TW329030B - Resist patterns - Google Patents

Resist patterns

Info

Publication number
TW329030B
TW329030B TW086102729A TW86102729A TW329030B TW 329030 B TW329030 B TW 329030B TW 086102729 A TW086102729 A TW 086102729A TW 86102729 A TW86102729 A TW 86102729A TW 329030 B TW329030 B TW 329030B
Authority
TW
Taiwan
Prior art keywords
resist
resist patterns
patterns
organci
achemically
Prior art date
Application number
TW086102729A
Other languages
English (en)
Inventor
Shin Takahashi
Satoshi Takechi
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of TW329030B publication Critical patent/TW329030B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/322—Aqueous alkaline compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW086102729A 1996-03-07 1997-03-06 Resist patterns TW329030B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04994696A JP3707856B2 (ja) 1996-03-07 1996-03-07 レジストパターンの形成方法

Publications (1)

Publication Number Publication Date
TW329030B true TW329030B (en) 1998-04-01

Family

ID=12845199

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086102729A TW329030B (en) 1996-03-07 1997-03-06 Resist patterns

Country Status (4)

Country Link
US (1) US6699645B2 (zh)
JP (1) JP3707856B2 (zh)
KR (1) KR100235209B1 (zh)
TW (1) TW329030B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6280911B1 (en) * 1998-09-10 2001-08-28 Shipley Company, L.L.C. Photoresist compositions comprising blends of ionic and non-ionic photoacid generators
JP3904795B2 (ja) * 2000-03-15 2007-04-11 株式会社東芝 基板処理方法及び基板処理装置
JP2002169299A (ja) * 2000-09-21 2002-06-14 Tokuyama Corp フォトレジスト現像液
DE10153496B4 (de) * 2001-10-31 2007-01-04 Infineon Technologies Ag Verfahren zur Aromatisierung und Cycloaliphatisierung von Fotoresists im UV-Bereich
JP4045180B2 (ja) * 2002-12-03 2008-02-13 Ａｚエレクトロニックマテリアルズ株式会社 リソグラフィー用リンス液およびそれを用いたレジストパターン形成方法
JP4146755B2 (ja) * 2003-05-09 2008-09-10 松下電器産業株式会社 パターン形成方法
KR20070034519A (ko) * 2004-05-27 2007-03-28 이 아이 듀폰 디 네모아 앤드 캄파니 광감성 중합체 보호층용 현상제
US7776758B2 (en) * 2004-06-08 2010-08-17 Nanosys, Inc. Methods and devices for forming nanostructure monolayers and devices including such monolayers
US8563133B2 (en) 2004-06-08 2013-10-22 Sandisk Corporation Compositions and methods for modulation of nanostructure energy levels
JP5000510B2 (ja) 2004-06-08 2012-08-15 ナノシス・インク． ナノ構造単層の形成方法および形成デバイスならびにかかる単層を含むデバイス
US7968273B2 (en) * 2004-06-08 2011-06-28 Nanosys, Inc. Methods and devices for forming nanostructure monolayers and devices including such monolayers
KR20060017170A (ko) * 2004-08-20 2006-02-23 동부아남반도체 주식회사 감광막 패턴 형성 방법
JP4797725B2 (ja) * 2006-03-17 2011-10-19 凸版印刷株式会社 レジスト用現像液組成物
US8317984B2 (en) * 2009-04-16 2012-11-27 Northrop Grumman Systems Corporation Graphene oxide deoxygenation
JP5537859B2 (ja) * 2009-07-31 2014-07-02 富士フイルム株式会社 化学増幅型レジスト組成物によるパターン形成用の処理液及びそれを用いたレジストパターン形成方法
JP5850607B2 (ja) * 2010-09-28 2016-02-03 富士フイルム株式会社 パターン形成方法、化学増幅型レジスト組成物及びレジスト膜
JP5618924B2 (ja) * 2011-06-30 2014-11-05 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、該組成物を用いたレジスト膜及びパターン形成方法、並びに電子デバイスの製造方法及び電子デバイス
RU2015104902A (ru) * 2012-07-16 2016-09-10 Басф Се Композиция, используемая в изготовлении интегральных схем, оптических устройств, микромашин и механических прецизионных устройств

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3891439A (en) * 1972-11-02 1975-06-24 Polychrome Corp Aqueous developing composition for lithographic diazo printing plates
JPH063549B2 (ja) * 1984-12-25 1994-01-12 株式会社東芝 ポジ型フォトレジスト現像液組成物
JPH0638159B2 (ja) * 1986-07-18 1994-05-18 東京応化工業株式会社 ポジ型ホトレジスト用現像液
US5094934A (en) * 1987-04-06 1992-03-10 Morton International, Inc. Method of developing a high contrast, positive photoresist using a developer containing alkanolamine
JP2626992B2 (ja) * 1988-05-10 1997-07-02 富士写真フイルム株式会社 感光性平版印刷版用現像液組成物及び現像方法
JPH02275956A (ja) * 1988-12-23 1990-11-09 Oki Electric Ind Co Ltd フォトレジスト組成物
US5252436A (en) * 1989-12-15 1993-10-12 Basf Aktiengesellschaft Process for developing a positive-working photoresist containing poly(p-hydroxystyrene) and sulfonium salt with an aqueous developer containing basic organic compounds
JP2881969B2 (ja) 1990-06-05 1999-04-12 富士通株式会社 放射線感光レジストとパターン形成方法
US5326674A (en) * 1991-04-30 1994-07-05 Fuji Photo Film Co., Ltd. Method for processing photosensitive copying materials
JP2898143B2 (ja) 1991-06-12 1999-05-31 三井化学株式会社 感光液組成物、感光性フィルム及び積層板
JP3221909B2 (ja) * 1992-03-12 2001-10-22 富士通株式会社 フォトレジスト材料およびそれを用いるパターン形成方法
JPH05257285A (ja) 1992-03-12 1993-10-08 Fujitsu Ltd 放射線感光材料およびそれを用いるパターン形成方法
JPH05265212A (ja) * 1992-03-17 1993-10-15 Fujitsu Ltd レジスト材料およびそれを用いるパターン形成方法
JP3568599B2 (ja) * 1993-12-28 2004-09-22 富士通株式会社 放射線感光材料及びパターン形成方法
JP2715881B2 (ja) * 1993-12-28 1998-02-18 日本電気株式会社 感光性樹脂組成物およびパターン形成方法
US5683856A (en) * 1994-10-18 1997-11-04 Fuji Photo Film Co., Ltd. Positive-working photosensitive composition

Also Published As

Publication number Publication date
KR970067574A (ko) 1997-10-13
US20010001703A1 (en) 2001-05-24
US6699645B2 (en) 2004-03-02
JP3707856B2 (ja) 2005-10-19
JPH09244261A (ja) 1997-09-19
KR100235209B1 (ko) 1999-12-15

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