TW202240727A - Measuring physical properties of a component carrier based on design data - Google Patents

Measuring physical properties of a component carrier based on design data Download PDF

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Publication number
TW202240727A
TW202240727A TW111107750A TW111107750A TW202240727A TW 202240727 A TW202240727 A TW 202240727A TW 111107750 A TW111107750 A TW 111107750A TW 111107750 A TW111107750 A TW 111107750A TW 202240727 A TW202240727 A TW 202240727A
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TW
Taiwan
Prior art keywords
measurement
component carrier
design data
measuring
area
Prior art date
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TW111107750A
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Chinese (zh)
Inventor
吳洋洋
方夏春
張偉
溫海洋
王小青
朱柳柳
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大陸商奧特斯（中國）有限公司
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Publication of TW202240727A publication Critical patent/TW202240727A/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G01D21/02—Measuring two or more variables by means not covered by a single other subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
    • G01B21/047—Accessories, e.g. for positioning, for tool-setting, for measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/10—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring diameters
    • G01B21/14—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring diameters internal diameters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/18—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring depth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09927—Machine readable code, e.g. bar code
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

Abstract

A component carrier (10) comprising at least one electrically isolating layer (12) and at least one electrically conducting layer (14) on the electrically isolating layer (12). A method for measuring physical properties (24) of the component carrier (10) comprises: determining a plurality of measurement areas (72) on the component carrier (10); determining a measurement point (26) in each measurement area (72); and performing a measurement of the physical property (24) at each measurement point (26), wherein at least one of the plurality of measurement areas (72) and/or the measurement point (26) are determined based on design data (64) of the component carrier (10), such that the at least one of the measurement areas (72) and/or the measurement point (26) are at positions having at least one predefined feature available in the design data (64).

Description

基於設計數據測量部件載體的物理特性Measuring Physical Properties of Part Carriers Based on Design Data

本發明涉及用於測量部件載體的物理特性的方法、計算機程式、計算機可讀介質和系統。The present invention relates to methods, computer programs, computer readable media and systems for measuring physical properties of component carriers.

電子部件和電氣部件可以與部件載體電力地和機械地互連，該部件載體可以由一個或多個電隔離層和佈置在這些電隔離層上及其之間的一個或多個導電層製成。可以將導電層構造和/或圖案化用於生成導電路徑。不同層的導電路徑可以與通孔即導電柱電力地互連，這些通孔大致正交於層對準並且/或者突出穿過一個或多個電隔離層。 通常，部件載體是通過在隔離層上電鍍諸如銅的金屬並在以這種方式生成的導電層中蝕刻結構而製造的。所得的中間產物可以被附連在一起並以這種方式再次處理。可以通過在電鍍之前穿過中間產物鑽孔來製造通孔，然後在所述電鍍期間可以用金屬填充所生成的孔。 在電鍍期間生產並通過蝕刻部分地減少的導電層的厚度是非常重要的過程參數，其必須被控制和檢查。通常，這通過在部件載體的專用點處進行厚度測量來完成，其中能夠確保沒有通孔或空腔幹擾測量過程。 Electronic and electrical components can be electrically and mechanically interconnected with a component carrier, which can be made of one or more electrically isolating layers and one or more conductive layers arranged on and between these electrically isolating layers . The conductive layer can be structured and/or patterned to create conductive paths. Conductive paths of different layers may be electrically interconnected with vias, ie, conductive posts, aligned generally normal to the layers and/or protruding through one or more electrically isolating layers. Typically, component carriers are manufactured by electroplating a metal such as copper on an insulating layer and etching structures in the conductive layer created in this way. The resulting intermediates can be attached together and processed again in this way. Via holes can be made by drilling holes through the intermediate product prior to electroplating, during which the resulting holes can then be filled with metal. The thickness of the conductive layer produced during electroplating and partly reduced by etching is a very important process parameter which has to be controlled and checked. Typically, this is done by performing thickness measurements at dedicated points on the component carrier, where it can be ensured that no vias or cavities interfere with the measurement process.

更一般地，可能必須在部件載體的生產期間檢查和控制其他過程參數和/或物理特性，諸如例如隔離層的厚度、導電路徑的寬度、通孔直徑、空腔的深度。 本發明的目的是使部件載體的物理特性的測量自動化、加速並改進。 此目的由獨立權利要求的主題實現。根據從屬權利要求和以下描述，另外的示例性實施例是顯然的。 本發明的第一方面涉及一種用於測量部件載體的物理特性的方法，該部件載體包括至少一個電隔離層和該電隔離層上的至少一個導電層。物理特性可以為能夠被測量的部件載體的特性，諸如電隔離層和/或導電層的各部分的厚度、寬度或深度。作為示例，物理特性可以為導電層的厚度。 部件載體可以被設計用於電力地和/或機械地互連電子部件和/或電氣部件，諸如電阻器、電容器、電感器、晶體管、集成電路等。可以將導電圖案分成導電路徑，這些導電路徑可以與不同層之間的通孔互連。部件載體可以為電路板。 可以通過將金屬電鍍到電隔離層上來形成導電層。可以通過蝕刻來形成導電層的圖案。可以通過穿過部件載體鑽孔並將金屬電鍍到孔中來形成通孔。 根據本發明的一個實施例，該方法包括：在部件載體上確定多個測量區域；在每個測量區域中確定測量點；以及在每個測量點處執行(或至少命令)物理特性的測量。該方法可以由評價設備自動地執行，該評價設備控制和/或命令執行測量的測量設備。 測量區域可以為在部件載體的側面上的區域和/或區。測量區域可以分佈在部件載體四處，使得能夠在大致均勻地分佈的測量點處執行測量。這可以意味著測量區域被選取，使得能夠選取測量點，使得它們具有大於最小距離且小於最大距離的距離。 多個測量區域中的至少一個和/或測量點基於部件載體的設計數據來確定，使得測量區域中的至少一個和/或測量點處於具有在設計數據中可獲得的至少一個預定義特徵的位置。 可以基於部件載體的設計數據確定測量區域中的一個、一些或全部，使得測量區域處於具有在設計數據中可獲得和/或編碼的至少一個預定義特徵的位置。 設計數據可以為對部件載體的設計進行編碼的數據。例如，設計數據可以對電隔離層和/或導電層的數目和/或厚度進行編碼和/或描述。特別地，設計數據可以對導電層的圖案和/或結構進行編碼和/或描述。這可以意味著在設計數據中對存在金屬材料的區域和/或已從導電層蝕刻掉金屬材料的區域進行編碼和/或描述。設計數據可以包括點和/或CAD數據，這些點和/或CAD數據定義在導電層中存在金屬材料的區與在導電層中不存在金屬材料的區之間的邊緣。 設計數據可以對穿過部件載體的通孔和/或鑽孔進行描述和/或編碼。通孔和/或鑽孔可以通過其位置、深度、延長部和/或直徑來編碼和/或描述。 此外，設計數據可以對在部件載體中哪裡存在空腔描述和/或編碼。此類空腔可以被適配用於收容電氣部件和/或電子部件。設計數據可以包括定義空腔的各面的點和/或CAD數據。 可以用設計數據自動地製造部件載體。可以將設計數據輸入到電鍍設備中，該電鍍設備然後將如設計數據中定義的厚度的金屬層電鍍到電隔離層上。可以將設計數據輸入到蝕刻設備中，該蝕刻設備然後將金屬層蝕刻成圖案和/或結構，使得如設計數據中定義的那樣生成導電層。可以將設計數據輸入到鑽孔設備中，該鑽孔設備如設計數據中定義的那樣穿過部件載體鑽孔。可以將設計數據輸入到鋸切設備中以便生成空腔，諸如設計數據中定義的。 例如，當在設計數據中對部件載體的整體延長部進行編碼和/或描述時，可以根據設計數據確定測量區域。例如，測量區域的數目可以為固定的，並且測量區域可以分佈在部件載體的側面之上。 替換地和附加地，可以基於部件載體的設計數據確定測量點，使得測量點處於具有在設計數據中可獲得和/或編碼的至少一個預定義特徵的位置。 當測量區域被確定時，在每個測量區域中搜索測量點。測量點可以具有在設計數據中可獲得和/或編碼的至少一個預定義特徵。這樣的預定義特徵可以為在部件載體上存在金屬材料、不存在鑽孔、不存在空腔等的地方。還可能的是，這樣的預定義特徵可以為存在鑽孔和/或空腔。通常，預定義特徵可以為部件載體的特性，其中可以在不幹擾部件載體的其他特性的情況下執行測量。 作為示例，當導電層的厚度測量是用該方法執行的測量時，至少一個預定義特徵包括存在金屬材料並且在金屬材料下方不存在通孔的區域。 評價設備可以在相應的測量區域中掃描設計數據，而無論是否存在具有至少一個預定義特徵的位置和/或區域。當找到這樣的位置時，可以將此位置用作測量點。 最後，在測量點處執行測量。評價設備可以控制和/或命令測量設備將傳感器移動到測量點並在每個測量點處執行測量。為此，測量設備可以包括附連有傳感器的臂或更一般地移動裝置。 根據本發明的一個實施例，該方法還包括：當在測量區域中未找到具有至少一個預定義特徵的測量點時，延長測量區域並在經延長的測量區域中確定測量點。可能的是，在測量區域中掃描測量點期間，未找到存在設計數據中可獲得的所有至少一個預定義特徵的位置和/或區。然後，測量區域可以通過增加其尺寸來延長。例如，測量區域可以為矩形，並且矩形的各邊可以為細長的。作為另一示例，測量區域可以為圓形，並且圓形的直徑可以延長。 根據本發明的一個實施例，在每個測量區域中確定多個測量點。這些測量點中的每一個均可以具有至少一個預定義特徵。然後可以在這些測量點中的每一個處進行測量。以這樣的方式，能夠將測量區域中的測量結果相互進行比較。 根據本發明的一個實施例，部件載體具有矩形形狀。可以將測量區域放置在部件載體的拐角中並且/或者可以將測量區域放置在部件載體的中心中。所有這些測量點處的測量結果可以代表完整部件載體的物理特性。通常，測量區域可以均勻地分佈在部件載體之上。 根據本發明的一個實施例，測量區域具有矩形形狀。這樣的形狀可以容易地與設計數據中的點相交，以便確定設計數據的哪一個部分對相應的測量區域來說相關。然而，諸如圓形形狀的其他形狀也是可能的。 根據本發明的一個實施例，設計數據對以下各項中的至少一個進行編碼：由電隔離層上的導電層的各部分提供的導電區域的延長部；導電層的層厚度；穿過部件載體的至少一些層的鑽孔的位置。如上已經提及的，設計數據還可以被用於自動地製造部件載體。 根據本發明的一個實施例，物理特性是部件載體的層厚度。測量可以為層厚度測量。層厚度可以為表面層和/或其他導電層如在表面層下面的層的層厚度。利用此類測量，可以確定是否已在電隔離層上電鍍了足夠的金屬材料和/或導電層的電導率是否足夠高。 根據本發明的一個實施例，以非破壞性方式執行測量。例如，測量可以基於渦電流測量、電感測量和x射線測量中的至少一個。對應傳感器可以由測量設備提供。 根據本發明的一個實施例，在設計數據中可獲得和/或編碼的預定義特徵是例如圍繞測量點的導電層的一部分，該部分具有大於最小區域的區域。在測量區域中掃描設計數據期間，可以搜索導電層的具有至少具體區域的區域。這樣的區域可以保證能夠執行厚度測量的均勻厚度。 根據本發明的一個實施例，在設計數據中可獲得和/或編碼的預定義特徵是部件載體的例如圍繞測量點的區和/或區域，該區沒有鑽孔和/或沒有通孔。鑽孔和/或通孔可能幹擾鑽孔和/或通孔上方的導電層的區域的厚度測量。必須注意，不容易通過目視檢查找到沒有鑽孔和/或沒有通孔的區域，因為導電層可以覆蓋此類特徵。在這裡，該方法可以顯著地改進由技術人員進行的測量。 根據本發明的一個實施例，該方法還包括：確定部件載體的定向點，其中，相對於定向點確定測量點。測量設備可以包括用於確定部件載體的拐角或其他定向點的裝置。 根據本發明的一個實施例，該方法還包括：通過掃描部件載體的至少一部分來確定部件載體的標識符；以及根據標識符確定設計數據。標識符可以為在部件載體上提供的計算機可讀代碼。此標識符可以用測量設備的掃描儀來掃描。評價設備可以被適配用於確定具有相應的標識符的部件載體的設計數據。例如，可以根據標識符和/或根據存儲標識符的查閱資料表確定到設計數據的鏈接。 根據本發明的一個實施例，測量多個同樣地設計的部件載體的物理特性，其中，在針對多個部件載體執行測量之前針對多個部件載體確定測量點。可能的是用該方法處理多個同樣地設計的部件載體。在這種情況下，可以僅一次確定設計數據和/或測量區域和/或測量點，並且可以在相同的測量點處針對每個部件載體執行測量。這可以節省評價設備的計算能力並且/或者可以提高該方法的速度。 根據本發明的一個實施例，該方法還包括：當測量點處的物理特性的測量在預定義邊界之外時，將部件載體評定為有故障的。該方法可以被用於區分具有所期望的物理特性即在期望的邊界內的部件載體和具有在這些邊界之外並然後被認為是有故障的物理特性的部件載體。例如，導電層的厚度在至少一個測量點中比最小厚度薄或比最大厚度厚的部件載體可以被認為是有故障的。 根據本發明的一個實施例，從進一步製造中自動地移除被評定為有故障的部件載體。可以進一步製造所測量的物理特性停留在邊界內的部件載體。可以從自動製造中移除其他部件載體。例如，輸送機設備或機器人可以將評定為無故障的部件載體輸送到下一製造設備，然而可以將評定為有故障的部件載體輸送到它們可以由技術人員檢查的地方。 本發明的另一個方面涉及一種用於測量部件載體的物理特性的計算機程式，該計算機程式當正由處理器執行時，適於執行上述和下述方法的步驟。計算機可讀介質可以為硬盤、USB(通用串列總線)存儲設備、RAM(隨機存取存儲器)、ROM(只讀存儲器)、EPROM(可擦除可編程只讀存儲器)或閃速存儲器。計算機可讀介質還可以為數據通信網絡，例如因特網，其允許下載程式代碼。通常，計算機可讀介質可以為非暫時性介質或暫時性介質。 本發明的另一個方面可以為一種計算機可讀介質，其中存儲了這樣的計算機程式。例如，評價設備可以包括在其中執行計算機程式的處理器和在其中存儲計算機程式的存儲器。 本發明的另一個方面涉及一種用於測量部件載體的物理特性的測量系統。該測量系統可以為製造系統的一部分，該製造系統還可以包括電鍍設備、蝕刻設備和鑽孔設備中的至少一個。該製造系統還可以包括用於在這些設備之間輸送部件載體的輸送機系統。 根據本發明的一個實施例，該測量系統包括：評價設備，該評價設備用於在部件載體上確定多個測量區域；用於在每個測量區域中確定測量點；和測量設備，該測量設備用於執行物理特性的測量。多個測量區域中的至少一個和/或測量點基於部件載體的設計數據來確定，使得測量區域中的至少一個和/或測量點處於具有在設計數據中可獲得的至少一個預定義特徵的位置。 根據本發明的一個實施例，該測量設備包括用於確定部件載體的物理特性的特性傳感器，該特性傳感器可由諸如移動臂的移動裝置移動。如以上所提及的，可以以非破壞性方式和/或用以上提及的相應的傳感器執行測量。 根據本發明的一個實施例，該測量設備包括：工作臺，該工作臺用於放置部件載體；和對準裝置，該對準裝置用於在工作臺上對準部件載體；以及位置傳感器，該位置傳感器用於確定部件載體的定向點。 必須理解，如在上文中並在下文中描述的方法的特徵可以為如在上文中並在下文中描述的計算機程式、計算機可讀介質和製造系統的特徵，並且反之亦然。 本發明的這些和其他方面將從在下文中描述的實施例中顯而易見，並且參考在下文中描述的實施例被闡明。 More generally, other process parameters and/or physical properties may have to be checked and controlled during production of the component carrier, such as eg thickness of isolation layers, width of conductive paths, diameter of vias, depth of cavities. The object of the invention is to automate, speed up and improve the measurement of the physical properties of component carriers. This object is achieved by the subject-matter of the independent claims. Further exemplary embodiments are evident from the dependent claims and the following description. A first aspect of the invention relates to a method for measuring a physical property of a component carrier comprising at least one electrically isolating layer and at least one electrically conductive layer on the electrically isolating layer. A physical property may be a property of the component carrier that can be measured, such as the thickness, width or depth of portions of the electrically isolating and/or electrically conducting layers. As an example, the physical property may be the thickness of the conductive layer. The component carrier may be designed for electrically and/or mechanically interconnecting electronic and/or electrical components, such as resistors, capacitors, inductors, transistors, integrated circuits, and the like. The conductive pattern can be divided into conductive paths, which can be interconnected with vias between different layers. The component carrier may be a circuit board. The conductive layer can be formed by electroplating a metal onto the electrically isolating layer. The conductive layer can be patterned by etching. Vias may be formed by drilling holes through the component carrier and plating metal into the holes. According to one embodiment of the invention, the method comprises: determining a plurality of measurement areas on the component carrier; determining a measurement point in each measurement area; and performing (or at least ordering) a measurement of a physical property at each measurement point. The method can be carried out automatically by an evaluation device which controls and/or commands a measuring device which performs the measurements. The measurement area can be an area and/or area on the side of the component carrier. The measurement areas can be distributed around the component carrier so that measurements can be performed at approximately evenly distributed measurement points. This may mean that the measurement area is chosen such that the measurement points can be chosen such that they have a distance greater than the minimum distance and less than the maximum distance. At least one of the plurality of measurement areas and/or measurement points is determined based on the design data of the component carrier such that at least one of the measurement areas and/or measurement points is in a position with at least one predefined feature available in the design data . One, some or all of the measurement areas may be determined based on the design data of the component carrier such that the measurement areas are in positions with at least one predefined feature available and/or encoded in the design data. Design data may be data encoding the design of the component carrier. For example, design data may encode and/or describe the number and/or thickness of electrically isolating layers and/or conducting layers. In particular, design data may encode and/or describe the pattern and/or structure of the conductive layer. This may mean encoding and/or describing in the design data areas where metallic material is present and/or where metallic material has been etched away from the conductive layer. The design data may include points and/or CAD data defining edges between regions where metallic material is present in the conductive layer and regions where metallic material is not present in the conductive layer. The design data can describe and/or code vias and/or bores through the component carrier. Through-holes and/or boreholes may be coded and/or described by their position, depth, extension and/or diameter. Furthermore, the design data can describe and/or code where cavities are present in the component carrier. Such cavities may be adapted to accommodate electrical and/or electronic components. Design data may include points and/or CAD data defining the faces of the cavity. The component carrier can be manufactured automatically from the design data. The design data can be input into an electroplating apparatus which then electroplates a metal layer of the thickness as defined in the design data onto the electrically isolating layer. The design data may be input into an etching device which then etches the metal layer into patterns and/or structures such that the conductive layer is produced as defined in the design data. The design data may be input into a drilling apparatus that drills holes through the component carrier as defined in the design data. Design data may be input into the sawing device to generate cavities, such as defined in the design data. For example, the measurement region can be determined from the design data when the entire extension of the component carrier is coded and/or described in the design data. For example, the number of measurement areas can be fixed and the measurement areas can be distributed over the side of the component carrier. Alternatively and additionally, the measurement points can be determined on the basis of the design data of the component carrier such that the measurement points are at positions with at least one predefined feature available and/or coded in the design data. When the measurement areas are determined, a measurement point is searched in each measurement area. A measurement point may have at least one predefined characteristic available and/or encoded in the design data. Such predefined features may be where there is metallic material, no drilled holes, no cavities etc. on the component carrier. It is also possible that such predefined features could be the presence of boreholes and/or cavities. Typically, a predefined characteristic may be a property of the component carrier, wherein measurements can be performed without disturbing other properties of the component carrier. As an example, when the thickness measurement of the conductive layer is the measurement performed with the method, the at least one predefined feature comprises an area where metallic