TW233340B - - Google Patents
Info
- Publication number
- TW233340B TW233340B TW083102365A TW83102365A TW233340B TW 233340 B TW233340 B TW 233340B TW 083102365 A TW083102365 A TW 083102365A TW 83102365 A TW83102365 A TW 83102365A TW 233340 B TW233340 B TW 233340B
- Authority
- TW
- Taiwan
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Image Analysis (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP06052493A JP3258118B2 (ja) | 1993-03-19 | 1993-03-19 | 帯状の試料の中心を検出する方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW233340B true TW233340B (zh) | 1994-11-01 |
Family
ID=13144793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW083102365A TW233340B (zh) | 1993-03-19 | 1994-03-18 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5425066A (zh) |
JP (1) | JP3258118B2 (zh) |
KR (1) | KR100288330B1 (zh) |
GB (1) | GB2276448B (zh) |
TW (1) | TW233340B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI665446B (zh) * | 2014-06-13 | 2019-07-11 | 日商日立高新技術科學股份有限公司 | 螢光x射線分析裝置 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2964137B2 (ja) * | 1997-04-08 | 1999-10-18 | セイコーインスツルメンツ株式会社 | 試料中心を検出できる蛍光x線分析装置 |
RU2180439C2 (ru) * | 2000-02-11 | 2002-03-10 | Кумахов Мурадин Абубекирович | Способ получения изображения внутренней структуры объекта с использованием рентгеновского излучения и устройство для его осуществления |
US7804934B2 (en) | 2004-12-22 | 2010-09-28 | Jordan Valley Semiconductors Ltd. | Accurate measurement of layer dimensions using XRF |
CN101164230A (zh) | 2005-04-25 | 2008-04-16 | 松下电器产业株式会社 | 自动增益控制电路和信号再现装置 |
IL180482A0 (en) * | 2007-01-01 | 2007-06-03 | Jordan Valley Semiconductors | Inspection of small features using x - ray fluorescence |
US8447549B2 (en) * | 2011-02-11 | 2013-05-21 | Quality Vision International, Inc. | Tolerance evaluation with reduced measured points |
US9390984B2 (en) | 2011-10-11 | 2016-07-12 | Bruker Jv Israel Ltd. | X-ray inspection of bumps on a semiconductor substrate |
US9389192B2 (en) | 2013-03-24 | 2016-07-12 | Bruker Jv Israel Ltd. | Estimation of XRF intensity from an array of micro-bumps |
US9632043B2 (en) | 2014-05-13 | 2017-04-25 | Bruker Jv Israel Ltd. | Method for accurately determining the thickness and/or elemental composition of small features on thin-substrates using micro-XRF |
US9829448B2 (en) | 2014-10-30 | 2017-11-28 | Bruker Jv Israel Ltd. | Measurement of small features using XRF |
JP2022013497A (ja) | 2020-07-03 | 2022-01-18 | 株式会社日立ハイテクサイエンス | X線分析装置 |
DE102021116258A1 (de) | 2021-06-23 | 2022-12-29 | Helmut Fischer GmbH Institut für Elektronik und Messtechnik | Messobjekt, Verfahren und Vorrichtung zum Betreiben einer Röntgenquelle |
CN113945591B (zh) * | 2021-09-14 | 2023-10-24 | 中国电子科技集团公司第十一研究所 | 一种半峰宽自动化测试工装 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE292540C (zh) * | ||||
JP2748128B2 (ja) * | 1988-09-07 | 1998-05-06 | キヤノン株式会社 | 電子線発生装置 |
JP2613513B2 (ja) * | 1991-11-05 | 1997-05-28 | 理学電機工業株式会社 | 蛍光x線の分析方法 |
JPH0581700U (ja) * | 1992-04-07 | 1993-11-05 | セイコー電子工業株式会社 | 蛍光x線膜厚測定装置 |
-
1993
- 1993-03-19 JP JP06052493A patent/JP3258118B2/ja not_active Expired - Lifetime
-
1994
- 1994-03-17 KR KR1019940005384A patent/KR100288330B1/ko not_active IP Right Cessation
- 1994-03-18 US US08/210,387 patent/US5425066A/en not_active Expired - Lifetime
- 1994-03-18 GB GB9405402A patent/GB2276448B/en not_active Expired - Lifetime
- 1994-03-18 TW TW083102365A patent/TW233340B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI665446B (zh) * | 2014-06-13 | 2019-07-11 | 日商日立高新技術科學股份有限公司 | 螢光x射線分析裝置 |
Also Published As
Publication number | Publication date |
---|---|
JPH06273146A (ja) | 1994-09-30 |
KR100288330B1 (ko) | 2002-02-19 |
GB9405402D0 (en) | 1994-05-04 |
GB2276448A (en) | 1994-09-28 |
US5425066A (en) | 1995-06-13 |
GB2276448B (en) | 1997-08-06 |
JP3258118B2 (ja) | 2002-02-18 |
KR940022055A (ko) | 1994-10-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |