TW391153B

TW391153B - Manufacturing method for connection of electric device and circuit board and its product

Info

Publication number: TW391153B
Application number: TW87118252A
Authority: TW
Inventors: Sz-Ping Chen; Rung-Lin Tsai
Original assignee: Hon Hai Prec Ind Co Ltd
Priority date: 1998-11-03
Filing date: 1998-11-03
Publication date: 2000-05-21

Abstract

The invention relates to a kind of manufacturing method for connection of electric device and circuit board and its method which at least comprises the following steps: forming, punching, tin coating, assembly and heating. The punching step is to punch a row of penetration holes at the corresponding positions of electric device assembled on the circuit board; then, using tin coating step to brush the tin material. Because the penetration hole has the permeation effect so that when coating tin on contacts of one side of the circuit board, the contacts on the other side can also be coated with tin. Therefore, when the electric device is held and connected to both sides of the circuit board, it can immediately proceed the heating step so that the electric devices can be electrically connected to the contacts on both sides of circuit board. The method can enhance the connection efficiency; further, the electric devices are configured on the board edge of circuit board so as to greatly reduce the total height of the electric apparatus.

Description

五、發明說明（1) 【發明領域】本發明係關於一種電子元件與及其成品，尤指一種在電路板：單f板接合之製造方法元件同時焊接在電路板之兩側電子【發明背景】 Ik方法及其成品。按’隨著科技曰新月異的進步，體積愈來愈小，其所需性能卻要工來：：裝腦等的. 二：t裝置之？積無法隨之相對擴增的同時，必須採用曰 Ϊ 2型i ί 等特殊功能所需之電子元件。以攜帶式的電，目前筆記型電腦係以插接通用型規格之 2卡的方式來達成擴充記憶體、增加不同之輸入/輸出功效以及插接硬碟等功能。一般而言，此類電子卡主要嗖有具若干相應電子元件之電路板以及可組接於電子裝置對接連接器上之插座連接器，其中，該等插座連接器與電路板的連接方法通常為穿孔式焊接，即將插座連接器之端子穿過電路板，並在電路板另一面焊接該等端子而構成電氣導通。惟，如是之連接方法將使該插座連接器直接佔用了電路板之兩侧空間，而且該插座連接器係疊置於電路板上’使整體的組接高度無法降低，進而影響組合空間上之可利用性。目前，表面黏著技術（Surface Mounting Technology ’SMT)發展日漸成熟’使插座連接器之端子及其接合點均可布置在電路板同一側面，相關專利如中華民國專利第85 101412號和第86 2 0 54 0 7號等案。然而，不論是穿孔式焊接端子還是採用表面接合技術焊接端子，其均V. Description of the Invention (1) [Field of the Invention] The present invention relates to an electronic component and its finished product, especially a manufacturing method for bonding on a circuit board: single f-board. Components are simultaneously soldered to both sides of the circuit board. [Background of the Invention] ] Ik method and its finished product. According to the progress of science and technology, the volume is getting smaller and smaller, but its required performance has to be worked :: brain-equipped. Second: t device? At the same time that the product cannot be relatively expanded, electronic components required for special functions such as Ϊ 2 type i ί must be used. With portable power, current notebook computers use plug-in type 2 cards to expand memory, add different input / output functions, and plug in hard disks. Generally speaking, this type of electronic card mainly includes a circuit board with a number of corresponding electronic components and a socket connector that can be assembled on the docking connector of an electronic device. The connection method of the socket connector and the circuit board is usually Through-hole welding, that is, the terminals of the socket connector are passed through the circuit board, and the terminals are welded on the other side of the circuit board to form electrical continuity. However, if the connection method is used, the socket connector directly occupies space on both sides of the circuit board, and the socket connector is stacked on the circuit board, so that the overall assembly height cannot be reduced, which will affect the combination space. Availability. At present, the development of Surface Mounting Technology (SMT) is becoming more and more mature, so that the terminals and joints of the socket connector can be arranged on the same side of the circuit board. Related patents such as the Republic of China Patent Nos. 85 101412 and 86 2 0 54 0 7 and other cases. However, whether it is a through-hole soldering terminal or a surface bonding technology soldering terminal, both

五 '發明說明（2) ^ ’亦即插座連接器均被設置於電路板之 7表面上，4樣的佈局將會導致電子卡產品的厚度很難 =而且也會導致電子卡的金屬屏蔽外殼易因支持不夠 ί二問題’中華民國專利第84112504號有將插座連接器電路板夾持於連接兩排蚝子間。惟，該方法雖可降低整體之古声，並在；用表面黏著技術接合下使端子接：：板緣排間就使錯位配置之兩 ϋϊϋίΠΤ上錫料，並將插頭連接器直接以其端 :為：是广；r亍印刷時，均僅能於法=面二：電上刷上錫料之後，是無台面上時九先刷上錫料之側面貼靠於工作於工作台面會料受f力而破碎或沾染佳’進而造成電性傳導的不良情ς面接合之焊接效果不【發明目的】路板於提供-種電子元件連接器與電可達到雙面：錫的效路：以電路板之單面印刷卻影響原先印刷錫料之效果；：刷：面無須翻轉而輸之穩定性。 I;保電子兀件焊接後電性傳本發明之又-目的在於電子元件與電路板接合之製造五、發明說明（3) 方：可大幅度提高應用該方法之成品製造效 3於：需單面印刷就能達成相對兩側面均形成接而效果，藉此可縮短焊接加卫時程並降低成本。錢°點< 本發明之另一目的在於利用單面雔 / 接合製造方法使電子元件之兩排錯位 ς八形，接點之 :板的相對兩侧面’從而使該電 Z電合高度大為減小。 1〒/、電路板之整體紐【發明特徵] / 本發明之製造方法至少包括有製驟'上錫步驟、袓&成型乂驟、冲孔步在經由製造成型步驟所得之電路板：：：：：孔步驟可組接位置上沖設出—排貫孔，再經4對應於電子元件之 :=’如此，路板之該印刷面之面印刷上上均刷上錫料，而且由於貫孔的 J接點及貫孔之位置散佈至電路板另一側面所二透作用，將使錫料亦能子元件之兩之接點上，藉此’僅管本雷卞I兩排ϋ*子為錯位排列拉 S田电子元件之端子I人，於加熱步驟後亦能使雷十气知子接合部與電路板之此使電品。經本發明製成之電子：:占對應固接而得到成之-側端緣而非與電路板彼此：接f ”置於電路板路板組接時之整體高产。且姐，藉此可降低與電【圖示簡單說明】第一圖係本發明電連接器與電流程圖。 '、接合之製造方法的製造第二，圖係本發明經劁成型步驟所製出之電連接器局部示Fifth invention description (2) ^ 'That is, the socket connectors are all arranged on the 7 surface of the circuit board, the 4 layout will make the thickness of the electronic card products difficult = = and will also cause the metal shield shell of the electronic card "Yin's support is not enough. Two problems," Republic of China Patent No. 84112504, is to clamp the socket connector circuit board between two rows of oysters. However, although this method can reduce the overall ancient sound, and use the surface adhesive technology to join the terminals: the board edge row, the two dislocations are placed on the tin, and the plug connector is directly connected to its end. : Is: wide; r 亍 can only be used in printing when printing = surface two: after the tin material is brushed on, when there is no surface, the side of the tin material is first brushed against the work surface. Broken or contaminated by f-force ', which leads to bad electrical conduction. The welding effect of surface bonding is not good [Objective of the invention] The circuit board provides a kind of electronic component connector and electricity can achieve double sides: the effect of tin: The single-sided printing of the circuit board affects the effect of the original printed tin material; I; to ensure the electronic transmission of electronic components after soldering. The purpose of the present invention is to manufacture electronic components and circuit boards. 5. Description of the invention (3) Side: can greatly improve the manufacturing efficiency of finished products using this method. Single-sided printing can achieve the effect of forming opposite sides on both sides, which can shorten the welding and guarding time and reduce costs. Qian point < Another object of the present invention is to use a single-sided 雔 / joint manufacturing method to make two rows of electronic components out of shape. For reduction. 1〒 /, the overall button of the circuit board [Inventive Features] / The manufacturing method of the present invention includes at least a manufacturing step, a tin mounting step, a & forming step, and a punching step. ：：： The hole step can be punched out at the connection position-row through holes, and then correspond to 4 of the electronic components: = 'So, the printing surface of the printed board is tinned with tin, and because The J-contacts of the through-holes and the positions of the through-holes are spread to the second side of the circuit board, which will make the tin material also be able to connect to the two contacts of the sub-components. * The sub-elements are arranged in a staggered manner to pull the terminals of the S-field electronic components. After the heating step, the electrical parts of the joint and the circuit board can also be used. The electrons made by the present invention: obtained by corresponding solid connection-side edges instead of each other with the circuit board: the connection f "when placed on the circuit board circuit board assembly overall high yield. And sister, which can reduce the And electricity [Simplified illustration of the diagram] The first diagram is the electrical connector and the electrical flowchart of the present invention. ', The manufacturing of the joint manufacturing method The second, the diagram is a partial illustration of the electrical connector produced by the molding process of the present invention

1: \二維條碼\A855LG_YANG. Ptd $ 6頁五、發明說明（4) 意之俯視圖。第三A圖係本發明經製造成型步驟所製出之電路板局部示 ' 意之俯視圖。第三B圖係本發明經製造成型步，驟所製出之電路板局部示意之仰視圖。第四A圖係本發明經印刷步驟後於電路板一側表面形成之、接點之俯視圖。 ‘ / 第四B圖係第四A圖沿B —B方向之剖視圖。第五圖係本發明經組合步驟實施示意之側視圖。第六A圖係本發明製造成型步驟完成之電連接器及電路板相對接合關係位置局部示意之俯視圖。第六B圖係本發明製造成型步驟完成之電連接器及電路板相對接合關係位置局部示意之仰視圖。第六C .圖係第六A圖沿C — C線方向之剖視圖。元件符號說明 1 12 ' 20 22 212 貫孔插座連接器第二端子彎折部錫料 11 電路板接點絕緣殼體第一端子接合部【較佳實施例】請參閱第一圖係本發明電子元件與電路板接合之製造方法的製造流程圖，第二圖係經本發明製程所製出插座連接器局部示意，而第三A、三B圖則為本發明製程所製出之 13 222 21 211 3 2211: \ two-dimensional bar code \ A855LG_YANG. Ptd $ 6 page 5. Description of the invention (4) The plan view intended. FIG. 3A is a partial plan view of a circuit board made by the manufacturing and forming steps of the present invention. FIG. 3B is a partial bottom view of the circuit board produced by the manufacturing step of the present invention. The fourth diagram A is a plan view of the contacts formed on the surface of one side of the circuit board after the printing step of the present invention. ‘/ The fourth B diagram is a sectional view of the fourth A diagram along the B-B direction. The fifth figure is a schematic side view of the embodiment of the present invention after combining steps. The sixth diagram A is a partially schematic plan view of the relative joint position of the electrical connector and the circuit board after the manufacturing and forming steps of the present invention are completed. FIG. 6B is a partial schematic bottom view of the relative joint position of the electrical connector and the circuit board after the manufacturing and forming steps of the present invention are completed. The sixth C. figure is a sectional view of the sixth A along the line C-C. Description of component symbols 1 12 '20 22 212 Through-hole socket connector second terminal bent portion tin material 11 circuit board contact insulation housing first terminal joint [preferred embodiment] Please refer to the first diagram of the present invention. The manufacturing flow chart of the manufacturing method for the connection between the component and the circuit board. The second figure is a partial illustration of the socket connector produced by the process of the present invention, and the third A and three B diagrams are 13 222 21 211 produced by the process of the present invention. 3 221

I :\二維條碼\八8551^^^妬.ptd 第7頁五、發明說明（5) 電路板局部示意。如圖所示本發明之製造方法係可應用於電子卡及電子卡用插座連接器2之製作及組合，其中，電子卡主要設有一具有電子零件接合其上之電路板i，該^ 路板1在其板緣適當位置上通常接合有一個以上之插座連接器2，以供電子卡與電子裝置上之電子卡連接器構成電性通連。電子卡之電路板丨與插座連接器2形成電性連接時 ’係依下列步驟之實施而將兩者加以接合：第一、製造成型步驟A、B: 1 依電路板1及插座連接器2之功能要求，分別將電子卡用之電路板1及插座連接器2以適當之加工方法製造必要構件，如電路板1板面、插座連接器2之絕緣殼體2〇、導電端子（容後詳述）等。第二、印刷電路步驟C : 依電子卡所應設置之功能性電子零件及電路設計，於電路板上的印刷（電鍍）出相關電子零件之組接接點及相關電路，同時，於電路板丨兩板面預定設置插座連接器2之 =置上各設有成排之接點12、13，且該兩排接點12、\3係设置於電路板1之不同垂直截面位置上。第三、組接步驟D : 將插座連接器2之絕緣殼體20、導電端子等基本構利用治工具將其組合成一體。第四、沖孔步驟E : 制+1電路板1其中一板側所設置之成排接點1 3上各藉沖貝複數個貫孔1 1，該貫孔Π均垂直貫穿電路板1，而I: \ Two-dimensional bar code \ eight 8551 ^^^ 妒 .ptd page 7 5. Description of the invention (5) The circuit board is partially shown. As shown in the figure, the manufacturing method of the present invention can be applied to the production and combination of electronic cards and socket connectors 2 for electronic cards. Among them, the electronic card is mainly provided with a circuit board i having electronic parts joined to the circuit board. 1 Generally, more than one socket connector 2 is connected at an appropriate position on the edge of the board. The power supply daughter card and the electronic card connector on the electronic device form an electrical connection. When the circuit board of the electronic card 丨 forms an electrical connection with the socket connector 2 ', the two are joined according to the following steps: First, the manufacturing molding steps A and B: 1 according to the circuit board 1 and the socket connector 2 For functional requirements, the necessary components such as the board surface of the circuit board 1 and the insulating housing 20 of the socket connector 2 and the conductive terminals (after capacity) are manufactured by using appropriate processing methods for the circuit board 1 and the socket connector 2 of the electronic card. Detailed) etc. Second, the printed circuit step C: According to the functional electronic parts and circuit design that the electronic card should be set, the group contacts and related circuits of the related electronic parts are printed (plated) on the circuit board, and at the same time, the circuit board丨 The two sockets of the socket connector 2 are to be arranged in a row, and the rows of contacts 12, 13 are arranged on the two boards, and the two rows of contacts 12, \ 3 are arranged at different vertical cross-section positions of the circuit board 1. Third, assembling step D: The basic structure of the insulating housing 20, the conductive terminals and the like of the socket connector 2 are combined into a whole by using a treatment tool. Fourth, punching step E: +1 circuit board 1 is provided with a plurality of through holes 1 1 in a row of contacts 13 arranged on one side of the board. The through holes Π pass through the circuit board 1 vertically. and

五、發明說明（6) -------- 且具有適當之孔徑。第五、上錫步驟F : 於電路板1未設有貫孔11之接點1 2所在的板面上覆蓋上杈板（圖未示），該模板於各貫孔11及接點1 2之位置上设^對應之模孔（圖未示），因此，加工時先將錫料3堆置二於杈板上，再於模板上將錫料來回推擠，而使錫料經孔沾置於貫孔11内及接點12上，並沿貫孔11走向擠至電‘ 板1之另一板面上（如第四A、四B圖示）。电第六、組合步驟G : 將組成一體之插座連接器2以治工具推接於設有對應接=1 2、1 3之板緣處，並藉插座連接器2具彈性之兩排導，端子分別夾持於電路板丨之板緣上、下兩側並藉其彈使插座連接器2得以暫時繫留於電路板1上。第七、加熱步驟Η : 將完成組接之插座連接器2與電路板1按照表面接合技化之製程送入加熱爐中加熱，利用加熱爐之高溫將錫料熔入，以使插座連接器2之導電端子2 1、2 2分別分別對應接 =接點1 3及接點1 2上’其巾’接點J 3上之錫料3係由貫 =内擠入之錫料熔化後藉重力及表面張力擴散至接點i 3 衣面而得。第八、成品I : 經過加熱過程之插座連接器2其導電端子21、22以夾符方式分別接合於電路板1板緣之兩側接點丨2、】3上 ’而得到可供繼續利用、加工之成品。V. Description of the invention (6) -------- and have appropriate pore size. Fifth, soldering step F: Cover the upper plate (not shown) on the surface of the circuit board 1 where the contact 12 of the through hole 11 is not provided. The template is provided on each of the through holes 11 and the contact 1 2 Corresponding die holes (not shown in the figure) are set at the positions. Therefore, the tin material 3 is first stacked on the fork plate during processing, and then the tin material is pushed back and forth on the template to make the tin material pass through the hole. It is placed in the through hole 11 and the contact 12, and squeezed along the through hole 11 to the other plate surface of the electric plate 1 (as shown in the fourth A and four B illustrations). Electric sixth, combination step G: Push the integrated socket connector 2 with a tool to the edge of the board with the corresponding connection = 1, 2, 1 3, and use the two flexible rows of the socket connector 2 to guide. The terminals are clamped on the upper and lower edges of the circuit board, respectively, and the socket connector 2 can be temporarily tied to the circuit board 1 by its spring. Seventh, heating step Η: Send the completed socket connector 2 and circuit board 1 into a heating furnace according to the process of surface bonding technology, and use the high temperature of the heating furnace to melt the tin material to make the socket connector The conductive terminals 2 1 and 2 of 2 correspond to the contact = contact 1 3 and contact 1 2 respectively. The tin material on the contact 3 of its towel J 3 is melted and borrowed from the tin material that has been squeezed in = Gravity and surface tension are spread to the surface of contact i 3. Eighth, the finished product I: The heated connector of the socket connector 2 has conductive terminals 21 and 22 which are respectively connected to the contacts on both sides of the board edge of the circuit board 1 with a clip, and 2] and 3 'to be used for further use. And processed products.

五、發明說明（7) 再請參閱第二圖所示，經本發明製造成型步驟B所製成之插座連接器2主要包括有絕緣殼體2〇及導電端子21、 22等構件’其中絕緣殼體2〇係呈縱長狀延伸，其上設有至少兩排相互對齊平行之端子孔（未圖示）以收容導電端子。導電端子係分為第一端子22及第二端子21，兩端子乃分別藉其一端插置於絕緣殼體2 〇之不同排端子孔内，而且其另一端均向外延伸形成有接合部212、222，而具第一端子 22之接合部222的延伸長度略長於第二端子21之接合部212 。又’於兩端子接合部212、222鄰接絕緣殼體2〇之部位各设有¥折部2 11、2 2 1，該等彎折部可使導電端子自絕緣殼體2 0延伸而出之後，經兩次折彎而形成錯位關係，而且第一端子2 2彎折部2 2 1之折彎錯位方向恰與第二端子21之彎折部211相反，如是，即可使第一端子22及第二端子21之接^部222、212彼此交錯配置（第二圊示），而且彼此相對靠近形成夾持狀（第五圖參照）。又凊參閱第三A、三B圖所示，經本發明製造成型步驟 Α所製成之電路板丨係呈平面延伸之板狀，其上佈設有適當之電子零件及電路，且於板緣一端之兩侧面上各設有成排接，’..占1 2 1 3，s玄兩排接點係交錯配置（即接點1 3之設置位置係於兩接點12之間隙上），而且接點13之設置位置距板j、’袭較遠。於接點1 3上之適當位置各經沖孔步驟E設有、孔Π 此專貝孔1 1係貝穿電路板1，並在電路板另一板面之接觸點1 2間隙附近形成孔洞。V. Description of the invention (7) Please refer to the second figure again. The socket connector 2 manufactured through the manufacturing step B of the present invention mainly includes an insulating shell 20 and conductive terminals 21 and 22, among which are insulating shells. The body 20 extends in an elongated shape, and at least two rows of terminal holes (not shown) aligned and parallel to each other are arranged on the body 20 to accommodate conductive terminals. The conductive terminals are divided into a first terminal 22 and a second terminal 21, and the two terminals are respectively inserted into different rows of terminal holes of the insulating housing 20 through one end, and the other end is extended to form a joint portion 212. 222, and the extending length of the joint portion 222 having the first terminal 22 is slightly longer than the joint portion 212 of the second terminal 21. In addition, at the positions where the two terminal joints 212 and 222 are adjacent to the insulating housing 20, folding sections 2 11, 2 2 1 are respectively provided. These bent sections can make the conductive terminals extend from the insulating housing 20 After two bendings, a misalignment relationship is formed, and the bending dislocation direction of the first terminal 2 2 bending portion 2 21 is opposite to that of the second terminal 21 bending portion 211. If so, the first terminal 22 can be made The connecting portions 222 and 212 of the second terminal 21 are arranged alternately with each other (second illustration), and are relatively close to each other to form a clamping shape (refer to the fifth figure). Also referring to Figures 3A and 3B, the circuit board produced by the manufacturing molding step A of the present invention is a plate extending in a plane, and appropriate electronic parts and circuits are arranged thereon, and one end of the board edge is arranged. There are rows of connections on both sides of it, '.. occupies 1 2 1 3, suan two rows of contacts are staggered (that is, the position of contact 13 is placed on the gap between the two contacts 12), and The position of the contact 13 is far from the board j, '. At the appropriate position on the contact point 13, each hole is provided through the punching step E. The hole 11 is formed through the circuit board 1, and a hole is formed near the gap between the contact point 12 on the other surface of the circuit board. .

