TW346650B - Source/drain implanted buffer oxide layer with improved hot carrier reliability - Google Patents

Source/drain implanted buffer oxide layer with improved hot carrier reliability

Info

Publication number
TW346650B
TW346650B TW085100933A TW85100933A TW346650B TW 346650 B TW346650 B TW 346650B TW 085100933 A TW085100933 A TW 085100933A TW 85100933 A TW85100933 A TW 85100933A TW 346650 B TW346650 B TW 346650B
Authority
TW
Taiwan
Prior art keywords
oxide layer
source
forming
hot carrier
ion implantation
Prior art date
Application number
TW085100933A
Other languages
Chinese (zh)
Inventor
Jong-Jyh Liaw
Shean-Wei Jin
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Priority to TW085100933A priority Critical patent/TW346650B/en
Application granted granted Critical
Publication of TW346650B publication Critical patent/TW346650B/en

Links

Landscapes

  • Thin Film Transistor (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)

Abstract

A source/drain implanted buffer oxide layer with improved hot carrier reliability, which comprises: defining and forming a gate on a silicon substrate; applying a lightly doped ion implantation thereby forming a component lightly doped region; depositing/etching back an insulative material thereby forming a side wall layer attached to the gate; globally depositing a thin oxide layer covering the surface of the component; and applying a high concentration ion implantation thereby forming a component source/drain region; using the covering thin oxide layer as a buffer material layer for the following ion implantation thereby reducing the depth of the formed region and the extent of inward lateral diffusion.
TW085100933A 1996-01-26 1996-01-26 Source/drain implanted buffer oxide layer with improved hot carrier reliability TW346650B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW085100933A TW346650B (en) 1996-01-26 1996-01-26 Source/drain implanted buffer oxide layer with improved hot carrier reliability

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW085100933A TW346650B (en) 1996-01-26 1996-01-26 Source/drain implanted buffer oxide layer with improved hot carrier reliability

Publications (1)

Publication Number Publication Date
TW346650B true TW346650B (en) 1998-12-01

Family

ID=58263918

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085100933A TW346650B (en) 1996-01-26 1996-01-26 Source/drain implanted buffer oxide layer with improved hot carrier reliability

Country Status (1)

Country Link
TW (1) TW346650B (en)

Similar Documents

Publication Publication Date Title
TW353773B (en) Semiconductor device and manufacturing method
EP0827205A3 (en) Method for manufacturing a semiconductor device
TW338193B (en) Non-volatile semiconductor memory
TW362290B (en) Semiconductor component and manufacturing method thereof
SE9501310D0 (en) A method for introducing an impurity dopant into SiC, a semiconductor device formed by the method and using a highly doped amorphous layer as a source for dopant diffusion into SiC
TW344899B (en) Semiconductor device and process for producing the same
KR960015811A (en) Active region implantation method using phosphorus to improve short channel performance of surface channel PMOS device
TW335554B (en) Semiconductor component with compensation implantation and method for production
TW369683B (en) A method for forming a semiconductor device having a shallow junction and a low sheet resistance
IE852964L (en) Trench transistor
MY124533A (en) Semiconductor device and method of manufacturing same
TW346650B (en) Source/drain implanted buffer oxide layer with improved hot carrier reliability
EP0401113A3 (en) Semiconductor device and production method thereof
EP0220108A3 (en) Side-wall doping for trench isolation
JPS6447076A (en) Manufacture of mos type thin film transistor
TW429512B (en) Semiconductor device and method for manufacturing the same
TW344108B (en) A bipolar transistor and method of manufacturing thereof
TW239226B (en) Process for VDMOS transistor
KR100352930B1 (en) Method for manufacturing semiconductor device
TW360975B (en) Semiconductor device having field isolating film of which upper surface is flat and method thereof
KR970011378B1 (en) Mosfet manufacturing method
TW222708B (en) Mask ROM
TW230267B (en) Fabricating method for WSi/polysilicon gate with sacrificing layer
TW259889B (en) Process of electric device isolation
TW231373B (en) Fabricating method for EEPROM IC with MONOS/MNOS structrue

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent