TW327242B - Method of global planarization in fabricating integrated circuit devices - Google Patents

Method of global planarization in fabricating integrated circuit devices

Info

Publication number
TW327242B
TW327242B TW085111201A TW85111201A TW327242B TW 327242 B TW327242 B TW 327242B TW 085111201 A TW085111201 A TW 085111201A TW 85111201 A TW85111201 A TW 85111201A TW 327242 B TW327242 B TW 327242B
Authority
TW
Taiwan
Prior art keywords
substrate
sacrificial material
integrated circuit
circuit devices
fabricating integrated
Prior art date
Application number
TW085111201A
Other languages
English (en)
Inventor
Paul Schwartz Gary
Original Assignee
At&T Tcorporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At&T Tcorporation filed Critical At&T Tcorporation
Application granted granted Critical
Publication of TW327242B publication Critical patent/TW327242B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW085111201A 1995-11-07 1996-09-13 Method of global planarization in fabricating integrated circuit devices TW327242B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/554,501 US5885900A (en) 1995-11-07 1995-11-07 Method of global planarization in fabricating integrated circuit devices

Publications (1)

Publication Number Publication Date
TW327242B true TW327242B (en) 1998-02-21

Family

ID=24213600

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085111201A TW327242B (en) 1995-11-07 1996-09-13 Method of global planarization in fabricating integrated circuit devices

Country Status (5)

Country Link
US (1) US5885900A (zh)
EP (1) EP0773581A1 (zh)
JP (1) JPH09167800A (zh)
KR (1) KR970030624A (zh)
TW (1) TW327242B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6395620B1 (en) * 1996-10-08 2002-05-28 Micron Technology, Inc. Method for forming a planar surface over low density field areas on a semiconductor wafer
JP3111928B2 (ja) 1997-05-14 2000-11-27 日本電気株式会社 金属膜の研磨方法
US6280644B1 (en) * 1998-06-05 2001-08-28 Agere Systems Guardian Corp. Method of planarizing a surface on an integrated circuit
US6180525B1 (en) 1998-08-19 2001-01-30 Micron Technology, Inc. Method of minimizing repetitive chemical-mechanical polishing scratch marks and of processing a semiconductor wafer outer surface
US6140200A (en) 1998-09-02 2000-10-31 Micron Technology, Inc. Methods of forming void regions dielectric regions and capacitor constructions
US6051496A (en) * 1998-09-17 2000-04-18 Taiwan Semiconductor Manufacturing Company Use of stop layer for chemical mechanical polishing of CU damascene
US6287972B1 (en) * 1999-03-04 2001-09-11 Philips Semiconductor, Inc. System and method for residue entrapment utilizing a polish and sacrificial fill for semiconductor fabrication
US6258711B1 (en) * 1999-04-19 2001-07-10 Speedfam-Ipec Corporation Sacrificial deposit to improve damascene pattern planarization in semiconductor wafers
DE10022656B4 (de) * 2000-04-28 2006-07-06 Infineon Technologies Ag Verfahren zum Entfernen von Strukturen
KR100363093B1 (ko) * 2000-07-28 2002-12-05 삼성전자 주식회사 반도체 소자의 층간 절연막 평탄화 방법
US6383935B1 (en) 2000-10-16 2002-05-07 Taiwan Semiconductor Manufacturing Company Method of reducing dishing and erosion using a sacrificial layer
DE10147929C1 (de) * 2001-09-28 2003-04-17 Infineon Technologies Ag Verfahren zum Herstellen einer Halbleiterstruktur und Verwendung des Verfahrens
KR100439047B1 (ko) * 2001-12-29 2004-07-05 주식회사 하이닉스반도체 반도체 소자의 평탄화 방법
TWI237327B (en) * 2003-11-18 2005-08-01 Powerchip Semiconductor Corp Method of forming barrier layer
US7393789B2 (en) * 2005-09-01 2008-07-01 Micron Technology, Inc. Protective coating for planarization
US7838427B2 (en) * 2006-01-13 2010-11-23 Taiwan Semiconductor Manufacturing Co., Ltd. Method for planarization
US7923373B2 (en) 2007-06-04 2011-04-12 Micron Technology, Inc. Pitch multiplication using self-assembling materials
US20090133908A1 (en) * 2007-11-28 2009-05-28 Goodner Michael D Interconnect structure for a microelectronic device, method of manfacturing same, and microelectronic structure containing same
US20120264300A1 (en) * 2011-04-13 2012-10-18 Nanya Technology Corporation Method of fabricating semiconductor component
CN103854967B (zh) * 2012-11-30 2017-09-22 中国科学院微电子研究所 平坦化处理方法
DE102015106441B4 (de) * 2015-04-27 2022-01-27 Infineon Technologies Ag Verfahren zum Planarisieren eines Halbleiterwafers

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB375258A (en) * 1930-02-19 1932-06-23 Renault Louis Improvements in or relating to the ports of internal combustion engines
US4671851A (en) * 1985-10-28 1987-06-09 International Business Machines Corporation Method for removing protuberances at the surface of a semiconductor wafer using a chem-mech polishing technique
US4944836A (en) * 1985-10-28 1990-07-31 International Business Machines Corporation Chem-mech polishing method for producing coplanar metal/insulator films on a substrate
US4874463A (en) * 1988-12-23 1989-10-17 At&T Bell Laboratories Integrated circuits from wafers having improved flatness
US5284804A (en) * 1991-12-31 1994-02-08 Texas Instruments Incorporated Global planarization process
US5312512A (en) * 1992-10-23 1994-05-17 Ncr Corporation Global planarization using SOG and CMP
US5362669A (en) * 1993-06-24 1994-11-08 Northern Telecom Limited Method of making integrated circuits
JPH07249626A (ja) * 1994-03-10 1995-09-26 Toshiba Corp 半導体装置の製造方法
US5516729A (en) * 1994-06-03 1996-05-14 Advanced Micro Devices, Inc. Method for planarizing a semiconductor topography using a spin-on glass material with a variable chemical-mechanical polish rate

Also Published As

Publication number Publication date
JPH09167800A (ja) 1997-06-24
EP0773581A1 (en) 1997-05-14
KR970030624A (ko) 1997-06-26
US5885900A (en) 1999-03-23

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