TW202410218A - Resin sealing device and resin sealing method - Google Patents
Resin sealing device and resin sealing method Download PDFInfo
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- TW202410218A TW202410218A TW112120569A TW112120569A TW202410218A TW 202410218 A TW202410218 A TW 202410218A TW 112120569 A TW112120569 A TW 112120569A TW 112120569 A TW112120569 A TW 112120569A TW 202410218 A TW202410218 A TW 202410218A
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- 229920005989 resin Polymers 0.000 title claims abstract description 192
- 239000011347 resin Substances 0.000 title claims abstract description 192
- 238000007789 sealing Methods 0.000 title claims abstract description 114
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000005520 cutting process Methods 0.000 claims abstract description 43
- 230000007246 mechanism Effects 0.000 claims description 47
- 239000000463 material Substances 0.000 claims description 25
- 238000004080 punching Methods 0.000 claims description 11
- 238000003825 pressing Methods 0.000 abstract description 23
- 238000003860 storage Methods 0.000 description 15
- 239000000758 substrate Substances 0.000 description 9
- -1 carrier plates Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005485 electric heating Methods 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920009441 perflouroethylene propylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
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- 230000007723 transport mechanism Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
本發明是有關於一種樹脂密封裝置及樹脂密封方法。The present invention relates to a resin sealing device and a resin sealing method.
作為藉由密封樹脂(以下,有時簡稱為「樹脂」)對在基材上搭載有電子零件的工件進行密封而加工為成形品的樹脂密封裝置及樹脂密封方法的例子,已知有利用轉注成形方式者。As an example of a resin sealing device and a resin sealing method that seals a workpiece with electronic components mounted on a base material using a sealing resin (hereinafter, sometimes simply referred to as "resin") and processes it into a molded product, transfer injection is known. Forming method.
轉注成形方式為如下技術:設置罐來向設置於包括上模及下模而構成的密封模具的一對密封區域(模腔)供給規定量的樹脂,在與該各密封區域對應的位置分別配置工件,藉由利用上模以及下模進行夾持並自罐向模腔注入樹脂的操作進行樹脂密封。 [現有技術文獻] [專利文獻] The transfer molding method is a technique in which a tank is provided to supply a predetermined amount of resin to a pair of sealing areas (cavities) provided in a sealing mold composed of an upper mold and a lower mold, workpieces are arranged at positions corresponding to the respective sealing areas, and resin sealing is performed by clamping the upper mold and the lower mold and injecting the resin from the tank into the cavity. [Prior art literature] [Patent literature]
[專利文獻1]日本專利特開2012-231030號公報 [專利文獻2]日本專利特開平3-184351號公報 [Patent Document 1] Japanese Patent Application Publication No. 2012-231030 [Patent Document 2] Japanese Patent Application Laid-Open No. 3-184351
[發明所欲解決之課題] 在先前的轉注成形方式的樹脂密封方法中,在自經樹脂密封的成形品中去除不需要樹脂部分的打澆口步驟中,一般採用對每個該成形品一併(一次)去除不需要樹脂部分的結構。作為一例,已知有以成形品的澆口附近為中心旋轉規定量而將其去除的方法(參照專利文獻1:日本專利特開2012-231030號公報),作為其他例,已知有在樹脂密封時在規定部位形成碰抵部,並利用銷頂著該碰抵部而將其去除的方法(參照專利文獻2:日本專利特開平3-184351號公報)。 [Problems to be solved by the invention] In the previous transfer molding resin sealing method, in the sprue step of removing the unnecessary resin part in the resin-sealed molded product, a structure is generally adopted in which the unnecessary resin part is removed at once for each molded product. As an example, there is a known method of removing the unnecessary resin part by rotating a predetermined amount around the sprue of the molded product (see patent document 1: Japanese Patent Laid-Open No. 2012-231030), and as another example, there is a known method of forming a contact part at a predetermined position during resin sealing and removing the contact part by pressing the contact part with a pin (see patent document 2: Japanese Patent Laid-Open No. 3-184351).
此處,作為所述「成形品」,若列舉以利用樹脂對框架(多個電子零件呈矩陣狀地搭載於規定形狀的連續的基材上而成的工件)進行密封而成者成為對象的情況為例,則考慮到框架的大小(上下方向尺寸、橫向尺寸)、實施打澆口步驟時的框架溫度、進而定位精度等各種要素,需要對製品部分確保規定的間隙(餘裕尺寸),並且將不需要樹脂部分去除。因此,在先前的打澆口步驟中,為了進行折取而減小形成於與模腔相鄰的澆口的位置的不需要樹脂部分(澆口殘留)(以下,有時稱為「澆口部」)存在極限。Here, if the "molded product" is a case where a frame (a workpiece in which a plurality of electronic components are mounted in a matrix on a continuous substrate of a predetermined shape) is sealed with resin, then in consideration of the size of the frame (vertical dimensions, lateral dimensions), the frame temperature during the sprue step, and positioning accuracy, it is necessary to ensure a predetermined gap (margin dimension) for the product portion and remove the unnecessary resin portion. Therefore, in the previous sprue step, there is a limit to reducing the unnecessary resin portion (sprue residue) (hereinafter sometimes referred to as "sprue portion") formed at the position of the sprue adjacent to the cavity for folding.
在所述背景下,近年來,製品的小型化及高精度化(高密度安裝化)進一步發展,要求更高精度地去除澆口部(即,進一步減小殘留尺寸)。然而,在樹脂密封步驟中形成的澆道部產生框架的翹曲,該翹曲成為阻止高精度地去除澆口部的主要原因。 [解決課題之手段] Against this background, in recent years, products have been further miniaturized and highly precise (high-density mounting), and gate portions have been required to be removed with higher precision (that is, to further reduce the residual size). However, the gate portion formed in the resin sealing step causes warping of the frame, and this warping becomes a factor that prevents the gate portion from being removed with high accuracy. [Means to solve the problem]
本發明是鑒於所述情況而成,其目的在於提供一種能夠更高精度地去除澆口部,且能夠實現成形品的小型化及高密度安裝化的樹脂密封裝置及樹脂密封方法。The present invention is made in view of the above situation, and its purpose is to provide a resin sealing device and a resin sealing method that can remove the nozzle part with higher precision and realize the miniaturization and high-density mounting of the molded product.
本發明藉由以下作為一實施方式記載的解決手段來解決所述課題。The present invention solves the above-mentioned problem by the following solution described as one embodiment.
本發明的樹脂密封方法是使用包括上模及下模的密封模具並藉由樹脂對工件進行密封而加工為成形品的樹脂密封方法,其必要條件在於包括:樹脂密封步驟,將錠狀的所述樹脂投入至設置於所述密封模具的罐中並藉由柱塞進行按壓,自分別設置於所述密封模具的剔料池經由澆道向模腔壓送,並藉由所述樹脂對所述工件進行密封;以及打澆口步驟,將實施樹脂密封步驟後的所述成形品自所述密封模具取出,並將所述成形品中的不需要樹脂部分去除,所述打澆口步驟中,在實施了將形成於所述剔料池及所述澆道的位置的所述不需要樹脂部分即剔料池部及澆道部去除的澆道斷開步驟之後,實施將形成於所述澆道與所述模腔之間的澆口的位置的所述不需要樹脂部分即澆口部去除的澆口切斷步驟。The resin sealing method of the present invention is a resin sealing method for processing a molded product by sealing a workpiece with a resin using a sealing mold including an upper mold and a lower mold, and the necessary conditions thereof are as follows: a resin sealing step, wherein the resin in tablet form is put into a tank arranged in the sealing mold and pressed by a plunger, and is pressed from a pick pool respectively arranged in the sealing mold to a mold cavity through a gutter, and the workpiece is sealed with the resin; and a guttering step, wherein the resin is pressed by a plunger, and ... The molded product after the resin sealing step is taken out from the sealing mold, and the unnecessary resin portion in the molded product is removed. In the gutter punching step, after the gutter breaking step of removing the unnecessary resin portion formed at the positions of the pick pool and the gutter, namely the pick pool portion and the gutter portion, is implemented, the gutter cutting step of removing the unnecessary resin portion formed at the position of the gutter between the gutter and the mold cavity, namely the gutter portion, is implemented.
據此,由於能夠在之前的步驟中去除剔料池部、澆道部,因此能夠在之後的步驟中在框架的翹曲被消除(減輕)的狀態下去除澆口部。因此,能夠高精度地去除澆口部、即減小殘留尺寸,從而能夠形成較先前更高精度的製品。According to this, since the material removal pool and the gutter can be removed in the previous step, the gutter can be removed in the subsequent step while the warp of the frame is eliminated (reduced). Therefore, the gutter can be removed with high precision, that is, the residual size can be reduced, so that a product with higher precision than before can be formed.
另外,較佳為所述澆口切斷步驟具有於將在所述澆道斷開步驟中去除了所述澆道部的狀態的所述成形品以規定的搬送距離依次輸送的同時去除所述澆口部的步驟。例如,所述規定的搬送距離被設定為在所述密封模具中上下一對地並排設置多組的所述罐及所述剔料池的中心間距離。據此,能夠以框架內的區塊單元進行澆口切斷步驟。因此,可更不易受到因樹脂密封時的熱而在框架產生的翹曲等的影響,因此能夠更進一步高精度地進行澆口部的去除、即能夠更進一步減小澆口部的殘留尺寸。In addition, it is preferred that the gate cutting step includes a step of removing the gate portion while sequentially conveying the molded product in a state where the gate portion has been removed in the gate cutting step at a prescribed conveying distance. For example, the prescribed conveying distance is set to be the center distance between a plurality of groups of the cans and the reject pools arranged side by side in pairs in the upper and lower parts of the sealing mold. Accordingly, the gate cutting step can be performed in block units within the frame. Therefore, it is less susceptible to the influence of warping or the like generated in the frame due to heat during resin sealing, and therefore the gate portion can be removed with further high precision, that is, the residual size of the gate portion can be further reduced.
另外,較佳為所述澆口切斷步驟具有將導銷插通至預先形成於所述工件的基材的導孔中來進行定位並進行所述成形品的搬送的步驟。在先前的樹脂密封方法中,一般是使導件抵接於成形品的外周部來進行定位。因此,容易受到成形品中產生的翹曲等的影響,而難以高精度地去除澆口部。相對於此,根據所述結構,可將導銷插通至預先形成於工件的基材的導孔中來進行定位,因此定位精度顯著提高,從而能夠高精度地去除澆口部。In addition, it is preferred that the guillotine cutting step includes a step of inserting a guide pin into a guide hole pre-formed in the base material of the workpiece to perform positioning and to transport the molded product. In the previous resin sealing method, positioning is generally performed by making the guide abut against the outer periphery of the molded product. Therefore, it is easily affected by the warp etc. generated in the molded product, and it is difficult to remove the guillotine portion with high precision. In contrast, according to the structure, the guide pin can be inserted into the guide hole pre-formed in the base material of the workpiece for positioning, so the positioning accuracy is significantly improved, thereby enabling the guillotine portion to be removed with high precision.
另外,本發明的樹脂密封裝置是使用包括上模及下模的密封模具並藉由樹脂對工件進行密封而加工為成形品的樹脂密封裝置,其必要條件在於包括:罐,設置於所述下模,供錠狀的所述樹脂投入;剔料池,設置於所述上模,推壓所述樹脂;澆道及模腔,設置於所述上模及所述下模中的至少一者,並自所述剔料池壓送所述樹脂;以及打澆口機構,自藉由所述樹脂密封的所述成形品中去除不需要樹脂部分,所述打澆口機構具有:澆道斷開衝頭,將形成於所述剔料池及所述澆道的位置的所述不需要樹脂部分即剔料池部及澆道部去除;以及澆口切斷衝頭,自去除了所述剔料池部及所述澆道部的狀態的所述成形品將形成於所述澆道與所述模腔之間的澆口的位置的所述不需要樹脂部分即澆口部去除。In addition, the resin sealing device of the present invention is a resin sealing device that uses a sealing mold including an upper mold and a lower mold to seal a workpiece with resin and process it into a molded product. A necessary condition for the resin sealing device is to include a tank disposed on the lower part. A mold for inputting the ingot-shaped resin; a picking pool provided on the upper mold to push the resin; a runner and a mold cavity provided on at least one of the upper mold and the lower mold , and press-feeds the resin from the reject pool; and a gating mechanism that removes unnecessary resin portions from the molded product sealed by the resin, the gating mechanism having: a runner break A punch is opened to remove the unnecessary resin portion formed at the position of the picking pool and the runner, that is, the picking pool portion and the runner portion; and a gate cutting punch is used to remove the picking The molded article in the state of the hopper part and the runner part has the gate part which is the unnecessary resin part formed at the position of the gate between the runner and the cavity removed.
另外,較佳為所述密封模具並排設置有多組上下一對的所述罐及所述剔料池,所述澆口切斷衝頭具有衝頭刃,所述衝頭刃形成為將與一組的所述罐及所述剔料池對應地形成的所述澆口部一次去除的形狀。據此,能夠以框架內的區塊單元進行澆口切斷步驟,因此能夠實現澆口切斷衝頭的小型化,進而實現打澆口機構的小型化。 [發明的效果] In addition, it is preferred that the sealing mold has a plurality of upper and lower pairs of the cans and the pick pools arranged side by side, and the guillotine cutting punch has a punch blade, and the punch blade is formed into a shape that removes the guillotine portion formed corresponding to a group of the cans and the pick pool at one time. Accordingly, the guillotine cutting step can be performed with the block unit within the frame, so that the guillotine cutting punch can be miniaturized, and the guillotine mechanism can be miniaturized. [Effect of the invention]
藉由本發明,與先前的方法相比,可更高精度地去除澆口部。因此,可實現成形品即製品的小型化及高密度安裝化。According to the present invention, the nozzle portion can be removed with higher precision compared to the previous method, thereby achieving miniaturization and high-density mounting of the molded product, i.e., the finished product.
(整體結構)
以下,參照圖式對本發明的實施方式進行詳細說明。圖1是表示本發明的實施方式的樹脂密封裝置1的例子的平面圖(概略圖)。再者,為了方便說明,有時在圖中藉由箭頭來說明樹脂密封裝置1等的前後、左右、上下的方向。另外,在用於說明各實施方式的所有圖中,有時對具有相同功能的構件標註相同符號,並省略其重覆說明。
(Overall structure)
Below, the embodiment of the present invention is described in detail with reference to the drawings. FIG. 1 is a plan view (schematic view) showing an example of a
本實施方式的樹脂密封裝置1為使用包括上模204及下模206的密封模具202對工件(被成形品)W進行樹脂密封的裝置。以下,作為樹脂密封裝置1,列舉如下的利用轉注成形方式的樹脂密封裝置為例進行說明,所述樹脂密封裝置利用下模206保持工件W,利用離形膜(以下,有時簡稱為「膜」)Fm覆蓋以對應的配置設置於上模204的模腔208(包括模具面204a的一部分),進行上模204(模具面204a)與下模206(模具面206a)的夾持動作,利用樹脂R對工件W進行密封。再者,在本實施方式中,列舉如下的結構為例進行說明,即在一個上模204設置兩個模腔208,並且在一個下模206配置兩個工件W(例如,所述框架F所例示的長條狀的工件)而一起進行樹脂密封,獲得成形品Wp。但是,並不限定於此,亦可並排設置多組所述結構(未圖示)。膜Fm亦並非必需的,模腔208亦可設置於上模204、下模206的任一者或兩者。The
首先,作為成形對象的工件W包括如下結構:於基材Wa上以規定配置搭載有一個或者多個電子零件Wb。作為一般的基材Wa的例子,為形成為長方形或圓形等板狀等的樹脂基板、陶瓷基板、金屬基板、托板(carrier plate)、引線框架、晶圓等,作為電子零件Wb的例子,為半導體晶片、微機電系統(Micro Electromechanical System,MEMS)晶片、被動元件、散熱板、導電構件、間隔件等。另外,作為在基材Wa上搭載電子零件Wb的方法的例子,有利用打線接合封裝、覆晶(flip chip)封裝等的搭載方法。在本實施方式中,作為工件W,列舉多個電子零件Wb呈矩陣狀地搭載於規定形狀的連續的基材Wa上的框架F為例來進行說明。但是,並不限定於該結構。First, the workpiece W as a forming object includes the following structure: one or more electronic components Wb are mounted on a substrate Wa in a prescribed configuration. Examples of general substrates Wa include resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, wafers, etc. formed into rectangular or circular plates, and examples of electronic components Wb include semiconductor chips, microelectromechanical systems (MEMS) chips, passive components, heat sinks, conductive components, spacers, etc. In addition, as examples of methods for mounting electronic components Wb on substrate Wa, there are mounting methods using wire bonding packaging, flip chip packaging, etc. In this embodiment, as a workpiece W, a frame F in which multiple electronic components Wb are mounted in a matrix on a continuous substrate Wa of a prescribed shape is cited as an example for explanation. However, it is not limited to this structure.
另一方面,作為樹脂R的例子,可使用錠狀(作為一例為圓柱狀)的熱硬化性樹脂(例如,含有填料的環氧系樹脂等)。再者,樹脂R並不限定於所述狀態,可為圓柱狀以外的形狀,亦可為環氧系熱硬化性樹脂以外的樹脂。On the other hand, as an example of the resin R, a tablet-shaped (for example, a cylindrical-shaped) thermosetting resin (for example, an epoxy resin containing a filler, etc.) can be used. In addition, the resin R is not limited to the above-mentioned state, and may have a shape other than a cylindrical shape, and may be a resin other than an epoxy thermosetting resin.
另外,作為膜Fm的例子,可較佳地使用耐熱性、剝離容易性、柔軟性、伸展性優異的膜材,例如聚四氟乙烯(Polytetrafluoroethylene,PTFE)、乙烯-四氟乙烯共聚物(Ethylene-Tetrafluoroethylene,ETFE)(聚四氟乙烯聚合物)、聚對苯二甲酸乙二酯(Polyethylene terephthalate,PET)、氟化乙烯丙烯(Fluorinated ethylene propylene,FEP)、氟含浸玻璃布、聚丙烯、聚偏二氯乙烯等。在本實施方式中,可使用輥狀的膜作為膜Fm。再者,作為其他例,亦可設為使用長條狀的膜的結構(未圖示)。In addition, as an example of the film Fm, a film material excellent in heat resistance, peelability, flexibility, and stretchability, such as polytetrafluoroethylene (PTFE), ethylene-tetrafluoroethylene copolymer (Ethylene), can be preferably used. -Tetrafluoroethylene (ETFE) (polytetrafluoroethylene polymer), polyethylene terephthalate (PET), fluorinated ethylene propylene (FEP), fluorine-impregnated glass cloth, polypropylene, polyethylene Vinylidene chloride, etc. In this embodiment, a roll-shaped film can be used as the film Fm. Furthermore, as another example, a structure using a long film (not shown) may be used.
繼而,對本實施方式的樹脂密封裝置1的概要進行說明。如圖1所示,樹脂密封裝置1包括下述構件作為主要結構:供給單元100A,主要進行作為樹脂密封對象的工件W及樹脂R的供給;壓製單元100B,主要對工件W進行樹脂密封而加工為成形品Wp;以及收納單元100C,主要進行樹脂密封後的成形品Wp的收納。Next, the outline of the
另外,樹脂密封裝置1包括搬送機構100D,所述搬送機構100D於各單元間移動而進行工件W、樹脂R及成形品Wp的搬送。作為一例,搬送機構100D包括:載入器(inloader)122,將工件W及樹脂R向壓製單元100B搬入;載出器(outloader)124,將成形品Wp自壓製單元100B搬出;以及導軌126,由載入器122及載出器124共用。再者,搬送機構100D並不限定於所述結構,亦可適當地設為併用公知的拾取器等的結構(未圖示)。另外,亦可取代包括裝載器(loader)的結構,而設為包括多關節機器人的結構(未圖示)。In addition, the
此處,載入器122起到在供給單元100A中接收工件W及樹脂R並向壓製單元100B搬送的作用。作為載入器122的結構例,設置有沿著左右方向並排設置有兩行且分別能夠保持一個工件W的工件保持部122A、工件保持部122B。另外,在兩行的工件保持部122A、工件保持部122B之間的位置設置有樹脂保持部122C,所述樹脂保持部122C能夠沿著前後方向保持多個(作為一例,列舉四個的情況為例,但並不限定於此,或者亦可為單數)的樹脂R。再者,關於工件保持部122A、工件保持部122B及樹脂保持部122C,可使用公知的保持機構(例如,具有保持爪進行夾持的結構、具有與抽吸裝置連通的抽吸孔進行吸附的結構等)(未圖示)。Here, the
本實施方式的載入器122設為如下結構,即:沿左右方向及前後方向移動,將工件W及樹脂R向密封模具202內搬入,並將其載置於下模206的規定位置。但是,並不限定於此,亦可設為如下結構(未圖示),即:單獨地包括沿左右方向移動而進行單元間的搬送的裝載器以及沿前後方向移動而進行向密封模具202的搬入的裝載器。The
另外,載出器124起到在壓製單元100B中接收成形品Wp(包括剔料池部、澆道部等的不需要樹脂部分)並向收納單元100C搬送的作用。作為載出器124的結構例,設置有能夠保持成形品Wp(於本實施方式中,包括剔料池部、澆道部等不需要樹脂部分,經由該些連結有兩張框架F的狀態)的成形品保持部124A。再者,關於成形品保持部124A,可使用公知的保持機構(例如,具有保持爪進行夾持的結構、具有與抽吸裝置連通的抽吸孔進行吸附的結構等)(未圖示)。In addition, the unloader 124 plays the role of receiving the molded product Wp (including the unresin-free parts such as the pick-out pool and the gutter) in the pressing unit 100B and transporting it to the storage unit 100C. As a structural example of the unloader 124, a molded product holding part 124A capable of holding the molded product Wp (in this embodiment, including the unresin-free parts such as the pick-out pool and the gutter, through which the two frames F are connected) is provided. Furthermore, with respect to the molded product holding part 124A, a known holding mechanism (for example, a structure having a holding claw for clamping, a structure having a suction hole connected to a suction device for adsorption, etc.) (not shown) can be used.