material is present and no vias are present below the metallic material. The evaluation device can scan the design data in the corresponding measurement area, irrespective of whether there are positions and/or areas with at least one predefined characteristic. When such a location is found, this location can be used as a measurement point. Finally, a measurement is performed at the measurement point. The evaluation device can control and/or command the measuring device to move the sensor to the measuring points and to perform a measurement at each measuring point. To this end, the measuring device may comprise an arm to which sensors are attached or more generally a mobile device. According to an embodiment of the present invention, the method further comprises: when no measurement point having at least one predefined characteristic is found in the measurement area, extending the measurement area and determining the measurement point in the extended measurement area. It is possible that, during scanning of the measurement points in the measurement area, no locations and/or regions are found in which there are all the at least one predefined feature available in the design data. The measurement area can then be extended by increasing its size. For example, the measurement area may be rectangular, and the sides of the rectangle may be elongated. As another example, the measurement area may be circular, and the diameter of the circle may be extended. According to one embodiment of the invention, a plurality of measurement points are determined in each measurement area. Each of these measurement points may have at least one predefined characteristic. Measurements can then be taken at each of these measurement points. In this way, the measurement results in the measurement areas can be compared with each other. According to one embodiment of the invention, the component carrier has a rectangular shape. The measurement area can be placed in the corners of the component carrier and/or the measurement area can be placed in the center of the component carrier. Measurements at all these measurement points can represent the physical properties of the complete component carrier. Typically, the measurement areas can be distributed evenly over the component carrier. According to one embodiment of the invention, the measurement area has a rectangular shape. Such shapes can easily be intersected with points in the design data in order to determine which part of the design data is relevant for the corresponding measurement area. However, other shapes such as circular shapes are also possible. According to one embodiment of the invention, the design data encodes at least one of the following: the extension of the conductive area provided by the parts of the conductive layer on the electrically isolating layer; the layer thickness of the conductive layer; passing through the component carrier The location of the drill holes for at least some of the layers. As already mentioned above, the design data can also be used to automatically manufacture the component carrier. According to one embodiment of the invention, the physical property is the layer thickness of the component carrier. The measurement may be a layer thickness measurement. The layer thickness may be the layer thickness of the surface layer and/or of other electrically conductive layers, such as layers below the surface layer. Using such measurements, it can be determined whether sufficient metallic material has been plated on the electrically isolating layer and/or whether the conductivity of the conducting layer is sufficiently high. According to one embodiment of the invention, the measurements are performed in a non-destructive manner. For example, the measurements may be based on at least one of eddy current measurements, inductance measurements and x-ray measurements. Corresponding sensors may be provided by a measuring device. According to one embodiment of the invention, the predefined feature available and/or encoded in the design data is, for example, a portion of the conductive layer surrounding the measurement point, which portion has an area larger than the minimum area. During scanning of the design data in the measurement area, an area of the conductive layer having at least a specific area may be searched. Such an area can guarantee a uniform thickness enabling thickness measurements to be performed. According to one embodiment of the invention, the predefined feature available and/or coded in the design data is a region and/or region of the component carrier, for example around a measuring point, which is free of drilled holes and/or free of through holes. The drilled holes and/or vias may interfere with thickness measurements of regions of the conductive layer above the drilled holes and/or vias. It must be noted that areas without drill holes and/or vias are not easy to find by visual inspection, as conductive layers can cover such features. Here, the method can significantly improve the measurements performed by the technician. According to an embodiment of the invention, the method further comprises: determining an orientation point of the component carrier, wherein the measurement point is determined relative to the orientation point. The measuring device may comprise means for determining corners or other orientation points of the component carrier. According to an embodiment of the invention, the method further comprises: determining an identifier of the component carrier by scanning at least a part of the component carrier; and determining design data based on the identifier. The identifier may be a computer readable code provided on the component carrier. This identifier can be scanned with the scanner of the measuring device. The evaluation device can be adapted to determine the design data of the component carrier with the corresponding identifier. For example, the link to the design data may be determined from the identifier and/or from a lookup table storing the identifier. According to one embodiment of the invention, the physical properties of a plurality of identically designed component carriers are measured, wherein measurement points are determined for a plurality of component carriers before the measurement is carried out for the plurality of component carriers. It is possible to process a plurality of identically designed component carriers with this method. In this case, the design data and/or the measurement areas and/or the measurement points can be determined only once, and the measurements can be carried out for each component carrier at the same measurement points. This can save computing power of the evaluation device and/or can increase the speed of the method. According to an embodiment of the invention, the method further comprises assessing the component carrier as faulty when the measurement of the physical property at the measurement point is outside predefined boundaries. The method can be used to distinguish between component carriers that have desired physical properties, ie within desired boundaries, and component carriers that have physical properties that are outside these boundaries and are then considered faulty. For example, a component carrier whose thickness of the conductive layer is thinner than a minimum thickness or thicker than a maximum thickness in at least one measurement point may be considered to be faulty. According to one embodiment of the invention, component carriers assessed as faulty are automatically removed from further manufacture. It is further possible to manufacture component carriers in which the measured physical properties stay within boundaries. Additional component carriers can be removed from automated manufacturing. For example, a conveyor device or robot may transport component carriers rated as fault-free to the next manufacturing facility, whereas component carriers rated as faulty may be transported where they can be inspected by a technician. Another aspect of the invention relates to a computer program for measuring physical properties of a component carrier, which computer program, when being executed by a processor, is adapted to carry out the steps of the methods described above and below. The computer readable medium can be a hard disk, a USB (Universal Serial Bus) storage device, RAM (Random Access Memory), ROM (Read Only Memory), EPROM (Erasable Programmable Read Only Memory), or flash memory. The computer readable medium can also be a data communication network, such as the Internet, which allows program code to be downloaded. In general, computer readable media can be either non-transitory or transitory. Another aspect of the present invention may be a computer readable medium in which such a computer program is stored. For example, an evaluation device may comprise a processor in which a computer program is executed and a memory in which the computer program is stored. Another aspect of the invention relates to a measurement system for measuring a physical characteristic of a component carrier. The measurement system may be part of a manufacturing system, which may also include at least one of plating equipment, etching equipment, and drilling equipment. The manufacturing system may also include a conveyor system for transporting component carriers between the devices. According to one embodiment of the invention, the measurement system comprises: an evaluation device for determining a plurality of measurement areas on a component carrier; for determining a measurement point in each measurement area; and a measurement device for Used to perform measurements of physical properties. At least one of the plurality of measurement areas and/or measurement points is determined based on the design data of the component carrier such that at least one of the measurement areas and/or measurement points is in a position with at least one predefined feature available in the design data . According to one embodiment of the invention, the measuring device comprises a property sensor for determining a physical property of the component carrier, the property sensor being movable by moving means, such as a moving arm. As mentioned above, the measurements may be performed in a non-destructive manner and/or with the corresponding sensors mentioned above. According to an embodiment of the present invention, the measuring device comprises: a workbench for placing a component carrier; and an alignment device for aligning the component carrier on the workbench; and a position sensor, the Position sensors are used to determine the orientation point of the component carrier. It has to be understood that features of the method as described above and hereinafter may be features of the computer program, computer readable medium and manufacturing system as described above and hereinafter, and vice versa. These and other aspects of the invention will be apparent from and elucidated with reference to the embodiments described hereinafter.

附圖中使用的附圖標記及其含義被以摘要形式列舉在附圖標記的列表中。原則上，在圖中相同的部分設有相同的附圖標記。 圖1示出部件載體10的橫截面視圖，該部件載體由以下各項組成：電隔離層12，其可以由塑膠材料製成；和導電層14，其可以由諸如銅的金屬材料製成。導電層14和電隔離層12被構造。導電層14被圖案化和/或構造為形成導電路徑16。不同層14的導電路徑16可以與通孔18(即穿過一個或多個電隔離層12的用金屬材料填充的孔20)互連。此外，電隔離層12和/或導電層14中的一個或多個可以被構造為具有空腔22。 導電層14的形成和構造可以通過電鍍和/或蝕刻來完成。電隔離層12的構造可以通過鑽孔和/或鋸切來完成。 部件載體10(其也可以被視為電路板)可以被用於機械地和電力地互連電氣部件和電子部件，這些電氣部件和電子部件可以被焊接和/或以其他方式附連到部件載體10。 為了測試部件載體10的生產過程是否成功，可以測量部件載體10的具體物理特性24、24a、24b、24c，諸如層厚度24a、空腔22的深度24b、導電路徑的寬度24c等。這不限於部件載體10的表面層，而且可以針對內層做這個。一個層堆疊並且我們將測量銅層的厚度。許多其他物理特性是可能的，並且只出於示例的目的列舉先前的物理特性。然而，為了測量這些特性，在部件載體上找到能夠最準確地進行這些測量的地方可以是有益的，因為測量可能受到部件載體10的其他部分幹擾。例如，用於金屬層12的層厚度24a的良好測量位置即位置26可以是有益的，因為在那裡，通過通孔18對測量的幹擾是不可能的。 圖2示意性地示出製造系統28，其中能夠自動地執行這樣的測量以便通過系統28控制過程流程。 製造系統28包括電鍍設備30、蝕刻設備32、鑽孔設備34、鋸切設備36、測量設備38和輸送機系統40。並非所有這些設備都需要為製造系統28的一部分。利用設備28、30、32、34、36，能夠製造部件載體10，諸如圖1所示的部件載體。利用測量設備38，能夠進行這些如以上所提及的用於檢查部件載體10的物理特性24的測量。輸送機系統40被適配用於在製造過程的不同階段中在不同設備28-38之間自動地輸送部件載體10。 製造系統28包括控制系統42，該控制系統可以包括中央部件44和本地部件46，諸如測量設備38的控制器46a。控制器46a任選地中央部件44和測量設備38可以形成製造系統28的測量子系統48。 圖3示出用於測量子系統48和製造系統28的測量設備38的頂視圖。測量設備38具有輸送機系統40可以將部件載體10放置到上面的工作臺50。對準裝置52(例如推動器)可以使部件載體10相對於移動裝置53(諸如臂)對準，該移動裝置被適配用於如通過箭頭所指示的那樣將部件載體上方的特性傳感器54移動到期望的測量位置26。特性傳感器54可以為非破壞性傳感器，其例如基於渦電流測量、電感測量和/或x射線測量來執行測量。 測量設備38可以包括位置傳感器56，其被適配用於確定部件載體10的定向點58，諸如拐角。定向點58可以被用於找到已由測量設備38確定的測量點26。例如，位置傳感器56可以執行用於確定定向點58的超聲距離測量。 此外，測量設備38可以包括用於掃描設置在部件載體10上的標識符62的掃描儀60。由標識符62提供的機器可讀代碼可以被用於標識部件載體10的類型和/或設計，據此確定測量點26。 圖4示出圖示可以由製造系統28自動地執行的方法的流程圖。 在步驟S10中，製造部件載體10。電隔離層12可以由輸送機系統40輸送到電鍍設備30中，該電鍍設備將一個或兩個導電層14電鍍到電隔離層12上。輸送機系統40將部件載體10的已形成的部分輸送到電鍍設備32，該電鍍設備然後將經電鍍的導電層14構造和/或構圖成導電路徑16。可能的是，鑽孔20和/或空腔22以前由部分地製造的部件載體10以前由輸送機系統40輸送到的鑽孔設備34和/或鋸切設備36形成。可以重複步驟S12中的不同生產步驟若干次，直到已形成完整部件載體10為止。 為了製造部件載體10，使用設計數據64。設計數據64可以被存儲在數據庫中和/或在檔中，例如在控制系統的中央部件44中，並且可以被分發到本地部件46，這些本地部件可以經由通信網絡控制製造設備30-36。 可以將以下步驟S12和S14視為用於測量部件載體10的物理特性24的測量方法。該測量方法可以由測量設備38的控制器46a任選地與製造系統28的中央部件44一起執行。可以將執行該方法的控制器46a和中央部件44的各部分和/或模塊視為評價設備66。 圖5A至圖5E示出部件載體10和在如將在下面描述的方法期間生成的具體數據。如圖5A所示，部件載體10具有矩形形狀。定向點58可以為部件載體10的預定拐角，該定向點58可以由位置傳感器56標識。 圖5B示出可以借助於定向點58針對部件載體10確定坐標系X、Y。利用此坐標系X、Y，還可以定義部件載體10的中心68。如圖5C所示，基於坐標系X、Y能夠選擇部件載體10的拐角中的Y區域70，能夠定義哪些區域被用於定義，諸如矩形測量區域72。 如圖5D所示，這些測量區域72可以比區域70小並且/或者可以延長到較大的測量區域74，如將在下面描述的。還可能的是，在部件載體10的中心68處定義另一個測量區域72(其也可以延長)。 在圖5E中，附加地圖示了設計數據64以及部件載體10。 設計數據64可以對導電層14的圖案和/或結構76進行編碼。此外，設計數據64可以對鑽孔20的位置78和空腔22的位置80進行編碼。在上面並在下面列舉了被編碼到設計數據64中的資訊的進一步示例，諸如由電隔離層12上的導電層14的各部分提供的導電區域的延長部、導電層14的層厚度和/或穿過部件載體10的導電層14和/或電隔離層12中的至少一些的鑽孔20的位置。 返回到圖4，在步驟S12中，根據設計數據64確定測量區域72和在這些測量區域72內部的測量點26。例如，測量區域72可以通過首先在拐角中確定區域70並然後通過在區域70內部確定較小的測量區域72來確定。這可以通過評價設計數據66來完成，使得根據設計數據64將測量區域72定位為具有至少一個預定義特徵。 例如，當相應的部件載體10已到達測量設備38時，可以針對每一部件載體10執行步驟S12。例如，測量設備38可以通過用掃描儀60掃描部件載體10的至少一部分來確定部件載體10的標識符62。然後可以根據標識符62確定設計數據64。例如，用於多種不同類型的部件載體10的設計數據64可以被存儲在例如由中央部件44提供的數據庫中。根據標識符62，可以確定部件載體10的類型，並且由此可以收集這種類型的設計數據64並將其發送到評價設備74。 還可能的是，在針對多個部件載體10執行測量之前針對多個同樣地設計的部件載體10一次確定測量區域72和測量點26。例如，可以針對具體類型的部件載體10定制測量設備38或者只針對已到達測量設備38的具體類型的第一部件載體10執行計算。在這種情況下，可以相對於該類型的部件載體10將測量區域72和測量點26存儲在評價設備66中。 可以以以下方式確定部件載體10上的測量區域72： 評價設備66可以根據設計數據64確定部件載體10的外形和尺寸。例如，部件載體10具有帶具體邊界長度的矩形形狀。根據部件載體10的外形和尺寸，評價設備66確定測量區域72的位置，這些測量區域例如被放置在部件載體10的拐角中並且/或者測量區域72被放置在部件載體10的中心(參見圖5A至圖5D)。 測量區域72可以具有相同的形狀，諸如矩形形狀，並且/或者可以具有相同的尺寸。可以將測量區域72的邊界長度選取為介於部件載體10的邊界長度的10%和20%之間。例如，測量區域72的邊界長度可以為10 cm×10 cm。此外，可以將拐角處的測量區域72定位為到部件載體10的邊界具有具體距離，諸如5 cm。 可以以以下方式確定測量區域72中的每個測量點26： 通常，可以根據與測量區域72相關聯的部件載體10的設計數據64確定每個測量區域72中的測量點26，使得測量點26處於具有在設計數據64中可獲得的至少一個預定義特徵的位置。 設計數據64包括關於部件載體10的相應部分和/或部件的位置的資訊。例如，導電層14的結構66的佈局可以包括定義結構66的邊界的點和線。此外，鑽孔和/或要鋸切的空腔的位置和/或延長部可以被存儲在設計數據中。關於位置的這種資訊可以被用於確定在設計數據64中定義的部分和/或部件是否在測量區域72中。 測量區域72中的部分和/或部件然後可以由評價設備66針對預定義特徵進行掃描。可以選擇預定義特徵，使得具體測量被促進和/或從那裡的預定義特徵中受益。 例如，在設計數據64中可獲得的預定義特徵可以為圍繞電位測量點26的導電層14的一部分。預定義特徵可以為外導電層14的具有大於最小區域的區域的一部分。這樣的最小區域可以為尺寸12 mm×19 mm的矩形區域。 作為另一個示例，在設計數據64中可獲得的預定義特徵可以為部件載體10的圍繞電位測量點26的區，該區沒有鑽孔20和/或沒有通孔18。例如，預定義特徵可以為部件載體10的在最小區域下面沒有鑽孔20和/或通孔18的區，例如如以上所提及的。 然後可以選擇測量點26作為已在設計數據64中找到所有預定義特徵的位置和/或點。 可能的是在每個測量區域72中確定多個測量點26。可能的是然後將所有這些測量點26稍後用於測量。還可能的是從多個(潛在)測量點26中選擇一個測量點26，這很可能產生最好測量。例如，這樣的測量點26可以具有導電層14的在下面沒有鑽孔20和/或通孔18的最大區域。 當在具有期望的預定義特徵的測量區域72中未找到測量點26時，可以延長測量區域72，從而產生延長的測量區域74，並且可以在經延長的測量區域74中搜索測量點26。例如，可以將測量區域72的邊界長度放大具體倍數，諸如1.5。可能的是重複測量區域72的延長部，直到找到測量點26為止。 在步驟S16中，用測量設備38執行對每個測量點26處的物理特性24的測量。為此，可能必須通過輸送機系統40將部件載體10輸送到測量設備38的工作臺50上。部件載體10可以由對準裝置52對準。可以確定部件載體10的定向點58，使得相對於定向點58確定測量點26。 特性傳感器54被移動到測量點26並在那裡執行測量。如已經提及的，可以以非破壞性方式執行測量。例如，當測量是表面層厚度測量時，該測量可以基於渦電流測量、電感測量和x射線測量中的至少一個。在這種情況下，物理特性可以為部件載體10的表面層14的表面層厚度25a。測量可以被存儲在測量數據82中，該測量數據可以被用於進一步控制製造過程。 例如，測量數據82可以被用於質量檢查用製造系統28生產的部件載體10。 為此，在步驟S16中，判定了應該如何進一步處理部件載體10。當測量點26處的物理特性24的測量在預定義邊界之外時，可以將部件載體10評定為有故障的。例如，僅具有在預定義邊界內的表面層厚度25a的部件載體10可以由輸送機系統40輸送到另一個生產步驟。 否則，可以將被評定為有故障的部件載體10從進一步製造中自動地移除。在這種情況下，輸送機系統40可以將已被評定為有故障的相應的部件載體10輸送到能夠人工地檢查或丟棄它的地方。 雖然已在附圖和前面的描述中詳細地圖示和描述了本發明，但是此類圖示和描述將被認為是說明性或示例性的，而不是限制性的；本發明不限於所公開的實施例。根據對附圖、公開內容和所附權利要求的研究，所公開的實施例的其他變型能夠由本領域的技術人員並通過實踐所要求保護的發明來理解和實現。在權利要求中，單詞“包括”不排除其他元件或步驟，並且不定冠詞“一”或“一個”不排除多個。單個處理器或控制器或其他單元可以履行權利要求中記載的若干項目的功能。在相互相同的從屬權利要求中記載某些措施的唯一事實不表明這些措施的組合不能用於處於優勢。不應該將權利要求中的任何附圖標記解釋為限制範圍。 The reference symbols used in the drawings and their meanings are listed in the list of reference symbols in summary form. In principle, identical parts are provided with the same reference symbols in the figures. Figure 1 shows a cross-sectional view of a component carrier 10 consisting of an electrically isolating layer 12, which may be made of a plastic material, and an electrically conductive layer 14, which may be made of a metallic material such as copper. The electrically conductive layer 14 and the electrically isolating layer 12 are structured. Conductive layer 14 is patterned and/or structured to form conductive paths 16 . The conductive paths 16 of the different layers 14 may be interconnected with vias 18 (ie, holes 20 filled with a metallic material through one or more electrically isolating layers 12 ). Additionally, one or more of the electrically isolating layer 12 and/or the electrically conductive layer 14 may be configured with a cavity 22 . Formation and structuring of the conductive layer 14 may be accomplished by electroplating and/or etching. The structuring of the electrical isolation layer 12 can be done by drilling and/or sawing. The component carrier 10 (which may also be considered a circuit board) may be used to mechanically and electrically interconnect electrical and electronic components, which may be soldered and/or otherwise attached to the component carrier 10. In order to test whether the production process of the component carrier 10 was successful, specific physical properties 24, 24a, 24b, 24c of the component carrier 10 may be measured, such as layer thickness 24a, depth 24b of the cavity 22, width 24c of the conductive path, etc. This is not limited to surface layers of the component carrier 10 , but it can be done for inner layers. A layer stack and we will measure the thickness of the copper layer. Many other physical properties are possible, and the previous physical properties are listed for example purposes only. However, to measure these properties, it may be beneficial to find a place on the component carrier where these measurements can be made most accurately, since the measurements may be disturbed by other parts of the component carrier 10 . For example, a good measurement location for the layer thickness 24 a of the metal layer 12 , the location 26 , can be advantageous, since there no disturbance of the measurement by the via 18 is possible. FIG. 2 schematically shows a manufacturing system 28 in which such measurements can be performed automatically in order to control the process flow through the system 28 . Manufacturing system 28 includes plating equipment 30 , etching equipment 32 , drilling equipment 34 , sawing equipment 36 , measuring equipment 38 , and conveyor system 40 . Not all of these devices need be part of manufacturing system 28 . With the devices 28 , 30 , 32 , 34 , 36 a component carrier 10 , such as the component carrier shown in FIG. 1 , can be manufactured. With the measuring device 38 these measurements, as mentioned above, for checking the physical properties 24 of the component carrier 10 can be carried out. The conveyor system 40 is adapted to automatically transport the component carriers 10 between the different devices 28-38 at different stages of the manufacturing process. The manufacturing system 28 includes a control system 42 that may include a central component 44 and local components 46 , such as a controller 46 a of the measurement device 38 . Controller 46 a and optionally central component 44 and measurement device 38 may form measurement subsystem 48 of manufacturing system 28 . FIG. 3 shows a top view of measurement equipment 38 for measurement subsystem 48 and manufacturing system 28 . The measuring device 38 has a table 50 onto which a conveyor system 40 can deposit the component carrier 10 . Alignment means 52 (eg pushers) may align the component carrier 10 with respect to moving means 53 (such as an arm) adapted to move the characteristic sensor 54 above the component carrier as indicated by the arrow to the desired measurement location 26 . The characteristic sensor 54 may be a non-destructive sensor that performs measurements based on eddy current measurements, inductance measurements and/or x-ray measurements, for example. The measuring device 38 may comprise a position sensor 56 adapted to determine an orientation point 58 of the component carrier 10 , such as a corner. The orientation point 58 can be used to find the measurement point 26 that has been determined by the measurement device 38 . For example, position sensor 56 may perform ultrasonic distance measurements for determining orientation point 58 . Furthermore, the measuring device 38 may comprise a scanner 60 for scanning an identifier 62 arranged on the component carrier 10 . The machine-readable code provided by the identifier 62 may be used to identify the type and/or design of the component carrier 10 from which the measurement point 26 is determined. FIG. 4 shows a flowchart illustrating a method that may be automatically performed by the manufacturing system 28 . In step S10 , the component carrier 10 is produced. Electrically isolating layer 12 may be conveyed by conveyor system 40 into electroplating apparatus 30 , which electroplates one or two conductive layers 14 onto electrically isolating layer 12 . Conveyor system 40 conveys the formed portion of component carrier 10 to electroplating apparatus 32 , which then structures and/or patterns electroplated conductive layer 14 into conductive paths 16 . It is possible that the bore holes 20 and/or the cavities 22 were previously formed by the drilling device 34 and/or the sawing device 36 to which the partially manufactured component carrier 10 was previously transported by the conveyor system 40 . The different production steps in step S12 may be repeated several times until a complete component carrier 10 has been formed. For producing the component carrier 10 , the design data 64 are used. Design data 64 may be stored in a database and/or archived, eg, in central component 44 of the control system, and may be distributed to local components 46, which may control manufacturing devices 30-36 via a communications network. The following steps S12 and S14 can be considered as a measurement method for measuring the physical property 24 of the component carrier 10 . The measuring method can be executed by the controller 46 a of the measuring device 38 optionally together with the central component 44 of the manufacturing system 28 . The controller 46 a and the individual parts and/or modules of the central part 44 carrying out the method can be considered as evaluation device 66 . 5A to 5E show the component carrier 10 and specific data generated during the method as will be described below. As shown in FIG. 5A , the component carrier 10 has a rectangular shape. The orientation point 58 may be a predetermined corner of the component carrier 10 , which orientation point 58 may be identified by the position sensor 56 . FIG. 5B shows that a coordinate system X, Y can be determined for the component carrier 10 by means of an orientation point 58 . With this coordinate system X, Y it is also possible to define the center 68 of the component carrier 10 . As shown in FIG. 5C , based on the coordinate system X,Y the Y area 70 in the corner of the component carrier 10 can be selected, which areas are used for definition, such as a rectangular measurement area 72 . As shown in Figure 5D, these measurement areas 72 may be smaller than areas 70 and/or may be extended to a larger measurement area 74, as will be described below. It is also possible to define a further measurement region 72 (which can also be extended) at the center 68 of the component carrier 10 . In FIG. 5E the design data 64 and the component carrier 10 are additionally illustrated. Design data 64 may encode a pattern and/or structure 76 of conductive layer 14 . Additionally, the design data 64 may encode the location 78 of the borehole 20 and the location 80 of the cavity 22 . Listed above and below are further examples of information encoded into the design data 64, such as the extension of the conductive area provided by the portions of the conductive layer 14 on the electrically isolating layer 12, the layer thickness of the conductive layer 14 and/or Or the location of the drill holes 20 through at least some of the electrically conductive layer 14 and/or the electrically isolating layer 12 of the component carrier 10 . Returning to FIG. 4 , in step S12 , the measurement areas 72 and the measurement points 26 inside these measurement areas 72 are determined based on the design data 64 . For example, the measurement area 72 can be determined by first determining the area 70 in the corner and then by determining the smaller measurement area 72 inside the area 70 . This can be done by evaluating the design data 66 such that the measurement region 72 is located as having at least one predefined characteristic according to the design data 64 . For example, step S12 may be carried out for each component carrier 10 when the respective component carrier 10 has arrived at the measuring device 38 . For example, measurement device 38 may determine identifier 62 of component carrier 10 by scanning at least a portion of component carrier 10 with scanner 60 . The design data 64 can then be determined from the identifier 62 . For example, design data 64 for several different types of component carriers 10 may be stored in a database, eg provided by the central component 44 . Based on the identifier 62 , the type of component carrier 10 can be determined and thus design data 64 of this type can be collected and sent to an evaluation device 74 . It is also possible to determine the measurement area 72 and the measurement points 26 once for a plurality of identically designed component carriers 10 before carrying out the measurement for a plurality of component carriers 10 . For example, the measurement device 38 may be customized for a specific type of component carrier 10 or the calculation may only be performed for a specific type of first component carrier 10 that has arrived at the measurement device 38 . In this case, measurement regions 72 and measurement points 26 can be stored in evaluation device 66 relative to a component carrier 10 of this type. The measurement area 72 on the component carrier 10 can be determined in the following manner: The evaluation device 66 can determine the shape and dimensions of the component carrier 10 on the basis of the design data 64 . For example, the component carrier 10 has a rectangular shape with specific border lengths. Depending on the shape and dimensions of the component carrier 10, the evaluation device 66 determines the position of the measurement areas 72, which are placed, for example, in the corners of the component carrier 10 and/or the measurement area 72 is placed in the center of the component carrier 10 (see FIG. 5A to Figure 5D). The measurement areas 72 may have the same shape, such as a rectangular shape, and/or may have the same size. The boundary length of the measurement region 72 can be chosen to be between 10% and 20% of the boundary length of the component carrier 10 . For example, the boundary length of the measurement area 72 may be 10 cm x 10 cm. Furthermore, the measurement areas 72 at the corners can be positioned at a specific distance, such as 5 cm, from the border of the component carrier 10 . Each measurement point 26 in the measurement area 72 can be determined in the following manner: Generally, the measurement points 26 in each measurement area 72 can be determined from the design data 64 of the component carrier 10 associated with the measurement areas 72 such that the measurement points 26 are in a position having at least one predefined characteristic available in the design data 64 . Location. The design data 64 comprise information about the position of the corresponding parts and/or components of the component carrier 10 . For example, the layout of structures 66 of conductive layer 14 may include points and lines that define the boundaries of structures 66 . Furthermore, the positions and/or extensions of boreholes and/or cavities to be sawed can be stored in the design data. This information about location may be used to determine whether parts and/or components defined in design data 64 are within measurement area 72 . Portions and/or components in the measurement area 72 may then be scanned by the evaluation device 66 for predefined features. Predefined features can be selected such that specific measurements are facilitated and/or benefit from there predefined features. For example, a predefined feature available in the design data 64 may be a portion of the conductive layer 14 surrounding the potential measurement point 26 . The predefined feature may be a portion of the outer conductive layer 14 having an area larger than the minimum area. Such a minimum area may be a rectangular area with dimensions 12 mm x 19 mm. As another example, a predefined feature available in the design data 64 may be a region of the component carrier 10 surrounding the potential measuring point 26 , which region is free of drilled holes 20 and/or free of through holes 18 . For example, a predefined feature may be a region of the component carrier 10 that has no drill holes 20 and/or through holes 18 below the minimum area, eg as mentioned above. Measurement points 26 may then be selected as locations and/or points where all predefined features have been found in design data 64 . It is possible to determine a plurality of measurement points 26 in each measurement area 72 . It is possible then to use all these measuring points 26 later for the measurement. It is also possible to select a measurement point 26 from a plurality of (potential) measurement points 26, which is likely to result in the best measurement. For example, such a measuring point 26 may have the largest area of the electrically conductive layer 14 that is free of drill holes 20 and/or vias 18 underneath. When no measurement point 26 is found in the measurement area 72 with the desired predefined characteristics, the measurement area 72 may be extended, resulting in an extended measurement area 74 , and the measurement point 26 may be searched in the extended measurement area 74 . For example, the boundary length of the measurement area 72 may be enlarged by a specific factor, such as 1.5. It is possible to repeat the measurement of the extension of the area 72 until the measurement point 26 is found. In step S16 , a measurement of the physical property 24 at each measurement point 26 is performed with the measuring device 38 . For this purpose, it may be necessary to transport the component carrier 10 via the conveyor system 40 onto the table 50 of the measuring device 38 . The component carrier 10 can be aligned by an alignment device 52 . An orientation point 58 of the component carrier 10 can be determined such that the measurement point 26 is determined relative to the orientation point 58 . The characteristic sensor 54 is moved to the measuring point 26 and the measurement is performed there. As already mentioned, the measurements can be performed in a non-destructive manner. For example, when the measurement is a surface layer thickness measurement, the measurement may be based on at least one of eddy current measurements, inductance measurements and x-ray measurements. In this case, the physical property may be the surface layer thickness 25 a of the surface layer 14 of the component carrier 10 . The measurements may be stored in measurement data 82, which may be used to further control the manufacturing process. For example, the measurement data 82 can be used for quality inspection of the component carrier 10 produced by the manufacturing system 28 . For this purpose, in step S16 it is determined how the component carrier 10 should be processed further. The component carrier 10 may be assessed as faulty when the measurement of the physical property 24 at the measurement point 26 is outside predefined boundaries. For example, component carriers 10 that only have a surface layer thickness 25a within predefined boundaries can be conveyed by the conveyor system 40 to another production step. Otherwise, the component carrier 10 assessed as defective can be automatically removed from further production. In this case, the conveyor system 40 can transport the respective component carrier 10 that has been assessed as faulty to where it can be manually inspected or discarded. While the invention has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive; the invention is not limited to the disclosed the embodiment. Other variations to the disclosed embodiments can be understood and effected by those skilled in the art and by practicing the claimed invention, from a study of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality. A single processor or controller or other unit may fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually identical dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope.

