TW301013B - The method and apparatus for cleaning & drying semiconductor - Google Patents
The method and apparatus for cleaning & drying semiconductor Download PDFInfo
- Publication number
- TW301013B TW301013B TW85102118A TW85102118A TW301013B TW 301013 B TW301013 B TW 301013B TW 85102118 A TW85102118 A TW 85102118A TW 85102118 A TW85102118 A TW 85102118A TW 301013 B TW301013 B TW 301013B
- Authority
- TW
- Taiwan
- Prior art keywords
- water
- organic solvent
- layer
- supply
- washing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/14—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects using gases or vapours other than air or steam, e.g. inert gases
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/005—Drying solid materials or objects by processes not involving the application of heat by dipping them into or mixing them with a chemical liquid, e.g. organic; chemical, e.g. organic, dewatering aids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Molecular Biology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24969895 | 1995-09-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW301013B true TW301013B (en) | 1997-03-21 |
Family
ID=17196879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW85102118A TW301013B (en) | 1995-09-27 | 1996-02-23 | The method and apparatus for cleaning & drying semiconductor |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW301013B (fr) |
WO (1) | WO1997012392A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3036478B2 (ja) * | 1997-08-08 | 2000-04-24 | 日本電気株式会社 | ウェハの洗浄及び乾燥方法 |
US5954888A (en) * | 1998-02-09 | 1999-09-21 | Speedfam Corporation | Post-CMP wet-HF cleaning station |
CN102446702B (zh) * | 2010-10-15 | 2014-03-19 | 中芯国际集成电路制造(北京)有限公司 | 湿法处理方法及回蚀方法 |
TW202205409A (zh) * | 2020-04-07 | 2022-02-01 | 日商東京威力科創股份有限公司 | 基板處理方法及基板處理裝置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03104225A (ja) * | 1989-09-19 | 1991-05-01 | Taiyo Sanso Co Ltd | 固体表面の洗浄・乾燥方法 |
JPH03218014A (ja) * | 1990-01-23 | 1991-09-25 | Matsushita Electron Corp | 半導体装置の製造方法 |
-
1996
- 1996-01-29 WO PCT/JP1996/000164 patent/WO1997012392A1/fr active Application Filing
- 1996-02-23 TW TW85102118A patent/TW301013B/zh active
Also Published As
Publication number | Publication date |
---|---|
WO1997012392A1 (fr) | 1997-04-03 |
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