本實施方式的載出器124設為如下結構,即:沿左右方向及前後方向移動,將成形品Wp向密封模具202外搬出,並將其向成形品工作台114載置。但是,並不限定於此,亦可設為如下結構(未圖示),即:單獨地包括沿前後方向移動而進行自密封模具202的搬出的裝載器以及沿左右方向移動而進行單元間的搬送的裝載器。The unloader 124 of this embodiment is configured to move in the left-right direction and the front-rear direction, carry out the molded product Wp outside the sealing
再者,樹脂密封裝置1可藉由改變單元的結構,從而變更整體的結構形態。例如,圖1所示的結構為配置有兩台壓製單元100B的例子,但亦能夠為僅配置一台壓製單元100B或者配置三台以上的壓製單元100B的結構等。另外,亦能夠為追加配置其他單元的結構等(均未圖示)。Furthermore, the
(供給單元)
繼而,對樹脂密封裝置1所包括的供給單元100A進行說明。
(Supply unit)
Next, the supply unit 100A included in the
作為一例,供給單元100A包括用於收容工件W的工件儲存器(work stocker)102以及載置工件W的工件工作台104。再者,關於工件儲存器102,可使用公知的堆疊匣盒(stack magazine)、狹縫式匣盒(slit magazine)等,能夠將多個工件W一起收容。藉由所述結構,使用公知的推進器等(未圖示),自工件儲存器102取出工件W,並載置於工件工作台104上(作為一例,兩個一組的工件W相向地並列載置)。接著,藉由載入器122對載置於工件工作台104上的工件W進行保持並向壓製單元100B搬送。As an example, the supply unit 100A includes a work stocker 102 for accommodating the workpiece W and a workpiece table 104 on which the workpiece W is placed. In addition, as the workpiece storage 102, a well-known stack magazine, a slit magazine, etc. can be used, and a plurality of workpieces W can be stored together. With the above structure, a known propeller or the like (not shown) is used to take out the workpiece W from the workpiece storage 102 and place it on the workpiece table 104 (as an example, a group of two workpieces W are arranged facing each other. loading). Next, the workpiece W placed on the workpiece table 104 is held by the
另外,供給單元100A(亦可設為其他單元)包括樹脂供給機構140,所述樹脂供給機構140於工件工作台104的側方位置供給樹脂R。作為一例,樹脂供給機構140包括:供給部142,具有料斗、進料器等而供給樹脂R;以及交接部144,具有升降機等移送機構而將自供給部142供給的多個樹脂R保持為規定位置。藉由所述結構,藉由載入器122對由交接部144保持的多個樹脂R進行保持並向壓製單元100B搬送。In addition, the supply unit 100A (or other units) includes a resin supply mechanism 140, which supplies resin R at a side position of the workpiece table 104. As an example, the resin supply mechanism 140 includes: a supply part 142, which has a hopper, a feeder, etc., and supplies resin R; and a delivery part 144, which has a transfer mechanism such as an elevator to hold the plurality of resins R supplied from the supply part 142 at a predetermined position. With the above structure, the plurality of resins R held by the delivery part 144 are held by the
(壓製單元)
繼而,對樹脂密封裝置1所包括的壓製單元100B進行說明。包括壓製裝置250,所述壓製裝置250藉由對密封模具202進行開閉驅動來夾持工件W並進行樹脂密封。此處,圖2是壓製裝置250的側面剖面圖(概略圖),圖3是密封模具202的正面剖面圖(概略圖)(再者,為了使結構清楚而省略離形膜的圖示)。
(suppression unit)
Next, the pressing unit 100B included in the
如圖2所示,壓製裝置250包括具有下模206以及上模204並配設於一對模板(platen)252、254間的密封模具202;供架設一對模板252、254的多個連結機構256;使模板254可動(升降)的驅動源(例如電動馬達)260;以及驅動傳遞機構(例如滾珠螺桿或肘節連桿(toggle link)機構)262。再者,在本實施方式中,將上模204組裝於固定模板252且將下模206組裝於可動模板254。但是,並不限定於所述結構,亦可將上模204組裝於可動模板且將下模206組裝於固定模板,或者亦可將上模204、下模206均組裝於可動模板。As shown in Figure 2, the
另外,壓製單元100B包括膜供給機構201,所述膜供給機構201將輥狀且於片材面無開口(孔)的膜Fm向密封模具202的內部搬送(供給)。所述膜供給機構201成為如下結構,即:將未使用的膜Fm自捲出部201A送出並供給至經開模的密封模具202,在密封模具202中用於樹脂密封後,作為使用完畢的膜Fm而利用捲取部201B來捲取。再者,捲出部201A與捲取部201B可於前後方向上相反地配置,或者亦可在左右方向上以供給一張膜Fm的方式配置(均未圖示)。另外,如上所述,亦可設為代替輥狀的膜而使用長條狀的膜的結構(未圖示)。In addition, the pressing unit 100B includes a film supply mechanism 201 that conveys (feeds) a roll-shaped film Fm without openings (holes) on the sheet surface into the sealing
接下來,詳細地說明密封模具202的下模206。如圖2、圖3所示,下模206包括下模模座(mould base)212、下模槽套區塊216、下模夾持區塊220等,並且將該些組裝而構成。作為一例,下模槽套區塊216被固定於下模模座212上,且下模模座212被固定於可動模板254上。Next, the
此處,在下模206沿著前後方向設置有多個(作為一例,列舉四個的情況為例,但並不限定於此,或者亦可為單數)收容樹脂(此處為錠狀的樹脂)R的筒狀的罐240。該罐240形成為與下模槽套區塊216及下模夾持區塊220連續的貫通孔。另外,在罐240內配設有由公知的傳送驅動機構(未圖示)推動的柱塞242。藉由所述結構,推動柱塞242,將罐240內的樹脂R向模腔208(後述)內供給。Here, a plurality of (four, as an example, but not limited to this, or an odd number) housing resins (in this case, ingot-shaped resins) are provided on the
另外,在本實施方式中,以被固定於下模槽套區塊216上的下模夾持區塊220包圍的配置,設置有保持一個或者多個工件W的工件保持部205。更具體而言,如圖3所示,以沿左右方向夾著罐240的配置配設有兩個工件保持部205(第一工件保持部205A及第二工件保持部205B)。作為一例,所述工件保持部205成為包括與抽吸裝置連通的抽吸路(均未圖示)、且吸附並保持工件W的結構。再者,亦可代替包括抽吸路的結構或者一併設為該結構以及包括夾持工件W的外周的保持爪的結構(未圖示)。In addition, in the present embodiment, a workpiece holding portion 205 for holding one or more workpieces W is provided in a configuration surrounded by a lower mold clamping block 220 fixed to a lower mold
另外,在下模模座212設置有下模加熱器(未圖示)。藉此,熱可經由下模槽套區塊216等傳導至罐240的周圍,在短時間內效率良好地將罐240內的樹脂R加熱至規定溫度(在本實施方式中為180℃左右)而使其熔融。作為一例,關於下模加熱器,可使用公知的電熱絲加熱器、鎧裝加熱器等。In addition, a lower mold heater (not shown) is provided on the
接下來,詳細地說明密封模具202的上模204。如圖2、圖3所示,上模204包括上模模座210、上模槽套區塊214、上模夾持區塊218等,並且將該些組裝而構成。作為一例,上模槽套區塊214被固定於上模模座210的下表面,且上模模座210被固定於固定模板252的下表面。Next, the
此處,在上模204設置有剔料池區塊244,所述剔料池區塊244在下模206的罐240的正上方位置(此處是指正上方的規定寬度的區域)被固定於上模槽套區塊214(此處包括固定於上模槽套區塊214的構件),且於下表面貫穿設置有剔料池246及與該剔料池246連通的澆道247(的一部分)。進而,設置有與該澆道247連通,且收容工件W的規定部位(搭載有電子零件Wb的部位)的模腔208。另外,澆道247與模腔208之間的邊界位置(邊界區域)成為被稱為澆口248的部位。再者,關於模腔208中的進行脫氣或膜吸附的抽吸路,省略了圖示。Here, the
本實施方式的模腔208貫穿設置於模腔區塊226的下表面,所述模腔區塊226被固定於上模槽套區塊214下的上模夾持區塊218包圍而配置。更具體而言,與下模206的兩個工件保持部205(第一工件保持部205A及第二工件保持部205B)的位置對應地,於俯視時隔著剔料池區塊244在左右方向(或前後方向)的兩側分別配設有模腔208(第一模腔208A及第二模腔208B)。該些工件保持部205A、205B以及模腔208A、208B成為藉由一個罐240及與其對應的剔料池246、澆道247、澆口248進行樹脂密封的一組結構單元(以下,有時稱為「區塊單元」)。於本實施方式中,成為該結構單元在前後方向(或左右方向)上並排設置多組的結構。但是,並不限定於該些結構,亦可設為工件保持部205及模腔208相對於剔料池區塊244僅配設於左右方向(或前後方向)上的其中一側的結構(未圖示)。另外,亦可設為僅配設一組所述結構單元的結構(未圖示)。The mold cavity 208 of this embodiment is disposed through the lower surface of the mold cavity block 226 , and the mold cavity block 226 is surrounded and arranged by the upper mold clamping block 218 fixed under the upper mold
再者,模腔亦可設置於下模206。於該情況下,可採用藉由貫通工件W的上下的孔使樹脂R通過的結構、或藉由自上模204的剔料池連通至下模206的澆道的流路使樹脂R通過的結構等(未圖示)。Furthermore, the mold cavity may also be provided in the
另外,在上模模座210設置有上模加熱器(未圖示)。藉此,熱可經由上模槽套區塊214等傳導至模腔208及樹脂流路(剔料池246、澆道247、澆口248等)的周圍,將填充至模腔208及樹脂流路246、樹脂流路247、樹脂流路248內的熔融狀態的樹脂R加熱至規定溫度。作為一例,關於上模加熱器,使用公知的電熱絲加熱器、鎧裝加熱器等。In addition, the
(收納單元)
繼而,對樹脂密封裝置1所包括的收納單元100C進行說明。
(storage unit)
Next, the storage unit 100C included in the
作為一例,收納單元100C包括:成形品工作台(亦稱為成形品搭載托盤)114,載置成形品Wp;打澆口機構116,自成形品Wp去除不需要樹脂部分;以及成形品儲存器112,用於收容去除了不需要樹脂部分的成形品Wp。再者,關於成形品儲存器112,可使用公知的堆疊匣盒、狹縫式匣盒等,能夠將多個成形品Wp一起收容。藉由所述結構,使用載出器124等自壓製單元100B搬送來的成形品Wp(包含不需要樹脂部分的狀態)被載置於成形品工作台114上。接著,使用公知的拾取器等(未圖示)將其移送至打澆口機構116並去除不需要樹脂部分後,使用公知的推進器等(未圖示)收容於成形品儲存器112。再者,成形品工作台114自身亦可在載置有成形品Wp的狀態下沿前後方向移動而移動至打澆口機構116。As an example, the storage unit 100C includes: a molded product workbench (also called a molded product loading tray) 114 for placing molded products Wp; a
如前所述,打澆口機構116是自成形品Wp中去除不需要樹脂部分的機構。所謂該不需要樹脂部分,具體而言,是形成於剔料池246的位置的「剔料池部」、形成於澆道247的位置的「澆道部」、形成於澆口248的位置的「澆口部」。在本實施方式中,作為工件W,列舉出使用多個電子零件Wb呈矩陣狀地搭載於規定形狀的連續的基材Wa上而成的框架F的例子。因此,對該工件W進行了樹脂密封的成形品Wp包含剔料池部、澆道部、澆口部等不需要樹脂部分,且是在經由該些連結有兩張框架F的狀態下形成。作為一例,於成形品Wp包括圖5A所示的結構的情況下,不需要樹脂部分成為圖5B(一個剔料池部Rc及與其連續的澆道部Rr、澆口部Rg的放大圖)所示的結構。作為另一例,於成形品Wp包括圖6A所示的結構的情況下,不需要樹脂部分成為圖6B(一個剔料池部Rc及與其連續的澆道部Rr、澆口部Rg的放大圖)所示的結構。As mentioned above, the
作為一例,如圖4所示,打澆口機構116包括將剔料池部及澆道部去除的澆道斷開衝頭160。更包括自去除了剔料池部及澆道部的狀態下的成形品Wp中去除澆口部的澆口切斷衝頭170(關於步驟將在後文敘述)。具體而言,澆道斷開衝頭160包括:衝頭刃162,藉由利用直立設置於衝頭刃162(設置於衝頭刃162的下側)的頂銷164(參照圖4)對進入形成於框架F的孔h(參照圖5A)中的澆道247上的經硬化的樹脂R進行頂出的衝孔加工(推落加工),自成形品Wp將剔料池部及澆道部推落並去除;驅動機構(未圖示),使該衝頭刃162上下移動;以及定位機構,在加工時進行成形品Wp的定位。同樣地,澆口切斷衝頭170包括:衝頭刃172,藉由衝孔加工(衝壓加工)自成形品Wp(去除了剔料池部及澆道部的狀態)衝壓去除澆口部;驅動機構(未圖示),使該衝頭刃172上下移動;以及定位機構,在加工時進行成形品Wp的定位。再者,於進行任一加工時,成形品Wp的搬送(移動)均使用托盤及驅動用伺服馬達(均未圖示)進行。As an example, as shown in FIG. 4 , the
首先,本實施方式的澆道斷開衝頭160中,衝頭刃162的衝壓範圍被設定(形成)為利用一次衝壓將在所述一組結構單元(區塊單元)中形成的範圍(圖5A的A部)的剔料池部及澆道部去除的形狀。據此,由於可將衝頭刃162的尺寸構成得小,因此可實現澆道斷開衝頭160的小型化,進而實現打澆口機構116的小型化。或者,作為變形例,可設為如下結構(未圖示):衝頭刃162的衝壓範圍被設定(形成)為利用一次衝壓將在多組結構單元(例如,成形品Wp中的所有結構單元)中形成的範圍(圖5A的B部)的剔料池部及澆道部去除的形狀。另外,亦可使搭載於成形品工作台114上的相連的兩個成形品Wp扭轉,自澆口部破壞剔料池部與澆道部而使其分離。據此,可增大能夠利用一次衝壓去除的剔料池部及澆道部的範圍,因此可縮短節拍時間。First, in the
另外,藉由衝頭刃162對剔料池部及澆道部進行衝壓時的成形品Wp的定位機構構成為,藉由使成形品Wp(連結有兩張框架F的狀態)的外周部碰抵於導件(未圖示)而定位於規定位置。In addition, the positioning mechanism of the molded product Wp when the
接下來,本實施方式的澆口切斷衝頭170中,衝頭刃172的衝壓範圍被設定(形成)為利用一次衝壓將在各框架F的一組結構單元(區塊單元)中形成的範圍(圖5A的C部)的澆口部去除的形狀。據此,由於可將衝頭刃172的尺寸構成得小,因此可實現澆口切斷衝頭170的小型化,進而實現打澆口機構116的小型化。但是,並不限定於該結構,衝頭刃172的衝壓範圍亦能夠設定(形成)為利用一次衝壓將在各框架F的多組結構單元(例如,成形品Wp中的所有結構單元)中形成的範圍(圖5A的D部)的剔料池部及澆道部去除的形狀(未圖示)。Next, in the
另外,藉由衝頭刃172對剔料池部及澆道部進行衝壓時的成形品Wp的定位機構構成為,藉由將設置於澆口切斷衝頭170(設置於衝頭刃172的下側)的導銷174(參照圖4)插通至預先形成於成形品Wp的各框架F(即,工件W的基材Wa)的導孔gh中而定位於規定位置。假設,在採用使導件抵接於框架F的外周部而進行定位的結構的情況下,容易受到框架F產生的變形(翹曲、膨脹等)的影響,難以高精度地去除澆口部。相對於此,根據本實施方式的結構,藉由將導銷174插通至預先形成於框架F(工件W的基材Wa)的導孔gh中而進行定位,定位精度顯著提高,從而可高精度地去除澆口部。進而,高精度的該導銷174為高價零件,但僅設置一組結構單元(區塊單元)的量便足夠,因此與先前裝置相比可實現成本降低。在本實施方式的情況下,如圖7的參考圖所例示般,較佳為在框架F上的澆口部Rg形成區域預先形成有貫通孔th(圖7中的交叉陰影線表示衝頭刃172)。再者,如圖8的參考圖所例示般,即便未必有貫通孔,亦可在利用澆口切斷衝頭170(具體而言為衝頭刃172)將成形品Wp局部地切斷的同時將其去除(圖8中的交叉陰影線表示衝頭刃172)。In addition, the positioning mechanism of the molded product Wp when punching the reject pool portion and the sprue portion by the
如以上所述,藉由本實施方式的打澆口機構116,可使用澆道斷開衝頭160將作為產生成形品Wp的翹曲的主要原因的剔料池部、澆道部先行去除。因此,可於成形品Wp的翹曲被消除(減輕)的狀態下,藉由將澆口切斷衝頭170的導銷174插通至框架F的導孔gh中進行定位來去除澆口部。藉此,可高精度地去除澆口部。另外,去除該澆口部的澆口切斷步驟可並非以連結有兩張框架F的狀態,而是以將該些分離後的各框架F為對象來實施。藉此,可進一步消除(減輕)翹曲的影響,因此可更高精度地去除澆口部。進而,可藉由一組結構單元(區塊單元)的依次輸送且藉由框架F的導孔gh與澆口切斷衝頭170的導銷174的定位來實施該澆口切斷步驟。藉此,可實現搬送精度的提高及定位精度的提高,因此可更進一步高精度地去除澆口部。藉由該些的協作效果,能夠實現在先前的方法中極其難以達成的澆口部的高精度加工(作為具體例,將澆口部的剩餘量設為0.15 mm以下的加工)。As described above, with the
(樹脂密封動作)
繼而,對使用本實施方式的樹脂密封裝置1進行樹脂密封的動作(即,本實施方式的樹脂密封方法)進行說明。此處,列舉如下結構為例,即在一個上模204設置兩組模腔208,並且在一個下模206並列配置兩個工件W(例如,所述框架F)而一起進行樹脂密封,獲得成形品Wp。但是,並不限定於所述結構,亦可設為配置一個工件W或者將多個工件W沿前後左右並列配置而進行樹脂密封的結構。
(Resin sealing action)
Next, the operation of resin sealing using the
作為準備步驟,實施藉由上模加熱器將上模204調整並加熱至規定溫度(例如100℃~200℃)的加熱步驟(上模加熱步驟)。另外,實施藉由下模加熱器將下模206調整並加熱至規定溫度(例如100℃~200℃)的加熱步驟(下模加熱步驟)。進而,實施下述步驟(膜供給步驟),即藉由膜供給機構201將膜Fm自捲出部201A向捲取部201B搬送(送出)而向密封模具202中的規定位置(上模204與下模206之間的位置)供給膜Fm。As a preparation step, a heating step (upper mold heating step) of adjusting and heating the
接著,實施藉由公知的推進器等(未圖示)自工件儲存器102將工件W逐個搬出並載置於工件工作台104的上表面的步驟(再者,亦可併用公知的拾取機構等)。另外,實施藉由公知的進料器、升降機等(未圖示)自供給部142將錠狀的樹脂R逐個搬出並將多個(作為一例為四個)樹脂R保持於交接部144的規定位置的步驟。Next, a step of unloading the workpieces W from the workpiece storage 102 one by one using a known pusher or the like (not shown) and placing them on the upper surface of the workpiece table 104 is performed (in addition, a known pick-up mechanism, etc. may also be used in combination. ). In addition, regulations are implemented to carry out the ingot-shaped resin R one by one from the supply part 142 using a known feeder, an elevator, etc. (not shown) and to hold a plurality (as an example, four) of the resin R in the transfer part 144 Location steps.
接著,使載入器122移動至工件工作台104的正上方(亦可於相同位置預先待機)。在所述位置,實施使工件工作台104上升(或者使載入器122下降)並藉由工件保持部122A、工件保持部122B保持工件W(於本實施方式中,工件保持部122A、工件保持部122B分別保持一個工件W)的步驟。Then, the
接著,使載入器122移動至交接部144的正上方。在所述位置,實施使交接部144上升(或者使載入器122下降)並藉由樹脂保持部122C保持樹脂R(於本實施方式中,樹脂保持部122C保持四個樹脂R)的步驟。Next, the
接著,實施如下步驟,即藉由載入器122在一次步驟中將多個(於本實施方式中為兩個)工件W及多個(於本實施方式中為四個)樹脂R向壓製單元100B的密封模具202內搬送,並在下模206的各工件保持部205(在本實施方式中為工件保持部205A、工件保持部205B)分別載置工件W;以及在下模206的多個(於本實施方式中為四個)罐240分別收容樹脂R。再者,亦可實施在搬送中途藉由設置於載入器122的加熱器(未圖示)對工件W或樹脂R進行預加熱的步驟(預加熱步驟)。Next, the following steps are performed, that is, the
接著,實施藉由進行密封模具202的閉模並利用上模204以及下模206夾持工件W進行樹脂密封而形成成形品Wp的步驟(樹脂密封步驟)。Next, a step of closing the sealing
更詳細而言,首先,對驅動源260及驅動傳遞機構262進行驅動,使可動模板254向上方移動。藉此,下模206朝向上模204(即,向上方)移動。若繼續使下模206向上方移動,則上模204的模腔區塊226與由下模206的工件保持部205保持的工件W抵接,而成為夾持工件W的狀態。於所述狀態下,使傳送驅動機構工作,將柱塞242向上模204的方向推動,將熔融的樹脂R向上模204的剔料池246推壓,使其通過與該剔料池246連通的澆道247等而向模腔208內壓送。More specifically, first, the
如上所述,藉由針對工件W而將樹脂R加熱加壓,樹脂R熱硬化而進行樹脂密封,從而形成成形品Wp。As described above, by heating and pressurizing the resin R with respect to the workpiece W, the resin R is thermally hardened to perform resin sealing, thereby forming a molded product Wp.
接著,實施如下步驟,即進行密封模具202的開模,藉由載出器124自密封模具202內取出成形品Wp(於本實施方式中,如圖5A、圖6A所例示般,包括剔料池部、澆道部等不需要樹脂部分,經由該些連結有兩張框架F的狀態)的步驟。Next, the following steps are carried out, that is, the sealing
與此並行(或者之後)實施如下步驟,即藉由膜供給機構201將膜Fm自捲出部201A向捲取部201B搬送,從而將使用完畢的膜Fm送出的步驟。In parallel with (or after) this, the following step is performed, namely, the film supply mechanism 201 conveys the film Fm from the unwinding section 201A to the winding section 201B, thereby sending out the used film Fm.
接著,實施藉由載出器124將成形品Wp向成形品工作台114上載置的步驟(再者,亦可併用公知的拾取機構等)。接著,實施於打澆口機構116自成形品Wp去除剔料池部、澆道部、澆口部等不需要樹脂部分的步驟(打澆口步驟)。接著,實施藉由公知的推進器等(未圖示)將成形品Wp(去除了不需要樹脂部分的狀態)逐個向成形品儲存器112搬入的步驟。再者,在該些步驟之前,亦可實施進行成形品Wp的後固化的步驟。Next, a step of placing the molded product Wp on the molded product workbench 114 by the unloader 124 is performed (in addition, a known pickup mechanism, etc. may also be used in combination). Next, a step of removing unnecessary resin portions such as the pick-up pool portion, the gutter portion, and the gutter portion from the molded product Wp by the gutter mechanism 116 (guttering step) is performed. Next, a step of moving the molded products Wp (with unnecessary resin portions removed) one by one into the molded product storage 112 is performed by a known pusher, etc. (not shown). In addition, before these steps, a step of post-curing the molded product Wp may also be performed.
