TW202330214A - Hand, transport device, and substrate processing apparatus - Google Patents

Hand, transport device, and substrate processing apparatus Download PDF

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TW202330214A
TW202330214A TW111132060A TW111132060A TW202330214A TW 202330214 A TW202330214 A TW 202330214A TW 111132060 A TW111132060 A TW 111132060A TW 111132060 A TW111132060 A TW 111132060A TW 202330214 A TW202330214 A TW 202330214A
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Taiwan
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manipulator
aforementioned
substrate
seating
members
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TW111132060A
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Chinese (zh)
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豊澤功太郎
斎藤賢一郎
武渕健一
鈴木憲一
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日商荏原製作所股份有限公司
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Priority claimed from JP2021167005A external-priority patent/JP2023057458A/en
Priority claimed from JP2021167003A external-priority patent/JP2023057456A/en
Priority claimed from JP2021167002A external-priority patent/JP2023057455A/en
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW202330214A publication Critical patent/TW202330214A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0028—Gripping heads and other end effectors with movable, e.g. pivoting gripping jaw surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • B25J19/021—Optical sensing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • B25J19/027—Electromagnetic sensing devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

To improve accuracy in detecting that a substrate is seated. A hand for holding a substrate includes a hand main body 620 and a plurality of seating members 630 which is mounted to the hand main body 620, and on which the substrate is seated. Each of the plurality of seating members 630 comprises: a shaft member 632 supported by the hand main body 620; and a lever member 634 which is supported by the shaft member 632 and includes a first end portion 634-1 having a seating portion 634-1a on which the substrate is seated and a second end portion 634-2 provided at the opposite side of the first end portion 634-1 with the shaft member 632 interposed between the seating portion 634-1 and the second end portion 634-2. At least a part of the plurality of seating members 630 further comprises: an energizing member 636 which applies to the lever member 634 force for rotating the lever member 634 so that the second end portion 634-2 moves downward; and a seating sensor 638 detecting that the second end portion 634-2 has moved upward.

Description

機械手、搬送裝置、及基板處理裝置Manipulator, transfer device, and substrate processing device

本申請案係關於機械手、搬送裝置、及基板處理裝置。本申請案依據2021年10月11日申請之日本專利申請編號第2021-167002號、日本專利申請編號第2021-167003號、及日本專利申請編號第2021-167005號主張優先權。包含日本專利申請編號第2021-167002號、日本專利申請編號第2021-167003號、及日本專利申請編號第2021-167005號之說明書、申請專利範圍、圖式及摘要的全部揭示內容以參照之方式全部援用於本申請案。This application relates to a robot, a transfer device, and a substrate processing device. This application claims priority based on Japanese Patent Application No. 2021-167002, Japanese Patent Application No. 2021-167003, and Japanese Patent Application No. 2021-167005 filed on October 11, 2021. All disclosures including Japanese Patent Application No. 2021-167002, Japanese Patent Application No. 2021-167003, and Japanese Patent Application No. 2021-167005 including specifications, patent claims, drawings and abstracts are hereby incorporated by reference All are used in this application.

近年來使用了用於對半導體晶圓等之基板進行各種處理的基板處理裝置。基板處理裝置之一例如為用於對基板進行研磨處理等之化學機械研磨（Chemical Mechanical Polishing, CMP）裝置。In recent years, substrate processing apparatuses for performing various processes on substrates such as semiconductor wafers have been used. One of the substrate processing devices is, for example, a chemical mechanical polishing (CMP) device for polishing the substrate.

如記載於專利文獻1，CMP裝置具備：用於進行基板之研磨處理的研磨裝置；用於進行基板之清洗處理及乾燥處理的清洗裝置；及對研磨裝置送交基板，並且接收藉由清洗裝置實施了清洗處理及乾燥處理之基板的裝載／卸載裝置等。此外，CMP裝置具備在研磨裝置、清洗裝置、及裝載／卸載裝置間進行基板之搬送的搬送裝置。CMP裝置藉由搬送裝置搬送基板，並依序進行研磨、清洗、及乾燥各種處理。As described in Patent Document 1, the CMP apparatus is provided with: a polishing device for polishing the substrate; a cleaning device for cleaning and drying the substrate; A loading/unloading device, etc. for substrates that have been cleaned and dried. In addition, the CMP apparatus includes a transfer device for transferring substrates between the polishing device, the cleaning device, and the loading/unloading device. The CMP device transports the substrate by the transport device, and sequentially performs various processes of grinding, cleaning, and drying.

有些搬送裝置具備：用於保持基板之機械手；及用於使機械手移動之驅動機構。機械手中設有供基板落座之複數個插銷，可檢測基板已落座於插銷。為了檢測基板之落座而使用具有投光部與受光部的光學式檢測器。例如，在插銷中設有受光部，並在離開插銷之指定場所設有投光部，藉由基板遮蔽投光部與受光部之間，可檢測基板已落座於插銷。Some transfer devices include: a robot arm for holding a substrate; and a drive mechanism for moving the robot arm. The manipulator is equipped with a plurality of pins for the substrate to be seated, and it can be detected that the substrate has been seated on the pins. In order to detect the seating of the substrate, an optical detector having a light projecting part and a light receiving part is used. For example, a light receiving part is provided in the plug, and a light projecting part is provided at a designated place away from the plug. By shielding the space between the light projecting part and the light receiving part with the substrate, it can be detected that the substrate has been seated on the plug.

有些搬送裝置具備：用於保持基板之機械手；及用於使機械手移動之驅動機構。機械手具備：基板落座之複數個插銷、及安裝有複數個插銷之第一葉片。對研磨裝置之頂環送交落座於複數個插銷的基板時，頂環將隔膜（吸附面）按壓於基板的上面，並藉由真空吸附而接收基板。機械手具備相對配置於第一葉片之下方的第二葉片，藉由經由安裝於第二葉片之複數個彈簧等的彈性構件而支撐第一葉片，可吸收來自頂環之按壓負荷。Some transfer devices include: a robot arm for holding a substrate; and a drive mechanism for moving the robot arm. The manipulator has: a plurality of pins on which the substrate is seated, and a first blade on which the plurality of pins are installed. When the top ring of the polishing device delivers the substrate seated on a plurality of pins, the top ring presses the diaphragm (adsorption surface) on the top of the substrate, and receives the substrate by vacuum suction. The manipulator has a second blade disposed below the first blade, and supports the first blade through elastic members such as a plurality of springs installed on the second blade to absorb the pressing load from the top ring.

有些搬送裝置具備：用於保持基板之機械手；及用於使機械手移動之驅動機構。機械手具備基板落座之複數個插銷。如記載於專利文獻2，複數個插銷分別具有：對水平方向傾斜並朝向上方側之第一傾斜面；與形成於第一傾斜面上方之對水平方向傾斜並朝向下方側的第二傾斜面。該搬送裝置在藉由基板搬送時之加速度而基板的落座位置偏移時，藉由基板之端部抵接於第二傾斜面，可抑制基板落下。 ［先前技術文獻］ ［專利文獻］ Some transfer devices include: a robot arm for holding a substrate; and a drive mechanism for moving the robot arm. The manipulator has a plurality of pins on which the substrate is seated. As described in Patent Document 2, the plurality of pins respectively have: a first inclined surface inclined to the horizontal direction and directed upward; and a second inclined surface formed above the first inclined surface and inclined to the horizontal direction and directed downward. In this transfer device, when the seating position of the substrate deviates due to the acceleration during substrate transfer, the end of the substrate abuts against the second inclined surface, thereby suppressing the substrate from falling. [Prior Technical Literature] [Patent Document]

[專利文獻1]日本特開2010-50436號公報 [專利文獻2]日本特開2014-175333號公報 [Patent Document 1] Japanese Unexamined Patent Publication No. 2010-50436 [Patent Document 2] Japanese Patent Laid-Open No. 2014-175333

（發明所欲解決之問題）(Problem to be solved by the invention)

但是，習知技術就提高基板之落座檢測的精度方面仍有改善之餘地。However, there is still room for improvement in the prior art in terms of improving the accuracy of substrate seating detection.

亦即，習知技術於落座檢測時係在基板落座之落座區域配置光學式檢測器。由於在落座區域混合有用於清洗處理之清洗水及用於研磨處理之漿液，因此，光學式檢測器之光因清洗水或漿液而亂反射，結果，造成基板落座之錯誤檢測。That is to say, in the prior art, an optical detector is arranged in the seating area where the substrate is seated during seating detection. Since cleaning water for cleaning and slurry for polishing are mixed in the seating area, the light of the optical detector is randomly reflected by the cleaning water or slurry, resulting in false detection of substrate seating.

因此，本申請案之1個目的為使基板之落座檢測的精度提高。Therefore, one object of this application is to improve the accuracy of the seating detection of the board|substrate.

此外，習知技術就更穩定地吸收來自頂環之按壓負荷方面仍有改善的餘地。In addition, there is still room for improvement in the prior art in terms of absorbing the pressing load from the top ring more stably.

亦即，習知技術在頂環之隔膜按壓於基板時，整個第一葉片可吸收按壓負荷。因此，例如隔膜對基板一端接觸時，壓下第一葉片之一部分使第一葉片傾斜，可能造成按壓負荷之吸收不穩定。That is, in the conventional technology, when the diaphragm of the top ring is pressed against the base plate, the entire first vane can absorb the pressing load. Therefore, for example, when the diaphragm is in contact with one end of the substrate, a part of the first vane is depressed to incline the first vane, which may cause unstable absorption of the pressing load.

因此，本申請案之1個目的為更穩定地吸收來自頂環之按壓負荷。Therefore, one object of the present application is to more stably absorb the pressing load from the top ring.

此外，習知技術從頂環接收基板時，在抑制基板落下，且將基板定位於指定之落座區域方面仍有改善的餘地。In addition, when the conventional technology receives the substrate from the top ring, there is still room for improvement in suppressing the substrate from falling and positioning the substrate in the designated seating area.

亦即，從頂環接收基板時，藉由對吸附於頂環之隔膜的基板吸附面供給流體，可使基板從隔膜脫離。此時，在基板保持水平狀態下從隔膜脫離時並無問題，不過，藉由基板之僅一側從隔膜脫離而基板傾斜狀態下會降落到搬送裝置。因而要求即使在此種情況下，仍然不使基板從搬送裝置落下而接收，且定位於指定之落座區域。That is, when receiving the substrate from the top ring, the substrate can be detached from the diaphragm by supplying a fluid to the substrate adsorption surface of the diaphragm adsorbed on the top ring. At this time, there is no problem when the substrate is detached from the diaphragm while maintaining a horizontal state. However, when only one side of the substrate is detached from the diaphragm, the substrate falls to the transfer device in an inclined state. Therefore, even in such a case, it is required to receive the substrate without falling from the transfer device, and to position it in a designated seating area.

因此，本申請案之1個目的為從頂環接收基板時抑制基板從機械手落下，且將基板定位於指定之落座區域。 （解決問題之技術手段） Therefore, one object of the present application is to suppress the substrate from falling from the robot when receiving the substrate from the top ring, and to position the substrate in a designated seating area. (technical means to solve the problem)

一個實施形態揭示一種機械手，係用於保持基板，且前述機械手包含：機械手本體；及複數個落座構件，其係安裝於前述機械手本體供基板落座；前述複數個落座構件分別具備：軸構件，其係被前述機械手本體支撐；及槓桿構件，其係被前述軸構件支撐，且包含：第一端部，其係具有基板落座之落座部；及第二端部，其係夾著前述軸構件而設於前述第一端部的相反側；前述複數個落座構件之至少一部分進一步具備：施力構件，其係用於將以前述第二端部向下方移動之方式使前述槓桿構件旋轉之力賦予前述槓桿構件；及落座檢測器，其係以檢測前述第二端部向上方移動之方式而構成。One embodiment discloses a manipulator, which is used to hold a substrate, and the manipulator includes: a manipulator body; and a plurality of seating members, which are installed on the manipulator body for seating the substrate; the plurality of seat members respectively have: A shaft member, which is supported by the aforementioned manipulator body; and a lever member, which is supported by the aforementioned shaft member, and includes: a first end portion, which is a seating portion with a substrate seat; and a second end portion, which is a clip The shaft member is arranged on the opposite side of the first end portion; at least a part of the plurality of seating members further includes: a force applying member, which is used to move the lever by moving the second end portion downward. The force of member rotation is given to the aforementioned lever member; and the seating detector is configured to detect the upward movement of the aforementioned second end.

一個實施形態揭示一種機械手，係用於保持基板，且前述機械手包含：機械手本體；及複數個落座構件，其係安裝於前述機械手本體供基板落座；前述複數個落座構件分別具備：軸構件，其係被前述機械手本體支撐；槓桿構件，其係被前述軸構件支撐，且包含：第一端部，其係具有基板落座之落座部；及第二端部，其係夾著前述軸構件而設於前述第一端部的相反側；軸承，其係用於支撐前述軸構件之兩端部；及彈性構件，其係用於支撐前述軸承。One embodiment discloses a manipulator, which is used to hold a substrate, and the manipulator includes: a manipulator body; and a plurality of seating members, which are installed on the manipulator body for seating the substrate; the plurality of seat members respectively have: The shaft member is supported by the aforementioned manipulator body; the lever member is supported by the aforementioned shaft member and includes: a first end portion, which is a seat portion having a base plate seat; and a second end portion, which sandwiches The shaft member is provided on the opposite side of the first end; the bearing is used to support the two ends of the shaft member; and the elastic member is used to support the bearing.

一個實施形態揭示一種機械手，係用於保持基板，且前述機械手具備：機械手本體；複數個落座構件，其係安裝於前述機械手本體供基板落座；複數個引導構件，其係以包圍基板落座之落座區域的方式彼此隔以指定間隔而安裝於前述機械手本體；及複數個定位構件，其係以包圍前述落座區域之方式彼此隔以指定間隔而安裝於前述機械手本體；前述複數個引導構件分別具有基板承受面，其係朝向前述落座區域而向下方傾斜，前述複數個定位構件分別具有定位部，其係接觸前述落座區域之外緣。One embodiment discloses a manipulator, which is used to hold a substrate, and the manipulator has: a manipulator body; a plurality of seating members, which are installed on the manipulator body for seating the substrate; a plurality of guiding members, which surround The seating area where the substrate is seated is mounted on the aforementioned manipulator body at predetermined intervals from each other; and a plurality of positioning members are mounted on the aforementioned manipulator body at predetermined intervals from each other so as to surround the aforementioned seating area; Each of the guiding members has a substrate receiving surface, which is inclined downward toward the seating area, and each of the plurality of positioning members has a positioning portion, which is in contact with the outer edge of the seating area.

以下，依據圖式說明本案發明一種實施形態之機械手、搬送裝置及基板處理裝置。以下說明之圖式中，對相同或相當之構成元件註記相同符號並省略重複的說明。 ＜研磨裝置＞ Hereinafter, a manipulator, a transfer device, and a substrate processing device according to an embodiment of the present invention will be described with reference to the drawings. In the drawings described below, the same reference numerals are attached to the same or corresponding constituent elements, and overlapping descriptions are omitted. ＜Grinding device＞

圖1係顯示作為本發明一種實施形態之基板處理裝置的一例之CMP裝置的整體構成俯視圖。如圖1所示，CMP裝置1000具備概略矩形狀之外殼1。外殼1之內部藉由分隔壁1a、1b劃分成裝載／卸載裝置2、研磨裝置3、及清洗裝置4。裝載／卸載裝置2、研磨裝置3、及清洗裝置4分別獨立安裝，且獨立排氣。此外，清洗裝置4具備：對研磨裝置供給電源之電源供給構件；及控制處理動作之控制裝置5。 ＜裝載／卸載裝置＞ FIG. 1 is a plan view showing the overall configuration of a CMP apparatus as an example of a substrate processing apparatus according to an embodiment of the present invention. As shown in FIG. 1 , a CMP apparatus 1000 includes a substantially rectangular housing 1 . The inside of the casing 1 is divided into a loading/unloading device 2, a grinding device 3, and a cleaning device 4 by partition walls 1a, 1b. The loading/unloading device 2, the grinding device 3, and the cleaning device 4 are installed independently and exhausted independently. In addition, the cleaning device 4 includes: a power supply means for supplying power to the polishing device; and a control device 5 for controlling the processing operation. ＜Loading/unloading device＞

裝載／卸載裝置2具備裝載貯存多數處理對象物（例如，圓板形狀之基板（晶圓））的基板匣盒之2個以上（本實施形態係4個）前裝載構件20。此等前裝載構件20鄰接於外殼1配置，並沿著研磨裝置之寬度方向（與長度方向垂直的方向）而排列。前裝載構件20中可搭載開放式匣盒、晶舟承載（Standard Manufacturing Interface, SMIF）盒（Pod）、或前開式晶圓傳送盒（Front Opening Unified Pod, FOUP）。此處，SMIF及FOUP係內部收納基板匣盒，並藉由以分隔壁覆蓋而可保持與外部空間獨立之環境的密閉容器。The loading/unloading device 2 includes two or more (four in this embodiment) front loading members 20 for loading and storing a large number of objects to be processed (for example, disk-shaped substrates (wafers)). These front loading members 20 are disposed adjacent to the housing 1 and arranged along the width direction (direction perpendicular to the length direction) of the grinding device. An open cassette, a Standard Manufacturing Interface (SMIF) Pod (Pod), or a Front Opening Unified Pod (FOUP) can be loaded in the front loading member 20 . Here, SMIF and FOUP are airtight containers that store substrate cassettes inside and maintain an environment independent from the outside space by covering them with partition walls.

此外，裝載／卸載裝置2中與前裝載構件20並列而敷設行駛機構21。在行駛機構21上設置可沿著基板匣盒之排列方向而移動的2台搬送機器人（裝載機、搬送機構）22。搬送機器人22藉由在行駛機構21上移動，可存取搭載於前裝載構件20之基板匣盒。各搬送機器人22在上下具備2個機械手。上側之機械手使用於將處理後之基板送回基板匣盒時。下側之機械手使用於從基板匣盒取出處理前之基板時。因而，可分開使用上下的機械手。再者，搬送機器人22下側之機械手係以可使基板反轉之方式而構成。 ＜研磨裝置＞ In addition, in the loading/unloading device 2 , a travel mechanism 21 is laid in parallel with the front loading member 20 . Two transfer robots (loader, transfer mechanism) 22 movable along the direction in which the substrate cassettes are arranged are provided on the traveling mechanism 21 . The transfer robot 22 can access the substrate cassette mounted on the front loader 20 by moving on the traveling mechanism 21 . Each transfer robot 22 has two upper and lower manipulators. The manipulator on the upper side is used to return the processed substrates to the substrate cassette. The manipulator on the lower side is used to take out the unprocessed substrate from the substrate magazine. Therefore, the upper and lower manipulators can be used separately. Furthermore, the manipulator on the lower side of the transfer robot 22 is configured to be able to reverse the substrate. ＜Grinding device＞

研磨裝置3係用於進行基板之研磨（平坦化）的裝置。研磨裝置3具備：第一研磨裝置3A、第二研磨裝置3B、第三研磨裝置3C、及第四研磨裝置3D。第一研磨裝置3A、第二研磨裝置3B、第三研磨裝置3C、及第四研磨裝置3D如圖1所示，係沿著研磨裝置之長度方向而排列。The polishing device 3 is a device for polishing (planarizing) the substrate. The polishing device 3 includes a first polishing device 3A, a second polishing device 3B, a third polishing device 3C, and a fourth polishing device 3D. The first grinding device 3A, the second grinding device 3B, the third grinding device 3C, and the fourth grinding device 3D are arranged along the longitudinal direction of the grinding device as shown in FIG. 1 .

如圖1所示，第一研磨裝置3A具備：安裝有具有研磨面之研磨墊（研磨具）10的研磨台30A；保持基板而按壓於研磨台30A上之研磨墊10來進行研磨的頂環31A；用於在研磨墊10上供給研磨液或修整液（例如，純水）之研磨液供給噴嘴32A；用於進行研磨墊10之研磨面的修整之修整器33A；及噴射液體（例如純水）與氣體（例如氮氣）之混合流體或液體（例如純水），除去研磨面上之漿液或研磨生成物、及修整時產生的研磨墊殘渣之霧化器34A。As shown in FIG. 1 , the first polishing device 3A includes: a polishing table 30A on which a polishing pad (polishing tool) 10 having a polishing surface is installed; and a top ring for grinding by holding a substrate and pressing the polishing pad 10 on the polishing table 30A 31A; the polishing liquid supply nozzle 32A for supplying the polishing liquid or the dressing liquid (for example, pure water) on the polishing pad 10; the dresser 33A for carrying out the finishing of the polishing surface of the polishing pad 10; Water) and gas (such as nitrogen) mixed fluid or liquid (such as pure water), remove the slurry on the grinding surface or grinding products, and the atomizer 34A of the grinding pad residue generated during dressing.

同樣地，第二研磨裝置3B具備：研磨台30B、頂環31B、研磨液供給噴嘴32B、修整器33B、及霧化器34B。第三研磨裝置3C具備：研磨台30C、頂環31C、研磨液供給噴嘴32C、修整器33C、及霧化器34C。第四研磨裝置3D具備：研磨台30D、頂環31D、研磨液供給噴嘴32D、修整器33D、及霧化器34D。Similarly, the second polishing device 3B includes a polishing table 30B, a top ring 31B, a polishing liquid supply nozzle 32B, a dresser 33B, and an atomizer 34B. The third polishing device 3C includes a polishing table 30C, a top ring 31C, a polishing liquid supply nozzle 32C, a dresser 33C, and an atomizer 34C. The fourth polishing device 3D includes a polishing table 30D, a top ring 31D, a polishing liquid supply nozzle 32D, a dresser 33D, and an atomizer 34D.

由於第一研磨裝置3A、第二研磨裝置3B、第三研磨裝置3C、及第四研磨裝置3D彼此具有相同構成，因此，以下僅就第一研磨裝置3A作說明。Since the first grinding device 3A, the second grinding device 3B, the third grinding device 3C, and the fourth grinding device 3D have the same structure, only the first grinding device 3A will be described below.

圖2係模式顯示第一研磨裝置3A之立體圖。頂環31A被頂環軸桿36支撐。在研磨台30A之上面貼合研磨墊10。研磨墊10之上面形成研磨基板W之研磨面。另外，亦可取代研磨墊10而使用固定研磨粒。頂環31A及研磨台30A如箭頭所示，係以在其軸心周圍旋轉之方式構成。基板W藉由真空吸附而保持於頂環31A之下面。研磨時，在從研磨液供給噴嘴32A供給研磨液至研磨墊10之研磨面的狀態下，藉由頂環31A將研磨對象之基板W按壓於研磨墊10的研磨面來進行研磨。 ＜清洗裝置＞ FIG. 2 is a perspective view schematically showing the first grinding device 3A. The top ring 31A is supported by a top ring shaft 36 . The polishing pad 10 is bonded on the polishing table 30A. The upper surface of the polishing pad 10 forms a polishing surface for polishing the substrate W. As shown in FIG. In addition, fixed abrasive grains may be used instead of the polishing pad 10 . The top ring 31A and the grinding table 30A are configured to rotate around their axes as indicated by the arrows. The substrate W is held under the top ring 31A by vacuum suction. During polishing, the substrate W to be polished is pressed against the polishing surface of the polishing pad 10 by the top ring 31A in a state where the polishing liquid is supplied from the polishing liquid supply nozzle 32A to the polishing surface of the polishing pad 10 . ＜Cleaning device＞

圖3係模式顯示清洗裝置之構成的俯視圖及側視圖。圖3(a)係顯示清洗裝置4之俯視圖，圖3(b)係顯示清洗裝置4之側視圖。如圖3(a)及圖3(b)所示，清洗裝置4被劃分成滾筒清洗室190、300、第一搬送室191、筆形清洗室192、第二搬送室193、乾燥室194、及第三搬送室195。Fig. 3 is a top view and a side view schematically showing the composition of the cleaning device. FIG. 3( a ) is a top view showing the cleaning device 4 , and FIG. 3( b ) is a side view showing the cleaning device 4 . As shown in Fig. 3 (a) and Fig. 3 (b), cleaning device 4 is divided into cylinder cleaning chamber 190,300, the first transfer chamber 191, pen-shaped cleaning chamber 192, the second transfer chamber 193, drying chamber 194, and The third transfer room 195 .

在滾筒清洗室190內配置有：沿著縱方向而排列之上側滾筒清洗模組201A及下側滾筒清洗模組201B。上側滾筒清洗模組201A及下側滾筒清洗模組201B係藉由將清洗液供給至基板表面與背面，並將旋轉之2個滾筒海綿分別按壓於基板的表面與背面來清洗基板之清洗機。在上側滾筒清洗模組201A與下側滾筒清洗模組201B之間設有基板的暫放台204。在滾筒清洗室300中配置與配置於滾筒清洗室190之上側滾筒清洗模組201A及下側滾筒清洗模組201B同樣的上側滾筒清洗模組300A及下側滾筒清洗模組300B。In the cylinder cleaning chamber 190, an upper cylinder cleaning module 201A and a lower cylinder cleaning module 201B are arranged along the vertical direction. The upper drum cleaning module 201A and the lower drum cleaning module 201B are cleaning machines that clean the substrate by supplying cleaning liquid to the surface and back of the substrate, and pressing two rotating roller sponges to the surface and back of the substrate respectively. A substrate temporary storage platform 204 is provided between the upper cylinder cleaning module 201A and the lower cylinder cleaning module 201B. In the drum cleaning chamber 300 , the same upper drum cleaning module 300A and lower drum cleaning module 300B as the upper drum cleaning module 201A and the lower drum cleaning module 201B arranged in the drum cleaning chamber 190 are arranged.

在筆形清洗室192內配置有沿著縱方向而排列之上側筆形清洗模組202A及下側筆形清洗模組202B。上側筆形清洗模組202A及下側筆形清洗模組202B係藉由將清洗液供給至基板表面，而且將旋轉之鉛筆形海綿按壓於基板表面，並在基板之徑方向搖動來清洗基板的清洗機。在上側筆形清洗模組202A與下側筆形清洗模組202B之間設有基板之暫放台203。另外，在第一搬送室191之側方配置有設置於無圖示之框架的基板W之暫放台180。Inside the pen-shaped cleaning chamber 192, an upper pen-shaped cleaning module 202A and a lower pen-shaped cleaning module 202B are arranged along the vertical direction. The upper pen-shaped cleaning module 202A and the lower pen-shaped cleaning module 202B are cleaning machines that clean the substrate by supplying cleaning liquid to the surface of the substrate, pressing a rotating pencil-shaped sponge on the surface of the substrate, and shaking in the radial direction of the substrate . Between the upper pen-shaped cleaning module 202A and the lower pen-shaped cleaning module 202B, there is a substrate temporary storage platform 203 . Moreover, the temporary storage table 180 of the board|substrate W provided in the frame which is not shown in figure is arrange|positioned at the side of the 1st transfer chamber 191. As shown in FIG.

在乾燥室194內配置有沿著縱方向而排列之上側乾燥模組205A及下側乾燥模組205B。在上側乾燥模組205A及下側乾燥模組205B之上部設有將潔淨之空氣分別供給至乾燥模組205A、205B內的過濾風扇裝置207A、207B。In the drying chamber 194, an upper side drying module 205A and a lower side drying module 205B are arranged along the vertical direction. Filter fan devices 207A, 207B are provided on the upper part of the upper drying module 205A and the lower drying module 205B to supply clean air into the drying modules 205A, 205B, respectively.

在第一搬送室191中配置可上下移動之第一搬送裝置209。在第二搬送室193中配置可上下移動之第二搬送裝置210。在第三搬送室195中配置可上下移動之第三搬送裝置213。第一搬送裝置209、第二搬送裝置210、及第三搬送裝置213分別移動自如地支撐於在縱方向延伸的支撐軸211、212、214。第一搬送裝置209、第二搬送裝置210、及第三搬送裝置213在內部具有馬達等之升降驅動機構，並沿著支撐軸211、212、214上下移動自如。第一搬送裝置209與搬送機器人22同樣地具有上下兩段機械手。第一搬送裝置209如圖3(a)之點線所示，其下側之機械手配置在可存取於暫放台180之位置。第一搬送裝置209之下側機械手存取於暫放台180時，設於分隔壁1b之快門（無圖示）打開。In the first transfer chamber 191, a first transfer device 209 that can move up and down is arranged. In the second transfer chamber 193, a second transfer device 210 capable of moving up and down is disposed. In the third transfer chamber 195, a third transfer device 213 capable of moving up and down is disposed. The first conveying device 209 , the second conveying device 210 , and the third conveying device 213 are movably supported by support shafts 211 , 212 , and 214 extending in the vertical direction, respectively. The first conveying device 209 , the second conveying device 210 , and the third conveying device 213 have elevating drive mechanisms such as motors inside, and are free to move up and down along the support shafts 211 , 212 , and 214 . The first transfer device 209 has two upper and lower stages of manipulators similarly to the transfer robot 22 . The first conveying device 209 is shown in dotted line in FIG. When the manipulator on the lower side of the first conveying device 209 accesses the temporary storage table 180, the shutter (not shown) provided on the partition wall 1b is opened.

第一搬送裝置209係以在暫放台180、上側滾筒清洗模組201A、下側滾筒清洗模組201B、暫放台204、暫放台203、上側筆形清洗模組202A、及下側筆形清洗模組202B之間搬送基板W的方式而動作。搬送清洗前之基板（附著有漿液之基板）時，第一搬送裝置209使用下側之機械手，搬送清洗後之基板時使用上側的機械手。The first conveying device 209 is based on the temporary placement platform 180, the upper side cylinder cleaning module 201A, the lower side roller cleaning module 201B, the temporary placement platform 204, the temporary placement platform 203, the upper side pen-shaped cleaning module 202A, and the lower side pen-shaped cleaning module. The module 202B operates to transfer the substrate W between the modules 202B. The first transfer device 209 uses the lower robot arm when transferring the uncleaned substrate (the substrate with the slurry attached), and uses the upper robot arm when transferring the cleaned substrate.

第二搬送裝置210係以在上側筆形清洗模組202A、下側筆形清洗模組202B、暫放台203、上側乾燥模組205A、及下側乾燥模組205B之間搬送基板W的方式而動作。由於第二搬送裝置210僅搬送清洗後之基板，因此僅具備1個機械手。圖1所示之搬送機器人22使用上側之機械手從上側乾燥模組205A或下側乾燥模組205B取出基板，並將該基板送回匣盒。搬送機器人22之上側機械手存取於乾燥模組205A、205B時，設於分隔壁1a之快門（無圖示）打開。The second transport device 210 operates in a manner of transporting the substrate W between the upper pen-shaped cleaning module 202A, the lower pen-shaped cleaning module 202B, the temporary storage table 203, the upper drying module 205A, and the lower drying module 205B. . Since the second transfer device 210 only transfers cleaned substrates, only one robot is provided. The transfer robot 22 shown in FIG. 1 uses the upper manipulator to take out the substrate from the upper drying module 205A or the lower drying module 205B, and returns the substrate to the magazine. When the upper manipulator of the transfer robot 22 accesses the drying modules 205A and 205B, the shutter (not shown) provided on the partition wall 1a is opened.

第三搬送裝置213係以在上側滾筒清洗模組300A、下側滾筒清洗模組300B、及暫放台204之間搬送基板W的方式而動作。搬送清洗前之基板（附著有漿液之基板）時，第三搬送裝置213使用下側的機械手，搬送清洗後之基板時使用上側的機械手。 ＜搬送裝置＞ The third transfer device 213 operates to transfer the substrate W between the upper drum cleaning module 300A, the lower drum cleaning module 300B, and the temporary storage table 204 . The third transfer device 213 uses the lower robot arm when transferring the uncleaned substrate (the substrate with the slurry attached), and uses the upper robot arm when transferring the cleaned substrate. ＜Conveying device＞

其次，說明用於搬送基板之搬送裝置。如圖1所示，鄰接於第一研磨裝置3A及第二研磨裝置3B而配置有第一線性傳輸機（搬送裝置）6。第一線性傳輸機6係在沿著研磨裝置3A、3B排列之方向的4個搬送位置（從裝載／卸載裝置側起依序為第一搬送位置TP1、第二搬送位置TP2、第三搬送位置TP3、及第四搬送位置TP4）之間搬送基板的裝置。Next, a transfer device for transferring substrates will be described. As shown in FIG. 1 , a first linear conveyor (conveying device) 6 is disposed adjacent to the first polishing device 3A and the second polishing device 3B. The first linear conveyor 6 is located at four transfer positions along the direction in which the grinding devices 3A and 3B are arranged (the first transfer position TP1, the second transfer position TP2, and the third transfer position from the loading/unloading device side). A device for transferring substrates between the position TP3 and the fourth transfer position TP4).

此外，鄰接於第三研磨裝置3C及第四研磨裝置3D而配置第二線性傳輸機（搬送裝置）7。第二線性傳輸機7係在沿著研磨裝置3C、3D排列之方向的3個搬送位置（從裝載／卸載裝置側起依序為第五搬送位置TP5、第六搬送位置TP6、第七搬送位置TP7）之間搬送基板的裝置。Moreover, the 2nd linear conveyor (conveying device) 7 is arrange|positioned adjacent to 3 C of 3rd grinding|polishing apparatuses and 3D of 4th grinding|polishing apparatuses. The second linear conveyor 7 is located at three transfer positions along the direction in which the grinding devices 3C and 3D are arranged (the fifth transfer position TP5, the sixth transfer position TP6, and the seventh transfer position from the loading/unloading device side). TP7) A device for transferring substrates between.

基板藉由第一線性傳輸機6而搬送至研磨裝置3A、3B。第一研磨裝置3A之頂環31A藉由頂環頭之搖擺動作而在研磨位置與第二搬送位置TP2之間移動。因此，係在第二搬送位置TP2進行對頂環31A送交基板。同樣地，第二研磨裝置3B之頂環31B在研磨位置與第三搬送位置TP3之間移動，而在第三搬送位置TP3進行對頂環31B送交基板。第三研磨裝置3C之頂環31C在研磨位置與第六搬送位置TP6之間移動，而在第六搬送位置TP6進行對頂環31C送交基板。第四研磨裝置3D之頂環31D在研磨位置與第七搬送位置TP7之間移動，而在第七搬送位置TP7進行對頂環31D送交基板。The substrate is conveyed to the polishing apparatuses 3A and 3B by the first linear conveyor 6 . The top ring 31A of the first grinding device 3A moves between the grinding position and the second transfer position TP2 by the rocking motion of the top ring head. Therefore, the transfer of the substrate to the top ring 31A is performed at the second transfer position TP2. Similarly, the top ring 31B of the second polishing device 3B moves between the polishing position and the third transfer position TP3 , and delivers the substrate to the top ring 31B at the third transfer position TP3 . The top ring 31C of the third polishing device 3C moves between the polishing position and the sixth transfer position TP6, and delivers the substrate to the top ring 31C at the sixth transfer position TP6. The top ring 31D of the fourth polishing device 3D moves between the polishing position and the seventh transfer position TP7 , and delivers the substrate to the top ring 31D at the seventh transfer position TP7 .

在第一搬送位置TP1配置有用於從搬送機器人22接收基板之升降機11。基板經由升降機11而從搬送機器人22送交第一線性傳輸機6。位於升降機11與搬送機器人22之間，在分隔壁1a上設有快門（無圖示），搬送基板時打開快門，可從搬送機器人22將基板送交升降機11。此外，在第一線性傳輸機6、第二線性傳輸機7、與清洗裝置4之間配置有搖擺傳輸機12。搖擺傳輸機12具有可在第四搬送位置TP4與第五搬送位置TP5之間移動的機械手。從第一線性傳輸機6送交基板至第二線性傳輸機7係藉由搖擺傳輸機12來進行。基板藉由第二線性傳輸機7搬送至第三研磨裝置3C及／或第四研磨裝置3D。此外，被研磨裝置3研磨後之基板經由搖擺傳輸機12搬送至清洗裝置4。The elevator 11 for receiving the board|substrate from the transfer robot 22 is arrange|positioned at 1st transfer position TP1. The substrate is sent from the transfer robot 22 to the first linear conveyor 6 via the elevator 11 . A shutter (not shown) is provided on the partition wall 1 a between the elevator 11 and the transfer robot 22 , and when the substrate is transferred, the shutter is opened to transfer the substrate from the transfer robot 22 to the elevator 11 . Furthermore, a swing conveyor 12 is disposed between the first linear conveyor 6 , the second linear conveyor 7 , and the cleaning device 4 . The swing conveyor 12 has a manipulator movable between the fourth transfer position TP4 and the fifth transfer position TP5. Substrates are delivered from the first linear conveyor 6 to the second linear conveyor 7 by means of a swing conveyor 12 . The substrate is transported to the third polishing device 3C and/or the fourth polishing device 3D by the second linear conveyor 7 . In addition, the substrate polished by the polishing device 3 is transported to the cleaning device 4 via the swing conveyor 12 .

圖4係模式顯示第一線性傳輸機6之立體圖。第一線性傳輸機6具備用於保持基板之第一、第二、第三、第四機械手600-1、600-2、600-3、600-4。此外，第一線性傳輸機6具備用於分別支撐第一～第四機械手600-1～600-4之支撐構件610。此外，第一線性傳輸機6具備用於經由支撐構件610使第一～第四機械手600-1～600-4移動之驅動機構680。驅動機構680具備：分別使第二、第三、第四機械手600-2、600-3、600-4上下移動之3個升降驅動機構（例如使用滾珠螺桿之馬達驅動機構或空氣汽缸）680A、680B、680C；在水平方向移動自如地支撐第一～第四機械手600-1～600-4之3個直線導軌682A、682B、682C；及在水平方向驅動第一～第四機械手600-1～600-4之3個水平驅動機構684A、684B、684C。本實施形態之水平驅動機構684A、684B、684C分別具有：一對滑輪686、掛在此等滑輪686上之皮帶687、及使一對滑輪中之其中一方旋轉的伺服馬達688。FIG. 4 is a schematic perspective view showing the first linear conveyor 6 . The first linear conveyor 6 includes first, second, third, and fourth robots 600-1, 600-2, 600-3, and 600-4 for holding substrates. In addition, the first linear conveyor 6 includes support members 610 for supporting the first to fourth manipulators 600-1 to 600-4, respectively. In addition, the first linear conveyor 6 includes a drive mechanism 680 for moving the first to fourth robots 600 - 1 to 600 - 4 via the supporting member 610 . The driving mechanism 680 is equipped with: 3 lifting driving mechanisms (such as a motor driving mechanism using a ball screw or an air cylinder) 680A that respectively move the second, third, and fourth manipulators 600-2, 600-3, and 600-4 up and down . - 3 horizontal drive mechanisms 684A, 684B, 684C from 1 to 600-4. The horizontal driving mechanisms 684A, 684B, and 684C of this embodiment each have a pair of pulleys 686, a belt 687 hung on these pulleys 686, and a servo motor 688 that rotates one of the pair of pulleys.

第一機械手600-1被第一直線導軌682A支撐，並被第一水平驅動機構684A驅動而在第一搬送位置TP1與第四搬送位置TP4之間移動。該第一機械手600-1係從升降機11接收基板，並將其送交第二線性傳輸機7的路徑機械手。因此，不以第一研磨裝置3A及第二研磨裝置3B研磨基板，而以第三研磨裝置3C及第四研磨裝置3D研磨時係使用第一機械手600-1。該第一機械手600-1中不設升降驅動機構，第一機械手600-1僅可在水平方向移動。The first manipulator 600-1 is supported by the first linear guide rail 682A and driven by the first horizontal drive mechanism 684A to move between the first transfer position TP1 and the fourth transfer position TP4. The first robot 600 - 1 is a path robot that receives substrates from the elevator 11 and delivers them to the second linear conveyor 7 . Therefore, the first robot arm 600 - 1 is used when the substrate is polished not by the first polishing device 3A and the second polishing device 3B but by the third polishing device 3C and the fourth polishing device 3D. The first manipulator 600-1 does not have a lifting drive mechanism, and the first manipulator 600-1 can only move in the horizontal direction.

第二機械手600-2被第二直線導軌682B支撐，並被第二水平驅動機構684B驅動而在第一搬送位置TP1與第二搬送位置TP2之間移動。該第二機械手600-2發揮用於將基板從升降機11搬送至第一研磨裝置3A的存取機械手之功能。亦即，第二機械手600-2係移動至第一搬送位置TP1，並在此處從升降機11接收基板。而後，第二機械手600-2再度移動至第二搬送位置TP2，在此處將保持於第二機械手600-2之基板送交頂環31A。第二機械手600-2連結有第一升降驅動機構680A，此等可一體地在水平方向移動。將基板送交頂環31A時，第二機械手600-2被第一升降驅動機構680A驅動而上升，將基板送交頂環31A後，被第一升降驅動機構680A驅動而下降。The second manipulator 600-2 is supported by the second linear guide rail 682B and driven by the second horizontal drive mechanism 684B to move between the first transfer position TP1 and the second transfer position TP2. The second robot 600-2 functions as an access robot for transferring the substrate from the elevator 11 to the first polishing apparatus 3A. That is, the second robot arm 600 - 2 moves to the first transfer position TP1 and receives the substrate from the elevator 11 there. Then, the second robot arm 600-2 moves to the second transfer position TP2 again, where the substrate held by the second robot arm 600-2 is delivered to the top ring 31A. The second manipulator 600-2 is connected with the first lift drive mechanism 680A, which can move in the horizontal direction integrally. When delivering the substrate to the top ring 31A, the second manipulator 600-2 is driven up by the first lift drive mechanism 680A, and after delivering the substrate to the top ring 31A, is driven down by the first lift drive mechanism 680A.

第三機械手600-3與第四機械手600-4被第三直線導軌682C支撐。第三機械手600-3與第四機械手600-4藉由空氣汽缸692而彼此連結，此等被第三水平驅動機構684C驅動，可一體地在水平方向移動。空氣汽缸692發揮調整第三機械手600-3與第四機械手600-4之間隔的間隔調整機構之功能。設置該空氣汽缸（間隔調整機構）692之理由是因為有時第一搬送位置TP1與第二搬送位置TP2之間隔、以及第二搬送位置TP2與第三搬送位置TP3之間隔不同。空氣汽缸692可在第三機械手600-3及第四機械手600-4移動中進行間隔調整動作。The third manipulator 600-3 and the fourth manipulator 600-4 are supported by the third linear guide rail 682C. The third manipulator 600-3 and the fourth manipulator 600-4 are connected to each other by the air cylinder 692, and these are driven by the third horizontal driving mechanism 684C, and can integrally move in the horizontal direction. The air cylinder 692 functions as an interval adjustment mechanism for adjusting the interval between the third robot arm 600-3 and the fourth robot arm 600-4. The reason why the air cylinder (interval adjusting mechanism) 692 is provided is that the interval between the first transfer position TP1 and the second transfer position TP2 and the interval between the second transfer position TP2 and the third transfer position TP3 may be different. The air cylinder 692 can perform the interval adjustment operation during the movement of the third manipulator 600-3 and the fourth manipulator 600-4.

第三機械手600-3連結有第二升降驅動機構680B，第四機械手600-4連結有第三升降驅動機構680C，第三機械手600-3與第四機械手600-4可獨立升降。第三機械手600-3在第一搬送位置TP1、第二搬送位置TP2、及第三搬送位置TP3之間移動，同時，第四機械手600-4在第二搬送位置TP2、第三搬送位置TP3、及第四搬送位置TP4之間移動。The third manipulator 600-3 is connected with the second lift drive mechanism 680B, the fourth manipulator 600-4 is connected with the third lift drive mechanism 680C, the third manipulator 600-3 and the fourth manipulator 600-4 can lift independently . The third manipulator 600-3 moves between the first transfer position TP1, the second transfer position TP2, and the third transfer position TP3. At the same time, the fourth manipulator 600-4 moves between the second transfer position TP2 and the third transfer position. It moves between TP3 and the fourth transfer position TP4.

第三機械手600-3發揮用於將基板從升降機11搬送至第二研磨裝置3B之存取機械手的功能。亦即，第三機械手600-3係以移動至第一搬送位置TP1，在此處從升降機11接收基板，進一步移動至第三搬送位置TP3，將基板送交頂環31B之方式而動作。第三機械手600-3還可發揮用於將被第一研磨裝置3A研磨後之基板搬送至第二研磨裝置3B的存取機械手之功能。亦即，第三機械手600-3係以移動至第二搬送位置TP2，在此處從頂環31A接收基板，進一步移動至第三搬送位置TP3，而後將基板送交頂環31B之方式而動作。在第三機械手600-3與頂環31A或頂環31B之間進行基板交接時，第三機械手600-3被第二升降驅動機構680B驅動而上升，基板交接結束後被第二升降驅動機構680B驅動而下降。The third robot 600-3 functions as an access robot for transferring the substrate from the elevator 11 to the second polishing apparatus 3B. That is, the third robot arm 600-3 moves to the first transfer position TP1, receives the substrate from the elevator 11 there, further moves to the third transfer position TP3, and delivers the substrate to the top ring 31B. The third robot 600-3 can also function as an access robot for transferring the substrate polished by the first polishing device 3A to the second polishing device 3B. That is, the third robot arm 600-3 moves to the second transfer position TP2, receives the substrate from the top ring 31A there, further moves to the third transfer position TP3, and then delivers the substrate to the top ring 31B. action. When transferring substrates between the third manipulator 600-3 and the top ring 31A or top ring 31B, the third manipulator 600-3 is driven up by the second lift drive mechanism 680B, and is driven by the second lift drive after the substrate handover is completed. Mechanism 680B is driven to descend.

第四機械手600-4發揮用於將被第一研磨裝置3A或第二研磨裝置3B研磨後之基板搬送至搖擺傳輸機12的存取機械手之功能。亦即，第四機械手600-4移動至第二搬送位置TP2或第三搬送位置TP3，在此處從頂環31A或頂環31B接收研磨後之基板，然後移動至第四搬送位置TP4。從頂環31A或頂環31B接收基板時，第四機械手600-4被第三升降驅動機構680C驅動而上升，接收基板後，被第三升降驅動機構680C驅動而下降。The fourth robot 600 - 4 functions as an access robot for transferring the substrate polished by the first polishing device 3A or the second polishing device 3B to the swing conveyor 12 . That is, the fourth robot arm 600-4 moves to the second transfer position TP2 or the third transfer position TP3, where it receives the polished substrate from the top ring 31A or 31B, and then moves to the fourth transfer position TP4. When receiving a substrate from the top ring 31A or 31B, the fourth manipulator 600-4 is driven up by the third lift drive mechanism 680C, and is driven down by the third lift drive mechanism 680C after receiving the substrate.

第二線性傳輸機7除了不具備相當於第一機械手600-1之零件係與第一線性傳輸機6不同之外，其他則與第一線性傳輸機6基本上具有相同構成，因此省略詳細之說明。 ＜機械手＞ The second linear conveyor 7 has basically the same structure as the first linear conveyor 6 except that it does not have parts equivalent to the first manipulator 600-1. Detailed description is omitted. ＜Robots＞

其次，詳細說明機械手。由於第一～第四機械手600-1～600-4具有同樣之構成，因此僅就1個機械手（權宜上，稱為「機械手600」）進行說明。圖5係模式顯示機械手之構成的立體圖。Second, the manipulator is specified in detail. Since the first to fourth manipulators 600-1 to 600-4 have the same configuration, only one manipulator (expediently referred to as "manipulator 600") will be described. Fig. 5 is a three-dimensional view schematically showing the composition of the manipulator.

如圖5所示，機械手600具備：機械手本體620；及安裝於機械手本體620之複數個（本實施形態係5個）落座構件630-1～630-5。機械手本體620係以包圍基板之落座區域SA的方式而形成概略U字狀的板狀構件。落座構件630-1～630-5係基板落座之構件。落座構件630-1～630-5以包圍落座區域SA之方式相互隔以間隔而安裝於機械手本體620。另外，本實施形態之機械手600係顯示具備5個落座構件630-1～630-5之例，不過落座構件630之數量不拘。機械手600只要具備將基板W儘量保持水平，且可將基板W之重量均等分配的3個以上落座構件630即可。As shown in FIG. 5 , the manipulator 600 includes: a manipulator body 620 ; and a plurality of (five in this embodiment) seating members 630 - 1 to 630 - 5 mounted on the manipulator body 620 . The robot body 620 is a generally U-shaped plate member that surrounds the seating area SA of the substrate. The seating components 630-1 to 630-5 are components for seating the substrate. The seating members 630-1 to 630-5 are installed on the manipulator body 620 at intervals so as to surround the seating area SA. In addition, the manipulator 600 of the present embodiment shows an example provided with five seating members 630-1 to 630-5, but the number of seating members 630 is not limited. The robot arm 600 only needs to include three or more seating members 630 that can keep the substrate W as horizontal as possible and distribute the weight of the substrate W equally.

落座構件630-1～630-5依有無用於檢測基板落座於機械手600的落座檢測器而區分成兩種。本實施形態之落座構件630-1、630-3、630-5備有落座檢測器，而落座構件630-2、630-4不具備落座檢測器。以下，為了區別兩者，而適切將落座構件630-1、630-3、630-5稱為「第一落座構件」，並將落座構件630-2、630-4稱為「第二落座構件」。The seating members 630 - 1 to 630 - 5 are divided into two types depending on whether there is a seating detector for detecting that the substrate is seated on the robot arm 600 . The seating members 630-1, 630-3, and 630-5 of this embodiment are equipped with a seating detector, while the seating members 630-2 and 630-4 are not equipped with a seating detector. Hereinafter, in order to distinguish the two, the seating members 630-1, 630-3, 630-5 are appropriately referred to as "first seating members", and the seating members 630-2, 630-4 are referred to as "second seating members". ".

圖6A係模式顯示第一落座構件之構成的立體圖。圖6B係圖6A之B-B線的剖面圖。圖6C係圖6A之C-C線的剖面圖。如圖6A至圖6C所示，第一落座構件630-1、630-3、630-5分別具備：安裝於機械手本體620之基座631；經由基座631而被機械手本體620支撐之軸構件632；及被軸構件632支撐之槓桿構件634。槓桿構件634係配置於形成在基座631之溝中的棒狀構件。槓桿構件634包含：具有基板落座之落座部634-1a的第一端部634-1；與夾著軸構件632而設於第一端部634-1之相反側的第二端部634-2。槓桿構件634係以第一端部634-1突出於落座區域SA之方式而被軸構件632支撐。Fig. 6A is a perspective view schematically showing the composition of the first seating member. Fig. 6B is a cross-sectional view of line B-B in Fig. 6A. Fig. 6C is a cross-sectional view of line C-C in Fig. 6A. As shown in Figure 6A to Figure 6C, the first seating members 630-1, 630-3, 630-5 respectively have: a base 631 installed on the manipulator body 620; a shaft member 632; and a lever member 634 supported by the shaft member 632. The lever member 634 is a rod-shaped member disposed in a groove formed in the base 631 . The lever member 634 includes: a first end portion 634-1 having a seat portion 634-1a on which the substrate is seated; . The lever member 634 is supported by the shaft member 632 in such a manner that the first end portion 634-1 protrudes from the seating area SA.

此外，第一落座構件630-1、630-3、630-5分別具備用於將使槓桿構件634旋轉之力賦予槓桿構件634的施力構件636。施力構件636係以第二端部634-2向下方移動之方式將使槓桿構件634旋轉之力賦予槓桿構件634。因此，圖6B中如虛線所示，基板未落座於槓桿構件634時，第二端部634-2變成向下方移動之狀態。本實施形態之施力構件636係壓縮彈簧。具體而言，壓縮彈簧係以一端安裝於覆蓋槓桿構件634之上部的外殼639，另一端安裝於形成在槓桿構件634之比軸構件632而在第二端部634-2側之上面的孔634b之底面的方式而構成。另外，施力構件636不限定於壓縮彈簧，只要是將上述之施加力賦予槓桿構件634者即可，可適用橡膠等之彈性體。In addition, each of the first seating members 630-1, 630-3, and 630-5 includes an urging member 636 for applying force to rotate the lever member 634 to the lever member 634. The biasing member 636 applies a force to rotate the lever member 634 to the lever member 634 such that the second end portion 634-2 moves downward. Therefore, as shown by the dotted line in FIG. 6B , when the substrate is not seated on the lever member 634 , the second end portion 634 - 2 is in a state of moving downward. The biasing member 636 of this embodiment is a compression spring. Specifically, one end of the compression spring is mounted on the housing 639 covering the top of the lever member 634, and the other end is mounted on the hole 634b formed on the second end 634-2 side of the lever member 634 than the shaft member 632. formed in the manner of the bottom surface. In addition, the urging member 636 is not limited to a compression spring, as long as it applies the above-mentioned urging force to the lever member 634, an elastic body such as rubber can be used.

第一落座構件630-1、630-3、630-5分別進一步具備用於檢測基板落座於機械手600之落座檢測器638。具體而言，落座檢測器638係以檢測第二端部634-2向上方移動之方式而構成。亦即，圖6B中，當基板未落座於槓桿構件634時，藉由施力構件636施力槓桿構件634，而如虛線所示，形成第二端部634-2位於下方之狀態。另外，當基板落座於槓桿構件634之落座部634-1a時，槓桿構件634藉由基板之重量而以軸構件632為中心旋轉，第一端部634-1向下方移動，並且第二端部634-2向上方移動。槓桿構件634之第二端部634-2中設有磁鐵634-2a。落座檢測器638包含檢測磁鐵634-2a向上方移動之磁性檢測器而構成。落座檢測器638在磁鐵634-2a向上方移動而接近磁性檢測器時，藉由檢測磁阻之變化而檢測第二端部634-2向上方移動，換言之，檢測基板落座於槓桿構件634之落座部634-1a。Each of the first seating members 630 - 1 , 630 - 3 , and 630 - 5 further includes a seating detector 638 for detecting that the substrate is seated on the robot arm 600 . Specifically, the seating detector 638 is configured to detect the upward movement of the second end portion 634-2. That is, in FIG. 6B , when the substrate is not seated on the lever member 634 , the lever member 634 is urged by the force applying member 636 , and as shown by the dotted line, a state in which the second end portion 634 - 2 is located below is formed. In addition, when the substrate is seated on the seating portion 634-1a of the lever member 634, the lever member 634 is rotated around the shaft member 632 by the weight of the substrate, the first end portion 634-1 moves downward, and the second end portion 634-2 moves upwards. The second end portion 634-2 of the lever member 634 is provided with a magnet 634-2a. The seating detector 638 includes a magnetic detector for detecting the upward movement of the magnet 634-2a. When the magnet 634-2a moves upward and approaches the magnetic detector, the seating detector 638 detects the change of the magnetic resistance to detect the upward movement of the second end 634-2. In other words, it detects that the substrate is seated on the lever member 634. Section 634-1a.

另外，機械手本體620中，沿著機械手本體620之外形設有配線護蓋622。連接於落座檢測器638之纜線通過配線護蓋622內部而配線。此外，第一落座構件630-1、630-3、630-5具備以覆蓋槓桿構件634之第二端部634-2及落座檢測器638的方式而構成之外殼639。In addition, the manipulator body 620 is provided with a wiring cover 622 along the outer shape of the manipulator body 620 . The cables connected to the seating detector 638 are wired through the inside of the wiring cover 622 . In addition, the first seating members 630 - 1 , 630 - 3 , and 630 - 5 include a housing 639 configured to cover the second end 634 - 2 of the lever member 634 and the seating detector 638 .

採用本實施形態時，可使基板之落座檢測的精度提高。亦即，習知技術係使用設於落座部634-1a之光學式檢測器進行落座檢測。此處，由於落座部634-1a在突出於落座區域SA之位置，且在落座區域SA混合有用於清洗處理之清洗水及用於研磨處理之漿液，因此光學式檢測器之光因清洗水或漿液而亂反射，結果，造成基板落座之錯誤檢測。相對於此，本實施形態之落座檢測器638係以藉由檢測第二端部634-2向上方移動而進行落座檢測的方式而構成。由於第二端部634-2與包含落座部634-1a之第一端部634-1夾著軸構件632而在相反側，並從落座區域SA離開，因此不易受到清洗水或漿液的干擾，結果，可使基板之落座檢測的精度提高。此外，本實施形態由於係藉由外殼639覆蓋第二端部634-2及落座檢測器638，因此，更加不易受到清洗水或漿液之干擾，結果可使基板之落座檢測的精度提高。According to this embodiment, the accuracy of the detection of the seating of the substrate can be improved. That is to say, the conventional technique is to use an optical detector provided on the seating portion 634-1a for seating detection. Here, since the seating portion 634-1a protrudes from the seating area SA, and the washing water for washing and the slurry for grinding are mixed in the seating area SA, the light of the optical detector is caused by the washing water or the slurry. The slurry is reflected randomly, and as a result, false detection of substrate seating is caused. In contrast, the seating detector 638 of the present embodiment is configured to perform seating detection by detecting the upward movement of the second end portion 634-2. Since the second end portion 634-2 and the first end portion 634-1 including the seating portion 634-1a are on the opposite side across the shaft member 632 and away from the seating area SA, it is less likely to be disturbed by cleaning water or slurry. As a result, the accuracy of substrate seating detection can be improved. In addition, in this embodiment, since the second end portion 634-2 and the seating detector 638 are covered by the casing 639, it is less likely to be disturbed by cleaning water or slurry, and as a result, the accuracy of the seating detection of the substrate can be improved.

另外，本實施形態係顯示落座檢測器638包含藉由磁性檢測器檢測設於第二端部634-2之磁鐵634-2a的自動切換式檢測器之例，不過不限定於此。例如，落座檢測器638亦可包含具有投光零件與受光零件之光學式檢測器。此時，投光零件與受光零件配置於第二端部634-2附近。槓桿構件634於第二端部634-2向上方移動時，係以遮蔽投光零件與受光零件之間的方式被軸構件632支撐。藉此，當基板未落座於槓桿構件634時，第二端部634-2位於下方，受光零件可檢測從投光零件所輸出的光。另外，由於第二端部634-2向上方移動時，受光零件無法檢測從投光零件所輸出的光，因此可檢測基板落座於槓桿構件634。In addition, this embodiment shows an example in which the seating detector 638 includes an automatic switching detector that detects the magnet 634-2a provided at the second end portion 634-2 by a magnetic detector, but it is not limited thereto. For example, the seating detector 638 may also include an optical detector having a light emitting part and a light receiving part. At this time, the light projecting component and the light receiving component are disposed near the second end portion 634-2. When the second end portion 634-2 moves upward, the lever member 634 is supported by the shaft member 632 so as to shield the space between the light emitting part and the light receiving part. Accordingly, when the substrate is not seated on the lever member 634, the second end portion 634-2 is located below, and the light receiving part can detect the light output from the light emitting part. In addition, since the light receiving part cannot detect the light output from the light emitting part when the second end part 634 - 2 moves upward, the detectable substrate is seated on the lever member 634 .

本實施形態係藉由磁鐵634-2a在圖6B之2點鏈線與實線的位置間移動來判斷落座。落座檢測器638之位置在本實施形態係配置於第二端部634-2旁邊（側面），不過，亦可設於與磁鐵634-2a之上面相對的外殼639之螺栓下面的位置。此外，落座檢測器638亦可包含電力式檢測器。此時，在槓桿構件634之第二端部634-2設第一電接點。落座檢測器638具有當第二端部634-2向上方移動時與第一電接點接觸的第二電接點，可藉由電壓之變化檢測基板落座於槓桿構件634。此外，落座檢測器638亦可包含壓電式檢測器（壓力檢測器）、或應變儀式檢測器。此時，在第二端部634-2之前端或端部的接觸部設置壓電式檢測器（壓力檢測器）或應變儀式檢測器，可藉由檢測壓力變化或應變變化來檢測基板落座於槓桿構件634。此外，本實施形態所說明之落座構件除了適用於移動式的機械手之外，亦可適用於在搬送中途之基板的暫放台及對準凹槽及定向平面之方向的定位台。In this embodiment, the seat is judged by moving the magnet 634-2a between the positions of the two-dot chain line and the solid line in FIG. 6B. The seating detector 638 is located beside (side of) the second end portion 634-2 in this embodiment, but it may also be provided at a position below the bolt of the casing 639 facing the upper surface of the magnet 634-2a. In addition, the seating detector 638 may also include an electrical detector. At this time, a first electrical contact is provided at the second end portion 634 - 2 of the lever member 634 . The seating detector 638 has a second electrical contact that is in contact with the first electrical contact when the second end 634 - 2 moves upward, and can detect that the substrate is seated on the lever member 634 through a change in voltage. In addition, the seating detector 638 may also include a piezoelectric detector (pressure detector), or a strain gauge detector. At this time, a piezoelectric detector (pressure detector) or a strain gauge detector is provided at the contact portion of the front end or end of the second end 634-2, and the seat of the substrate can be detected by detecting a pressure change or a strain change. lever member 634 . In addition, the seating member described in this embodiment is applicable not only to a mobile robot arm, but also to a temporary storage platform for substrates in transit and a positioning platform for aligning the direction of the groove and the orientation plane.

圖7A係模式顯示第二落座構件之構成的立體圖。第二落座構件630-2、630-4與第一落座構件630-1、630-3、630-5比較，不同之處為不具備施力構件636及落座檢測器638。其他零件具有同樣功能，因此對於具有同樣功能之零件註記同樣的符號。如圖7A所示，第二落座構件630-2、630-4分別具備：安裝於機械手本體620之基座631；經由基座631而被機械手本體620支撐之軸構件632；及被軸構件632支撐之槓桿構件634。槓桿構件634包含：具有基板落座之落座部634-1a的第一端部634-1；及夾著軸構件632而設於與第一端部634-1相反側之第二端部634-2。槓桿構件634係以第一端部634-1突出於落座區域SA之方式而被軸構件632支撐。槓桿構件634及軸構件632藉由外殼639覆蓋。Fig. 7A is a perspective view schematically showing the composition of the second seating member. Compared with the first seating members 630 - 1 , 630 - 3 , 630 - 5 , the second seating members 630 - 2 , 630 - 4 are different in that they do not have the force applying member 636 and the seating detector 638 . Other parts have the same function, so mark the same symbol for the parts with the same function. As shown in Figure 7A, the second seating members 630-2, 630-4 respectively have: a base 631 installed on the manipulator body 620; a shaft member 632 supported by the manipulator body 620 through the base 631; The lever member 634 supported by the member 632. The lever member 634 includes: a first end portion 634-1 having a seat portion 634-1a on which the substrate is seated; . The lever member 634 is supported by the shaft member 632 in such a manner that the first end portion 634-1 protrudes from the seating area SA. The lever member 634 and the shaft member 632 are covered by a case 639 .

此外，如圖6及圖7A所示，落座構件630-1～630-5分別具備：用於支撐軸構件632之兩端部的一對軸承633；及用於支撐一對軸承633之一對彈性構件635。彈性構件635在本實施形態係彈簧構件。彈簧構件係以一端安裝於軸承633的下面，另一端安裝於形成在機械手本體620上面之孔的底面之方式而構成。藉由該構成，槓桿構件634藉由彈性構件635而被機械手本體620支撐。另外，彈性構件635不限定於彈簧構件，只要是可吸收來自頂環之按壓負荷的構件即可。In addition, as shown in FIG. 6 and FIG. 7A , the seating members 630-1 to 630-5 are respectively equipped with: a pair of bearings 633 for supporting both ends of the shaft member 632; Elastic member 635. The elastic member 635 is a spring member in this embodiment. The spring member is configured such that one end is mounted on the lower surface of the bearing 633 and the other end is mounted on the bottom surface of a hole formed on the upper surface of the manipulator body 620 . With this configuration, the lever member 634 is supported by the manipulator body 620 via the elastic member 635 . In addition, the elastic member 635 is not limited to a spring member, as long as it can absorb the pressing load from the top ring.

圖7B係模式顯示從機械手向頂環送交基板之圖。圖7B模式顯示後述之圖8A中的B-B線剖面。頂環31具備：環狀之扣環312；及被扣環312包圍之隔膜320等。如圖7B所示，落座構件之外殼639的剖面形成L字形狀。扣環312係以從機械手600向頂環31送交基板W時收容於外殼639之包圍成L字形狀的空間之方式而配置。藉此，可輕易確認機械手600與頂環31之位置關係。此外，如圖7B所示，從機械手向頂環31送交基板W時，係將隔膜320按壓於基板W進行真空吸附。這一點係基板W落座之槓桿構件634經由彈性構件635而被機械手本體620支撐。因此，藉由隔膜320壓下基板W時，可藉由彈性構件635吸收按壓負荷。Fig. 7B is a schematic diagram showing substrate delivery from the robot to the top ring. Fig. 7B schematically shows the B-B line section in Fig. 8A described later. The top ring 31 includes: an annular buckle 312 ; and a diaphragm 320 surrounded by the buckle 312 , and the like. As shown in FIG. 7B, the cross section of the housing 639 of the seating member is formed in an L-shape. The retaining ring 312 is arranged so as to be accommodated in the L-shaped space surrounded by the case 639 when the substrate W is transferred from the robot arm 600 to the top ring 31 . Thereby, the positional relationship between the manipulator 600 and the top ring 31 can be easily confirmed. In addition, as shown in FIG. 7B , when the substrate W is delivered from the robot to the top ring 31 , the diaphragm 320 is pressed against the substrate W for vacuum adsorption. This point is that the lever member 634 on which the substrate W sits is supported by the manipulator body 620 via the elastic member 635 . Therefore, when the substrate W is pressed down by the diaphragm 320 , the pressing load can be absorbed by the elastic member 635 .

採用本實施形態時，可更穩定地吸收來自頂環之按壓負荷。亦即，習知技術之機械手係包含2片葉片（上側葉片與下側葉片）而構成，並藉由在葉片間設置彈性構件而吸收來自頂環之按壓負荷。此時，當頂環之隔膜按壓於基板W時，整個上側葉片承受按壓負荷。因此，例如隔膜對基板W一端接觸時，上側葉片之一部分壓下，造成上側葉片傾斜，可能導致按壓負荷之吸收不穩定。According to this embodiment, the pressing load from the top ring can be more stably absorbed. That is, the manipulator of the prior art is composed of two blades (upper blade and lower blade), and the pressing load from the top ring is absorbed by arranging elastic members between the blades. At this time, when the diaphragm of the top ring is pressed against the base plate W, the entire upper blade bears the pressing load. Therefore, for example, when the diaphragm comes into contact with one end of the substrate W, a part of the upper vane is pushed down, causing the upper vane to incline, which may result in unstable absorption of the pressing load.

相對而言，本實施形態由於落座構件630-1～630-5分別具有支撐槓桿構件634之彈性構件635，因此可以1片構成機械手本體620，可節約成本。再加上，由於落座構件630-1～630-5之各個槓桿構件634經由彈性構件635而被1片機械手本體620支撐，因此，例如隔膜320對基板W一端接觸時，由於對應於一端接觸位置之落座構件630-1～630-5的任何一個吸收按壓負荷，因此機械手本體620不易傾斜。結果，採用本實施形態時，可更穩定地吸收來自頂環之按壓負荷。另外，關於第一～第四機械手600-1～600-4中，不承受來自頂環之按壓負荷的機械手（例如第一機械手600-1）亦可不設彈性構件635。此外，本實施形態之機械手600係支撐固定基板W者，再者，對其支撐部***、配置基板W之方法係將基板W水平地落入者。本實施形態之機械手600並非將機械手600從基板W之兩側面方向水平移動，以夾著的方式而握持者。In contrast, in this embodiment, since the seating members 630-1 to 630-5 each have the elastic member 635 supporting the lever member 634, the manipulator body 620 can be constructed in one piece, which can save costs. In addition, since the lever members 634 of the seating members 630-1 to 630-5 are supported by one manipulator body 620 via the elastic member 635, for example, when the diaphragm 320 is in contact with one end of the substrate W, due to the corresponding one end contact Any one of the seating members 630-1 to 630-5 at the positions absorbs the pressing load, so the manipulator body 620 is less likely to tilt. As a result, according to this embodiment, the pressing load from the top ring can be more stably absorbed. In addition, among the first to fourth manipulators 600 - 1 to 600 - 4 , the manipulator that does not bear the pressing load from the top ring (for example, the first manipulator 600 - 1 ) may not have the elastic member 635 . In addition, the manipulator 600 of this embodiment supports and fixes the substrate W, and the method of inserting and arranging the substrate W to the supporting portion is to drop the substrate W horizontally. The robot arm 600 of this embodiment does not move the robot arm 600 horizontally from both side surfaces of the substrate W to grip it in a sandwiching manner.

