TW344862B - Manufacture of semiconductor wafer - Google Patents
Manufacture of semiconductor waferInfo
- Publication number
- TW344862B TW344862B TW086107020A TW86107020A TW344862B TW 344862 B TW344862 B TW 344862B TW 086107020 A TW086107020 A TW 086107020A TW 86107020 A TW86107020 A TW 86107020A TW 344862 B TW344862 B TW 344862B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor wafer
- manufacture
- wafer
- alkali
- etching
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8279819A JPH1092777A (ja) | 1996-09-12 | 1996-09-12 | 半導体ウェハの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW344862B true TW344862B (en) | 1998-11-11 |
Family
ID=17616364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086107020A TW344862B (en) | 1996-09-12 | 1997-05-24 | Manufacture of semiconductor wafer |
Country Status (3)
Country | Link |
---|---|
US (1) | US5899731A (zh) |
JP (1) | JPH1092777A (zh) |
TW (1) | TW344862B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI650811B (zh) * | 2016-09-26 | 2019-02-11 | 日商斯庫林集團股份有限公司 | 基板處理方法及基板處理裝置 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6239039B1 (en) * | 1997-12-09 | 2001-05-29 | Shin-Etsu Handotai Co., Ltd. | Semiconductor wafers processing method and semiconductor wafers produced by the same |
MY119304A (en) * | 1997-12-11 | 2005-04-30 | Shinetsu Handotai Kk | Silicon wafer etching method and silicon wafer etchant |
US6395085B2 (en) | 1999-07-14 | 2002-05-28 | Seh America, Inc. | Purity silicon wafer for use in advanced semiconductor devices |
US6454852B2 (en) | 1999-07-14 | 2002-09-24 | Seh America, Inc. | High efficiency silicon wafer optimized for advanced semiconductor devices |
US6632277B2 (en) | 1999-07-14 | 2003-10-14 | Seh America, Inc. | Optimized silicon wafer gettering for advanced semiconductor devices |
US6716722B1 (en) | 1999-07-15 | 2004-04-06 | Shin-Etsu Handotai Co., Ltd. | Method of producing a bonded wafer and the bonded wafer |
KR100297738B1 (ko) * | 1999-10-07 | 2001-11-02 | 윤종용 | 챔퍼가 형성된 금속 실리사이드층을 갖춘 반도체소자의 제조방법 |
EP1313135A1 (en) * | 2000-06-29 | 2003-05-21 | Shin-Etsu Handotai Co., Ltd | Method for processing semiconductor wafer and semiconductor wafer |
JP2003068996A (ja) * | 2001-08-22 | 2003-03-07 | Sumitomo Mitsubishi Silicon Corp | 張り合わせシリコン基板の製造方法 |
JP2003163335A (ja) * | 2001-11-27 | 2003-06-06 | Shin Etsu Handotai Co Ltd | 貼り合わせウェーハの製造方法 |
EP1699075B1 (en) | 2003-12-05 | 2012-11-21 | SUMCO Corporation | Method for manufacturing single-side mirror surface wafer |
JP2005203507A (ja) * | 2004-01-14 | 2005-07-28 | Siltronic Japan Corp | 半導体ウェーハの加工方法および半導体ウェーハ処理装置 |
JP4857738B2 (ja) * | 2005-11-30 | 2012-01-18 | 信越半導体株式会社 | 半導体ウエーハの洗浄方法および製造方法 |
JP2007150167A (ja) * | 2005-11-30 | 2007-06-14 | Shin Etsu Handotai Co Ltd | 半導体ウエーハの平面研削方法および製造方法 |
US20080206992A1 (en) * | 2006-12-29 | 2008-08-28 | Siltron Inc. | Method for manufacturing high flatness silicon wafer |
JP2009200360A (ja) * | 2008-02-22 | 2009-09-03 | Tkx:Kk | シリコン部材の表面処理方法 |
JP6898737B2 (ja) * | 2014-12-15 | 2021-07-07 | シャープ株式会社 | 半導体基板の製造方法、光電変換素子の製造方法および光電変換素子 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08126873A (ja) * | 1994-10-28 | 1996-05-21 | Nec Corp | 電子部品等の洗浄方法及び装置 |
-
1996
- 1996-09-12 JP JP8279819A patent/JPH1092777A/ja active Pending
-
1997
- 1997-05-24 TW TW086107020A patent/TW344862B/zh active
- 1997-09-10 US US08/927,034 patent/US5899731A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI650811B (zh) * | 2016-09-26 | 2019-02-11 | 日商斯庫林集團股份有限公司 | 基板處理方法及基板處理裝置 |
Also Published As
Publication number | Publication date |
---|---|
JPH1092777A (ja) | 1998-04-10 |
US5899731A (en) | 1999-05-04 |
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