TW231396B - Copper foil for PCB and its process - Google Patents

Copper foil for PCB and its process

Info

Publication number
TW231396B
TW231396B TW083101482A TW83101482A TW231396B TW 231396 B TW231396 B TW 231396B TW 083101482 A TW083101482 A TW 083101482A TW 83101482 A TW83101482 A TW 83101482A TW 231396 B TW231396 B TW 231396B
Authority
TW
Taiwan
Prior art keywords
copper foil
pcb
layer
antirust
copper
Prior art date
Application number
TW083101482A
Other languages
English (en)
Chinese (zh)
Inventor
Tsuyoshi Akihiro
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Application granted granted Critical
Publication of TW231396B publication Critical patent/TW231396B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
TW083101482A 1994-02-15 1994-02-22 Copper foil for PCB and its process TW231396B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03931794A JP3292774B2 (ja) 1994-02-15 1994-02-15 プリント配線板用銅箔およびその製造方法

Publications (1)

Publication Number Publication Date
TW231396B true TW231396B (en) 1994-10-01

Family

ID=12549739

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083101482A TW231396B (en) 1994-02-15 1994-02-22 Copper foil for PCB and its process

Country Status (4)

Country Link
JP (1) JP3292774B2 (ja)
FR (1) FR2716329B1 (ja)
MY (1) MY113830A (ja)
TW (1) TW231396B (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100344445C (zh) * 2003-04-30 2007-10-24 美格株式会社 铜表面的对树脂粘接层
CN100363175C (zh) * 2003-04-30 2008-01-23 美格株式会社 粘接层形成液、使用该液的铜和树脂的粘接层的制造方法及其层压体
CN102783255A (zh) * 2010-02-24 2012-11-14 吉坤日矿日石金属株式会社 印刷电路基板用铜箔及印刷电路基板用覆铜层压板
CN104704137A (zh) * 2012-10-12 2015-06-10 三井金属矿业株式会社 表面处理铜箔、表面处理铜箔的制造方法、负极集电体及非水性二次电池的负极材料

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3142259B2 (ja) * 1998-11-30 2001-03-07 三井金属鉱業株式会社 耐薬品性および耐熱性に優れたプリント配線板用銅箔およびその製造方法
US6579568B2 (en) 1999-11-29 2003-06-17 Mitsui Mining & Smelting Co., Ltd. Copper foil for printed wiring board having excellent chemical resistance and heat resistance
JP2001177204A (ja) * 1999-12-15 2001-06-29 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びその表面処理銅箔の製造方法
JP3670185B2 (ja) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
JP3670186B2 (ja) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
JP3306404B2 (ja) * 2000-01-28 2002-07-24 三井金属鉱業株式会社 表面処理銅箔の製造方法及びその製造方法で得られた表面処理銅箔を用いた銅張積層板
JP3661763B2 (ja) * 2000-01-28 2005-06-22 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
JP3743702B2 (ja) 2000-04-28 2006-02-08 三井金属鉱業株式会社 プリント配線板のセミアディティブ製造法
JP4379854B2 (ja) 2001-10-30 2009-12-09 日鉱金属株式会社 表面処理銅箔
CN1301046C (zh) * 2002-05-13 2007-02-14 三井金属鉱业株式会社 膜上芯片用软性印刷线路板
JP5116943B2 (ja) * 2003-02-04 2013-01-09 古河電気工業株式会社 高周波回路用銅箔及びその製造方法
JP2006222185A (ja) * 2005-02-09 2006-08-24 Furukawa Circuit Foil Kk ポリイミド系フレキシブル銅張積層板用銅箔、ポリイミド系フレキシブル銅張積層板、及びポリイミド系フレキシブルプリント配線板
JP4683646B2 (ja) * 2006-03-31 2011-05-18 Ｊｘ日鉱日石金属株式会社 プリント配線基板用銅又は銅合金箔
JP5024930B2 (ja) * 2006-10-31 2012-09-12 三井金属鉱業株式会社 表面処理銅箔、極薄プライマ樹脂層付表面処理銅箔及びその表面処理銅箔の製造方法並びに極薄プライマ樹脂層付表面処理銅箔の製造方法
JP5474316B2 (ja) * 2008-05-30 2014-04-16 三井金属鉱業株式会社 銅張積層板、その銅張積層板製造に用いる表面処理銅箔及びその銅張積層板を用いて得られるプリント配線板
JP2011162860A (ja) * 2010-02-12 2011-08-25 Furukawa Electric Co Ltd:The 表面粗化銅箔とその製造方法及び銅張積層板
JP5685061B2 (ja) * 2010-11-19 2015-03-18 株式会社Ｓｈカッパープロダクツ プリント配線板用銅箔、及びプリント配線板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856758B2 (ja) * 1975-12-17 1983-12-16 ミツイアナコンダドウハク カブシキガイシヤ ドウハクヒヨウメンシヨリホウホウ
JPS5515216A (en) * 1978-07-20 1980-02-02 Mitsui Anakonda Dohaku Kk Printed circut copper foil and method of manufacturing same
JPS5856758A (ja) * 1981-09-28 1983-04-04 Hitachi Ltd 大型工作物の自動芯出し装置
JPS5920621A (ja) * 1982-07-12 1984-02-02 Nippon Denkai Kk 印刷回路用銅箔とその製造方法
JPS61110794A (ja) * 1984-11-06 1986-05-29 Mitsui Mining & Smelting Co Ltd 銅箔の表面処理方法
JPS62216294A (ja) * 1986-03-17 1987-09-22 日本電解株式会社 プリント回路用銅箔の製造方法
JPH0226097A (ja) * 1988-07-15 1990-01-29 Nikko Guruude Fuoiru Kk プリント配線板用銅箔及びその製造方法
US5071520A (en) * 1989-10-30 1991-12-10 Olin Corporation Method of treating metal foil to improve peel strength
JPH04274389A (ja) * 1991-03-01 1992-09-30 Furukawa Saakitsuto Foil Kk プリント配線板用銅箔

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100344445C (zh) * 2003-04-30 2007-10-24 美格株式会社 铜表面的对树脂粘接层
CN100363175C (zh) * 2003-04-30 2008-01-23 美格株式会社 粘接层形成液、使用该液的铜和树脂的粘接层的制造方法及其层压体
CN102783255A (zh) * 2010-02-24 2012-11-14 吉坤日矿日石金属株式会社 印刷电路基板用铜箔及印刷电路基板用覆铜层压板
TWI509113B (zh) * 2010-02-24 2015-11-21 Jx Nippon Mining & Metals Corp Copper cladding for printed circuit boards and copper clad laminates for printed circuit boards
CN102783255B (zh) * 2010-02-24 2017-04-19 吉坤日矿日石金属株式会社 印刷电路基板用铜箔及印刷电路基板用覆铜层压板
CN104704137A (zh) * 2012-10-12 2015-06-10 三井金属矿业株式会社 表面处理铜箔、表面处理铜箔的制造方法、负极集电体及非水性二次电池的负极材料

Also Published As

Publication number Publication date
MY113830A (en) 2002-06-29
JPH07231161A (ja) 1995-08-29
JP3292774B2 (ja) 2002-06-17
FR2716329B1 (fr) 1996-08-14
FR2716329A1 (fr) 1995-08-18

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