此處,本實施方式的打澆口步驟包括自成形品Wp去除剔料池部及澆道部的澆道斷開步驟、及在實施該澆道斷開步驟後自成形品Wp去除澆口部的澆口切斷步驟。Here, the gating step in this embodiment includes a runner disconnecting step of removing the reject pool part and the runner part from the molded product Wp, and a runner disconnecting step of removing the gate part from the molded product Wp. Gate cutting step.
根據所述結構,在之前的步驟(澆道斷開步驟)中,可將剔料池部以及作為產生成形品Wp的翹曲的大的主要原因的澆道部去除。因此,可在之後的步驟(澆口切斷步驟)中在成形品Wp的翹曲被消除(減輕)的狀態下去除澆口部。藉此,可高精度地去除澆口部、即減小澆口部的殘留尺寸。According to the above structure, in the previous step (runner disconnection step), the reject pool portion and the runner portion, which are a major cause of warpage of the molded product Wp, can be removed. Therefore, in the subsequent step (gate cutting step), the gate portion can be removed in a state where the warpage of the molded product Wp is eliminated (reduced). Thereby, the gate part can be removed with high precision, that is, the remaining size of the gate part can be reduced.
特別是,於如本實施方式般以夾著剔料池246的配置將兩張框架F一起密封的成形品Wp(參照圖5A、圖6A)的情況等下,由於在之前的步驟(澆道斷開步驟)中可分離成一張一張的框架單元,因此在之後的步驟(澆口切斷步驟)中可以各個框架單元進行定位而去除澆口部。因此,可更顯著地獲得所述效果。In particular, in the case of a molded article Wp (see FIGS. 5A and 6A ) in which two frames F are sealed together in an arrangement sandwiching the reject pool 246 as in the present embodiment, since the previous step (runner) The frame units can be separated one by one in the cutting step), so each frame unit can be positioned and the gate portion can be removed in the subsequent step (gate cutting step). Therefore, the effect can be obtained more significantly.
另外,本實施方式的澆口切斷步驟設為於將在之前的澆道斷開步驟中去除了剔料池部、澆道部的狀態下的成形品Wp(如前所述,經分離的一張框架F)以規定的搬送距離依次輸送的同時去除澆口部的步驟。作為一例,該搬送距離被設定為在密封模具202中上下一對地並排設置多組的罐240彼此的中心間距離(即,一個罐240與相鄰的其他罐240的中心間距離)(剔料池246彼此的中心間距離亦相同)。據此,可以一張框架F內的區塊單元(與一組的罐240及剔料池246對應的樹脂密封區域(單元))進行澆口切斷步驟。因此,可更不易受到因樹脂密封時的熱而在框架F中產生的變形(翹曲、膨脹等)的影響,因此可更進一步高精度地進行澆口部的去除、即可更進一步減小澆口部的殘留尺寸。In addition, in the gate cutting step of this embodiment, the molded product Wp is removed from the reject pool part and the runner part in the previous runner cutting step (as mentioned above, the separated one Frame F) The step of removing the gate portion while sequentially conveying frames F) at a predetermined conveyance distance. As an example, the conveyance distance is set to the center-to-center distance of a plurality of groups of cans 240 arranged side by side in pairs in an upper and lower position in the sealing mold 202 (that is, the center-to-center distance between one can 240 and other adjacent cans 240) (tick The distances between the centers of the material pools 246 are also the same). Accordingly, the gate cutting step can be performed in a block unit (a resin sealing area (unit) corresponding to a group of tanks 240 and a reject pool 246) within the frame F. Therefore, the frame F is less susceptible to deformation (warping, expansion, etc.) caused by the heat during resin sealing. Therefore, the gate portion can be removed with higher precision, and the size can be further reduced. The remaining dimensions of the gate area.
另外,澆口切斷步驟設為將設置於澆口切斷衝頭170的導銷174插通至預先形成於工件W的基材Wa的導孔gh中並進行定位,從而進行成形品Wp的搬送的步驟。在先前的樹脂密封方法中,一般是使導件抵接於框架F的外周部來進行定位。因此,容易受到框架F中產生的變形(翹曲、膨脹等)的影響,從而難以高精度地去除澆口部。相對於此,根據所述結構,可將導銷174插通至預先形成於框架F(工件W的基材Wa)的導孔gh而進行定位,因此定位精度顯著提高,從而可高精度地去除澆口部。進而,成形品Wp的輸送方法亦藉由使用伺服馬達的一組結構單元(區塊單元)的依次輸送來實施,有助於提高精度。In addition, the grooving step is a step of inserting the
如此,根據本實施方式的打澆口步驟,藉由協作地獲得所述效果,能夠實現在先前的方法中極其難以達成的澆口部的高精度加工,作為具體例,將澆口部的剩餘量設為0.15 mm以下的加工。In this way, according to the gating step of this embodiment, by cooperatively obtaining the above-mentioned effects, it is possible to achieve high-precision processing of the gate portion that is extremely difficult to achieve with the conventional method. As a specific example, the remaining portion of the gate portion can be processed Processing where the amount is set to 0.15 mm or less.
以上為使用樹脂密封裝置1進行的樹脂密封的主要動作。但是,所述的步驟順序為一例,只要無妨礙,則能夠變更先後順序或並行實施。例如,在本實施方式中,由於為包括兩台壓製單元100B的結構,因此藉由並行實施所述動作,能夠有效率地形成成形品。The above is the main operation of resin sealing using the
如以上所說明般,根據本發明的樹脂密封裝置及樹脂密封方法,能夠在之前的步驟中去除剔料池部、澆道部,因此能夠在之後的步驟中在框架的翹曲被消除(減輕)的狀態下去除澆口部。因此,能夠高精度地去除澆口部、即減小殘留尺寸,能夠形成先前極其難以實現的高精度的製品。As explained above, according to the resin sealing device and the resin sealing method of the present invention, the reject pool part and the sprue part can be removed in the previous step, so the warpage of the frame can be eliminated (reduced) in the subsequent step. Remove the gate part in the state. Therefore, the gate portion can be removed with high precision, that is, the residual size can be reduced, and a high-precision product that has been extremely difficult to achieve in the past can be formed.
再者,本發明並不限定於所述實施方式,能夠在不脫離本發明的範圍內進行各種變更。具體而言,在所述實施方式中,列舉上模包括兩個藉由一個罐及與其對應的剔料池、澆道壓送樹脂的模腔、下模包括兩個對應的工件保持部的結構單元沿前後方向(或左右方向)並排設置多組的結構為例進行了說明,但並不限定於此。In addition, the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the scope of the present invention. Specifically, in the above embodiment, the upper mold includes two mold cavities that pressure-feed resin through a tank and its corresponding reject pool and runner, and the lower mold includes two corresponding workpiece holding parts. The structure in which multiple groups of units are arranged side by side in the front-rear direction (or left-right direction) has been described as an example, but the structure is not limited to this.
另外,在所述實施方式中,作為工件,列舉多個電子零件呈矩陣狀地搭載於規定形狀的連續的基材上而成的框架為例進行了說明,但並不限定於此。In addition, in the above-mentioned embodiment, a frame in which a plurality of electronic components are mounted in a matrix on a continuous base material of a predetermined shape has been described as an example as a workpiece. However, the workpiece is not limited to this.