另外，上述實施形態係顯示落座構件630-1～630-5分別具備：用於支撐軸構件632之兩端部的一對軸承633；及用於支撐一對軸承633的一對彈性構件635之例，不過不限定於此。以下，說明一對軸承633與一對彈性構件635之變化例。圖7C係圖6A中之C’-C’線的剖面圖。如圖7C所示，落座構件630-1～630-5亦可分別具備用於支撐軸構件632之兩端部的軸承633’。軸承633’係在軸構件632之下方橫跨軸構件632之兩端部而延伸的單一構件。此外，如圖7C所示，落座構件630-1～630-5亦可分別具備支撐軸承633’之下面中央的單一之彈性構件635’。In addition, the above embodiment shows that the seating members 630-1 to 630-5 respectively include: a pair of bearings 633 for supporting both ends of the shaft member 632; and a pair of elastic members 635 for supporting the pair of bearings 633. example, but not limited to this. Hereinafter, modifications of the pair of bearings 633 and the pair of elastic members 635 will be described. Fig. 7C is a sectional view of line C'-C' in Fig. 6A. As shown in FIG. 7C , the seating members 630-1 to 630-5 may also have bearings 633' for supporting both ends of the shaft member 632, respectively. Bearing 633' is a single member extending across both ends of shaft member 632 below shaft member 632. In addition, as shown in FIG. 7C , the seating members 630-1 to 630-5 may each have a single elastic member 635' supporting the center of the lower surface of the bearing 633'.

採用本變化例時，與上述實施形態同樣地，由於落座構件630-1～630-5之各個槓桿構件634係經由彈性構件635’而被1片機械手本體620支撐，因此可更穩地定吸收來自頂環之按壓負荷。 ＜引導構件及定位構件＞ When adopting this modification, as in the above-mentioned embodiment, each lever member 634 of the seating members 630-1 to 630-5 is supported by a piece of manipulator body 620 through the elastic member 635', so it can be stabilized more stably. Absorbs the pressing load from the top ring. <Guide member and positioning member>

其次，說明設於機械手600之引導構件及定位構件。圖8A係模式顯示機械手之構成的俯視圖。圖8B係模式顯示引導構件之構成的立體圖。圖8C係模式顯示引導構件之構成的剖面圖。Next, the guide member and the positioning member provided in the manipulator 600 will be described. Fig. 8A is a top view schematically showing the composition of the manipulator. Fig. 8B is a perspective view schematically showing the composition of the guide member. Fig. 8C is a cross-sectional view schematically showing the structure of the guide member.

如圖8所示，機械手600具備複數個（本實施形態係4個）引導構件640。複數個引導構件640係以包圍落座區域SA之方式彼此隔以指定間隔而安裝於機械手本體620。複數個引導構件640分別具有：在鉛直方向延伸之圓柱狀的引導本體641；與以朝向落座區域SA並向下方傾斜之方式形成於引導本體641的基板承受面642。在機械手本體620之下面固定有用於支撐引導本體641之支撐構件644。此外，在機械手本體620之貫穿孔中安裝有圓筒構件645。引導本體641***圓筒構件645之內部，並經由彈性構件646（彈簧構件）而被支撐構件644支撐。藉此，可以彈性構件646吸收施加於引導本體641之負荷。As shown in FIG. 8 , the manipulator 600 includes a plurality of (four in this embodiment) guide members 640 . A plurality of guide members 640 are installed on the manipulator body 620 at predetermined intervals so as to surround the seating area SA. The plurality of guide members 640 each have: a cylindrical guide body 641 extending in the vertical direction; and a substrate receiving surface 642 formed on the guide body 641 to be inclined downward toward the seating area SA. A supporting member 644 for supporting the guiding body 641 is fixed under the manipulator body 620 . In addition, a cylindrical member 645 is installed in the through hole of the manipulator body 620 . The guide body 641 is inserted into the cylindrical member 645 and supported by the support member 644 via the elastic member 646 (spring member). Accordingly, the elastic member 646 can absorb the load applied to the guide body 641 .

藉由在引導本體641中形成有基板承受面642，如圖8A所示，設置比落座區域SA之直徑大的基板端緣徑WC。所謂基板端緣徑WC係連結複數個引導本體641之基板承受面642上端的圓之直徑。機械手600從頂環接收基板時，即使將基板送至落座區域SA外，只要是在基板端緣徑WC之範圍內，仍可使基板落座於落座區域SA。關於這一點，與以下說明之定位構件合併說明於後。By forming the substrate receiving surface 642 in the guide body 641, as shown in FIG. 8A, the substrate edge diameter WC larger than the diameter of the seating area SA is provided. The so-called substrate edge diameter WC refers to the diameter of the circle connecting the upper ends of the substrate receiving surfaces 642 of the plurality of guide bodies 641 . When the robot arm 600 receives the substrate from the top ring, even if the substrate is sent out of the seating area SA, the substrate can still be seated in the seating area SA as long as it is within the range of the edge diameter WC of the substrate. Regarding this point, it will be described later in conjunction with the positioning member described below.

圖9A係模式顯示機械手之構成的俯視圖。圖9B係模式顯示定位構件之構成的立體圖。圖9C係模式顯示定位構件之構成的側視圖。如圖9A至圖9C所示，機械手600具備複數個（本實施形態係4個）定位構件650。複數個定位構件650係以包圍落座區域SA之方式彼此隔以指定的間隔而安裝於機械手本體620。複數個定位構件650分別具有與落座區域SA之外緣接觸的定位部652。具體而言，定位構件650分別包含形成從機械手本體620之上面在鉛直上方向延伸的圓柱形狀之定位柱654，並在定位柱654之接觸基板W的側面形成定位部652。藉由將定位構件650形成圓柱形狀之定位柱654，可減少基板與定位柱654之接觸面積，因此可降低基板表面之瑕疵。Fig. 9A is a top view schematically showing the composition of the manipulator. Fig. 9B is a perspective view schematically showing the composition of the positioning member. Fig. 9C is a side view schematically showing the composition of the positioning member. As shown in FIGS. 9A to 9C , the manipulator 600 includes a plurality of (four in this embodiment) positioning members 650 . A plurality of positioning members 650 are installed on the manipulator body 620 at predetermined intervals so as to surround the seating area SA. The plurality of positioning members 650 each have a positioning portion 652 in contact with the outer edge of the seating area SA. Specifically, the positioning members 650 each include cylindrical positioning columns 654 extending vertically upward from the upper surface of the robot body 620 , and positioning portions 652 are formed on the sides of the positioning columns 654 that contact the substrate W. By forming the positioning member 650 into a cylindrical positioning post 654, the contact area between the substrate and the positioning post 654 can be reduced, thereby reducing defects on the surface of the substrate.

如圖9A所示，4個定位構件650係以與鄰接之定位構件650的間隔概略均等之方式而配置。鄰接之定位構件650的間隔形成均等（以90°間隔配置4個定位構件650）時，在搬送基板W時（特別是在水平方向搬送時）具有抑制基板W從機械手600跳出的效果。本實施形態因為機械手本體620之形狀（機械手本體620在長度方向之尺寸上限）上的關係，雖然定位構件650並未完全均等配置，不過，由於係概略均等配置，因此，在搬送基板W時仍可抑制基板W從機械手600跳出。再者，基板W有可能搭載於以下敘述之定位構件650時，亦可防止搭載之部分從對象位置落下。此外，如圖9A所示，4個定位構件650係以連結各個定位部652之圓的直徑（基板定位徑WP）對基板W之直徑包含少許邊緣的方式而配置。此外，如圖9C所示，定位部652之下端642a形成在對應於落座區域SA之外緣的位置。連結定位構件650之圓的直徑，需要比連結引導構件640之基板承受面642的下端642a之圓的直徑大。此因有可能基板W搭載於定位構件650。此外，定位構件650需要位於比扣環312之內徑在內側。此因將基板W送交頂環31時，不致與隔膜接觸。As shown in FIG. 9A , the four positioning members 650 are arranged at approximately equal intervals from the adjacent positioning members 650 . When the adjacent positioning members 650 are evenly spaced (four positioning members 650 are arranged at intervals of 90°), there is an effect of preventing the substrate W from jumping out of the robot 600 when transferring the substrate W (especially when transferring in the horizontal direction). In this embodiment, because of the shape of the manipulator body 620 (the upper limit of the size of the manipulator body 620 in the length direction), although the positioning members 650 are not completely evenly arranged, they are roughly evenly arranged, so when transferring the substrate W It is still possible to suppress the substrate W from jumping out of the manipulator 600. Furthermore, when the substrate W may be mounted on the positioning member 650 described below, it is also possible to prevent the mounted part from falling from the target position. In addition, as shown in FIG. 9A , the four positioning members 650 are arranged such that the diameter of the circle connecting the respective positioning portions 652 (substrate positioning diameter WP) includes a little edge to the diameter of the substrate W. In addition, as shown in FIG. 9C , the lower end 642 a of the positioning portion 652 is formed at a position corresponding to the outer edge of the seating area SA. The diameter of the circle to which the positioning member 650 is connected needs to be larger than the diameter of the circle to which the lower end 642 a of the substrate receiving surface 642 of the guide member 640 is connected. This makes it possible for the substrate W to be mounted on the positioning member 650 . Additionally, the positioning member 650 needs to be located on the inside of the inner diameter of the retaining ring 312 . Therefore, when the substrate W is delivered to the top ring 31, it does not come into contact with the diaphragm.

採用本實施形態時，從頂環31接收基板W時可抑制基板W從機械手落下，且可將基板W定位於指定之落座區域SA。亦即，機械手600從頂環31接收基板W時，藉由對於吸附於頂環31之隔膜320的基板W之吸附面供給流體，可使基板W從隔膜320脫離。此時，雖然基板W在保持水平狀態下從隔膜320脫離時並無問題，不過藉由基板W僅一側從隔膜320脫離，而在基板W傾斜狀態下會下降到機械手600。此種情況下，採用本實施形態時，傾斜下降之基板W的一側雖下降到比落座區域SA之外緣在內側，不過由於落座構件630-1～630-5之槓桿構件634突出於落座區域SA，因此基板W之一側被其中一個槓桿構件634之落座部634-1a支撐。繼續，基板W之相反側下降，不過，由於一側比落座區域SA之外緣在內側被槓桿構件634支撐，因此基板W之相反側被形成於在相對位置的引導本體641之基板承受面642支撐。由於基板承受面642朝向落座區域SA而傾斜於下方，因此藉由基板W之相反側滑降基板承受面642，基板W落座於落座區域SA。此時，由於在落座區域SA周圍配置有具有與落座區域SA之外緣接觸的定位部652之複數個定位構件650，因此將基板W定位於落座區域SA。 ＜機械手支架＞ According to this embodiment, when receiving the substrate W from the top ring 31, the substrate W can be suppressed from falling from the robot, and the substrate W can be positioned in the designated seating area SA. That is, when the robot 600 receives the substrate W from the top ring 31 , the substrate W can be detached from the diaphragm 320 by supplying fluid to the adsorption surface of the substrate W of the diaphragm 320 adsorbed on the top ring 31 . At this time, although there is no problem when the substrate W is detached from the diaphragm 320 in a horizontal state, only one side of the substrate W is detached from the diaphragm 320 , and the substrate W falls to the robot arm 600 in an inclined state. In this case, when adopting this embodiment, although one side of the substrate W that is inclined to descend falls to the inner side than the outer edge of the seating area SA, the lever members 634 of the seating members 630-1 to 630-5 protrude beyond the seating area. In the area SA, one side of the substrate W is supported by the seating portion 634 - 1 a of one of the lever members 634 . Continuing, the opposite side of the substrate W descends, however, since one side is supported by the lever member 634 on the inner side than the outer edge of the seating area SA, the opposite side of the substrate W is formed on the substrate receiving surface 642 of the guide body 641 at the opposite position. support. Since the substrate receiving surface 642 is inclined downward toward the seating area SA, the substrate W is seated on the seating area SA by sliding down the substrate receiving surface 642 from the opposite side of the substrate W. At this time, since a plurality of positioning members 650 having positioning portions 652 contacting the outer edge of the seating area SA are arranged around the seating area SA, the substrate W is positioned in the seating area SA. ＜Robot support＞

其次，說明用於將機械手600安裝於支撐構件610之機構。圖10A係模式顯示機械手及機械手支架之構成的立體圖。圖10B係放大圖10A之機械手支架部分的立體圖。如圖10A及圖10B所示，第一線性傳輸機6具備用於將機械手600如圖4所示地安裝於支撐構件610之機械手支架660。機械手支架660係以支撐機械手本體620之下面620b的方式所構成之構件，且藉由螺栓662固定於機械手本體620。機械手支架660具有用於將機械手支架660固定於支撐構件610之螺栓孔660a、660b。藉由螺栓固定機械手支架660與支撐構件610，可將機械手600安裝於支撐構件610。Next, the mechanism for attaching the manipulator 600 to the supporting member 610 will be described. Fig. 10A is a perspective view schematically showing the composition of the manipulator and the manipulator support. Fig. 10B is an enlarged perspective view of the support part of the manipulator in Fig. 10A. As shown in FIGS. 10A and 10B , the first linear conveyor 6 includes a robot bracket 660 for mounting the robot 600 on the supporting member 610 as shown in FIG. 4 . The manipulator bracket 660 is a member configured to support the lower surface 620 b of the manipulator body 620 , and is fixed to the manipulator body 620 by bolts 662 . The manipulator bracket 660 has bolt holes 660 a , 660 b for fixing the manipulator bracket 660 to the support member 610 . By fixing the manipulator bracket 660 and the support member 610 with bolts, the manipulator 600 can be installed on the support member 610 .

另外，圖10之實施形態係顯示將機械手支架660直接安裝於支撐構件610之例，不過不限定於此。以下，說明其他實施形態之機械手支架。圖11A係模式顯示對支撐構件安裝機械手之立體圖。圖11B係模式顯示機械手支架之構成的立體圖。圖11C係模式顯示機械手支架之構成的側視圖及俯視圖。In addition, the embodiment shown in FIG. 10 shows an example in which the manipulator bracket 660 is directly mounted on the supporting member 610, but it is not limited thereto. Next, a robot holder of another embodiment will be described. Fig. 11A is a schematic perspective view showing a manipulator installed on a support member. Fig. 11B is a three-dimensional view schematically showing the composition of the manipulator support. Fig. 11C is a side view and a top view of the pattern showing the composition of the manipulator support.

如圖11A至圖11C所示，機械手支架670具備：安裝於機械手600之第一機械手支架672；及安裝於支撐構件610之第二機械手支架674。第一機械手支架672係以支撐機械手本體620之下面的方式所構成之板狀構件。第一機械手支架672具有用於藉由螺栓將第一機械手支架672固定於機械手本體620之螺栓孔672a。As shown in FIGS. 11A to 11C , the manipulator support 670 includes: a first manipulator support 672 installed on the manipulator 600 ; and a second manipulator support 674 installed on the supporting member 610 . The first manipulator support 672 is a plate-shaped member configured to support the lower surface of the manipulator body 620 . The first manipulator support 672 has a bolt hole 672 a for fixing the first manipulator support 672 to the manipulator body 620 by bolts.

第二機械手支架674備有：隔以間隔而配置之板狀的下部支架674-1及板狀之上部支架674-3；以及連接兩者之端部的連接構件674-2；且係概略如U字溝的形狀。在下部支架674-1與上部支架674-3之間形成***第一機械手支架672之連結區域674c。上部支架674-3具有用於藉由螺栓將第二機械手支架674固定於支撐構件610之螺栓孔674-3a、674-3b。The second manipulator support 674 is equipped with: a plate-shaped lower support 674-1 and a plate-shaped upper support 674-3 arranged at intervals; and a connecting member 674-2 connecting the ends of the two; and is schematically Such as the shape of a U-shaped ditch. Between the lower frame 674-1 and the upper frame 674-3, a connecting region 674c into which the first robot frame 672 is inserted is formed. The upper bracket 674-3 has bolt holes 674-3a, 674-3b for fixing the second manipulator bracket 674 to the supporting member 610 by bolts.

如圖11C所示，機械手本體620藉由螺栓662而固定於第一機械手支架672。此外，在第一機械手支架672中形成有用於藉由插銷675連結第一機械手支架672與第二機械手支架674之插銷孔672b。此外，在第一機械手支架672之底面672f形成朝向第二機械手支架674以前端變細之方式而傾斜的錐形面672c。此外，在第一機械手支架672之第二機械手支架674側的側面672g形成有俯視時係梯形形狀的缺口672d。缺口672d中，在梯形形狀之腳部分形成一對錐形面672e。另外，本實施形態俯視時係顯示形成有梯形形狀的缺口672d之例，不過缺口672d之形狀不拘。As shown in FIG. 11C , the manipulator body 620 is fixed to the first manipulator support 672 by bolts 662 . In addition, a pin hole 672b for connecting the first manipulator support 672 and the second manipulator support 674 via a pin 675 is formed in the first manipulator support 672 . In addition, a tapered surface 672c is formed on the bottom surface 672f of the first robot holder 672 so as to taper toward the second robot holder 674 . In addition, a notch 672d having a trapezoidal shape in plan view is formed on a side surface 672g of the first manipulator support 672 on the side of the second manipulator support 674 . In the notch 672d, a pair of tapered surfaces 672e are formed at the foot portion of the trapezoidal shape. In addition, the present embodiment shows an example in which the trapezoidal notch 672d is formed in plan view, but the shape of the notch 672d is not limited.

另外，在下部支架674-1中形成有用於藉由插銷675而連結第一機械手支架672與第二機械手支架674之插銷孔674-1b。此外，在連結區域674c形成有對應於錐形面672c而傾斜之錐形面674-1c。具體而言，在下部支架674-1之上面674-1a中形成有朝向連接構件674-2而傾斜於上方的錐形面674-1c。錐形面674-1c對應於錐形面672c而傾斜。In addition, a pin hole 674-1b for connecting the first manipulator bracket 672 and the second manipulator bracket 674 via a pin 675 is formed in the lower bracket 674-1. In addition, a tapered surface 674-1c inclined corresponding to the tapered surface 672c is formed in the connection region 674c. Specifically, a tapered surface 674-1c inclined upward toward the connection member 674-2 is formed on the upper surface 674-1a of the lower bracket 674-1. The tapered surface 674-1c is inclined corresponding to the tapered surface 672c.

此外，在連結區域674c形成有具有對應於缺口672d之梯形形狀的腳部分之一對錐形面672e而傾斜的錐形面674-2e之突部674-2d。具體而言，突部674-2d係從連接構件674-2突出於第一機械手支架672側而形成。突部674-2d係對應於缺口672d之形狀，且俯視時變成梯形形狀。突部674-2d中，在梯形形狀之腳部分形成一對錐形面674-2e。另外，本實施形態係顯示在第一機械手支架672中形成缺口672d，並在第二機械手支架674中形成突部674-2d之例，不過不限定於此。例如，亦可在第二機械手支架674中形成缺口，並在第一機械手支架672中形成對應於缺口之形狀的突部。In addition, a protrusion 674-2d having a tapered surface 674-2e inclined to the tapered surface 672e corresponding to one of the trapezoidal-shaped foot portions of the notch 672d is formed in the connecting region 674c. Specifically, the protrusion 674-2d is formed to protrude from the connection member 674-2 to the side of the first robot bracket 672. The protruding portion 674-2d is corresponding to the shape of the notch 672d, and becomes a trapezoidal shape when viewed from above. In the protrusion 674-2d, a pair of tapered surfaces 674-2e are formed at the foot portion of the trapezoidal shape. In addition, this embodiment shows an example in which the notch 672d is formed in the first manipulator frame 672 and the protrusion 674-2d is formed in the second manipulator frame 674, but it is not limited thereto. For example, a notch may also be formed in the second manipulator support 674 , and a protrusion corresponding to the shape of the notch may be formed in the first manipulator support 672 .

本實施形態之機械手支架670藉由將第一機械手支架672***連結區域674c，並藉由插銷675連結第一機械手支架672與第二機械手支架674，可將機械手600安裝於支撐構件610。The manipulator bracket 670 of this embodiment can install the manipulator 600 on the support by inserting the first manipulator bracket 672 into the connection area 674c, and connecting the first manipulator bracket 672 and the second manipulator bracket 674 through the pin 675. Component 610.

採用本實施形態之機械手支架670時，可在短時間將機械手600安裝在對支撐構件610正確的位置。亦即，由於機械手600之零件，特別是與基板接觸之落座構件630-1～630-5有磨損等之顧慮，因此應該定期更換。為了實施零件更換，而從支撐構件610拆卸機械手600，在零件更換後，再度產生安裝於支撐構件610的作業。此處，例如圖10所示，將機械手支架660直接安裝於支撐構件610時，機械手600之定位困難，精確進行安裝耗費時間，且作業效率差。When the manipulator bracket 670 of this embodiment is used, the manipulator 600 can be installed at the correct position with respect to the supporting member 610 in a short time. That is, the parts of the robot 600, especially the seating members 630-1 to 630-5 in contact with the substrate, may be worn and should be replaced periodically. In order to replace the parts, the manipulator 600 is detached from the supporting member 610, and after the parts are replaced, the work of attaching to the supporting member 610 occurs again. Here, for example, as shown in FIG. 10 , when the manipulator bracket 660 is directly installed on the support member 610 , it is difficult to position the manipulator 600 , and it takes time to install it accurately, and the working efficiency is poor.

相對而言，採用機械手支架670時，將第一機械手支架672***連結區域674c時，由於將錐形面672c引導至錐形面674-1c，且將一對錐形面672e引導至錐形面674-2e，因此可將第一機械手支架672輕易定位於連結區域674c內之正確位置。而後，由於將第一機械手支架672定位於正確的位置時，插銷孔672b與插銷孔674-1b的位置一致，因此，藉由***插銷675無須旋緊螺栓即可輕易連結第一機械手支架672與第二機械手支架674。另外，本實施形態係顯示將第一機械手支架672安裝於機械手600，並將第二機械手支架674安裝於支撐構件610之例，不過不限定於此。亦可將第一機械手支架672安裝於支撐構件610，並將第二機械手支架674安裝於機械手600。In contrast, when the manipulator holder 670 is used, when the first manipulator holder 672 is inserted into the connecting region 674c, since the tapered surface 672c is guided to the tapered surface 674-1c, and the pair of tapered surfaces 672e are guided to the tapered surface 674-1c. Shaped surface 674-2e, so the first manipulator support 672 can be easily positioned at the correct position in the connection area 674c. Then, when the first manipulator support 672 is positioned at the correct position, the position of the pin hole 672b is consistent with the position of the pin hole 674-1b, therefore, the first manipulator support can be easily connected by inserting the pin 675 without tightening the bolts. 672 and the second manipulator support 674. In addition, this embodiment shows an example in which the first manipulator bracket 672 is attached to the manipulator 600, and the second manipulator bracket 674 is attached to the supporting member 610, but it is not limited thereto. The first manipulator bracket 672 can also be installed on the support member 610 , and the second manipulator bracket 674 can be installed on the manipulator 600 .

以上，說明了一些本發明之實施形態，不過上述發明之實施形態係為了容易理解本發明者，而並非限定本發明者。本發明在不脫離其旨趣下可變更及改良，並且本發明中當然包含其等效物。此外，在可解決上述問題之至少一部分的範圍、或是可達到效果之至少一部分的範圍內，申請專利範圍及說明書中記載之各構成元件可任意組合或省略。Some embodiments of the present invention have been described above, but the above-mentioned embodiments of the invention are intended to facilitate the understanding of the present invention and do not limit the present invention. The present invention can be changed and improved without departing from the gist thereof, and of course equivalents thereof are included in the present invention. In addition, within the scope of solving at least part of the above-mentioned problems, or achieving at least part of the effects, the constituent elements described in the claims and the specification can be combined or omitted arbitrarily.

本申請案一個實施形態揭示一種機械手，係用於保持基板，且前述機械手包含：機械手本體；及複數個落座構件，其係安裝於前述機械手本體供基板落座；前述複數個落座構件分別具備：軸構件，其係被前述機械手本體支撐；及槓桿構件，其係被前述軸構件支撐，且包含：第一端部，其係具有基板落座之落座部；及第二端部，其係夾著前述軸構件而設於前述第一端部的相反側；前述複數個落座構件之至少一部分進一步具備：施力構件，其係用於將以前述第二端部向下方移動之方式使前述槓桿構件旋轉之力賦予前述槓桿構件；及落座檢測器，其係以檢測前述第二端部向上方移動之方式而構成。An embodiment of the present application discloses a manipulator, which is used to hold a substrate, and the manipulator includes: a manipulator body; and a plurality of seating members, which are installed on the manipulator body for the substrate to sit on; the aforementioned plurality of seat members Respectively equipped with: a shaft member, which is supported by the aforementioned manipulator body; and a lever member, which is supported by the aforementioned shaft member, and includes: a first end portion, which is a seat portion with a substrate seat; and a second end portion, It is provided on the opposite side of the first end portion with the shaft member interposed therebetween; at least a part of the plurality of seating members further includes: a force applying member for moving the second end portion downward. A force for rotating the lever member is given to the lever member; and a seating detector configured to detect the upward movement of the second end portion.

再者，本申請案之一個實施形態揭示一種機械手，其中在前述槓桿構件之前述第二端部設置磁鐵，前述落座檢測器包含磁性檢測器，其係檢測前述磁鐵向上方移動。Furthermore, one embodiment of the present application discloses a manipulator, wherein a magnet is provided at the second end of the lever member, and the seating detector includes a magnetic detector that detects the upward movement of the magnet.

再者，本申請案一個實施形態揭示一種機械手，其中前述落座檢測器包含光學式檢測器，其係具有投光零件與受光零件，前述槓桿構件在前述第二端部向上方移動時，以遮蔽前述投光零件與受光零件之間的方式被前述軸構件支撐。Furthermore, one embodiment of the present application discloses a manipulator, wherein the seat detector includes an optical detector, which has a light-emitting part and a light-receiving part, and when the aforementioned second end moves upward, the lever member moves upward with A means for shielding between the light projecting part and the light receiving part is supported by the shaft member.

再者，本申請案一個實施形態揭示一種機械手，其中在前述槓桿構件之前述第二端部設置第一電接點，前述落座檢測器包含電力式檢測器，其係具有當前述第二端部向上方移動時，與前述第一電接點接觸之第二電接點。Furthermore, one embodiment of the present application discloses a manipulator, wherein a first electrical contact is provided at the aforementioned second end of the aforementioned lever member, and the aforementioned seating detector includes an electric type detector, which has a function of when the aforementioned second end When the part moves upwards, the second electrical contact is in contact with the aforementioned first electrical contact.

再者，本申請案一個實施形態揭示一種機械手，其中前述複數個落座構件之至少一部分進一步包含外殼，其係以覆蓋前述槓桿構件之前述第二端部及前述落座檢測器的方式而構成。Furthermore, one embodiment of the present application discloses a robot arm, wherein at least a part of the plurality of seating members further includes a housing configured to cover the second end portion of the lever member and the seating detector.

再者，本申請案一個實施形態揭示一種機械手，其中前述複數個落座構件係以包圍基板落座之落座區域的方式彼此隔以指定間隔而安裝於前述機械手本體，前述槓桿構件係以前述第一端部突出於前述落座區域之方式被前述軸構件支撐。Furthermore, one embodiment of the present application discloses a manipulator, wherein the aforementioned plurality of seating members are installed on the aforementioned manipulator body at predetermined intervals in such a manner as to surround the seating area where the substrate is seated, and the aforementioned lever member is based on the aforementioned first One end protrudes from the seating area and is supported by the shaft member.

再者，本申請案一個實施形態揭示一種機械手，其中前述複數個落座構件分別具備：軸承，其係用於支撐前述軸構件之兩端部；及彈性構件，其係用於支撐前述軸承。Moreover, an embodiment of the present application discloses a robot arm, wherein the plurality of seating members respectively include: bearings for supporting both ends of the shaft member; and elastic members for supporting the bearings.

再者，本申請案一個實施形態揭示一種機械手，其中前述機械手進一步具備：複數個引導構件，其係以包圍基板落座之落座區域的方式彼此隔以指定間隔而安裝於前述機械手本體；及複數個定位構件，其係以包圍前述落座區域之方式彼此隔以指定間隔而安裝於前述機械手本體；前述複數個引導構件分別具有基板承受面，其係朝向前述落座區域而傾斜於下方，前述複數個定位構件分別具有定位部，其係與前述落座區域之外緣接觸。Furthermore, an embodiment of the present application discloses a manipulator, wherein the manipulator further includes: a plurality of guide members, which are installed on the manipulator body at predetermined intervals from each other in a manner surrounding the seating area where the substrate is seated; and a plurality of positioning members, which are installed on the aforementioned manipulator body at predetermined intervals to surround the aforementioned seating area; the aforementioned plurality of guiding members each have a substrate receiving surface, which is inclined downward toward the aforementioned seating area, The aforementioned plurality of positioning members each have a positioning portion, which is in contact with the outer edge of the aforementioned seating area.

再者，本申請案一個實施形態揭示一種機械手，其中前述複數個定位構件分別包含形成圓柱形狀之定位柱。Furthermore, an embodiment of the present application discloses a manipulator, wherein each of the plurality of positioning members includes a cylindrical positioning column.

再者，本申請案一個實施形態揭示一種機械手，其中進一步包含：支撐構件，其係用於支撐前述機械手；及機械手支架，其係用於將前述機械手安裝於前述支撐構件；前述機械手支架包含：第一機械手支架，其係安裝於前述機械手及前述支撐構件之其中一方；及第二機械手支架，其係安裝於前述機械手及前述支撐構件之其中另一方；在前述第一機械手支架之底面，形成有以朝向前述第二機械手支架其前端變細之方式而傾斜的錐形面，前述第二機械手支架具有***前述第一機械手支架之連結區域，在前述連結區域形成有對應於前述第一機械手支架之前述錐形面而傾斜的錐形面。Moreover, an embodiment of the present application discloses a manipulator, which further includes: a support member, which is used to support the aforementioned manipulator; and a manipulator bracket, which is used to install the aforementioned manipulator on the aforementioned support member; the aforementioned The manipulator support includes: the first manipulator support, which is installed on one of the aforementioned manipulator and the aforementioned support member; and the second manipulator support, which is installed on the other side of the aforementioned manipulator and the aforementioned support member; The bottom surface of the first manipulator support is formed with a tapered surface that is inclined toward the front end of the second manipulator support, and the second manipulator support has a connection area inserted into the first manipulator support, A tapered surface inclined correspondingly to the tapered surface of the first manipulator support is formed in the connecting region.

再者，本申請案一個實施形態揭示一種機械手，其中在前述第一機械手支架之前述第二機械手支架側的側面形成有缺口，在前述連結區域形成有突部，其係具有對應於形成於前述缺口之錐形面而傾斜的錐形面。Furthermore, one embodiment of the present application discloses a manipulator, wherein a notch is formed on the side of the first manipulator support on the side of the second manipulator support, and a protrusion is formed in the aforementioned connection area, which has a corresponding A tapered surface formed on the tapered surface of the aforementioned notch and inclined.

再者，本申請案一個實施形態揭示一種搬送裝置，係包含：上述任何一項之機械手；及驅動機構，其係用於使前述機械手移動。Furthermore, an embodiment of the present application discloses a conveying device, which includes: any one of the above-mentioned manipulators; and a driving mechanism, which is used to move the aforementioned manipulators.

再者，本申請案一個實施形態揭示一種基板處理裝置，係包含：研磨裝置，其係以研磨基板之方式而構成；清洗裝置，其係以清洗基板之方式而構成；及上述任何一項之搬送裝置，其係以搬送由前述研磨裝置或前述清洗裝置處理之基板的方式而構成。Moreover, one embodiment of the present application discloses a substrate processing device, which includes: a polishing device configured to grind a substrate; a cleaning device configured to clean a substrate; and any one of the above The transfer device is configured to transfer the substrate processed by the polishing device or the cleaning device.

本申請案一個實施形態揭示一種機械手，係用於保持基板，且前述機械手包含：機械手本體；及複數個落座構件，其係安裝於前述機械手本體供基板落座；前述複數個落座構件分別具備：軸構件，其係被前述機械手本體支撐；槓桿構件，其係被前述軸構件支撐，且包含：第一端部，其係具有基板落座之落座部；及第二端部，其係夾著前述軸構件而設於前述第一端部的相反側；軸承，其係用於支撐前述軸構件之兩端部；及彈性構件，其係用於支撐前述軸承。An embodiment of the present application discloses a manipulator, which is used to hold a substrate, and the manipulator includes: a manipulator body; and a plurality of seating members, which are installed on the manipulator body for the substrate to sit on; the aforementioned plurality of seat members Respectively equipped with: a shaft member, which is supported by the aforementioned manipulator body; a lever member, which is supported by the aforementioned shaft member, and includes: a first end portion, which is a seat portion with a substrate seat; and a second end portion, which The shaft member is provided on the opposite side of the first end, the bearing is used to support both ends of the shaft member, and the elastic member is used to support the bearing.

再者，本申請案一個實施形態揭示一種機械手，其中前述軸承包含一對軸承，其係用於分別支撐前述軸構件之兩端部，前述彈性構件包含一對彈性構件，其係用於分別支撐前述一對軸承。Furthermore, one embodiment of the present application discloses a manipulator, wherein the aforementioned bearings include a pair of bearings for respectively supporting the two ends of the aforementioned shaft member, and the aforementioned elastic member includes a pair of elastic members for respectively The aforementioned pair of bearings are supported.

再者，本申請案一個實施形態揭示一種機械手，其中前述軸承包含單一軸承，其係在前述軸構件之下方橫跨前述軸構件之兩端部而延伸，前述彈性構件包含單一彈性構件，其係支撐前述單一軸承之下面中央。Furthermore, an embodiment of the present application discloses a manipulator, wherein the aforementioned bearing includes a single bearing extending across the two ends of the aforementioned shaft member under the aforementioned shaft member, and the aforementioned elastic member includes a single elastic member whose It supports the lower center of the aforementioned single bearing.

再者，本申請案一個實施形態揭示一種機械手，其中前述複數個落座構件之至少一部分進一步具備：施力構件，其係用於將以前述第二端部向下方移動的方式而使前述槓桿構件旋轉之力賦予前述槓桿構件；及落座檢測器，其係以檢測前述第二端部向上方移動之方式而構成。Moreover, one embodiment of the present application discloses a manipulator, wherein at least a part of the aforementioned plurality of seating members further includes: a force applying member, which is used to move the aforementioned lever by moving the aforementioned second end portion downward. The force of member rotation is given to the aforementioned lever member; and the seating detector is configured to detect the upward movement of the aforementioned second end.

再者，本申請案一個實施形態揭示一種機械手，其中在前述槓桿構件之前述第二端部設置磁鐵，前述落座檢測器包含磁性檢測器，其係檢測前述磁鐵向上方移動。Moreover, one embodiment of the present application discloses a manipulator, wherein a magnet is provided at the second end of the lever member, and the seat detector includes a magnetic detector for detecting the upward movement of the magnet.

再者，本申請案一個實施形態揭示一種機械手，其中前述落座檢測器包含光學式檢測器，其係具有投光零件與受光零件，前述槓桿構件在前述第二端部向上方移動時，係以遮蔽前述投光零件與受光零件之間的方式而被前述軸構件支撐。Furthermore, an embodiment of the present application discloses a manipulator, wherein the seat detector includes an optical detector, which has a light-emitting part and a light-receiving part, and when the aforementioned lever member moves upward at the second end, it is It is supported by the shaft member so as to shield the space between the light projecting part and the light receiving part.

再者，本申請案一個實施形態揭示一種機械手，其中在前述槓桿構件之前述第二端部設置第一電接點，前述落座檢測器包含電力式檢測器，其係具有當前述第二端部向上方移動時與前述第一電接點接觸之第二電接點。Furthermore, one embodiment of the present application discloses a manipulator, wherein a first electrical contact is provided at the aforementioned second end of the aforementioned lever member, and the aforementioned seating detector includes an electric type detector, which has a function of when the aforementioned second end The second electrical contact that is in contact with the aforementioned first electrical contact when the part moves upwards.

再者，本申請案一個實施形態揭示一種機械手，其中前述複數個落座構件之至少一部分進一步包含外殼，其係以覆蓋前述槓桿構件之前述第二端部及前述落座檢測器的方式而構成。Furthermore, one embodiment of the present application discloses a robot arm, wherein at least a part of the plurality of seating members further includes a housing configured to cover the second end portion of the lever member and the seating detector.

再者，本申請案一個實施形態揭示一種機械手，其中前述複數個落座構件係以包圍基板落座之落座區域的方式彼此隔以指定間隔而安裝於前述機械手本體，前述槓桿構件係以前述第一端部突出於前述落座區域之方式而被前述軸構件支撐。Furthermore, one embodiment of the present application discloses a manipulator, wherein the aforementioned plurality of seating members are installed on the aforementioned manipulator body at predetermined intervals in such a manner as to surround the seating area where the substrate is seated, and the aforementioned lever member is based on the aforementioned first One end protrudes from the seating area and is supported by the shaft member.

再者，本申請案一個實施形態揭示一種機械手，其中前述機械手進一步具備：複數個引導構件，其係以包圍基板落座之落座區域的方式彼此隔以指定間隔而安裝於前述機械手本體；及複數個定位構件，其係以包圍前述落座區域之方式彼此隔以指定間隔而安裝於前述機械手本體；前述複數個引導構件分別具有基板承受面，其係朝向前述落座區域而傾斜於下方，前述複數個定位構件分別具有定位部，其係與前述落座區域之外緣接觸。Furthermore, an embodiment of the present application discloses a manipulator, wherein the manipulator further includes: a plurality of guide members, which are installed on the manipulator body at predetermined intervals from each other in a manner surrounding the seating area where the substrate is seated; and a plurality of positioning members, which are installed on the aforementioned manipulator body at predetermined intervals to surround the aforementioned seating area; the aforementioned plurality of guiding members each have a substrate receiving surface, which is inclined downward toward the aforementioned seating area, The aforementioned plurality of positioning members each have a positioning portion, which is in contact with the outer edge of the aforementioned seating area.

再者，本申請案一個實施形態揭示一種機械手，其中前述複數個定位構件分別包含形成圓柱形狀之定位柱。Furthermore, an embodiment of the present application discloses a manipulator, wherein each of the plurality of positioning members includes a cylindrical positioning column.

再者，本申請案一個實施形態揭示一種機械手，其中進一步包含：支撐構件，其係用於支撐前述機械手；及機械手支架，其係用於將前述機械手安裝於前述支撐構件；前述機械手支架包含：第一機械手支架，其係安裝於前述機械手及前述支撐構件之其中一方；及第二機械手支架，其係安裝於前述機械手及前述支撐構件之其中另一方；在前述第一機械手支架之底面，形成有以朝向前述第二機械手支架其前端變細之方式而傾斜的錐形面，前述第二機械手支架具有***前述第一機械手支架之連結區域，在前述連結區域形成有對應於前述第一機械手支架之前述錐形面而傾斜的錐形面。Moreover, an embodiment of the present application discloses a manipulator, which further includes: a support member, which is used to support the aforementioned manipulator; and a manipulator bracket, which is used to install the aforementioned manipulator on the aforementioned support member; the aforementioned The manipulator support includes: the first manipulator support, which is installed on one of the aforementioned manipulator and the aforementioned support member; and the second manipulator support, which is installed on the other side of the aforementioned manipulator and the aforementioned support member; The bottom surface of the first manipulator support is formed with a tapered surface that is inclined toward the front end of the second manipulator support, and the second manipulator support has a connection area inserted into the first manipulator support, A tapered surface inclined correspondingly to the tapered surface of the first manipulator support is formed in the connecting region.

再者，本申請案一個實施形態揭示一種機械手，其中在前述第一機械手支架之前述第二機械手支架側的側面形成有缺口，在前述連結區域形成有突部，其係具有對應於形成於前述缺口之錐形面而傾斜的錐形面。Furthermore, one embodiment of the present application discloses a manipulator, wherein a notch is formed on the side of the first manipulator support on the side of the second manipulator support, and a protrusion is formed in the aforementioned connection area, which has a corresponding A tapered surface formed on the tapered surface of the aforementioned notch and inclined.

再者，本申請案一個實施形態揭示一種搬送裝置，係包含：上述任何一項之機械手；及驅動機構，其係用於使前述機械手移動。Furthermore, an embodiment of the present application discloses a conveying device, which includes: any one of the above-mentioned manipulators; and a driving mechanism, which is used to move the aforementioned manipulators.

再者，本申請案一個實施形態揭示一種基板處理裝置，係包含：研磨裝置，其係以研磨基板之方式而構成；清洗裝置，其係以清洗基板之方式而構成；及上述任何一項之搬送裝置，其係以搬送由前述研磨裝置或前述清洗裝置處理之基板的方式而構成。Moreover, one embodiment of the present application discloses a substrate processing device, which includes: a polishing device configured to grind a substrate; a cleaning device configured to clean a substrate; and any one of the above The transfer device is configured to transfer the substrate processed by the polishing device or the cleaning device.

本申請案一個實施形態揭示一種機械手，係用於保持基板，且前述機械手具備：機械手本體；複數個落座構件，其係安裝於前述機械手本體供基板落座；複數個引導構件，其係以包圍基板落座之落座區域的方式彼此隔以指定間隔而安裝於前述機械手本體；及複數個定位構件，其係以包圍前述落座區域之方式彼此隔以指定間隔而安裝於前述機械手本體；前述複數個引導構件分別具有基板承受面，其係朝向前述落座區域而向下方傾斜，前述複數個定位構件分別具有定位部，其係接觸前述落座區域之外緣。An embodiment of the present application discloses a manipulator, which is used to hold a substrate, and the manipulator has: a manipulator body; a plurality of seating members, which are installed on the manipulator body for seating the substrate; a plurality of guiding members, which and a plurality of positioning members are installed on the aforementioned manipulator body at predetermined intervals from each other so as to surround the seating area where the substrate is seated; The aforementioned plurality of guiding members each have a substrate receiving surface, which is inclined downward toward the aforementioned seating area, and the aforementioned plurality of positioning members each have a positioning portion, which is in contact with the outer edge of the aforementioned seating area.

再者，本申請案一個實施形態揭示一種機械手，其中前述複數個定位構件分別包含形成圓柱形狀之定位柱。Furthermore, an embodiment of the present application discloses a manipulator, wherein each of the plurality of positioning members includes a cylindrical positioning column.

再者，本申請案一個實施形態揭示一種機械手，其中前述複數個落座構件分別具備：軸構件，其係被前述機械手本體支撐；及槓桿構件，其係被前述軸構件支撐，且包含：第一端部，其係具有基板落座之落座部；及第二端部，其係夾著前述軸構件而設於前述第一端部的相反側；前述複數個落座構件之至少一部分進一步具備：施力構件，其係用於將以前述第二端部向下方移動之方式使前述槓桿構件旋轉之力賦予前述槓桿構件；及落座檢測器，其係以檢測前述第二端部向上方移動之方式而構成。Furthermore, an embodiment of the present application discloses a manipulator, wherein the aforementioned plurality of seating members respectively include: a shaft member supported by the aforementioned manipulator body; and a lever member supported by the aforementioned shaft member, and includes: The first end portion has a seating portion on which the substrate is seated; and the second end portion is provided on the opposite side of the first end portion with the shaft member sandwiched; at least a part of the plurality of seating members further includes: a biasing member for imparting force to the lever member to rotate the lever member in such a manner that the second end portion moves downward; and a seating detector for detecting upward movement of the second end portion constituted in a manner.

再者，本申請案之一個實施形態揭示一種機械手，其中在前述槓桿構件之前述第二端部設置磁鐵，前述落座檢測器包含磁性檢測器，其係檢測前述磁鐵向上方移動。Furthermore, one embodiment of the present application discloses a manipulator, wherein a magnet is provided at the second end of the lever member, and the seating detector includes a magnetic detector that detects the upward movement of the magnet.

再者，本申請案一個實施形態揭示一種機械手，其中前述落座檢測器包含光學式檢測器，其係具有投光零件與受光零件，前述槓桿構件在前述第二端部向上方移動時，以遮蔽前述投光零件與受光零件之間的方式被前述軸構件支撐。Furthermore, one embodiment of the present application discloses a manipulator, wherein the seat detector includes an optical detector, which has a light-emitting part and a light-receiving part, and when the aforementioned second end moves upward, the lever member moves upward with A means for shielding between the light projecting part and the light receiving part is supported by the shaft member.

再者，本申請案一個實施形態揭示一種機械手，其中在前述槓桿構件之前述第二端部設置第一電接點，前述落座檢測器包含電力式檢測器，其係具有當前述第二端部向上方移動時，與前述第一電接點接觸之第二電接點。Furthermore, one embodiment of the present application discloses a manipulator, wherein a first electrical contact is provided at the aforementioned second end of the aforementioned lever member, and the aforementioned seating detector includes an electric type detector, which has a function of when the aforementioned second end When the part moves upwards, the second electrical contact is in contact with the aforementioned first electrical contact.

再者，本申請案一個實施形態揭示一種機械手，其中前述複數個落座構件之至少一部分進一步包含外殼，其係以覆蓋前述槓桿構件之前述第二端部及前述落座檢測器的方式而構成。Furthermore, one embodiment of the present application discloses a robot arm, wherein at least a part of the plurality of seating members further includes a housing configured to cover the second end portion of the lever member and the seating detector.

再者，本申請案一個實施形態揭示一種機械手，其中前述複數個落座構件係以包圍基板落座之落座區域的方式彼此隔以指定間隔而安裝於前述機械手本體，前述槓桿構件係以前述第一端部突出於前述落座區域之方式被前述軸構件支撐。Furthermore, one embodiment of the present application discloses a manipulator, wherein the aforementioned plurality of seating members are installed on the aforementioned manipulator body at predetermined intervals in such a manner as to surround the seating area where the substrate is seated, and the aforementioned lever member is based on the aforementioned first One end protrudes from the seating area and is supported by the shaft member.

再者，本申請案一個實施形態揭示一種機械手，其中前述複數個落座構件分別具備：軸承，其係用於支撐前述軸構件之兩端部；及彈性構件，其係用於支撐前述軸承。Moreover, an embodiment of the present application discloses a robot arm, wherein the plurality of seating members respectively include: bearings for supporting both ends of the shaft member; and elastic members for supporting the bearings.

再者，本申請案一個實施形態揭示一種機械手，其中進一步包含：支撐構件，其係用於支撐前述機械手；及機械手支架，其係用於將前述機械手安裝於前述支撐構件；前述機械手支架包含：第一機械手支架，其係安裝於前述機械手及前述支撐構件之其中一方；及第二機械手支架，其係安裝於前述機械手及前述支撐構件之其中另一方；在前述第一機械手支架之底面，形成有以朝向前述第二機械手支架其前端變細之方式而傾斜的錐形面，前述第二機械手支架具有***前述第一機械手支架之連結區域，在前述連結區域形成有對應於前述第一機械手支架之前述錐形面而傾斜的錐形面。Moreover, an embodiment of the present application discloses a manipulator, which further includes: a support member, which is used to support the aforementioned manipulator; and a manipulator bracket, which is used to install the aforementioned manipulator on the aforementioned support member; the aforementioned The manipulator support includes: the first manipulator support, which is installed on one of the aforementioned manipulator and the aforementioned support member; and the second manipulator support, which is installed on the other side of the aforementioned manipulator and the aforementioned support member; The bottom surface of the first manipulator support is formed with a tapered surface that is inclined toward the front end of the second manipulator support, and the second manipulator support has a connection area inserted into the first manipulator support, A tapered surface inclined correspondingly to the tapered surface of the first manipulator support is formed in the connecting region.

再者，本申請案一個實施形態揭示一種機械手，其中在前述第一機械手支架之前述第二機械手支架側的側面形成有缺口，在前述連結區域形成有突部，其係具有對應於形成於前述缺口之錐形面而傾斜的錐形面。Furthermore, one embodiment of the present application discloses a manipulator, wherein a notch is formed on the side of the first manipulator support on the side of the second manipulator support, and a protrusion is formed in the aforementioned connection area, which has a corresponding A tapered surface formed on the tapered surface of the aforementioned notch and inclined.

再者，本申請案一個實施形態揭示一種搬送裝置，係包含：上述任何一項之機械手；及驅動機構，其係用於使前述機械手移動。Furthermore, an embodiment of the present application discloses a conveying device, which includes: any one of the above-mentioned manipulators; and a driving mechanism, which is used to move the aforementioned manipulators.

再者，本申請案一個實施形態揭示一種基板處理裝置，係包含：研磨裝置，其係以研磨基板之方式而構成；清洗裝置，其係以清洗基板之方式而構成；及上述任何一項之搬送裝置，其係以搬送由前述研磨裝置或前述清洗裝置處理之基板的方式而構成。Moreover, one embodiment of the present application discloses a substrate processing device, which includes: a polishing device configured to grind a substrate; a cleaning device configured to clean a substrate; and any one of the above The transfer device is configured to transfer the substrate processed by the polishing device or the cleaning device.

1:外殼 1a,1b:分隔壁 2:裝載／卸載裝置 3:研磨裝置 3A～3D:第一～第四研磨裝置 4:清洗裝置 5:控制裝置 6:第一線性傳輸機（搬送裝置） 7:第二線性傳輸機（搬送裝置） 10:研磨墊 11:升降機 12:搖擺傳輸機 20:前裝載構件 21:行駛機構 22:搬送機器人 30A,30B,30C,30D:研磨台 31A,31B,31C,31D:頂環 32A,32B,32C,32D:研磨液供給噴嘴 33A,33B,33C,33D:修整器 34A,34B,34C,34D:霧化器 36:頂環軸桿 180:暫放台 190,300:滾筒清洗室 191:第一搬送室 192:筆形清洗室 193:第二搬送室 194:乾燥室 195:第三搬送室 201A:上側滾筒清洗模組 201B:下側滾筒清洗模組 202A:上側筆形清洗模組 202B:下側筆形清洗模組 203,204:暫放台 205A:上側乾燥模組 205B:下側乾燥模組 207A,207B:過濾風扇裝置 209:第一搬送裝置 210:第二搬送裝置 211,212,214:支撐軸 213:第三搬送裝置 300A:上側滾筒清洗模組 300B:下側滾筒清洗模組 312:扣環 600:機械手 600-1～600-4:第一～第四機械手 610:支撐構件 620:機械手本體 622:配線護蓋 630:落座構件 630-1～630-5:落座構件 631:基座 632:軸構件 633:軸承 634:槓桿構件 634-1:第一端部 634-1a:落座部 634-2:第二端部 634-2a:磁鐵 635:彈性構件 636:施力構件 638:落座檢測器 639:外殼 640:引導構件 641:引導本體 642:基板承受面 644:支撐構件 645:圓筒構件 646:彈性構件 650:定位構件 652:定位部 654:定位柱 660:機械手支架 660a,660b:螺栓孔 662:螺栓 670:機械手支架 672:第一機械手支架 672a:螺栓孔 672b:插銷孔 672c:錐形面 672d:缺口 672e:錐形面 672f:底面 672g:側面 674:第二機械手支架 674-1:下部支架 674-1a:上面 674-1b:插銷孔 674-1c:錐形面 674-2:連接構件 674-2d:突部 674-2e:錐形面 674-3:上部支架 674-3a,674-3b:螺栓孔 674c:連結區域 675:插銷 680A,680B,680C:升降驅動機構 682A,682B,682C:直線導軌 684A,684B,684C:水平驅動機構 686:滑輪 687:皮帶 688:伺服馬達 1000:CMP裝置 SA:落座區域 TP1～TP7:第一～第七搬送位置 W:基板 WP:基板定位徑 1: Shell 1a, 1b: partition wall 2: Loading/unloading device 3: Grinding device 3A～3D: the first to the fourth grinding device 4: Cleaning device 5: Control device 6: The first linear conveyor (conveying device) 7: The second linear conveyor (conveying device) 10: Grinding pad 11: Lift 12: Swing conveyor 20: Front loading components 21: Traveling mechanism 22: Transfer robot 30A, 30B, 30C, 30D: grinding table 31A, 31B, 31C, 31D: top ring 32A, 32B, 32C, 32D: Polishing liquid supply nozzle 33A, 33B, 33C, 33D: dressers 34A, 34B, 34C, 34D: Atomizer 36: top ring shaft 180: Temporary release station 190,300: drum cleaning room 191: The first transfer room 192: Pen-shaped cleaning room 193: The second transfer room 194: drying room 195: The third transfer room 201A: Upper drum cleaning module 201B: Lower drum cleaning module 202A: Pen-shaped cleaning module on the upper side 202B: Lower side pen-shaped cleaning module 203,204: Temporary release 205A: Upper drying module 205B: Lower side drying module 207A, 207B: filter fan unit 209: The first conveying device 210: Second conveying device 211, 212, 214: support shaft 213: The third conveying device 300A: Upper drum cleaning module 300B: Lower drum cleaning module 312: Buckle 600: manipulator 600-1～600-4: the first to the fourth manipulator 610: support member 620: Manipulator body 622: Wiring cover 630: seating member 630-1～630-5: Seating components 631: base 632: Shaft component 633: Bearing 634: lever member 634-1: first end 634-1a: Seat 634-2: second end 634-2a: Magnet 635: elastic member 636: Force member 638: Seat detector 639: shell 640: Guidance components 641: Guide ontology 642: substrate receiving surface 644: support member 645: Cylindrical member 646: elastic member 650: Positioning components 652: Positioning Department 654: positioning column 660: Manipulator bracket 660a, 660b: bolt holes 662: Bolt 670: Manipulator bracket 672: The first manipulator bracket 672a: Bolt holes 672b: pin hole 672c: Conical surface 672d: Gap 672e: Conical surface 672f: bottom surface 672g: side 674: The second manipulator support 674-1: Lower Bracket 674-1a: above 674-1b: pin hole 674-1c: Tapered face 674-2: Connecting members 674-2d: protrusion 674-2e: Tapered face 674-3: Upper Bracket 674-3a, 674-3b: Bolt holes 674c: Connecting Areas 675: pin 680A, 680B, 680C: lifting drive mechanism 682A, 682B, 682C: linear guide rail 684A, 684B, 684C: horizontal drive mechanism 686: pulley 687:belt 688:Servo motor 1000:CMP device SA: seating area TP1～TP7: 1st to 7th transport positions W: Substrate WP: Base plate positioning diameter

圖1係顯示作為本發明一種實施形態之基板處理裝置的一例之CMP裝置的整體構成俯視圖。 圖2係模式顯示研磨裝置之立體圖。 圖3係模式顯示清洗裝置之構成的俯視圖及側視圖。 圖4係模式顯示搬送裝置之第一線性傳輸機的立體圖。 圖5係模式顯示機械手之構成的立體圖。 圖6A係模式顯示第一落座構件之構成的立體圖。 圖6B係圖6A之B-B線的剖面圖。 圖6C係圖6A之C-C線的剖面圖。 圖7A係模式顯示第二落座構件之構成的立體圖。 圖7B係模式顯示從機械手向頂環送交基板之圖。 圖7C係圖6A中之C’-C’線的剖面圖。 圖8A係模式顯示機械手之構成的俯視圖。 圖8B係模式顯示引導構件之構成的立體圖。 圖8C係模式顯示引導構件之構成的剖面圖。 圖9A係模式顯示機械手之構成的俯視圖。 圖9B係模式顯示定位構件之構成的立體圖。 圖9C係模式顯示定位構件之構成的側視圖。 圖10A係模式顯示機械手及機械手支架之構成的立體圖。 圖10B係放大圖10A之機械手支架部分的立體圖。 圖11A係模式顯示對支撐構件安裝機械手之立體圖。 圖11B係模式顯示機械手支架之構成的立體圖。 圖11C係模式顯示機械手支架之構成的側視圖及俯視圖。 FIG. 1 is a plan view showing the overall configuration of a CMP apparatus as an example of a substrate processing apparatus according to an embodiment of the present invention. Fig. 2 is a schematic perspective view of the grinding device. Fig. 3 is a top view and a side view schematically showing the composition of the cleaning device. Fig. 4 is a schematic perspective view showing the first linear conveyor of the conveying device. Fig. 5 is a three-dimensional view schematically showing the composition of the manipulator. Fig. 6A is a perspective view schematically showing the composition of the first seating member. Fig. 6B is a cross-sectional view of line B-B in Fig. 6A. Fig. 6C is a cross-sectional view of line C-C in Fig. 6A. Fig. 7A is a perspective view schematically showing the composition of the second seating member. Fig. 7B is a schematic diagram showing substrate delivery from the robot to the top ring. Fig. 7C is a sectional view of line C'-C' in Fig. 6A. Fig. 8A is a top view schematically showing the composition of the manipulator. Fig. 8B is a perspective view schematically showing the composition of the guide member. Fig. 8C is a cross-sectional view schematically showing the structure of the guide member. Fig. 9A is a top view schematically showing the composition of the manipulator. Fig. 9B is a perspective view schematically showing the composition of the positioning member. Fig. 9C is a side view schematically showing the composition of the positioning member. Fig. 10A is a perspective view schematically showing the composition of the manipulator and the manipulator support. Fig. 10B is an enlarged perspective view of the support part of the manipulator in Fig. 10A. Fig. 11A is a schematic perspective view showing a manipulator installed on a support member. Fig. 11B is a three-dimensional view schematically showing the composition of the manipulator support. Fig. 11C is a side view and a top view of the pattern showing the composition of the manipulator support.

620:機械手本體 620: Manipulator body

630-1~630-5:落座構件 630-1~630-5: seating member

631:基座 631: base

632:軸構件 632: Shaft component

633:軸承 633: Bearing

634:槓桿構件 634: lever member

634-1:第一端部 634-1: first end

634-1a:落座部 634-1a: Seat

634-2:第二端部 634-2: second end

634-2a:磁鐵 634-2a: Magnet

636:施力構件 636: Force member

638:落座檢測器 638: Seat detector

639:外殼 639: shell

Claims (18)

一種機械手，係用於保持基板， 且前述機械手包含：機械手本體；及複數個落座構件，其係安裝於前述機械手本體供基板落座； 前述複數個落座構件分別具備：軸構件，其係被前述機械手本體支撐；及槓桿構件，其係被前述軸構件支撐，且包含：第一端部，其係具有基板落座之落座部；及第二端部，其係夾著前述軸構件而設於前述第一端部的相反側； 前述複數個落座構件之至少一部分進一步具備：施力構件，其係用於將以前述第二端部向下方移動之方式使前述槓桿構件旋轉之力賦予前述槓桿構件；及落座檢測器，其係以檢測前述第二端部向上方移動之方式而構成。 A manipulator for holding a substrate, And the aforementioned manipulator includes: the manipulator body; and a plurality of seating members, which are installed on the aforementioned manipulator body for the substrate to sit on; The aforesaid plurality of seating members respectively include: a shaft member supported by the aforementioned manipulator body; and a lever member supported by the aforementioned shaft member and including: a first end portion having a seating portion for seating the substrate; and a second end portion provided on the opposite side of the first end portion with the shaft member interposed therebetween; At least a part of the plurality of seating members further includes: an urging member for imparting force to the lever member to rotate the lever member in such a manner that the second end portion moves downward; and a seating detector for It is configured to detect the upward movement of the aforementioned second end portion. 如請求項1之機械手，其中在前述槓桿構件之前述第二端部設置磁鐵， 前述落座檢測器包含磁性檢測器，其係檢測前述磁鐵向上方移動。 The manipulator according to claim 1, wherein a magnet is provided at the aforementioned second end of the aforementioned lever member, The seat detector includes a magnetic detector that detects the upward movement of the magnet. 如請求項1之機械手，其中前述落座檢測器包含光學式檢測器，其係具有投光零件與受光零件， 前述槓桿構件在前述第二端部向上方移動時，以遮蔽前述投光零件與受光零件之間的方式被前述軸構件支撐。 The manipulator according to claim 1, wherein the seat detector includes an optical detector, which has a light-emitting part and a light-receiving part, The lever member is supported by the shaft member so as to shield a space between the light projecting part and the light receiving part when the second end part moves upward. 如請求項1之機械手，其中在前述槓桿構件之前述第二端部設置第一電接點， 前述落座檢測器包含電力式檢測器，其係具有當前述第二端部向上方移動時，與前述第一電接點接觸之第二電接點。 The manipulator according to claim 1, wherein a first electrical contact is provided at the aforementioned second end of the aforementioned lever member, The aforementioned seating detector includes an electric type detector, which has a second electrical contact that contacts the aforementioned first electrical contact when the aforementioned second end moves upward. 如請求項1之機械手，其中前述複數個落座構件之至少一部分進一步包含外殼，其係以覆蓋前述槓桿構件之前述第二端部及前述落座檢測器的方式而構成。The robot arm according to claim 1, wherein at least a part of the plurality of seating members further includes a casing, which is configured to cover the second end portion of the lever member and the seating detector. 如請求項1之機械手，其中前述複數個落座構件係以包圍基板落座之落座區域的方式彼此隔以指定間隔而安裝於前述機械手本體， 前述槓桿構件係以前述第一端部突出於前述落座區域之方式被前述軸構件支撐。 The manipulator according to claim 1, wherein the plurality of seating members are mounted on the manipulator body at predetermined intervals from each other in a manner surrounding the seating area where the substrate is seated, The aforementioned lever member is supported by the aforementioned shaft member in such a way that the aforementioned first end protrudes from the aforementioned seating area. 如請求項1之機械手，其中前述複數個落座構件分別具備：軸承，其係用於支撐前述軸構件之兩端部；及彈性構件，其係用於支撐前述軸承。The manipulator according to claim 1, wherein the plurality of seating members respectively include: bearings for supporting both ends of the shaft member; and elastic members for supporting the bearings. 如請求項1之機械手，其中前述機械手進一步具備：複數個引導構件，其係以包圍基板落座之落座區域的方式彼此隔以指定間隔而安裝於前述機械手本體；及複數個定位構件，其係以包圍前述落座區域之方式彼此隔以指定間隔而安裝於前述機械手本體； 前述複數個引導構件分別具有基板承受面，其係朝向前述落座區域而向下方傾斜， 前述複數個定位構件分別具有定位部，其係接觸前述落座區域之外緣。 The manipulator according to claim 1, wherein the manipulator further comprises: a plurality of guiding members, which are installed on the manipulator body at predetermined intervals from each other so as to surround a seating area where the substrate is seated; and a plurality of positioning members, They are installed on the aforementioned manipulator body at a specified distance from each other in a manner surrounding the aforementioned seating area; The plurality of guide members each have a substrate receiving surface that is inclined downward toward the seating area, The aforementioned plurality of positioning members each have a positioning portion, which is in contact with the outer edge of the aforementioned seating area. 如請求項8之機械手，其中前述複數個定位構件分別包含形成圓柱形狀之定位柱。The manipulator according to claim 8, wherein each of the plurality of positioning members includes a cylindrical positioning column. 如請求項1之機械手，其中進一步包含： 支撐構件，其係用於支撐前述機械手；及 機械手支架，其係用於將前述機械手安裝於前述支撐構件； 前述機械手支架包含：第一機械手支架，其係安裝於前述機械手及前述支撐構件之其中一方；及第二機械手支架，其係安裝於前述機械手及前述支撐構件之其中另一方； 在前述第一機械手支架之底面，形成有以朝向前述第二機械手支架其前端變細之方式而傾斜的錐形面， 前述第二機械手支架具有***前述第一機械手支架之連結區域，在前述連結區域形成有對應於前述第一機械手支架之前述錐形面而傾斜的錐形面。 Such as the manipulator of claim 1, which further includes: a support member for supporting the aforementioned manipulator; and a manipulator bracket, which is used to install the aforementioned manipulator on the aforementioned supporting member; The aforementioned manipulator support includes: a first manipulator support, which is installed on one of the aforementioned manipulator and the aforementioned support member; and a second manipulator support, which is installed on the other of the aforementioned manipulator and the aforementioned support member; On the bottom surface of the first manipulator support, there is formed a tapered surface inclined in such a way that it becomes thinner toward the front end of the second manipulator support, The second manipulator support has a connection area inserted into the first manipulator support, and a tapered surface corresponding to the tapered surface of the first manipulator support is formed in the connection area. 如請求項10之機械手，其中在前述第一機械手支架之前述第二機械手支架側的側面形成有缺口， 在前述連結區域形成有突部，其係具有對應於形成於前述缺口之錐形面而傾斜的錐形面。 The manipulator according to claim 10, wherein a notch is formed on the side of the second manipulator support side of the first manipulator support, A protruding portion is formed in the connecting region, which has a tapered surface inclined correspondingly to the tapered surface formed in the notch. 一種搬送裝置，係包含： 請求項1之機械手；及 驅動機構，其係用於使前述機械手移動。 A conveying device comprising: The manipulator of claim 1; and A drive mechanism is used to move the aforementioned manipulator. 一種基板處理裝置，係包含： 研磨裝置，其係以研磨基板之方式而構成； 清洗裝置，其係以清洗基板之方式而構成；及 請求項12之搬送裝置，其係以搬送由前述研磨裝置或前述清洗裝置處理之基板的方式而構成。 A substrate processing device, comprising: A grinding device configured to grind a substrate; A cleaning device configured to clean a substrate; and The transfer device according to claim 12 is configured to transfer the substrate processed by the aforementioned polishing device or the aforementioned cleaning device. 一種機械手，係用於保持基板， 且前述機械手包含：機械手本體；及複數個落座構件，其係安裝於前述機械手本體供基板落座； 前述複數個落座構件分別具備：軸構件，其係被前述機械手本體支撐；槓桿構件，其係被前述軸構件支撐，且包含：第一端部，其係具有基板落座之落座部；及第二端部，其係夾著前述軸構件而設於前述第一端部的相反側；軸承，其係用於支撐前述軸構件之兩端部；及彈性構件，其係用於支撐前述軸承。 A manipulator for holding a substrate, And the aforementioned manipulator includes: the manipulator body; and a plurality of seating members, which are installed on the aforementioned manipulator body for the substrate to sit on; The aforementioned plurality of seating members are respectively provided with: a shaft member supported by the aforementioned manipulator body; a lever member supported by the aforementioned shaft member and including: a first end portion having a seating portion for seating the substrate; and a second end portion. The two ends are provided on opposite sides of the first end to sandwich the shaft member; the bearing is used to support the two ends of the shaft member; and the elastic member is used to support the bearing. 如請求項14之機械手，其中前述軸承包含一對軸承，其係用於分別支撐前述軸構件之兩端部， 前述彈性構件包含一對彈性構件，其係用於分別支撐前述一對軸承。 As the manipulator of claim 14, wherein the aforementioned bearings include a pair of bearings, which are used to respectively support the two ends of the aforementioned shaft member, The aforementioned elastic member includes a pair of elastic members, which are used to respectively support the aforementioned pair of bearings. 如請求項14之機械手，其中前述軸承包含單一軸承，其係在前述軸構件之下方橫跨前述軸構件之兩端部而延伸， 前述彈性構件包含單一彈性構件，其係支撐前述單一軸承之下面中央。 As the manipulator of claim 14, wherein the aforementioned bearing comprises a single bearing extending across both ends of the aforementioned shaft member under the aforementioned shaft member, The aforementioned elastic member includes a single elastic member, which supports the lower center of the aforementioned single bearing. 一種機械手，係用於保持基板， 且前述機械手具備：機械手本體；複數個落座構件，其係安裝於前述機械手本體供基板落座；複數個引導構件，其係以包圍基板落座之落座區域的方式彼此隔以指定間隔而安裝於前述機械手本體；及複數個定位構件，其係以包圍前述落座區域之方式彼此隔以指定間隔而安裝於前述機械手本體； 前述複數個引導構件分別具有基板承受面，其係朝向前述落座區域而向下方傾斜， 前述複數個定位構件分別具有定位部，其係接觸前述落座區域之外緣。 A manipulator for holding a substrate, And the aforementioned manipulator has: a manipulator body; a plurality of seating members, which are installed on the aforementioned manipulator body for seating the substrate; and a plurality of guiding members, which are installed at specified intervals from each other in a manner surrounding the seating area where the substrate is seated. On the aforementioned manipulator body; and a plurality of positioning members, which are installed on the aforementioned manipulator body at specified intervals from each other in a manner surrounding the aforementioned seating area; The plurality of guide members each have a substrate receiving surface that is inclined downward toward the seating area, The aforementioned plurality of positioning members each have a positioning portion, which is in contact with the outer edge of the aforementioned seating area. 如請求項17之機械手，其中前述複數個定位構件分別包含形成圓柱形狀之定位柱。The manipulator according to claim 17, wherein each of the plurality of positioning members includes a cylindrical positioning column.
TW111132060A 2021-10-11 2022-08-25 Hand, transport device, and substrate processing apparatus TW202330214A (en)

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