TW202346490A - Adhesive tape and method for producing same - Google Patents
Adhesive tape and method for producing same Download PDFInfo
- Publication number
- TW202346490A TW202346490A TW112114155A TW112114155A TW202346490A TW 202346490 A TW202346490 A TW 202346490A TW 112114155 A TW112114155 A TW 112114155A TW 112114155 A TW112114155 A TW 112114155A TW 202346490 A TW202346490 A TW 202346490A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive tape
- mass
- adhesive layer
- adhesive
- base material
- Prior art date
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 139
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 90
- 239000000853 adhesive Substances 0.000 claims abstract description 85
- 230000001070 adhesive effect Effects 0.000 claims abstract description 84
- 238000003860 storage Methods 0.000 claims abstract description 66
- 229920005989 resin Polymers 0.000 claims abstract description 52
- 239000011347 resin Substances 0.000 claims abstract description 52
- 229920000915 polyvinyl chloride Polymers 0.000 claims abstract description 46
- 239000004800 polyvinyl chloride Substances 0.000 claims abstract description 46
- 239000012790 adhesive layer Substances 0.000 claims description 170
- 229920001971 elastomer Polymers 0.000 claims description 85
- 239000005060 rubber Substances 0.000 claims description 84
- 239000004014 plasticizer Substances 0.000 claims description 78
- 239000000203 mixture Substances 0.000 claims description 47
- 244000043261 Hevea brasiliensis Species 0.000 claims description 39
- 229920003052 natural elastomer Polymers 0.000 claims description 39
- 229920001194 natural rubber Polymers 0.000 claims description 39
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 31
- 150000002148 esters Chemical class 0.000 claims description 27
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 24
- 229920000578 graft copolymer Polymers 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 21
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 19
- 239000011256 inorganic filler Substances 0.000 claims description 19
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 19
- 229920000728 polyester Polymers 0.000 claims description 17
- 239000006084 composite stabilizer Substances 0.000 claims description 13
- 239000003208 petroleum Substances 0.000 claims description 13
- 239000001361 adipic acid Substances 0.000 claims description 12
- 235000011037 adipic acid Nutrition 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 11
- 239000004816 latex Substances 0.000 claims description 10
- 238000006116 polymerization reaction Methods 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 9
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 229910052623 talc Inorganic materials 0.000 claims description 9
- 229920000126 latex Polymers 0.000 claims description 8
- 239000000454 talc Substances 0.000 claims description 8
- 239000010445 mica Substances 0.000 claims description 7
- 229910052618 mica group Inorganic materials 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 6
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 claims description 6
- 229910001701 hydrotalcite Inorganic materials 0.000 claims description 6
- 229960001545 hydrotalcite Drugs 0.000 claims description 6
- 125000005591 trimellitate group Chemical group 0.000 claims description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 4
- 239000001095 magnesium carbonate Substances 0.000 claims description 4
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims description 4
- 239000008029 phthalate plasticizer Substances 0.000 claims 1
- 230000007774 longterm Effects 0.000 abstract description 16
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 27
- 238000011156 evaluation Methods 0.000 description 23
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 16
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 16
- 239000010410 layer Substances 0.000 description 16
- 239000011342 resin composition Substances 0.000 description 16
- 239000000654 additive Substances 0.000 description 15
- 238000005259 measurement Methods 0.000 description 14
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 13
- 239000004615 ingredient Substances 0.000 description 13
- 239000000314 lubricant Substances 0.000 description 11
- 239000002245 particle Substances 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- 235000014113 dietary fatty acids Nutrition 0.000 description 10
- 230000000694 effects Effects 0.000 description 10
- 239000000194 fatty acid Substances 0.000 description 10
- 229930195729 fatty acid Natural products 0.000 description 10
- 239000003963 antioxidant agent Substances 0.000 description 9
- 235000007586 terpenes Nutrition 0.000 description 9
- 150000004665 fatty acids Chemical class 0.000 description 8
- 238000000691 measurement method Methods 0.000 description 8
- -1 terpenes Terpene Chemical class 0.000 description 8
- JNXDCMUUZNIWPQ-UHFFFAOYSA-N trioctyl benzene-1,2,4-tricarboxylate Chemical compound CCCCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCCC)C(C(=O)OCCCCCCCC)=C1 JNXDCMUUZNIWPQ-UHFFFAOYSA-N 0.000 description 8
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 239000004094 surface-active agent Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- JQCXWCOOWVGKMT-UHFFFAOYSA-N diheptyl phthalate Chemical compound CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 description 6
- 239000000839 emulsion Substances 0.000 description 6
- 238000007127 saponification reaction Methods 0.000 description 6
- 239000003381 stabilizer Substances 0.000 description 6
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 5
- 235000021355 Stearic acid Nutrition 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 5
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 5
- 239000008117 stearic acid Substances 0.000 description 5
- 150000003505 terpenes Chemical class 0.000 description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 4
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 4
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Chemical compound CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 4
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- 230000001186 cumulative effect Effects 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000006386 neutralization reaction Methods 0.000 description 4
- 238000004448 titration Methods 0.000 description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- GPZYYYGYCRFPBU-UHFFFAOYSA-N 6-Hydroxyflavone Chemical compound C=1C(=O)C2=CC(O)=CC=C2OC=1C1=CC=CC=C1 GPZYYYGYCRFPBU-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000003490 calendering Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229920006132 styrene block copolymer Polymers 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 2
- DECACTMEFWAFRE-UHFFFAOYSA-N 6-o-benzyl 1-o-octyl hexanedioate Chemical compound CCCCCCCCOC(=O)CCCCC(=O)OCC1=CC=CC=C1 DECACTMEFWAFRE-UHFFFAOYSA-N 0.000 description 2
- 239000004114 Ammonium polyphosphate Substances 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229920002367 Polyisobutene Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 2
- 229920001276 ammonium polyphosphate Polymers 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
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- AGXUVMPSUKZYDT-UHFFFAOYSA-L barium(2+);octadecanoate Chemical compound [Ba+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O AGXUVMPSUKZYDT-UHFFFAOYSA-L 0.000 description 2
- 239000000440 bentonite Substances 0.000 description 2
- 229910000278 bentonite Inorganic materials 0.000 description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 2
- SAOKZLXYCUGLFA-UHFFFAOYSA-N bis(2-ethylhexyl) adipate Chemical compound CCCCC(CC)COC(=O)CCCCC(=O)OCC(CC)CCCC SAOKZLXYCUGLFA-UHFFFAOYSA-N 0.000 description 2
- WXZOXVVKILCOPG-UHFFFAOYSA-N bis(2-ethylhexyl) benzene-1,3-dicarboxylate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC(C(=O)OCC(CC)CCCC)=C1 WXZOXVVKILCOPG-UHFFFAOYSA-N 0.000 description 2
- ZDWGXBPVPXVXMQ-UHFFFAOYSA-N bis(2-ethylhexyl) nonanedioate Chemical compound CCCCC(CC)COC(=O)CCCCCCCC(=O)OCC(CC)CCCC ZDWGXBPVPXVXMQ-UHFFFAOYSA-N 0.000 description 2
- RNSLCHIAOHUARI-UHFFFAOYSA-N butane-1,4-diol;hexanedioic acid Chemical compound OCCCCO.OC(=O)CCCCC(O)=O RNSLCHIAOHUARI-UHFFFAOYSA-N 0.000 description 2
- 229920005549 butyl rubber Polymers 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 2
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- 235000013539 calcium stearate Nutrition 0.000 description 2
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- 229910052799 carbon Inorganic materials 0.000 description 2
- VJHINFRRDQUWOJ-UHFFFAOYSA-N dioctyl sebacate Chemical compound CCCCC(CC)COC(=O)CCCCCCCCC(=O)OCC(CC)CCCC VJHINFRRDQUWOJ-UHFFFAOYSA-N 0.000 description 2
- 239000002612 dispersion medium Substances 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
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- 238000004898 kneading Methods 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
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- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical class [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229940063655 aluminum stearate Drugs 0.000 description 1
- ARCGXLSVLAOJQL-UHFFFAOYSA-N anhydrous trimellitic acid Natural products OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- QBLDFAIABQKINO-UHFFFAOYSA-N barium borate Chemical compound [Ba+2].[O-]B=O.[O-]B=O QBLDFAIABQKINO-UHFFFAOYSA-N 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- RAKMKCZMVZBODU-PIQLPZBWSA-L barium(2+);(z)-12-hydroxyoctadec-9-enoate Chemical compound [Ba+2].CCCCCCC(O)C\C=C/CCCCCCCC([O-])=O.CCCCCCC(O)C\C=C/CCCCCCCC([O-])=O RAKMKCZMVZBODU-PIQLPZBWSA-L 0.000 description 1
- YKGYQYOQRGPFTO-UHFFFAOYSA-N bis(8-methylnonyl) hexanedioate Chemical compound CC(C)CCCCCCCOC(=O)CCCCC(=O)OCCCCCCCC(C)C YKGYQYOQRGPFTO-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- HIAAVKYLDRCDFQ-UHFFFAOYSA-L calcium;dodecanoate Chemical compound [Ca+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O HIAAVKYLDRCDFQ-UHFFFAOYSA-L 0.000 description 1
- CEDDGDWODCGBFQ-UHFFFAOYSA-N carbamimidoylazanium;hydron;phosphate Chemical compound NC(N)=N.OP(O)(O)=O CEDDGDWODCGBFQ-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- KRGNPJFAKZHQPS-UHFFFAOYSA-N chloroethene;ethene Chemical group C=C.ClC=C KRGNPJFAKZHQPS-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910001648 diaspore Inorganic materials 0.000 description 1
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 1
- HCIBTBXNLVOFER-UHFFFAOYSA-N diphenylcyclopropenone Chemical compound O=C1C(C=2C=CC=CC=2)=C1C1=CC=CC=C1 HCIBTBXNLVOFER-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- UAUDZVJPLUQNMU-KTKRTIGZSA-N erucamide Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-KTKRTIGZSA-N 0.000 description 1
- BXOUVIIITJXIKB-UHFFFAOYSA-N ethene;styrene Chemical group C=C.C=CC1=CC=CC=C1 BXOUVIIITJXIKB-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 229940075507 glyceryl monostearate Drugs 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- 239000001788 mono and diglycerides of fatty acids Substances 0.000 description 1
- TXSUIVPRHHQNTM-UHFFFAOYSA-N n'-(3-methylanilino)-n-phenyliminobenzenecarboximidamide Chemical compound CC1=CC=CC(NN=C(N=NC=2C=CC=CC=2)C=2C=CC=CC=2)=C1 TXSUIVPRHHQNTM-UHFFFAOYSA-N 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- FATBGEAMYMYZAF-UHFFFAOYSA-N oleicacidamide-heptaglycolether Natural products CCCCCCCCC=CCCCCCCCC(N)=O FATBGEAMYMYZAF-UHFFFAOYSA-N 0.000 description 1
- 235000014366 other mixer Nutrition 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- GULAEPPQYOTQDE-UHFFFAOYSA-N phthalic acid;propane-1,2-diol Chemical compound CC(O)CO.OC(=O)C1=CC=CC=C1C(O)=O GULAEPPQYOTQDE-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920005671 poly(vinyl chloride-propylene) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- WBHHMMIMDMUBKC-XLNAKTSKSA-N ricinelaidic acid Chemical compound CCCCCC[C@@H](O)C\C=C\CCCCCCCC(O)=O WBHHMMIMDMUBKC-XLNAKTSKSA-N 0.000 description 1
- 229960003656 ricinoleic acid Drugs 0.000 description 1
- FEUQNCSVHBHROZ-UHFFFAOYSA-N ricinoleic acid Natural products CCCCCCC(O[Si](C)(C)C)CC=CCCCCCCCC(=O)OC FEUQNCSVHBHROZ-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229940045870 sodium palmitate Drugs 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- GGXKEBACDBNFAF-UHFFFAOYSA-M sodium;hexadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCC([O-])=O GGXKEBACDBNFAF-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 239000004334 sorbic acid Substances 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 229940037312 stearamide Drugs 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- YPDXSCXISVYHOB-UHFFFAOYSA-N tris(7-methyloctyl) benzene-1,2,4-tricarboxylate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCC(C)C)C(C(=O)OCCCCCCC(C)C)=C1 YPDXSCXISVYHOB-UHFFFAOYSA-N 0.000 description 1
- FJFYFBRNDHRTHL-UHFFFAOYSA-N tris(8-methylnonyl) benzene-1,2,4-tricarboxylate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCCC(C)C)C(C(=O)OCCCCCCCC(C)C)=C1 FJFYFBRNDHRTHL-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229940098697 zinc laurate Drugs 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- GAWWVVGZMLGEIW-GNNYBVKZSA-L zinc ricinoleate Chemical compound [Zn+2].CCCCCC[C@@H](O)C\C=C/CCCCCCCC([O-])=O.CCCCCC[C@@H](O)C\C=C/CCCCCCCC([O-])=O GAWWVVGZMLGEIW-GNNYBVKZSA-L 0.000 description 1
- 229940100530 zinc ricinoleate Drugs 0.000 description 1
- 229940057977 zinc stearate Drugs 0.000 description 1
- GPYYEEJOMCKTPR-UHFFFAOYSA-L zinc;dodecanoate Chemical compound [Zn+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O GPYYEEJOMCKTPR-UHFFFAOYSA-L 0.000 description 1
- PZRXQXJGIQEYOG-UHFFFAOYSA-N zinc;oxido(oxo)borane Chemical compound [Zn+2].[O-]B=O.[O-]B=O PZRXQXJGIQEYOG-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J107/00—Adhesives based on natural rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
- C09J109/06—Copolymers with styrene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
- C09J125/02—Homopolymers or copolymers of hydrocarbons
- C09J125/04—Homopolymers or copolymers of styrene
- C09J125/08—Copolymers of styrene
- C09J125/10—Copolymers of styrene with conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/06—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
本發明，係關於黏著帶及其製造方法。The present invention relates to adhesive tape and its manufacturing method.
就在汽車、鐵路、飛機、船舶、房屋、工廠等中，用以將各種電氣設備的配線捆束之黏著帶而言，考量具有適度的柔軟性與伸長性，阻燃性、機械強度、耐熱變形性、電絕緣性、及成形加工性等各種物性優異，而且價格較為便宜，係使用在將含有聚氯乙烯樹脂之樹脂組成物作為原料之基材的單面上塗布了黏著劑之聚氯乙烯樹脂系黏著帶(例如，專利文獻1、2等)。 〔先前技術文獻〕 〔專利文獻〕 For adhesive tapes used to bundle wiring of various electrical equipment in automobiles, railways, airplanes, ships, houses, factories, etc., they are considered to have moderate flexibility and stretchability, flame retardancy, mechanical strength, and heat resistance. It is excellent in various physical properties such as deformability, electrical insulation, and molding processability, and is relatively cheap. It uses a base material made of a resin composition containing polyvinyl chloride resin as a raw material and has an adhesive coated on one side of the base material. Vinyl resin adhesive tape (for example, Patent Documents 1 and 2, etc.). [Prior Technical Document] 〔Patent documents〕
專利文獻1：日本特開平11-209718 專利文獻2：國際公開第2020/026697號 Patent Document 1: Japanese Patent Application Publication No. 11-209718 Patent Document 2: International Publication No. 2020/026697
〔發明所欲解決之課題〕[Problem to be solved by the invention]
對於上述聚氯乙烯樹脂系黏著帶，要求用以將電線、纜線等對象物捆束之高黏著力。另一方面，提升了黏著力之黏著帶，在長時間保存時有在膠帶側面產生黏性的問題。 〔解決課題之方式〕 The above-mentioned polyvinyl chloride resin adhesive tape is required to have high adhesion for binding objects such as wires and cables. On the other hand, adhesive tapes with improved adhesion have the problem of developing stickiness on the sides of the tape when stored for a long time. [Methods to solve problems]
本發明係鑑於上述情況所完成者，目的在於提供即使長時間保存，膠帶側面的黏性仍少，且具有用以將電線、纜線等對象物捆束之優異的黏著力之黏著帶及其製造方法。The present invention was made in view of the above-mentioned circumstances, and an object thereof is to provide an adhesive tape that has less stickiness on the side of the tape even if stored for a long time and has excellent adhesive force for binding objects such as wires and cables, and the same. Manufacturing methods.
本案發明人們努力研究的結果，發現使黏著劑層在常溫的儲存彈性模數最佳化以提升黏著特性，並進一步控制黏著劑層在高溫的儲存彈性模數、與黏著劑層的凝膠分率，以抑制黏著劑的流動，藉此可得到抑制長時間保存時的膠帶側面的黏性，同時具有高黏著力之黏著帶，而完成本發明。即，本發明具有以下態樣。 [1]一種黏著帶，其具備：含有聚氯乙烯樹脂之基材、與設置在前述基材的至少一側的面上之黏著劑層，前述黏著劑層的凝膠分率為2.5~30質量%，前述黏著劑層在23℃的儲存彈性模數(E’23℃)，為6.8×10 4~3.0×10 5Pa，前述黏著劑層在80℃的儲存彈性模數(E’80℃)與前述儲存彈性模數(E’23℃)滿足下述式(1)。 1.5≦(E’23℃)/(E’80℃)≦8.0．．．(1) [2]如[1]記載之黏著帶，其中前述黏著劑層，含有苯乙烯-丁二烯橡膠(A)、與增黏劑(X)。 [3]如[2]記載之黏著帶，其中前述苯乙烯-丁二烯橡膠(A)，含有經交聯之苯乙烯-丁二烯共聚物橡膠(A1)。 [4]如[2]或[3]記載之黏著帶，其中前述苯乙烯-丁二烯橡膠(A)的凝膠分率，為10~80質量%。 [5]如[1]至[4]中任一項記載之黏著帶，其中前述黏著劑層，含有選自天然橡膠、及天然橡膠衍生物中之至少1種橡膠成分(B)。 [6]如[1]至[5]中任一項記載之黏著帶，其中前述黏著劑層的酯值，為90~150mgKOH/g。 [7]如[1]至[6]中任一項記載之黏著帶，其中前述黏著劑層，含有天然橡膠與(甲基)丙烯酸烷基酯的接枝共聚物(C)。 [8]如[2]至[7]中任一項記載之黏著帶，其中前述增黏劑(X)，含有石油樹脂。 [9]如[1]至[8]中任一項記載之黏著帶，其中前述黏著劑層，進一步含有塑化劑(Y1)。 [10]如[1]至[9]中任一項記載之黏著帶，其相對於前述黏著劑層的總質量，含有5~40質量%的苯乙烯-丁二烯橡膠(A)。 [11]如[1]至[10]中任一項記載之黏著帶，其相對於前述黏著劑層的總質量，含有5~40質量%的選自天然橡膠、及天然橡膠衍生物中之至少1種橡膠成分(B)。 [12]如[1]至[11]中任一項記載之黏著帶，其相對於前述黏著劑層的總質量，含有30~65質量%的增黏劑(X)。 [13]如[1]至[12]中任一項記載之黏著帶，其相對於前述黏著劑層的總質量，含有10~40質量%的塑化劑(Y1)。 [14]如[1]至[13]中任一項記載之黏著帶，其中前述聚氯乙烯樹脂的平均聚合度，為500~2,000。 [15]如[1]至[14]中任一項記載之黏著帶，其中前述基材，相對於100質量份的前述聚氯乙烯樹脂，含有25~75質量份的塑化劑(Y2)。 [16]如[15]記載之黏著帶，其中前述塑化劑(Y2)，含有選自偏苯三甲酸酯系塑化劑、鄰苯二甲酸酯系塑化劑、己二酸酯系塑化劑、及己二酸聚酯系塑化劑中之至少1種。 [17]如[1]至[16]中任一項記載之黏著帶，其中前述基材，含有無機填充材料(Z)。 [18]如[17]記載之黏著帶，其中前述無機填充材料(Z)，含有選自水滑石、滑石、雲母、碳酸鈣、及碳酸鎂中之至少1種。 [19]如[1]至[18]中任一項記載之黏著帶，其中前述基材，含有金屬系複合穩定劑。 [20]如[1]至[19]中任一項記載之黏著帶，其中前述黏著劑層的厚度，為10~40μm。 [21]如[1]至[20]中任一項記載之黏著帶，其中前述基材的厚度，為100~250μm。 [22]如[1]至[21]中任一項記載之黏著帶，其係捆束用。 [23]如[1]至[22]中任一項記載之黏著帶，其係電線類的捆束用。 [24]一種電線類，其係以如[1]至[23]中任一項記載之黏著帶捆束。 [25]一種黏著帶之製造方法，其係如[1]至[23]中任一項記載之黏著帶之製造方法，其包含在前述基材的至少一側的面上，形成前述黏著劑層之步驟。 [26]如[25]記載之黏著帶之製造方法，其中形成前述黏著劑層之步驟，包含將黏著劑組成物的水系乳膠塗布在前述基材上之步驟。 〔發明之效果〕 As a result of diligent research by the inventors of this case, they found that the storage elastic modulus of the adhesive layer at normal temperature can be optimized to improve the adhesive properties, and further control the storage elastic modulus of the adhesive layer at high temperatures and the gel separation of the adhesive layer. rate to suppress the flow of the adhesive, thereby obtaining an adhesive tape that suppresses the stickiness of the side of the tape during long-term storage and has high adhesive force, and thus completes the present invention. That is, the present invention has the following aspects. [1] An adhesive tape comprising: a base material containing polyvinyl chloride resin; and an adhesive layer provided on at least one side of the base material; the adhesive layer has a gel fraction of 2.5 to 30 Mass %, the storage elastic modulus of the aforementioned adhesive layer at 23℃ (E'23℃) is 6.8×10 4 ~3.0×10 5 Pa, and the storage elastic modulus of the aforementioned adhesive layer at 80℃ (E'80 ℃) and the aforementioned storage elastic modulus (E'23℃) satisfy the following formula (1). 1.5≦(E'23℃)/(E'80℃)≦8.0． ． ． (1) [2] The adhesive tape according to [1], wherein the adhesive layer contains styrene-butadiene rubber (A) and a tackifier (X). [3] The adhesive tape according to [2], wherein the styrene-butadiene rubber (A) contains a cross-linked styrene-butadiene copolymer rubber (A1). [4] The adhesive tape according to [2] or [3], wherein the gel fraction of the styrene-butadiene rubber (A) is 10 to 80 mass %. [5] The adhesive tape according to any one of [1] to [4], wherein the adhesive layer contains at least one rubber component (B) selected from the group consisting of natural rubber and natural rubber derivatives. [6] The adhesive tape according to any one of [1] to [5], wherein the ester value of the adhesive layer is 90 to 150 mgKOH/g. [7] The adhesive tape according to any one of [1] to [6], wherein the adhesive layer contains a graft copolymer (C) of natural rubber and alkyl (meth)acrylate. [8] The adhesive tape according to any one of [2] to [7], wherein the aforementioned tackifier (X) contains petroleum resin. [9] The adhesive tape according to any one of [1] to [8], wherein the adhesive layer further contains a plasticizer (Y1). [10] The adhesive tape according to any one of [1] to [9], which contains 5 to 40 mass % of styrene-butadiene rubber (A) based on the total mass of the adhesive layer. [11] The adhesive tape according to any one of [1] to [10], which contains 5 to 40 mass % of natural rubber and natural rubber derivatives based on the total mass of the adhesive layer. At least 1 rubber component (B). [12] The adhesive tape according to any one of [1] to [11], which contains 30 to 65 mass % of the tackifier (X) relative to the total mass of the adhesive layer. [13] The adhesive tape according to any one of [1] to [12], which contains 10 to 40 mass % of plasticizer (Y1) based on the total mass of the adhesive layer. [14] The adhesive tape according to any one of [1] to [13], wherein the average degree of polymerization of the polyvinyl chloride resin is 500 to 2,000. [15] The adhesive tape according to any one of [1] to [14], wherein the base material contains 25 to 75 parts by mass of a plasticizer (Y2) relative to 100 parts by mass of the polyvinyl chloride resin. . [16] The adhesive tape according to [15], wherein the plasticizer (Y2) is selected from the group consisting of trimellitate-based plasticizers, phthalate-based plasticizers, and adipate-based plasticizers. At least one of a plasticizer and an adipic acid polyester plasticizer. [17] The adhesive tape according to any one of [1] to [16], wherein the base material contains an inorganic filler material (Z). [18] The adhesive tape according to [17], wherein the inorganic filler (Z) contains at least one selected from the group consisting of hydrotalcite, talc, mica, calcium carbonate, and magnesium carbonate. [19] The adhesive tape according to any one of [1] to [18], wherein the base material contains a metal-based composite stabilizer. [20] The adhesive tape according to any one of [1] to [19], wherein the thickness of the adhesive layer is 10 to 40 μm. [21] The adhesive tape according to any one of [1] to [20], wherein the thickness of the base material is 100 to 250 μm. [22] The adhesive tape described in any one of [1] to [21] is used for binding. [23] The adhesive tape described in any one of [1] to [22] is used for bundling electrical wires. [24] Electric wires bound with an adhesive tape according to any one of [1] to [23]. [25] A method for manufacturing an adhesive tape, which is the method for manufacturing an adhesive tape according to any one of [1] to [23], which includes forming the aforementioned adhesive on at least one side of the aforementioned base material Layer steps. [26] The method of manufacturing an adhesive tape according to [25], wherein the step of forming the adhesive layer includes the step of coating an aqueous latex of the adhesive composition on the substrate. [Effects of the invention]
根據本發明，能夠提供即使長時間保存，膠帶側面的黏性仍少，且具有用以將電線、纜線等對象物捆束之優異的黏著力之黏著帶及其製造方法。According to the present invention, it is possible to provide an adhesive tape that has low stickiness on the side of the tape even when stored for a long period of time and has excellent adhesive force for binding objects such as wires and cables, and a manufacturing method thereof.
以下，針對本發明的一實施形態詳細地進行說明。本發明，並未限定於以下實施形態，在不阻礙本發明之效果的範圍內能夠適當加以變更來實施。本說明書中，「~」係意指「以上以下」。例如，所謂「10~40μm」，係意指「10μm以上40μm以下」。Hereinafter, one embodiment of the present invention will be described in detail. The present invention is not limited to the following embodiments, and can be implemented with appropriate changes within the scope that does not inhibit the effects of the present invention. In this manual, "~" means "above and below." For example, "10~40 μm" means "10 μm or more and 40 μm or less".
[黏著帶] 本實施形態之黏著帶，係具備含有聚氯乙烯樹脂之基材、與設置在前述基材的至少一側的面上之黏著劑層之黏著帶，其特徵為：前述黏著劑層的凝膠分率為2.5~30質量%，前述黏著劑層在23℃的儲存彈性模數(E’23℃)，為6.8×10 4~3.0×10 5Pa，前述黏著劑層在80℃的儲存彈性模數(E’80℃)與前述儲存彈性模數(E’23℃)滿足下述式(1)。 1.5≦(E’23℃)/(E’80℃)≦8.0．．．(1) 本實施形態之黏著帶，即使長時間保存，膠帶側面的黏性仍少，且具有用以將電線、纜線等對象物捆束之優異的黏著力。以下，針對本實施形態之黏著帶的詳細內容進行說明。 [Adhesive Tape] The adhesive tape according to this embodiment is an adhesive tape including a base material containing polyvinyl chloride resin and an adhesive layer provided on at least one side of the base material. The adhesive tape is characterized by: The gel fraction of the layer is 2.5~30% by mass. The storage elastic modulus of the aforementioned adhesive layer at 23℃ (E'23℃) is 6.8×10 4 ~3.0×10 5 Pa. The aforementioned adhesive layer is 80 The storage elastic modulus at ℃ (E'80°C) and the aforementioned storage elastic modulus (E'23°C) satisfy the following formula (1). 1.5≦(E'23℃)/(E'80℃)≦8.0． ． ． (1) The adhesive tape of this embodiment has less stickiness on the side of the tape even if it is stored for a long time, and has excellent adhesive force for binding objects such as wires and cables. Hereinafter, the details of the adhesive tape of this embodiment will be described.
＜黏著劑層＞ 本實施形態之黏著帶，具有設置在基材的至少一側的面上之黏著劑層。本實施形態的黏著劑層，凝膠分率為2.5~30質量%。黏著劑層的凝膠分率能夠利用以下方法來測定。 ＜黏著劑層的凝膠分率之測定方法＞ 從黏著帶削取0.1g(W0：[g])的構成黏著劑層之黏著劑組成物並使其浸漬於50mL的甲苯中。之後，利用振動機在溫度23℃、200rpm的條件下振動24小時。振動後，使用金屬網(開口#200網目)，將甲苯與吸收甲苯而膨潤之黏著劑組成物分離。使分離後的黏著劑組成物在110℃的條件下乾燥1小時。測定乾燥後包含金屬網之黏著劑組成物的重量(W1：[g])，由下述式(2)算出凝膠分率。 凝膠分率(重量%)=(W1-W2)/W0×100．．．(2) (W0：初始黏著劑組成物的重量(g)，W1：乾燥後包含金屬網之黏著劑組成物的重量(g)，W2：金屬網的初始重量(g)) ＜Adhesive layer＞ The adhesive tape of this embodiment has an adhesive layer provided on at least one side of the base material. The adhesive layer of this embodiment has a gel fraction of 2.5 to 30% by mass. The gel fraction of the adhesive layer can be measured using the following method. ＜Measurement method of gel fraction of adhesive layer＞ 0.1 g (W0: [g]) of the adhesive composition constituting the adhesive layer was scraped from the adhesive tape and immersed in 50 mL of toluene. Thereafter, the vibrator was used to vibrate for 24 hours at a temperature of 23° C. and 200 rpm. After vibration, a metal mesh (opening #200 mesh) is used to separate toluene from the adhesive composition that absorbs toluene and swells. The separated adhesive composition was dried at 110° C. for 1 hour. The weight of the adhesive composition including the metal mesh after drying is measured (W1: [g]), and the gel fraction is calculated from the following formula (2). Gel fraction (weight%) = (W1-W2)/W0×100. ． ． (2) (W0: The weight of the initial adhesive composition (g), W1: The weight of the adhesive composition including the metal mesh after drying (g), W2: The initial weight of the metal mesh (g))
本實施形態中，黏著劑層的凝膠分率較佳為3.0~26質量%，更佳為3.1~20質量%，進一步較佳為3.3~15質量%。藉由黏著劑層的凝膠分率為2.5~30質量%，變得容易抑制黏著劑的流動，長時間保存後膠帶側面的黏性變少。凝膠分率為2.5~30質量%的黏著劑層，例如藉由調整作為黏著劑成分的後述橡膠成分(A)的凝膠分率等而容易達成。In this embodiment, the gel fraction of the adhesive layer is preferably 3.0 to 26 mass%, more preferably 3.1 to 20 mass%, and further preferably 3.3 to 15 mass%. Since the gel fraction of the adhesive layer is 2.5 to 30% by mass, it becomes easier to suppress the flow of the adhesive, and the adhesive tape side becomes less sticky after long-term storage. An adhesive layer with a gel fraction of 2.5 to 30% by mass can be easily achieved, for example, by adjusting the gel fraction of the rubber component (A) described below as an adhesive component.
本實施形態之黏著劑層在23℃的儲存彈性模數(E’23℃)，為6.8×10 4~3.0×10 5Pa。又，黏著劑層在80℃的儲存彈性模數(E’80℃)與前述儲存彈性模數(E’23℃)滿足下述式(1)。 1.5≦(E’23℃)/(E’80℃)≦8.0．．．(1) 黏著劑層的儲存彈性模數(E’)，能夠利用以下方法來測定。 (黏著劑層的儲存彈性模數(E’)之測定方法) 削取0.1g的構成黏著帶的黏著劑層之黏著劑組成物，成形為厚度1mm的片狀，製作儲存彈性模數測定用試樣。之後，使用動態彈性模數測定裝置(例如，TA儀器公司製，產品名稱「ARES」)，在以下測定條件下測定前述試樣，算出儲存彈性模數(E’23℃)及儲存彈性模數(E’80℃)。 (測定條件) 測定起始溫度：-60℃ 測定結束溫度：120℃ 升溫速度：4℃/分鐘 頻率：1Hz The storage elastic modulus of the adhesive layer in this embodiment at 23°C (E'23°C) is 6.8×10 4 ~3.0×10 5 Pa. Moreover, the storage elastic modulus of the adhesive layer at 80°C (E'80°C) and the aforementioned storage elastic modulus (E'23°C) satisfy the following formula (1). 1.5≦(E'23℃)/(E'80℃)≦8.0． ． ． (1) The storage elastic modulus (E') of the adhesive layer can be measured using the following method. (Measurement method of storage elastic modulus (E') of the adhesive layer) Cut out 0.1g of the adhesive composition constituting the adhesive layer of the adhesive tape, shape it into a sheet with a thickness of 1 mm, and prepare a storage elastic modulus measurement method. Sample. Then, use a dynamic elastic modulus measuring device (for example, manufactured by TA Instruments, product name "ARES") to measure the aforementioned sample under the following measurement conditions, and calculate the storage elastic modulus (E'23°C) and the storage elastic modulus. (E'80℃). (Measurement conditions) Measurement start temperature: -60℃ Measurement end temperature: 120℃ Temperature rise rate: 4℃/min Frequency: 1Hz
本實施形態中，黏著劑層的儲存彈性模數(E’23℃)，為6.8×10 4~3.0×10 5Pa，較佳為7.0×10 4~2.5×10 5Pa，更佳為8.0×10 4~2×10 5Pa。又，上述式(1)中，(E’23℃)/(E’80℃)，為1.5以上8.0以下，較佳為1.55~7.0，更佳為1.60~6.0。若黏著劑層在23℃的儲存彈性模數(E’23℃)為6.8×10 4~3.0×10 5Pa，則會成為上述式(1)中之(E’23℃)/(E’80℃)為1.5以上8.0以下的黏著劑層。結果變得容易抑制黏著劑的流動，長時間保存後的膠帶側面的黏性變少。又，可得到常溫下的黏著力優異的黏著帶。 此外，儲存彈性模數(E’23℃)為6.8×10 4~3.0×10 5Pa、且儲存彈性模數(E’23℃)與儲存彈性模數(E’80℃)滿足前述式(1)之黏著劑層，例如藉由黏著劑層中的酯成分的調整、及調整黏著劑層中的橡膠成分(A)與其他黏著劑成分的摻合比等而容易達成。 In this embodiment, the storage elastic modulus (E'23°C) of the adhesive layer is 6.8×10 4 ~3.0×10 5 Pa, preferably 7.0×10 4 ~2.5×10 5 Pa, and more preferably 8.0 ×10 4 ~2×10 5 Pa. Moreover, in the above formula (1), (E'23°C)/(E'80°C) is 1.5 or more and 8.0 or less, preferably 1.55 to 7.0, more preferably 1.60 to 6.0. If the storage elastic modulus of the adhesive layer at 23℃ (E'23℃) is 6.8×10 4 ~3.0×10 5 Pa, it will become (E'23℃)/(E' in the above formula (1) 80℃) is an adhesive layer of 1.5 or more and 8.0 or less. As a result, it becomes easier to suppress the flow of the adhesive, and the side surfaces of the tape become less sticky after being stored for a long time. In addition, an adhesive tape excellent in adhesive force at normal temperature can be obtained. In addition, the storage elastic modulus (E'23℃) is 6.8×10 4 ~3.0×10 5 Pa, and the storage elastic modulus (E'23℃) and storage elastic modulus (E'80℃) satisfy the aforementioned formula ( The adhesive layer of 1) can be easily achieved, for example, by adjusting the ester component in the adhesive layer and adjusting the blending ratio of the rubber component (A) and other adhesive components in the adhesive layer.
一實施形態中，黏著劑層在80℃的儲存彈性模數(E’80℃)，亦可為9.0×10 3~1.5×10 5Pa，亦可為9.0×10 3~1.0×10 5Pa，亦可為1.0×10 4~9.0×10 4Pa。(E’80℃)為前述範圍內的黏著劑層，例如在黏著劑層中含有天然橡膠與(甲基)丙烯酸烷基酯的接枝共聚物(C)的情況、含有增黏劑(X)的情況等，藉由將此等的添加量調整為後述較佳的範圍等而容易達成。 In one embodiment, the storage elastic modulus of the adhesive layer at 80°C (E'80°C) may be 9.0×10 3 ~1.5×10 5 Pa, or may be 9.0×10 3 ~1.0×10 5 Pa , it can also be 1.0×10 4 ~9.0×10 4 Pa. (E'80°C) is an adhesive layer within the aforementioned range. For example, when the adhesive layer contains a graft copolymer (C) of natural rubber and alkyl (meth)acrylate, a tackifier (X ) can be easily achieved by adjusting the amount of addition to a preferable range described below.
(黏著劑組成物) 本實施形態之黏著劑層，可由能夠達成前述凝膠分率及儲存彈性模數之黏著劑組成物構成。一實施形態中，黏著劑層亦可以含有苯乙烯-丁二烯橡膠(A)、與增黏劑(X)之黏著劑組成物構成。藉由使用含有苯乙烯-丁二烯橡膠(A)與增黏劑(X)之黏著劑組成物，容易控制黏著劑層的儲存彈性模數，黏著帶對自我背面之黏著力(以下，記載為「自我背面黏著力」)容易提升。以下，針對含有前述成分之黏著劑組成物的一例進行說明。 (Adhesive composition) The adhesive layer of this embodiment can be composed of an adhesive composition that can achieve the aforementioned gel fraction and storage elastic modulus. In one embodiment, the adhesive layer may also be composed of an adhesive composition containing styrene-butadiene rubber (A) and a tackifier (X). By using an adhesive composition containing styrene-butadiene rubber (A) and a tackifier (X), it is easy to control the storage elastic modulus of the adhesive layer and the adhesive force of the adhesive tape to the self-back surface (hereinafter, record "Self-back adhesion") can be easily improved. Hereinafter, an example of an adhesive composition containing the above-mentioned components will be described.
(苯乙烯-丁二烯橡膠(A)) 所謂苯乙烯-丁二烯橡膠(A)(以下，有時亦記載為「橡膠成分(A)」)，係結構內含有苯乙烯嵌段與丁二烯嵌段之彈性體，可列舉例如：苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS)、苯乙烯-乙烯/丙烯-苯乙烯嵌段共聚物(SEBS)、苯乙烯-丁二烯共聚物橡膠(SBR)等。又，此等橡膠成分(A)，可為非交聯，亦可進行交聯。一實施形態中，作為橡膠成分(A)，較佳為含有選自經交聯之苯乙烯-丁二烯共聚物橡膠(A1)(以下，有時亦記載為「成分(A1)」)、及非交聯的苯乙烯-丁二烯共聚物橡膠(A2)(以下，有時亦記載為「成分(A2)」)中之至少1種，更佳為含有成分(A1)。 (Styrene-butadiene rubber (A)) Styrene-butadiene rubber (A) (hereinafter sometimes referred to as "rubber component (A)") is an elastomer containing a styrene block and a butadiene block. Examples include: Styrene-butadiene-styrene block copolymer (SBS), styrene-ethylene/propylene-styrene block copolymer (SEBS), styrene-butadiene copolymer rubber (SBR), etc. In addition, these rubber components (A) may be non-crosslinked or crosslinked. In one embodiment, the rubber component (A) preferably contains a crosslinked styrene-butadiene copolymer rubber (A1) (hereinafter, sometimes also described as "component (A1)"), and at least one of non-crosslinked styrene-butadiene copolymer rubber (A2) (hereinafter, sometimes also described as "component (A2)"), and more preferably contains component (A1).
一實施形態中，黏著劑層中的橡膠成分(A)的比例，相對於黏著劑層的總質量，較佳為5~40質量%，更佳為5~35質量%，進一步較佳為10~30質量%。一實施形態中，黏著劑層中的橡膠成分(A)的比例，亦可為5~30質量%，亦可為10~40質量%，亦可為20~40質量%，亦可為30~40質量%。藉由黏著劑層在前述範圍內含有橡膠成分(A)，與增黏劑(X)的相容性變得良好，黏著力容易變得良好。此外，所謂「黏著劑層的總質量」，係指構成黏著劑層之樹脂組成物的總質量。In one embodiment, the proportion of the rubber component (A) in the adhesive layer is preferably 5 to 40 mass %, more preferably 5 to 35 mass %, and further preferably 10 mass % relative to the total mass of the adhesive layer. ~30% by mass. In one embodiment, the proportion of the rubber component (A) in the adhesive layer may be 5 to 30 mass %, 10 to 40 mass %, 20 to 40 mass %, or 30 to 30 mass %. 40% by mass. When the adhesive layer contains the rubber component (A) within the above range, the compatibility with the tackifier (X) becomes good, and the adhesive force becomes easy to become good. In addition, the "total mass of the adhesive layer" refers to the total mass of the resin composition constituting the adhesive layer.
(成分(A1)) 成分(A1)，為經交聯之苯乙烯-丁二烯共聚物橡膠。成分(A1)，例如可為凝膠分率為10~80質量%的經交聯之苯乙烯-丁二烯共聚物橡膠。前述凝膠分率，亦可為15~50質量%，亦可為20~40質量%。 橡膠成分(A)含有成分(A1)時，橡膠成分(A)中的成分(A1)的比例，相對於橡膠成分(A)的總質量，較佳為10質量%以上，更佳為30質量%以上，進一步較佳為50質量%以上。橡膠成分(A)中的成分(A1)的比例亦可為100質量%。即，橡膠成分(A)中的成分(A1)的比例，亦可為10~100質量%，亦可為30~100質量%，亦可為50~100質量%，亦可為10~30質量%，亦可為10~50質量%，亦可為30~50質量%。又，黏著劑層中的成分(A1)的比例，較佳為4~40質量%，更佳為4.5~39質量%，進一步較佳為4.75~38.5質量%。藉由成分(A1)的比例為前述範圍內，黏著劑層的凝膠分率容易成為2.5~30質量%，變得容易得到長時間保存後的膠帶側面的黏性少的黏著帶。 (Ingredients (A1)) Component (A1) is cross-linked styrene-butadiene copolymer rubber. Component (A1) may be, for example, a cross-linked styrene-butadiene copolymer rubber with a gel fraction of 10 to 80% by mass. The aforementioned gel fraction may be 15 to 50 mass% or 20 to 40 mass%. When the rubber component (A) contains the component (A1), the proportion of the component (A1) in the rubber component (A) is preferably 10 mass % or more, more preferably 30 mass % with respect to the total mass of the rubber component (A). % or more, more preferably 50 mass% or more. The proportion of the component (A1) in the rubber component (A) may be 100% by mass. That is, the proportion of the component (A1) in the rubber component (A) may be 10 to 100 mass %, 30 to 100 mass %, 50 to 100 mass %, or 10 to 30 mass %. %, it can also be 10~50 mass%, or it can be 30~50 mass%. Moreover, the proportion of component (A1) in the adhesive layer is preferably 4 to 40 mass %, more preferably 4.5 to 39 mass %, and further preferably 4.75 to 38.5 mass %. When the proportion of component (A1) is within the aforementioned range, the gel fraction of the adhesive layer can easily be 2.5 to 30% by mass, making it easier to obtain an adhesive tape with less tackiness on the side of the tape after long-term storage.
就成分(A1)而言，亦可使用市售品。就市售品而言，可列舉例如：JSR(股)製的產品名稱「0533」(凝膠分率：81質量%)、「0113」(凝膠分率：80質量%)、「0545」(凝膠分率：85質量%)等。又，成分(A1)可單獨使用1種，亦可併用2種以上。As for the component (A1), a commercially available product can also be used. Examples of commercially available products include product names "0533" (gel fraction: 81 mass%), "0113" (gel fraction: 80 mass%), and "0545" manufactured by JSR Co., Ltd. (Gel fraction: 85 mass%) etc. In addition, component (A1) may be used individually by 1 type, and may be used in combination of 2 or more types.
(成分(A2)) 成分(A2)，為非交聯的苯乙烯-丁二烯共聚物橡膠。成分(A2)，例如可為苯乙烯率為20~50質量%的非交聯的苯乙烯-丁二烯共聚物橡膠。成分(A2)可單獨使用1種，亦可併用2種以上。 橡膠成分(A)含有成分(A2)時，橡膠成分(A)中的成分(A2)的比例，相對於橡膠成分(A)的總質量，較佳為90質量%以下，更佳為70質量%以下，進一步較佳為50質量%以下。 黏著劑層中的成分(A2)的比例，較佳為0~30質量%，更佳為5~30質量%，進一步較佳為5~25質量%。又，黏著劑層中的成分(A2)的比例，亦可超過0質量%且為15質量%以下，亦可為5~15質量%，亦可為15~26質量%。若黏著劑層中的成分(A2)的比例為前述範圍內，則與增黏劑(X)的相容性容易變得良好，結果黏著力容易變得良好。 (Ingredients (A2)) Component (A2) is non-crosslinked styrene-butadiene copolymer rubber. Component (A2) may be, for example, a non-crosslinked styrene-butadiene copolymer rubber with a styrene content of 20 to 50% by mass. Component (A2) may be used individually by 1 type, or may be used in combination of 2 or more types. When the rubber component (A) contains the component (A2), the proportion of the component (A2) in the rubber component (A) relative to the total mass of the rubber component (A) is preferably 90 mass % or less, more preferably 70 mass % % or less, more preferably 50 mass% or less. The proportion of component (A2) in the adhesive layer is preferably 0 to 30 mass%, more preferably 5 to 30 mass%, and further preferably 5 to 25 mass%. Moreover, the proportion of the component (A2) in the adhesive layer may exceed 0 mass% and be 15 mass% or less, may be 5 to 15 mass%, or may be 15 to 26 mass%. If the ratio of the component (A2) in the adhesive layer is within the aforementioned range, the compatibility with the tackifier (X) will tend to be good, and as a result, the adhesive force will tend to be good.
一實施形態中，黏著劑層含有之橡膠成分(A)的凝膠分率，較佳為10~80質量%，更佳為20~80質量%，進一步較佳為22.5~75質量%。若橡膠成分(A)的凝膠分率為前述範圍內，則黏著劑層的凝膠分率容易成為2.5~30質量%的範圍，容易成為長時間保存後膠帶側面的黏性亦少的黏著帶。此外，橡膠成分(A)的凝膠分率，能夠利用與前述黏著劑層的凝膠分率之測定方法相同的方法來測定。即，將0.1g的構成橡膠成分(A)之組成物作為W0(g)，使其浸漬於50mL的甲苯中。之後，利用振動機在溫度23℃、200rpm的條件下振動24小時。振動後，使用金屬網(開口#200網目)，將甲苯與吸收甲苯而膨潤之黏著劑組成物分離。使分離後的組成物在110℃的條件下乾燥1小時。測定乾燥後包含金屬網之組成物的重量(W1：[g])，由前述式(2)，算出橡膠成分(A)的凝膠分率。In one embodiment, the gel fraction of the rubber component (A) contained in the adhesive layer is preferably 10 to 80 mass %, more preferably 20 to 80 mass %, and further preferably 22.5 to 75 mass %. If the gel fraction of the rubber component (A) is within the above range, the gel fraction of the adhesive layer is likely to be in the range of 2.5 to 30% by mass, and the adhesive layer will tend to have less tackiness on the side of the tape after long-term storage. belt. In addition, the gel fraction of the rubber component (A) can be measured by the same method as the method for measuring the gel fraction of the adhesive layer. That is, 0.1 g of the composition constituting the rubber component (A) was taken as W0 (g) and immersed in 50 mL of toluene. Thereafter, the vibrator was used to vibrate for 24 hours at a temperature of 23° C. and 200 rpm. After vibration, a metal mesh (opening #200 mesh) is used to separate toluene from the adhesive composition that absorbs toluene and swells. The separated composition was dried at 110° C. for 1 hour. The weight of the composition including the metal mesh after drying is measured (W1: [g]), and the gel fraction of the rubber component (A) is calculated from the aforementioned formula (2).
(其他黏著劑成分) 本實施形態之黏著劑層，亦可含有前述橡膠成分(A)以外的黏著劑成分(其他黏著劑成分)。就其他黏著劑成分而言，可列舉例如：橡膠成分(A)以外的橡膠系黏著劑、丙烯酸系黏著劑、矽氧系黏著劑、胺甲酸乙酯系黏著劑等。考量與橡膠成分(A)的相容性等觀點，較佳為含有橡膠成分(A)以外的橡膠系黏著劑。 就橡膠成分(A)以外的橡膠系黏著劑而言，可列舉例如：天然橡膠(NR)；環化天然橡膠、氯化天然橡膠、環氧化天然橡膠等天然橡膠衍生物；苯乙烯-異戊二烯-苯乙烯嵌段共聚物(SIS)、前述苯乙烯系嵌段共聚物的氫化物(SIPS)、聚異戊二烯橡膠(IR)、聚異丁烯(PIB)、及丁基橡膠(IIR)等合成橡膠；選自天然橡膠及前述合成橡膠中之至少1種橡膠成分與(甲基)丙烯酸烷基酯的接枝共聚物等。此等可單獨使用1種，亦可併用2種以上。一實施形態中，黏著劑層，亦可含有選自天然橡膠、及天然橡膠衍生物中之至少1種橡膠成分(B)。又，亦可含有天然橡膠與(甲基)丙烯酸烷基酯的接枝共聚物(C)。 (Other adhesive ingredients) The adhesive layer of this embodiment may contain adhesive components (other adhesive components) other than the rubber component (A) mentioned above. Examples of other adhesive components include rubber-based adhesives other than the rubber component (A), acrylic adhesives, silicone-based adhesives, urethane-based adhesives, and the like. Taking into consideration the compatibility with the rubber component (A), etc., it is preferable to contain a rubber-based adhesive other than the rubber component (A). Examples of rubber-based adhesives other than the rubber component (A) include natural rubber (NR); natural rubber derivatives such as cyclized natural rubber, chlorinated natural rubber, and epoxidized natural rubber; styrene-isoamyl Diene-styrene block copolymer (SIS), hydrogenated product of the aforementioned styrenic block copolymer (SIPS), polyisoprene rubber (IR), polyisobutylene (PIB), and butyl rubber (IIR) ) and other synthetic rubbers; graft copolymers of at least one rubber component selected from natural rubber and the aforementioned synthetic rubbers and alkyl (meth)acrylate, etc. These may be used individually by 1 type, and may be used in combination of 2 or more types. In one embodiment, the adhesive layer may contain at least one rubber component (B) selected from natural rubber and natural rubber derivatives. Moreover, a graft copolymer (C) of natural rubber and (meth)acrylic acid alkyl ester may be included.
