TW235346B - - Google Patents

Info

Publication number
TW235346B
TW235346B TW082101225A TW82101225A TW235346B TW 235346 B TW235346 B TW 235346B TW 082101225 A TW082101225 A TW 082101225A TW 82101225 A TW82101225 A TW 82101225A TW 235346 B TW235346 B TW 235346B
Authority
TW
Taiwan
Application number
TW082101225A
Original Assignee
Oku Seisakusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oku Seisakusho Kk filed Critical Oku Seisakusho Kk
Application granted granted Critical
Publication of TW235346B publication Critical patent/TW235346B/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2022Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/2032Simultaneous exposure of the front side and the backside
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0094Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Projection-Type Copiers In General (AREA)
TW082101225A 1992-03-19 1993-02-22 TW235346B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4062971A JPH05265220A (ja) 1992-03-19 1992-03-19 基板傾斜式露光装置

Publications (1)

Publication Number Publication Date
TW235346B true TW235346B (zh) 1994-12-01

Family

ID=13215746

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082101225A TW235346B (zh) 1992-03-19 1993-02-22

Country Status (5)

Country Link
EP (1) EP0561486B1 (zh)
JP (1) JPH05265220A (zh)
KR (1) KR930020224A (zh)
DE (1) DE69314684T2 (zh)
TW (1) TW235346B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6214525B1 (en) 1996-09-06 2001-04-10 International Business Machines Corp. Printed circuit board with circuitized cavity and methods of producing same
US7008483B2 (en) * 2002-04-19 2006-03-07 Hewlett-Packard Development Company, L.P. Curing printed circuit board coatings
JP2007142265A (ja) * 2005-11-21 2007-06-07 Fuji Koken Kk 露光装置及び露光方法
TW201015230A (en) * 2008-10-03 2010-04-16 Univ Nat Chiao Tung Immersion inclined lithography apparatus and tank thereof
JP6149214B2 (ja) * 2013-03-26 2017-06-21 サンエー技研株式会社 露光装置、露光方法
JP6053154B2 (ja) * 2013-03-28 2016-12-27 リンテック株式会社 光照射装置および光照射方法
JP7383341B2 (ja) * 2019-11-27 2023-11-20 株式会社オーク製作所 ダイレクト露光装置および基板の露光方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6340157A (ja) * 1986-08-06 1988-02-20 Mitsubishi Electric Corp 露光機
JPH02254456A (ja) * 1989-03-29 1990-10-15 Orc Mfg Co Ltd フォトレジスト露光方法およびその装置
JPH07111583B2 (ja) * 1989-04-21 1995-11-29 株式会社オーク製作所 入射角可変用露光装置
US5147760A (en) * 1989-07-21 1992-09-15 Mitsubishi Denki Kabushiki Kaisha Method of exposing printed wiring boards having through holes

Also Published As

Publication number Publication date
KR930020224A (ko) 1993-10-19
DE69314684D1 (de) 1997-11-27
EP0561486B1 (en) 1997-10-22
DE69314684T2 (de) 1998-02-19
EP0561486A1 (en) 1993-09-22
JPH05265220A (ja) 1993-10-15

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