1:樹脂密封裝置 100A:供給單元 100B:壓製單元 100C:收納單元 100D:搬送機構 102:工件儲存器 104:工件工作台 112:成形品儲存器 114:成形品工作台 116:打澆口機構 122:載入器 122A、122B、205:工件保持部 122C:樹脂保持部 124:載出器 124A:成形品保持部 126:導軌 140:樹脂供給機構 142:供給部 144:交接部 160:澆道斷開衝頭 162、172:衝頭刃 164:頂銷 170:澆口切斷衝頭 174:導銷 201:膜供給機構 201A:捲出部 201B:捲取部 202:密封模具 204:上模 204a、206a:模具面 205A:第一工件保持部(工件保持部) 205B:第二工件保持部(工件保持部) 206:下模 208:模腔 208A:第一模腔(模腔) 208B:第二模腔(模腔) 210:上模模座 212:下模模座 214:上模槽套區塊 216:下模槽套區塊 218:上模夾持區塊 220:下模夾持區塊 226:模腔區塊 240:罐 242:柱塞 244:剔料池區塊 246:剔料池(樹脂流路) 247:澆道(樹脂流路) 248:澆口(樹脂流路) 250:壓製裝置 252、254:模板 256:連結機構 260:驅動源 262:驅動傳遞機構 A、B、C、D:部 F:框架 Fm:膜(離形膜) gh:導孔 h:孔 R:樹脂 Rc:剔料池部 Rg:澆口部 Rr:澆道部 th:貫通孔 W:工件(被成形品) Wa:基材 Wb:電子零件 Wp:成形品 1: Resin sealing device 100A: Supply unit 100B: Pressing unit 100C: Storage unit 100D: Transport mechanism 102: Workpiece storage 104: Workpiece table 112: Molded product storage 114: Molded product table 116: Gushing mechanism 122: Loader 122A, 122B, 205: Workpiece holding section 122C: Resin holding section 124: Unloader 124A: Molded product holding section 126: Guide rail 140: Resin supply mechanism 142: Supply section 144: Handover section 160: Gushing channel breaking punch 162, 172: Punch blade 164: Ejector pin 170: Slot cutting punch 174: Guide pin 201: Film supply mechanism 201A: Roll-out section 201B: Roll-up section 202: Sealing mold 204: Upper mold 204a, 206a: Mold surface 205A: First workpiece holding section (workpiece holding section) 205B: Second workpiece holding section (workpiece holding section) 206: Lower mold 208: Mold cavity 208A: First mold cavity (mold cavity) 208B: Second mold cavity (mold cavity) 210: Upper mold base 212: Lower mold base 214: Upper mold groove sleeve block 216: Lower mold groove sleeve block 218: Upper mold clamping block 220: Lower mold clamping block 226: Cavity block 240: Tank 242: Plunger 244: Removal pool block 246: Removal pool (resin flow path) 247: Gutter (resin flow path) 248: Gutter (resin flow path) 250: Pressing device 252, 254: Template 256: Connection mechanism 260: Drive source 262: Drive transmission mechanism A, B, C, D: Part F: Frame Fm: Membrane (release membrane) gh: Guide hole h: Hole R: Resin Rc: Removal pool part Rg: Gutter part Rr: Gutter part th: Through hole W: workpiece (molded product) Wa: base material Wb: electronic parts Wp: molded product
圖1是表示本發明的實施方式的樹脂密封裝置的例子的平面圖。 圖2是表示圖1的樹脂密封裝置的壓製裝置的例子的側面剖面圖。 圖3是表示圖1的樹脂密封裝置的密封模具的例子的正面剖面圖。 圖4是表示圖1的樹脂密封裝置的打澆口機構的例子的正面圖(局部剖面圖)。 圖5A是表示在本發明的實施方式中形成的成形品的一例的平面圖,圖5B是表示成形品中的不需要樹脂部分的例子的放大圖。 圖6A是表示本發明的實施方式中形成的成形品的另一例的平面圖,圖6B是表示成形品中的不需要樹脂部分的例子的放大圖。 圖7是用於對使用本發明的實施方式的樹脂密封裝置的澆口切斷步驟中的裝置/成形品(框架)結構及步驟的一例進行說明的參考圖(平面圖)。 圖8是用於對使用本發明的實施方式的樹脂密封裝置的澆口切斷步驟中的裝置/成形品(框架)結構及步驟的另一例進行說明的參考圖(平面圖)。 FIG. 1 is a plan view showing an example of a resin sealing device according to an embodiment of the present invention. FIG. 2 is a side cross-sectional view showing an example of the pressing device of the resin sealing device of FIG. 1 . FIG. 3 is a front cross-sectional view showing an example of the sealing mold of the resin sealing device of FIG. 1 . FIG. 4 is a front view (partial cross-sectional view) showing an example of the gating mechanism of the resin sealing device of FIG. 1 . FIG. 5A is a plan view showing an example of a molded article formed in the embodiment of the present invention, and FIG. 5B is an enlarged view showing an example of an unnecessary resin portion in the molded article. 6A is a plan view showing another example of a molded article formed in the embodiment of the present invention, and FIG. 6B is an enlarged view showing an example of an unnecessary resin portion in the molded article. 7 is a reference diagram (plan view) for explaining an example of the device/molded product (frame) structure and steps in the gate cutting step using the resin sealing device according to the embodiment of the present invention. 8 is a reference diagram (plan view) for explaining another example of the device/molded product (frame) structure and steps in the gate cutting step using the resin sealing device according to the embodiment of the present invention.
202:密封模具 202:Sealing mold
204:上模 204: Upper mold
204a、206a:模具面 204a, 206a: Mold surface
205:工件保持部 205: Workpiece holding part
205A:第一工件保持部(工件保持部) 205A: First workpiece holding portion (workpiece holding portion)
205B:第二工件保持部(工件保持部) 205B: Second workpiece holding part (workpiece holding part)
206:下模 206: Lower mold
208:模腔 208:Mold cavity
208A:第一模腔(模腔) 208A: First mold cavity (mold cavity)
208B:第二模腔(模腔) 208B: Second mold cavity (mold cavity)
214:上模槽套區塊 214: Upper die groove sleeve block
216:下模槽套區塊 216: Lower die groove cover block
218:上模夾持區塊 218: Upper die clamping block
220:下模夾持區塊 220: Lower mold clamping block
226:模腔區塊 226:Mold cavity block
240:罐 240:Cans
242:柱塞 242: Plunger
244:剔料池區塊 244: Material removal pool area
246:剔料池(樹脂流路) 246: Material removal pool (resin flow path)
247:澆道(樹脂流路) 247:Sprue (resin flow path)
248:澆口(樹脂流路) 248: Watering port (resin flow path)
R:樹脂 R: Resin
W:工件(被成形品) W: Workpiece (formed product)
Wa:基材 Wa: base material
Wb:電子零件 Wb:Electronic parts
Claims (6)
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JP2022-136435 | 2022-08-30 | ||
JP2022136435A JP2024033057A (en) | 2022-08-30 | 2022-08-30 | Resin sealing device and resin sealing method |
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TW202410218A true TW202410218A (en) | 2024-03-01 |
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TW112120569A TW202410218A (en) | 2022-08-30 | 2023-06-01 | Resin sealing device and resin sealing method |
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JP (1) | JP2024033057A (en) |
TW (1) | TW202410218A (en) |
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JPH0740573B2 (en) * | 1987-01-26 | 1995-05-01 | 株式会社東芝 | Semiconductor manufacturing equipment |
JP2000003921A (en) * | 1998-06-13 | 2000-01-07 | Shibaura Mechatronics Corp | Semiconductor manufacturing device |
JP3911361B2 (en) * | 1999-04-19 | 2007-05-09 | アピックヤマダ株式会社 | Degate method for matrix substrate |
JP4836547B2 (en) * | 2005-11-05 | 2011-12-14 | Towa株式会社 | Gate cutting method for molded matrix lead frame |
JP5732669B2 (en) * | 2010-08-12 | 2015-06-10 | アピックヤマダ株式会社 | Degate device and resin molding device provided with the same |
JP7395874B2 (en) * | 2019-08-21 | 2023-12-12 | I-Pex株式会社 | Gate breaking method and gate breaking device |
JP7121835B1 (en) * | 2021-06-25 | 2022-08-18 | Towa株式会社 | RESIN MOLDING APPARATUS AND METHOD OF MANUFACTURING RESIN MOLDED PRODUCT |
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