000-100,000 g/mole.

Embodiment 29 is the article of embodiment 27, wherein the at least one (meth) acrylate-based polymer or copolymer comprises a mixture of at least two (meth) acrylate polymers or copolymers comprising a (meth) acrylate polymer or copolymer having a weight average molecular weight of 50,000-100,000 g/mole and a (meth) acrylate polymer or copolymer having a weight average molecular weight of 100,000-200,000 g/mole.

Embodiment 30 is the article of any of embodiments 15-29, wherein the heat activated adhesive composition further comprises a particulate filler present from about 5 to 20 weight percent, the particulate filler comprising silica particles or polymer beads.

Embodiment 31 is the article of any one of embodiments 15-30, wherein the heat activated bond ranges from 135 ℃ to 170 ℃.

Embodiment 32 is the article of any one of embodiments 15-30, wherein the heat activated bond ranges from 135 ℃ to 160 ℃.

Embodiment 33 is the article of any one of embodiments 15-30, wherein the heat activated bond ranges from 140 ℃ to 160 ℃.

Embodiment 34 is the article of any one of embodiments 15-33, wherein the peel adhesion is maintained for up to 30 days.

Embodiment 35 is the article of any of embodiments 15-34, wherein the cover tape maintains peel adhesion upon exposure to temperatures up to 60 ℃.

Embodiment 36 is the article of any of embodiments 15-34, wherein the cover tape maintains peel adhesion when exposed to a temperature of up to 52 ℃ and a relative humidity of up to 95%.

Examples

Examples and comparative examples provided below are helpful in understanding the present disclosure, and should not be construed as limiting the scope of the present disclosure. All parts, percentages, ratios, etc. in the examples and the remainder of the specification are by weight unless otherwise indicated, and all reagents used in the examples were obtained or purchased from general chemical suppliers such as Sigma Aldrich corp, saint louis, MO, US, st.

The following abbreviations are used in this section: DEG C is centigrade, J/cm²Joule per square centimeter, min-min, ft/min-ft/min, m/min-m/min, V-volt, em-centimeter, g-gram, gf-gram, μm-micrometer, wt% >, and weight%.

Sample preparationPreparation process

Base layer and cushion layer

Exemplary cover tapes were prepared using a substrate consisting of a biaxially oriented polyethylene terephthalate (BOPET) base layer and an Ethylene Vinyl Acetate (EVA) backing layer (ITF 0160 available from Yixing Wangzhe molding, inc., jiang shangsu, China). The substrate contained 18 mass% VA and had a vicat softening temperature of 56 ℃ (data from the manufacturer).

Antistatic layer

Antistatic layer AS-1 was prepared by adding 550g of water to 50g of ORGACON ICP 1010 (PEDOT-PSS dispersion with 1.22 wt% solids, available from AGFA Specialty Products, Mortsel, Belgium) by Mozel Belgium). To this mixture was slowly added 25g of NEOCRYL A-1091 (a modified styrene copolymer dispersion with 44% solids, available from Dismann engineering Plastics, Genk, Belgium, Henkel) with stirring to form a stable blue dispersion. Upon coating and drying, the dispersion produced an antistatic coating with 94.7% copolymer binder.

The dispersion was roll-to-roll coated onto the EVA side of the substrate by a contact reverse coating method. Using a volume factor of 19.8cm³/m²Three spiral pattern intaglio bars (gravure bar). Before coating, the substrate was exposed to a radiation at 5.17J/cm²In-line nitrogen corona treatment at power level. The line speed was 10ft/min (3m/min) and the gravure roll speed was 15ft/min (4.6 m/min). After coating, the film was passed through a 3-stage drying oven set at 65 ℃,65 ℃ and 75 ℃, respectively.

Antistatic layer AS-2 was prepared by adding 50g of water and 350g of isopropanol to 50g of ORGACON ICP 1010 with stirring. This dispersion was coated onto a substrate under the same conditions AS for production of AS-1, except that no corona treatment was used.

