TWI834363B

TWI834363B - Pressing mechanism, testing device, and processing machine

Info

Publication number: TWI834363B
Application number: TW111141118A
Authority: TW
Inventors: 李子瑋; 黃旭輝
Original assignee: 鴻勁精密股份有限公司
Priority date: 2022-10-28
Filing date: 2022-10-28
Publication date: 2024-03-01

Abstract

A pressing mechanism includes a dodging structure and a pressing module. The support seat of the dodging structure is horizontally movable between the working area and a holding area. The pressing module is disposed on the support seat and has a pressing member for pressing the electronic component wherein the pressing member is movable along a pressing axis. The pressing module is moved from the holding area to the working area by the support seat so that the pressing member can press the electronic component in the working area for test. The pressing module is moved from the working area to the holding area by the support seat for dodging so that the electronic component in the working area can be processed by other equipments.

Description

壓接機構、測試裝置及作業機Crimping mechanism, testing device and operating machine

本發明提供一種利於空間配置及便利更換壓接模組之壓接機構。 The invention provides a crimping mechanism that facilitates space configuration and facilitates replacement of crimping modules.

在現今，電子元件於製作完成後，以測試裝置執行測試作業，進而確保出廠品質；請參閱圖1，測試裝置於測試室11配置測試機構及壓接機構，測試機構設有電性連接之電路板12及具探針之測試器13，以供測試電子元件，壓接機構配置於測試機構之上方，並設有馬達14驅動皮帶輪組15，皮帶輪組15傳動一螺桿螺座組16，利用螺桿螺座組16之螺座161帶動壓接器17作Z方向位移，以供壓接測試器13之電子元件，使電子元件之接點與測試器13之探針作有效性接觸而執行測試作業。 Nowadays, after the electronic components are produced, they are tested with a testing device to ensure the factory quality. Please refer to Figure 1. The testing device is equipped with a testing mechanism and a crimping mechanism in the testing room 11. The testing mechanism is equipped with electrically connected circuits. The board 12 and the tester 13 with probes are used for testing electronic components. The crimping mechanism is arranged above the testing mechanism and is provided with a motor 14 to drive a pulley set 15. The pulley set 15 drives a screw screw seat set 16. The screw is used to The screw seat 161 of the screw seat group 16 drives the crimping device 17 to move in the Z direction for crimping the electronic components of the tester 13 so that the contacts of the electronic components make effective contact with the probes of the tester 13 to perform the test operation. .

惟，電子元件由一輸送裝置之輸送器18作水平位移移入測試器13，為使壓接機構之壓接器17可迴避輸送裝置之輸送器18，勢必架高壓接器17之Z方向初始位置，相對地，必需架高馬達14、皮帶輪組15及螺桿螺座組16的裝配高度，不僅增大壓接機構之裝配空間，而不利測試裝置之整體空間配置，亦增長壓接器17之Z方向壓接行程，以致於下降移動過程中易因螺桿晃動而影響壓測品質之問題。 However, the electronic components are moved horizontally into the tester 13 by the conveyor 18 of a conveying device. In order for the crimping device 17 of the crimping mechanism to avoid the conveyor 18 of the conveying device, the initial position of the high-voltage connector 17 in the Z direction must be set. , correspondingly, it is necessary to raise the assembly height of the motor 14, the pulley set 15 and the screw nut seat set 16, which not only increases the assembly space of the crimping mechanism, but is not conducive to the overall spatial configuration of the test device, and also increases the Z of the crimping device 17 The direction of the crimping stroke causes the screw to shake easily during the downward movement, which may affect the quality of the pressure measurement.

再者，壓接器17以複數個栓具鎖固裝配於螺座161，欲更換不同型式或數量之壓接器時，必須繁瑣耗時拆卸、鎖固複數個栓具，以致無法提高作業效能。 Furthermore, the crimping device 17 is locked and assembled to the screw base 161 with a plurality of bolts. When replacing crimping devices of different types or quantities, it is necessary to disassemble and lock the plurality of bolts, which is cumbersome and time-consuming, so that the work efficiency cannot be improved. .

由於部分電子元件之表面呈傾斜狀，壓接器17作Z方向壓接電子元件之表面時，將會發生壓接器17無法作全面式貼合電子元件之表面，以致電子元件受壓不均，進而影響測試品質。 Since the surface of some electronic components is inclined, when the crimping device 17 is used to press the surface of the electronic component in the Z direction, it will happen that the crimping device 17 cannot fully fit the surface of the electronic component, resulting in uneven pressure on the electronic component. , thus affecting the test quality.

本發明之目的一，提供一種壓接機構，包含讓位結構及壓接模組，讓位結構設置載座及讓位驅動源，讓位驅動源驅動載座能夠作水平位移於作業區及暫置區，壓接模組裝配於載座，並設有一可沿壓接軸向位移之壓接器，於載座載送壓接模組同步由暫置區作水平位移至作業區，可供壓接器壓接位於作業區之電子元件執行測試作業，於載座載送壓接模組同步由作業區作水平位移至暫置區而讓位，可供相關裝置(例如輸送器)於作業區對電子元件執行預設作業(例如入出料作業)；藉以壓接模組作水平位移讓位迴避相關裝置而可有效降低壓接器之架置高度，並縮減壓接機構之整體體積，進而利於機構之空間配置。 The first object of the present invention is to provide a crimping mechanism, which includes a yielding structure and a crimping module. The yielding structure is provided with a carrier and a yielding driving source. The yielding driving source drives the carrier to be capable of horizontal displacement in the working area and temporarily. In the placement area, the crimping module is assembled on the carrier, and is equipped with a crimping device that can move along the crimping axis. The crimping module is carried on the carrier and simultaneously moves horizontally from the temporary placement area to the operating area for use. The crimping device crimps electronic components located in the working area to perform testing operations, and the crimping module is carried on the carrier and simultaneously moves horizontally from the working area to the temporary storage area to make way for related devices (such as conveyors) to operate Perform preset operations on electronic components (such as loading and unloading operations); by using the crimping module to move horizontally to avoid related devices, the installation height of the crimping device can be effectively reduced, and the overall volume of the crimping mechanism can be reduced, thus Conducive to the spatial configuration of the organization.

本發明之目的二，提供一種壓接機構，其讓位結構之載座載送壓接模組同步水平位移至作業區，以縮短壓接模組之壓接器與作業區之測試器間的作業行程，可有效避免壓接器於下降過程發生晃動，進而提高電子元件壓測品質。 The second object of the present invention is to provide a crimping mechanism in which the holder of the shifting structure carries the crimping module for synchronous horizontal displacement to the working area, so as to shorten the gap between the crimping device of the crimping module and the tester in the working area. The working stroke can effectively prevent the crimper from shaking during the descent process, thereby improving the quality of pressure testing of electronic components.

本發明之目的三，提供一種壓接機構，其讓位結構之載座載送壓接模組同步水平位移至作業區，以縮短壓接模組之壓接器與作業區之測試器間的作業行程，使壓接器迅速壓接電子元件執行測試作業，達到提高生產效能之實用效益。 The third object of the present invention is to provide a crimping mechanism in which the carrier of the space-saving structure carries the crimping module for synchronous horizontal displacement to the working area, so as to shorten the distance between the crimping device of the crimping module and the tester in the working area. The working stroke allows the crimping device to quickly crimp electronic components to perform testing operations, achieving practical benefits of improving production efficiency.

本發明之目的四，提供一種壓接機構，其壓接模組設有承置器、壓接器及勾扣單元，承置器配置於載座，並供裝配壓接器，勾扣單元可使承載器與載座組裝或分離；藉以更換不同型式之壓接器時，利用勾扣單元迅速分離承載器與載座，而可便利裝拆整組之壓接模組，達到提高換裝作業效能之實用效益。 The fourth object of the present invention is to provide a crimping mechanism. The crimping module is provided with a holder, a crimping device and a hooking unit. The holder is arranged on the carrier and is used for assembling the crimping device. The hooking unit can The carrier and the carrier can be assembled or separated; when replacing different types of crimpers, the hook unit can be used to quickly separate the carrier and the carrier, which can facilitate the assembly and disassembly of the entire set of crimping modules, thereby improving the replacement work. The practical benefit of efficiency.

本發明之目的五，提供一種壓接機構，其壓接模組之承置器設有第一部件、第二部件及微調單元，第一部件裝配於載座，第二部件裝配於第一部件，並供裝配壓接器，微調單元於第一部件與第二部件間設有彈性件，以供第二部件貼合或遠離第一部件；藉以壓接器壓接一表面傾斜之電子元件時，微調單元可使第二部件及壓接器作浮動傾斜，以利壓接器全面式貼合且平均壓接電子元件，進而提高壓測品質。 The fifth object of the present invention is to provide a crimping mechanism in which the holder of the crimping module is provided with a first component, a second component and a fine-tuning unit. The first component is assembled on the carrier, and the second component is assembled on the first component. , and for assembling a crimping device. The fine-tuning unit is provided with an elastic member between the first part and the second part so that the second part can fit or move away from the first part; when the crimping device is used to crimp an electronic component with an inclined surface , the fine-tuning unit can make the second component and the crimping device float and tilt, so that the crimping device can fully fit and evenly crimp electronic components, thereby improving the quality of pressure measurement.

本發明之目的六，提供一種測試裝置，包含測試機構及本發明壓接機構；測試機構配置於作業區，並設有電性連接之電路板及測試器，以供測試電子元件；本發明壓接機構裝配於測試機構或機台，包含讓位結構及壓接模組，以供壓接作業區之測試機構的電子元件。 The sixth object of the present invention is to provide a testing device, including a testing mechanism and a crimping mechanism of the present invention; the testing mechanism is arranged in the working area and is provided with an electrically connected circuit board and a tester for testing electronic components; the crimping mechanism of the present invention The bonding mechanism is assembled on the testing mechanism or machine platform, and includes a clearance structure and a crimping module for electronic components of the testing mechanism in the crimping operation area.

本發明之目的七，提供一種作業機，包含機台、供料裝置、收料裝置、輸送裝置、測試裝置及中央控制裝置，供料裝置配置於機台，並設有至少一供料器，以供容置至少一待測電子元件；收料裝置配置於機台，並設有至少一收料器，以供容置至少一已測電子元件；輸送裝置配置於機台，並設有至少一輸送器，以供輸送電子元件；測試裝置配置於機台，並設有測試機構及本發明壓接機構，以供測試電子元件；中央控制裝置以控制及整合各裝置作動而執行自動化作業。 The seventh object of the present invention is to provide a working machine, which includes a machine platform, a feeding device, a receiving device, a conveying device, a testing device and a central control device. The feeding device is arranged on the machine platform and is provided with at least one feeder. To accommodate at least one electronic component to be tested; the receiving device is arranged on the machine platform and is provided with at least one receiving device for accommodating at least one electronic component to be tested; the conveying device is arranged on the machine platform and is provided with at least A conveyor for conveying electronic components; the testing device is configured on the machine and is equipped with a testing mechanism and the The crimping mechanism is invented for testing electronic components; the central control device controls and integrates the actions of each device to perform automated operations.

[習知] [customary knowledge]

11:測試室 11:Test room

12:電路板 12:Circuit board

13:測試器 13:Tester

14:馬達 14: Motor

15:皮帶輪組 15: Pulley set

16:螺桿螺座組 16:Screw nut seat set

161:螺座 161:Screw seat

17:壓接器 17:Crimper

18:輸送器 18:Conveyor

[本發明] [Invention]

20:測試裝置 20:Test device

21:載座 21:Carrying seat

211:承裝塊 211: Loading block

2111:對位銷 2111:Alignment pin

212:第一腔室 212:First chamber

213:卡柱 213: stuck column

22:固定桿 22:Fixed rod

221:活塞 221:Piston

222:支撐架 222: Support frame

231:滑軌 231:Slide rail

232:滑座 232:Sliding seat

241:第一部件 241:First part

2411:對位孔 2411: Alignment hole

2412:螺孔 2412:Screw hole

2413:槽孔 2413:Slot

2414:第一導引件 2414: First guide

242:第二部件 242:Second part

2421:階級槽 2421:Class slot

2422:栓具 2422: Bolts

2423:第二導引件 2423: Second guide

243:勾扣件 243:Hook fasteners

2431:勾槽 2431: hook groove

251:氣缸體 251:Cylinder block

252:活塞桿 252:piston rod

253:壓接具 253:Crimping tool

2531:壓接部件 2531: Crimping parts

254:溫控件 254: Temperature control

262:彈性件 262: Elastic parts

261:連接件 261: Connector

271:電路板 271:Circuit board

272:測試器 272:Tester

A:作業區 A:Working area

B:暫置區 B: Temporary area

C:壓接軸向 C: crimping axial direction

31:輸送器 31:Conveyor

32:電子元件 32: Electronic components

40:機台 40:Machine

50:供料裝置 50: Feeding device

51:供料器 51: Feeder

60:收料裝置 60: Receiving device

61:收料器 61:Receiver

70:輸送裝置 70:Conveying device

71:第一輸送器 71: First conveyor

72:第二輸送器 72: Second conveyor

73:第三輸送器 73:Third conveyor

圖1：習知測試裝置之示意圖。 Figure 1: Schematic diagram of a conventional test device.

圖2：本發明壓接機構之前視圖。 Figure 2: Front view of the crimping mechanism of the present invention.

圖3：本發明壓接機構之俯視圖。 Figure 3: Top view of the crimping mechanism of the present invention.

圖4：本發明壓接機構之剖視圖(一)。 Figure 4: Cross-sectional view (1) of the crimping mechanism of the present invention.

圖5：本發明壓接機構之剖視圖(二)。 Figure 5: Cross-sectional view (2) of the crimping mechanism of the present invention.

圖6至圖10：壓接機構應用於測試裝置之使用示意圖。 Figure 6 to Figure 10: Schematic diagram of the use of the crimping mechanism in the test device.

圖11：測試裝置應用於作業機之示意圖。 Figure 11: Schematic diagram of the test device applied to the operating machine.

為使貴審查委員對本發明作更進一步之瞭解，茲舉一較佳實施例並配合圖式，詳述如後：請參閱圖2~8，本發明壓接機構包含讓位結構及壓接模組。 In order for your review committee to have a further understanding of the present invention, a preferred embodiment is cited and accompanied by drawings, which are described in detail below: Please refer to Figures 2 to 8. The crimping mechanism of the present invention includes a yielding structure and a crimping mold. group.

讓位結構設置至少一載座，載座能夠作水平位移於作業區及暫置區；更進一步，載座可為獨立之座體或具腔室之缸體，例如載座為獨立座體，並由一讓位驅動源驅動作水平位移，讓位驅動源可為線性馬達、壓缸或包含馬達及至少一傳動組，傳動組可為皮帶輪組或螺桿螺座等，不受限於本實施例。 The yielding structure is provided with at least one carrier seat, which can move horizontally in the operating area and the temporary storage area; further, the carrier seat can be an independent seat body or a cylinder with a chamber, for example, the carrier seat can be an independent seat body, And it is driven by a displacement driving source for horizontal displacement. The displacement driving source can be a linear motor, a pressure cylinder, or a motor and at least one transmission group. The transmission group can be a pulley group or a screw screw seat, etc., and is not limited to this implementation. example.

例如載座可為缸體，於載座之內部設有具流體之第一腔室，以供置入一呈水平配置之固定桿的活塞，載座利用流路設計而能夠沿固定桿作水平位移；更進一步，缸體之頂面可增設塊體或座體作為承裝部件，以供承裝壓接模組，亦無不可。 For example, the carrier can be a cylinder, and a first chamber containing fluid is provided inside the carrier for placing a piston with a horizontally arranged fixed rod. The carrier can use the flow path design to move horizontally along the fixed rod. displacement; further, a block or a base can be added on the top surface of the cylinder as a supporting component to accommodate the crimping module.

於本實施例，讓位結構包含複數個載座21及複數個固定桿22，載座21為一缸體，其頂面設有一為承裝塊211之承裝部件，載座21之內部設有一具氣體之第一腔室212，固定桿22呈水平配置，其一端的活塞221伸入於載座21之第一腔室212，另一端則固設於一支撐架222，使得載座21利用第一腔室212之流路設計，而能夠沿固定桿22作水平位移(如X方向)於作業區A及暫置區B；作業區A以供配置至少一可測試電子元件之測試器(圖未示出)；暫置區B位於作業區A之側方，以供暫置載座21。 In this embodiment, the position-giving structure includes a plurality of carrier seats 21 and a plurality of fixed rods 22. The carrier seat 21 is a cylinder, and a bearing component called a bearing block 211 is provided on the top surface of the carrier seat 21. There is a first chamber 212 of gas, the fixed rod 22 is arranged horizontally, the piston 221 at one end extends into the first chamber 212 of the carrier 21, and the other end is fixed on a support frame 222, so that the carrier 21 Utilizing the flow path design of the first chamber 212, it is possible to perform horizontal displacement (such as the X direction) along the fixed rod 22 in the operating area A and the temporary storage area B; the operating area A is used to configure at least one tester that can test electronic components. (not shown in the figure); the temporary storage area B is located on the side of the operation area A for temporarily placing the carrier 21 .

更進一步，讓位結構於載座21之下方設有滑軌單元，以供輔助水平位移；滑軌單元設有呈水平配置且相互配合之滑軌231及滑座232，滑軌231及滑座232其中一者可裝配於機台或測試機構，另一者可供裝配載座21；於本實施例，滑軌單元之滑軌231的長度涵括作業區A及暫置區B，並於頂面供固設支撐架222，而底面固設裝配於測試機構，滑座232可沿滑軌231作水平位移，並供裝配載座21。 Furthermore, the yielding structure is provided with a slide rail unit under the carrier 21 for auxiliary horizontal displacement; the slide rail unit is provided with a slide rail 231 and a slide seat 232 that are arranged horizontally and cooperate with each other. The slide rail 231 and the slide seat One of 232 can be installed on the machine or testing mechanism, and the other can be used to assemble the carrier 21; in this embodiment, the length of the slide rail 231 of the slide rail unit covers the operating area A and the temporary storage area B, and is in The top surface is provided with a fixed support frame 222, while the bottom surface is fixedly assembled with the testing mechanism. The sliding base 232 can move horizontally along the slide rail 231 and is used to assemble the carrier 21.

壓接模組裝配於讓位結構之載座21，並設有至少一可壓接電子元件之壓接器，於載座21載送壓接模組同步由暫置區B作水平位移至作業區A，以供壓接器壓接作業區A之電子元件，於載座21載送壓接模組同步由作業區A作水平位移至暫置區B而讓位。 The crimping module is assembled on the carrier 21 of the clearance structure, and is equipped with at least one crimper capable of crimping electronic components. The crimping module is carried on the carrier 21 and simultaneously moved horizontally from the temporary area B to the operation Area A is for the crimping device to crimp the electronic components in the working area A. The crimping module is carried on the carrier 21 and simultaneously moves horizontally from the working area A to the temporary setting area B to give way.

承上述，壓接模組設有承置器，承置器裝配於載座21，並供配置壓接器；於本實施例，承置器設有第一部件241及第二部件242，第一部件241呈Z方向配置，並裝配於載台21之承裝塊211上方。 Based on the above, the crimping module is provided with a holder, which is assembled on the carrier 21 and is used to configure the crimping device; in this embodiment, the holder is provided with a first component 241 and a second component 242. A component 241 is arranged in the Z direction and assembled above the bearing block 211 of the carrier 21 .

更進一步，第一部件241與承裝塊211間設有相互配合之第一對位件及第二對位件；於本實施例，第一部件241之底面設有複數個可為對位孔2411之第一對位件，承裝塊211於頂面相對應複數個對位孔2411之位置設有複數個可為對位銷2111之第二對位件，以供對位孔2411套合對位銷2111，使第一部件241對位裝配於載座21。 Furthermore, the first component 241 and the holding block 211 are provided with first and second alignment components that cooperate with each other. In this embodiment, the bottom surface of the first component 241 is provided with a plurality of alignment holes. 2411 is the first positioning member. The bearing block 211 is provided with a plurality of second positioning members that can be positioning pins 2111 at positions corresponding to the positioning holes 2411 on the top surface, so that the positioning holes 2411 can be aligned. The positioning pin 2111 enables the first component 241 to be aligned and assembled on the carrier 21 .

第二部件242呈水平配置裝配於第一部件241，並供裝配壓接器；於本實施例，第二部件242設有複數個階級槽2421，以供穿置複數個栓具2422，栓具2422之頭部位於階級槽2421，且與階級槽2421之底面具有適當間距，栓具2422之桿體則穿伸出第二部件242之底面，並螺合於第一部件241開設之螺孔2412，使第二部件242可作Z方向位移，並不會脫離第一部件241。 The second component 242 is horizontally arranged and assembled to the first component 241, and is used for assembling the crimping device; in this embodiment, the second component 242 is provided with a plurality of stepped grooves 2421 for inserting a plurality of bolts 2422. The head of 2422 is located in the step groove 2421 and has an appropriate distance from the bottom surface of the step groove 2421. The rod of the bolt 2422 extends out of the bottom surface of the second component 242 and is screwed into the screw hole 2412 opened in the first component 241. , so that the second component 242 can move in the Z direction without breaking away from the first component 241 .

壓接器包含壓接驅動源及壓接具，壓接驅動源裝配於承置器，以供驅動壓接具沿壓接軸向C位移壓接電子元件；更進一步，壓接驅動源可為氣囊、壓缸或包含膜片及氣室；於本實施例，壓接驅動源為一沿壓接軸向C配置之氣壓缸，氣壓缸之氣缸體251裝配於第二部件242底面，氣壓缸之活塞桿252裝配壓接具253(請配合參閱圖7、圖8)，壓接具253設有壓接部件2531，以供壓接位於作業區A之電子元件。 The crimping device includes a crimping drive source and a crimping tool. The crimping drive source is installed in the holder to drive the crimping tool to move along the crimping axis C to crimp electronic components; further, the crimping drive source can be The air bag or pressure cylinder may include a diaphragm and an air chamber; in this embodiment, the pressure driving source is a pneumatic cylinder arranged along the pressure axial direction C. The cylinder body 251 of the pneumatic cylinder is assembled on the bottom surface of the second component 242. The pneumatic cylinder The piston rod 252 is equipped with a crimping tool 253 (please refer to Figures 7 and 8). The crimping tool 253 is provided with a crimping component 2531 for crimping the electronic components located in the working area A.

承上述，壓接具253更包含至少一溫控件254，以供溫控電子元件；更進一步，溫控件可為加熱件、致冷晶片或具流體之座體，於本實施例，壓接具253之內部設有溫控件254。 Based on the above, the crimping tool 253 further includes at least one temperature control 254 for temperature control of electronic components; further, the temperature control can be a heating element, a cooling chip, or a fluid-containing base. In this embodiment, the press The connector 253 is provided with a temperature control 254 inside.

承上述，壓接部件2531可為壓接具253之底面或者獨立裝配之壓接治具，亦或為溫控件254(例如加熱件)之底面，不受限於本實施例；於本實施例，壓接部件2531為一壓接治具。 Based on the above, the crimping component 2531 can be the bottom surface of the crimping tool 253 or an independently assembled crimping fixture, or the bottom surface of the temperature control 254 (such as a heating element), which is not limited to this embodiment; in this implementation For example, the crimping component 2531 is a crimping jig.

更進一步，壓接模組設有勾扣單元，勾扣單元於第一部件241與載座21設有相互配合之第一扣接件及第二扣接件，而能夠使第一部件241與載座21組裝或分離；於本實施例，載座21於承裝塊211之前面設有一為卡柱213之第一扣接件，於第一部件241之前面設有可擺動且為勾扣件243之第二扣接件，勾扣件243設有勾槽2431，以供勾扣於卡柱213，於勾扣件243之勾槽2431勾扣卡柱213時，能夠使壓接模組之第一部件241與讓位結構之載座21組裝定位，反之，於勾扣件243之勾槽2431離開卡柱213時，能夠使壓接模組之第一部件241與讓位結構之載座21分離。 Furthermore, the crimping module is provided with a hooking unit. The hooking unit is provided with first and second fastening parts that cooperate with each other on the first component 241 and the carrier 21, so that the first component 241 and the carrier 21 can be connected. The carrier 21 is assembled or separated; in this embodiment, the carrier 21 is provided with a first fastener that is a clamping post 213 in front of the bearing block 211, and is provided with a swingable hook in front of the first component 241. The second fastening part of the component 243 is provided with a hook groove 2431 for hooking the clamping post 213. When the hook groove 2431 of the hooking part 243 hooks the clamping post 213, the crimping module can be made The first component 241 of the crimping module is assembled and positioned with the carrier 21 of the relief structure. On the contrary, when the hook groove 2431 of the hook fastener 243 leaves the clamping column 213, the first component 241 of the crimping module can be assembled and positioned with the carrier 21 of the relief structure. Block 21 separates.

壓接模組設有微調單元，微調單元於第一部件241與第二部件242間設有至少一彈性件，以供第二部件242可貼合或遠離第一部件241；更進一步，第一部件241與第二部件242間設有至少一套置彈性件之連接件；於本實施例，一套置彈性件262之連接件261，其一端連結第二部件242，另一端位於第一部件241開設之槽孔2413，彈性件262之一端頂抵於槽孔2413之內頂面，另一端頂抵於連接件261之凸塊，利用彈性件262之彈力而拉持第二部件242貼合於第一部件241，並供第二部件242可作微幅Z方向浮動位移及角度傾斜調整。 The crimping module is provided with a fine-tuning unit. The fine-tuning unit is provided with at least one elastic member between the first component 241 and the second component 242 so that the second component 242 can fit or move away from the first component 241; further, the first There is at least one connector 261 for mounting the elastic member between the component 241 and the second component 242. In this embodiment, a connector 261 for mounting the elastic member 262 has one end connected to the second component 242 and the other end located on the first component. 241 opens the slot 2413, one end of the elastic member 262 abuts the inner top surface of the slot 2413, and the other end abuts the protrusion of the connecting member 261, and the elastic force of the elastic member 262 is used to pull the second component 242 to fit In the first component 241, the second component 242 is provided for slight Z-direction floating displacement and angle tilt adjustment.

承上述，微調單元於第一部件241與第二部件242間設有相互配合之第一導引件及第二導引件，以供導引第二部件242水平擺置復位；於本實施例，第一部件241之頂面設有一為弧塊之第一導引件2414，第二部件242於底面相對應第一導引件2414之位置設有一為導孔之第二導引件2423，第二導引件2423供套合第一導引件2414，並可沿第一導引件2414之曲弧作位移，於第二部件242無外力頂推時，利用第二導引件2423沿第一導引件2414之曲弧作位移，使第二部件242迅速水平擺置復位。 Based on the above, the fine-tuning unit is provided with a first guide member and a second guide member that cooperate with each other between the first component 241 and the second component 242 to guide the second component 242 to be positioned horizontally and reset; in this embodiment, , the top surface of the first component 241 is provided with a first guide member 2414 that is an arc block, and the second component 242 is provided with a second guide member 2423 that is a guide hole at a position corresponding to the first guide member 2414 on the bottom surface. The second guide member 2423 is used to fit the first guide member 2414 and can be displaced along the arc of the first guide member 2414. When the second component 242 is pushed without external force, the second guide member 2423 is used to move along the curve of the first guide member 2414. The curved arc of the first guide member 2414 is displaced, causing the second component 242 to quickly return to its horizontal position.

請參閱圖6~9，本發明之壓接機構應用於測試裝置20，測試裝置20包含測試機構及本發明壓接機構，測試機構位於作業區A，並設有電性連接之電路板271及測試器272，測試器272具有探針，以供承置及測試電子元件；本發明壓接機構裝配於測試機構或機台，包含讓位結構及壓接模組，以供壓接作業區A之測試機構的電子元件；於本實施例，壓接機構以讓位結構之滑軌231裝配固設於測試器272，讓位結構帶動壓接模組作水平位移於作業區A及暫置區B，並令滑座232沿滑軌231位移。 Please refer to Figures 6 to 9. The crimping mechanism of the present invention is applied to the testing device 20. The testing device 20 includes a testing mechanism and the crimping mechanism of the present invention. The testing mechanism is located in the working area A and is equipped with an electrically connected circuit board 271 and Tester 272, the tester 272 has a probe for holding and testing electronic components; the crimping mechanism of the present invention is assembled on a testing mechanism or machine, including a yielding structure and a crimping module for crimping operation area A Electronic components of the test mechanism; in this embodiment, the crimping mechanism is assembled and fixed on the tester 272 with the slide rail 231 of the recessed structure. The recessed structure drives the crimping module to move horizontally in the operating area A and the temporary storage area. B, and make the sliding seat 232 displace along the sliding rail 231.

於執行電子元件入出料作業時，讓位結構以第一腔室212內之氣體推動載座21沿固定桿22作水平位移，由於壓接模組裝配於載座21，載座21利用第一部件241及第二部件242帶動壓接驅動源之氣缸體251、活塞桿252及壓接具253同步由作業區A作水平位移至暫置區B，令壓接模組讓位出測試器272之上方空間，以供一輸送裝置之輸送器31將電子元件32移入或移出測試器272；因此，壓接模組作水平位移讓位迴避輸送器31，而可有效降低壓接器之架置高度，以縮減壓接機構之整體體積而利於空間配置。 When performing the loading and unloading operation of electronic components, the outgoing structure uses the gas in the first chamber 212 to push the carrier 21 to move horizontally along the fixed rod 22. Since the crimping module is assembled on the carrier 21, the carrier 21 utilizes the first chamber 212 to move the carrier 21 horizontally. The component 241 and the second component 242 drive the cylinder 251, the piston rod 252 and the crimping tool 253 of the crimping driving source to move horizontally from the operating area A to the temporary area B simultaneously, causing the crimping module to give way to the tester 272 The space above is for the conveyor 31 of a conveying device to move the electronic component 32 into or out of the tester 272; therefore, the crimping module moves horizontally to make way for the conveyor 31, which can effectively reduce the installation of the crimping device. height to reduce the overall volume of the crimping mechanism and facilitate space configuration.

於執行電子元件測試作業時，讓位結構以第一腔室212內之氣體推動載座21沿固定桿22作反向水平位移，載座21利用第一部件241及第二部件242帶動壓接驅動源之氣缸體251、活塞桿252及壓接具253同步由暫置區B水平位移至作業區A，令壓接具253位於測試器272之上方；壓接模組利用氣缸體251內之氣體頂推活塞桿252帶動壓接具253沿壓接軸向C位移，使壓接具253之壓接部件2531下壓作業區A之測試器272的電子元件32而執行測試作業；因此，不僅有效縮短壓接具253與測試器272的作業行程而可迅速壓接電子元件，並避免壓接具253於下降過程發生晃動，進而提高電子元件測試品質及生產效能。 When performing electronic component testing operations, the out-of-position structure uses the gas in the first chamber 212 to push the carrier 21 to move horizontally in the opposite direction along the fixed rod 22, and the carrier 21 uses the first component 241 and the second component 242 to drive the crimping The cylinder body 251, piston rod 252 and crimping tool 253 of the driving source are synchronously moved horizontally from the temporary area B to the operating area A, so that the crimping tool 253 is located above the tester 272; the crimping module uses the pressure inside the cylinder body 251 The gas pushes the piston rod 252 to drive the crimping tool 253 to move along the crimping axis C, causing the crimping component 2531 of the crimping tool 253 to press down the electronic component 32 of the tester 272 in the working area A to perform the test operation; therefore, not only The working stroke of the crimping tool 253 and the tester 272 is effectively shortened to quickly press the electronic components, and the crimping tool 253 is prevented from shaking during the descending process, thereby improving the electronic component testing quality and production efficiency.

然，壓接具253下壓電子元件32作有效性接觸測試器272之探針的過程中，電子元件32會承受測試器272之探針的反作用力而頂推活塞桿252，活塞桿252利用氣體頂推第二部件242作Z方向浮動位移，第二部件242上拉連接件261，連接件261壓縮彈性件262，若電子元件32之表面呈傾斜狀，第二部件242可帶動壓接具253同步作Z方向浮動位移且可傾斜擺動，使壓接具253之壓接部件2531作全面式貼合電子元件32之表面，而平均施力壓接電子元件32，進而提高壓測品質。 However, when the crimping tool 253 presses down the electronic component 32 to effectively contact the probe of the tester 272, the electronic component 32 will bear the reaction force of the probe of the tester 272 and push the piston rod 252. The piston rod 252 utilizes The gas pushes the second component 242 to float in the Z direction. The second component 242 pulls up the connector 261 and the connector 261 compresses the elastic member 262. If the surface of the electronic component 32 is inclined, the second component 242 can drive the crimping tool. 253 synchronously performs floating displacement in the Z direction and can tilt and swing, so that the crimping component 2531 of the crimping tool 253 fully fits the surface of the electronic component 32, and evenly applies force to crimp the electronic component 32, thereby improving the quality of the pressure test.

請參閱圖10，於更換不同型式之壓接具時，可扳動壓接模組之勾扣單元的勾扣件243，令勾扣件243之勾槽2431脫離載座21上之卡柱213，使第一部件241與載座21之承裝塊211迅速分離，即可供工作人員將整組之壓接模組作Z方向向上取出，而便利更換新的整組之壓接模組，達到提高換裝作業效能之實用效益。 Please refer to Figure 10. When replacing different types of crimping tools, the hook fastener 243 of the hook unit of the crimping module can be pulled so that the hook groove 2431 of the hook fastener 243 is separated from the clamping post 213 on the carrier 21. , the first component 241 is quickly separated from the holding block 211 of the carrier 21, which allows the staff to take out the entire set of crimping modules upward in the Z direction, and facilitates the replacement of a new set of crimping modules. Achieve the practical benefit of improving the efficiency of reloading operations.

請參閱圖2~11，本發明測試裝置應用於電子元件作業機，作業機包含機台40、供料裝置50、收料裝置60、輸送裝置70、本發明測試裝置20及中央控制裝置(圖未示出)；供料裝置50裝配於機台40，並設有至少一供料器51，以容納至少一待測之電子元件；收料裝置60裝配於機台40，並設有至少一收料器61，以容納至少一已測之電子元件；測試裝置20配置於機台40，並設有至少一測試機構及至少一本發明壓接機構，至少一測試機構位於作業區A，並設有至少一測試器，以供測試電子元件；至少一本發明壓接機構裝配於測試機構或機台40，以供壓接作業區A之測試機構的電子元件；於本實施例，測試機構設有電性連接之電路板271及測試器272，測試器272具有探針，以供承置及測試電子元件；本發明壓接機構裝配於測試機構，包含讓位結構及壓接模組，讓位結構以讓位驅動源驅動載座21能夠作水平位移於作業區A及暫置區B，壓接模組裝配於載座21，並設有一可沿壓接軸向C位移之壓接器，於載座21載送壓接模組同步水平位移至暫置區B，而可讓位出測試器272之上方空間，以供輸送裝置70於作業區A對電子元件執行入出料作業，於載座21載送壓接模組同步水平位移至作業區A，以供壓接器壓接作業區A之測試器272的電子元件執行測試作業；輸送裝置70裝配於機台40，並設有至少一輸送器，以輸送電子元件，於本實施例，輸送裝置70設有第一輸送器71，以於供料裝置50之供料器51取出待測之電子元件，並移載至第二輸送器72，輸送裝置70以第三輸送器73於第二輸送器72取出待測電子元件，壓接機構之讓位結構帶動壓接模組由作業區A水平位移至暫置區B，以供第三輸送器73取出已測電子元件，並將待測電子元件移入測試機構之測試器272，讓位結構再帶動壓接模組由暫置區B作水平位移至作業區A，以供壓接模組壓接電子元件執行測試作業，第三輸送器73將已測電子元件移載至第二輸送器72，第一輸送器71於第二輸送器72取出已測之電子元件，並依據測試結果，將已測之電子元件輸送至收料裝置60之收料器61處而分類收置；中央控制裝置(圖未示出)用以控制及整合各裝置作動，以執行自動化作業，達到提升作業效能之實用效益。 Please refer to Figures 2 to 11. The testing device of the present invention is applied to an electronic component working machine. The working machine includes a machine table 40, a feeding device 50, a receiving device 60, a conveying device 70, a testing device 20 of the present invention and a central control device (Fig. (not shown); the feeding device 50 is assembled on the machine 40 and is provided with at least one feeder 51 to accommodate at least one electronic component to be tested; the receiving device 60 is assembled on the machine 40 and is provided with at least one The receiver 61 is to accommodate at least one tested electronic component; the testing device 20 is configured on the machine 40 and is provided with at least one testing mechanism and at least one inventive crimping mechanism. At least one testing mechanism is located in the operating area A, and At least one tester is provided for testing electronic components; at least one crimping mechanism of the invention is assembled on the testing mechanism or machine 40 for crimping the electronic components of the testing mechanism in the working area A; in this embodiment, the testing mechanism A circuit board 271 and a tester 272 are provided with electrical connections. The tester 272 has a probe for holding and testing electronic components. The crimping mechanism of the present invention is assembled on the testing mechanism and includes a yielding structure and a crimping module. give way structure to give way The driving source drives the carrier 21 to move horizontally in the operating area A and the temporary storage area B. The crimping module is assembled on the carrier 21 and is provided with a crimping device that can be displaced along the crimping axis C. The crimping module is mounted on the carrier 21 The carrying crimping module is synchronously moved horizontally to the temporary storage area B, and the space above the tester 272 can be cleared for the conveyor device 70 to perform loading and unloading operations on the electronic components in the operating area A, and carry them on the carrier 21 The crimping module is synchronously moved horizontally to the operating area A, so that the electronic components of the tester 272 in the crimping operating area A can perform testing operations; the conveying device 70 is assembled on the machine 40 and is provided with at least one conveyor. To convey electronic components, in this embodiment, the conveying device 70 is provided with a first conveyor 71 to take out the electronic components to be tested from the feeder 51 of the feeding device 50 and transfer them to the second conveyor 72 for conveying. The device 70 uses the third conveyor 73 to take out the electronic components to be tested from the second conveyor 72. The yielding structure of the crimping mechanism drives the crimping module to move horizontally from the operating area A to the temporary storage area B for the third conveyor. 73 Take out the tested electronic components and move the electronic components to be tested into the tester 272 of the testing mechanism. The accommodating structure then drives the crimping module to move horizontally from the temporary area B to the operating area A for the crimping module to press. The electronic components are connected to perform testing operations. The third conveyor 73 transfers the tested electronic components to the second conveyor 72. The first conveyor 71 takes out the tested electronic components from the second conveyor 72, and according to the test results, The tested electronic components are transported to the collector 61 of the collection device 60 and stored in categories; the central control device (not shown) is used to control and integrate the actions of each device to perform automated operations to improve operating efficiency. Practical benefits.