續請參閱第四A、四B圖所示，經本發明之上錫步驟FContinuing, please refer to Figures 4A and 4B.

1:\二維條碼\A85^YANGptd 第10頁五、發明說明（8) 後’於電路板1上對應模孔之位置被刷上錫料3。由於貫孔 11亦對應模孔位置，於上錫時錫料3受到來回推擠會沿貫孔11之走向而沾置於電路板1之下板面。另請參閱第五圖及第六A、六B、六C圖所示，經本發明之组合步驟G後，插座連接器接於設有對應接點丨2、i 3 之電路板板緣處’並藉插座連接器具彈性之兩排導電端子分別失持於該板緣上、下兩側並藉其彈力使插座連接器得二暫蚪繫留於電路板。因此，藉由前述本發明各步驟所介紹之製造方法’其印刷錫料3通過貫孔丨丨從電路板丨上表面滲透到下表面’可實現在單面印刷錫料，而能滿足雙面焊J，大幅節省加工時間及成本。另夕卜，藉此方法所獲得 =電子卡產品，由於採用前述之佈局’使電子卡之敕又大為減小，更能滿足當今電腦之發展需要。、综合上述，本發明確已符合發明專利之要件，法提出專利申請。惟，以上所述僅為本發明之: 效修飾或變化，皆應涵蓋在以下之專利作之專1: \ Two-dimensional bar code \ A85 ^ YANGptd Page 10 V. Description of the invention (8) After the soldering material 3 is applied to the position of the corresponding die hole on the circuit board 1. Since the through hole 11 also corresponds to the position of the die hole, when the tin material 3 is pushed back and forth when the tin is loaded, it will stick to the surface of the circuit board 1 along the direction of the through hole 11. Please also refer to the fifth figure and the sixth figures A, VI B, and VI C. After the combination step G of the present invention, the socket connector is connected to the edge of the circuit board with corresponding contacts 丨 2, i 3 ′ The two rows of conductive terminals of the socket connecting device are lost on the upper and lower edges of the board respectively, and the socket connector is temporarily retained on the circuit board by its elastic force. Therefore, through the manufacturing method introduced in the foregoing steps of the present invention, 'the printing tin 3 penetrates from the upper surface to the lower surface of the circuit board through through holes, and can be printed on one side, and can meet both sides. Welding J greatly saves processing time and costs. In addition, the electronic card products obtained by this method can reduce the size of electronic cards because of the aforementioned layout, which can better meet the development needs of today's computers. Based on the above, the present invention has indeed met the requirements of the invention patent, and a patent application has been filed. However, the above is only the invention: Modifications or changes should be covered by the following patents.