(橡膠成分(B)) 一實施形態中，黏著劑層，能夠含有選自天然橡膠、及天然橡膠衍生物中之至少1種橡膠成分(B)。考量相容性的觀點，亦可含有天然橡膠作為橡膠成分(B)。黏著劑層含有橡膠成分(B)時，其比例，相對於黏著劑層的總質量，較佳為5~40質量%，更佳為6~35質量%，進一步較佳為7~30質量%。藉由在前述範圍內含有橡膠成分(B)，更佳為藉由組合前述橡膠成分(A)與橡膠成分(B)，變得容易得到常溫下的黏著特性優異的黏著帶。 (Rubber component (B)) In one embodiment, the adhesive layer can contain at least one rubber component (B) selected from natural rubber and natural rubber derivatives. From the viewpoint of compatibility, natural rubber may also be included as the rubber component (B). When the adhesive layer contains the rubber component (B), its proportion relative to the total mass of the adhesive layer is preferably 5 to 40 mass %, more preferably 6 to 35 mass %, and further preferably 7 to 30 mass %. . By containing the rubber component (B) within the aforementioned range, more preferably by combining the aforementioned rubber component (A) and the rubber component (B), it becomes easy to obtain an adhesive tape excellent in adhesive properties at normal temperature.
(接枝共聚物(C)) 一實施形態中，黏著劑層，亦可含有天然橡膠與(甲基)丙烯酸烷基酯的接枝共聚物(C)。藉由黏著劑層含有接枝共聚物(C)，變得容易調整黏著劑層中的酯量，變得容易得到滿足前述式(1)之黏著劑層。此外，本說明書中，「(甲基)丙烯酸烷基酯」，可包含丙烯酸烷基酯及甲基丙烯酸烷基酯兩者。 黏著劑層中的接枝共聚物(C)的比例，相對於黏著劑層的總質量，較佳為5~40質量%，更佳為6~35質量%，進一步較佳為7~30質量%。 (Graft copolymer (C)) In one embodiment, the adhesive layer may also contain a graft copolymer (C) of natural rubber and alkyl (meth)acrylate. When the adhesive layer contains the graft copolymer (C), it becomes easy to adjust the amount of ester in the adhesive layer, and it becomes easy to obtain an adhesive layer satisfying the above formula (1). In addition, in this specification, "(meth)acrylic acid alkyl ester" may include both acrylic acid alkyl ester and methacrylic acid alkyl ester. The proportion of the graft copolymer (C) in the adhesive layer is preferably 5 to 40 mass %, more preferably 6 to 35 mass %, and further preferably 7 to 30 mass % relative to the total mass of the adhesive layer. %.
接枝共聚物(C)中，(甲基)丙烯酸烷基酯與天然橡膠的質量比((甲基)丙烯酸烷基酯/天然橡膠)，可為3/97~30/70的範圍，亦可為3/97~24/76的範圍，亦可為3/97~18/82的範圍。又，就前述(甲基)丙烯酸烷基酯而言，較佳為烷基的碳數為1~18的(甲基)丙烯酸烷基酯。就更佳的(甲基)丙烯酸烷基酯的具體例而言，可列舉：甲基丙烯酸甲酯、丙烯酸甲酯、甲基丙烯酸乙酯、丙烯酸乙酯、甲基丙烯酸丁酯、丙烯酸丁酯等。其中，考量容易調整黏著劑層的酯量，且彈性模數的控制更為容易的觀點，特佳為甲基丙烯酸甲酯(MMA)。In the graft copolymer (C), the mass ratio of alkyl (meth)acrylate to natural rubber (alkyl (meth)acrylate/natural rubber) can be in the range of 3/97 to 30/70, or It can be in the range of 3/97~24/76, or in the range of 3/97~18/82. Moreover, the alkyl (meth)acrylate is preferably an alkyl (meth)acrylate in which the number of carbon atoms in the alkyl group is 1 to 18. Specific examples of more preferred alkyl (meth)acrylates include: methyl methacrylate, methyl acrylate, ethyl methacrylate, ethyl acrylate, butyl methacrylate, and butyl acrylate. wait. Among them, methyl methacrylate (MMA) is particularly preferred from the viewpoint that the amount of ester in the adhesive layer is easy to adjust and the elastic modulus is easier to control.
一實施形態中，黏著劑層，亦可為前述橡膠成分(A)、橡膠成分(B)、及接枝共聚物(C)的混合物。黏著劑層含有前述混合物時，各成分的比率((A)：(B)：(C))，可為(50~85)：(5~30)：(5~30)(但是，(A)~(C)的合計未超過100)的範圍。又，相對於橡膠成分(A)、橡膠成分(B)及接枝共聚物(C)的合計量，橡膠成分(A)的比例亦可為50~70質量%，橡膠成分(B)的比例亦可為1~30質量%，接枝共聚物(C)的比例亦可為1~30質量%(但是，前述成分的合計量未超過100質量%)。藉由以前述比率摻合各成分，變得更容易控制黏著劑層的凝膠分率及儲存彈性模數。結果變得更容易得到長時間保存後的膠帶側面的黏性少的黏著帶。又，變得容易得到高黏著的膠帶。 又，黏著劑層中的前述成分(A)~(C)的合計量，相對於黏著劑層的總質量，較佳為40~60質量%，更佳為42~58質量%，進一步較佳為43~55質量%。 In one embodiment, the adhesive layer may also be a mixture of the aforementioned rubber component (A), rubber component (B), and graft copolymer (C). When the adhesive layer contains the aforementioned mixture, the ratio of each component ((A): (B): (C)) can be (50~85): (5~30): (5~30) (However, (A )~(C) does not exceed the range of 100). In addition, the proportion of the rubber component (A) may be 50 to 70% by mass, and the proportion of the rubber component (B) may be It may be 1 to 30 mass %, and the proportion of the graft copolymer (C) may be 1 to 30 mass % (however, the total amount of the aforementioned components does not exceed 100 mass %). By blending each component in the aforementioned ratio, it becomes easier to control the gel fraction and storage elastic modulus of the adhesive layer. As a result, it becomes easier to obtain an adhesive tape with less stickiness on the side of the tape after being stored for a long time. In addition, it becomes easy to obtain a highly adhesive tape. In addition, the total amount of the aforementioned components (A) to (C) in the adhesive layer is preferably 40 to 60 mass %, more preferably 42 to 58 mass %, and further preferably 40 to 60 mass % relative to the total mass of the adhesive layer. It is 43~55% by mass.
(增黏劑(X)) 本實施形態之黏著劑層，較佳為含有增黏劑(X)。藉由含有增黏劑(X)，變得容易得到更高黏著的黏著帶。 就增黏劑(X)而言，可列舉例如：未改性松脂、改性松脂、松脂衍生物等松脂系樹脂；未改性萜烯、芳香族改性萜烯、氫化萜烯、萜烯酚等萜烯系樹脂；脂肪族石油樹脂、芳香族石油樹脂、脂肪族及芳香族石油樹脂、以及此等的氫化物等石油樹脂；苯并呋喃-茚樹脂；酚醛樹脂、二甲苯樹脂等縮合系樹脂等。此等可單獨使用1種，亦可併用2種以上。其中，考量黏著力更容易提升的觀點，較佳為含有選自萜烯系樹脂、及石油樹脂中之至少1種增黏劑，更佳為含有石油樹脂。 (Tackifier(X)) The adhesive layer of this embodiment preferably contains a tackifier (X). By containing the tackifier (X), it becomes easier to obtain an adhesive tape with higher adhesion. Examples of the tackifier (X) include: rosin-based resins such as unmodified rosin, modified rosin, and rosin derivatives; unmodified terpenes, aromatic modified terpenes, hydrogenated terpenes, and terpenes Terpene resins such as phenol; petroleum resins such as aliphatic petroleum resins, aromatic petroleum resins, aliphatic and aromatic petroleum resins, and their hydrides; benzofuran-indene resins; phenolic resins, xylene resins, etc. Condensation System resin, etc. These may be used individually by 1 type, and may be used in combination of 2 or more types. Among them, from the viewpoint that the adhesive force is more easily improved, it is preferable to contain at least one tackifier selected from the group consisting of terpene resins and petroleum resins, and it is more preferred to contain petroleum resins.
黏著劑層中的增黏劑(X)的比例，相對於黏著劑層的總質量，可為30~65質量%，亦可為30~60質量%，亦可為32~58質量%，亦可為35~55質量%。若黏著劑組成物中的增黏劑(X)的比例為前述範圍內，則變得容易得到增黏的效果。The proportion of the tackifier (X) in the adhesive layer, relative to the total mass of the adhesive layer, can be 30 to 65 mass %, 30 to 60 mass %, 32 to 58 mass %, or It can be 35~55% by mass. If the ratio of the tackifier (X) in the adhesive composition is within the aforementioned range, the tackifier effect will be easily obtained.
(塑化劑(Y1)) 本實施形態之黏著劑層亦可含有塑化劑(Y1)。藉由含有塑化劑(Y1)，黏著劑層變得柔軟，對於對象物之濕潤性變得容易提升。再者，變得容易控制黏著劑層的儲存彈性模數(尤其是E’23℃)。就塑化劑(Y1)而言，能夠例示與後述基材說明之塑化劑(Y2)相同者，較佳的例子亦相同。 (Plasticizer(Y1)) The adhesive layer of this embodiment may also contain a plasticizer (Y1). By containing the plasticizer (Y1), the adhesive layer becomes softer and the wettability to the object becomes easier to improve. Furthermore, it becomes easy to control the storage elastic modulus of the adhesive layer (especially E'23°C). The plasticizer (Y1) can be exemplified by the same plasticizer (Y2) as the base material described below, and preferred examples are also the same.
黏著劑層中的塑化劑(Y1)的比例，相對於黏著劑層的總質量，可為10~40質量%，亦可為12~38質量%，亦可為15~35質量%，亦可為10~25質量%，亦可為10~20質量%。若塑化劑(Y1)的比例為前述範圍內，則在控制黏著劑層的儲存彈性模數(尤其是E’23℃)的同時，容易調整黏著劑層的酯成分量。The proportion of plasticizer (Y1) in the adhesive layer, relative to the total mass of the adhesive layer, can be 10 to 40 mass %, 12 to 38 mass %, 15 to 35 mass %, or It may be 10~25% by mass or 10~20% by mass. If the proportion of the plasticizer (Y1) is within the aforementioned range, it is easy to adjust the ester component amount of the adhesive layer while controlling the storage elastic modulus of the adhesive layer (especially E'23°C).
本實施形態之黏著劑層依據JIS K0070(1992年)中記載的中和滴定法測定之酯值，可為90~150mgKOH/g，亦可為95~140mgKOH/g。藉由以黏著劑層的酯值成為前述範圍內的方式，調整黏著劑層的酯成分、及後述基材的酯成分量，黏著劑層的極性會變大而變得容易得到黏著力提升的效果。 此外，黏著劑層的酯值能夠利用以下方法來測定。 (酯值之測定方法) 依據JIS K0070(1992年)，利用中和滴定法測定皂化值及酸值，由以下式(3)算出酯值。具體而言，使用刮勺等從黏著帶的黏著劑層採取1g的樣品，測定前述樣品的皂化值與酸值。 酯值(mgKOH/g)=皂化值(mgKOH/g)-酸值(mgKOH/g)．．．(3) 此外，黏著劑層的酯值，亦可為使剛製造的黏著帶在23℃±2℃的條件下老化18~24小時後經測定之值。 The ester value of the adhesive layer of this embodiment measured based on the neutralization titration method described in JIS K0070 (1992) may be 90 to 150 mgKOH/g or 95 to 140 mgKOH/g. By adjusting the ester component of the adhesive layer and the ester component amount of the base material described below so that the ester value of the adhesive layer falls within the above range, the polarity of the adhesive layer becomes larger and the adhesive force is easily improved. Effect. In addition, the ester value of the adhesive layer can be measured by the following method. (Measurement method of ester value) According to JIS K0070 (1992), the saponification value and acid value are measured using the neutralization titration method, and the ester value is calculated from the following formula (3). Specifically, a 1 g sample is taken from the adhesive layer of the adhesive tape using a spatula, etc., and the saponification value and acid value of the sample are measured. Ester value (mgKOH/g) = saponification value (mgKOH/g) - acid value (mgKOH/g). ． ． (3) In addition, the ester value of the adhesive layer can also be a value measured after aging the newly manufactured adhesive tape at 23°C ± 2°C for 18 to 24 hours.
黏著劑層中的酯值，例如能夠藉由在黏著劑層中摻合依據JIS K0070(1992年)中記載的中和滴定法測定之酯值為50~500mgKOH/g的塑化劑(Y1)等來調整。前述塑化劑(Y1)的酯值，亦可為100~450mgKOH/g，亦可為200~400mgKOH/g。具體而言，作為塑化劑(Y1)，較佳為含有後述鄰苯二甲酸酯系塑化劑。The ester value in the adhesive layer can be obtained, for example, by blending a plasticizer (Y1) with an ester value of 50 to 500 mgKOH/g measured according to the neutralization titration method described in JIS K0070 (1992) into the adhesive layer. Wait to adjust. The ester value of the aforementioned plasticizer (Y1) may be 100~450 mgKOH/g or 200~400 mgKOH/g. Specifically, the plasticizer (Y1) preferably contains a phthalate-based plasticizer described below.
(其他添加劑) 本實施形態之黏著劑層中，亦可含有軟化劑、表面潤滑劑、調平劑、抗氧化劑、界面活性劑、抗腐蝕劑、光穩定劑、紫外線吸收劑、耐熱穩定劑、聚合抑制劑、矽烷偶聯劑、潤滑劑、無機填充材料、有機填充材料、金屬粉、顏料等其他添加劑。此等可單獨使用1種，亦可併用2種以上。就其他添加劑而言，考量黏著帶保存時對熱、光之黏著特性的維持、對於被黏體之濕潤性及親和性的觀點，較佳為選自界面活性劑、抗氧化劑、調平劑、光穩定劑、紫外線吸收劑、矽烷偶聯劑、無機填充材料、及有機填充材料中之至少1種，更佳為選自界面活性劑、及抗氧化劑中之至少1種。 黏著劑層含有其他添加劑時，其合計量，相對於黏著劑層的總質量，較佳為0.1~10質量%，更佳為0.3~5質量%。 (Other additives) The adhesive layer of this embodiment may also contain softeners, surface lubricants, leveling agents, antioxidants, surfactants, anti-corrosion agents, light stabilizers, ultraviolet absorbers, heat-resistant stabilizers, polymerization inhibitors, and silane. Coupling agents, lubricants, inorganic fillers, organic fillers, metal powders, pigments and other additives. These may be used individually by 1 type, and may be used in combination of 2 or more types. As for other additives, considering the maintenance of heat and light adhesive properties of the adhesive tape during storage, and the wettability and affinity of the adherend, it is preferably selected from the group consisting of surfactants, antioxidants, leveling agents, At least one kind selected from the group consisting of a light stabilizer, an ultraviolet absorber, a silane coupling agent, an inorganic filler material, and an organic filler material, and more preferably at least one kind selected from the group consisting of a surfactant and an antioxidant. When the adhesive layer contains other additives, the total amount is preferably 0.1 to 10 mass %, and more preferably 0.3 to 5 mass % relative to the total mass of the adhesive layer.
本實施形態之黏著劑層的厚度，考量容易得到更高黏著力的黏著帶的觀點，可為10~40μm，亦可為12~39μm，亦可為15~38μm。此外，黏著劑層的厚度能夠利用測厚儀來測定。The thickness of the adhesive layer in this embodiment may be 10 to 40 μm, 12 to 39 μm, or 15 to 38 μm from the viewpoint of easily obtaining an adhesive tape with higher adhesive force. In addition, the thickness of the adhesive layer can be measured using a thickness gauge.
一實施形態中，構成黏著劑層之黏著劑組成物亦可為水系乳液。即，黏著劑組成物亦可含有水作為分散介質。若黏著劑組成物為水系乳液，則在黏著帶中殘留之溶劑會變少(或完全沒有殘留溶劑)，因此容易成為低VOC的黏著帶。又，能夠從製造步驟中省略溶劑揮發步驟，製造時的環境負荷亦容易變小。 黏著劑組成物為水系乳液時，黏著劑組成物中的水的比例，能夠在黏著劑組成物的固體成分濃度成為5~70質量%的範圍內適當調整，較佳為7~65質量%，更佳為9~60質量%。 In one embodiment, the adhesive composition constituting the adhesive layer may also be an aqueous emulsion. That is, the adhesive composition may contain water as a dispersion medium. If the adhesive composition is a water-based emulsion, there will be less solvent remaining in the adhesive tape (or no residual solvent at all), so it is easy to become a low-VOC adhesive tape. In addition, the solvent evaporation step can be omitted from the production process, and the environmental load during production can also be easily reduced. When the adhesive composition is an aqueous emulsion, the proportion of water in the adhesive composition can be appropriately adjusted within the range of 5 to 70 mass % of the solid content concentration of the adhesive composition, preferably 7 to 65 mass %. More preferably, it is 9~60 mass %.
＜基材＞ 本實施形態之黏著帶，具備含有聚氯乙烯樹脂之基材。即，本實施形態之黏著帶中，基材以含有聚氯乙烯樹脂之樹脂組成物(以下，記載為「基材用樹脂組成物」)構成。以下，針對基材用樹脂組成物的一實施形態進行說明。 ＜Substrate＞ The adhesive tape of this embodiment has a base material containing polyvinyl chloride resin. That is, in the adhesive tape of this embodiment, the base material is composed of a resin composition containing polyvinyl chloride resin (hereinafter, described as "resin composition for base material"). Hereinafter, one embodiment of the resin composition for base materials will be described.
(基材用樹脂組成物) (聚氯乙烯樹脂) 基材用樹脂組成物含有聚氯乙烯樹脂。就基材含有之聚氯乙烯樹脂而言，可列舉例如：氯乙烯的均聚物(以下，記載為「聚氯乙烯」)、氯乙烯-乙酸乙烯酯共聚物、氯乙烯-乙烯共聚物、氯乙烯-丙烯共聚物等。此等可單獨使用1種，亦可組合2種以上使用。此等之中，由於強度優異，且耐磨耗性、防水性、防塵性優異，較佳為聚氯乙烯。 聚氯乙烯樹脂的平均聚合度，只要具有本發明之效果則並未特別限定。考量基材的製膜性的觀點，較佳為500以上。又，考量黏著帶的捲繞性(基材不會過度變硬)觀點，較佳為2,000以下。一實施形態中，前述平均聚合度，亦可為700~1,800，亦可為1,000~1,300。此外，前述平均聚合物，為依照JIS K6720-2測定之值。 (Resin composition for base material) (polyvinyl chloride resin) The resin composition for the base material contains polyvinyl chloride resin. Examples of the polyvinyl chloride resin contained in the base material include vinyl chloride homopolymer (hereinafter referred to as "polyvinyl chloride"), vinyl chloride-vinyl acetate copolymer, vinyl chloride-ethylene copolymer, Vinyl chloride-propylene copolymer, etc. These may be used individually by 1 type, and may be used in combination of 2 or more types. Among these, polyvinyl chloride is preferred because it is excellent in strength and has excellent abrasion resistance, waterproofness, and dustproofness. The average degree of polymerization of the polyvinyl chloride resin is not particularly limited as long as it has the effect of the present invention. From the viewpoint of film-forming properties of the base material, it is preferably 500 or more. In addition, from the viewpoint of the windability of the adhesive tape (the base material will not become excessively hardened), the value is preferably 2,000 or less. In one embodiment, the average degree of polymerization may be 700 to 1,800, or 1,000 to 1,300. In addition, the aforementioned average polymer is a value measured in accordance with JIS K6720-2.
基材中的聚氯乙烯樹脂的比例，相對於基材用樹脂組成物的總質量，可為50~75質量%，亦可為50~70質量%。The proportion of the polyvinyl chloride resin in the base material may be 50 to 75% by mass or 50 to 70% by mass relative to the total mass of the resin composition for the base material.
(塑化劑(Y2)) 本實施形態中，基材較佳為進一步含有塑化劑(Y2)。藉由含有塑化劑(Y2)，基材的伸長率、製膜性變得容易提升。就塑化劑(Y2)而言，較佳為含有選自偏苯三甲酸酯系塑化劑、鄰苯二甲酸酯系塑化劑、己二酸酯系塑化劑、及己二酸聚酯系塑化劑中之至少1種。 (Plasticizer (Y2)) In this embodiment, it is preferable that the base material further contains a plasticizer (Y2). By containing a plasticizer (Y2), the elongation and film forming properties of the base material can be easily improved. The plasticizer (Y2) preferably contains one selected from the group consisting of trimellitate plasticizers, phthalate plasticizers, adipate plasticizers, and adipic acid. At least one type of polyester plasticizer.
就偏苯三甲酸酯系塑化劑而言，可列舉例如：偏苯三甲酸三正辛酯、偏苯三甲酸三-2-乙烯己酯(TOTM)、偏苯三甲酸三異辛酯、偏苯三甲酸三正壬酯、偏苯三甲酸三異壬酯、偏苯三甲酸三正癸酯、偏苯三甲酸三異癸酯等。此等可單獨使用1種，亦可併用2種以上。其中，較佳為含有偏苯三甲酸三正辛酯。Examples of the trimellitic acid ester plasticizer include: tri-n-octyl trimellitate, tri-2-ethylenehexyl trimellitate (TOTM), triisoctyl trimellitate, Trin-nonyl trimellitate, triisononyl trimellitate, tri-n-decyl trimellitate, triisodecyl trimellitate, etc. These may be used individually by 1 type, and may be used in combination of 2 or more types. Among these, it is preferable to contain tri-n-octyl trimellitate.
就鄰苯二甲酸酯系塑化劑而言，可列舉例如：鄰苯二甲酸二異壬酯(DINP)、鄰苯二甲酸二庚酯(DHP)、鄰苯二甲酸二-2-乙基己酯(DEHP)、鄰苯二甲酸二正辛酯(n-DOP)、鄰苯二甲酸二異癸酯(DIDP)、間苯二甲酸二-2-乙基己酯(DOIP)、對苯二甲酸二-2-乙基己酯(DOTP)、鄰苯二甲酸-丙二醇系聚酯等。此等可單獨使用1種，亦可併用2種以上。其中，較佳為含有鄰苯二甲酸二異壬酯(DINP)。Examples of phthalate plasticizers include diisononyl phthalate (DINP), diheptyl phthalate (DHP), and di-2-ethyl phthalate. ethylhexyl ester (DEHP), di-n-octyl phthalate (n-DOP), diisodecyl phthalate (DIDP), di-2-ethylhexyl isophthalate (DOIP), p- Di-2-ethylhexyl phthalate (DOTP), phthalate-propylene glycol polyester, etc. These may be used individually by 1 type, and may be used in combination of 2 or more types. Among them, it is preferable to contain diisononyl phthalate (DINP).
就己二酸酯系塑化劑而言，可列舉例如：己二酸二-2-乙基己酯(DOA)、己二酸二異壬酯(DINA)、己二酸二異癸酯(DIDA)等。此等可單獨使用1種，亦可併用2種以上。Examples of adipate-based plasticizers include di-2-ethylhexyl adipate (DOA), diisononyl adipate (DINA), and diisodecyl adipate (DINA). DIDA) etc. These may be used individually by 1 type, and may be used in combination of 2 or more types.
就己二酸聚酯系塑化劑而言，可列舉例如：己二酸-丙二醇系聚酯、己二酸-丁二醇系聚酯等。此等可單獨使用1種，亦可併用2種以上。其中，較佳為含有己二酸-丙二醇系聚酯、或己二酸-丁二醇系聚酯。又，前述己二酸聚酯的質量平均分子量(Mw)，可為400~3,000。前述Mw，係指使用凝膠滲透層析儀(GPC)(例如，東曹(股)製)，GPC管柱使用Shodex公司製，產品名稱「KF-806L」2根、「KF-802」及「KF-801」各1根合計4根，從上游側依照KF-806L、KF-806L、KF-802、及KF-801的順序連接，將高效能液相層析儀用四氫呋喃(不含穩定劑)(例如，富士軟片和光純藥(股)製)作為流動相，在流速1.0mL/分鐘、管柱溫度40℃、試樣濃度1mg/mL、及試樣注入量100μL的條件下測定之值。Examples of the adipic acid polyester plasticizer include adipic acid-propylene glycol polyester, adipic acid-butylene glycol polyester, and the like. These may be used individually by 1 type, and may be used in combination of 2 or more types. Among them, it is preferable to contain adipic acid-propylene glycol polyester or adipic acid-butylene glycol polyester. In addition, the mass average molecular weight (Mw) of the adipic acid polyester may be 400 to 3,000. The aforementioned Mw refers to the use of gel permeation chromatography (GPC) (for example, manufactured by Tosoh Corporation). The GPC columns manufactured by Shodex Co., Ltd. are used. The product names are "KF-806L" 2 pieces, "KF-802" and "KF-801" 1 each, a total of 4, connect from the upstream side in the order of KF-806L, KF-806L, KF-802, and KF-801, and use tetrahydrofuran (excluding stable (e.g., manufactured by Fuji Film and Wako Pure Chemical Industries, Ltd.) as the mobile phase, and measured under the conditions of a flow rate of 1.0 mL/min, a column temperature of 40°C, a sample concentration of 1 mg/mL, and a sample injection volume of 100 μL. value.
基材中，亦可含有上述偏苯三甲酸酯系塑化劑、鄰苯二甲酸酯系塑化劑、己二酸酯系塑化劑、及己二酸聚酯系塑化劑以外的塑化劑(其他塑化劑)。就其他塑化劑而言，可列舉例如：鄰苯二甲酸苄基丁酯(BBP)、壬二酸二-2-乙基己酯(DOZ)、癸二酸二-2-乙基己酯(DOS)、磷酸三甲苯酯(TCP)、己二酸苄基辛酯(BOA)、磷酸二苯基甲苯酯(DPCP)、環氧化大豆油、環氧化亞麻仁油、氯化石蠟等。此等其他塑化劑可單獨使用1種，亦可組合2種以上使用。The base material may also contain other than the above-mentioned trimellitate-based plasticizers, phthalate-based plasticizers, adipate-based plasticizers, and adipic acid polyester-based plasticizers. Plasticizers (other plasticizers). Examples of other plasticizers include benzylbutyl phthalate (BBP), di-2-ethylhexyl azelate (DOZ), and di-2-ethylhexyl sebacate. (DOS), tricresyl phosphate (TCP), benzyloctyl adipate (BOA), diphenyltolyl phosphate (DPCP), epoxidized soybean oil, epoxidized linseed oil, chlorinated paraffin, etc. These other plasticizers may be used individually by 1 type, or in combination of 2 or more types.
其他實施形態中，亦可含有鄰苯二甲酸二正辛酯(n-DOP)、或鄰苯二甲酸二異癸酯(DIDP)作為塑化劑(Y2)。In other embodiments, di-n-octyl phthalate (n-DOP) or diisodecyl phthalate (DIDP) may be contained as the plasticizer (Y2).
本實施形態中，基材含有之塑化劑(Y2)的比例，相對於100質量份的聚氯乙烯樹脂，較佳為25~75質量份，更佳為28~71質量份，進一步較佳為35~60質量份。若基材中的塑化劑(Y2)的比例為前述範圍內，則加工性容易變得良好。In this embodiment, the proportion of plasticizer (Y2) contained in the base material is preferably 25 to 75 parts by mass, more preferably 28 to 71 parts by mass, and further preferably 100 parts by mass of polyvinyl chloride resin. It is 35~60 parts by mass. When the ratio of the plasticizer (Y2) in the base material is within the aforementioned range, the processability is likely to be good.
一實施形態中，基材含有之塑化劑(Y2)、與黏著劑層含有之塑化劑(Y1)，亦可為相同的塑化劑。例如，含有鄰苯二甲酸酯系塑化劑作為塑化劑(Y2)時，塑化劑(Y1)亦可含有鄰苯二甲酸酯系塑化劑。又，黏著劑層中的塑化劑(Y1)的比例(質量%)與基材中的塑化劑(Y2)的比例(質量%)的差(塑化劑(Y2)(質量%)-塑化劑(Y1)(質量%))，可為30質量%以下，亦可為25質量%以下。藉由以塑化劑(Y2)的比例變得比塑化劑(Y1)的比例更高的方式設計，基材中的酯成分變得容易遷移至黏著劑層中，變得容易控制黏著劑層的儲存彈性模數(尤其是E’23℃)。In one embodiment, the plasticizer (Y2) contained in the base material and the plasticizer (Y1) contained in the adhesive layer can also be the same plasticizer. For example, when a phthalate-based plasticizer is contained as the plasticizer (Y2), the plasticizer (Y1) may contain a phthalate-based plasticizer. Also, the difference between the proportion (mass %) of the plasticizer (Y1) in the adhesive layer and the proportion (mass %) of the plasticizer (Y2) in the base material (plasticizer (Y2) (mass %) - Plasticizer (Y1) (mass %)) may be 30 mass % or less, or may be 25 mass % or less. By designing such that the proportion of plasticizer (Y2) becomes higher than that of plasticizer (Y1), the ester component in the base material becomes easier to migrate into the adhesive layer, making it easier to control the adhesive. The storage elastic modulus of the layer (especially E'23°C).
(其他樹脂) 基材中，在不阻礙本發明之效果的範圍內，亦可含有聚氯乙烯樹脂以外的樹脂(以下，記載為「其他樹脂」)。就其他樹脂而言，可列舉例如：聚酯系樹脂、聚醯亞胺系樹脂、聚醯胺系樹脂、聚烯烴系樹脂等。此等可單獨使用1種，亦可併用2種以上。基材含有其他樹脂時，相對於基材用樹脂組成物的總質量，較佳為20質量%以下。 (Other resins) The base material may contain resins other than polyvinyl chloride resin (hereinafter referred to as "other resins") within a range that does not inhibit the effects of the present invention. Examples of other resins include polyester resins, polyimide resins, polyamide resins, polyolefin resins, and the like. These may be used individually by 1 type, and may be used in combination of 2 or more types. When the base material contains other resins, it is preferably 20 mass % or less based on the total mass of the resin composition for the base material.
(其他添加劑) 基材中，在不阻礙本發明之效果的範圍內，亦可含有其他添加劑。就其他添加劑而言，可列舉例如：無機填充材料、改質劑、分散劑、著色劑、光吸收劑、潤滑劑、抗黏連劑、抗靜電劑、穩定劑、抗氧化劑、加工助劑等。其中，亦可含有選自無機填充材料、穩定劑、及潤滑劑中之至少1種。 (other additives) The base material may also contain other additives within the scope that does not hinder the effects of the present invention. Examples of other additives include inorganic fillers, modifiers, dispersants, colorants, light absorbers, lubricants, anti-blocking agents, antistatic agents, stabilizers, antioxidants, processing aids, etc. . Among them, at least one selected from the group consisting of inorganic fillers, stabilizers, and lubricants may be included.
(無機填充材料(Z)) 就無機填充材料(Z)而言，可列舉例如：氫氧化鋁、氫氧化鎂、氫氧化鋯、氫氧化鈣、氫氧化鉀、氫氧化鋇、聚磷酸銨、聚磷酸醯胺、氧化鋯、氧化鎂、氧化鋅、氧化鈦、氧化鉬、磷酸胍、膨潤石、硼酸鋅、無水硼酸鋅、偏硼酸鋅、偏硼酸鋇、氧化銻、三氧化二銻、五氧化二銻、紅磷、水滑石、滑石、雲母、高嶺土、黏土、氧化鋁、二氧化矽、水鋁石、膨土、矽酸鈉、矽酸鈣、硫酸鈣、碳酸鈣、碳酸鎂、碳黑等。此等可單獨使用1種，亦可併用2種以上。其中，較佳為含有選自水滑石、滑石、雲母、碳酸鈣、及碳酸鎂中之至少1種，更佳為含有碳酸鈣。 (Inorganic filler material (Z)) Examples of the inorganic filler (Z) include aluminum hydroxide, magnesium hydroxide, zirconium hydroxide, calcium hydroxide, potassium hydroxide, barium hydroxide, ammonium polyphosphate, ammonium polyphosphate, and zirconium oxide. Magnesium oxide, zinc oxide, titanium oxide, molybdenum oxide, guanidine phosphate, bentonite, zinc borate, anhydrous zinc borate, zinc metaborate, barium metaborate, antimony oxide, antimony trioxide, antimony pentoxide, red phosphorus, water Talc, talc, mica, kaolin, clay, alumina, silica, diaspore, bentonite, sodium silicate, calcium silicate, calcium sulfate, calcium carbonate, magnesium carbonate, carbon black, etc. These may be used individually by 1 type, and may be used in combination of 2 or more types. Among them, it is preferable to contain at least one selected from the group consisting of hydrotalcite, talc, mica, calcium carbonate, and magnesium carbonate, and it is more preferable to contain calcium carbonate.
無機填充材料(Z)的平均粒徑(D50)，考量加工性與基材的平滑性的觀點，可為0.03~20μm，亦可為0.1~10μm。此外，無機填充材料(Z)的平均粒徑，係指使用雷射繞射式粒度分布測定裝置測定之體積基準的累積粒度分布中，累積值相當於50%之粒徑。累積粒度分布，以將橫軸設為粒徑(μm)、將縱軸設為累積值(%)之分布曲線表示。The average particle diameter (D50) of the inorganic filler material (Z) may be 0.03 to 20 μm or 0.1 to 10 μm from the viewpoint of processability and base material smoothness. In addition, the average particle diameter of the inorganic filler (Z) refers to the particle diameter at which the cumulative value corresponds to 50% of the volume-based cumulative particle size distribution measured using a laser diffraction particle size distribution measuring device. The cumulative particle size distribution is represented by a distribution curve in which the horizontal axis represents particle diameter (μm) and the vertical axis represents cumulative value (%).
一實施形態中，基材中含有之無機填充材料(Z)的比例，相對於100質量份的聚氯乙烯樹脂，較佳為0.1~30質量份，更佳為1~27質量份，進一步較佳為2.5~25質量份。一實施形態中，基材中的無機填充材料(Z)的比例，相對於100質量份的聚氯乙烯樹脂，亦可為3~30質量份，亦可為4~30質量份，亦可為3~22質量份。In one embodiment, the proportion of the inorganic filler material (Z) contained in the base material is preferably 0.1 to 30 parts by mass, more preferably 1 to 27 parts by mass, relative to 100 parts by mass of the polyvinyl chloride resin. The optimal amount is 2.5~25 parts by mass. In one embodiment, the proportion of the inorganic filler material (Z) in the base material may be 3 to 30 parts by mass, 4 to 30 parts by mass, or 100 parts by mass of the polyvinyl chloride resin. 3~22 parts by mass.
(穩定劑) 就穩定劑而言，可列舉例如金屬系複合穩定劑等。藉由含有金屬系複合穩定劑等，基材的熱穩定性變得容易提升。 就金屬系複合穩定劑而言，可列舉例如選自脂肪酸鈣、脂肪酸鋅、及脂肪酸鋇中之至少1種。就金屬系複合穩定劑的脂肪酸成分而言，可列舉例如：月桂酸、硬脂酸、蓖麻油酸等。就這樣的金屬系複合穩定劑的具體例而言，較宜使用例如：月桂酸鈣、硬脂酸鈣、蓖麻油酸鈣、月桂酸鋅、蓖麻油酸鋅、硬脂酸鋅、月桂酸鋇、硬脂酸鋇、蓖麻油酸鋇等。此等可單獨使用1種，亦可併用2種以上。此外，考量藉由組合而熱穩定性效果變得更容易提高的觀點，較宜使用含有脂肪酸鈣與脂肪酸鋅之Ca-Zn系金屬穩定劑。 (stabilizer) Examples of the stabilizer include metal-based composite stabilizers. By containing a metal-based composite stabilizer, etc., the thermal stability of the base material can be easily improved. Examples of the metal-based composite stabilizer include at least one selected from fatty acid calcium, fatty acid zinc, and fatty acid barium. Examples of the fatty acid component of the metal-based composite stabilizer include lauric acid, stearic acid, ricinoleic acid, and the like. Specific examples of such metal-based composite stabilizers are preferably calcium laurate, calcium stearate, calcium ricinoleate, zinc laurate, zinc ricinoleate, zinc stearate, and barium laurate. , barium stearate, barium ricinoleate, etc. These may be used individually by 1 type, and may be used in combination of 2 or more types. In addition, from the viewpoint that the thermal stability effect is more easily improved by combination, it is more suitable to use a Ca-Zn metal stabilizer containing fatty acid calcium and fatty acid zinc.
一實施形態中，基材中含有之金屬系複合穩定劑的比例，相對於100質量份的聚氯乙烯樹脂，較佳為0.1~10質量份，進一步較佳為1~7質量份。In one embodiment, the proportion of the metal-based composite stabilizer contained in the base material is preferably 0.1 to 10 parts by mass, and further preferably 1 to 7 parts by mass relative to 100 parts by mass of the polyvinyl chloride resin.
(潤滑劑) 就潤滑劑而言，能夠列舉例如：硬脂酸、棕櫚酸等高級脂肪酸；棕櫚醇、硬脂醇等高級醇；硬脂酸鈣、硬脂酸鋅、硬脂酸鋇、硬脂酸鋁、硬脂酸鎂、棕櫚酸鈉等高級脂肪酸的金屬鹽；硬脂酸丁酯、單硬脂酸甘油酯等高級脂肪酸酯；油醯胺、硬脂醯胺、芥醯胺等高級脂肪醯胺等。此處，所謂「高級」，係碳數9以上，較佳為碳數為9以上30以下。此等可單獨使用1種，亦可併用2種以上。其中，考量基材的製膜性的觀點，較佳為含有硬脂酸。 (lubricant) Examples of lubricants include higher fatty acids such as stearic acid and palmitic acid; higher alcohols such as palmitol and stearyl alcohol; calcium stearate, zinc stearate, barium stearate, aluminum stearate, Metal salts of higher fatty acids such as magnesium stearate and sodium palmitate; higher fatty acid esters such as butyl stearate and glyceryl monostearate; higher fatty acid amines such as oleamide, stearamide and erucamide wait. Here, "high grade" means a carbon number of 9 or more, preferably a carbon number of 9 or more and 30 or less. These may be used individually by 1 type, and may be used in combination of 2 or more types. Among these, from the viewpoint of film-forming properties of the base material, it is preferable to contain stearic acid.
基材中的潤滑劑的比例，相對於基材用樹脂組成物的總質量，較佳為1質量%以下，更佳為0.5質量%以下。The proportion of the lubricant in the base material is preferably 1% by mass or less, more preferably 0.5% by mass or less based on the total mass of the resin composition for the base material.
本實施形態之基材的厚度，考量輕量性與基材的斷裂強度、耐電壓性的觀點，可為100~250μm，亦可為110~225μm。此外，基材的厚度能夠利用測厚儀來測定。The thickness of the base material in this embodiment may be 100 to 250 μm or 110 to 225 μm from the viewpoint of lightweight, breaking strength, and voltage resistance of the base material. In addition, the thickness of the base material can be measured using a thickness gauge.
＜下塗層＞ 本實施形態之黏著帶的一實施形態中，考量使基材與黏著劑層的密接性提升的觀點，亦可在基材與黏著劑層之間設置下塗層。 ＜Undercoat＞ In an embodiment of the adhesive tape of this embodiment, from the viewpoint of improving the adhesion between the base material and the adhesive layer, an undercoat layer may be provided between the base material and the adhesive layer.
就形成下塗層之下塗層用組成物而言，可列舉例如相對於100質量份的前述接枝共聚物(C)，摻合了25~300質量份的丙烯腈-丁二烯共聚物之組成物。 前述丙烯腈-丁二烯共聚物中的丙烯腈(AN)與丁二烯(BD)的比例，能夠在不阻礙本發明之效果的範圍內適當調整。例如，AN/BD(質量比)為(25~30)/(70~75)的共聚物1、AN/BD(質量比)為(31~35)/(65~69)的共聚物2、AN/BD(質量比)為(36~43)/(57~64)的共聚物3等，能夠使用1種，或組合2種以上使用。 Examples of the composition for forming an undercoat layer include blending 25 to 300 parts by mass of an acrylonitrile-butadiene copolymer with respect to 100 parts by mass of the graft copolymer (C). its composition. The ratio of acrylonitrile (AN) and butadiene (BD) in the acrylonitrile-butadiene copolymer can be appropriately adjusted within a range that does not hinder the effects of the present invention. For example, copolymer 1 whose AN/BD (mass ratio) is (25~30)/(70~75), copolymer 2 whose AN/BD (mass ratio) is (31~35)/(65~69), Copolymer 3 etc. whose AN/BD (mass ratio) is (36~43)/(57~64) can be used 1 type or in combination of 2 or more types.
一實施形態中，下塗層的厚度，能夠在0.1~1.0μm的範圍內調整，亦可為0.3~0.5μm。又，下塗層可為單層，亦可疊層2層以上。使下塗層成為2層以上時，其總厚度能夠在5~50μm的範圍內調整。此外，考量使長時間保存後的膠帶側面的黏性變少的觀點，下塗層的厚度，亦可超過0.1μm且為0.8μm以下。In one embodiment, the thickness of the undercoat layer can be adjusted in the range of 0.1~1.0 μm, or may be 0.3~0.5 μm. In addition, the undercoat layer may be a single layer or two or more layers may be laminated. When the undercoat layer is made into two or more layers, the total thickness can be adjusted within the range of 5 to 50 μm. In addition, in order to reduce the stickiness on the side of the tape after long-term storage, the thickness of the undercoat layer may exceed 0.1 μm and be 0.8 μm or less.
本實施形態之黏著帶對自我背面之黏著力，可為1.5N/10mm以上，亦可為1.7N/10mm以上。本實施形態之黏著帶，具有用以將對象物捆束之優異的黏著力，對自我背面之黏著力亦高。此外，黏著帶對自我背面之黏著力，係指在以下條件下測定之值。 (黏著帶的自我背面黏著力之測定方法) 依照JIS Z 0237進行測定。具體而言，首先將寬度10mm的黏著帶靜置在設定為溫度23±2℃、濕度50±5%RH之評價試驗室內24小時以上。老化後，在厚度1mm的金屬板上貼合長度150mm的黏著帶，製作自我背面測定用的黏著帶基材面樣品。之後，準備長度150mm的黏著帶，將其黏著劑層面貼合在自我背面測定用的黏著帶的基材面上後，以5mm/s的速度使重量2,000g的滾筒來回1次以進行貼合。從貼合開始20分鐘後，使用拉伸試驗機(例如，島津製作所(股)製，產品名稱「Autograph AGX」)，測定膠帶黏著面與膠帶基材面之間的180度剝離強度(N/10mm)。 The adhesive force of the adhesive tape of this embodiment to the back of the self can be 1.5N/10mm or more, or 1.7N/10mm or more. The adhesive tape of this embodiment has excellent adhesion for binding objects and has high adhesion to the back of the self. In addition, the adhesive force of the adhesive tape to the back of the self refers to the value measured under the following conditions. (Measurement method of self-back adhesion of adhesive tape) Measurement was performed in accordance with JIS Z 0237. Specifically, an adhesive tape with a width of 10 mm was first left to stand in an evaluation test chamber set to a temperature of 23±2°C and a humidity of 50±5%RH for more than 24 hours. After aging, an adhesive tape with a length of 150 mm was bonded to a metal plate with a thickness of 1 mm to prepare an adhesive tape base material surface sample for self-back measurement. After that, prepare an adhesive tape with a length of 150mm, and stick the adhesive layer on the base surface of the adhesive tape for self-back measurement. Then, the roller weighing 2,000g reciprocates once at a speed of 5mm/s for lamination. . 20 minutes after the start of lamination, use a tensile testing machine (for example, manufactured by Shimadzu Corporation, product name "Autograph AGX") to measure the 180-degree peel strength (N/ 10mm).
將黏著力高的黏著帶長時間保存時，有黏著劑從膠帶側面滲出，而產生黏性的問題。本案發明人們，針對高黏著帶在保存時黏著劑滲出之原因進行探討，結果認為原因是高黏著帶在高溫時的儲存彈性模數低，因此黏著劑隨著時間經過而流動化。為了增大高溫時的儲存彈性模數，在高溫下應用高彈性的聚合物是有效的，但另一方面，有常溫下的彈性模數過度變高而黏著力降低的問題。因此本案發明人們，著眼於常溫(23℃)下的儲存彈性模數並進行評價，結果發現藉由以23℃的儲存彈性模數成為一定範圍的方式控制黏著劑層的彈性模數以提升黏著特性，並進一步藉由黏著劑層中的交聯成分、酯成分的調整來控制黏著劑層的凝膠分率，藉此可將高溫時(80℃)的儲存彈性模數抑制得低。本實施形態之黏著帶，藉由同時控制黏著劑層在常溫時與高溫時的儲存彈性模數，能夠一邊維持高黏著力，一邊亦改善黏著劑層的滲出所致之膠帶側面的黏性。When an adhesive tape with high adhesion is stored for a long time, the adhesive may seep out from the sides of the tape, causing stickiness problems. The inventors of this case studied the reasons why the adhesive oozes out during storage of high-adhesive tapes, and found that the reason is that the storage elastic modulus of high-adhesive tapes at high temperatures is low, so the adhesive fluidizes over time. In order to increase the storage elastic modulus at high temperatures, it is effective to use a highly elastic polymer at high temperatures. However, on the other hand, there is a problem that the elastic modulus at room temperature becomes excessively high and the adhesive force decreases. Therefore, the inventors of the present case focused on and evaluated the storage elastic modulus at normal temperature (23°C). As a result, they found that by controlling the elastic modulus of the adhesive layer so that the storage elastic modulus at 23°C falls within a certain range, adhesion can be improved. characteristics, and further control the gel fraction of the adhesive layer by adjusting the cross-linking component and ester component in the adhesive layer, thereby suppressing the storage elastic modulus at high temperature (80°C) to a low level. The adhesive tape of this embodiment can simultaneously maintain high adhesion by controlling the storage elastic modulus of the adhesive layer at normal temperature and high temperature, while also improving the stickiness on the side of the tape caused by the bleeding of the adhesive layer.
[黏著帶之製造方法] 本實施形態之黏著帶之製造方法，特徵為包含在前述基材的至少一側的面上，形成前述黏著劑層之步驟。以下，針對本實施形態之製造方法進行說明。 [Manufacturing method of adhesive tape] The method of manufacturing an adhesive tape according to this embodiment is characterized by including the step of forming the adhesive layer on at least one side of the base material. Hereinafter, the manufacturing method of this embodiment is demonstrated.
＜步驟(I-1)＞ 本實施形態之製造方法，亦可在形成前述黏著劑層之步驟(步驟(I))之前，包含基材的形成步驟(步驟(I-1))。一實施形態中，前述步驟(I-1)，亦可將含有聚氯乙烯樹脂、因應需要的塑化劑(Y2)、與無機填充材料(Z)之基材用樹脂組成物熔融混練以得到基材。步驟(I-1)中將基材用樹脂組成物熔融混練之方法，只要具有本發明之效果則並未特別限定，能夠使用例如：雙軸擠製機、連續式及批次式的捏合機、輥、班布里混合機等具備加熱裝置之各種混合器、混練機。能夠利用慣用的方法，例如壓延法、T字模具法、吹脹法等將藉由前述方法使原料均勻地分散之基材用樹脂組成物製膜成片狀，以製成基材。就成形機而言，考量生產性、顏色變化、形狀的均勻性、厚度精度等觀點，更佳為使用壓延法。 壓延成形中之輥排列方式，能夠採用例如L型、反L型、Z型等周知的方式，又，輥溫度通常設定為150~200℃，較佳為設定為155~190℃。 <Step (I-1)> The manufacturing method of this embodiment may also include a base material forming step (step (I-1)) before the step of forming the adhesive layer (step (I)). In one embodiment, in the aforementioned step (I-1), the base material resin composition containing polyvinyl chloride resin, plasticizer (Y2) as needed, and inorganic filler (Z) can also be melted and kneaded to obtain base material. The method of melting and kneading the resin composition for the base material in step (I-1) is not particularly limited as long as it has the effect of the present invention. For example, a twin-screw extruder, a continuous type and a batch type kneader can be used. , roller, Banbury mixer and other mixers and kneading machines equipped with heating devices. The resin composition for the base material in which the raw materials are uniformly dispersed by the above-mentioned method can be formed into a film into a sheet using a conventional method, such as the calendering method, the T-die method, the inflation method, etc., to prepare the base material. Regarding the molding machine, it is better to use the calendering method in view of productivity, color change, shape uniformity, thickness accuracy, etc. The roller arrangement in calendering can be a well-known method such as L-shaped, reverse L-shaped, Z-shaped, etc. The roller temperature is usually set to 150 to 200°C, preferably 155 to 190°C.
本實施形態之製造方法中，亦可在步驟(I-1)之後，設置下塗層形成步驟(I-2)。就下塗層形成步驟而言，可列舉例如藉由凹版法、噴霧法、吻輥塗法、棒塗法、或刀塗法等，將含有前述下塗層用組成物之水系乳膠，塗布在基材的一側的面上，形成下塗層之步驟。In the manufacturing method of this embodiment, the undercoat layer forming step (I-2) may be provided after the step (I-1). The step of forming the undercoat layer includes, for example, applying an aqueous latex containing the composition for the undercoat layer to The step of forming an undercoat layer on one side of the substrate.
＜步驟(I)＞ 一實施形態中，步驟(I)，亦可包含將黏著劑組成物的水系乳膠塗布在前述基材上之步驟。前述黏著劑組成物中，亦可含有前述橡膠成分(A)、與增黏劑(X)。再者，亦可含有選自橡膠成分(B)、接枝共聚物(C)、及塑化劑(Y1)中之至少1種成分。就塗布方法而言，較佳為凹版塗布、缺角輪塗布、或模塗機塗布。 ＜Step (I)＞ In one embodiment, step (I) may also include the step of coating the aqueous latex of the adhesive composition on the aforementioned substrate. The aforementioned adhesive composition may also contain the aforementioned rubber component (A) and tackifier (X). Furthermore, at least one component selected from the group consisting of the rubber component (B), the graft copolymer (C), and the plasticizer (Y1) may be included. As for the coating method, gravure coating, notch coating, or die coater coating is preferred.
又，步驟(I)之後，考量促進塑化劑的遷移的觀點，亦可實施熱處理。就熱處理而言，可列舉例如在100~120℃處理1~8小時。In addition, after step (I), heat treatment may be performed from the viewpoint of promoting migration of the plasticizer. Examples of heat treatment include treatment at 100 to 120° C. for 1 to 8 hours.
[用途] 本實施形態之黏著帶，能夠適合作為用以捆束、保護配置在汽車等中之電線類的膠帶利用。本實施形態之黏著帶，即使長時間保存，膠帶側面的黏性仍少，且具有用以將電線、纜線等對象物捆束之優異的黏著力。此外，理所當然地，本實施形態之黏著帶，其用途並未限定於汽車、飛機的電線類的捆束、保護。 [use] The adhesive tape of this embodiment can be suitably used as a tape for bundling and protecting electric wires and the like installed in automobiles and the like. The adhesive tape of this embodiment has less stickiness on the sides of the tape even if it is stored for a long time, and has excellent adhesive force for binding objects such as wires and cables. In addition, it goes without saying that the use of the adhesive tape of this embodiment is not limited to bundling and protecting electric wires in automobiles and airplanes.
本實施形態之黏膠帶的更佳的實施形態係如下述。 ＜1＞一種黏著帶，其具備：含有聚氯乙烯樹脂之基材、與設置在前述基材的至少一側的面上之黏著劑層，前述黏著劑層，包含含有經交聯之苯乙烯-丁二烯共聚物橡膠(A1)之苯乙烯-丁二烯橡膠(A)、與接枝共聚物(C)，相對於前述黏著劑層的總質量，前述成分(A1)的比例為4~40質量%，前述接枝共聚物(C)的比例為5~40質量%，前述黏著劑層的凝膠分率為2.5~30質量%，前述黏著劑層在23℃的儲存彈性模數(E’23℃)，為6.8×10 4~3.0×10 5Pa，前述黏著劑層在80℃的儲存彈性模數(E’80℃)與前述(E’23℃)滿足下述式(1)。 1.5≦(E’23℃)/(E’80℃)≦8.0．．．(1) ＜2＞如＜1＞記載之黏著帶，其中前述黏著劑層，進一步含有增黏劑(X)。 ＜3＞如＜1＞或＜2＞記載之黏著帶，其中前述黏著劑層，進一步含有天然橡膠成分(B)。 ＜4＞如＜3＞記載之黏著帶，其中前述天然橡膠成分(B)相對於前述黏著劑層的總質量之比例，為5~40質量%。 ＜5＞如＜3＞或＜4＞記載之黏著帶，其中前述黏著劑層中，相對於前述橡膠成分(A)、前述橡膠成分(B)、與前述接枝共聚物(C)的合計量，前述橡膠成分(A)的比例為50~70質量%，前述橡膠成分(B)的比例為1~30質量%，前述接枝共聚物(C)的比例為1~30質量%(但是，前述成分的合計量未超過100質量%)。 〔實施例〕 A more preferable embodiment of the adhesive tape of this embodiment is as follows. <1> An adhesive tape comprising: a base material containing polyvinyl chloride resin, and an adhesive layer provided on at least one side of the base material, wherein the adhesive layer contains cross-linked styrene. - Butadiene copolymer rubber (A1), styrene-butadiene rubber (A) and graft copolymer (C), the proportion of the aforementioned component (A1) relative to the total mass of the aforementioned adhesive layer is 4 ~40 mass%, the proportion of the aforementioned graft copolymer (C) is 5 to 40 mass%, the gel fraction of the aforementioned adhesive layer is 2.5 to 30 mass%, and the storage elastic modulus of the aforementioned adhesive layer at 23°C (E'23℃), is 6.8×10 4 ~3.0×10 5 Pa. The storage elastic modulus of the aforementioned adhesive layer at 80℃ (E'80℃) and the aforementioned (E'23℃) satisfy the following formula ( 1). 1.5≦(E'23℃)/(E'80℃)≦8.0． ． ． (1) <2> The adhesive tape according to <1>, wherein the adhesive layer further contains a tackifier (X). <3> The adhesive tape according to <1> or <2>, wherein the adhesive layer further contains a natural rubber component (B). <4> The adhesive tape according to <3>, wherein the proportion of the natural rubber component (B) to the total mass of the adhesive layer is 5 to 40 mass %. <5> The adhesive tape according to <3> or <4>, wherein in the adhesive layer, relative to the total of the rubber component (A), the rubber component (B), and the graft copolymer (C) The proportion of the aforementioned rubber component (A) is 50 to 70 mass%, the proportion of the aforementioned rubber component (B) is 1 to 30 mass%, and the proportion of the aforementioned graft copolymer (C) is 1 to 30 mass% (but , the total amount of the aforementioned components does not exceed 100 mass%). [Example]
以下，顯示實施例以詳細地說明本發明，但本發明未被以下記載所限定。Hereinafter, although an Example is shown and this invention is demonstrated in detail, this invention is not limited to the following description.
[實施例1] (黏著帶的製作) 對於100質量份的聚氯乙烯(大洋氯乙烯(股)製，產品名稱「TH-1000」，平均聚合度1,000)，摻合作為塑化劑(Y2)的45質量份的鄰苯二甲酸二異壬酯(DINP)、作為無機填充材料(Z)的3質量份的碳酸鈣、作為其他添加劑的2質量份的金屬系複合穩定劑及1質量份的潤滑劑以得到基材用樹脂組成物。利用班布里混合機，以各成分均勻地分散的方式將此基材用樹脂組成物熔融混練後，使用壓延成形機，在輥溫度165℃進行成形，得到厚度為160μm的基材。 [Example 1] (Production of adhesive tape) To 100 parts by mass of polyvinyl chloride (manufactured by Taiyang Vinyl Chloride Co., Ltd., product name "TH-1000", average degree of polymerization: 1,000), 45 parts by mass of diphthalate as a plasticizer (Y2) was blended. Isononyl ester (DINP), 3 parts by mass of calcium carbonate as the inorganic filler (Z), 2 parts by mass of a metal-based composite stabilizer as other additives, and 1 part by mass of a lubricant were used to obtain a resin composition for a base material . This base material resin composition was melted and kneaded using a Bambry mixer so that each component was uniformly dispersed, and then molded using a calender molding machine at a roll temperature of 165°C to obtain a base material with a thickness of 160 μm.
將作為苯乙烯-丁二烯橡膠(A)的35質量份的經交聯之苯乙烯-丁二烯共聚物橡膠(A1-1)(JSR(股)製，產品名稱「0533」)及35質量份的非交聯的苯乙烯-丁二烯共聚物橡膠(A2)(JSR(股)製，產品名稱「T-093A」)、作為橡膠成分(B)的15質量份的天然橡膠(Regitex(股)製，產品名稱「HA-LATEX」。凝膠分率：68%)、作為接枝共聚物(C)的15質量份的在天然橡膠中使甲基丙烯酸甲酯接枝共聚合而成之接枝聚合物乳膠(Regitex(股)製，產品名稱「MG-40S」)的混合物作為黏著劑成分使用。又，對於100質量份的前述黏著劑成分，摻合作為增黏劑(X)的100質量份的石油樹脂(荒川化學工業(股)製，產品名稱「AP-1100」)、作為塑化劑(Y1)的20質量份的鄰苯二甲酸二異壬酯(DINP)、作為其他添加劑的1質量份的界面活性劑(花王(股)製，產品名稱「OT-P」)及10質量份的抗氧化劑/塑化劑(三愛石油(股)製，產品名稱「DIEM」)、作為分散介質的水，得到黏著劑組成物的水系乳液。As the styrene-butadiene rubber (A), 35 parts by mass of cross-linked styrene-butadiene copolymer rubber (A1-1) (manufactured by JSR Co., Ltd., product name "0533") and 35 Parts by mass of non-crosslinked styrene-butadiene copolymer rubber (A2) (manufactured by JSR Co., Ltd., product name "T-093A"), and 15 parts by mass of natural rubber (Regitex) as the rubber component (B) Co., Ltd., product name "HA-LATEX". Gel fraction: 68%), 15 parts by mass of graft copolymer (C) obtained by graft copolymerizing methyl methacrylate in natural rubber. A mixture of graft polymer latex (manufactured by Regitex Co., Ltd., product name "MG-40S") was used as an adhesive component. Moreover, 100 parts by mass of petroleum resin (manufactured by Arakawa Chemical Industry Co., Ltd., product name "AP-1100") as a tackifier (X) and a plasticizer were blended with 100 parts by mass of the aforementioned adhesive component. (Y1) 20 parts by mass of diisononyl phthalate (DINP), 1 part by mass of surfactant (manufactured by Kao Co., Ltd., product name "OT-P") as other additives, and 10 parts by mass The antioxidant/plasticizer (manufactured by Sanai Petroleum Co., Ltd., product name "DIEM") and water as the dispersion medium were used to obtain an aqueous emulsion of the adhesive composition.
接著，在基材的一側的面上，利用凹版法塗布下塗劑(水系乳膠；E-TEC(股)製，產品名稱「KT-4612-A」)並使其乾燥，形成厚度0.5μm的下塗層。 在前述下塗層上，利用缺角輪法塗布前述黏著劑組成物的水系乳液，並使其乾燥，形成厚度為30μm的黏著劑層。針對得到之黏著帶，在以下條件下測定黏著劑層的凝膠分率、及(E’23℃)及(E’80℃)。結果黏著劑層的凝膠分率為12.1質量%。又，黏著劑層的(E’23℃)為1.3×10 5Pa，(E’80℃)為6.7×10 4Pa。又，(E’23℃)/(E’80℃)為2.0。接著，在以下條件下實施黏著劑層的酯值、自我背面黏著力、電線類的捆束性、及長時間保存試驗。將結果示於表1。 Next, a primer (water-based latex; product name "KT-4612-A" manufactured by E-TEC Co., Ltd.) was applied on one side of the base material by the gravure method and dried to form a 0.5 μm thick Lower coat. On the aforementioned lower coating layer, the aqueous emulsion of the aforementioned adhesive composition was applied using the notch wheel method and dried to form an adhesive layer with a thickness of 30 μm. For the obtained adhesive tape, the gel fraction, (E'23°C) and (E'80°C) of the adhesive layer were measured under the following conditions. As a result, the gel fraction of the adhesive layer was 12.1% by mass. Moreover, (E'23°C) of the adhesive layer was 1.3×10 5 Pa, and (E'80°C) was 6.7×10 4 Pa. Moreover, (E'23°C)/(E'80°C) is 2.0. Next, the ester value of the adhesive layer, the self-back adhesion, the bundling properties of electric wires, and the long-term storage test were carried out under the following conditions. The results are shown in Table 1.
＜黏著劑層的凝膠分率之測定方法＞ 從黏著帶削取0.1g(W0：[g])的構成黏著劑層之黏著劑組成物並使其浸漬於50mL的甲苯中。之後，利用振動機在溫度23℃、200rpm的條件下振動24小時。振動後，使用金屬網(開口#200網目)，將甲苯與吸收甲苯而膨潤之黏著劑組成物分離。使分離後的黏著劑組成物在110℃的條件下乾燥1小時。測定乾燥後包含金屬網之黏著劑組成物的重量(W1：[g])，由下述式(2)算出凝膠分率。 凝膠分率(重量%)=(W1-W2)/W0×100．．．(2) (W0：初始黏著劑組成物的重量(g)，W1：乾燥後包含金屬網之黏著劑組成物的重量(g)，W2：金屬網的初始重量(g)) ＜Measurement method of gel fraction of adhesive layer＞ 0.1 g (W0: [g]) of the adhesive composition constituting the adhesive layer was scraped from the adhesive tape and immersed in 50 mL of toluene. Thereafter, the vibrator was used to vibrate for 24 hours at a temperature of 23° C. and 200 rpm. After vibration, a metal mesh (opening #200 mesh) is used to separate toluene from the adhesive composition that absorbs toluene and swells. The separated adhesive composition was dried at 110° C. for 1 hour. The weight of the adhesive composition including the metal mesh after drying is measured (W1: [g]), and the gel fraction is calculated from the following formula (2). Gel fraction (weight%) = (W1-W2)/W0×100. ． ． (2) (W0: The weight of the initial adhesive composition (g), W1: The weight of the adhesive composition including the metal mesh after drying (g), W2: The initial weight of the metal mesh (g))
＜黏著劑層的儲存彈性模數之測定方法＞ 削取0.1g的構成黏著帶的黏著劑層之黏著劑組成物，成形為厚度1mm的片狀，製作儲存彈性模數測定用試樣。之後，使用動態彈性模數測定裝置(TA儀器公司製，產品名稱「ARES」)，在以下測定條件下測定前述試樣，算出(E’23℃)及(E’80℃)。 (測定條件) 測定起始溫度：-60℃ 測定結束溫度：120℃ 升溫速度：4℃/分鐘 頻率：1Hz ＜Measurement method of storage elastic modulus of adhesive layer＞ Cut off 0.1 g of the adhesive composition constituting the adhesive layer of the adhesive tape, shape it into a sheet with a thickness of 1 mm, and prepare a sample for storage elastic modulus measurement. Thereafter, the aforementioned sample was measured under the following measurement conditions using a dynamic elastic modulus measuring device (manufactured by TA Instruments, product name "ARES"), and (E' 23°C) and (E' 80°C) were calculated. (Measurement conditions) Determination starting temperature: -60℃ Measurement end temperature: 120℃ Heating rate: 4℃/min Frequency: 1Hz
＜黏著劑層的酯值之測定方法＞ 依據JIS K0070(1992年)，利用中和滴定法測定皂化值及酸值，由以下式(3)算出酯值。具體而言，使用刮勺等從黏著帶的黏著劑層採取1g的樣品，測定前述樣品的皂化值與酸值。 酯值(mgKOH/g)=皂化值(mgKOH/g)-酸值(mgKOH/g)．．．(3) ＜Measurement method of ester value of adhesive layer＞ According to JIS K0070 (1992), the saponification value and acid value are measured using the neutralization titration method, and the ester value is calculated from the following formula (3). Specifically, a 1 g sample is taken from the adhesive layer of the adhesive tape using a spatula, etc., and the saponification value and acid value of the sample are measured. Ester value (mgKOH/g) = saponification value (mgKOH/g) - acid value (mgKOH/g). ． ． (3)
＜黏著帶的自我背面黏著力評價＞ 依照JIS Z 0237進行測定。具體而言，首先將寬度10mm的樣品帶靜置在設定為溫度23±2℃、濕度50±5%RH之評價試驗室內24小時以上。老化後，在厚度1mm的金屬板上貼合長度150mm的樣品帶，製作自我背面測定用的基材面樣品。之後，準備長度150mm的樣品帶，將其黏著劑層面貼合在自我背面測定用的基材面上後，以5mm/s的速度使重量2,000g的滾筒來回1次以進行貼合。從貼合開始20分鐘後，使用拉伸試驗機(島津製作所(股)製，產品名稱「Autograph AGX」)，測定膠帶黏著面與膠帶基材面之間的180度剝離強度(N/10mm)。又，依照以下評價基準進行評價，將B評價以上評為合格。 (評價基準) A：自我背面黏著力為2.4N/10mm以上。 B：自我背面黏著力為1.6N/10mm以上且未達2.4N/10mm。 C：自我背面黏著力未達1.6N/10mm。 ＜Evaluation of self-back adhesion of adhesive tape＞ Measurement was performed in accordance with JIS Z 0237. Specifically, first, a sample tape with a width of 10 mm was left undisturbed in an evaluation test chamber set to a temperature of 23±2°C and a humidity of 50±5%RH for more than 24 hours. After aging, a sample tape with a length of 150 mm was bonded to a metal plate with a thickness of 1 mm to prepare a base material surface sample for self-back measurement. After that, a sample tape with a length of 150 mm is prepared, and the adhesive layer is bonded to the surface of the base material for self-back measurement. The roller weighing 2,000 g is reciprocated once at a speed of 5 mm/s to perform bonding. 20 minutes after the start of lamination, use a tensile testing machine (manufactured by Shimadzu Corporation, product name "Autograph AGX") to measure the 180-degree peel strength (N/10mm) between the adhesive surface of the tape and the tape base material surface. . Moreover, evaluation was performed based on the following evaluation standards, and B evaluation or above was evaluated as passing. (evaluation criteria) A: The self-back adhesive force is above 2.4N/10mm. B: Self-back adhesive force is 1.6N/10mm or more and less than 2.4N/10mm. C: The self-back adhesive force does not reach 1.6N/10mm.