An antistatic layer AS-3 was prepared in the same manner AS the antistatic layer AS-1, with the following modifications. The dispersion was roll-to-roll coated onto the EVA side of the substrate using a line speed of 6m/min and a gravure roll speed of 12 m/min. After coating, the film was passed through a 4-stage drying oven set at 50 ℃, 55 ℃, 60 ℃ and 65 ℃, respectively.

Sealing layer

Tables 1-4 list the polymers used in the sealant layer and the formulation of the sealant layer. Sealant layer formulations SL1, SL2, SL3, and SL4 included SSX-102 beads (highly crosslinked, spherical particles of polymethyl methacrylate with an average diameter of 2 μm, available from Sekisui Plastics, Tokyo, Japan). Ethyl acetate (EtOAc) was used as solvent. The sealant layer formulation was prepared by slowly adding the polymer resin to ethyl acetate with stirring until a uniform distribution was formed.

Table 1: sealing layer material

Information obtained from manufacturer's data sheets.

Table 2: seal layer formulations SL1 to SL4 in parts by weight

Table 3: seal layer formulations SL5 to SL10

Table 4: seal layer formulations SL11 to SL12

Exemplary and comparative cover tapes

Cover tape examples 1-10 and comparative examples CEl and CE2 were prepared using various combinations of the substrates (base layer + cushion layer), antistatic layer formulations, and seal layer formulations summarized in table 5.

To prepare examples 1 to 8, a substrate coated with an antistatic coating AS-3 (prepared AS described above) was roll-to-roll coated with the selected seal layer using 140# triple spiral patterned gravure bars. The line speed was 6m/min and the gravure roll speed was 12 m/min. After coating, the film was passed through a 4-stage drying oven set at 50 ℃, 55 ℃, 60 ℃ and 65 ℃, respectively.

To prepare examples 9 and 10 and comparative examples CE1 and CE2, substrates coated with the specified antistatic coatings were roll-coated with the appropriate sealant layer at a line speed of 10ft/min (3m/min) and a gravure roll speed of 15ft/min (4.6 m/min). After coating, the film was passed through an in-line 3-stage drying oven set at 65 ℃, and 75 ℃ respectively. Comparative examples CE1 and CE2 contained no binder in the antistatic layer.

Table 5: cover tape structure

Carrier tape

Exemplary cover tapes were evaluated using a polycarbonate carrier tape (3M 3000 carrier tape, available from 3M company, st. paul, MN, USA, st.) of saint paul, minnesota. The carrier tape had the following dimensions: the width is 8 mm; the center-to-center distance (spacing) between the pits is 4 mm; the nominal dimensions of the pits were 3.15mm long by 2.77mm wide by 1.22mm deep.

Test method

The crossover temperatures of the polymers used in sealant formulations SL5 to SL10 were determined by Dynamic Mechanical Analysis (DMA) using an ARES-G2 rheometer of parallel plate geometry (available from TA Instruments, New Castle, DE, US). The starting temperature was 80 deg.C, the ending temperature was 180 deg.C, the temperature was increased at a rate of 5 deg.C/min, and the oscillation frequency was 1.0 Hz. The crossover temperature is determined as the temperature at which the loss modulus (G ") is equal to the storage modulus (G'); that is, tan (δ) ═ G "/G' ═ 1.

Prior to peel strength measurements, 20cm portions of each cover tape sample were sealed to the empty portion of the 3M3000 carrier tape using an MBM-4000 sealer (available from isomerca european Semiconductor, La Chaux-de-Fonds, Switzerland) available from rashoid seal, european america, at the desired bonding temperature, a pressure of 0.09MPa, and a dwell time of 40 milliseconds. The peel strength was measured using a PT-55 peel force tester (available from V-TEK, Mankato, MN, US, Mankato, Minn., USA). During the test, values for maximum peel force, minimum peel force, and average peel force were recorded. The difference between the maximum peel force and the minimum peel force was calculated as the peel force range.

The Usable Sealant Temperature (UST) was determined by bonding a sample of the cover tape to a 3M3000 carrier tape. Since the peel force slightly increased with the bonding temperature, the bonding temperature was adjusted until the peel force was about 45gf, and the temperature was recorded as the usable sealant temperature. The peel force range under UST is recorded.

Surface resistance was measured using a type 152-1 surface/volume resistance meter (TREK, Lockport, NY, US) from rockporter, new york, usa using a two point resistance probe and a test voltage of 100V.

HAZE and transmission were measured by a HAZE-GARD measuring instrument (BYK additive and Instruments, Wesel, Germany) from Wessel, Germany.

Results

Table 6 summarizes the sealing characteristics of cover tape examples 1-8, compared to the crossover temperature of the polymers used in the sealing layer.

Table 6: characteristics of examples 1 to 8

The optical and electrical characteristics of examples 9 and 10 are compared in table 7 with those of comparative examples CE1 and CE 2. Tables 8 and 9 summarize the peel performance of examples 9, 10, CE1, and CE2, respectively, before and after aging under the following two sets of conditions: at 60 ℃ and 52 ℃ and 95% Relative Humidity (RH).

Table 7: optical and electrical properties of cover tape

Table 8: peel force of cover tape after aging at 60 ℃ (bonding temperature 145 ℃ and pressure 0.09MPa)

Table 9: peel force of cover tape after aging at 52 ℃ and 95% RH (bonding temperature 145 ℃ and pressure ═ 145 ℃) 0.09MPa)

Table 10 lists the minimum peel force (min), maximum peel force (max), average peel force, and peel force ranges as a function of bonding temperature. The process window is determined as a temperature range in which the minimum peel strength is greater than 30gf and the maximum peel strength is less than 70 gf. Table 10 shows that example 9 can bond within a process window of about 135 ℃ -160 ℃, and example 10 can bond within a process window of about 140 ℃ -160 ℃.

Table 10: peel force of cover tape at various bonding temperatures

Although specific embodiments have been illustrated and described herein for purposes of description of the preferred embodiment, it will be appreciated by those of ordinary skill in the art that a wide variety of alternate and/or equivalent implementations may be substituted for the specific embodiments shown and described without departing from the scope of the present disclosure. This application is intended to cover any adaptations or variations of the preferred embodiments discussed herein. Therefore, it is manifestly intended that this disclosure be limited only by the claims and the equivalents thereof.

Claims

1. A cover tape, comprising:

a base layer having a first major surface and a second major surface, the base layer comprising a thermoplastic polymer having a thickness of 10 to 20 micrometers;

a mat layer having a first major surface and a second major surface, wherein the first major surface of the mat layer is in contact with or adhesively bonded to the second major surface of the base layer, the mat layer comprising a polymeric or copolymer thermoplastic composition having a thickness of 20 to 35 micrometers;

an antistatic layer having a first major surface and a second major surface, wherein the first major surface is in contact with the second major surface of the underlayer, the antistatic layer comprising a polymeric binder or copolymer binder and PEDOT-PSS (poly-3, 4-ethylenedioxythiophene-polystyrene sulfonic acid) dispersed within the polymeric binder or copolymer binder, wherein the PEDOT-PSS is 5-30 wt% of the antistatic layer; and

a sealing layer having a first major surface and a second major surface, wherein the first major surface of the sealing layer is in contact with the second major surface of the antistatic layer, the sealing layer comprising a heat-activated adhesive, wherein the heat-activated adhesive comprises a polymer composition or copolymer composition having a thickness of 0.5-2.0 micrometers; and is

Wherein the cover tape has a heat activated bond range of at least 135 ℃, retains cover tape peel adhesion forces when exposed to conditions of time, temperature, humidity, or combinations thereof, and has a 10 as measured on the second major surface of the sealing layer at a temperature of 23 ℃ and a relative humidity of 50%⁶-10¹¹Ohmic Sheet Resistance (SR) value.

