TW327694B - The method for depositing oxynitride film on substrate by LPD - Google Patents
The method for depositing oxynitride film on substrate by LPDInfo
- Publication number
- TW327694B TW327694B TW086101045A TW86101045A TW327694B TW 327694 B TW327694 B TW 327694B TW 086101045 A TW086101045 A TW 086101045A TW 86101045 A TW86101045 A TW 86101045A TW 327694 B TW327694 B TW 327694B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- oxynitride film
- lpd
- solution
- silicon oxide
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1275—Process of deposition of the inorganic material performed under inert atmosphere
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW086101045A TW327694B (en) | 1997-01-30 | 1997-01-30 | The method for depositing oxynitride film on substrate by LPD |
US08/819,017 US5766692A (en) | 1997-01-30 | 1997-03-17 | Process for depositing oxynitride film on substrate by liquid phase deposition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW086101045A TW327694B (en) | 1997-01-30 | 1997-01-30 | The method for depositing oxynitride film on substrate by LPD |
Publications (1)
Publication Number | Publication Date |
---|---|
TW327694B true TW327694B (en) | 1998-03-01 |
Family
ID=21626355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086101045A TW327694B (en) | 1997-01-30 | 1997-01-30 | The method for depositing oxynitride film on substrate by LPD |
Country Status (2)
Country | Link |
---|---|
US (1) | US5766692A (zh) |
TW (1) | TW327694B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6689645B2 (en) | 2000-12-05 | 2004-02-10 | National Science Council | Method of surface treatment on the improvement of electrical properties for doped silicon oxides (SiO2) films |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6294832B1 (en) * | 2000-04-10 | 2001-09-25 | National Science Council | Semiconductor device having structure of copper interconnect/barrier dielectric liner/low-k dielectric trench and its fabrication method |
US6607984B1 (en) * | 2000-06-20 | 2003-08-19 | International Business Machines Corporation | Removable inorganic anti-reflection coating process |
JP5185598B2 (ja) * | 2007-11-06 | 2013-04-17 | 株式会社ジャパンディスプレイイースト | 有機el表示装置およびその製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5565376A (en) * | 1994-07-12 | 1996-10-15 | United Microelectronics Corp. | Device isolation technology by liquid phase deposition |
-
1997
- 1997-01-30 TW TW086101045A patent/TW327694B/zh not_active IP Right Cessation
- 1997-03-17 US US08/819,017 patent/US5766692A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6689645B2 (en) | 2000-12-05 | 2004-02-10 | National Science Council | Method of surface treatment on the improvement of electrical properties for doped silicon oxides (SiO2) films |
Also Published As
Publication number | Publication date |
---|---|
US5766692A (en) | 1998-06-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |