TW202348442A - Binding protective tape - Google Patents
Binding protective tape Download PDFInfo
- Publication number
- TW202348442A TW202348442A TW112119281A TW112119281A TW202348442A TW 202348442 A TW202348442 A TW 202348442A TW 112119281 A TW112119281 A TW 112119281A TW 112119281 A TW112119281 A TW 112119281A TW 202348442 A TW202348442 A TW 202348442A
- Authority
- TW
- Taiwan
- Prior art keywords
- base material
- protective tape
- bundled
- polyorganosiloxane
- mass
- Prior art date
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 116
- 239000000463 material Substances 0.000 claims abstract description 127
- 229920005989 resin Polymers 0.000 claims abstract description 47
- 239000011347 resin Substances 0.000 claims abstract description 47
- 229920000915 polyvinyl chloride Polymers 0.000 claims abstract description 37
- 239000004800 polyvinyl chloride Substances 0.000 claims abstract description 37
- 239000004014 plasticizer Substances 0.000 claims abstract description 24
- 239000000945 filler Substances 0.000 claims abstract description 21
- 239000012790 adhesive layer Substances 0.000 claims abstract description 19
- 239000011342 resin composition Substances 0.000 claims abstract description 19
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 13
- 238000012360 testing method Methods 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 19
- 239000002987 primer (paints) Substances 0.000 description 18
- 239000000758 substrate Substances 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 12
- 238000007667 floating Methods 0.000 description 11
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 10
- 239000004205 dimethyl polysiloxane Substances 0.000 description 10
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 10
- 229920000578 graft copolymer Polymers 0.000 description 10
- 239000010410 layer Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 10
- 239000000203 mixture Substances 0.000 description 9
- -1 phthalate ester Chemical class 0.000 description 9
- 244000043261 Hevea brasiliensis Species 0.000 description 8
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 229920003052 natural elastomer Polymers 0.000 description 8
- 229920001194 natural rubber Polymers 0.000 description 8
- 238000000576 coating method Methods 0.000 description 7
- 229920001971 elastomer Polymers 0.000 description 7
- 239000000839 emulsion Substances 0.000 description 7
- 239000005060 rubber Substances 0.000 description 7
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 7
- 102100035474 DNA polymerase kappa Human genes 0.000 description 6
- 101710108091 DNA polymerase kappa Proteins 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- JQCXWCOOWVGKMT-UHFFFAOYSA-N diheptyl phthalate Chemical compound CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 description 6
- 238000001556 precipitation Methods 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 5
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 4
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Chemical compound CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- 238000003490 calendering Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000004816 latex Substances 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229920003051 synthetic elastomer Polymers 0.000 description 4
- 239000005061 synthetic rubber Substances 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007756 gravure coating Methods 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 229920000126 latex Polymers 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 150000002825 nitriles Chemical class 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000012855 volatile organic compound Substances 0.000 description 3
- BKUSIKGSPSFQAC-RRKCRQDMSA-N 2'-deoxyinosine-5'-diphosphate Chemical compound O1[C@H](CO[P@@](O)(=O)OP(O)(O)=O)[C@@H](O)C[C@@H]1N1C(NC=NC2=O)=C2N=C1 BKUSIKGSPSFQAC-RRKCRQDMSA-N 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 239000004803 Di-2ethylhexylphthalate Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- 229920005601 base polymer Polymers 0.000 description 2
- 239000000440 bentonite Substances 0.000 description 2
- 229910000278 bentonite Inorganic materials 0.000 description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000012417 linear regression Methods 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 239000008029 phthalate plasticizer Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000007761 roller coating Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- KPAPHODVWOVUJL-UHFFFAOYSA-N 1-benzofuran;1h-indene Chemical compound C1=CC=C2CC=CC2=C1.C1=CC=C2OC=CC2=C1 KPAPHODVWOVUJL-UHFFFAOYSA-N 0.000 description 1
- IVORCBKUUYGUOL-UHFFFAOYSA-N 1-ethynyl-2,4-dimethoxybenzene Chemical compound COC1=CC=C(C#C)C(OC)=C1 IVORCBKUUYGUOL-UHFFFAOYSA-N 0.000 description 1
- QTKPMCIBUROOGY-UHFFFAOYSA-N 2,2,2-trifluoroethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(F)(F)F QTKPMCIBUROOGY-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- 239000004114 Ammonium polyphosphate Substances 0.000 description 1
- 229920006310 Asahi-Kasei Polymers 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229920004482 WACKER® Polymers 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229920006271 aliphatic hydrocarbon resin Polymers 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- UJOHNXQDVUADCG-UHFFFAOYSA-L aluminum;magnesium;carbonate Chemical compound [Mg+2].[Al+3].[O-]C([O-])=O UJOHNXQDVUADCG-UHFFFAOYSA-L 0.000 description 1
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 1
- 229920001276 ammonium polyphosphate Polymers 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 229920006272 aromatic hydrocarbon resin Polymers 0.000 description 1
- QBLDFAIABQKINO-UHFFFAOYSA-N barium borate Chemical compound [Ba+2].[O-]B=O.[O-]B=O QBLDFAIABQKINO-UHFFFAOYSA-N 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 229910001593 boehmite Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- CEDDGDWODCGBFQ-UHFFFAOYSA-N carbamimidoylazanium;hydron;phosphate Chemical compound NC(N)=N.OP(O)(O)=O CEDDGDWODCGBFQ-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000000068 chlorophenyl group Chemical group 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- GCFAUZGWPDYAJN-UHFFFAOYSA-N cyclohexyl 3-phenylprop-2-enoate Chemical compound C=1C=CC=CC=1C=CC(=O)OC1CCCCC1 GCFAUZGWPDYAJN-UHFFFAOYSA-N 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- QQVIHTHCMHWDBS-UHFFFAOYSA-L isophthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC(C([O-])=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-L 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- 229920006173 natural rubber latex Polymers 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- 125000005498 phthalate group Chemical group 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000005591 trimellitate group Chemical group 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- PZRXQXJGIQEYOG-UHFFFAOYSA-N zinc;oxido(oxo)borane Chemical compound [Zn+2].[O-]B=O.[O-]B=O PZRXQXJGIQEYOG-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/04—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C08L27/06—Homopolymers or copolymers of vinyl chloride
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
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- Polymers & Plastics (AREA)
- Adhesive Tapes (AREA)
- Package Frames And Binding Bands (AREA)
Abstract
Description
本發明係關於一種集束保護帶。該集束保護帶能夠較好地用於電動汽車、混合動力汽車之高壓電纜或汽車之線束等之集束及保護用途。The invention relates to a bundled protective tape. This bundled protective tape can be well used for bundling and protecting high-voltage cables of electric vehicles, hybrid vehicles, or automobile wiring harnesses.
汽車線束之集束及保護用途中，出於具有適度之柔軟性與伸長性，阻燃性、機械強度、耐熱變形性、電絕緣性、及成形加工性等方面優異，進而價格相對便宜之理由之考慮，使用將黏著劑塗佈於包含聚氯乙烯樹脂之基材之單面而得之聚氯乙烯系集束保護帶(專利文獻1～2)。又，已知藉由將比聚氯乙烯樹脂更加硬質之硬質線材排列於規定之切割方向並埋設於基材中，從而提高聚氯乙烯系集束保護帶之切割性與耐磨性(專利文獻3)。 [先前技術文獻] [專利文獻] For the purpose of bundling and protecting automobile wire harnesses, it has moderate flexibility and elongation, excellent flame retardancy, mechanical strength, heat deformation resistance, electrical insulation, and molding processability, and is relatively cheap. It is considered to use a polyvinyl chloride-based bundled protective tape in which an adhesive is applied to one side of a base material containing a polyvinyl chloride resin (Patent Documents 1 and 2). Furthermore, it is known that the cutting performance and wear resistance of a polyvinyl chloride-based bundled protective tape can be improved by arranging hard wires that are harder than polyvinyl chloride resin in a predetermined cutting direction and embedding them in the base material (Patent Document 3 ). [Prior technical literature] [Patent Document]
[專利文獻1]日本專利特開平8-259909號公報 [專利文獻2]日本專利特開2012-184369號公報 [專利文獻3]日本專利特開平10-264902 [Patent Document 1] Japanese Patent Application Laid-Open No. 8-259909 [Patent Document 2] Japanese Patent Application Publication No. 2012-184369 [Patent Document 3] Japanese Patent Application Laid-Open No. 10-264902
[發明所欲解決之問題][Problem to be solved by the invention]
本發明之課題在於提供一種柔軟性與保護性能之平衡性優異，進而基材之製膜性優異之集束保護帶。 [解決問題之技術手段] An object of the present invention is to provide a bundled protective tape that has an excellent balance between flexibility and protective performance and has excellent film-forming properties of the base material. [Technical means to solve problems]
本發明人等進行了研究，結果發現一種具有基材、及形成於上述基材之單面之黏著劑層之集束保護帶，其中藉由使上述基材含有聚氯乙烯樹脂、塑化劑、填充劑、及聚有機矽氧烷，且使相對於上述聚氯乙烯樹脂100質量份之上述聚有機矽氧烷之含量為1～10質量份，從而能夠獲得柔軟性與保護性能之平衡性優異，進而基材之製膜性優異之集束保護帶。 即， 本發明係關於下述者： [1]一種集束保護帶， 其係具有基材、及形成於上述基材之單面之黏著劑層者，且 上述基材由含有聚氯乙烯樹脂、塑化劑、填充劑、及聚有機矽氧烷之樹脂組合物所構成， 上述樹脂組合物中，相對於上述聚氯乙烯樹脂100質量份之上述聚有機矽氧烷之含量為1～10質量份。 [2]如[1]所記載之集束保護帶，其中 使用日東電工公司製造之No.5000NS之雙面膠帶將上述基材固定於試樣台，使用基於ASTM D1894之R接觸件，於負載200 g、試驗速度2.5 mm/sec之條件下測得之上述基材表面之動摩擦係數為0.06～0.26。 [3]如[1]所記載之集束保護帶，其中 經由上述黏著劑層將上述集束保護帶固定於試樣台，使用基於ASTM D1894之R接觸件，於負載200 g、試驗速度2.5 mm/sec之條件下測得之上述集束保護帶之基材背面之動摩擦係數為0.13～0.60。 [4]如[1]至[3]中任一項所記載之集束保護帶，其中上述聚有機矽氧烷係使(甲基)丙烯酸酯共聚於該聚有機矽氧烷之側鏈而成之丙烯酸改性聚有機矽氧烷。 [5]如[4]所記載之集束保護帶，其中上述丙烯酸改性聚有機矽氧烷之重量平均分子量為30萬～50萬。 [6]如[1]至[5]中任一項所記載之集束保護帶，其中上述樹脂組合物中，相對於上述聚氯乙烯樹脂100質量份之上述塑化劑之含量為38～50質量份。 [7]如[1]至[6]中任一項所記載之集束保護帶，其中上述樹脂組合物中，相對於上述聚氯乙烯樹脂100質量份之上述填充劑之含量為10～60質量份。 [8]如[1]至[7]中任一項所記載之集束保護帶，其中上述基材之厚度為190～330 μm。 [9]如[1]至[8]中任一項所記載之集束保護帶，其中上述基材之厚度換算之拉伸彈性模數為6～9 N/mm。 [發明之效果] The present inventors conducted research and found a bundled protective tape having a base material and an adhesive layer formed on one side of the base material, in which the base material contains polyvinyl chloride resin, a plasticizer, filler, and polyorganosiloxane, and the content of the above-mentioned polyorganosiloxane is 1 to 10 parts by mass relative to 100 parts by mass of the above-mentioned polyvinyl chloride resin, thereby achieving excellent balance between flexibility and protective properties. , and a bundled protective tape with excellent film forming properties on the base material. Right now, The present invention relates to: [1]A kind of cluster protective tape, It has a base material and an adhesive layer formed on one side of the base material, and The above-mentioned base material is composed of a resin composition containing polyvinyl chloride resin, plasticizer, filler, and polyorganosiloxane, In the above-mentioned resin composition, the content of the above-mentioned polyorganosiloxane is 1 to 10 parts by mass relative to 100 parts by mass of the above-mentioned polyvinyl chloride resin. [2] The bundled protective tape as described in [1], wherein The above base material was fixed to the sample stage using double-sided tape No. 5000NS manufactured by Nitto Denko Co., Ltd., using R contacts based on ASTM D1894, and measured under the conditions of load 200 g and test speed 2.5 mm/sec. The dynamic friction coefficient of the base material surface is 0.06~0.26. [3] The bundled protective tape as described in [1], wherein The above-mentioned collective protective tape is fixed to the sample stage through the above-mentioned adhesive layer, and the back side of the base material of the above-mentioned collective protective tape is measured under the conditions of load 200 g and test speed 2.5 mm/sec using an R contact based on ASTM D1894. The dynamic friction coefficient is 0.13~0.60. [4] The bundled protective tape according to any one of [1] to [3], wherein the polyorganosiloxane is obtained by copolymerizing (meth)acrylate on the side chain of the polyorganosiloxane. Acrylic modified polyorganosiloxane. [5] The bundled protective tape according to [4], wherein the weight average molecular weight of the acrylic-modified polyorganosiloxane is 300,000 to 500,000. [6] The bundled protective tape according to any one of [1] to [5], wherein the content of the plasticizer in the resin composition is 38 to 50 parts by mass relative to 100 parts by mass of the polyvinyl chloride resin. parts by mass. [7] The bundled protective tape according to any one of [1] to [6], wherein the content of the filler in the resin composition is 10 to 60 parts by mass relative to 100 parts by mass of the polyvinyl chloride resin. share. [8] The bundled protective tape according to any one of [1] to [7], wherein the thickness of the base material is 190 to 330 μm. [9] The bundled protective tape according to any one of [1] to [8], wherein the tensile elastic modulus converted from the thickness of the base material is 6 to 9 N/mm. [Effects of the invention]
根據本發明，可提供一種柔軟性與保護性能之平衡性優異，進而基材之製膜性優異之集束保護帶。According to the present invention, it is possible to provide a bundled protective tape that has an excellent balance between flexibility and protective performance and has excellent film-forming properties of the base material.
＜用語之說明＞ 本案說明書中，例如，「A～B」之記載係A以上B以下之含義。 ＜Explanation of terms＞ In the description of this case, for example, the description "A～B" means A above and B below.
以下，針對本發明之實施方式，詳細地進行說明。本發明並不限定於此，於不脫離其主旨之範圍內能夠進行各種變形。以下所示之實施方式中所示出之各種特徵事項可相互組合。又，各特徵事項獨立地使發明成立。Hereinafter, embodiments of the present invention will be described in detail. The present invention is not limited to this, and various modifications can be made without departing from the gist of the invention. Various features shown in the embodiments shown below can be combined with each other. Furthermore, each characteristic matter independently establishes the invention.
＜集束保護帶之構成＞ 本發明之一實施方式之集束保護帶具有基材、及形成於上述基材之單面之黏著劑層。以下，針對各構成，詳細地進行說明。 ＜Construction of bundled protective tape＞ A bundled protective tape according to one embodiment of the present invention has a base material and an adhesive layer formed on one side of the base material. Each structure will be described in detail below.
＜基材＞ 本發明之一實施方式之基材係由含有聚氯乙烯樹脂、塑化劑、填充劑、及聚有機矽氧烷，且相對於聚氯乙烯樹脂100質量份之上述聚有機矽氧烷之含量為1～10質量份之樹脂組合物所構成。 ＜Substrate＞ The base material of one embodiment of the present invention is composed of polyvinyl chloride resin, plasticizer, filler, and polyorganosiloxane, and the content of the above polyorganosiloxane relative to 100 parts by mass of the polyvinyl chloride resin is It is composed of 1 to 10 parts by mass of the resin composition.
＜聚氯乙烯樹脂＞ 作為本發明之一實施方式中之聚氯乙烯樹脂，較佳為平均聚合度1000～1500之聚氯乙烯樹脂，亦可使用平均聚合度不同之2種以上之聚氯乙烯樹脂。若平均聚合度未達1000，則聚合物鏈之纏繞不充分，有時無法獲得足夠之強度(耐磨性)。若平均聚合度高於1500，則難以進行凝膠化，因此製膜性有時會變差。 ＜Polyvinyl chloride resin＞ The polyvinyl chloride resin in one embodiment of the present invention is preferably a polyvinyl chloride resin with an average polymerization degree of 1,000 to 1,500. Two or more types of polyvinyl chloride resins with different average polymerization degrees may also be used. If the average degree of polymerization is less than 1000, the polymer chains are not sufficiently entangled, and sufficient strength (wear resistance) may not be obtained. If the average degree of polymerization is higher than 1500, gelation becomes difficult and film-forming properties may deteriorate.
＜塑化劑＞ 本發明之一實施方式中之塑化劑並無特別限定，只要可對基材賦予柔軟性即可。例如可例舉：偏苯三甲酸酯、己二酸酯、鄰苯二甲酸酯、環氧系塑化劑、間苯二甲酸酯、對苯二甲酸酯、磷酸系塑化劑。基於對聚氯乙烯樹脂之塑化效果或較少滲出之觀點而言，較佳為鄰苯二甲酸酯。該等塑化劑可單獨地使用，亦可組合2種以上來使用。 ＜Plasticizer＞ The plasticizer in one embodiment of the present invention is not particularly limited as long as it can impart flexibility to the base material. Examples thereof include trimellitate, adipate, phthalate, epoxy plasticizer, isophthalate, terephthalate, and phosphoric acid plasticizer. From the viewpoint of plasticizing effect on polyvinyl chloride resin or less bleeding, phthalate ester is preferred. These plasticizers can be used individually or in combination of 2 or more types.
＜鄰苯二甲酸酯＞ 作為本發明之一實施方式中之鄰苯二甲酸酯系塑化劑，例如可例舉：DINP(鄰苯二甲酸二異壬酯)、DHP(鄰苯二甲酸二庚酯)、DOP(鄰苯二甲酸二-2-乙基己酯)、n-DOP(鄰苯二甲酸二正辛酯)、DIDP(鄰苯二甲酸二異癸酯)。基於對聚氯乙烯樹脂之塑化效果或較少滲出、對人體產生之影響較小之觀點而言，較佳為DINP(鄰苯二甲酸二異壬酯)、DIDP(鄰苯二甲酸二異癸酯)等鄰苯二甲酸與碳數9～10之醇之二酯。該等塑化劑可單獨地使用，亦可組合2種以上來使用。 ＜Phthalates＞ Examples of the phthalate plasticizer in one embodiment of the present invention include DINP (diisononyl phthalate), DHP (diheptyl phthalate), DOP ( Di-2-ethylhexyl phthalate), n-DOP (di-n-octyl phthalate), DIDP (diisodecyl phthalate). From the viewpoint of the plasticizing effect of polyvinyl chloride resin or less leakage and less impact on the human body, DINP (diisononyl phthalate) or DIDP (diisophthalate) are preferred. Diesters of phthalic acid and alcohols with 9 to 10 carbon atoms such as decyl ester). These plasticizers can be used individually or in combination of 2 or more types.
本發明之一實施方式中，塑化劑之含量相對於聚氯乙烯樹脂100質量份而言，較佳為38～50質量份，更佳為40～48質量份。具體而言，例如較佳為38質量份、40質量份、42質量份、43質量份、44質量份、45質量份、46質量份、48質量份、或50質量份，亦可為此處所例示之任意2個數值之間之範圍內。藉由使塑化劑為38質量份以上，從而提高基材之柔軟性，例如提高將其捲繞於電線等時之追隨性，由此可減少集束保護帶產生浮起。藉由使塑化劑為50質量份以下，從而提高基材之耐磨性，能夠獲得良好之保護性能。 再者，於併用塑化劑之情形時，塑化劑之含量係指併用之塑化劑之合計含量。 In one embodiment of the present invention, the content of the plasticizer is preferably 38 to 50 parts by mass, and more preferably 40 to 48 parts by mass relative to 100 parts by mass of the polyvinyl chloride resin. Specifically, for example, it is preferably 38 parts by mass, 40 parts by mass, 42 parts by mass, 43 parts by mass, 44 parts by mass, 45 parts by mass, 46 parts by mass, 48 parts by mass, or 50 parts by mass, and may also be used here. Within the range between any two numerical values in the example. By making the plasticizer content 38 parts by mass or more, the flexibility of the base material can be improved, for example, the followability when winding it around electric wires, etc. can be improved, thereby reducing the occurrence of floating of the bundled protective tape. By setting the plasticizer content to 50 parts by mass or less, the wear resistance of the base material is improved and good protective performance can be obtained. Furthermore, when a plasticizer is used together, the content of the plasticizer refers to the total content of the plasticizers used together.
＜填充劑＞ 本發明之一實施方式中之填充劑並無特別限定，只要可使基材增量，提高硬度即可。例如，基於同時具備補強效果與柔軟性之觀點而言，較佳為無機填充劑。 ＜Filler＞ The filler in one embodiment of the present invention is not particularly limited, as long as it can increase the size of the base material and increase the hardness. For example, inorganic fillers are preferred from the viewpoint of having both reinforcing effect and softness.
＜無機填充劑＞ 作為本發明之一實施方式中之無機填充劑，例如可例舉：碳酸鈣、氫氧化鋁、氫氧化鎂、氫氧化鋯、氫氧化鈣、氫氧化鉀、氫氧化鋇、亞磷酸三苯酯、多磷酸銨、多磷醯胺、氧化鋯、氧化鎂、氧化鋅、氧化鈦、氧化鉬、磷酸胍、鋁碳酸鎂、膨潤石、硼酸鋅、無水硼酸鋅、偏硼酸鋅、偏硼酸鋇、氧化銻、五氧化二銻、赤磷、滑石、氧化鋁、二氧化矽、軟水鋁石、膨潤土、矽酸鈉、矽酸鈣、硫酸鈣、碳酸鎂、碳黑。基於同時具備補強效果與柔軟性之觀點而言，較佳為碳酸鈣、二氧化矽、碳黑。該等填充劑可單獨地使用，亦可組合2種以上來使用。 ＜Inorganic filler＞ Examples of the inorganic filler in one embodiment of the present invention include calcium carbonate, aluminum hydroxide, magnesium hydroxide, zirconium hydroxide, calcium hydroxide, potassium hydroxide, barium hydroxide, and triphenyl phosphite. , ammonium polyphosphate, polyphosphoramide, zirconium oxide, magnesium oxide, zinc oxide, titanium oxide, molybdenum oxide, guanidine phosphate, aluminum magnesium carbonate, bentonite, zinc borate, anhydrous zinc borate, zinc metaborate, barium metaborate, Antimony oxide, antimony pentoxide, red phosphorus, talc, alumina, silica, boehmite, bentonite, sodium silicate, calcium silicate, calcium sulfate, magnesium carbonate, carbon black. From the viewpoint of having both reinforcing effect and softness, calcium carbonate, silica, and carbon black are preferred. These fillers may be used individually or in combination of 2 or more types.
本發明之一實施方式中之填充劑之含量相對於聚氯乙烯樹脂100質量份而言，較佳為10～60質量份，更佳為20～40質量份。具體而言，例如為10質量份、15質量份、20質量份、25質量份、30質量份、35質量份、40質量份、45質量份、50質量份、或60質量份，亦可為此處所例示之任意2個數值之間之範圍內。藉由使填充劑為10質量份以上，從而提高基材之耐磨性，能夠獲得良好之保護性能。藉由使填充劑為60質量份以下，從而提高基材之柔軟性，例如提高將其捲繞於電線等時之追隨性，由此可減少集束保護帶產生浮起。 再者，於併用填充劑之情形時，填充劑之含量係指併用之填充劑之合計含量。 The content of the filler in one embodiment of the present invention is preferably 10 to 60 parts by mass, and more preferably 20 to 40 parts by mass relative to 100 parts by mass of the polyvinyl chloride resin. Specifically, it may be, for example, 10 parts by mass, 15 parts by mass, 20 parts by mass, 25 parts by mass, 30 parts by mass, 35 parts by mass, 40 parts by mass, 45 parts by mass, 50 parts by mass, or 60 parts by mass. Within the range between any two numerical values illustrated here. By adding the filler to 10 parts by mass or more, the wear resistance of the base material is improved and good protective performance can be obtained. By setting the filler content to 60 parts by mass or less, the flexibility of the base material can be improved, for example, the followability when being wound around electric wires, etc. can be improved, thereby reducing the occurrence of floating of the bundled protective tape. In addition, when a filler is used together, the content of the filler refers to the total content of the fillers used together.
＜聚有機矽氧烷＞ ＜聚有機矽氧烷結構＞ 本發明之一實施方式中之聚有機矽氧烷並無特別限定，只要具有聚有機矽氧烷結構即可。所謂聚有機矽氧烷結構，係指主鏈上具有-Si-O-之重複單元，側鏈上具有有機基之聚合物。作為重複單元，例如可例舉以下結構式所示之重複單元。 ＜Polyorganosiloxane＞ ＜Polyorganosiloxane structure＞ The polyorganosiloxane in one embodiment of the present invention is not particularly limited, as long as it has a polyorganosiloxane structure. The so-called polyorganosiloxane structure refers to a polymer with -Si-O- repeating units on the main chain and organic groups on the side chains. Examples of the repeating unit include repeating units represented by the following structural formulas.
[化1] [Chemical 1]
式中，R 1及R 2係分別獨立地為選自烷基、聚氧伸烷基、含氟基、氯苯基中之有機基。基於滑動性之觀點而言，較佳為烷基。 作為烷基，例如，基於滑動性之觀點而言，可例舉：甲基及乙基。 該等聚有機矽氧烷結構可單獨地使用，亦可組合2種以上來使用。 In the formula, R 1 and R 2 are each independently an organic group selected from alkyl groups, polyoxyalkylene groups, fluorine-containing groups, and chlorophenyl groups. From the viewpoint of sliding properties, an alkyl group is preferred. Examples of the alkyl group include, from the viewpoint of sliding properties, methyl and ethyl groups. These polyorganosiloxane structures may be used individually or in combination of two or more types.
＜丙烯酸改性聚有機矽氧烷＞ 基於聚氯乙烯樹脂中之分散性及滑動性持續性之觀點而言，本發明之一實施方式中之聚有機矽氧烷亦可為使(甲基)丙烯酸酯共聚於該聚有機矽氧烷之側鏈而成之丙烯酸改性聚有機矽氧烷。 ＜Acrylic modified polyorganosiloxane＞ From the viewpoint of dispersion and slipability sustainability in polyvinyl chloride resin, the polyorganosiloxane in one embodiment of the present invention may also be a polyorganosiloxane copolymerized with (meth)acrylate. Acrylic modified polyorganosiloxane made of side chains.
作為本發明之一實施方式中之導入至聚有機矽氧烷之側鏈之(甲基)丙烯酸酯，例如可例舉：甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸丙酯、甲基丙烯酸異丙酯、甲基丙烯酸丁酯、甲基丙烯酸異丁酯、甲基丙烯酸環己酯、甲基丙烯酸苯酯、甲基丙烯酸2-乙基己酯、甲基丙烯酸第三丁基環己酯、甲基丙烯酸苄酯、甲基丙烯酸2,2,2-三氟乙酯等。基於處理或獲取之容易程度之觀點而言，較佳為甲基丙烯酸甲酯。 該等可共聚之(甲基)丙烯酸酯可單獨地使用，亦可組合2種以上來使用。 基於聚氯乙烯樹脂中之分散性及滑動性持續性之觀點而言，本發明之一實施方式中之聚有機矽氧烷較佳為使甲基丙烯酸甲酯共聚於聚有機矽氧烷之側鏈而成之甲基丙烯酸甲酯改性聚有機矽氧烷。 Examples of the (meth)acrylate introduced into the side chain of the polyorganosiloxane in one embodiment of the present invention include: methyl methacrylate, ethyl methacrylate, propyl methacrylate, Isopropyl methacrylate, butyl methacrylate, isobutyl methacrylate, cyclohexyl methacrylate, phenyl methacrylate, 2-ethylhexyl methacrylate, tert-butyl methacrylate Cyclohexyl ester, benzyl methacrylate, 2,2,2-trifluoroethyl methacrylate, etc. From the viewpoint of ease of handling or acquisition, methyl methacrylate is preferred. These copolymerizable (meth)acrylates can be used individually or in combination of two or more types. From the viewpoint of dispersion and sliding properties in polyvinyl chloride resin, the polyorganosiloxane in one embodiment of the present invention is preferably copolymerized with methyl methacrylate on the side of the polyorganosiloxane. Methyl methacrylate modified polyorganosiloxane.
＜丙烯酸改性聚有機矽氧烷之重量平均分子量(Mw)＞ 本發明之一實施方式中之丙烯酸改性聚有機矽氧烷之重量平均分子量(Mw)較佳為30萬～50萬，更佳為35萬～45萬。具體而言，例如為30萬、35萬、38萬、40萬、42萬、45萬、或50萬，亦可為此處所例示之任意2個數值之間之範圍內。藉由使丙烯酸改性聚有機矽氧烷之重量平均分子量(Mw)為30萬以上，可提高基材之製造時之基材之製膜性、保管時之穩定性。藉由使重量平均分子量(Mw)為50萬以下，可均勻地分散於聚氯乙烯樹脂中。 <Weight average molecular weight (Mw) of acrylic modified polyorganosiloxane> The weight average molecular weight (Mw) of the acrylic modified polyorganosiloxane in one embodiment of the present invention is preferably 300,000 to 500,000, more preferably 350,000 to 450,000. Specifically, it may be, for example, 300,000, 350,000, 380,000, 400,000, 420,000, 450,000, or 500,000, or it may be within the range between any two numerical values illustrated here. By setting the weight average molecular weight (Mw) of the acrylic-modified polyorganosiloxane to 300,000 or more, the film-forming properties of the substrate during production and the stability during storage can be improved. By setting the weight average molecular weight (Mw) to 500,000 or less, it can be uniformly dispersed in polyvinyl chloride resin.
本發明之一實施方式中之丙烯酸改性聚有機矽氧烷之重量平均分子量(Mw)例如可使用凝膠滲透層析儀(GPC)進行測定。丙烯酸改性聚有機矽氧烷之重量平均分子量(Mw)例如可藉由調節聚有機矽氧烷之重量平均分子量(Mw)來進行控制。 再者，於併用丙烯酸改性聚有機矽氧烷之情形時，重量平均分子量(Mw)係指併用之丙烯酸改性聚有機矽氧烷之合計重量平均分子量(Mw)。 The weight average molecular weight (Mw) of the acrylic acid-modified polyorganosiloxane in one embodiment of the present invention can be measured, for example, using gel permeation chromatography (GPC). The weight average molecular weight (Mw) of the acrylic modified polyorganosiloxane can be controlled, for example, by adjusting the weight average molecular weight (Mw) of the polyorganosiloxane. In addition, when acrylic acid-modified polyorganosiloxane is used together, the weight average molecular weight (Mw) refers to the total weight average molecular weight (Mw) of the acrylic acid-modified polyorganosiloxane used together.
＜直鏈狀聚有機矽氧烷＞ 本發明之一實施方式中之聚有機矽氧烷亦可為主鏈之矽氧烷鍵直鏈狀地鍵結而成之直鏈狀聚有機矽氧烷。作為直鏈狀聚有機矽氧烷，例如可例舉：直鏈狀聚二甲基矽氧烷、直鏈狀聚甲基苯基矽氧烷、直鏈狀聚甲基氫化矽氧烷等。基於滑動性之觀點而言，較佳為直鏈狀聚二甲基矽氧烷。 該等以外之直鏈狀聚有機矽氧烷可單獨地使用，亦可組合2種以上來使用。 ＜Linear chain polyorganosiloxane＞ The polyorganosiloxane in one embodiment of the present invention may also be a linear polyorganosiloxane formed by linearly bonding siloxane bonds in the main chain. Examples of linear polyorganosiloxane include linear polydimethylsiloxane, linear polymethylphenylsiloxane, linear polymethylhydrogensiloxane, and the like. From the viewpoint of sliding properties, linear polydimethylsiloxane is preferred. Linear polyorganosiloxanes other than these may be used individually or in combination of two or more types.
＜經交聯之聚有機矽氧烷＞ 基於基材之製造時之基材之製膜性、保管時之穩定性之觀點而言，本發明之一實施方式中之聚有機矽氧烷亦可為直鏈狀聚有機矽氧烷經交聯之結構、矽氧烷鍵三維網狀地交聯之結構。基於滑動性之觀點而言，較佳為直鏈狀聚有機矽氧烷交聯而成之聚有機矽氧烷。 該等經交聯之聚有機矽氧烷可單獨地使用，亦可組合2種以上來使用。 ＜Crosslinked polyorganosiloxane＞ From the viewpoint of the film-forming properties of the substrate during production and the stability during storage, the polyorganosiloxane in one embodiment of the present invention may also be a linear polyorganosiloxane with cross-linked polyorganosiloxane. The structure is a three-dimensional cross-linked network of siloxane bonds. From the viewpoint of sliding properties, polyorganosiloxane cross-linked with linear polyorganosiloxane is preferred. These crosslinked polyorganosiloxanes may be used individually or in combination of two or more types.
本發明之一實施方式中，聚有機矽氧烷之含量相對於聚氯乙烯樹脂100質量份而言，為1～10質量份，更佳為3～7質量份。具體而言，例如為1質量份、2質量份、4質量份、6質量份、8質量份、或10質量份，亦可為此處所例示之任意2個數值之間之範圍內。藉由使聚有機矽氧烷之含量為1質量份以上，從而提高基材之耐磨性，能夠獲得良好之保護性能。藉由使聚有機矽氧烷之含量為10質量份以下，從而提高基材之柔軟性，例如提高將其捲繞於電線等時之追隨性，由此可減少集束保護帶產生浮起。又，製膜時可防止機面析出(樹脂組合物之一部分分離而附著於成形機上之現象)。 再者，於併用聚有機矽氧烷之情形時，聚有機矽氧烷之含量係指併用之聚有機矽氧烷之合計含量。 In one embodiment of the present invention, the content of polyorganosiloxane is 1 to 10 parts by mass, and more preferably 3 to 7 parts by mass relative to 100 parts by mass of polyvinyl chloride resin. Specifically, it is, for example, 1 part by mass, 2 parts by mass, 4 parts by mass, 6 parts by mass, 8 parts by mass, or 10 parts by mass, or it may be in the range between any two numerical values illustrated here. By setting the content of the polyorganosiloxane to 1 part by mass or more, the wear resistance of the base material is improved and good protective performance can be obtained. By setting the content of the polyorganosiloxane to 10 parts by mass or less, the flexibility of the base material can be improved, for example, the followability when being wound around a wire or the like can be improved, thereby reducing the occurrence of floating of the bundled protective tape. In addition, it can prevent machine surface precipitation (a phenomenon in which part of the resin composition separates and adheres to the molding machine) during film production. In addition, when polyorganosiloxane is used together, the content of polyorganosiloxane refers to the total content of polyorganosiloxane used together.
＜其他添加劑＞ 又，本實施方式中之樹脂組合物中，視需要可於不損害本發明之效果之範圍內調配著色劑、穩定劑、抗氧化劑、紫外線吸收劑、潤滑劑等作為其他添加劑。 ＜Other additives＞ Moreover, in the resin composition in this embodiment, if necessary, a colorant, a stabilizer, an antioxidant, an ultraviolet absorber, a lubricant, etc. can be blended as other additives within the range which does not impair the effect of the present invention.
＜基材之厚度＞ 本實施方式中之集束保護帶之基材厚度根據使用目的或用途等而不同，較佳為190～330 μm，更佳為190～250 μm。具體而言，例如為190 μm、195 μm、200 μm、205 μm、210 μm、220 μm、250 μm、280 μm、300 μm、或330 μm，亦可為此處所例示之任意2個數值之間之範圍內。藉由使基材厚度為190 μm以上，從而提高基材之耐磨性，能夠獲得良好之保護性能。藉由使基材厚度為330 μm以下，從而提高基材之柔軟性，例如提高將其捲繞於電線等時之追隨性，由此可減少集束保護帶產生浮起。 ＜Thickness of base material＞ The thickness of the base material of the bundled protective tape in this embodiment varies depending on the purpose or use, but is preferably 190 to 330 μm, and more preferably 190 to 250 μm. Specifically, for example, it is 190 μm, 195 μm, 200 μm, 205 μm, 210 μm, 220 μm, 250 μm, 280 μm, 300 μm, or 330 μm, or it can be between any two values illustrated here. within the range. By making the base material thickness more than 190 μm, the wear resistance of the base material is improved and good protective performance can be obtained. By setting the thickness of the base material to 330 μm or less, the flexibility of the base material can be improved, for example, the followability of the base material when being wound around wires, etc. can be reduced, thereby reducing the occurrence of floating of the bundled protective tape.
＜基材之構造＞ 基於製程或製造設備簡易之觀點而言，本實施方式中之集束保護帶之基材之構造較佳為單層構造。 ＜Structure of base material＞ From the viewpoint of simple manufacturing process or manufacturing equipment, the structure of the base material of the bundled protective tape in this embodiment is preferably a single-layer structure.
＜基材之製造方法＞ 用於製造本實施方式之基材之樹脂組合物可藉由使聚氯乙烯樹脂、塑化劑、填充劑、及聚有機矽氧烷、以及視需要之熱穩定劑、光吸收劑、顏料、其他添加劑等熔融混練而獲得。熔融混練方法並無特別限定，可使用雙軸擠出機、連續式及批次式之捏合機、輥、班布里混合機等具備加熱裝置之各種混合機、混練機，使上述樹脂組合物以均勻分散之方式混合，對所獲得之混合物，利用作為常用之成形方法之壓延法、T字模法、吹脹法等使其成形為基材。出於生產性、變色、形狀之均勻性等方面之考慮，成形機較佳為壓延成形機。壓延成形中之輥排列方式例如可採用L型、倒L型、Z型等公知之方式，又，輥之溫度通常設定為150～200℃，較佳地設定為155～190℃。 ＜Manufacturing method of base material＞ The resin composition used to manufacture the base material of this embodiment can be prepared by using polyvinyl chloride resin, plasticizer, filler, and polyorganosiloxane, as well as optional heat stabilizers, light absorbers, pigments, It is obtained by melting and kneading other additives. The melt-kneading method is not particularly limited, and various mixers and kneaders equipped with heating devices such as twin-screw extruders, continuous and batch kneaders, rollers, Banbury mixers, etc. can be used to make the above resin composition. The mixture is mixed uniformly and dispersed, and the obtained mixture is formed into a base material using commonly used molding methods such as calendering, T-die method, and inflation. In consideration of productivity, discoloration, shape uniformity, etc., the forming machine is preferably a calendar forming machine. The roller arrangement in calendering can be, for example, known methods such as L-shaped, inverted L-shaped, and Z-shaped. In addition, the temperature of the rollers is usually set to 150 to 200°C, preferably 155 to 190°C.
＜基材表面之動摩擦係數＞ 本發明之一實施方式中，於使用日東電工公司製造之No.5000NS之雙面膠帶將基材固定於測定台之情形時，使用基於ASTM D1894之R接觸件，於負載200 g、試驗速度2.5 mm/sec之條件下測得之基材表面之動摩擦係數較佳為0.06～0.26，進而較佳為0.10～0.25。具體而言，例如較佳為0.06、0.08、0.10、0.12、0.14、0.16、0.18、0.20、0.22、0.24、或0.26，亦可為此處所例示之任意2個數值之間之範圍內。藉由使基材表面之動摩擦係數為0.06以上，從而提高集束保護帶之柔軟性，例如提高將其捲繞於電線等時之追隨性，由此可減少集束保護帶產生浮起。藉由使基材表面之動摩擦係數為0.26以下，從而提高集束保護帶之耐磨性，能夠獲得良好之保護性能。 ＜Dynamic friction coefficient of base material surface＞ In one embodiment of the present invention, when the base material is fixed to the measuring table using double-sided tape No. 5000NS manufactured by Nitto Denko Co., Ltd., an R contact based on ASTM D1894 is used, and the load is 200 g and the test speed is 2.5 The dynamic friction coefficient of the base material surface measured under the condition of mm/sec is preferably 0.06 to 0.26, and more preferably 0.10 to 0.25. Specifically, for example, 0.06, 0.08, 0.10, 0.12, 0.14, 0.16, 0.18, 0.20, 0.22, 0.24, or 0.26 is preferred, and it may be within the range between any two numerical values illustrated here. By setting the dynamic friction coefficient of the base material surface to 0.06 or above, the flexibility of the protective bundled tape can be improved, for example, the followability of the protective bundled tape when being wound around wires, etc. can be improved, thereby reducing the floating of the protective bundled tape. By making the dynamic friction coefficient of the base material surface less than 0.26, the wear resistance of the bundled protective tape is improved, and good protective performance can be obtained.
基材表面之動摩擦係數可藉由調整用於製造基材之樹脂組合物中所含有之聚有機矽氧烷之種類或含量來進行控制。The dynamic friction coefficient of the substrate surface can be controlled by adjusting the type or content of the polyorganosiloxane contained in the resin composition used to manufacture the substrate.
＜基材表面之動摩擦係數之測定＞ 本實施方式之基材中之基材表面之動摩擦係數例如可使用協和界面科學公司製造之自動摩擦磨耗解析裝置TS-501，根據以下之程序進行測定。 將基材樣品切割為寬度50 mm×長度100 mm，使用雙面膠帶(日東電工公司製造之No. 5000NS)將其固定於試樣台。 將基於ASTM D1894之R接觸件放置於所貼合之基材樣品背面，於負載200 g、試驗速度2.5 mm/sec之條件下測定動摩擦係數(室溫23℃、濕度50%RH)。 ＜Measurement of dynamic friction coefficient of base material surface＞ The dynamic friction coefficient of the base material surface in the base material of this embodiment can be measured according to the following procedure using, for example, the automatic friction and wear analysis device TS-501 manufactured by Kyowa Interface Science Co., Ltd. The substrate sample was cut into a width of 50 mm × a length of 100 mm, and was fixed to the sample stage using double-sided tape (No. 5000NS manufactured by Nitto Denko Co., Ltd.). The R contact based on ASTM D1894 was placed on the back of the bonded substrate sample, and the dynamic friction coefficient was measured under the conditions of load 200 g and test speed 2.5 mm/sec (room temperature 23°C, humidity 50%RH).
＜基材之厚度換算之拉伸彈性模數＞ 關於本實施方式之基材，基材之厚度換算之拉伸彈性模數較佳為6～9 N/mm，更佳為7～9 N/mm。具體而言，例如為6 N/mm、7 N/mm、8 N/mm、或9 N/mm，亦可為此處所例示之任意2個數值之間之範圍內。藉由使基材之厚度換算之拉伸彈性模數為6 N/mm以上，從而可達成與基材之保護性能之平衡性。藉由使基材之厚度換算之拉伸彈性模數為9 N/mm以下，從而提高基材之柔軟性，例如提高將其捲繞於電線等時之追隨性，由此可減少集束保護帶產生浮起。 基材之厚度換算之拉伸彈性模數可藉由調整用於製造基材之樹脂組合物中所含有之滑動性賦予劑之種類或含量來進行控制。 ＜Tensile elastic modulus converted from base material thickness＞ Regarding the base material of this embodiment, the tensile elastic modulus in terms of thickness of the base material is preferably 6 to 9 N/mm, more preferably 7 to 9 N/mm. Specifically, it is, for example, 6 N/mm, 7 N/mm, 8 N/mm, or 9 N/mm, or it may be in the range between any two numerical values illustrated here. By setting the tensile elastic modulus converted from the thickness of the base material to 6 N/mm or more, a balance with the protective performance of the base material can be achieved. By setting the tensile elastic modulus of the thickness of the base material to 9 N/mm or less, the flexibility of the base material can be improved, for example, by improving the followability when winding it around wires, etc., thus reducing the need for bundled protective tapes. Produce buoyancy. The tensile elastic modulus in terms of the thickness of the base material can be controlled by adjusting the type or content of the sliding property-imparting agent contained in the resin composition used to produce the base material.
＜基材之厚度換算之拉伸彈性模數之測定＞ 本實施方式之基材之厚度換算之拉伸彈性模數可根據以下之程序，由拉伸彈性模數之值獲得。 利用拉伸試驗機之夾頭部，以夾頭間距離為100 mm之方式夾住寬度19 mm、長度200 mm之集束帶試片使其固定。於室溫23℃、相對濕度50%RH之環境下，以300 mm/min之速度拉伸試片，測定拉伸應力與應變。根據線性回歸，算出在應變為0.01～0.05%之間之拉伸應力與應變之比，將所得之值作為拉伸彈性模數。 將如此所獲得之拉伸彈性模數與集束帶之總厚度(單位：mm)之乘積作為厚度換算之拉伸彈性模數。 ＜Measurement of tensile elastic modulus in terms of base material thickness＞ The thickness-converted tensile elastic modulus of the base material in this embodiment can be obtained from the value of the tensile elastic modulus according to the following procedure. Use the chuck of the tensile testing machine to clamp the bundled tape test piece with a width of 19 mm and a length of 200 mm so that the distance between the chucks is 100 mm to fix it. At room temperature of 23°C and relative humidity of 50% RH, the specimen was stretched at a speed of 300 mm/min to measure the tensile stress and strain. Based on linear regression, the ratio of tensile stress to strain was calculated when the strain was between 0.01 and 0.05%, and the obtained value was used as the tensile elastic modulus. The product of the tensile elastic modulus thus obtained and the total thickness of the gathering tape (unit: mm) is used as the thickness-converted tensile elastic modulus.
＜黏著劑層＞ 本實施方式之集束保護帶之黏著材層之黏著劑較佳為橡膠系黏著劑，可為溶劑型、乳液型之任一種。作為橡膠系黏著劑，較佳為含有選自天然橡膠或合成橡膠中之1種以上之橡膠、及黏著賦予樹脂，進而較佳為天然橡膠、合成橡膠、及黏著賦予樹脂之混合物。關於黏著賦予樹脂之混合比率，相對於含有天然橡膠及合成橡膠之混合物之橡膠成分100質量份而言，較佳為含有50～150質量份黏著賦予樹脂。 ＜Adhesive layer＞ The adhesive of the adhesive material layer of the bundled protective tape of this embodiment is preferably a rubber-based adhesive, which can be either solvent-based or emulsion-based. The rubber-based adhesive preferably contains one or more types of rubber selected from natural rubber or synthetic rubber and a tackifying resin, and is more preferably a mixture of natural rubber, synthetic rubber, and tackifying resin. The mixing ratio of the tackifier resin is preferably 50 to 150 parts by mass of the tackifier resin based on 100 parts by mass of the rubber component of the mixture of natural rubber and synthetic rubber.
作為上述天然橡膠及合成橡膠，可例舉：天然橡膠-甲基丙烯酸甲酯共聚物乳膠、苯乙烯-丁二烯共聚物、丙烯腈-丁二烯共聚物、甲基丙烯酸甲酯-丁二烯共聚物等。該等可單獨地使用，亦可混合選擇2種以上來使用。Examples of the natural rubber and synthetic rubber include natural rubber-methyl methacrylate copolymer latex, styrene-butadiene copolymer, acrylonitrile-butadiene copolymer, and methyl methacrylate-butadiene copolymer. olefin copolymers, etc. These may be used individually, or 2 or more types may be mixed and used.
作為上述黏著賦予樹脂，可考慮到軟化點、及與各成分之相容性等來進行選擇。例如可例舉：萜烯樹脂、松香樹脂、氫化松香樹脂、苯并呋喃-茚樹脂、苯乙烯系樹脂、脂肪族系石油樹脂、脂環族系石油樹脂、萜烯-酚樹脂、二甲苯系樹脂、其他脂肪族烴樹脂或芳香族烴樹脂等乳液。該等可單獨地使用，亦可混合2種以上來使用。The above-mentioned tackifying resin can be selected taking into consideration the softening point, compatibility with each component, and the like. Examples include: terpene resin, rosin resin, hydrogenated rosin resin, benzofuran-indene resin, styrene-based resin, aliphatic petroleum resin, alicyclic petroleum resin, terpene-phenol resin, xylene-based resin Resin, other aliphatic hydrocarbon resin or aromatic hydrocarbon resin emulsion. These may be used individually or in mixture of 2 or more types.
上述橡膠系黏著劑可自由地選擇溶劑型、乳液型，較佳為VOC(Volatile organic compounds，揮發性有機化合物)之產生量較少之乳液型。The above-mentioned rubber-based adhesive can be freely selected from solvent type or emulsion type, and the emulsion type that produces less VOC (Volatile organic compounds, volatile organic compounds) is preferably used.
＜底塗劑層＞＜Primer layer＞
又，本實施方式之集束保護帶中，視需要亦可於不損害本發明之效果之範圍內，於基材與黏著劑層之間設置底塗劑層，以提高基材與黏著劑層之密接性。 於該情形時，如後所述，底塗劑層之厚度通常為0.1～1 μm，更佳為0.3～0.5 μm，底塗劑層之厚度較佳為小於基材之厚度。 In addition, in the bundled protective tape of this embodiment, if necessary, within the scope that does not impair the effect of the present invention, a primer layer can be provided between the base material and the adhesive layer to improve the bonding between the base material and the adhesive layer. Tightness. In this case, as described later, the thickness of the primer layer is usually 0.1 to 1 μm, more preferably 0.3 to 0.5 μm, and the thickness of the primer layer is preferably smaller than the thickness of the base material.
作為形成上述底塗劑層之底塗劑，較佳為相對於使甲基丙烯酸甲酯與天然橡膠接枝聚合而成之接枝聚合物100質量份而言，包含25～300質量份丙烯腈-丁二烯共聚物之底塗劑。The primer forming the primer layer preferably contains 25 to 300 parts by mass of acrylonitrile based on 100 parts by mass of a graft polymer obtained by graft polymerizing methyl methacrylate and natural rubber. - Primer of butadiene copolymer.
用於上述底塗劑之使甲基丙烯酸甲酯與天然橡膠接枝聚合而成之接枝聚合物較佳為使30～50質量%甲基丙烯酸甲酯與70～50質量%天然橡膠接枝聚合而成者。若接枝聚合物中之甲基丙烯酸甲酯之比率未達30質量%，則存在甲基丙烯酸甲酯與膜基材之密接性變差，導致集束保護帶之層間產生剝離之情況。又，若甲基丙烯酸甲酯之比率多於50質量%，則存在底塗劑本身發生硬化，無法追隨於膜基材之變形，導致集束保護帶之層間產生剝離。The graft polymer used in the primer is preferably a graft polymer of 30 to 50% by mass of methyl methacrylate and 70 to 50% of natural rubber. Those formed by aggregation. If the ratio of methyl methacrylate in the graft polymer is less than 30% by mass, the adhesion between the methyl methacrylate and the film base material may become poor, resulting in peeling between the layers of the bundled protective tape. In addition, if the ratio of methyl methacrylate is more than 50% by mass, the primer itself may harden and be unable to follow the deformation of the film base material, resulting in peeling of the layers of the bundled protective tape.
作為用於上述底塗劑之丙烯腈-丁二烯共聚物，可例舉：中腈型(丙烯腈25～30質量%、丁二烯75～70質量%)、中高腈型(丙烯腈31～35質量%、丁二烯69～65質量%)、高腈型(丙烯腈36～43質量%、丁二烯64～57質量%)等。該等可單獨地使用，亦可併用2種以上。Examples of the acrylonitrile-butadiene copolymer used in the primer include a medium nitrile type (acrylonitrile 25 to 30 mass %, butadiene 75 to 70 mass %), a medium to high nitrile type (acrylonitrile 31 ~35 mass%, butadiene 69-65 mass%), high nitrile type (acrylonitrile 36-43 mass%, butadiene 64-57 mass%), etc. These may be used individually, or 2 or more types may be used together.
＜集束保護帶之製造方法＞ 本實施方式之集束保護帶例如可以如下方式獲得：將底塗劑塗佈於基材之單面，利用乾燥爐充分地去除溶劑後，塗佈黏著劑，與底塗劑同樣地利用乾燥爐充分地去除溶劑，其後塗佈黏著劑，獲得集束保護帶。再者，作為底塗劑之塗佈方式，可例舉：凹版塗佈方式、噴霧塗佈方式、接觸輥塗佈方式、棒式塗佈方式、刮塗方式等，作為黏著劑之塗佈方式，可例舉：缺角輪塗佈方式、模唇式模嘴塗佈方式、凹版塗佈方式、輥塗方式、狹縫式模嘴塗佈方式等。底塗劑層之厚度通常為0.1～1 μm，更佳為0.3～0.5 μm。又，黏著劑層之厚度根據使用目的或用途等而不同，通常為5～50 μm，更佳為10～30 μm。 ＜Manufacturing method of bundled protective tape＞ The bundled protective tape of this embodiment can be obtained, for example, by applying a primer to one side of the base material, using a drying oven to fully remove the solvent, then applying an adhesive, and using a drying oven to fully remove the primer. The solvent is completely removed, and then the adhesive is applied to obtain a bundled protective tape. Furthermore, as the coating method of the primer, examples include: gravure coating method, spray coating method, contact roller coating method, rod coating method, blade coating method, etc., as the coating method of the adhesive agent , examples include: notch wheel coating method, die lip die coating method, gravure coating method, roller coating method, slit die nozzle coating method, etc. The thickness of the primer layer is usually 0.1-1 μm, preferably 0.3-0.5 μm. In addition, the thickness of the adhesive layer varies depending on the purpose of use, application, etc., but is usually 5 to 50 μm, and more preferably 10 to 30 μm.
＜集束保護帶基材背面之動摩擦係數＞ 本發明之另一實施方式中，於經由黏著劑層將集束保護帶固定於測定台之情形時，使用基於ASTM D1894之R接觸件，於負載200 g、試驗速度2.5 mm/sec之條件下測得之集束保護帶基材背面之動摩擦係數較佳為0.13～0.60，進而較佳為0.23～0.58。具體而言，例如，較佳為0.13、0.15、0.20、0.25、0.30、0.35、0.40、0.45、0.50、0.55、或0.60，亦可為此處所例示之任意2個數值之間之範圍內。藉由使集束保護帶基材背面之動摩擦係數為0.13以上，從而提高集束保護帶之柔軟性，例如提高將其捲繞於電線等時之追隨性，由此可減少集束保護帶產生浮起。藉由使集束保護帶基材背面之動摩擦係數為0.60以下，從而提高集束保護帶之耐磨性，能夠獲得良好之保護性能。 再者，所謂集束保護帶基材背面，係指集束保護帶之基材中之與形成有黏著劑層之表面相反一側之表面。 ＜Coefficient of dynamic friction on the back side of the base material of the bundled protective tape＞ In another embodiment of the present invention, when the bundled protective tape is fixed to the measurement platform through the adhesive layer, an R contact based on ASTM D1894 is used, and the measurement is performed under the conditions of a load of 200 g and a test speed of 2.5 mm/sec. The dynamic friction coefficient of the back side of the base material of the bundled protective tape is preferably 0.13 to 0.60, and more preferably 0.23 to 0.58. Specifically, for example, 0.13, 0.15, 0.20, 0.25, 0.30, 0.35, 0.40, 0.45, 0.50, 0.55, or 0.60 is preferred, and it may be within the range between any two numerical values illustrated here. By making the dynamic friction coefficient of the backside of the base material of the bundled protective tape be 0.13 or more, the flexibility of the bundled protective tape can be improved, for example, the followability of the bundled protective tape when being wound around wires, etc. can be reduced, thereby reducing the floating of the bundled protective tape. By making the dynamic friction coefficient of the backside of the base material of the bundled protective tape less than 0.60, the wear resistance of the bundled protective tape is improved and good protective performance can be obtained. Furthermore, the back side of the base material of the bundled protective tape refers to the surface of the base material of the bundled protective tape on the opposite side to the surface on which the adhesive layer is formed.
關於集束保護帶基材背面之動摩擦係數，例如當使基材之厚度同等時，若基材表面之動摩擦係數上升，則集束保護帶之基材背面之動摩擦係數亦存在上升之傾向，因此藉由將基材表面之動摩擦係數調整為上述範圍內，可控制集束保護帶基材背面之動摩擦係數。於對基材設置黏著劑層而製成集束保護帶之情形時，集束保護帶之基材背面之動摩擦係數之值存在大於基材表面之動摩擦係數之值之傾向，但根據上述關係，可藉由將基材表面之動摩擦係數調整為規定範圍內，從而控制集束保護帶之基材背面之動摩擦係數處於所需範圍內。又，若基材之厚度變大，則存在使設置黏著劑層引起之對集束保護帶之基材背面之動摩擦係數之變化所產生之影響變小之傾向，因此基材之厚度較大時，仍然可藉由將基材表面之動摩擦係數調整為上述範圍內，從而控制集束保護帶基材背面之動摩擦係數。Regarding the kinetic friction coefficient of the back surface of the base material of the bundled protective tape, for example, when the thickness of the base material is made equal, if the kinetic friction coefficient of the base material surface increases, the kinetic friction coefficient of the back surface of the base material of the bundled protective tape will also tend to increase. Therefore, by By adjusting the dynamic friction coefficient on the surface of the base material to within the above range, the dynamic friction coefficient on the back side of the base material of the bundled protective tape can be controlled. When an adhesive layer is provided on a base material to form a bundled protective tape, the value of the kinetic friction coefficient on the back side of the base material of the bundled protective tape tends to be greater than the value of the kinetic friction coefficient on the surface of the base material. However, based on the above relationship, it can be used By adjusting the dynamic friction coefficient on the surface of the base material to within a specified range, the dynamic friction coefficient on the back side of the base material of the bundled protective tape is controlled to be within the required range. In addition, as the thickness of the base material becomes larger, the influence of the provision of the adhesive layer on the change in the dynamic friction coefficient of the backside of the base material of the bundled protective tape tends to become smaller. Therefore, when the thickness of the base material becomes larger, The dynamic friction coefficient on the back side of the base material of the bundled protective tape can still be controlled by adjusting the dynamic friction coefficient on the surface of the base material to within the above range.
＜集束保護帶基材背面之動摩擦係數之測定＞ 本實施方式之集束保護帶中之集束保護帶基材背面動摩擦係數例如可使用協和界面科學公司製造之自動摩擦磨耗解析裝置TS-501，根據以下之程序進行測定。 將集束保護帶樣品切割為寬度50 mm×長度100 mm，經由集束保護帶樣品之黏著劑層將其固定於試樣台。 將基於ASTM D1894之R接觸件放置於所貼合之集束保護帶樣品背面，於負載200 g、試驗速度2.5 mm/sec之條件下測定動摩擦係數(室溫23℃、濕度50%RH)。 ＜Measurement of the dynamic friction coefficient on the back side of the base material of the bundled protective tape＞ The dynamic friction coefficient of the backside of the bundled protective tape base material in the bundled protective tape of this embodiment can be measured according to the following procedure using, for example, the automatic friction and wear analysis device TS-501 manufactured by Kyowa Interface Science Co., Ltd. Cut the bundled protective tape sample into a width of 50 mm and a length of 100 mm, and fix it to the sample stage through the adhesive layer of the bundled protective tape sample. The R contact based on ASTM D1894 was placed on the back of the bonded protective tape sample, and the dynamic friction coefficient was measured under the conditions of load 200 g and test speed 2.5 mm/sec (room temperature 23°C, humidity 50%RH).
＜集束保護帶之用途＞ 本實施方式之集束保護帶例如較好地用作電動汽車或混合動力汽車之高壓電纜或線束之集束用集束保護帶。 [實施例] ＜Uses of bundled protective tape＞ The bundled protective tape of this embodiment is preferably used as a bundled protective tape for bundling high-voltage cables or wire harnesses of electric vehicles or hybrid vehicles, for example. [Example]
以下，舉出實施例，對本發明進而詳細地進行說明。又，該等實施例均為例示者，而非限定本發明之內容。Hereinafter, an Example is given and this invention is demonstrated in detail. In addition, these embodiments are illustrative and do not limit the content of the present invention.
＜基材之製作＞ ＜使用材料＞ (1)聚氯乙烯樹脂 氯乙烯之均聚物、平均聚合度1000：製品名「TH-1000」、大洋聚氯乙烯(Taiyo Vinyl)(股)製造 (2)聚有機矽氧烷 使甲基丙烯酸甲酯共聚於側鏈而成之丙烯酸改性聚有機矽氧烷(重量平均分子量40萬)：製品名「Chaline R-170S」、日信化學工業(股)製造 使甲基丙烯酸甲酯共聚於側鏈而成之丙烯酸改性聚有機矽氧烷(重量平均分子量20萬)：製品名「Chaline R-175S」、日信化學工業(股)製造 直鏈狀聚二甲基矽氧烷：製品名「GENIOPLAST GUM」、旭化成瓦克矽酮(股)製造 聚二甲基矽氧烷之交聯物(直鏈狀聚有機矽氧烷交聯而成之聚有機矽氧烷)：製品名「KMP-597」、信越化學工業(股)製造 (3)塑化劑 鄰苯二甲酸酯系塑化劑、鄰苯二甲酸二異壬酯：製品名「DINP」、J-PLUS(股)製造 (4)填充劑 碳酸鈣：製品名「Calcies(註冊商標)P」、神島化學工業(股)製造 ＜Preparation of base material＞ ＜Materials used＞ (1) Polyvinyl chloride resin Homopolymer of vinyl chloride, average degree of polymerization 1000: Product name "TH-1000", manufactured by Taiyo Vinyl Co., Ltd. (2)Polyorganosiloxane Acrylic modified polyorganosiloxane (weight average molecular weight 400,000) made by copolymerizing methyl methacrylate with side chains: Product name "Chaline R-170S", manufactured by Nissin Chemical Industry Co., Ltd. Acrylic modified polyorganosiloxane (weight average molecular weight 200,000) made by copolymerizing methyl methacrylate with side chains: Product name "Chaline R-175S", manufactured by Nissin Chemical Industry Co., Ltd. Linear polydimethylsiloxane: Product name "GENIOPLAST GUM", manufactured by Asahi Kasei Wacker Silicones Co., Ltd. Cross-linked product of polydimethylsiloxane (polyorganosiloxane cross-linked with linear polyorganosiloxane): Product name "KMP-597", manufactured by Shin-Etsu Chemical Industry Co., Ltd. (3)Plasticizer Phthalate plasticizer, diisononyl phthalate: Product name "DINP", manufactured by J-PLUS Co., Ltd. (4) Filler Calcium carbonate: Product name "Calcies (registered trademark) P", manufactured by Kamijima Chemical Industry Co., Ltd.
使聚氯乙烯樹脂、聚有機矽氧烷、塑化劑、及填充劑以表1及表2所示之組成利用班布里混合機以均勻分散之方式熔融混練後，利用壓延成形機，於輥溫度165℃下製作規定厚度之基材。After the polyvinyl chloride resin, polyorganosiloxane, plasticizer, and filler have the composition shown in Table 1 and Table 2, they are melted and kneaded in a uniformly dispersed manner using a Banbury mixer, and then the calendering machine is used. The roller temperature is 165°C to produce a substrate with a specified thickness.
＜集束保護帶之製作＞ ＜使用材料＞ (1)基材 上述步驟中所製得之基材 (2)底塗層 使甲基丙烯酸甲酯與天然橡膠接枝聚合而成之接枝聚合物乳膠與丙烯腈-丁二烯共聚物乳液之混合物乳液：製品名「KT4612A」、E-TEC股份有限公司製造 (3)黏著劑層 使天然橡膠乳膠(REGITEX股份有限公司製造、製品名：HA LATEX)60質量份(固形物成分)、甲基丙烯酸甲酯與天然橡膠接枝聚合而成之接枝聚合物乳膠(REGITEX股份有限公司製造、製品名：MG-40S)40質量份(固形物成分)、及石油樹脂系乳液型黏著賦予劑(荒川化學工業股份有限公司製造、製品名：AP-1100-NT)135質量份(固形物成分)混合而成者。 ＜Preparation of bundled protective tape＞ ＜Materials used＞ (1)Substrate The base material prepared in the above steps (2) Primer coating Mixture emulsion of graft polymer latex obtained by graft polymerizing methyl methacrylate and natural rubber and acrylonitrile-butadiene copolymer emulsion: Product name "KT4612A", manufactured by E-TEC Co., Ltd. (3)Adhesive layer Graft polymer latex (REGITEX Co., Ltd.) obtained by graft-polymerizing 60 parts by mass (solid content) of natural rubber latex (manufactured by REGITEX Co., Ltd., product name: HA LATEX), methyl methacrylate, and natural rubber Manufactured, product name: MG-40S) 40 parts by mass (solid content), and petroleum resin emulsion type adhesive imparting agent (manufactured by Arakawa Chemical Industry Co., Ltd., product name: AP-1100-NT) 135 parts by mass (solid content) ingredients) mixed together.
將底塗劑藉由凹版塗佈方式塗佈於基材之單面，利用乾燥爐充分地去除溶劑後，將黏著劑藉由缺角輪塗佈方式進行塗佈，與底塗劑同樣地利用乾燥爐充分地去除溶劑，製得集束保護帶。底塗劑層之乾燥後之厚度為0.3 μm，黏著劑層之乾燥後之厚度為20 μm。Coat the primer on one side of the substrate by gravure coating, use a drying oven to fully remove the solvent, then apply the adhesive by notch wheel coating, and use it in the same way as the primer The drying oven fully removes the solvent to produce a bundled protective tape. The dry thickness of the primer layer is 0.3 μm, and the dry thickness of the adhesive layer is 20 μm.
＜基材及集束保護帶之物性＞ 根據以下所示之測定條件，對基材及集束保護帶實施物性之測定及評價。將結果示於表1及表2中。再者，表中，PVC係指聚氯乙烯樹脂，DINP係指鄰苯二甲酸二異壬酯，MMA係指甲基丙烯酸甲酯，PDMS係指聚二甲基矽氧烷。 ＜Physical properties of base material and bundled protective tape＞ Based on the measurement conditions shown below, the physical properties of the base material and the bundled protective tape were measured and evaluated. The results are shown in Table 1 and Table 2. Furthermore, in the table, PVC refers to polyvinyl chloride resin, DINP refers to diisononyl phthalate, MMA refers to methyl methacrylate, and PDMS refers to polydimethylsiloxane.
＜基材表面之動摩擦係數＞ 使用協和界面科學公司製造之自動摩擦磨耗解析裝置TS-501，根據以下之程序進行測定。 將基材樣品切割為寬度50 mm×長度100 mm，使用雙面膠帶(日東電工公司製造之No.5000NS)將其固定於試樣台。 將基於ASTM D1894之R接觸件放置於所貼合之基材樣品背面，於負載200 g、試驗速度2.5 mm/sec之條件下測定動摩擦係數(室溫23℃、濕度50%RH)。 ＜Dynamic friction coefficient of base material surface＞ The automatic friction and wear analysis device TS-501 manufactured by Kyowa Interface Science Co., Ltd. was used to perform the measurement according to the following procedure. The base material sample was cut into a width of 50 mm × a length of 100 mm, and was fixed to the sample stage using double-sided tape (No. 5000NS manufactured by Nitto Denko Co., Ltd.). The R contact based on ASTM D1894 was placed on the back of the bonded substrate sample, and the dynamic friction coefficient was measured under the conditions of load 200 g and test speed 2.5 mm/sec (room temperature 23°C, humidity 50%RH).
＜集束保護帶之基材背面之動摩擦係數＞ 使用協和界面科學公司製造之自動摩擦磨耗解析裝置TS-501，根據以下之程序進行測定。 將集束保護帶樣品切割為寬度50 mm×長度100 mm，經由黏著劑層將其貼附並固定於試樣台。 將基於ASTM D1894之R接觸件放置於所貼合之集束保護帶樣品背面，於負載200 g、試驗速度2.5 mm/sec之條件下測定動摩擦係數(室溫23℃、濕度50%RH)。 ＜Coefficient of dynamic friction on the back side of the base material of the bundled protective tape＞ The automatic friction and wear analysis device TS-501 manufactured by Kyowa Interface Science Co., Ltd. was used to perform the measurement according to the following procedure. Cut the bundled protective tape sample into a width of 50 mm and a length of 100 mm, and attach and fix it to the sample stage through the adhesive layer. The R contact based on ASTM D1894 was placed on the back of the bonded protective tape sample, and the dynamic friction coefficient was measured under the conditions of load 200 g and test speed 2.5 mm/sec (room temperature 23°C, humidity 50%RH).
＜拉伸彈性模數/厚度換算之拉伸彈性模數＞ 利用拉伸試驗機之夾頭部，以夾頭間距離為100 mm之方式夾住寬度19 mm、長度200 mm之集束帶試片使其固定。於室溫23℃、相對濕度50%RH之環境下，以300 mm/min之速度拉伸試片，測定拉伸應力與應變。根據線性回歸，算出在應變為0.01～0.05%之間之拉伸應力與應變之比，將所得之值作為拉伸彈性模數。 又，將拉伸彈性模數與集束帶之總厚度(單位：mm)之乘積作為厚度換算之拉伸彈性模數。 ＜Tensile elastic modulus/thickness conversion to tensile elastic modulus＞ Use the chuck of the tensile testing machine to clamp the bundled tape test piece with a width of 19 mm and a length of 200 mm so that the distance between the chucks is 100 mm to fix it. At room temperature of 23°C and relative humidity of 50% RH, the specimen was stretched at a speed of 300 mm/min to measure the tensile stress and strain. Based on linear regression, the ratio of tensile stress to strain was calculated when the strain was between 0.01 and 0.05%, and the obtained value was used as the tensile elastic modulus. In addition, the product of the tensile elastic modulus and the total thickness of the gathering belt (unit: mm) is used as the thickness-converted tensile elastic modulus.
＜硬度＞ 使用高分子計器公司製造之ASKER橡膠硬度計A型(基於ASTM D2240之A型壓頭)，對堆疊成厚度6 mm以上之基材樣品測定硬度計A硬度(室溫23℃、濕度50%RH)。 ＜Hardness＞ Use the ASKER rubber durometer type A (based on the A-type indenter of ASTM D2240) manufactured by Polymer Instruments Co., Ltd. to measure the durometer A hardness (room temperature 23°C, humidity 50% RH) on base material samples stacked to a thickness of 6 mm or more. ).
＜保護性能＞ 根據以下之程序，依據耐磨性對保護性能進行評價。 依據ISO6722-1(2001)來實施。將基材樣品於直徑10 mm之圓筒上捲繞2周並利用膠帶等加以固定。利用硬質材為熔融氧化鋁且粒度150 μm之紙銼，以速度1500 mm/min自樣品之上對樣品表面進行磨耗。測定直至樣品上開孔為止之磨耗距離(mm)(室溫23℃、濕度50%RH)。關於直至樣品上開孔為止之磨耗距離(mm)，根據以下之判斷基準進行評價。若基材之磨耗距離之評價優異，則耐磨性較高，因此能預測到使用該基材所製造之集束保護帶能夠達成優異之保護性能。 ◎：磨耗距離為1000 mm以上 ○：磨耗距離為800 mm以上且未達1000 mm ×：磨耗距離未達800 mm ＜Protection performance＞ The protective performance was evaluated based on wear resistance according to the following procedure. Implemented in accordance with ISO6722-1(2001). The base material sample is wound around a cylinder with a diameter of 10 mm for 2 times and fixed with tape. Use a paper file whose hard material is fused alumina and has a particle size of 150 μm to abrade the sample surface at a speed of 1500 mm/min. Measure the wear distance (mm) until the hole is opened on the sample (room temperature 23°C, humidity 50%RH). The abrasion distance (mm) until the hole is opened in the sample is evaluated based on the following criteria. If the evaluation of the wear distance of the base material is excellent, the wear resistance is high, so it can be predicted that the bundled protective tape manufactured using the base material can achieve excellent protective performance. ◎: Wear distance is more than 1000 mm ○: The wear distance is more than 800 mm and less than 1000 mm ×: The wear distance does not reach 800 mm
＜柔軟性＞ 根據以下之程序，依據電線集束時有無浮起來對柔軟性進行評價。 將集束保護帶樣品於直徑15 mm、及10 mm之電線束上螺旋狀地捲繞2周(半疊繞(half lap))而集束。當將該集束電線於直徑50 mm之心軸捲繞1周時，確認集束保護帶樣品與電線束之間有無浮起(因剝離所產生之間隙)。關於集束保護帶樣品與電線束之間之浮起，根據以下之判斷基準進行評價。 ◎：電線直徑15 mm及10 mm之電線束上均無浮起 ○：電線直徑15 mm之電線束上無浮起，電線直徑10 mm之電線束上有浮起 ×：電線直徑15 mm及10 mm之電線束上均有浮起 ＜Softness＞ According to the following procedure, the flexibility is evaluated based on whether the wires float when bundled. The bundled protective tape samples were spirally wound 2 times (half lap) around wire bundles with diameters of 15 mm and 10 mm, and bundled. When the bundled wires are wound around a mandrel with a diameter of 50 mm, check whether there is any floating (gap due to peeling) between the bundled protective tape sample and the wire bundle. The lift between the bundled protective tape sample and the wire bundle will be evaluated based on the following criteria. ◎: There is no floating on the wire bundle with wire diameters of 15 mm and 10 mm. ○: There is no floating on the wire bundle with a wire diameter of 15 mm, and there is floating on the wire bundle with a wire diameter of 10 mm. ×: There are floating marks on wire bundles with wire diameters of 15 mm and 10 mm.
＜基材之製膜性＞ 根據以下之程序及評價基準對基材之製膜性進行評價。 當利用壓延成形機對基材進行製膜時，對表面上有無聚有機矽氧烷之機面析出、及基材膜對橡膠輥表面有無黏著進行觀察。 ◎：機面析出及基材膜之黏著均未發生 ○：略微發生了機面析出及基材膜之黏著，但為對製造而言不造成問題之程度 ×：發生了機面析出及基材膜之黏著 ＜Film-forming property of base material＞ The film-forming property of the base material was evaluated according to the following procedures and evaluation criteria. When using a calendering machine to form a film on the base material, observe whether there is precipitation of polyorganosiloxane on the surface and whether the base film adheres to the surface of the rubber roller. ◎: Neither precipitation on the machine surface nor adhesion of the substrate film occurred. ○: Slight precipitation on the machine surface and adhesion of the base film occurred, but to an extent that does not cause problems in manufacturing. ×: Sedimentation on the machine surface and adhesion of the substrate film occurred.
[表1]
[表2]
根據表1及表2之結果，可知使用實施例之基材之集束保護帶、及實施例之集束保護帶之柔軟性與保護性能之平衡性優異。進而，發現了實施例之基材之製膜性優異。另一方面，關於使用比較例之基材之集束保護帶、及比較例之集束保護帶，可知其基於柔軟性與保護性能之平衡性、及基材之製膜性之一個以上觀點而言較差。 [產業上之可利用性] From the results of Table 1 and Table 2, it can be seen that the bundled protective tape using the base material of the Example and the bundled protective tape of the Example have an excellent balance between flexibility and protective performance. Furthermore, it was found that the base material of the Example was excellent in film forming properties. On the other hand, it was found that the bundled protective tape using the base material of the comparative example and the bundled protective tape of the comparative example were inferior from one or more viewpoints, including the balance between flexibility and protective performance, and the film-forming properties of the base material. . [Industrial availability]
本發明之集束保護帶之柔軟性與保護性能之平衡性優異，進而基材之製膜性優異。本發明之集束保護帶可較好地用於電動汽車、混合動力汽車之高壓電纜或汽車之線束等之集束及保護用途，具有產業上之可利用性。The bundled protective tape of the present invention has an excellent balance between flexibility and protective performance, and furthermore has excellent film forming properties of the base material. The bundled protective tape of the present invention can be preferably used for bundling and protecting high-voltage cables of electric vehicles, hybrid vehicles, or wiring harnesses of automobiles, and has industrial applicability.
Claims (9)
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| JP2022-087867 | 2022-05-30 | ||
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| JPH08291243A (en) * | 1995-04-21 | 1996-11-05 | Zeon Kasei Co Ltd | Vinyl chloride resin composition for powder molding and laminate using the same |
| US6087430A (en) * | 1996-10-09 | 2000-07-11 | Res Development Corporation | Thermoplastic polymers with dispersed fluorocarbon additives |
| JP3888431B2 (en) * | 2001-11-28 | 2007-03-07 | 住友電装株式会社 | Wire harness protective material and wire harness using the same |
| WO2021029403A1 (en) * | 2019-08-15 | 2021-02-18 | デンカ株式会社 | Adhesive tape |
| CN111748162B (en) * | 2020-06-30 | 2022-06-03 | 江门市支点光电科技有限公司 | Heat-conducting PVC composition and preparation method thereof |
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