21:載座 21:Carrying seat

212:第一腔室 212:First chamber

22:固定桿 22:Fixed rod

231:滑軌 231:Slide rail

232:滑座 232:Sliding seat

241:第一部件 241:First part

242:第二部件 242:Second part

251:氣缸體 251:Cylinder block

252:活塞桿 252:piston rod

253:壓接具 253:Crimping tool

272:測試器 272:Tester

A:作業區 A:Working area

B:暫置區 B: Temporary area

31:輸送器 31:Conveyor

32:電子元件 32: Electronic components

Claims

一種壓接機構，包含：讓位結構：設置至少一載座，該載座能夠作水平位移於作業區及暫置區；壓接模組：裝配於該讓位結構之該載座，並設有至少一可壓接電子元件之壓接器，於該載座載送該壓接模組同步由該暫置區作水平位移至該作業區，以供該壓接器壓接該作業區之電子元件，於該載座載送該壓接模組同步由該作業區作水平位移至該暫置區而讓位。 A crimping mechanism, including: a yielding structure: at least one carrier is provided, and the carrier can move horizontally in the operating area and the temporary storage area; a crimping module: the carrier is assembled on the yielding structure, and is provided with There is at least one crimping device that can crimp electronic components, and the crimping module is carried on the carrier to move horizontally from the temporary area to the operating area simultaneously, so that the crimping device can crimp the working area. The electronic component carries the crimping module on the carrier and simultaneously moves horizontally from the operating area to the temporary storage area to give way.

如請求項1所述之壓接機構，其該讓位結構設有讓位驅動源，以供驅動該載座作水平位移。 As for the crimping mechanism described in claim 1, the displacement structure is provided with a displacement driving source for driving the carrier to move horizontally.

如請求項1所述之壓接機構，其該讓位結構設有該載座及固定桿，該載座之內部設有具流體之第一腔室，該固定桿呈水平配置，其一端之活塞伸入該載座之該第一腔室，該載座能夠沿該固定桿作水平位移。 As for the crimping mechanism described in claim 1, the displacement structure is provided with the carrier seat and the fixed rod, the interior of the carrier seat is provided with a first chamber containing fluid, the fixed rod is arranged horizontally, and one end of the fixed rod is disposed horizontally. The piston extends into the first chamber of the carrier seat, and the carrier seat can move horizontally along the fixed rod.

如請求項1所述之壓接機構，其該壓接模組設有承置器，該承置器設有第一部件及第二部件，該第一部件裝配於該載座，該第二部件裝配於該第一部件，並供裝配該壓接器。 The crimping mechanism of claim 1, wherein the crimping module is provided with a holder, the holder is provided with a first component and a second component, the first component is assembled on the carrier, and the second component The component is assembled to the first component and is used for assembling the crimper.

如請求項4所述之壓接機構，其該壓接器包含壓接驅動源及壓接具，該壓接驅動源裝配於該承置器，以供驅動該壓接具沿壓接軸向位移壓接該電子元件。 The crimping mechanism of claim 4, wherein the crimping device includes a crimping driving source and a crimping tool, and the crimping driving source is mounted on the holder to drive the crimping tool along the crimping axis. Displacement crimps the electronic components.

如請求項4所述之壓接機構，其該壓接模組設有勾扣單元，該勾扣單元於該第一部件與該載座間設有相互配合之第一扣接件及第二扣接件，而能夠使該第一部件與該載座組裝或分離。 The crimping mechanism of claim 4, wherein the crimping module is provided with a hook unit, and the hook unit is provided with a first fastener and a second fastener that cooperate with each other between the first component and the carrier. The connector enables the first component to be assembled or separated from the carrier.

如請求項4所述之壓接機構，其該壓接模組設有微調單元，該微調單元於該第一部件與該第二部件間設有至少一彈性件，以供該第二部件可貼合或遠離該第一部件。 The crimping mechanism of claim 4, wherein the crimping module is provided with a fine-tuning unit, and the fine-tuning unit is provided with at least one elastic member between the first component and the second component so that the second component can To or away from the first component.

如請求項1至7中任一項所述之壓接機構，其該讓位結構於該載座之下方設有滑軌單元。 For the crimping mechanism according to any one of claims 1 to 7, the displacement structure is provided with a slide rail unit below the carrier.

一種測試裝置，包含：至少一測試機構：位於作業區，並設有電性連接之電路板及測試器，以供測試電子元件；至少一如請求項1所述之壓接機構：裝配於該測試機構或機台，以供壓接該作業區之該測試機構的電子元件。 A testing device, including: at least one testing mechanism: located in the working area and equipped with electrically connected circuit boards and testers for testing electronic components; at least one crimping mechanism as described in claim 1: assembled on the A testing mechanism or machine for crimping the electronic components of the testing mechanism in the working area.

一種作業機，包含：機台；供料裝置：配置於該機台，並設有至少一供料器，以供容置至少一待測電子元件；收料裝置：配置於該機台，並設有至少一收料器，以供容置至少一已測電子元件；輸送裝置：配置於該機台，並設有至少一輸送器，以供輸送電子元件；至少一如請求項9所述之測試裝置：配置於該機台，以供測試電子元件；中央控制裝置：以控制及整合各裝置作動而執行自動化作業。 An operating machine, including: a machine; a feeding device: configured on the machine, and provided with at least one feeder for accommodating at least one electronic component to be tested; a receiving device: configured on the machine, and At least one receiver is provided for accommodating at least one tested electronic component; a conveying device: is disposed on the machine and is provided with at least one conveyor for conveying electronic components; at least one device is as described in claim 9 Test device: configured on the machine for testing electronic components; central control device: used to control and integrate the actions of each device to perform automated operations.