TW349249B - Resin-packaged type semiconductor device having a heat sink - Google Patents
Resin-packaged type semiconductor device having a heat sinkInfo
- Publication number
- TW349249B TW349249B TW086107224A TW86107224A TW349249B TW 349249 B TW349249 B TW 349249B TW 086107224 A TW086107224 A TW 086107224A TW 86107224 A TW86107224 A TW 86107224A TW 349249 B TW349249 B TW 349249B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat sink
- guide plate
- inner portion
- mounting
- resin
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 239000000463 material Substances 0.000 abstract 5
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP08188283 | 1996-06-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW349249B true TW349249B (en) | 1999-01-01 |
Family
ID=16220939
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086107226A TW353790B (en) | 1996-06-28 | 1997-05-28 | Resin packaged type semiconductor device having a heat sink and its manufacturing process |
TW086107224A TW349249B (en) | 1996-06-28 | 1997-05-28 | Resin-packaged type semiconductor device having a heat sink |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086107226A TW353790B (en) | 1996-06-28 | 1997-05-28 | Resin packaged type semiconductor device having a heat sink and its manufacturing process |
Country Status (3)
Country | Link |
---|---|
US (3) | US5798570A (zh) |
KR (2) | KR100263513B1 (zh) |
TW (2) | TW353790B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI574441B (zh) * | 2014-04-15 | 2017-03-11 | 聖約翰科技大學 | 可撓性發光二極體之連續加工裝置 |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5798570A (en) * | 1996-06-28 | 1998-08-25 | Kabushiki Kaisha Gotoh Seisakusho | Plastic molded semiconductor package with thermal dissipation means |
US6252772B1 (en) | 1999-02-10 | 2001-06-26 | Micron Technology, Inc. | Removable heat sink bumpers on a quad flat package |
US6061242A (en) * | 1999-02-25 | 2000-05-09 | Micron Technology, Inc. | Die paddle heat sink with thermal posts |
KR100350046B1 (ko) * | 1999-04-14 | 2002-08-24 | 앰코 테크놀로지 코리아 주식회사 | 리드프레임 및 이를 이용한 방열판이 부착된 반도체패키지 |
US6376266B1 (en) * | 2000-11-06 | 2002-04-23 | Semiconductor Components Industries Llc | Semiconductor package and method for forming same |
US6456515B1 (en) | 2000-11-27 | 2002-09-24 | Briggs & Stratton Corporation | Three-phase H-bridge assembly and method of assembling the same |
KR100819794B1 (ko) * | 2002-04-02 | 2008-04-07 | 삼성테크윈 주식회사 | 리드프레임 및, 그것을 이용한 반도체 패키지 제조 방법 |
JP2004014823A (ja) * | 2002-06-07 | 2004-01-15 | Renesas Technology Corp | 半導体装置及びその製造方法 |
US20040170671A1 (en) * | 2003-03-05 | 2004-09-02 | Jian Tao | Thin wall gloves that release chlorine dioxide |
TWI246760B (en) * | 2004-12-22 | 2006-01-01 | Siliconware Precision Industries Co Ltd | Heat dissipating semiconductor package and fabrication method thereof |
US7375415B2 (en) * | 2005-06-30 | 2008-05-20 | Sandisk Corporation | Die package with asymmetric leadframe connection |
DE102006028816B4 (de) * | 2006-06-21 | 2008-05-15 | Hansatronic Gmbh | Verfahren zum getakteten, kontinuierlichen Herstellen von beidseitig umspritzten flexiblen Leiterplatten |
DE112008001425T5 (de) * | 2007-05-25 | 2010-04-15 | Molex Inc., Lisle | Verbindungsvorrichtung, die eine Wärmesenke sowie elektrische Verbindungen zwischen einem Wärme erzeugenden Bauelement und einer Stromversorgungsquelle bildet |
JP2012033665A (ja) * | 2010-07-30 | 2012-02-16 | On Semiconductor Trading Ltd | 半導体装置及びその製造方法 |
CN103531551A (zh) * | 2013-09-26 | 2014-01-22 | 杰群电子科技(东莞)有限公司 | 一种半导体封装结构及其成型方法 |
US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
JP1563812S (zh) * | 2016-04-11 | 2016-11-21 | ||
JP1580899S (zh) * | 2016-11-15 | 2017-07-10 | ||
JP1577511S (zh) * | 2016-11-15 | 2017-05-29 | ||
JP1603358S (zh) * | 2017-10-19 | 2018-05-07 | ||
JP1603359S (zh) * | 2017-10-19 | 2018-05-07 | ||
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD906271S1 (en) * | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
JP1632999S (zh) * | 2018-06-12 | 2019-06-03 | ||
CN112216658A (zh) * | 2019-07-10 | 2021-01-12 | 恩智浦美国有限公司 | 具有适应各种管芯尺寸的引线框架的半导体器件 |
USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
JP1711418S (ja) * | 2021-10-13 | 2022-03-31 | 半導体素子 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0257681A3 (en) * | 1986-08-27 | 1990-02-07 | STMicroelectronics S.r.l. | Method for manufacturing plastic encapsulated semiconductor devices and devices obtained thereby |
JPH01171256A (ja) * | 1987-12-25 | 1989-07-06 | Fuji Electric Co Ltd | 半導体装置の組立構造 |
JPH02306639A (ja) * | 1989-05-22 | 1990-12-20 | Toshiba Corp | 半導体装置の樹脂封入方法 |
JPH0565746A (ja) * | 1991-09-05 | 1993-03-19 | Toray Ind Inc | 繊維補強水硬性無機質材料 |