Claims

、申請專利範圍種電子元件與電路板接合之製造方法，其包括： .製造成型步驟’係按電子裝置之功能需要分別製出電子凡件及電路板’其中於電路板並製成有能達成該電子裝置功能之電路及組接相關電子元件之接點， *亥等接點係視需要而分設於電路板之兩相對板側；沖孔步驟，係於電路板之部分接點上沖設有貫穿電路板之貝孔，S亥等貫孔之另一側孔端並未設有其他接點， ’係於電路板-側面上印刷锡料，使電路板該側面上之接點及貫孔内均舖設有錫料；、 Ί $電子元件及其導電部分對應組接於電路板〃刀設於其兩侧板面之接合點. 加中至定位之電路板與電子元件置於 ^ tr, ^藉使接點與貫孔内之錫料熔融並接 '如；=士接點與電子元件之導電部分。造方法，宜T : f t項所述電子元件與電路板接合之製 = 置之接合點係各自成排且二在力、=專： = 子元件與電路板接合之製 .Κ係遠離電路板端緣之=貫孔之接點係彼此成專利範圍第3項所述電 …，其中上锡步驟中電路板印:;锡電路板接合，製 ⑴场枓之侧面的相2. A manufacturing method for applying electronic components to circuit boards in the scope of patent application, which includes: The manufacturing step 'forms electronic parts and circuit boards separately according to the function requirements of the electronic device'. The circuit of the electronic device function and the contact of the related electronic components. * The contacts such as Hai are set on the two opposite board sides of the circuit board as needed; the punching step is set on some of the contacts of the circuit board. There is a shell hole penetrating through the circuit board. The other hole end of the through hole such as Shai is not provided with other contacts. 'It is printed on the circuit board-the side of the tin material, so that the contact and Tin materials are laid in the holes; Ί Ί $ The electronic components and their conductive parts are connected to the circuit board with trowels at the joints on both sides of the board. , ^ If the contact is melted and connected with the tin material in the through hole, such as; = the contact and the conductive part of the electronic component. Manufacturing method, should be T: ft The electronic component and the circuit board bonding system = the joints are placed in a row and two forces, = special: = the sub-component and the circuit board bonding system. K is far from the circuit board The edge of the edge = the contact of the through hole is the same as described in item 3 of the patent scope, where the circuit board is printed in the step of soldering: the tin circuit board is bonded to make the phase of the side of the field.

I: \二維條碼\八8551^_^/\[^ Ptd 第12頁申請專利範圍 <子側表面所設之接點係藉擠入” 面張力之作用而沾接上踢料。貝孔之踢料依重力及表、如4請專利範圍第4項所述造方法，其中制、土士圳此电千70件與電路板接合之製係用於電；卡：J電：：所3之電子裝置電路板該電路板一側緣之插座連接器。電子元件係為組於如申睛專利範圍第5項所述 ‘ 造方法’其中製造成型.步驟所製出牛之插電路1接合之製括有絕緣殼體及，複數個導電端子作為導^β係包進一步經組接步驟@ g '·'·、 '口F 77 ，其係孚总八σ 而使知子組入絕緣殼體内，兮楚山子係刀呈兩排佈置，且不同排端子分 2寺柒路板兩側面所設之接點上。 ί應接合於電 ‘—種電子裳置’其包括：電其上設有適用於電子裝置所需之電路佈罢且於其兩侧板面適當位置上各設有電路接覃，接點均設於電路板之不同垂直截面位置上’ ’·，认該等接點上並設有貫穿電路板之貫孔；；。卩分电子元件，係設有相對於電路板接點位置之導 '，以在電路板單面印刷且於該側面未設貫孔之崢汾及貫孔中塗佈锡料後，使該等導電部分同時接點. 合於電路板之兩側接點上。 17熱接如申請專利範圍第7項所述電子裝置，其中電路所设之接點係各成—排且設於距電路板緣反兩側位置上。〜门艰近之I: \ Two-dimensional barcode \ eight 8551 ^ _ ^ / \ [^ Ptd Page 12 Patent Application Scope < The contacts set on the sub-surface are extruded by the effect of “surface tension” on the kick material. Hole kick material is manufactured according to gravity and table, as described in item 4 of the patent scope, in which 70 pieces of electric and circuit boards are connected to the circuit board for electricity; card: J electricity :: The electronic device circuit board No. 3 is a socket connector on one side of the circuit board. The electronic components are assembled and manufactured in the "manufacturing method" as described in item 5 of the patent scope of Shenyan. The plug circuit produced by the steps 1 The joint system includes an insulating case and a plurality of conductive terminals as a conductive ^ β series package. After further assembly steps @ g '·' ·, '口 F 77, the system is connected to the total σ to make the sub-groups insulated. Inside the casing, the Xishan Mountain series of knives are arranged in two rows, and the terminals of different rows are divided into two points on the two sides of the temple board. Ί should be connected to the electric '--a kind of electronic clothes' which includes: There are circuit cloths suitable for electronic devices, and circuit connections are provided at appropriate positions on both sides of the board. They are all set at different vertical cross-section positions of the circuit board. '·, Recognize that these contacts are provided with through holes penetrating through the circuit board; 卩 Divided electronic components are provided with guides relative to the position of the circuit board contacts ', To print on one side of the circuit board and apply tin to the fenfen and through holes that do not have through holes on the side, so that these conductive parts are contacted at the same time. It is connected to the contacts on both sides of the circuit board. Connect to the electronic device as described in item 7 of the scope of patent application, wherein the contacts of the circuit are arranged in rows and located on opposite sides of the edge of the circuit board.

I ·· \二維條碼\祕551^_丫狀(；ptdI ·· \ Two-dimensional barcode \ Secret 551 ^ _ 丫状 (; ptd

10 10 11 申請專利範圍 *1:=利圍第8項所述電子裝置，a 板之同-側面上'，、如二利—Λ，未設有任何電路及單面印刷錫料後於未执書/二裝置’其工认母 τ说％禾s又貝孔之接點及貫^ 作用而·土孔内之錫料係經加熱熔融後藉i ’附至另一孔端處之接點上。、如=請專利範圍第1〇項所述電子裝置，* ~ 卡’電路板則收容.定位於該驾 0 12、如申請專利範圍第u項所述電子裝置，其，之，電子it件係為設於電子卡電路板板緣之 ’。玄插座連接器至少設有兩排端子以作為 1 3、如申請專利範圍第1 2項所述電子裝置，其之插座連接器的兩排導電端子各有不同之不同位置之電路板接點，且該兩排端子係 .方向兩次彎折以組接於該等對應接點上。卜電路板設置且在其貫穿接點。中電路板係 *内佈設力及附著i 中電子裝置子卡之内部中電子裝置插座連接器導電部分</ 中電子裝置長度以配合分別朝相反10 10 11 Scope of patent application * 1: = The electronic device described in item 8 of Liwei, the same on the side of a board-on the side, such as Erli-Λ, without any circuit and single-sided printed tin before Book / Second Device: Its worker recognizes that the contact and the function of the hole and the hole ^ and the tin material in the soil hole is heated and melted by i 'attached to the end of another hole Point. For example, please refer to the electronic device described in item 10 of the patent scope, and the circuit board of the card ~~ is located. Positioned on the driver 0 12, the electronic device described in item u of the scope of patent application, and, of course, electronic it It is located on the edge of the electronic card circuit board. A black socket connector is provided with at least two rows of terminals as 1 3. As described in Item 12 of the scope of the patent application, the two rows of conductive terminals of the socket connector have different circuit board contacts in different positions, And the two rows of terminals are bent twice in the direction to connect to the corresponding contacts. The circuit board is provided at and through the contacts. Medium circuit board system * Inner layout force and attachment i Inside of the electronic device Daughter card Medium electronic device Socket connector Conductive part < / China electronic device

I :\二維條碼\八8551^_丫4胍.ptd 第14頁I: \ Two-dimensional barcode \ 八 8551 ^ _ 丫 4guanidine.ptd Page 14