10:部件載體 12:電隔離層 14:導電層 16:導電路徑 18:通孔 20:孔 22:空腔 24:物理特性 24a:層厚度 24b:深度 24c:寬度 26:測量位置 28:製造系統 30:電鍍設備 32:蝕刻設備 34:鑽孔設備 36:鋸切設備 38:測量設備 40:輸送機系統 42:控制系統 44:中央部件 46:本地部件 46a:測量設備的控制器 48:測量系統 50:工作臺 52:對準裝置 53:移動裝置 54:特性傳感器 56:位置傳感器 58:定向點 60:掃描儀 62:標識符 64:設計數據 66:評價設備 68:中心 X,Y:坐標系的軸線 70:部件載體上的區域 72:測量區域 74:延長的測量區域 76:結構 78:鑽孔的位置 80:空腔的位置 82:測量數據 10: Part carrier 12: Electric isolation layer 14: Conductive layer 16: Conductive path 18: Through hole 20: hole 22: cavity 24:Physical characteristics 24a: layer thickness 24b: Depth 24c: width 26: Measurement position 28: Manufacturing System 30: Electroplating equipment 32: Etching equipment 34:Drilling equipment 36: Sawing equipment 38: Measuring equipment 40: Conveyor system 42: Control system 44: central part 46:Local components 46a: Controllers for measuring equipment 48:Measuring system 50:Workbench 52: Alignment device 53:Mobile device 54:Characteristic sensor 56: Position sensor 58: Orientation point 60:Scanner 62: identifier 64: Design data 66: Evaluating Equipment 68: center X, Y: axis of the coordinate system 70:Area on component carrier 72: Measurement area 74: Extended measurement area 76: Structure 78: Drilling position 80: Position of cavity 82: Measurement data