IT1252136B (it) * | 1991-11-29 | 1995-06-05 | St Microelectronics Srl | Struttura di dispositivo a semiconduttore con dissipatore metallico e corpo in plastica, con mezzi per una connessione elettrica al dissipatore di alta affidabilita' |
US5328870A (en) * | 1992-01-17 | 1994-07-12 | Amkor Electronics, Inc. | Method for forming plastic molded package with heat sink for integrated circuit devices |
US5387554A (en) * | 1992-09-10 | 1995-02-07 | Vlsi Technology, Inc. | Apparatus and method for thermally coupling a heat sink to a lead frame |
KR940016705A (ko) * | 1992-12-14 | 1994-07-23 | 김광호 | 반도체장치 |
US5394607A (en) * | 1993-05-20 | 1995-03-07 | Texas Instruments Incorporated | Method of providing low cost heat sink |
US5420752A (en) * | 1993-08-18 | 1995-05-30 | Lsi Logic Corporation | GPT system for encapsulating an integrated circuit package |
JP3362530B2 (ja) * | 1993-12-16 | 2003-01-07 | セイコーエプソン株式会社 | 樹脂封止型半導体装置およびその製造方法 |
US5486720A (en) * | 1994-05-26 | 1996-01-23 | Analog Devices, Inc. | EMF shielding of an integrated circuit package |
US5886396A (en) * | 1995-06-05 | 1999-03-23 | Motorola, Inc. | Leadframe assembly for conducting thermal energy from a semiconductor die disposed in a package |
US5770479A (en) * | 1996-01-11 | 1998-06-23 | Micron Technology, Inc. | Bonding support for leads-over-chip process |
US5798570A (en) * | 1996-06-28 | 1998-08-25 | Kabushiki Kaisha Gotoh Seisakusho | Plastic molded semiconductor package with thermal dissipation means |
-
1996
- 1996-11-14 US US08/749,215 patent/US5798570A/en not_active Expired - Fee Related
-
1997
- 1997-05-28 TW TW086107226A patent/TW353790B/zh active
- 1997-05-28 TW TW086107224A patent/TW349249B/zh active
- 1997-06-26 KR KR1019970027505A patent/KR100263513B1/ko not_active IP Right Cessation
- 1997-06-27 US US08/884,504 patent/US6020649A/en not_active Expired - Fee Related
- 1997-06-27 KR KR1019970027941A patent/KR100263514B1/ko not_active IP Right Cessation
-
1999
- 1999-11-01 US US09/431,185 patent/US6274408B1/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI574441B (zh) * | 2014-04-15 | 2017-03-11 | 聖約翰科技大學 | 可撓性發光二極體之連續加工裝置 |
Also Published As
Publication number | Publication date |
---|---|
KR980006155A (ko) | 1998-03-30 |
KR980006162A (ko) | 1998-03-30 |
TW353790B (en) | 1999-03-01 |
US5798570A (en) | 1998-08-25 |
US6020649A (en) | 2000-02-01 |
US6274408B1 (en) | 2001-08-14 |
KR100263513B1 (ko) | 2000-08-01 |
KR100263514B1 (ko) | 2000-08-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW349249B (en) | Resin-packaged type semiconductor device having a heat sink | |
TW328156B (en) | Resin-sealing type semiconductor and method of manufacture thereof | |
MY114547A (en) | Thin type semiconductor device, module structure using the device and method of mounting the device on board | |
KR0119464B1 (en) | Semiconductor device and lead frame | |
SG80675A1 (en) | Semiconductor device and its manufacturing method | |
EP0214719A3 (en) | Mounting an integrated circuit chip to an etched circuit board | |
TW371358B (en) | Semiconductor device | |
US4117508A (en) | Pressurizable semiconductor pellet assembly | |
TW339455B (en) | An electrode structure of semiconductor integrated circuit and method for forming the package therefor | |
EP1187202A3 (en) | Semiconductor package | |
IT1252136B (it) | Struttura di dispositivo a semiconduttore con dissipatore metallico e corpo in plastica, con mezzi per una connessione elettrica al dissipatore di alta affidabilita' | |
EP0218438A3 (en) | Apparatus for mounting a semiconductor chip and making electrical connections thereto | |
DE59504284D1 (de) | Trägerelement für integrierten schaltkreis | |
KR970067728A (ko) | 반도체 장치 | |
TW347585B (en) | Lead frame, semiconductor device using the same and manufacturing of semiconductor device thereof | |
MY133357A (en) | A semiconductor device and a method of manufacturing the same | |
TW375816B (en) | Semiconductor device | |
EP0179577A3 (en) | Method for making a semiconductor device having conductor pins | |
SG77704A1 (en) | Semiconductor device and method of fabricating the same | |
TW358990B (en) | Lead frame, semiconductor package having the same and method for manufacturing the same | |
TW345708B (en) | Resin sealed semiconductor device and metal die plate therefor | |
TW345726B (en) | Semiconductor chip, semiconductor device having such semiconductor chip installed therein, and method for making the semiconductor device | |
KR880002260A (ko) | 열적으로 향상된 대규모 집적회로 패키지 및 집적회로 다이의 장착방법 | |
TW370698B (en) | Package with carrier | |
TW354856B (en) | Semiconductor chip package having combined structure of lead-on-chip leads on chip leads and standard normal leads |