TW202343155A - Printing system and method for producing electric component mounting substrate having functional pattern - Google Patents
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Abstract
Description
本發明有關一種印刷系統、及具有功能性圖案的電氣零件安裝基板的製造方法，特別有關一種在安裝有電氣零件的基板上形成功能性圖案的技術。The present invention relates to a printing system and a method of manufacturing an electrical component mounting substrate with functional patterns, and in particular to a technology for forming functional patterns on a substrate mounted with electrical components.
藉由印刷在基板上形成圖案時，可以對表示圖案的圖像資料進行補正。例如，在專利文獻1中記載了用攝影機拍攝載置在載物台上的基板，根據基板的圖像檢測基板的斜率，根據檢測出的斜率補正圖像資料的技術。When a pattern is formed on a substrate by printing, the image data representing the pattern can be corrected. For example, Patent Document 1 describes a technique for photographing a substrate placed on a stage with a camera, detecting the slope of the substrate based on the image of the substrate, and correcting the image data based on the detected slope.
[專利文獻1]日本特開2021-021782號公報[Patent Document 1] Japanese Patent Application Publication No. 2021-021782
但是，專利文獻1所記載的技術存在只能適用於未安裝電氣零件的基板的缺點。安裝有電氣零件時，除了斜率之外，還需要對應電氣零件的高度方向的資訊、電氣零件的安裝位置、電氣零件下方的間隙及電氣零件的懸垂形狀。However, the technology described in Patent Document 1 has the disadvantage that it can only be applied to a substrate on which electrical components are not mounted. When electrical parts are installed, in addition to the slope, information corresponding to the height direction of the electrical parts, the installation position of the electrical parts, the gap below the electrical parts, and the overhang shape of the electrical parts are also required.
本發明係鑑於上述情況而完成者，其目的為提供一種用於通過利用安裝在電氣零件安裝基板上的電氣零件的觀察資料來形成功能性圖案的印刷系統、及具有功能性圖案的電氣零件安裝基板的製造方法。The present invention was made in view of the above circumstances, and an object thereof is to provide a printing system for forming a functional pattern using observation data of an electrical component mounted on an electrical component mounting substrate, and an electrical component mounting device having a functional pattern. Method of manufacturing substrate.
用於實現上述目的之印刷系統的一態樣為包含印刷裝置、攝影機及圖案資料生成裝置的印刷系統，其具備：噴液頭，具有吐出功能性液體的噴嘴；及相對移動機構，使噴液頭和安裝在電氣零件上的電氣零件安裝基板向相對移動方向相對移動，使噴液頭和電氣零件安裝基板相對移動，根據圖案資料從噴液頭吐出功能性液體在電氣零件安裝基板上形成功能性圖案，攝影機生成電氣零件安裝基板的觀察資料，圖案資料生成裝置具備：至少1個處理器；及至少1個記憶體，記憶使用至少1個處理器而執行之命令，其中，至少1個處理器執行命令以獲得電氣零件安裝基板的觀察資料中的至少安裝在電氣零件安裝基板上的電氣零件的觀察資料，根據電氣零件的觀察資料生成表示功能性圖案的圖案資料。根據本形態，可以根據觀察到的電氣零件的資訊形成功能性圖案。One aspect of the printing system used to achieve the above purpose is a printing system including a printing device, a camera, and a pattern data generating device. It is equipped with: a liquid ejection head having a nozzle that spits out functional liquid; and a relative movement mechanism that ejects the liquid. The head and the electrical component mounting substrate mounted on the electrical component move relative to each other in the relative movement direction, causing the liquid ejection head and the electrical component mounting substrate to move relative to each other. The functional liquid is ejected from the liquid ejection head based on the pattern data to form a function on the electrical component mounting substrate. Characteristic pattern, the camera generates observation data of the electrical component mounting substrate, the pattern data generation device has: at least 1 processor; and at least 1 memory, which stores commands executed using at least 1 processor, of which at least 1 processor The server executes the command to obtain observation data of at least the electrical components mounted on the electrical component mounting substrate among the observation data of the electrical component mounting substrate, and generates pattern data representing the functional pattern based on the observation data of the electrical components. According to this aspect, functional patterns can be formed based on observed information on electrical components.
至少1個處理器確定電氣零件的零件名稱、型號及形狀中的至少1個為較佳。由此，可以根據特定的資訊形成功能性圖案。電氣零件的零件名稱、型號及形狀中的至少1個的特定可以利用人工智能提高判斷精確度。It is preferable that at least one processor determines at least one of the part name, model and shape of the electrical component. Thus, functional patterns can be formed based on specific information. Artificial intelligence can be used to improve the accuracy of judgment by specifying at least one of the part name, model, and shape of an electrical component.
至少1個處理器根據電氣零件的形狀來決定噴液頭吐出的功能性液體的賦予量為較佳。可以形成根據電氣零件的形狀之功能性圖案。例如，對於與電氣零件安裝基板之間具有間隙的形狀的電氣零件、具有懸垂形狀的電氣零件，可以增加功能性液體的賦予量。It is preferable that at least one processor determines the amount of functional liquid to be ejected from the liquid ejection head based on the shape of the electrical component. Functional patterns based on the shape of electrical components can be formed. For example, the amount of functional liquid added can be increased for electrical components having a shape with a gap from the electrical component mounting substrate or electrical components having an overhanging shape.
至少1個處理器根據電氣零件的特性來決定賦予功能性液體的區域為較佳。由此，可以形成根據電氣零件的特性之功能性圖案。例如，對於賦予功能性液體不理想的溫濕度感測器、連接器等的電氣零件可以形成不賦予功能性液體的功能性圖案。It is preferable that at least one processor determines the area to which functional liquid is added based on the characteristics of the electrical component. Thereby, a functional pattern according to the characteristics of the electrical component can be formed. For example, for electrical components such as temperature and humidity sensors and connectors that are not ideal for adding functional liquid, functional patterns without adding functional liquid can be formed.
印刷裝置使噴液頭與電氣零件安裝基板多次相對移動，形成由複數層功能性油墨構成的功能性圖案，至少1個處理器根據賦予了功能性液體的電氣零件安裝基板的觀察資料，生成圖案資料為較佳。藉此，能夠與功能性液體的賦予狀態對應地生成圖案資料。The printing device moves the liquid ejection head and the electrical component mounting substrate relative to each other multiple times to form a functional pattern composed of multiple layers of functional ink. At least one processor generates a pattern based on the observation data of the electrical component mounting substrate to which the functional liquid has been added. Pattern information is better. Thereby, pattern data can be generated in accordance with the supplied state of the functional liquid.
至少1個處理器生成將功能性液體賦予到電氣零件安裝基板的功能性液體不足的區域的圖案資料為較佳。藉此，能夠在功能性液體不足的區域補充功能性液體。It is preferable that at least one processor generates pattern data for applying functional liquid to a functional liquid-deficient area of the electrical component mounting substrate. Thereby, the functional liquid can be replenished in the area where the functional liquid is insufficient.
至少1個處理器在電氣零件安裝基板的賦予了功能性液體的位置僅偏移偏差量時，根據偏差量生成將位置偏移的圖案資料為較佳。藉此，可以減少偏差量賦予功能性液體。When at least one processor shifts the position of the electrical component mounting substrate to which the functional liquid is provided by only the deviation amount, it is preferable to generate pattern data that shifts the position based on the deviation amount. Thereby, the amount of deviation can be reduced and the functional liquid can be provided.
至少1個處理器根據藉由第1次的相對移動賦予了功能性液體的電氣零件安裝基板的觀察資料，生成位置偏移的圖案資料為較佳。藉此，容易在觀察資料中以光澤判斷偏差，進而能夠將偏移賦予的功能性液體的量控制在最小限度。It is preferable that at least one processor generates positional shift pattern data based on observation data of the electrical component mounting substrate to which the functional liquid has been imparted through the first relative movement. This makes it easy to determine the deviation in the observation data based on the gloss, and further allows the amount of functional liquid to be added to the deviation to be controlled to a minimum.
功能性液體為藉由照射紫外線而硬化的紫外線硬化型油墨為較佳。藉此，可以適當地形成功能性圖案。The functional liquid is preferably an ultraviolet curable ink that is cured by irradiation with ultraviolet rays. Thereby, functional patterns can be formed appropriately.
相對移動機構使攝影機和電氣零件安裝基板向相對移動方向相對移動，印刷裝置使攝影機和電氣零件安裝基板相對移動，使攝影機拍攝電氣零件安裝基板。藉此，可以藉由1次的相對移動來實施油墨的賦予和攝影機的拍攝。The relative movement mechanism moves the camera and the electrical component mounting board relative to each other in the relative movement direction, and the printing device moves the camera and the electrical component mounting board relative to each other, causing the camera to photograph the electrical component mounting board. Thereby, the application of ink and the shooting of the camera can be performed with one relative movement.
用於實現上述目的之電氣零件安裝基板的製造方法的一態樣為具有功能性圖案的電氣零件安裝基板的製造方法，使具有吐出功能性液體的噴嘴的噴液頭和安裝在電氣零件上的電氣零件安裝基板向相對移動方向相對移動，根據表示功能性圖案的圖案資料，從噴液頭吐出功能性液體在電氣零件安裝基板上賦予功能性液體，對賦予了功能性液體的電氣零件安裝基板進行拍攝生成電氣零件的觀察資料，根據電氣零件的觀察資料生成對圖案資料進行補正的補正圖案資料，使噴液頭和電氣零件安裝基板向相對移動方向相對移動，根據補正圖案資料從噴液頭吐出功能性液體在電氣零件安裝基板上賦予功能性液體。根據本形態，可以根據觀察到的電氣零件的資訊形成功能性圖案。 [發明效果] One aspect of the method of manufacturing an electrical component mounting substrate for achieving the above object is a method of manufacturing an electrical component mounting substrate having a functional pattern, using a liquid ejection head having a nozzle for ejecting functional liquid and a liquid ejection head mounted on an electrical component. The electrical component mounting substrate moves relatively in the relative movement direction, and functional liquid is ejected from the liquid ejection head based on the pattern data indicating the functional pattern, and the functional liquid is applied to the electrical component mounting substrate. Photographing is performed to generate observation data of the electrical parts, and correction pattern data that corrects the pattern data is generated based on the observation data of the electrical parts, so that the liquid ejection head and the electrical component mounting substrate are relatively moved in the relative movement direction, and the liquid ejection head and the electrical component mounting substrate are relatively moved in the relative movement direction based on the correction pattern data. The functional liquid is discharged and applied to the electrical component mounting substrate. According to this aspect, functional patterns can be formed based on observed information on electrical components. [Effects of the invention]
根據本發明，可以根據觀察到的電氣零件的資訊形成功能性圖案。According to the present invention, functional patterns can be formed based on observed information on electrical components.
以下，按照圖式對本發明的較佳實施形態詳細地進行說明。在本說明書中，對相同的構成要素標註相同的參照符號，並且適當地省略重複說明。Hereinafter, preferred embodiments of the present invention will be described in detail based on the drawings. In this specification, the same components are denoted by the same reference numerals, and repeated descriptions are appropriately omitted.
[電氣零件安裝基板的結構] 圖1係功能性圖案形成基板的斜視圖。在該圖所示之功能性圖案形成基板1000中，對印刷配線基板1002的零件安裝面1004，應用安裝有IC1006、電阻器1008及電容器1010之電氣零件安裝基板1003。 [Structure of electrical parts mounting board] FIG. 1 is a perspective view of a functional pattern forming substrate. In the functional pattern forming substrate 1000 shown in this figure, an electrical component mounting substrate 1003 on which an IC 1006, a resistor 1008 and a capacitor 1010 are mounted is applied to the component mounting surface 1004 of a printed wiring substrate 1002.
又，在功能性圖案形成基板1000中，在包含電氣零件安裝基板1003的IC1006的區域形成有導電圖案1020。又，在功能性圖案形成基板1000中，在導電圖案1020的內部（電氣零件安裝基板1003與導電圖案1020之間）形成有絕緣圖案1022。Furthermore, in the functional pattern forming substrate 1000, the conductive pattern 1020 is formed in a region including the IC 1006 of the electrical component mounting substrate 1003. Furthermore, in the functional pattern forming substrate 1000, the insulating pattern 1022 is formed inside the conductive pattern 1020 (between the electrical component mounting substrate 1003 and the conductive pattern 1020).
在圖1中例示了將印刷配線基板1002的一個表面作為零件安裝面1004之態樣，但亦可以將印刷配線基板1002的另一表面作為零件安裝面，亦可以將印刷配線基板1002的一個表面及另一表面這兩個表面均作為零件安裝面。FIG. 1 illustrates an aspect in which one surface of the printed wiring board 1002 is used as the component mounting surface 1004. However, the other surface of the printed wiring board 1002 may be used as a component mounting surface, or one surface of the printed wiring board 1002 may be used. and another surface. Both surfaces serve as mounting surfaces for parts.
IC1006係使用樹脂等封裝體構成外圍且內部設置有積體電路之電氣零件。又，IC1006具有電極露出於封裝體的外部之結構。再者，電氣零件有時可稱為電氣零件或簡稱為零件。IC1006 is an electrical component that uses a resin or other package to form the outer periphery and has an integrated circuit inside. In addition, IC1006 has a structure in which electrodes are exposed outside the package. Furthermore, electrical parts may sometimes be called electrical parts or simply parts.
又，電阻器1008能夠包括電阻陣列1008A，在該電阻陣列1008A中複數個電阻元件被積體化且使用樹脂等封裝體成為一體化。電容器1010能夠包括電解電容器及陶瓷電容器等各種電容器。Furthermore, the resistor 1008 can include a resistor array 1008A in which a plurality of resistive elements are integrated and integrated using a package such as resin. The capacitor 1010 can include various capacitors such as electrolytic capacitors and ceramic capacitors.
絕緣圖案1022係對絕緣圖案1022的形成區域從噴墨頭吐出絕緣油墨的液滴，並使絕緣油墨的連續體乾燥及硬化來形成。The insulating pattern 1022 is formed by ejecting droplets of insulating ink from an inkjet head to the area where the insulating pattern 1022 is formed, and drying and hardening a continuous body of insulating ink.
導電圖案1020係對導電圖案1020的形成區域從噴墨頭吐出導電油墨的液滴，並使導電油墨的連續體乾燥及硬化來形成。The conductive pattern 1020 is formed by ejecting droplets of conductive ink from an inkjet head to the formation area of the conductive pattern 1020 and drying and hardening a continuous body of conductive ink.
導電圖案1020作為電磁波屏蔽發揮作用，以抑制由IC1006接收之電磁波及抑制從IC1006發射之電磁波為目的。絕緣圖案1022作為確保導電圖案1020與IC1006的電絕緣之絕緣構件、確保導電圖案1020與IC1006的密接性之接著構件及確保導電圖案1020的基底的平坦性之構件等發揮作用。The conductive pattern 1020 functions as an electromagnetic wave shield for the purpose of suppressing electromagnetic waves received by the IC 1006 and suppressing electromagnetic waves emitted from the IC 1006 . The insulating pattern 1022 functions as an insulating member that ensures electrical insulation between the conductive pattern 1020 and the IC 1006 , an adhesive member that ensures adhesion between the conductive pattern 1020 and the IC 1006 , a member that ensures the flatness of the base of the conductive pattern 1020 , and the like.
未形成導電圖案1020的區域並配置有不需要電磁波屏蔽之電氣零件之零件區域中的至少一部分可以使用絕緣油墨被覆。不需要電磁波屏蔽之電氣零件能夠包括二極體、線圈、變壓器及開關等。又，對於未安裝有電氣零件且配置有露出之電極1009之電極區域，可以使用絕緣油墨被覆。At least part of the component area where the conductive pattern 1020 is not formed and where electrical components that do not require electromagnetic wave shielding are disposed may be covered with insulating ink. Electrical components that do not require electromagnetic wave shielding can include diodes, coils, transformers, switches, etc. In addition, the electrode area where the electrical parts are not installed and where the exposed electrode 1009 is disposed can be covered with insulating ink.
導電油墨係在經硬化之狀態下作為導體發揮作用之液體，作為一例，可舉出將金屬等具有導電性之粒子分散於溶劑中而得之液體。絕緣油墨係在經硬化之狀態下發揮絕緣性能之液體，作為一例，可舉出將樹脂等具有絕緣性之粒子分散於溶劑中而得之液體。Conductive ink is a liquid that functions as a conductor in a cured state. An example of the conductive ink is a liquid obtained by dispersing conductive particles such as metal in a solvent. The insulating ink is a liquid that exhibits insulating properties in a hardened state. An example of the insulating ink is a liquid obtained by dispersing insulating particles such as resin in a solvent.
[功能性圖案形成基板的製造製程] 圖2係表示功能性圖案形成基板的製造製程的順序的一例之流程圖。在該圖圖示了應用於功能性圖案形成基板1000的製造製程的各步驟之裝置的例子。在該圖所示之箭頭線表示成為功能性圖案形成基板1000之印刷配線基板1002或電氣零件安裝基板1003的流動。 [Manufacturing process of functional pattern forming substrate] FIG. 2 is a flowchart showing an example of the procedure of a manufacturing process of a functional pattern forming substrate. This figure illustrates an example of a device used in each step of the manufacturing process of the functional pattern forming substrate 1000. The arrow lines shown in this figure represent the flow of the printed wiring board 1002 or the electrical component mounting board 1003 that becomes the functional pattern forming board 1000.
圖1所示之功能性圖案形成基板1000經過圖2所示之零件安裝步驟S1000、回流焊步驟S1002、外觀檢查步驟S1004、電氣檢查步驟S1006及功能性圖案形成步驟S1008而製造。圖2所示之功能性圖案形成步驟S1008包括絕緣圖案形成步驟S1010及導電圖案形成步驟S1012。The functional pattern forming substrate 1000 shown in FIG. 1 is manufactured through the component mounting step S1000, the reflow soldering step S1002, the appearance inspection step S1004, the electrical inspection step S1006 and the functional pattern forming step S1008 shown in FIG. 2 . The functional pattern forming step S1008 shown in FIG. 2 includes an insulating pattern forming step S1010 and a conductive pattern forming step S1012.
[零件安裝步驟] 在零件安裝步驟S1000中應用被稱為安裝器之零件安裝機1100。在零件安裝步驟S1000中，使用零件安裝機1100在印刷配線基板1002上印刷膏狀焊料，並且在印刷有膏狀焊料之位置安裝電氣零件。對經過了零件安裝步驟S1000之印刷配線基板1002實施回流焊步驟S1002。 [Parts installation steps] In the parts mounting step S1000, a parts mounting machine 1100 called a mounter is used. In the parts mounting step S1000, cream solder is printed on the printed wiring board 1002 using the parts mounting machine 1100, and electrical components are mounted at the positions where the cream solder is printed. The reflow soldering step S1002 is performed on the printed wiring board 1002 that has passed the component mounting step S1000.
[回流焊步驟] 回流焊步驟S1002中應用被稱為回流焊爐等之附回流焊焊料之裝置1102。在回流焊步驟S1002中，加熱在常溫下被印刷之焊料。藉此，電氣零件與印刷配線基板1002的電路電連接，相對於印刷配線基板1002電氣零件的位置被固定。經過了回流焊步驟S1002之印刷配線基板1002作為電氣零件安裝基板1003而實施外觀檢查步驟S1004。此處的常溫係零件安裝步驟S1000中的印刷配線基板1002的環境溫度，例如，能夠應用15℃以上且25℃以下的任意溫度。 [Reflow soldering steps] In the reflow step S1002, a device 1102 with reflow solder called a reflow oven or the like is used. In the reflow soldering step S1002, the solder printed at normal temperature is heated. Thereby, the electrical component is electrically connected to the circuit of the printed wiring board 1002 , and the position of the electrical component relative to the printed wiring board 1002 is fixed. The printed wiring board 1002 that has undergone the reflow step S1002 is used as the electrical component mounting board 1003 and is subjected to the appearance inspection step S1004. The ambient temperature of the printed wiring board 1002 in the normal-temperature component mounting step S1000 may be any temperature ranging from 15° C. to 25° C., for example.
[外觀檢查步驟] 外觀檢查步驟S1004中應用AOI（Automated Optical Inspection：自動光學檢測）等自動外觀檢查裝置1104。在外觀檢查步驟S1004中，使用自動外觀檢查裝置1104拍攝電氣零件安裝基板1003，進行電氣零件安裝基板1003的外觀檢查。再者，實施形態所示之自動外觀檢查裝置1104係外觀檢查裝置的一例。 [Appearance inspection procedure] In the appearance inspection step S1004, an automatic appearance inspection device 1104 such as AOI (Automated Optical Inspection) is applied. In the appearance inspection step S1004, the electrical component mounting board 1003 is photographed using the automatic appearance inspection device 1104, and the appearance inspection of the electrical component mounting board 1003 is performed. In addition, the automatic appearance inspection device 1104 shown in the embodiment is an example of the appearance inspection device.
[電氣檢查步驟] 電氣檢查步驟S1006中應用被稱為測試器等之電氣檢查裝置1106。電氣檢查裝置1106使探針與電極及墊等電氣配線的露出部分接觸，以確認電氣零件之間的電連接。亦即，在電氣檢查步驟S1006中，對形成於電氣零件安裝基板1003之配線的斷線、配線的短路、電氣零件的電極之間的短路及電氣零件之間的短路的有無進行檢查。 [Electrical inspection procedures] In the electrical inspection step S1006, an electrical inspection device 1106 called a tester or the like is used. The electrical inspection device 1106 makes contact with exposed portions of electrical wiring such as electrodes and pads with probes to confirm electrical connections between electrical components. That is, in the electrical inspection step S1006, the presence or absence of breakage of the wiring formed on the electrical component mounting substrate 1003, short circuit of the wiring, short circuit between the electrodes of the electrical components, and short circuit between the electrical components is inspected.
又，在電氣檢查步驟S1006中，對形成於電氣零件安裝基板1003之電子電路中的電氣訊號是否適當地處理進行檢查。在電氣檢查步驟S1006中，可以使用檢查電氣零件之間的電連接之配線檢查裝置及檢查電子電路中的電氣訊號是否適當地處理之電路檢查裝置。對經過了電氣檢查步驟S1006之配線基板實施功能性圖案形成步驟S1008。Furthermore, in the electrical inspection step S1006, it is inspected whether the electrical signals formed in the electronic circuit of the electrical component mounting substrate 1003 are properly processed. In the electrical inspection step S1006, a wiring inspection device that inspects electrical connections between electrical components and a circuit inspection device that inspects whether electrical signals in electronic circuits are properly processed may be used. The functional pattern forming step S1008 is performed on the wiring board that has passed the electrical inspection step S1006.
[功能性圖案形成步驟] 在圖2中，例示如下態樣：在功能性圖案形成步驟中，使用絕緣圖案形成裝置1108在電氣零件安裝基板1003上形成絕緣圖案，並使用導電圖案形成裝置1110在電氣零件安裝基板1003上形成導電圖案。 [Functional pattern formation step] In FIG. 2 , in the functional pattern forming step, an insulating pattern is formed on the electrical component mounting substrate 1003 using the insulating pattern forming device 1108 , and an insulating pattern is formed on the electrical component mounting substrate 1003 using the conductive pattern forming device 1110 . Conductive pattern.
絕緣圖案形成裝置1108應用噴墨方式的印刷裝置，對電氣零件安裝基板1003吐出絕緣油墨，使絕緣油墨乾燥而形成絕緣圖案。The insulating pattern forming device 1108 uses an inkjet printing device to eject insulating ink onto the electrical component mounting substrate 1003, and dries the insulating ink to form an insulating pattern.
導電圖案形成裝置1110應用噴墨方式的印刷裝置，對形成有絕緣圖案之電氣零件安裝基板1003吐出導電油墨，使導電油墨乾燥而形成導電圖案。The conductive pattern forming device 1110 uses an inkjet printing device to eject conductive ink onto the electrical component mounting substrate 1003 on which the insulation pattern is formed, and dries the conductive ink to form a conductive pattern.
再者，在電氣零件安裝基板1003上形成絕緣圖案及導電圖案時，在電氣零件安裝基板1003上形成有絕緣圖案之狀態係功能性圖案形成基板1000的半完成狀態，設為電氣零件安裝基板1003。另一方面，在電氣零件安裝基板1003上僅形成有絕緣圖案時，在電氣零件安裝基板1003上形成有絕緣圖案之狀態設為功能性圖案形成基板1000。Furthermore, when the insulating pattern and the conductive pattern are formed on the electrical component mounting substrate 1003, the state in which the insulating pattern is formed on the electrical component mounting substrate 1003 is a semi-finished state of the functional pattern forming substrate 1000, and is referred to as the electrical component mounting substrate 1003. . On the other hand, when only the insulating pattern is formed on the electrical component mounting substrate 1003, the state in which the insulating pattern is formed on the electrical component mounting substrate 1003 is regarded as the functional pattern forming substrate 1000.
絕緣油墨及導電油墨能夠應用UV油墨、水性油墨及溶劑油墨等各種油墨。UV油墨含有對紫外線表現出硬化反應之單體等。即，UV油墨是藉由照射紫外線而硬化的紫外線硬化型油墨的一例。水性油墨應用水作為溶劑的主成分。溶劑油墨應用溶劑作為溶劑的主成分。再者，UV係UltraViolet（紫外線）的縮寫。Various inks such as UV ink, water-based ink and solvent ink can be used for insulating ink and conductive ink. UV ink contains monomers that exhibit a curing reaction against ultraviolet rays. That is, UV ink is an example of ultraviolet curable ink that is cured by irradiation with ultraviolet rays. Water-based inks use water as the main component of the solvent. Solvent ink uses solvent as the main component of the solvent. Furthermore, UV is the abbreviation of UltraViolet.
作為絕緣油墨應用UV油墨。作為導電油墨，能夠應用將銀及銅等金屬溶解於溶劑中而得之油墨。作為導電油墨，可以應用將金屬的奈米粒子分散於溶劑中而得之油墨。若對上述之導電油墨曝光紫外線，則金屬原子發熱而溶劑揮發。藉此，導電油墨的黏度上昇，最終導電油墨硬化。即，導電油墨是藉由照射紫外線而硬化的紫外線硬化型油墨的一例。導電油墨的乾燥可以應用溫度比常溫更高的高溫空氣的送風及近紅外線的照射。As insulating ink apply UV ink. As the conductive ink, an ink obtained by dissolving metals such as silver and copper in a solvent can be used. As the conductive ink, an ink obtained by dispersing metal nanoparticles in a solvent can be used. If the above-mentioned conductive ink is exposed to ultraviolet rays, the metal atoms generate heat and the solvent volatilizes. As a result, the viscosity of the conductive ink increases, and eventually the conductive ink hardens. That is, the conductive ink is an example of an ultraviolet curable ink that is cured by irradiation with ultraviolet rays. The drying of conductive ink can be achieved by applying high-temperature air supply with a temperature higher than normal temperature and irradiation of near-infrared rays.
[配線基板] 圖3係配線基板的說明圖。在圖3中，在集合基板1200中分配有16個個別基板1202。圖3所示之個別基板1202分別相當於圖1所示之電氣零件安裝基板1003。圖3所示之集合基板1200及個別基板1202省略配線圖案的圖示。 [Wiring board] FIG. 3 is an explanatory diagram of the wiring board. In FIG. 3 , 16 individual substrates 1202 are allocated in the collective substrate 1200 . The individual substrates 1202 shown in FIG. 3 are respectively equivalent to the electrical component mounting substrates 1003 shown in FIG. 1 . The collective substrate 1200 and the individual substrates 1202 shown in FIG. 3 omit wiring patterns.
又，在圖3所示之集合基板1200中，省略圖1所示之IC1006及電阻器1008等電氣零件的圖示，在個別基板1202中，將IC1006等示意性地圖示為電氣零件1204。In addition, in the collective substrate 1200 shown in FIG. 3 , the illustration of the electrical components such as the IC 1006 and the resistor 1008 shown in FIG. 1 is omitted, and in the individual substrate 1202 , the IC 1006 and the like are schematically shown as the electrical components 1204 .
在集合基板1200中形成有對準標記1210。形成對準標記1210時能夠應用印刷。對準標記1210形成於集合基板1200的四角。對準標記1210作為形成功能性圖案時的位置對準的基準發揮作用。Alignment marks 1210 are formed in the collective substrate 1200 . Printing can be applied when forming the alignment mark 1210 . Alignment marks 1210 are formed at four corners of the collective substrate 1200 . The alignment mark 1210 functions as a reference for positioning when forming a functional pattern.
在圖3中例示了在集合基板1200的四角形成有對準標記1210之態樣，但在對集合基板1200實施高精度的定位時，可以增加對準標記1210。FIG. 3 illustrates a state in which alignment marks 1210 are formed at the four corners of the collective substrate 1200. However, when positioning the collective substrate 1200 with high precision, the alignment marks 1210 may be added.
在電氣零件1204以高密度安裝之情況等、難以在集合基板1200上形成對準標記1210之情況下，能夠代替對準標記1210而將使用半導體製程而形成之配線等作為定位的基準。例如，電氣檢查用電極及導通配線圖案之通孔用圖案等，亦能夠作為代替對準標記1210之定位的基準。When it is difficult to form the alignment marks 1210 on the collective substrate 1200, such as when the electrical components 1204 are mounted at high density, wiring formed using a semiconductor process can be used as a positioning reference instead of the alignment marks 1210. For example, electrical inspection electrodes, conductive wiring patterns, via hole patterns, etc. can also be used as a reference for positioning in place of the alignment mark 1210 .
在圖3中例示了在個別基板1202的四角亦印刷有對準標記1212之態樣。形成於個別基板1202之對準標記1212作為個別基板1202上的位置對準基準發揮作用。FIG. 3 illustrates a state in which alignment marks 1212 are also printed on the four corners of an individual substrate 1202. The alignment mark 1212 formed on the individual substrate 1202 functions as a position alignment reference on the individual substrate 1202 .
以下說明之圖案形成裝置中，對圖3所示之集合基板1200賦予功能性油墨，但圖案形成裝置亦可以對從集合基板1200切出之個別基板1202賦予功能性油墨。In the pattern forming device described below, functional ink is applied to the collective substrate 1200 shown in FIG. 3 . However, the pattern forming device may also apply functional ink to individual substrates 1202 cut out from the collective substrate 1200 .
[圖案形成裝置的結構例] 圖4係表示圖案形成裝置的結構例之俯視圖。圖5係圖4所示之圖案形成裝置的側視圖。圖4及圖5所示之圖案形成裝置10應用於圖2所示之絕緣圖案形成裝置1108及導電圖案形成裝置1110。以下，適當地參考圖4及圖5對圖案形成裝置10的結構例進行說明。 [Structure example of pattern forming device] FIG. 4 is a plan view showing a structural example of the pattern forming device. FIG. 5 is a side view of the pattern forming device shown in FIG. 4 . The pattern forming device 10 shown in FIGS. 4 and 5 is applied to the insulating pattern forming device 1108 and the conductive pattern forming device 1110 shown in FIG. 2 . Hereinafter, a structural example of the pattern forming device 10 will be described with reference to FIGS. 4 and 5 as appropriate.
圖案形成裝置10對作為圖3所示之集合基板1200構成之電氣零件安裝基板1003應用噴墨方式而吐出功能性油墨，並在電氣零件安裝基板1003上形成功能性圖案。再者，實施形態中所記載之功能性油墨為功能性液體的一例。The pattern forming device 10 applies an inkjet method to the electrical component mounting substrate 1003 configured as the collective substrate 1200 shown in FIG. 3 to eject functional ink and form a functional pattern on the electrical component mounting substrate 1003. In addition, the functional ink described in the embodiment is an example of functional liquid.
圖案形成裝置10具備噴墨頭12、UV曝光裝置14及攝影機16。圖案形成裝置10具備傳送電氣零件安裝基板1003之傳送裝置18。The pattern forming device 10 includes an inkjet head 12 , a UV exposure device 14 and a camera 16 . The pattern forming device 10 includes a conveyor 18 for conveying the electrical component mounting substrate 1003 .
又，圖案形成裝置10具備：支撐噴墨頭12之頭支撐構件、支撐UV曝光裝置14之曝光裝置支撐構件及支撐攝影機16之攝影機支撐構件。再者，省略頭支撐構件、曝光裝置支撐構件及攝影機支撐構件的圖示。Furthermore, the pattern forming device 10 includes a head support member that supports the inkjet head 12 , an exposure device support member that supports the UV exposure device 14 , and a camera support member that supports the camera 16 . In addition, illustrations of the head support member, the exposure device support member, and the camera support member are omitted.
頭支撐構件、曝光裝置支撐構件、攝影機支撐構件及傳送裝置18配置於基座20的上表面。基座20中應用平台（Surface plate）等。頭支撐構件能夠應用如下結構，該結構具備：立設於基座20之2根支柱；及使用2根支柱支撐兩端之頭支撐柱。曝光裝置支撐構件及攝影機支撐構件能夠應用與頭支撐構件相同的結構。The head support member, the exposure device support member, the camera support member, and the transfer device 18 are arranged on the upper surface of the base 20 . Application platform (Surface plate) in the base 20, etc. The head support member can use a structure including two pillars erected on the base 20 and a head support column using the two pillars to support both ends. The same structure as that of the head support member can be applied to the exposure device support member and the camera support member.
圖案形成裝置10可以具備頭升降裝置，該頭升降裝置使噴墨頭12升降，以調整噴墨頭12與電氣零件安裝基板1003的距離。The pattern forming device 10 may be equipped with a head lifting device that raises and lowers the inkjet head 12 to adjust the distance between the inkjet head 12 and the electrical component mounting substrate 1003 .
又，圖案形成裝置10可以具備UV升降裝置，該UV升降裝置使UV曝光裝置14升降，以調整UV曝光裝置14與電氣零件安裝基板1003的距離。此外，圖案形成裝置10可以具備攝影機升降裝置，該攝影機升降裝置使攝影機16升降，以調整攝影機16與電氣零件安裝基板1003的距離。In addition, the pattern forming device 10 may be equipped with a UV lifting device that raises and lowers the UV exposure device 14 to adjust the distance between the UV exposure device 14 and the electrical component mounting substrate 1003 . In addition, the pattern forming device 10 may be provided with a camera lifting device that raises and lowers the camera 16 to adjust the distance between the camera 16 and the electrical component mounting substrate 1003 .
噴墨頭12具備形成有未圖示的噴嘴開口的未圖示的噴嘴面。噴墨頭12對與噴嘴面對向之電氣零件安裝基板1003的零件安裝面1004從噴嘴開口吐出功能性油墨。噴墨頭12以噴嘴面的法線與零件安裝面1004的法線平行之姿勢被固定。The inkjet head 12 includes a nozzle surface (not shown) on which a nozzle opening (not shown) is formed. The inkjet head 12 discharges the functional ink from the nozzle opening to the component mounting surface 1004 of the electrical component mounting substrate 1003 facing the nozzle surface. The inkjet head 12 is fixed in an attitude such that the normal line of the nozzle surface is parallel to the normal line of the component mounting surface 1004 .
噴墨頭12中應用如下線型頭：在基板寬度方向上，沿著超過印刷配線基板1002的整個寬度之長度配置有複數個噴嘴。具備線型頭之圖案形成裝置10中能夠實施如下單程方式的液體吐出：能夠使噴墨頭12和電氣零件安裝基板1003掃描1次，以將功能性油墨賦予至電氣零件安裝基板1003的整個表面。此處的液體吐出的含義與印刷及圖像形成的含義相同。The inkjet head 12 uses a linear head in which a plurality of nozzles are arranged along a length exceeding the entire width of the printed wiring substrate 1002 in the substrate width direction. The pattern forming device 10 equipped with a line head can perform liquid ejection in a one-pass manner in which the inkjet head 12 and the electrical component mounting substrate 1003 can be scanned once to apply functional ink to the entire surface of the electrical component mounting substrate 1003 . The meaning of liquid discharge here is the same as that of printing and image formation.
噴墨頭12可以組合複數個頭模組來構成。例如，可以在基板寬度方向上將複數個頭模組配置為一列來構成線型頭。此處的基板寬度方向係與電氣零件安裝基板1003的傳送方向亦即基板傳送方向正交之方向。The inkjet head 12 can be configured by combining a plurality of head modules. For example, a plurality of head modules may be arranged in a row in the width direction of the substrate to form a linear head. The substrate width direction here is a direction orthogonal to the conveyance direction of the electrical component mounting substrate 1003, that is, the substrate conveyance direction.
再者，本說明書中的術語正交能夠包括能夠將嚴格地以未達90°的角度或超過90°的角度交叉之兩個方向視為正交之實質上的正交。又，術語平行能夠包括能夠將嚴格地交叉之兩個方向視為平行之實質上的平行。Furthermore, the term orthogonal in this specification can include substantial orthogonality in which two directions that strictly intersect at an angle less than 90° or at an angle exceeding 90° can be regarded as orthogonal. In addition, the term parallel can include substantial parallelism in which two directions that strictly cross each other can be regarded as parallel.
噴墨頭12的噴嘴配置能夠應用二維配置。作為二維配置的例子，能夠應用2列的鋸齒形配置及矩陣配置。噴墨頭12的噴嘴面與噴嘴配置對應配置有噴嘴開口。噴墨頭12從配置於噴嘴面之複數個噴嘴開口分別吐出功能性油墨。The nozzle arrangement of the inkjet head 12 can apply a two-dimensional arrangement. As examples of the two-dimensional arrangement, a two-column zigzag arrangement and a matrix arrangement can be applied. The nozzle surface of the inkjet head 12 has nozzle openings corresponding to the nozzle arrangement. The inkjet head 12 discharges functional ink from a plurality of nozzle openings arranged on the nozzle surface.
噴墨頭12的吐出方式能夠應用利用壓電元件的撓曲變形而加壓功能性油墨以吐出功能性油墨的壓電方式。噴墨頭12的吐出方式能夠應用使用加熱器加熱功能性油墨並利用功能性油墨的膜沸騰現象以吐出功能性油墨的熱方式。As the ejection method of the inkjet head 12 , a piezoelectric method that utilizes the flexural deformation of a piezoelectric element to pressurize the functional ink and eject the functional ink can be applied. The discharge method of the inkjet head 12 can apply a thermal method in which a heater is used to heat the functional ink and the film boiling phenomenon of the functional ink is used to discharge the functional ink.
再者，實施形態中記載的噴墨頭12為噴液頭的一例。In addition, the inkjet head 12 described in the embodiment is an example of a liquid ejection head.
UV曝光裝置14具備UV光源。UV光源能夠應用如下結構：在基板寬度方向上，在與電氣零件安裝基板1003的全長對應之長度上配置有複數個UVLED。UVLED是UltraViolet Light Emitting Diode的縮寫。UV曝光裝置14向電氣零件安裝基板1003照射從UV光源射出之紫外線。The UV exposure device 14 is equipped with a UV light source. The UV light source can have a structure in which a plurality of UVLEDs are arranged along a length corresponding to the entire length of the electrical component mounting substrate 1003 in the width direction of the substrate. UVLED is the abbreviation of UltraViolet Light Emitting Diode. The UV exposure device 14 irradiates the electrical component mounting substrate 1003 with ultraviolet rays emitted from the UV light source.
再者，圖4中例示了在功能性油墨的乾燥處理中使用紫外線之態樣，但功能性油墨的乾燥處理可以應用熱能的賦予，亦可以應用送風。Furthermore, FIG. 4 illustrates a state in which ultraviolet rays are used in the drying process of the functional ink. However, the drying process of the functional ink may be performed by applying heat energy or by blowing air.
攝影機16讀取電氣零件安裝基板1003的對準標記1210並生成對準標記1210的攝影資料。對準標記1210的攝影資料應用於電氣零件安裝基板1003的位置的測定。電氣零件安裝基板1003的位置的測定資料應用於作為功能性圖案的吐出資料的基礎資料之圖案資料的變換。The camera 16 reads the alignment marks 1210 of the electrical component mounting substrate 1003 and generates photographic data of the alignment marks 1210 . The photographic data of the alignment mark 1210 is used for measuring the position of the electrical component mounting substrate 1003 . The measurement data of the position of the electrical component mounting substrate 1003 is used for conversion of pattern data which is the basic data of the output data of the functional pattern.
圖案形成裝置10可以具備攝影機移動機構，該攝影機移動機構依據電氣零件安裝基板1003的尺寸沿著基板寬度方向使攝影機16移動。藉此，能夠使攝影機16移動至適於讀取電氣零件安裝基板1003的對準標記1212之位置。The pattern forming device 10 may be provided with a camera moving mechanism that moves the camera 16 in the width direction of the electrical component mounting substrate 1003 according to the size of the substrate. Thereby, the camera 16 can be moved to a position suitable for reading the alignment mark 1212 of the electrical component mounting substrate 1003 .
又，攝影機16拍攝電氣零件安裝基板1003，並生成電氣零件安裝基板1003的圖像資料即觀察資料。攝影機16可以生成安裝在電氣零件安裝基板1003上的電氣零件的觀察資料。攝影機16與功能性油墨的賦予之前後無關地，可以拍攝電氣零件安裝基板1003並生成觀察資料。由攝影機16生成的觀察資料用於推測電氣零件的名稱、確認電氣零件的位置偏差、及獲得電氣零件安裝基板1003相對於工作台30位置偏差的程度。又，觀察資料用於獲取每個電氣零件的位置資訊及每個電氣零件的高度資訊。Furthermore, the camera 16 photographs the electrical component mounting substrate 1003 and generates observation data that is image data of the electrical component mounting substrate 1003 . The camera 16 can generate observation data of the electrical components mounted on the electrical component mounting substrate 1003 . The camera 16 can photograph the electrical component mounting substrate 1003 and generate observation data regardless of whether the functional ink is applied before or after. The observation data generated by the camera 16 is used to estimate the name of the electrical component, confirm the positional deviation of the electrical component, and obtain the degree of positional deviation of the electrical component mounting substrate 1003 relative to the workbench 30 . In addition, the observation data is used to obtain the position information of each electrical component and the height information of each electrical component.
對電氣零件的位置能夠應用被規定於電氣零件安裝基板1003的零件安裝面1004上之二維座標的座標值。對電氣零件的高度能夠應用電氣零件安裝基板1003的零件安裝面1004的法線方向上的電氣零件的長度。亦即，根據攝影機16生成的觀察資料，獲取電氣零件安裝基板1003上的電氣零件的三維位置資訊。The coordinate values of the two-dimensional coordinates specified on the component mounting surface 1004 of the electrical component mounting substrate 1003 can be applied to the positions of the electrical components. The length of the electrical component in the normal direction of the component mounting surface 1004 of the electrical component mounting board 1003 can be used as the height of the electrical component. That is, based on the observation data generated by the camera 16, the three-dimensional position information of the electrical components on the electrical component mounting substrate 1003 is obtained.
圖6係表示可用作攝影機16的在線掃描器16A的圖。在線掃描儀16A包括複數個CMOS或CCD等光電轉換元件沿基板寬度方向配置成一列的未圖示的線傳感器。CMOS是Complementary Metal-Oxide Semiconductor的縮寫，CCD是Charge-Coupled Device的縮寫。在線掃描儀16A將從受光面17入射的光藉由線感測器轉換為電信號，生成觀察資料。FIG. 6 shows a line scanner 16A that can be used as the camera 16 . The line scanner 16A includes a line sensor (not shown) in which a plurality of photoelectric conversion elements such as CMOS and CCD are arranged in a line along the width direction of the substrate. CMOS is the abbreviation of Complementary Metal-Oxide Semiconductor, and CCD is the abbreviation of Charge-Coupled Device. The line scanner 16A converts the light incident from the light-receiving surface 17 into an electrical signal through the line sensor, and generates observation data.
圖7係表示可用作攝影機16的複數個攝影機16B的圖。複數個攝影機16B的各個攝影機在基板寬度方向上配置成一列。複數個攝影機16B中的各個攝影機分別包括二維排列的CMOS或CCD等光電轉換元件。FIG. 7 is a diagram showing a plurality of cameras 16B that can be used as the camera 16 . Each of the plurality of cameras 16B is arranged in a row in the width direction of the substrate. Each of the plurality of cameras 16B includes photoelectric conversion elements such as CMOS and CCD arranged two-dimensionally.
攝影機16可以使用從複數個不同的視點拍攝的3D掃描儀中利用的攝影機。3D是three-dimensional的縮寫。不僅從正上方拍攝，還從傾斜角度拍攝，藉此可以適當地獲得高度方向的資訊。除了攝影機之外，還可以使用距離感測器來獲取電氣零件的高度方向的資訊。距離感測器可以是利用發射的激光和反射的激光之間的相位差來檢測距離的激光距離感測器。The camera 16 may be a camera used in a 3D scanner that captures images from a plurality of different viewpoints. 3D is the abbreviation of three-dimensional. Not only shooting from directly above, but also from an oblique angle, you can obtain appropriate height information. In addition to cameras, distance sensors can also be used to obtain information on the height direction of electrical components. The distance sensor may be a laser distance sensor that detects distance using a phase difference between emitted laser light and reflected laser light.
回到圖4及5的說明，傳送裝置18沿著基板傳送方向傳送電氣零件安裝基板1003。基板傳送方向是相對移動方向的一例。傳送裝置18具備支撐電氣零件安裝基板1003之載台30及使載台30沿著基板傳送方向移動之基板移動機構32。Returning to the description of FIGS. 4 and 5 , the conveying device 18 conveys the electrical component mounting substrate 1003 along the substrate conveying direction. The substrate conveyance direction is an example of the relative movement direction. The conveying device 18 includes a stage 30 that supports the electrical component mounting substrate 1003 and a substrate moving mechanism 32 that moves the stage 30 along the substrate conveying direction.
載台30具備用於固定電氣零件安裝基板1003之固定機構。固定機構可以應用機械固定電氣零件安裝基板1003之態樣，亦可以應用對電氣零件安裝基板1003施加負壓來吸附之態樣。The stage 30 is provided with a fixing mechanism for fixing the electrical component mounting substrate 1003 . The fixing mechanism can be used to mechanically fix the electrical component mounting substrate 1003, or can be used to apply negative pressure to the electrical component mounting substrate 1003 for adsorption.
載台30可以具備高度調整機構，該高度調整機構微調電氣零件安裝基板1003與噴墨頭12之間的距離。載台30可以構成為自由調整電氣零件安裝基板1003的基板寬度方向的位置。The stage 30 may be provided with a height adjustment mechanism that finely adjusts the distance between the electrical component mounting substrate 1003 and the inkjet head 12 . The stage 30 can be configured to freely adjust the position of the electrical component mounting substrate 1003 in the substrate width direction.
基板移動機構32能夠應用滾珠螺桿驅動機構及皮帶驅動機構等連接於馬達旋轉軸之態樣。基板移動機構32可以應用具備線性馬達之態樣。工作台30藉由基板移動機構32分別移動到噴墨頭12、UV曝光裝置14及攝影機16的下方（基座20側）。The substrate moving mechanism 32 can be connected to the motor rotation shaft using a ball screw driving mechanism, a belt driving mechanism, or the like. The substrate moving mechanism 32 may be provided with a linear motor. The workbench 30 is moved to the bottom (to the base 20 side) of the inkjet head 12 , the UV exposure device 14 and the camera 16 respectively by the substrate moving mechanism 32 .
圖4及圖5中示出了使電氣零件安裝基板1003相對於基板傳送方向的位置被固定之噴墨頭12，沿著基板傳送方向移動之態樣，但亦可以使噴墨頭12相對於基板傳送方向的位置被固定之電氣零件安裝基板1003，沿著基板傳送方向移動。又，亦可以使電氣零件安裝基板1003和噴墨頭12這兩者沿著基板傳送方向移動。4 and 5 show a state in which the inkjet head 12 is moved along the substrate conveyance direction with the electrical component mounting substrate 1003 fixed in position relative to the substrate conveyance direction. However, the inkjet head 12 may also be moved relative to the substrate conveyance direction. The electrical component mounting substrate 1003 whose position in the substrate conveyance direction is fixed moves along the substrate conveyance direction. Alternatively, both the electrical component mounting substrate 1003 and the inkjet head 12 may be moved along the substrate conveyance direction.
圖案形成裝置10可以應用如下串列方式：在基板寬度方向上，具備比電氣零件安裝基板1003的全長更短尺寸的噴墨頭，並在基板寬度方向及基板傳送方向兩個方向上，使電氣零件安裝基板1003與噴墨頭相對移動，以在電氣零件安裝基板1003的整個表面印刷功能性圖案。The pattern forming device 10 can be applied in a tandem system that has an inkjet head that is shorter than the entire length of the electrical component mounting substrate 1003 in the substrate width direction, and makes electrical inkjet heads in both the substrate width direction and the substrate conveyance direction. The component mounting substrate 1003 and the inkjet head move relatively to print functional patterns on the entire surface of the electrical component mounting substrate 1003 .
這樣構成的圖案形成裝置10首先在基板傳送方向上移動由工作台30支撐的電氣零件安裝基板1003。在電氣零件安裝基板1003通過攝影機16的正下方時，藉由攝影機16實施對準標記1210的拍攝。The pattern forming apparatus 10 configured in this way first moves the electrical component mounting substrate 1003 supported by the table 30 in the substrate conveyance direction. When the electrical component mounting substrate 1003 passes directly under the camera 16 , the alignment mark 1210 is photographed by the camera 16 .
圖案形成裝置10使由工作台30支撐的電氣零件安裝基板1003返回到基板傳送方向的上游側，並再次向基板傳送方向移動。在電氣零件安裝基板1003通過噴墨頭12的正下方時，藉由噴墨頭12賦予功能性油墨。亦即，功能性油墨印刷在電氣零件安裝基板1003上。The pattern forming apparatus 10 returns the electrical component mounting substrate 1003 supported by the table 30 to the upstream side in the substrate conveyance direction, and moves it in the substrate conveyance direction again. When the electrical component mounting substrate 1003 passes directly under the inkjet head 12 , functional ink is applied by the inkjet head 12 . That is, functional ink is printed on the electrical component mounting substrate 1003 .
圖案形成裝置10使賦予功能性油墨的電氣零件安裝基板1003向基板傳送方向移動。電氣零件安裝基板1003在通過UV曝光裝置14的正下方時，藉由UV曝光裝置14照射紫外線。此外，圖案形成裝置10使功能性油墨硬化的電氣零件安裝基板1003向基板傳送方向移動。電氣零件安裝基板1003在通過攝影機16的正下方時，藉由攝影機16拍攝，生成拍攝資料。The pattern forming device 10 moves the electrical component mounting substrate 1003 to which the functional ink has been applied in the substrate conveying direction. When the electrical component mounting substrate 1003 passes directly under the UV exposure device 14, the UV exposure device 14 irradiates ultraviolet rays. Furthermore, the pattern forming device 10 moves the electrical component mounting substrate 1003 on which the functional ink has been cured in the substrate conveying direction. When the electrical component mounting substrate 1003 passes directly under the camera 16, it is photographed by the camera 16 to generate photographic data.
之後，圖案形成裝置10將電氣零件安裝基板1003返回到基板傳送方向的上游側。在此，為了形成功能性圖案需要多次印刷，圖案形成裝置10使電氣零件安裝基板1003向基板傳送方向移動，重複相同的處理。Thereafter, the pattern forming apparatus 10 returns the electrical component mounting substrate 1003 to the upstream side in the substrate conveyance direction. Here, multiple printings are required to form a functional pattern. The pattern forming device 10 moves the electrical component mounting substrate 1003 in the substrate conveyance direction and repeats the same process.
如上所述，藉由1次相對移動來進行功能性油墨的賦予、紫外線的照射及觀察資料的生成，藉由多次重複相對移動，形成功能性圖案形成基板1000，其形成有由複數層功能性油墨構成的功能性圖案。As described above, one relative movement is used to apply the functional ink, irradiate ultraviolet rays, and generate observation data. By repeating the relative movement multiple times, a functional pattern forming substrate 1000 is formed, which is formed with a plurality of layers of functions. Functional patterns made of flexible ink.
再者，實施形態中所記載之圖案形成裝置10為印刷裝置的一例。又，實施形態中所記載之傳送裝置18為相對移動機構的一例。In addition, the pattern forming device 10 described in the embodiment is an example of a printing device. In addition, the conveyor 18 described in the embodiment is an example of a relative movement mechanism.
[圖案形成裝置的電氣結構] 圖8係表示圖4所示之圖案形成裝置的電氣結構之功能框圖。圖案形成裝置10具備系統控制部100。系統控制部100向圖案形成裝置10的各種處理部發送指令訊號，並多元控制（multiple unit control）圖案形成裝置10的動作。 [Electrical structure of pattern forming device] FIG. 8 is a functional block diagram showing the electrical structure of the pattern forming device shown in FIG. 4 . The pattern forming apparatus 10 includes a system control unit 100 . The system control unit 100 sends command signals to various processing units of the pattern forming device 10 and performs multiple unit control (multiple unit control) on the operations of the pattern forming device 10 .
圖案形成裝置10具備基板資料獲取部102。基板資料獲取部102獲取印刷配線基板1002的設計資料、形成於電氣零件安裝基板1003之電子電路的設計資料及電氣零件安裝基板1003上的設計上的電氣零件的安裝位置的資訊。基板資料獲取部102可以獲取安裝在電氣零件安裝基板1003上的電氣零件的零件名稱、設計形狀及設計高度的資訊。The pattern forming apparatus 10 includes a substrate data acquisition unit 102 . The board data acquisition unit 102 acquires the design data of the printed wiring board 1002 , the design data of the electronic circuit formed on the electrical component mounting board 1003 , and the information on the designed mounting position of the electrical components on the electrical component mounting board 1003 . The substrate data acquisition unit 102 can acquire information on component names, design shapes, and design heights of electrical components mounted on the electrical component mounting substrate 1003 .
圖案形成裝置10具備觀察資料獲取部104。觀察資料獲取部104從攝影機16獲取電氣零件安裝基板1003的觀察資料。觀察資料包括電氣零件安裝基板1003上的電氣零件1204的實際的三維位置資訊。The pattern forming apparatus 10 includes an observation data acquisition unit 104 . The observation data acquisition unit 104 acquires observation data of the electrical component mounting substrate 1003 from the camera 16 . The observation data includes actual three-dimensional position information of the electrical component 1204 on the electrical component mounting substrate 1003.
觀察資料獲取部104可以獲取圖3所示之集合基板1200上的對準標記1210的位置資訊。觀察資料獲取部104可以獲取個別基板1202上的對準標記1212的位置資訊。The observation data acquisition unit 104 can acquire the position information of the alignment mark 1210 on the set substrate 1200 shown in FIG. 3 . The observation data acquisition unit 104 may acquire the position information of the alignment mark 1212 on the individual substrate 1202 .
圖案形成裝置10具備印刷區域資料生成部106。印刷區域資料生成部106使用印刷配線基板1002的設計資料、電子電路的設計資料及實際電氣零件1204的三維位置資訊來規定表示形成於電氣零件安裝基板1003之功能性圖案之印刷區域，並生成印刷區域資料。The pattern forming device 10 includes a printing area data generation unit 106 . The printing area data generation unit 106 uses the design data of the printed wiring board 1002, the design data of the electronic circuit, and the three-dimensional position information of the actual electrical component 1204 to define a printing area that represents the functional pattern formed on the electrical component mounting substrate 1003, and generates a print area. Regional data.
印刷區域資料生成部106使用印刷配線基板1002的設計資料、電子電路的設計資料並根據設計資料來規定印刷區域而生成印刷區域資料。可以使用實際電氣零件1204的三維位置資訊來補正印刷區域資料。The print area data generation unit 106 uses the design data of the printed wiring board 1002 and the design data of the electronic circuit, specifies the print area based on the design data, and generates the print area data. The three-dimensional position information of the actual electrical component 1204 may be used to correct the printing area data.
印刷區域資料能夠包括功能性圖案的厚度的資訊。印刷區域資料可以為表示功能性圖案的三維形狀之三維資料，亦可以為表示功能性圖案的二維形狀之二維資料與功能性圖案的厚度的資訊的組合。The printing area data can include information on the thickness of the functional pattern. The printing area data may be three-dimensional data representing the three-dimensional shape of the functional pattern, or may be a combination of two-dimensional data representing the two-dimensional shape of the functional pattern and information on the thickness of the functional pattern.
圖案形成裝置10具備圖案資料生成部108。圖案資料生成部108對印刷區域資料實施訊號處理，以生成規定構成功能性圖案之點位置及點尺寸等之圖案資料。The pattern forming device 10 includes a pattern data generating unit 108 . The pattern data generation unit 108 performs signal processing on the printing area data to generate pattern data specifying dot positions, dot sizes, etc. constituting the functional pattern.
圖案資料生成部108可以對印刷區域資料實施各種補正處理。作為補正處理的例子，可舉出對不吐出噴嘴等異常噴嘴之補正處理。圖案資料生成部108可以對圖案資料實施補正處理。The pattern data generation unit 108 can perform various correction processes on the printing area data. An example of the correction processing is correction processing for abnormal nozzles such as non-discharging nozzles. The pattern data generation unit 108 can perform correction processing on the pattern data.
圖案資料生成部108可以使用功能性圖案的厚度的資訊來規定電氣零件安裝基板1003與噴墨頭12的相對移動次數。例如，圖案資料生成部108能夠將功能性圖案的厚度除以1次相對移動中的功能性圖案要素的厚度而得之值規定為相對移動的次數。其中，術語相對移動表示電氣零件安裝基板1003與噴墨頭12的相對移動。The pattern data generation unit 108 may use information on the thickness of the functional pattern to specify the number of relative movements between the electrical component mounting substrate 1003 and the inkjet head 12 . For example, the pattern data generation unit 108 can define a value obtained by dividing the thickness of the functional pattern by the thickness of the functional pattern element in one relative movement as the number of relative movements. Here, the term relative movement refers to the relative movement between the electrical component mounting substrate 1003 and the inkjet head 12 .
圖案資料生成部108可以依據功能性油墨的種類等功能性油墨的條件基準及噴墨頭12的驅動條件等來補正由設計條件規定之基準的相對移動的次數而規定相對移動的次數。The pattern data generation unit 108 can correct the number of relative movements based on the criteria specified by the design conditions based on the functional ink condition criteria such as the type of functional ink and the driving conditions of the inkjet head 12 to determine the number of relative movements.
圖案資料生成部108可以調整電氣零件安裝基板1003與噴墨頭12的相對移動的次數來調整賦予至電氣零件安裝基板1003之功能性油墨的總體積。The pattern data generation unit 108 can adjust the total volume of functional ink applied to the electrical component mounting substrate 1003 by adjusting the number of relative movements between the electrical component mounting substrate 1003 and the inkjet head 12 .
圖案資料生成部108可以從預先規定之複數個種類的液滴種類中選擇1種液滴種類。液滴種類可以應用形成1點之液滴的體積。構成1點之液滴的體積可以為複數個微小液滴合併而形成1點時之每個微小液滴的體積的總和。The pattern data generating unit 108 can select one droplet type from a plurality of predetermined droplet types. The droplet type can be applied to the volume of the droplet that forms 1 point. The volume of the droplets constituting one point may be the sum of the volumes of each tiny droplet when a plurality of tiny droplets merge to form one point.
圖案形成裝置10具備驅動電壓生成部110。驅動電壓生成部110根據半色調資料來生成供給至噴墨頭12之驅動電壓。驅動電壓應用作為規定的電壓波形之驅動波形。The pattern forming device 10 includes a drive voltage generating unit 110 . The driving voltage generating unit 110 generates a driving voltage to be supplied to the inkjet head 12 based on the halftone data. The driving voltage shall be the driving waveform of the specified voltage waveform.
圖案形成裝置10具備傳送控制部112。傳送控制部112根據從系統控制部100發送之指令訊號來控制傳送裝置18的動作。傳送控制部112依據規定的相對移動次數實施電氣零件安裝基板1003與噴墨頭12的相對移動。The pattern forming device 10 includes a transport control unit 112 . The transmission control unit 112 controls the operation of the transmission device 18 based on the command signal sent from the system control unit 100 . The transfer control unit 112 performs relative movement between the electrical component mounting substrate 1003 and the inkjet head 12 according to a predetermined number of relative movements.
傳送控制部112在實施2次以上的相對移動時，對應用於第1次相對移動之相對傳送速度，可以應用比應用於第2次以後的相對移動之相對移動速度更慢的相對移動速度。其中，術語速度能夠包括表示為速度的絕對值之速度的概念。When performing relative movement two or more times, the transport control unit 112 may apply a relative movement speed corresponding to the relative transport speed applied to the first relative movement that is slower than the relative movement speed applied to the second and subsequent relative movements. Herein, the term speed can include the concept of speed expressed as an absolute value of speed.
圖案形成裝置10具備曝光控制部114。曝光控制部114根據從系統控制部100發送之指令訊號來控制UV曝光裝置14的動作。曝光控制部114使UV曝光裝置14進行動作，以對藉由每個相對移動而形成之功能性圖案的圖案要素實施乾燥處理。The pattern forming device 10 includes an exposure control unit 114 . The exposure control unit 114 controls the operation of the UV exposure device 14 based on the command signal sent from the system control unit 100 . The exposure control unit 114 operates the UV exposure device 14 to perform a drying process on the pattern elements of the functional pattern formed by each relative movement.
圖案形成裝置10具備攝影機控制部116。攝影機控制部116使攝影機16進行動作，以拍攝電氣零件安裝基板1003的對準標記1210並生成對準標記1210的攝影資料。對準標記1210的攝影資料應用於印刷區域資料生成部106中的印刷區域的規定。The pattern forming device 10 includes a camera control unit 116 . The camera control unit 116 operates the camera 16 to photograph the alignment marks 1210 of the electrical component mounting substrate 1003 and generates photographic data of the alignment marks 1210 . The photographic data of the alignment mark 1210 is used to define the printing area in the printing area data generating unit 106 .
攝影機控制部116使攝影機16動作來拍攝電氣零件安裝基板1003，使攝影機16生成電氣零件安裝基板1003的觀察資料。The camera control unit 116 operates the camera 16 to photograph the electrical component mounting board 1003 , and causes the camera 16 to generate observation data of the electrical component mounting board 1003 .
圖案形成裝置10具備記憶體120。記憶體120記憶用於控制圖案形成裝置10之各種資料、各種參數及各種程式等。系統控制部100應用記憶於記憶體120中之各種參數等來實施對圖案形成裝置10各部的控制。The pattern forming device 10 includes a memory 120 . The memory 120 stores various data, various parameters, various programs, etc. used to control the pattern forming device 10 . The system control unit 100 uses various parameters and the like stored in the memory 120 to control each unit of the pattern forming device 10 .
圖案形成裝置10具備感測器122。圖8所示之感測器122包括溫度感測器及位置檢測感測器等設置於圖案形成裝置10之各種感測器。再者，圖8所示之各種處理部係為了方便起見依據功能而區分者，能夠適當地進行合併、分離、變更、刪除及追加等。The pattern forming device 10 includes a sensor 122 . The sensor 122 shown in FIG. 8 includes various sensors provided in the pattern forming device 10 such as a temperature sensor and a position detection sensor. In addition, the various processing units shown in FIG. 8 are divided according to functions for convenience, and they can be combined, separated, changed, deleted, added, etc. appropriately.
圖2所示之絕緣圖案形成裝置1108及導電圖案形成裝置1110均能夠應用圖案形成裝置10，但可以依據絕緣油墨的特性等絕緣油墨的吐出條件變更圖案形成裝置10。同樣地，可以依據導電油墨的特性等導電油墨的吐出條件變更圖案形成裝置10。The pattern forming device 10 can be applied to both the insulating pattern forming device 1108 and the conductive pattern forming device 1110 shown in FIG. 2 , but the pattern forming device 10 can be changed according to the discharge conditions of the insulating ink such as the characteristics of the insulating ink. Similarly, the pattern forming device 10 can be changed according to the discharge conditions of the conductive ink such as the characteristics of the conductive ink.
又，圖案形成裝置10可以構成為具備圖2所示之絕緣圖案形成裝置1108及導電圖案形成裝置1110這兩個功能之裝置。例如，圖案形成裝置10可以針對絕緣油墨及導電油墨分別具備噴墨頭12及UV曝光裝置14。Furthermore, the pattern forming device 10 may be configured as a device having two functions: the insulating pattern forming device 1108 and the conductive pattern forming device 1110 shown in FIG. 2 . For example, the pattern forming device 10 may include an inkjet head 12 and a UV exposure device 14 for insulating ink and conductive ink, respectively.
[應用於圖案形成裝置的控制裝置之硬體的結構] 圖9係表示應用於圖4所示之圖案形成裝置的控制裝置之硬體結構之框圖。設置於圖案形成裝置10之控制裝置200具備處理器202、作為非暫時性有形物體之電腦可讀取媒體204、通信介面206及輸入輸出介面208。 [Structure of hardware applied to control device of pattern forming device] FIG. 9 is a block diagram showing the hardware structure of a control device used in the pattern forming device shown in FIG. 4 . The control device 200 provided in the pattern forming device 10 includes a processor 202, a computer-readable medium 204 as a non-transitory tangible object, a communication interface 206, and an input/output interface 208.
控制裝置200應用電腦。電腦的形態可以為伺服器，亦可以為個人電腦，亦可以為工作站，又，亦可以為平板終端等。The control device 200 applies a computer. The computer can be in the form of a server, a personal computer, a workstation, a tablet terminal, etc.
處理器202具備作為通用的處理裝置之CPU（Central Processing Unit：中央處理單元）。處理器202可以具備作為專用於圖像處理之處理裝置之GPU（Graphics Processing Unit：圖形處理單元）。The processor 202 is provided with a CPU (Central Processing Unit: Central Processing Unit) which is a general-purpose processing device. The processor 202 may be equipped with a GPU (Graphics Processing Unit) which is a processing device dedicated to image processing.
處理器202經由總線210與電腦可讀取媒體204、通信介面206及輸入輸出介面208連接。輸入裝置214及顯示裝置216經由輸入輸出介面208與總線210連接。The processor 202 is connected to the computer-readable medium 204, the communication interface 206, and the input-output interface 208 via the bus 210. The input device 214 and the display device 216 are connected to the bus 210 via the input-output interface 208 .
電腦可讀取媒體204具備作為主記憶裝置之記憶體及作為輔助記憶裝置之儲存器。電腦可讀取媒體204能夠使用半導體記憶體、硬碟裝置及固態硬碟裝置等。電腦可讀取媒體204能夠使用複數個裝置的任意組合。The computer-readable medium 204 has a memory as a primary memory device and a storage as a auxiliary memory device. The computer readable medium 204 can use a semiconductor memory, a hard disk device, a solid state hard disk device, etc. Computer readable media 204 can be used with any combination of multiple devices.
再者，硬碟裝置亦能夠稱為英文標記的Hard Disk Drive的縮寫HDD。固態硬碟裝置亦能夠稱為英文標記的Solid State Drive的縮寫SSD。Furthermore, the hard disk device can also be called the abbreviation HDD of Hard Disk Drive in English. The solid state drive device can also be called the abbreviation SSD of Solid State Drive in English.
控制裝置200經由通信介面206與網路連接，並可通信地與外部裝置連接。網路能夠使用LAN（Local Area Network）等。再者，省略網路的圖示。The control device 200 is connected to the network via the communication interface 206 and is communicably connected to external devices. The network can use LAN (Local Area Network), etc. Furthermore, the network icon is omitted.
電腦可讀取媒體204記憶基板資料獲取控制程式220、觀察資料獲取控制程式222、印刷區域資料生成程式223及圖案資料生成控制程式224。The computer-readable medium 204 stores the substrate data acquisition control program 220, the observation data acquisition control program 222, the printing area data generation program 223, and the pattern data generation control program 224.
又，電腦可讀取媒體204記憶吐出控制程式226、曝光控制程式228、攝影機控制程式230及傳送控制程式232。電腦可讀取媒體204能夠作為圖8所示之記憶體120發揮作用。In addition, the computer can read the media 204 and store the ejection control program 226, the exposure control program 228, the camera control program 230 and the transmission control program 232. The computer-readable medium 204 can function as the memory 120 shown in FIG. 8 .
基板資料獲取控制程式220與應用於圖8所示之基板資料獲取部102之印刷配線基板1002的設計資料等的獲取處理對應。觀察資料獲取控制程式222與應用於觀察資料獲取部104之電氣零件安裝基板1003的觀察資料的獲取處理對應。印刷區域資料生成程式223與應用於印刷區域資料生成部106之印刷區域的規定對應。The board data acquisition control program 220 corresponds to the acquisition process of the design data and the like of the printed wiring board 1002 applied to the board data acquisition unit 102 shown in FIG. 8 . The observation data acquisition control program 222 corresponds to the observation data acquisition process applied to the observation data acquisition unit 104 of the electrical component mounting substrate 1003 . The printing area data generation program 223 corresponds to the specification of the printing area applied to the printing area data generation unit 106 .
圖案資料生成控制程式224與應用於圖案資料生成部108之圖案資料的生成對應。吐出控制程式226與應用於噴墨頭12之吐出控制對應。The pattern data generation control program 224 is applied to the pattern data generation unit 108 to generate pattern data. The discharge control program 226 corresponds to the discharge control applied to the inkjet head 12 .
曝光控制程式228與應用於曝光控制部114之UV曝光裝置14的曝光控制對應。攝影機控制程式230與應用於攝影機控制部116之攝影機16的攝影控制及攝影資料的生成處理對應。傳送控制程式232與應用於傳送裝置18之電氣零件安裝基板1003的傳送控制對應。The exposure control program 228 corresponds to the exposure control applied to the UV exposure device 14 of the exposure control unit 114 . The camera control program 230 corresponds to the photography control of the camera 16 and the generation process of photography data applied to the camera control unit 116 . The transfer control program 232 corresponds to the transfer control applied to the electrical component mounting substrate 1003 of the transfer device 18 .
記憶於電腦可讀取媒體204之各種程式中包括1個以上的命令。電腦可讀取媒體204記憶各種資料及各種參數等。Various programs stored in the computer-readable medium 204 include one or more commands. The computer can read the media 204 and store various data and parameters.
在圖案形成裝置10中，處理器202執行記憶於電腦可讀取媒體204之各種程式，以實現圖案形成裝置10中的各種功能。再者，術語程式的含義與術語軟體的含義相同。In the pattern forming device 10 , the processor 202 executes various programs stored in the computer readable medium 204 to realize various functions in the pattern forming device 10 . Furthermore, the term program has the same meaning as the term software.
控制裝置200經由通信介面206來實施與外部裝置的資料通信。通信接口206可應用USB等各種標準。USB是Universal Serial Bus的縮寫。通信介面206的通信形態可以應用有線通信及無線通信中的任一種。The control device 200 implements data communication with external devices through the communication interface 206 . The communication interface 206 can apply various standards such as USB. USB is the abbreviation of Universal Serial Bus. The communication mode of the communication interface 206 can be either wired communication or wireless communication.
控制裝置200經由輸入輸出介面208與輸入裝置214及顯示裝置216連接。輸入裝置214應用鍵盤及鼠標等輸入裝置。顯示裝置216顯示應用於控制裝置200之各種資訊。The control device 200 is connected to the input device 214 and the display device 216 via the input/output interface 208 . The input device 214 applies input devices such as a keyboard and a mouse. The display device 216 displays various information applied to the control device 200 .
顯示裝置216能夠應用液晶顯示、有機EL顯示及投影儀等。顯示裝置216能夠應用複數個裝置的任意的組合。再者，有機EL顯示的EL為Electro-Luminescence的縮寫。The display device 216 can apply a liquid crystal display, an organic EL display, a projector, or the like. The display device 216 can use any combination of a plurality of devices. Furthermore, EL in organic EL display is the abbreviation of Electro-Luminescence.
其中，作為處理器202的硬體的結構例，可舉出CPU、GPU、PLD（Programmable Logic Device：可程式邏輯裝置）及ASIC（Application Specific Integrated Circuit：特殊應用積體電路）。CPU係執行程式並作為各種功能部發揮作用之通用的處理器。GPU係專用於圖像處理之處理器。Examples of the hardware structure of the processor 202 include a CPU, a GPU, a PLD (Programmable Logic Device), and an ASIC (Application Specific Integrated Circuit). The CPU is a general-purpose processor that executes programs and functions as various functional units. GPU is a processor dedicated to image processing.
PLD係製造裝置之後能夠變更電路的結構之處理器。作為PLD的例子，可舉出FPGA（Field Programmable Gate Array：場域可程式閘陣列）。ASIC係具備用於執行特定的處理而專門設計之專用電路之處理器。PLD is a processor that can change the structure of the circuit after manufacturing the device. An example of PLD is Field Programmable Gate Array (FPGA). ASIC is a processor with specialized circuits designed to perform specific processing.
1個處理部可以由該等各種處理器中的1個來構成，亦可以由相同種類或不同種類的2個以上的處理器來構成。作為各種處理器的組合的例子，可舉出1個以上的FPGA與1個以上的CPU的組合、1個以上的FPGA與1個以上的GPU的組合。作為各種處理器的組合的其他例子，可舉出1個以上的CPU與1個以上的GPU的組合。One processing unit may be composed of one of these various processors, or may be composed of two or more processors of the same type or different types. Examples of combinations of various processors include a combination of one or more FPGAs and one or more CPUs, and a combination of one or more FPGAs and one or more GPUs. Another example of a combination of various processors is a combination of one or more CPUs and one or more GPUs.
可以使用1個處理器來構成複數個功能部。作為使用1個處理器來構成複數個功能部之例子，可舉出如下態樣：應用以客戶或伺服器等電腦為代表之SoC（System On a Chip：系統單晶片）等1個以上的CPU與軟體的組合來構成1個處理器，並使該處理器作為複數個功能部來發揮作用。One processor can be used to configure multiple functional units. An example of using one processor to configure multiple functional units is as follows: using one or more CPUs such as SoC (System On a Chip) represented by computers such as clients or servers. It is combined with software to form a processor and allows the processor to function as a plurality of functional units.
作為使用1個處理器來構成複數個功能部之其他例子，可舉出使用如下處理器之態樣：使用1個IC晶片來實現包括複數個功能部之系統整體的功能。Another example of using one processor to configure a plurality of functional units is to use a processor that uses one IC chip to realize the functions of the entire system including a plurality of functional units.
如上所述，各種功能部作為硬體結構使用1個以上的上述之各種處理器來構成。此外，更具體而言，上述之各種處理器的硬體結構為組合半導體元件等電路元件而成之電路（circuitry）。As described above, each functional unit is configured as a hardware structure using one or more of the various processors described above. In addition, more specifically, the hardware structure of the above-mentioned various processors is a circuit composed of a combination of circuit elements such as semiconductor elements.
電腦可讀取媒體204能夠包括ROM（Read Only Memory：唯讀記憶體）及RAM（Random Access Memory：隨機存取記憶）等半導體元件。電腦可讀取媒體204能夠包括硬碟等磁性記憶媒體。電腦可讀取媒體204能夠具備複數種類的記憶媒體。The computer-readable medium 204 can include semiconductor components such as ROM (Read Only Memory) and RAM (Random Access Memory). Computer-readable media 204 can include magnetic memory media such as hard drives. The computer-readable medium 204 can include multiple types of storage media.
圖8所示之圖案形成裝置10可以作為單獨的裝置而具備印刷區域資料生成裝置，該印刷區域資料生成裝置具備基板資料獲取部102、觀察資料獲取部104及印刷區域資料生成部106。又，圖案形成裝置10可以作為單獨的裝置而具備圖案資料生成裝置，該圖案資料生成裝置具備基板資料獲取部102、觀察資料獲取部104、印刷區域資料生成部106及圖案資料生成部108。The pattern forming device 10 shown in FIG. 8 may be provided with a printing area data generation device as a separate device, and the printing area data generation device includes a substrate data acquisition unit 102, an observation data acquisition unit 104, and a printing area data generation unit 106. Alternatively, the pattern forming device 10 may be a separate device and include a pattern data generating device including a substrate data acquisition unit 102, an observation data acquisition unit 104, a printing area data generation unit 106, and a pattern data generation unit 108.
亦即，圖案形成裝置10可以不具備基板資料獲取部102、觀察資料獲取部104及印刷區域資料生成部106，而從印刷區域資料生成裝置獲取印刷區域資料。又，圖案形成裝置10可以不具備基板資料獲取部102、觀察資料獲取部104、印刷區域資料生成部106及圖案資料生成部108，而從圖案資料生成裝置獲取圖案資料。That is, the pattern forming device 10 may not include the substrate data acquisition unit 102, the observation data acquisition unit 104, and the printing area data generation unit 106, but may acquire the printing area data from the printing area data generation device. In addition, the pattern forming apparatus 10 may not include the substrate data acquisition unit 102, the observation data acquisition unit 104, the printing area data generation unit 106, and the pattern data generation unit 108, but may acquire the pattern data from the pattern data generation device.
[功能性圖案的具體例] 圖10係表示功能性圖案的具體例之功能性圖案形成基板的剖面圖。在圖10中示出了被稱為正形之功能性圖案形成基板1000A的態樣。在圖10所示之功能性圖案形成基板1000A上形成由使用絕緣油墨之絕緣圖案1302及使用導電油墨之導電圖案1304構成之功能性圖案1300。功能性圖案1300作為電磁波屏蔽發揮作用，該電磁波屏蔽實現抑制來自電氣零件1204之電磁波的輻射及抑制電氣零件1204所接受之電磁波中的至少一種。 [Specific examples of functional patterns] FIG. 10 is a cross-sectional view of a functional pattern forming substrate showing a specific example of a functional pattern. FIG. 10 shows an aspect of a functional pattern forming substrate 1000A called a positive shape. A functional pattern 1300 composed of an insulating pattern 1302 using insulating ink and a conductive pattern 1304 using conductive ink is formed on the functional pattern forming substrate 1000A shown in FIG. 10 . The functional pattern 1300 functions as an electromagnetic wave shield that at least one of suppresses the radiation of electromagnetic waves from the electrical component 1204 and suppresses the electromagnetic waves received by the electrical component 1204 .
在功能性圖案形成基板1000A中，針對每個電氣零件1204個別地形成有絕緣圖案1302，與絕緣圖案1302重疊而形成有導電圖案1304，且針對每個電氣零件1204個別地形成有功能性圖案1300。亦即，作為形成功能性圖案1300之零件位置而規定每個電氣零件1204的位置。此處的電氣零件1204的位置係指電氣零件1204在電氣零件安裝基板1003中所佔有之區域。In the functional pattern forming substrate 1000A, an insulating pattern 1302 is formed individually for each electrical component 1204, a conductive pattern 1304 is formed overlapping the insulating pattern 1302, and a functional pattern 1300 is formed individually for each electrical component 1204. . That is, the position of each electrical component 1204 is defined as a component position forming the functional pattern 1300 . The position of the electrical component 1204 here refers to the area occupied by the electrical component 1204 on the electrical component mounting substrate 1003 .
圖10所示之功能性圖案1300旨在盡可能減少絕緣油墨的使用量來提高生產性之情況下為有利。又，功能性圖案1300旨在盡可能減少導電油墨及導電油墨的使用量來提高生產性之情況下亦為有利。The functional pattern 1300 shown in FIG. 10 is advantageous when it is intended to reduce the usage of insulating ink as much as possible to improve productivity. In addition, it is also advantageous when the functional pattern 1300 is intended to reduce conductive ink and the usage amount of conductive ink as much as possible to improve productivity.
圖11係表示功能性圖案的另一具體例之功能性圖案形成基板的剖面圖。在圖11中示出了被稱為埋入之功能性圖案形成基板1000B的態樣。在圖11所示之功能性圖案形成基板1000B中，形成有與複數個電氣零件1204為一體的功能性圖案1310。FIG. 11 is a cross-sectional view of a functional pattern forming substrate showing another specific example of the functional pattern. FIG. 11 shows an aspect of a functional pattern forming substrate 1000B called embedded. In the functional pattern forming substrate 1000B shown in FIG. 11, a functional pattern 1310 integrated with a plurality of electrical components 1204 is formed.
在功能性圖案1310中，在包括複數個電氣零件1204之區域形成有絕緣圖案1302，與絕緣圖案1302重疊而形成有導電圖案1304，對於複數個電氣零件1204形成有連續之功能性圖案1310。亦即，作為形成有功能性圖案1310之零件位置而規定包括複數個電氣零件1204之區域。In the functional pattern 1310, an insulating pattern 1302 is formed in a region including a plurality of electrical components 1204, a conductive pattern 1304 is formed overlapping the insulating pattern 1302, and a continuous functional pattern 1310 is formed for the plurality of electrical components 1204. That is, a region including a plurality of electrical components 1204 is defined as a component position where the functional pattern 1310 is formed.
換言之，功能性圖案1310包括與複數個電氣零件1204為一體的絕緣圖案1312，且包括與絕緣圖案1312重疊而形成之導電圖案1314。In other words, the functional pattern 1310 includes an insulating pattern 1312 integrated with the plurality of electrical components 1204, and includes a conductive pattern 1314 formed by overlapping the insulating pattern 1312.
圖11所示之功能性圖案1310在如下情況下為有利：在零件位置填充充分的絕緣油墨及導電油墨，以生成對機械衝擊較強的電氣零件安裝基板1003。The functional pattern 1310 shown in FIG. 11 is advantageous when the parts are filled with sufficient insulating ink and conductive ink to create an electrical parts mounting substrate 1003 that is strong against mechanical impact.
對1個電氣零件安裝基板1003，可以組合圖10所示之功能性圖案1300及圖11所示之功能性圖案1310。例如，在安裝有複數個電氣零件1204之情況下，可以在孤立之電氣零件1204形成有保形的功能性圖案1300，並且在密集之複數個電氣零件1204形成有埋入的功能性圖案1310。For one electrical component mounting substrate 1003, the functional pattern 1300 shown in FIG. 10 and the functional pattern 1310 shown in FIG. 11 can be combined. For example, when a plurality of electrical components 1204 are installed, a conformal functional pattern 1300 may be formed on the isolated electrical component 1204, and a buried functional pattern 1310 may be formed on the dense plurality of electrical components 1204.
圖4至圖6所示之圖案形成裝置10能夠選擇性地切換自在地構成保形的功能性圖案1300的形成與埋入的功能性圖案1310的形成。換言之，圖6所示之印刷區域資料生成部106可以生成保形的功能性圖案1300的印刷區域資料，亦可以生成埋入的功能性圖案1310的印刷區域資料。兩者的選擇可以藉由使用者輸入來實施，亦可以根據電氣零件安裝基板1003的設計資料自動地實施。The pattern forming device 10 shown in FIGS. 4 to 6 can selectively and freely switch between the formation of the conformal functional pattern 1300 and the formation of the embedded functional pattern 1310 . In other words, the printing area data generating unit 106 shown in FIG. 6 can generate printing area data of the conformal functional pattern 1300 or can also generate printing area data of the embedded functional pattern 1310. The selection of the two can be performed by user input, or can be performed automatically based on the design data of the electrical component mounting substrate 1003 .
[功能性圖案形成系統的結構例] 圖12係實施形態之圖案形成系統的整體結構圖。在以下說明中，在無需區分圖10所示之功能性圖案1300與圖11所示之功能性圖案1310時，省略符號而記載為功能性圖案。 [Structure example of functional pattern forming system] FIG. 12 is an overall structural diagram of the pattern forming system according to the embodiment. In the following description, when there is no need to distinguish between the functional pattern 1300 shown in FIG. 10 and the functional pattern 1310 shown in FIG. 11 , the reference numerals are omitted and are described as functional patterns.
同樣地，在無需區分絕緣圖案1302與絕緣圖案1312時，省略符號而記載為絕緣圖案，在無需區分導電圖案1304與導電圖案1314時，省略符號而記載為導電圖案。Similarly, when it is not necessary to distinguish the insulating pattern 1302 and the insulating pattern 1312, the reference numerals are omitted and they are described as insulating patterns. When there is no need to distinguish the conductive pattern 1304 and the conductive pattern 1314, the reference numerals are omitted and they are described as conductive patterns.
圖12所示之功能性圖案形成基板製造系統300具備伺服器裝置302、基板CAD裝置304及圖案資料生成裝置306及圖案形成裝置308。伺服器裝置302、基板CAD裝置304、圖案資料生成裝置306及圖案形成裝置308經由網絡以能夠相互通信的方式電連接。The functional pattern forming substrate manufacturing system 300 shown in FIG. 12 includes a server device 302, a substrate CAD device 304, a pattern data generating device 306, and a pattern forming device 308. The server device 302, the substrate CAD device 304, the pattern data generation device 306, and the pattern forming device 308 are electrically connected to each other via a network so as to be able to communicate with each other.
伺服器裝置302接收從各裝置發送之各種資料。伺服器裝置302向各裝置發送在處理中所使用之資料。伺服器裝置302可以記憶應用於各裝置之各種程式。伺服器裝置302可以記憶應用於各裝置之各種資料。伺服器裝置302可以為物理伺服器，亦可以為虛擬伺服器。The server device 302 receives various data sent from various devices. Server device 302 sends data used in processing to each device. The server device 302 can store various programs applied to each device. The server device 302 can store various data applicable to each device. The server device 302 may be a physical server or a virtual server.
基板CAD裝置304應用於形成於印刷配線基板1002之電子電路的設計。基板CAD裝置304規定作為二維資訊之功能性油墨的印刷區域。亦即，基板CAD裝置304生成表示功能性油墨的印刷區域之功能性油墨印刷區域資料。作為基板CAD裝置304，可以應用在功能性油墨的印刷形狀設計中能夠記述三維資訊之CAD裝置。The substrate CAD device 304 is applied to the design of electronic circuits formed on the printed wiring substrate 1002 . The substrate CAD device 304 specifies a printing area of functional ink as two-dimensional information. That is, the substrate CAD device 304 generates functional ink printing area data indicating the printing area of the functional ink. As the substrate CAD device 304, a CAD device capable of describing three-dimensional information for printing shape design of functional ink can be applied.
基板CAD裝置304可以具有CAM功能。再者，CAD是Computer Aided Design的縮寫，CAM是Computer Aided Manufacturing的縮寫。The substrate CAD device 304 may have CAM functionality. Furthermore, CAD is the abbreviation of Computer Aided Design, and CAM is the abbreviation of Computer Aided Manufacturing.
圖案資料生成裝置306由至少1個電腦實現。圖案資料生成裝置306包括處理器及記憶體。圖案資料生成裝置306的處理器及記憶體的結構與圖案形成裝置10的處理器202及電腦可讀介質204的記憶體相同。The pattern data generating device 306 is implemented by at least one computer. The pattern data generating device 306 includes a processor and a memory. The structure of the processor and memory of the pattern data generating device 306 is the same as that of the processor 202 and the memory of the computer-readable medium 204 of the pattern forming device 10 .
圖案資料生成裝置306實現與圖案形成裝置10的印刷區域資料生成部106及圖案資料生成部108相同的功能。亦即，圖案資料生成裝置306依據使用基板CAD裝置304而被規定之功能性油墨印刷區域資料，生成應用於圖案形成裝置308之圖案資料。又，圖案資料生成裝置306根據攝影機16生成的觀察資料來補正印刷區域並生成反映了補正之圖案資料。圖案資料生成裝置306可以根據攝影機16生成的觀察資料來生成表示功能性油墨的印刷區域的功能性油墨印刷區域資料。The pattern data generation device 306 implements the same functions as the printing area data generation unit 106 and the pattern data generation unit 108 of the pattern forming device 10 . That is, the pattern data generating device 306 generates pattern data to be applied to the pattern forming device 308 based on the functional ink printing area data specified using the substrate CAD device 304 . Furthermore, the pattern data generating device 306 corrects the printing area based on the observation data generated by the camera 16 and generates pattern data reflecting the correction. The pattern data generation device 306 can generate functional ink printing area data indicating the printing area of the functional ink based on the observation data generated by the camera 16 .
又，圖案資料生成裝置306根據攝影機16生成的觀察資料來測定電氣零件安裝基板1003上的電氣零件1204的位置。具體而言，圖案資料生成裝置306對以對準標記1210為原點之電氣零件1204的座標進行測定。Furthermore, the pattern data generating device 306 measures the position of the electrical component 1204 on the electrical component mounting substrate 1003 based on the observation data generated by the camera 16 . Specifically, the pattern data generating device 306 measures the coordinates of the electrical component 1204 with the alignment mark 1210 as the origin.
電氣零件1204的座標能夠應用三維正交座標系。作為三維正交座標系的例子，可舉出在電氣零件安裝基板1003的零件安裝面1004上規定X方向及Y方向、將零件安裝面1004的法線方向規定為Z方向之例子。能夠將基板寬度方向設為X方向、將基板傳送方向設為Y方向。The coordinates of the electrical component 1204 can use a three-dimensional orthogonal coordinate system. As an example of the three-dimensional orthogonal coordinate system, the X direction and the Y direction are defined on the component mounting surface 1004 of the electrical component mounting board 1003, and the normal direction of the component mounting surface 1004 is defined as the Z direction. The substrate width direction can be the X direction, and the substrate transport direction can be the Y direction.
電氣零件1204的座標應用於電氣零件1204的位置、姿勢及尺寸的規定。換言之，電氣零件1204的座標能夠包括表示電氣零件1204在電氣零件安裝基板1003的零件安裝面1004中所佔有之空間之複數個座標。The coordinates of the electrical component 1204 are used to define the position, posture, and size of the electrical component 1204 . In other words, the coordinates of the electrical component 1204 can include a plurality of coordinates representing the space occupied by the electrical component 1204 in the component mounting surface 1004 of the electrical component mounting substrate 1003 .
在回流焊步驟中，電氣零件1204表現自對準效果而定位，但由於自對準效果的表現而引起之電氣零件1204的定位誤差有可能超過容許範圍。因此，需要將電氣零件1204的定位誤差適當地反映到圖案資料中。During the reflow soldering step, the electrical component 1204 exhibits a self-alignment effect and is positioned. However, the positioning error of the electrical component 1204 caused by the self-alignment effect may exceed the allowable range. Therefore, it is necessary to appropriately reflect the positioning error of the electrical component 1204 in the pattern data.
又，由於回流焊步驟的熱量，有可能發生印刷配線基板1002本身的變形。因此，需要對包括印刷配線基板1002本身的變形的影響之圖案資料進行補正。In addition, the printed wiring board 1002 itself may be deformed due to the heat of the reflow soldering step. Therefore, it is necessary to correct the pattern data including the influence of deformation of the printed wiring board 1002 itself.
圖案資料依據印刷解析度包括複數個像素而構成。在形成有包括圖10所示之絕緣圖案1302及導電圖案1304之功能性圖案1300之情況下，圖案資料生成裝置306生成表示絕緣圖案1302之絕緣圖案資料及表示導電圖案1304之導電圖案資料。The pattern data is composed of a plurality of pixels according to the printing resolution. In the case where the functional pattern 1300 including the insulating pattern 1302 and the conductive pattern 1304 shown in FIG. 10 is formed, the pattern data generating device 306 generates insulating pattern data representing the insulating pattern 1302 and conductive pattern data representing the conductive pattern 1304.
圖案形成裝置308具備圖4及圖5所示之圖案形成裝置10的構成要素。圖案形成裝置308具備圖6所示之系統控制部100、驅動電壓生成部110、傳送控制部112、曝光控制部114、攝影機控制部116、記憶體120及感測器122。The pattern forming device 308 includes the components of the pattern forming device 10 shown in FIGS. 4 and 5 . The pattern forming device 308 includes the system control unit 100, the driving voltage generation unit 110, the transmission control unit 112, the exposure control unit 114, the camera control unit 116, the memory 120 and the sensor 122 shown in FIG. 6 .
功能性圖案形成基板製造系統300是印刷系統的一例。The functional pattern forming substrate manufacturing system 300 is an example of a printing system.
[第1實施形態] 〔圖案資料的生成〕 對第1實施形態之圖案資料的生成進行說明。再者，印刷區域資料的生成及圖案資料的生成可以藉由圖案形成裝置10的印刷區域資料生成部106及圖案資料生成部108實施，亦可以藉由圖案資料生成裝置306實施。 [First Embodiment] [Generation of pattern data] The generation of pattern data in the first embodiment will be described. Furthermore, the generation of printing area data and the generation of pattern data can be implemented by the printing area data generation unit 106 and the pattern data generation unit 108 of the pattern forming device 10, or by the pattern data generation device 306.
如上所述，電氣零件安裝基板1003首先通過噴墨頭12及UV曝光裝置14的下方而不進行功能性油墨的賦予及UV曝光，在通過攝影機16的下方的同時拍攝功能性油墨賦予前的圖像。圖案形成裝置10利用圖案資料生成裝置306，根據攝影機16生成的觀察資料，推測安裝在電氣零件安裝基板1003的零件安裝面1004上的電氣零件的零件名稱、形狀，及高度中的至少1個。最好使用人工智能（AI：Artificial Intelligence）進行推測。As described above, the electrical component mounting substrate 1003 first passes under the inkjet head 12 and the UV exposure device 14 without applying functional ink and UV exposure, and then passes under the camera 16 and captures a picture before applying the functional ink. picture. The pattern forming device 10 uses the pattern data generating device 306 to estimate at least one of the component name, shape, and height of the electrical component mounted on the component mounting surface 1004 of the electrical component mounting substrate 1003 based on the observation data generated by the camera 16 . It is best to use artificial intelligence (AI: Artificial Intelligence) for speculation.
在第1實施形態中，可以從賦予功能性油墨的電氣零件安裝基板1003的CAD/CAM資料獲得零件資訊。此外，藉由組合分析觀察資料來推測電氣零件信息的方法，可以檢測零件搭載錯誤。In the first embodiment, the component information can be obtained from the CAD/CAM data of the electrical component mounting substrate 1003 provided with functional ink. In addition, component mounting errors can be detected by combining analysis of observation data to infer electrical component information.
例如，層積陶瓷電容器有複數個製造商生產，即使在同一製造商中，亦有複數個型號。關於它們，可以根據從攝影機16的觀察資料獲得的電氣零件的平面尺寸資訊、電極的圖案以及顏色，使用人工智能來判斷製造商及型號。For example, laminated ceramic capacitors are produced by multiple manufacturers, and even within the same manufacturer, there are multiple models. Regarding them, artificial intelligence can be used to determine the manufacturer and model based on the plane size information of the electrical components, the pattern and color of the electrodes obtained from the observation data of the camera 16 .
可以使用經過學習的模型來作為人工智能。經過學習的模型使用例如卷積神經網絡構成。根據電氣零件的觀察資料推測電氣零件的製造商及型號的經過學習的模型是藉由電氣零件的圖像和該電氣零件的製造商及型號的信息為一組的學習用的學習資料集機器學習的。Learned models can be used as artificial intelligence. The learned model is constructed using, for example, a convolutional neural network. The learned model for inferring the manufacturer and model of an electrical component based on the observation data of the electrical component is machine learning using a set of learning data sets of images of the electrical component and information on the manufacturer and model of the electrical component. of.
又，藉由根據推測的零件名稱檢索電氣零件庫的信息，可以由數百dpi程度的比攝影機解析度高的解析度獲得製造尺寸、及安裝有電氣零件的正確的位置。再者，dpi是dots per inch的縮寫。In addition, by searching the information of the electrical parts library based on the presumed part name, the manufacturing dimensions and the correct position where the electrical parts are mounted can be obtained with a resolution of several hundred dpi that is higher than the resolution of a camera. Furthermore, dpi is the abbreviation of dots per inch.
又，即使根據觀察資料的分析結果不能確定正確的零件名稱時，例如亦可以根據層積陶瓷電容器的信息大致地類推長方體的零件形狀。又，不僅可以根據電氣零件本身的觀察資料，還可以根據電氣零件的周圍零件（最寬區域的整個電氣零件安裝基板的圖像）的觀察資料，高精度地推測該電氣零件名稱。具體而言，發現靠近數字電源電路系統時，推測其周圍存在線圈及水晶振蕩器。Even if the correct part name cannot be determined based on the analysis results of the observation data, for example, the shape of the rectangular parallelepiped part can be roughly inferred based on the information on the laminated ceramic capacitor. Furthermore, the name of the electrical component can be estimated with high accuracy based not only on the observation data of the electrical component itself, but also on the observation data of the surrounding parts of the electrical component (the image of the entire electrical component mounting board in the widest area). Specifically, when it is found close to a digital power circuit system, it is speculated that there are coils and crystal oscillators around it.
使用圖案形成裝置10的用戶指定要形成功能性圖案的區域，亦即要賦予功能性油墨的賦予區域（塗布區域）時，包圍電氣零件安裝基板的預定區域。藉此，用戶期待預定區域內被適當地塗敷功能性油墨。這樣的圖像資料的製作通常使用基板CAD裝置304或未圖示的CAM裝置來進行。相對於在顯示裝置216中輸入的圖像，用戶可以使用輸入裝置214來指定塗布區域。When a user using the pattern forming device 10 designates an area where a functional pattern is to be formed, that is, an application area (coating area) where functional ink is to be applied, a predetermined area surrounding the electrical component mounting substrate is enclosed. Thereby, the user expects the functional ink to be appropriately applied in the predetermined area. Creation of such image data is usually performed using the substrate CAD device 304 or a CAM device (not shown). The user can specify the coating area using the input device 214 relative to the image input in the display device 216 .
圖13係表示指定塗布區域的一例的圖。圖13中實線包圍的區域為塗布區域S。在第1實施形態中，用絕緣油墨填埋塗布區域S。為了用絕緣油墨填埋塗布區域S，可以使塗布區域S中存在的電氣零件被絕緣油墨填埋，或者使絕緣油墨對整個塗布區域S保形地塗敷。為了使絕緣油墨填埋電氣零件，例如，可以製作圖案資料，以比存在於塗布區域S的電氣零件中的高度（電氣零件安裝面1004的法線方向上的電氣零件的長度）最高的電氣零件的高度稍高的高度填埋絕緣油墨。或者，亦可以製作大致填滿塗布區域S的高度的圖案資料。FIG. 13 is a diagram showing an example of a designated coating area. The area surrounded by solid lines in Figure 13 is the coating area S. In the first embodiment, the coating area S is filled with insulating ink. In order to fill the coating area S with the insulating ink, the electrical components present in the coating area S may be filled with the insulating ink, or the entire coating area S may be conformally coated with the insulating ink. In order to embed the electrical components with the insulating ink, for example, a pattern material may be created so as to be higher than the height of the electrical components (the length of the electrical components in the normal direction of the electrical component mounting surface 1004) among the electrical components present in the coating area S. The height is slightly higher than the height of the insulating ink filled. Alternatively, pattern data may be produced that substantially fills the height of the coating area S.
當塗布填埋至存在於塗布區域S的電氣零件的高度的圖案資料時，需要存在於塗覆區域S的電氣零件的高度信息。功能性圖案形成基板製造系統300從CAD/CAM資料中取得電氣零件的高度信息，并且藉由使用由攝影機16所拍攝的資料，能夠求出電氣零件的正確的高度。When applying pattern data that fills the height of the electrical components existing in the coating area S, height information of the electrical components existing in the coating area S is required. The functional pattern forming substrate manufacturing system 300 obtains the height information of the electrical components from the CAD/CAM data, and can obtain the correct height of the electrical components by using the data captured by the camera 16 .
圖14的F14A～圖14的F14B係功能性圖案形成基板的剖面圖。在此，簡化圖示，示出了在包括4個電氣零件1024A、1024B、1024C及1024D的塗布區域S中形成了由絕緣油墨構成之絕緣圖案1022的示例。圖14的F14A係示出了將整個塗布區域S保形地塗敷的功能性圖案形成基板1000C。在圖14的F14A中，高度超過4個電氣零件1024A、1024B、1024C及1024D中高度最高的電氣零件1204C的高度的絕緣油墨被賦予到整個塗布區域S，形成上表面平坦的絕緣圖案1022。F14A in FIG. 14 to F14B in FIG. 14 are cross-sectional views of the functional pattern forming substrate. Here, the diagram is simplified and shows an example in which the insulating pattern 1022 made of insulating ink is formed in the coating area S including four electrical components 1024A, 1024B, 1024C, and 1024D. F14A in FIG. 14 shows a functional pattern forming substrate 1000C in which the entire coating area S is conformally coated. In F14A of FIG. 14 , insulating ink having a height exceeding the height of the electrical component 1204C, which is the highest among the four electrical components 1024A, 1024B, 1024C, and 1024D, is applied to the entire coating area S, forming an insulating pattern 1022 with a flat upper surface.
圖14的F14B示出了根據塗布區域S的各電氣零件的高度來賦予絕緣油墨的功能性圖案形成基板1000D的示例。在圖14的F14B中，賦予絕緣油墨直到分別覆蓋4個電氣零件1024A、1024B、1024C及1024D的上表面的高度。F14B of FIG. 14 shows an example of the functional pattern forming substrate 1000D in which insulating ink is applied according to the height of each electrical component in the coating area S. In F14B of FIG. 14 , the insulating ink is applied to a height that covers the upper surfaces of the four electrical components 1024A, 1024B, 1024C, and 1024D respectively.
再者，亦存在安裝在電氣零件1004的電氣零件與零件安裝面1004之間具有間隙的電氣零件。圖15的F15A～圖15的F15B係示出與零件安裝面1004之間形成間隙的電氣零件的一例即IC1400的圖。圖15的F15A係IC1400的斜視圖。IC 1400是分別從封裝部分1402的兩個側面突出7個引線部1404的14終端類型的SOP。Furthermore, there are also electrical components that have a gap between the electrical components mounted on the electrical components 1004 and the component mounting surface 1004 . F15A in FIG. 15 to F15B in FIG. 15 are diagrams showing IC 1400 as an example of an electrical component forming a gap with the component mounting surface 1004 . Figure 15 is a perspective view of the F15A series IC1400. The IC 1400 is a 14-terminal type SOP in which seven lead portions 1404 respectively protrude from both sides of the package portion 1402 .
圖15的F15B係IC1400的側面的局部放大圖。如圖15的F15B所示，IC1400中，引線部1404的端部1404A比封裝部1402的底面1402A更向下方（-Z方向）延伸。14個引線部1404的形狀相同。因此，當引線部1404的端部1404A固定到零件安裝面1004時，在零件安裝面1004和封裝部1402的底面1402A之間形成間隙。Figure 15 is a partial enlarged view of the side of the F15B series IC1400. As shown in F15B of FIG. 15 , in the IC 1400 , the end portion 1404A of the lead portion 1404 extends downward (in the −Z direction) from the bottom surface 1402A of the package portion 1402 . The 14 lead portions 1404 have the same shape. Therefore, when the end portion 1404A of the lead portion 1404 is fixed to the component mounting surface 1004, a gap is formed between the component mounting surface 1004 and the bottom surface 1402A of the package portion 1402.
在此，以SOP為例進行了說明，但對於QFP等也是同樣的。再者，SOP是Small Outline Package的縮寫，QFP是Quad Flat Package的縮寫。Here, SOP is used as an example for explanation, but the same applies to QFP and the like. Furthermore, SOP is the abbreviation of Small Outline Package, and QFP is the abbreviation of Quad Flat Package.
對於IC1400這樣的電氣零件，可以將用於填埋零件安裝面1004和電氣零件閒的間隙所需的絕緣油墨的賦予量追加到電氣零件周圍。必要的絕緣油墨的賦予量可以用封裝的面積乘以間隙的高度來計算。For an electrical component such as the IC 1400, the amount of insulating ink required to fill the gap between the component mounting surface 1004 and the electrical component can be added around the electrical component. The necessary amount of insulating ink to be applied can be calculated by multiplying the area of the package by the height of the gap.
又，有些電氣零件還具有懸垂形狀。圖16係表示具有懸垂形狀的電氣零件的一例即線圈1410的圖。如圖16所示，線圈1410具備在繞線芯的兩端設置有凸緣1412A及凸緣1412B的繞線筒1412，線材1414纏繞在繞線筒1412的繞線芯上。從Z方向觀察，捲繞在繞線芯上的線材1414的最外周停留在凸緣1412A及凸緣1412B的內側。亦即，線圈1410具有懸垂形狀。In addition, some electrical parts also have overhanging shapes. FIG. 16 is a diagram showing a coil 1410 which is an example of an electrical component having a pendant shape. As shown in FIG. 16 , the coil 1410 includes a bobbin 1412 having flanges 1412A and 1412B provided at both ends of a winding core, and the wire 1414 is wound around the winding core of the bobbin 1412 . Viewed from the Z direction, the outermost periphery of the wire 1414 wound around the winding core stays inside the flange 1412A and the flange 1412B. That is, the coil 1410 has a pendant shape.
為了填充圖案形成裝置10中的線圈1410那樣具有懸垂形狀的電氣零件的懸垂部分，需要增加電氣零件周圍的絕緣油墨的賦予量。功能性圖案形成基板製造系統300藉由從CAD/CAM的資料中取得高度信息，並利用攝影機16所拍攝的資料來求出電氣零件的準確的形狀，可以將懸垂的體積計算為應增加的絕緣油墨的賦予量。In order to fill the overhanging portion of an electrical component having an overhang shape like the coil 1410 in the pattern forming device 10, it is necessary to increase the amount of insulating ink applied around the electrical component. The functional pattern forming substrate manufacturing system 300 obtains the height information from the CAD/CAM data and uses the data captured by the camera 16 to obtain the accurate shape of the electrical component, and can calculate the overhanging volume as the insulation that should be added. The amount of ink applied.
如此一來，功能性圖案形成基板製造系統300便可根據電氣零件的形狀，決定噴墨頭12所吐出的絕緣油墨的賦予量，並生成圖案資料。In this way, the functional pattern forming substrate manufacturing system 300 can determine the amount of insulating ink ejected from the inkjet head 12 according to the shape of the electrical component, and generate pattern data.
又，亦有不應賦予絕緣油墨的電氣零件。圖17係表示不應賦予絕緣油墨的電氣零件的一例即溫濕度感測器1420的圖。如圖17所示，溫濕度感測器1420中，檢測元件1422露出於封裝體的中央部，因此溫濕度感測器1420（至少檢測元件1422）不應塗有絕緣油墨。In addition, there are also electrical parts that should not be coated with insulating ink. FIG. 17 is a diagram showing a temperature and humidity sensor 1420 which is an example of an electrical component to which insulating ink should not be applied. As shown in FIG. 17 , in the temperature and humidity sensor 1420 , the detection element 1422 is exposed at the center of the package, so the temperature and humidity sensor 1420 (at least the detection element 1422 ) should not be coated with insulating ink.
又，對於若賦予絕緣油墨則在之後的電連接出現問題的電氣零件不會賦予油墨。圖18係表示因賦予絕緣油墨而電連接出現問題的電氣零件的一例即連接器1430的圖。如圖18所示，連接器1430是基板間連接器，連接到設置於配對的未圖示的印刷基板上的連接器。若絕緣油墨施加到連接器1430，則基板間的電連接出現障礙。In addition, ink is not applied to electrical components that may cause problems with subsequent electrical connections if insulating ink is applied. FIG. 18 is a diagram showing a connector 1430 which is an example of an electrical component having problems with electrical connection due to application of insulating ink. As shown in FIG. 18 , the connector 1430 is an inter-board connector and is connected to a connector provided on a mating printed circuit board (not shown). If insulating ink is applied to the connector 1430, electrical connections between the substrates may be disrupted.
又，對於如開關那樣的可動零件不賦予絕緣油墨。In addition, insulating ink is not applied to movable parts such as switches.
對於如溫濕度感測器1420、連接器1430及開關那樣不應賦予絕緣油墨的電氣零件，需要禁止圖案形成裝置10中的絕緣油墨的賦予。功能性圖案形成基板製造系統300藉由從CAD/CAM資料中取得電氣零件的特性資訊，并且利用攝影機16所拍攝的資料，求出電氣零件的準確特性，判斷該電氣零件的位置不應賦予絕緣油墨，生成不對周邊賦予絕緣油墨的圖案資料。For electrical components that should not be applied with insulating ink, such as the temperature and humidity sensor 1420, the connector 1430, and the switch, it is necessary to prohibit the application of insulating ink in the pattern forming device 10. The functional pattern forming substrate manufacturing system 300 obtains the characteristic information of the electrical component from the CAD/CAM data and uses the data captured by the camera 16 to obtain the accurate characteristics of the electrical component and determine that the position of the electrical component should not be insulated. Ink is used to create pattern materials that do not apply insulating ink to the surrounding area.
如此一來，功能性圖案形成基板製造系統300便可根據電氣零件的特性，決定賦予絕緣油墨的區域，並生成圖案資料。In this way, the functional pattern forming substrate manufacturing system 300 can determine the area to be applied with insulating ink based on the characteristics of the electrical component, and generate pattern data.
此外，如果從特定的電氣零件名稱中發現該電氣零件不是雜訊源並且判明為不太可能受到外部雜訊的不利影響的零件時，為了減少消耗油墨量，無需對該電氣零件賦予油墨。例如，電容器等。功能性圖案形成基板製造系統300生成考慮到這些之圖案資料。In addition, if it is found from the name of a specific electrical component that the electrical component is not a noise source and is found to be a component that is unlikely to be adversely affected by external noise, there is no need to apply ink to the electrical component in order to reduce the amount of ink consumed. For example, capacitors, etc. The functional patterning substrate manufacturing system 300 generates pattern data taking these into consideration.
又，功能性圖案形成基板製造系統300，在賦予絕緣油墨之後再賦予導電油墨時，生成圖案資料以使絕緣油墨不賦予到電氣零件安裝基板1003的接地圖案。Furthermore, the functional pattern forming substrate manufacturing system 300 generates pattern data so that the insulating ink is not applied to the ground pattern of the electrical component mounting substrate 1003 when applying the conductive ink after applying the insulating ink.
在塗布區域S中存在不賦予絕緣油墨的電氣零件時，可以將該電氣零件通知給用戶。When there is an electrical component to which insulating ink is not applied in the coating area S, the user can be notified of the electrical component.
〔位置偏差的補正〕 功能性圖案形成基板製造系統300期望根據攝影機16的拍攝圖像，檢測電氣零件的平面方向（與電氣零件安裝基板1003的零件安裝面1004平行的方向）的位置偏差，與檢測到的位置偏差對應地補正圖案資料。再者，補正圖案資料與生成新的補正圖案為相同含義。 [Correction of position deviation] The functional pattern forming substrate manufacturing system 300 is expected to detect the positional deviation of the electrical component in the plane direction (the direction parallel to the component mounting surface 1004 of the electrical component mounting substrate 1003) based on the image captured by the camera 16, and to correspond to the detected positional deviation. Correct the pattern data. Furthermore, correcting pattern data and generating a new correction pattern have the same meaning.
圖19的F19A～圖19的F19D係用於說明第1實施形態之圖案資料的補正的圖。圖19的F19A～圖19的F19D所示的XY座標表示圖案資料的設計座標系。圖19的F19A表示絕緣圖案的形成區域亦即絕緣油墨的塗布區域S的設計資料DD1。如圖19的F19A所示，設計資料DD1包括塗布區域S中包含的零件區域PT1、PT2及PT3。零件區域PT1、PT2及PT3分別是相當於安裝在電氣零件安裝基板1003上的電氣零件的區域。F19A in FIG. 19 to F19D in FIG. 19 are diagrams for explaining the correction of pattern data in the first embodiment. The XY coordinates shown at F19A in Figure 19 to F19D in Figure 19 represent the design coordinate system of the pattern data. F19A in FIG. 19 represents the design data DD1 of the insulating ink coating area S which is the formation area of the insulating pattern. As shown in F19A of FIG. 19 , the design data DD1 includes the component areas PT1, PT2, and PT3 included in the coating area S. The component areas PT1, PT2, and PT3 are respectively areas corresponding to the electrical components mounted on the electrical component mounting substrate 1003.
圖19的F19B示出了拍攝應形成絕緣圖案的電氣零件安裝基板的塗布區域S的圖像資料DI1。如圖19的F19B所示，圖像資料DI1包括塗布區域S中包含的電氣零件1024E、1024F及1024G。電氣零件1024E、1024F及1024G是分別安裝在相當於設計資料DD1的零件區域PT1、PT2及PT3的位置的零件，但平面方向的位置偏移地被安裝。F19B in FIG. 19 shows image data DI1 capturing the coating area S of the electrical component mounting substrate on which the insulation pattern is to be formed. As shown in F19B of FIG. 19 , the image data DI1 includes the electrical components 1024E, 1024F, and 1024G included in the coating area S. Electrical components 1024E, 1024F, and 1024G are components mounted at positions corresponding to component areas PT1, PT2, and PT3 of the design data DD1, respectively, but are mounted so as to be offset in the plane direction.
圖19的F19C表示用於向塗布區域S賦予功能性油墨的圖案資料DP1。圖案資料DP1是根據設計資料DD1生成的。如圖19的F19C所示，圖案資料DP1包括塗布區域S中包含的零件區域PR1、PR2及PR3。零件區域PR1、PR2及PR3的塗布區域S內的位置與設計資料DD1的零件區域PT1、PT2及PT3的塗布區域S內的位置一致。F19C in FIG. 19 represents pattern data DP1 for applying functional ink to the coating area S. Pattern data DP1 is generated based on design data DD1. As shown in F19C of FIG. 19 , the pattern data DP1 includes the component areas PR1, PR2, and PR3 included in the coating area S. The positions in the coating area S of the parts areas PR1, PR2 and PR3 coincide with the positions in the coating area S of the part areas PT1, PT2 and PT3 of the design data DD1.
圖案形成裝置10根據圖案資料DP1，藉由進行多次印刷，而在塗布區域S形成絕緣圖案。此時，圖案形成裝置10首先將絕緣油墨賦予到塗布區域S中除零件區域PT1、PT2及PT3以外的區域。塗布區域S中除零件區域PT1、PT2及PT3以外的區域的油墨的厚度達到電氣零件1024E、1024F及1024G的高度後，在之後的印刷中，對包含零件區域PT1、PT2及PT3的整個塗布區域S賦予絕緣油墨。The pattern forming device 10 forms an insulating pattern in the coating area S by performing multiple printings based on the pattern data DP1. At this time, the pattern forming device 10 first applies the insulating ink to the areas of the coating area S except the component areas PT1, PT2, and PT3. After the thickness of the ink in the coating area S except the parts areas PT1, PT2 and PT3 reaches the height of the electrical parts 1024E, 1024F and 1024G, in the subsequent printing, the entire coating area including the parts areas PT1, PT2 and PT3 S imparts insulating ink.
這樣，多次印刷中的到中途為止的印刷中，零件區域PT1、PT2及PT3的位置很重要。因此，需要根據電氣零件1024E、1024F及1024G的偏差來生成對圖案資料的零件區域PR1、PR2及PR3的位置進行了補正的圖案資料。In this way, the positions of the part areas PT1, PT2, and PT3 are important during the printing up to the middle of the plurality of printings. Therefore, it is necessary to generate pattern data in which the positions of the component regions PR1, PR2, and PR3 of the pattern data are corrected based on the deviations of the electrical components 1024E, 1024F, and 1024G.
圖19的F19D表示功能性圖案形成基板製造系統300中根據電氣零件的位置偏差補正圖案資料DP1後的圖案資料DP2。圖案資料DP2是根據圖像資料DI1生成的。如圖19的F19D所示，圖案資料DP2包括塗布區域S中包含的零件區域PR1、PR2及PR3。圖案資料DP2的零件區域PR1、PR2及PR3的位置是根據圖像資料DI1的電氣零件1024E、1024F及1024G的位置偏差來補正的。圖案形成裝置10藉由使用圖案資料DP2向圖19的F19B拍攝的電氣零件安裝基板賦予絕緣油墨，能夠向在平面方向上位置偏移地安裝的電氣零件1024E、1024F及1024G的周圍適當地賦予絕緣油墨，可以適當地形成功能性圖案。F19D in FIG. 19 shows the pattern data DP2 after correcting the pattern data DP1 based on the positional deviation of the electrical component in the functional pattern forming substrate manufacturing system 300. Pattern data DP2 is generated based on image data DI1. As shown in F19D of FIG. 19 , the pattern data DP2 includes the component areas PR1, PR2, and PR3 included in the coating area S. The positions of the component areas PR1, PR2, and PR3 of the pattern data DP2 are corrected based on the positional deviations of the electrical components 1024E, 1024F, and 1024G of the image data DI1. By applying the insulating ink to the electrical component mounting substrate photographed at F19B in FIG. 19 using the pattern data DP2, the pattern forming device 10 can appropriately provide insulation around the electrical components 1024E, 1024F, and 1024G that are mounted offset in the plane direction. Ink, functional patterns can be formed appropriately.
功能性圖案形成基板製造系統300可根據工作台30與放置在工作台30上的電氣零件安裝基板的位置偏差，將圖案資料旋轉一角度或者將圖案資料伸縮。The functional pattern forming substrate manufacturing system 300 can rotate the pattern data by an angle or expand and contract the pattern data according to the positional deviation between the workbench 30 and the electrical component mounting substrate placed on the workbench 30 .
圖20係用於說明對於放置在工作台30上的電氣零件安裝基板的位置偏差的圖案資料的補正的圖。圖20所示的XY座標表示圖案資料的設計座標系。在此，對以對齊標記為基準計算“重心補正值”、“旋轉量”及“倍率補正值”的參數來進行定位的例子進行說明。FIG. 20 is a diagram for explaining correction of pattern data for positional deviation of the electrical component mounting substrate placed on the workbench 30 . The XY coordinates shown in Fig. 20 represent the design coordinate system of the pattern data. Here, an example in which the parameters of "center of gravity correction value", "rotation amount" and "magnification correction value" are calculated based on the alignment mark to perform positioning will be described.
圖20的F20A表示包含絕緣油墨的塗布區域的圖案資料DP1及由攝影機16拍攝的電氣零件安裝基板的圖像資料DI2。圖像資料DI2包括相當於電氣零件安裝基板的4個對準標記1210（參照圖3）的4個標記測量值MM1、MM2、MM3及MM4。又，圖案資料DP1包括相當於電氣零件安裝基板的4個對準標記1210的位置的4個標記設計值MD1、MD2、MD3及MD4。在此，由於工作台30和電氣零件安裝基板的位置偏移，因此圖案資料DP1的標記測量值MM1、MM2、MM3及MM4與圖像資料DI2的標記設計值MD1、MD2、MD3及MD4的位置分別不一致。F20A in FIG. 20 shows the pattern data DP1 including the coating area of the insulating ink and the image data DI2 of the electrical component mounting substrate captured by the camera 16 . The image data DI2 includes four mark measurement values MM1, MM2, MM3 and MM4 corresponding to the four alignment marks 1210 (see FIG. 3) of the electrical component mounting substrate. Furthermore, the pattern data DP1 includes four mark design values MD1, MD2, MD3, and MD4 corresponding to the positions of the four alignment marks 1210 of the electrical component mounting substrate. Here, since the positions of the workbench 30 and the electrical component mounting substrate are shifted, the position of the mark measurement values MM1, MM2, MM3 and MM4 of the pattern data DP1 and the mark design values MD1, MD2, MD3 and MD4 of the image data DI2 are are inconsistent respectively.
首先，功能性圖案形成基板製造系統300將圖案資料DP1的重心與圖像資料DI0的重心對齊。亦即，功能性圖案形成基板製造系統300將圖案資料DP1在X方向及Y方向上移動，使得標記測量值MM1、MM2、MM3及MM4的重心與標記設計值MD1、MD2、MD3及MD4的重心一致。在圖20的F20A所示的示例中，圖案資料DP1的重心與圖像資料DI0的重心的偏差量（重心補正值）在X方向上為dx，在Y方向上為dy。First, the functional pattern forming substrate manufacturing system 300 aligns the center of gravity of the pattern data DP1 with the center of gravity of the image data DI0. That is, the functional pattern forming substrate manufacturing system 300 moves the pattern data DP1 in the X direction and the Y direction so that the centers of gravity of the mark measurement values MM1, MM2, MM3 and MM4 are the same as the centers of gravity of the mark design values MD1, MD2, MD3 and MD4. consistent. In the example shown in F20A of FIG. 20 , the deviation amount (center of gravity correction value) between the center of gravity of the pattern data DP1 and the center of gravity of the image data DI0 is dx in the X direction and dy in the Y direction.
圖20的F20B表示圖案資料DP2及圖像資料DI2。圖案資料DP2係圖案資料DP1在X方向上僅移動dx，在Y方向上僅移動dy的資料。如圖20的F20B所示，圖案資料DP2的重心與圖像資料DI2的重心一致。F20B in Fig. 20 indicates pattern data DP2 and image data DI2. Pattern data DP2 is data in which pattern data DP1 moves only dx in the X direction and moves only dy in the Y direction. As shown in F20B of FIG. 20 , the center of gravity of the pattern data DP2 coincides with the center of gravity of the image data DI2.
其次，功能性圖案形成基板製造系統300將圖案資料DP2與圖像資料DI2對齊旋轉。亦即，功能性圖案形成基板製造系統300求出通過連接圖案資料DP2的標記設計值MD1及MD2的線的中心的垂線和通過連接圖像資料DI1的標記測量值MM1及MM2的線的中心的垂線的斜率θx。又，資料處理部134求出通過連接圖案資料DP2的標記設計值MD2及MD3的線的中心的垂線和通過連接圖像資料DI1的標記測量值MM2及MM3的線的中心的垂線的斜率θy。然後，資料處理部134將斜率θx和斜率θy的平均作為旋轉量θ，以與X方向及Y方向正交的方向為軸將圖案資料DP2僅旋轉旋轉量θ。Next, the functional pattern forming substrate manufacturing system 300 aligns and rotates the pattern data DP2 and the image data DI2. That is, the functional pattern forming substrate manufacturing system 300 determines the vertical line passing through the center of the line connecting the mark design values MD1 and MD2 of the pattern data DP2 and the center of the line connecting the mark measurement values MM1 and MM2 of the image data DI1. The slope of the vertical line θx. Furthermore, the data processing unit 134 determines the slope θy of the vertical line passing through the center of the line connecting the mark design values MD2 and MD3 of the pattern data DP2 and the vertical line passing through the center of the line connecting the mark measurement values MM2 and MM3 of the image data DI1. Then, the data processing unit 134 uses the average of the slope θx and the slope θy as the rotation amount θ, and rotates the pattern data DP2 by the rotation amount θ with the direction orthogonal to the X direction and the Y direction as an axis.
圖20的F20C表示圖案資料DP3及圖像資料DI1。再者，對於圖像資料DI2，未顯示外形，僅顯示標記測量值MM1、MM2、MM3及MM4。圖案資料DP3是將圖案資料DP2順時針僅旋轉旋轉量θ而得的資料。如圖20的F20C所示，圖像資料DI2的縱向（連接標記測量值MM2及MM3的方向）及橫向（連接標記測量值MM1及MM2的方向）與圖案資料設計座標系的X方向及Y方向一致。F20C in Fig. 20 indicates pattern data DP3 and image data DI1. Furthermore, for the image data DI2, the shape is not displayed, and only the mark measurement values MM1, MM2, MM3 and MM4 are displayed. Pattern data DP3 is data obtained by rotating pattern data DP2 clockwise by the rotation amount θ. As shown in F20C in Figure 20, the vertical direction (the direction connecting the mark measurement values MM2 and MM3) and the horizontal direction (the direction connecting the mark measurement values MM1 and MM2) of the image data DI2 and the X direction and Y direction of the pattern data design coordinate system consistent.
最後，功能性圖案形成基板製造系統300將圖案資料DP3與圖像資料DI2對齊變倍。亦即，功能性圖案形成基板製造系統300用最小二乘法計算標記測量值MM1、MM2、MM3及MM4的重心與標記設計值MD1、MD2、MD3及MD4各自的距離d1、d2、d3及d4的平方和最小的kx及ky（倍率補正值）。Finally, the functional pattern forming substrate manufacturing system 300 aligns and magnifies the pattern data DP3 and the image data DI2. That is, the functional pattern forming substrate manufacturing system 300 calculates the distances d1, d2, d3 and d4 between the centers of gravity of the mark measurement values MM1, MM2, MM3 and MM4 and the mark design values MD1, MD2, MD3 and MD4 using the least square method. kx and ky (magnification correction value) with the smallest sum of squares.
圖20的F20D示出通過將圖案資料DP3僅變倍kx及ky而得的圖案資料DP4。圖案資料DP4與圖像資料DI1的位置、斜率及大小一致。亦即，圖案形成裝置10可以藉由使用圖案資料DP4將絕緣油墨適當地賦予到電氣零件安裝基板。F20D in FIG. 20 shows pattern data DP4 obtained by changing the magnification of pattern data DP3 by only kx and ky. The position, slope and size of the pattern data DP4 and the image data DI1 are consistent. That is, the pattern forming device 10 can appropriately apply the insulating ink to the electrical component mounting substrate by using the pattern data DP4.
在此，對使用4個對準標記補正圖案資料的示例進行了說明，但是可以讀取和分割包括4個角的更多點處的標記來補正。又，代替對準標記，可以讀取安裝的電氣零件，使用設計上的電氣零件的位置與讀取的電氣零件的位置來補正圖案資料。Here, an example in which four alignment marks are used to correct the pattern data has been described, but it is possible to read and divide marks at more points including four corners for correction. In addition, instead of the alignment mark, the mounted electrical component can be read, and the pattern data can be corrected using the designed position of the electrical component and the read position of the electrical component.
如上所述，根據第1實施形態，從電氣零件安裝基板的觀測資料中至少獲取安裝在電氣零件安裝基板上的電氣零件的觀察資料，並根據電氣零件的觀察資料生成表示功能性圖案的圖案資料，因此能夠形成與觀察到的電氣零件的資訊對應的功能性圖案。As described above, according to the first embodiment, at least the observation data of the electrical components mounted on the electrical component mounting board are acquired from the observation data of the electrical component mounting board, and pattern data representing the functional pattern is generated based on the observation data of the electrical components. , therefore it is possible to form functional patterns corresponding to the observed information on electrical components.
[第1實施形態的變形例1] 至此，對絕緣油墨的塗布區域由用戶指定的情況進行了說明，但是塗布區域可以由功能性圖案形成基板製造系統300來決定。在這種情況下，功能性圖案形成基板製造系統300根據印刷基板的觀察資料來決定絕緣油墨的塗布區域。 [Modification 1 of the first embodiment] So far, the case where the application area of the insulating ink is specified by the user has been described, but the application area may be determined by the functional pattern forming substrate manufacturing system 300 . In this case, the functional pattern forming substrate manufacturing system 300 determines the coating area of the insulating ink based on observation data of the printed substrate.
具體而言，如第1實施形態中記載，能夠判斷應塗布絕緣油墨的區域或不需要塗布絕緣油墨的區域。可以從電氣零件的信息判斷這些來決定塗布領域。Specifically, as described in the first embodiment, it is possible to determine the area where the insulating ink should be applied or the area where the insulating ink does not need to be applied. These can be judged from the information on electrical parts to determine the coating area.
又，當形成在絕緣圖案上形成導電圖案的電磁波遮蔽時，應當屏蔽作為雜訊源的電氣零件以及在收到雜訊時容易發生誤操作的電氣零件。因此，期望根據CAD/CAM資料及觀察資料特定這些電氣零件，並將特定的電氣零件用作絕緣油墨及導電油墨的塗布區域。Furthermore, when forming electromagnetic wave shielding by forming a conductive pattern on an insulating pattern, it is necessary to shield electrical components that are noise sources and electrical components that are prone to malfunction when receiving noise. Therefore, it is expected to specify these electrical parts based on CAD/CAM data and observation data, and use the specific electrical parts as coating areas for insulating ink and conductive ink.
成為雜訊源的電氣零件例如是LTE通信用的增幅器、晶體振盪器、穩壓器等電路以及線圈。又，集成電路根據連接的電氣零件和用途亦可能成為雜訊源。再者，LTE是Long Term Evolution的縮寫。Electrical components that become noise sources include amplifiers, crystal oscillators, voltage regulators and other circuits and coils for LTE communications, for example. In addition, integrated circuits may also become noise sources depending on the connected electrical components and their uses. Furthermore, LTE is the abbreviation of Long Term Evolution.
[第1實施形態的變形例2] 到目前為止，對能夠獲得CAD/CAM資料的情況進行了說明，但亦有無法獲得CAD/CAM資料的情況。第1實施形態之功能性圖案形成基板製造系統300亦能夠適用於無法獲得CAD/CAM資料的情況、亦即希望對任意的電氣零件安裝基板賦電磁波遮蔽的情況。例如，當考慮在電氣雜訊成為問題的電氣零件安裝基板上使用導電油墨形成屏蔽時，即使不存在CAD/CAM資料時亦可以進行測試。 [Modification 2 of the first embodiment] So far, the case where CAD/CAM data can be obtained has been explained, but there are cases where CAD/CAM data cannot be obtained. The functional pattern forming substrate manufacturing system 300 of the first embodiment can also be applied to a situation where CAD/CAM data cannot be obtained, that is, a situation where it is desired to provide electromagnetic wave shielding to an arbitrary electrical component mounting substrate. For example, when considering using conductive ink to form a shield on an electrical component mounting substrate where electrical noise is a problem, testing can be performed even if CAD/CAM data does not exist.
例如，功能性圖案形成基板製造系統300根據攝影機16所生成的電氣零件安裝基板的觀察資料，特定安裝在電氣零件安裝基板上的電氣零件的零件名稱及零件類型，並判斷應在哪個區域形成電磁屏蔽，亦即是否應該用導電油墨覆蓋。For example, the functional pattern forming substrate manufacturing system 300 specifies the component name and component type of the electrical components mounted on the electrical component mounting substrate based on the observation data of the electrical component mounting substrate generated by the camera 16, and determines in which area the electromagnetic components should be formed. Shielding, i.e. whether it should be covered with conductive ink.
[第2實施形態] 在第1實施形態中，在賦予功能性油墨之前補正圖案資料，但是在第2實施形態及第3實施形態中，對於在開始功能性油墨的賦予之後補正圖案資料的具有功能性圖案的電氣零件安裝基板的製造方法進行說明。在第2實形態中，對在多次塗布功能性油墨時，每層或至少1次用攝影機16觀察電氣零件安裝基板，補正油墨的賦予量的例子進行說明。 [Second Embodiment] In the first embodiment, the pattern data is corrected before applying the functional ink. However, in the second embodiment and the third embodiment, the pattern data is corrected after starting the application of the functional ink for electrical components with functional patterns. The manufacturing method of the mounting substrate is explained. In the second embodiment, when the functional ink is applied multiple times, the electrical component mounting substrate is observed with the camera 16 for each layer or at least once, and the applied amount of the ink is corrected.
圖21的F21A～圖21的F21B係用於說明第2實施形態的圖案資料的補正的圖，係功能性圖案形成基板的剖面的示意圖。圖21的F21A係與圖14的F14A相同的圖，表示第2實施形態中待形成的絕緣圖案1022的功能性圖案形成基板1000C。如圖21的F21A所示，功能性圖案形成基板1000C中，在包含4個電氣零件1024A、1024B、1024C及1024D的塗布區域S的形成上表面平坦的絕緣圖案1022。F21A in FIG. 21 to F21B in FIG. 21 are diagrams for explaining the correction of pattern data in the second embodiment, and are schematic cross-sectional views of the functional pattern forming substrate. F21A in FIG. 21 is the same as F14A in FIG. 14 , and shows the functional pattern forming substrate 1000C on which the insulating pattern 1022 is to be formed in the second embodiment. As shown in F21A of FIG. 21 , in the functional pattern forming substrate 1000C, an insulating pattern 1022 with a flat upper surface is formed in the coating area S including the four electrical components 1024A, 1024B, 1024C, and 1024D.
圖21的F21B表示使電氣零件安裝基板1003和噴墨頭12相對移動多次來賦予絕緣油墨後的功能性圖案形成基板1000D的絕緣圖案1022的一例。在圖21的F21B所示的例中，功能性圖案形成基板1000D中，賦予到電氣零件1024B的上表面的絕緣油墨比賦予到電氣零件1024A、1024C及1024D的上表面的絕緣油墨少。因此，絕緣圖案1022呈電氣零件1024B的上表面區域比電氣零件1024A、1024C及1024D的上表面區域凹陷高度h的形狀，上表面形成得不平坦。F21B in FIG. 21 shows an example of the insulating pattern 1022 of the functional pattern forming substrate 1000D after the electrical component mounting substrate 1003 and the inkjet head 12 are relatively moved multiple times to apply insulating ink. In the example shown in F21B of FIG. 21 , in the functional pattern forming substrate 1000D, the insulating ink applied to the upper surface of the electrical component 1024B is less than the insulating ink applied to the upper surfaces of the electrical components 1024A, 1024C, and 1024D. Therefore, the insulation pattern 1022 has a shape in which the upper surface area of the electrical component 1024B is recessed by a height h from the upper surface areas of the electrical components 1024A, 1024C, and 1024D, and the upper surface is formed unevenly.
功能性圖案形成基板製造系統300根據攝影機16拍攝功能性圖案形成基板1000D的觀察資料，估計絕緣油墨不足的體積，對圖案資料進行補正以賦予不足的體積量的絕緣油墨，並生成補正圖案資料。圖案形成裝置10藉由根據生成的補正圖案資料將絕緣油墨賦予到功能性圖案形成基板1000D，可以將圖21的F21B中所示的絕緣圖案1022補正為圖21的F21A中所示的絕緣圖案1022。The functional pattern forming substrate manufacturing system 300 estimates the insufficient volume of insulating ink based on the observation data captured by the camera 16 of the functional pattern forming substrate 1000D, corrects the pattern data to provide the insufficient volume of insulating ink, and generates corrected pattern data. The pattern forming device 10 can correct the insulating pattern 1022 shown in F21B of FIG. 21 to the insulating pattern 1022 shown in F21A of FIG. 21 by applying insulating ink to the functional pattern forming substrate 1000D based on the generated correction pattern data. .
如此，功能性圖案形成基板製造系統300使噴墨頭12與電氣零件安裝基板1003相對移動多次，形成由複數層絕緣油墨構成的絕緣圖案，根據賦予了絕緣油墨的電氣零件安裝基板1003的觀察資料，生成圖案資料。在此，功能性圖案形成基板製造系統300藉由在電氣零件安裝基板1003的絕緣油墨不足的區域賦予絕緣油墨，能夠形成適當的絕緣圖案。In this way, the functional pattern forming substrate manufacturing system 300 relatively moves the inkjet head 12 and the electrical component mounting substrate 1003 multiple times to form an insulating pattern composed of multiple layers of insulating ink. According to the observation of the electrical component mounting substrate 1003 provided with the insulating ink, data to generate pattern data. Here, the functional pattern forming substrate manufacturing system 300 can form an appropriate insulating pattern by applying insulating ink to areas of the electrical component mounting substrate 1003 where the insulating ink is insufficient.
[第3實施形態] 在第3實施形態中，對觀察多次塗布功能性油墨時的第1次的印刷結果，補正塗布區域的位置偏差的例子進行說明。 [Third Embodiment] In the third embodiment, an example will be described in which the first printing result when functional ink is applied multiple times is observed and the positional deviation of the applied area is corrected.
圖22的F22A～圖22的F22C係用於說明第3實施形態之圖案資料的補正的圖。圖22的F22A表示拍攝了絕緣油墨賦予前的電氣零件安裝基板1003的圖像資料DI3。如圖22的F22A所示，圖像資料DI3包括電氣零件1024E、1024F及1024G。F22A in FIG. 22 to F22C in FIG. 22 are diagrams for explaining the correction of pattern data in the third embodiment. F22A in FIG. 22 shows image data DI3 in which the electrical component mounting substrate 1003 is photographed before insulating ink is applied. As shown in F22A of FIG. 22 , image data DI3 includes electrical components 1024E, 1024F, and 1024G.
圖22的F22B示出了使電氣零件安裝基板1003和噴墨頭12相對移動1次以施加絕緣油墨時拍攝的圖像資料DI4，示出了理想的絕緣圖案1022。如圖22的F22B所示，通過第1次的印刷形成的理想的絕緣圖案1022中，絕緣圖案1022形成在塗布區域S，沒有形成在電氣零件1024E、1024F及1024G的上表面。F22B in FIG. 22 shows the image data DI4 captured when the electrical component mounting substrate 1003 and the inkjet head 12 are relatively moved once to apply the insulating ink, and shows the ideal insulating pattern 1022. As shown in F22B of FIG. 22 , in the ideal insulating pattern 1022 formed by the first printing, the insulating pattern 1022 is formed in the coating area S and is not formed on the upper surfaces of the electrical components 1024E, 1024F, and 1024G.
圖22的F22C表示使電氣零件安裝基板1003和噴墨頭12相對移動1次並賦予絕緣油墨後拍攝的圖像資料DI5的一例，表示與塗布區域S發生偏差時的絕緣圖案1022的一例。在圖22的F22C所示的例子中，在電氣零件1024E、1024F及1024G的各自的上表面的Y方向側的一部分區域即區域1024EA、1024FA及1024GA上被賦予了絕緣油墨。又，在印刷配線基板1002的電氣零件1024E、1024F及1024G的各自的-Y方向側的印刷配線基板1002（電氣零件安裝羈絆1003）的區域即區域1002EA、1002FA及1002GA上未被賦予絕緣油墨。F22C in FIG. 22 shows an example of the image data DI5 captured after the electrical component mounting substrate 1003 and the inkjet head 12 were relatively moved once and the insulating ink was applied, and shows an example of the insulating pattern 1022 when there is a deviation from the coating area S. In the example shown in F22C of FIG. 22 , insulating ink is applied to areas 1024EA, 1024FA, and 1024GA, which are partial areas on the Y-direction side of the respective upper surfaces of the electrical components 1024E, 1024F, and 1024G. In addition, insulating ink is not applied to areas 1002EA, 1002FA, and 1002GA, which are areas of the printed wiring board 1002 (electrical component mounting constraints 1003) on the respective −Y direction sides of the electrical components 1024E, 1024F, and 1024G of the printed wiring board 1002.
功能性圖案形成基板製造系統300藉由從圖像資料DI4檢測塗布區域S與絕緣圖案1022的位置偏差，根據位置偏差方向及位置偏差量來補正圖案資料。在此，圖案資料在Y方向上偏移並被補正。The functional pattern forming substrate manufacturing system 300 detects the positional deviation between the coating area S and the insulating pattern 1022 from the image data DI4, and corrects the pattern data based on the positional deviation direction and the positional deviation amount. Here, the pattern data is shifted and corrected in the Y direction.
如此，功能性圖案形成基板製造系統300使噴墨頭12與電氣零件安裝基板1003相對移動多次，根據團資料形成根據複數層絕緣油墨的絕緣圖案，根據賦予了絕緣油墨的電氣零件安裝基板1003的觀察資料，生成補正了圖案資料的補正圖案資料。在此，功能性圖案形成基板製造系統300中，在第1此的相對移動中賦予了電氣零件安裝基板1003的絕緣油墨的位置僅偏移偏差量時，生成根據偏差量而位置偏移的補正圖案資料。藉由一邊反饋絕緣油墨的賦予位置，一邊進行印刷，能夠減少所形成的絕緣圖案的偏差。In this way, the functional pattern forming substrate manufacturing system 300 moves the inkjet head 12 and the electrical component mounting substrate 1003 relatively multiple times to form an insulating pattern based on multiple layers of insulating ink based on the group data, and the electrical component mounting substrate 1003 based on the insulating ink is formed. Observation data is used to generate corrected pattern data that corrects the pattern data. Here, in the functional pattern forming substrate manufacturing system 300, when the position of the insulating ink applied to the electrical component mounting substrate 1003 shifts by only the deviation amount during the first relative movement, correction of the position deviation based on the deviation amount is generated. Pattern information. By printing while feeding back the application position of the insulating ink, it is possible to reduce variation in the formed insulating pattern.
在此，根據第1次的印刷時的絕緣油墨的賦予位置的偏差量生成圖案資料，但亦可以印刷2次以上後觀察絕緣油墨的賦予位置的偏差量。但是，如果是第1次印刷，很容易從觀察資料中的光澤度判斷偏差。又，如果是第1次印刷，則能夠將偏移賦予的功能性液體的量抑制到最小限度。Here, the pattern data is generated based on the amount of deviation in the application position of the insulating ink during the first printing. However, the amount of deviation in the application position of the insulating ink can also be observed after printing twice or more. However, if it is the first printing, it is easy to judge the deviation from the glossiness in the observation data. In addition, if it is the first printing, the amount of functional liquid to be offset can be suppressed to the minimum.
[絕緣油墨] 作為絕緣油墨的一例，可以舉出具有以下結構的緣油墨。 ・NVC：N-乙烯基己內醯胺（FUJIFILM Wako Pure Chemical Corporation製造）15質量% ・DCPTeA：丙烯酸二環戊烯酯（產品名“FA-511AS”，昭和電工材料公司製造）30質量% ・TCDDMDA：三環癸烷二甲醇二丙烯酸酯（產品名“SR833S”，Sartomer公司製造）15質量% ・HDDA：1,6-己二醇二丙烯酸酯（產品名“SR238”，Sartomer公司製造）8質量% ・EOTMPTA：三羥甲基丙烷EO加成三丙烯酸酯、產品名“Speedcure 7010L”（Lambson公司製造）中包含的50質量%份 2質量% ・PEMB：新戊四醇四（3-巰基丁酸酯）（產品名“Karenz MT（註冊商標）PE1”）20質量% ・379：2-（二甲氨基）-2-（4-甲基芐基）-1-（4-口末啉代苯基）-丁-1-酮（產品名“Omnirad 379”，IGM Res ins B.V.公司製造）1質量% ・ITX：2-異丙基噻噸酮（產品名“SPEEDCURE ITX”，LAMBSON公司製造）6質量％ ・7010：1,3-二（[α-[（1-氯-9-氧代-9H-硫口山口星-4-基）氧]乙醯聚[氧（1-甲基乙烯）]]氧）-2,2-二（[α-[1-甲基乙烯]]氧甲基）丙烷，產品名“Speedcure 7010L”（Lambson公司製造）中包含的50質量％份 2質量％ ・MEHQ：對甲氧基苯酚 1質量% [Insulation ink] As an example of the insulating ink, there is an edge ink having the following structure. ・NVC: N-vinylcaprolactam (manufactured by FUJIFILM Wako Pure Chemical Corporation) 15% by mass ・DCPTeA: Dicyclopentenyl acrylate (product name "FA-511AS", manufactured by Showa Denko Materials Co., Ltd.) 30% by mass ・TCDDMDA: Tricyclodecane dimethanol diacrylate (product name "SR833S", manufactured by Sartomer Corporation) 15% by mass ・HDDA: 1,6-hexanediol diacrylate (product name "SR238", manufactured by Sartomer Corporation) 8% by mass ・EOTMPTA: 50% by mass of trimethylolpropane EO-addition triacrylate, product name "Speedcure 7010L" (manufactured by Lambson Co., Ltd.) 2% by mass ・PEMB: Neopentaerythritol tetrakis(3-mercaptobutyrate) (product name "Karenz MT (registered trademark) PE1") 20 mass% ・379: 2-(dimethylamino)-2-(4-methylbenzyl)-1-(4-endolinophenyl)-butan-1-one (product name "Omnirad 379", IGM Res ins B.V. company) 1% by mass ・ITX: 2-isopropylthioxanthone (product name "SPEEDCURE ITX", manufactured by LAMBSON Corporation) 6% by mass ・7010: 1,3-bis([α-[(1-chloro-9-oxo-9H-sulfamate-4-yl)oxy]acetylpoly[oxy(1-methylethylene)]] Oxygen)-2,2-bis([α-[1-methylethylene]]oxymethyl)propane, 50 mass% part 2 mass% contained in the product name "Speedcure 7010L" (manufactured by Lambson Corporation) ・MEHQ: p-methoxyphenol 1% by mass
使用圖案形成裝置10，從噴墨頭12向放置在工作台30上的電氣零件安裝基板賦予絕緣油墨，絕緣油墨賦予後0.5秒以內在UV曝光裝置14中以100m秒照射12W/cm 2的紫外線，使賦予於電氣零件安裝基板的絕緣油墨硬化。當切削完成的印刷物（功能性圖案形成基板）並觀察剖面形狀時，確認電氣零件被絕緣油墨埋設。 The pattern forming device 10 is used to apply insulating ink from the inkjet head 12 to the electrical component mounting substrate placed on the workbench 30. Within 0.5 seconds after the insulating ink is applied, ultraviolet light of 12 W/cm 2 is irradiated in the UV exposure device 14 at 100 m seconds. , hardening the insulating ink applied to the electrical component mounting substrate. When the completed print (functional pattern forming substrate) was cut and the cross-sectional shape was observed, it was confirmed that the electrical parts were embedded with insulating ink.
[其他] 至此，對包括裝置裝置、攝影機和圖案資料生成裝置的印刷系統進行了說明。印刷裝置是圖案形成裝置10，攝影機是攝影機16。圖案資料生成裝置可以是圖案資料生成裝置306，亦可以是圖案形成裝置10的印刷區域資料生成部106及圖案資料生成部108。 [other] So far, the printing system including the device, the camera, and the pattern data generating device has been described. The printing device is the pattern forming device 10 , and the camera is the camera 16 . The pattern data generating device may be the pattern data generating device 306, or the printing area data generating unit 106 and the pattern data generating unit 108 of the pattern forming device 10.
本發明的技術範圍不限於上述實施形態中記載的範圍。在不脫離本發明的主旨的範圍內，能夠在各實施形態之間適當地組合各實施形態的結構等。The technical scope of the present invention is not limited to the range described in the above embodiments. The configurations and the like of each embodiment can be appropriately combined between the embodiments without departing from the gist of the present invention.
10:圖案形成裝置 12:噴墨頭 14:UV曝光裝置 16:攝影機 16A:在線掃描儀 16B:複數個攝影機 17:受光面 18:傳送裝置 20:基座 30:載台 32:基板移動機構 100:系統控制部 102:基板資料獲取部 104:觀察資料獲取部 106:印刷區域資料生成部 108:圖案資料生成部 110:驅動電壓生成部 112:傳送控制部 114:曝光控制部 116:攝影機控制部 120:記憶體 122:感測器 200:控制裝置 202:處理器 204:電腦可讀取媒體 206:通信介面 208:輸入輸出介面 210:總線 214:輸入裝置 216:顯示裝置 220:基板資料獲取控制程式 222:觀察資料獲取控制程式 223:印刷區域資料生成程式 224:圖案資料生成控制程式 226:吐出控制程式 228:曝光控制程式 230:攝影機控制程式 232:傳送控制程式 300:功能性圖案形成基板製造系統 302:伺服器裝置 304:基板CAD裝置 306:圖案資料生成裝置 308:圖案形成裝置 1000:功能性圖案形成基板 1000A:功能性圖案形成基板 1000B:功能性圖案形成基板 1000C:功能性圖案形成基板 1000D:功能性圖案形成基板 1002:印刷配線基板 1002EA:區域 1002FA:區域 1002GA:區域 1003:電氣零件安裝基板 1004:零件安裝面 1006:IC 1008:電阻器 1008A:電阻陣列 1009:電極 1010:電容器 1020:導電圖案 1022:絕緣圖案 1024A:電氣零件 1024B:電氣零件 1024C:電氣零件 1024D:電氣零件 1024E:電氣零件 1024EA:區域 1024F:電氣零件 1024FA:區域 1024G:電氣零件 1024GA:區域 1100:零件安裝機 1102:裝置 1104:自動外觀檢查裝置 1106:電氣檢查裝置 1108:絕緣圖案形成裝置 1110:導電圖案形成裝置 1200:集合基板 1202:個別基板 1204:電氣零件 1210:對準標記 1212:對準標記 1300:功能性圖案 1302:絕緣圖案 1304:導電圖案 1310:功能性圖案 1312:絕緣圖案 1314:導電圖案 1400:IC 1402:封裝部 1402A:底面 1404:引線部 1404A:端部 1410:線圈 1412:繞線筒 1412A:凸緣 1412B:凸緣 1414:線材 1420:溫濕度感測器 1422:檢測元件 1430:連接器 d1:距離 d2:距離 d3:距離 d4:距離 DD1:設計資料 DI1:圖像資料 DI2:圖像資料 DI3:圖像資料 DI4:圖像資料 DI5:圖像資料 DP1:圖案資料 DP2:圖案資料 DP3:圖案資料 DP4:圖案資料 dx、dy:偏差量（重心補正值） h:高度 MD1:標記設計值 MD2:標記設計值 MD3:標記設計值 MD4:標記設計值 MM1:標記測量值 MM2:標記測量值 MM3:標記測量值 MM4:標記測量值 PR1:零件區域 PR2:零件區域 PR3:零件區域 PT1:零件區域 PT2:零件區域 PT3:零件區域 S:塗布區域 S1000、S1002、S1004、S1006、S1008、S1010、S1012:步驟 X、Y、Z:方向 θx、θy:斜率 10: Pattern forming device 12: Inkjet head 14:UV exposure device 16:Camera 16A:Online scanner 16B: Multiple cameras 17:Light-receiving surface 18:Transmission device 20: base 30: Carrier stage 32:Substrate moving mechanism 100:System Control Department 102: Substrate data acquisition department 104: Observation data acquisition department 106: Printing area data generation department 108: Pattern data generation department 110: Driving voltage generation section 112:Transmission control department 114:Exposure Control Department 116:Camera Control Department 120:Memory 122: Sensor 200:Control device 202: Processor 204: Computer readable media 206: Communication interface 208: Input and output interface 210:Bus 214:Input device 216:Display device 220:Substrate data acquisition control program 222: Observation data acquisition control program 223: Printing area data generation program 224: Pattern data generation control program 226:Spit out the control program 228: Exposure control program 230:Camera control program 232:Transmission control program 300: Functional patterning substrate manufacturing system 302:Server device 304:Substrate CAD device 306: Pattern data generating device 308: Pattern forming device 1000: Functional pattern forming substrate 1000A: Functional pattern forming substrate 1000B: Functional pattern forming substrate 1000C: Functional pattern forming substrate 1000D: Functional pattern forming substrate 1002:Printed wiring board 1002EA:Area 1002FA:Area 1002GA:Area 1003: Electrical parts mounting base plate 1004:Part mounting surface 1006:IC 1008:Resistor 1008A: Resistor array 1009:Electrode 1010:Capacitor 1020: Conductive pattern 1022:Insulation pattern 1024A: Electrical parts 1024B: Electrical parts 1024C: Electrical parts 1024D: Electrical parts 1024E: Electrical parts 1024EA:Area 1024F: Electrical parts 1024FA:Region 1024G: Electrical parts 1024GA:Area 1100: Parts installation machine 1102:Device 1104: Automatic appearance inspection device 1106: Electrical inspection device 1108: Insulation pattern forming device 1110: Conductive pattern forming device 1200:Collection substrate 1202:Individual substrate 1204: Electrical parts 1210:Alignment mark 1212:Alignment mark 1300: Functional pattern 1302:Insulation pattern 1304: Conductive pattern 1310:Functional pattern 1312:Insulation pattern 1314: Conductive pattern 1400: IC 1402:Packaging Department 1402A: Bottom surface 1404: Lead part 1404A: End 1410: coil 1412: bobbin 1412A:Flange 1412B:Flange 1414:Wire 1420: Temperature and humidity sensor 1422: Detection component 1430:Connector d1: distance d2: distance d3: distance d4: distance DD1: Design data DI1: Image data DI2:Image data DI3:Image data DI4:Image data DI5:Image information DP1: Pattern data DP2: Pattern data DP3: Pattern data DP4: Pattern data dx, dy: deviation amount (center of gravity correction value) h: height MD1: mark design value MD2: mark design value MD3: mark design value MD4: mark design value MM1: mark measurement value MM2: Mark measurement value MM3: Mark measurements MM4: Mark measurements PR1: Parts area PR2: Parts area PR3: Parts area PT1: Parts area PT2: Parts area PT3: Parts area S: coating area S1000, S1002, S1004, S1006, S1008, S1010, S1012: steps X, Y, Z: direction θx, θy: slope
圖1係功能性圖案形成基板的斜視圖。 圖2係表示功能性圖案形成基板的製造製程的順序的一例之流程圖。 圖3係印刷配線基板的說明圖。 圖4係表示圖案形成裝置的結構例之俯視圖。 圖5係圖4所示之圖案形成裝置的側視圖。 圖6係表示線掃描器的圖。 圖7係表示複數個攝影機的圖。 圖8係表示圖案形成裝置的電氣結構之功能框圖。 圖9係表示應用於圖案形成裝置的控制裝置之硬體結構之框圖。 圖10係功能性圖案形成基板的剖面圖。 圖11係功能性圖案形成基板的剖面圖。 圖12係圖案形成系統的整體結構圖。 圖13係表示指定塗布區域的一例的圖。 圖14的F14A～圖14的F14B係功能性圖案形成基板的剖面圖。 圖15的F15A～圖15的F15B係表示IC的圖。 圖16係表示線圈的圖。 圖17係表示溫濕度感測器的圖。 圖18係表示連接器的圖。 圖19的F19A～圖19的F19D係用於說明圖案資料的補正的圖。 圖20的F20A～圖20的F20D係用於說明圖案資料的補正的圖。 圖21的F21A～圖21的F21B係用於說明圖案資料的補正的圖。 圖22的F22A～圖22的F22C係用於說明圖案資料的補正的圖。 FIG. 1 is a perspective view of a functional pattern forming substrate. FIG. 2 is a flowchart showing an example of the procedure of a manufacturing process of a functional pattern forming substrate. FIG. 3 is an explanatory diagram of a printed wiring board. FIG. 4 is a plan view showing a structural example of the pattern forming device. FIG. 5 is a side view of the pattern forming device shown in FIG. 4 . FIG. 6 is a diagram showing a line scanner. FIG. 7 is a diagram showing a plurality of cameras. FIG. 8 is a functional block diagram showing the electrical structure of the pattern forming device. FIG. 9 is a block diagram showing the hardware structure of a control device applied to the pattern forming device. FIG. 10 is a cross-sectional view of the functional pattern forming substrate. FIG. 11 is a cross-sectional view of the functional pattern forming substrate. Figure 12 is an overall structural diagram of the pattern forming system. FIG. 13 is a diagram showing an example of a designated coating area. F14A in FIG. 14 to F14B in FIG. 14 are cross-sectional views of the functional pattern forming substrate. F15A in Figure 15 to F15B in Figure 15 are diagrams showing ICs. Fig. 16 is a diagram showing a coil. FIG. 17 is a diagram showing a temperature and humidity sensor. Fig. 18 is a diagram showing a connector. F19A in FIG. 19 to F19D in FIG. 19 are diagrams for explaining the correction of pattern data. F20A in FIG. 20 to F20D in FIG. 20 are diagrams for explaining the correction of pattern data. F21A in FIG. 21 to F21B in FIG. 21 are diagrams for explaining the correction of pattern data. F22A in FIG. 22 to F22C in FIG. 22 are diagrams for explaining the correction of pattern data.
10:圖案形成裝置 10: Pattern forming device
12:噴墨頭 12: Inkjet head
14:UV曝光裝置 14:UV exposure device
16:攝影機 16:Camera
18:傳送裝置 18:Transmission device
100:系統控制部 100:System Control Department
102:基板資料獲取部 102: Substrate data acquisition department
104:觀察資料獲取部 104: Observation data acquisition department
106:印刷區域資料生成部 106: Printing area data generation department
108:圖案資料生成部 108: Pattern data generation department
110:驅動電壓生成部 110: Driving voltage generation section
112:傳送控制部 112:Transmission control department
114:曝光控制部 114:Exposure Control Department
116:攝影機控制部 116:Camera Control Department
120:記憶體 120:Memory
122:感測器 122: Sensor
Claims (11)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-046646 | 2022-03-23 | ||
| JP2022046646 | 2022-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202343155A true TW202343155A (en) | 2023-11-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112109916A TW202343155A (en) | 2022-03-23 | 2023-03-17 | Printing system and method for producing electric component mounting substrate having functional pattern |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW202343155A (en) |
| WO (1) | WO2023182035A1 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3169926B2 (en) * | 1998-02-13 | 2001-05-28 | キヤノン株式会社 | Manufacturing method of electron source |
| JP2008118076A (en) * | 2006-11-08 | 2008-05-22 | Seiko Epson Corp | Method of forming wiring structure, wiring structure, and electronic apparatus |
| JP2009170657A (en) * | 2008-01-16 | 2009-07-30 | Ricoh Co Ltd | Method and device for forming wiring |
| JP2010219248A (en) * | 2009-03-16 | 2010-09-30 | Seiko Epson Corp | Apparatus and method for pattern formation |
| US9516749B2 (en) * | 2012-07-04 | 2016-12-06 | Panasonic Intellectual Property Management Co., Ltd. | Electronic component-mounted structure, IC card and COF package |
| JP6052995B2 (en) * | 2013-02-22 | 2016-12-27 | ヤマハ発動機株式会社 | Printing method and apparatus using metal mask, and flip chip mixed mounting method and apparatus |
| CN108538755B (en) * | 2018-03-22 | 2019-05-21 | 华中科技大学 | A kind of conformal manufacturing equipment and method of complex-curved electronic system |
-
2023
- 2023-03-13 WO PCT/JP2023/009552 patent/WO2023182035A1/en unknown
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| WO2023182035A1 (en) | 2023-09-28 |
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