TW233340B - - Google Patents

Info

Publication number
TW233340B
TW233340B TW083102365A TW83102365A TW233340B TW 233340 B TW233340 B TW 233340B TW 083102365 A TW083102365 A TW 083102365A TW 83102365 A TW83102365 A TW 83102365A TW 233340 B TW233340 B TW 233340B
Authority
TW
Taiwan
Application number
TW083102365A
Original Assignee
Seiko Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Electron Co Ltd filed Critical Seiko Electron Co Ltd
Application granted granted Critical
Publication of TW233340B publication Critical patent/TW233340B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Image Analysis (AREA)
TW083102365A 1993-03-19 1994-03-18 TW233340B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06052493A JP3258118B2 (ja) 1993-03-19 1993-03-19 帯状の試料の中心を検出する方法

Publications (1)

Publication Number Publication Date
TW233340B true TW233340B (zh) 1994-11-01

Family

ID=13144793

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083102365A TW233340B (zh) 1993-03-19 1994-03-18

Country Status (5)

Country Link
US (1) US5425066A (zh)
JP (1) JP3258118B2 (zh)
KR (1) KR100288330B1 (zh)
GB (1) GB2276448B (zh)
TW (1) TW233340B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI665446B (zh) * 2014-06-13 2019-07-11 日商日立高新技術科學股份有限公司 螢光ｘ射線分析裝置

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2964137B2 (ja) * 1997-04-08 1999-10-18 セイコーインスツルメンツ株式会社 試料中心を検出できる蛍光ｘ線分析装置
RU2180439C2 (ru) * 2000-02-11 2002-03-10 Кумахов Мурадин Абубекирович Способ получения изображения внутренней структуры объекта с использованием рентгеновского излучения и устройство для его осуществления
US7804934B2 (en) 2004-12-22 2010-09-28 Jordan Valley Semiconductors Ltd. Accurate measurement of layer dimensions using XRF
CN101164230A (zh) 2005-04-25 2008-04-16 松下电器产业株式会社 自动增益控制电路和信号再现装置
IL180482A0 (en) * 2007-01-01 2007-06-03 Jordan Valley Semiconductors Inspection of small features using x - ray fluorescence
US8447549B2 (en) * 2011-02-11 2013-05-21 Quality Vision International, Inc. Tolerance evaluation with reduced measured points
US9390984B2 (en) 2011-10-11 2016-07-12 Bruker Jv Israel Ltd. X-ray inspection of bumps on a semiconductor substrate
US9389192B2 (en) 2013-03-24 2016-07-12 Bruker Jv Israel Ltd. Estimation of XRF intensity from an array of micro-bumps
US9632043B2 (en) 2014-05-13 2017-04-25 Bruker Jv Israel Ltd. Method for accurately determining the thickness and/or elemental composition of small features on thin-substrates using micro-XRF
US9829448B2 (en) 2014-10-30 2017-11-28 Bruker Jv Israel Ltd. Measurement of small features using XRF
JP2022013497A (ja) 2020-07-03 2022-01-18 株式会社日立ハイテクサイエンス Ｘ線分析装置
DE102021116258A1 (de) 2021-06-23 2022-12-29 Helmut Fischer GmbH Institut für Elektronik und Messtechnik Messobjekt, Verfahren und Vorrichtung zum Betreiben einer Röntgenquelle
CN113945591B (zh) * 2021-09-14 2023-10-24 中国电子科技集团公司第十一研究所 一种半峰宽自动化测试工装

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE292540C (zh) *
JP2748128B2 (ja) * 1988-09-07 1998-05-06 キヤノン株式会社 電子線発生装置
JP2613513B2 (ja) * 1991-11-05 1997-05-28 理学電機工業株式会社 蛍光ｘ線の分析方法
JPH0581700U (ja) * 1992-04-07 1993-11-05 セイコー電子工業株式会社 蛍光ｘ線膜厚測定装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI665446B (zh) * 2014-06-13 2019-07-11 日商日立高新技術科學股份有限公司 螢光ｘ射線分析裝置

Also Published As

Publication number Publication date
JPH06273146A (ja) 1994-09-30
KR100288330B1 (ko) 2002-02-19
GB9405402D0 (en) 1994-05-04
GB2276448A (en) 1994-09-28
US5425066A (en) 1995-06-13
GB2276448B (en) 1997-08-06
JP3258118B2 (ja) 2002-02-18
KR940022055A (ko) 1994-10-20

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Legal Events

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