＜電線類的捆束性評價＞ 在10根電線(住友電裝(股)製，產品名稱「AVX0.5f」)上，以半纏繞狀捲繞黏著帶。又，捲繞時以目視評價有無膠帶的剝離，依照以下評價基準評價捆束性。此外，將B評價以上評為合格。 (評價基準) A：捲繞時即使不以手按壓膠帶，膠帶仍不會剝離而可捲繞。 B：捲繞時藉由以手按壓膠帶，膠帶不會剝離而可捲繞。 C：捲繞時即使以手按壓膠帶，膠帶仍會剝離，無法捲繞。 ＜Evaluation of Bundling Properties of Electric Wires＞ An adhesive tape is wound around 10 wires (manufactured by Sumitomo Electric Co., Ltd., product name "AVX0.5f") in a semi-wound shape. In addition, the presence or absence of tape peeling was visually evaluated during winding, and the bundling properties were evaluated based on the following evaluation criteria. In addition, a B rating or above was rated as pass. (evaluation criteria) A: Even if you do not press the tape with your hands during winding, the tape will not peel off and can be wound. B: By pressing the tape with your hands during winding, the tape can be wound without peeling off. C: Even if you press the tape with your hands during winding, the tape will peel off and cannot be wound.
＜黏著帶的長時間保存試驗評價＞ 評價在60℃的條件下保存黏著帶10天後的膠帶側面的黏性。依照以下評價基準進行評價，將B評價以上評為合格。 (評價基準) A：膠帶側面完全沒有黏性。 B：膠帶側面有些微黏性。 C：膠帶側面有黏性。 ＜Long-term storage test evaluation of adhesive tape＞ The adhesive tape side was evaluated after storing the adhesive tape at 60°C for 10 days. Evaluate based on the following evaluation criteria, and grade B or above as passing. (evaluation criteria) A: The sides of the tape are not sticky at all. B: The side of the tape is slightly sticky. C: The tape is sticky on the side.
＜黏著帶的綜合評價＞ 依據黏著帶的自我背面黏著力、電線類的捆束性評價、及長時間保存試驗評價，依照以下基準進行黏著帶的綜合評價。又，將B評價以上評為合格。 (評價基準) A：自我背面黏著力、電線類的捆束性、及長時間保存試驗皆為A評價。 B：自我背面黏著力、電線類的捆束性、或長時間保存試驗的1個以上為B評價。 C：自我背面黏著力、電線類的捆束性、及長時間保存試驗的1個以上為C評價。 ＜Comprehensive evaluation of adhesive tape＞ Based on the self-back adhesion of the adhesive tape, the bundling properties of wires, and the long-term storage test evaluation, the adhesive tape is comprehensively evaluated according to the following standards. Moreover, it was rated as passing with B evaluation or above. (evaluation criteria) A: The self-back adhesion, wire bundling properties, and long-term storage tests were all rated A. B: One or more of the self-back adhesion, bundling properties of wires, or long-term storage tests are evaluated as B. C: One or more of the self-back adhesion, wire bundling properties, and long-term storage tests were evaluated as C.
[實施例2~26、及比較例1~6] 將基材用樹脂組成物及黏著劑組成物的組成、及各層的厚度如表1~2表示般設定，除此之外，利用與實施例1相同的方法得到黏著帶。針對各黏著帶，利用與實施例1相同的方法，測定黏著劑層的凝膠分率、(E’23℃)及(E’80℃)。又，利用與實施例1相同的方法，評價黏著劑層的酯值、自我背面黏著力、電線類的捆束性、及長時間保存試驗。將結果示於表1~2。 [Examples 2 to 26 and Comparative Examples 1 to 6] Except that the compositions of the base material resin composition and the adhesive composition, and the thickness of each layer were set as shown in Tables 1 to 2, an adhesive tape was obtained in the same manner as in Example 1. For each adhesive tape, the gel fraction, (E'23°C) and (E'80°C) of the adhesive layer were measured using the same method as Example 1. In addition, the ester value of the adhesive layer, the self-back adhesive force, the bundling properties of electric wires, and the long-term storage test were evaluated in the same manner as in Example 1. The results are shown in Tables 1 to 2.
表1~2中記載的原材料的詳細內容如下。The details of the raw materials listed in Tables 1 to 2 are as follows.
[黏著劑層] ＜橡膠成分(A)＞ 橡膠成分(A1-1)：經交聯之苯乙烯-丁二烯共聚物橡膠(JSR(股)製，產品名稱「533」。凝膠分率：81質量%，苯乙烯率：33質量%)。 橡膠成分(A1-2)：經交聯之苯乙烯-丁二烯共聚物橡膠(JSR(股)製，產品名稱「0113」。凝膠分率：80質量%，苯乙烯率：33質量%)。 橡膠成分(A1-3)：經交聯之苯乙烯-丁二烯共聚物橡膠(JSR(股)製，產品名稱「0545」。凝膠分率：85質量%，苯乙烯率：45質量%)。 橡膠成分(A1-4)：經交聯之苯乙烯-丁二烯共聚物橡膠(JRS(股)製，產品名稱「LX-426」。凝膠分率：80質量%，苯乙烯率：33質量%)。 橡膠成分(A2)：非交聯的苯乙烯-丁二烯共聚物橡膠(JSR(股)製，產品名稱「T-093A」。凝膠分率：0質量%，苯乙烯率：35質量%)。 ＜橡膠成分(B)＞ 天然橡膠：Regitex(股)製，產品名稱「HA-LATEX」(凝膠分率：68質量%)。 ＜接枝共聚物(C)＞ 在天然橡膠中使甲基丙烯酸甲酯接枝共聚合而成之接枝聚合物乳膠：Regitex(股)製，產品名稱「MG-40S」。 ＜塑化劑(Y1)＞ 鄰苯二甲酸二異壬酯：J-PLUS(股)製，產品名稱「DINP」。 偏苯三甲酸三辛酯：J-PLUS(股)製，產品名稱「TOTM」。 己二酸聚酯：DIC(股)，產品名稱「Polycizer(註冊商標)W-2050」(Mw：2300)。 ＜增黏劑(X)＞ 石油樹脂：C5C9系石油樹脂(荒川化學工業(股)製，產品名稱「AP-1100」)。 萜烯酚：荒川化學工業(股)製，產品名稱「E-200」。 ＜其他添加劑＞ 界面活性劑：二烷基磺酸基琥珀酸鈉(花王(股)製，產品名稱「Pelex(註冊商標)OT-P」)。 抗氧化劑/塑化劑：酚-硫系抗氧化劑/DINP(三愛石油(股)製，產品名稱「DIEM」)。 [Adhesive layer] ＜Rubber component (A)＞ Rubber component (A1-1): Cross-linked styrene-butadiene copolymer rubber (manufactured by JSR Co., Ltd., product name "533"). Gel fraction: 81 mass%, styrene fraction: 33 mass% ). Rubber component (A1-2): Cross-linked styrene-butadiene copolymer rubber (manufactured by JSR Co., Ltd., product name "0113"). Gel fraction: 80 mass%, styrene fraction: 33 mass% ). Rubber component (A1-3): Cross-linked styrene-butadiene copolymer rubber (manufactured by JSR Co., Ltd., product name "0545"). Gel fraction: 85 mass%, styrene fraction: 45 mass% ). Rubber component (A1-4): Cross-linked styrene-butadiene copolymer rubber (manufactured by JRS Co., Ltd., product name "LX-426"). Gel fraction: 80 mass%, styrene fraction: 33 mass%). Rubber component (A2): Non-crosslinked styrene-butadiene copolymer rubber (manufactured by JSR Co., Ltd., product name "T-093A"). Gel fraction: 0% by mass, styrene fraction: 35% by mass ). ＜Rubber component (B)＞ Natural rubber: Made by Regitex Co., Ltd., product name "HA-LATEX" (gel fraction: 68 mass%). ＜Graft copolymer (C)＞ Graft polymer latex obtained by graft copolymerizing methyl methacrylate in natural rubber: manufactured by Regitex Co., Ltd., product name "MG-40S". ＜Plasticizer(Y1)＞ Diisononyl phthalate: manufactured by J-PLUS Co., Ltd., product name "DINP". Trioctyl trimellitate: manufactured by J-PLUS Co., Ltd., product name "TOTM". Adipic acid polyester: DIC Co., Ltd., product name "Polycizer (registered trademark) W-2050" (Mw: 2300). ＜Tackifier (X)＞ Petroleum resin: C5C9 series petroleum resin (manufactured by Arakawa Chemical Industry Co., Ltd., product name "AP-1100"). Terpene phenol: manufactured by Arakawa Chemical Industry Co., Ltd., product name "E-200". ＜Other additives＞ Surfactant: Sodium dialkyl sulfosuccinate (manufactured by Kao Co., Ltd., product name "Pelex (registered trademark) OT-P"). Antioxidant/plasticizer: phenol-sulfur antioxidant/DINP (manufactured by Sanai Petroleum Co., Ltd., product name "DIEM").
[基材] ＜聚氯乙烯樹脂＞ 聚氯乙烯1：聚氯乙烯(平均聚合度700)(大洋氯乙烯(股)製，產品名稱「TH-700」)。 聚氯乙烯2：聚氯乙烯(平均聚合度1000)(大洋氯乙烯(股)製，產品名稱「TH-1000」)。 聚氯乙烯3：聚氯乙烯(平均聚合度1300)(大洋氯乙烯(股)製，產品名稱「TH-1300」)。 聚氯乙烯4：聚氯乙烯(平均聚合度1800)(大洋氯乙烯(股)製，產品名稱「TH-1800」)。 ＜塑化劑(Y2)＞ 鄰苯二甲酸二異壬酯：J-PLUS(股)製，產品名稱「DINP」。 偏苯三甲酸三辛酯：J-PLUS(股)製，產品名稱「TOTM」。 己二酸聚酯：DIC(股)，產品名稱「Polycizer W-2050」(Mw：2,300)。 ＜無機填充材料(Z)＞ 水滑石：協和化學工業(股)製，產品名稱「Alcamizer(註冊商標)1」(平均粒徑：0.62μm)。 滑石：日本滑石(股)製，產品名稱「P-8」(平均粒徑：2.8μm)。 雲母：山口雲母(股)製，產品名稱「SJ-005」(平均粒徑：5μm)。 碳酸鈣：神島化學工業(股)製，產品名稱「Calseeds(註冊商標)P」(平均粒徑：0.18μm)。 ＜其他添加劑＞ 金屬系複合穩定劑：Ca-Zn-Mg系複合穩定劑(堺化學工業(股)製，產品名稱「OW-5200」)。 潤滑劑：硬脂酸(日油(股)製，產品名稱「Stearic Acid Sakura」)。 [Substrate] ＜Polyvinyl chloride resin＞ Polyvinyl chloride 1: Polyvinyl chloride (average degree of polymerization 700) (manufactured by Ocean Vinyl Chloride Co., Ltd., product name "TH-700"). Polyvinyl chloride 2: Polyvinyl chloride (average degree of polymerization 1000) (manufactured by Ocean Vinyl Chloride Co., Ltd., product name "TH-1000"). Polyvinyl chloride 3: Polyvinyl chloride (average degree of polymerization 1300) (manufactured by Ocean Vinyl Chloride Co., Ltd., product name "TH-1300"). Polyvinyl chloride 4: Polyvinyl chloride (average degree of polymerization 1800) (manufactured by Ocean Vinyl Chloride Co., Ltd., product name "TH-1800"). ＜Plasticizer(Y2)＞ Diisononyl phthalate: manufactured by J-PLUS Co., Ltd., product name "DINP". Trioctyl trimellitate: manufactured by J-PLUS Co., Ltd., product name "TOTM". Adipic acid polyester: DIC Co., Ltd., product name "Polycizer W-2050" (Mw: 2,300). ＜Inorganic filler material(Z)＞ Hydrotalcite: manufactured by Kyowa Chemical Industry Co., Ltd., product name "Alcamizer (registered trademark) 1" (average particle size: 0.62 μm). Talc: manufactured by Nippon Talc Co., Ltd., product name "P-8" (average particle size: 2.8 μm). Mica: Made by Yamaguchi Mica Co., Ltd., product name "SJ-005" (average particle size: 5 μm). Calcium carbonate: manufactured by Kamijima Chemical Industry Co., Ltd., product name "Calseeds (registered trademark) P" (average particle size: 0.18 μm). ＜Other additives＞ Metal-based composite stabilizer: Ca-Zn-Mg-based composite stabilizer (manufactured by Sakai Chemical Industry Co., Ltd., product name "OW-5200"). Lubricant: stearic acid (manufactured by NOF Co., Ltd., product name "Stearic Acid Sakura").
[下塗層] 水系乳膠：在天然橡膠中使MMA接枝共聚合而成之接枝天然橡膠與丙烯腈-丁二烯共聚物乳液的混合物(E-TEC(股)製，產品名稱「KT-4612-A」)。 [Undercoat] Water-based latex: A mixture of grafted natural rubber and acrylonitrile-butadiene copolymer emulsion obtained by graft copolymerizing MMA in natural rubber (manufactured by E-TEC Co., Ltd., product name "KT-4612-A" ).
[表1]
[表2]
如表1~2所示，本實施形態之黏著帶，即使長時間保存後，膠帶側面的黏性仍少，且具有用以將電線類捆束之優異的黏著力。另一方面，未滿足本實施形態之黏著劑層的凝膠分率及儲存彈性模數的任一要件之比較例1~6的黏著帶，黏著力、電線類的捆束性、或長時間保存後的膠帶側面的黏性的任一者不佳，無法改善本申請案的課題。 由以上的結果，確認了根據本實施形態之黏著帶與其製造方法，可得到即使長時間保存，膠帶側面的黏性仍少，且具有用以將電線、纜線等對象物捆束之優異的黏著力之黏著帶。 〔產業上的可利用性〕 As shown in Tables 1 and 2, the adhesive tape of this embodiment has less stickiness on the side of the tape even after being stored for a long time, and has excellent adhesive force for bundling electric wires. On the other hand, the adhesive tapes of Comparative Examples 1 to 6, which did not satisfy any of the gel fraction and storage elastic modulus requirements of the adhesive layer of this embodiment, had poor adhesion, binding properties for wires, or long-term performance. The adhesive tape on both sides after storage is not good, and the problem of this application cannot be improved. From the above results, it was confirmed that according to the adhesive tape and its manufacturing method according to the present embodiment, even if the tape is stored for a long time, the stickiness on the side of the tape is small, and it has excellent properties for binding objects such as wires and cables. Adhesive tape. [Industrial availability]
本實施形態之黏著帶，即使長時間保存，膠帶側面的黏性仍少，且具有用以將電線、纜線等對象物捆束之優異的黏著力。這樣的黏著帶，能夠適合作為用以捆束、保護配置在汽車等中之電線類的膠帶利用。The adhesive tape of this embodiment has less stickiness on the sides of the tape even if it is stored for a long time, and has excellent adhesive force for binding objects such as wires and cables. Such an adhesive tape can be suitably used as a tape for bundling and protecting electric wires installed in automobiles and the like.
Claims (26)
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| JPS6049235B2 (en) * | 1979-08-18 | 1985-10-31 | 日東電工株式会社 | pressure sensitive adhesive tape |
| JP3366020B2 (en) * | 1992-07-24 | 2003-01-14 | 矢崎総業株式会社 | Manufacturing method of adhesive tape |
| CA2213243C (en) * | 1995-02-16 | 2006-11-07 | Minnesota Mining And Manufacturing Company | Acrylic pressure-sensitive adhesive |
| JP2003217355A (en) * | 2002-01-18 | 2003-07-31 | Sumitomo Wiring Syst Ltd | Wire harness protection material and wire harness using this |
| JP5964073B2 (en) * | 2011-05-26 | 2016-08-03 | 日東電工株式会社 | Water-dispersed pressure-sensitive adhesive composition, pressure-sensitive adhesive, and pressure-sensitive adhesive sheet |
| JP6306679B2 (en) * | 2012-07-31 | 2018-04-04 | 日東電工株式会社 | Radiation curable adhesive, radiation curable adhesive layer, radiation curable adhesive sheet and laminate |
| TWI714815B (en) * | 2016-12-26 | 2021-01-01 | 日商迪愛生股份有限公司 | Articles, article manufacturing methods and void filling methods |
| CN112789335B (en) * | 2018-10-01 | 2023-04-28 | 电化株式会社 | Adhesive sheet |
| US20230340307A1 (en) * | 2020-08-28 | 2023-10-26 | Sekisui Chemical Co., Ltd. | Compound, method for producing compound, adhesive composition and adhesive tape |
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