2. The cover tape of claim 1, wherein the base layer comprises a polyethylene terephthalate polymer or a polyimide thermoplastic.

3. The cover tape of claim 1, wherein the cushion layer comprises an ethylene-based polymer or copolymer.

4. The cover tape of claim 3, wherein the ethylene-based polymer or copolymer comprises ethylene-vinyl acetate copolymer, polyethylene, a blend of ethylene-vinyl acetate copolymer and polyethylene, or alternating layers of polyethylene and ethylene-vinyl acetate.

5. The cover tape of claim 3, wherein the ethylene-based polymer or copolymer comprises an ethylene-vinyl acetate copolymer containing 10-30 wt.% vinyl acetate.

6. The cover tape of claim 1, wherein the polymeric binder or copolymer binder of the antistatic layer comprises a modified acrylate polymer or copolymer, a styrene-based polymer or copolymer, or a combination thereof.

7. The cover tape of claim 6, wherein the polymeric binder or copolymer binder of the antistatic layer comprises a modified acrylate polymer or copolymer.

8. The cover tape of claim 6, wherein the polymeric binder or copolymer binder of the antistatic layer comprises a styrene-based polymer or copolymer.

9. The cover tape of claim 6, wherein the polymeric or copolymeric binder comprises an acrylate-styrene copolymer.

10. The cover tape of claim 1, wherein the antistatic layer is a dried layer formed from a dispersion mixture comprising:

an aqueous dispersion of the polymeric or copolymeric binder; and

aqueous dispersions of PEDOT-PSS (poly-3, 4-ethylenedioxythiophene-polystyrenesulfonic acid);

wherein the polymeric binder or copolymer binder material is a moisture resistant material such that, when immersed in water for 24 hours, the uptake of water is less than 5% by weight.

11. The cover tape of claim 1, wherein the heat-activated adhesive of the sealing layer comprises at least one (meth) acrylate-based polymer or copolymer.

12. The cover tape of claim 11, wherein the at least one (meth) acrylate-based polymer or copolymer comprises a (meth) acrylate polymer or copolymer having a weight average molecular weight of 50,000 and 100,000 g/mole.

13. The cover tape of claim 11, wherein the at least one (meth) acrylate-based polymer or copolymer comprises a mixture of at least two (meth) acrylate polymers or copolymers comprising a (meth) acrylate polymer or copolymer having a weight average molecular weight of 50,000-100,000 g/mole and a (meth) acrylate polymer or copolymer having a weight average molecular weight of 100,000-200,000 g/mole.

14. The cover tape of claim 11, wherein the heat-activated adhesive further comprises a particulate filler present at about 5-20 wt%, the particulate filler comprising silica particles or polymer beads.

15. An article of manufacture, comprising:

a carrier tape including a plurality of pits; and

a cover tape bonded to the carrier tape and sealing the plurality of pockets; wherein the cover tape comprises:

a sealing layer having a first major surface and a second major surface, wherein the first major surface of the sealing layer is in contact with the second major surface of the antistatic layer, the sealing layer comprising a heat-activated adhesive, wherein the heat-activated adhesive comprises a polymer composition or copolymer composition having a thickness of 0.50-2.0 micrometers; and is

16. The article of claim 15, wherein the carrier tape comprises a polycarbonate or polystyrene carrier tape.

17. The article of claim 15, wherein the cover tape has a peel value from the carrier tape sealed at a temperature of at least 135 ℃ in the range of 30-70 grams-force (gf).

18. The article of claim 15 wherein the article is heat sealed at a temperature of 140-160 ℃ and the peel adhesion is in the range of 30-70 grams force (gf).

19. The article of claim 15, wherein the cover tape maintains peel adhesion upon exposure to conditions of 30 days of aging, temperatures of up to 60 ℃, or combinations thereof.

20. The article of claim 15, wherein the cover tape maintains peel adhesion upon exposure to conditions of up to 52 ℃ temperature and up to 95% relative humidity.