[圖1]示出部件載體的示意性橫截面視圖。 [圖2]示意性地示出根據本發明的一個實施例的具有測量系統的製造系統。 [圖3]示出根據本發明的一個實施例的到用於測量系統的測量設備上的示意性頂視圖。 [圖4]示出圖示根據本發明的一個實施例的方法的流程圖。 [圖5A]至[圖5E]示出圖示在根據本發明的一個實施例的方法中使用的測量區域和設計數據的圖。 [ Fig. 1 ] A schematic cross-sectional view showing a component carrier. [ Fig. 2 ] Schematically shows a manufacturing system with a measurement system according to one embodiment of the present invention. [ Fig. 3 ] Shows a schematic top view onto a measuring device for a measuring system according to one embodiment of the present invention. [ Fig. 4 ] Shows a flowchart illustrating a method according to one embodiment of the present invention. [ FIG. 5A ] to [ FIG. 5E ] show diagrams illustrating measurement regions and design data used in a method according to one embodiment of the present invention.

10:部件載體 10: Part carrier

20:孔 20: hole

22:空腔 22: cavity

26:測量位置 26: Measurement position

58:定向點 58: Orientation point

64:設計數據 64: Design data

72:測量區域 72: Measurement area

76:結構 76: Structure

78:鑽孔的位置 78: Drilling position

80:空腔的位置 80: Position of cavity

Y:坐標系的軸線 Y: axis of the coordinate system

Claims (16)

一種用於測量部件載體(10)的物理特性(24)的方法，所述部件載體(10)包括至少一個電隔離層(12)和在所述電隔離層(12)上的至少一個導電層(14)， 所述方法包括： 在所述部件載體(10)上確定多個測量區域(72)； 在每個測量區域(72)中確定測量點(26)； 在每個測量點(26)處執行所述物理特性(24)的測量； 其中，基於所述部件載體(10)的設計數據(64)來確定所述多個測量區域(72)中的至少一個和/或所述測量點(26)，使得所述測量區域(72)中的所述至少一個和/或所述測量點(26)處於具有在所述設計數據(64)中可獲得的至少一個預定義特徵的位置。 A method for measuring a physical property (24) of a component carrier (10) comprising at least one electrically insulating layer (12) and at least one electrically conductive layer on said electrically insulating layer (12) (14), The methods include: defining a plurality of measurement areas (72) on said component carrier (10); determining measurement points (26) in each measurement area (72); performing a measurement of said physical property (24) at each measurement point (26); wherein at least one of the plurality of measurement areas (72) and/or the measurement points (26) is determined based on design data (64) of the component carrier (10), such that the measurement area (72) Said at least one of and/or said measuring point (26) is at a location having at least one predefined characteristic available in said design data (64). 根據請求項1所述的方法， 其中，在每個測量區域(72)中確定多個測量點(26)。 According to the method described in claim 1, Therein, a plurality of measurement points (26) are determined in each measurement area (72). 根據請求項1所述的方法， 其中，所述設計資料(64)對以下中的至少一個進行編碼： 由在電隔離層(12)上的導電層(14)的各部分提供的導電區域的延長部； 導電層(14)的層厚度； 穿過所述部件載體(10)的所述導電層(14)和/或所述電隔離層(12)中的至少一些的鑽孔(20)的位置。 According to the method described in claim 1, Wherein, the design data (64) encodes at least one of the following: continuations of the conductive areas provided by portions of the conductive layer (14) on the electrically isolating layer (12); layer thickness of the conductive layer (14); Location of drilled holes (20) through at least some of said electrically conductive layer (14) and/or said electrically isolating layer (12) of said component carrier (10). 根據請求項1所述的方法， 其中，所述物理特性是所述部件載體(10)的層厚度(25a)； 其中，所述測量是層厚度測量。 According to the method described in claim 1, wherein said physical property is the layer thickness (25a) of said component carrier (10); Therein, the measurement is a layer thickness measurement. 根據請求項1所述的所述的方法， 其中，以非破壞性方式執行所述測量。 According to the method described in claim 1, Therein, the measurement is performed in a non-destructive manner. 根據請求項1所述的方法， 其中，在所述設計數據(64)中可獲得的預定義特徵是導電層(14)的一部分，所述部分具有大於最小區域的區域。 According to the method described in claim 1, Wherein the predefined feature available in said design data (64) is a portion of the conductive layer (14), said portion having an area larger than a minimum area. 根據請求項1所述的方法， 其中，在所述設計資料(64)中可獲得的預定義特徵是所述部件載體(10)的沒有鑽孔(20)和/或沒有通孔(18)的區。 According to the method described in claim 1, In this case, the predefined features available in the design data (64) are regions of the component carrier (10) which are free of drilled holes (20) and/or free of through-holes (18). 根據請求項1所述的方法，還包括： 確定所述部件載體(10)的定向點(58)，其中，相對於所述定向點(58)來確定所述測量點(26)。 According to the method described in claim item 1, further comprising: An orientation point (58) of the component carrier (10) is determined, wherein the measurement point (26) is determined relative to the orientation point (58). 根據請求項1所述的方法，還包括： 通過掃描所述部件載體(10)的至少一部分來確定所述部件載體(10)的識別字(62)； 根據所述識別字(62)來確定所述設計資料。 According to the method described in claim item 1, further comprising: determining an identifier (62) of the component carrier (10) by scanning at least a portion of the component carrier (10); The design data is determined according to the identification word (62). 根據請求項1所述的方法，還包括： 其中，測量多個同樣地設計的部件載體(10)的物理特性(24)； 其中，在針對所述多個部件載體(10)執行所述測量之前，針對所述多個部件載體(10)來確定所述測量點(26)。 According to the method described in claim item 1, further comprising: wherein the physical properties (24) of a plurality of identically designed component carriers (10) are measured; Therein, the measurement points (26) are determined for the plurality of component carriers (10) before the measurement is carried out for the plurality of component carriers (10). 根據請求項1所述的方法，還包括： 當在測量點(26)處的所述物理特性(24)的所述測量在預定義邊界之外時，將所述部件載體(10)評定為有故障的； 從進一步製造中自動地移除被評定為有故障的部件載體(10)。 According to the method described in claim item 1, further comprising: assessing said component carrier (10) as faulty when said measurement of said physical property (24) at a measurement point (26) is outside predefined boundaries; Component carriers ( 10 ) rated as defective are automatically removed from further production. 一種用於測量部件載體(10)的物理特性(24)的計算機程式，當由處理器執行時，所述計算機程式適於執行根據請求項1所述的方法的步驟。A computer program for measuring physical properties (24) of a component carrier (10), said computer program being adapted to perform the steps of the method according to claim 1 when executed by a processor. 一種計算機可讀介質，在所述計算機可讀介質中存儲根據請求項12所述的計算機程式。A computer readable medium in which the computer program according to claim 12 is stored. 一種用於測量部件載體(10)的物理特性(24)的測量系統(48)，其中，所述測量系統包括： 評價設備(66)，所述評價設備(66)用於在所述部件載體(10)上確定多個測量區域(72)；用於在每個測量區域(72)中確定測量點(26)；以及 測量設備(38)，所述測量設備(38)用於執行所述物理特性的所述測量； 其中，基於所述部件載體(10)的設計數據(64)來確定所述多個測量區域(72)中的至少一個和/或所述測量點(26)，使得所述測量區域(72)中的所述至少一個和/或所述測量點(26)處於具有在所述設計數據(64)中可獲得的至少一個預定義特徵的位置。 A measurement system (48) for measuring a physical property (24) of a component carrier (10), wherein the measurement system comprises: An evaluation device (66) for determining a plurality of measurement areas (72) on the component carrier (10); for determining a measurement point (26) in each measurement area (72) ;as well as a measuring device (38) for performing said measuring of said physical property; wherein at least one of the plurality of measurement areas (72) and/or the measurement points (26) is determined based on design data (64) of the component carrier (10), such that the measurement area (72) Said at least one of and/or said measuring point (26) is at a location having at least one predefined characteristic available in said design data (64). 根據請求項14所述的測量系統(48)， 其中，所述測量設備(38)包括用於確定所述部件載體(10)的所述物理特性(24)的特性傳感器(54)，該特性傳感器(54)可由移動裝置(53)移動。 A measurement system (48) according to claim 14, Therein, the measuring device (38) comprises a property sensor (54) for determining the physical property (24) of the component carrier (10), which property sensor (54) is movable by a movement device (53). 根據請求項14所述的測量系統(48)， 其中，所述測量設備(38)包括：工作臺(50)，所述工作臺用於放置所述部件載體(10)；對準裝置(52)，所述對準裝置(52)用於在所述工作臺(50)上對準所述部件載體(10)；以及位置傳感器(56)，所述位置傳感器(56)用於確定所述部件載體(10)的定向點(58)。 A measurement system (48) according to claim 14, Wherein, the measuring equipment (38) comprises: a workbench (50), which is used to place the component carrier (10); an alignment device (52), which is used for alignment of the component carrier (10) on the table (50); and a position sensor (56) for determining an orientation point (58) of the component carrier (10).
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Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0305734A3 (en) * 1987-08-26 1989-04-05 Siemens Aktiengesellschaft Test arrangement for circuit boards
DE4023294A1 (en) * 1990-07-21 1992-01-23 Bosch Gmbh Robert Short circuit testing of multilayer circuit board - has test probe pressed against insulated conductor track
AT401131B (en) * 1992-05-15 1996-06-25 Schrack Telecom Multilayer printed circuit board
KR0163688B1 (en) * 1995-07-28 1999-03-20 전주범 Internal circuit measuring device
JP2006078280A (en) * 2004-09-08 2006-03-23 Denso Corp Capacitive humidity sensor
US7685879B2 (en) * 2004-12-08 2010-03-30 Abb Ag Differential pressure measuring transducer unit
DE102005028191B4 (en) * 2005-06-17 2009-04-09 Atg Luther & Maelzer Gmbh Method and device for testing unpopulated, large-area circuit boards with a finger tester
JP4956958B2 (en) * 2005-10-20 2012-06-20 株式会社島津製作所 X-ray inspection equipment
DE102008043169A1 (en) * 2008-10-24 2010-04-29 Endress + Hauser Gmbh + Co. Kg Measuring device and method for producing the measuring device
US20130146755A1 (en) * 2010-08-19 2013-06-13 Elesta Relays Gmbh Position measuring device
DE102011113138B4 (en) * 2011-04-14 2013-06-06 Inb Vision Ag Apparatus and method for measuring surfaces
CN102840832A (en) * 2012-09-11 2012-12-26 厦门爱谱生电子科技有限公司 Method for detecting thickness of conductive adhesive on flexible printed circuit board and slice structure of flexible printed circuit board
CN103792481B (en) * 2012-11-02 2016-08-03 纬创资通股份有限公司 Automatic tester for circuitboard and circuit board automatic test approach
US8788205B2 (en) * 2012-12-17 2014-07-22 Microsoft Corporation Sensor data collection
WO2014136194A1 (en) * 2013-03-04 2014-09-12 東京エレクトロン株式会社 X-ray nondestructive testing device
TWI627546B (en) * 2013-06-29 2018-06-21 新納普系統股份有限公司 Chip cross-section identification and rendering during failure analysis
TWI487898B (en) * 2014-01-13 2015-06-11 Machvision Inc Test apparatus, test system and test method of defects in blind vias of printed circuit board
US9406572B2 (en) * 2014-10-30 2016-08-02 Infineon Technologies Ag Method for processing a substrate and a method of process screening for integrated circuits
CN105092598B (en) * 2015-09-28 2018-02-06 深圳大学 A kind of large format pcb board defect method for quickly identifying and system based on connected domain
CN106596588A (en) * 2016-12-09 2017-04-26 英业达科技有限公司 Automatic detection system for circuit boards
TWI629473B (en) * 2017-05-02 2018-07-11 技嘉科技股份有限公司 Circuit board assembly detection system and detection method thereof
CN108811483B (en) * 2017-05-02 2021-08-20 技嘉科技股份有限公司 Assembled circuit board detection system and assembled circuit board detection method
CN108181323A (en) * 2017-12-15 2018-06-19 河南飞优驰网络科技有限公司 Integrated circuit plate fault detection method and system based on electromagnetic signature
CN108398112A (en) * 2018-02-08 2018-08-14 广州兴森快捷电路科技有限公司 Circuit board copper plating detecting system and detection method
CN108511498A (en) * 2018-04-10 2018-09-07 京东方科技集团股份有限公司 Display base plate and production method, display device
CN109142380A (en) * 2018-09-19 2019-01-04 广州视源电子科技股份有限公司 The fault detection method of circuit board, device and system
CN109211182B (en) * 2018-10-18 2020-10-20 广州小鹏汽车科技有限公司 Circuit board deformation degree measuring device and method
CN209418465U (en) * 2018-12-24 2019-09-20 东泰高科装备科技有限公司 Accurately measure the layer structural detail and semiconductor device fabrication equipment of temperature
CN111508923B (en) * 2019-01-31 2024-03-26 奥特斯奥地利科技与***技术有限公司 Manufacturing through holes with low offset in component carrier material
CN112087887B (en) * 2019-06-12 2023-06-09 奥特斯科技(重庆)有限公司 Alignment of component carrier structures by combining evaluation pad and hole type alignment marks
CN112082480A (en) * 2020-09-08 2020-12-15 浙江清华柔性电子技术研究院 Method and system for measuring spatial orientation of chip, electronic device and storage medium

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