TW202321318A - Photosensitive resin composition, photosensitive resin layer using the same, and color filter - Google Patents

Photosensitive resin composition, photosensitive resin layer using the same, and color filter Download PDF

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TW202321318A
TW202321318A TW111143691A TW111143691A TW202321318A TW 202321318 A TW202321318 A TW 202321318A TW 111143691 A TW111143691 A TW 111143691A TW 111143691 A TW111143691 A TW 111143691A TW 202321318 A TW202321318 A TW 202321318A
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photosensitive resin
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徐光源
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南韓商三星Ｓｄｉ股份有限公司
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images

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  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
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  • Structural Engineering (AREA)
  • Optics & Photonics (AREA)
  • Optical Filters (AREA)
  • Materials For Photolithography (AREA)

Abstract

Provided are a photosensitive resin composition, a photosensitive resin layer manufactured using the photosensitive resin composition, and a color filter including the same, the photosensitive resin composition including (A) a binder resin; (B) a photopolymerizable compound; (C) a photopolymerization initiator; (D) a colorant; and (E) a solvent, wherein the binder resin essentially includes specific structural units.

Description

感光性樹脂組成物、使用感光性樹脂組成物的感光性樹脂層以及彩色濾光器Photosensitive resin composition, photosensitive resin layer using photosensitive resin composition, and color filter

本申請主張2021年11月17日在韓國智慧財產權局申請的韓國專利申請案第10-2021-0158819號的優先權和權益，所述申請案的全部內容以引用的方式併入本文中。This application claims priority and benefit to Korean Patent Application No. 10-2021-0158819 filed with the Korean Intellectual Property Office on November 17, 2021, the entire contents of which are incorporated herein by reference.

本公開涉及一種感光性樹脂組成物、使用感光性樹脂組成物製造的感光性樹脂層以及彩色濾光器。The present disclosure relates to a photosensitive resin composition, a photosensitive resin layer manufactured using the photosensitive resin composition, and a color filter.

在許多類型的顯示器中，液晶顯示裝置的優勢在於亮度、薄度、低成本、低操作功耗以及對積體電路的改進粘附性，且已經更廣泛地用於膝上型電腦、監視器以及TV螢幕。液晶顯示裝置包含：下部襯底，在其上形成有黑色基質、彩色濾光器以及ITO圖元電極；和上部襯底，在其上形成有包含液晶層、薄膜電晶體以及電容器層的有源電路部分和ITO圖元電極。Among many types of displays, liquid crystal display devices have advantages in brightness, thinness, low cost, low operating power consumption, and improved adhesion to integrated circuits, and have been more widely used in laptops, monitors and TV screens. The liquid crystal display device includes: a lower substrate on which a black matrix, a color filter, and an ITO graphic element electrode are formed; and an upper substrate on which an active layer including a liquid crystal layer, a thin film transistor, and a capacitor layer is formed. Circuit part and ITO picture element electrode.

在圖元區中通過以預定次序依序堆疊多個彩色濾光器（一般來說，由三種原色形成，如紅色（R）、綠色（G）以及藍色（B）以形成各圖元來形成彩色濾光器，且在透明襯底上以預定圖案安置黑色基質層以在圖元之間形成邊界。作為一種形成彩色濾光器的方法的顏料分散法通過重複一系列工藝來提供彩色薄膜，如在包含黑色基質的透明襯底上應用包含著色劑的光可聚合組成物、使所形成圖案暴露於光、用溶劑去除未曝光部分以及使其熱固化。用於根據顏料分散法產生彩色濾光器的彩色感光性樹脂組成物通常包含堿溶性樹脂、光聚合單體、光聚合起始劑、環氧樹脂、溶劑、其它添加劑等。顏料分散法有效地應用於產生LCD，例如行動電話、膝上型電腦、監視器以及TV。In the primitive area, each primitive is formed by sequentially stacking a plurality of color filters (generally, formed of three primary colors such as red (R), green (G) and blue (B)) in a predetermined order. A color filter is formed, and a black matrix layer is arranged in a predetermined pattern on a transparent substrate to form a boundary between picture elements. The pigment dispersion method as a method of forming a color filter provides a color thin film by repeating a series of processes , such as applying a photopolymerizable composition containing a colorant on a transparent substrate containing a black matrix, exposing the formed pattern to light, removing the unexposed part with a solvent, and allowing it to be thermally cured. Used to produce color according to the pigment dispersion method The color photosensitive resin composition of an optical filter usually contains an alkali-soluble resin, a photopolymerizable monomer, a photopolymerization initiator, an epoxy resin, a solvent, other additives, etc. The pigment dispersion method is effectively applied to produce LCDs, such as mobile phones , laptop, monitor and TV.

近來，為克服由顏料的細微性所引起的亮度和對比度的限制，已對已其中不與顏料形成粒子的染料的混合感光性樹脂組成物進行研究。然而，混合感光性樹脂彩色濾光器組成物與顏料型組成物相比較具有高水分吸收率，且由此存在歸因於LCD製造過程中發生的液晶氣泡缺陷而導致的成品率劣化的問題。Recently, in order to overcome the limitations of brightness and contrast caused by the fineness of pigments, studies have been conducted on mixed photosensitive resin compositions in which dyes which do not form particles with pigments have been used. However, the mixed photosensitive resin color filter composition has a high moisture absorption rate compared with the pigment type composition, and thus has a problem of deterioration in yield due to liquid crystal bubble defects that occur during the LCD manufacturing process.

另一方面，為了降低彩色濾光器組成物的水分吸收率，通常已使用在曝光和烘焙過程中增加固化密度的方法。舉例來說，通過使用多官能單體或增加起始劑或熱硬化劑的含量而增加交聯密度的方法已用於製造彩色濾光器。然而，當前方法在顯著降低彩色濾光器組成物的水分吸收率發放那個面具有限制。On the other hand, in order to reduce the moisture absorption rate of the color filter composition, a method of increasing the curing density during exposure and baking has generally been used. For example, a method of increasing crosslink density by using a multifunctional monomer or increasing the content of an initiator or a thermosetting agent has been used to manufacture color filters. However, current methods have limitations in significantly reducing the moisture absorption rate emission of color filter compositions.

一個實施例提供具有低水分吸收率和極佳可加工性的感光性樹脂組成物。One embodiment provides a photosensitive resin composition having low moisture absorption rate and excellent processability.

另一實施例提供一種使用感光性樹脂組成物產生的感光性樹脂層。Another embodiment provides a photosensitive resin layer produced using a photosensitive resin composition.

另一實施例提供一種使用感光性樹脂層製造的彩色濾光器。Another embodiment provides a color filter manufactured using a photosensitive resin layer.

本發明的實施例提供一種感光性樹脂組成物，所述感光性樹脂組成物包含：（A）粘合劑樹脂；（B）光可聚合化合物；（C）光聚合起始劑；（D）著色劑；以及（E）溶劑，其中粘合劑樹脂包含從由化學式1表示的單體衍生的第一結構單元、從由化學式2表示的單體衍生的第二結構單元以及從由化學式3表示的單體衍生的第三結構單元：An embodiment of the present invention provides a photosensitive resin composition comprising: (A) binder resin; (B) photopolymerizable compound; (C) photopolymerization initiator; (D) a colorant; and (E) a solvent, wherein the binder resin comprises a first structural unit derived from a monomer represented by Chemical Formula 1, a second structural unit derived from a monomer represented by Chemical Formula 2, and a compound derived from a monomer represented by Chemical Formula 3 The third structural unit derived from the monomer:

[化學式1][chemical formula 1]

Figure 02_image001
Figure 02_image001

在化學式1中，R 1為C1到C10經取代或未經取代的烷基或C2到C10經取代或未經取代的烯基； In Chemical Formula 1, R is C1 to C10 substituted or unsubstituted alkyl or C2 to C10 substituted or unsubstituted alkenyl;

[化學式2][chemical formula 2]

Figure 02_image003
Figure 02_image003

在化學式2中，R 2為C1到C10經取代或未經取代的烷基或C2到C10經取代或未經取代的烯基；且R 3為C11到C20經取代或未經取代的烷基或C11到C20經取代或未經取代的烯基； In Chemical Formula 2, R is C1 to C10 substituted or unsubstituted alkyl or C2 to C10 substituted or unsubstituted alkenyl; and R is C11 to C20 substituted or unsubstituted alkyl or C11 to C20 substituted or unsubstituted alkenyl;

[化學式3][chemical formula 3]

Figure 02_image005
Figure 02_image005

在化學式3中，R 4為C1到C10經取代或未經取代的烷基或C2到C10經取代或未經取代的烯基；R 5為C1到C10烷基或C1到C10烯基；且R 5經1到3個氟取代。 In Chemical Formula 3, R is C1 to C10 substituted or unsubstituted alkyl or C2 to C10 substituted or unsubstituted alkenyl; R is C1 to C10 alkyl or C1 to C10 alkenyl; and R 5 is substituted with 1 to 3 fluorines.

R 1可為CH 2=CH-*或CH 2=C(CH 3)-*。 R 1 may be CH 2 =CH-* or CH 2 =C(CH 3 )-*.

在構成粘合劑樹脂的單體的總量中，可以10重量%到25重量%的量包含由化學式1表示的單體。The monomer represented by Chemical Formula 1 may be included in an amount of 10% by weight to 25% by weight in the total amount of monomers constituting the binder resin.

本文中R 2可為C2到C5經取代或未經取代的烯基；且R 3可為C11到C18經取代或未經取代的烷基。 Herein R2 can be C2 to C5 substituted or unsubstituted alkenyl; and R3 can be C11 to C18 substituted or unsubstituted alkyl.

在構成粘合劑樹脂的單體的總量中，可以10重量%到50重量%的量包含由化學式2表示的單體。The monomer represented by Chemical Formula 2 may be included in an amount of 10% by weight to 50% by weight in the total amount of monomers constituting the binder resin.

本文中，R 4可為C2到C5經取代或未經取代的烯基；且R 5可為C1到C5烷基；且R 5可經1到3個氟取代。 Herein, R 4 may be C2 to C5 substituted or unsubstituted alkenyl; and R 5 may be C1 to C5 alkyl; and R 5 may be substituted by 1 to 3 fluorines.

在構成粘合劑樹脂的單體的總量中，可以3重量%到40重量%的量包含由化學式3表示的單體。The monomer represented by Chemical Formula 3 may be included in an amount of 3% by weight to 40% by weight in the total amount of monomers constituting the binder resin.

粘合劑樹脂可還包含從由化學式4表示的單體衍生的第四結構單元、從由化學式5表示的單體衍生的第五結構單元或其組合：The binder resin may further include a fourth structural unit derived from a monomer represented by Chemical Formula 4, a fifth structural unit derived from a monomer represented by Chemical Formula 5, or a combination thereof:

[化學式4][chemical formula 4]

Figure 02_image007
Figure 02_image007

在化學式4中，R 6為氫或C1到C10烷基；且L為單鍵或C1到C10亞烷基； In Chemical Formula 4, R is hydrogen or C1 to C10 alkyl; and L is a single bond or C1 to C10 alkylene;

[化學式5][chemical formula 5]

Figure 02_image009
Figure 02_image009

在化學式5中，R 7為氫、C1到C10烷基或C6到C10芳基。 In Chemical Formula 5, R 7 is hydrogen, C1 to C10 alkyl or C6 to C10 aryl.

在構成粘合劑樹脂的單體的總量中，可以0.01重量%到40重量%的量包含第四結構單元，且可以0.01重量%到15重量%的量包含第五結構單元。In the total amount of monomers constituting the binder resin, the fourth structural unit may be included in an amount of 0.01% by weight to 40% by weight, and the fifth structural unit may be included in an amount of 0.01% by weight to 15% by weight.

粘合劑樹脂的重均分子量可為5000克/摩爾到30000克/摩爾。The weight average molecular weight of the binder resin may be 5000 g/mol to 30000 g/mol.

著色劑可包含酞菁類顏料、呫噸類染料或其組合。The colorant may include phthalocyanine-based pigments, xanthene-based dyes, or combinations thereof.

按感光性樹脂組成物的總固體含量計，感光性樹脂組成物可包含：1重量%到60重量%的（A）粘合劑樹脂；10重量%到50重量%的（B）著色劑；1重量%到60重量%的（C）光可聚合化合物；0.1重量%到15重量%的（D）光聚合起始劑；以及餘量的（E）溶劑。Based on the total solid content of the photosensitive resin composition, the photosensitive resin composition may include: 1% by weight to 60% by weight of (A) binder resin; 10% by weight to 50% by weight of (B) colorant; 1% by weight to 60% by weight of (C) a photopolymerizable compound; 0.1% by weight to 15% by weight of (D) a photopolymerization initiator; and the balance of (E) a solvent.

感光性樹脂組成物可還包含選自以下各者的至少一種添加劑：丙二酸；3-氨基-1,2-丙二醇；含有乙烯基或(甲基)丙烯醯氧基的偶聯劑；調平劑；氟類表面活性劑；以及自由基聚合起始劑。The photosensitive resin composition may further comprise at least one additive selected from the following: malonic acid; 3-amino-1,2-propanediol; a coupling agent containing vinyl or (meth)acryloxy; leveling agent; fluorosurfactant; and free radical polymerization initiator.

另一實施例提供一種使用感光性樹脂組成物製造的感光性樹脂層。Another embodiment provides a photosensitive resin layer manufactured using a photosensitive resin composition.

另一實施例提供一種包含感光性樹脂層的彩色濾光器。Another embodiment provides a color filter including a photosensitive resin layer.

另一實施例提供一種包含彩色濾光器的顯示裝置。Another embodiment provides a display device including a color filter.

本發明的其它實施例包含在以下詳細描述中。Other embodiments of the invention are included in the following detailed description.

與包含不同粘合劑樹脂的感光性樹脂組成物相比較，根據實施例的感光性樹脂組成物可歸因於基本上包含第一結構單元到第三結構單元的粘合劑樹脂而具有較低水分吸收率和極佳可加工性。Compared with photosensitive resin compositions including different binder resins, the photosensitive resin composition according to the embodiment may have a lower Moisture absorption and excellent processability.

下文中，詳細地描述本發明的實施例。然而，這些實施例是示例性的，本發明不限於此且本發明由權利要求的範圍定義。Hereinafter, embodiments of the present invention are described in detail. However, these embodiments are exemplary, the present invention is not limited thereto and the present invention is defined by the scope of the claims.

在本說明書中，當未以其它方式提供具體定義時，“經取代”是指化合物的至少一個氫經以下取代基置換：鹵素原子（F、Cl、Br或I）、羥基、C1到C20烷氧基、硝基、氰基、氨基、亞氨基、疊氮基、脒基、肼基、亞肼基、羰基、氨甲醯基、硫醇基、酯基、醚基、羧基或其鹽、磺酸基或其鹽、磷酸或其鹽、C1到C20烷基、C2到C20烯基、C2到C20炔基、C6到C30芳基、C3到C20環烷基、C3到C20環烯基、C3到C20環炔基、C2到C20雜環烷基、C2到C20雜環烯基、C2到C20雜環炔基或其組合。In this specification, when no specific definition is otherwise provided, "substituted" means that at least one hydrogen of the compound is replaced by the following substituents: halogen atom (F, Cl, Br or I), hydroxyl, C1 to C20 alkane Oxygen, nitro, cyano, amino, imino, azido, amidino, hydrazino, hydrazino, carbonyl, carbamoyl, thiol, ester, ether, carboxyl or their salts, Sulfonic acid or its salt, phosphoric acid or its salt, C1 to C20 alkyl, C2 to C20 alkenyl, C2 to C20 alkynyl, C6 to C30 aryl, C3 to C20 cycloalkyl, C3 to C20 cycloalkenyl, C3 to C20 cycloalkynyl, C2 to C20 heterocycloalkyl, C2 to C20 heterocycloalkenyl, C2 to C20 heterocycloalkynyl, or combinations thereof.

在本說明書中，當不另外提供特定定義時，“雜環烷基”、“雜環烯基”、“雜環炔基”以及“亞雜環烷基”是指包含N、O、S或P中的至少一個雜原子的環烷基、環烯基、環炔基以及亞環烷基環狀化合物。In this specification, when no specific definition is provided otherwise, "heterocycloalkyl", "heterocycloalkenyl", "heterocycloalkynyl" and "heterocycloalkylene" refer to Cycloalkyl, cycloalkenyl, cycloalkynyl and cycloalkylene cyclic compounds with at least one heteroatom in P.

在本說明書中，當不另外提供特定定義時，“(甲基)丙烯酸酯”是指“丙烯酸酯”和“甲基丙烯酸酯”。In this specification, "(meth)acrylate" means "acrylate" and "methacrylate" when no specific definition is otherwise provided.

在本說明書中，當不另外提供特定定義時，術語“組合”指混合或共聚。另外，“共聚”是指嵌段共聚到無規共聚，且“共聚物”是指嵌段共聚物到無規共聚物。In this specification, when a specific definition is not otherwise provided, the term "combination" means mixing or copolymerization. In addition, "copolymerization" means block copolymerization to random copolymerization, and "copolymer" means block copolymer to random copolymerization.

在本說明書的化學式中，當未另外提供特定定義時，當化學鍵在應給出的位置處未繪製時，氫鍵結在所述位置處。In the chemical formulas in this specification, when a chemical bond is not drawn at a position that should be given when a specific definition is not otherwise provided, the hydrogen bond is at the position.

另外，在本說明書中，當未另外提供特定定義時，“*”指示鍵聯相同或不同原子或化學式的點。In addition, in the present specification, when no specific definition is otherwise provided, "*" indicates a point of bonding the same or different atoms or chemical formulas.

實施例提供一種感光性樹脂組成物：包含（A）粘合劑樹脂；（B）光可聚合化合物；（C）光聚合起始劑；（D）著色劑；以及（E）溶劑，其中粘合劑樹脂包含從由化學式1表示的單體衍生的第一結構單元、從由化學式2表示的單體衍生的第二結構單元以及從由化學式3表示的單體衍生的第三結構單元：The embodiment provides a photosensitive resin composition: including (A) binder resin; (B) photopolymerizable compound; (C) photopolymerization initiator; (D) colorant; and (E) solvent, wherein The mixture resin comprises a first structural unit derived from a monomer represented by Chemical Formula 1, a second structural unit derived from a monomer represented by Chemical Formula 2, and a third structural unit derived from a monomer represented by Chemical Formula 3:

[化學式1][chemical formula 1]

Figure 02_image001
Figure 02_image001

在化學式1中，R 1為C1到C10經取代或未經取代的烷基或C2到C10經取代或未經取代的烯基； In Chemical Formula 1, R is C1 to C10 substituted or unsubstituted alkyl or C2 to C10 substituted or unsubstituted alkenyl;

[化學式2][chemical formula 2]

Figure 02_image003
Figure 02_image003

在化學式2中，R 2為C1到C10經取代或未經取代的烷基或C2到C10經取代或未經取代的烯基；且R 3為C11到C20經取代或未經取代的烷基或C11到C20經取代或未經取代的烯基；以及 In Chemical Formula 2, R is C1 to C10 substituted or unsubstituted alkyl or C2 to C10 substituted or unsubstituted alkenyl; and R is C11 to C20 substituted or unsubstituted alkyl or C11 to C20 substituted or unsubstituted alkenyl; and

[化學式3][chemical formula 3]

Figure 02_image013
Figure 02_image013

在化學式3中，R 4為C1到C10經取代或未經取代的烷基或C2到C10經取代或未經取代的烯基；R 5為C1到C10烷基或C1到C10烯基；且R 5經1到3個氟取代。 In Chemical Formula 3, R is C1 to C10 substituted or unsubstituted alkyl or C2 to C10 substituted or unsubstituted alkenyl; R is C1 to C10 alkyl or C1 to C10 alkenyl; and R 5 is substituted with 1 to 3 fluorines.

粘合劑樹脂可為丙烯醯類複合粘合劑樹脂，其中第一結構單元從具有酸值的單體（由化學式1表示的單體）衍生，第二結構單元從具有高分子量的(甲基)丙烯酸烷酯類單體（由化學式2表示的單體）衍生，且第三結構單元從具有極高疏水性的氟類單體（由化學式3表示的單體）衍生。The binder resin may be an acrylic composite binder resin in which the first structural unit is derived from a monomer having an acid value (monomer represented by Chemical Formula 1), and the second structural unit is derived from a high molecular weight (methyl ) alkyl acrylate monomer (monomer represented by Chemical Formula 2), and the third structural unit is derived from a fluorine-based monomer (monomer represented by Chemical Formula 3) having extremely high hydrophobicity.

具體來說，第二結構單元和第三結構單元分別歸因於較高碳數和高疏水性而降低感光性樹脂組成物的水分吸收率，且第一結構單元確保極佳顯影可加工性。Specifically, the second structural unit and the third structural unit reduce the moisture absorption rate of the photosensitive resin composition due to a higher carbon number and high hydrophobicity, respectively, and the first structural unit ensures excellent development processability.

因此，與包含不同粘合劑樹脂的感光性樹脂組成物相比較，根據實施例的感光性樹脂組成物歸因於基本上包含第一結構單元到第三結構單元的粘合劑樹脂而同時具有較低水分吸收率和極佳可加工性。Therefore, compared with photosensitive resin compositions including different binder resins, the photosensitive resin compositions according to the examples simultaneously have Low moisture absorption and excellent processability.

在下文中，詳細描述各組分。Hereinafter, each component is described in detail.

（A）粘合劑樹脂(A) Binder resin

如上文所提及，根據實施例的感光性樹脂組成物為丙烯醯類複合粘合劑樹脂，且包含基本上包含第一結構單元到第三結構單元的粘合劑樹脂。As mentioned above, the photosensitive resin composition according to the embodiment is an acrylic composite adhesive resin, and includes an adhesive resin substantially including the first to third structural units.

第一結構單元從與第二結構單元相比較具有較低分子量和酸值的單體衍生，且具有‘酸值’意指具有‘羧基’。The first structural unit is derived from a monomer having a lower molecular weight and acid value than the second structural unit, and having an 'acid value' means having a 'carboxyl group'.

具體來說，第一結構單元從含有羧基以及C1到C10經取代或未經取代的烷基或C2到C10經取代或未經取代的烯基的單體衍生。更具體來說，R 1可為C2到C5經取代或未經取代的烯基。舉例來說，R 1為CH 2=CH-*或CH 2=C(CH 3)-*，且由化學式1表示的單體可為丙烯酸酯或甲基丙烯酸脂。 Specifically, the first structural unit is derived from a monomer containing a carboxyl group and a C1 to C10 substituted or unsubstituted alkyl group or a C2 to C10 substituted or unsubstituted alkenyl group. More specifically, R 1 can be a C2 to C5 substituted or unsubstituted alkenyl. For example, R 1 is CH 2 =CH-* or CH 2 =C(CH 3 )-*, and the monomer represented by Chemical Formula 1 may be acrylate or methacrylate.

由化學式1表示的單體可具有5,000克/摩爾到30,000克/摩爾的重均分子量。另外，包含由化學式1表示的單體製備的粘合劑具有30毫克氫氧化鉀/克到220毫克氫氧化鉀/克的酸值，且可通過與堿顯影液反應而展現極佳顯影可加工性。The monomer represented by Chemical Formula 1 may have a weight average molecular weight of 5,000 g/mol to 30,000 g/mol. In addition, the binder prepared including the monomer represented by Chemical Formula 1 has an acid value of 30 mg potassium hydroxide/g to 220 mg potassium hydroxide/g, and exhibits excellent development processability by reacting with alkaline developer sex.

在構成粘合劑樹脂的單體的總量中，可以10重量%到25重量%的量包含由化學式1表示的單體。具體來說，在構成粘合劑樹脂的單體的總量中，由化學式1表示的單體可大於或等於10重量%、大於或等於11重量%或大於或等於12重量%以及小於或等於25重量%、小於或等於20重量%或小於或等於18重量%。當滿足此範圍時，感光性樹脂組成物可確保極佳可加工性。The monomer represented by Chemical Formula 1 may be included in an amount of 10% by weight to 25% by weight in the total amount of monomers constituting the binder resin. Specifically, in the total amount of monomers constituting the binder resin, the monomer represented by Chemical Formula 1 may be greater than or equal to 10% by weight, greater than or equal to 11% by weight, or greater than or equal to 12% by weight and less than or equal to 25% by weight, less than or equal to 20% by weight, or less than or equal to 18% by weight. When this range is satisfied, the photosensitive resin composition can ensure excellent processability.

第二結構單元從比第一結構單元具有更高分子量的酯類單體衍生。The second structural unit is derived from an ester monomer having a higher molecular weight than the first structural unit.

具體來說，第二結構單元從酯化化合物衍生：包含C1到C10經取代或未經取代的烷基或C2到C10經取代或未經取代的烯基的酸；以及包含C11到C20經取代或未經取代的烷基或C11到C20經取代或未經取代的烯基的醇。更具體來說，R 2為C2到C5經取代或未經取代的烯基；且R 3可為C11到C15經取代或未經取代的烷基。舉例來說，當R 2為CH 2=CH-*或CH 2=C(CH 3)-*，且R 3為C12未經取代烷基時，由化學式2表示的單體可為丙烯酸月桂酯或甲基丙烯酸月桂酯。 Specifically, the second structural unit is derived from an esterified compound: an acid comprising a C1 to C10 substituted or unsubstituted alkyl or a C2 to C10 substituted or unsubstituted alkenyl; and an acid comprising a C11 to C20 substituted Or unsubstituted alkyl or C11 to C20 substituted or unsubstituted alkenyl alcohol. More specifically, R 2 is C2 to C5 substituted or unsubstituted alkenyl; and R 3 may be C11 to C15 substituted or unsubstituted alkyl. For example, when R 2 is CH 2 =CH-* or CH 2 =C(CH 3 )-*, and R 3 is C12 unsubstituted alkyl, the monomer represented by Chemical Formula 2 may be lauryl acrylate or lauryl methacrylate.

由於由化學式2表示的單體具有120克/摩爾到400克/摩爾的分子量且具有疏水性，因此可降低粘合劑對水的親和力。因此，包含由化學式2表示的單體製備的粘合劑可允許感光性樹脂組成物具有較低水分吸收率。Since the monomer represented by Chemical Formula 2 has a molecular weight of 120 g/mol to 400 g/mol and has hydrophobicity, affinity of the binder to water may be reduced. Therefore, the binder prepared including the monomer represented by Chemical Formula 2 may allow the photosensitive resin composition to have a lower moisture absorption rate.

在構成粘合劑樹脂的單體的總量中，可以10重量%到50重量%的量包含由化學式2表示的單體。具體來說，在構成粘合劑樹脂的單體的總量中，可以大於或等於10重量%、大於或等於15重量%或大於或等於20重量%且小於或等於50重量%、小於或等於49重量%或小於或等於48重量%的量包含由化學式2表示的單體。當滿足此範圍時，感光性樹脂組成物可具有較低水分吸收率。The monomer represented by Chemical Formula 2 may be included in an amount of 10% by weight to 50% by weight in the total amount of monomers constituting the binder resin. Specifically, in the total amount of monomers constituting the binder resin, it may be greater than or equal to 10% by weight, greater than or equal to 15% by weight, or greater than or equal to 20% by weight and less than or equal to 50% by weight, less than or equal to The monomer represented by Chemical Formula 2 is included in an amount of 49% by weight or less than or equal to 48% by weight. When this range is satisfied, the photosensitive resin composition may have a lower moisture absorption rate.

第三結構單元從與第二結構單元相比較具有較低分子量和極高疏水性的氟類單體衍生。The third structural unit is derived from a fluorine-based monomer having a lower molecular weight and extremely high hydrophobicity than the second structural unit.

具體來說，第三結構單元從酯化化合物衍生：包含C1到C10經取代或未經取代的烷基或C2到C10經取代或未經取代的烯基的酸；以及經1到3個氟取代且包含C1到C10烷基或C1到C10烯基的醇。更具體來說，R 4可為C2到C5經取代或未經取代的烯基；且R 5可為C1到C5烷基；且R 5可經1到3個氟取代。舉例來說，當R 4為CH 2=CH-*或CH 2=C(CH 3)-*，且R 5為C2未經取代的烷基時，由化學式3表示的單體為三氟乙基丙烯酸酯或甲基丙烯酸三氟乙脂。 Specifically, the third structural unit is derived from an esterified compound: an acid comprising a C1 to C10 substituted or unsubstituted alkyl group or a C2 to C10 substituted or unsubstituted alkenyl group; and via 1 to 3 fluorine Alcohols that are substituted and contain C1 to C10 alkyl or C1 to C10 alkenyl groups. More specifically, R4 can be C2 to C5 substituted or unsubstituted alkenyl; and R5 can be C1 to C5 alkyl; and R5 can be substituted with 1 to 3 fluorines. For example, when R 4 is CH 2 =CH-* or CH 2 =C(CH 3 )-*, and R 5 is C2 unsubstituted alkyl, the monomer represented by Chemical Formula 3 is trifluoroethylene acrylate or trifluoroethyl methacrylate.

在構成粘合劑樹脂的單體的總量中，可以3重量%到40重量%的量包含由化學式3表示的單體。具體來說，在構成粘合劑樹脂的單體的總量中，可以大於或等於3重量%、大於或等於4重量%或大於或等於5重量%且小於或等於40重量%、小於或等於30重量%或小於或等於15重量%的量包含由化學式3表示的單體。當滿足此範圍時，感光性樹脂組成物可具有較低水分吸收率。The monomer represented by Chemical Formula 3 may be included in an amount of 3% by weight to 40% by weight in the total amount of monomers constituting the binder resin. Specifically, in the total amount of monomers constituting the binder resin, it may be greater than or equal to 3% by weight, greater than or equal to 4% by weight, or greater than or equal to 5% by weight and less than or equal to 40% by weight, less than or equal to The monomer represented by Chemical Formula 3 is included in an amount of 30% by weight or less than or equal to 15% by weight. When this range is satisfied, the photosensitive resin composition may have a lower moisture absorption rate.

同時，粘合劑樹脂可還包含從由化學式4表示的單體衍生的第四結構單元、從由化學式5表示的單體衍生的第五結構單元或其組合：Meanwhile, the binder resin may further include a fourth structural unit derived from a monomer represented by Chemical Formula 4, a fifth structural unit derived from a monomer represented by Chemical Formula 5, or a combination thereof:

[化學式4][chemical formula 4]

Figure 02_image015
Figure 02_image015

在化學式4中，R 6為氫或C1到C10烷基；且L為單鍵或C1到C10亞烷基。具體來說，R 6可為氫或甲基，且L可為單鍵。舉例來說，由化學式4表示的單體可為由化學式4-1表示的甲基丙烯酸三環癸酯（tricyclodecanyl methacrylate；TCDMA）。 In Chemical Formula 4, R 6 is hydrogen or C1 to C10 alkyl; and L is a single bond or C1 to C10 alkylene. Specifically, R6 can be hydrogen or methyl, and L can be a single bond. For example, the monomer represented by Chemical Formula 4 may be tricyclodecanyl methacrylate (TCDMA) represented by Chemical Formula 4-1.

[化學式4-1][chemical formula 4-1]

Figure 02_image017
Figure 02_image017

[化學式5][chemical formula 5]

Figure 02_image019
Figure 02_image019

在化學式5中，R 7為氫、C1到C10烷基或C6到C10芳基。舉例來說，當R 7為苯基時，由化學式5表示的單體可為由化學式5-1表示的苯基馬來醯亞胺。 In Chemical Formula 5, R 7 is hydrogen, C1 to C10 alkyl or C6 to C10 aryl. For example, when R 7 is phenyl, the monomer represented by Chemical Formula 5 may be phenylmaleimide represented by Chemical Formula 5-1.

[化學式5-1][chemical formula 5-1]

Figure 02_image021
Figure 02_image021

由化學式4表示的單體歸因於其環結構而具有增加緊密接觸力的效應，且由化學式5表示的單體歸因於其醯亞胺結構而具有增強耐熱性的效應。因此，還包含從由化學式4表示的單體衍生的第四結構單元、從由化學式5表示的單體衍生的第五結構單元或其組合的感光性樹脂組成物可展現極佳可加工性。The monomer represented by Chemical Formula 4 has an effect of increasing close contact force due to its ring structure, and the monomer represented by Chemical Formula 5 has an effect of enhancing heat resistance due to its imide structure. Therefore, the photosensitive resin composition further including the fourth structural unit derived from the monomer represented by Chemical Formula 4, the fifth structural unit derived from the monomer represented by Chemical Formula 5, or a combination thereof may exhibit excellent processability.

在構成粘合劑樹脂的單體的總量中，可以0.01重量%到40重量%的量包含第四結構單元，且可以0.01重量%到15重量%的量包含第五結構單元。具體來說，在構成粘合劑樹脂的單體的總量中，可以大於或等於0.01重量%、大於或等於1重量%或大於或等於3重量%且小於或等於40重量%、小於或等於30重量%或小於或等於15重量%的量包含由化學式4表示的單體。當滿足此範圍時，感光性樹脂組成物可具有較低水分吸收率。In the total amount of monomers constituting the binder resin, the fourth structural unit may be included in an amount of 0.01% by weight to 40% by weight, and the fifth structural unit may be included in an amount of 0.01% by weight to 15% by weight. Specifically, in the total amount of monomers constituting the binder resin, it may be greater than or equal to 0.01% by weight, greater than or equal to 1% by weight, or greater than or equal to 3% by weight and less than or equal to 40% by weight, less than or equal to The monomer represented by Chemical Formula 4 is included in an amount of 30% by weight or less than or equal to 15% by weight. When this range is satisfied, the photosensitive resin composition may have a lower moisture absorption rate.

粘合劑樹脂的重均分子量可為5000克/摩爾到30000克/摩爾。當粘合劑樹脂的重均分子量在上述範圍內時，感光性樹脂組成物具有極佳物理和化學性質，具有適當黏度，且在製造彩色濾光器時對襯底具有極佳緊密接觸性質。The weight average molecular weight of the binder resin may be 5000 g/mol to 30000 g/mol. When the weight-average molecular weight of the binder resin is within the above range, the photosensitive resin composition has excellent physical and chemical properties, has an appropriate viscosity, and has excellent close-contact properties to a substrate when manufacturing a color filter.

粘合劑樹脂可還包含丙烯醯類樹脂。The binder resin may further contain acrylic resin.

丙烯醯類樹脂可為第一乙烯不飽和單體和可與其共聚的第二乙烯不飽和單體的共聚物，且可為包含至少一個丙烯醯類重複單元的樹脂。The acrylic resin may be a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and may be a resin including at least one acrylic repeating unit.

第一乙烯不飽和單體為包含至少一個羧基的乙烯系不飽和單體。單體的實例包含丙烯酸、甲基丙烯酸、順丁烯二酸、衣康酸、反丁烯二酸或其組合。The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing at least one carboxyl group. Examples of monomers include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or combinations thereof.

按丙烯醯類粘合劑樹脂的總量計，可以5重量%到50重量%，例如10重量%到40重量%的量包含第一乙烯不飽和單體。The first ethylenically unsaturated monomer may be included in an amount of 5% by weight to 50% by weight, for example, 10% by weight to 40% by weight, based on the total amount of the acrylic binder resin.

第二乙烯不飽和單體可為芳香族乙烯基化合物，例如苯乙烯、α-甲基苯乙烯、乙烯基甲苯、乙烯基苯甲基甲醚等；不飽和羧酸酯化合物，例如(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸2-羥乙酯、(甲基)丙烯酸2-羥丁酯、(甲基)丙烯酸苯甲酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸苯酯等；不飽和羧酸氨基烷基酯化合物，例如(甲基)丙烯酸2-氨基乙酯、(甲基)丙烯酸2-二甲氨基乙酯等；羧酸乙烯酯化合物，例如乙酸乙烯酯、苯甲酸乙烯酯等；不飽和羧酸縮水甘油酯化合物，例如(甲基)丙烯酸縮水甘油酯等；乙烯基氰化合物，例如(甲基)丙烯腈等；不飽和醯胺化合物，例如(甲基)丙烯醯胺等；等等。這些可單獨使用或作為兩種或大於兩種的混合物使用。The second ethylenically unsaturated monomer can be an aromatic vinyl compound, such as styrene, α-methylstyrene, vinyl toluene, vinyl benzyl methyl ether, etc.; an unsaturated carboxylic acid ester compound, such as (methyl ) methyl acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxy butyl (meth) acrylate, benzyl (meth) acrylate ester, cyclohexyl (meth)acrylate, phenyl (meth)acrylate, etc.; unsaturated carboxylic acid aminoalkyl ester compounds, such as 2-aminoethyl (meth)acrylate, 2-dimethacrylate Methyl amino ethyl ester, etc.; vinyl carboxylic acid ester compounds, such as vinyl acetate, vinyl benzoate, etc.; glycidyl unsaturated carboxylic acid ester compounds, such as glycidyl (meth)acrylate, etc.; vinyl cyanide compounds, such as ( Meth)acrylonitrile and the like; unsaturated amide compounds such as (meth)acrylamide and the like; and the like. These may be used alone or as a mixture of two or more.

丙烯醯類樹脂的特定實例可為(甲基)丙烯酸/甲基丙烯酸苯甲酯共聚物、(甲基)丙烯酸/甲基丙烯酸苯甲酯/苯乙烯共聚物、(甲基)丙烯酸/甲基丙烯酸苯甲酯/甲基丙烯酸2-羥乙酯共聚物、(甲基)丙烯酸/甲基丙烯酸苯甲酯/苯乙烯/甲基丙烯酸2-羥乙酯共聚物等，但不限於此。這些可單獨使用或作為兩種或大於兩種的混合物使用。Specific examples of the acrylic resin may be (meth)acrylic acid/benzyl methacrylate copolymer, (meth)acrylic acid/benzyl methacrylate/styrene copolymer, (meth)acrylic acid/methacrylate Benzyl acrylate/2-hydroxyethyl methacrylate copolymer, (meth)acrylic acid/benzyl methacrylate/styrene/2-hydroxyethyl methacrylate copolymer, etc., but not limited thereto. These may be used alone or as a mixture of two or more.

粘合劑樹脂可還包含環氧類粘合劑樹脂。The binder resin may further include an epoxy-based binder resin.

粘合劑樹脂可通過進一步包含環氧類粘合劑樹脂來改進耐熱性。環氧類粘合劑樹脂可包含例如苯酚酚醛清漆環氧樹脂、四甲基聯苯環氧樹脂、雙酚A環氧樹脂、雙酚F環氧樹脂、脂環族環氧樹脂或其組合，但不限於此。Binder Resin Heat resistance may be improved by further including an epoxy-based binder resin. The epoxy-based adhesive resin may comprise, for example, phenol novolac epoxy resin, tetramethylbiphenyl epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, cycloaliphatic epoxy resin, or combinations thereof, But not limited to this.

此外，包含環氧類粘合劑樹脂的粘合劑樹脂確保如稍後將描述的例如顏料的著色劑的分散穩定性，且同時有助於在顯影過程期間形成具有所要解析度的圖元。Furthermore, the binder resin including the epoxy-based binder resin ensures dispersion stability of a colorant such as a pigment as will be described later, and at the same time contributes to the formation of a picture element with a desired resolution during a developing process.

按粘合劑樹脂的總量計，可以1重量%到10重量%，例如5重量%到10重量%的量包含環氧類粘合劑樹脂。當環氧類粘合劑樹脂包含在上述範圍中時，可大大地改進膜殘留率和耐化學性。The epoxy-based binder resin may be included in an amount of 1% by weight to 10% by weight, for example, 5% by weight to 10% by weight, based on the total amount of the binder resin. When the epoxy-based binder resin is included in the above range, the film residue rate and chemical resistance can be greatly improved.

環氧類粘合劑樹脂的環氧當量可為150克/當量到200克/當量。當具有上述範圍內的環氧當量的環氧類粘合劑樹脂包含在粘合劑樹脂中時，粘合劑可改進圖案的固化程度且促進形成圖案的結構中的著色劑的黏附力。The epoxy equivalent of the epoxy-based binder resin may be 150 g/equivalent to 200 g/equivalent. When the epoxy-based binder resin having an epoxy equivalent within the above range is included in the binder resin, the binder may improve the degree of curing of the pattern and promote the adhesion of the colorant in the pattern-forming structure.

粘合劑樹脂呈固體含量的形式，且可溶解於待稍後描述的溶劑中以構成感光性樹脂組成物。在這種情況下，按溶解在溶劑中的粘合劑樹脂溶液的總量計，呈固態的粘合劑樹脂可為約10重量%到50重量%，例如20重量%到40重量%。The binder resin is in the form of solid content, and can be dissolved in a solvent to be described later to constitute a photosensitive resin composition. In this case, the binder resin in a solid state may be about 10% by weight to 50% by weight, for example, 20% by weight to 40% by weight, based on the total amount of the binder resin solution dissolved in the solvent.

按感光性樹脂組成物的總固體含量計，可以1重量%到60重量%，例如3重量%到10重量%的量包含粘合劑樹脂。當粘合劑樹脂存在於上述範圍內時，改進顯影性和交聯以在彩色濾光器的製造期間提供極佳表面光滑度。The binder resin may be included in an amount of 1% to 60% by weight, for example, 3% to 10% by weight, based on the total solid content of the photosensitive resin composition. When the binder resin is present within the above range, developability and crosslinking are improved to provide excellent surface smoothness during manufacture of a color filter.

（B）光可聚合化合物(B) Photopolymerizable compound

光可聚合化合物可為包含至少一個乙烯不飽和雙鍵的(甲基)丙烯酸的單官能或多官能酯。The photopolymerizable compound may be a monofunctional or polyfunctional ester of (meth)acrylic acid containing at least one ethylenically unsaturated double bond.

歸因於乙烯不飽和雙鍵，光可聚合化合物可在圖案形成過程中的曝光期間引起足夠的聚合且形成具有極佳耐熱性、耐光性以及耐化學性的圖案。Due to the ethylenically unsaturated double bond, the photopolymerizable compound can cause sufficient polymerization during exposure during pattern formation and form a pattern having excellent heat resistance, light resistance, and chemical resistance.

光可聚合化合物的特定實例可為乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、雙酚A二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、季戊四醇六(甲基)丙烯酸酯、二季戊四醇二(甲基)丙烯酸酯、二季戊四醇三(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、雙酚A環氧基(甲基)丙烯酸酯、乙二醇單甲基醚(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、磷酸三(甲基)丙烯醯氧基乙酯、酚醛環氧(甲基)丙烯酸酯等。Specific examples of photopolymerizable compounds may be ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate Acrylates, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, bisphenol A di( Meth)acrylate, Pentaerythritol Di(meth)acrylate, Pentaerythritol Tri(meth)acrylate, Pentaerythritol Tetra(meth)acrylate, Pentaerythritol Hexa(meth)acrylate, Dipentaerythritol Di(meth)acrylate Dipentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, bisphenol A epoxy (meth)acrylate, ethylene glycol monomethacrylate Ether (meth)acrylate, trimethylolpropane tri(meth)acrylate, tri(meth)acryloxyethyl phosphate, novolac epoxy (meth)acrylate, etc.

光可聚合化合物的市售實例可如下。單官能(甲基)丙烯酸酯可包含Aronix M-101®、M-111®、M-114®（東亞合成化學工業株式會社（Toagosei Chemistry Industry Co., Ltd.））；KAYARAD TC-110S®、TC-120S®（日本化藥株式會社（Nippon Kayaku Co., Ltd.））；V-158®、V-2311®（大阪有機化學工業株式會社（Osaka Organic Chemical Ind., Ltd.））等。雙官能(甲基)丙烯酸酯的實例可包含Aronix M-210®、M-240®、M-6200®（東亞合成化學工業株式會社）；KAYARAD HDDA®、HX-220®、R-604®（日本化藥株式會社）；V-260®、V-312®、V-335 HP®（大阪有機化學工業株式會社）等。三官能(甲基)丙烯酸酯的實例可包含Aronix M-309®、M-400®、M-405®、M-450®、M-7100®、M-8030®、M-8060®（東亞合成化學工業株式會社）；KAYARAD TMPTA®、DPCA-20®、DPCA-30®、DPCA-60®、DPCA-120®（日本化藥株式會社）；V-295®、V-300®、V-360®、V-GPT®、V-3PA®、V-400®（大阪由岐化藥工業株式會社（Osaka Yuki Kayaku Kogyo Co. Ltd.）等。這些可單獨使用或作為兩種或大於兩種的混合物使用。Commercially available examples of the photopolymerizable compound may be as follows. Monofunctional (meth)acrylates may include Aronix M-101®, M-111®, M-114® (Toagosei Chemistry Industry Co., Ltd.); KAYARAD TC-110S®, TC-120S® (Nippon Kayaku Co., Ltd.); V-158®, V-2311® (Osaka Organic Chemical Ind., Ltd.), etc. Examples of difunctional (meth)acrylates may include Aronix M-210®, M-240®, M-6200® (Toagosei Chemical Industry Co., Ltd.); KAYARAD HDDA®, HX-220®, R-604® ( Nippon Kayaku Co., Ltd.); V-260®, V-312®, V-335 HP® (Osaka Organic Chemical Industry Co., Ltd.), etc. Examples of trifunctional (meth)acrylates may include Aronix M-309®, M-400®, M-405®, M-450®, M-7100®, M-8030®, M-8060® (Toya Synthetic Chemical Industry Co., Ltd.); KAYARAD TMPTA®, DPCA-20®, DPCA-30®, DPCA-60®, DPCA-120® (Nippon Kayaku Co., Ltd.); V-295®, V-300®, V-360 ®, V-GPT®, V-3PA®, V-400® (Osaka Yuki Kayaku Kogyo Co. Ltd.), etc. These can be used alone or as a mixture of two or more use.

光可聚合化合物可用酸酐處理以改進顯影性。The photopolymerizable compound may be treated with an anhydride to improve developability.

按感光性樹脂組成物的總量計，可以1重量%到60重量%，例如0.1重量%到5重量%的量包含光可聚合化合物。當包含所述範圍內的光可聚合化合物時，光可聚合化合物在圖案形成過程中的曝光期間充分固化且具有極佳可靠性，且可改進鹼性顯影液的顯影性。The photopolymerizable compound may be included in an amount of 1% to 60% by weight, for example, 0.1% to 5% by weight, based on the total amount of the photosensitive resin composition. When the photopolymerizable compound is contained within the range, the photopolymerizable compound is sufficiently cured and has excellent reliability during exposure during pattern formation, and developability of an alkaline developer may be improved.

（C）光聚合起始劑(C) Photopolymerization initiator

光聚合起始劑可為感光性樹脂組成物中通常使用的光聚合起始劑，例如苯乙酮類化合物、苯甲酮類化合物、噻噸酮類化合物、安息香類化合物、三嗪類化合物、肟類化合物或其組合。The photopolymerization initiator can be a photopolymerization initiator commonly used in photosensitive resin compositions, such as acetophenone compounds, benzophenone compounds, thioxanthone compounds, benzoin compounds, triazine compounds, Oxime compounds or combinations thereof.

苯乙酮類化合物的實例可為2,2'-二乙氧基苯乙酮、2,2'-二丁氧基苯乙酮、2-羥基-2-甲基苯丙酮、對叔丁基三氯苯乙酮、對叔丁基二氯苯乙酮、4-氯苯乙酮、2,2'-二氯-4-苯氧基苯乙酮、2-甲基-1-(4-(甲硫基)苯基)-2-嗎啉基丙-1-酮、2-苯甲基-2-二甲氨基-1-(4-嗎啉基苯基)-丁-1-酮等。Examples of acetophenones can be 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, p-tert-butyl Trichloroacetophenone, p-tert-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4- (Methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, etc. .

苯甲酮類化合物的實例可為苯甲酮、苯甲酸苯甲醯酯、苯甲醯基苯甲酸甲酯、4-苯基苯甲酮、羥基苯甲酮、丙烯酸化苯甲酮、4,4'-雙(二甲基氨基)苯甲酮、4,4'-雙(二乙基氨基)苯甲酮、4,4'-二甲氨基二苯甲酮、4,4'-二氯二苯甲酮、3,3'-二甲基-2-甲氧基二苯甲酮等。Examples of benzophenone compounds may be benzophenone, benzoyl benzoate, methyl benzoyl benzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4, 4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichloro Benzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.

噻噸酮類化合物的實例可為噻噸酮、2-甲基噻噸酮、異丙基噻噸酮、2,4-二乙基噻噸酮、2,4-二異丙基噻噸酮、2-氯噻噸酮等。Examples of thioxanthone compounds may be thioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone , 2-chlorothioxanthone, etc.

安息香類化合物的實例可為安息香、安息香甲醚、安息香***、安息香異丙醚、安息香異丁醚、苯甲基二甲基縮酮等。Examples of benzoin-based compounds may be benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, and the like.

三嗪類化合物的實例可為2,4,6-三氯-均三嗪、2-苯基4,6-雙(三氯甲基)-均三嗪、2-(3',4'-二甲氧基苯乙烯基)-4,6-雙(三氯甲基)-均三嗪、2-(4'-甲氧基萘基)-4,6-雙(三氯甲基)-均三嗪、2-(對甲氧苯基)-4,6-雙(三氯甲基)-均三嗪、2-(對甲苯基)-4,6-雙(三氯甲基)-均三嗪、2-聯苯基4,6-雙(三氯甲基)-均三嗪、雙(三氯甲基)-6-苯乙烯基-均三嗪、2-(萘酚-基)-4,6-雙(三氯甲基)-均三嗪、2-(4-甲氧基萘酚-基)-4,6-雙(三氯甲基)-均三嗪、2-4-雙(三氯甲基)-6-向日葵基-均三嗪、2-4-雙(三氯甲基)-6-(4-甲氧基苯乙烯基)-均三嗪等。Examples of triazine compounds can be 2,4,6-trichloro-s-triazine, 2-phenyl 4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'- Dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)- s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)- s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphthol-yl )-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphthol-yl)-4,6-bis(trichloromethyl)-s-triazine, 2- 4-bis(trichloromethyl)-6-helianthyl-s-triazine, 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine and the like.

肟類化合物的實例可為O-醯肟類化合物、2-(O-苯甲醯基肟)-1-[4-(苯硫基)苯基]-1,2-辛二酮、1-(O-乙醯肟)-1-[9-乙基-6-(2-甲基苯甲醯基)-9H-哢唑-3-基]乙酮、O-乙氧羰基-α-氧氨基-1-苯基丙-1-酮等。O-醯肟類化合物的特定實例可為1,2-辛二酮、2-二甲氨基-2-(4-甲基苯甲基)-1-(4-嗎啉-4-基-苯基)-丁-1-酮、1-(4-苯硫基苯基)-丁烷-1,2-二酮2-肟-O-苯甲酸酯、1-(4-苯硫基苯基)-辛烷-1,2-二酮2-肟-O-苯甲酸酯、1-(4-苯硫基苯基)-辛-1-酮肟-O-乙酸酯、1-(4-苯硫基苯基)-丁-1-酮肟-O-乙酸酯等。Examples of oxime compounds can be O-acyl oxime compounds, 2-(O-benzoyl oxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1- (O-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-oxazol-3-yl]ethanone, O-ethoxycarbonyl-α-oxygen Amino-1-phenylpropan-1-one, etc. Specific examples of O-acyl oximes may be 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-benzene base)-butan-1-one, 1-(4-phenylthiophenyl)-butane-1,2-dione 2-oxime-O-benzoate, 1-(4-phenylthiophenyl Base)-octane-1,2-dione 2-oxime-O-benzoate, 1-(4-phenylthiophenyl)-octane-1-one oxime-O-acetate, 1- (4-Phenylthiophenyl)-butan-1-one oxime-O-acetate, etc.

除所述化合物以外，光聚合起始劑可還包含哢唑類化合物、二酮類化合物、硼酸鋶類化合物、重氮類化合物、咪唑類化合物、聯咪唑類化合物、芴類化合物等。In addition to the above compounds, the photopolymerization initiator may further include oxazole-based compounds, diketone-based compounds, boronic acid-based compounds, diazo-based compounds, imidazole-based compounds, biimidazole-based compounds, fluorene-based compounds, and the like.

光聚合起始劑可與能夠通過吸收光引起化學反應且變得激發且接著轉移其能量的光敏劑一起使用。The photopolymerization initiator can be used together with a photosensitizer capable of causing a chemical reaction by absorbing light and becoming excited and then transferring its energy.

光敏劑的實例可為四乙二醇雙-3-巰基丙酸酯、季戊四醇四-3-巰基丙酸酯、二季戊四醇四-3-巰基丙酸酯等。Examples of the photosensitizer may be tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetra-3-mercaptopropionate, dipentaerythritol tetra-3-mercaptopropionate, and the like.

按感光性樹脂組成物的總固體含量計，可以0.1重量%到15重量%，例如0.1重量%到3重量%的量包含光聚合起始劑。當包含所述範圍內的光聚合起始劑時，歸因於在圖案形成過程中的曝光期間充分固化，可確保極佳可靠性，圖案可具有極佳解析度和緊密接觸性質以及極佳耐熱性、耐光性以及耐化學性，且歸因於非反應起始劑，可防止透射率劣化。The photopolymerization initiator may be included in an amount of 0.1 wt % to 15 wt %, for example, 0.1 wt % to 3 wt %, based on the total solid content of the photosensitive resin composition. When the photopolymerization initiator is contained within the range, excellent reliability can be ensured due to sufficient curing during exposure during pattern formation, and the pattern can have excellent resolution and close contact properties as well as excellent heat resistance properties, light resistance, and chemical resistance, and prevents deterioration of transmittance due to non-reactive initiators.

（D）著色劑(D) colorant

著色劑可包含酞菁類顏料、呫噸類染料或其組合。The colorant may include phthalocyanine-based pigments, xanthene-based dyes, or combinations thereof.

酞菁類顏料覆蓋淺藍色到綠色區，且稱為具有極佳彩色強度和化學穩定性的材料。酞菁類顏料為酞菁藍顏料，且可單獨使用或以兩種或大於兩種物質的組合方式使用具有相同色彩索引（color index；C.I.）數目（例如，C.I顏料藍15、15:1、15:2、15:3、15:4、15:6）的各顏料。Phthalocyanine pigments cover the light blue to green region, and are known as materials with excellent color strength and chemical stability. Phthalocyanine pigments are phthalocyanine blue pigments, and can be used alone or in combination of two or more substances having the same color index (color index; C.I.) number (for example, C.I Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, 15:6) of each pigment.

呫噸類染料為展現黃色到粉紅色、藍色以及亮色調的螢光的材料，且例如可使用由下述化學式表示的化合物。Xanthene-based dyes are materials that exhibit fluorescence of yellow to pink, blue, and bright hues, and for example, compounds represented by the following chemical formulas can be used.

Figure 02_image023
Figure 02_image023

當著色劑包含酞菁類顏料和呫噸類染料時，分散劑可一起使用以形成組成物。具體來說，可在表面上用分散劑預處理顏料或添加顏料以製備組成物。When the colorant includes a phthalocyanine-based pigment and a xanthene-based dye, a dispersant may be used together to form a composition. Specifically, the pigment may be pretreated with a dispersant or added to the surface to prepare a composition.

分散劑可為非離子分散劑、陰離子分散劑、陽離子分散劑等。分散劑的特定實例可為聚亞烷基二醇和其酯、聚氧化烯、多元醇酯環氧烷加成產物、醇環氧烷加成產物、磺酸酯、磺酸鹽、羧酸酯、羧酸鹽、烷基醯胺環氧烷加成產物、烷基胺等，且這些可單獨使用或作為兩種或大於兩種的混合物使用。The dispersant may be a nonionic dispersant, anionic dispersant, cationic dispersant, or the like. Specific examples of dispersants may be polyalkylene glycols and their esters, polyoxyalkylenes, polyol ester alkylene oxide addition products, alcohol alkylene oxide addition products, sulfonates, sulfonates, carboxylates, Carboxylate, alkylamide alkylene oxide addition product, alkylamine, etc., and these may be used alone or as a mixture of two or more.

分散劑的市售實例可包含BYK有限公司（BYK Co., Ltd）製造的DISPERBYK-101、DISPERBYK-130、DISPERBYK-140、DISPERBYK-160、DISPERBYK-161、DISPERBYK-162、DISPERBYK-163、DISPERBYK-164、DISPERBYK-165、DISPERBYK-166、DISPERBYK-170、DISPERBYK-171、DISPERBYK-182、DISPERBYK-2000、DISPERBYK-2001等；EFKA化學公司（EFKA Chemicals Co.）製造的EFKA-47、EFKA-47EA、EFKA-48、EFKA-49、EFKA-100、EFKA-400、EFKA-450等；澤內卡公司（Zeneka Co.）製造的Solsperse 5000、Solsperse 12000、Solsperse 13240、Solsperse 13940、Solsperse 17000、Solsperse 20000、Solsperse24000GR、Solsperse 27000、Solsperse 28000等；或味之素株式會社（Ajinomoto Inc）製造的PB711、PB821。Commercially available examples of the dispersant may include DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK- 164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, etc.; EFKA-47, EFKA-47EA, manufactured by EFKA Chemicals Co. EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, etc.; Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse 20000 manufactured by Zeneka Co. Solsperse24000GR, Solsperse 27000, Solsperse 28000, etc.; or PB711, PB821 manufactured by Ajinomoto Inc.

感光性樹脂組成物的總量計，可以0.1重量%到15重量%的量包含分散劑。當包含所述範圍內的分散劑時，歸因於在彩色濾光器的製造期間改進的分散性質，組成物具有極佳穩定性、顯影性以及可圖案性。The dispersant may be included in an amount of 0.1% by weight to 15% by weight based on the total amount of the photosensitive resin composition. When the dispersant is contained within the range, the composition has excellent stability, developability, and patternability due to improved dispersion properties during manufacture of the color filter.

顏料可使用水溶性無機鹽和潤濕劑預處理。當顏料經預處理時，顏料的平均粒徑可變得更精細。Pigments can be pretreated with water soluble inorganic salts and wetting agents. When the pigment is pretreated, the average particle size of the pigment can become finer.

可通過捏合顏料與水溶性無機鹽以及潤濕劑，且接著過濾且洗滌捏合的顏料來進行預處理。Pretreatment may be performed by kneading the pigment with a water-soluble inorganic salt and a wetting agent, and then filtering and washing the kneaded pigment.

捏合可在40℃到100℃的溫度下進行，且可通過在用水等洗去無機鹽之後過濾顏料來進行過濾和洗滌。The kneading may be performed at a temperature of 40°C to 100°C, and filtration and washing may be performed by filtering the pigment after washing away the inorganic salt with water or the like.

水溶性無機鹽的實例可為氯化鈉、氯化鉀等，但不限於此。潤濕劑可使顏料與水溶性無機鹽均勻混合且粉碎。潤濕劑的實例包含：亞烷基二醇單烷基醚，如乙二醇單***、丙二醇單甲醚、二甘醇單甲醚等；及醇，如乙醇、異丙醇、丁醇、己醇、環己醇、乙二醇、二乙二醇、聚乙二醇、丙三醇聚乙二醇等，且這些可單獨使用或作為兩種或大於兩種的混合物使用。Examples of water-soluble inorganic salts may be sodium chloride, potassium chloride, etc., but are not limited thereto. The wetting agent can uniformly mix and pulverize the pigment and the water-soluble inorganic salt. Examples of wetting agents include: alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, etc.; and alcohols such as ethanol, isopropanol, butanol, Hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, glycerol polyethylene glycol, etc., and these may be used alone or as a mixture of two or more.

捏合之後的顏料的平均粒徑範圍可以在5納米到200納米，例如5納米到150納米內。當顏料的平均粒徑在所述範圍內時，可改進顏料分散液的穩定性且圖元解析度可能不會劣化。The average particle size of the pigment after kneading may range from 5 nm to 200 nm, for example, from 5 nm to 150 nm. When the average particle diameter of the pigment is within the range, the stability of the pigment dispersion liquid may be improved and the picture element resolution may not be deteriorated.

用於形成顏料分散液的溶劑可為乙二醇乙酸酯、乙基溶纖劑、丙二醇甲醚乙酸酯、乳酸乙酯、聚乙二醇、環己酮、丙二醇甲醚等。The solvent used to form the pigment dispersion can be ethylene glycol acetate, ethyl cellosolve, propylene glycol methyl ether acetate, ethyl lactate, polyethylene glycol, cyclohexanone, propylene glycol methyl ether, and the like.

具體來說，顏料可以包含稍後將描述的分散劑和溶劑的顏料分散液形式使用，且所述顏料分散液可包含固體顏料、分散劑以及溶劑。按顏料分散液的總量計，可以5重量%到20重量%，例如8重量%到15重量%的量包含固體顏料。Specifically, the pigment may be used in the form of a pigment dispersion liquid containing a dispersant and a solvent which will be described later, and the pigment dispersion liquid may contain a solid pigment, a dispersant, and a solvent. The solid pigment may be contained in an amount of 5% to 20% by weight, for example, 8% to 15% by weight, based on the total amount of the pigment dispersion.

按感光性樹脂組成物的總量計，可以包含10重量%到50重量%，例如20重量%到50重量%的量的著色劑。當著色劑包含在所述範圍內時，改進染色效應和顯影性。Based on the total amount of the photosensitive resin composition, the colorant may be included in an amount of 10% to 50% by weight, for example, 20% to 50% by weight. When the colorant is contained within the range, dyeing effect and developability are improved.

（E）溶劑(E) Solvent

溶劑為與著色劑、粘合劑樹脂、光可聚合化合物以及光聚合起始劑具有相容性但不與其反應的材料。The solvent is a material that has compatibility with, but does not react with, the colorant, binder resin, photopolymerizable compound, and photopolymerization initiator.

溶劑的實例可包含：醇，例如甲醇、乙醇等；醚，例如二氯***、正丁醚、二異戊醚、甲基苯醚、四氫呋喃等；二醇醚，例如乙二醇單甲醚、乙二醇單***等；乙二醇乙酸***，例如甲基乙二醇乙酸***、乙基乙二醇乙酸***、二乙基乙二醇乙酸***等；卡必醇，例如甲基乙基卡必醇、二乙基卡必醇、二乙二醇單甲醚、二乙二醇單***、二乙二醇二甲醚、二乙二醇甲基乙基醚、二乙二醇二***等；丙二醇烷基醚乙酸酯，例如丙二醇甲醚乙酸酯、丙二醇丙醚乙酸酯等；芳香烴，例如甲苯、二甲苯等；酮，例如甲基乙基酮、環己酮、4-羥基-4-甲基-2-戊酮、甲基正丙酮、甲基正丁酮、甲基正戊酮、2-庚酮等；飽和脂族單羧烷基酯，例如乙酸乙酯、乙酸正丁酯、乙酸異丁酯、等；乳酸酯，例如乳酸甲酯、乳酸乙酯等；氧基乙酸烷基酯，例如氧基乙酸甲酯、氧基乙酸乙酯、氧乙酸丁酯等；烷氧基乙酸烷基酯，例如甲氧基乙酸甲酯、甲氧基乙酸乙酯、甲氧基乙酸丁酯、乙氧基乙酸甲酯、乙氧基乙酸乙酯等；3-氧基丙酸烷基酯，例如3-氧基丙酸甲酯、3-氧基丙酸乙酯等；3-烷氧基丙酸烷基酯，例如3-甲氧基丙酸甲酯、3-甲氧基丙酸乙酯、3-乙氧基丙酸乙酯、3-乙氧基丙酸甲酯等；2-氧基丙酸烷基酯，例如2-氧基丙酸甲酯、2-氧基丙酸乙酯、2-氧基丙酸丙酯等；2-烷氧基丙酸烷基酯，例如2-甲氧基丙酸甲酯、2-甲氧基丙酸乙酯、2-乙氧基丙酸乙酯、2-乙氧基丙酸甲酯等；2-氧基-2-甲基丙酸酯，如2-氧基-2-甲基丙酸甲酯、2-氧基-2-甲基丙酸乙酯等；2-烷氧基-2-甲基烷基丙酸酯的單氧基單羧酸烷基酯，例如2-甲氧基-2-甲基丙酸甲酯、2-乙氧基-2-甲基丙酸乙酯等；酯，例如2-羥基丙酸乙酯、2-羥基-2-甲基丙酸乙酯、羥基乙酸乙酯、2-羥基-3-甲基丁酸甲酯等；酮酸酯，例如丙酮酸乙酯等。另外，也可使用高沸點溶劑，例如N-甲基甲醯胺、N,N-二甲基甲醯胺、N-甲基甲醯苯胺、N-甲基乙醯胺、N,N-二甲基乙醯胺、N-甲基吡咯烷酮、二甲亞碸、苯甲基***、二己醚、乙醯丙酮、異佛爾酮、己酸、辛酸、1-辛醇、1-壬醇、苯甲醇、乙酸苯甲酯、苯甲酸乙酯、草酸二乙酯、馬來酸二乙酯、γ-丁內酯、碳酸乙二酯、碳酸丙二酯、苯基乙二醇乙酸***等。Examples of the solvent may include: alcohols such as methanol, ethanol, etc.; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether, tetrahydrofuran, etc.; glycol ethers such as ethylene glycol monomethyl ether, Ethylene glycol monoethyl ether, etc.; ethyl glycol acetate, such as methyl glycol acetate, ethyl glycol acetate, diethyl glycol acetate, etc.; carbitol, such as methyl ethyl carbitol Must alcohol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, etc. ; Propylene glycol alkyl ether acetate, such as propylene glycol methyl ether acetate, propylene glycol propyl ether acetate, etc.; Aromatic hydrocarbons, such as toluene, xylene, etc.; Ketones, such as methyl ethyl ketone, cyclohexanone, 4- Hydroxy-4-methyl-2-pentanone, methyl n-acetone, methyl n-butanone, methyl n-pentanone, 2-heptanone, etc.; saturated aliphatic monocarboxyalkyl esters, such as ethyl acetate, acetic acid N-butyl ester, isobutyl acetate, etc.; Lactate esters, such as methyl lactate, ethyl lactate, etc.; Alkyl oxyacetate, such as methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, etc. ;Alkyl alkoxyacetate, such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, etc.; 3-oxyl Alkyl propionate, such as methyl 3-oxypropionate, ethyl 3-oxypropionate, etc.; alkyl 3-alkoxypropionate, such as methyl 3-methoxypropionate, 3- Ethyl methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, etc.; alkyl 2-oxypropionate, such as methyl 2-oxypropionate, 2 -Ethyl oxypropionate, propyl 2-oxypropionate, etc.; alkyl 2-alkoxypropionate, such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, Ethyl 2-ethoxypropionate, methyl 2-ethoxypropionate, etc.; 2-oxy-2-methylpropionate, such as methyl 2-oxy-2-methylpropionate, 2 - ethyl oxy-2-methylpropionate, etc.; alkyl monooxymonocarboxylates of 2-alkoxy-2-methylalkylpropionates, such as 2-methoxy-2-methoxy Methyl propionate, ethyl 2-ethoxy-2-methylpropionate, etc.; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyacetate , 2-hydroxy-3-methyl butyrate, etc.; keto esters, such as ethyl pyruvate, etc. In addition, high-boiling solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformaniline, N-methylacetamide, N,N-di Methylacetamide, N-Methylpyrrolidone, Dimethylsulfoxide, Benzyl Ether, Dihexyl Ether, Acetyl Acetone, Isophorone, Caproic Acid, Caprylic Acid, 1-Octanol, 1-Nonanol, Benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, gamma-butyrolactone, ethylene carbonate, propylene carbonate, phenylglycol ethyl acetate, etc.

考慮到混溶性和反應性，可理想地使用酮，例如環己酮等；二醇醚，例如乙二醇單***等；乙二醇烷基醚乙酸酯，例如乙基乙二醇乙酸***等；酯，例如2-羥基丙酸乙酯等；卡必醇，例如二乙二醇單甲醚等；丙二醇烷基醚乙酸酯，例如丙二醇甲醚乙酸酯、丙二醇丙醚乙酸酯等。In consideration of miscibility and reactivity, ketones such as cyclohexanone, etc.; glycol ethers, such as ethylene glycol monoethyl ether, etc.; glycol alkyl ether acetates, such as ethyl glycol ethyl acetate are ideally used etc.; esters, such as 2-hydroxyethyl propionate, etc.; carbitol, such as diethylene glycol monomethyl ether, etc.; propylene glycol alkyl ether acetates, such as propylene glycol methyl ether acetate, propylene glycol propyl ether acetate wait.

按感光性樹脂組成物的總量計，可以餘量，例如30重量%到70重量%，例如35重量%到65重量%包含溶劑。當溶劑包含在上述範圍內時，改進感光性樹脂組成物的塗布性質且可獲得具有極佳平坦度的塗層膜。Based on the total amount of the photosensitive resin composition, the solvent may be contained in a balance, for example, 30% to 70% by weight, such as 35% to 65% by weight. When the solvent is contained within the above range, coating properties of the photosensitive resin composition are improved and a coating film having excellent flatness can be obtained.

（F）其它添加劑(F) Other additives

感光性樹脂組成物可還包含選自以下的至少一種添加劑：丙二酸；3-氨基-1；2-丙二醇；包含乙烯基或(甲基)丙烯醯氧基的偶聯劑；調平劑；表面活性劑；以及自由基聚合起始劑，以便防止在塗布期間的污漬或光點，以調整調平或防止歸因於不顯影而導致的圖案殘留。The photosensitive resin composition may further comprise at least one additive selected from the following: malonic acid; 3-amino-1; 2-propanediol; a coupling agent containing vinyl or (meth)acryloxy; a leveling agent ; a surfactant; and a radical polymerization initiator in order to prevent stains or spots during coating, to adjust leveling or to prevent pattern residue due to non-development.

可取決於所要性質控制添加劑。Additives can be controlled depending on the desired properties.

偶聯劑可為矽烷類偶聯劑，且矽烷類偶聯劑的實例可包含三甲氧基矽烷基苯甲酸、γ-甲基丙烯基丙氧基三甲氧基矽烷、乙烯基三乙醯氧基矽烷、乙烯基三甲氧基矽烷、γ-異氰酸酯丙基三乙氧基矽烷、γ-縮水甘油氧基丙基三甲氧基矽烷、β-環氧環己基乙基三甲氧基矽烷等。這些可單獨使用或以兩種或大於兩種的混合物的形式使用。The coupling agent may be a silane-based coupling agent, and examples of the silane-based coupling agent may include trimethoxysilylbenzoic acid, γ-methacrylpropoxytrimethoxysilane, vinyltriacetyloxy Silane, vinyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, β-epoxycyclohexylethyltrimethoxysilane, etc. These may be used alone or in admixture of two or more.

具體來說，按100重量份的感光性樹脂組成物計，可以0.01重量份到1重量份的量使用矽烷類偶聯劑。Specifically, based on 100 parts by weight of the photosensitive resin composition, the silane coupling agent can be used in an amount of 0.01 to 1 part by weight.

另外，必要時，用於彩色濾光器的感光性樹脂組成物可還包含表面活性劑，例如氟類表面活性劑。In addition, the photosensitive resin composition for a color filter may further contain a surfactant, such as a fluorine-based surfactant, if necessary.

氟類表面活性劑的實例可包含大日本油墨化學工業株式會社（DIC Co., Ltd.）製造的F-482、F-484、F-478等，但不限於此。Examples of the fluorine-based surfactant may include, but are not limited to, F-482, F-484, F-478 and the like manufactured by DIC Co., Ltd.

按感光性樹脂組成物的總量計，理想地以0.01重量%到5重量%，且更理想地0.01重量%到2重量%的量包含表面活性劑。當量超出上述範圍時，可在顯影之後產生外來物質，這不是非所要的。The surfactant is desirably included in an amount of 0.01% by weight to 5% by weight, and more desirably 0.01% by weight to 2% by weight, based on the total amount of the photosensitive resin composition. When the amount exceeds the above range, foreign substances may be generated after development, which is not undesirable.

此外，除非添加劑使感光性樹脂組成物的性質劣化，否則感光性樹脂組成物可包含預定量的其它添加劑，例如抗氧化劑、穩定劑等。In addition, the photosensitive resin composition may contain predetermined amounts of other additives such as antioxidants, stabilizers, etc. unless the additives degrade the properties of the photosensitive resin composition.

根據另一實施例，提供使用根據實施例的感光性樹脂組成物製造的感光性樹脂層。According to another embodiment, there is provided a photosensitive resin layer manufactured using the photosensitive resin composition according to the embodiment.

根據另一實施例，使用前述感光性樹脂組成物製造彩色濾光器。According to another embodiment, the aforementioned photosensitive resin composition is used to manufacture a color filter.

製造彩色濾光器的方法如下。A method of manufacturing a color filter is as follows.

以例如旋塗、滾塗、噴塗等適當方法塗布前述感光性樹脂組成物以在玻璃襯底上形成0.5微米到10微米厚度的感光性樹脂組成物層。The above-mentioned photosensitive resin composition is coated by an appropriate method such as spin coating, roll coating, spray coating, etc. to form a photosensitive resin composition layer with a thickness of 0.5 μm to 10 μm on the glass substrate.

隨後，通過光輻射具有感光性樹脂組成物層的襯底以形成彩色濾光器所需的圖案。作為用於輻射的光源，可使用UV、電子束或X射線，且例如可輻射190納米到450納米，具體地說200納米到400納米的區域中的UV。在輻射過程中，可進一步使用光阻掩模。在以此方式進行輻射過程之後，用顯影溶液處理用光源輻射的感光性樹脂組成物層。此時，溶解感光性樹脂組成物層的未曝光部分以形成彩色濾光器所必需的圖案。通過根據大量所需色彩重複此過程，可獲得具有所要圖案的彩色濾光器。另外，當再次加熱或通過具有光化射線的輻射固化在上述過程中通過顯影獲得的圖像圖案時，可改進抗裂性和耐溶劑性。Subsequently, the substrate having the photosensitive resin composition layer is irradiated with light to form a desired pattern for the color filter. As a light source for irradiation, UV, electron beams, or X-rays may be used, and, for example, UV may be irradiated in a region of 190 nm to 450 nm, specifically, 200 nm to 400 nm. During the irradiation process, a photoresist mask can further be used. After performing the irradiation process in this way, the photosensitive resin composition layer irradiated with the light source is treated with a developing solution. At this time, the unexposed portion of the photosensitive resin composition layer is dissolved to form a pattern necessary for the color filter. By repeating this process for a large number of desired colors, a color filter with a desired pattern can be obtained. In addition, when the image pattern obtained by development in the above process is cured by heating again or by radiation with actinic rays, crack resistance and solvent resistance may be improved.

根據另一實施例，提供一種包含前述彩色濾光器的顯示裝置。顯示裝置可為例如液晶顯示器（LCD）。According to another embodiment, there is provided a display device including the aforementioned color filter. The display device may be, for example, a liquid crystal display (LCD).

在下文中，參考實例更詳細示出本發明，然而，但這些實例不以任何含義解釋為限制本發明的範圍。Hereinafter, the present invention is shown in more detail with reference to examples, however, these examples are not construed as limiting the scope of the present invention in any sense.

（合成粘合劑樹脂）(synthetic binder resin)

合成實例1到合成實例7和比較合成實例1到比較合成實例4Synthetic Example 1 to Synthetic Example 7 and Comparative Synthetic Example 1 to Comparative Synthetic Example 4

將3.5重量份的AIBN作為起始劑（按100重量份的不包括AIBN的用於聚合的單體的總量計）置於100毫升燒杯中，且按下方表1和表2所示的比率（按單體的總量的100重量%計）依序向其中添加用於聚合的單體，且接著攪拌30分鐘。隨後，為繼續進行聚合反應，將70克的PGMEA置於配備有冷卻器的250毫升玻璃反應器中，且接著加熱到85℃，且將所製備單體溶液逐滴添加到反應器中3小時。在相同溫度下進一步進行反應6小時之後，將溫度降低到室溫以完成反應，其中在氮氣氛圍下進行反應。3.5 parts by weight of AIBN as an initiator (based on 100 parts by weight of the total amount of monomers used for polymerization excluding AIBN) was placed in a 100 ml beaker at the ratios shown in Table 1 and Table 2 below The monomers for polymerization were sequentially added thereto (based on 100% by weight of the total amount of monomers), and then stirred for 30 minutes. Subsequently, to continue the polymerization reaction, 70 g of PGMEA was placed in a 250 ml glass reactor equipped with a cooler, and then heated to 85° C., and the prepared monomer solution was added dropwise to the reactor for 3 hours . After the reaction was further performed at the same temperature for 6 hours, the temperature was lowered to room temperature to complete the reaction, which was performed under a nitrogen atmosphere.

（表1） 單體類型 比較合成實例1 比較合成實例2 比較合成實例3 比較合成實例4 單位 甲基丙烯酸 15 15 15 15 重量% 甲基丙烯酸月桂酯 0 45 25 25 重量% 甲基丙烯酸三氟乙脂 30 0 2 41 重量% 甲基丙烯三環癸脂（TCDMA） 40 25 43 4 重量% 苯基馬來醯亞胺 15 15 15 15 重量% AIBN 3.5 3.5 3.5 3.5 重量份 分子量（Mw） 11500 11500 11500 11500 克/摩爾 (Table 1) monomer type Comparative Synthesis Example 1 Comparative Synthesis Example 2 Comparative Synthesis Example 3 Comparative Synthesis Example 4 unit Methacrylate 15 15 15 15 weight% lauryl methacrylate 0 45 25 25 weight% Trifluoroethyl methacrylate 30 0 2 41 weight% Tricyclodecanyl Methacrylate (TCDMA) 40 25 43 4 weight% Phenylmaleimide 15 15 15 15 weight% AIBN 3.5 3.5 3.5 3.5 parts by weight Molecular weight (Mw) 11500 11500 11500 11500 g/mol

（表2） 單體類型 合成實例1 合成實例2 合成實例3 合成實例4 合成實例5 合成實例6 合成實例7 單位 甲基丙烯酸 15 15 15 15 15 15 15 重量% 甲基丙烯酸月桂酯 25 25 25 35 45 37 20 重量% 甲基丙烯酸三氟乙脂 10 20 30 20 20 3 40 重量% 甲基丙烯三環癸脂（TCDMA） 35 25 15 15 5 30 10 重量% 苯基馬來醯亞胺 15 15 15 15 15 15 15 重量% AIBN 3.5 3.5 3.5 3.5 3.5 3.5 3.5 重量份 分子量（Mw） 12000 11500 12500 12000 12000 12000 12000 克/摩爾 (Table 2) monomer type Synthetic Example 1 Synthetic example 2 Synthetic Example 3 Synthetic Example 4 Synthetic Example 5 Synthetic Example 6 Synthetic Example 7 unit Methacrylate 15 15 15 15 15 15 15 weight% lauryl methacrylate 25 25 25 35 45 37 20 weight% Trifluoroethyl methacrylate 10 20 30 20 20 3 40 weight% Tricyclodecanyl Methacrylate (TCDMA) 35 25 15 15 5 30 10 weight% Phenylmaleimide 15 15 15 15 15 15 15 weight% AIBN 3.5 3.5 3.5 3.5 3.5 3.5 3.5 parts by weight Molecular weight (Mw) 12000 11500 12500 12000 12000 12000 12000 g/mol

（製備感光性樹脂組成物）(Preparation of photosensitive resin composition)

實例1到實例7和比較例1到比較例4Example 1 to Example 7 and Comparative Example 1 to Comparative Example 4

在下方表3和表4中展示的各組成物中混合以下組分，製備根據實施例1到實施例7和比較例1到比較例4的各感光性樹脂組成物。Each photosensitive resin composition according to Example 1 to Example 7 and Comparative Example 1 to Comparative Example 4 was prepared by mixing the following components in each composition shown in Table 3 and Table 4 below.

具體來說，將光聚合起始劑溶解於溶劑中，且接著在室溫下攪拌，且向其中添加粘合劑樹脂和光可聚合化合物，且接著在室溫下攪拌。隨後，將作為著色劑的染料和顏料分散液添加到所獲得反應物中，且接著將室溫下攪拌。接著，3次過濾產物以去除雜質，製備感光性樹脂組成物。Specifically, a photopolymerization initiator is dissolved in a solvent, and then stirred at room temperature, and a binder resin and a photopolymerizable compound are added thereto, and then stirred at room temperature. Subsequently, dye and pigment dispersion liquids as colorants were added to the obtained reactant, and then stirred at room temperature. Next, the product was filtered three times to remove impurities to prepare a photosensitive resin composition.

（表3）(table 3)

（單位：重量%） 組分 比較例1 比較例2 比較例3 比較例4 （A）粘合劑樹脂 A-1 3.8 3.8 3.8 3.8 A-2 0.5 0.5 0.5 0.5 A-3 4.1 - - - A-4   4.1 - - A-5   - 4.1 - A-6 - - - 4.1 A-7 - - - - A-8 - - - - A-9 - - - - A-10 -   - - A-11 -   - - A-12 - - - - A-13 - - - - （B）光可聚合化合物 B-1 4.0 4.0 4.0 4.0 B-2 0.4 0.4 0.4 0.4 （C）光聚合起始劑 C-1 0.3 0.3 0.3 0.3 C-2 0.2 0.2 0.2 0.2 （D）著色劑 D-1 25.5 25.5 25.5 25.5 D-2 2.8 2.8 2.8 2.8 （E）溶劑 E-1 58.4 58.4 58.4 58.4 （F）添加劑 F-1 0.0 0.0 0.0 0.0 總計 100 100 100 100 (unit weight%) components Comparative example 1 Comparative example 2 Comparative example 3 Comparative example 4 (A) Binder resin A-1 3.8 3.8 3.8 3.8 A-2 0.5 0.5 0.5 0.5 A-3 4.1 - - - A-4 4.1 - - A-5 - 4.1 - A-6 - - - 4.1 A-7 - - - - A-8 - - - - A-9 - - - - A-10 - - - A-11 - - - A-12 - - - - A-13 - - - - (B) Photopolymerizable compound B-1 4.0 4.0 4.0 4.0 B-2 0.4 0.4 0.4 0.4 (C) Photopolymerization initiator C-1 0.3 0.3 0.3 0.3 C-2 0.2 0.2 0.2 0.2 (D) colorant D-1 25.5 25.5 25.5 25.5 D-2 2.8 2.8 2.8 2.8 (E) Solvent E-1 58.4 58.4 58.4 58.4 (F) Additives F-1 0.0 0.0 0.0 0.0 total 100 100 100 100

（表4）(Table 4)

（單位：重量%） 組分 實例1 實例2 實例3 實例4 實例5 實例6 實例7 （A）粘合劑樹脂 A-1 3.8 3.8 3.8 3.8 3.8 3.8 3.8 A-2 0.5 0.5 0.5 0.5 0.5 0.5 0.5 A-3 - - - - - - - A-4 - - - - - - - A-5 - - - - - - - A-6 - - - - - - - A-7 4.1 - - - - - - A-8 - 4.1 - - - - - A-9 - - 4.1 - - - - A-10 - - - 4.1 - - - A-11 - - - - 4.1 - - A-12 - - - - - 4.1 - A-13 - - - - - - 4.1 （B）光可聚合化合物 B-1 4.0 4.0 4.0 4.0 4.0 4.0 4.0 B-2 0.4 0.4 0.4 0.4 0.4 0.4 0.4 （C）光聚合起始劑 C-1 0.3 0.3 0.3 0.3 0.3 0.3 0.3 C-2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 （D）著色劑 D-1 25.5 25.5 25.5 25.5 25.5 25.5 25.5 D-2 2.8 2.8 2.8 2.8 2.8 2.8 2.8 （E）溶劑 E-1 58.4 58.4 58.4 58.4 58.4 58.4 58.4 （F）添加劑 F-1 0.0 0.0 0.0 0.0 0.0 0.0 0.0 總計 100 100 100 100 100 100 100 (unit weight%) components Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 (A) Binder resin A-1 3.8 3.8 3.8 3.8 3.8 3.8 3.8 A-2 0.5 0.5 0.5 0.5 0.5 0.5 0.5 A-3 - - - - - - - A-4 - - - - - - - A-5 - - - - - - - A-6 - - - - - - - A-7 4.1 - - - - - - A-8 - 4.1 - - - - - A-9 - - 4.1 - - - - A-10 - - - 4.1 - - - A-11 - - - - 4.1 - - A-12 - - - - - 4.1 - A-13 - - - - - - 4.1 (B) Photopolymerizable compound B-1 4.0 4.0 4.0 4.0 4.0 4.0 4.0 B-2 0.4 0.4 0.4 0.4 0.4 0.4 0.4 (C) Photopolymerization initiator C-1 0.3 0.3 0.3 0.3 0.3 0.3 0.3 C-2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 (D) colorant D-1 25.5 25.5 25.5 25.5 25.5 25.5 25.5 D-2 2.8 2.8 2.8 2.8 2.8 2.8 2.8 (E) Solvent E-1 58.4 58.4 58.4 58.4 58.4 58.4 58.4 (F) Additives F-1 0.0 0.0 0.0 0.0 0.0 0.0 0.0 total 100 100 100 100 100 100 100

（A）粘合劑樹脂(A) Binder resin

（A-1）丙烯醯類粘合劑樹脂（產品名稱：NPR 5216，製造商：美源（Miwon）） (A-1) Acrylic binder resin (product name: NPR 5 216, manufacturer: Miwon)

（A-2）環氧類粘合劑樹脂（產品名稱：EHPE3150，製造商：大賽璐株式會社（Dicel））(A-2) Epoxy-based adhesive resin (product name: EHPE3150, manufacturer: Daicel Corporation (Dicel))

（A-3）丙烯醯類複合粘合劑樹脂（比較合成實例1）(A-3) Acrylic Composite Binder Resin (Comparative Synthesis Example 1)

（A-4）丙烯醯類複合粘合劑樹脂（比較合成實例2）(A-4) Acrylic composite binder resin (comparative synthesis example 2)

（A-5）丙烯醯類複合粘合劑樹脂（比較合成實例3）(A-5) Acrylic composite binder resin (comparative synthesis example 3)

（A-6）丙烯醯類複合粘合劑樹脂（比較合成實例4）(A-6) Acrylic Composite Binder Resin (Comparative Synthesis Example 4)

（A-7）丙烯醯類複合粘合劑樹脂（合成實例1）(A-7) Acrylic composite binder resin (Synthesis Example 1)

（A-8）丙烯醯類複合粘合劑樹脂（合成實例2）(A-8) Acrylic composite binder resin (Synthesis Example 2)

（A-9）丙烯醯類複合粘合劑樹脂（合成實例3）(A-9) Acrylic composite binder resin (Synthesis Example 3)

（A-10）丙烯醯類複合粘合劑樹脂（合成實例4）(A-10) Acrylic composite binder resin (Synthesis Example 4)

（A-11）丙烯醯類複合粘合劑樹脂（合成實例5）(A-11) Acrylic composite binder resin (Synthesis Example 5)

（A-12）丙烯醯類複合粘合劑樹脂（合成實例6）(A-12) Acrylic composite binder resin (synthesis example 6)

（A-13）丙烯醯類複合粘合劑樹脂（合成實例7）(A-13) Acrylic composite binder resin (Synthesis Example 7)

（B）光可聚合化合物(B) Photopolymerizable compound

(B-1)光可聚合單體（物質名稱：聚二季戊四醇六丙烯酸酯（DPHA），製造商：日本化藥株式會社）(B-1) Photopolymerizable monomer (substance name: polydipentaerythritol hexaacrylate (DPHA), manufacturer: Nippon Kayaku Co., Ltd.)

（B-2）顯影性賦予光可聚合單體（產品名稱：V1000，製造商：工芸（Gongyeong））(B-2) Developability-imparting photopolymerizable monomer (product name: V1000, manufacturer: Gongyeong)

（C）光聚合起始劑(C) Photopolymerization initiator

（C-1）SPI-03（製造商：三養公司（Samyang Corporation））(C-1) SPI-03 (Manufacturer: Samyang Corporation)

（C-2）PBG-305（製造商：強力（Tronly））(C-2) PBG-305 (manufacturer: Tronly)

（D）著色劑(D) colorant

（D-1）酞菁類顏料分散液（產品名稱：B15:6，製造商：三洋（Sanyo））(D-1) Phthalocyanine pigment dispersion (product name: B15:6, manufacturer: Sanyo)

（D-2）由下式表示的酞菁類顏料和呫噸類染料的混合分散液（B15:6和呫噸類染料的重量比=70:30，製造商：伊裡多斯（Iridos））(D-2) Mixed dispersion of phthalocyanine pigment and xanthene dye represented by the following formula (weight ratio of B15:6 to xanthene dye = 70:30, manufacturer: Iridos) )

Figure 02_image025
Figure 02_image025

（E）溶劑(E) Solvent

（E-1）丙二醇單甲醚乙酸酯（PGMEA，製造商：西格瑪-奧德里奇（Sigma-Aldrich））(E-1) Propylene glycol monomethyl ether acetate (PGMEA, manufacturer: Sigma-Aldrich)

（F）添加劑(F) Additives

（F-1）氟類表面活性劑（F-554，製造商：大日本油墨化學工業株式會社（DIC））(F-1) Fluorinated surfactant (F-554, manufacturer: Dainippon Ink & Chemicals Co., Ltd. (DIC))

（評價）(evaluate)

評估1:水分吸收率、解析度以及PTN撕裂特性Evaluation 1: Moisture Absorption, Resolution, and PTN Tear Properties

分別相對於水分吸收率、解析度以及PTN撕裂特性測量根據實例1到實例7和比較例1到比較例4的感光性樹脂組成物，且結果展示於表5和表6中。The photosensitive resin compositions according to Examples 1 to 7 and Comparative Examples 1 to 4 were measured with respect to moisture absorption, resolution, and PTN tearing properties, respectively, and the results are shown in Tables 5 and 6.

本文中，如下提供測量水分吸收率、解析度以及PTN撕裂特性的各方法。Herein, each method of measuring the moisture absorption rate, the resolution, and the tear property of the PTN is provided as follows.

1）  水分吸收率：將各感光性樹脂組成物在玻璃上旋塗為2.6微米厚度，在90℃加熱板上加熱90秒，通過使用UV曝光器以50毫焦曝光，且在230℃烘箱中加熱20分鐘，製造整個表面樣本。將前樣本浸入蒸餾水中120分鐘，且接著通過TGA分析（TA儀器（室溫→150℃（10℃/分鐘）→維持20分鐘））相對於失重率（%）進行測量。1) Moisture absorption rate: each photosensitive resin composition is spin-coated on glass to a thickness of 2.6 microns, heated on a 90°C heating plate for 90 seconds, exposed at 50 mJ by using a UV exposure device, and placed in an oven at 230°C Heat for 20 minutes to make an entire surface sample. The front sample was immersed in distilled water for 120 minutes, and then measured by TGA analysis (TA instrument (room temperature → 150°C (10°C/min) → hold for 20 minutes)) relative to weight loss rate (%).

2）  解析度：將各感光性樹脂組成物在玻璃上旋塗為2.6微米厚度，在90℃加熱板上加熱90秒，通過使用UV曝光器以50毫焦曝光，在1.0千克力壓力下通過使用顯影劑（SVS-2000）在KOH顯影液中顯影60秒，且用水洗滌60秒，且接著相對於剩餘最小橫條圖案大小進行測量。2) Resolution: Each photosensitive resin composition is spin-coated on glass to a thickness of 2.6 microns, heated on a heating plate at 90°C for 90 seconds, exposed at 50 millijoules by using a UV exposure device, and passed under a pressure of 1.0 kgf The developer (SVS-2000) was developed in a KOH developer solution for 60 seconds, and washed with water for 60 seconds, and then measured relative to the remaining minimum horizontal stripe pattern size.

3）  圖案撕裂特性：將各感光性樹脂組成物在玻璃上旋塗為2.6微米厚度，在90℃加熱板上加熱90秒，通過使用UV曝光器以50毫焦曝光，在2.0千克力的壓力下通過使用顯影劑（SVS-2000）在KOH顯影液中顯影120秒，且用水洗滌60秒，且接著相對于相同區中的橫條圖案的邊緣撕裂數目進行測量。3) Pattern tearing characteristics: Each photosensitive resin composition was spin-coated on glass to a thickness of 2.6 microns, heated on a 90°C heating plate for 90 seconds, exposed at 50 mJ by using a UV exposure device, and exposed at 2.0 kgf It was developed under pressure by using a developer (SVS-2000) in a KOH developer solution for 120 seconds, and washed with water for 60 seconds, and then measured with respect to the number of edge tears of the horizontal stripe pattern in the same area.

（表5） 評估專案 比較例1 比較例2 比較例3 比較例4 水分吸收率（%） 1 1.8 2 0.3 解析度（微米） 50 20 10 40 PTN撕裂（個（ea）） 95 3 15 30 (table 5) Evaluation Project Comparative example 1 Comparative example 2 Comparative example 3 Comparative example 4 Moisture absorption rate (%) 1 1.8 2 0.3 Resolution (microns) 50 20 10 40 PTN tear (unit(ea)) 95 3 15 30

（表6） 評估專案 實例1 實例2 實例3 實例4 實例5 實例6 實例7 水分吸收率（%） 1.3 1.1 0.9 1.0 0.8 1.8 0.5 解析度（微米） 20 20 20 20 10 10 10 PTN撕裂（個） 14 25 32 15 2 5 35 (Table 6) Evaluation Project Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Moisture absorption rate (%) 1.3 1.1 0.9 1.0 0.8 1.8 0.5 Resolution (microns) 20 20 20 20 10 10 10 PTN tear (pieces) 14 25 32 15 2 5 35

參考表5和表6，根據一個實施例的感光性樹脂組成物具有比根據比較例1到比較例4的感光性樹脂組成物更低的水分吸收率，但相對極佳的解析度和極佳的可加工性。Referring to Table 5 and Table 6, the photosensitive resin composition according to one example has a lower moisture absorption rate than the photosensitive resin compositions according to Comparative Example 1 to Comparative Example 4, but relatively excellent resolution and excellent machinability.

此外，比較例1到實例7的感光性樹脂組成物，可看出例如水分吸收率、解析度、可加工性等的特性通過適當地調整其組分的混合比來控制。In addition, comparing the photosensitive resin compositions of Examples 1 to 7, it can be seen that properties such as moisture absorption rate, resolution, processability, etc. can be controlled by appropriately adjusting the mixing ratio of the components.

雖然已結合目前視為實用實例實施例的內容來描述本發明，但應理解，本發明不限於所公開的實施例，而相反，本發明旨在涵蓋包含在隨附權利要求的精神和範圍內的各種修改和等效佈置。While the invention has been described in connection with what are presently considered to be practical example embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but on the contrary, the invention is intended to cover the scope of the invention included within the spirit and scope of the appended claims. Various modifications and equivalent arrangements of .

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無。none.

Claims (16)

一種感光性樹脂組成物，包括： （A）粘合劑樹脂； （B）光可聚合化合物； （C）光聚合起始劑； （D）著色劑；以及 （E）溶劑， 其中所述粘合劑樹脂包含從由化學式1表示的單體衍生的第一結構單元、從由化學式2表示的單體衍生的第二結構單元以及從由化學式3表示的單體衍生的第三結構單元： [化學式1]
Figure 03_image027
其中，在化學式1中， R 1為C1到C10經取代或未經取代的烷基或C2到C10經取代或未經取代的烯基； [化學式2]
Figure 03_image029
其中，在化學式2中， R 2為C1到C10經取代或未經取代的烷基或C2到C10經取代或未經取代的烯基；以及 R 3為C11到C20經取代或未經取代的烷基或C11到C20經取代或未經取代的烯基； [化學式3]
Figure 03_image031
其中，在化學式3中， R 4為C1到C10經取代或未經取代的烷基或C2到C10經取代或未經取代的烯基；以及 R 5為C1到C10烷基或C1到C10烯基；且R 5經1到3個氟取代。 A photosensitive resin composition comprising: (A) a binder resin; (B) a photopolymerizable compound; (C) a photopolymerization initiator; (D) a colorant; and (E) a solvent, wherein the binder The mixture resin comprises a first structural unit derived from a monomer represented by Chemical Formula 1, a second structural unit derived from a monomer represented by Chemical Formula 2, and a third structural unit derived from a monomer represented by Chemical Formula 3: [ Chemical formula 1]
Figure 03_image027
Wherein, in Chemical Formula 1, R 1 is C1 to C10 substituted or unsubstituted alkyl or C2 to C10 substituted or unsubstituted alkenyl; [Chemical Formula 2]
Figure 03_image029
Wherein, in Chemical Formula 2, R 2 is C1 to C10 substituted or unsubstituted alkyl or C2 to C10 substituted or unsubstituted alkenyl; and R 3 is C11 to C20 substituted or unsubstituted Alkyl or C11 to C20 substituted or unsubstituted alkenyl; [chemical formula 3]
Figure 03_image031
Wherein, in Chemical Formula 3, R is C1 to C10 substituted or unsubstituted alkyl or C2 to C10 substituted or unsubstituted alkenyl; and R is C1 to C10 alkyl or C1 to C10 alkenyl and R 5 is substituted by 1 to 3 fluorines. 如請求項1所述的感光性樹脂組成物，其中 R 1為C2到C5經取代或未經取代的烯基。 The photosensitive resin composition as claimed in claim 1, wherein R 1 is C2 to C5 substituted or unsubstituted alkenyl. 如請求項1所述的感光性樹脂組成物，其中 在構成所述粘合劑樹脂的單體的總量中，以10重量%到25重量%的量包含所述由化學式1表示的單體。 The photosensitive resin composition as described in Claim 1, wherein The monomer represented by Chemical Formula 1 is included in an amount of 10% by weight to 25% by weight in the total amount of monomers constituting the binder resin. 如請求項1所述的感光性樹脂組成物，其中 R 2為C2到C5經取代或未經取代的烯基；以及 R 3為C11到C18經取代或未經取代的烷基。 The photosensitive resin composition as claimed in claim 1, wherein R 2 is C2 to C5 substituted or unsubstituted alkenyl; and R 3 is C11 to C18 substituted or unsubstituted alkyl. 如請求項1所述的感光性樹脂組成物，其中 在構成所述粘合劑樹脂的單體的總量中，以10重量%到50重量%的量包含所述由化學式2表示的單體。 The photosensitive resin composition as described in Claim 1, wherein The monomer represented by Chemical Formula 2 is included in an amount of 10% by weight to 50% by weight in the total amount of monomers constituting the binder resin. 如請求項1所述的感光性樹脂組成物，其中 R 4為C2到C5經取代或未經取代的烯基；以及 R 5為C1到C5烷基；且R 5經1到3個氟取代。 The photosensitive resin composition as claimed in claim 1, wherein R 4 is C2 to C5 substituted or unsubstituted alkenyl; and R 5 is C1 to C5 alkyl; and R 5 is substituted by 1 to 3 fluorine . 如請求項1所述的感光性樹脂組成物，其中 在構成所述粘合劑樹脂的單體的總量中，以3重量%到40重量%的量包含所述由化學式3表示的單體。 The photosensitive resin composition as described in Claim 1, wherein The monomer represented by Chemical Formula 3 is included in an amount of 3% by weight to 40% by weight in the total amount of monomers constituting the binder resin. 如請求項1所述的感光性樹脂組成物，其中 所述粘合劑樹脂還包含從由化學式4表示的單體衍生的第四結構單元、從由化學式5表示的單體衍生的第五結構單元或其組合： [化學式4]
Figure 03_image033
其中，在化學式4中， R 6為氫或C1到C10烷基；以及 L為單鍵或C1到C10亞烷基； [化學式5]
Figure 03_image035
其中，在化學式5中， R 7為氫、C1到C10烷基或C6到C10芳基。 The photosensitive resin composition according to claim 1, wherein the binder resin further comprises a fourth structural unit derived from a monomer represented by Chemical Formula 4, a fifth structure derived from a monomer represented by Chemical Formula 5 A unit or combination thereof: [Chemical formula 4]
Figure 03_image033
Wherein, in Chemical Formula 4, R 6 is hydrogen or C1 to C10 alkyl; and L is a single bond or C1 to C10 alkylene; [Chemical Formula 5]
Figure 03_image035
Wherein, in Chemical Formula 5, R 7 is hydrogen, C1 to C10 alkyl or C6 to C10 aryl. 如請求項8所述的感光性樹脂組成物，其中 在構成所述粘合劑樹脂的單體的所述總量中，以0.01重量%到40重量%的量包含所述第四結構單元，且以0.01重量%到15重量%的量包含所述第五結構單元。 The photosensitive resin composition as described in Claim 8, wherein In the total amount of monomers constituting the binder resin, the fourth structural unit is included in an amount of 0.01% by weight to 40% by weight, and the fourth structural unit is included in an amount of 0.01% by weight to 15% by weight. fifth structural unit. 如請求項1所述的感光性樹脂組成物，其中 所述粘合劑樹脂的重均分子量為5000克/摩爾到30000克/摩爾。 The photosensitive resin composition as described in Claim 1, wherein The weight average molecular weight of the binder resin is 5000 g/mol to 30000 g/mol. 如請求項1所述的感光性樹脂組成物，其中 所述著色劑包含酞菁類顏料、呫噸類染料或其組合。 The photosensitive resin composition as described in Claim 1, wherein The colorant includes phthalocyanine pigments, xanthene dyes or combinations thereof. 如請求項1所述的感光性樹脂組成物，其中 按所述感光性樹脂組成物的總固體含量計，所述感光性樹脂組成物包含： 1重量%到60重量%的所述（A）粘合劑樹脂； 10重量%到50重量%的所述（B）著色劑； 1重量%到60重量%的所述（C）光可聚合化合物； 1重量%到15重量%的所述（D）光聚合起始劑；以及 餘量的所述（E）溶劑。 The photosensitive resin composition as described in Claim 1, wherein According to the total solid content of the photosensitive resin composition, the photosensitive resin composition comprises: 1% by weight to 60% by weight of the (A) binder resin; 10% to 50% by weight of said (B) colorant; 1% to 60% by weight of said (C) photopolymerizable compound; 1% by weight to 15% by weight of the (D) photopolymerization initiator; and The remainder of the (E) solvent. 如請求項1所述的感光性樹脂組成物，其中 所述感光性樹脂組成物還包含選自以下各者的至少一種添加劑：丙二酸；3-氨基-1,2-丙二醇；含有乙烯基或(甲基)丙烯醯氧基的偶聯劑；調平劑；氟類表面活性劑；以及自由基聚合起始劑。 The photosensitive resin composition as described in Claim 1, wherein The photosensitive resin composition further comprises at least one additive selected from the following: malonic acid; 3-amino-1,2-propanediol; a coupling agent containing vinyl or (meth)acryloxy; leveling agents; fluorosurfactants; and free radical polymerization initiators. 一種感光性樹脂層，使用如請求項1至13中任一項所述的感光性樹脂組成物製造。A photosensitive resin layer manufactured using the photosensitive resin composition described in any one of Claims 1 to 13. 一種彩色濾光器，包括如請求項14所述的感光性樹脂層。A color filter comprising the photosensitive resin layer as claimed in claim 14. 一種顯示裝置，包括如請求項15所述的彩色濾光器。A display device comprising the color filter as claimed in claim 15.
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